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84-PRS11010-12 Aries Electronics Description: ZIF 11X11 84PIN FOOTPRN 11010
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
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40-6556-30 Aries Electronics Description: 40 POS TEST SOCK RECEPT SOLDER
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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16-822-90E Aries Electronics Description: 16 PIN RT ANGLE HORIZONTAL SOCKT
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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108-PRS12024-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
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20-6513-10 Aries Electronics Description: IC SOCK COLLET CT 20 PIN GOLD
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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32-8800-610C Aries Electronics Description: CONN ELEVATOR SOCKET 32 PIN .600
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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LCQT-TSOP40 LCQT-TSOP40 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER TSOP TO 40DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Produkt ist nicht verfügbar
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LCQT-TSOP40-1 LCQT-TSOP40-1 Aries Electronics 19000-small-outline-prototyping-adapters.pdf Description: SOCKET ADAPTER TSOP TO 40DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Produkt ist nicht verfügbar
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06-2503-30 Aries Electronics 12012-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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06-2503-31 Aries Electronics 12012-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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SP200 SP200 Aries Electronics 16009-shorting-plug-and-jack.pdf Description: PLUG SHORTING INSULATED BLACK
Packaging: Bulk
Gender: Male Pins
Contact Finish: Gold
Color: Black
Current Rating (Amps): 5A
Pitch: 0.200" (5.08mm)
Type: Closed Top, Grip
Height: 0.480" (12.20mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: 10.0µin (0.25µm)
Material Flammability Rating: UL94 V-0
Housing Material: Polyamide (PA46), Nylon 4/6
auf Bestellung 443 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.73 EUR
10+6.56 EUR
25+6.15 EUR
50+5.85 EUR
100+5.57 EUR
250+5.23 EUR
Mindestbestellmenge: 3
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181-PRS15006-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
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225-PRS15001-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
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08-2503-30 08-2503-30 Aries Electronics 12012-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
auf Bestellung 121 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.34 EUR
10+6.24 EUR
25+5.85 EUR
50+5.57 EUR
100+5.3 EUR
Mindestbestellmenge: 3
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08-2503-20 Aries Electronics 12012-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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08-2503-21 Aries Electronics 12012-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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08-2503-31 Aries Electronics 12012-dip-collet-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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20-555000-00 Aries Electronics Description: SOCKET ADAPTER SSOP/SOWIC 20POS
Packaging: Bulk
Number of Pins: 20
Mounting Type: Surface Mount
Convert From (Adapter End): SSOP
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
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62-PRS21031-12 Aries Electronics Description: SOCKET
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 62
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
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14-350003-10-P Aries Electronics Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 0.700" L x 0.380" W (17.78mm x 9.65mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOJ
Produkt ist nicht verfügbar
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14-350003-10 Aries Electronics Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.300" (7.62mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: SOIC to DIP
Package Accepted: SOIC
Produkt ist nicht verfügbar
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14-350003-11-RC Aries Electronics Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.300" (7.62mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: SOIC to DIP
Package Accepted: SOIC
Produkt ist nicht verfügbar
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40-600-20 Aries Electronics Description: CONN HDR DIP POST 40POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 40
Pitch: 0.100" (2.54mm)
Contact Type: Post
Row Spacing: 0.600" (15.24mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
Produkt ist nicht verfügbar
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28-653000-11-RC-P Aries Electronics Description: SOCKET ADAPTER
Packaging: Bulk
Produkt ist nicht verfügbar
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56-PGM09008-10 Aries Electronics Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 56
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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56-PGM09009-10 Aries Electronics Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 56
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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184-PRS15075-12 Aries Electronics Description: SOCKET
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 184
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
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108-PGM12004-11H Aries Electronics Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 108
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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14-6501-30 Aries Electronics Description: .6 WW SOCKET
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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208-PGM17059-10 Aries Electronics Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 208
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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1110748 1110748 Aries Electronics 18043-surface-mount-to-dip-jedec-sot-adapter.pdf Description: SOCKET ADAPTER SOT25 TO 6DIP 0.3
Packaging: Bulk
Size / Dimension: 0.300" L x 0.400" W (7.62mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.87 EUR
10+21.98 EUR
25+20.6 EUR
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24-350000-10-P Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 24.000" L x 0.450" W (609.60mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.300" (7.62mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: SOIC to DIP
Package Accepted: SOIC
Produkt ist nicht verfügbar
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24-350000-11-RC-P Aries Electronics 18010-soic-and-soj-to-dip-adapter.pdf Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Produkt ist nicht verfügbar
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ME-100 ME-100 Aries Electronics 16001-economy-miniature-jumper-355429.pdf Headers & Wire Housings Economy Mini-Link
auf Bestellung 20693 Stücke:
Lieferzeit 10-14 Tag (e)
9+0.33 EUR
13+0.23 EUR
100+0.19 EUR
500+0.18 EUR
1000+0.15 EUR
2000+0.14 EUR
10000+0.13 EUR
Mindestbestellmenge: 9
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ML-100 ML-100 Aries Electronics 16002-miniature-jumper-337456.pdf Headers & Wire Housings MINILINK MINI JUMPER
auf Bestellung 802 Stücke:
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ML-100S ML-100S Aries Electronics 16002-miniature-jumper-337456.pdf Headers & Wire Housings .10 JUMPER CLOSED Au
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20-680-191T 20-680-191T Aries Electronics 16005-program-header-and-cover-337303.pdf Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
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1+2.85 EUR
10+2.75 EUR
100+2.41 EUR
500+1.99 EUR
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2500+1.83 EUR
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14-675-190T Aries Electronics 16004-program-header-337740.pdf Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
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1+3.8 EUR
10+3.1 EUR
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520+2.73 EUR
1014+2.43 EUR
2522+2.27 EUR
5018+2.15 EUR
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20-680-191TC 20-680-191TC Aries Electronics 16005-program-header-and-cover-337303.pdf Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
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14-675-191 Aries Electronics 16004-program-header-337740.pdf Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
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14-675-191T Aries Electronics 16004-program-header-337740.pdf Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
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14-675-190 Aries Electronics 16004-program-header-337740.pdf Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
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14-675-191TC Aries Electronics 16004-program-header-1225712.pdf IC & Component Sockets
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14-9625-11 Aries Electronics 12035-dip-header-1225754.pdf IC & Component Sockets
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16-350000-11-RC 16-350000-11-RC Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf IC & Component Sockets SOIC 16-PIN DIP ADAPTER
auf Bestellung 256 Stücke:
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1+41.57 EUR
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28-6554-11 28-6554-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf IC & Component Sockets 28 PIN W/HANDLE
auf Bestellung 9 Stücke:
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1+39.2 EUR
9+31.94 EUR
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108+28.16 EUR
252+26.52 EUR
504+26.14 EUR
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08-3518-10 08-3518-10 Aries Electronics 12016-open-frame-dip-collet-solder-tail-socket-336841.pdf IC & Component Sockets 8P SOLDER TIN/GLD
auf Bestellung 1372 Stücke:
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49+1.07 EUR
98+0.88 EUR
539+0.79 EUR
1029+0.72 EUR
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40-6518-10 40-6518-10 Aries Electronics 12016_open_frame_dip_collet_solder_tail_socket.pdf IC & Component Sockets 40P SOLDER TIN/GLD
auf Bestellung 267 Stücke:
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12+9.96 EUR
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60+8.99 EUR
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252+8.13 EUR
504+7.73 EUR
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14-3518-10 14-3518-10 Aries Electronics 12016-open-frame-dip-collet-solder-tail-socket-336841.pdf IC & Component Sockets 14P SOLDER TIN/GLD
auf Bestellung 396 Stücke:
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2+2.69 EUR
10+1.74 EUR
112+1.42 EUR
504+1.35 EUR
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2520+1.18 EUR
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10-4823-90C 10-4823-90C Aries Electronics 13005-horizontal-display-socket-335797.pdf IC & Component Sockets VERTISOCKETS HORIZ COLLET 10 PINS
auf Bestellung 118 Stücke:
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14-350000-11-RC 14-350000-11-RC Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf IC & Component Sockets SOIC DIP ADAPTER
auf Bestellung 351 Stücke:
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1+39.62 EUR
10+33.69 EUR
25+31.33 EUR
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100+26.84 EUR
264+26.45 EUR
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25-0513-10 25-0513-10 Aries Electronics 12013-pin-line-collet-socket.pdf IC & Component Sockets 25P SOLDER TAIL TIN
auf Bestellung 71 Stücke:
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1+7.13 EUR
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50+6 EUR
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20-350000-11-RC 20-350000-11-RC Aries Electronics 18010rc-rohs-compliant-soic-to-dip-adapter.pdf IC & Component Sockets SOIC DIP ADAPTER
auf Bestellung 43 Stücke:
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1+49.68 EUR
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19+39.78 EUR
57+38.88 EUR
114+37.15 EUR
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40-0518-10 40-0518-10 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf IC & Component Sockets 40P LO-PRO STRIP TIN
auf Bestellung 598 Stücke:
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1+6.69 EUR
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40-6554-10 40-6554-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf IC & Component Sockets 40P TEST SOCKET TIN
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28-6554-10 28-6554-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf IC & Component Sockets 28P TEST SOCKET TIN
auf Bestellung 115 Stücke:
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1+23.02 EUR
9+19.94 EUR
27+18.92 EUR
54+18.64 EUR
108+16.46 EUR
252+15.35 EUR
504+15.01 EUR
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16-675-191 16-675-191 Aries Electronics 16004-program-header-337740.pdf Headers & Wire Housings DIP PROGRAM HEADERS 16 PINS
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16-0600-11 16-0600-11 Aries Electronics 12034-strip-line-header.pdf IC & Component Sockets STRIP LINE 16 PINS COINED CONTACT
auf Bestellung 294 Stücke:
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1+7.76 EUR
10+5.24 EUR
50+4.38 EUR
250+4.07 EUR
500+4.01 EUR
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16-810-90C 16-810-90C Aries Electronics 13004-vertical-display-socket-337448.pdf IC & Component Sockets VERTISOCKETS VERT COLLET 16 PINS
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.73 EUR
10+18.8 EUR
25+17.34 EUR
100+14.15 EUR
250+13.11 EUR
500+12.64 EUR
1000+12.14 EUR
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48-3552-11 48-3552-11 Aries Electronics 10001-universal-dip-zif-test-socket-337360.pdf IC & Component Sockets DIP TEST SCKT GOLD 48 PINS
Produkt ist nicht verfügbar
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84-PRS11010-12
Hersteller: Aries Electronics
Description: ZIF 11X11 84PIN FOOTPRN 11010
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
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40-6556-30
Hersteller: Aries Electronics
Description: 40 POS TEST SOCK RECEPT SOLDER
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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16-822-90E
Hersteller: Aries Electronics
Description: 16 PIN RT ANGLE HORIZONTAL SOCKT
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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108-PRS12024-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
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20-6513-10
Hersteller: Aries Electronics
Description: IC SOCK COLLET CT 20 PIN GOLD
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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32-8800-610C
Hersteller: Aries Electronics
Description: CONN ELEVATOR SOCKET 32 PIN .600
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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LCQT-TSOP40 19000-small-outline-prototyping-adapters.pdf
LCQT-TSOP40
Hersteller: Aries Electronics
Description: SOCKET ADAPTER TSOP TO 40DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Produkt ist nicht verfügbar
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LCQT-TSOP40-1 19000-small-outline-prototyping-adapters.pdf
LCQT-TSOP40-1
Hersteller: Aries Electronics
Description: SOCKET ADAPTER TSOP TO 40DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Produkt ist nicht verfügbar
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06-2503-30 12012-dip-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
06-2503-31 12012-dip-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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SP200 16009-shorting-plug-and-jack.pdf
SP200
Hersteller: Aries Electronics
Description: PLUG SHORTING INSULATED BLACK
Packaging: Bulk
Gender: Male Pins
Contact Finish: Gold
Color: Black
Current Rating (Amps): 5A
Pitch: 0.200" (5.08mm)
Type: Closed Top, Grip
Height: 0.480" (12.20mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: 10.0µin (0.25µm)
Material Flammability Rating: UL94 V-0
Housing Material: Polyamide (PA46), Nylon 4/6
auf Bestellung 443 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.73 EUR
10+6.56 EUR
25+6.15 EUR
50+5.85 EUR
100+5.57 EUR
250+5.23 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
181-PRS15006-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
225-PRS15001-16 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-2503-30 12012-dip-collet-socket.pdf
08-2503-30
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
auf Bestellung 121 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.34 EUR
10+6.24 EUR
25+5.85 EUR
50+5.57 EUR
100+5.3 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
08-2503-20 12012-dip-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-2503-21 12012-dip-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-2503-31 12012-dip-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-555000-00
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SSOP/SOWIC 20POS
Packaging: Bulk
Number of Pins: 20
Mounting Type: Surface Mount
Convert From (Adapter End): SSOP
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
62-PRS21031-12
Hersteller: Aries Electronics
Description: SOCKET
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 62
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-350003-10-P
Hersteller: Aries Electronics
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 0.700" L x 0.380" W (17.78mm x 9.65mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOJ
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-350003-10
Hersteller: Aries Electronics
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.300" (7.62mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: SOIC to DIP
Package Accepted: SOIC
Produkt ist nicht verfügbar
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14-350003-11-RC
Hersteller: Aries Electronics
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.300" (7.62mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: SOIC to DIP
Package Accepted: SOIC
Produkt ist nicht verfügbar
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40-600-20
Hersteller: Aries Electronics
Description: CONN HDR DIP POST 40POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 40
Pitch: 0.100" (2.54mm)
Contact Type: Post
Row Spacing: 0.600" (15.24mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
Produkt ist nicht verfügbar
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28-653000-11-RC-P
Hersteller: Aries Electronics
Description: SOCKET ADAPTER
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
56-PGM09008-10
Hersteller: Aries Electronics
Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 56
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
56-PGM09009-10
Hersteller: Aries Electronics
Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 56
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
184-PRS15075-12
Hersteller: Aries Electronics
Description: SOCKET
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 184
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
108-PGM12004-11H
Hersteller: Aries Electronics
Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 108
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-6501-30
Hersteller: Aries Electronics
Description: .6 WW SOCKET
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
208-PGM17059-10
Hersteller: Aries Electronics
Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 208
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1110748 18043-surface-mount-to-dip-jedec-sot-adapter.pdf
1110748
Hersteller: Aries Electronics
Description: SOCKET ADAPTER SOT25 TO 6DIP 0.3
Packaging: Bulk
Size / Dimension: 0.300" L x 0.400" W (7.62mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.87 EUR
10+21.98 EUR
25+20.6 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-350000-10-P 18010-soic-and-soj-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 24.000" L x 0.450" W (609.60mm x 11.43mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.300" (7.62mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: SOIC to DIP
Package Accepted: SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-350000-11-RC-P 18010-soic-and-soj-to-dip-adapter.pdf
Hersteller: Aries Electronics
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
ME-100 16001-economy-miniature-jumper-355429.pdf
ME-100
Hersteller: Aries Electronics
Headers & Wire Housings Economy Mini-Link
auf Bestellung 20693 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+0.33 EUR
13+0.23 EUR
100+0.19 EUR
500+0.18 EUR
1000+0.15 EUR
2000+0.14 EUR
10000+0.13 EUR
Mindestbestellmenge: 9
Im Einkaufswagen  Stück im Wert von  UAH
ML-100 16002-miniature-jumper-337456.pdf
ML-100
Hersteller: Aries Electronics
Headers & Wire Housings MINILINK MINI JUMPER
auf Bestellung 802 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
ML-100S 16002-miniature-jumper-337456.pdf
ML-100S
Hersteller: Aries Electronics
Headers & Wire Housings .10 JUMPER CLOSED Au
auf Bestellung 352 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
20-680-191T 16005-program-header-and-cover-337303.pdf
20-680-191T
Hersteller: Aries Electronics
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+2.85 EUR
10+2.75 EUR
100+2.41 EUR
500+1.99 EUR
1000+1.9 EUR
2500+1.83 EUR
5000+1.78 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-675-190T 16004-program-header-337740.pdf
Hersteller: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+3.8 EUR
10+3.1 EUR
104+2.99 EUR
520+2.73 EUR
1014+2.43 EUR
2522+2.27 EUR
5018+2.15 EUR
Im Einkaufswagen  Stück im Wert von  UAH
20-680-191TC 16005-program-header-and-cover-337303.pdf
20-680-191TC
Hersteller: Aries Electronics
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
Produkt ist nicht verfügbar
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14-675-191 16004-program-header-337740.pdf
Hersteller: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-675-191T 16004-program-header-337740.pdf
Hersteller: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-675-190 16004-program-header-337740.pdf
Hersteller: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Produkt ist nicht verfügbar
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14-675-191TC 16004-program-header-1225712.pdf
Hersteller: Aries Electronics
IC & Component Sockets
Produkt ist nicht verfügbar
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14-9625-11 12035-dip-header-1225754.pdf
Hersteller: Aries Electronics
IC & Component Sockets
Produkt ist nicht verfügbar
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16-350000-11-RC 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
16-350000-11-RC
Hersteller: Aries Electronics
IC & Component Sockets SOIC 16-PIN DIP ADAPTER
auf Bestellung 256 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+41.57 EUR
10+39.72 EUR
24+34.3 EUR
48+33.33 EUR
120+32.88 EUR
264+31.2 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-6554-11 10001-universal-dip-zif-test-socket.pdf
28-6554-11
Hersteller: Aries Electronics
IC & Component Sockets 28 PIN W/HANDLE
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+39.2 EUR
9+31.94 EUR
27+31.05 EUR
54+29.57 EUR
108+28.16 EUR
252+26.52 EUR
504+26.14 EUR
Im Einkaufswagen  Stück im Wert von  UAH
08-3518-10 12016-open-frame-dip-collet-solder-tail-socket-336841.pdf
08-3518-10
Hersteller: Aries Electronics
IC & Component Sockets 8P SOLDER TIN/GLD
auf Bestellung 1372 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
49+1.07 EUR
98+0.88 EUR
539+0.79 EUR
1029+0.72 EUR
Mindestbestellmenge: 49
Im Einkaufswagen  Stück im Wert von  UAH
40-6518-10 12016_open_frame_dip_collet_solder_tail_socket.pdf
40-6518-10
Hersteller: Aries Electronics
IC & Component Sockets 40P SOLDER TIN/GLD
auf Bestellung 267 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+12.02 EUR
12+9.96 EUR
24+9.26 EUR
60+8.99 EUR
108+8.62 EUR
252+8.13 EUR
504+7.73 EUR
Im Einkaufswagen  Stück im Wert von  UAH
14-3518-10 12016-open-frame-dip-collet-solder-tail-socket-336841.pdf
14-3518-10
Hersteller: Aries Electronics
IC & Component Sockets 14P SOLDER TIN/GLD
auf Bestellung 396 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+2.69 EUR
10+1.74 EUR
112+1.42 EUR
504+1.35 EUR
1008+1.28 EUR
2520+1.18 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
10-4823-90C 13005-horizontal-display-socket-335797.pdf
10-4823-90C
Hersteller: Aries Electronics
IC & Component Sockets VERTISOCKETS HORIZ COLLET 10 PINS
auf Bestellung 118 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
14-350000-11-RC 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
14-350000-11-RC
Hersteller: Aries Electronics
IC & Component Sockets SOIC DIP ADAPTER
auf Bestellung 351 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+39.62 EUR
10+33.69 EUR
25+31.33 EUR
50+29.83 EUR
100+26.84 EUR
264+26.45 EUR
Im Einkaufswagen  Stück im Wert von  UAH
25-0513-10 12013-pin-line-collet-socket.pdf
25-0513-10
Hersteller: Aries Electronics
IC & Component Sockets 25P SOLDER TAIL TIN
auf Bestellung 71 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+7.13 EUR
10+6.49 EUR
25+6.14 EUR
50+6 EUR
100+5.72 EUR
250+5 EUR
500+4.8 EUR
Im Einkaufswagen  Stück im Wert von  UAH
20-350000-11-RC 18010rc-rohs-compliant-soic-to-dip-adapter.pdf
20-350000-11-RC
Hersteller: Aries Electronics
IC & Component Sockets SOIC DIP ADAPTER
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+49.68 EUR
10+46.39 EUR
19+39.78 EUR
57+38.88 EUR
114+37.15 EUR
266+35.38 EUR
Im Einkaufswagen  Stück im Wert von  UAH
40-0518-10 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
40-0518-10
Hersteller: Aries Electronics
IC & Component Sockets 40P LO-PRO STRIP TIN
auf Bestellung 598 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+6.69 EUR
10+5.68 EUR
50+5.67 EUR
100+4.82 EUR
500+4.29 EUR
1000+4.1 EUR
2500+4.08 EUR
Im Einkaufswagen  Stück im Wert von  UAH
40-6554-10 10001-universal-dip-zif-test-socket.pdf
40-6554-10
Hersteller: Aries Electronics
IC & Component Sockets 40P TEST SOCKET TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-6554-10 10001-universal-dip-zif-test-socket.pdf
28-6554-10
Hersteller: Aries Electronics
IC & Component Sockets 28P TEST SOCKET TIN
auf Bestellung 115 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+23.02 EUR
9+19.94 EUR
27+18.92 EUR
54+18.64 EUR
108+16.46 EUR
252+15.35 EUR
504+15.01 EUR
Im Einkaufswagen  Stück im Wert von  UAH
16-675-191 16004-program-header-337740.pdf
16-675-191
Hersteller: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 16 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-0600-11 12034-strip-line-header.pdf
16-0600-11
Hersteller: Aries Electronics
IC & Component Sockets STRIP LINE 16 PINS COINED CONTACT
auf Bestellung 294 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+7.76 EUR
10+5.24 EUR
50+4.38 EUR
250+4.07 EUR
500+4.01 EUR
Im Einkaufswagen  Stück im Wert von  UAH
16-810-90C 13004-vertical-display-socket-337448.pdf
16-810-90C
Hersteller: Aries Electronics
IC & Component Sockets VERTISOCKETS VERT COLLET 16 PINS
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.73 EUR
10+18.8 EUR
25+17.34 EUR
100+14.15 EUR
250+13.11 EUR
500+12.64 EUR
1000+12.14 EUR
Im Einkaufswagen  Stück im Wert von  UAH
48-3552-11 10001-universal-dip-zif-test-socket-337360.pdf
48-3552-11
Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT GOLD 48 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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