Produkte > ARIES ELECTRONICS > Alle Produkte des Herstellers ARIES ELECTRONICS (15955) > Seite 131 nach 266
Foto | Bezeichnung | Hersteller | Beschreibung |
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48-6556-30 | Aries Electronics |
Description: UNIVERSAL TEST SOCKET 48POS Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Wire Wrap Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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LCQT-TSOP32 | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
84-PRS11010-12 | Aries Electronics |
Description: ZIF 11X11 84PIN FOOTPRN 11010 Features: Closed Frame Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
40-6556-30 | Aries Electronics |
Description: 40 POS TEST SOCK RECEPT SOLDER Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Wire Wrap Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
16-822-90E | Aries Electronics |
Description: 16 PIN RT ANGLE HORIZONTAL SOCKT Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: 105°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
108-PRS12024-12 | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -65°C ~ 125°C Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
20-6513-10 | Aries Electronics |
Description: IC SOCK COLLET CT 20 PIN GOLD Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
32-8800-610C | Aries Electronics |
Description: CONN ELEVATOR SOCKET 32 PIN .600 Features: Closed Frame, Elevated Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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LCQT-TSOP40 | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LCQT-TSOP40-1 | Aries Electronics |
![]() Packaging: Tube Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
06-2503-30 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
06-2503-31 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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SP200 | Aries Electronics |
![]() Packaging: Bulk Gender: Male Pins Contact Finish: Gold Color: Black Current Rating (Amps): 5A Pitch: 0.200" (5.08mm) Type: Closed Top, Grip Height: 0.480" (12.20mm) Number of Positions or Pins (Grid): 2 (1 x 2) Contact Finish Thickness: 10.0µin (0.25µm) Material Flammability Rating: UL94 V-0 Housing Material: Polyamide (PA46), Nylon 4/6 |
auf Bestellung 399 Stücke: Lieferzeit 10-14 Tag (e) |
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181-PRS15006-12 | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -65°C ~ 125°C Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
225-PRS15001-16 | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -65°C ~ 200°C Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Bronze Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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08-2503-30 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
auf Bestellung 121 Stücke: Lieferzeit 10-14 Tag (e) |
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08-2503-20 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
08-2503-21 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
08-2503-31 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
20-555000-00 | Aries Electronics |
Description: SOCKET ADAPTER SSOP/SOWIC 20POS Packaging: Bulk Number of Pins: 20 Mounting Type: Surface Mount Convert From (Adapter End): SSOP Convert To (Adapter End): SOWIC Termination: Solder Pitch - Mating: 0.026" (0.65mm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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ME-100 | Aries Electronics |
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auf Bestellung 20693 Stücke: Lieferzeit 10-14 Tag (e) |
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ML-100 | Aries Electronics |
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auf Bestellung 802 Stücke: Lieferzeit 10-14 Tag (e) |
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ML-100S | Aries Electronics |
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auf Bestellung 352 Stücke: Lieferzeit 10-14 Tag (e) |
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20-680-191T | Aries Electronics |
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auf Bestellung 100 Stücke: Lieferzeit 10-14 Tag (e) |
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14-675-190T | Aries Electronics |
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auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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20-680-191TC | Aries Electronics |
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Produkt ist nicht verfügbar |
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14-675-191 | Aries Electronics |
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Produkt ist nicht verfügbar |
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14-675-191T | Aries Electronics |
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Produkt ist nicht verfügbar |
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14-675-190 | Aries Electronics |
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Produkt ist nicht verfügbar |
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14-675-191TC | Aries Electronics |
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Produkt ist nicht verfügbar |
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14-9625-11 | Aries Electronics |
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Produkt ist nicht verfügbar |
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16-350000-11-RC | Aries Electronics |
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auf Bestellung 212 Stücke: Lieferzeit 10-14 Tag (e) |
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28-6554-11 | Aries Electronics |
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auf Bestellung 103 Stücke: Lieferzeit 10-14 Tag (e) |
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08-3518-10 | Aries Electronics |
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auf Bestellung 1372 Stücke: Lieferzeit 10-14 Tag (e) |
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40-6518-10 | Aries Electronics |
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auf Bestellung 554 Stücke: Lieferzeit 10-14 Tag (e) |
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14-3518-10 | Aries Electronics |
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auf Bestellung 396 Stücke: Lieferzeit 10-14 Tag (e) |
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10-4823-90C | Aries Electronics |
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auf Bestellung 118 Stücke: Lieferzeit 10-14 Tag (e) |
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14-350000-11-RC | Aries Electronics |
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auf Bestellung 343 Stücke: Lieferzeit 10-14 Tag (e) |
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25-0513-10 | Aries Electronics |
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auf Bestellung 196 Stücke: Lieferzeit 10-14 Tag (e) |
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20-350000-11-RC | Aries Electronics |
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auf Bestellung 296 Stücke: Lieferzeit 10-14 Tag (e) |
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40-0518-10 | Aries Electronics |
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auf Bestellung 769 Stücke: Lieferzeit 10-14 Tag (e) |
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40-6554-10 | Aries Electronics |
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auf Bestellung 75 Stücke: Lieferzeit 10-14 Tag (e) |
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28-6554-10 | Aries Electronics |
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auf Bestellung 111 Stücke: Lieferzeit 10-14 Tag (e) |
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16-675-191 | Aries Electronics |
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auf Bestellung 59 Stücke: Lieferzeit 10-14 Tag (e) |
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16-0600-11 | Aries Electronics |
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auf Bestellung 317 Stücke: Lieferzeit 10-14 Tag (e) |
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16-810-90C | Aries Electronics |
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auf Bestellung 44 Stücke: Lieferzeit 10-14 Tag (e) |
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48-3552-11 | Aries Electronics |
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Produkt ist nicht verfügbar |
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1108800 | Aries Electronics |
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auf Bestellung 360 Stücke: Lieferzeit 10-14 Tag (e) |
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16-3518-10 | Aries Electronics |
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auf Bestellung 1056 Stücke: Lieferzeit 10-14 Tag (e) |
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16-600-10 | Aries Electronics |
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auf Bestellung 348 Stücke: Lieferzeit 10-14 Tag (e) |
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24-350000-11-RC | Aries Electronics |
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auf Bestellung 37 Stücke: Lieferzeit 10-14 Tag (e) |
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08-600-11 | Aries Electronics |
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auf Bestellung 572 Stücke: Lieferzeit 10-14 Tag (e) |
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08-3518-00 | Aries Electronics |
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auf Bestellung 194 Stücke: Lieferzeit 10-14 Tag (e) |
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14-600-10 | Aries Electronics |
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auf Bestellung 156 Stücke: Lieferzeit 10-14 Tag (e) |
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18-650-10 | Aries Electronics |
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Produkt ist nicht verfügbar |
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20-3518-10 | Aries Electronics |
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auf Bestellung 817 Stücke: Lieferzeit 10-14 Tag (e) |
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24-6554-10 | Aries Electronics |
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auf Bestellung 97 Stücke: Lieferzeit 10-14 Tag (e) |
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03-0513-10 | Aries Electronics |
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auf Bestellung 117 Stücke: Lieferzeit 10-14 Tag (e) |
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16-600-11 | Aries Electronics |
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auf Bestellung 337 Stücke: Lieferzeit 10-14 Tag (e) |
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25-0600-10 | Aries Electronics |
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auf Bestellung 222 Stücke: Lieferzeit 10-14 Tag (e) |
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48-6556-30 |
Hersteller: Aries Electronics
Description: UNIVERSAL TEST SOCKET 48POS
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: UNIVERSAL TEST SOCKET 48POS
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LCQT-TSOP32 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER TSOP 32DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Description: SOCKET ADAPTER TSOP 32DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
84-PRS11010-12 |
Hersteller: Aries Electronics
Description: ZIF 11X11 84PIN FOOTPRN 11010
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: ZIF 11X11 84PIN FOOTPRN 11010
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
40-6556-30 |
Hersteller: Aries Electronics
Description: 40 POS TEST SOCK RECEPT SOLDER
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 40 POS TEST SOCK RECEPT SOLDER
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
16-822-90E |
Hersteller: Aries Electronics
Description: 16 PIN RT ANGLE HORIZONTAL SOCKT
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Description: 16 PIN RT ANGLE HORIZONTAL SOCKT
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
108-PRS12024-12 |
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Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
20-6513-10 |
Hersteller: Aries Electronics
Description: IC SOCK COLLET CT 20 PIN GOLD
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: IC SOCK COLLET CT 20 PIN GOLD
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
32-8800-610C |
Hersteller: Aries Electronics
Description: CONN ELEVATOR SOCKET 32 PIN .600
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN ELEVATOR SOCKET 32 PIN .600
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LCQT-TSOP40 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER TSOP TO 40DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Description: SOCKET ADAPTER TSOP TO 40DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LCQT-TSOP40-1 |
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Hersteller: Aries Electronics
Description: SOCKET ADAPTER TSOP TO 40DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Description: SOCKET ADAPTER TSOP TO 40DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
06-2503-30 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
06-2503-31 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SP200 |
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Hersteller: Aries Electronics
Description: PLUG SHORTING INSULATED BLACK
Packaging: Bulk
Gender: Male Pins
Contact Finish: Gold
Color: Black
Current Rating (Amps): 5A
Pitch: 0.200" (5.08mm)
Type: Closed Top, Grip
Height: 0.480" (12.20mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: 10.0µin (0.25µm)
Material Flammability Rating: UL94 V-0
Housing Material: Polyamide (PA46), Nylon 4/6
Description: PLUG SHORTING INSULATED BLACK
Packaging: Bulk
Gender: Male Pins
Contact Finish: Gold
Color: Black
Current Rating (Amps): 5A
Pitch: 0.200" (5.08mm)
Type: Closed Top, Grip
Height: 0.480" (12.20mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: 10.0µin (0.25µm)
Material Flammability Rating: UL94 V-0
Housing Material: Polyamide (PA46), Nylon 4/6
auf Bestellung 399 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 6.72 EUR |
10+ | 5.72 EUR |
25+ | 5.36 EUR |
50+ | 5.10 EUR |
100+ | 4.86 EUR |
250+ | 4.55 EUR |
181-PRS15006-12 |
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Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
225-PRS15001-16 |
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Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
08-2503-30 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
auf Bestellung 121 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 7.34 EUR |
10+ | 6.24 EUR |
25+ | 5.85 EUR |
50+ | 5.57 EUR |
100+ | 5.30 EUR |
08-2503-20 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
08-2503-21 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
08-2503-31 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
20-555000-00 |
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP/SOWIC 20POS
Packaging: Bulk
Number of Pins: 20
Mounting Type: Surface Mount
Convert From (Adapter End): SSOP
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP/SOWIC 20POS
Packaging: Bulk
Number of Pins: 20
Mounting Type: Surface Mount
Convert From (Adapter End): SSOP
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
ME-100 |
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Hersteller: Aries Electronics
Headers & Wire Housings Economy Mini-Link
Headers & Wire Housings Economy Mini-Link
auf Bestellung 20693 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
9+ | 0.33 EUR |
13+ | 0.23 EUR |
100+ | 0.19 EUR |
500+ | 0.18 EUR |
1000+ | 0.15 EUR |
2000+ | 0.14 EUR |
10000+ | 0.13 EUR |
ML-100 |
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Hersteller: Aries Electronics
Headers & Wire Housings MINILINK MINI JUMPER
Headers & Wire Housings MINILINK MINI JUMPER
auf Bestellung 802 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
ML-100S |
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Hersteller: Aries Electronics
Headers & Wire Housings .10 JUMPER CLOSED Au
Headers & Wire Housings .10 JUMPER CLOSED Au
auf Bestellung 352 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
20-680-191T |
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Hersteller: Aries Electronics
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 2.85 EUR |
10+ | 2.75 EUR |
100+ | 2.41 EUR |
500+ | 1.99 EUR |
1000+ | 1.90 EUR |
2500+ | 1.83 EUR |
5000+ | 1.78 EUR |
14-675-190T |
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Hersteller: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 3.80 EUR |
10+ | 3.10 EUR |
104+ | 2.99 EUR |
520+ | 2.73 EUR |
1014+ | 2.43 EUR |
2522+ | 2.27 EUR |
5018+ | 2.15 EUR |
20-680-191TC |
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Hersteller: Aries Electronics
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
14-675-191 |
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Hersteller: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
14-675-191T |
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Hersteller: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
14-675-190 |
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Hersteller: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
14-675-191TC |
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Hersteller: Aries Electronics
IC & Component Sockets
IC & Component Sockets
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
14-9625-11 |
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Hersteller: Aries Electronics
IC & Component Sockets
IC & Component Sockets
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
16-350000-11-RC |
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Hersteller: Aries Electronics
IC & Component Sockets SOIC 16-PIN DIP ADAPTER
IC & Component Sockets SOIC 16-PIN DIP ADAPTER
auf Bestellung 212 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 39.11 EUR |
10+ | 39.09 EUR |
24+ | 30.76 EUR |
48+ | 27.91 EUR |
120+ | 26.66 EUR |
264+ | 26.01 EUR |
28-6554-11 |
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Hersteller: Aries Electronics
IC & Component Sockets 28 PIN W/HANDLE
IC & Component Sockets 28 PIN W/HANDLE
auf Bestellung 103 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 42.42 EUR |
9+ | 32.19 EUR |
27+ | 30.82 EUR |
54+ | 29.11 EUR |
108+ | 27.26 EUR |
252+ | 25.59 EUR |
504+ | 23.94 EUR |
08-3518-10 |
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Hersteller: Aries Electronics
IC & Component Sockets 8P SOLDER TIN/GLD
IC & Component Sockets 8P SOLDER TIN/GLD
auf Bestellung 1372 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
49+ | 1.07 EUR |
98+ | 0.88 EUR |
539+ | 0.79 EUR |
1029+ | 0.72 EUR |
40-6518-10 |
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Hersteller: Aries Electronics
IC & Component Sockets 40P SOLDER TIN/GLD
IC & Component Sockets 40P SOLDER TIN/GLD
auf Bestellung 554 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 11.02 EUR |
12+ | 7.52 EUR |
24+ | 6.83 EUR |
108+ | 6.58 EUR |
252+ | 5.88 EUR |
2508+ | 5.63 EUR |
14-3518-10 |
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Hersteller: Aries Electronics
IC & Component Sockets 14P SOLDER TIN/GLD
IC & Component Sockets 14P SOLDER TIN/GLD
auf Bestellung 396 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 2.69 EUR |
10+ | 1.74 EUR |
112+ | 1.42 EUR |
504+ | 1.35 EUR |
1008+ | 1.28 EUR |
2520+ | 1.18 EUR |
10-4823-90C |
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Hersteller: Aries Electronics
IC & Component Sockets VERTISOCKETS HORIZ COLLET 10 PINS
IC & Component Sockets VERTISOCKETS HORIZ COLLET 10 PINS
auf Bestellung 118 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
14-350000-11-RC |
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Hersteller: Aries Electronics
IC & Component Sockets SOIC DIP ADAPTER
IC & Component Sockets SOIC DIP ADAPTER
auf Bestellung 343 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 41.38 EUR |
10+ | 31.94 EUR |
25+ | 28.93 EUR |
50+ | 26.89 EUR |
100+ | 25.04 EUR |
250+ | 22.39 EUR |
462+ | 21.65 EUR |
25-0513-10 |
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Hersteller: Aries Electronics
IC & Component Sockets 25P SOLDER TAIL TIN
IC & Component Sockets 25P SOLDER TAIL TIN
auf Bestellung 196 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 6.12 EUR |
10+ | 4.96 EUR |
100+ | 4.05 EUR |
500+ | 3.59 EUR |
1000+ | 3.38 EUR |
20-350000-11-RC |
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Hersteller: Aries Electronics
IC & Component Sockets SOIC DIP ADAPTER
IC & Component Sockets SOIC DIP ADAPTER
auf Bestellung 296 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 44.05 EUR |
10+ | 43.74 EUR |
19+ | 31.91 EUR |
57+ | 30.76 EUR |
114+ | 28.93 EUR |
266+ | 28.28 EUR |
40-0518-10 |
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Hersteller: Aries Electronics
IC & Component Sockets 40P LO-PRO STRIP TIN
IC & Component Sockets 40P LO-PRO STRIP TIN
auf Bestellung 769 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 5.74 EUR |
10+ | 4.77 EUR |
100+ | 4.08 EUR |
250+ | 4.03 EUR |
500+ | 3.59 EUR |
1000+ | 3.48 EUR |
40-6554-10 |
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Hersteller: Aries Electronics
IC & Component Sockets 40P TEST SOCKET TIN
IC & Component Sockets 40P TEST SOCKET TIN
auf Bestellung 75 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 27.40 EUR |
7+ | 25.52 EUR |
28+ | 24.38 EUR |
56+ | 23.95 EUR |
105+ | 20.29 EUR |
252+ | 19.62 EUR |
504+ | 19.48 EUR |
28-6554-10 |
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Hersteller: Aries Electronics
IC & Component Sockets 28P TEST SOCKET TIN
IC & Component Sockets 28P TEST SOCKET TIN
auf Bestellung 111 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 24.89 EUR |
9+ | 22.00 EUR |
27+ | 20.29 EUR |
108+ | 19.13 EUR |
252+ | 16.83 EUR |
504+ | 16.23 EUR |
1008+ | 15.07 EUR |
16-675-191 |
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Hersteller: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 16 PINS
Headers & Wire Housings DIP PROGRAM HEADERS 16 PINS
auf Bestellung 59 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 5.33 EUR |
10+ | 3.80 EUR |
115+ | 3.17 EUR |
253+ | 2.99 EUR |
506+ | 2.68 EUR |
1012+ | 2.59 EUR |
16-0600-11 |
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Hersteller: Aries Electronics
IC & Component Sockets STRIP LINE 16 PINS COINED CONTACT
IC & Component Sockets STRIP LINE 16 PINS COINED CONTACT
auf Bestellung 317 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 6.35 EUR |
10+ | 5.79 EUR |
100+ | 5.09 EUR |
250+ | 4.59 EUR |
500+ | 3.94 EUR |
1000+ | 3.78 EUR |
2500+ | 3.71 EUR |
16-810-90C |
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Hersteller: Aries Electronics
IC & Component Sockets VERTISOCKETS VERT COLLET 16 PINS
IC & Component Sockets VERTISOCKETS VERT COLLET 16 PINS
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 20.73 EUR |
10+ | 18.80 EUR |
25+ | 17.34 EUR |
100+ | 14.15 EUR |
250+ | 13.11 EUR |
500+ | 12.64 EUR |
1000+ | 12.14 EUR |
48-3552-11 |
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Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT GOLD 48 PINS
IC & Component Sockets DIP TEST SCKT GOLD 48 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1108800 |
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Hersteller: Aries Electronics
IC & Component Sockets OSCILLATOR HALF 4PIN
IC & Component Sockets OSCILLATOR HALF 4PIN
auf Bestellung 360 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 1.56 EUR |
10+ | 1.24 EUR |
98+ | 1.07 EUR |
539+ | 0.96 EUR |
1029+ | 0.85 EUR |
2548+ | 0.79 EUR |
16-3518-10 |
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Hersteller: Aries Electronics
IC & Component Sockets 16P SOLDER TIN/GLD
IC & Component Sockets 16P SOLDER TIN/GLD
auf Bestellung 1056 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
24+ | 1.72 EUR |
120+ | 1.53 EUR |
504+ | 1.47 EUR |
1008+ | 1.44 EUR |
2520+ | 1.28 EUR |
16-600-10 |
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Hersteller: Aries Electronics
IC & Component Sockets 16P FORK DIP HDR
IC & Component Sockets 16P FORK DIP HDR
auf Bestellung 348 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 5.10 EUR |
10+ | 3.59 EUR |
115+ | 2.85 EUR |
506+ | 2.53 EUR |
1012+ | 2.38 EUR |
5014+ | 2.11 EUR |
24-350000-11-RC |
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Hersteller: Aries Electronics
IC & Component Sockets SOIC DIP ADAPTER
IC & Component Sockets SOIC DIP ADAPTER
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 48.75 EUR |
10+ | 38.68 EUR |
25+ | 36.36 EUR |
48+ | 34.20 EUR |
112+ | 33.40 EUR |
08-600-11 |
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Hersteller: Aries Electronics
IC & Component Sockets 8P DIP FORK HDR GLD
IC & Component Sockets 8P DIP FORK HDR GLD
auf Bestellung 572 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
44+ | 2.78 EUR |
88+ | 2.38 EUR |
528+ | 2.20 EUR |
1012+ | 1.87 EUR |
2508+ | 1.75 EUR |
5016+ | 1.67 EUR |
10032+ | 1.64 EUR |
08-3518-00 |
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Hersteller: Aries Electronics
IC & Component Sockets 8P SMD SCKT TIN/GOLD
IC & Component Sockets 8P SMD SCKT TIN/GOLD
auf Bestellung 194 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 3.01 EUR |
10+ | 2.46 EUR |
100+ | 2.15 EUR |
500+ | 1.99 EUR |
1000+ | 1.81 EUR |
2500+ | 1.74 EUR |
10000+ | 1.68 EUR |
14-600-10 |
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Hersteller: Aries Electronics
IC & Component Sockets 14P FORK DIP HDR
IC & Component Sockets 14P FORK DIP HDR
auf Bestellung 156 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
26+ | 3.33 EUR |
104+ | 2.92 EUR |
520+ | 2.11 EUR |
1014+ | 1.99 EUR |
5018+ | 1.95 EUR |
18-650-10 |
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Hersteller: Aries Electronics
IC & Component Sockets 18P DIP CVR HT .270" MAX COMP HT .125"
IC & Component Sockets 18P DIP CVR HT .270" MAX COMP HT .125"
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
20-3518-10 |
![]() |
Hersteller: Aries Electronics
IC & Component Sockets 20P SOLDER TIN/GLD
IC & Component Sockets 20P SOLDER TIN/GLD
auf Bestellung 817 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
19+ | 2.04 EUR |
114+ | 1.87 EUR |
513+ | 1.72 EUR |
1007+ | 1.63 EUR |
2508+ | 1.53 EUR |
5016+ | 1.52 EUR |
24-6554-10 |
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Hersteller: Aries Electronics
IC & Component Sockets 24P TEST SOCKET TIN
IC & Component Sockets 24P TEST SOCKET TIN
auf Bestellung 97 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 24.06 EUR |
10+ | 19.43 EUR |
30+ | 16.61 EUR |
250+ | 14.10 EUR |
500+ | 13.16 EUR |
1000+ | 12.32 EUR |
03-0513-10 |
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Hersteller: Aries Electronics
IC & Component Sockets 3P COLLET IN-LINE SOCKET
IC & Component Sockets 3P COLLET IN-LINE SOCKET
auf Bestellung 117 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 1.25 EUR |
10+ | 1.07 EUR |
100+ | 0.96 EUR |
500+ | 0.70 EUR |
1000+ | 0.68 EUR |
2500+ | 0.66 EUR |
5000+ | 0.64 EUR |
16-600-11 |
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Hersteller: Aries Electronics
IC & Component Sockets 16P DIP FORK HDR GLD
IC & Component Sockets 16P DIP FORK HDR GLD
auf Bestellung 337 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 6.04 EUR |
10+ | 4.63 EUR |
115+ | 3.89 EUR |
506+ | 3.33 EUR |
1012+ | 3.12 EUR |
2507+ | 3.08 EUR |
5014+ | 2.83 EUR |
25-0600-10 |
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Hersteller: Aries Electronics
IC & Component Sockets STRIP LINE 25 PINS COINED CONTACT
IC & Component Sockets STRIP LINE 25 PINS COINED CONTACT
auf Bestellung 222 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 5.42 EUR |
10+ | 4.80 EUR |
100+ | 4.59 EUR |
500+ | 4.14 EUR |
1000+ | 3.66 EUR |