Produkte > MICRON TECHNOLOGY INC. > Alle Produkte des Herstellers MICRON TECHNOLOGY INC. (10575) > Seite 168 nach 177
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MT53D512M32D2DS-053 WT:D TR | Micron Technology Inc. |
Description: IC DRAM 16GBIT 1.866GHZ 200WFBGA Packaging: Tape & Reel (TR) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 16Gbit Memory Type: Volatile Operating Temperature: -30°C ~ 85°C (TC) Voltage - Supply: 1.1V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 1.866 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Memory Organization: 512M x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53D512M32D2DS-053 WT:D TR | Micron Technology Inc. |
Description: IC DRAM 16GBIT 1.866GHZ 200WFBGA Packaging: Cut Tape (CT) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 16Gbit Memory Type: Volatile Operating Temperature: -30°C ~ 85°C (TC) Voltage - Supply: 1.1V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 1.866 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Memory Organization: 512M x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 WT:B | Micron Technology Inc. |
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA Packaging: Tray Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 1G x 32 DigiKey Programmable: Not Verified |
auf Bestellung 935 Stücke: Lieferzeit 10-14 Tag (e) |
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MT53E1G32D2FW-046 WT:A | Micron Technology Inc. |
Description: LPDDR4 32G 1GX32 FBGA DDP Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Memory Organization: 1G x 32 DigiKey Programmable: Not Verified |
auf Bestellung 1343 Stücke: Lieferzeit 10-14 Tag (e) |
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MT53E1G32D2FW-046 IT:B | Micron Technology Inc. |
Description: LPDDR4 32G 1GX32 FBGA DDP Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 1G x 32 DigiKey Programmable: Not Verified |
auf Bestellung 1089 Stücke: Lieferzeit 10-14 Tag (e) |
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MT53E1G32D2FW-046 AAT:B | Micron Technology Inc. |
Description: LPDDR4 32G 1GX32 FBGA DDP Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 1G x 32 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 485 Stücke: Lieferzeit 10-14 Tag (e) |
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MT53E1G32D2FW-046 WT:B TR | Micron Technology Inc. |
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 1G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 WT:A TR | Micron Technology Inc. |
Description: LPDDR4 32G 1GX32 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Memory Organization: 1G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 IT:A TR | Micron Technology Inc. |
Description: LPDDR4 32G 1GX32 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Memory Organization: 1G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 IT:A | Micron Technology Inc. |
Description: LPDDR4 32G 1GX32 FBGA DDP Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Memory Organization: 1G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 IT:B TR | Micron Technology Inc. |
Description: LPDDR4 32G 1GX32 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 1G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 AIT:A TR | Micron Technology Inc. |
Description: LPDDR4 32G 1GX32 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Memory Organization: 1G x 32 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 AIT:B TR | Micron Technology Inc. |
Description: LPDDR4 32G 1GX32 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 1G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 AIT:A | Micron Technology Inc. |
Description: LPDDR4 32G 1GX32 FBGA DDP Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Memory Organization: 1G x 32 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 AIT:B | Micron Technology Inc. |
Description: LPDDR4 32G 1GX32 FBGA DDP Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 1G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 AAT:A TR | Micron Technology Inc. |
Description: LPDDR4 32G 1GX32 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Memory Organization: 1G x 32 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 AAT:A | Micron Technology Inc. |
Description: LPDDR4 32G 1GX32 FBGA DDP Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Memory Organization: 1G x 32 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 AAT:B TR | Micron Technology Inc. |
Description: LPDDR4 32G 1GX32 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 1G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 AUT:A | Micron Technology Inc. |
Description: LPDDR4 32G 1GX32 FBGA DDP Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 125°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Memory Organization: 1G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 AUT:A TR | Micron Technology Inc. |
Description: LPDDR4 32G 1GX32 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 125°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Memory Organization: 1G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 AUT:B | Micron Technology Inc. |
Description: LPDDR4 32G 1GX32 FBGA DDP Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 125°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 1G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 AUT:B TR | Micron Technology Inc. |
Description: LPDDR4 32G 1GX32 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 125°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 1G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 AIT:C | Micron Technology Inc. |
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA Packaging: Tray Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 1G x 32 |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 AIT:C TR | Micron Technology Inc. |
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 1G x 32 |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 AAT:C TR | Micron Technology Inc. |
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 1G x 32 |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 AAT:C | Micron Technology Inc. |
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA Packaging: Tray Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 1G x 32 |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 AUT:C | Micron Technology Inc. |
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA Packaging: Tray Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 125°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 1G x 32 |
Produkt ist nicht verfügbar |
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MT53E1G32D2FW-046 AUT:C TR | Micron Technology Inc. |
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 125°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 1G x 32 |
Produkt ist nicht verfügbar |
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MT29TZZZ8D5JKETS-107 W.95Q TR | Micron Technology Inc. |
Description: IC FLASH RAM 64GBIT MMC 168VFBGA Packaging: Tape & Reel (TR) Package / Case: 168-VFBGA Mounting Type: Surface Mount Memory Size: 64Gbit (NAND), 8Gbit (LPDDR3) Memory Type: Non-Volatile, Volatile Operating Temperature: -25°C ~ 85°C Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V Technology: FLASH - NAND, DRAM - LPDDR3 Clock Frequency: 933 MHz Memory Format: FLASH, RAM Supplier Device Package: 168-VFBGA (12x12) Memory Interface: MMC, LPDRAM Memory Organization: 68G x 8 (NAND), 256M x 32 (LPDDR3) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT29TZZZ8D5JKETS-107 W.95Q | Micron Technology Inc. |
Description: IC FLASH RAM 64GBIT MMC 168VFBGA Packaging: Bulk Package / Case: 168-VFBGA Mounting Type: Surface Mount Memory Size: 64Gbit (NAND), 8Gbit (LPDDR3) Memory Type: Non-Volatile, Volatile Operating Temperature: -25°C ~ 85°C Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V Technology: FLASH - NAND, DRAM - LPDDR3 Clock Frequency: 933 MHz Memory Format: FLASH, RAM Supplier Device Package: 168-VFBGA (12x12) Memory Interface: MMC, LPDRAM Memory Organization: 68G x 8 (NAND), 256M x 32 (LPDDR3) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT49H8M36FM-33 TR | Micron Technology Inc. |
Description: IC DRAM 288MBIT PARALLEL 144UBGA Packaging: Tape & Reel (TR) Package / Case: 144-TFBGA Mounting Type: Surface Mount Memory Size: 288Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.7V ~ 1.9V Technology: DRAM Clock Frequency: 300 MHz Memory Format: DRAM Supplier Device Package: 144-FBGA (18.5x11) Memory Interface: Parallel Access Time: 20 ns Memory Organization: 8M x 36 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT49H16M18FM-33 TR | Micron Technology Inc. |
Description: IC DRAM 288MBIT PARALLEL 144UBGA Packaging: Tape & Reel (TR) Package / Case: 144-TFBGA Mounting Type: Surface Mount Memory Size: 288Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.7V ~ 1.9V Technology: DRAM Clock Frequency: 300 MHz Memory Format: DRAM Supplier Device Package: 144-µBGA (18.5x11) Memory Interface: Parallel Access Time: 20 ns Memory Organization: 16M x 18 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT49H32M9FM-33 TR | Micron Technology Inc. |
Description: IC DRAM 288MBIT PARALLEL 144UBGA Packaging: Tape & Reel (TR) Package / Case: 144-TFBGA Mounting Type: Surface Mount Memory Size: 288Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.7V ~ 1.9V Technology: DRAM Clock Frequency: 300 MHz Memory Format: DRAM Supplier Device Package: 144-µBGA (18.5x11) Memory Interface: Parallel Access Time: 20 ns Memory Organization: 32M x 9 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT49H16M18FM-33:B TR | Micron Technology Inc. |
Description: IC DRAM 288MBIT PARALLEL 144UBGA Packaging: Tape & Reel (TR) Package / Case: 144-TFBGA Mounting Type: Surface Mount Memory Size: 288Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.7V ~ 1.9V Technology: DRAM Clock Frequency: 300 MHz Memory Format: DRAM Supplier Device Package: 144-µBGA (18.5x11) Memory Interface: Parallel Access Time: 20 ns Memory Organization: 16M x 18 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT49H32M9FM-33:B TR | Micron Technology Inc. |
Description: IC DRAM 288MBIT PARALLEL 144UBGA Packaging: Tape & Reel (TR) Package / Case: 144-TFBGA Mounting Type: Surface Mount Memory Size: 288Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.7V ~ 1.9V Technology: DRAM Clock Frequency: 300 MHz Memory Format: DRAM Supplier Device Package: 144-µBGA (18.5x11) Memory Interface: Parallel Access Time: 20 ns Memory Organization: 32M x 9 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MTFC128GAZAQJP-AIT | Micron Technology Inc. |
Description: IC FLASH 1TBIT MMC 153VFBGA Packaging: Tray Package / Case: 153-VFBGA Mounting Type: Surface Mount Memory Size: 1Tbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND Clock Frequency: 200 MHz Memory Format: FLASH Supplier Device Package: 153-VFBGA (11.5x13) Memory Interface: MMC Memory Organization: 128G x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MTFC128GAZAQJP-AIT TR | Micron Technology Inc. |
Description: IC FLASH 1TBIT MMC 153VFBGA Packaging: Tape & Reel (TR) Package / Case: 153-VFBGA Mounting Type: Surface Mount Memory Size: 1Tbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND Clock Frequency: 200 MHz Memory Format: FLASH Supplier Device Package: 153-VFBGA (11.5x13) Memory Interface: MMC Memory Organization: 128G x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT58L64L32PT-6 TR | Micron Technology Inc. |
Description: SRAM SYNC QUAD 2M-BIT 64KX32 Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT58L64L32FT-10TR | Micron Technology Inc. |
Description: IC SRAM 2MBIT PARALLEL 100TQFP Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Memory Size: 2Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 3.135V ~ 3.6V Technology: SRAM - Standard Clock Frequency: 66 MHz Memory Format: SRAM Supplier Device Package: 100-TQFP (14x20.1) Memory Interface: Parallel Access Time: 10 ns Memory Organization: 64K x 32 DigiKey Programmable: Not Verified |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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MTFDDAT240MBD-1AK12AIYY | Micron Technology Inc. |
Description: SSD 240GB MSATA MLC SATAIII 3.3V Packaging: Bulk Size / Dimension: 50.80mm x 29.85mm x 4.75mm Memory Size: 240GB Memory Type: Solid State Drive (SSD) FLASH - NAND (MLC) Type: SATA III Weight: 0.353 oz (10 g) Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.3V Form Factor: mSATA Speed - Read: 500MB/s Speed - Write: 250MB/s |
Produkt ist nicht verfügbar |
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MTFDDAT240MBD-1AK12ITYY | Micron Technology Inc. |
Description: SSD 240GB MSATA MLC SATAIII 3.3V Packaging: Bulk Size / Dimension: 50.80mm x 29.85mm x 4.75mm Memory Size: 240GB Memory Type: Solid State Drive (SSD) FLASH - NAND (MLC) Type: SATA III Weight: 0.353 oz (10 g) Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.3V Form Factor: mSATA Speed - Read: 500MB/s Speed - Write: 250MB/s |
Produkt ist nicht verfügbar |
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MTFDDAT240MBD-AAK12AIYYES | Micron Technology Inc. |
Description: SSD 240GB MSATA MLC SATAIII 3.3V Packaging: Bulk Size / Dimension: 50.80mm x 29.85mm x 4.75mm Memory Size: 240GB Memory Type: Solid State Drive (SSD) FLASH - NAND (MLC) Type: SATA III Weight: 0.353 oz (10 g) Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.3V Form Factor: mSATA Speed - Read: 500MB/s Speed - Write: 250MB/s |
Produkt ist nicht verfügbar |
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MTFC32GAZAQHD-AIT TR | Micron Technology Inc. |
Description: IC FLASH 256GBIT MMC 153VFBGA Packaging: Tape & Reel (TR) Package / Case: 153-VFBGA Mounting Type: Surface Mount Memory Size: 256Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND Clock Frequency: 200 MHz Memory Format: FLASH Supplier Device Package: 153-VFBGA (11.5x13) Memory Interface: MMC Memory Organization: 32G x 8 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MTFC32GAZAQHD-AIT TR | Micron Technology Inc. |
Description: IC FLASH 256GBIT MMC 153VFBGA Packaging: Cut Tape (CT) Package / Case: 153-VFBGA Mounting Type: Surface Mount Memory Size: 256Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND Clock Frequency: 200 MHz Memory Format: FLASH Supplier Device Package: 153-VFBGA (11.5x13) Memory Interface: MMC Memory Organization: 32G x 8 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 1977 Stücke: Lieferzeit 10-14 Tag (e) |
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MTFC64GAZAQHD-IT TR | Micron Technology Inc. |
Description: IC FLASH 512GBIT EMMC 153VFBGA Packaging: Cut Tape (CT) Package / Case: 153-VFBGA Mounting Type: Surface Mount Memory Size: 512Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND Clock Frequency: 200 MHz Memory Format: FLASH Supplier Device Package: 153-VFBGA (11.5x13) Memory Interface: eMMC Memory Organization: 64G x 8 DigiKey Programmable: Not Verified |
auf Bestellung 1675 Stücke: Lieferzeit 10-14 Tag (e) |
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MTFC32GAZAQHD-WT TR | Micron Technology Inc. |
Description: EMMC 256G Packaging: Cut Tape (CT) Package / Case: 153-VFBGA Mounting Type: Surface Mount Memory Size: 256Gbit Memory Type: Non-Volatile Operating Temperature: -25°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Clock Frequency: 200 MHz Memory Format: FLASH Supplier Device Package: 153-VFBGA (11.5x13) Memory Interface: eMMC_5.1 Memory Organization: 32G x 8 DigiKey Programmable: Not Verified |
auf Bestellung 1506 Stücke: Lieferzeit 10-14 Tag (e) |
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MTFC32GAZAQHD-IT TR | Micron Technology Inc. |
Description: IC FLASH 256GBIT EMMC 153VFBGA Packaging: Cut Tape (CT) Package / Case: 153-VFBGA Mounting Type: Surface Mount Memory Size: 256Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND Clock Frequency: 200 MHz Memory Format: FLASH Supplier Device Package: 153-VFBGA (11.5x13) Memory Interface: eMMC Memory Organization: 32G x 8 DigiKey Programmable: Not Verified |
auf Bestellung 512 Stücke: Lieferzeit 10-14 Tag (e) |
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MTFC32GAZAQHD-AIT | Micron Technology Inc. |
Description: IC FLASH 256GBIT MMC 153VFBGA Packaging: Tray Package / Case: 153-VFBGA Mounting Type: Surface Mount Memory Size: 256Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND Clock Frequency: 200 MHz Memory Format: FLASH Supplier Device Package: 153-VFBGA (11.5x13) Memory Interface: MMC Memory Organization: 32G x 8 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 1195 Stücke: Lieferzeit 10-14 Tag (e) |
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MTFC128GAJAEDN-IT TR | Micron Technology Inc. |
Description: IC FLASH 1TB MMC 169LFBGA Packaging: Tape & Reel (TR) Package / Case: 169-LFBGA Mounting Type: Surface Mount Memory Size: 1Tbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 169-LFBGA (14x18) Memory Interface: MMC Memory Organization: 128G x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MTFC128GAJAEDN-IT | Micron Technology Inc. |
Description: IC FLASH 1TB MMC 169LFBGA Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Memory Size: 1Tbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 169-LFBGA (14x18) Memory Interface: MMC Memory Organization: 128G x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MTFC128GAJAEDN-AIT TR | Micron Technology Inc. |
Description: IC FLASH 1TB MMC 169LFBGA Packaging: Tape & Reel (TR) Package / Case: 169-LFBGA Mounting Type: Surface Mount Memory Size: 1Tbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 169-LFBGA (14x18) Memory Interface: MMC Memory Organization: 128G x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT48LC32M16A2P-75:C TR | Micron Technology Inc. |
Description: IC DRAM 512MBIT PAR 54TSOP II Packaging: Tape & Reel (TR) Package / Case: 54-TSOP (0.400", 10.16mm Width) Mounting Type: Surface Mount Memory Size: 512Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 3V ~ 3.6V Technology: SDRAM Clock Frequency: 133 MHz Memory Format: DRAM Supplier Device Package: 54-TSOP II Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 5.4 ns Memory Organization: 32M x 16 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT48LC32M16A2P-75:C TR | Micron Technology Inc. |
Description: IC DRAM 512MBIT PAR 54TSOP II Packaging: Cut Tape (CT) Package / Case: 54-TSOP (0.400", 10.16mm Width) Mounting Type: Surface Mount Memory Size: 512Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 3V ~ 3.6V Technology: SDRAM Clock Frequency: 133 MHz Memory Format: DRAM Supplier Device Package: 54-TSOP II Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 5.4 ns Memory Organization: 32M x 16 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MTFDHAL3T2MCE-1AN1ZABYY | Micron Technology Inc. |
Description: SSD 3.2TB U.2 MOD MLC NVME 12V Packaging: Bulk Size / Dimension: 100.50mm x 69.85mm x 15.00mm Memory Size: 3.2TB Memory Type: Solid State Drive (SSD) FLASH - NAND (MLC) Type: NVMe Operating Temperature: 0°C ~ 85°C Voltage - Supply: 12V Form Factor: U.2 Module Speed - Read: 3.0GB/s Speed - Write: 2.0GB/s |
Produkt ist nicht verfügbar |
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MTFDHAL800MCE-1AN1ZABYY | Micron Technology Inc. |
Description: SSD 800GB U.2 MOD MLC NVME 12V Packaging: Bulk Size / Dimension: 100.50mm x 69.85mm x 15.00mm Memory Size: 800GB Memory Type: Solid State Drive (SSD) FLASH - NAND (MLC) Type: NVMe Operating Temperature: 0°C ~ 85°C Voltage - Supply: 12V Form Factor: U.2 Module Speed - Read: 2.1GB/s Speed - Write: 650MB/s |
Produkt ist nicht verfügbar |
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MTFDHAL1T6TCU-1AR1ZABYY | Micron Technology Inc. |
Description: SSD 1.6TB U.2 MOD TLC NVME 12V Packaging: Bulk Size / Dimension: 100.20mm x 69.85mm x 14.80mm Memory Size: 1.6TB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Weight: 1.98 oz (56 g) Operating Temperature: 0°C ~ 35°C Voltage - Supply: 12V Current - Max: 2.5A Form Factor: U.2 Module Speed - Read: 2.7GB/s Speed - Write: 1.95GB/s |
Produkt ist nicht verfügbar |
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MTFDHAL1T9TCT-1AR1ZABYY | Micron Technology Inc. |
Description: SSD 1.92TB U.2 TLC NVME 12V Packaging: Bulk Size / Dimension: 100.20mm x 69.85mm x 14.80mm Memory Size: 1.92TB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Weight: 1.98 oz (56 g) Operating Temperature: 0°C ~ 35°C Voltage - Supply: 12V Current - Max: 2.5A Form Factor: U.2 Module Speed - Read: 2.7GB/s Speed - Write: 1.95GB/s |
Produkt ist nicht verfügbar |
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MTFDHAL3T2TCU-1AR1ZABYY | Micron Technology Inc. |
Description: SSD 3.2TB U.2 MOD TLC NVME 12V Packaging: Bulk Size / Dimension: 100.20mm x 69.85mm x 14.80mm Memory Size: 3.2TB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Weight: 1.98 oz (56 g) Operating Temperature: 0°C ~ 35°C Voltage - Supply: 12V Current - Max: 2.5A Form Factor: U.2 Module Speed - Read: 3.35GB/s Speed - Write: 2.4GB/s |
Produkt ist nicht verfügbar |
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MTFDHAL3T8TCT-1AR1ZABYY | Micron Technology Inc. |
Description: SSD 3.84TB U.2 TLC NVME 12V Packaging: Bulk Size / Dimension: 100.20mm x 69.85mm x 14.80mm Memory Size: 3.84TB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Weight: 1.98 oz (56 g) Operating Temperature: 0°C ~ 35°C Voltage - Supply: 12V Current - Max: 2.5A Form Factor: U.2 Module Speed - Read: 3.35GB/s Speed - Write: 2.4GB/s |
Produkt ist nicht verfügbar |
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MTFDHAL11TATCW-1AR1ZABYY | Micron Technology Inc. |
Description: SSD 11TB U.2 MODULE TLC NVME 12V Packaging: Bulk Size / Dimension: 100.20mm x 69.85mm x 14.80mm Memory Size: 11TB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Operating Temperature: 0°C ~ 35°C Voltage - Supply: 12V Form Factor: U.2 Module Speed - Read: 3.35GB/s Speed - Write: 2.4GB/s |
Produkt ist nicht verfügbar |
MT53D512M32D2DS-053 WT:D TR |
Hersteller: Micron Technology Inc.
Description: IC DRAM 16GBIT 1.866GHZ 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: -30°C ~ 85°C (TC)
Voltage - Supply: 1.1V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.866 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 16GBIT 1.866GHZ 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: -30°C ~ 85°C (TC)
Voltage - Supply: 1.1V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.866 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53D512M32D2DS-053 WT:D TR |
Hersteller: Micron Technology Inc.
Description: IC DRAM 16GBIT 1.866GHZ 200WFBGA
Packaging: Cut Tape (CT)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: -30°C ~ 85°C (TC)
Voltage - Supply: 1.1V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.866 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 16GBIT 1.866GHZ 200WFBGA
Packaging: Cut Tape (CT)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: -30°C ~ 85°C (TC)
Voltage - Supply: 1.1V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.866 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 WT:B |
Hersteller: Micron Technology Inc.
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
auf Bestellung 935 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 40.18 EUR |
10+ | 37.41 EUR |
25+ | 37.01 EUR |
40+ | 36.09 EUR |
80+ | 31.68 EUR |
230+ | 30.62 EUR |
440+ | 29.79 EUR |
MT53E1G32D2FW-046 WT:A |
Hersteller: Micron Technology Inc.
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
auf Bestellung 1343 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 44.07 EUR |
10+ | 41.44 EUR |
25+ | 40.01 EUR |
50+ | 38.74 EUR |
100+ | 34.1 EUR |
250+ | 33.19 EUR |
500+ | 32.17 EUR |
MT53E1G32D2FW-046 IT:B |
Hersteller: Micron Technology Inc.
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
auf Bestellung 1089 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 62.37 EUR |
10+ | 57.85 EUR |
25+ | 55.78 EUR |
50+ | 54.4 EUR |
100+ | 47.66 EUR |
250+ | 46.34 EUR |
MT53E1G32D2FW-046 AAT:B |
Hersteller: Micron Technology Inc.
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 485 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 71.6 EUR |
10+ | 66.39 EUR |
25+ | 64.02 EUR |
50+ | 62.42 EUR |
100+ | 54.7 EUR |
250+ | 53.19 EUR |
MT53E1G32D2FW-046 WT:B TR |
Hersteller: Micron Technology Inc.
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 WT:A TR |
Hersteller: Micron Technology Inc.
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 IT:A TR |
Hersteller: Micron Technology Inc.
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 IT:A |
Hersteller: Micron Technology Inc.
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 IT:B TR |
Hersteller: Micron Technology Inc.
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 AIT:A TR |
Hersteller: Micron Technology Inc.
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 AIT:B TR |
Hersteller: Micron Technology Inc.
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 AIT:A |
Hersteller: Micron Technology Inc.
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 AIT:B |
Hersteller: Micron Technology Inc.
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 AAT:A TR |
Hersteller: Micron Technology Inc.
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 AAT:A |
Hersteller: Micron Technology Inc.
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 AAT:B TR |
Hersteller: Micron Technology Inc.
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 AUT:A |
Hersteller: Micron Technology Inc.
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 AUT:A TR |
Hersteller: Micron Technology Inc.
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 AUT:B |
Hersteller: Micron Technology Inc.
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 AUT:B TR |
Hersteller: Micron Technology Inc.
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 32G 1GX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 AIT:C |
Hersteller: Micron Technology Inc.
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 AIT:C TR |
Hersteller: Micron Technology Inc.
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 AAT:C TR |
Hersteller: Micron Technology Inc.
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 AAT:C |
Hersteller: Micron Technology Inc.
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 AUT:C |
Hersteller: Micron Technology Inc.
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
Produkt ist nicht verfügbar
MT53E1G32D2FW-046 AUT:C TR |
Hersteller: Micron Technology Inc.
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
Produkt ist nicht verfügbar
MT29TZZZ8D5JKETS-107 W.95Q TR |
Hersteller: Micron Technology Inc.
Description: IC FLASH RAM 64GBIT MMC 168VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 168-VFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit (NAND), 8Gbit (LPDDR3)
Memory Type: Non-Volatile, Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: FLASH - NAND, DRAM - LPDDR3
Clock Frequency: 933 MHz
Memory Format: FLASH, RAM
Supplier Device Package: 168-VFBGA (12x12)
Memory Interface: MMC, LPDRAM
Memory Organization: 68G x 8 (NAND), 256M x 32 (LPDDR3)
DigiKey Programmable: Not Verified
Description: IC FLASH RAM 64GBIT MMC 168VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 168-VFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit (NAND), 8Gbit (LPDDR3)
Memory Type: Non-Volatile, Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: FLASH - NAND, DRAM - LPDDR3
Clock Frequency: 933 MHz
Memory Format: FLASH, RAM
Supplier Device Package: 168-VFBGA (12x12)
Memory Interface: MMC, LPDRAM
Memory Organization: 68G x 8 (NAND), 256M x 32 (LPDDR3)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT29TZZZ8D5JKETS-107 W.95Q |
Hersteller: Micron Technology Inc.
Description: IC FLASH RAM 64GBIT MMC 168VFBGA
Packaging: Bulk
Package / Case: 168-VFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit (NAND), 8Gbit (LPDDR3)
Memory Type: Non-Volatile, Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: FLASH - NAND, DRAM - LPDDR3
Clock Frequency: 933 MHz
Memory Format: FLASH, RAM
Supplier Device Package: 168-VFBGA (12x12)
Memory Interface: MMC, LPDRAM
Memory Organization: 68G x 8 (NAND), 256M x 32 (LPDDR3)
DigiKey Programmable: Not Verified
Description: IC FLASH RAM 64GBIT MMC 168VFBGA
Packaging: Bulk
Package / Case: 168-VFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit (NAND), 8Gbit (LPDDR3)
Memory Type: Non-Volatile, Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: FLASH - NAND, DRAM - LPDDR3
Clock Frequency: 933 MHz
Memory Format: FLASH, RAM
Supplier Device Package: 168-VFBGA (12x12)
Memory Interface: MMC, LPDRAM
Memory Organization: 68G x 8 (NAND), 256M x 32 (LPDDR3)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT49H8M36FM-33 TR |
Hersteller: Micron Technology Inc.
Description: IC DRAM 288MBIT PARALLEL 144UBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Memory Size: 288Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: DRAM
Clock Frequency: 300 MHz
Memory Format: DRAM
Supplier Device Package: 144-FBGA (18.5x11)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 8M x 36
DigiKey Programmable: Not Verified
Description: IC DRAM 288MBIT PARALLEL 144UBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Memory Size: 288Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: DRAM
Clock Frequency: 300 MHz
Memory Format: DRAM
Supplier Device Package: 144-FBGA (18.5x11)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 8M x 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT49H16M18FM-33 TR |
Hersteller: Micron Technology Inc.
Description: IC DRAM 288MBIT PARALLEL 144UBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Memory Size: 288Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: DRAM
Clock Frequency: 300 MHz
Memory Format: DRAM
Supplier Device Package: 144-µBGA (18.5x11)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 16M x 18
DigiKey Programmable: Not Verified
Description: IC DRAM 288MBIT PARALLEL 144UBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Memory Size: 288Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: DRAM
Clock Frequency: 300 MHz
Memory Format: DRAM
Supplier Device Package: 144-µBGA (18.5x11)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 16M x 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT49H32M9FM-33 TR |
Hersteller: Micron Technology Inc.
Description: IC DRAM 288MBIT PARALLEL 144UBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Memory Size: 288Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: DRAM
Clock Frequency: 300 MHz
Memory Format: DRAM
Supplier Device Package: 144-µBGA (18.5x11)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 32M x 9
DigiKey Programmable: Not Verified
Description: IC DRAM 288MBIT PARALLEL 144UBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Memory Size: 288Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: DRAM
Clock Frequency: 300 MHz
Memory Format: DRAM
Supplier Device Package: 144-µBGA (18.5x11)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 32M x 9
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT49H16M18FM-33:B TR |
Hersteller: Micron Technology Inc.
Description: IC DRAM 288MBIT PARALLEL 144UBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Memory Size: 288Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: DRAM
Clock Frequency: 300 MHz
Memory Format: DRAM
Supplier Device Package: 144-µBGA (18.5x11)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 16M x 18
DigiKey Programmable: Not Verified
Description: IC DRAM 288MBIT PARALLEL 144UBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Memory Size: 288Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: DRAM
Clock Frequency: 300 MHz
Memory Format: DRAM
Supplier Device Package: 144-µBGA (18.5x11)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 16M x 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT49H32M9FM-33:B TR |
Hersteller: Micron Technology Inc.
Description: IC DRAM 288MBIT PARALLEL 144UBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Memory Size: 288Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: DRAM
Clock Frequency: 300 MHz
Memory Format: DRAM
Supplier Device Package: 144-µBGA (18.5x11)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 32M x 9
DigiKey Programmable: Not Verified
Description: IC DRAM 288MBIT PARALLEL 144UBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Memory Size: 288Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: DRAM
Clock Frequency: 300 MHz
Memory Format: DRAM
Supplier Device Package: 144-µBGA (18.5x11)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 32M x 9
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MTFC128GAZAQJP-AIT |
Hersteller: Micron Technology Inc.
Description: IC FLASH 1TBIT MMC 153VFBGA
Packaging: Tray
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Tbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Memory Interface: MMC
Memory Organization: 128G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 1TBIT MMC 153VFBGA
Packaging: Tray
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Tbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Memory Interface: MMC
Memory Organization: 128G x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MTFC128GAZAQJP-AIT TR |
Hersteller: Micron Technology Inc.
Description: IC FLASH 1TBIT MMC 153VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Tbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Memory Interface: MMC
Memory Organization: 128G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 1TBIT MMC 153VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Tbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Memory Interface: MMC
Memory Organization: 128G x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT58L64L32PT-6 TR |
Hersteller: Micron Technology Inc.
Description: SRAM SYNC QUAD 2M-BIT 64KX32
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: SRAM SYNC QUAD 2M-BIT 64KX32
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT58L64L32FT-10TR |
Hersteller: Micron Technology Inc.
Description: IC SRAM 2MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Standard
Clock Frequency: 66 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 64K x 32
DigiKey Programmable: Not Verified
Description: IC SRAM 2MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Standard
Clock Frequency: 66 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 64K x 32
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
51+ | 10.51 EUR |
MTFDDAT240MBD-1AK12AIYY |
Hersteller: Micron Technology Inc.
Description: SSD 240GB MSATA MLC SATAIII 3.3V
Packaging: Bulk
Size / Dimension: 50.80mm x 29.85mm x 4.75mm
Memory Size: 240GB
Memory Type: Solid State Drive (SSD) FLASH - NAND (MLC)
Type: SATA III
Weight: 0.353 oz (10 g)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Form Factor: mSATA
Speed - Read: 500MB/s
Speed - Write: 250MB/s
Description: SSD 240GB MSATA MLC SATAIII 3.3V
Packaging: Bulk
Size / Dimension: 50.80mm x 29.85mm x 4.75mm
Memory Size: 240GB
Memory Type: Solid State Drive (SSD) FLASH - NAND (MLC)
Type: SATA III
Weight: 0.353 oz (10 g)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Form Factor: mSATA
Speed - Read: 500MB/s
Speed - Write: 250MB/s
Produkt ist nicht verfügbar
MTFDDAT240MBD-1AK12ITYY |
Hersteller: Micron Technology Inc.
Description: SSD 240GB MSATA MLC SATAIII 3.3V
Packaging: Bulk
Size / Dimension: 50.80mm x 29.85mm x 4.75mm
Memory Size: 240GB
Memory Type: Solid State Drive (SSD) FLASH - NAND (MLC)
Type: SATA III
Weight: 0.353 oz (10 g)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Form Factor: mSATA
Speed - Read: 500MB/s
Speed - Write: 250MB/s
Description: SSD 240GB MSATA MLC SATAIII 3.3V
Packaging: Bulk
Size / Dimension: 50.80mm x 29.85mm x 4.75mm
Memory Size: 240GB
Memory Type: Solid State Drive (SSD) FLASH - NAND (MLC)
Type: SATA III
Weight: 0.353 oz (10 g)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Form Factor: mSATA
Speed - Read: 500MB/s
Speed - Write: 250MB/s
Produkt ist nicht verfügbar
MTFDDAT240MBD-AAK12AIYYES |
Hersteller: Micron Technology Inc.
Description: SSD 240GB MSATA MLC SATAIII 3.3V
Packaging: Bulk
Size / Dimension: 50.80mm x 29.85mm x 4.75mm
Memory Size: 240GB
Memory Type: Solid State Drive (SSD) FLASH - NAND (MLC)
Type: SATA III
Weight: 0.353 oz (10 g)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Form Factor: mSATA
Speed - Read: 500MB/s
Speed - Write: 250MB/s
Description: SSD 240GB MSATA MLC SATAIII 3.3V
Packaging: Bulk
Size / Dimension: 50.80mm x 29.85mm x 4.75mm
Memory Size: 240GB
Memory Type: Solid State Drive (SSD) FLASH - NAND (MLC)
Type: SATA III
Weight: 0.353 oz (10 g)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Form Factor: mSATA
Speed - Read: 500MB/s
Speed - Write: 250MB/s
Produkt ist nicht verfügbar
MTFC32GAZAQHD-AIT TR |
Hersteller: Micron Technology Inc.
Description: IC FLASH 256GBIT MMC 153VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 256Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Memory Interface: MMC
Memory Organization: 32G x 8
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC FLASH 256GBIT MMC 153VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 256Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Memory Interface: MMC
Memory Organization: 32G x 8
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MTFC32GAZAQHD-AIT TR |
Hersteller: Micron Technology Inc.
Description: IC FLASH 256GBIT MMC 153VFBGA
Packaging: Cut Tape (CT)
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 256Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Memory Interface: MMC
Memory Organization: 32G x 8
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC FLASH 256GBIT MMC 153VFBGA
Packaging: Cut Tape (CT)
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 256Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Memory Interface: MMC
Memory Organization: 32G x 8
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1977 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 34.55 EUR |
10+ | 32.18 EUR |
25+ | 31.84 EUR |
50+ | 31.05 EUR |
100+ | 27.26 EUR |
250+ | 26.34 EUR |
500+ | 25.63 EUR |
MTFC64GAZAQHD-IT TR |
Hersteller: Micron Technology Inc.
Description: IC FLASH 512GBIT EMMC 153VFBGA
Packaging: Cut Tape (CT)
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 512Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Memory Interface: eMMC
Memory Organization: 64G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 512GBIT EMMC 153VFBGA
Packaging: Cut Tape (CT)
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 512Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Memory Interface: eMMC
Memory Organization: 64G x 8
DigiKey Programmable: Not Verified
auf Bestellung 1675 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 57.02 EUR |
10+ | 53.62 EUR |
25+ | 51.76 EUR |
50+ | 50.12 EUR |
100+ | 44.12 EUR |
250+ | 42.94 EUR |
MTFC32GAZAQHD-WT TR |
Hersteller: Micron Technology Inc.
Description: EMMC 256G
Packaging: Cut Tape (CT)
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 256Gbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Memory Interface: eMMC_5.1
Memory Organization: 32G x 8
DigiKey Programmable: Not Verified
Description: EMMC 256G
Packaging: Cut Tape (CT)
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 256Gbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Memory Interface: eMMC_5.1
Memory Organization: 32G x 8
DigiKey Programmable: Not Verified
auf Bestellung 1506 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 29.99 EUR |
10+ | 27.76 EUR |
25+ | 27.39 EUR |
50+ | 27.04 EUR |
100+ | 23.7 EUR |
250+ | 22.68 EUR |
500+ | 22.53 EUR |
MTFC32GAZAQHD-IT TR |
Hersteller: Micron Technology Inc.
Description: IC FLASH 256GBIT EMMC 153VFBGA
Packaging: Cut Tape (CT)
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 256Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Memory Interface: eMMC
Memory Organization: 32G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 256GBIT EMMC 153VFBGA
Packaging: Cut Tape (CT)
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 256Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Memory Interface: eMMC
Memory Organization: 32G x 8
DigiKey Programmable: Not Verified
auf Bestellung 512 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 32.52 EUR |
10+ | 30.3 EUR |
25+ | 29.97 EUR |
50+ | 29.23 EUR |
100+ | 25.66 EUR |
250+ | 24.8 EUR |
500+ | 24.13 EUR |
MTFC32GAZAQHD-AIT |
Hersteller: Micron Technology Inc.
Description: IC FLASH 256GBIT MMC 153VFBGA
Packaging: Tray
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 256Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Memory Interface: MMC
Memory Organization: 32G x 8
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC FLASH 256GBIT MMC 153VFBGA
Packaging: Tray
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 256Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Memory Interface: MMC
Memory Organization: 32G x 8
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1195 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 35.59 EUR |
10+ | 33.15 EUR |
25+ | 32.79 EUR |
40+ | 31.98 EUR |
80+ | 28.08 EUR |
230+ | 27.13 EUR |
440+ | 26.4 EUR |
MTFC128GAJAEDN-IT TR |
Hersteller: Micron Technology Inc.
Description: IC FLASH 1TB MMC 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Memory Size: 1Tbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 169-LFBGA (14x18)
Memory Interface: MMC
Memory Organization: 128G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 1TB MMC 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Memory Size: 1Tbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 169-LFBGA (14x18)
Memory Interface: MMC
Memory Organization: 128G x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MTFC128GAJAEDN-IT |
Hersteller: Micron Technology Inc.
Description: IC FLASH 1TB MMC 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Memory Size: 1Tbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 169-LFBGA (14x18)
Memory Interface: MMC
Memory Organization: 128G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 1TB MMC 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Memory Size: 1Tbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 169-LFBGA (14x18)
Memory Interface: MMC
Memory Organization: 128G x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MTFC128GAJAEDN-AIT TR |
Hersteller: Micron Technology Inc.
Description: IC FLASH 1TB MMC 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Memory Size: 1Tbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 169-LFBGA (14x18)
Memory Interface: MMC
Memory Organization: 128G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 1TB MMC 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Memory Size: 1Tbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 169-LFBGA (14x18)
Memory Interface: MMC
Memory Organization: 128G x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT48LC32M16A2P-75:C TR |
Hersteller: Micron Technology Inc.
Description: IC DRAM 512MBIT PAR 54TSOP II
Packaging: Tape & Reel (TR)
Package / Case: 54-TSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 3.6V
Technology: SDRAM
Clock Frequency: 133 MHz
Memory Format: DRAM
Supplier Device Package: 54-TSOP II
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 5.4 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Description: IC DRAM 512MBIT PAR 54TSOP II
Packaging: Tape & Reel (TR)
Package / Case: 54-TSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 3.6V
Technology: SDRAM
Clock Frequency: 133 MHz
Memory Format: DRAM
Supplier Device Package: 54-TSOP II
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 5.4 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT48LC32M16A2P-75:C TR |
Hersteller: Micron Technology Inc.
Description: IC DRAM 512MBIT PAR 54TSOP II
Packaging: Cut Tape (CT)
Package / Case: 54-TSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 3.6V
Technology: SDRAM
Clock Frequency: 133 MHz
Memory Format: DRAM
Supplier Device Package: 54-TSOP II
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 5.4 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Description: IC DRAM 512MBIT PAR 54TSOP II
Packaging: Cut Tape (CT)
Package / Case: 54-TSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 3.6V
Technology: SDRAM
Clock Frequency: 133 MHz
Memory Format: DRAM
Supplier Device Package: 54-TSOP II
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 5.4 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MTFDHAL3T2MCE-1AN1ZABYY |
Hersteller: Micron Technology Inc.
Description: SSD 3.2TB U.2 MOD MLC NVME 12V
Packaging: Bulk
Size / Dimension: 100.50mm x 69.85mm x 15.00mm
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (MLC)
Type: NVMe
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 12V
Form Factor: U.2 Module
Speed - Read: 3.0GB/s
Speed - Write: 2.0GB/s
Description: SSD 3.2TB U.2 MOD MLC NVME 12V
Packaging: Bulk
Size / Dimension: 100.50mm x 69.85mm x 15.00mm
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (MLC)
Type: NVMe
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 12V
Form Factor: U.2 Module
Speed - Read: 3.0GB/s
Speed - Write: 2.0GB/s
Produkt ist nicht verfügbar
MTFDHAL800MCE-1AN1ZABYY |
Hersteller: Micron Technology Inc.
Description: SSD 800GB U.2 MOD MLC NVME 12V
Packaging: Bulk
Size / Dimension: 100.50mm x 69.85mm x 15.00mm
Memory Size: 800GB
Memory Type: Solid State Drive (SSD) FLASH - NAND (MLC)
Type: NVMe
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 12V
Form Factor: U.2 Module
Speed - Read: 2.1GB/s
Speed - Write: 650MB/s
Description: SSD 800GB U.2 MOD MLC NVME 12V
Packaging: Bulk
Size / Dimension: 100.50mm x 69.85mm x 15.00mm
Memory Size: 800GB
Memory Type: Solid State Drive (SSD) FLASH - NAND (MLC)
Type: NVMe
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 12V
Form Factor: U.2 Module
Speed - Read: 2.1GB/s
Speed - Write: 650MB/s
Produkt ist nicht verfügbar
MTFDHAL1T6TCU-1AR1ZABYY |
Hersteller: Micron Technology Inc.
Description: SSD 1.6TB U.2 MOD TLC NVME 12V
Packaging: Bulk
Size / Dimension: 100.20mm x 69.85mm x 14.80mm
Memory Size: 1.6TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Weight: 1.98 oz (56 g)
Operating Temperature: 0°C ~ 35°C
Voltage - Supply: 12V
Current - Max: 2.5A
Form Factor: U.2 Module
Speed - Read: 2.7GB/s
Speed - Write: 1.95GB/s
Description: SSD 1.6TB U.2 MOD TLC NVME 12V
Packaging: Bulk
Size / Dimension: 100.20mm x 69.85mm x 14.80mm
Memory Size: 1.6TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Weight: 1.98 oz (56 g)
Operating Temperature: 0°C ~ 35°C
Voltage - Supply: 12V
Current - Max: 2.5A
Form Factor: U.2 Module
Speed - Read: 2.7GB/s
Speed - Write: 1.95GB/s
Produkt ist nicht verfügbar
MTFDHAL1T9TCT-1AR1ZABYY |
Hersteller: Micron Technology Inc.
Description: SSD 1.92TB U.2 TLC NVME 12V
Packaging: Bulk
Size / Dimension: 100.20mm x 69.85mm x 14.80mm
Memory Size: 1.92TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Weight: 1.98 oz (56 g)
Operating Temperature: 0°C ~ 35°C
Voltage - Supply: 12V
Current - Max: 2.5A
Form Factor: U.2 Module
Speed - Read: 2.7GB/s
Speed - Write: 1.95GB/s
Description: SSD 1.92TB U.2 TLC NVME 12V
Packaging: Bulk
Size / Dimension: 100.20mm x 69.85mm x 14.80mm
Memory Size: 1.92TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Weight: 1.98 oz (56 g)
Operating Temperature: 0°C ~ 35°C
Voltage - Supply: 12V
Current - Max: 2.5A
Form Factor: U.2 Module
Speed - Read: 2.7GB/s
Speed - Write: 1.95GB/s
Produkt ist nicht verfügbar
MTFDHAL3T2TCU-1AR1ZABYY |
Hersteller: Micron Technology Inc.
Description: SSD 3.2TB U.2 MOD TLC NVME 12V
Packaging: Bulk
Size / Dimension: 100.20mm x 69.85mm x 14.80mm
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Weight: 1.98 oz (56 g)
Operating Temperature: 0°C ~ 35°C
Voltage - Supply: 12V
Current - Max: 2.5A
Form Factor: U.2 Module
Speed - Read: 3.35GB/s
Speed - Write: 2.4GB/s
Description: SSD 3.2TB U.2 MOD TLC NVME 12V
Packaging: Bulk
Size / Dimension: 100.20mm x 69.85mm x 14.80mm
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Weight: 1.98 oz (56 g)
Operating Temperature: 0°C ~ 35°C
Voltage - Supply: 12V
Current - Max: 2.5A
Form Factor: U.2 Module
Speed - Read: 3.35GB/s
Speed - Write: 2.4GB/s
Produkt ist nicht verfügbar
MTFDHAL3T8TCT-1AR1ZABYY |
Hersteller: Micron Technology Inc.
Description: SSD 3.84TB U.2 TLC NVME 12V
Packaging: Bulk
Size / Dimension: 100.20mm x 69.85mm x 14.80mm
Memory Size: 3.84TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Weight: 1.98 oz (56 g)
Operating Temperature: 0°C ~ 35°C
Voltage - Supply: 12V
Current - Max: 2.5A
Form Factor: U.2 Module
Speed - Read: 3.35GB/s
Speed - Write: 2.4GB/s
Description: SSD 3.84TB U.2 TLC NVME 12V
Packaging: Bulk
Size / Dimension: 100.20mm x 69.85mm x 14.80mm
Memory Size: 3.84TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Weight: 1.98 oz (56 g)
Operating Temperature: 0°C ~ 35°C
Voltage - Supply: 12V
Current - Max: 2.5A
Form Factor: U.2 Module
Speed - Read: 3.35GB/s
Speed - Write: 2.4GB/s
Produkt ist nicht verfügbar
MTFDHAL11TATCW-1AR1ZABYY |
Hersteller: Micron Technology Inc.
Description: SSD 11TB U.2 MODULE TLC NVME 12V
Packaging: Bulk
Size / Dimension: 100.20mm x 69.85mm x 14.80mm
Memory Size: 11TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 35°C
Voltage - Supply: 12V
Form Factor: U.2 Module
Speed - Read: 3.35GB/s
Speed - Write: 2.4GB/s
Description: SSD 11TB U.2 MODULE TLC NVME 12V
Packaging: Bulk
Size / Dimension: 100.20mm x 69.85mm x 14.80mm
Memory Size: 11TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 35°C
Voltage - Supply: 12V
Form Factor: U.2 Module
Speed - Read: 3.35GB/s
Speed - Write: 2.4GB/s
Produkt ist nicht verfügbar