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PIC32MK0256GPG064-I/R4X PIC32MK0256GPG064-I/R4X Microchip Technology PIC32MK-General-Purpose-and-Motor-Control-GPGMCJ-With-CAN-FD-Family-DS60001570C.pdf Description: IC MCU 32BIT 256KB FLASH 64VQFN
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-VQFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x12b; D/A 2x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
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PIC32MK0256GPG064-E/R4X PIC32MK0256GPG064-E/R4X Microchip Technology PIC32MK-General-Purpose-and-Motor-Control-GPGMCJ-With-CAN-FD-Family-DS60001570C.pdf Description: IC MCU 32BIT 256KB FLASH 64VQFN
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-VQFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x12b; D/A 2x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
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PIC32MK0256MCJ064-I/R4X PIC32MK0256MCJ064-I/R4X Microchip Technology PIC32MK-General-Purpose-and-Motor-Control-GPGMCJ-With-CAN-FD-Family-DS60001570C.pdf Description: IC MCU 32BIT 256KB FLASH 64VQFN
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-VQFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x12b; D/A 2x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
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PIC32MK0256MCJ064T-E/R4X PIC32MK0256MCJ064T-E/R4X Microchip Technology PIC32MK-General-Purpose-and-Motor-Control-GPGMCJ-With-CAN-FD-Family-DS60001570C.pdf Description: IC MCU 32BIT 256KB FLASH 64VQFN
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-VQFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x12b; D/A 2x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PIC32MK0256MCJ064-E/PT PIC32MK0256MCJ064-E/PT Microchip Technology PIC32MK-General-Purpose-and-Motor-Control-GPGMCJ-With-CAN-FD-Family-DS60001570C.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x12b; D/A 2x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tray
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PIC32MK0256MCJ064T-I/R4X PIC32MK0256MCJ064T-I/R4X Microchip Technology PIC32MK-General-Purpose-and-Motor-Control-GPGMCJ-With-CAN-FD-Family-DS60001570C.pdf Description: IC MCU 32BIT 256KB FLASH 64VQFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-VQFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x12b; D/A 2x12b
Core Processor: MIPS32® microAptiv™
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PIC32MK0256MCJ064-I/PT PIC32MK0256MCJ064-I/PT Microchip Technology PIC32MK-General-Purpose-and-Motor-Control-GPGMCJ-With-CAN-FD-Family-DS60001570C.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x12b; D/A 2x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tray
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PIC32MK0256MCJ064T-E/PT PIC32MK0256MCJ064T-E/PT Microchip Technology PIC32MK-General-Purpose-and-Motor-Control-GPGMCJ-With-CAN-FD-Family-DS60001570C.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x12b; D/A 2x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
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PIC32MK0256MCJ064-E/R4X PIC32MK0256MCJ064-E/R4X Microchip Technology PIC32MK-General-Purpose-and-Motor-Control-GPGMCJ-With-CAN-FD-Family-DS60001570C.pdf Description: IC MCU 32BIT 256KB FLASH 64VQFN
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-VQFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x12b; D/A 2x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
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RN42APL-I/RM Microchip Technology Class-2-Bluetooth-Module-with-EDR-Support-DS50002328B.pdf Description: MODULE
Part Status: Obsolete
Serial Interfaces: SPI, UART
RF Family/Standard: Bluetooth
Antenna Type: PCB Trace
Protocol: Bluetooth v2.1 + EDR, Class 2
Data Rate: 3Mbps
Power - Output: 4dBm
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -86dBm
Package / Case: 35-SMD Module
Packaging: Bulk
DigiKey Programmable: Not Verified
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RN42-I/RMMGK477 Microchip Technology Description: MODULE
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -86dBm
Package / Case: 35-SMD Module
Packaging: Bulk
Part Status: Obsolete
Serial Interfaces: SPI, UART
RF Family/Standard: Bluetooth
Antenna Type: PCB Trace
Protocol: Bluetooth v2.1 + EDR, Class 2
Data Rate: 3Mbps
Power - Output: 4dBm
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
DigiKey Programmable: Not Verified
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RN42-I/RM477 Microchip Technology Description: MODULE
Part Status: Obsolete
Serial Interfaces: SPI, UART
RF Family/Standard: Bluetooth
Antenna Type: PCB Trace
Protocol: Bluetooth v2.1 + EDR, Class 2
Data Rate: 3Mbps
Power - Output: 4dBm
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -86dBm
Package / Case: 35-SMD Module
Packaging: Bulk
DigiKey Programmable: Not Verified
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RN42APL-I/RM545 Microchip Technology Class-2-Bluetooth-Module-with-EDR-Support-DS50002328B.pdf Description: MODULE
Protocol: Bluetooth v2.1 + EDR, Class 2
Data Rate: 3Mbps
Power - Output: 4dBm
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -86dBm
Package / Case: 35-SMD Module
Packaging: Bulk
Part Status: Obsolete
Serial Interfaces: SPI, UART
RF Family/Standard: Bluetooth
Antenna Type: PCB Trace
DigiKey Programmable: Not Verified
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RN42APL-I/RM543 Microchip Technology Class-2-Bluetooth-Module-with-EDR-Support-DS50002328B.pdf Description: MODULE
DigiKey Programmable: Not Verified
Part Status: Obsolete
Serial Interfaces: SPI, UART
RF Family/Standard: Bluetooth
Antenna Type: PCB Trace
Protocol: Bluetooth v2.1 + EDR, Class 2
Data Rate: 3Mbps
Power - Output: 4dBm
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -86dBm
Package / Case: 35-SMD Module
Packaging: Bulk
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RN42N-I/RM477 Microchip Technology Class-2-Bluetooth-Module-with-EDR-Support-DS50002328B.pdf Description: MODULE
Part Status: Obsolete
Serial Interfaces: SPI, UART
RF Family/Standard: Bluetooth
Antenna Type: PCB Trace
Protocol: Bluetooth v2.1 + EDR, Class 2
Data Rate: 3Mbps
Power - Output: 4dBm
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -86dBm
Package / Case: 35-SMD Module
Packaging: Bulk
DigiKey Programmable: Not Verified
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1N6063AE3 1N6063AE3 Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 82VWM 137VC DO13
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-202AA, DO-13, Axial
Packaging: Bulk
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 137V
Voltage - Breakdown (Min): 95V
Bidirectional Channels: 1
Supplier Device Package: DO-13 (DO-202AA)
Voltage - Reverse Standoff (Typ): 82V
Current - Peak Pulse (10/1000µs): 11A
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1N6043A/TR 1N6043A/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 12VWM 21.2VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 21.2V
Voltage - Breakdown (Min): 14.3V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 12V
Current - Peak Pulse (10/1000µs): 71A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6069A/TR 1N6069A/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 150VWM 261VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 261V
Voltage - Breakdown (Min): 171V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 150V
Current - Peak Pulse (10/1000µs): 5.7A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6056A/TR 1N6056A/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 43VWM 70.1VC DO13
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 70.1V
Voltage - Breakdown (Min): 48.5V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 43V
Current - Peak Pulse (10/1000µs): 21.4A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
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1N6037A/TR 1N6037A/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 7VWM 12.1VC DO13
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 7V
Current - Peak Pulse (10/1000µs): 124A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 12.1V
Voltage - Breakdown (Min): 7.79V
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1N6045A/TR 1N6045A/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 15VWM 25.2VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 25.2V
Voltage - Breakdown (Min): 17.1V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 15V
Current - Peak Pulse (10/1000µs): 59.5A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6036A/TR 1N6036A/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 6VWM 11.3VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 11.3V
Voltage - Breakdown (Min): 7.13V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 6V
Current - Peak Pulse (10/1000µs): 132A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6063AE3/TR 1N6063AE3/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 82VWM 137VC DO13
Bidirectional Channels: 1
Supplier Device Package: DO-13 (DO-202AA)
Voltage - Reverse Standoff (Typ): 82V
Current - Peak Pulse (10/1000µs): 11A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-202AA, DO-13, Axial
Packaging: Tape & Reel (TR)
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 137V
Voltage - Breakdown (Min): 95V
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1N6067A/TR 1N6067A/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 128VWM 213VC DO13
Current - Peak Pulse (10/1000µs): 7A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 213V
Voltage - Breakdown (Min): 143V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 128V
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1N6071/TR 1N6071/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 165VWM 308VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 308V
Voltage - Breakdown (Min): 180V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 165V
Current - Peak Pulse (10/1000µs): 4.9A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6072A/TR 1N6072A/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 185VWM 328VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 328V
Voltage - Breakdown (Min): 209V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 185V
Current - Peak Pulse (10/1000µs): 4.6A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6062A/TR 1N6062A/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 75VWM 125VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 125V
Voltage - Breakdown (Min): 86.5V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 75V
Current - Peak Pulse (10/1000µs): 12A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6051A/TR 1N6051A/TR Microchip Technology 1N6036A-1N6072A.pdf Description: TVS DIODE 28VWM 45.7VC DO13
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 45.7V
Voltage - Breakdown (Min): 31.4V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 28V
Current - Peak Pulse (10/1000µs): 33A
Produkt ist nicht verfügbar
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1N6054A/TR 1N6054A/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 36VWM 59.3VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 59.3V
Voltage - Breakdown (Min): 40.9V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 36V
Current - Peak Pulse (10/1000µs): 25.3A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6039A/TR 1N6039A/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 8.5VWM 14.5VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 14.5V
Voltage - Breakdown (Min): 9.5V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 8.5V
Current - Peak Pulse (10/1000µs): 103A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6063A/TR 1N6063A/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 82VWM 137VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 137V
Voltage - Breakdown (Min): 95V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 82V
Current - Peak Pulse (10/1000µs): 11A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6060AE3 1N6060AE3 Microchip Technology Description: BI-DIRECTIONAL TVS
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-202AA, DO-13, Axial
Packaging: Bulk
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 103V
Voltage - Breakdown (Min): 71.3V
Bidirectional Channels: 1
Supplier Device Package: DO-13 (DO-202AA)
Voltage - Reverse Standoff (Typ): 64V
Current - Peak Pulse (10/1000µs): 14.6A
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1N6056/TR 1N6056/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 41VWM 73.5VC DO13
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 73.5V
Voltage - Breakdown (Min): 45.9V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 41V
Current - Peak Pulse (10/1000µs): 20.4A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6050A/TR 1N6050A/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 25VWM 41.4VC DO13
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 41.4V
Voltage - Breakdown (Min): 28.5V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 25V
Current - Peak Pulse (10/1000µs): 36A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6071A/TR 1N6071A/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 170VWM 294VC DO13
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1N6057A/TR 1N6057A/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 47VWM 77VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 77V
Voltage - Breakdown (Min): 53.2V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 47V
Current - Peak Pulse (10/1000µs): 19.5A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6061A/TR 1N6061A/TR Microchip Technology 8923-lds-0097-datasheet Description: TVS DIODE 70VWM 113VC DO13
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 113V
Voltage - Breakdown (Min): 77.9V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 70V
Current - Peak Pulse (10/1000µs): 13.3A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
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SY75602ATWL-TR SY75602ATWL-TR Microchip Technology SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf Description: IC CLK BUFFER 1:2 250MHZ 8VDFN
Number of Circuits: 1
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Frequency - Max: 250 MHz
Supplier Device Package: 8-VDFN (1.6x1.4)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:2
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
Number of Circuits: 1
Package / Case: 8-VFDFN
Packaging: Tape & Reel (TR)
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SY75602ATWL-TR SY75602ATWL-TR Microchip Technology SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf Description: IC CLK BUFFER 1:2 250MHZ 8VDFN
Number of Circuits: 1
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Frequency - Max: 250 MHz
Supplier Device Package: 8-VDFN (1.6x1.4)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:2
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
Number of Circuits: 1
Package / Case: 8-VFDFN
Packaging: Cut Tape (CT)
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SY75603BTWL SY75603BTWL Microchip Technology Description: IC CLK BUFFER 1:2 250MHZ 16VQFN
Frequency - Max: 250 MHz
Supplier Device Package: 16-VQFN (3x3)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:2
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: HCSL
Mounting Type: Surface Mount, Wettable Flank
Number of Circuits: 1
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tube
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SY75604ATWL SY75604ATWL Microchip Technology SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Number of Circuits: 1
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
Number of Circuits: 1
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tube
Frequency - Max: 250 MHz
Supplier Device Package: 16-VQFN (3x3)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:4
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
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SY75604BTWL SY75604BTWL Microchip Technology SY75604 Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Number of Circuits: 1
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Frequency - Max: 250 MHz
Supplier Device Package: 16-VQFN (3x3)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:4
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
Number of Circuits: 1
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tube
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SY75603BTWL-TR SY75603BTWL-TR Microchip Technology SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf Description: IC CLK BUFFER 1:2 250MHZ 16VQFN
Number of Circuits: 1
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Frequency - Max: 250 MHz
Supplier Device Package: 16-VQFN (3x3)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:2
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
Number of Circuits: 1
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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SY75603BTWL-TR SY75603BTWL-TR Microchip Technology SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf Description: IC CLK BUFFER 1:2 250MHZ 16VQFN
Number of Circuits: 1
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Number of Circuits: 1
Package / Case: 16-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Frequency - Max: 250 MHz
Supplier Device Package: 16-VQFN (3x3)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:2
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
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SY75604BTWL-TR SY75604BTWL-TR Microchip Technology SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Number of Circuits: 1
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Frequency - Max: 250 MHz
Supplier Device Package: 16-VQFN (3x3)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:4
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
Number of Circuits: 1
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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SY75604BTWL-TR SY75604BTWL-TR Microchip Technology SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Number of Circuits: 1
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Frequency - Max: 250 MHz
Supplier Device Package: 16-VQFN (3x3)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:4
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
Number of Circuits: 1
Package / Case: 16-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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SY75604ATWL-TR SY75604ATWL-TR Microchip Technology SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-6-Clock-Buffer-DS20006508.pdf Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Number of Circuits: 1
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Frequency - Max: 250 MHz
Supplier Device Package: 16-VQFN (3x3)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:4
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
Number of Circuits: 1
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SY75604ATWL-TR SY75604ATWL-TR Microchip Technology SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-6-Clock-Buffer-DS20006508.pdf Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Number of Circuits: 1
Number of Circuits: 1
Package / Case: 16-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Frequency - Max: 250 MHz
Supplier Device Package: 16-VQFN (3x3)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:4
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
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SY100S811JC TR SY100S811JC TR Microchip Technology MCHP-S-A0002530353-1.pdf?t.download=true&u=5oefqw Description: IC CLK BUFFER 2:9 28PLCC
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MCP6471T-E/OTVAO MCP6471T-E/OTVAO Microchip Technology 20002324C.pdf Description: IC OPAMP GP 1 CIRCUIT SOT23-5
Qualification: AEC-Q100
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2 V
Current - Output / Channel: 32 mA
Number of Circuits: 1
Grade: Automotive
Supplier Device Package: SOT-23-5
Voltage - Input Offset: 1.5 mV
Current - Input Bias: 1 pA
Gain Bandwidth Product: 2 MHz
Slew Rate: 1.1V/µs
Current - Supply: 100µA
Operating Temperature: -40°C ~ 125°C (TA)
Amplifier Type: General Purpose
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: SC-74A, SOT-753
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33EV256GM004T-I/P8 DSPIC33EV256GM004T-I/P8 Microchip Technology dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf Description: IC MCU 16BIT 256KB FLASH 48TQFP
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x10/12b; D/A 1x7b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (85.5K x 24)
Speed: 70MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tape & Reel (TR)
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DSPIC33EV256GM004T-I/P8 DSPIC33EV256GM004T-I/P8 Microchip Technology dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf Description: IC MCU 16BIT 256KB FLASH 48TQFP
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x10/12b; D/A 1x7b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (85.5K x 24)
Speed: 70MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Cut Tape (CT)
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DSPIC33EV256GM104T-I/P8 DSPIC33EV256GM104T-I/P8 Microchip Technology dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf Description: IC MCU 16BIT 256KB FLASH 48TQFP
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x10/12b; D/A 1x7b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (85.5K x 24)
Speed: 70MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tape & Reel (TR)
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DSPIC33EV256GM104T-I/P8 DSPIC33EV256GM104T-I/P8 Microchip Technology dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf Description: IC MCU 16BIT 256KB FLASH 48TQFP
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x10/12b; D/A 1x7b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (85.5K x 24)
Speed: 70MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Cut Tape (CT)
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DSPIC33EV256GM004-E/P8 DSPIC33EV256GM004-E/P8 Microchip Technology dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf Description: IC MCU 16BIT 256KB FLASH 48TQFP
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x10/12b; D/A 1x7b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (85.5K x 24)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
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dsPIC33EV256GM002-I/SS dsPIC33EV256GM002-I/SS Microchip Technology dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf Description: IC MCU 16BIT 256KB FLASH 28SSOP
DigiKey Programmable: Not Verified
Number of I/O: 21
Supplier Device Package: 28-SSOP
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 11x10/12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (85.5K x 24)
Speed: 70 MIPs
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Tube
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dsPIC33EV256GM102-E/SS dsPIC33EV256GM102-E/SS Microchip Technology dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf Description: IC MCU 16BIT 256KB FLASH 28SSOP
Connectivity: CANbus, I²C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 11x10/12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (85.5K x 24)
Speed: 60 MIPs
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 21
Supplier Device Package: 28-SSOP
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
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dsPIC33EV128GM002-I/SS dsPIC33EV128GM002-I/SS Microchip Technology dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf Description: IC MCU 16BIT 128KB FLASH 28SSOP
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DSPIC33EV128GM004-I/P8 DSPIC33EV128GM004-I/P8 Microchip Technology dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf Description: IC MCU 16BIT 128KB FLASH 48TQFP
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dsPIC33EV128GM002-H/SO Microchip Technology dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf Description: IC MCU 16BIT 128KB FLASH 28SOIC
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PIC32MK0256GPG064-I/R4X PIC32MK-General-Purpose-and-Motor-Control-GPGMCJ-With-CAN-FD-Family-DS60001570C.pdf
PIC32MK0256GPG064-I/R4X
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-VQFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x12b; D/A 2x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
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PIC32MK0256GPG064-E/R4X PIC32MK-General-Purpose-and-Motor-Control-GPGMCJ-With-CAN-FD-Family-DS60001570C.pdf
PIC32MK0256GPG064-E/R4X
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-VQFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x12b; D/A 2x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
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PIC32MK0256MCJ064-I/R4X PIC32MK-General-Purpose-and-Motor-Control-GPGMCJ-With-CAN-FD-Family-DS60001570C.pdf
PIC32MK0256MCJ064-I/R4X
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-VQFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x12b; D/A 2x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
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PIC32MK0256MCJ064T-E/R4X PIC32MK-General-Purpose-and-Motor-Control-GPGMCJ-With-CAN-FD-Family-DS60001570C.pdf
PIC32MK0256MCJ064T-E/R4X
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-VQFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x12b; D/A 2x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PIC32MK0256MCJ064-E/PT PIC32MK-General-Purpose-and-Motor-Control-GPGMCJ-With-CAN-FD-Family-DS60001570C.pdf
PIC32MK0256MCJ064-E/PT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x12b; D/A 2x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tray
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PIC32MK0256MCJ064T-I/R4X PIC32MK-General-Purpose-and-Motor-Control-GPGMCJ-With-CAN-FD-Family-DS60001570C.pdf
PIC32MK0256MCJ064T-I/R4X
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-VQFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x12b; D/A 2x12b
Core Processor: MIPS32® microAptiv™
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PIC32MK0256MCJ064-I/PT PIC32MK-General-Purpose-and-Motor-Control-GPGMCJ-With-CAN-FD-Family-DS60001570C.pdf
PIC32MK0256MCJ064-I/PT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x12b; D/A 2x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tray
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PIC32MK0256MCJ064T-E/PT PIC32MK-General-Purpose-and-Motor-Control-GPGMCJ-With-CAN-FD-Family-DS60001570C.pdf
PIC32MK0256MCJ064T-E/PT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x12b; D/A 2x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
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PIC32MK0256MCJ064-E/R4X PIC32MK-General-Purpose-and-Motor-Control-GPGMCJ-With-CAN-FD-Family-DS60001570C.pdf
PIC32MK0256MCJ064-E/R4X
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-VQFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x12b; D/A 2x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
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RN42APL-I/RM Class-2-Bluetooth-Module-with-EDR-Support-DS50002328B.pdf
Hersteller: Microchip Technology
Description: MODULE
Part Status: Obsolete
Serial Interfaces: SPI, UART
RF Family/Standard: Bluetooth
Antenna Type: PCB Trace
Protocol: Bluetooth v2.1 + EDR, Class 2
Data Rate: 3Mbps
Power - Output: 4dBm
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -86dBm
Package / Case: 35-SMD Module
Packaging: Bulk
DigiKey Programmable: Not Verified
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RN42-I/RMMGK477
Hersteller: Microchip Technology
Description: MODULE
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -86dBm
Package / Case: 35-SMD Module
Packaging: Bulk
Part Status: Obsolete
Serial Interfaces: SPI, UART
RF Family/Standard: Bluetooth
Antenna Type: PCB Trace
Protocol: Bluetooth v2.1 + EDR, Class 2
Data Rate: 3Mbps
Power - Output: 4dBm
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
DigiKey Programmable: Not Verified
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RN42-I/RM477
Hersteller: Microchip Technology
Description: MODULE
Part Status: Obsolete
Serial Interfaces: SPI, UART
RF Family/Standard: Bluetooth
Antenna Type: PCB Trace
Protocol: Bluetooth v2.1 + EDR, Class 2
Data Rate: 3Mbps
Power - Output: 4dBm
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -86dBm
Package / Case: 35-SMD Module
Packaging: Bulk
DigiKey Programmable: Not Verified
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RN42APL-I/RM545 Class-2-Bluetooth-Module-with-EDR-Support-DS50002328B.pdf
Hersteller: Microchip Technology
Description: MODULE
Protocol: Bluetooth v2.1 + EDR, Class 2
Data Rate: 3Mbps
Power - Output: 4dBm
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -86dBm
Package / Case: 35-SMD Module
Packaging: Bulk
Part Status: Obsolete
Serial Interfaces: SPI, UART
RF Family/Standard: Bluetooth
Antenna Type: PCB Trace
DigiKey Programmable: Not Verified
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RN42APL-I/RM543 Class-2-Bluetooth-Module-with-EDR-Support-DS50002328B.pdf
Hersteller: Microchip Technology
Description: MODULE
DigiKey Programmable: Not Verified
Part Status: Obsolete
Serial Interfaces: SPI, UART
RF Family/Standard: Bluetooth
Antenna Type: PCB Trace
Protocol: Bluetooth v2.1 + EDR, Class 2
Data Rate: 3Mbps
Power - Output: 4dBm
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -86dBm
Package / Case: 35-SMD Module
Packaging: Bulk
Produkt ist nicht verfügbar
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RN42N-I/RM477 Class-2-Bluetooth-Module-with-EDR-Support-DS50002328B.pdf
Hersteller: Microchip Technology
Description: MODULE
Part Status: Obsolete
Serial Interfaces: SPI, UART
RF Family/Standard: Bluetooth
Antenna Type: PCB Trace
Protocol: Bluetooth v2.1 + EDR, Class 2
Data Rate: 3Mbps
Power - Output: 4dBm
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -86dBm
Package / Case: 35-SMD Module
Packaging: Bulk
DigiKey Programmable: Not Verified
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1N6063AE3 8923-lds-0097-datasheet
1N6063AE3
Hersteller: Microchip Technology
Description: TVS DIODE 82VWM 137VC DO13
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-202AA, DO-13, Axial
Packaging: Bulk
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 137V
Voltage - Breakdown (Min): 95V
Bidirectional Channels: 1
Supplier Device Package: DO-13 (DO-202AA)
Voltage - Reverse Standoff (Typ): 82V
Current - Peak Pulse (10/1000µs): 11A
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1N6043A/TR 8923-lds-0097-datasheet
1N6043A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 12VWM 21.2VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 21.2V
Voltage - Breakdown (Min): 14.3V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 12V
Current - Peak Pulse (10/1000µs): 71A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N6069A/TR 8923-lds-0097-datasheet
1N6069A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 150VWM 261VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 261V
Voltage - Breakdown (Min): 171V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 150V
Current - Peak Pulse (10/1000µs): 5.7A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N6056A/TR 8923-lds-0097-datasheet
1N6056A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 43VWM 70.1VC DO13
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 70.1V
Voltage - Breakdown (Min): 48.5V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 43V
Current - Peak Pulse (10/1000µs): 21.4A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
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1N6037A/TR 8923-lds-0097-datasheet
1N6037A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 7VWM 12.1VC DO13
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 7V
Current - Peak Pulse (10/1000µs): 124A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 12.1V
Voltage - Breakdown (Min): 7.79V
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1N6045A/TR 8923-lds-0097-datasheet
1N6045A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 15VWM 25.2VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 25.2V
Voltage - Breakdown (Min): 17.1V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 15V
Current - Peak Pulse (10/1000µs): 59.5A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N6036A/TR 8923-lds-0097-datasheet
1N6036A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 6VWM 11.3VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 11.3V
Voltage - Breakdown (Min): 7.13V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 6V
Current - Peak Pulse (10/1000µs): 132A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N6063AE3/TR 8923-lds-0097-datasheet
1N6063AE3/TR
Hersteller: Microchip Technology
Description: TVS DIODE 82VWM 137VC DO13
Bidirectional Channels: 1
Supplier Device Package: DO-13 (DO-202AA)
Voltage - Reverse Standoff (Typ): 82V
Current - Peak Pulse (10/1000µs): 11A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-202AA, DO-13, Axial
Packaging: Tape & Reel (TR)
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 137V
Voltage - Breakdown (Min): 95V
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1N6067A/TR 8923-lds-0097-datasheet
1N6067A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 128VWM 213VC DO13
Current - Peak Pulse (10/1000µs): 7A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 213V
Voltage - Breakdown (Min): 143V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 128V
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1N6071/TR 8923-lds-0097-datasheet
1N6071/TR
Hersteller: Microchip Technology
Description: TVS DIODE 165VWM 308VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 308V
Voltage - Breakdown (Min): 180V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 165V
Current - Peak Pulse (10/1000µs): 4.9A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6072A/TR 8923-lds-0097-datasheet
1N6072A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 185VWM 328VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 328V
Voltage - Breakdown (Min): 209V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 185V
Current - Peak Pulse (10/1000µs): 4.6A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6062A/TR 8923-lds-0097-datasheet
1N6062A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 75VWM 125VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 125V
Voltage - Breakdown (Min): 86.5V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 75V
Current - Peak Pulse (10/1000µs): 12A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6051A/TR 1N6036A-1N6072A.pdf
1N6051A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 28VWM 45.7VC DO13
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 45.7V
Voltage - Breakdown (Min): 31.4V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 28V
Current - Peak Pulse (10/1000µs): 33A
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1N6054A/TR 8923-lds-0097-datasheet
1N6054A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 36VWM 59.3VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 59.3V
Voltage - Breakdown (Min): 40.9V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 36V
Current - Peak Pulse (10/1000µs): 25.3A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N6039A/TR 8923-lds-0097-datasheet
1N6039A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 8.5VWM 14.5VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 14.5V
Voltage - Breakdown (Min): 9.5V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 8.5V
Current - Peak Pulse (10/1000µs): 103A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6063A/TR 8923-lds-0097-datasheet
1N6063A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 82VWM 137VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 137V
Voltage - Breakdown (Min): 95V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 82V
Current - Peak Pulse (10/1000µs): 11A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6060AE3
1N6060AE3
Hersteller: Microchip Technology
Description: BI-DIRECTIONAL TVS
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-202AA, DO-13, Axial
Packaging: Bulk
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 103V
Voltage - Breakdown (Min): 71.3V
Bidirectional Channels: 1
Supplier Device Package: DO-13 (DO-202AA)
Voltage - Reverse Standoff (Typ): 64V
Current - Peak Pulse (10/1000µs): 14.6A
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1N6056/TR 8923-lds-0097-datasheet
1N6056/TR
Hersteller: Microchip Technology
Description: TVS DIODE 41VWM 73.5VC DO13
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 73.5V
Voltage - Breakdown (Min): 45.9V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 41V
Current - Peak Pulse (10/1000µs): 20.4A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N6050A/TR 8923-lds-0097-datasheet
1N6050A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 25VWM 41.4VC DO13
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 41.4V
Voltage - Breakdown (Min): 28.5V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 25V
Current - Peak Pulse (10/1000µs): 36A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6071A/TR 8923-lds-0097-datasheet
1N6071A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 170VWM 294VC DO13
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1N6057A/TR 8923-lds-0097-datasheet
1N6057A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 47VWM 77VC DO13
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 77V
Voltage - Breakdown (Min): 53.2V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 47V
Current - Peak Pulse (10/1000µs): 19.5A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
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1N6061A/TR 8923-lds-0097-datasheet
1N6061A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 70VWM 113VC DO13
Mounting Type: Through Hole
Package / Case: DO-13
Packaging: Tape & Reel (TR)
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 113V
Voltage - Breakdown (Min): 77.9V
Bidirectional Channels: 1
Supplier Device Package: DO-13
Voltage - Reverse Standoff (Typ): 70V
Current - Peak Pulse (10/1000µs): 13.3A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
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SY75602ATWL-TR SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf
SY75602ATWL-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 250MHZ 8VDFN
Number of Circuits: 1
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Frequency - Max: 250 MHz
Supplier Device Package: 8-VDFN (1.6x1.4)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:2
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
Number of Circuits: 1
Package / Case: 8-VFDFN
Packaging: Tape & Reel (TR)
auf Bestellung 2000 Stücke:
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AnzahlPrivatkunde
2000+1.8 EUR
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SY75602ATWL-TR SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf
SY75602ATWL-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 250MHZ 8VDFN
Number of Circuits: 1
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Frequency - Max: 250 MHz
Supplier Device Package: 8-VDFN (1.6x1.4)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:2
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
Number of Circuits: 1
Package / Case: 8-VFDFN
Packaging: Cut Tape (CT)
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10+2.24 EUR
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100+1.8 EUR
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SY75603BTWL
SY75603BTWL
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 250MHZ 16VQFN
Frequency - Max: 250 MHz
Supplier Device Package: 16-VQFN (3x3)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:2
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: HCSL
Mounting Type: Surface Mount, Wettable Flank
Number of Circuits: 1
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tube
auf Bestellung 664 Stücke:
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AnzahlPrivatkunde
6+3.56 EUR
25+2.98 EUR
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SY75604ATWL SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf
SY75604ATWL
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Number of Circuits: 1
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
Number of Circuits: 1
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tube
Frequency - Max: 250 MHz
Supplier Device Package: 16-VQFN (3x3)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:4
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
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6+3.89 EUR
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SY75604BTWL SY75604
SY75604BTWL
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Number of Circuits: 1
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Frequency - Max: 250 MHz
Supplier Device Package: 16-VQFN (3x3)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:4
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
Number of Circuits: 1
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tube
auf Bestellung 271 Stücke:
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6+3.89 EUR
25+3.25 EUR
100+3.14 EUR
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SY75603BTWL-TR SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf
SY75603BTWL-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 250MHZ 16VQFN
Number of Circuits: 1
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Frequency - Max: 250 MHz
Supplier Device Package: 16-VQFN (3x3)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:2
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
Number of Circuits: 1
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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AnzahlPrivatkunde
3300+1.09 EUR
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SY75603BTWL-TR SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf
SY75603BTWL-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 250MHZ 16VQFN
Number of Circuits: 1
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Number of Circuits: 1
Package / Case: 16-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Frequency - Max: 250 MHz
Supplier Device Package: 16-VQFN (3x3)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:2
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
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16+1.36 EUR
25+1.13 EUR
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SY75604BTWL-TR SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf
SY75604BTWL-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Number of Circuits: 1
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Frequency - Max: 250 MHz
Supplier Device Package: 16-VQFN (3x3)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:4
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
Number of Circuits: 1
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SY75604BTWL-TR SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf
SY75604BTWL-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Number of Circuits: 1
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Frequency - Max: 250 MHz
Supplier Device Package: 16-VQFN (3x3)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:4
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
Number of Circuits: 1
Package / Case: 16-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 3064 Stücke:
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AnzahlPrivatkunde
13+1.71 EUR
25+1.44 EUR
100+1.39 EUR
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SY75604ATWL-TR SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-6-Clock-Buffer-DS20006508.pdf
SY75604ATWL-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Number of Circuits: 1
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Frequency - Max: 250 MHz
Supplier Device Package: 16-VQFN (3x3)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:4
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
Number of Circuits: 1
Produkt ist nicht verfügbar
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SY75604ATWL-TR SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-6-Clock-Buffer-DS20006508.pdf
SY75604ATWL-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Main Purpose: PCI Express (PCIe)
Frequency - Max: 250MHz
Number of Circuits: 1
Number of Circuits: 1
Package / Case: 16-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Frequency - Max: 250 MHz
Supplier Device Package: 16-VQFN (3x3)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:4
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 105°C (TA)
Input: HCSL
Type: Clock Buffer
Output: LP-HCSL
Mounting Type: Surface Mount, Wettable Flank
auf Bestellung 7736 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
13+1.71 EUR
25+1.44 EUR
100+1.39 EUR
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SY100S811JC TR MCHP-S-A0002530353-1.pdf?t.download=true&u=5oefqw
SY100S811JC TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 2:9 28PLCC
auf Bestellung 580 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
34+17.21 EUR
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MCP6471T-E/OTVAO 20002324C.pdf
MCP6471T-E/OTVAO
Hersteller: Microchip Technology
Description: IC OPAMP GP 1 CIRCUIT SOT23-5
Qualification: AEC-Q100
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2 V
Current - Output / Channel: 32 mA
Number of Circuits: 1
Grade: Automotive
Supplier Device Package: SOT-23-5
Voltage - Input Offset: 1.5 mV
Current - Input Bias: 1 pA
Gain Bandwidth Product: 2 MHz
Slew Rate: 1.1V/µs
Current - Supply: 100µA
Operating Temperature: -40°C ~ 125°C (TA)
Amplifier Type: General Purpose
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: SC-74A, SOT-753
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33EV256GM004T-I/P8 dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf
DSPIC33EV256GM004T-I/P8
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48TQFP
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x10/12b; D/A 1x7b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (85.5K x 24)
Speed: 70MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33EV256GM004T-I/P8 dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf
DSPIC33EV256GM004T-I/P8
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48TQFP
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x10/12b; D/A 1x7b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (85.5K x 24)
Speed: 70MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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DSPIC33EV256GM104T-I/P8 dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf
DSPIC33EV256GM104T-I/P8
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48TQFP
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x10/12b; D/A 1x7b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (85.5K x 24)
Speed: 70MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSPIC33EV256GM104T-I/P8 dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf
DSPIC33EV256GM104T-I/P8
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48TQFP
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x10/12b; D/A 1x7b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (85.5K x 24)
Speed: 70MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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DSPIC33EV256GM004-E/P8 dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf
DSPIC33EV256GM004-E/P8
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48TQFP
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x10/12b; D/A 1x7b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (85.5K x 24)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
Produkt ist nicht verfügbar
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dsPIC33EV256GM002-I/SS dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf
dsPIC33EV256GM002-I/SS
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 28SSOP
DigiKey Programmable: Not Verified
Number of I/O: 21
Supplier Device Package: 28-SSOP
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 11x10/12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (85.5K x 24)
Speed: 70 MIPs
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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dsPIC33EV256GM102-E/SS dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf
dsPIC33EV256GM102-E/SS
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 28SSOP
Connectivity: CANbus, I²C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 11x10/12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (85.5K x 24)
Speed: 60 MIPs
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 21
Supplier Device Package: 28-SSOP
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Produkt ist nicht verfügbar
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dsPIC33EV128GM002-I/SS dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf
dsPIC33EV128GM002-I/SS
Hersteller: Microchip Technology
Description: IC MCU 16BIT 128KB FLASH 28SSOP
Produkt ist nicht verfügbar
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DSPIC33EV128GM004-I/P8 dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf
DSPIC33EV128GM004-I/P8
Hersteller: Microchip Technology
Description: IC MCU 16BIT 128KB FLASH 48TQFP
Produkt ist nicht verfügbar
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dsPIC33EV128GM002-H/SO dsPIC33EVXXXGM00X-10X-Family-Data-Sheet-DS70005144H.pdf
Hersteller: Microchip Technology
Description: IC MCU 16BIT 128KB FLASH 28SOIC
Produkt ist nicht verfügbar
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