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BGU8H1X BGU8H1X NXP Semiconductors PHGL-S-A0005068069-1.pdf?t.download=true&u=5oefqw Description: BGU8H1 - SiGe:C Low Noise Amplif
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13dB
Current - Supply: 5mA
Noise Figure: 0.9dB
P1dB: -3dBm
Test Frequency: 3.35GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 1873853 Stücke:
Lieferzeit 21-28 Tag (e)
1797+0.41 EUR
Mindestbestellmenge: 1797
74LVC1GU04GN,132 74LVC1GU04GN,132 NXP Semiconductors PHGLS27066-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 3750 Stücke:
Lieferzeit 21-28 Tag (e)
3750+0.24 EUR
Mindestbestellmenge: 3750
LPC2929FBD144,551 NXP Semiconductors Description: LPC2929 - ARM9 microcontroller w
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 104
Produkt ist nicht verfügbar
LPC4076FBD144E NXP Semiconductors PHGLS25790-1.pdf?t.download=true&u=5oefqw Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 109
auf Bestellung 626 Stücke:
Lieferzeit 21-28 Tag (e)
32+22.66 EUR
Mindestbestellmenge: 32
LPC4074FBD144,551 NXP Semiconductors PHGLS25790-1.pdf?t.download=true&u=5oefqw Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 109
auf Bestellung 623 Stücke:
Lieferzeit 21-28 Tag (e)
41+18.01 EUR
Mindestbestellmenge: 41
LPC4078FBD144,551 NXP Semiconductors PHGLS25790-1.pdf?t.download=true&u=5oefqw Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 109
auf Bestellung 2528 Stücke:
Lieferzeit 21-28 Tag (e)
30+23.82 EUR
Mindestbestellmenge: 30
PN7360AUEV/C300Y NXP Semiconductors Description: PN7360AUEV - NFC Cortex®
Packaging: Bulk
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 21-28 Tag (e)
40+19.68 EUR
Mindestbestellmenge: 40
PUMH9/ZL165 NXP Semiconductors Description: Nexperia PUMH9 Small Signal Bipo
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 2 NPN - Pre-Biased
Power - Max: 200mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Frequency - Transition: 230MHz
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 47kOhm
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
LPC2917FBD144/01/, LPC2917FBD144/01/, NXP Semiconductors Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 88K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM968E-S
Data Converters: A/D 16x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 108
Produkt ist nicht verfügbar
LPC2921FBD100,551 NXP Semiconductors PHGLS20650-1.pdf?t.download=true&u=5oefqw Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 16x8b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 60
auf Bestellung 287 Stücke:
Lieferzeit 21-28 Tag (e)
64+11.24 EUR
Mindestbestellmenge: 64
2PD2150,115 2PD2150,115 NXP Semiconductors PHGLS14575-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 2PD2150 - POWER BIPOLAR
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 100mA, 2A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 100mA, 2V
Frequency - Transition: 220MHz
Supplier Device Package: SOT-89
Part Status: Active
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 20 V
Power - Max: 2 W
auf Bestellung 8026 Stücke:
Lieferzeit 21-28 Tag (e)
3652+0.19 EUR
Mindestbestellmenge: 3652
LPC1114JBD48/303QL LPC1114JBD48/303QL NXP Semiconductors PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
auf Bestellung 220 Stücke:
Lieferzeit 21-28 Tag (e)
100+7.25 EUR
Mindestbestellmenge: 100
LPC1112FHI33/102,5 LPC1112FHI33/102,5 NXP Semiconductors Description: LPC1112 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
auf Bestellung 2351 Stücke:
Lieferzeit 21-28 Tag (e)
158+4.94 EUR
Mindestbestellmenge: 158
LPC1114LVFHN24/103 LPC1114LVFHN24/103 NXP Semiconductors PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 4x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 20
Connectivity: I2C, SPI, SSP, UART/USART
auf Bestellung 964 Stücke:
Lieferzeit 21-28 Tag (e)
151+4.8 EUR
Mindestbestellmenge: 151
LPC1112FHN24/202J LPC1112FHN24/202J NXP Semiconductors Description: LPC1112 - Arm Cortex -M0 Cores M
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 19
auf Bestellung 5684 Stücke:
Lieferzeit 21-28 Tag (e)
163+4.81 EUR
Mindestbestellmenge: 163
74AUP2G04GM,132 74AUP2G04GM,132 NXP Semiconductors PHGLS24263-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74AUP2G04GM - INVERTER,
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (1.45x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
auf Bestellung 4094840 Stücke:
Lieferzeit 21-28 Tag (e)
3518+0.23 EUR
Mindestbestellmenge: 3518
1N4738A,133 1N4738A,133 NXP Semiconductors 1N4728A_SER.pdf Description: NEXPERIA 1N4738A - ZENER DIODE,
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 4.5 Ohms
Supplier Device Package: DO-41
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 6 V
auf Bestellung 132963 Stücke:
Lieferzeit 21-28 Tag (e)
9043+0.072 EUR
Mindestbestellmenge: 9043
74HC240DB,118 74HC240DB,118 NXP Semiconductors PHGLS28497-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER INVERT 6V 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
Part Status: Active
auf Bestellung 3360 Stücke:
Lieferzeit 21-28 Tag (e)
1076+0.67 EUR
Mindestbestellmenge: 1076
88W8987-A2-NYEA/AZ NXP Semiconductors Description: 88W8987 - RF Transceiver (Board
Packaging: Bulk
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Data Rate (Max): 433Mbps
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Part Status: Active
auf Bestellung 10000 Stücke:
Lieferzeit 21-28 Tag (e)
35+20.6 EUR
Mindestbestellmenge: 35
74AUP2G241DC,125 74AUP2G241DC,125 NXP Semiconductors PHGLS26016-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 8VSSOP
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-VSSOP
Part Status: Active
auf Bestellung 35459 Stücke:
Lieferzeit 21-28 Tag (e)
1815+0.44 EUR
Mindestbestellmenge: 1815
74AUP1G17GN,132 74AUP1G17GN,132 NXP Semiconductors PHGL-S-A0000283103-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
auf Bestellung 5000 Stücke:
Lieferzeit 21-28 Tag (e)
1920+0.38 EUR
Mindestbestellmenge: 1920
PMEG2015EA115 PMEG2015EA115 NXP Semiconductors PMEG2015EA.pdf Description: DIODE SCHOTTKY 20V 1.5A SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Current - Average Rectified (Io): 1.5A
Supplier Device Package: SOD-323
Operating Temperature - Junction: -65°C ~ 125°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 660 mV @ 1.5 A
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Produkt ist nicht verfügbar
TDA5231XUMA1 TDA5231XUMA1 NXP Semiconductors TDA5230,31.pdf Description: TDA52WireleContrReceiver
Features: RSSI Equipped
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 302MHz ~ 320MHz
Modulation or Protocol: ASK, FSK
Data Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
Applications: RKE, Security Systems, TPMS
Data Rate (Max): 20kbps
Antenna Connector: Not Included
Supplier Device Package: PG-TSSOP-28-1
Part Status: Obsolete
auf Bestellung 6632 Stücke:
Lieferzeit 21-28 Tag (e)
143+5.49 EUR
Mindestbestellmenge: 143
PMDXB600UNEL/S500Z NXP Semiconductors Description: PMDXB600UNEL - N Channel MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MRF6VP11KGSR5 NXP Semiconductors FSCLS07342-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230-4S GW
Current Rating (Amps): 100µA
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 150MHz
Configuration: 2 N-Channel
Power - Output: 1000W
Gain: 26dB @ 130MHz
Technology: LDMOS (Dual)
Supplier Device Package: NI-1230-4S GULL
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
auf Bestellung 2000 Stücke:
Lieferzeit 21-28 Tag (e)
2+705.73 EUR
Mindestbestellmenge: 2
BZX884-C12,315 BZX884-C12,315 NXP Semiconductors PHGLS19465-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA BZX884-C12 - ZENER DIOD
Tolerance: ±5%
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
auf Bestellung 18159 Stücke:
Lieferzeit 21-28 Tag (e)
18159+0.048 EUR
Mindestbestellmenge: 18159
MIMX8ML4DVNLZAB NXP Semiconductors Description: IC MPU I.MX8M 1.8GHZ 486LFBGA
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Part Status: Active
Additional Interfaces: CANbus, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 4816 Stücke:
Lieferzeit 21-28 Tag (e)
9+85.66 EUR
Mindestbestellmenge: 9
MIMX8QM6CVUFFAB NXP Semiconductors Description: IC MPU I.MX8Q 264MHZ 1313FCPBGA
Packaging: Bulk
Package / Case: 1313-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz, 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1313-FCPBGA (29x29)
Ethernet: 1Gbps (2)
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
auf Bestellung 44 Stücke:
Lieferzeit 21-28 Tag (e)
2+458.85 EUR
Mindestbestellmenge: 2
74LV74PW,118 NXP Semiconductors 74LV74.pdf Description: IC FF D-TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 80 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 110 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 3969 Stücke:
Lieferzeit 21-28 Tag (e)
2845+0.29 EUR
Mindestbestellmenge: 2845
MC10XS3535JHFK NXP Semiconductors www.nxp.com Description: MC10XS3535JHFK - 12 V Automotive
Packaging: Bulk
Features: Slew Rate Controlled
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 5
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 55mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 6V ~ 28V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Ratio - Input:Output: 1:5
Supplier Device Package: 24-PQFN (12x12)
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Over Temperature, Reverse Battery, UVLO
Produkt ist nicht verfügbar
MC35XS3500HFK NXP Semiconductors MC35XS3500.pdf Description: MC35XS3500HFK - 12 V Automotive
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Bulk
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 5
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 35mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 6V ~ 28V
Voltage - Supply (Vcc/Vdd): 6V ~ 28V
Current - Output (Max): 65mA
Ratio - Input:Output: 1:5
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Battery, UVLO
Part Status: Obsolete
Produkt ist nicht verfügbar
74LVC257AD,112 74LVC257AD,112 NXP Semiconductors 74LVC257A.pdf Description: NEXPERIA 74LVC257AD - MULTIPLEXE
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Active
auf Bestellung 8260 Stücke:
Lieferzeit 21-28 Tag (e)
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74LVC1GU04GV,125 74LVC1GU04GV,125 NXP Semiconductors PHGLS27066-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 1CH 1-INP SC74A
Packaging: Bulk
Part Status: Active
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: SC-74A
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 30160 Stücke:
Lieferzeit 21-28 Tag (e)
7493+0.095 EUR
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S912XEG384BCAA NXP Semiconductors Description: MC9S12XE - FLIPPER-16-bit MCU, 3
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
Produkt ist nicht verfügbar
S912XEQ384BCAA NXP Semiconductors Description: MC9S12XE - FLIPPER-16-bit MCU, 3
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
Produkt ist nicht verfügbar
PMN48XPAX PMN48XPAX NXP Semiconductors PMN48XPA.pdf Description: NEXPERIA PMN48XP - 20V, P-CHANNE
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 4.1A (Ta)
Rds On (Max) @ Id, Vgs: 55mOhm @ 2.4A, 4.5V
Power Dissipation (Max): 530mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Supplier Device Package: 6-TSOP
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1000 pF @ 10 V
Produkt ist nicht verfügbar
NX7002AK215 NXP Semiconductors Description: Nexperia NX7002AK - Small Signal
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 190mA (Ta), 300mA (Tc)
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 100mA, 10V
Power Dissipation (Max): 265mW (Ta), 1.33W (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 250µA
Supplier Device Package: SOT-23-3 (TO-236)
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 0.43 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 20 pF @ 10 V
Produkt ist nicht verfügbar
BZV85-C3V6,133 BZV85-C3V6,133 NXP Semiconductors BZV85_SER.pdf Description: NEXPERIA BZV85-C3V6 - ZENER DIOD
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-41
Part Status: Active
Power - Max: 1.3 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
auf Bestellung 30450 Stücke:
Lieferzeit 21-28 Tag (e)
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MPC8358CVRADDDA557 NXP Semiconductors Description: IC MPU MPC83XX 266MHZ 668TEPBGA
Packaging: Bulk
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-TEPBGA (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
auf Bestellung 36 Stücke:
Lieferzeit 21-28 Tag (e)
4+212.55 EUR
Mindestbestellmenge: 4
FS32V234CON1VUB NXP Semiconductors Description: IC MPU S32V 1GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE (1)
Number of Cores/Bus Width: 5 Core, 32-Bit, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Part Status: Obsolete
auf Bestellung 1190 Stücke:
Lieferzeit 21-28 Tag (e)
4+210.76 EUR
Mindestbestellmenge: 4
BUK763R1-40B,118 NXP Semiconductors PHGLS22330-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA BUK763R1-40B - 75A, 40V
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 94 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6808 pF @ 25 V
auf Bestellung 12400 Stücke:
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MC9328MX1DVM15 NXP Semiconductors FSCLS05269-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX1 150MHZ 225MAPBGA
Packaging: Bulk
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Part Status: Active
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
auf Bestellung 207 Stücke:
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13+56.8 EUR
Mindestbestellmenge: 13
PCMF2HDMI14SZ PCMF2HDMI14SZ NXP Semiconductors PCMFXHDMI14S_SER.pdf Description: CMC
Packaging: Bulk
Package / Case: 10-UFBGA, WLCSP
Size / Dimension: 0.062" L x 0.046" W (1.57mm x 1.17mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Height: 0.024" (0.60mm)
Filter Order: 3rd
Applications: General Purpose
Technology: LC
Resistance - Channel (Ohms): 3
ESD Protection: Yes
Part Status: Active
Number of Channels: 2
auf Bestellung 4480 Stücke:
Lieferzeit 21-28 Tag (e)
1332+0.55 EUR
Mindestbestellmenge: 1332
BUK7509-55A,127 BUK7509-55A,127 NXP Semiconductors PHGLS22268-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA BUK7509-55A - 75A, 55V,
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 25A, 10V
Power Dissipation (Max): 211W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 0 V
Input Capacitance (Ciss) (Max) @ Vds: 3271 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 3370 Stücke:
Lieferzeit 21-28 Tag (e)
533+1.33 EUR
Mindestbestellmenge: 533
BUK7508-55A,127 BUK7508-55A,127 NXP Semiconductors BUK7508-55A.pdf Description: NEXPERIA BUK7508-55A - 75A, 55V,
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Ta)
Rds On (Max) @ Id, Vgs: 8mOhm @ 25A, 10V
Power Dissipation (Max): 254W (Ta)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 76 nC @ 0 V
Input Capacitance (Ciss) (Max) @ Vds: 4352 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 10333 Stücke:
Lieferzeit 21-28 Tag (e)
300+2.38 EUR
Mindestbestellmenge: 300
74HC4020DB,112 74HC4020DB,112 NXP Semiconductors 74HC_HCT4020.pdf Description: NEXPERIA 74HC4020DB - BINARY COU
Packaging: Bulk
Part Status: Active
auf Bestellung 3653 Stücke:
Lieferzeit 21-28 Tag (e)
710+1.01 EUR
Mindestbestellmenge: 710
74HCT240PW,112 74HCT240PW,112 NXP Semiconductors PHGLS28497-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER INVERT 5.5V 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-TSSOP
Part Status: Active
auf Bestellung 28827 Stücke:
Lieferzeit 21-28 Tag (e)
1539+0.48 EUR
Mindestbestellmenge: 1539
88W9068-A0-BWPC/AK NXP Semiconductors Description: 88W9068 - WiFi Access Point SOC.
Packaging: Bulk
Type: TxRx Only
Protocol: 802.11ax
Data Rate (Max): 4.8Gbps
Modulation: 1024QAM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, I²C, SPI
Part Status: Obsolete
auf Bestellung 4760 Stücke:
Lieferzeit 21-28 Tag (e)
10+81.61 EUR
Mindestbestellmenge: 10
74HCT27D,653 74HCT27D,653 NXP Semiconductors 74HC_HCT27.pdf Description: IC GATE NOR
Packaging: Bulk
Part Status: Active
auf Bestellung 3934 Stücke:
Lieferzeit 21-28 Tag (e)
3934+0.21 EUR
Mindestbestellmenge: 3934
74AXP1T32GXZ NXP Semiconductors 74AXP1T32.pdf Description: 74AXP1T32 - DUAL SUPPLY 2-INPUT
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 6-X2SON (1.0x0.8)
Max Propagation Delay @ V, Max CL: 6.5ns @ 2.5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
auf Bestellung 10000 Stücke:
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A3G35H100-04SR3 NXP Semiconductors A3G35H100-04S.pdf Description: RF MOSFET GAN 48V NI780
Packaging: Bulk
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Configuration: 2 N-Channel
Power - Output: 14W
Technology: GaN
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 80 mA
Gain: 14dB @ 3.6GHz
auf Bestellung 137 Stücke:
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3+246.19 EUR
Mindestbestellmenge: 3
PCA9675PW,118 PCA9675PW,118 NXP Semiconductors PCA9675.pdf Description: PCA9675PW - Remote 16-Bit I/O Ex
Packaging: Bulk
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Part Status: Active
Current - Output Source/Sink: 300µA, 42mA
auf Bestellung 6128 Stücke:
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PESD1NFC-SFYL NXP Semiconductors PESD18VF1BSF.pdf Description: PESD1NFC-S - ULTRA LOW CAPACITAN
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -45°C ~ 125°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 0.28pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1A (8/20µs)
Voltage - Reverse Standoff (Typ): 18V (Max)
Supplier Device Package: DSN0603-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 16V
Power Line Protection: No
Part Status: Obsolete
auf Bestellung 8730 Stücke:
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LPC3131FET180,551 NXP Semiconductors PHGLS25043-1.pdf?t.download=true&u=5oefqw Description: LPC3131 - Low-cost, low-power AR
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 4x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.2V ~ 3.6V
Connectivity: EBI/EMI, I²C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LCD, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
auf Bestellung 1476 Stücke:
Lieferzeit 21-28 Tag (e)
30+24.3 EUR
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LS1043ASN7MNLB NXP Semiconductors Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 21-28 Tag (e)
5+182.78 EUR
Mindestbestellmenge: 5
LS1088ASE7MQA NXP Semiconductors LS1088AXE7MQA.pdf?t.download=true&u=ovmfp3 Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1.2V
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, IFC, PCI, SPI, UART
auf Bestellung 40 Stücke:
Lieferzeit 21-28 Tag (e)
2+398.4 EUR
Mindestbestellmenge: 2
74LVC1G19GM,132 74LVC1G19GM,132 NXP Semiconductors PHGLS30449-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74LVC1G19GM - DECODER/D
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 1:2
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 32mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
auf Bestellung 2709990 Stücke:
Lieferzeit 21-28 Tag (e)
4661+0.14 EUR
Mindestbestellmenge: 4661
74LVC1G19GM,115 74LVC1G19GM,115 NXP Semiconductors PHGLS30449-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74LVC1G19GM - DECODER/D
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 1:2
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 32mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
auf Bestellung 160450 Stücke:
Lieferzeit 21-28 Tag (e)
4661+0.14 EUR
Mindestbestellmenge: 4661
MIMXRT105SCVL5B MIMXRT105SCVL5B NXP Semiconductors PHGL-S-A0006456212-1.pdf?t.download=true&u=5oefqw Description: MXRT1050 - i.MXRT105A
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
auf Bestellung 480 Stücke:
Lieferzeit 21-28 Tag (e)
28+26.43 EUR
Mindestbestellmenge: 28
74HCT3G07GD,125 74HCT3G07GD,125 NXP Semiconductors 74HC_HCT3G07.pdf Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
auf Bestellung 104522 Stücke:
Lieferzeit 21-28 Tag (e)
1519+0.52 EUR
Mindestbestellmenge: 1519
BGU8H1X PHGL-S-A0005068069-1.pdf?t.download=true&u=5oefqw
BGU8H1X
Hersteller: NXP Semiconductors
Description: BGU8H1 - SiGe:C Low Noise Amplif
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13dB
Current - Supply: 5mA
Noise Figure: 0.9dB
P1dB: -3dBm
Test Frequency: 3.35GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 1873853 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1797+0.41 EUR
Mindestbestellmenge: 1797
74LVC1GU04GN,132 PHGLS27066-1.pdf?t.download=true&u=5oefqw
74LVC1GU04GN,132
Hersteller: NXP Semiconductors
Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 3750 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
3750+0.24 EUR
Mindestbestellmenge: 3750
LPC2929FBD144,551
Hersteller: NXP Semiconductors
Description: LPC2929 - ARM9 microcontroller w
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 104
Produkt ist nicht verfügbar
LPC4076FBD144E PHGLS25790-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 109
auf Bestellung 626 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
32+22.66 EUR
Mindestbestellmenge: 32
LPC4074FBD144,551 PHGLS25790-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 109
auf Bestellung 623 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
41+18.01 EUR
Mindestbestellmenge: 41
LPC4078FBD144,551 PHGLS25790-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 109
auf Bestellung 2528 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
30+23.82 EUR
Mindestbestellmenge: 30
PN7360AUEV/C300Y
Hersteller: NXP Semiconductors
Description: PN7360AUEV - NFC Cortex®
Packaging: Bulk
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
40+19.68 EUR
Mindestbestellmenge: 40
PUMH9/ZL165
Hersteller: NXP Semiconductors
Description: Nexperia PUMH9 Small Signal Bipo
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 2 NPN - Pre-Biased
Power - Max: 200mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Frequency - Transition: 230MHz
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 47kOhm
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
LPC2917FBD144/01/,
LPC2917FBD144/01/,
Hersteller: NXP Semiconductors
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 88K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM968E-S
Data Converters: A/D 16x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 108
Produkt ist nicht verfügbar
LPC2921FBD100,551 PHGLS20650-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 16x8b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 60
auf Bestellung 287 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
64+11.24 EUR
Mindestbestellmenge: 64
2PD2150,115 PHGLS14575-1.pdf?t.download=true&u=5oefqw
2PD2150,115
Hersteller: NXP Semiconductors
Description: NEXPERIA 2PD2150 - POWER BIPOLAR
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 100mA, 2A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 100mA, 2V
Frequency - Transition: 220MHz
Supplier Device Package: SOT-89
Part Status: Active
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 20 V
Power - Max: 2 W
auf Bestellung 8026 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
3652+0.19 EUR
Mindestbestellmenge: 3652
LPC1114JBD48/303QL PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114JBD48/303QL
Hersteller: NXP Semiconductors
Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
auf Bestellung 220 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
100+7.25 EUR
Mindestbestellmenge: 100
LPC1112FHI33/102,5
LPC1112FHI33/102,5
Hersteller: NXP Semiconductors
Description: LPC1112 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
auf Bestellung 2351 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
158+4.94 EUR
Mindestbestellmenge: 158
LPC1114LVFHN24/103 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114LVFHN24/103
Hersteller: NXP Semiconductors
Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 4x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 20
Connectivity: I2C, SPI, SSP, UART/USART
auf Bestellung 964 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
151+4.8 EUR
Mindestbestellmenge: 151
LPC1112FHN24/202J
LPC1112FHN24/202J
Hersteller: NXP Semiconductors
Description: LPC1112 - Arm Cortex -M0 Cores M
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 19
auf Bestellung 5684 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
163+4.81 EUR
Mindestbestellmenge: 163
74AUP2G04GM,132 PHGLS24263-1.pdf?t.download=true&u=5oefqw
74AUP2G04GM,132
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP2G04GM - INVERTER,
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (1.45x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
auf Bestellung 4094840 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
3518+0.23 EUR
Mindestbestellmenge: 3518
1N4738A,133 1N4728A_SER.pdf
1N4738A,133
Hersteller: NXP Semiconductors
Description: NEXPERIA 1N4738A - ZENER DIODE,
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 4.5 Ohms
Supplier Device Package: DO-41
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 6 V
auf Bestellung 132963 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
9043+0.072 EUR
Mindestbestellmenge: 9043
74HC240DB,118 PHGLS28497-1.pdf?t.download=true&u=5oefqw
74HC240DB,118
Hersteller: NXP Semiconductors
Description: IC BUFFER INVERT 6V 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
Part Status: Active
auf Bestellung 3360 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1076+0.67 EUR
Mindestbestellmenge: 1076
88W8987-A2-NYEA/AZ
Hersteller: NXP Semiconductors
Description: 88W8987 - RF Transceiver (Board
Packaging: Bulk
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Data Rate (Max): 433Mbps
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Part Status: Active
auf Bestellung 10000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
35+20.6 EUR
Mindestbestellmenge: 35
74AUP2G241DC,125 PHGLS26016-1.pdf?t.download=true&u=5oefqw
74AUP2G241DC,125
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 8VSSOP
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-VSSOP
Part Status: Active
auf Bestellung 35459 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1815+0.44 EUR
Mindestbestellmenge: 1815
74AUP1G17GN,132 PHGL-S-A0000283103-1.pdf?t.download=true&u=5oefqw
74AUP1G17GN,132
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
auf Bestellung 5000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1920+0.38 EUR
Mindestbestellmenge: 1920
PMEG2015EA115 PMEG2015EA.pdf
PMEG2015EA115
Hersteller: NXP Semiconductors
Description: DIODE SCHOTTKY 20V 1.5A SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Current - Average Rectified (Io): 1.5A
Supplier Device Package: SOD-323
Operating Temperature - Junction: -65°C ~ 125°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 660 mV @ 1.5 A
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Produkt ist nicht verfügbar
TDA5231XUMA1 TDA5230,31.pdf
TDA5231XUMA1
Hersteller: NXP Semiconductors
Description: TDA52WireleContrReceiver
Features: RSSI Equipped
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 302MHz ~ 320MHz
Modulation or Protocol: ASK, FSK
Data Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
Applications: RKE, Security Systems, TPMS
Data Rate (Max): 20kbps
Antenna Connector: Not Included
Supplier Device Package: PG-TSSOP-28-1
Part Status: Obsolete
auf Bestellung 6632 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
143+5.49 EUR
Mindestbestellmenge: 143
PMDXB600UNEL/S500Z
Hersteller: NXP Semiconductors
Description: PMDXB600UNEL - N Channel MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MRF6VP11KGSR5 FSCLS07342-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230-4S GW
Current Rating (Amps): 100µA
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 150MHz
Configuration: 2 N-Channel
Power - Output: 1000W
Gain: 26dB @ 130MHz
Technology: LDMOS (Dual)
Supplier Device Package: NI-1230-4S GULL
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
auf Bestellung 2000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2+705.73 EUR
Mindestbestellmenge: 2
BZX884-C12,315 PHGLS19465-1.pdf?t.download=true&u=5oefqw
BZX884-C12,315
Hersteller: NXP Semiconductors
Description: NEXPERIA BZX884-C12 - ZENER DIOD
Tolerance: ±5%
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
auf Bestellung 18159 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
18159+0.048 EUR
Mindestbestellmenge: 18159
MIMX8ML4DVNLZAB
Hersteller: NXP Semiconductors
Description: IC MPU I.MX8M 1.8GHZ 486LFBGA
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Part Status: Active
Additional Interfaces: CANbus, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 4816 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
9+85.66 EUR
Mindestbestellmenge: 9
MIMX8QM6CVUFFAB
Hersteller: NXP Semiconductors
Description: IC MPU I.MX8Q 264MHZ 1313FCPBGA
Packaging: Bulk
Package / Case: 1313-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz, 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1313-FCPBGA (29x29)
Ethernet: 1Gbps (2)
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
auf Bestellung 44 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2+458.85 EUR
Mindestbestellmenge: 2
74LV74PW,118 74LV74.pdf
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 80 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 110 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 3969 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2845+0.29 EUR
Mindestbestellmenge: 2845
MC10XS3535JHFK www.nxp.com
Hersteller: NXP Semiconductors
Description: MC10XS3535JHFK - 12 V Automotive
Packaging: Bulk
Features: Slew Rate Controlled
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 5
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 55mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 6V ~ 28V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Ratio - Input:Output: 1:5
Supplier Device Package: 24-PQFN (12x12)
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Over Temperature, Reverse Battery, UVLO
Produkt ist nicht verfügbar
MC35XS3500HFK MC35XS3500.pdf
Hersteller: NXP Semiconductors
Description: MC35XS3500HFK - 12 V Automotive
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Bulk
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 5
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 35mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 6V ~ 28V
Voltage - Supply (Vcc/Vdd): 6V ~ 28V
Current - Output (Max): 65mA
Ratio - Input:Output: 1:5
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Battery, UVLO
Part Status: Obsolete
Produkt ist nicht verfügbar
74LVC257AD,112 74LVC257A.pdf
74LVC257AD,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC257AD - MULTIPLEXE
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Active
auf Bestellung 8260 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2142+0.36 EUR
Mindestbestellmenge: 2142
74LVC1GU04GV,125 PHGLS27066-1.pdf?t.download=true&u=5oefqw
74LVC1GU04GV,125
Hersteller: NXP Semiconductors
Description: IC INVERTER 1CH 1-INP SC74A
Packaging: Bulk
Part Status: Active
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: SC-74A
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 30160 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
7493+0.095 EUR
Mindestbestellmenge: 7493
S912XEG384BCAA
Hersteller: NXP Semiconductors
Description: MC9S12XE - FLIPPER-16-bit MCU, 3
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
Produkt ist nicht verfügbar
S912XEQ384BCAA
Hersteller: NXP Semiconductors
Description: MC9S12XE - FLIPPER-16-bit MCU, 3
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
Produkt ist nicht verfügbar
PMN48XPAX PMN48XPA.pdf
PMN48XPAX
Hersteller: NXP Semiconductors
Description: NEXPERIA PMN48XP - 20V, P-CHANNE
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 4.1A (Ta)
Rds On (Max) @ Id, Vgs: 55mOhm @ 2.4A, 4.5V
Power Dissipation (Max): 530mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Supplier Device Package: 6-TSOP
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1000 pF @ 10 V
Produkt ist nicht verfügbar
NX7002AK215
Hersteller: NXP Semiconductors
Description: Nexperia NX7002AK - Small Signal
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 190mA (Ta), 300mA (Tc)
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 100mA, 10V
Power Dissipation (Max): 265mW (Ta), 1.33W (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 250µA
Supplier Device Package: SOT-23-3 (TO-236)
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 0.43 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 20 pF @ 10 V
Produkt ist nicht verfügbar
BZV85-C3V6,133 BZV85_SER.pdf
BZV85-C3V6,133
Hersteller: NXP Semiconductors
Description: NEXPERIA BZV85-C3V6 - ZENER DIOD
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-41
Part Status: Active
Power - Max: 1.3 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
auf Bestellung 30450 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
9072+0.072 EUR
Mindestbestellmenge: 9072
MPC8358CVRADDDA557
Hersteller: NXP Semiconductors
Description: IC MPU MPC83XX 266MHZ 668TEPBGA
Packaging: Bulk
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-TEPBGA (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
auf Bestellung 36 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
4+212.55 EUR
Mindestbestellmenge: 4
FS32V234CON1VUB
Hersteller: NXP Semiconductors
Description: IC MPU S32V 1GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE (1)
Number of Cores/Bus Width: 5 Core, 32-Bit, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Part Status: Obsolete
auf Bestellung 1190 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
4+210.76 EUR
Mindestbestellmenge: 4
BUK763R1-40B,118 PHGLS22330-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK763R1-40B - 75A, 40V
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 94 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6808 pF @ 25 V
auf Bestellung 12400 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
233+3.35 EUR
Mindestbestellmenge: 233
MC9328MX1DVM15 FSCLS05269-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX1 150MHZ 225MAPBGA
Packaging: Bulk
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Part Status: Active
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
auf Bestellung 207 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
13+56.8 EUR
Mindestbestellmenge: 13
PCMF2HDMI14SZ PCMFXHDMI14S_SER.pdf
PCMF2HDMI14SZ
Hersteller: NXP Semiconductors
Description: CMC
Packaging: Bulk
Package / Case: 10-UFBGA, WLCSP
Size / Dimension: 0.062" L x 0.046" W (1.57mm x 1.17mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Height: 0.024" (0.60mm)
Filter Order: 3rd
Applications: General Purpose
Technology: LC
Resistance - Channel (Ohms): 3
ESD Protection: Yes
Part Status: Active
Number of Channels: 2
auf Bestellung 4480 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1332+0.55 EUR
Mindestbestellmenge: 1332
BUK7509-55A,127 PHGLS22268-1.pdf?t.download=true&u=5oefqw
BUK7509-55A,127
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK7509-55A - 75A, 55V,
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 25A, 10V
Power Dissipation (Max): 211W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 0 V
Input Capacitance (Ciss) (Max) @ Vds: 3271 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 3370 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
533+1.33 EUR
Mindestbestellmenge: 533
BUK7508-55A,127 BUK7508-55A.pdf
BUK7508-55A,127
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK7508-55A - 75A, 55V,
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Ta)
Rds On (Max) @ Id, Vgs: 8mOhm @ 25A, 10V
Power Dissipation (Max): 254W (Ta)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 76 nC @ 0 V
Input Capacitance (Ciss) (Max) @ Vds: 4352 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 10333 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
300+2.38 EUR
Mindestbestellmenge: 300
74HC4020DB,112 74HC_HCT4020.pdf
74HC4020DB,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HC4020DB - BINARY COU
Packaging: Bulk
Part Status: Active
auf Bestellung 3653 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
710+1.01 EUR
Mindestbestellmenge: 710
74HCT240PW,112 PHGLS28497-1.pdf?t.download=true&u=5oefqw
74HCT240PW,112
Hersteller: NXP Semiconductors
Description: IC BUFFER INVERT 5.5V 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-TSSOP
Part Status: Active
auf Bestellung 28827 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1539+0.48 EUR
Mindestbestellmenge: 1539
88W9068-A0-BWPC/AK
Hersteller: NXP Semiconductors
Description: 88W9068 - WiFi Access Point SOC.
Packaging: Bulk
Type: TxRx Only
Protocol: 802.11ax
Data Rate (Max): 4.8Gbps
Modulation: 1024QAM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, I²C, SPI
Part Status: Obsolete
auf Bestellung 4760 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
10+81.61 EUR
Mindestbestellmenge: 10
74HCT27D,653 74HC_HCT27.pdf
74HCT27D,653
Hersteller: NXP Semiconductors
Description: IC GATE NOR
Packaging: Bulk
Part Status: Active
auf Bestellung 3934 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
3934+0.21 EUR
Mindestbestellmenge: 3934
74AXP1T32GXZ 74AXP1T32.pdf
Hersteller: NXP Semiconductors
Description: 74AXP1T32 - DUAL SUPPLY 2-INPUT
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 6-X2SON (1.0x0.8)
Max Propagation Delay @ V, Max CL: 6.5ns @ 2.5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
auf Bestellung 10000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2218+0.36 EUR
Mindestbestellmenge: 2218
A3G35H100-04SR3 A3G35H100-04S.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET GAN 48V NI780
Packaging: Bulk
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Configuration: 2 N-Channel
Power - Output: 14W
Technology: GaN
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 80 mA
Gain: 14dB @ 3.6GHz
auf Bestellung 137 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
3+246.19 EUR
Mindestbestellmenge: 3
PCA9675PW,118 PCA9675.pdf
PCA9675PW,118
Hersteller: NXP Semiconductors
Description: PCA9675PW - Remote 16-Bit I/O Ex
Packaging: Bulk
Features: POR
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Part Status: Active
Current - Output Source/Sink: 300µA, 42mA
auf Bestellung 6128 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
183+3.9 EUR
Mindestbestellmenge: 183
PESD1NFC-SFYL PESD18VF1BSF.pdf
Hersteller: NXP Semiconductors
Description: PESD1NFC-S - ULTRA LOW CAPACITAN
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -45°C ~ 125°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 0.28pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1A (8/20µs)
Voltage - Reverse Standoff (Typ): 18V (Max)
Supplier Device Package: DSN0603-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 16V
Power Line Protection: No
Part Status: Obsolete
auf Bestellung 8730 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
3309+0.22 EUR
Mindestbestellmenge: 3309
LPC3131FET180,551 PHGLS25043-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC3131 - Low-cost, low-power AR
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 4x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.2V ~ 3.6V
Connectivity: EBI/EMI, I²C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LCD, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
auf Bestellung 1476 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
30+24.3 EUR
Mindestbestellmenge: 30
LS1043ASN7MNLB
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
5+182.78 EUR
Mindestbestellmenge: 5
LS1088ASE7MQA LS1088AXE7MQA.pdf?t.download=true&u=ovmfp3
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1.2V
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, IFC, PCI, SPI, UART
auf Bestellung 40 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2+398.4 EUR
Mindestbestellmenge: 2
74LVC1G19GM,132 PHGLS30449-1.pdf?t.download=true&u=5oefqw
74LVC1G19GM,132
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC1G19GM - DECODER/D
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 1:2
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 32mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
auf Bestellung 2709990 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
4661+0.14 EUR
Mindestbestellmenge: 4661
74LVC1G19GM,115 PHGLS30449-1.pdf?t.download=true&u=5oefqw
74LVC1G19GM,115
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC1G19GM - DECODER/D
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 1:2
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 32mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
auf Bestellung 160450 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
4661+0.14 EUR
Mindestbestellmenge: 4661
MIMXRT105SCVL5B PHGL-S-A0006456212-1.pdf?t.download=true&u=5oefqw
MIMXRT105SCVL5B
Hersteller: NXP Semiconductors
Description: MXRT1050 - i.MXRT105A
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
auf Bestellung 480 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
28+26.43 EUR
Mindestbestellmenge: 28
74HCT3G07GD,125 74HC_HCT3G07.pdf
74HCT3G07GD,125
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
auf Bestellung 104522 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1519+0.52 EUR
Mindestbestellmenge: 1519
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