Produkte > NXP SEMICONDUCTORS > Alle Produkte des Herstellers NXP SEMICONDUCTORS (56197) > Seite 52 nach 937
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74LVC257ADB,112 | NXP Semiconductors |
 Description: NEXPERIA 74LVC257ADB - MULTIPLEXPackaging: Bulk Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 4 x 2:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.2V ~ 3.6V Independent Circuits: 1 Current - Output High, Low: 24mA, 24mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP Part Status: Active |
auf Bestellung 6102 Stücke: Lieferzeit 21-28 Tag (e) |
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74LVC126ADB,118 | NXP Semiconductors |
Description: IC BUFFER NON-INVERT 3.6V 14SSOP Packaging: Bulk Package / Case: 14-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.2V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: 24mA, 24mA Supplier Device Package: 14-SSOP Part Status: Active |
auf Bestellung 6000 Stücke: Lieferzeit 21-28 Tag (e) |
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PDTC143ET,235 | NXP Semiconductors |
Description: TRANS PREBIAS NPN 50V SOT23 Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V Supplier Device Package: SOT-23 Part Status: Active Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Resistor - Base (R1): 4.7 kOhms Resistor - Emitter Base (R2): 4.7 kOhms |
auf Bestellung 380000 Stücke: Lieferzeit 21-28 Tag (e) |
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74LVC1G10GN,132 | NXP Semiconductors |
Description: IC GATE NAND Packaging: Bulk Part Status: Active |
auf Bestellung 189790 Stücke: Lieferzeit 21-28 Tag (e) |
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PDTD113EQAZ | NXP Semiconductors |
Description: TRANS PREBIAS 50V 500MA Packaging: Bulk Part Status: Active |
auf Bestellung 30000 Stücke: Lieferzeit 21-28 Tag (e) |
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| S2ZMMBZ27VALT1G | NXP Semiconductors |
Description: S2ZMMBZ - ZEN SOT23 REG .225W SP Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| BZV55-B27,115 | NXP Semiconductors |
Description: NEXPERIA BZV55-B27 - ZENER DIODE Packaging: Bulk Tolerance: ±2% Package / Case: DO-213AC, MINI-MELF, SOD-80 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 200°C Voltage - Zener (Nom) (Vz): 27 V Impedance (Max) (Zzt): 80 Ohms Supplier Device Package: LLDS; MiniMelf Part Status: Active Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V |
auf Bestellung 125900 Stücke: Lieferzeit 21-28 Tag (e) |
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| MC10XS3435BHFKR2 | NXP Semiconductors |
Description: MC10XS3435 - 12 V Automotive Ext Packaging: Bulk Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Package / Case: 24-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 4 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: High Side Rds On (Typ): 10mOhm, 35mOhm Input Type: Non-Inverting Voltage - Load: 6V ~ 20V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 6A Ratio - Input:Output: 1:1 Supplier Device Package: 24-PQFN (12x12) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Part Status: Obsolete |
auf Bestellung 1175 Stücke: Lieferzeit 21-28 Tag (e) |
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74HCT365DB,112 | NXP Semiconductors |
Description: IC BUFFER NON-INVERT 5.5V 16SSOP Packaging: Bulk Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 6 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 16-SSOP Part Status: Active |
auf Bestellung 10583 Stücke: Lieferzeit 21-28 Tag (e) |
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| BAS321135 | NXP Semiconductors |
Description: NOW NEXPERIA BAS321 - RECTIFIER Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| BZX79-B15143 | NXP Semiconductors |
Description: NEXPERIA ZENER DIODE, 15V, 2%, 0 Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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BC859B,215 | NXP Semiconductors |
Description: NEXPERIA BC859B - SMALL SIGNAL B Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V Frequency - Transition: 100MHz Supplier Device Package: TO-236AB Part Status: Active Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 30 V Power - Max: 250 mW Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 9498000 Stücke: Lieferzeit 21-28 Tag (e) |
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| MC908QY4AMDWE | NXP Semiconductors |
Description: MC908QY - MICROCONTROLLER, 8-BIT Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| MC908QY4AMDTE | NXP Semiconductors |
Description: MC908QY - MICROCONTROLLER, 8-BIT Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| BSP32,115 | NXP Semiconductors |
Description: NOW NEXPERIA BSP32 - POWER BIPOL Packaging: Bulk Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 100mA, 5V Frequency - Transition: 100MHz Supplier Device Package: SOT-223 Part Status: Active Current - Collector (Ic) (Max): 1 A Voltage - Collector Emitter Breakdown (Max): 80 V Power - Max: 1.3 W |
Produkt ist nicht verfügbar |
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| BSP32,115 | NXP Semiconductors |
Description: NOW NEXPERIA BSP32 - POWER BIPOL Packaging: Bulk Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 100mA, 5V Frequency - Transition: 100MHz Supplier Device Package: SOT-223 Part Status: Active Current - Collector (Ic) (Max): 1 A Voltage - Collector Emitter Breakdown (Max): 80 V Power - Max: 1.3 W |
Produkt ist nicht verfügbar |
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| NZX24C,133 | NXP Semiconductors |
Description: NEXPERIA NZX24C - ZENER DIODE, 2 Packaging: Bulk Tolerance: ±2% Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C Voltage - Zener (Nom) (Vz): 24 V Impedance (Max) (Zzt): 70 Ohms Supplier Device Package: ALF2 Part Status: Active Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V |
auf Bestellung 249544 Stücke: Lieferzeit 21-28 Tag (e) |
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| MC9S08AW60MFGE | NXP Semiconductors |
Description: MC9S08AW - Microcontroller, 8-Bi Packaging: Bulk Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 34 |
auf Bestellung 780 Stücke: Lieferzeit 21-28 Tag (e) |
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| BUK9275-100A,118 | NXP Semiconductors |
Description: NOW NEXPERIA BUK9275-100A - 21.7 Packaging: Bulk Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 21.7A (Tc) Rds On (Max) @ Id, Vgs: 72mOhm @ 10A, 10V Power Dissipation (Max): 88W (Tc) Vgs(th) (Max) @ Id: 2V @ 1mA Supplier Device Package: DPAK Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±10V Drain to Source Voltage (Vdss): 100 V Input Capacitance (Ciss) (Max) @ Vds: 1690 pF @ 25 V |
Produkt ist nicht verfügbar |
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| MIMXRT1051DVL6A | NXP Semiconductors |
Description: MXRT1050 - i.MX RT1050 Crossover Packaging: Bulk Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz Program Memory Size: 96KB (96K x 8) RAM Size: 512K x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-LFBGA (10x10) Part Status: Obsolete Number of I/O: 127 |
auf Bestellung 700 Stücke: Lieferzeit 21-28 Tag (e) |
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| MIMXRT106FDVL6A | NXP Semiconductors |
Description: MXRT1060 - I.MX RT1060 CROSSOVER Packaging: Bulk Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz Program Memory Size: 128KB (128K x 8) RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Part Status: Obsolete Number of I/O: 127 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| 74LVC2G53GS,115 | NXP Semiconductors |
Description: 74LVC2G53 - 2-CHANNEL ANALOG MUL Packaging: Bulk Package / Case: 8-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 10Ohm -3db Bandwidth: 300MHz Supplier Device Package: 8-XSON (1.35x1) Voltage - Supply, Single (V+): 1.65V ~ 5.5V Charge Injection: 7.5pC Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Switch Time (Ton, Toff) (Max): 3.8ns, 3.8ns Channel Capacitance (CS(off), CD(off)): 6pF Current - Leakage (IS(off)) (Max): 5µA Part Status: Active Number of Circuits: 1 |
auf Bestellung 76494 Stücke: Lieferzeit 21-28 Tag (e) |
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| LPC1102LVUKZ | NXP Semiconductors |
Description: LPC1102 - Scalable 32-bit Microc Packaging: Bulk Package / Case: 25-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 6x8b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V Connectivity: I²C, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 25-WLCSP (2.17x2.32) Part Status: Active Number of I/O: 21 |
auf Bestellung 6651 Stücke: Lieferzeit 21-28 Tag (e) |
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SAF7741HV/N125ZK | NXP Semiconductors |
Description: SAF7741HV - CAR RADIO DIGITAL SI Packaging: Bulk Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Interface: I²C, I²S, LSB, SPDIF Type: Car Signal Processor Operating Temperature: -40°C ~ 85°C (TA) Voltage - I/O: 3.30V Voltage - Core: 1.80V Clock Rate: 44.1kHz, 48kHz, 96kHz Supplier Device Package: 144-HLQFP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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74AHCT2G241GD,125 | NXP Semiconductors |
Description: IC BUFFER NON-INVERT 5.5V 8XSON Packaging: Bulk Package / Case: 8-XFDFN Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 8-XSON (2x3) Part Status: Active |
auf Bestellung 25005 Stücke: Lieferzeit 21-28 Tag (e) |
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74HCT74DB,112 | NXP Semiconductors |
Description: IC FF D-TYPE DUAL 1BIT 14SSOP Packaging: Bulk Package / Case: 14-SSOP (0.209", 5.30mm Width) Output Type: Complementary Mounting Type: Surface Mount Number of Elements: 2 Function: Set(Preset) and Reset Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 80 µA Current - Output High, Low: 4mA, 4mA Trigger Type: Positive Edge Clock Frequency: 54 MHz Input Capacitance: 3.5 pF Supplier Device Package: 14-SSOP Max Propagation Delay @ V, Max CL: 53ns @ 4.5V, 50pF Part Status: Active Number of Bits per Element: 1 |
auf Bestellung 13084 Stücke: Lieferzeit 21-28 Tag (e) |
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MK21DX128AVMC5 | NXP Semiconductors |
Description: MK21DX128AVMC5 - Kinetis K21: 50 Packaging: Bulk Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 1x16b SAR; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Part Status: Active Number of I/O: 64 |
auf Bestellung 161 Stücke: Lieferzeit 21-28 Tag (e) |
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74LVC1G3157GN,132 | NXP Semiconductors |
Description: NEXPERIA 74LVC1G3157GN - SINGLE- Packaging: Bulk Part Status: Active |
auf Bestellung 594938 Stücke: Lieferzeit 21-28 Tag (e) |
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JN5168-001-M00Z | NXP Semiconductors |
Description: RF TXRX MOD 802.15.4 TRC ANT SMD Packaging: Bulk Package / Case: 40-VFQFN Exposed Pad Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2V ~ 3.6V Power - Output: 2.5dBm Protocol: Zigbee® Current - Receiving: 17mA Current - Transmitting: 15.3mA Antenna Type: Integrated, Trace Modulation: O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete |
auf Bestellung 469 Stücke: Lieferzeit 21-28 Tag (e) |
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74AHC1G04GW-Q100125 | NXP Semiconductors |
Description: NEXPERIA 74AHC1G04GW-Q100 - INVE Packaging: Bulk |
Produkt ist nicht verfügbar |
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| 74AHC541PW-Q100118 | NXP Semiconductors |
Description: NEXPERIA 74AHC541PW-Q100 - BUS D Packaging: Bulk |
Produkt ist nicht verfügbar |
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74HCT4040PW,112 | NXP Semiconductors |
Description: NEXPERIA 74HCT4040PW - BINARY CO Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C (TA) Direction: Up Trigger Type: Negative Edge Supplier Device Package: 16-TSSOP Voltage - Supply: 4.5 V ~ 5.5 V Count Rate: 79 MHz Number of Bits per Element: 12 |
auf Bestellung 18365 Stücke: Lieferzeit 21-28 Tag (e) |
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KTY82/151,215 | NXP Semiconductors |
Description: KTY82/151 - Silicon temperature Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Supplier Device Package: TO-236AB Resistance @ 25°C: 975 Ohms |
auf Bestellung 1959 Stücke: Lieferzeit 21-28 Tag (e) |
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| S912XDG128F2VAA | NXP Semiconductors |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Bulk Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
auf Bestellung 84 Stücke: Lieferzeit 21-28 Tag (e) |
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| BC847RA147 | NXP Semiconductors |
Description: BC1NPN/PGENERAL-PURPODOUBTRANSIS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| MC74HC42D | NXP Semiconductors |
Description: 74HBDECIMDECOD1-OF-10 Packaging: Bulk |
Produkt ist nicht verfügbar |
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| SZMMSZ5266BT1G | NXP Semiconductors |
Description: SZMMSZENDIO5SOD-123 Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: SOD-123 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Voltage - Zener (Nom) (Vz): 68 V Impedance (Max) (Zzt): 230 Ohms Supplier Device Package: SOD-123 Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 100 nA @ 52 V |
Produkt ist nicht verfügbar |
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| S32V-SONYCAM | NXP Semiconductors |
Description: S32V - MIPI CAMERAS AND DE-SERIA Packaging: Bulk For Use With/Related Products: S32V234 Accessory Type: Camera |
auf Bestellung 4 Stücke: Lieferzeit 21-28 Tag (e) |
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| S912XEG128J2MAA | NXP Semiconductors |
Description: MC9S12XE - KIPPER-16-BIT MCU, 12 Packaging: Bulk Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 |
Produkt ist nicht verfügbar |
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| MPC8377VRAGDA | NXP Semiconductors |
Description: IC MPU MPC83XX 400MHZ PBGA689 Packaging: Bulk Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e300c4s Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No SATA: SATA 3Gbps (2) |
Produkt ist nicht verfügbar |
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| MPC875CVR66 | NXP Semiconductors |
Description: IC MPU MPC87XX 66MHZ 256BGA Packaging: Bulk Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography |
auf Bestellung 43 Stücke: Lieferzeit 21-28 Tag (e) |
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| MPC860DPVR66D4 | NXP Semiconductors |
Description: IC MPU MPC86XX 66MHZ 357BGA Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
auf Bestellung 880 Stücke: Lieferzeit 21-28 Tag (e) |
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| AFT20P060-4NR3 | NXP Semiconductors |
Description: RF MOSFET LDMOS 28V OM780-4 Packaging: Bulk Package / Case: OM-780-4L Mounting Type: Surface Mount Frequency: 2.17GHz Configuration: 2 N-Channel Power - Output: 60W Gain: 18.9dB Technology: LDMOS (Dual) Supplier Device Package: OM-780-4L Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 450 mA |
auf Bestellung 2000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BC847BS/DG/B3115 | NXP Semiconductors |
Description: BCSMASIGNBIPOLTRANSISTO0.1452-EL Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| RMLV1616AGSD-5S2#AA1 | NXP Semiconductors |
Description: RMLV161616ADVANCLPSR(WO16W8BIT) Packaging: Tray |
Produkt ist nicht verfügbar |
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PMEG2020EJ/ZL135 | NXP Semiconductors |
Description: PMEG2020EJ - Nexperia PMEG2020EJ Packaging: Bulk Package / Case: SC-90, SOD-323F Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Technology: Schottky Capacitance @ Vr, F: 50pF @ 5V, 1MHz Current - Average Rectified (Io): 2A Supplier Device Package: SOD-323F Operating Temperature - Junction: 150°C Voltage - DC Reverse (Vr) (Max): 20 V Voltage - Forward (Vf) (Max) @ If: 525 mV @ 2 A Current - Reverse Leakage @ Vr: 200 µA @ 20 V |
Produkt ist nicht verfügbar |
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| LPC2294U029 | NXP Semiconductors |
Description: LPC2294 - Arm7, 32-Bit RISC Micr Packaging: Bulk |
auf Bestellung 6327 Stücke: Lieferzeit 21-28 Tag (e) |
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| 74HC125DAUJ | NXP Semiconductors |
Description: 74HC1BDRIVEHC/SERIE4-FUN1-BITROU Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74HC03D,653 | NXP Semiconductors |
Description: IC GATE NAND Packaging: Bulk |
auf Bestellung 41990 Stücke: Lieferzeit 21-28 Tag (e) |
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74AHCT14D,112 | NXP Semiconductors |
Description: IC INVERTER Packaging: Bulk |
auf Bestellung 83845 Stücke: Lieferzeit 21-28 Tag (e) |
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| BC860CW/ZL115 | NXP Semiconductors |
Description: BC8PGENERPURPOTRANSISTORS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| 74HC2G34GW,125 | NXP Semiconductors |
Description: IC BUFFER NON-INVERT 6V 6TSSOP Packaging: Bulk Package / Case: 6-TSSOP, SC-88, SOT-363 Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 1 Current - Output High, Low: 5.2mA, 5.2mA Supplier Device Package: SOT-363 |
Produkt ist nicht verfügbar |
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| SIT8924AA-23-33N-30.000000G | NXP Semiconductors |
Description: SIT89LPOWPROGRAMMABOSCILLATOAUTE Packaging: Bulk |
Produkt ist nicht verfügbar |
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| SIT8924AA-23-18E-27.000000G | NXP Semiconductors |
Description: SIT8LPOWPROGRAMMABOSCILLATOAUTEM Packaging: Bulk |
Produkt ist nicht verfügbar |
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| 74HC73PW112 | NXP Semiconductors |
Description: IC FF JK TYPE DUAL 1BIT 14TSSOP Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Output Type: Complementary Mounting Type: Surface Mount Number of Elements: 2 Function: Reset Type: JK Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 4 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Negative Edge Clock Frequency: 83 MHz Input Capacitance: 3.5 pF Supplier Device Package: 14-TSSOP Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF Number of Bits per Element: 1 |
Produkt ist nicht verfügbar |
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 |
BZV85-C3V9,113 | NXP Semiconductors |
Description: NEXPERIA BZV85-C3V9 - ZENER DIOD Packaging: Bulk Tolerance: ±5% Package / Case: DO-204AL, DO-41, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 200°C Voltage - Zener (Nom) (Vz): 3.9 V Impedance (Max) (Zzt): 15 Ohms Supplier Device Package: DO-41 Power - Max: 1.3 W Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Current - Reverse Leakage @ Vr: 10 µA @ 1 V |
auf Bestellung 75000 Stücke: Lieferzeit 21-28 Tag (e) |
|
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| 74HCT04DAUJ | NXP Semiconductors |
Description: 74HCTINVERTEHSERIE6-FUN1-INPUCMO Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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 |
MC34717EPR2 | NXP Semiconductors |
Description: MC34717 - Switch-Mode Power Supp Packaging: Bulk Package / Case: 26-VFQFN Exposed Pad Voltage - Output: 0.7V ~ 3.6V Mounting Type: Surface Mount Number of Outputs: 2 Voltage - Input: 3V ~ 6V Operating Temperature: -40°C ~ 85°C Applications: Converter, DDR Supplier Device Package: 26-QFN (5x5) |
auf Bestellung 668 Stücke: Lieferzeit 21-28 Tag (e) |
|
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| MC908JK3EMDWE | NXP Semiconductors |
Description: MC9S08JK - MICROCONTROLLER, 8-BI Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: M68HC08 Data Converters: A/D 10x8b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LED, LVD, POR, PWM Supplier Device Package: 20-SOIC Number of I/O: 15 |
Produkt ist nicht verfügbar |
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 |
MC33790HEGR2 | NXP Semiconductors |
Description: IC DIST SYST INTERFACE 16SOIC Packaging: Bulk Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Type: Distributed System Interface (DSI) Supplier Device Package: 16-SOIC DigiKey Programmable: Not Verified |
auf Bestellung 1000 Stücke: Lieferzeit 21-28 Tag (e) |
|
| 74LVC257ADB,112 |
|
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC257ADB - MULTIPLEX
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
Description: NEXPERIA 74LVC257ADB - MULTIPLEX
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
auf Bestellung 6102 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1410+ | 0.55 EUR |
| 74LVC126ADB,118 |
|
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 14-SSOP
Part Status: Active
Description: IC BUFFER NON-INVERT 3.6V 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 14-SSOP
Part Status: Active
auf Bestellung 6000 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2150+ | 0.33 EUR |
| PDTC143ET,235 |
|
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS NPN 50V SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V
Supplier Device Package: SOT-23
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Description: TRANS PREBIAS NPN 50V SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V
Supplier Device Package: SOT-23
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
auf Bestellung 380000 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 13172+ | 0.048 EUR |
| 74LVC1G10GN,132 |
|
auf Bestellung 189790 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2882+ | 0.24 EUR |
| PDTD113EQAZ |
|
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS 50V 500MA
Packaging: Bulk
Part Status: Active
Description: TRANS PREBIAS 50V 500MA
Packaging: Bulk
Part Status: Active
auf Bestellung 30000 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 8219+ | 0.096 EUR |
| S2ZMMBZ27VALT1G |
Hersteller: NXP Semiconductors
Description: S2ZMMBZ - ZEN SOT23 REG .225W SP
Packaging: Bulk
Part Status: Active
Description: S2ZMMBZ - ZEN SOT23 REG .225W SP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| BZV55-B27,115 |
|
Hersteller: NXP Semiconductors
Description: NEXPERIA BZV55-B27 - ZENER DIODE
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: LLDS; MiniMelf
Part Status: Active
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Description: NEXPERIA BZV55-B27 - ZENER DIODE
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: LLDS; MiniMelf
Part Status: Active
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
auf Bestellung 125900 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 15000+ | 0.052 EUR |
| MC10XS3435BHFKR2 |
Hersteller: NXP Semiconductors
Description: MC10XS3435 - 12 V Automotive Ext
Packaging: Bulk
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 35mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Description: MC10XS3435 - 12 V Automotive Ext
Packaging: Bulk
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 35mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
auf Bestellung 1175 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 61+ | 12.92 EUR |
| 74HCT365DB,112 |
|
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SSOP
Part Status: Active
Description: IC BUFFER NON-INVERT 5.5V 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SSOP
Part Status: Active
auf Bestellung 10583 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 886+ | 0.82 EUR |
| BAS321135 |
|
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA BAS321 - RECTIFIER
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BAS321 - RECTIFIER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| BZX79-B15143 |
Hersteller: NXP Semiconductors
Description: NEXPERIA ZENER DIODE, 15V, 2%, 0
Packaging: Bulk
Part Status: Active
Description: NEXPERIA ZENER DIODE, 15V, 2%, 0
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| BC859B,215 |
|
Hersteller: NXP Semiconductors
Description: NEXPERIA BC859B - SMALL SIGNAL B
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-236AB
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 250 mW
Grade: Automotive
Qualification: AEC-Q101
Description: NEXPERIA BC859B - SMALL SIGNAL B
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-236AB
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 250 mW
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 9498000 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 13172+ | 0.048 EUR |
| MC908QY4AMDWE |
|
Hersteller: NXP Semiconductors
Description: MC908QY - MICROCONTROLLER, 8-BIT
Packaging: Bulk
Part Status: Active
Description: MC908QY - MICROCONTROLLER, 8-BIT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| MC908QY4AMDTE |
|
Hersteller: NXP Semiconductors
Description: MC908QY - MICROCONTROLLER, 8-BIT
Packaging: Bulk
Part Status: Active
Description: MC908QY - MICROCONTROLLER, 8-BIT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| BSP32,115 |
|
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA BSP32 - POWER BIPOL
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 100mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-223
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 1.3 W
Description: NOW NEXPERIA BSP32 - POWER BIPOL
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 100mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-223
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 1.3 W
Produkt ist nicht verfügbar
| BSP32,115 |
|
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA BSP32 - POWER BIPOL
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 100mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-223
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 1.3 W
Description: NOW NEXPERIA BSP32 - POWER BIPOL
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 100mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-223
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 1.3 W
Produkt ist nicht verfügbar
| NZX24C,133 |
|
Hersteller: NXP Semiconductors
Description: NEXPERIA NZX24C - ZENER DIODE, 2
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 70 Ohms
Supplier Device Package: ALF2
Part Status: Active
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V
Description: NEXPERIA NZX24C - ZENER DIODE, 2
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 70 Ohms
Supplier Device Package: ALF2
Part Status: Active
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V
auf Bestellung 249544 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 15000+ | 0.052 EUR |
| MC9S08AW60MFGE |
|
Hersteller: NXP Semiconductors
Description: MC9S08AW - Microcontroller, 8-Bi
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
Description: MC9S08AW - Microcontroller, 8-Bi
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
auf Bestellung 780 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 34+ | 21.62 EUR |
| BUK9275-100A,118 |
|
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA BUK9275-100A - 21.7
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 21.7A (Tc)
Rds On (Max) @ Id, Vgs: 72mOhm @ 10A, 10V
Power Dissipation (Max): 88W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: DPAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 1690 pF @ 25 V
Description: NOW NEXPERIA BUK9275-100A - 21.7
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 21.7A (Tc)
Rds On (Max) @ Id, Vgs: 72mOhm @ 10A, 10V
Power Dissipation (Max): 88W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: DPAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 1690 pF @ 25 V
Produkt ist nicht verfügbar
| MIMXRT1051DVL6A |
Hersteller: NXP Semiconductors
Description: MXRT1050 - i.MX RT1050 Crossover
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Obsolete
Number of I/O: 127
Description: MXRT1050 - i.MX RT1050 Crossover
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Obsolete
Number of I/O: 127
auf Bestellung 700 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 47+ | 16.72 EUR |
| MIMXRT106FDVL6A |
Hersteller: NXP Semiconductors
Description: MXRT1060 - I.MX RT1060 CROSSOVER
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Obsolete
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: MXRT1060 - I.MX RT1060 CROSSOVER
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Obsolete
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 74LVC2G53GS,115 |
|
Hersteller: NXP Semiconductors
Description: 74LVC2G53 - 2-CHANNEL ANALOG MUL
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 8-XSON (1.35x1)
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Switch Time (Ton, Toff) (Max): 3.8ns, 3.8ns
Channel Capacitance (CS(off), CD(off)): 6pF
Current - Leakage (IS(off)) (Max): 5µA
Part Status: Active
Number of Circuits: 1
Description: 74LVC2G53 - 2-CHANNEL ANALOG MUL
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 8-XSON (1.35x1)
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Switch Time (Ton, Toff) (Max): 3.8ns, 3.8ns
Channel Capacitance (CS(off), CD(off)): 6pF
Current - Leakage (IS(off)) (Max): 5µA
Part Status: Active
Number of Circuits: 1
auf Bestellung 76494 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3297+ | 0.23 EUR |
| LPC1102LVUKZ |
|
Hersteller: NXP Semiconductors
Description: LPC1102 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I²C, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 25-WLCSP (2.17x2.32)
Part Status: Active
Number of I/O: 21
Description: LPC1102 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I²C, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 25-WLCSP (2.17x2.32)
Part Status: Active
Number of I/O: 21
auf Bestellung 6651 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 110+ | 6.77 EUR |
| SAF7741HV/N125ZK |
Hersteller: NXP Semiconductors
Description: SAF7741HV - CAR RADIO DIGITAL SI
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, LSB, SPDIF
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Clock Rate: 44.1kHz, 48kHz, 96kHz
Supplier Device Package: 144-HLQFP
Part Status: Obsolete
Description: SAF7741HV - CAR RADIO DIGITAL SI
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, LSB, SPDIF
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Clock Rate: 44.1kHz, 48kHz, 96kHz
Supplier Device Package: 144-HLQFP
Part Status: Obsolete
Produkt ist nicht verfügbar
| 74AHCT2G241GD,125 |
|
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
auf Bestellung 25005 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2049+ | 0.36 EUR |
| 74HCT74DB,112 |
|
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE DUAL 1BIT 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 80 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 54 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SSOP
Max Propagation Delay @ V, Max CL: 53ns @ 4.5V, 50pF
Part Status: Active
Number of Bits per Element: 1
Description: IC FF D-TYPE DUAL 1BIT 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 80 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 54 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SSOP
Max Propagation Delay @ V, Max CL: 53ns @ 4.5V, 50pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 13084 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1691+ | 0.43 EUR |
| MK21DX128AVMC5 |
|
Hersteller: NXP Semiconductors
Description: MK21DX128AVMC5 - Kinetis K21: 50
Packaging: Bulk
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 64
Description: MK21DX128AVMC5 - Kinetis K21: 50
Packaging: Bulk
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 64
auf Bestellung 161 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 41+ | 19.14 EUR |
| 74LVC1G3157GN,132 |
|
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC1G3157GN - SINGLE-
Packaging: Bulk
Part Status: Active
Description: NEXPERIA 74LVC1G3157GN - SINGLE-
Packaging: Bulk
Part Status: Active
auf Bestellung 594938 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2882+ | 0.24 EUR |
| JN5168-001-M00Z |
|
Hersteller: NXP Semiconductors
Description: RF TXRX MOD 802.15.4 TRC ANT SMD
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 17mA
Current - Transmitting: 15.3mA
Antenna Type: Integrated, Trace
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
Description: RF TXRX MOD 802.15.4 TRC ANT SMD
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 17mA
Current - Transmitting: 15.3mA
Antenna Type: Integrated, Trace
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
auf Bestellung 469 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 23+ | 31.81 EUR |
| 74AHC541PW-Q100118 |
|
Produkt ist nicht verfügbar
| 74HCT4040PW,112 |
|
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HCT4040PW - BINARY CO
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-TSSOP
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 79 MHz
Number of Bits per Element: 12
Description: NEXPERIA 74HCT4040PW - BINARY CO
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-TSSOP
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 79 MHz
Number of Bits per Element: 12
auf Bestellung 18365 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 747+ | 0.99 EUR |
| KTY82/151,215 |
|
Hersteller: NXP Semiconductors
Description: KTY82/151 - Silicon temperature
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: TO-236AB
Resistance @ 25°C: 975 Ohms
Description: KTY82/151 - Silicon temperature
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: TO-236AB
Resistance @ 25°C: 975 Ohms
auf Bestellung 1959 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 706+ | 1.03 EUR |
| S912XDG128F2VAA |
|
Hersteller: NXP Semiconductors
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 84 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 19+ | 38.51 EUR |
| BC847RA147 |
Hersteller: NXP Semiconductors
Description: BC1NPN/PGENERAL-PURPODOUBTRANSIS
Packaging: Tape & Reel (TR)
Description: BC1NPN/PGENERAL-PURPODOUBTRANSIS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
| MC74HC42D |
Produkt ist nicht verfügbar
| SZMMSZ5266BT1G |
|
Hersteller: NXP Semiconductors
Description: SZMMSZENDIO5SOD-123
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: SOD-123
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 68 V
Impedance (Max) (Zzt): 230 Ohms
Supplier Device Package: SOD-123
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 52 V
Description: SZMMSZENDIO5SOD-123
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: SOD-123
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 68 V
Impedance (Max) (Zzt): 230 Ohms
Supplier Device Package: SOD-123
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 52 V
Produkt ist nicht verfügbar
| S32V-SONYCAM |
Hersteller: NXP Semiconductors
Description: S32V - MIPI CAMERAS AND DE-SERIA
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
Description: S32V - MIPI CAMERAS AND DE-SERIA
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
auf Bestellung 4 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 643.54 EUR |
| S912XEG128J2MAA |
Hersteller: NXP Semiconductors
Description: MC9S12XE - KIPPER-16-BIT MCU, 12
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
Description: MC9S12XE - KIPPER-16-BIT MCU, 12
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
Produkt ist nicht verfügbar
| MPC8377VRAGDA |
|
Hersteller: NXP Semiconductors
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
| MPC875CVR66 |
Hersteller: NXP Semiconductors
Description: IC MPU MPC87XX 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Description: IC MPU MPC87XX 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
auf Bestellung 43 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 8+ | 99.79 EUR |
| MPC860DPVR66D4 |
Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC86XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
auf Bestellung 880 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 458.47 EUR |
| AFT20P060-4NR3 |
|
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: 2 N-Channel
Power - Output: 60W
Gain: 18.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: 2 N-Channel
Power - Output: 60W
Gain: 18.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
auf Bestellung 2000 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 8+ | 90.97 EUR |
| BC847BS/DG/B3115 |
Hersteller: NXP Semiconductors
Description: BCSMASIGNBIPOLTRANSISTO0.1452-EL
Packaging: Tape & Reel (TR)
Description: BCSMASIGNBIPOLTRANSISTO0.1452-EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
| RMLV1616AGSD-5S2#AA1 |
|
Produkt ist nicht verfügbar
| PMEG2020EJ/ZL135 |
Hersteller: NXP Semiconductors
Description: PMEG2020EJ - Nexperia PMEG2020EJ
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 50pF @ 5V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: SOD-323F
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 525 mV @ 2 A
Current - Reverse Leakage @ Vr: 200 µA @ 20 V
Description: PMEG2020EJ - Nexperia PMEG2020EJ
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 50pF @ 5V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: SOD-323F
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 525 mV @ 2 A
Current - Reverse Leakage @ Vr: 200 µA @ 20 V
Produkt ist nicht verfügbar
| LPC2294U029 |
auf Bestellung 6327 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 21+ | 38.06 EUR |
| 74HC125DAUJ |
Hersteller: NXP Semiconductors
Description: 74HC1BDRIVEHC/SERIE4-FUN1-BITROU
Packaging: Tape & Reel (TR)
Description: 74HC1BDRIVEHC/SERIE4-FUN1-BITROU
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
| 74HC03D,653 |
|
auf Bestellung 41990 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3694+ | 0.19 EUR |
| 74AHCT14D,112 |
|
auf Bestellung 83845 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2823+ | 0.26 EUR |
| BC860CW/ZL115 |
Produkt ist nicht verfügbar
| 74HC2G34GW,125 |
|
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 6V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: SOT-363
Description: IC BUFFER NON-INVERT 6V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: SOT-363
Produkt ist nicht verfügbar
| SIT8924AA-23-33N-30.000000G |
Produkt ist nicht verfügbar
| SIT8924AA-23-18E-27.000000G |
Produkt ist nicht verfügbar
| 74HC73PW112 |
|
Hersteller: NXP Semiconductors
Description: IC FF JK TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
Description: IC FF JK TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
Produkt ist nicht verfügbar
| BZV85-C3V9,113 |
|
Hersteller: NXP Semiconductors
Description: NEXPERIA BZV85-C3V9 - ZENER DIOD
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-41
Power - Max: 1.3 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
Description: NEXPERIA BZV85-C3V9 - ZENER DIOD
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-41
Power - Max: 1.3 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
auf Bestellung 75000 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 9043+ | 0.071 EUR |
| 74HCT04DAUJ |
Hersteller: NXP Semiconductors
Description: 74HCTINVERTEHSERIE6-FUN1-INPUCMO
Packaging: Tape & Reel (TR)
Description: 74HCTINVERTEHSERIE6-FUN1-INPUCMO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
| MC34717EPR2 |
|
Hersteller: NXP Semiconductors
Description: MC34717 - Switch-Mode Power Supp
Packaging: Bulk
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
Description: MC34717 - Switch-Mode Power Supp
Packaging: Bulk
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
auf Bestellung 668 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 61+ | 11.73 EUR |
| MC908JK3EMDWE |
|
Hersteller: NXP Semiconductors
Description: MC9S08JK - MICROCONTROLLER, 8-BI
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 10x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
Description: MC9S08JK - MICROCONTROLLER, 8-BI
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 10x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
Produkt ist nicht verfügbar
| MC33790HEGR2 |
Hersteller: NXP Semiconductors
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Distributed System Interface (DSI)
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Distributed System Interface (DSI)
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 65+ | 12.04 EUR |