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S25FL064P0XMFV003 NXP Semiconductors Description: S25FL064P - 64-Mbit 3.0 V Flash
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MCF54450ACVM180 NXP Semiconductors Description: MCF5445x - 32-bit MPU, ColdFire
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
PZU9.1BL,315 PZU9.1BL,315 NXP Semiconductors PZUXBL_SER.pdf Description: NEXPERIA PZU9.1BL - ZENER DIODE,
Packaging: Bulk
Tolerance: ±5%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
auf Bestellung 92499 Stücke:
Lieferzeit 21-28 Tag (e)
12070+0.048 EUR
Mindestbestellmenge: 12070
BZX884-B11,315 BZX884-B11,315 NXP Semiconductors PHGLS19465-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA BZX884-B11 - ZENER DIOD
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
auf Bestellung 70000 Stücke:
Lieferzeit 21-28 Tag (e)
11727+0.072 EUR
Mindestbestellmenge: 11727
PZU3.6B2L,315 PZU3.6B2L,315 NXP Semiconductors PHGLS15647-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PZU3.6B2L - ZENER DIODE
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
auf Bestellung 20000 Stücke:
Lieferzeit 21-28 Tag (e)
10764+0.078 EUR
Mindestbestellmenge: 10764
BZX884-B30,315 BZX884-B30,315 NXP Semiconductors PHGLS19465-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA BZX884-B30 - ZENER DIOD
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 30 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 21 V
auf Bestellung 16905 Stücke:
Lieferzeit 21-28 Tag (e)
11727+0.072 EUR
Mindestbestellmenge: 11727
TDA18219HN/C1518 NXP Semiconductors Description: TDA18SILICTUN40HVQFN
Packaging: Bulk
Part Status: Obsolete
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Standards: DTMB, DVB-C, DVB-T, ISDB-T
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I²C
auf Bestellung 4000 Stücke:
Lieferzeit 21-28 Tag (e)
174+4.1 EUR
Mindestbestellmenge: 174
NXQ1TXH5/101118 NXQ1TXH5/101118 NXP Semiconductors Description: NXQ1TXH5 - One-chip 5 V Qi wirel
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
PCA9663B/S911118 NXP Semiconductors Description: PCA9663 - Parallel Bus to Three-
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
MCIMX31LDVMN5DR2 NXP Semiconductors FSCLS05432-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX31 532MHZ 473BGA
Packaging: Bulk
Part Status: Active
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2V, 2.5V, 2.7V, 3V
Supplier Device Package: 473-PBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
auf Bestellung 5250 Stücke:
Lieferzeit 21-28 Tag (e)
10+78.17 EUR
Mindestbestellmenge: 10
74HCT27PW,112 74HCT27PW,112 NXP Semiconductors 74HC_HCT27.pdf Description: IC GATE NOR
Packaging: Bulk
Part Status: Active
auf Bestellung 12686 Stücke:
Lieferzeit 21-28 Tag (e)
2329+0.31 EUR
Mindestbestellmenge: 2329
LS1012AXN7KKB NXP Semiconductors Description: IC MPU QORLQ LS1 1GHZ 211FCLGA
Packaging: Bulk
Part Status: Active
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
auf Bestellung 336 Stücke:
Lieferzeit 21-28 Tag (e)
11+76.49 EUR
Mindestbestellmenge: 11
74CBTLV3257D,118 74CBTLV3257D,118 NXP Semiconductors 74CBTLV3257.pdf Description: NEXPERIA 74CBTLV3257 - QUAD 1-OF
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 1:2
Type: Multiplexer/Demultiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Active
auf Bestellung 2400 Stücke:
Lieferzeit 21-28 Tag (e)
2400+0.42 EUR
Mindestbestellmenge: 2400
MCIMX6Q4AVT10AE NXP Semiconductors Description: MCIMX6Q4AVT10AE - i.MX 6 series
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MCIMX6Q5EZK08AD NXP Semiconductors PHGL-S-A0006627490-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Bulk
Part Status: Active
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 258 Stücke:
Lieferzeit 21-28 Tag (e)
4+186.04 EUR
Mindestbestellmenge: 4
74LVC3G17GN,115 74LVC3G17GN,115 NXP Semiconductors 74LVC3G17.pdf Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-XSON (1.2x1)
Part Status: Active
auf Bestellung 78500 Stücke:
Lieferzeit 21-28 Tag (e)
1381+0.54 EUR
Mindestbestellmenge: 1381
PCA9430HKZ NXP Semiconductors Description: RF Evaluation/Development Kits
Packaging: Bulk
Part Status: Active
auf Bestellung 34988 Stücke:
Lieferzeit 21-28 Tag (e)
198+3.7 EUR
Mindestbestellmenge: 198
PMEG100T20ELPX NXP Semiconductors Description: PMEG100T20ELP - 100 V, 2 A low l
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 12 ns
Technology: Schottky
Capacitance @ Vr, F: 200pF @ 1V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: SOD-128/CFP5
Operating Temperature - Junction: 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 2 A
Current - Reverse Leakage @ Vr: 1.25 µA @ 100 V
auf Bestellung 7781 Stücke:
Lieferzeit 21-28 Tag (e)
3000+0.26 EUR
Mindestbestellmenge: 3000
SPC5748GK0AMMJ6 SPC5748GK0AMMJ6 NXP Semiconductors PHGL-S-A0004670910-1.pdf?t.download=true&u=5oefqw Description: TRIPLE CORE, 6M FLASH, 768K RAM,
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 1.32V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
auf Bestellung 553 Stücke:
Lieferzeit 21-28 Tag (e)
7+103.21 EUR
Mindestbestellmenge: 7
MC34GD3000EP NXP Semiconductors MC33GD3000.pdf Description: GD3000 - Brushless DC Motor Gate
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: SPI
Operating Temperature: -20°C ~ 105°C (TA)
Output Configuration: Half Bridge (3)
Voltage - Supply: 6V ~ 58V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 6V ~ 58V
Supplier Device Package: 56-QFN (8x8)
Motor Type - Stepper: Multiphase
Motor Type - AC, DC: Brushless DC (BLDC)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 208 Stücke:
Lieferzeit 21-28 Tag (e)
93+7.75 EUR
Mindestbestellmenge: 93
BZX79-C36143 BZX79-C36143 NXP Semiconductors BZX79.pdf Description: NOW NEXPERIA BZX79-C36 - ZENER D
Packaging: Bulk
Part Status: Active
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Produkt ist nicht verfügbar
KC912DG128CCPVE KC912DG128CCPVE NXP Semiconductors Description: MC912DG128CCPVE - Microcontrolle
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
NT2H1611G0DA8J NXP Semiconductors NTAG213_215_216.pdf Description: NT2H1611G0DA8 - NTAG NFC Forum T
Packaging: Bulk
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: PLLMC
Part Status: Active
auf Bestellung 22951 Stücke:
Lieferzeit 21-28 Tag (e)
713+1.01 EUR
Mindestbestellmenge: 713
LX2080XE72232B NXP Semiconductors LX2160XE72232B.pdf?t.download=true&u=axiww2 Description: IC MPU QORIQ LX 2.2GHZ 1517BGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4 SDRAM
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
auf Bestellung 744 Stücke:
Lieferzeit 21-28 Tag (e)
1+1517.96 EUR
LX2120SE72029B NXP Semiconductors Description: IC MPU QORIQ LX 2GHZ 1517FCPBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4 SDRAM
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 21-28 Tag (e)
1+1440.5 EUR
LX2160SC72232B NXP Semiconductors Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4 SDRAM
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
auf Bestellung 17 Stücke:
Lieferzeit 21-28 Tag (e)
1+2033.59 EUR
BGU8H1X BGU8H1X NXP Semiconductors PHGL-S-A0005068069-1.pdf?t.download=true&u=5oefqw Description: BGU8H1 - SiGe:C Low Noise Amplif
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13dB
Current - Supply: 5mA
Noise Figure: 0.9dB
P1dB: -3dBm
Test Frequency: 3.35GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 1873853 Stücke:
Lieferzeit 21-28 Tag (e)
1797+0.41 EUR
Mindestbestellmenge: 1797
74LVC1GU04GN,132 74LVC1GU04GN,132 NXP Semiconductors PHGLS27066-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 3750 Stücke:
Lieferzeit 21-28 Tag (e)
3750+0.24 EUR
Mindestbestellmenge: 3750
LPC2929FBD144,551 NXP Semiconductors Description: LPC2929 - ARM9 microcontroller w
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 104
Produkt ist nicht verfügbar
LPC4076FBD144E NXP Semiconductors PHGLS25790-1.pdf?t.download=true&u=5oefqw Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 109
auf Bestellung 626 Stücke:
Lieferzeit 21-28 Tag (e)
32+22.66 EUR
Mindestbestellmenge: 32
LPC4074FBD144,551 NXP Semiconductors PHGLS25790-1.pdf?t.download=true&u=5oefqw Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 109
auf Bestellung 623 Stücke:
Lieferzeit 21-28 Tag (e)
41+18.01 EUR
Mindestbestellmenge: 41
LPC4078FBD144,551 NXP Semiconductors PHGLS25790-1.pdf?t.download=true&u=5oefqw Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 109
auf Bestellung 2528 Stücke:
Lieferzeit 21-28 Tag (e)
30+23.82 EUR
Mindestbestellmenge: 30
PN7360AUEV/C300Y NXP Semiconductors Description: PN7360AUEV - NFC Cortex®
Packaging: Bulk
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 21-28 Tag (e)
40+19.68 EUR
Mindestbestellmenge: 40
PUMH9/ZL165 NXP Semiconductors Description: Nexperia PUMH9 Small Signal Bipo
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 2 NPN - Pre-Biased
Power - Max: 200mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Frequency - Transition: 230MHz
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 47kOhm
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
LPC2917FBD144/01/, LPC2917FBD144/01/, NXP Semiconductors Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 88K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM968E-S
Data Converters: A/D 16x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 108
Produkt ist nicht verfügbar
LPC2921FBD100,551 NXP Semiconductors PHGLS20650-1.pdf?t.download=true&u=5oefqw Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 16x8b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 60
auf Bestellung 287 Stücke:
Lieferzeit 21-28 Tag (e)
64+11.24 EUR
Mindestbestellmenge: 64
2PD2150,115 2PD2150,115 NXP Semiconductors PHGLS14575-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 2PD2150 - POWER BIPOLAR
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 100mA, 2A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 100mA, 2V
Frequency - Transition: 220MHz
Supplier Device Package: SOT-89
Part Status: Active
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 20 V
Power - Max: 2 W
auf Bestellung 8026 Stücke:
Lieferzeit 21-28 Tag (e)
4187+0.18 EUR
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LPC1112FDH28/102:5 LPC1112FDH28/102:5 NXP Semiconductors Description: LPC1112 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
auf Bestellung 8647 Stücke:
Lieferzeit 21-28 Tag (e)
181+4.32 EUR
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LPC1114JBD48/303QL LPC1114JBD48/303QL NXP Semiconductors PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
auf Bestellung 220 Stücke:
Lieferzeit 21-28 Tag (e)
100+7.25 EUR
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LPC1112FHI33/102,5 LPC1112FHI33/102,5 NXP Semiconductors Description: LPC1112 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
auf Bestellung 2351 Stücke:
Lieferzeit 21-28 Tag (e)
158+4.94 EUR
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LPC1114LVFHN24/103 LPC1114LVFHN24/103 NXP Semiconductors PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 4x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 20
Connectivity: I2C, SPI, SSP, UART/USART
auf Bestellung 964 Stücke:
Lieferzeit 21-28 Tag (e)
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LPC1112FHN24/202J LPC1112FHN24/202J NXP Semiconductors Description: LPC1112 - Arm Cortex -M0 Cores M
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 19
auf Bestellung 5684 Stücke:
Lieferzeit 21-28 Tag (e)
163+4.81 EUR
Mindestbestellmenge: 163
74AUP2G04GM,132 74AUP2G04GM,132 NXP Semiconductors PHGLS24263-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74AUP2G04GM - INVERTER,
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (1.45x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
auf Bestellung 4094840 Stücke:
Lieferzeit 21-28 Tag (e)
3518+0.23 EUR
Mindestbestellmenge: 3518
74AUP3G04GN,115 NXP Semiconductors PHGLS25965-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74AUP3G04GN - INVERTER,
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 8-XSON (1.2x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 500 nA
auf Bestellung 55000 Stücke:
Lieferzeit 21-28 Tag (e)
877+0.88 EUR
Mindestbestellmenge: 877
1N4738A,133 1N4738A,133 NXP Semiconductors 1N4728A_SER.pdf Description: NEXPERIA 1N4738A - ZENER DIODE,
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 4.5 Ohms
Supplier Device Package: DO-41
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 6 V
auf Bestellung 132963 Stücke:
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9043+0.072 EUR
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74HC240DB,118 74HC240DB,118 NXP Semiconductors PHGLS28497-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER INVERT 6V 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
Part Status: Active
auf Bestellung 3360 Stücke:
Lieferzeit 21-28 Tag (e)
1076+0.67 EUR
Mindestbestellmenge: 1076
88W8987-A2-NYEA/AZ NXP Semiconductors Description: 88W8987 - RF Transceiver (Board
Packaging: Bulk
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Data Rate (Max): 433Mbps
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Part Status: Active
auf Bestellung 10000 Stücke:
Lieferzeit 21-28 Tag (e)
35+20.6 EUR
Mindestbestellmenge: 35
74AUP2G241DC,125 74AUP2G241DC,125 NXP Semiconductors PHGLS26016-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 8VSSOP
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-VSSOP
Part Status: Active
auf Bestellung 35459 Stücke:
Lieferzeit 21-28 Tag (e)
1815+0.44 EUR
Mindestbestellmenge: 1815
74AUP1G17GN,132 74AUP1G17GN,132 NXP Semiconductors PHGL-S-A0000283103-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
auf Bestellung 5000 Stücke:
Lieferzeit 21-28 Tag (e)
1920+0.38 EUR
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PMEG2015EA115 PMEG2015EA115 NXP Semiconductors PMEG2015EA.pdf Description: DIODE SCHOTTKY 20V 1.5A SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Current - Average Rectified (Io): 1.5A
Supplier Device Package: SOD-323
Operating Temperature - Junction: -65°C ~ 125°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 660 mV @ 1.5 A
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Produkt ist nicht verfügbar
TDA5231XUMA1 TDA5231XUMA1 NXP Semiconductors TDA5230,31.pdf Description: TDA52WireleContrReceiver
Features: RSSI Equipped
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 302MHz ~ 320MHz
Modulation or Protocol: ASK, FSK
Data Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
Applications: RKE, Security Systems, TPMS
Data Rate (Max): 20kbps
Antenna Connector: Not Included
Supplier Device Package: PG-TSSOP-28-1
Part Status: Obsolete
auf Bestellung 6632 Stücke:
Lieferzeit 21-28 Tag (e)
143+5.49 EUR
Mindestbestellmenge: 143
PMDXB600UNEL/S500Z NXP Semiconductors Description: PMDXB600UNEL - N Channel MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MRF6VP11KGSR5 NXP Semiconductors FSCLS07342-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230-4S GW
Current Rating (Amps): 100µA
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 150MHz
Configuration: 2 N-Channel
Power - Output: 1000W
Gain: 26dB @ 130MHz
Technology: LDMOS (Dual)
Supplier Device Package: NI-1230-4S GULL
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
auf Bestellung 2000 Stücke:
Lieferzeit 21-28 Tag (e)
2+705.73 EUR
Mindestbestellmenge: 2
BZX884-C12,315 BZX884-C12,315 NXP Semiconductors PHGLS19465-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA BZX884-C12 - ZENER DIOD
Tolerance: ±5%
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
auf Bestellung 18159 Stücke:
Lieferzeit 21-28 Tag (e)
18159+0.048 EUR
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MIMX8ML4DVNLZAB NXP Semiconductors Description: IC MPU I.MX8M 1.8GHZ 486LFBGA
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Part Status: Active
Additional Interfaces: CANbus, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 9632 Stücke:
Lieferzeit 21-28 Tag (e)
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MIMX8QM6CVUFFAB NXP Semiconductors Description: IC MPU I.MX8Q 264MHZ 1313FCPBGA
Packaging: Bulk
Package / Case: 1313-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz, 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1313-FCPBGA (29x29)
Ethernet: 1Gbps (2)
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
auf Bestellung 44 Stücke:
Lieferzeit 21-28 Tag (e)
2+458.85 EUR
Mindestbestellmenge: 2
MIMX8QP6AVUFFAB NXP Semiconductors Description: IC MPU I.MX8Q 266MHZ 1313FCPBGA
Packaging: Bulk
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Number of Cores/Bus Width: 7 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: LPDDR4
Graphics Acceleration: Yes
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Part Status: Active
Package / Case: 1313-BBGA, FCBGA
Supplier Device Package: 1313-FCPBGA (29x29)
Speed: 1.6GHz, 1.26GHz, 266MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A72, Arm Cortex®-M4F
Ethernet: 1Gbps (2)
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Additional Interfaces: CANbus, I2C, SPI, UART
auf Bestellung 180 Stücke:
Lieferzeit 21-28 Tag (e)
2+469.91 EUR
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74LV74PW,118 NXP Semiconductors 74LV74.pdf Description: IC FF D-TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 80 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 110 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 3969 Stücke:
Lieferzeit 21-28 Tag (e)
2845+0.29 EUR
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MC10XS3535JHFK NXP Semiconductors www.nxp.com Description: MC10XS3535JHFK - 12 V Automotive
Packaging: Bulk
Features: Slew Rate Controlled
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 5
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 55mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 6V ~ 28V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Ratio - Input:Output: 1:5
Supplier Device Package: 24-PQFN (12x12)
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Over Temperature, Reverse Battery, UVLO
Produkt ist nicht verfügbar
MC35XS3500HFK NXP Semiconductors MC35XS3500.pdf Description: MC35XS3500HFK - 12 V Automotive
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Bulk
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 5
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 35mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 6V ~ 28V
Voltage - Supply (Vcc/Vdd): 6V ~ 28V
Current - Output (Max): 65mA
Ratio - Input:Output: 1:5
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Battery, UVLO
Part Status: Obsolete
Produkt ist nicht verfügbar
S25FL064P0XMFV003
Hersteller: NXP Semiconductors
Description: S25FL064P - 64-Mbit 3.0 V Flash
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MCF54450ACVM180
Hersteller: NXP Semiconductors
Description: MCF5445x - 32-bit MPU, ColdFire
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
PZU9.1BL,315 PZUXBL_SER.pdf
PZU9.1BL,315
Hersteller: NXP Semiconductors
Description: NEXPERIA PZU9.1BL - ZENER DIODE,
Packaging: Bulk
Tolerance: ±5%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
auf Bestellung 92499 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
12070+0.048 EUR
Mindestbestellmenge: 12070
BZX884-B11,315 PHGLS19465-1.pdf?t.download=true&u=5oefqw
BZX884-B11,315
Hersteller: NXP Semiconductors
Description: NEXPERIA BZX884-B11 - ZENER DIOD
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
auf Bestellung 70000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
11727+0.072 EUR
Mindestbestellmenge: 11727
PZU3.6B2L,315 PHGLS15647-1.pdf?t.download=true&u=5oefqw
PZU3.6B2L,315
Hersteller: NXP Semiconductors
Description: NEXPERIA PZU3.6B2L - ZENER DIODE
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
auf Bestellung 20000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
10764+0.078 EUR
Mindestbestellmenge: 10764
BZX884-B30,315 PHGLS19465-1.pdf?t.download=true&u=5oefqw
BZX884-B30,315
Hersteller: NXP Semiconductors
Description: NEXPERIA BZX884-B30 - ZENER DIOD
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 30 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 21 V
auf Bestellung 16905 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
11727+0.072 EUR
Mindestbestellmenge: 11727
TDA18219HN/C1518
Hersteller: NXP Semiconductors
Description: TDA18SILICTUN40HVQFN
Packaging: Bulk
Part Status: Obsolete
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Standards: DTMB, DVB-C, DVB-T, ISDB-T
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I²C
auf Bestellung 4000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
174+4.1 EUR
Mindestbestellmenge: 174
NXQ1TXH5/101118
NXQ1TXH5/101118
Hersteller: NXP Semiconductors
Description: NXQ1TXH5 - One-chip 5 V Qi wirel
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
PCA9663B/S911118
Hersteller: NXP Semiconductors
Description: PCA9663 - Parallel Bus to Three-
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
MCIMX31LDVMN5DR2 FSCLS05432-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX31 532MHZ 473BGA
Packaging: Bulk
Part Status: Active
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2V, 2.5V, 2.7V, 3V
Supplier Device Package: 473-PBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
auf Bestellung 5250 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
10+78.17 EUR
Mindestbestellmenge: 10
74HCT27PW,112 74HC_HCT27.pdf
74HCT27PW,112
Hersteller: NXP Semiconductors
Description: IC GATE NOR
Packaging: Bulk
Part Status: Active
auf Bestellung 12686 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2329+0.31 EUR
Mindestbestellmenge: 2329
LS1012AXN7KKB
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ LS1 1GHZ 211FCLGA
Packaging: Bulk
Part Status: Active
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
auf Bestellung 336 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
11+76.49 EUR
Mindestbestellmenge: 11
74CBTLV3257D,118 74CBTLV3257.pdf
74CBTLV3257D,118
Hersteller: NXP Semiconductors
Description: NEXPERIA 74CBTLV3257 - QUAD 1-OF
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 1:2
Type: Multiplexer/Demultiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Active
auf Bestellung 2400 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2400+0.42 EUR
Mindestbestellmenge: 2400
MCIMX6Q4AVT10AE
Hersteller: NXP Semiconductors
Description: MCIMX6Q4AVT10AE - i.MX 6 series
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MCIMX6Q5EZK08AD PHGL-S-A0006627490-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Bulk
Part Status: Active
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 258 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
4+186.04 EUR
Mindestbestellmenge: 4
74LVC3G17GN,115 74LVC3G17.pdf
74LVC3G17GN,115
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-XSON (1.2x1)
Part Status: Active
auf Bestellung 78500 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1381+0.54 EUR
Mindestbestellmenge: 1381
PCA9430HKZ
Hersteller: NXP Semiconductors
Description: RF Evaluation/Development Kits
Packaging: Bulk
Part Status: Active
auf Bestellung 34988 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
198+3.7 EUR
Mindestbestellmenge: 198
PMEG100T20ELPX
Hersteller: NXP Semiconductors
Description: PMEG100T20ELP - 100 V, 2 A low l
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 12 ns
Technology: Schottky
Capacitance @ Vr, F: 200pF @ 1V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: SOD-128/CFP5
Operating Temperature - Junction: 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 2 A
Current - Reverse Leakage @ Vr: 1.25 µA @ 100 V
auf Bestellung 7781 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
3000+0.26 EUR
Mindestbestellmenge: 3000
SPC5748GK0AMMJ6 PHGL-S-A0004670910-1.pdf?t.download=true&u=5oefqw
SPC5748GK0AMMJ6
Hersteller: NXP Semiconductors
Description: TRIPLE CORE, 6M FLASH, 768K RAM,
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 1.32V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
auf Bestellung 553 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
7+103.21 EUR
Mindestbestellmenge: 7
MC34GD3000EP MC33GD3000.pdf
Hersteller: NXP Semiconductors
Description: GD3000 - Brushless DC Motor Gate
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: SPI
Operating Temperature: -20°C ~ 105°C (TA)
Output Configuration: Half Bridge (3)
Voltage - Supply: 6V ~ 58V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 6V ~ 58V
Supplier Device Package: 56-QFN (8x8)
Motor Type - Stepper: Multiphase
Motor Type - AC, DC: Brushless DC (BLDC)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 208 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
93+7.75 EUR
Mindestbestellmenge: 93
BZX79-C36143 BZX79.pdf
BZX79-C36143
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA BZX79-C36 - ZENER D
Packaging: Bulk
Part Status: Active
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Produkt ist nicht verfügbar
KC912DG128CCPVE
KC912DG128CCPVE
Hersteller: NXP Semiconductors
Description: MC912DG128CCPVE - Microcontrolle
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
NT2H1611G0DA8J NTAG213_215_216.pdf
Hersteller: NXP Semiconductors
Description: NT2H1611G0DA8 - NTAG NFC Forum T
Packaging: Bulk
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: PLLMC
Part Status: Active
auf Bestellung 22951 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
713+1.01 EUR
Mindestbestellmenge: 713
LX2080XE72232B LX2160XE72232B.pdf?t.download=true&u=axiww2
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ LX 2.2GHZ 1517BGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4 SDRAM
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
auf Bestellung 744 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1+1517.96 EUR
LX2120SE72029B
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ LX 2GHZ 1517FCPBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4 SDRAM
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1+1440.5 EUR
LX2160SC72232B
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4 SDRAM
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
auf Bestellung 17 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1+2033.59 EUR
BGU8H1X PHGL-S-A0005068069-1.pdf?t.download=true&u=5oefqw
BGU8H1X
Hersteller: NXP Semiconductors
Description: BGU8H1 - SiGe:C Low Noise Amplif
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13dB
Current - Supply: 5mA
Noise Figure: 0.9dB
P1dB: -3dBm
Test Frequency: 3.35GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 1873853 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1797+0.41 EUR
Mindestbestellmenge: 1797
74LVC1GU04GN,132 PHGLS27066-1.pdf?t.download=true&u=5oefqw
74LVC1GU04GN,132
Hersteller: NXP Semiconductors
Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 3750 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
3750+0.24 EUR
Mindestbestellmenge: 3750
LPC2929FBD144,551
Hersteller: NXP Semiconductors
Description: LPC2929 - ARM9 microcontroller w
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 104
Produkt ist nicht verfügbar
LPC4076FBD144E PHGLS25790-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 109
auf Bestellung 626 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
32+22.66 EUR
Mindestbestellmenge: 32
LPC4074FBD144,551 PHGLS25790-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 109
auf Bestellung 623 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
41+18.01 EUR
Mindestbestellmenge: 41
LPC4078FBD144,551 PHGLS25790-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 109
auf Bestellung 2528 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
30+23.82 EUR
Mindestbestellmenge: 30
PN7360AUEV/C300Y
Hersteller: NXP Semiconductors
Description: PN7360AUEV - NFC Cortex®
Packaging: Bulk
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
40+19.68 EUR
Mindestbestellmenge: 40
PUMH9/ZL165
Hersteller: NXP Semiconductors
Description: Nexperia PUMH9 Small Signal Bipo
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 2 NPN - Pre-Biased
Power - Max: 200mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Frequency - Transition: 230MHz
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 47kOhm
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
LPC2917FBD144/01/,
LPC2917FBD144/01/,
Hersteller: NXP Semiconductors
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 88K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM968E-S
Data Converters: A/D 16x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 108
Produkt ist nicht verfügbar
LPC2921FBD100,551 PHGLS20650-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 16x8b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 60
auf Bestellung 287 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
64+11.24 EUR
Mindestbestellmenge: 64
2PD2150,115 PHGLS14575-1.pdf?t.download=true&u=5oefqw
2PD2150,115
Hersteller: NXP Semiconductors
Description: NEXPERIA 2PD2150 - POWER BIPOLAR
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 100mA, 2A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 100mA, 2V
Frequency - Transition: 220MHz
Supplier Device Package: SOT-89
Part Status: Active
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 20 V
Power - Max: 2 W
auf Bestellung 8026 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
4187+0.18 EUR
Mindestbestellmenge: 4187
LPC1112FDH28/102:5
LPC1112FDH28/102:5
Hersteller: NXP Semiconductors
Description: LPC1112 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
auf Bestellung 8647 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
181+4.32 EUR
Mindestbestellmenge: 181
LPC1114JBD48/303QL PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114JBD48/303QL
Hersteller: NXP Semiconductors
Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
auf Bestellung 220 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
100+7.25 EUR
Mindestbestellmenge: 100
LPC1112FHI33/102,5
LPC1112FHI33/102,5
Hersteller: NXP Semiconductors
Description: LPC1112 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
auf Bestellung 2351 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
158+4.94 EUR
Mindestbestellmenge: 158
LPC1114LVFHN24/103 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114LVFHN24/103
Hersteller: NXP Semiconductors
Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 4x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 20
Connectivity: I2C, SPI, SSP, UART/USART
auf Bestellung 964 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
151+4.8 EUR
Mindestbestellmenge: 151
LPC1112FHN24/202J
LPC1112FHN24/202J
Hersteller: NXP Semiconductors
Description: LPC1112 - Arm Cortex -M0 Cores M
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 19
auf Bestellung 5684 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
163+4.81 EUR
Mindestbestellmenge: 163
74AUP2G04GM,132 PHGLS24263-1.pdf?t.download=true&u=5oefqw
74AUP2G04GM,132
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP2G04GM - INVERTER,
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (1.45x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
auf Bestellung 4094840 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
3518+0.23 EUR
Mindestbestellmenge: 3518
74AUP3G04GN,115 PHGLS25965-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP3G04GN - INVERTER,
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 8-XSON (1.2x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 500 nA
auf Bestellung 55000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
877+0.88 EUR
Mindestbestellmenge: 877
1N4738A,133 1N4728A_SER.pdf
1N4738A,133
Hersteller: NXP Semiconductors
Description: NEXPERIA 1N4738A - ZENER DIODE,
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 4.5 Ohms
Supplier Device Package: DO-41
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 6 V
auf Bestellung 132963 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
9043+0.072 EUR
Mindestbestellmenge: 9043
74HC240DB,118 PHGLS28497-1.pdf?t.download=true&u=5oefqw
74HC240DB,118
Hersteller: NXP Semiconductors
Description: IC BUFFER INVERT 6V 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
Part Status: Active
auf Bestellung 3360 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1076+0.67 EUR
Mindestbestellmenge: 1076
88W8987-A2-NYEA/AZ
Hersteller: NXP Semiconductors
Description: 88W8987 - RF Transceiver (Board
Packaging: Bulk
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Data Rate (Max): 433Mbps
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Part Status: Active
auf Bestellung 10000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
35+20.6 EUR
Mindestbestellmenge: 35
74AUP2G241DC,125 PHGLS26016-1.pdf?t.download=true&u=5oefqw
74AUP2G241DC,125
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 8VSSOP
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-VSSOP
Part Status: Active
auf Bestellung 35459 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1815+0.44 EUR
Mindestbestellmenge: 1815
74AUP1G17GN,132 PHGL-S-A0000283103-1.pdf?t.download=true&u=5oefqw
74AUP1G17GN,132
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
auf Bestellung 5000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1920+0.38 EUR
Mindestbestellmenge: 1920
PMEG2015EA115 PMEG2015EA.pdf
PMEG2015EA115
Hersteller: NXP Semiconductors
Description: DIODE SCHOTTKY 20V 1.5A SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Current - Average Rectified (Io): 1.5A
Supplier Device Package: SOD-323
Operating Temperature - Junction: -65°C ~ 125°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 660 mV @ 1.5 A
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Produkt ist nicht verfügbar
TDA5231XUMA1 TDA5230,31.pdf
TDA5231XUMA1
Hersteller: NXP Semiconductors
Description: TDA52WireleContrReceiver
Features: RSSI Equipped
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 302MHz ~ 320MHz
Modulation or Protocol: ASK, FSK
Data Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
Applications: RKE, Security Systems, TPMS
Data Rate (Max): 20kbps
Antenna Connector: Not Included
Supplier Device Package: PG-TSSOP-28-1
Part Status: Obsolete
auf Bestellung 6632 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
143+5.49 EUR
Mindestbestellmenge: 143
PMDXB600UNEL/S500Z
Hersteller: NXP Semiconductors
Description: PMDXB600UNEL - N Channel MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MRF6VP11KGSR5 FSCLS07342-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230-4S GW
Current Rating (Amps): 100µA
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 150MHz
Configuration: 2 N-Channel
Power - Output: 1000W
Gain: 26dB @ 130MHz
Technology: LDMOS (Dual)
Supplier Device Package: NI-1230-4S GULL
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
auf Bestellung 2000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2+705.73 EUR
Mindestbestellmenge: 2
BZX884-C12,315 PHGLS19465-1.pdf?t.download=true&u=5oefqw
BZX884-C12,315
Hersteller: NXP Semiconductors
Description: NEXPERIA BZX884-C12 - ZENER DIOD
Tolerance: ±5%
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
auf Bestellung 18159 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
18159+0.048 EUR
Mindestbestellmenge: 18159
MIMX8ML4DVNLZAB
Hersteller: NXP Semiconductors
Description: IC MPU I.MX8M 1.8GHZ 486LFBGA
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Part Status: Active
Additional Interfaces: CANbus, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 9632 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
9+85.66 EUR
Mindestbestellmenge: 9
MIMX8QM6CVUFFAB
Hersteller: NXP Semiconductors
Description: IC MPU I.MX8Q 264MHZ 1313FCPBGA
Packaging: Bulk
Package / Case: 1313-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz, 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1313-FCPBGA (29x29)
Ethernet: 1Gbps (2)
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
auf Bestellung 44 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2+458.85 EUR
Mindestbestellmenge: 2
MIMX8QP6AVUFFAB
Hersteller: NXP Semiconductors
Description: IC MPU I.MX8Q 266MHZ 1313FCPBGA
Packaging: Bulk
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Number of Cores/Bus Width: 7 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: LPDDR4
Graphics Acceleration: Yes
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Part Status: Active
Package / Case: 1313-BBGA, FCBGA
Supplier Device Package: 1313-FCPBGA (29x29)
Speed: 1.6GHz, 1.26GHz, 266MHz
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A72, Arm Cortex®-M4F
Ethernet: 1Gbps (2)
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Additional Interfaces: CANbus, I2C, SPI, UART
auf Bestellung 180 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2+469.91 EUR
Mindestbestellmenge: 2
74LV74PW,118 74LV74.pdf
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 80 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 110 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 3969 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2845+0.29 EUR
Mindestbestellmenge: 2845
MC10XS3535JHFK www.nxp.com
Hersteller: NXP Semiconductors
Description: MC10XS3535JHFK - 12 V Automotive
Packaging: Bulk
Features: Slew Rate Controlled
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 5
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 55mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 6V ~ 28V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Ratio - Input:Output: 1:5
Supplier Device Package: 24-PQFN (12x12)
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Over Temperature, Reverse Battery, UVLO
Produkt ist nicht verfügbar
MC35XS3500HFK MC35XS3500.pdf
Hersteller: NXP Semiconductors
Description: MC35XS3500HFK - 12 V Automotive
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Bulk
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 5
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 35mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 6V ~ 28V
Voltage - Supply (Vcc/Vdd): 6V ~ 28V
Current - Output (Max): 65mA
Ratio - Input:Output: 1:5
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Battery, UVLO
Part Status: Obsolete
Produkt ist nicht verfügbar
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