Produkte > ARIES ELECTRONICS > Alle Produkte des Herstellers ARIES ELECTRONICS (15929) > Seite 130 nach 266

Wählen Sie Seite:   [  << Vorherige Seite ]  1 26 52 78 104 125 126 127 128 129 130 131 132 133 134 135 156 182 208 234 260 266  [ Nächste Seite >> ]
Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
ohne MwSt
LCQT-SOIC16 LCQT-SOIC16 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER SOIC TO 16DIP
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 187 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.73 EUR
30+ 6.63 EUR
120+ 6.17 EUR
Mindestbestellmenge: 3
LCQT-SOIC16W LCQT-SOIC16W Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER SOIC-W TO 16DIP
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 138 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.73 EUR
30+ 6.63 EUR
120+ 6.17 EUR
Mindestbestellmenge: 3
LCQT-TSSOP20 LCQT-TSSOP20 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER TSSOP TO 20DIP
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.47 EUR
24+ 9.46 EUR
Mindestbestellmenge: 2
LCQT-SSOP20 LCQT-SSOP20 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER SSOP TO 20DIP
Packaging: Tube
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
auf Bestellung 74 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.47 EUR
24+ 9.46 EUR
48+ 8.72 EUR
Mindestbestellmenge: 2
LCQT-SOIC20W LCQT-SOIC20W Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER SOIC-W TO 20DIP
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.31 EUR
24+ 9.33 EUR
Mindestbestellmenge: 2
LCQT-TSSOP28 LCQT-TSSOP28 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER TSSOP TO 28DIP
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 89 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.02 EUR
17+ 11.77 EUR
34+ 11.12 EUR
51+ 10.85 EUR
Mindestbestellmenge: 2
LCQT-SOIC28 LCQT-SOIC28 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER SOIC TO 28DIP
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 1478 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.94 EUR
17+ 12.6 EUR
102+ 11.04 EUR
1003+ 8.13 EUR
Mindestbestellmenge: 2
LCQT-SOIC32 LCQT-SOIC32 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER SOIC TO 32DIP
Packaging: Tube
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 65 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.62 EUR
10+ 12.31 EUR
25+ 11.63 EUR
50+ 11.35 EUR
Mindestbestellmenge: 2
LCQT-SOIC32W LCQT-SOIC32W Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER SOIC-W TO 32DIP
Packaging: Tube
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 75 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.62 EUR
10+ 12.31 EUR
25+ 11.63 EUR
50+ 11.35 EUR
Mindestbestellmenge: 2
LCQT-TSOP32-1 LCQT-TSOP32-1 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER TSOP TO 32DIP
Packaging: Tube
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.75 EUR
15+ 12.43 EUR
30+ 11.74 EUR
Mindestbestellmenge: 2
28-450001-11-RC Aries Electronics 18011rc-rohs-compliant-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOJ TO 28DIP 0.4
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
24-650000-11-RC-P Aries Electronics 18011rc-rohs-compliant-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
Produkt ist nicht verfügbar
28-650000-11-RC-P Aries Electronics 18011rc-rohs-compliant-soj-to-dip-adapter.pdf Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
04-002-154YS Aries Electronics 11015-yellow-streak-sip-jumpers.pdf Description: CABLE 4POS .100 JUMPER 1 INCH
Produkt ist nicht verfügbar
97-AQ132D-P Aries Electronics 18022-pqfp-to-pga-socket.pdf Description: SCKT ADPT PQFP-132PGA PANELIZED
Packaging: Bulk
Number of Pins: 132
Mounting Type: Through Hole
Convert From (Adapter End): PQFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
08-008.75-173 Aries Electronics 11005-flat-pin-staked-flex-jumpers.pdf Description: FLAT PIN-STAKED FLEX 8 POS 8.75"
Produkt ist nicht verfügbar
25-0625-31 25-0625-31 Aries Electronics 12036-pin-line-header.pdf Description: CONN HDR STRIP SOLDER 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
Produkt ist nicht verfügbar
16-820-90T Aries Electronics Description: RT ANGLE 16 PIN SKT .1 INCH CTR
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
68-PGM10006-10 Aries Electronics Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
14-600-21 Aries Electronics Description: CONN HDR DIP POST 14POS GOLD
Produkt ist nicht verfügbar
132-PGM13038-10 Aries Electronics Description: PIN GRID ARRAY SOCKET/HEADER
Produkt ist nicht verfügbar
132-PGM13038-50 Aries Electronics Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
132-PRS14033-12 Aries Electronics Description: PGA ZIF TEST/BURN-IN SOCKET
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
08-354000-10 Aries Electronics Description: CONN ADAPTER 8POS DIP-S01C
Packaging: Bulk
Number of Pins: 8
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
1111841 Aries Electronics Description: SOCKET MSOP TO SOIC
Produkt ist nicht verfügbar
16-354000-10 Aries Electronics Description: CONN ADAPTER 16POS DIP-SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
20-354000-10 Aries Electronics Description: CONN ADAPTER 20POS DIP-SOIC
Produkt ist nicht verfügbar
225-PLS18003-12 Aries Electronics Description: ZIF PGA SOCKET 225 PIN 18 X 18
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 225 (15 x 15)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
181-PLS18040-12 Aries Electronics Description: ZIF PGA LIST SOCKET 181PIN GOLD
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
14-8875-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
10-2511-10 Aries Electronics Description: 10-PIN SOLDER TAIL IC SOCKET
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
14-0518-10 Aries Electronics Description: 14 PIN SOCKET
Produkt ist nicht verfügbar
36-6625-21 Aries Electronics 12035-dip-header.pdf Description: CONN HDR DIP POST 36POS GOLD
Produkt ist nicht verfügbar
28-354000-10 Aries Electronics Description: ADAPTER 28 PIN DIP TO SOIC
Packaging: Bulk
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
20-3540-10 Aries Electronics Description: COLLET PIN CARRIER 20-PIN .300
Produkt ist nicht verfügbar
14-0600-20 Aries Electronics Description: CONN SIL HDR POST 14POS TIN
Produkt ist nicht verfügbar
20-600-20 Aries Electronics Description: CONN HDR DIP POST 20POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Contact Type: Post
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
Produkt ist nicht verfügbar
10-6511-10 Aries Electronics Description: SOCKET 10 POS SOLDER TAIL TIN
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
180-PGM18006-10 Aries Electronics Description: PIN GRID ARRAY SOCKET 180PIN
Mounting Type: Through Hole
Type: PGA
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
LP300 RED Aries Electronics Description: CONN SCKT SHORT PLUG FOR 0.3"RED
Packaging: Bulk
Color: Black
For Use With/Related Products: 0.3" DIP Sockets
Accessory Type: Shorting Plug
Body Material: Polyamide (PA46), Nylon 4/6
Part Status: Active
Produkt ist nicht verfügbar
84-652000-10 Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 84DIP 0.6
Packaging: Bulk
Number of Pins: 84
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
32-652000-11-RC Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
84-652000-11-RC Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 84DIP 0.6
Packaging: Bulk
Number of Pins: 84
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
68-652000-10 Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 68DIP 0.6
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
68-652000-11-RC Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 68DIP 0.6
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
20-352000-10 Aries Electronics 18015-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
32-652000-10 Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
44-652000-10 Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 44DIP 0.6
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
28-352000-10 Aries Electronics 18015-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 28DIP 0.3
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
32-652000-10-P Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
28-652000-10 Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
28-652000-11-RC Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
44-652000-11-RC Aries Electronics 18014-plcc-to-dip-adapter.pdf Description: SOCKET ADAPTER PLCC TO 44DIP 0.6
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
181-PLS15003-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Produkt ist nicht verfügbar
181-PLS15006-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Produkt ist nicht verfügbar
225-PLS15001-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Produkt ist nicht verfügbar
225-PRS15001-12 225-PRS15001-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 225 (15 x 15)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 97 Stücke:
Lieferzeit 10-14 Tag (e)
1+172.96 EUR
10+ 158.72 EUR
25+ 152.61 EUR
50+ 147.53 EUR
108-PLS12024-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
SP200 SP200 Aries Electronics 16009-shorting-plug-and-jack.pdf Description: PLUG SHORTING INSULATED BLACK
Packaging: Bulk
Gender: Male Pins
Contact Finish: Gold
Color: Black
Current Rating (Amps): 5A
Pitch: 0.200" (5.08mm)
Type: Closed Top, Grip
Height: 0.480" (12.20mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: 10.0µin (0.25µm)
Material Flammability Rating: UL94 V-0
Housing Material: Polyamide (PA46), Nylon 4/6
auf Bestellung 1514 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.28 EUR
10+ 3.72 EUR
100+ 3.32 EUR
1000+ 2.37 EUR
Mindestbestellmenge: 5
181-PLS15006-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
LCQT-SOIC16 19000-small-outline-prototyping-adapters.pdf
LCQT-SOIC16
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 16DIP
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 187 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+7.73 EUR
30+ 6.63 EUR
120+ 6.17 EUR
Mindestbestellmenge: 3
LCQT-SOIC16W 19000-small-outline-prototyping-adapters.pdf
LCQT-SOIC16W
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC-W TO 16DIP
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 138 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+7.73 EUR
30+ 6.63 EUR
120+ 6.17 EUR
Mindestbestellmenge: 3
LCQT-TSSOP20 19000-small-outline-prototyping-adapters.pdf
LCQT-TSSOP20
Hersteller: Aries Electronics
Description: SOCKET ADAPTER TSSOP TO 20DIP
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.47 EUR
24+ 9.46 EUR
Mindestbestellmenge: 2
LCQT-SSOP20 19000-small-outline-prototyping-adapters.pdf
LCQT-SSOP20
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP TO 20DIP
Packaging: Tube
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
auf Bestellung 74 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.47 EUR
24+ 9.46 EUR
48+ 8.72 EUR
Mindestbestellmenge: 2
LCQT-SOIC20W 19000-small-outline-prototyping-adapters.pdf
LCQT-SOIC20W
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC-W TO 20DIP
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.31 EUR
24+ 9.33 EUR
Mindestbestellmenge: 2
LCQT-TSSOP28 19000-small-outline-prototyping-adapters.pdf
LCQT-TSSOP28
Hersteller: Aries Electronics
Description: SOCKET ADAPTER TSSOP TO 28DIP
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 89 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.02 EUR
17+ 11.77 EUR
34+ 11.12 EUR
51+ 10.85 EUR
Mindestbestellmenge: 2
LCQT-SOIC28 19000-small-outline-prototyping-adapters.pdf
LCQT-SOIC28
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 1478 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.94 EUR
17+ 12.6 EUR
102+ 11.04 EUR
1003+ 8.13 EUR
Mindestbestellmenge: 2
LCQT-SOIC32 19000-small-outline-prototyping-adapters.pdf
LCQT-SOIC32
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 32DIP
Packaging: Tube
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 65 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.62 EUR
10+ 12.31 EUR
25+ 11.63 EUR
50+ 11.35 EUR
Mindestbestellmenge: 2
LCQT-SOIC32W 19000-small-outline-prototyping-adapters.pdf
LCQT-SOIC32W
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC-W TO 32DIP
Packaging: Tube
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 75 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.62 EUR
10+ 12.31 EUR
25+ 11.63 EUR
50+ 11.35 EUR
Mindestbestellmenge: 2
LCQT-TSOP32-1 19000-small-outline-prototyping-adapters.pdf
LCQT-TSOP32-1
Hersteller: Aries Electronics
Description: SOCKET ADAPTER TSOP TO 32DIP
Packaging: Tube
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.75 EUR
15+ 12.43 EUR
30+ 11.74 EUR
Mindestbestellmenge: 2
28-450001-11-RC 18011rc-rohs-compliant-soj-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOJ TO 28DIP 0.4
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOJ
Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
24-650000-11-RC-P 18011rc-rohs-compliant-soj-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 24DIP 0.6
Produkt ist nicht verfügbar
28-650000-11-RC-P 18011rc-rohs-compliant-soj-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
04-002-154YS 11015-yellow-streak-sip-jumpers.pdf
Hersteller: Aries Electronics
Description: CABLE 4POS .100 JUMPER 1 INCH
Produkt ist nicht verfügbar
97-AQ132D-P 18022-pqfp-to-pga-socket.pdf
Hersteller: Aries Electronics
Description: SCKT ADPT PQFP-132PGA PANELIZED
Packaging: Bulk
Number of Pins: 132
Mounting Type: Through Hole
Convert From (Adapter End): PQFP
Convert To (Adapter End): PGA
Termination: Solder
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
08-008.75-173 11005-flat-pin-staked-flex-jumpers.pdf
Hersteller: Aries Electronics
Description: FLAT PIN-STAKED FLEX 8 POS 8.75"
Produkt ist nicht verfügbar
25-0625-31 12036-pin-line-header.pdf
25-0625-31
Hersteller: Aries Electronics
Description: CONN HDR STRIP SOLDER 25POS GOLD
Packaging: Bulk
Connector Type: Header Strip
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
Produkt ist nicht verfügbar
16-820-90T
Hersteller: Aries Electronics
Description: RT ANGLE 16 PIN SKT .1 INCH CTR
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
68-PGM10006-10
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
14-600-21
Hersteller: Aries Electronics
Description: CONN HDR DIP POST 14POS GOLD
Produkt ist nicht verfügbar
132-PGM13038-10
Hersteller: Aries Electronics
Description: PIN GRID ARRAY SOCKET/HEADER
Produkt ist nicht verfügbar
132-PGM13038-50
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Produkt ist nicht verfügbar
132-PRS14033-12
Hersteller: Aries Electronics
Description: PGA ZIF TEST/BURN-IN SOCKET
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
08-354000-10
Hersteller: Aries Electronics
Description: CONN ADAPTER 8POS DIP-S01C
Packaging: Bulk
Number of Pins: 8
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
1111841
Hersteller: Aries Electronics
Description: SOCKET MSOP TO SOIC
Produkt ist nicht verfügbar
16-354000-10
Hersteller: Aries Electronics
Description: CONN ADAPTER 16POS DIP-SOIC
Packaging: Bulk
Number of Pins: 16
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
20-354000-10
Hersteller: Aries Electronics
Description: CONN ADAPTER 20POS DIP-SOIC
Produkt ist nicht verfügbar
225-PLS18003-12
Hersteller: Aries Electronics
Description: ZIF PGA SOCKET 225 PIN 18 X 18
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 225 (15 x 15)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
181-PLS18040-12
Hersteller: Aries Electronics
Description: ZIF PGA LIST SOCKET 181PIN GOLD
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
14-8875-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
10-2511-10
Hersteller: Aries Electronics
Description: 10-PIN SOLDER TAIL IC SOCKET
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
14-0518-10
Hersteller: Aries Electronics
Description: 14 PIN SOCKET
Produkt ist nicht verfügbar
36-6625-21 12035-dip-header.pdf
Hersteller: Aries Electronics
Description: CONN HDR DIP POST 36POS GOLD
Produkt ist nicht verfügbar
28-354000-10
Hersteller: Aries Electronics
Description: ADAPTER 28 PIN DIP TO SOIC
Packaging: Bulk
Number of Pins: 28
Mounting Type: Surface Mount
Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Produkt ist nicht verfügbar
20-3540-10
Hersteller: Aries Electronics
Description: COLLET PIN CARRIER 20-PIN .300
Produkt ist nicht verfügbar
14-0600-20
Hersteller: Aries Electronics
Description: CONN SIL HDR POST 14POS TIN
Produkt ist nicht verfügbar
20-600-20
Hersteller: Aries Electronics
Description: CONN HDR DIP POST 20POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Contact Type: Post
Row Spacing: 0.300" (7.62mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Part Status: Active
Number of Rows: 2
Produkt ist nicht verfügbar
10-6511-10
Hersteller: Aries Electronics
Description: SOCKET 10 POS SOLDER TAIL TIN
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
180-PGM18006-10
Hersteller: Aries Electronics
Description: PIN GRID ARRAY SOCKET 180PIN
Mounting Type: Through Hole
Type: PGA
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
LP300 RED
Hersteller: Aries Electronics
Description: CONN SCKT SHORT PLUG FOR 0.3"RED
Packaging: Bulk
Color: Black
For Use With/Related Products: 0.3" DIP Sockets
Accessory Type: Shorting Plug
Body Material: Polyamide (PA46), Nylon 4/6
Part Status: Active
Produkt ist nicht verfügbar
84-652000-10 18014-plcc-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 84DIP 0.6
Packaging: Bulk
Number of Pins: 84
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
32-652000-11-RC 18014-plcc-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
84-652000-11-RC 18014-plcc-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 84DIP 0.6
Packaging: Bulk
Number of Pins: 84
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
68-652000-10 18014-plcc-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 68DIP 0.6
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
68-652000-11-RC 18014-plcc-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 68DIP 0.6
Packaging: Bulk
Number of Pins: 68
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
20-352000-10 18015-plcc-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 20DIP 0.3
Packaging: Bulk
Number of Pins: 20
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
32-652000-10 18014-plcc-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
44-652000-10 18014-plcc-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 44DIP 0.6
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
28-352000-10 18015-plcc-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 28DIP 0.3
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
32-652000-10-P 18014-plcc-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 32DIP 0.6
Packaging: Bulk
Number of Pins: 32
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
28-652000-10 18014-plcc-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
28-652000-11-RC 18014-plcc-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 28DIP 0.6
Packaging: Bulk
Number of Pins: 28
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
44-652000-11-RC 18014-plcc-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: SOCKET ADAPTER PLCC TO 44DIP 0.6
Packaging: Bulk
Number of Pins: 44
Mounting Type: Through Hole
Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Board Material: FR4 Epoxy Glass
Part Status: Active
Produkt ist nicht verfügbar
181-PLS15003-16 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Produkt ist nicht verfügbar
181-PLS15006-16 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Produkt ist nicht verfügbar
225-PLS15001-16 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Produkt ist nicht verfügbar
225-PRS15001-12 10004-pga-zif-test-and-burn-in-socket.pdf
225-PRS15001-12
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 225 (15 x 15)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 97 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+172.96 EUR
10+ 158.72 EUR
25+ 152.61 EUR
50+ 147.53 EUR
108-PLS12024-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
SP200 16009-shorting-plug-and-jack.pdf
SP200
Hersteller: Aries Electronics
Description: PLUG SHORTING INSULATED BLACK
Packaging: Bulk
Gender: Male Pins
Contact Finish: Gold
Color: Black
Current Rating (Amps): 5A
Pitch: 0.200" (5.08mm)
Type: Closed Top, Grip
Height: 0.480" (12.20mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: 10.0µin (0.25µm)
Material Flammability Rating: UL94 V-0
Housing Material: Polyamide (PA46), Nylon 4/6
auf Bestellung 1514 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+4.28 EUR
10+ 3.72 EUR
100+ 3.32 EUR
1000+ 2.37 EUR
Mindestbestellmenge: 5
181-PLS15006-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Wählen Sie Seite:   [  << Vorherige Seite ]  1 26 52 78 104 125 126 127 128 129 130 131 132 133 134 135 156 182 208 234 260 266  [ Nächste Seite >> ]