Produkte > DIP

Wählen Sie Seite:   [  << Vorherige Seite ]  1 2 3 4 5 6 7 8  [ Nächste Seite >> ]
BezeichnungHerstellerBeschreibungVerfügbarkeitPrivatkunde
DIP300T600P22Chip Quik Inc.Description: DIP-22 (0.3" BODY) TO DIP-22 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 22
Material: FR4 Epoxy Glass
Size / Dimension: 1.100" L x 0.700" W (27.94mm x 17.78mm)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP300T600P24Chip Quik Inc.Description: DIP-24 (0.3" BODY) TO DIP-24 (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
3+9.13 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
DIP300T600P26Chip Quik Inc.Description: DIP-26 (0.3" BODY) TO DIP-26 (0.
Packaging: Bulk
Size / Dimension: 1.300" L x 0.700" W (33.02mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 26
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
3+9.87 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
DIP300T600P28Chip Quik Inc.Description: DIP-28 (0.3" BODY) TO DIP-28 (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.6 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
DIP306-001BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 6POS GOLD
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP308-001BAmphenol ICC (FCI)Description: DIP SOCKET 8 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP308-011BAmphenol ICC (FCI)Description: DIP SOCKET 8 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP308-014BAmphenol ICC (FCI)Description: DIP SOCKET 8 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP314-001BAmphenol ICC (FCI)Description: DIP SOCKET 14 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP314-001BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 14POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP314-011BAmphenol ICC (FCI)Description: DIP SOCKET 14 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP314-011BAmphenol Communications Solutions-FCIConn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole
auf Bestellung 710 Stücke:
Lieferzeit 14-21 Tag (e)
12+14.72 EUR
100+13.24 EUR
500+7.37 EUR
Mindestbestellmenge: 12 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
DIP316-001BLFAmphenol FCIDescription: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2700 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
DIP316-011BLFAmphenol FCIDescription: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2700 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
DIP316-014BLFAmphenol FCIDescription: CONN IC DIP SOCKET 16POS TIN
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2700 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
DIP318-011BLFAmphenol FCIDescription: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2376 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
DIP320-001BAmphenol ICC (FCI)Description: DIP320-001B-DIP SOCKET 20 CTS
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP320-011BAmphenol ICC (FCI)Description: DIP320-011B-DIP SOCKET 20 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP324-001BAmphenol ICC (FCI)Description: DIP324-001B-DIP SOCKET 24 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP324-001BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP324-011BAmphenol ICC (FCI)Description: DIP324-011B-DIP SOCKET 24 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP324-011BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP324-014BAmphenol ICC (FCI)Description: DIP324-014B-DIP SOCKET 24 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP324-014BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 24POS TIN
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP328-011BAmphenol ICC (FCI)Description: DIP328-011B-DIP SOCKET 28 CTS
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP328-011BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 28POS GOLD
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP328-014BAmphenol ICC (FCI)Description: DIP328-014B-DIP SOCKET 28 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP328-014BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 28POS TIN
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Part Status: Obsolete
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-08NChip Quik Inc.Description: DIP-08 (DIP-8) (0.6" WIDTH, 0.1"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
2+20.4 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-08NChip QuikSockets & Adapters DIP-08 (DIP-8) (0.6" width, 0.1" pitch) to SOIC-8 Narrow (1.27mm pitch, 150/200 mil body) Adapter
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
1+14.03 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-08WChip QuikSockets & Adapters DIP-08 (DIP-8) (0.6" width, 0.1" pitch) to SOIC-8 Wide (1.27mm pitch, 300 mil body) Adapter
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
1+14.39 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-08WChip Quik Inc.Description: DIP-08 (DIP-8) (0.6" WIDTH, 0.1"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
2+20.81 EUR
5+17.98 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-10NChip QuikSockets & Adapters DIP-10 (0.6" width, 0.1" pitch) to SOIC-10 Narrow (1.27mm pitch, 150/200 mil body) Adapter
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
1+14.74 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-10NChip Quik Inc.Description: DIP-10 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Number of Positions: 10
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.3 EUR
5+18.4 EUR
10+17.36 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-10WChip QuikSockets & Adapters DIP-10 (0.6" width, 0.1" pitch) to SOIC-10 Wide (1.27mm pitch, 300 mil body) Adapter
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
1+15.12 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-10WChip Quik Inc.Description: DIP-10 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Number of Positions: 10
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.77 EUR
5+18.8 EUR
10+17.75 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-12NChip QuikSockets & Adapters DIP-12 (0.6" width, 0.1" pitch) to SOIC-12 Narrow (1.27mm pitch, 150/200 mil body) Adapter
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
1+15.48 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-12NChip Quik Inc.Description: DIP-12 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.24 EUR
5+19.22 EUR
10+18.15 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-12WChip Quik Inc.Description: DIP-12 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.68 EUR
5+19.62 EUR
10+18.53 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-12WChip QuikSockets & Adapters DIP-12 (0.6" width, 0.1" pitch) to SOIC-12 Wide (1.27mm pitch, 300 mil body) Adapter
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
1+15.84 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-14NChip QuikSockets & Adapters DIP-14 (0.6" width, 0.1" pitch) to SOIC-14 Narrow (1.27mm pitch, 150/200 mil body) Adapter
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+16.18 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-14NChip Quik Inc.Description: DIP-14 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+23.17 EUR
5+20.04 EUR
10+18.92 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-14WChip QuikSockets & Adapters DIP-14 (0.6" width, 0.1" pitch) to SOIC-14 Wide (1.27mm pitch, 300 mil body) Adapter
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
1+16.54 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-14WChip Quik Inc.Description: DIP-14 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+23.62 EUR
5+20.44 EUR
10+19.31 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-16NChip QuikSockets & Adapters DIP-16 (0.6" width, 0.1" pitch) to SOIC-16 Narrow (1.27mm pitch, 150/200 mil body) Adapter
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
1+16.92 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-16NChip Quik Inc.Description: DIP-16 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.800" W (17.78mm x 20.32mm)
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.11 EUR
5+20.85 EUR
10+19.69 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-16WChip QuikSockets & Adapters DIP-16 (0.6" width, 0.1" pitch) to SOIC-16 Wide (1.27mm pitch, 300 mil body) Adapter
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+17.28 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-16WChip Quik Inc.Description: DIP-16 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.800" W (17.78mm x 20.32mm)
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.56 EUR
5+21.25 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-18NChip Quik Inc.Description: DIP-18 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.900" W (17.78mm x 22.86mm)
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+25 EUR
5+21.66 EUR
10+20.47 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-18NChip QuikSockets & Adapters DIP-18 (0.6" width, 0.1" pitch) to SOIC-18 Narrow (1.27mm pitch, 150/200 mil body) Adapter
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
1+17.64 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-18WChip QuikSockets & Adapters DIP-18 (0.6" width, 0.1" pitch) to SOIC-18 Wide (1.27mm pitch, 300 mil body) Adapter
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
1+17.99 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-18WChip Quik Inc.Description: DIP-18 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.900" W (17.78mm x 22.86mm)
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.47 EUR
5+22.06 EUR
10+20.85 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-20NChip QuikSockets & Adapters DIP-20 (0.6" width, 0.1" pitch) to SOIC-20 Narrow (1.27mm pitch, 150/200 mil body) Adapter
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.35 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-20NChip Quik Inc.Description: DIP-20 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.95 EUR
5+22.47 EUR
10+21.23 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-20WChip QuikSockets & Adapters DIP-20 (0.6" width, 0.1" pitch) to SOIC-20 Wide (1.27mm pitch, 300 mil body) Adapter
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.72 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-20WChip Quik Inc.Description: DIP-20 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
1+26.41 EUR
5+22.87 EUR
10+21.61 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-22NChip QuikSockets & Adapters DIP-22 (0.6" width, 0.1" pitch) to SOIC-22 Narrow (1.27mm pitch, 150/200 mil body) Adapter
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.08 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-22NChip Quik Inc.Description: DIP-22 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.100" W (17.78mm x 27.94mm)
Number of Positions: 22
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+26.87 EUR
5+23.28 EUR
10+21.99 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-22WChip Quik Inc.Description: DIP-22 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.100" W (17.78mm x 27.94mm)
Number of Positions: 22
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.33 EUR
5+23.68 EUR
10+22.38 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-22WChip QuikSockets & Adapters DIP-22 (0.6" width, 0.1" pitch) to SOIC-22 Wide (1.27mm pitch, 300 mil body) Adapter
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.43 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-24NChip QuikSockets & Adapters DIP-24 (0.6" width, 0.1" pitch) to SOIC-24 Narrow (1.27mm pitch, 150/200 mil body) Adapter
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.79 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-24NChip Quik Inc.Description: DIP-24 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.200" W (17.78mm x 30.48mm)
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.77 EUR
5+24.07 EUR
10+22.76 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-24WChip Quik Inc.Description: DIP-24 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.200" W (17.78mm x 30.48mm)
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+28.23 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-24WChip QuikSockets & Adapters DIP-24 (0.6" width, 0.1" pitch) to SOIC-24 Wide (1.27mm pitch, 300 mil body) Adapter
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.15 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-26NChip QuikSockets & Adapters DIP-26 (0.6" width, 0.1" pitch) to SOIC-26 Narrow (1.27mm pitch, 150/200 mil body) Adapter
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.53 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-26NChip Quik Inc.Description: DIP-26 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm)
Number of Positions: 26
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+28.69 EUR
5+24.88 EUR
10+23.53 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-26WChip QuikSockets & Adapters DIP-26 (0.6" width, 0.1" pitch) to SOIC-26 Wide (1.27mm pitch, 300 mil body) Adapter
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.88 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-26WChip Quik Inc.Description: DIP-26 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm)
Number of Positions: 26
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+29.16 EUR
5+25.28 EUR
10+23.91 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-28NChip Quik Inc.Description: DIP-28 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.400" W (17.78mm x 35.56mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+29.6 EUR
5+25.68 EUR
10+24.29 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-28NChip QuikSockets & Adapters DIP-28 (0.6" width, 0.1" pitch) to SOIC-28 Narrow (1.27mm pitch, 150/200 mil body) Adapter
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.24 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-28WChip QuikSockets & Adapters DIP-28 (0.6" width, 0.1" pitch) to SOIC-28 Wide (1.27mm pitch, 300 mil body) Adapter
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.6 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600-SOIC-28WChip Quik Inc.Description: DIP-28 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.400" W (17.78mm x 35.56mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.06 EUR
5+26.08 EUR
10+24.66 EUR
Im Einkaufswagen  Stück im Wert von  UAH
DIP600T300P04Chip Quik Inc.Description: DIP-4 (0.6" BODY) TO DIP-4 (0.3"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
DIP600T300P06Chip Quik Inc.Description: DIP-6 (0.6" BODY) TO DIP-6 (0.3"
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 6
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Packaging: Bulk
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
DIP600T300P08Chip Quik Inc.Description: DIP-8 (0.6" BODY) TO DIP-8 (0.3"
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 8
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Packaging: Bulk
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
DIP600T300P10Chip Quik Inc.Description: DIP-10 (0.6" BODY) TO DIP-10 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
DIP600T300P12Chip Quik Inc.Description: DIP-12 (0.6" BODY) TO DIP-12 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 12
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Packaging: Bulk
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
DIP600T300P14Chip Quik Inc.Description: DIP-14 (0.6" BODY) TO DIP-14 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 14
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Packaging: Bulk
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
DIP600T300P16Chip Quik Inc.Description: DIP-16 (0.6" BODY) TO DIP-16 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 16
Material: FR4 Epoxy Glass
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Packaging: Bulk
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
4+6.03 EUR
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
DIP600T300P18Chip Quik Inc.Description: DIP-18 (0.6" BODY) TO DIP-18 (0.
Packaging: Bulk
Size / Dimension: 0.900" L x 0.700" W (22.86mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP600T300P20Chip Quik Inc.Description: DIP-20 (0.6" BODY) TO DIP-20 (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
DIP600T300P24Chip Quik Inc.Description: DIP-24 (0.6" BODY) TO DIP-24 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 24
Material: FR4 Epoxy Glass
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Packaging: Bulk
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
3+9.13 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
DIP600T300P26Chip Quik Inc.Description: DIP-26 (0.6" BODY) TO DIP-26 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 26
Material: FR4 Epoxy Glass
Size / Dimension: 1.300" L x 0.700" W (33.02mm x 17.78mm)
Packaging: Bulk
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)
3+10.14 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
DIP600T300P28Chip Quik Inc.Description: DIP-28 (0.6" BODY) TO DIP-28 (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
DIP624-001BAmphenol ICC (FCI)Description: DIP624-001B-DIP SOCKET 24 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP624-011BAmphenol ICC (FCI)Description: DIP624-011B-DIP SOCKET 24 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP624-011BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 24POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP628-001BAmphenol ICC (FCI)Description: DIP628-001B-DIP SOCKET 28 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP628-001BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 28POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP628-011BAmphenol ICC (FCI)Description: DIP628-011B-DIP SOCKET 28 CTS
Packaging: Bag
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP628-014BAmphenol ICC (FCI)Description: DIP628-014B-DIP SOCKET 28 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP628-014BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 28POS TIN
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP632-001BAmphenol ICC (FCI)Description: DIP632-001B-DIP SOCKET 32 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP632-001BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP632-011BAmphenol ICC (FCI)Description: DIP632-011B-DIP SOCKET 32 CTS
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP632-014BAmphenol ICC (FCI)Description: DIP632-014B-DIP SOCKET 32 CTS
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP640-001BAmphenol ICC (FCI)Description: DIP640-001B-DIP SOCKET 40 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP640-001BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 40POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP640-011BAmphenol ICC (FCI)Description: DIP640-011B-DIP SOCKET 40 CTS
Features: Open Frame
Packaging: Bag
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DIP640-011BLFAmphenol ICC (FCI)Description: CONN IC DIP SOCKET 40POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bag
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
Wählen Sie Seite:   [  << Vorherige Seite ]  1 2 3 4 5 6 7 8  [ Nächste Seite >> ]