Produkte > NXP SEMICONDUCTORS > Alle Produkte des Herstellers NXP SEMICONDUCTORS (56138) > Seite 55 nach 936
Foto | Bezeichnung | Hersteller | Beschreibung |
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74ALVC08D,118 | NXP Semiconductors |
Description: NEXPERIA 74ALVC08D - AND GATE, A Packaging: Bulk |
auf Bestellung 11982 Stücke: Lieferzeit 21-28 Tag (e) |
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MPC860DTCVR50D4 | NXP Semiconductors |
Description: IC MPU MPC86XX 50MHZ 357BGA Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 95°C (TJ) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
auf Bestellung 440 Stücke: Lieferzeit 21-28 Tag (e) |
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MPC860TCVR50D4 | NXP Semiconductors |
Description: IC MPU MPC86XX 50MHZ 357BGA Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 95°C (TJ) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
auf Bestellung 450 Stücke: Lieferzeit 21-28 Tag (e) |
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MPC860TCZQ66D4 | NXP Semiconductors |
Description: IC MPU MPC86XX 66MHZ 357BGA Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 95°C (TJ) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
auf Bestellung 4280 Stücke: Lieferzeit 21-28 Tag (e) |
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BZV85-C5V1,133 | NXP Semiconductors |
Description: NEXPERIA BZV85-C5V1 - ZENER DIOD Tolerance: ±5% Packaging: Bulk Package / Case: DO-204AL, DO-41, Axial Mounting Type: Through Hole Operating Temperature: 200°C Voltage - Zener (Nom) (Vz): 5.1 V Impedance (Max) (Zzt): 10 Ohms Supplier Device Package: DO-41 Power - Max: 1 W Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Current - Reverse Leakage @ Vr: 3 µA @ 2 V |
auf Bestellung 46670 Stücke: Lieferzeit 21-28 Tag (e) |
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SPC5748GSK1MMJ6 | NXP Semiconductors |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Bulk Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz, 160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 192K x 8 Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b SAR Core Size: 32-Bit 3-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, I2S, LVD/HVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Number of I/O: 178 DigiKey Programmable: Not Verified |
auf Bestellung 236 Stücke: Lieferzeit 21-28 Tag (e) |
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74HC03D,652 | NXP Semiconductors |
Description: IC GATE NAND Packaging: Bulk |
auf Bestellung 33012 Stücke: Lieferzeit 21-28 Tag (e) |
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FS32K146HRT0CLLT | NXP Semiconductors |
Description: S32K146 32-bit MCU, ARM Cortex-M Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 24x12b SAR; D/A 1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: DMA, I²S, LVD, LVR, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 128 |
auf Bestellung 234 Stücke: Lieferzeit 21-28 Tag (e) |
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74LVC2G32GM,125 | NXP Semiconductors |
Description: IC DUAL 2-INP Packaging: Bulk |
auf Bestellung 24000 Stücke: Lieferzeit 21-28 Tag (e) |
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74LVT16244BDGG,112 | NXP Semiconductors |
Description: IC BUFF NON-INVERT 3.6V 48TSSOP Packaging: Bulk Package / Case: 48-TFSOP (0.240", 6.10mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 48-TSSOP |
auf Bestellung 1777 Stücke: Lieferzeit 21-28 Tag (e) |
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74HC4316PW,112 | NXP Semiconductors |
Description: NEXPERIA 74HC4316PW - SPST, 4 FU Packaging: Bulk |
auf Bestellung 2400 Stücke: Lieferzeit 21-28 Tag (e) |
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PTN5110NDHQZ | NXP Semiconductors |
Description: PTN5110NDHQ - USB PD TCPC PHY IC Packaging: Bulk Package / Case: 16-XFQFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Voltage - Supply: 2.7V ~ 5.5V Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet Supplier Device Package: 16-HX2QFN (2.6x2.6) |
auf Bestellung 3629 Stücke: Lieferzeit 21-28 Tag (e) |
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74HC11D,653 | NXP Semiconductors |
Description: IC GATE AND 3CH 3-INP 14SO Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: AND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-SO Input Logic Level - High: 1.2V ~ 3.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
auf Bestellung 44831 Stücke: Lieferzeit 21-28 Tag (e) |
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74HC11DB,118 | NXP Semiconductors |
Description: IC GATE AND Packaging: Bulk |
auf Bestellung 3853 Stücke: Lieferzeit 21-28 Tag (e) |
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74HC11DB,112 | NXP Semiconductors |
Description: IC GATE AND Packaging: Bulk |
auf Bestellung 3432 Stücke: Lieferzeit 21-28 Tag (e) |
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BYV29F-600,127 | NXP Semiconductors |
Description: DIODE GEN PURP 600V 9A TO220AC Packaging: Bulk Package / Case: TO-220-2 Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 35 ns Technology: Standard Current - Average Rectified (Io): 9A Supplier Device Package: TO-220AC Operating Temperature - Junction: 150°C (Max) Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 8 A Current - Reverse Leakage @ Vr: 50 µA @ 600 V |
auf Bestellung 51992 Stücke: Lieferzeit 21-28 Tag (e) |
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TYN16X-600CT127 | NXP Semiconductors |
Description: NOW WEEN - TYN16X-600CT - SILICO Packaging: Bulk Package / Case: TO-220-3 Full Pack, Isolated Tab Mounting Type: Through Hole SCR Type: Standard Recovery Operating Temperature: 150°C (TJ) Current - Hold (Ih) (Max): 40 mA Current - Gate Trigger (Igt) (Max): 15 mA Current - Non Rep. Surge 50, 60Hz (Itsm): 180A, 198A Current - On State (It (AV)) (Max): 10.2 A Voltage - Gate Trigger (Vgt) (Max): 1.3 V Voltage - On State (Vtm) (Max): 1.6 V Current - Off State (Max): 1 mA Supplier Device Package: TO-220F Current - On State (It (RMS)) (Max): 16 A Voltage - Off State: 600 V |
auf Bestellung 283000 Stücke: Lieferzeit 21-28 Tag (e) |
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BCW33,215 | NXP Semiconductors |
Description: NEXPERIA BCW33 - SMALL SIGNAL BI Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 210mV @ 2.5mA, 50mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V Frequency - Transition: 100MHz Supplier Device Package: TO-236AB Grade: Automotive Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 32 V Power - Max: 250 mW Qualification: AEC-Q101 |
auf Bestellung 83341 Stücke: Lieferzeit 21-28 Tag (e) |
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74LVC2G02GF,115 | NXP Semiconductors |
Description: IC GATE NOR Packaging: Bulk |
auf Bestellung 2040 Stücke: Lieferzeit 21-28 Tag (e) |
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74HC85PW,112 | NXP Semiconductors |
Description: NEXPERIA 74HC85PW - MAGNITUDE CO Packaging: Bulk |
auf Bestellung 7855 Stücke: Lieferzeit 21-28 Tag (e) |
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74LVC1G27GF,132 | NXP Semiconductors |
Description: IC GATE NOR Packaging: Bulk |
auf Bestellung 94890 Stücke: Lieferzeit 21-28 Tag (e) |
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PBSS5130QAZ | NXP Semiconductors |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR Packaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 240mV @ 100mA, 1A Current - Collector Cutoff (Max): 100nA DC Current Gain (hFE) (Min) @ Ic, Vce: 250 @ 100mA, 2V Frequency - Transition: 170MHz Supplier Device Package: DFN1010D-3 Current - Collector (Ic) (Max): 1 A Voltage - Collector Emitter Breakdown (Max): 30 V Power - Max: 325 mW |
auf Bestellung 204190 Stücke: Lieferzeit 21-28 Tag (e) |
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MRFX600HSR5 | NXP Semiconductors |
Description: RF MOSFET LDMOS 65V NI780 Packaging: Bulk Package / Case: NI-780S-4L Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 1.8MHz ~ 400MHz Configuration: 2 N-Channel Power - Output: 600W Gain: 26.4dB @ 230MHz Technology: LDMOS (Dual) Supplier Device Package: NI-780S-4L Voltage - Rated: 179 V Voltage - Test: 65 V Current - Test: 100 mA |
auf Bestellung 2 Stücke: Lieferzeit 21-28 Tag (e) |
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BTA202X-600E,127 | NXP Semiconductors |
Description: TRIAC SENS GATE 600V 2A TO220F Packaging: Bulk Package / Case: TO-220-3 Full Pack, Isolated Tab Mounting Type: Through Hole Triac Type: Logic - Sensitive Gate Configuration: Single Operating Temperature: 125°C (TJ) Current - Hold (Ih) (Max): 12 mA Current - Gate Trigger (Igt) (Max): 10 mA Current - Non Rep. Surge 50, 60Hz (Itsm): 14A, 15.4A Voltage - Gate Trigger (Vgt) (Max): 1.5 V Supplier Device Package: TO-220F Current - On State (It (RMS)) (Max): 2 A Voltage - Off State: 600 V |
auf Bestellung 7252 Stücke: Lieferzeit 21-28 Tag (e) |
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P4080NSN7PNAC | NXP Semiconductors |
Description: IC MPU QORIQ P4 1.5GHZ 1295BGA Packaging: Bulk Package / Case: 1295-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500mc Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 1295-FCPBGA (37.5x37.5) Ethernet: 1Gbps (8), 10Gbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 8 Core, 32-Bit Co-Processors/DSP: Security; SEC 4.0 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox |
auf Bestellung 25 Stücke: Lieferzeit 21-28 Tag (e) |
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MF1SEP1031DA4/03KJ | NXP Semiconductors |
Description: MF1SEP1031DA4 - MIFARE Plus SE, Packaging: Bulk Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Interface: UART Type: RFID Transponder Operating Temperature: -25°C ~ 70°C (TA) Standards: ISO 14443 Supplier Device Package: PLLMC |
auf Bestellung 249588 Stücke: Lieferzeit 21-28 Tag (e) |
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74LVC1G02GX,125 | NXP Semiconductors |
Description: IC GATE NOR Packaging: Bulk |
auf Bestellung 40162 Stücke: Lieferzeit 21-28 Tag (e) |
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MC56F83769AVLLA | NXP Semiconductors |
Description: MC56F837XX - Performance Level D Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 20x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, I²C, LINbus, SCI, SPI, USB Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 82 |
auf Bestellung 90 Stücke: Lieferzeit 21-28 Tag (e) |
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74HC153D,652 | NXP Semiconductors |
Description: NEXPERIA 74HC153D - MULTIPLEXER, Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
auf Bestellung 18206 Stücke: Lieferzeit 21-28 Tag (e) |
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TDA18254AHN/C1,518 | NXP Semiconductors |
Description: TDA18254AH - CABLE SILICON TUNER Packaging: Bulk Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.3V Applications: Consumer Video Supplier Device Package: 48-HVQFN (7x7) Control Interface: I²C |
auf Bestellung 280000 Stücke: Lieferzeit 21-28 Tag (e) |
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74HCT253D,652 | NXP Semiconductors |
Description: NEXPERIA 74HCT253D - MULTIPLEXER Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 6mA, 6mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
auf Bestellung 25486 Stücke: Lieferzeit 21-28 Tag (e) |
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74LV00PW,118 | NXP Semiconductors |
Description: IC GATE NAND 4CH 2-INP 14TSSOP Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5.5V Current - Output High, Low: 12mA, 12mA Number of Inputs: 2 Supplier Device Package: 14-TSSOP Input Logic Level - High: 0.9V ~ 2V Input Logic Level - Low: 0.3V ~ 0.8V Max Propagation Delay @ V, Max CL: 14ns @ 5V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 40 µA |
auf Bestellung 124183 Stücke: Lieferzeit 21-28 Tag (e) |
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MCIMX6L7DVN10AC | NXP Semiconductors |
Description: IC MPU 1GHZ 432MAPBGA Packaging: Bulk Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 3V Supplier Device Package: 432-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
auf Bestellung 158 Stücke: Lieferzeit 21-28 Tag (e) |
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MC9328MXLVP20R2 | NXP Semiconductors |
Description: IC MPU I.MXL 200MHZ 225MAPBGA Packaging: Bulk Package / Case: 225-LFBGA Mounting Type: Surface Mount Speed: 200MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: ARM920T Voltage - I/O: 1.8V, 3V Supplier Device Package: 225-MAPBGA (13x13) USB: USB (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD |
auf Bestellung 79 Stücke: Lieferzeit 21-28 Tag (e) |
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74LVC2G00GN,115 | NXP Semiconductors |
Description: IC GATE NAND 2CH 2-INP 8XSON Packaging: Bulk Package / Case: 8-XFDFN Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 2 Supplier Device Package: 8-XSON (1.2x1) Input Logic Level - High: 1.07V ~ 3.85V Input Logic Level - Low: 0.58V ~ 1.65V Max Propagation Delay @ V, Max CL: 3.3ns @ 5V, 50pF Number of Circuits: 2 Current - Quiescent (Max): 4 µA |
auf Bestellung 74800 Stücke: Lieferzeit 21-28 Tag (e) |
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MC908AP16ACFAE | NXP Semiconductors |
Description: IC MCU 8BIT 16KB FLASH 48LQFP Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: M68HC08 Data Converters: A/D 8x10b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LED, LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Number of I/O: 31 DigiKey Programmable: Not Verified |
auf Bestellung 582 Stücke: Lieferzeit 21-28 Tag (e) |
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MC908LJ12CFUER | NXP Semiconductors |
Description: IC MCU 8BIT 12KB FLASH 64QFP Packaging: Bulk Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 12KB (12K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: M68HC08 Data Converters: A/D 6x10b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: I2C, IRSCI, SPI Peripherals: LCD, LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 1330 Stücke: Lieferzeit 21-28 Tag (e) |
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74HC2G02DC,125 | NXP Semiconductors |
Description: IC GATE NOR Packaging: Bulk |
auf Bestellung 21000 Stücke: Lieferzeit 21-28 Tag (e) |
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PBSS4260QAZ | NXP Semiconductors |
Description: NOW NEXPERIA PBSS4260QA - SMALL Packaging: Bulk |
auf Bestellung 305000 Stücke: Lieferzeit 21-28 Tag (e) |
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TDZ5V6J135 | NXP Semiconductors |
Description: TDZ5V6J - GENERAL-PURPOSE ZENER Packaging: Bulk Tolerance: ±1.96% Package / Case: SC-90, SOD-323F Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 5.6 V Impedance (Max) (Zzt): 40 Ohms Supplier Device Package: SOD-323F Grade: Automotive Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 10 µA @ 2.5 V Qualification: AEC-Q101 |
auf Bestellung 18900 Stücke: Lieferzeit 21-28 Tag (e) |
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MC8640TVJ1067NE557 | NXP Semiconductors |
Description: RISC Microprocessor, 32-Bit, Pow Packaging: Bulk |
Produkt ist nicht verfügbar |
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LPC2926FBD144,557 | NXP Semiconductors |
Description: LPC2926FBD144 - ARM9 microcontro Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 125MHz Program Memory Size: 256KB (256K x 8) RAM Size: 56K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM968E-S Data Converters: A/D 24x10b SAR Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 104 |
auf Bestellung 298 Stücke: Lieferzeit 21-28 Tag (e) |
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LPC2926FBD144,551 | NXP Semiconductors |
Description: LPC2900 - Arm9, 32-Bit RISC Micr Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 125MHz Program Memory Size: 256KB (256K x 8) RAM Size: 56K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM968E-S Data Converters: A/D 24x10b SAR Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 104 |
auf Bestellung 230 Stücke: Lieferzeit 21-28 Tag (e) |
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MPC8548VJAQGD | NXP Semiconductors |
Description: IC MPU 1GHZ 783FCPBGA Packaging: Bulk Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: AES, Cryptography, Kasumi, Random Number Generator |
auf Bestellung 24 Stücke: Lieferzeit 21-28 Tag (e) |
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74HC40105D,652 | NXP Semiconductors |
Description: IC FIFO 16X4 Packaging: Bulk DigiKey Programmable: Not Verified |
auf Bestellung 4426 Stücke: Lieferzeit 21-28 Tag (e) |
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74AHC04D,112 | NXP Semiconductors |
Description: IC INVERTER Packaging: Bulk |
auf Bestellung 35954 Stücke: Lieferzeit 21-28 Tag (e) |
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MC56F8006VWL | NXP Semiconductors |
Description: IC MCU 16BIT 16KB FLASH 28SOIC Packaging: Bulk Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 16KB (8K x 16) RAM Size: 1K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 15x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 28-SOIC Number of I/O: 23 DigiKey Programmable: Not Verified |
auf Bestellung 78 Stücke: Lieferzeit 21-28 Tag (e) |
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HEF4030BT,652 | NXP Semiconductors |
Description: IC GATE XOR Packaging: Bulk |
auf Bestellung 17982 Stücke: Lieferzeit 21-28 Tag (e) |
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BZX79-B10,133 | NXP Semiconductors |
Description: NEXPERIA BZX79-B10 - ZENER DIODE Tolerance: ±2% Packaging: Bulk Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 200°C Voltage - Zener (Nom) (Vz): 10 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: ALF2 Power - Max: 400 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 200 nA @ 7 V |
auf Bestellung 89612 Stücke: Lieferzeit 21-28 Tag (e) |
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74LVC04AD,112 | NXP Semiconductors |
Description: IC INVERTER Packaging: Bulk |
auf Bestellung 162196 Stücke: Lieferzeit 21-28 Tag (e) |
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MPC8536EBVJAULA | NXP Semiconductors |
Description: IC MPU 1.333GHZ 783FCPBGA Packaging: Bulk Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography SATA: SATA 3Gbps (2) |
auf Bestellung 36 Stücke: Lieferzeit 21-28 Tag (e) |
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P83C557E4EFB/215557 | NXP Semiconductors |
Description: P83C557E4EFB/215:5 - Microcontro Packaging: Bulk |
auf Bestellung 330 Stücke: Lieferzeit 21-28 Tag (e) |
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74LVCH2T45GN,115 | NXP Semiconductors |
Description: NEXPERIA 74LVCH2T45GN - BUS TRAN Packaging: Bulk |
auf Bestellung 4324 Stücke: Lieferzeit 21-28 Tag (e) |
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HEF4069UBT,013 | NXP Semiconductors |
Description: IC INVERTER Packaging: Bulk |
auf Bestellung 2500 Stücke: Lieferzeit 21-28 Tag (e) |
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74HC154PW,112 | NXP Semiconductors |
Description: NEXPERIA 74HC154PW - DECODER/DRI Packaging: Bulk Package / Case: 24-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 1 x 4:16 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 24-TSSOP |
auf Bestellung 655 Stücke: Lieferzeit 21-28 Tag (e) |
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M86291G12 | NXP Semiconductors |
Description: TEMP MS PART - C2K 900MHz Device Packaging: Bulk Package / Case: 625-BFBGA, FCBGA Mounting Type: Surface Mount Interface: SPI, USB Supplier Device Package: 625-FCPBGA (21x21) |
auf Bestellung 300 Stücke: Lieferzeit 21-28 Tag (e) |
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74LVC157AD,118 | NXP Semiconductors |
Description: NEXPERIA 74LVC157AD - MULTIPLEXE Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 4 x 2:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.2V ~ 3.6V Independent Circuits: 1 Current - Output High, Low: 24mA, 24mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
auf Bestellung 45747 Stücke: Lieferzeit 21-28 Tag (e) |
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LPC1830-UK012 | NXP Semiconductors |
Description: LPC1800 - High-Performance Micro Packaging: Bulk |
auf Bestellung 49443 Stücke: Lieferzeit 21-28 Tag (e) |
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MC56F83786VLK | NXP Semiconductors |
Description: MC56F83786VLK - 32-bit DSC, 5680 Packaging: Bulk Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 20x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, I²C, SCI, SPI, UART Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Supplier Device Package: 80-LQFP (12x12) Number of I/O: 68 |
auf Bestellung 480 Stücke: Lieferzeit 21-28 Tag (e) |
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NXH2280UK/C1012 | NXP Semiconductors |
Description: NXH2280UK - Power Distribution S Packaging: Bulk |
auf Bestellung 78000 Stücke: Lieferzeit 21-28 Tag (e) |
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74ALVC08D,118 |
auf Bestellung 11982 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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1976+ | 0.37 EUR |
MPC860DTCVR50D4 |
Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
auf Bestellung 440 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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2+ | 407.85 EUR |
MPC860TCVR50D4 |
Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
auf Bestellung 450 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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2+ | 419.59 EUR |
MPC860TCZQ66D4 |
Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC86XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
auf Bestellung 4280 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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2+ | 605.58 EUR |
BZV85-C5V1,133 |
Hersteller: NXP Semiconductors
Description: NEXPERIA BZV85-C5V1 - ZENER DIOD
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: 200°C
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Description: NEXPERIA BZV85-C5V1 - ZENER DIOD
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: 200°C
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
auf Bestellung 46670 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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9072+ | 0.072 EUR |
SPC5748GSK1MMJ6 |
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 192K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit 3-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 192K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit 3-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
auf Bestellung 236 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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8+ | 97.5 EUR |
74HC03D,652 |
auf Bestellung 33012 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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2637+ | 0.26 EUR |
FS32K146HRT0CLLT |
Hersteller: NXP Semiconductors
Description: S32K146 32-bit MCU, ARM Cortex-M
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, I²S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 128
Description: S32K146 32-bit MCU, ARM Cortex-M
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, I²S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 128
auf Bestellung 234 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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18+ | 39.94 EUR |
74LVC2G32GM,125 |
auf Bestellung 24000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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4940+ | 0.14 EUR |
74LVT16244BDGG,112 |
Hersteller: NXP Semiconductors
Description: IC BUFF NON-INVERT 3.6V 48TSSOP
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-TSSOP
Description: IC BUFF NON-INVERT 3.6V 48TSSOP
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-TSSOP
auf Bestellung 1777 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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703+ | 1.06 EUR |
74HC4316PW,112 |
auf Bestellung 2400 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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2400+ | 0.31 EUR |
PTN5110NDHQZ |
Hersteller: NXP Semiconductors
Description: PTN5110NDHQ - USB PD TCPC PHY IC
Packaging: Bulk
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Description: PTN5110NDHQ - USB PD TCPC PHY IC
Packaging: Bulk
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Supplier Device Package: 16-HX2QFN (2.6x2.6)
auf Bestellung 3629 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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258+ | 2.76 EUR |
74HC11D,653 |
Hersteller: NXP Semiconductors
Description: IC GATE AND 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 1.2V ~ 3.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE AND 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 1.2V ~ 3.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 44831 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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3694+ | 0.19 EUR |
74HC11DB,118 |
auf Bestellung 3853 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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1762+ | 0.41 EUR |
74HC11DB,112 |
auf Bestellung 3432 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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1610+ | 0.46 EUR |
BYV29F-600,127 |
Hersteller: NXP Semiconductors
Description: DIODE GEN PURP 600V 9A TO220AC
Packaging: Bulk
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 35 ns
Technology: Standard
Current - Average Rectified (Io): 9A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 8 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
Description: DIODE GEN PURP 600V 9A TO220AC
Packaging: Bulk
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 35 ns
Technology: Standard
Current - Average Rectified (Io): 9A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 8 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
auf Bestellung 51992 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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756+ | 0.95 EUR |
TYN16X-600CT127 |
Hersteller: NXP Semiconductors
Description: NOW WEEN - TYN16X-600CT - SILICO
Packaging: Bulk
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
SCR Type: Standard Recovery
Operating Temperature: 150°C (TJ)
Current - Hold (Ih) (Max): 40 mA
Current - Gate Trigger (Igt) (Max): 15 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 180A, 198A
Current - On State (It (AV)) (Max): 10.2 A
Voltage - Gate Trigger (Vgt) (Max): 1.3 V
Voltage - On State (Vtm) (Max): 1.6 V
Current - Off State (Max): 1 mA
Supplier Device Package: TO-220F
Current - On State (It (RMS)) (Max): 16 A
Voltage - Off State: 600 V
Description: NOW WEEN - TYN16X-600CT - SILICO
Packaging: Bulk
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
SCR Type: Standard Recovery
Operating Temperature: 150°C (TJ)
Current - Hold (Ih) (Max): 40 mA
Current - Gate Trigger (Igt) (Max): 15 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 180A, 198A
Current - On State (It (AV)) (Max): 10.2 A
Voltage - Gate Trigger (Vgt) (Max): 1.3 V
Voltage - On State (Vtm) (Max): 1.6 V
Current - Off State (Max): 1 mA
Supplier Device Package: TO-220F
Current - On State (It (RMS)) (Max): 16 A
Voltage - Off State: 600 V
auf Bestellung 283000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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859+ | 0.83 EUR |
BCW33,215 |
Hersteller: NXP Semiconductors
Description: NEXPERIA BCW33 - SMALL SIGNAL BI
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 210mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 32 V
Power - Max: 250 mW
Qualification: AEC-Q101
Description: NEXPERIA BCW33 - SMALL SIGNAL BI
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 210mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 32 V
Power - Max: 250 mW
Qualification: AEC-Q101
auf Bestellung 83341 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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13053+ | 0.048 EUR |
74LVC2G02GF,115 |
auf Bestellung 2040 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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2040+ | 0.39 EUR |
74HC85PW,112 |
auf Bestellung 7855 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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1395+ | 0.53 EUR |
74LVC1G27GF,132 |
auf Bestellung 94890 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
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3909+ | 0.2 EUR |
PBSS5130QAZ |
Hersteller: NXP Semiconductors
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 240mV @ 100mA, 1A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 250 @ 100mA, 2V
Frequency - Transition: 170MHz
Supplier Device Package: DFN1010D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 325 mW
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 240mV @ 100mA, 1A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 250 @ 100mA, 2V
Frequency - Transition: 170MHz
Supplier Device Package: DFN1010D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 325 mW
auf Bestellung 204190 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5124+ | 0.14 EUR |
MRFX600HSR5 |
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 65V NI780
Packaging: Bulk
Package / Case: NI-780S-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: 2 N-Channel
Power - Output: 600W
Gain: 26.4dB @ 230MHz
Technology: LDMOS (Dual)
Supplier Device Package: NI-780S-4L
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 65V NI780
Packaging: Bulk
Package / Case: NI-780S-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: 2 N-Channel
Power - Output: 600W
Gain: 26.4dB @ 230MHz
Technology: LDMOS (Dual)
Supplier Device Package: NI-780S-4L
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
auf Bestellung 2 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 371.15 EUR |
BTA202X-600E,127 |
Hersteller: NXP Semiconductors
Description: TRIAC SENS GATE 600V 2A TO220F
Packaging: Bulk
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 12 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 14A, 15.4A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220F
Current - On State (It (RMS)) (Max): 2 A
Voltage - Off State: 600 V
Description: TRIAC SENS GATE 600V 2A TO220F
Packaging: Bulk
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 12 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 14A, 15.4A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220F
Current - On State (It (RMS)) (Max): 2 A
Voltage - Off State: 600 V
auf Bestellung 7252 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
994+ | 0.71 EUR |
P4080NSN7PNAC |
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ P4 1.5GHZ 1295BGA
Packaging: Bulk
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (8), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.0
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Description: IC MPU QORIQ P4 1.5GHZ 1295BGA
Packaging: Bulk
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (8), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.0
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
auf Bestellung 25 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 2096.46 EUR |
MF1SEP1031DA4/03KJ |
Hersteller: NXP Semiconductors
Description: MF1SEP1031DA4 - MIFARE Plus SE,
Packaging: Bulk
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443
Supplier Device Package: PLLMC
Description: MF1SEP1031DA4 - MIFARE Plus SE,
Packaging: Bulk
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443
Supplier Device Package: PLLMC
auf Bestellung 249588 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1169+ | 0.62 EUR |
74LVC1G02GX,125 |
auf Bestellung 40162 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5017+ | 0.14 EUR |
MC56F83769AVLLA |
Hersteller: NXP Semiconductors
Description: MC56F837XX - Performance Level D
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SCI, SPI, USB
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 82
Description: MC56F837XX - Performance Level D
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SCI, SPI, USB
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 82
auf Bestellung 90 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
26+ | 28.4 EUR |
74HC153D,652 |
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HC153D - MULTIPLEXER,
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: NEXPERIA 74HC153D - MULTIPLEXER,
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 18206 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1565+ | 0.45 EUR |
TDA18254AHN/C1,518 |
Hersteller: NXP Semiconductors
Description: TDA18254AH - CABLE SILICON TUNER
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I²C
Description: TDA18254AH - CABLE SILICON TUNER
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I²C
auf Bestellung 280000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
146+ | 5.07 EUR |
74HCT253D,652 |
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HCT253D - MULTIPLEXER
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: NEXPERIA 74HCT253D - MULTIPLEXER
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 25486 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1410+ | 0.52 EUR |
74LV00PW,118 |
Hersteller: NXP Semiconductors
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 14ns @ 5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 14ns @ 5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
auf Bestellung 124183 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2807+ | 0.27 EUR |
MCIMX6L7DVN10AC |
Hersteller: NXP Semiconductors
Description: IC MPU 1GHZ 432MAPBGA
Packaging: Bulk
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Description: IC MPU 1GHZ 432MAPBGA
Packaging: Bulk
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 158 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
14+ | 51.62 EUR |
MC9328MXLVP20R2 |
Hersteller: NXP Semiconductors
Description: IC MPU I.MXL 200MHZ 225MAPBGA
Packaging: Bulk
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Description: IC MPU I.MXL 200MHZ 225MAPBGA
Packaging: Bulk
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
auf Bestellung 79 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
20+ | 36.03 EUR |
74LVC2G00GN,115 |
Hersteller: NXP Semiconductors
Description: IC GATE NAND 2CH 2-INP 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (1.2x1)
Input Logic Level - High: 1.07V ~ 3.85V
Input Logic Level - Low: 0.58V ~ 1.65V
Max Propagation Delay @ V, Max CL: 3.3ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
Description: IC GATE NAND 2CH 2-INP 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (1.2x1)
Input Logic Level - High: 1.07V ~ 3.85V
Input Logic Level - Low: 0.58V ~ 1.65V
Max Propagation Delay @ V, Max CL: 3.3ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
auf Bestellung 74800 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1474+ | 0.48 EUR |
MC908AP16ACFAE |
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
auf Bestellung 582 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
39+ | 19.17 EUR |
MC908LJ12CFUER |
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 12KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 6x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I2C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 12KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 6x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I2C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1330 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
26+ | 28.52 EUR |
74HC2G02DC,125 |
auf Bestellung 21000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1582+ | 0.45 EUR |
PBSS4260QAZ |
auf Bestellung 305000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3904+ | 0.2 EUR |
TDZ5V6J135 |
Hersteller: NXP Semiconductors
Description: TDZ5V6J - GENERAL-PURPOSE ZENER
Packaging: Bulk
Tolerance: ±1.96%
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOD-323F
Grade: Automotive
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 10 µA @ 2.5 V
Qualification: AEC-Q101
Description: TDZ5V6J - GENERAL-PURPOSE ZENER
Packaging: Bulk
Tolerance: ±1.96%
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOD-323F
Grade: Automotive
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 10 µA @ 2.5 V
Qualification: AEC-Q101
auf Bestellung 18900 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
9072+ | 0.074 EUR |
MC8640TVJ1067NE557 |
Produkt ist nicht verfügbar
LPC2926FBD144,557 |
Hersteller: NXP Semiconductors
Description: LPC2926FBD144 - ARM9 microcontro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
Description: LPC2926FBD144 - ARM9 microcontro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
auf Bestellung 298 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
22+ | 33.74 EUR |
LPC2926FBD144,551 |
Hersteller: NXP Semiconductors
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
auf Bestellung 230 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
22+ | 33.74 EUR |
MPC8548VJAQGD |
Hersteller: NXP Semiconductors
Description: IC MPU 1GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: AES, Cryptography, Kasumi, Random Number Generator
Description: IC MPU 1GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: AES, Cryptography, Kasumi, Random Number Generator
auf Bestellung 24 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 566.36 EUR |
74HC40105D,652 |
Hersteller: NXP Semiconductors
Description: IC FIFO 16X4
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC FIFO 16X4
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 4426 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
612+ | 1.17 EUR |
74AHC04D,112 |
auf Bestellung 35954 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2823+ | 0.26 EUR |
MC56F8006VWL |
Hersteller: NXP Semiconductors
Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
auf Bestellung 78 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
78+ | 11.12 EUR |
HEF4030BT,652 |
auf Bestellung 17982 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1484+ | 0.48 EUR |
BZX79-B10,133 |
Hersteller: NXP Semiconductors
Description: NEXPERIA BZX79-B10 - ZENER DIODE
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 200 nA @ 7 V
Description: NEXPERIA BZX79-B10 - ZENER DIODE
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 200 nA @ 7 V
auf Bestellung 89612 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
15000+ | 0.048 EUR |
74LVC04AD,112 |
auf Bestellung 162196 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2796+ | 0.26 EUR |
MPC8536EBVJAULA |
Hersteller: NXP Semiconductors
Description: IC MPU 1.333GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Description: IC MPU 1.333GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
auf Bestellung 36 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 806.99 EUR |
P83C557E4EFB/215557 |
auf Bestellung 330 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
54+ | 13.41 EUR |
74LVCH2T45GN,115 |
auf Bestellung 4324 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1446+ | 0.52 EUR |
HEF4069UBT,013 |
auf Bestellung 2500 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2500+ | 0.34 EUR |
74HC154PW,112 |
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HC154PW - DECODER/DRI
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 4:16
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 24-TSSOP
Description: NEXPERIA 74HC154PW - DECODER/DRI
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 4:16
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 24-TSSOP
auf Bestellung 655 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
481+ | 1.49 EUR |
M86291G12 |
Hersteller: NXP Semiconductors
Description: TEMP MS PART - C2K 900MHz Device
Packaging: Bulk
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: SPI, USB
Supplier Device Package: 625-FCPBGA (21x21)
Description: TEMP MS PART - C2K 900MHz Device
Packaging: Bulk
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: SPI, USB
Supplier Device Package: 625-FCPBGA (21x21)
auf Bestellung 300 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 126.75 EUR |
74LVC157AD,118 |
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC157AD - MULTIPLEXE
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: NEXPERIA 74LVC157AD - MULTIPLEXE
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 45747 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3106+ | 0.24 EUR |
LPC1830-UK012 |
auf Bestellung 49443 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
31+ | 24.44 EUR |
MC56F83786VLK |
Hersteller: NXP Semiconductors
Description: MC56F83786VLK - 32-bit DSC, 5680
Packaging: Bulk
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I²C, SCI, SPI, UART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Number of I/O: 68
Description: MC56F83786VLK - 32-bit DSC, 5680
Packaging: Bulk
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I²C, SCI, SPI, UART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Number of I/O: 68
auf Bestellung 480 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
28+ | 27.07 EUR |
NXH2280UK/C1012 |
auf Bestellung 78000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
30+ | 24.24 EUR |