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LPC1112LVFHN24/003 LPC1112LVFHN24/003 NXP Semiconductors PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: LPC1112 - Scalable Entry Level 3
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: FIFO, I2C, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Number of I/O: 20
auf Bestellung 486 Stücke:
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BAP65LX,315 NXP Semiconductors PHGL-S-A0007134014-1.pdf?t.download=true&u=5oefqw Description: BAP65LX - Silicon PIN Diode
Packaging: Bulk
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.37pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Current - Max: 100 mA
Power Dissipation (Max): 135 mW
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MRFX1K80H-230MHZ NXP Semiconductors MRFX1K80H.pdf Description: RF MOSFET LDMOS 65V NI1230
Packaging: Bulk
Package / Case: SOT-979A
Current Rating (Amps): 100mA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: Dual
Power - Output: 1800W
Gain: 25.1dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 1.5 A
Produkt ist nicht verfügbar
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74HCT4046AD,118 74HCT4046AD,118 NXP Semiconductors 74HC_HCT4046A.pdf Description: NEXPERIA 74HCT4046AD - PLL FREQU
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 21MHz
Type: Phase Lock Loop (PLL)
Input: Clock
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Differential - Input:Output: No/No
Supplier Device Package: 16-SO
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
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BC859B,215 BC859B,215 NXP Semiconductors BC859_BC860.pdf Description: TRANS PNP 30V 0.1A TO-236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 250 mW
Qualification: AEC-Q101
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MKW20Z160VHT4 NXP Semiconductors PHGL-S-A0005067296-1.pdf?t.download=true&u=5oefqw Description: IC RF TXRX+MCU 802.15.4
Packaging: Bulk
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 160kB Flash, 20kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.45V ~ 3.6V
Power - Output: 5dBm
Protocol: ZigbeePRO®
Current - Receiving: 6.5mA ~ 15.4mA
Data Rate (Max): 250kbps
Current - Transmitting: 8.4mA ~ 18.5mA
GPIO: 28
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
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74LVC139D,112 74LVC139D,112 NXP Semiconductors PHGLS23390-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74LVC139D - DECODER/DRI
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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MRFE6VP8600HR5 NXP Semiconductors MRFE6VP8600H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230
Current Rating (Amps): 20µA
Mounting Type: Chassis Mount
Frequency: 470MHz ~ 860MHz
Configuration: Dual, Common Source
Power - Output: 600W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 1.4 A
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BAT18,235 BAT18,235 NXP Semiconductors BAT18.pdf Description: RF DIODE STANDARD 35V SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Standard - Single
Operating Temperature: 125°C (TJ)
Capacitance @ Vr, F: 1pF @ 20V, 1MHz
Resistance @ If, F: 700mOhm @ 5mA, 200MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
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PCF7961XTT/D1AC09J NXP Semiconductors Description: IMMO COMBI CHIP
Features: Programmable
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Memory Size: 192B RAM, 512B EEPROM
Modulation or Protocol: UHF
Voltage - Supply: 2.1V ~ 3.6V
Applications: Remote Keyless Entry
Supplier Device Package: 20-TSSOP
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PDTA115EU,115 PDTA115EU,115 NXP Semiconductors PIRSS13039-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS
Packaging: Bulk
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74AUP1G79GM,115 74AUP1G79GM,115 NXP Semiconductors PHGLS24882-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 50pF
Number of Bits per Element: 1
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74LVC2G02GN,115 74LVC2G02GN,115 NXP Semiconductors 74LVC2G02.pdf Description: IC DUAL 2-INP
Packaging: Bulk
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74HCT2G17GW-Q100H 74HCT2G17GW-Q100H NXP Semiconductors 74HC_HCT2G17_Q100.pdf Description: IC BUFFER NON-INVERT 5.5V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-TSSOP
Grade: Automotive
Qualification: AEC-Q100
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MPC860DTCZQ50D4 NXP Semiconductors FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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2+277.16 EUR
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NVT4555UKZ NVT4555UKZ NXP Semiconductors PHGLS28214-1.pdf?t.download=true&u=5oefqw Description: NVT4555UK - SIM card interface l
Packaging: Bulk
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Voltage - Supply: 1.1V ~ 3.6V
Applications: SIM Card
Supplier Device Package: 12-WLCSP (1.62x1.19)
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PN7362BNHN/C300Y PN7362BNHN/C300Y NXP Semiconductors PN7462.pdf Description: PN7362 - NFC CORTEX-M0 MICROCONT
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 59948 Stücke:
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48+10.51 EUR
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PESD2NFC-LYL PESD2NFC-LYL NXP Semiconductors PESD5V0F1BL.pdf Description: TVS DIODE 24VWM DFN1006-2
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Voltage - Reverse Standoff (Typ): 24V (Max)
Supplier Device Package: DFN1006-2
Bidirectional Channels: 1
Power Line Protection: No
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3309+0.15 EUR
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BZX79-C22,133 BZX79-C22,133 NXP Semiconductors BZX79.pdf Description: DIODE ZENER 22V 400MW ALF2
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 55 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15.4 V
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BZX79-C22,143 BZX79-C22,143 NXP Semiconductors BZX79.pdf Description: DIODE ZENER 22V 400MW ALF2
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 55 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
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PBSS4130QAZ PBSS4130QAZ NXP Semiconductors NEXP-S-A0003560291-1.pdf?t.download=true&u=5oefqw Description: TRANS NPN 30V 1A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 245mV @ 50mA, 1A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 1A, 2V
Frequency - Transition: 190MHz
Supplier Device Package: DFN1010D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 325 mW
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MC68302AG25C NXP Semiconductors FSCLS09687-1.pdf?t.download=true&u=5oefqw Description: IC MPU 25MHZ 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
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MC68302EH25CB1 MC68302EH25CB1 NXP Semiconductors FSCLS09687-1.pdf?t.download=true&u=5oefqw Description: IC MPU M683XX 25MHZ 132PQFP
Packaging: Bulk
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5V
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
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A7101CLTK2/T0BC2WJ A7101CLTK2/T0BC2WJ NXP Semiconductors PHGL-S-A0006349687-1.pdf?t.download=true&amp;u=5oefqw Description: RF MOSFET
Packaging: Bulk
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PMBTA14,215 PMBTA14,215 NXP Semiconductors PMBTA13_PMBTA14.pdf Description: TRANS NPN DARL 30V 0.5A TO-236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN - Darlington
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.5V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 20000 @ 100mA, 5V
Frequency - Transition: 125MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 250 mW
Qualification: AEC-Q101
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6968+0.07 EUR
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SPC5746CHK1AMMH6 SPC5746CHK1AMMH6 NXP Semiconductors SPC5746CFK1ACKU6.pdf?t.download=true&u=axiww2 Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
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74HCT597DB,112 74HCT597DB,112 NXP Semiconductors PHGLS29568-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74HCT597DB - PARALLEL I
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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BZV55-B33,115 BZV55-B33,115 NXP Semiconductors BZV55_SER.pdf Description: DIODE ZENER 33V 500MW LLDS
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: LLDS; MiniMelf
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
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PMBT4403YSX PMBT4403YSX NXP Semiconductors PMBT4403YS.pdf Description: TRANS PNP 40V 0.6A SOT-363
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 750mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Frequency - Transition: 200MHz
Supplier Device Package: SOT-363
Grade: Automotive
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Qualification: AEC-Q101
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10724+0.05 EUR
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74AUP1G157GF,132 74AUP1G157GF,132 NXP Semiconductors PHGLS24877-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74AUP1G157GF - MULTIPLE
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT891 (1x1)
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1972+0.25 EUR
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NX3P1108UKZ NX3P1108UKZ NXP Semiconductors NX3P1108.pdf Description: NX3P1108UK - Logic controlled hi
Features: Load Discharge, Slew Rate Controlled
Packaging: Bulk
Package / Case: 4-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 34mOhm
Input Type: Non-Inverting
Voltage - Load: 0.9V ~ 3.6V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 4-WLCSP (0.96x0.96)
Grade: Automotive
Qualification: AEC-Q100
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1609+0.29 EUR
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NX5P1100UKZ NX5P1100UKZ NXP Semiconductors NX5P1100.pdf Description: NX5P1100UK - Logic controlled hi
Features: Slew Rate Controlled
Packaging: Bulk
Package / Case: 12-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 60mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.66x1.36)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
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PESD5V0F1BSF,315 PESD5V0F1BSF,315 NXP Semiconductors PESD5V0F1BSF.pdf Description: NEXPERIA PESD5V0F1BSF - TRANS VO
Packaging: Bulk
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A2V09H400-04NR3 NXP Semiconductors PHGL-S-A0003207742-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 720MHz ~ 960MHz
Configuration: 2 N-Channel
Power - Output: 107W
Gain: 17.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 688 mA
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PTN5110DHQZ NXP Semiconductors Description: USB Type-C Rev 3.0 PD PHY, Dongl
Packaging: Bulk
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Bus, I2C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Supplier Device Package: 16-HX2QFN (2.6x2.6)
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74LV04PW,118 74LV04PW,118 NXP Semiconductors PHGL-S-A0001366847-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER
Packaging: Bulk
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74LV04D,112 74LV04D,112 NXP Semiconductors 74LV04.pdf Description: IC INVERTER
Packaging: Bulk
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BGU8L1X BGU8L1X NXP Semiconductors PHGL-S-A0005068106-1.pdf?t.download=true&u=5oefqw Description: BGU8L1 - C Low Noise Amplifier M
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 14.5dB
Current - Supply: 4.6mA
Noise Figure: 0.7dB
P1dB: -3dBm
Test Frequency: 882MHz
Supplier Device Package: 6-XSON (1.1x0.7)
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74LVC1GU04GV,125 74LVC1GU04GV,125 NXP Semiconductors PHGLS27066-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 1CH 1-INP SC74A
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: SC-74A
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
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74HC4049DB,112 74HC4049DB,112 NXP Semiconductors 74HC4049.pdf Description: IC BUFFER INVERT 6V 16SSOP
Packaging: Bulk
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MC9S08SU8VFK NXP Semiconductors PHGL-S-A0003028296-1.pdf?t.download=true&u=5oefqw Description: MC9S08SU - 8 bit MCU with S08L c
Packaging: Bulk
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08L
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 17
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74LVC14APW,112 74LVC14APW,112 NXP Semiconductors PHGL-S-A0002149314-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER
Packaging: Bulk
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74AUP1G07GF,132 74AUP1G07GF,132 NXP Semiconductors PHGLS25181-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON, SOT891 (1x1)
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74AHCT74PW,118 74AHCT74PW,118 NXP Semiconductors 74AHC_AHCT74.pdf Description: IC FF D-TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 2 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 140 MHz
Input Capacitance: 3 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 8.8ns @ 5V, 50pF
Number of Bits per Element: 1
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74AHCT74D,118 74AHCT74D,118 NXP Semiconductors PHGL-S-A0000764177-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 2 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 140 MHz
Input Capacitance: 3 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 8.8ns @ 5V, 50pF
Number of Bits per Element: 1
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CBT3306D,112 CBT3306D,112 NXP Semiconductors CBT3306.pdf Description: C3306 - NOW NEXPERIA CBT3306D -
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SO
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74HC4020PW,118 74HC4020PW,118 NXP Semiconductors PHGLS25199-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74HC4020PW - BINARY COU
Packaging: Bulk
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SPC5748GK0AMMJ6 SPC5748GK0AMMJ6 NXP Semiconductors PHGL-S-A0004670910-1.pdf?t.download=true&u=5oefqw Description: TRIPLE CORE, 6M FLASH, 768K RAM,
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 1.32V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
auf Bestellung 553 Stücke:
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9+59.00 EUR
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BCV65,215 BCV65,215 NXP Semiconductors BCV65.pdf Description: TRANS NPN/PNP 30V 100MA SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP (Emitter Coupled)
Operating Temperature: 150°C (TJ)
Power - Max: 250mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 30V
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 75 @ 2mA, 5V
Supplier Device Package: SOT-143B
Grade: Automotive
Qualification: AEC-Q101
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74LV00PW,118 74LV00PW,118 NXP Semiconductors 74LV00.pdf Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 14ns @ 5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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74LV00DB,118 74LV00DB,118 NXP Semiconductors 74LV00.pdf Description: IC GATE NAND
Packaging: Bulk
auf Bestellung 6000 Stücke:
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74AHC257PW,118 74AHC257PW,118 NXP Semiconductors PHGLS15522-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74AHC257PW - MULTIPLEXE
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
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74HCT27D,653 74HCT27D,653 NXP Semiconductors 74HC_HCT27.pdf Description: IC GATE NOR
Packaging: Bulk
auf Bestellung 3937 Stücke:
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74LVC132APW,118 74LVC132APW,118 NXP Semiconductors PHGLS23872-1.pdf?t.download=true&u=5oefqw Description: IC GATE NAND
Packaging: Bulk
auf Bestellung 19315 Stücke:
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2005+0.25 EUR
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74LVC132APW,112 74LVC132APW,112 NXP Semiconductors PHGLS23872-1.pdf?t.download=true&u=5oefqw Description: IC GATE NAND
Packaging: Bulk
auf Bestellung 5306 Stücke:
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1955+0.25 EUR
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74HCT163D,653 74HCT163D,653 NXP Semiconductors PHGL-S-A0001367747-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74HCT163D - BINARY COUN
Packaging: Bulk
auf Bestellung 6805 Stücke:
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PCMF1USB30Z PCMF1USB30Z NXP Semiconductors PCMFXUSB30_SER.pdf Description: NEXPERIA PCMF1USB - ELECTRONIC I
Packaging: Bulk
auf Bestellung 20495 Stücke:
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1998+0.25 EUR
Mindestbestellmenge: 1998
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PZU20BA,115 PZU20BA,115 NXP Semiconductors PZUXBA_SER.pdf Description: DIODE ZENER 20V 320MW SOD323
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
auf Bestellung 48000 Stücke:
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PZU20B1A,115 PZU20B1A,115 NXP Semiconductors PZUXBA_SER.pdf Description: DIODE ZENER 20V 320MW SOD323
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
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PZU20B2,115 PZU20B2,115 NXP Semiconductors PHGLS19743-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 20V 310MW SOD323F
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323F
Power - Max: 310 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
auf Bestellung 27000 Stücke:
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LPC1112LVFHN24/003 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112LVFHN24/003
Hersteller: NXP Semiconductors
Description: LPC1112 - Scalable Entry Level 3
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: FIFO, I2C, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Number of I/O: 20
auf Bestellung 486 Stücke:
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Anzahl Preis
193+2.61 EUR
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BAP65LX,315 PHGL-S-A0007134014-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: BAP65LX - Silicon PIN Diode
Packaging: Bulk
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.37pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Current - Max: 100 mA
Power Dissipation (Max): 135 mW
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4929+0.13 EUR
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MRFX1K80H-230MHZ MRFX1K80H.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 65V NI1230
Packaging: Bulk
Package / Case: SOT-979A
Current Rating (Amps): 100mA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: Dual
Power - Output: 1800W
Gain: 25.1dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 1.5 A
Produkt ist nicht verfügbar
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74HCT4046AD,118 74HC_HCT4046A.pdf
74HCT4046AD,118
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HCT4046AD - PLL FREQU
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 21MHz
Type: Phase Lock Loop (PLL)
Input: Clock
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Differential - Input:Output: No/No
Supplier Device Package: 16-SO
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
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978+0.52 EUR
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BC859B,215 BC859_BC860.pdf
BC859B,215
Hersteller: NXP Semiconductors
Description: TRANS PNP 30V 0.1A TO-236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 250 mW
Qualification: AEC-Q101
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13172+0.03 EUR
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MKW20Z160VHT4 PHGL-S-A0005067296-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC RF TXRX+MCU 802.15.4
Packaging: Bulk
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 160kB Flash, 20kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.45V ~ 3.6V
Power - Output: 5dBm
Protocol: ZigbeePRO®
Current - Receiving: 6.5mA ~ 15.4mA
Data Rate (Max): 250kbps
Current - Transmitting: 8.4mA ~ 18.5mA
GPIO: 28
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
auf Bestellung 220 Stücke:
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77+6.60 EUR
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74LVC139D,112 PHGLS23390-1.pdf?t.download=true&u=5oefqw
74LVC139D,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC139D - DECODER/DRI
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 28668 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1871+0.27 EUR
Mindestbestellmenge: 1871
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MRFE6VP8600HR5 MRFE6VP8600H.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230
Current Rating (Amps): 20µA
Mounting Type: Chassis Mount
Frequency: 470MHz ~ 860MHz
Configuration: Dual, Common Source
Power - Output: 600W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 1.4 A
auf Bestellung 890 Stücke:
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Anzahl Preis
1+564.82 EUR
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BAT18,235 BAT18.pdf
BAT18,235
Hersteller: NXP Semiconductors
Description: RF DIODE STANDARD 35V SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Standard - Single
Operating Temperature: 125°C (TJ)
Capacitance @ Vr, F: 1pF @ 20V, 1MHz
Resistance @ If, F: 700mOhm @ 5mA, 200MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
auf Bestellung 150016 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1865+0.25 EUR
Mindestbestellmenge: 1865
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PCF7961XTT/D1AC09J
Hersteller: NXP Semiconductors
Description: IMMO COMBI CHIP
Features: Programmable
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Memory Size: 192B RAM, 512B EEPROM
Modulation or Protocol: UHF
Voltage - Supply: 2.1V ~ 3.6V
Applications: Remote Keyless Entry
Supplier Device Package: 20-TSSOP
auf Bestellung 2490 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
73+6.95 EUR
Mindestbestellmenge: 73
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PDTA115EU,115 PIRSS13039-1.pdf?t.download=true&u=5oefqw
PDTA115EU,115
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS
Packaging: Bulk
auf Bestellung 174000 Stücke:
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Anzahl Preis
13172+0.03 EUR
Mindestbestellmenge: 13172
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74AUP1G79GM,115 PHGLS24882-1.pdf?t.download=true&u=5oefqw
74AUP1G79GM,115
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 50pF
Number of Bits per Element: 1
auf Bestellung 180000 Stücke:
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Anzahl Preis
4139+0.12 EUR
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74LVC2G02GN,115 74LVC2G02.pdf
74LVC2G02GN,115
Hersteller: NXP Semiconductors
Description: IC DUAL 2-INP
Packaging: Bulk
auf Bestellung 40000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1708+0.30 EUR
Mindestbestellmenge: 1708
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74HCT2G17GW-Q100H 74HC_HCT2G17_Q100.pdf
74HCT2G17GW-Q100H
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-TSSOP
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2796+0.19 EUR
Mindestbestellmenge: 2796
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MPC860DTCZQ50D4 FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 384 Stücke:
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Anzahl Preis
2+277.16 EUR
Mindestbestellmenge: 2
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NVT4555UKZ PHGLS28214-1.pdf?t.download=true&u=5oefqw
NVT4555UKZ
Hersteller: NXP Semiconductors
Description: NVT4555UK - SIM card interface l
Packaging: Bulk
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Voltage - Supply: 1.1V ~ 3.6V
Applications: SIM Card
Supplier Device Package: 12-WLCSP (1.62x1.19)
auf Bestellung 2867 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
454+1.11 EUR
Mindestbestellmenge: 454
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PN7362BNHN/C300Y PN7462.pdf
PN7362BNHN/C300Y
Hersteller: NXP Semiconductors
Description: PN7362 - NFC CORTEX-M0 MICROCONT
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 59948 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
48+10.51 EUR
Mindestbestellmenge: 48
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PESD2NFC-LYL PESD5V0F1BL.pdf
PESD2NFC-LYL
Hersteller: NXP Semiconductors
Description: TVS DIODE 24VWM DFN1006-2
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Voltage - Reverse Standoff (Typ): 24V (Max)
Supplier Device Package: DFN1006-2
Bidirectional Channels: 1
Power Line Protection: No
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3309+0.15 EUR
Mindestbestellmenge: 3309
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BZX79-C22,133 BZX79.pdf
BZX79-C22,133
Hersteller: NXP Semiconductors
Description: DIODE ZENER 22V 400MW ALF2
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 55 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15.4 V
auf Bestellung 89940 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13172+0.03 EUR
Mindestbestellmenge: 13172
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BZX79-C22,143 BZX79.pdf
BZX79-C22,143
Hersteller: NXP Semiconductors
Description: DIODE ZENER 22V 400MW ALF2
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 55 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
auf Bestellung 75000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13172+0.03 EUR
Mindestbestellmenge: 13172
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PBSS4130QAZ NEXP-S-A0003560291-1.pdf?t.download=true&u=5oefqw
PBSS4130QAZ
Hersteller: NXP Semiconductors
Description: TRANS NPN 30V 1A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 245mV @ 50mA, 1A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 1A, 2V
Frequency - Transition: 190MHz
Supplier Device Package: DFN1010D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 325 mW
auf Bestellung 243300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3414+0.15 EUR
Mindestbestellmenge: 3414
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MC68302AG25C FSCLS09687-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU 25MHZ 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
auf Bestellung 144 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+116.21 EUR
Mindestbestellmenge: 5
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MC68302EH25CB1 FSCLS09687-1.pdf?t.download=true&u=5oefqw
MC68302EH25CB1
Hersteller: NXP Semiconductors
Description: IC MPU M683XX 25MHZ 132PQFP
Packaging: Bulk
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5V
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+130.68 EUR
Mindestbestellmenge: 4
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A7101CLTK2/T0BC2WJ PHGL-S-A0006349687-1.pdf?t.download=true&amp;u=5oefqw
A7101CLTK2/T0BC2WJ
Hersteller: NXP Semiconductors
Description: RF MOSFET
Packaging: Bulk
auf Bestellung 111264 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
319+1.59 EUR
Mindestbestellmenge: 319
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PMBTA14,215 PMBTA13_PMBTA14.pdf
PMBTA14,215
Hersteller: NXP Semiconductors
Description: TRANS NPN DARL 30V 0.5A TO-236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN - Darlington
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.5V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 20000 @ 100mA, 5V
Frequency - Transition: 125MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 250 mW
Qualification: AEC-Q101
auf Bestellung 96000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6968+0.07 EUR
Mindestbestellmenge: 6968
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SPC5746CHK1AMMH6 SPC5746CFK1ACKU6.pdf?t.download=true&u=axiww2
SPC5746CHK1AMMH6
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
auf Bestellung 334 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
14+38.36 EUR
Mindestbestellmenge: 14
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74HCT597DB,112 PHGLS29568-1.pdf?t.download=true&u=5oefqw
74HCT597DB,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HCT597DB - PARALLEL I
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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BZV55-B33,115 BZV55_SER.pdf
BZV55-B33,115
Hersteller: NXP Semiconductors
Description: DIODE ZENER 33V 500MW LLDS
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: LLDS; MiniMelf
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
auf Bestellung 127500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13172+0.03 EUR
Mindestbestellmenge: 13172
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PMBT4403YSX PMBT4403YS.pdf
PMBT4403YSX
Hersteller: NXP Semiconductors
Description: TRANS PNP 40V 0.6A SOT-363
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 750mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Frequency - Transition: 200MHz
Supplier Device Package: SOT-363
Grade: Automotive
Current - Collector (Ic) (Max): 600 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Qualification: AEC-Q101
auf Bestellung 300000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10724+0.05 EUR
Mindestbestellmenge: 10724
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74AUP1G157GF,132 PHGLS24877-1.pdf?t.download=true&u=5oefqw
74AUP1G157GF,132
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP1G157GF - MULTIPLE
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT891 (1x1)
auf Bestellung 15300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1972+0.25 EUR
Mindestbestellmenge: 1972
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NX3P1108UKZ NX3P1108.pdf
NX3P1108UKZ
Hersteller: NXP Semiconductors
Description: NX3P1108UK - Logic controlled hi
Features: Load Discharge, Slew Rate Controlled
Packaging: Bulk
Package / Case: 4-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 34mOhm
Input Type: Non-Inverting
Voltage - Load: 0.9V ~ 3.6V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 4-WLCSP (0.96x0.96)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 8200 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1609+0.29 EUR
Mindestbestellmenge: 1609
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NX5P1100UKZ NX5P1100.pdf
NX5P1100UKZ
Hersteller: NXP Semiconductors
Description: NX5P1100UK - Logic controlled hi
Features: Slew Rate Controlled
Packaging: Bulk
Package / Case: 12-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 60mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.66x1.36)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
auf Bestellung 12407 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
456+1.02 EUR
Mindestbestellmenge: 456
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PESD5V0F1BSF,315 PESD5V0F1BSF.pdf
PESD5V0F1BSF,315
Hersteller: NXP Semiconductors
Description: NEXPERIA PESD5V0F1BSF - TRANS VO
Packaging: Bulk
auf Bestellung 35079000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10490+0.05 EUR
Mindestbestellmenge: 10490
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A2V09H400-04NR3 PHGL-S-A0003207742-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 720MHz ~ 960MHz
Configuration: 2 N-Channel
Power - Output: 107W
Gain: 17.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 688 mA
auf Bestellung 454 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+156.88 EUR
Mindestbestellmenge: 4
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PTN5110DHQZ
Hersteller: NXP Semiconductors
Description: USB Type-C Rev 3.0 PD PHY, Dongl
Packaging: Bulk
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Bus, I2C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Supplier Device Package: 16-HX2QFN (2.6x2.6)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
192+2.55 EUR
Mindestbestellmenge: 192
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74LV04PW,118 PHGL-S-A0001366847-1.pdf?t.download=true&u=5oefqw
74LV04PW,118
Hersteller: NXP Semiconductors
Description: IC INVERTER
Packaging: Bulk
auf Bestellung 3217 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3217+0.19 EUR
Mindestbestellmenge: 3217
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74LV04D,112 74LV04.pdf
74LV04D,112
Hersteller: NXP Semiconductors
Description: IC INVERTER
Packaging: Bulk
auf Bestellung 14744 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2406+0.20 EUR
Mindestbestellmenge: 2406
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BGU8L1X PHGL-S-A0005068106-1.pdf?t.download=true&u=5oefqw
BGU8L1X
Hersteller: NXP Semiconductors
Description: BGU8L1 - C Low Noise Amplifier M
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 14.5dB
Current - Supply: 4.6mA
Noise Figure: 0.7dB
P1dB: -3dBm
Test Frequency: 882MHz
Supplier Device Package: 6-XSON (1.1x0.7)
auf Bestellung 1352200 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1255+0.40 EUR
Mindestbestellmenge: 1255
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74LVC1GU04GV,125 PHGLS27066-1.pdf?t.download=true&u=5oefqw
74LVC1GU04GV,125
Hersteller: NXP Semiconductors
Description: IC INVERTER 1CH 1-INP SC74A
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: SC-74A
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 21160 Stücke:
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7493+0.07 EUR
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74HC4049DB,112 74HC4049.pdf
74HC4049DB,112
Hersteller: NXP Semiconductors
Description: IC BUFFER INVERT 6V 16SSOP
Packaging: Bulk
auf Bestellung 2427 Stücke:
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Anzahl Preis
833+0.61 EUR
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MC9S08SU8VFK PHGL-S-A0003028296-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: MC9S08SU - 8 bit MCU with S08L c
Packaging: Bulk
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08L
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 17
auf Bestellung 463 Stücke:
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Anzahl Preis
118+4.31 EUR
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74LVC14APW,112 PHGL-S-A0002149314-1.pdf?t.download=true&u=5oefqw
74LVC14APW,112
Hersteller: NXP Semiconductors
Description: IC INVERTER
Packaging: Bulk
auf Bestellung 32279 Stücke:
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Anzahl Preis
2659+0.19 EUR
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74AUP1G07GF,132 PHGLS25181-1.pdf?t.download=true&u=5oefqw
74AUP1G07GF,132
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON, SOT891 (1x1)
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3493+0.15 EUR
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74AHCT74PW,118 74AHC_AHCT74.pdf
74AHCT74PW,118
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 2 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 140 MHz
Input Capacitance: 3 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 8.8ns @ 5V, 50pF
Number of Bits per Element: 1
auf Bestellung 153980 Stücke:
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Anzahl Preis
3634+0.13 EUR
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74AHCT74D,118 PHGL-S-A0000764177-1.pdf?t.download=true&u=5oefqw
74AHCT74D,118
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 2 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 140 MHz
Input Capacitance: 3 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 8.8ns @ 5V, 50pF
Number of Bits per Element: 1
auf Bestellung 12500 Stücke:
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Anzahl Preis
3883+0.13 EUR
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CBT3306D,112 CBT3306.pdf
CBT3306D,112
Hersteller: NXP Semiconductors
Description: C3306 - NOW NEXPERIA CBT3306D -
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SO
auf Bestellung 2000 Stücke:
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Anzahl Preis
952+0.54 EUR
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74HC4020PW,118 PHGLS25199-1.pdf?t.download=true&u=5oefqw
74HC4020PW,118
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HC4020PW - BINARY COU
Packaging: Bulk
auf Bestellung 12603 Stücke:
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Anzahl Preis
1533+0.34 EUR
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SPC5748GK0AMMJ6 PHGL-S-A0004670910-1.pdf?t.download=true&u=5oefqw
SPC5748GK0AMMJ6
Hersteller: NXP Semiconductors
Description: TRIPLE CORE, 6M FLASH, 768K RAM,
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 1.32V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
auf Bestellung 553 Stücke:
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Anzahl Preis
9+59.00 EUR
Mindestbestellmenge: 9
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BCV65,215 BCV65.pdf
BCV65,215
Hersteller: NXP Semiconductors
Description: TRANS NPN/PNP 30V 100MA SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP (Emitter Coupled)
Operating Temperature: 150°C (TJ)
Power - Max: 250mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 30V
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 75 @ 2mA, 5V
Supplier Device Package: SOT-143B
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 4561 Stücke:
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Anzahl Preis
4561+0.13 EUR
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74LV00PW,118 74LV00.pdf
74LV00PW,118
Hersteller: NXP Semiconductors
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 14ns @ 5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
auf Bestellung 124183 Stücke:
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2956+0.17 EUR
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74LV00DB,118 74LV00.pdf
74LV00DB,118
Hersteller: NXP Semiconductors
Description: IC GATE NAND
Packaging: Bulk
auf Bestellung 6000 Stücke:
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Anzahl Preis
1803+0.29 EUR
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74AHC257PW,118 PHGLS15522-1.pdf?t.download=true&u=5oefqw
74AHC257PW,118
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AHC257PW - MULTIPLEXE
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
auf Bestellung 11612 Stücke:
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Anzahl Preis
1920+0.27 EUR
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74HCT27D,653 74HC_HCT27.pdf
74HCT27D,653
Hersteller: NXP Semiconductors
Description: IC GATE NOR
Packaging: Bulk
auf Bestellung 3937 Stücke:
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Anzahl Preis
3937+0.15 EUR
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74LVC132APW,118 PHGLS23872-1.pdf?t.download=true&u=5oefqw
74LVC132APW,118
Hersteller: NXP Semiconductors
Description: IC GATE NAND
Packaging: Bulk
auf Bestellung 19315 Stücke:
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Anzahl Preis
2005+0.25 EUR
Mindestbestellmenge: 2005
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74LVC132APW,112 PHGLS23872-1.pdf?t.download=true&u=5oefqw
74LVC132APW,112
Hersteller: NXP Semiconductors
Description: IC GATE NAND
Packaging: Bulk
auf Bestellung 5306 Stücke:
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Anzahl Preis
1955+0.25 EUR
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74HCT163D,653 PHGL-S-A0001367747-1.pdf?t.download=true&u=5oefqw
74HCT163D,653
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HCT163D - BINARY COUN
Packaging: Bulk
auf Bestellung 6805 Stücke:
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1622+0.32 EUR
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PCMF1USB30Z PCMFXUSB30_SER.pdf
PCMF1USB30Z
Hersteller: NXP Semiconductors
Description: NEXPERIA PCMF1USB - ELECTRONIC I
Packaging: Bulk
auf Bestellung 20495 Stücke:
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Anzahl Preis
1998+0.25 EUR
Mindestbestellmenge: 1998
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PZU20BA,115 PZUXBA_SER.pdf
PZU20BA,115
Hersteller: NXP Semiconductors
Description: DIODE ZENER 20V 320MW SOD323
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
auf Bestellung 48000 Stücke:
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12488+0.03 EUR
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PZU20B1A,115 PZUXBA_SER.pdf
PZU20B1A,115
Hersteller: NXP Semiconductors
Description: DIODE ZENER 20V 320MW SOD323
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
auf Bestellung 15000 Stücke:
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Anzahl Preis
15000+0.03 EUR
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PZU20B2,115 PHGLS19743-1.pdf?t.download=true&u=5oefqw
PZU20B2,115
Hersteller: NXP Semiconductors
Description: DIODE ZENER 20V 310MW SOD323F
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323F
Power - Max: 310 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
auf Bestellung 27000 Stücke:
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Anzahl Preis
10804+0.05 EUR
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