Produkte > MICROCHIP TECHNOLOGY > Alle Produkte des Herstellers MICROCHIP TECHNOLOGY (338318) > Seite 1695 nach 5639
Foto | Bezeichnung | Hersteller | Beschreibung |
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MCP6004T-I/SLVAO | Microchip Technology |
Description: IC OPAMP GP 4 CIRCUIT 14SOIC Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Output Type: Rail-to-Rail Mounting Type: Surface Mount Amplifier Type: General Purpose Operating Temperature: -40°C ~ 85°C (TA) Current - Supply: 100µA (x4 Channels) Slew Rate: 0.6V/µs Gain Bandwidth Product: 1 MHz Current - Input Bias: 1 pA Voltage - Input Offset: 4.5 mV Supplier Device Package: 14-SOIC Part Status: Active Number of Circuits: 4 Current - Output / Channel: 23 mA Voltage - Supply Span (Min): 1.8 V Voltage - Supply Span (Max): 6 V |
Produkt ist nicht verfügbar |
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MCP6004T-I/SLVAO | Microchip Technology |
Description: IC OPAMP GP 4 CIRCUIT 14SOIC Packaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Output Type: Rail-to-Rail Mounting Type: Surface Mount Amplifier Type: General Purpose Operating Temperature: -40°C ~ 85°C (TA) Current - Supply: 100µA (x4 Channels) Slew Rate: 0.6V/µs Gain Bandwidth Product: 1 MHz Current - Input Bias: 1 pA Voltage - Input Offset: 4.5 mV Supplier Device Package: 14-SOIC Part Status: Active Number of Circuits: 4 Current - Output / Channel: 23 mA Voltage - Supply Span (Min): 1.8 V Voltage - Supply Span (Max): 6 V |
Produkt ist nicht verfügbar |
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MCP6004T-E/STVAO | Microchip Technology |
Description: IC OPAMP GP 4 CIRCUIT 14TSSOP Packaging: Tape & Reel (TR) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Output Type: Rail-to-Rail Mounting Type: Surface Mount Amplifier Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Current - Supply: 100µA (x4 Channels) Slew Rate: 0.6V/µs Gain Bandwidth Product: 1 MHz Current - Input Bias: 1 pA Voltage - Input Offset: 4.5 mV Supplier Device Package: 14-TSSOP Part Status: Active Number of Circuits: 4 Current - Output / Channel: 23 mA Voltage - Supply Span (Min): 1.8 V Voltage - Supply Span (Max): 6 V |
Produkt ist nicht verfügbar |
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MCP6004T-E/STVAO | Microchip Technology |
Description: IC OPAMP GP 4 CIRCUIT 14TSSOP Packaging: Cut Tape (CT) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Output Type: Rail-to-Rail Mounting Type: Surface Mount Amplifier Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Current - Supply: 100µA (x4 Channels) Slew Rate: 0.6V/µs Gain Bandwidth Product: 1 MHz Current - Input Bias: 1 pA Voltage - Input Offset: 4.5 mV Supplier Device Package: 14-TSSOP Part Status: Active Number of Circuits: 4 Current - Output / Channel: 23 mA Voltage - Supply Span (Min): 1.8 V Voltage - Supply Span (Max): 6 V |
Produkt ist nicht verfügbar |
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MCP6004-I/SLGVAO | Microchip Technology |
Description: IC OPAMP GP 4 CIRCUIT 14SOIC Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Output Type: Rail-to-Rail Mounting Type: Surface Mount Amplifier Type: General Purpose Operating Temperature: -40°C ~ 85°C (TA) Current - Supply: 100µA (x4 Channels) Slew Rate: 0.6V/µs Gain Bandwidth Product: 1 MHz Current - Input Bias: 1 pA Voltage - Input Offset: 4.5 mV Supplier Device Package: 14-SOIC Part Status: Active Number of Circuits: 4 Current - Output / Channel: 23 mA Voltage - Supply Span (Min): 1.8 V Voltage - Supply Span (Max): 6 V |
Produkt ist nicht verfügbar |
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MCP6004-I/SLVAO | Microchip Technology |
Description: IC OPAMP GP 4 CIRCUIT 14SOIC Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Output Type: Rail-to-Rail Mounting Type: Surface Mount Amplifier Type: General Purpose Operating Temperature: -40°C ~ 85°C (TA) Current - Supply: 100µA (x4 Channels) Slew Rate: 0.6V/µs Gain Bandwidth Product: 1 MHz Current - Input Bias: 1 pA Voltage - Input Offset: 4.5 mV Supplier Device Package: 14-SOIC Part Status: Active Number of Circuits: 4 Current - Output / Channel: 23 mA Voltage - Supply Span (Min): 1.8 V Voltage - Supply Span (Max): 6 V |
Produkt ist nicht verfügbar |
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MCP6004-E/SLVAO | Microchip Technology |
Description: IC OPAMP GP 4 CIRCUIT 14SOIC Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Output Type: Rail-to-Rail Mounting Type: Surface Mount Amplifier Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Current - Supply: 100µA (x4 Channels) Slew Rate: 0.6V/µs Gain Bandwidth Product: 1 MHz Current - Input Bias: 1 pA Voltage - Input Offset: 4.5 mV Supplier Device Package: 14-SOIC Part Status: Active Number of Circuits: 4 Current - Output / Channel: 23 mA Voltage - Supply Span (Min): 1.8 V Voltage - Supply Span (Max): 6 V |
Produkt ist nicht verfügbar |
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MIC39101-2.5YM | Microchip Technology |
Description: IC REG LINEAR 2.5V 1A 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Fixed Mounting Type: Surface Mount Current - Output: 1A Operating Temperature: -40°C ~ 125°C Output Configuration: Positive Voltage - Input (Max): 16V Number of Regulators: 1 Supplier Device Package: 8-SOIC Voltage - Output (Min/Fixed): 2.5V Control Features: Enable Part Status: Active Voltage Dropout (Max): 0.63V @ 1A Protection Features: Over Current, Over Temperature, Reverse Polarity |
auf Bestellung 289 Stücke: Lieferzeit 21-28 Tag (e) |
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SY89838UMG-TR | Microchip Technology |
Description: IC CLK BUFFER 2:8 2GHZ 32QFN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Number of Circuits: 1 Mounting Type: Surface Mount Output: LVDS Type: Fanout Buffer (Distribution), Multiplexer Input: CML, LVDS, LVPECL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.375V ~ 2.625V Ratio - Input:Output: 2:8 Differential - Input:Output: Yes/Yes Supplier Device Package: 32-QFN (5x5) Part Status: Active Frequency - Max: 2 GHz |
auf Bestellung 3969 Stücke: Lieferzeit 21-28 Tag (e) |
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SY89833LMG-TR | Microchip Technology |
Description: IC CLK BUFFER 1:4 2GHZ 16MLF Packaging: Cut Tape (CT) Package / Case: 16-VFQFN Exposed Pad, 16-MLF® Number of Circuits: 1 Mounting Type: Surface Mount Output: LVDS Type: Fanout Buffer (Distribution), Translator Input: CML, LVDS, LVPECL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Ratio - Input:Output: 1:4 Differential - Input:Output: Yes/Yes Supplier Device Package: 16-MLF® (3x3) Part Status: Active Frequency - Max: 2 GHz |
auf Bestellung 3902 Stücke: Lieferzeit 21-28 Tag (e) |
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SY89832UMG-TR | Microchip Technology |
Description: IC CLK BUFFER 1:4 2.5GHZ 16MLF Packaging: Cut Tape (CT) Package / Case: 16-VFQFN Exposed Pad, 16-MLF® Number of Circuits: 1 Mounting Type: Surface Mount Output: LVDS Type: Fanout Buffer (Distribution), Translator Input: CML, LVDS, LVPECL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.375V ~ 2.625V Ratio - Input:Output: 1:4 Differential - Input:Output: Yes/Yes Supplier Device Package: 16-MLF® (3x3) Part Status: Active Frequency - Max: 2.5 GHz |
auf Bestellung 1585 Stücke: Lieferzeit 21-28 Tag (e) |
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SY89876LMG-TR | Microchip Technology |
Description: IC CLK BUFFER 1:2 2GHZ 16MLF Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad, 16-MLF® Number of Circuits: 1 Mounting Type: Surface Mount Output: LVDS Type: Fanout Buffer (Distribution), Divider Input: CML, HSTL, LVDS, LVPECL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.97V ~ 3.63V Ratio - Input:Output: 1:2 Differential - Input:Output: Yes/Yes Supplier Device Package: 16-MLF® (3x3) Part Status: Active Frequency - Max: 2 GHz |
auf Bestellung 1000 Stücke: Lieferzeit 21-28 Tag (e) |
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SY89876LMG-TR | Microchip Technology |
Description: IC CLK BUFFER 1:2 2GHZ 16MLF Packaging: Cut Tape (CT) Package / Case: 16-VFQFN Exposed Pad, 16-MLF® Number of Circuits: 1 Mounting Type: Surface Mount Output: LVDS Type: Fanout Buffer (Distribution), Divider Input: CML, HSTL, LVDS, LVPECL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.97V ~ 3.63V Ratio - Input:Output: 1:2 Differential - Input:Output: Yes/Yes Supplier Device Package: 16-MLF® (3x3) Part Status: Active Frequency - Max: 2 GHz |
auf Bestellung 1824 Stücke: Lieferzeit 21-28 Tag (e) |
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SY89831UMG-TR | Microchip Technology |
Description: IC CLK BUFFER 1:4 2GHZ 16MLF Packaging: Cut Tape (CT) Package / Case: 16-VFQFN Exposed Pad, 16-MLF® Number of Circuits: 1 Mounting Type: Surface Mount Output: LVPECL Type: Fanout Buffer (Distribution), Translator Input: CML, LVDS, LVPECL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.375V ~ 3.6V Ratio - Input:Output: 1:4 Differential - Input:Output: Yes/Yes Supplier Device Package: 16-MLF® (3x3) Part Status: Active Frequency - Max: 2 GHz |
auf Bestellung 3480 Stücke: Lieferzeit 21-28 Tag (e) |
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SY89464UMY-TR | Microchip Technology |
Description: IC CLK MULTIPLX 2:10 2GHZ 44MLF Packaging: Tape & Reel (TR) Package / Case: 44-VFQFN Exposed Pad, 44-MLF® Number of Circuits: 1 Mounting Type: Surface Mount Output: LVPECL Type: Multiplexer Input: CML, LVDS, PECL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.375V ~ 3.6V Ratio - Input:Output: 2:10 Differential - Input:Output: Yes/Yes Supplier Device Package: 44-MLF® (7x7) Part Status: Active Frequency - Max: 2 GHz |
Produkt ist nicht verfügbar |
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SY89464UMY-TR | Microchip Technology |
Description: IC CLK MULTIPLX 2:10 2GHZ 44MLF Packaging: Cut Tape (CT) Package / Case: 44-VFQFN Exposed Pad, 44-MLF® Number of Circuits: 1 Mounting Type: Surface Mount Output: LVPECL Type: Multiplexer Input: CML, LVDS, PECL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.375V ~ 3.6V Ratio - Input:Output: 2:10 Differential - Input:Output: Yes/Yes Supplier Device Package: 44-MLF® (7x7) Part Status: Active Frequency - Max: 2 GHz |
auf Bestellung 790 Stücke: Lieferzeit 21-28 Tag (e) |
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1N2784 | Microchip Technology |
Description: DIODE GEN PURP 200V 22A DO4 Packaging: Bulk Package / Case: DO-203AA, DO-4, Stud Mounting Type: Stud Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 22A Supplier Device Package: DO-4 (DO-203AA) Operating Temperature - Junction: -65°C ~ 200°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 200 V Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 30 A Current - Reverse Leakage @ Vr: 10 µA @ 200 V |
Produkt ist nicht verfügbar |
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WP3232M6NFEI-320B2 | Microchip Technology |
Description: WINPATH3 232M6 PROC. 320MHZ LF Packaging: Tray Package / Case: 896-BGA, FCBGA Mounting Type: Surface Mount Interface: I2C, RMII, UART Program Memory Type: SRAM Applications: Network Processor Core Processor: MIPS32® 34Kc™ Supplier Device Package: 896-FCBGA (31x31) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 27 Stücke: Lieferzeit 21-28 Tag (e) |
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PIC16F18857T-E/SSVAO | Microchip Technology |
Description: IC MCU 8BIT 56KB FLASH 28SSOP Packaging: Tape & Reel (TR) Package / Case: 28-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 56KB (32K x 14) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: PIC Data Converters: A/D 24x10b; D/A 1x5b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 28-SSOP Part Status: Active Number of I/O: 25 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PIC16F18857T-I/SO | Microchip Technology |
Description: IC MCU 8BIT 56KB FLASH 28SOIC Packaging: Tape & Reel (TR) Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 56KB (32K x 14) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: PIC Data Converters: A/D 24x10b; D/A 1x5b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 28-SOIC Part Status: Active Number of I/O: 25 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PIC16F18857-E/SSVAO | Microchip Technology |
Description: IC MCU 8BIT 56KB FLASH 28SSOP Packaging: Tube Package / Case: 28-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 56KB (32K x 14) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: PIC Data Converters: A/D 24x10b; D/A 1x5b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 28-SSOP Part Status: Active Number of I/O: 25 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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JANS1N5712-1/TR | Microchip Technology |
Description: DIODE SCHOTTKY 20V 75MA DO35 Packaging: Tape & Reel (TR) Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Speed: Small Signal =< 200mA (Io), Any Speed Technology: Schottky Capacitance @ Vr, F: 2pF @ 0V, 1MHz Current - Average Rectified (Io): 75mA Supplier Device Package: DO-35 (DO-204AH) Operating Temperature - Junction: -65°C ~ 150°C Grade: Military Part Status: Active Voltage - DC Reverse (Vr) (Max): 20 V Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA Current - Reverse Leakage @ Vr: 150 nA @ 16 V Qualification: MIL-PRF-19500/444 |
Produkt ist nicht verfügbar |
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JANS1N5712UR-1 | Microchip Technology |
Description: DIODE SCHOTTKY 16V 75MA DO213AA Packaging: Bulk Package / Case: DO-213AA Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Technology: Schottky Capacitance @ Vr, F: 2pF @ 0V, 1MHz Current - Average Rectified (Io): 75mA Supplier Device Package: DO-213AA Operating Temperature - Junction: -65°C ~ 150°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 16 V Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA Current - Reverse Leakage @ Vr: 150 nA @ 16 V |
Produkt ist nicht verfügbar |
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JANS1N5712UR-1/TR | Microchip Technology |
Description: DIODE SCHOTTKY 16V 75MA DO213AA Packaging: Tape & Reel (TR) Package / Case: DO-213AA Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Technology: Schottky Capacitance @ Vr, F: 2pF @ 0V, 1MHz Current - Average Rectified (Io): 75mA Supplier Device Package: DO-213AA Operating Temperature - Junction: -65°C ~ 150°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 16 V Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA Current - Reverse Leakage @ Vr: 150 nA @ 16 V |
Produkt ist nicht verfügbar |
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JANS1N5712UBD/TR | Microchip Technology |
Description: DIODE SCHOTTKY 16V 75MA UB Packaging: Tape & Reel (TR) Package / Case: 3-SMD, No Lead Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Technology: Schottky Capacitance @ Vr, F: 2pF @ 0V, 1MHz Current - Average Rectified (Io): 75mA Supplier Device Package: UB Operating Temperature - Junction: -65°C ~ 150°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 16 V Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA Current - Reverse Leakage @ Vr: 150 nA @ 16 V |
Produkt ist nicht verfügbar |
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EV03J37A | Microchip Technology |
Description: DSPIC33CK64MC105 MC DIM Packaging: Bulk Mounting Type: Fixed Type: MCU Contents: Board(s) Core Processor: dsPIC Platform: Dual-Inline Module (DIM) Part Status: Active Utilized IC / Part: dsPIC33CK64MC105 |
auf Bestellung 3 Stücke: Lieferzeit 21-28 Tag (e) |
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EV84C64A | Microchip Technology |
Description: ILLC DEVELOPMENT BOARD Packaging: Bulk Mounting Type: Fixed Type: MCU Contents: Board(s) Core Processor: dsPIC Part Status: Active Utilized IC / Part: dsPIC33CH128MP506 |
auf Bestellung 3 Stücke: Lieferzeit 21-28 Tag (e) |
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MNS2N2222AUBP/TR | Microchip Technology |
Description: TRANS NPN 50V 0.8A UB Packaging: Bulk Package / Case: 3-SMD, No Lead Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -65°C ~ 200°C (TJ) Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA Current - Collector Cutoff (Max): 50nA DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V Supplier Device Package: UB Part Status: Active Current - Collector (Ic) (Max): 800 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 500 mW Grade: Military Qualification: MIL-PRF-19500/255 |
Produkt ist nicht verfügbar |
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MSR2N2222AUB | Microchip Technology |
Description: RH SMALL-SIGNAL BJT Packaging: Bulk Package / Case: 3-SMD, No Lead Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -65°C ~ 200°C (TJ) Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA Current - Collector Cutoff (Max): 50nA DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V Supplier Device Package: UB Part Status: Active Current - Collector (Ic) (Max): 800 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 500 mW |
Produkt ist nicht verfügbar |
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DSA1101BL3-040.0000VAO | Microchip Technology |
Description: MEMS OSC AUTO LOWPWR -40C-105C Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±20ppm Voltage - Supply: 2.25V ~ 3.63V Ratings: AEC-Q100 Current - Supply (Max): 35mA Height - Seated (Max): 0.035" (0.90mm) Part Status: Active Frequency: 40 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1001BL3-001.0000 | Microchip Technology |
Description: OSC MEMS LOW PWR LVCMOS Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±20ppm Voltage - Supply: 1.8V ~ 3.3V Ratings: AEC-Q100 Current - Supply (Max): 6.5mA Height - Seated (Max): 0.035" (0.90mm) Part Status: Active Frequency: 1 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSA1101BL3-050.0000TVAO | Microchip Technology |
Description: MEMS OSC AUTO LOW JITTER -40C-10 Packaging: Tape & Reel (TR) Package / Case: 6-VDFN Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±20ppm Voltage - Supply: 2.25V ~ 3.63V Ratings: AEC-Q100 Current - Supply (Max): 35mA Height - Seated (Max): 0.035" (0.90mm) Part Status: Active Frequency: 50 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSA1001BL3-025.0000VAO | Microchip Technology |
Description: MEMS OSCILLATOR, AUTOMOTIVE, LOW Packaging: Tube Package / Case: 4-VDFN Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±20ppm Voltage - Supply: 1.8V ~ 3.3V Ratings: AEC-Q100 Current - Supply (Max): 8mA Height - Seated (Max): 0.035" (0.90mm) Part Status: Active Frequency: 25 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1001BL3-001.0000T | Microchip Technology |
Description: OSC MEMS LOW PWR LVCMOS Packaging: Tape & Reel (TR) Package / Case: 6-VDFN Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±20ppm Voltage - Supply: 1.8V ~ 3.3V Ratings: AEC-Q100 Current - Supply (Max): 6.5mA Height - Seated (Max): 0.035" (0.90mm) Part Status: Active Frequency: 1 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1121BL3-012.2880 | Microchip Technology |
Description: MEMS OSC LOW JITTER 12.288MHZ LV Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 3.6V Current - Supply (Max): 35mA Height - Seated (Max): 0.035" (0.90mm) Part Status: Active Absolute Pull Range (APR): ±20ppm Frequency: 12.288 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSA1101BL3-050.0000VAO | Microchip Technology |
Description: MEMS OSC AUTO LOW JITTER -40C-10 Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±20ppm Voltage - Supply: 2.25V ~ 3.63V Ratings: AEC-Q100 Current - Supply (Max): 35mA Height - Seated (Max): 0.035" (0.90mm) Part Status: Active Frequency: 50 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSC1121BL3-012.2880T | Microchip Technology |
Description: MEMS OSC LOW JITTER 12.288MHZ LV Packaging: Tape & Reel (TR) Package / Case: 6-VDFN Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 3.6V Current - Supply (Max): 35mA Height - Seated (Max): 0.035" (0.90mm) Part Status: Active Absolute Pull Range (APR): ±20ppm Frequency: 12.288 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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DSA1001BL3-025.0000TVAO | Microchip Technology |
Description: MEMS OSCILLATOR, AUTOMOTIVE, LOW Packaging: Tube Package / Case: 4-VDFN Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±20ppm Voltage - Supply: 1.8V ~ 3.3V Ratings: AEC-Q100 Current - Supply (Max): 8mA Height - Seated (Max): 0.035" (0.90mm) Part Status: Active Frequency: 25 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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ATTINY426-SFR | Microchip Technology |
Description: IC MCU 8BIT 4KB FLASH 20SOIC Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: AVR Data Converters: A/D 15x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 20-SOIC Part Status: Active Number of I/O: 18 DigiKey Programmable: Not Verified |
auf Bestellung 1360 Stücke: Lieferzeit 21-28 Tag (e) |
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ATTINY427-MFR | Microchip Technology |
Description: IC MCU 8BIT 4KB FLASH 24VQFN Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: AVR Data Converters: A/D 15x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 24-VQFN (4x4) Part Status: Active Number of I/O: 22 DigiKey Programmable: Not Verified |
auf Bestellung 11240 Stücke: Lieferzeit 21-28 Tag (e) |
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UPS5819E3/TR13 | Microchip Technology |
Description: DIODE SCHOTTKY 40V 1A POWERMITE1 Packaging: Tape & Reel (TR) Package / Case: DO-216AA Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Technology: Schottky Capacitance @ Vr, F: 60pF @ 5V, 1MHz Current - Average Rectified (Io): 1A Supplier Device Package: Powermite 1 (DO216-AA) Operating Temperature - Junction: -55°C ~ 150°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 40 V Voltage - Forward (Vf) (Max) @ If: 550 mV @ 1 A Current - Reverse Leakage @ Vr: 1 mA @ 20 V |
Produkt ist nicht verfügbar |
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UPS5819E3/TR13 | Microchip Technology |
Description: DIODE SCHOTTKY 40V 1A POWERMITE1 Packaging: Cut Tape (CT) Package / Case: DO-216AA Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Technology: Schottky Capacitance @ Vr, F: 60pF @ 5V, 1MHz Current - Average Rectified (Io): 1A Supplier Device Package: Powermite 1 (DO216-AA) Operating Temperature - Junction: -55°C ~ 150°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 40 V Voltage - Forward (Vf) (Max) @ If: 550 mV @ 1 A Current - Reverse Leakage @ Vr: 1 mA @ 20 V |
auf Bestellung 10129 Stücke: Lieferzeit 21-28 Tag (e) |
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UPS5817E3/TR7 | Microchip Technology |
Description: DIODE SCHOTTKY 20V 1A POWERMITE1 Packaging: Tape & Reel (TR) Package / Case: DO-216AA Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Technology: Schottky Current - Average Rectified (Io): 1A Supplier Device Package: Powermite 1 (DO216-AA) Operating Temperature - Junction: -55°C ~ 150°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 20 V Voltage - Forward (Vf) (Max) @ If: 450 mV @ 1 A Current - Reverse Leakage @ Vr: 1 mA @ 20 V |
Produkt ist nicht verfügbar |
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UPS5817E3/TR7 | Microchip Technology |
Description: DIODE SCHOTTKY 20V 1A POWERMITE1 Packaging: Cut Tape (CT) Package / Case: DO-216AA Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Technology: Schottky Current - Average Rectified (Io): 1A Supplier Device Package: Powermite 1 (DO216-AA) Operating Temperature - Junction: -55°C ~ 150°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 20 V Voltage - Forward (Vf) (Max) @ If: 450 mV @ 1 A Current - Reverse Leakage @ Vr: 1 mA @ 20 V |
Produkt ist nicht verfügbar |
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MSCGLQ50DH120CTBL2NG | Microchip Technology |
Description: PM-IGBT-SBD-BL2 Packaging: Bulk Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: Asymmetrical Bridge Operating Temperature: -55°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.4V @ 15V, 50A NTC Thermistor: Yes Part Status: Active Current - Collector (Ic) (Max): 110 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 375 W Current - Collector Cutoff (Max): 25 µA Input Capacitance (Cies) @ Vce: 2.77 nF @ 25 V |
Produkt ist nicht verfügbar |
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EQCO125T40C1T-I/8EX | Microchip Technology |
Description: IC DRIVER 1/0 16QFN TR Packaging: Tape & Reel (TR) Package / Case: 16-VQFN Exposed Pad Mounting Type: Surface Mount Type: Driver Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.25V Number of Drivers/Receivers: 1/0 Data Rate: 12.5Gbps Supplier Device Package: 16-QFN (4x4) Part Status: Last Time Buy |
auf Bestellung 1000 Stücke: Lieferzeit 21-28 Tag (e) |
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EQCO125T40C1T-I/8EX | Microchip Technology |
Description: IC DRIVER 1/0 16QFN TR Packaging: Cut Tape (CT) Package / Case: 16-VQFN Exposed Pad Mounting Type: Surface Mount Type: Driver Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.25V Number of Drivers/Receivers: 1/0 Data Rate: 12.5Gbps Supplier Device Package: 16-QFN (4x4) Part Status: Last Time Buy |
auf Bestellung 1624 Stücke: Lieferzeit 21-28 Tag (e) |
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2CGA301A-MSCL | Microchip Technology |
Description: POWER BJT Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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2CGA201A-MSCL | Microchip Technology |
Description: POWER BJT Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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CMLRGLQ80V601AMXG-AS | Microchip Technology |
Description: IC POWER MODULE SMD Packaging: Tray Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MCP3202-CI/SNVAO | Microchip Technology |
Description: IC ADC 12BIT SAR 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Bits: 12 Configuration: S/H-ADC Data Interface: SPI Reference Type: External Operating Temperature: -40°C ~ 85°C Voltage - Supply, Analog: 2.7V ~ 5.5V Voltage - Supply, Digital: 2.7V ~ 5.5V Sampling Rate (Per Second): 100k Input Type: Pseudo-Differential, Single Ended Number of Inputs: 1, 2 Supplier Device Package: 8-SOIC Architecture: SAR Ratio - S/H:ADC: 1:1 Part Status: Active Number of A/D Converters: 1 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MSMBJ26CAe3 | Microchip Technology |
Description: TVS DIODE 26VWM 42.1VC SMBJ Packaging: Bulk Package / Case: DO-214AA, SMB Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 14.2A Voltage - Reverse Standoff (Typ): 26V Supplier Device Package: SMBJ (DO-214AA) Bidirectional Channels: 1 Voltage - Breakdown (Min): 28.9V Voltage - Clamping (Max) @ Ipp: 42.1V Power - Peak Pulse: 600W Power Line Protection: No Grade: Military Part Status: Active Qualification: MIL-PRF-19500 |
Produkt ist nicht verfügbar |
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MASMBJ26CAe3 | Microchip Technology |
Description: TVS DIODE 26VWM 42.1VC SMBJ Packaging: Bulk Package / Case: DO-214AA, SMB Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 14.2A Voltage - Reverse Standoff (Typ): 26V Supplier Device Package: SMBJ (DO-214AA) Bidirectional Channels: 1 Voltage - Breakdown (Min): 28.9V Voltage - Clamping (Max) @ Ipp: 42.1V Power - Peak Pulse: 600W Power Line Protection: No Grade: Military Part Status: Active Qualification: MIL-PRF-19500 |
Produkt ist nicht verfügbar |
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MXSMBJ26CAe3 | Microchip Technology |
Description: TVS DIODE 26VWM 42.1VC SMBJ Packaging: Bulk Package / Case: DO-214AA, SMB Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 14.2A Voltage - Reverse Standoff (Typ): 26V Supplier Device Package: SMBJ (DO-214AA) Bidirectional Channels: 1 Voltage - Breakdown (Min): 28.9V Voltage - Clamping (Max) @ Ipp: 42.1V Power - Peak Pulse: 600W Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
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MXLSMBJ26CA | Microchip Technology |
Description: TVS DIODE 26VWM 42.1VC SMBJ Packaging: Bulk Package / Case: DO-214AA, SMB Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 14.2A Voltage - Reverse Standoff (Typ): 26V Supplier Device Package: SMBJ (DO-214AA) Bidirectional Channels: 1 Voltage - Breakdown (Min): 28.9V Voltage - Clamping (Max) @ Ipp: 42.1V Power - Peak Pulse: 600W Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
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MXSMBJ26CA | Microchip Technology |
Description: TVS DIODE 26VWM 42.1VC SMBJ Packaging: Bulk Package / Case: DO-214AA, SMB Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 14.2A Voltage - Reverse Standoff (Typ): 26V Supplier Device Package: SMBJ (DO-214AA) Bidirectional Channels: 1 Voltage - Breakdown (Min): 28.9V Voltage - Clamping (Max) @ Ipp: 42.1V Power - Peak Pulse: 600W Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
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MASMBJ26CA | Microchip Technology |
Description: TVS DIODE 26VWM 42.1VC SMBJ Packaging: Bulk Package / Case: DO-214AA, SMB Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 14.2A Voltage - Reverse Standoff (Typ): 26V Supplier Device Package: SMBJ (DO-214AA) Bidirectional Channels: 1 Voltage - Breakdown (Min): 28.9V Voltage - Clamping (Max) @ Ipp: 42.1V Power - Peak Pulse: 600W Power Line Protection: No Grade: Military Part Status: Active Qualification: MIL-PRF-19500 |
Produkt ist nicht verfügbar |
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MXLSMBJ26CAe3 | Microchip Technology |
Description: TVS DIODE 26VWM 42.1VC SMBJ Packaging: Bulk Package / Case: DO-214AA, SMB Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 14.2A Voltage - Reverse Standoff (Typ): 26V Supplier Device Package: SMBJ (DO-214AA) Bidirectional Channels: 1 Voltage - Breakdown (Min): 28.9V Voltage - Clamping (Max) @ Ipp: 42.1V Power - Peak Pulse: 600W Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
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MSMBJ26CA | Microchip Technology |
Description: TVS DIODE 26VWM 42.1VC SMBJ Packaging: Bulk Package / Case: DO-214AA, SMB Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 14.2A Voltage - Reverse Standoff (Typ): 26V Supplier Device Package: SMBJ (DO-214AA) Bidirectional Channels: 1 Voltage - Breakdown (Min): 28.9V Voltage - Clamping (Max) @ Ipp: 42.1V Power - Peak Pulse: 600W Power Line Protection: No Part Status: Active Grade: Military Qualification: MIL-PRF-19500 |
Produkt ist nicht verfügbar |
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MPLAD7.5KP28CA | Microchip Technology |
Description: TVS DIODE Packaging: Bulk Package / Case: Nonstandard SMD Mounting Type: Surface Mount Type: Zener Operating Temperature: -55°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 165A Voltage - Reverse Standoff (Typ): 28V Supplier Device Package: Mini-PLAD Bidirectional Channels: 1 Voltage - Breakdown (Min): 31.1V Voltage - Clamping (Max) @ Ipp: 45.5V Power - Peak Pulse: 7500W (7.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
MCP6004T-I/SLVAO |
Hersteller: Microchip Technology
Description: IC OPAMP GP 4 CIRCUIT 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Description: IC OPAMP GP 4 CIRCUIT 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
MCP6004T-I/SLVAO |
Hersteller: Microchip Technology
Description: IC OPAMP GP 4 CIRCUIT 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Description: IC OPAMP GP 4 CIRCUIT 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
MCP6004T-E/STVAO |
Hersteller: Microchip Technology
Description: IC OPAMP GP 4 CIRCUIT 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Description: IC OPAMP GP 4 CIRCUIT 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
MCP6004T-E/STVAO |
Hersteller: Microchip Technology
Description: IC OPAMP GP 4 CIRCUIT 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Description: IC OPAMP GP 4 CIRCUIT 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
MCP6004-I/SLGVAO |
Hersteller: Microchip Technology
Description: IC OPAMP GP 4 CIRCUIT 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Description: IC OPAMP GP 4 CIRCUIT 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
MCP6004-I/SLVAO |
Hersteller: Microchip Technology
Description: IC OPAMP GP 4 CIRCUIT 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Description: IC OPAMP GP 4 CIRCUIT 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
MCP6004-E/SLVAO |
Hersteller: Microchip Technology
Description: IC OPAMP GP 4 CIRCUIT 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Description: IC OPAMP GP 4 CIRCUIT 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
MIC39101-2.5YM |
Hersteller: Microchip Technology
Description: IC REG LINEAR 2.5V 1A 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Voltage - Input (Max): 16V
Number of Regulators: 1
Supplier Device Package: 8-SOIC
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Active
Voltage Dropout (Max): 0.63V @ 1A
Protection Features: Over Current, Over Temperature, Reverse Polarity
Description: IC REG LINEAR 2.5V 1A 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Voltage - Input (Max): 16V
Number of Regulators: 1
Supplier Device Package: 8-SOIC
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Active
Voltage Dropout (Max): 0.63V @ 1A
Protection Features: Over Current, Over Temperature, Reverse Polarity
auf Bestellung 289 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5+ | 5.38 EUR |
25+ | 4.47 EUR |
100+ | 4.06 EUR |
SY89838UMG-TR |
Hersteller: Microchip Technology
Description: IC CLK BUFFER 2:8 2GHZ 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Multiplexer
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V
Ratio - Input:Output: 2:8
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Frequency - Max: 2 GHz
Description: IC CLK BUFFER 2:8 2GHZ 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Multiplexer
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V
Ratio - Input:Output: 2:8
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Frequency - Max: 2 GHz
auf Bestellung 3969 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 21.97 EUR |
25+ | 18.33 EUR |
100+ | 16.66 EUR |
SY89833LMG-TR |
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:4 2GHZ 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Translator
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2 GHz
Description: IC CLK BUFFER 1:4 2GHZ 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Translator
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2 GHz
auf Bestellung 3902 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 23.79 EUR |
25+ | 19.83 EUR |
100+ | 18.04 EUR |
SY89832UMG-TR |
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:4 2.5GHZ 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Translator
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2.5 GHz
Description: IC CLK BUFFER 1:4 2.5GHZ 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Translator
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2.5 GHz
auf Bestellung 1585 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 23.79 EUR |
25+ | 19.83 EUR |
100+ | 18.04 EUR |
SY89876LMG-TR |
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 2GHZ 16MLF
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Divider
Input: CML, HSTL, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2 GHz
Description: IC CLK BUFFER 1:2 2GHZ 16MLF
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Divider
Input: CML, HSTL, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2 GHz
auf Bestellung 1000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1000+ | 13.01 EUR |
SY89876LMG-TR |
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 2GHZ 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Divider
Input: CML, HSTL, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2 GHz
Description: IC CLK BUFFER 1:2 2GHZ 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Divider
Input: CML, HSTL, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2 GHz
auf Bestellung 1824 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 17.21 EUR |
25+ | 14.32 EUR |
100+ | 13.01 EUR |
SY89831UMG-TR |
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:4 2GHZ 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Fanout Buffer (Distribution), Translator
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.6V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2 GHz
Description: IC CLK BUFFER 1:4 2GHZ 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Fanout Buffer (Distribution), Translator
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.6V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2 GHz
auf Bestellung 3480 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 19.99 EUR |
25+ | 16.66 EUR |
100+ | 15.13 EUR |
SY89464UMY-TR |
Hersteller: Microchip Technology
Description: IC CLK MULTIPLX 2:10 2GHZ 44MLF
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad, 44-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Multiplexer
Input: CML, LVDS, PECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.6V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 44-MLF® (7x7)
Part Status: Active
Frequency - Max: 2 GHz
Description: IC CLK MULTIPLX 2:10 2GHZ 44MLF
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad, 44-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Multiplexer
Input: CML, LVDS, PECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.6V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 44-MLF® (7x7)
Part Status: Active
Frequency - Max: 2 GHz
Produkt ist nicht verfügbar
SY89464UMY-TR |
Hersteller: Microchip Technology
Description: IC CLK MULTIPLX 2:10 2GHZ 44MLF
Packaging: Cut Tape (CT)
Package / Case: 44-VFQFN Exposed Pad, 44-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Multiplexer
Input: CML, LVDS, PECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.6V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 44-MLF® (7x7)
Part Status: Active
Frequency - Max: 2 GHz
Description: IC CLK MULTIPLX 2:10 2GHZ 44MLF
Packaging: Cut Tape (CT)
Package / Case: 44-VFQFN Exposed Pad, 44-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Multiplexer
Input: CML, LVDS, PECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.6V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 44-MLF® (7x7)
Part Status: Active
Frequency - Max: 2 GHz
auf Bestellung 790 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 23.17 EUR |
25+ | 19.32 EUR |
100+ | 17.55 EUR |
1N2784 |
Hersteller: Microchip Technology
Description: DIODE GEN PURP 200V 22A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 22A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Description: DIODE GEN PURP 200V 22A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 22A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Produkt ist nicht verfügbar
WP3232M6NFEI-320B2 |
Hersteller: Microchip Technology
Description: WINPATH3 232M6 PROC. 320MHZ LF
Packaging: Tray
Package / Case: 896-BGA, FCBGA
Mounting Type: Surface Mount
Interface: I2C, RMII, UART
Program Memory Type: SRAM
Applications: Network Processor
Core Processor: MIPS32® 34Kc™
Supplier Device Package: 896-FCBGA (31x31)
Part Status: Active
DigiKey Programmable: Not Verified
Description: WINPATH3 232M6 PROC. 320MHZ LF
Packaging: Tray
Package / Case: 896-BGA, FCBGA
Mounting Type: Surface Mount
Interface: I2C, RMII, UART
Program Memory Type: SRAM
Applications: Network Processor
Core Processor: MIPS32® 34Kc™
Supplier Device Package: 896-FCBGA (31x31)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 27 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 733.17 EUR |
25+ | 610.83 EUR |
PIC16F18857T-E/SSVAO |
Hersteller: Microchip Technology
Description: IC MCU 8BIT 56KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 56KB (32K x 14)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 56KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 56KB (32K x 14)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PIC16F18857T-I/SO |
Hersteller: Microchip Technology
Description: IC MCU 8BIT 56KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 56KB (32K x 14)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 56KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 56KB (32K x 14)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PIC16F18857-E/SSVAO |
Hersteller: Microchip Technology
Description: IC MCU 8BIT 56KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 56KB (32K x 14)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 56KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 56KB (32K x 14)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
JANS1N5712-1/TR |
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 20V 75MA DO35
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 75mA
Supplier Device Package: DO-35 (DO-204AH)
Operating Temperature - Junction: -65°C ~ 150°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
Qualification: MIL-PRF-19500/444
Description: DIODE SCHOTTKY 20V 75MA DO35
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 75mA
Supplier Device Package: DO-35 (DO-204AH)
Operating Temperature - Junction: -65°C ~ 150°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
Qualification: MIL-PRF-19500/444
Produkt ist nicht verfügbar
JANS1N5712UR-1 |
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 16V 75MA DO213AA
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 75mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 16 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
Description: DIODE SCHOTTKY 16V 75MA DO213AA
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 75mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 16 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
Produkt ist nicht verfügbar
JANS1N5712UR-1/TR |
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 16V 75MA DO213AA
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 75mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 16 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
Description: DIODE SCHOTTKY 16V 75MA DO213AA
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 75mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 16 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
Produkt ist nicht verfügbar
JANS1N5712UBD/TR |
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 16V 75MA UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 75mA
Supplier Device Package: UB
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 16 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
Description: DIODE SCHOTTKY 16V 75MA UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 75mA
Supplier Device Package: UB
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 16 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
Produkt ist nicht verfügbar
EV03J37A |
Hersteller: Microchip Technology
Description: DSPIC33CK64MC105 MC DIM
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: dsPIC
Platform: Dual-Inline Module (DIM)
Part Status: Active
Utilized IC / Part: dsPIC33CK64MC105
Description: DSPIC33CK64MC105 MC DIM
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: dsPIC
Platform: Dual-Inline Module (DIM)
Part Status: Active
Utilized IC / Part: dsPIC33CK64MC105
auf Bestellung 3 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 43.68 EUR |
EV84C64A |
Hersteller: Microchip Technology
Description: ILLC DEVELOPMENT BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: dsPIC
Part Status: Active
Utilized IC / Part: dsPIC33CH128MP506
Description: ILLC DEVELOPMENT BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: dsPIC
Part Status: Active
Utilized IC / Part: dsPIC33CH128MP506
auf Bestellung 3 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 710.76 EUR |
MNS2N2222AUBP/TR |
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Grade: Military
Qualification: MIL-PRF-19500/255
Description: TRANS NPN 50V 0.8A UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Grade: Military
Qualification: MIL-PRF-19500/255
Produkt ist nicht verfügbar
MSR2N2222AUB |
Hersteller: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Produkt ist nicht verfügbar
DSA1101BL3-040.0000VAO |
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-105C
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 40 MHz
Base Resonator: MEMS
Description: MEMS OSC AUTO LOWPWR -40C-105C
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 40 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1001BL3-001.0000 |
Hersteller: Microchip Technology
Description: OSC MEMS LOW PWR LVCMOS
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.5mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 1 MHz
Base Resonator: MEMS
Description: OSC MEMS LOW PWR LVCMOS
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.5mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 1 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSA1101BL3-050.0000TVAO |
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOW JITTER -40C-10
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 50 MHz
Base Resonator: MEMS
Description: MEMS OSC AUTO LOW JITTER -40C-10
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 50 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSA1001BL3-025.0000VAO |
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, LOW
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 25 MHz
Base Resonator: MEMS
Description: MEMS OSCILLATOR, AUTOMOTIVE, LOW
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1001BL3-001.0000T |
Hersteller: Microchip Technology
Description: OSC MEMS LOW PWR LVCMOS
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.5mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 1 MHz
Base Resonator: MEMS
Description: OSC MEMS LOW PWR LVCMOS
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.5mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 1 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1121BL3-012.2880 |
Hersteller: Microchip Technology
Description: MEMS OSC LOW JITTER 12.288MHZ LV
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Absolute Pull Range (APR): ±20ppm
Frequency: 12.288 MHz
Base Resonator: MEMS
Description: MEMS OSC LOW JITTER 12.288MHZ LV
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Absolute Pull Range (APR): ±20ppm
Frequency: 12.288 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSA1101BL3-050.0000VAO |
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOW JITTER -40C-10
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 50 MHz
Base Resonator: MEMS
Description: MEMS OSC AUTO LOW JITTER -40C-10
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 50 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSC1121BL3-012.2880T |
Hersteller: Microchip Technology
Description: MEMS OSC LOW JITTER 12.288MHZ LV
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Absolute Pull Range (APR): ±20ppm
Frequency: 12.288 MHz
Base Resonator: MEMS
Description: MEMS OSC LOW JITTER 12.288MHZ LV
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Absolute Pull Range (APR): ±20ppm
Frequency: 12.288 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
DSA1001BL3-025.0000TVAO |
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, LOW
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 25 MHz
Base Resonator: MEMS
Description: MEMS OSCILLATOR, AUTOMOTIVE, LOW
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
ATTINY426-SFR |
Hersteller: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 15x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 15x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 1360 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
10+ | 2.81 EUR |
25+ | 2.57 EUR |
100+ | 2.35 EUR |
ATTINY427-MFR |
Hersteller: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 24VQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 15x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-VQFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 24VQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 15x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-VQFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 11240 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
10+ | 2.78 EUR |
25+ | 2.52 EUR |
100+ | 2.3 EUR |
UPS5819E3/TR13 |
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 40V 1A POWERMITE1
Packaging: Tape & Reel (TR)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 60pF @ 5V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: Powermite 1 (DO216-AA)
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 550 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 mA @ 20 V
Description: DIODE SCHOTTKY 40V 1A POWERMITE1
Packaging: Tape & Reel (TR)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 60pF @ 5V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: Powermite 1 (DO216-AA)
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 550 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 mA @ 20 V
Produkt ist nicht verfügbar
UPS5819E3/TR13 |
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 40V 1A POWERMITE1
Packaging: Cut Tape (CT)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 60pF @ 5V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: Powermite 1 (DO216-AA)
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 550 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 mA @ 20 V
Description: DIODE SCHOTTKY 40V 1A POWERMITE1
Packaging: Cut Tape (CT)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 60pF @ 5V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: Powermite 1 (DO216-AA)
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 550 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 mA @ 20 V
auf Bestellung 10129 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
24+ | 1.09 EUR |
100+ | 1.01 EUR |
UPS5817E3/TR7 |
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 20V 1A POWERMITE1
Packaging: Tape & Reel (TR)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 1A
Supplier Device Package: Powermite 1 (DO216-AA)
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 450 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 mA @ 20 V
Description: DIODE SCHOTTKY 20V 1A POWERMITE1
Packaging: Tape & Reel (TR)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 1A
Supplier Device Package: Powermite 1 (DO216-AA)
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 450 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 mA @ 20 V
Produkt ist nicht verfügbar
UPS5817E3/TR7 |
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 20V 1A POWERMITE1
Packaging: Cut Tape (CT)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 1A
Supplier Device Package: Powermite 1 (DO216-AA)
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 450 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 mA @ 20 V
Description: DIODE SCHOTTKY 20V 1A POWERMITE1
Packaging: Cut Tape (CT)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 1A
Supplier Device Package: Powermite 1 (DO216-AA)
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 450 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 mA @ 20 V
Produkt ist nicht verfügbar
MSCGLQ50DH120CTBL2NG |
Hersteller: Microchip Technology
Description: PM-IGBT-SBD-BL2
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Asymmetrical Bridge
Operating Temperature: -55°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.4V @ 15V, 50A
NTC Thermistor: Yes
Part Status: Active
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 375 W
Current - Collector Cutoff (Max): 25 µA
Input Capacitance (Cies) @ Vce: 2.77 nF @ 25 V
Description: PM-IGBT-SBD-BL2
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Asymmetrical Bridge
Operating Temperature: -55°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.4V @ 15V, 50A
NTC Thermistor: Yes
Part Status: Active
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 375 W
Current - Collector Cutoff (Max): 25 µA
Input Capacitance (Cies) @ Vce: 2.77 nF @ 25 V
Produkt ist nicht verfügbar
EQCO125T40C1T-I/8EX |
Hersteller: Microchip Technology
Description: IC DRIVER 1/0 16QFN TR
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Driver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.25V
Number of Drivers/Receivers: 1/0
Data Rate: 12.5Gbps
Supplier Device Package: 16-QFN (4x4)
Part Status: Last Time Buy
Description: IC DRIVER 1/0 16QFN TR
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Driver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.25V
Number of Drivers/Receivers: 1/0
Data Rate: 12.5Gbps
Supplier Device Package: 16-QFN (4x4)
Part Status: Last Time Buy
auf Bestellung 1000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1000+ | 77.49 EUR |
EQCO125T40C1T-I/8EX |
Hersteller: Microchip Technology
Description: IC DRIVER 1/0 16QFN TR
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Driver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.25V
Number of Drivers/Receivers: 1/0
Data Rate: 12.5Gbps
Supplier Device Package: 16-QFN (4x4)
Part Status: Last Time Buy
Description: IC DRIVER 1/0 16QFN TR
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Driver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.25V
Number of Drivers/Receivers: 1/0
Data Rate: 12.5Gbps
Supplier Device Package: 16-QFN (4x4)
Part Status: Last Time Buy
auf Bestellung 1624 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 77.51 EUR |
2CGA301A-MSCL |
Produkt ist nicht verfügbar
2CGA201A-MSCL |
Produkt ist nicht verfügbar
CMLRGLQ80V601AMXG-AS |
Hersteller: Microchip Technology
Description: IC POWER MODULE SMD
Packaging: Tray
Part Status: Obsolete
Description: IC POWER MODULE SMD
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
MCP3202-CI/SNVAO |
Hersteller: Microchip Technology
Description: IC ADC 12BIT SAR 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: SPI
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.7V ~ 5.5V
Voltage - Supply, Digital: 2.7V ~ 5.5V
Sampling Rate (Per Second): 100k
Input Type: Pseudo-Differential, Single Ended
Number of Inputs: 1, 2
Supplier Device Package: 8-SOIC
Architecture: SAR
Ratio - S/H:ADC: 1:1
Part Status: Active
Number of A/D Converters: 1
Grade: Automotive
Qualification: AEC-Q100
Description: IC ADC 12BIT SAR 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: SPI
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.7V ~ 5.5V
Voltage - Supply, Digital: 2.7V ~ 5.5V
Sampling Rate (Per Second): 100k
Input Type: Pseudo-Differential, Single Ended
Number of Inputs: 1, 2
Supplier Device Package: 8-SOIC
Architecture: SAR
Ratio - S/H:ADC: 1:1
Part Status: Active
Number of A/D Converters: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MSMBJ26CAe3 |
Hersteller: Microchip Technology
Description: TVS DIODE 26VWM 42.1VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.2A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: SMBJ (DO-214AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 42.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Part Status: Active
Qualification: MIL-PRF-19500
Description: TVS DIODE 26VWM 42.1VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.2A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: SMBJ (DO-214AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 42.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Part Status: Active
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
MASMBJ26CAe3 |
Hersteller: Microchip Technology
Description: TVS DIODE 26VWM 42.1VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.2A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: SMBJ (DO-214AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 42.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Part Status: Active
Qualification: MIL-PRF-19500
Description: TVS DIODE 26VWM 42.1VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.2A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: SMBJ (DO-214AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 42.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Part Status: Active
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
MXSMBJ26CAe3 |
Hersteller: Microchip Technology
Description: TVS DIODE 26VWM 42.1VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.2A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: SMBJ (DO-214AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 42.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 26VWM 42.1VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.2A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: SMBJ (DO-214AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 42.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
MXLSMBJ26CA |
Hersteller: Microchip Technology
Description: TVS DIODE 26VWM 42.1VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.2A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: SMBJ (DO-214AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 42.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 26VWM 42.1VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.2A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: SMBJ (DO-214AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 42.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
MXSMBJ26CA |
Hersteller: Microchip Technology
Description: TVS DIODE 26VWM 42.1VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.2A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: SMBJ (DO-214AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 42.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 26VWM 42.1VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.2A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: SMBJ (DO-214AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 42.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
MASMBJ26CA |
Hersteller: Microchip Technology
Description: TVS DIODE 26VWM 42.1VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.2A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: SMBJ (DO-214AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 42.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Part Status: Active
Qualification: MIL-PRF-19500
Description: TVS DIODE 26VWM 42.1VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.2A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: SMBJ (DO-214AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 42.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Part Status: Active
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
MXLSMBJ26CAe3 |
Hersteller: Microchip Technology
Description: TVS DIODE 26VWM 42.1VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.2A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: SMBJ (DO-214AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 42.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 26VWM 42.1VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.2A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: SMBJ (DO-214AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 42.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
MSMBJ26CA |
Hersteller: Microchip Technology
Description: TVS DIODE 26VWM 42.1VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.2A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: SMBJ (DO-214AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 42.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
Grade: Military
Qualification: MIL-PRF-19500
Description: TVS DIODE 26VWM 42.1VC SMBJ
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.2A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: SMBJ (DO-214AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 42.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
MPLAD7.5KP28CA |
Hersteller: Microchip Technology
Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 165A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.1V
Voltage - Clamping (Max) @ Ipp: 45.5V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 165A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.1V
Voltage - Clamping (Max) @ Ipp: 45.5V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar