Produkte > ARIES ELECTRONICS > Alle Produkte des Herstellers ARIES ELECTRONICS (15986) > Seite 59 nach 267
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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|---|---|---|---|---|---|---|---|---|---|
| 14-003.5-181B | Aries Electronics |
Description: PIN-STAKED FLEX JUMPER 14POSNumber of Positions: 14 Pitch: 0.100" (2.54mm) Length: 3.50" (88.90mm) Contact Termination: Solder Tab to Solder Tab Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 14-003-181B | Aries Electronics |
Description: PIN-STAKED FLEX JUMPER 14POSNumber of Positions: 14 Pitch: 0.100" (2.54mm) Length: 3.00" (76.20mm) Contact Termination: Solder Tab to Solder Tab Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 14-004-181B | Aries Electronics |
Description: PIN-STAKED FLEX JUMPER 14POSNumber of Positions: 14 Part Status: Active Pitch: 0.100" (2.54mm) Length: 4.00" (101.60mm) Contact Termination: Solder Tab to Solder Tab Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 16-002.5-182D | Aries Electronics |
Description: PIN-STAKED FLEX JUMPER 16POSPackaging: Bulk Number of Positions: 16 Pitch: 0.100" (2.54mm) Length: 2.50" (63.50mm) Contact Termination: Receptacle to Solder Tab |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 16-002-182D | Aries Electronics |
Description: PIN-STAKED FLEX JUMPER 16POSNumber of Positions: 16 Pitch: 0.100" (2.54mm) Length: 2.00" (50.80mm) Contact Termination: Receptacle to Solder Tab Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 16-003-182D | Aries Electronics |
Description: PIN-STAKED FLEX JUMPER 16POSNumber of Positions: 16 Pitch: 0.100" (2.54mm) Length: 3.00" (76.20mm) Contact Termination: Receptacle to Solder Tab Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 20-003-181B | Aries Electronics |
Description: PIN-STAKED FLEX JUMPER 20POSNumber of Positions: 20 Pitch: 0.100" (2.54mm) Length: 3.00" (76.20mm) Contact Termination: Solder Tab to Solder Tab Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 30-002.5-181A | Aries Electronics |
Description: PIN-STAKED FLEX JUMPER 30POS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 30-002-181A | Aries Electronics |
Description: PIN-STAKED FLEX JUMPER 30POS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 32-003-181B | Aries Electronics |
Description: PIN-STAKED FLEX JUMPER 32POSNumber of Positions: 32 Pitch: 0.100" (2.54mm) Length: 3.00" (76.20mm) Contact Termination: Solder Tab to Solder Tab Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 08-3511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS TIN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 08-3511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 08-6511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS TINFeatures: Closed Frame Packaging: Bulk Part Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 08-6511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDPart Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 10-6511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 10POS GOLDPart Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 10 (2 x 5) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
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|
14-6511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS TINPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
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| 14-6511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 16-6511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 16POS TIN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 16-6511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 16POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 14-3511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS TINTermination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk Part Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 14-3511-10WR | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS TINPart Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 14-3511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS GOLDPart Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 14-3511-11WR | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS GOLDFeatures: Closed Frame Packaging: Bulk Part Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 18-6511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 18POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 16-3511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 16POS TINContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 16 (2 x 8) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 16-3511-10WR | Aries Electronics |
Description: CONN IC DIP SOCKET 16POS TINContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 16 (2 x 8) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 16-3511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 16POS GOLDContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 16 (2 x 8) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 16-6511-11WR | Aries Electronics |
Description: CONN IC DIP SOCKET 16POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 18-3511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 18POS TIN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 18-3511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 18POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 24-6511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS TIN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 24-6511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 20-3511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 20POS TIN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 20-3511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 20POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 20-6511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 20POS TIN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 20-6511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 20POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 28-6511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS TIN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 28-6511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD |
auf Bestellung 45 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 32-6511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS TIN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 32-6511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 34-6511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 34POS TIN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 34-6511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 34POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 36-6511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 36POS TIN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 36-6511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 36POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 38-6511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 38POS TINPart Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 38 (2 x 19) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 38-6511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 38POS GOLDPart Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 38 (2 x 19) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 40-6511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS TIN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 40-6511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 48-6511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 48POS TIN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 48-6511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 48POS GOLDHousing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 48 (2 x 24) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk Part Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 08-2511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS TIN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 08-2511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDTermination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 10-2511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 10POS GOLDType: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 10 (2 x 5) Operating Temperature: -55°C ~ 125°C |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 22-4511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS TIN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 22-4511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 22-6511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS TIN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 22-6511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 30-6511-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS TIN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 30-6511-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
| 08-6501-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS TIN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 14-003.5-181B |
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Hersteller: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 14POS
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Length: 3.50" (88.90mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
Description: PIN-STAKED FLEX JUMPER 14POS
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Length: 3.50" (88.90mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 14-003-181B |
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Hersteller: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 14POS
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Length: 3.00" (76.20mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
Description: PIN-STAKED FLEX JUMPER 14POS
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Length: 3.00" (76.20mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 14-004-181B |
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Hersteller: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 14POS
Number of Positions: 14
Part Status: Active
Pitch: 0.100" (2.54mm)
Length: 4.00" (101.60mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
Description: PIN-STAKED FLEX JUMPER 14POS
Number of Positions: 14
Part Status: Active
Pitch: 0.100" (2.54mm)
Length: 4.00" (101.60mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 16-002.5-182D |
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Hersteller: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 16POS
Packaging: Bulk
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Length: 2.50" (63.50mm)
Contact Termination: Receptacle to Solder Tab
Description: PIN-STAKED FLEX JUMPER 16POS
Packaging: Bulk
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Length: 2.50" (63.50mm)
Contact Termination: Receptacle to Solder Tab
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 16-002-182D |
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Hersteller: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 16POS
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Length: 2.00" (50.80mm)
Contact Termination: Receptacle to Solder Tab
Packaging: Bulk
Description: PIN-STAKED FLEX JUMPER 16POS
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Length: 2.00" (50.80mm)
Contact Termination: Receptacle to Solder Tab
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 16-003-182D |
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Hersteller: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 16POS
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Length: 3.00" (76.20mm)
Contact Termination: Receptacle to Solder Tab
Packaging: Bulk
Description: PIN-STAKED FLEX JUMPER 16POS
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Length: 3.00" (76.20mm)
Contact Termination: Receptacle to Solder Tab
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 20-003-181B |
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Hersteller: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 20POS
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Length: 3.00" (76.20mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
Description: PIN-STAKED FLEX JUMPER 20POS
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Length: 3.00" (76.20mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 30-002.5-181A |
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Hersteller: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 30POS
Description: PIN-STAKED FLEX JUMPER 30POS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 30-002-181A |
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Hersteller: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 30POS
Description: PIN-STAKED FLEX JUMPER 30POS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 32-003-181B |
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Hersteller: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 32POS
Number of Positions: 32
Pitch: 0.100" (2.54mm)
Length: 3.00" (76.20mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
Description: PIN-STAKED FLEX JUMPER 32POS
Number of Positions: 32
Pitch: 0.100" (2.54mm)
Length: 3.00" (76.20mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 08-3511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
Description: CONN IC DIP SOCKET 8POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 08-3511-11 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 08-6511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Description: CONN IC DIP SOCKET 8POS TIN
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 08-6511-11 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 10-6511-11 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 10POS GOLD
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 14-6511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 7.44 EUR |
| 10+ | 6.33 EUR |
| 14-6511-11 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 16-6511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Description: CONN IC DIP SOCKET 16POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 16-6511-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 14-3511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Description: CONN IC DIP SOCKET 14POS TIN
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 14-3511-10WR |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 14POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 14-3511-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 14POS GOLD
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 14-3511-11WR |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 18-6511-11 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 16-3511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 16POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 16-3511-10WR |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 16POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 16-3511-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 16-6511-11WR |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 18-3511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Description: CONN IC DIP SOCKET 18POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 18-3511-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 24-6511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS TIN
Description: CONN IC DIP SOCKET 24POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 24-6511-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 20-3511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
Description: CONN IC DIP SOCKET 20POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 20-3511-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 20-6511-10 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
Description: CONN IC DIP SOCKET 20POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 20-6511-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 28-6511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 28POS TIN
Description: CONN IC DIP SOCKET 28POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 28-6511-11 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| 32-6511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 32POS TIN
Description: CONN IC DIP SOCKET 32POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 32-6511-11 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 34-6511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 34POS TIN
Description: CONN IC DIP SOCKET 34POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 34-6511-11 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 34POS GOLD
Description: CONN IC DIP SOCKET 34POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 36-6511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 36POS TIN
Description: CONN IC DIP SOCKET 36POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 36-6511-11 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 38-6511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 38POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 38 (2 x 19)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 38POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 38 (2 x 19)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 38-6511-11 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 38POS GOLD
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 38 (2 x 19)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 38POS GOLD
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 38 (2 x 19)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 40-6511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 40POS TIN
Description: CONN IC DIP SOCKET 40POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 40-6511-11 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 48-6511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 48POS TIN
Description: CONN IC DIP SOCKET 48POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 48-6511-11 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Description: CONN IC DIP SOCKET 48POS GOLD
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 08-2511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
Description: CONN IC DIP SOCKET 8POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 08-2511-11 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Description: CONN IC DIP SOCKET 8POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 10-2511-11 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Description: CONN IC DIP SOCKET 10POS GOLD
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 22-4511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS TIN
Description: CONN IC DIP SOCKET 22POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 22-4511-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 22-6511-10 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS TIN
Description: CONN IC DIP SOCKET 22POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 22-6511-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 30-6511-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 30POS TIN
Description: CONN IC DIP SOCKET 30POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 30-6511-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Description: CONN IC DIP SOCKET 30POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 08-6501-20 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
Description: CONN IC DIP SOCKET 8POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
