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CDLL5278D/TR Microchip Technology Description: VOLTAGE REGULATOR
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 170 V
Impedance (Max) (Zzt): 1900 Ohms
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 123 V
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M5KP28A/TR Microchip Technology Description: TVS 28V 5% 5000W UNI
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 45.4V
Voltage - Breakdown (Min): 31.1V
Unidirectional Channels: 1
Supplier Device Package: P600
Voltage - Reverse Standoff (Typ): 28V
Current - Peak Pulse (10/1000µs): 110A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: P600, Axial
Packaging: Tape & Reel (TR)
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M5KP28AE3/TR Microchip Technology Description: TVS 28V 10% 5000W UNI
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 45.4V
Voltage - Breakdown (Min): 31.1V
Unidirectional Channels: 1
Supplier Device Package: P600
Voltage - Reverse Standoff (Typ): 28V
Current - Peak Pulse (10/1000µs): 110A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: P600, Axial
Packaging: Tape & Reel (TR)
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1N2996A 1N2996A Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 50V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 50 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 36 V
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ZL30291LDF1 ZL30291LDF1 Microchip Technology ZL30291-CK440Q-Compliant-Gen-6-PCIe-and-Platform-Timing-Clock-Generator-DS20006463.pdf Description: IC CLK GENERATOR PCIE 100-UFQFN
DigiKey Programmable: Not Verified
Number of Circuits: 1
PLL: No
Differential - Input:Output: No/Yes
Ratio - Input:Output: 1:19
Main Purpose: Intel QPI, PCI Express (PCIe)
Voltage - Supply: 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 85°C
Frequency - Max: 100MHz
Output: HCSL
Packaging: Tape & Reel (TR)
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ZL30291LDG1 ZL30291LDG1 Microchip Technology ZL30291-CK440Q-Compliant-Gen-6-PCIe-and-Platform-Timing-Clock-Generator-DS20006463.pdf Description: IC CLK GENERATOR PCIE 100-UFQFN
DigiKey Programmable: Not Verified
Number of Circuits: 1
PLL: No
Supplier Device Package: 100-UQFN (8x8)
Differential - Input:Output: No/Yes
Ratio - Input:Output: 1:19
Main Purpose: Intel QPI, PCI Express (PCIe)
Voltage - Supply: 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 85°C
Frequency - Max: 100MHz
Output: LP-HCSL
Mounting Type: Surface Mount
Package / Case: 100-UFQFN Dual Rows, Exposed Pad
Packaging: Tray
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CEC1736-S0-I/2HW-TCSM Microchip Technology CEC173x_Data_Brief.pdf Description: TRUSTCUSTOM 1-CHANNEL PFR WITH 2
Number of I/O: 52
Supplier Device Package: 64-VFBGA (5.5x5.5)
Core Processor: ARM® Cortex®-M4F
Applications: Real Time Platform Root
Program Memory Type: OTP (1kB)
Controller Series: CEC173X
Voltage - Supply: 1.8V ~ 3.3V
Operating Temperature: -40°C ~ 85°C
RAM Size: 384K x 8
Interface: I2C, PWM, SMBus, SPI, UART
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tray
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CEC1734-S0-I/2HW-TCSM Microchip Technology CEC173x_Data_Brief.pdf Description: TRUSTCUSTOM 1-CHANNEL PFR WITH 2
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Applications: Real Time Platform Root
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 64-VFBGA (5.5x5.5)
Number of I/O: 52
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CEC1734-S0-I/2ZW-TCSM CEC1734-S0-I/2ZW-TCSM Microchip Technology CEC173x_Data_Brief.pdf Description: TRUSTCUSTOM 2-CHANNEL PFR WITH 4
Packaging: Tray
Package / Case: 84-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Applications: Real Time Platform Root
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 84-WFBGA (7x7)
Number of I/O: 71
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CEC1736-S0-I/2ZW-TCSM CEC1736-S0-I/2ZW-TCSM Microchip Technology CEC173x_Data_Brief.pdf Description: TRUSTCUSTOM 2-CHANNEL PFR WITH 4
Packaging: Tray
Package / Case: 84-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Applications: Real Time Platform Root
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 84-WFBGA (7x7)
Number of I/O: 71
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1N5989UR-1/TR 1N5989UR-1/TR Microchip Technology 1N5985BUR-%281%29-1N6031BUR-%281%29.pdf Description: DIODE ZENER 3.6V 500MW DO213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Voltage - Zener (Nom) (Vz): 3.6 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AA
Packaging: Tape & Reel (TR)
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1N5989UR-1/TR 1N5989UR-1/TR Microchip Technology 1N5985BUR-%281%29-1N6031BUR-%281%29.pdf Description: DIODE ZENER 3.6V 500MW DO213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Voltage - Zener (Nom) (Vz): 3.6 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AA
Packaging: Cut Tape (CT)
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AT87F55WD-24PI AT87F55WD-24PI Microchip Technology AT87F55WD.pdf Description: IC MCU 8BIT 20KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 24MHz
Program Memory Size: 20KB (20K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: OTP Quick FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V
Connectivity: UART/USART
Peripherals: WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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AT87F51RC-24PI AT87F51RC-24PI Microchip Technology AT87F51RC.pdf Description: IC MCU 8BIT 32KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: OTP Quick FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4V ~ 6V
Connectivity: UART/USART
Peripherals: WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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CDLL5236D Microchip Technology Description: DIODE ZENER 7.5V DO-213AA
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 6 Ohms
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 6 V
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WBZ350PE-I WBZ350PE-I Microchip Technology PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf Description: BLUETOOTH LOW ENERGY/802.15.4 CO
Serial Interfaces: ADC, DAC, GPIO, I2C, PWM, QSPI, RS485, SPI, USART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: GFSK, O-QPSK
Utilized IC / Part: PIC32CX5109BZ31032
Antenna Type: PCB Trace
Current - Transmitting: 22mA ~ 49mA
Current - Receiving: 16mA ~ 20mA
Protocol: Bluetooth v5.2, Zigbee®
Data Rate: 2Mbps
Power - Output: 11dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Memory Size: 512kB Flash, 96kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -108dBm
Package / Case: 30-SMD Module
Packaging: Tray
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WBZ350UE-I WBZ350UE-I Microchip Technology PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf Description: BLUETOOTH LE / ZIGBEE COMBO MODU
Serial Interfaces: ADC, DAC, GPIO, I2C, PWM, QSPI, RS485, SPI, USART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: GFSK, O-QPSK
Utilized IC / Part: PIC32CX5109BZ31032
Antenna Type: Antenna Not Included, U.FL
Current - Transmitting: 22mA ~ 49mA
Current - Receiving: 16mA ~ 20mA
Protocol: Bluetooth v5.2, Zigbee®
Data Rate: 2Mbps
Power - Output: 11dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Memory Size: 512kB Flash, 96kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -108dBm
Package / Case: 30-SMD Module
Packaging: Tray
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MP6KE68A MP6KE68A Microchip Technology rf01007_rb.pdf Description: TVS DIODE 58.1VWM 92VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.5A
Voltage - Reverse Standoff (Typ): 58.1V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 64.6V
Voltage - Clamping (Max) @ Ipp: 92V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PIC18LF25K40-E/SP PIC18LF25K40-E/SP Microchip Technology PIC18(L)F24_25K40%2028-Pin%20Low-Power%20High-Performance%20MCU%20with%20XLP%20Technology%2040001843D.pdf Description: IC MCU 8BIT 32KB FLASH 28SDIP
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 28-SPDIP
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 35x10b; D/A 1x5b
Core Processor: PIC
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (16K x 16)
Speed: 64MHz
Mounting Type: Through Hole
Package / Case: 28-DIP (0.300", 7.62mm)
Packaging: Tube
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MIC29303BT MIC29303BT Microchip Technology MIC2915x-30x-50x-75x-High-Current-Low-Dropout-Regulators-DS20005685B.pdf Description: IC REG LINEAR POS ADJ 3A TO220-5
Protection Features: Over Current, Over Temperature, Reverse Polarity, Transient Voltage
Voltage Dropout (Max): 0.6V @ 3A
Voltage - Output (Min/Fixed): 1.25V
Voltage - Output (Max): 25V
Supplier Device Package: TO-220-5
Number of Regulators: 1
Voltage - Input (Max): 26V
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 3A
Mounting Type: Through Hole
Output Type: Adjustable
Package / Case: TO-220-5
Packaging: Bulk
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VC-709-0032-125M000000 Microchip Technology 1243786-vc-709 Description: CUSTOM LOW POWER DIFFERENTIAL XO
Base Resonator: Crystal
Frequency: 125 MHz
Height - Seated (Max): 0.067" (1.70mm)
Type: XO (Standard)
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 6-SMD, No Lead
Packaging: Tape & Reel (TR)
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090-03240-003 Microchip Technology 090-03240-001%2C%20090-03240-003.pdf Description: IC EMBEDDED ATOMIC CLK 12DIP
DigiKey Programmable: Not Verified
Type: Embedded Atomic Clocks
Mounting Type: Through Hole
Package / Case: 12-DIP Module, 9 Leads
Packaging: Tray
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090-03240-001 Microchip Technology 090-03240-001%2C%20090-03240-003.pdf Description: IC EMBEDDED ATOMIC CLK 12DIP
Packaging: Tray
Package / Case: 12-DIP Module, 9 Leads
Mounting Type: Through Hole
Type: Embedded Atomic Clocks
DigiKey Programmable: Not Verified
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PIC16F18074T-I/PT PIC16F18074T-I/PT Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 7KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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PIC16F18074T-I/PT PIC16F18074T-I/PT Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 7KB FLASH 44TQFP
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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PIC16F18074T-I/MP PIC16F18074T-I/MP Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 7KB FLASH 40VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 35
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PIC16F18074T-I/MP PIC16F18074T-I/MP Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 7KB FLASH 40VFQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 35
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PIC16F18075T-I/PT PIC16F18075T-I/PT Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 14KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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PIC16F18075T-I/PT PIC16F18075T-I/PT Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 14KB FLASH 44TQFP
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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PIC16F18074-E/PT PIC16F18074-E/PT Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 7KB FLASH 44TQFP
Number of I/O: 35
Supplier Device Package: 44-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tray
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PIC16F18075T-I/MP PIC16F18075T-I/MP Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 14KB FLASH 40VFQFN
Number of I/O: 35
Supplier Device Package: 40-QFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PIC16F18075T-I/MP PIC16F18075T-I/MP Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 14KB FLASH 40VFQFN
Number of I/O: 35
Supplier Device Package: 40-QFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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PIC16F18074-E/MP PIC16F18074-E/MP Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 7KB FLASH 40VFQFN
Number of I/O: 35
Supplier Device Package: 40-QFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tube
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PIC16F18075-E/PT PIC16F18075-E/PT Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 14KB FLASH 44TQFP
Number of I/O: 35
Supplier Device Package: 44-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tray
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PIC16F18075-E/MP PIC16F18075-E/MP Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 14KB FLASH 40VFQFN
Number of I/O: 35
Supplier Device Package: 40-QFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tube
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PIC16F18074-E/P PIC16F18074-E/P Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 7KB FLASH 40DIP
Number of I/O: 35
Supplier Device Package: 40-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
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PIC16F18075-E/P PIC16F18075-E/P Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 14KB FLASH 40DIP
Number of I/O: 35
Supplier Device Package: 40-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
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JANTXV1N3023CUR-1 JANTXV1N3023CUR-1 Microchip Technology 1N3016BUR-1-1N3045BUR-1.pdf Description: DIODE ZENER 13V 1W DO213AB
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 9.9 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 13 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±2%
Packaging: Bulk
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1N2068 Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP 1KV 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 1000 V
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1N2068R Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP REV 1KV 275A DO205AB
Current - Reverse Leakage @ Vr: 75 µA @ 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Voltage - DC Reverse (Vr) (Max): 1000 V
Operating Temperature - Junction: -65°C ~ 190°C
Supplier Device Package: DO-205AB (DO-9)
Current - Average Rectified (Io): 275A
Technology: Standard, Reverse Polarity
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-205AB, DO-9, Stud
Packaging: Bulk
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2N6229 2N6229 Microchip Technology Description: PNP POWER TRANSISTOR SILICON AMP
Packaging: Bulk
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JAN2N6274 JAN2N6274 Microchip Technology Description: TRANS NPN 100V 50A TO-3
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 3V @ 10A, 50A
Current - Collector Cutoff (Max): 50µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20A, 4V
Supplier Device Package: TO-3
Grade: Military
Current - Collector (Ic) (Max): 50 A
Voltage - Collector Emitter Breakdown (Max): 100 V
Power - Max: 250 W
Qualification: MIL-PRF-19500/514
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Jantxv2N6274 Jantxv2N6274 Microchip Technology Description: TRANS NPN 100V 50A TO-3
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 3V @ 10A, 50A
Current - Collector Cutoff (Max): 50µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20A, 4V
Supplier Device Package: TO-3
Grade: Military
Current - Collector (Ic) (Max): 50 A
Voltage - Collector Emitter Breakdown (Max): 100 V
Power - Max: 250 W
Qualification: MIL-PRF-19500/514
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PIC16F18023-I/P PIC16F18023-I/P Microchip Technology PIC16F18013-14-23-24-Microcontroller-Data-Sheet-DS40002539.pdf Description: IC MCU 8BIT 3.5KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 3.5KB (3.5K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
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PIC16F18023-E/P PIC16F18023-E/P Microchip Technology PIC16F18013-14-23-24-Microcontroller-Data-Sheet-DS40002539.pdf Description: IC MCU 8BIT 3.5KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Program Memory Size: 3.5KB (3.5K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
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PIC16F18024-I/P PIC16F18024-I/P Microchip Technology PIC16F18013-14-23-24-Microcontroller-Data-Sheet-DS40002539.pdf Description: IC MCU 8BIT 7KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
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PIC16F18024-E/P PIC16F18024-E/P Microchip Technology PIC16F18013-14-23-24-Microcontroller-Data-Sheet-DS40002539.pdf Description: IC MCU 8BIT 7KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
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PIC16F18025-E/P PIC16F18025-E/P Microchip Technology PIC16F18015-25-44-45-Microcontroller-Data-Sheet-40002340B.pdf Description: IC MCU 8BIT 14KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
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JAN1N3023C-1 JAN1N3023C-1 Microchip Technology 125225-lds-0285-datasheet Description: DIODE ZENER 13V 1W DO41
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 9.9 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-204AL (DO-41)
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 13 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AL, DO-41, Axial
Tolerance: ±2%
Packaging: Bulk
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JANTXV1N3595AUS/TR Microchip Technology Description: SIGNAL OR COMPUTER DIODE
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, D
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Capacitance @ Vr, F: 8pF @ 0V, 1MHz
Current - Average Rectified (Io): 150mA
Supplier Device Package: D-5D
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 125 V
Voltage - Forward (Vf) (Max) @ If: 920 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 nA @ 125 V
Qualification: MIL-PRF-19500
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1N4988US/TR 1N4988US/TR Microchip Technology 1N4954US-1N4996US_1N5968US-1N5969US_1N6632US-1N6637US.pdf Description: DIODE ZENER 180V 5W E-MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 180 V
Impedance (Max) (Zzt): 450 Ohms
Supplier Device Package: E-MELF
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 136.8 V
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1N4988US/TR 1N4988US/TR Microchip Technology 1N4954US-1N4996US_1N5968US-1N5969US_1N6632US-1N6637US.pdf Description: DIODE ZENER 180V 5W E-MELF
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 180 V
Impedance (Max) (Zzt): 450 Ohms
Supplier Device Package: E-MELF
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 136.8 V
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DSC1001BE2-014.7456T DSC1001BE2-014.7456T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 14.7456MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.7456 MHz
Base Resonator: MEMS
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DSC1001BE2-014.7450T DSC1001BE2-014.7450T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 14.7450MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.745 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-012.2880T DSC1001BE2-012.2880T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 12.2880MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.288 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-010.0000T DSC1001BE2-010.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 10.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-012.0000T DSC1001BE2-012.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-012.2880 DSC1001BE2-012.2880 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 12.2880MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.288 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-010.0000 DSC1001BE2-010.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 10.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-014.7450 DSC1001BE2-014.7450 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 14.7450MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.745 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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CDLL5278D/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 170 V
Impedance (Max) (Zzt): 1900 Ohms
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 123 V
Produkt ist nicht verfügbar
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M5KP28A/TR
Hersteller: Microchip Technology
Description: TVS 28V 5% 5000W UNI
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 45.4V
Voltage - Breakdown (Min): 31.1V
Unidirectional Channels: 1
Supplier Device Package: P600
Voltage - Reverse Standoff (Typ): 28V
Current - Peak Pulse (10/1000µs): 110A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: P600, Axial
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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M5KP28AE3/TR
Hersteller: Microchip Technology
Description: TVS 28V 10% 5000W UNI
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 45.4V
Voltage - Breakdown (Min): 31.1V
Unidirectional Channels: 1
Supplier Device Package: P600
Voltage - Reverse Standoff (Typ): 28V
Current - Peak Pulse (10/1000µs): 110A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: P600, Axial
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N2996A 8914-lds-0075-datasheet
1N2996A
Hersteller: Microchip Technology
Description: DIODE ZENER 50V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 50 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 36 V
Produkt ist nicht verfügbar
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ZL30291LDF1 ZL30291-CK440Q-Compliant-Gen-6-PCIe-and-Platform-Timing-Clock-Generator-DS20006463.pdf
ZL30291LDF1
Hersteller: Microchip Technology
Description: IC CLK GENERATOR PCIE 100-UFQFN
DigiKey Programmable: Not Verified
Number of Circuits: 1
PLL: No
Differential - Input:Output: No/Yes
Ratio - Input:Output: 1:19
Main Purpose: Intel QPI, PCI Express (PCIe)
Voltage - Supply: 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 85°C
Frequency - Max: 100MHz
Output: HCSL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ZL30291LDG1 ZL30291-CK440Q-Compliant-Gen-6-PCIe-and-Platform-Timing-Clock-Generator-DS20006463.pdf
ZL30291LDG1
Hersteller: Microchip Technology
Description: IC CLK GENERATOR PCIE 100-UFQFN
DigiKey Programmable: Not Verified
Number of Circuits: 1
PLL: No
Supplier Device Package: 100-UQFN (8x8)
Differential - Input:Output: No/Yes
Ratio - Input:Output: 1:19
Main Purpose: Intel QPI, PCI Express (PCIe)
Voltage - Supply: 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 85°C
Frequency - Max: 100MHz
Output: LP-HCSL
Mounting Type: Surface Mount
Package / Case: 100-UFQFN Dual Rows, Exposed Pad
Packaging: Tray
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25+3.99 EUR
100+3.86 EUR
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CEC1736-S0-I/2HW-TCSM CEC173x_Data_Brief.pdf
Hersteller: Microchip Technology
Description: TRUSTCUSTOM 1-CHANNEL PFR WITH 2
Number of I/O: 52
Supplier Device Package: 64-VFBGA (5.5x5.5)
Core Processor: ARM® Cortex®-M4F
Applications: Real Time Platform Root
Program Memory Type: OTP (1kB)
Controller Series: CEC173X
Voltage - Supply: 1.8V ~ 3.3V
Operating Temperature: -40°C ~ 85°C
RAM Size: 384K x 8
Interface: I2C, PWM, SMBus, SPI, UART
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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CEC1734-S0-I/2HW-TCSM CEC173x_Data_Brief.pdf
Hersteller: Microchip Technology
Description: TRUSTCUSTOM 1-CHANNEL PFR WITH 2
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Applications: Real Time Platform Root
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 64-VFBGA (5.5x5.5)
Number of I/O: 52
Produkt ist nicht verfügbar
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CEC1734-S0-I/2ZW-TCSM CEC173x_Data_Brief.pdf
CEC1734-S0-I/2ZW-TCSM
Hersteller: Microchip Technology
Description: TRUSTCUSTOM 2-CHANNEL PFR WITH 4
Packaging: Tray
Package / Case: 84-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Applications: Real Time Platform Root
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 84-WFBGA (7x7)
Number of I/O: 71
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CEC1736-S0-I/2ZW-TCSM CEC173x_Data_Brief.pdf
CEC1736-S0-I/2ZW-TCSM
Hersteller: Microchip Technology
Description: TRUSTCUSTOM 2-CHANNEL PFR WITH 4
Packaging: Tray
Package / Case: 84-WFBGA
Mounting Type: Surface Mount
Interface: I2C, PWM, SMBus, SPI, UART
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Controller Series: CEC173X
Program Memory Type: OTP (1kB)
Applications: Real Time Platform Root
Core Processor: ARM® Cortex®-M4F
Supplier Device Package: 84-WFBGA (7x7)
Number of I/O: 71
Produkt ist nicht verfügbar
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1N5989UR-1/TR 1N5985BUR-%281%29-1N6031BUR-%281%29.pdf
1N5989UR-1/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 3.6V 500MW DO213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Voltage - Zener (Nom) (Vz): 3.6 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N5989UR-1/TR 1N5985BUR-%281%29-1N6031BUR-%281%29.pdf
1N5989UR-1/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 3.6V 500MW DO213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Voltage - Zener (Nom) (Vz): 3.6 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AA
Packaging: Cut Tape (CT)
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AT87F55WD-24PI AT87F55WD.pdf
AT87F55WD-24PI
Hersteller: Microchip Technology
Description: IC MCU 8BIT 20KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 24MHz
Program Memory Size: 20KB (20K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: OTP Quick FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V
Connectivity: UART/USART
Peripherals: WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AT87F51RC-24PI AT87F51RC.pdf
AT87F51RC-24PI
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: OTP Quick FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4V ~ 6V
Connectivity: UART/USART
Peripherals: WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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CDLL5236D
Hersteller: Microchip Technology
Description: DIODE ZENER 7.5V DO-213AA
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 6 Ohms
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 6 V
Produkt ist nicht verfügbar
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WBZ350PE-I PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf
WBZ350PE-I
Hersteller: Microchip Technology
Description: BLUETOOTH LOW ENERGY/802.15.4 CO
Serial Interfaces: ADC, DAC, GPIO, I2C, PWM, QSPI, RS485, SPI, USART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: GFSK, O-QPSK
Utilized IC / Part: PIC32CX5109BZ31032
Antenna Type: PCB Trace
Current - Transmitting: 22mA ~ 49mA
Current - Receiving: 16mA ~ 20mA
Protocol: Bluetooth v5.2, Zigbee®
Data Rate: 2Mbps
Power - Output: 11dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Memory Size: 512kB Flash, 96kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -108dBm
Package / Case: 30-SMD Module
Packaging: Tray
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WBZ350UE-I PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf
WBZ350UE-I
Hersteller: Microchip Technology
Description: BLUETOOTH LE / ZIGBEE COMBO MODU
Serial Interfaces: ADC, DAC, GPIO, I2C, PWM, QSPI, RS485, SPI, USART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: GFSK, O-QPSK
Utilized IC / Part: PIC32CX5109BZ31032
Antenna Type: Antenna Not Included, U.FL
Current - Transmitting: 22mA ~ 49mA
Current - Receiving: 16mA ~ 20mA
Protocol: Bluetooth v5.2, Zigbee®
Data Rate: 2Mbps
Power - Output: 11dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Memory Size: 512kB Flash, 96kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -108dBm
Package / Case: 30-SMD Module
Packaging: Tray
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4+6.53 EUR
100+6.13 EUR
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MP6KE68A rf01007_rb.pdf
MP6KE68A
Hersteller: Microchip Technology
Description: TVS DIODE 58.1VWM 92VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.5A
Voltage - Reverse Standoff (Typ): 58.1V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 64.6V
Voltage - Clamping (Max) @ Ipp: 92V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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PIC18LF25K40-E/SP PIC18(L)F24_25K40%2028-Pin%20Low-Power%20High-Performance%20MCU%20with%20XLP%20Technology%2040001843D.pdf
PIC18LF25K40-E/SP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28SDIP
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 28-SPDIP
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 35x10b; D/A 1x5b
Core Processor: PIC
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (16K x 16)
Speed: 64MHz
Mounting Type: Through Hole
Package / Case: 28-DIP (0.300", 7.62mm)
Packaging: Tube
Produkt ist nicht verfügbar
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MIC29303BT MIC2915x-30x-50x-75x-High-Current-Low-Dropout-Regulators-DS20005685B.pdf
MIC29303BT
Hersteller: Microchip Technology
Description: IC REG LINEAR POS ADJ 3A TO220-5
Protection Features: Over Current, Over Temperature, Reverse Polarity, Transient Voltage
Voltage Dropout (Max): 0.6V @ 3A
Voltage - Output (Min/Fixed): 1.25V
Voltage - Output (Max): 25V
Supplier Device Package: TO-220-5
Number of Regulators: 1
Voltage - Input (Max): 26V
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 3A
Mounting Type: Through Hole
Output Type: Adjustable
Package / Case: TO-220-5
Packaging: Bulk
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VC-709-0032-125M000000 1243786-vc-709
Hersteller: Microchip Technology
Description: CUSTOM LOW POWER DIFFERENTIAL XO
Base Resonator: Crystal
Frequency: 125 MHz
Height - Seated (Max): 0.067" (1.70mm)
Type: XO (Standard)
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 6-SMD, No Lead
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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090-03240-003 090-03240-001%2C%20090-03240-003.pdf
Hersteller: Microchip Technology
Description: IC EMBEDDED ATOMIC CLK 12DIP
DigiKey Programmable: Not Verified
Type: Embedded Atomic Clocks
Mounting Type: Through Hole
Package / Case: 12-DIP Module, 9 Leads
Packaging: Tray
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090-03240-001 090-03240-001%2C%20090-03240-003.pdf
Hersteller: Microchip Technology
Description: IC EMBEDDED ATOMIC CLK 12DIP
Packaging: Tray
Package / Case: 12-DIP Module, 9 Leads
Mounting Type: Through Hole
Type: Embedded Atomic Clocks
DigiKey Programmable: Not Verified
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PIC16F18074T-I/PT PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18074T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
Produkt ist nicht verfügbar
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PIC16F18074T-I/PT PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18074T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 44TQFP
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
auf Bestellung 1100 Stücke:
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AnzahlPrivatkunde
8+2.93 EUR
25+2.69 EUR
100+2.61 EUR
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PIC16F18074T-I/MP PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18074T-I/MP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 40VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 35
Produkt ist nicht verfügbar
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PIC16F18074T-I/MP PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18074T-I/MP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 40VFQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 35
auf Bestellung 3275 Stücke:
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AnzahlPrivatkunde
7+3.14 EUR
25+2.88 EUR
100+2.77 EUR
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PIC16F18075T-I/PT PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18075T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
auf Bestellung 1200 Stücke:
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1200+2.2 EUR
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PIC16F18075T-I/PT PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18075T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 44TQFP
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
auf Bestellung 1200 Stücke:
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8+2.67 EUR
25+2.44 EUR
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PIC16F18074-E/PT PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18074-E/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 44TQFP
Number of I/O: 35
Supplier Device Package: 44-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tray
auf Bestellung 480 Stücke:
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AnzahlPrivatkunde
7+3.2 EUR
25+2.94 EUR
100+2.87 EUR
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PIC16F18075T-I/MP PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18075T-I/MP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 40VFQFN
Number of I/O: 35
Supplier Device Package: 40-QFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
auf Bestellung 3300 Stücke:
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3300+2.94 EUR
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PIC16F18075T-I/MP PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18075T-I/MP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 40VFQFN
Number of I/O: 35
Supplier Device Package: 40-QFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 3300 Stücke:
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7+3.36 EUR
25+3.06 EUR
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PIC16F18074-E/MP PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18074-E/MP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 40VFQFN
Number of I/O: 35
Supplier Device Package: 40-QFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tube
auf Bestellung 438 Stücke:
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7+3.42 EUR
25+3.13 EUR
100+3.02 EUR
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PIC16F18075-E/PT PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18075-E/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 44TQFP
Number of I/O: 35
Supplier Device Package: 44-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tray
auf Bestellung 480 Stücke:
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AnzahlPrivatkunde
7+3.45 EUR
25+3.15 EUR
100+3.05 EUR
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PIC16F18075-E/MP PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18075-E/MP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 40VFQFN
Number of I/O: 35
Supplier Device Package: 40-QFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tube
auf Bestellung 949 Stücke:
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6+3.64 EUR
25+3.34 EUR
100+3.21 EUR
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PIC16F18074-E/P PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18074-E/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 40DIP
Number of I/O: 35
Supplier Device Package: 40-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
auf Bestellung 210 Stücke:
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3+7.35 EUR
25+6.76 EUR
100+6.12 EUR
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PIC16F18075-E/P PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18075-E/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 40DIP
Number of I/O: 35
Supplier Device Package: 40-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
auf Bestellung 200 Stücke:
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25+6.99 EUR
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JANTXV1N3023CUR-1 1N3016BUR-1-1N3045BUR-1.pdf
JANTXV1N3023CUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 13V 1W DO213AB
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 9.9 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 13 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±2%
Packaging: Bulk
Produkt ist nicht verfügbar
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1N2068 1N4044-1N4056.pdf
Hersteller: Microchip Technology
Description: DIODE GP 1KV 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 1000 V
Produkt ist nicht verfügbar
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1N2068R 1N4044-1N4056.pdf
Hersteller: Microchip Technology
Description: DIODE GP REV 1KV 275A DO205AB
Current - Reverse Leakage @ Vr: 75 µA @ 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Voltage - DC Reverse (Vr) (Max): 1000 V
Operating Temperature - Junction: -65°C ~ 190°C
Supplier Device Package: DO-205AB (DO-9)
Current - Average Rectified (Io): 275A
Technology: Standard, Reverse Polarity
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-205AB, DO-9, Stud
Packaging: Bulk
Produkt ist nicht verfügbar
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2N6229
2N6229
Hersteller: Microchip Technology
Description: PNP POWER TRANSISTOR SILICON AMP
Packaging: Bulk
Produkt ist nicht verfügbar
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JAN2N6274
JAN2N6274
Hersteller: Microchip Technology
Description: TRANS NPN 100V 50A TO-3
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 3V @ 10A, 50A
Current - Collector Cutoff (Max): 50µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20A, 4V
Supplier Device Package: TO-3
Grade: Military
Current - Collector (Ic) (Max): 50 A
Voltage - Collector Emitter Breakdown (Max): 100 V
Power - Max: 250 W
Qualification: MIL-PRF-19500/514
Produkt ist nicht verfügbar
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Jantxv2N6274
Jantxv2N6274
Hersteller: Microchip Technology
Description: TRANS NPN 100V 50A TO-3
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 3V @ 10A, 50A
Current - Collector Cutoff (Max): 50µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20A, 4V
Supplier Device Package: TO-3
Grade: Military
Current - Collector (Ic) (Max): 50 A
Voltage - Collector Emitter Breakdown (Max): 100 V
Power - Max: 250 W
Qualification: MIL-PRF-19500/514
Produkt ist nicht verfügbar
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PIC16F18023-I/P PIC16F18013-14-23-24-Microcontroller-Data-Sheet-DS40002539.pdf
PIC16F18023-I/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 3.5KB (3.5K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
auf Bestellung 630 Stücke:
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9+2.43 EUR
25+2.24 EUR
100+2.02 EUR
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PIC16F18023-E/P PIC16F18013-14-23-24-Microcontroller-Data-Sheet-DS40002539.pdf
PIC16F18023-E/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Program Memory Size: 3.5KB (3.5K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
auf Bestellung 570 Stücke:
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8+2.68 EUR
25+2.45 EUR
100+2.21 EUR
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PIC16F18024-I/P PIC16F18013-14-23-24-Microcontroller-Data-Sheet-DS40002539.pdf
PIC16F18024-I/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
auf Bestellung 510 Stücke:
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7+3.08 EUR
25+2.82 EUR
100+2.55 EUR
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PIC16F18024-E/P PIC16F18013-14-23-24-Microcontroller-Data-Sheet-DS40002539.pdf
PIC16F18024-E/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
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7+3.39 EUR
25+3.09 EUR
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PIC16F18025-E/P PIC16F18015-25-44-45-Microcontroller-Data-Sheet-40002340B.pdf
PIC16F18025-E/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
auf Bestellung 683 Stücke:
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5+4.4 EUR
25+4.05 EUR
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JAN1N3023C-1 125225-lds-0285-datasheet
JAN1N3023C-1
Hersteller: Microchip Technology
Description: DIODE ZENER 13V 1W DO41
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 9.9 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-204AL (DO-41)
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 13 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AL, DO-41, Axial
Tolerance: ±2%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTXV1N3595AUS/TR
Hersteller: Microchip Technology
Description: SIGNAL OR COMPUTER DIODE
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, D
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Capacitance @ Vr, F: 8pF @ 0V, 1MHz
Current - Average Rectified (Io): 150mA
Supplier Device Package: D-5D
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 125 V
Voltage - Forward (Vf) (Max) @ If: 920 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 nA @ 125 V
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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1N4988US/TR 1N4954US-1N4996US_1N5968US-1N5969US_1N6632US-1N6637US.pdf
1N4988US/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 180V 5W E-MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 180 V
Impedance (Max) (Zzt): 450 Ohms
Supplier Device Package: E-MELF
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 136.8 V
Produkt ist nicht verfügbar
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1N4988US/TR 1N4954US-1N4996US_1N5968US-1N5969US_1N6632US-1N6637US.pdf
1N4988US/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 180V 5W E-MELF
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 180 V
Impedance (Max) (Zzt): 450 Ohms
Supplier Device Package: E-MELF
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 136.8 V
auf Bestellung 56 Stücke:
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DSC1001BE2-014.7456T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE2-014.7456T
Hersteller: Microchip Technology
Description: MEMS OSC XO 14.7456MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.7456 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-014.7450T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE2-014.7450T
Hersteller: Microchip Technology
Description: MEMS OSC XO 14.7450MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.745 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-012.2880T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE2-012.2880T
Hersteller: Microchip Technology
Description: MEMS OSC XO 12.2880MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.288 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-010.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE2-010.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 10.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-012.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE2-012.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-012.2880 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE2-012.2880
Hersteller: Microchip Technology
Description: MEMS OSC XO 12.2880MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.288 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-010.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE2-010.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 10.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-014.7450 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE2-014.7450
Hersteller: Microchip Technology
Description: MEMS OSC XO 14.7450MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.745 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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