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84-PRS11010-12 Aries Electronics Description: ZIF 11X11 84PIN FOOTPRN 11010
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
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40-6556-30 Aries Electronics Description: 40 POS TEST SOCK RECEPT SOLDER
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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16-822-90E Aries Electronics Description: 16 PIN RT ANGLE HORIZONTAL SOCKT
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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108-PRS12024-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
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20-6513-10 Aries Electronics Description: IC SOCK COLLET CT 20 PIN GOLD
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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32-8800-610C Aries Electronics Description: CONN ELEVATOR SOCKET 32 PIN .600
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Produkt ist nicht verfügbar
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LCQT-TSOP40 LCQT-TSOP40 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER TSOP TO 40DIP
Package Accepted: TSOP
Pitch: 0.020" (0.50mm)
Number of Positions: 40
Material: FR4 Epoxy Glass
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Packaging: Tube
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
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LCQT-TSOP40-1 LCQT-TSOP40-1 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER TSOP TO 40DIP
Package Accepted: TSOP
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
Pitch: 0.020" (0.50mm)
Number of Positions: 40
Material: FR4 Epoxy Glass
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Packaging: Tube
Produkt ist nicht verfügbar
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06-2503-30 Aries Electronics 12012-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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06-2503-31 Aries Electronics 12012-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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SP200 SP200 Aries Electronics 16009-shorting-plug-and-jack.pdf Description: PLUG SHORTING INSULATED BLACK
Packaging: Bulk
Gender: Male Pins
Contact Finish: Gold
Color: Black
Current Rating (Amps): 5A
Pitch: 0.200" (5.08mm)
Type: Closed Top, Grip
Height: 0.480" (12.20mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: 10.0µin (0.25µm)
Material Flammability Rating: UL94 V-0
Housing Material: Polyamide (PA46), Nylon 4/6
auf Bestellung 443 Stücke:
Lieferzeit 10-14 Tag (e)
3+9.07 EUR
10+7.71 EUR
25+7.22 EUR
50+6.88 EUR
100+6.56 EUR
250+6.14 EUR
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181-PRS15006-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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225-PRS15001-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
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08-2503-30 08-2503-30 Aries Electronics 12012-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
auf Bestellung 121 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.73 EUR
10+7.43 EUR
25+6.96 EUR
50+6.63 EUR
100+6.31 EUR
Mindestbestellmenge: 3 Stücke
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08-2503-20 Aries Electronics 12012-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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08-2503-21 Aries Electronics 12012-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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08-2503-31 Aries Electronics 12012-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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20-555000-00 Aries Electronics Description: SOCKET ADAPTER SSOP/SOWIC 20POS
Packaging: Bulk
Number of Pins: 20
Mounting Type: Surface Mount
Convert From (Adapter End): SSOP
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
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62-PRS21031-12 Aries Electronics 14033-pga-socket-header.pdf Description: SOCKET
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 62
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
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14-350003-10-P Aries Electronics Description: ADAPTER BREAKOUT BOARDS
Package Accepted: SOIC, SOJ
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
Pitch: 0.050" (1.27mm)
Number of Positions: 14
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.380" W (17.78mm x 9.65mm)
Packaging: Bulk
Produkt ist nicht verfügbar
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14-350003-10 Aries Electronics Description: ADAPTER BREAKOUT BOARDS
Package Accepted: SOIC
Proto Board Type: SOIC to DIP
Board Thickness: 0.062" (1.57mm)
Pitch: 0.300" (7.62mm)
Number of Positions: 14
Material: FR4 Epoxy Glass
Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm)
Packaging: Bulk
Produkt ist nicht verfügbar
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14-350003-11-RC Aries Electronics Description: ADAPTER BREAKOUT BOARDS
Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm)
Packaging: Bulk
Package Accepted: SOIC
Proto Board Type: SOIC to DIP
Board Thickness: 0.062" (1.57mm)
Pitch: 0.300" (7.62mm)
Number of Positions: 14
Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
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40-600-20 Aries Electronics Description: CONN HDR DIP POST 40POS TIN
Number of Rows: 2
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Row Spacing: 0.600" (15.24mm)
Contact Type: Post
Pitch: 0.100" (2.54mm)
Number of Positions: 40
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: DIP, DIL - Header
Packaging: Bulk
Produkt ist nicht verfügbar
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28-653000-11-RC-P Aries Electronics Description: SOCKET ADAPTER
Packaging: Bulk
Produkt ist nicht verfügbar
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56-PGM09008-10 Aries Electronics Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 56
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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56-PGM09009-10 Aries Electronics Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 56
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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184-PRS15075-12 Aries Electronics Description: SOCKET
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 184
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
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108-PGM12004-11H Aries Electronics Description: SOCKET
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 108
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Packaging: Bulk
Produkt ist nicht verfügbar
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14-6501-30 Aries Electronics Description: .6 WW SOCKET
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
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208-PGM17059-10 Aries Electronics Description: SOCKET
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 208
Operating Temperature: -55°C ~ 105°C
Type: PGA
Mounting Type: Through Hole
Packaging: Bulk
Produkt ist nicht verfügbar
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24-350000-10-P Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 24.000" L x 0.450" W (609.60mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.300" (7.62mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: SOIC to DIP
Package Accepted: SOIC
Produkt ist nicht verfügbar
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24-350000-11-RC-P Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Produkt ist nicht verfügbar
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08-8375-310C Aries Electronics 14033-pga-socket-header.pdf Description: SOCKET
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
 Mindestbestellmenge: 13 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
ME-100 ME-100 Aries Electronics 16001-economy-miniature-jumper-355429.pdf Headers & Wire Housings Economy Mini-Link
auf Bestellung 20693 Stücke:
Lieferzeit 10-14 Tag (e)
9+0.39 EUR
13+0.27 EUR
100+0.23 EUR
500+0.21 EUR
1000+0.18 EUR
2000+0.17 EUR
10000+0.15 EUR
Mindestbestellmenge: 9 Stücke
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ML-100 ML-100 Aries Electronics 16002-miniature-jumper-337456.pdf Headers & Wire Housings MINILINK MINI JUMPER
auf Bestellung 802 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
ML-100S ML-100S Aries Electronics 16002-miniature-jumper-337456.pdf Headers & Wire Housings .10 JUMPER CLOSED Au
auf Bestellung 352 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
20-680-191T 20-680-191T Aries Electronics 16005-program-header-and-cover-337303.pdf Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
1+3.39 EUR
10+3.27 EUR
100+2.87 EUR
500+2.37 EUR
1000+2.26 EUR
2500+2.18 EUR
5000+2.12 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-675-190T Aries Electronics 16004-program-header-337740.pdf Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+4.52 EUR
10+3.69 EUR
104+3.56 EUR
520+3.25 EUR
1014+2.89 EUR
2522+2.7 EUR
5018+2.56 EUR
Im Einkaufswagen  Stück im Wert von  UAH
20-680-191TC 20-680-191TC Aries Electronics 16005-program-header-and-cover-337303.pdf Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-675-191 Aries Electronics 16004-program-header.pdf Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)
1+6.22 EUR
10+5.65 EUR
26+5.37 EUR
104+3.47 EUR
1014+3.39 EUR
2522+3.28 EUR
5018+3.2 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-675-191T Aries Electronics 16004-program-header-337740.pdf Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-675-190 Aries Electronics 16004-program-header-337740.pdf Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
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Im Einkaufswagen  Stück im Wert von  UAH
14-675-191TC Aries Electronics 16004-program-header-1225712.pdf IC & Component Sockets
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-9625-11 Aries Electronics 12035-dip-header-1225754.pdf IC & Component Sockets
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-350000-11-RC 16-350000-11-RC Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf IC & Component Sockets SOIC 16-PIN DIP ADAPTER
auf Bestellung 511 Stücke:
Lieferzeit 10-14 Tag (e)
1+47.59 EUR
10+44.64 EUR
24+40.67 EUR
48+38.79 EUR
264+37.13 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-6554-11 28-6554-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf IC & Component Sockets 28 PIN W/HANDLE
auf Bestellung 106 Stücke:
Lieferzeit 10-14 Tag (e)
1+90.04 EUR
9+78.29 EUR
27+74.92 EUR
54+72.48 EUR
108+70.06 EUR
252+66.2 EUR
Im Einkaufswagen  Stück im Wert von  UAH
08-3518-10 08-3518-10 Aries Electronics 12016-open-frame-dip-collet-solder-tail-socket-336841.pdf IC & Component Sockets 8P SOLDER TIN/GLD
auf Bestellung 1372 Stücke:
Lieferzeit 10-14 Tag (e)
49+1.27 EUR
98+1.05 EUR
539+0.94 EUR
1029+0.86 EUR
Mindestbestellmenge: 49 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
40-6518-10 40-6518-10 Aries Electronics 12016_open_frame_dip_collet_solder_tail_socket.pdf IC & Component Sockets 40P SOLDER TIN/GLD
auf Bestellung 267 Stücke:
Lieferzeit 10-14 Tag (e)
1+14.3 EUR
12+11.85 EUR
24+11.02 EUR
60+10.7 EUR
108+10.26 EUR
252+9.67 EUR
504+9.2 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-3518-10 14-3518-10 Aries Electronics 12016_open_frame_dip_collet_solder_tail_socket.pdf IC & Component Sockets 14P SOLDER TIN/GLD
auf Bestellung 513 Stücke:
Lieferzeit 10-14 Tag (e)
1+3.58 EUR
10+3.09 EUR
28+2.62 EUR
112+2.45 EUR
252+2.26 EUR
504+2.14 EUR
1008+2.12 EUR
Im Einkaufswagen  Stück im Wert von  UAH
10-4823-90C 10-4823-90C Aries Electronics 13005-horizontal-display-socket-335797.pdf IC & Component Sockets VERTISOCKETS HORIZ COLLET 10 PINS
auf Bestellung 118 Stücke:
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Im Einkaufswagen  Stück im Wert von  UAH
14-350000-11-RC 14-350000-11-RC Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf IC & Component Sockets SOIC DIP ADAPTER
auf Bestellung 167 Stücke:
Lieferzeit 10-14 Tag (e)
1+47.15 EUR
10+40.09 EUR
25+37.28 EUR
50+35.5 EUR
100+33.81 EUR
264+31.94 EUR
528+31.48 EUR
Im Einkaufswagen  Stück im Wert von  UAH
25-0513-10 25-0513-10 Aries Electronics 12013-pin-line-collet-socket.pdf IC & Component Sockets 25P SOLDER TAIL TIN
auf Bestellung 357 Stücke:
Lieferzeit 10-14 Tag (e)
1+7.91 EUR
10+6.75 EUR
100+5.71 EUR
500+5.09 EUR
1000+4.86 EUR
Im Einkaufswagen  Stück im Wert von  UAH
20-350000-11-RC 20-350000-11-RC Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf IC & Component Sockets SOIC DIP ADAPTER
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+60 EUR
10+48.74 EUR
19+46.39 EUR
57+45.09 EUR
114+42.94 EUR
266+40.98 EUR
Im Einkaufswagen  Stück im Wert von  UAH
40-0518-10 40-0518-10 Aries Electronics 12020_single_dual_row_solder_pin_tails_collet_socket.pdf IC & Component Sockets 40P LO-PRO STRIP TIN
auf Bestellung 1668 Stücke:
Lieferzeit 10-14 Tag (e)
1+8.48 EUR
10+7.63 EUR
25+7.27 EUR
50+7.14 EUR
100+6.5 EUR
250+6.43 EUR
500+5.89 EUR
Im Einkaufswagen  Stück im Wert von  UAH
40-6554-10 40-6554-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf IC & Component Sockets 40P TEST SOCKET TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-6554-10 28-6554-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf IC & Component Sockets 28P TEST SOCKET TIN
auf Bestellung 115 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.39 EUR
9+23.73 EUR
27+22.51 EUR
54+22.18 EUR
108+19.59 EUR
252+18.27 EUR
504+17.86 EUR
Im Einkaufswagen  Stück im Wert von  UAH
16-675-191 16-675-191 Aries Electronics 16004-program-header.pdf Headers & Wire Housings DIP PROGRAM HEADERS 16 PINS
auf Bestellung 325 Stücke:
Lieferzeit 10-14 Tag (e)
1+5.57 EUR
10+4.46 EUR
23+4.44 EUR
115+3.97 EUR
506+3.58 EUR
1012+3.42 EUR
2507+3.33 EUR
Im Einkaufswagen  Stück im Wert von  UAH
16-0600-11 16-0600-11 Aries Electronics 12034_strip_line_header.pdf IC & Component Sockets STRIP LINE 16 PINS COINED CONTACT
auf Bestellung 294 Stücke:
Lieferzeit 10-14 Tag (e)
1+9.23 EUR
10+6.24 EUR
50+5.21 EUR
250+4.84 EUR
500+4.77 EUR
Im Einkaufswagen  Stück im Wert von  UAH
16-810-90C 16-810-90C Aries Electronics 13004-vertical-display-socket-337448.pdf IC & Component Sockets VERTISOCKETS VERT COLLET 16 PINS
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.67 EUR
10+22.37 EUR
25+20.63 EUR
100+16.84 EUR
250+15.6 EUR
500+15.04 EUR
1000+14.45 EUR
Im Einkaufswagen  Stück im Wert von  UAH
48-3552-11 48-3552-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf IC & Component Sockets DIP TEST SCKT GOLD 48 PINS
Produkt ist nicht verfügbar
 Mindestbestellmenge: 54 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
84-PRS11010-12
Hersteller: Aries Electronics
Description: ZIF 11X11 84PIN FOOTPRN 11010
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Mindestbestellmenge: 6 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
40-6556-30
Hersteller: Aries Electronics
Description: 40 POS TEST SOCK RECEPT SOLDER
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 27 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
16-822-90E
Hersteller: Aries Electronics
Description: 16 PIN RT ANGLE HORIZONTAL SOCKT
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Mindestbestellmenge: 81 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
108-PRS12024-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
20-6513-10
Hersteller: Aries Electronics
Description: IC SOCK COLLET CT 20 PIN GOLD
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 159 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
32-8800-610C
Hersteller: Aries Electronics
Description: CONN ELEVATOR SOCKET 32 PIN .600
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Produkt ist nicht verfügbar
Mindestbestellmenge: 24 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
LCQT-TSOP40 19000-small-outline-prototyping-adapters.pdf
LCQT-TSOP40
Hersteller: Aries Electronics
Description: SOCKET ADAPTER TSOP TO 40DIP
Package Accepted: TSOP
Pitch: 0.020" (0.50mm)
Number of Positions: 40
Material: FR4 Epoxy Glass
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Packaging: Tube
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
Produkt ist nicht verfügbar
Mindestbestellmenge: 72 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
LCQT-TSOP40-1 19000-small-outline-prototyping-adapters.pdf
LCQT-TSOP40-1
Hersteller: Aries Electronics
Description: SOCKET ADAPTER TSOP TO 40DIP
Package Accepted: TSOP
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
Pitch: 0.020" (0.50mm)
Number of Positions: 40
Material: FR4 Epoxy Glass
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Packaging: Tube
Produkt ist nicht verfügbar
Mindestbestellmenge: 72 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
06-2503-30 12012-dip-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Mindestbestellmenge: 139 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
06-2503-31 12012-dip-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Mindestbestellmenge: 68 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
SP200 16009-shorting-plug-and-jack.pdf
SP200
Hersteller: Aries Electronics
Description: PLUG SHORTING INSULATED BLACK
Packaging: Bulk
Gender: Male Pins
Contact Finish: Gold
Color: Black
Current Rating (Amps): 5A
Pitch: 0.200" (5.08mm)
Type: Closed Top, Grip
Height: 0.480" (12.20mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: 10.0µin (0.25µm)
Material Flammability Rating: UL94 V-0
Housing Material: Polyamide (PA46), Nylon 4/6
auf Bestellung 443 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.07 EUR
10+7.71 EUR
25+7.22 EUR
50+6.88 EUR
100+6.56 EUR
250+6.14 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
181-PRS15006-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Mindestbestellmenge: 5 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
225-PRS15001-16 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-2503-30 12012-dip-collet-socket.pdf
08-2503-30
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
auf Bestellung 121 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+8.73 EUR
10+7.43 EUR
25+6.96 EUR
50+6.63 EUR
100+6.31 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
08-2503-20 12012-dip-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Mindestbestellmenge: 133 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
08-2503-21 12012-dip-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Mindestbestellmenge: 63 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
08-2503-31 12012-dip-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Mindestbestellmenge: 63 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
20-555000-00
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP/SOWIC 20POS
Packaging: Bulk
Number of Pins: 20
Mounting Type: Surface Mount
Convert From (Adapter End): SSOP
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Mindestbestellmenge: 20 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
62-PRS21031-12 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: SOCKET
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 62
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-350003-10-P
Hersteller: Aries Electronics
Description: ADAPTER BREAKOUT BOARDS
Package Accepted: SOIC, SOJ
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
Pitch: 0.050" (1.27mm)
Number of Positions: 14
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.380" W (17.78mm x 9.65mm)
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 322 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
14-350003-10
Hersteller: Aries Electronics
Description: ADAPTER BREAKOUT BOARDS
Package Accepted: SOIC
Proto Board Type: SOIC to DIP
Board Thickness: 0.062" (1.57mm)
Pitch: 0.300" (7.62mm)
Number of Positions: 14
Material: FR4 Epoxy Glass
Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm)
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 28 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
14-350003-11-RC
Hersteller: Aries Electronics
Description: ADAPTER BREAKOUT BOARDS
Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm)
Packaging: Bulk
Package Accepted: SOIC
Proto Board Type: SOIC to DIP
Board Thickness: 0.062" (1.57mm)
Pitch: 0.300" (7.62mm)
Number of Positions: 14
Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Mindestbestellmenge: 28 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
40-600-20
Hersteller: Aries Electronics
Description: CONN HDR DIP POST 40POS TIN
Number of Rows: 2
Contact Finish Thickness: 200.0µin (5.08µm)
Termination: Solder
Row Spacing: 0.600" (15.24mm)
Contact Type: Post
Pitch: 0.100" (2.54mm)
Number of Positions: 40
Mounting Type: Through Hole
Color: Black
Contact Finish: Tin
Connector Type: DIP, DIL - Header
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 82 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-653000-11-RC-P
Hersteller: Aries Electronics
Description: SOCKET ADAPTER
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 17 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
56-PGM09008-10
Hersteller: Aries Electronics
Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 56
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 9 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
56-PGM09009-10
Hersteller: Aries Electronics
Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 56
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 9 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
184-PRS15075-12
Hersteller: Aries Electronics
Description: SOCKET
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 184
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
108-PGM12004-11H
Hersteller: Aries Electronics
Description: SOCKET
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 108
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
14-6501-30
Hersteller: Aries Electronics
Description: .6 WW SOCKET
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 75 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
208-PGM17059-10
Hersteller: Aries Electronics
Description: SOCKET
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 208
Operating Temperature: -55°C ~ 105°C
Type: PGA
Mounting Type: Through Hole
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
24-350000-10-P 18010-soic-and-soj-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 24.000" L x 0.450" W (609.60mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.300" (7.62mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: SOIC to DIP
Package Accepted: SOIC
Produkt ist nicht verfügbar
Mindestbestellmenge: 154 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
24-350000-11-RC-P 18010-soic-and-soj-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 154 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
08-8375-310C 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: SOCKET
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 13 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
ME-100 16001-economy-miniature-jumper-355429.pdf
ME-100
Hersteller: Aries Electronics
Headers & Wire Housings Economy Mini-Link
auf Bestellung 20693 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
9+0.39 EUR
13+0.27 EUR
100+0.23 EUR
500+0.21 EUR
1000+0.18 EUR
2000+0.17 EUR
10000+0.15 EUR
Mindestbestellmenge: 9 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
ML-100 16002-miniature-jumper-337456.pdf
ML-100
Hersteller: Aries Electronics
Headers & Wire Housings MINILINK MINI JUMPER
auf Bestellung 802 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
ML-100S 16002-miniature-jumper-337456.pdf
ML-100S
Hersteller: Aries Electronics
Headers & Wire Housings .10 JUMPER CLOSED Au
auf Bestellung 352 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
20-680-191T 16005-program-header-and-cover-337303.pdf
20-680-191T
Hersteller: Aries Electronics
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+3.39 EUR
10+3.27 EUR
100+2.87 EUR
500+2.37 EUR
1000+2.26 EUR
2500+2.18 EUR
5000+2.12 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-675-190T 16004-program-header-337740.pdf
Hersteller: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+4.52 EUR
10+3.69 EUR
104+3.56 EUR
520+3.25 EUR
1014+2.89 EUR
2522+2.7 EUR
5018+2.56 EUR
Im Einkaufswagen  Stück im Wert von  UAH
20-680-191TC 16005-program-header-and-cover-337303.pdf
20-680-191TC
Hersteller: Aries Electronics
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-675-191 16004-program-header.pdf
Hersteller: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+6.22 EUR
10+5.65 EUR
26+5.37 EUR
104+3.47 EUR
1014+3.39 EUR
2522+3.28 EUR
5018+3.2 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-675-191T 16004-program-header-337740.pdf
Hersteller: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-675-190 16004-program-header-337740.pdf
Hersteller: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-675-191TC 16004-program-header-1225712.pdf
Hersteller: Aries Electronics
IC & Component Sockets
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-9625-11 12035-dip-header-1225754.pdf
Hersteller: Aries Electronics
IC & Component Sockets
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-350000-11-RC 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
16-350000-11-RC
Hersteller: Aries Electronics
IC & Component Sockets SOIC 16-PIN DIP ADAPTER
auf Bestellung 511 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+47.59 EUR
10+44.64 EUR
24+40.67 EUR
48+38.79 EUR
264+37.13 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-6554-11 10001-universal-dip-zif-test-socket.pdf
28-6554-11
Hersteller: Aries Electronics
IC & Component Sockets 28 PIN W/HANDLE
auf Bestellung 106 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+90.04 EUR
9+78.29 EUR
27+74.92 EUR
54+72.48 EUR
108+70.06 EUR
252+66.2 EUR
Im Einkaufswagen  Stück im Wert von  UAH
08-3518-10 12016-open-frame-dip-collet-solder-tail-socket-336841.pdf
08-3518-10
Hersteller: Aries Electronics
IC & Component Sockets 8P SOLDER TIN/GLD
auf Bestellung 1372 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
49+1.27 EUR
98+1.05 EUR
539+0.94 EUR
1029+0.86 EUR
Mindestbestellmenge: 49 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
40-6518-10 12016_open_frame_dip_collet_solder_tail_socket.pdf
40-6518-10
Hersteller: Aries Electronics
IC & Component Sockets 40P SOLDER TIN/GLD
auf Bestellung 267 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+14.3 EUR
12+11.85 EUR
24+11.02 EUR
60+10.7 EUR
108+10.26 EUR
252+9.67 EUR
504+9.2 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-3518-10 12016_open_frame_dip_collet_solder_tail_socket.pdf
14-3518-10
Hersteller: Aries Electronics
IC & Component Sockets 14P SOLDER TIN/GLD
auf Bestellung 513 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+3.58 EUR
10+3.09 EUR
28+2.62 EUR
112+2.45 EUR
252+2.26 EUR
504+2.14 EUR
1008+2.12 EUR
Im Einkaufswagen  Stück im Wert von  UAH
10-4823-90C 13005-horizontal-display-socket-335797.pdf
10-4823-90C
Hersteller: Aries Electronics
IC & Component Sockets VERTISOCKETS HORIZ COLLET 10 PINS
auf Bestellung 118 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
14-350000-11-RC 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
14-350000-11-RC
Hersteller: Aries Electronics
IC & Component Sockets SOIC DIP ADAPTER
auf Bestellung 167 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+47.15 EUR
10+40.09 EUR
25+37.28 EUR
50+35.5 EUR
100+33.81 EUR
264+31.94 EUR
528+31.48 EUR
Im Einkaufswagen  Stück im Wert von  UAH
25-0513-10 12013-pin-line-collet-socket.pdf
25-0513-10
Hersteller: Aries Electronics
IC & Component Sockets 25P SOLDER TAIL TIN
auf Bestellung 357 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+7.91 EUR
10+6.75 EUR
100+5.71 EUR
500+5.09 EUR
1000+4.86 EUR
Im Einkaufswagen  Stück im Wert von  UAH
20-350000-11-RC 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
20-350000-11-RC
Hersteller: Aries Electronics
IC & Component Sockets SOIC DIP ADAPTER
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+60 EUR
10+48.74 EUR
19+46.39 EUR
57+45.09 EUR
114+42.94 EUR
266+40.98 EUR
Im Einkaufswagen  Stück im Wert von  UAH
40-0518-10 12020_single_dual_row_solder_pin_tails_collet_socket.pdf
40-0518-10
Hersteller: Aries Electronics
IC & Component Sockets 40P LO-PRO STRIP TIN
auf Bestellung 1668 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+8.48 EUR
10+7.63 EUR
25+7.27 EUR
50+7.14 EUR
100+6.5 EUR
250+6.43 EUR
500+5.89 EUR
Im Einkaufswagen  Stück im Wert von  UAH
40-6554-10 10001-universal-dip-zif-test-socket.pdf
40-6554-10
Hersteller: Aries Electronics
IC & Component Sockets 40P TEST SOCKET TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-6554-10 10001-universal-dip-zif-test-socket.pdf
28-6554-10
Hersteller: Aries Electronics
IC & Component Sockets 28P TEST SOCKET TIN
auf Bestellung 115 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+27.39 EUR
9+23.73 EUR
27+22.51 EUR
54+22.18 EUR
108+19.59 EUR
252+18.27 EUR
504+17.86 EUR
Im Einkaufswagen  Stück im Wert von  UAH
16-675-191 16004-program-header.pdf
16-675-191
Hersteller: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 16 PINS
auf Bestellung 325 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+5.57 EUR
10+4.46 EUR
23+4.44 EUR
115+3.97 EUR
506+3.58 EUR
1012+3.42 EUR
2507+3.33 EUR
Im Einkaufswagen  Stück im Wert von  UAH
16-0600-11 12034_strip_line_header.pdf
16-0600-11
Hersteller: Aries Electronics
IC & Component Sockets STRIP LINE 16 PINS COINED CONTACT
auf Bestellung 294 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+9.23 EUR
10+6.24 EUR
50+5.21 EUR
250+4.84 EUR
500+4.77 EUR
Im Einkaufswagen  Stück im Wert von  UAH
16-810-90C 13004-vertical-display-socket-337448.pdf
16-810-90C
Hersteller: Aries Electronics
IC & Component Sockets VERTISOCKETS VERT COLLET 16 PINS
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+24.67 EUR
10+22.37 EUR
25+20.63 EUR
100+16.84 EUR
250+15.6 EUR
500+15.04 EUR
1000+14.45 EUR
Im Einkaufswagen  Stück im Wert von  UAH
48-3552-11 10001-universal-dip-zif-test-socket.pdf
48-3552-11
Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT GOLD 48 PINS
Produkt ist nicht verfügbar
Mindestbestellmenge: 54 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
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