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PESD2NFC-LYL PESD2NFC-LYL NXP Semiconductors PESD5V0F1BL.pdf Description: TVS DIODE 24VWM DFN1006-2
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Voltage - Reverse Standoff (Typ): 24V (Max)
Supplier Device Package: DFN1006-2
Bidirectional Channels: 1
Power Line Protection: No
auf Bestellung 10000 Stücke:
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3309+0.15 EUR
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BZX79-C22,143 BZX79-C22,143 NXP Semiconductors BZX79.pdf Description: DIODE ZENER 22V 400MW ALF2
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 55 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
auf Bestellung 75000 Stücke:
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13172+0.034 EUR
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MC68302AG25C NXP Semiconductors FSCLS09687-1.pdf?t.download=true&u=5oefqw Description: IC MPU 25MHZ 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
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5+98.18 EUR
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MC68302EH25CB1 MC68302EH25CB1 NXP Semiconductors FSCLS09687-1.pdf?t.download=true&u=5oefqw Description: IC MPU M683XX 25MHZ 132PQFP
Packaging: Bulk
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5V
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
auf Bestellung 54 Stücke:
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4+130.68 EUR
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A7101CLTK2/T0BC2WJ A7101CLTK2/T0BC2WJ NXP Semiconductors PHGL-S-A0006349687-1.pdf?t.download=true&amp;u=5oefqw Description: RF MOSFET
Packaging: Bulk
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SPC5746CHK1AMMH6 SPC5746CHK1AMMH6 NXP Semiconductors SPC5746CFK1ACKU6.pdf?t.download=true&u=axiww2 Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
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14+38.36 EUR
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74HCT597DB,112 74HCT597DB,112 NXP Semiconductors PHGLS29568-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74HCT597DB - PARALLEL I
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74AUP1G157GF,132 74AUP1G157GF,132 NXP Semiconductors PHGLS24877-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74AUP1G157GF - MULTIPLE
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT891 (1x1)
auf Bestellung 15300 Stücke:
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1972+0.25 EUR
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NX5P1100UKZ NX5P1100UKZ NXP Semiconductors NX5P1100.pdf Description: NX5P1100UK - Logic controlled hi
Packaging: Bulk
Features: Slew Rate Controlled
Package / Case: 12-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 60mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.66x1.36)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
auf Bestellung 12407 Stücke:
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456+1.02 EUR
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A2V09H400-04NR3 NXP Semiconductors PHGL-S-A0003207742-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 720MHz ~ 960MHz
Configuration: 2 N-Channel
Power - Output: 107W
Gain: 17.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 688 mA
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4+156.88 EUR
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PTN5110DHQZ NXP Semiconductors Description: USB Type-C Rev 3.0 PD PHY, Dongl
Packaging: Bulk
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Bus, I2C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Supplier Device Package: 16-HX2QFN (2.6x2.6)
auf Bestellung 1000 Stücke:
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192+2.55 EUR
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74LV04PW,118 74LV04PW,118 NXP Semiconductors PHGL-S-A0001366847-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER
Packaging: Bulk
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3217+0.19 EUR
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74LV04D,112 74LV04D,112 NXP Semiconductors 74LV04.pdf Description: IC INVERTER
Packaging: Bulk
auf Bestellung 14744 Stücke:
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2406+0.2 EUR
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BGU8L1X BGU8L1X NXP Semiconductors PHGL-S-A0005068106-1.pdf?t.download=true&u=5oefqw Description: BGU8L1 - C Low Noise Amplifier M
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 14.5dB
Current - Supply: 4.6mA
Noise Figure: 0.7dB
P1dB: -3dBm
Test Frequency: 882MHz
Supplier Device Package: 6-XSON (1.1x0.7)
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1255+0.4 EUR
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MC9S08SU8VFK NXP Semiconductors PHGL-S-A0003028296-1.pdf?t.download=true&u=5oefqw Description: MC9S08SU - 8 bit MCU with S08L c
Packaging: Bulk
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08L
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 17
auf Bestellung 463 Stücke:
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118+4.31 EUR
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74AUP1G07GF,132 74AUP1G07GF,132 NXP Semiconductors PHGLS25181-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON, SOT891 (1x1)
auf Bestellung 295000 Stücke:
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3493+0.15 EUR
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CBT3306D,112 CBT3306D,112 NXP Semiconductors CBT3306.pdf Description: C3306 - NOW NEXPERIA CBT3306D -
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SO
auf Bestellung 2000 Stücke:
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952+0.54 EUR
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BCV65,215 BCV65,215 NXP Semiconductors BCV65.pdf Description: TRANS NPN/PNP 30V 100MA SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP (Emitter Coupled)
Operating Temperature: 150°C (TJ)
Power - Max: 250mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 30V
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 75 @ 2mA, 5V
Supplier Device Package: SOT-143B
Grade: Automotive
Qualification: AEC-Q101
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4561+0.13 EUR
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74LV00DB,118 74LV00DB,118 NXP Semiconductors 74LV00.pdf Description: IC GATE NAND
Packaging: Bulk
auf Bestellung 6000 Stücke:
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1803+0.29 EUR
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74AHC257PW,118 74AHC257PW,118 NXP Semiconductors PHGLS15522-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74AHC257PW - MULTIPLEXE
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
auf Bestellung 11612 Stücke:
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1920+0.27 EUR
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74HCT163D,653 74HCT163D,653 NXP Semiconductors PHGL-S-A0001367747-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74HCT163D - BINARY COUN
Packaging: Bulk
auf Bestellung 6805 Stücke:
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1622+0.32 EUR
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PCMF1USB30Z PCMF1USB30Z NXP Semiconductors PCMFXUSB30_SER.pdf Description: NEXPERIA PCMF1USB - ELECTRONIC I
Packaging: Bulk
auf Bestellung 20495 Stücke:
Lieferzeit 10-14 Tag (e)
1998+0.25 EUR
Mindestbestellmenge: 1998
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PZU20BA,115 PZU20BA,115 NXP Semiconductors PZUXBA_SER.pdf Description: DIODE ZENER 20V 320MW SOD323
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
auf Bestellung 48000 Stücke:
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12488+0.034 EUR
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PZU20B1A,115 PZU20B1A,115 NXP Semiconductors PZUXBA_SER.pdf Description: DIODE ZENER 20V 320MW SOD323
Packaging: Bulk
Tolerance: ±2%
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
auf Bestellung 15000 Stücke:
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15000+0.034 EUR
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PZU20B2,115 PZU20B2,115 NXP Semiconductors PHGLS19743-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 20V 310MW SOD323F
Packaging: Bulk
Tolerance: ±2%
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323F
Power - Max: 310 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
auf Bestellung 27000 Stücke:
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10804+0.051 EUR
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PZU20B,115 PZU20B,115 NXP Semiconductors PHGLS19743-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 19.97V 310MW SOD323F
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
Voltage - Zener (Nom) (Vz): 19.97 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323F
Power - Max: 310 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
auf Bestellung 17666 Stücke:
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10804+0.051 EUR
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PESD1NFC-SFYL NXP Semiconductors PESD18VF1BSF.pdf Description: TVS DIODE 18VWM 16VC DSN06032
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -45°C ~ 125°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 0.28pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1A (8/20µs)
Voltage - Reverse Standoff (Typ): 18V (Max)
Supplier Device Package: DSN0603-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 16V
Power Line Protection: No
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2714+0.16 EUR
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MPC8545VJATGD NXP Semiconductors FSCLS11828-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC85XX 1.2GHZ 783BGA
Packaging: Bulk
Package / Case: 783-BBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-PBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: AES, Cryptography, Kasumi, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, RapidIO
auf Bestellung 118 Stücke:
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2+371.2 EUR
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SCC2698BC1A84,512 SCC2698BC1A84,512 NXP Semiconductors SCC2698B.pdf Description: IC UART OCTAL ENHANCED 84-PLCC
Packaging: Bulk
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Package / Case: 84-LCC (J-Lead)
Number of Channels: 8
Mounting Type: Surface Mount
Voltage - Supply: 5V
Protocol: RS485
Supplier Device Package: 84-PLCC (29.26x29.26)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
auf Bestellung 21 Stücke:
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9+52.78 EUR
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MFRC53101T/0FE,112 MFRC53101T/0FE,112 NXP Semiconductors Description: STANDARD ISO/IEC 14443 A/B READE
Packaging: Bulk
auf Bestellung 1050 Stücke:
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21+24.6 EUR
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PMEG2010EPASX PMEG2010EPASX NXP Semiconductors NEXP-S-A0003105495-1.pdf?t.download=true&u=5oefqw Description: DIODE SCHOTTKY 20V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Schottky
Capacitance @ Vr, F: 175pF @ 1V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DFN2020D-3
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 375 mV @ 1 A
Current - Reverse Leakage @ Vr: 335 µA @ 20 V
Qualification: AEC-Q101
auf Bestellung 27000 Stücke:
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2647+0.18 EUR
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PMEG6010ESBYL NXP Semiconductors PMEG6010ESB.pdf Description: DIODE SCHOTTKY 60V 1A DSN1006-2
Packaging: Bulk
Package / Case: 2-XDFN
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2.4 ns
Technology: Schottky
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DSN1006-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A
Current - Reverse Leakage @ Vr: 30 µA @ 60 V
auf Bestellung 199680 Stücke:
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7088+0.067 EUR
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BZX884-C12,315 BZX884-C12,315 NXP Semiconductors PHGLS19465-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 12V 250MW DFN1006-2
Packaging: Bulk
Tolerance: ±5%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DFN1006-2
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
auf Bestellung 18159 Stücke:
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18159+0.034 EUR
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BFG505/X,215 BFG505/X,215 NXP Semiconductors BFG505_X_Rev4.pdf Description: RF TRANS NPN 15V 9GHZ SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 18mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz
Supplier Device Package: SOT-143B
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PBSS5230QAZ PBSS5230QAZ NXP Semiconductors PBSS5230QA.pdf Description: TRANS PNP 30V 2A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 210mV @ 50mA, 1A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V
Frequency - Transition: 170MHz
Supplier Device Package: DFN1010D-3
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 325 mW
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74AUP3G17GTX 74AUP3G17GTX NXP Semiconductors 74AUP3G17.pdf Description: NEXPERIA 74AUP3G17 - LOW-POWER T
Packaging: Bulk
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MC33886PVWR2 NXP Semiconductors FSCLS11623-1.pdf?t.download=true&u=5oefqw Description: 5.0 A H-Bridge
Packaging: Bulk
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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TEA1733MT/N2,118 TEA1733MT/N2,118 NXP Semiconductors TEA1733MT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 91.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Power (Watts): 75 W
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TEA1703T/N1,118 TEA1703T/N1,118 NXP Semiconductors TEA1703T.pdf Description: IC CTRLR SMPS GREEN OVP 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V ~ 30V
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 30V
Applications: Secondary-Side Controller
Supplier Device Package: 8-SO
Current - Supply: 30 µA
DigiKey Programmable: Not Verified
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TEA1750T/N1,518 TEA1750T/N1,518 NXP Semiconductors TEA1750.pdf Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 125kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Power (Watts): 250 W
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TEA1753T/N1,518 TEA1753T/N1,518 NXP Semiconductors TEA1753T.pdf Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 250kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Power (Watts): 250 W
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NTS0103GU10,115 NTS0103GU10,115 NXP Semiconductors NTS0103.pdf Description: NTS0103 - DUAL SUPPLY TRANSLATIN
Packaging: Bulk
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CGY1047,112 CGY1047,112 NXP Semiconductors CGY1047.pdf Description: NARROW BAND HIGH POWER AMPLIFIER
Packaging: Tube
Package / Case: SOT-115J
Output Type: Push-Pull
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 250 mA
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PMXB350UPEZ PMXB350UPEZ NXP Semiconductors PMXB350UPE.pdf Description: NEXPERIA PMXB350UPE - 20 V, P-CH
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 1.2A (Ta)
Rds On (Max) @ Id, Vgs: 447mOhm @ 1.2A, 4.5V
Power Dissipation (Max): 360mW (Ta), 5.68W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 2.3 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 116 pF @ 10 V
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MPC8377VRAGDA NXP Semiconductors FSCLS06714-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8536EBVJAULA NXP Semiconductors FSCL-S-A0001024010-1.pdf?t.download=true&u=5oefqw Description: IC MPU 1.333GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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LPC11U14FET48/201, LPC11U14FET48/201, NXP Semiconductors PHGLS29590-1.pdf?t.download=true&u=5oefqw Description: LPC11U14- Scalable Entry Level 3
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
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LPC11U13FBD48/201, LPC11U13FBD48/201, NXP Semiconductors PHGLS29590-1.pdf?t.download=true&u=5oefqw Description: LPC11U13 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
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TDA10025HN/C1,518 TDA10025HN/C1,518 NXP Semiconductors TDA10025HN_SDS.pdf Description: IC DEMODULATOR DUAL 48-HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Processor
Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
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LPC4076FBD144E NXP Semiconductors PHGLS25790-1.pdf?t.download=true&u=5oefqw Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 109
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BC54-10PASX BC54-10PASX NXP Semiconductors NEXP-S-A0002912161-1.pdf?t.download=true&u=5oefqw Description: TRANS NPN 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 180MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
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BC51PASX BC51PASX NXP Semiconductors NEXP-S-A0002912151-1.pdf?t.download=true&u=5oefqw Description: TRANS PNP 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 145MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
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PCAL9538APWJ NXP Semiconductors PCAL9538A.pdf Description: PCAL9538A - LOW-VOLTAGE 8-BIT I2
Packaging: Bulk
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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MC9S08GT8ACFDE MC9S08GT8ACFDE NXP Semiconductors FSCL-S-A0001034636-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 8KB FLASH 48MAPQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-MAPQFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MCF51AC128CCFGE NXP Semiconductors FSCLS07439-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50.33MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
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AFT27S010NT1 NXP Semiconductors AFT27S010N.pdf Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Bulk
Package / Case: PLD-1.5W
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 728MHz ~ 3.6GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
Produkt ist nicht verfügbar
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MKM33Z64CLH5 NXP Semiconductors FSCL-S-A0000577355-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR, 24b Sigma-Delta
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MWPR1516CFM MWPR1516CFM NXP Semiconductors FSCL-S-A0000210124-1.pdf?t.download=true&u=5oefqw Description: WIRELESS CHARGER RECEIVER ASSP W
Packaging: Bulk
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.5V ~ 20V
Applications: Wireless Power Transmitter
Supplier Device Package: 32-QFN (5x5)
auf Bestellung 49239 Stücke:
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132+3.41 EUR
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TEA1738GT/N1,118 TEA1738GT/N1,118 NXP Semiconductors TEA1738GT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 118kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature
Voltage - Start Up: 13.2 V
Power (Watts): 75 W
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BAP1321-03,115 BAP1321-03,115 NXP Semiconductors BAP1321-03_Rev_Oct2010.pdf Description: RF DIODE PIN 60V 500MW SOD-323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD-323
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
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PESD2NFC-LYL PESD5V0F1BL.pdf
PESD2NFC-LYL
Hersteller: NXP Semiconductors
Description: TVS DIODE 24VWM DFN1006-2
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Voltage - Reverse Standoff (Typ): 24V (Max)
Supplier Device Package: DFN1006-2
Bidirectional Channels: 1
Power Line Protection: No
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3309+0.15 EUR
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BZX79-C22,143 BZX79.pdf
BZX79-C22,143
Hersteller: NXP Semiconductors
Description: DIODE ZENER 22V 400MW ALF2
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 55 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
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MC68302AG25C FSCLS09687-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU 25MHZ 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
auf Bestellung 44 Stücke:
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Anzahl Preis
5+98.18 EUR
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MC68302EH25CB1 FSCLS09687-1.pdf?t.download=true&u=5oefqw
MC68302EH25CB1
Hersteller: NXP Semiconductors
Description: IC MPU M683XX 25MHZ 132PQFP
Packaging: Bulk
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5V
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
auf Bestellung 54 Stücke:
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Anzahl Preis
4+130.68 EUR
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A7101CLTK2/T0BC2WJ PHGL-S-A0006349687-1.pdf?t.download=true&amp;u=5oefqw
A7101CLTK2/T0BC2WJ
Hersteller: NXP Semiconductors
Description: RF MOSFET
Packaging: Bulk
auf Bestellung 110886 Stücke:
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Anzahl Preis
216+2.1 EUR
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SPC5746CHK1AMMH6 SPC5746CFK1ACKU6.pdf?t.download=true&u=axiww2
SPC5746CHK1AMMH6
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
auf Bestellung 334 Stücke:
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Anzahl Preis
14+38.36 EUR
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74HCT597DB,112 PHGLS29568-1.pdf?t.download=true&u=5oefqw
74HCT597DB,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HCT597DB - PARALLEL I
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74AUP1G157GF,132 PHGLS24877-1.pdf?t.download=true&u=5oefqw
74AUP1G157GF,132
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP1G157GF - MULTIPLE
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT891 (1x1)
auf Bestellung 15300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1972+0.25 EUR
Mindestbestellmenge: 1972
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NX5P1100UKZ NX5P1100.pdf
NX5P1100UKZ
Hersteller: NXP Semiconductors
Description: NX5P1100UK - Logic controlled hi
Packaging: Bulk
Features: Slew Rate Controlled
Package / Case: 12-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 60mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.66x1.36)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
auf Bestellung 12407 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
456+1.02 EUR
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A2V09H400-04NR3 PHGL-S-A0003207742-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 720MHz ~ 960MHz
Configuration: 2 N-Channel
Power - Output: 107W
Gain: 17.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 688 mA
auf Bestellung 454 Stücke:
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Anzahl Preis
4+156.88 EUR
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PTN5110DHQZ
Hersteller: NXP Semiconductors
Description: USB Type-C Rev 3.0 PD PHY, Dongl
Packaging: Bulk
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Bus, I2C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Supplier Device Package: 16-HX2QFN (2.6x2.6)
auf Bestellung 1000 Stücke:
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Anzahl Preis
192+2.55 EUR
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74LV04PW,118 PHGL-S-A0001366847-1.pdf?t.download=true&u=5oefqw
74LV04PW,118
Hersteller: NXP Semiconductors
Description: IC INVERTER
Packaging: Bulk
auf Bestellung 3217 Stücke:
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Anzahl Preis
3217+0.19 EUR
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74LV04D,112 74LV04.pdf
74LV04D,112
Hersteller: NXP Semiconductors
Description: IC INVERTER
Packaging: Bulk
auf Bestellung 14744 Stücke:
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Anzahl Preis
2406+0.2 EUR
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BGU8L1X PHGL-S-A0005068106-1.pdf?t.download=true&u=5oefqw
BGU8L1X
Hersteller: NXP Semiconductors
Description: BGU8L1 - C Low Noise Amplifier M
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 14.5dB
Current - Supply: 4.6mA
Noise Figure: 0.7dB
P1dB: -3dBm
Test Frequency: 882MHz
Supplier Device Package: 6-XSON (1.1x0.7)
auf Bestellung 1352200 Stücke:
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Anzahl Preis
1255+0.4 EUR
Mindestbestellmenge: 1255
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MC9S08SU8VFK PHGL-S-A0003028296-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: MC9S08SU - 8 bit MCU with S08L c
Packaging: Bulk
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08L
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 17
auf Bestellung 463 Stücke:
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Anzahl Preis
118+4.31 EUR
Mindestbestellmenge: 118
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74AUP1G07GF,132 PHGLS25181-1.pdf?t.download=true&u=5oefqw
74AUP1G07GF,132
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON, SOT891 (1x1)
auf Bestellung 295000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3493+0.15 EUR
Mindestbestellmenge: 3493
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CBT3306D,112 CBT3306.pdf
CBT3306D,112
Hersteller: NXP Semiconductors
Description: C3306 - NOW NEXPERIA CBT3306D -
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SO
auf Bestellung 2000 Stücke:
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Anzahl Preis
952+0.54 EUR
Mindestbestellmenge: 952
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BCV65,215 BCV65.pdf
BCV65,215
Hersteller: NXP Semiconductors
Description: TRANS NPN/PNP 30V 100MA SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP (Emitter Coupled)
Operating Temperature: 150°C (TJ)
Power - Max: 250mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 30V
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 75 @ 2mA, 5V
Supplier Device Package: SOT-143B
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 4561 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4561+0.13 EUR
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74LV00DB,118 74LV00.pdf
74LV00DB,118
Hersteller: NXP Semiconductors
Description: IC GATE NAND
Packaging: Bulk
auf Bestellung 6000 Stücke:
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Anzahl Preis
1803+0.29 EUR
Mindestbestellmenge: 1803
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74AHC257PW,118 PHGLS15522-1.pdf?t.download=true&u=5oefqw
74AHC257PW,118
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AHC257PW - MULTIPLEXE
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
auf Bestellung 11612 Stücke:
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Anzahl Preis
1920+0.27 EUR
Mindestbestellmenge: 1920
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74HCT163D,653 PHGL-S-A0001367747-1.pdf?t.download=true&u=5oefqw
74HCT163D,653
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HCT163D - BINARY COUN
Packaging: Bulk
auf Bestellung 6805 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1622+0.32 EUR
Mindestbestellmenge: 1622
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PCMF1USB30Z PCMFXUSB30_SER.pdf
PCMF1USB30Z
Hersteller: NXP Semiconductors
Description: NEXPERIA PCMF1USB - ELECTRONIC I
Packaging: Bulk
auf Bestellung 20495 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1998+0.25 EUR
Mindestbestellmenge: 1998
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PZU20BA,115 PZUXBA_SER.pdf
PZU20BA,115
Hersteller: NXP Semiconductors
Description: DIODE ZENER 20V 320MW SOD323
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
auf Bestellung 48000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12488+0.034 EUR
Mindestbestellmenge: 12488
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PZU20B1A,115 PZUXBA_SER.pdf
PZU20B1A,115
Hersteller: NXP Semiconductors
Description: DIODE ZENER 20V 320MW SOD323
Packaging: Bulk
Tolerance: ±2%
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15000+0.034 EUR
Mindestbestellmenge: 15000
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PZU20B2,115 PHGLS19743-1.pdf?t.download=true&u=5oefqw
PZU20B2,115
Hersteller: NXP Semiconductors
Description: DIODE ZENER 20V 310MW SOD323F
Packaging: Bulk
Tolerance: ±2%
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323F
Power - Max: 310 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10804+0.051 EUR
Mindestbestellmenge: 10804
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PZU20B,115 PHGLS19743-1.pdf?t.download=true&u=5oefqw
PZU20B,115
Hersteller: NXP Semiconductors
Description: DIODE ZENER 19.97V 310MW SOD323F
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
Voltage - Zener (Nom) (Vz): 19.97 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323F
Power - Max: 310 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
auf Bestellung 17666 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10804+0.051 EUR
Mindestbestellmenge: 10804
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PESD1NFC-SFYL PESD18VF1BSF.pdf
Hersteller: NXP Semiconductors
Description: TVS DIODE 18VWM 16VC DSN06032
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -45°C ~ 125°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 0.28pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1A (8/20µs)
Voltage - Reverse Standoff (Typ): 18V (Max)
Supplier Device Package: DSN0603-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 16V
Power Line Protection: No
auf Bestellung 8730 Stücke:
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Anzahl Preis
2714+0.16 EUR
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MPC8545VJATGD FSCLS11828-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC85XX 1.2GHZ 783BGA
Packaging: Bulk
Package / Case: 783-BBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-PBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: AES, Cryptography, Kasumi, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, RapidIO
auf Bestellung 118 Stücke:
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Anzahl Preis
2+371.2 EUR
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SCC2698BC1A84,512 SCC2698B.pdf
SCC2698BC1A84,512
Hersteller: NXP Semiconductors
Description: IC UART OCTAL ENHANCED 84-PLCC
Packaging: Bulk
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Package / Case: 84-LCC (J-Lead)
Number of Channels: 8
Mounting Type: Surface Mount
Voltage - Supply: 5V
Protocol: RS485
Supplier Device Package: 84-PLCC (29.26x29.26)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
auf Bestellung 21 Stücke:
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Anzahl Preis
9+52.78 EUR
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MFRC53101T/0FE,112
MFRC53101T/0FE,112
Hersteller: NXP Semiconductors
Description: STANDARD ISO/IEC 14443 A/B READE
Packaging: Bulk
auf Bestellung 1050 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
21+24.6 EUR
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PMEG2010EPASX NEXP-S-A0003105495-1.pdf?t.download=true&u=5oefqw
PMEG2010EPASX
Hersteller: NXP Semiconductors
Description: DIODE SCHOTTKY 20V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Schottky
Capacitance @ Vr, F: 175pF @ 1V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DFN2020D-3
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 375 mV @ 1 A
Current - Reverse Leakage @ Vr: 335 µA @ 20 V
Qualification: AEC-Q101
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2647+0.18 EUR
Mindestbestellmenge: 2647
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PMEG6010ESBYL PMEG6010ESB.pdf
Hersteller: NXP Semiconductors
Description: DIODE SCHOTTKY 60V 1A DSN1006-2
Packaging: Bulk
Package / Case: 2-XDFN
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2.4 ns
Technology: Schottky
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DSN1006-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A
Current - Reverse Leakage @ Vr: 30 µA @ 60 V
auf Bestellung 199680 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7088+0.067 EUR
Mindestbestellmenge: 7088
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BZX884-C12,315 PHGLS19465-1.pdf?t.download=true&u=5oefqw
BZX884-C12,315
Hersteller: NXP Semiconductors
Description: DIODE ZENER 12V 250MW DFN1006-2
Packaging: Bulk
Tolerance: ±5%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DFN1006-2
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
auf Bestellung 18159 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
18159+0.034 EUR
Mindestbestellmenge: 18159
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BFG505/X,215 BFG505_X_Rev4.pdf
BFG505/X,215
Hersteller: NXP Semiconductors
Description: RF TRANS NPN 15V 9GHZ SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 18mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz
Supplier Device Package: SOT-143B
auf Bestellung 4610 Stücke:
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Anzahl Preis
1366+0.33 EUR
Mindestbestellmenge: 1366
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PBSS5230QAZ PBSS5230QA.pdf
PBSS5230QAZ
Hersteller: NXP Semiconductors
Description: TRANS PNP 30V 2A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 210mV @ 50mA, 1A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V
Frequency - Transition: 170MHz
Supplier Device Package: DFN1010D-3
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 325 mW
auf Bestellung 554308 Stücke:
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Anzahl Preis
4691+0.1 EUR
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74AUP3G17GTX 74AUP3G17.pdf
74AUP3G17GTX
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP3G17 - LOW-POWER T
Packaging: Bulk
auf Bestellung 4973 Stücke:
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Anzahl Preis
2565+0.19 EUR
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MC33886PVWR2 FSCLS11623-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: 5.0 A H-Bridge
Packaging: Bulk
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
auf Bestellung 625 Stücke:
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Anzahl Preis
52+9.02 EUR
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TEA1733MT/N2,118 TEA1733MT.pdf
TEA1733MT/N2,118
Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 91.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Power (Watts): 75 W
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
519+0.88 EUR
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TEA1703T/N1,118 TEA1703T.pdf
TEA1703T/N1,118
Hersteller: NXP Semiconductors
Description: IC CTRLR SMPS GREEN OVP 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V ~ 30V
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 30V
Applications: Secondary-Side Controller
Supplier Device Package: 8-SO
Current - Supply: 30 µA
DigiKey Programmable: Not Verified
auf Bestellung 9883 Stücke:
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Anzahl Preis
404+1.12 EUR
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TEA1750T/N1,518 TEA1750.pdf
TEA1750T/N1,518
Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 125kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Power (Watts): 250 W
auf Bestellung 4502 Stücke:
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Anzahl Preis
202+2.25 EUR
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TEA1753T/N1,518 TEA1753T.pdf
TEA1753T/N1,518
Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 250kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Power (Watts): 250 W
auf Bestellung 1640 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
157+2.88 EUR
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NTS0103GU10,115 NTS0103.pdf
NTS0103GU10,115
Hersteller: NXP Semiconductors
Description: NTS0103 - DUAL SUPPLY TRANSLATIN
Packaging: Bulk
auf Bestellung 6604 Stücke:
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Anzahl Preis
409+1.1 EUR
Mindestbestellmenge: 409
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CGY1047,112 CGY1047.pdf
CGY1047,112
Hersteller: NXP Semiconductors
Description: NARROW BAND HIGH POWER AMPLIFIER
Packaging: Tube
Package / Case: SOT-115J
Output Type: Push-Pull
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 250 mA
auf Bestellung 2194 Stücke:
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Anzahl Preis
12+38.99 EUR
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PMXB350UPEZ PMXB350UPE.pdf
PMXB350UPEZ
Hersteller: NXP Semiconductors
Description: NEXPERIA PMXB350UPE - 20 V, P-CH
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 1.2A (Ta)
Rds On (Max) @ Id, Vgs: 447mOhm @ 1.2A, 4.5V
Power Dissipation (Max): 360mW (Ta), 5.68W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 2.3 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 116 pF @ 10 V
auf Bestellung 659217 Stücke:
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Anzahl Preis
3703+0.12 EUR
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MPC8377VRAGDA FSCLS06714-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
auf Bestellung 339 Stücke:
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Anzahl Preis
6+84.8 EUR
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MPC8536EBVJAULA FSCL-S-A0001024010-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU 1.333GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
auf Bestellung 36 Stücke:
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Anzahl Preis
2+393.28 EUR
Mindestbestellmenge: 2
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LPC11U14FET48/201, PHGLS29590-1.pdf?t.download=true&u=5oefqw
LPC11U14FET48/201,
Hersteller: NXP Semiconductors
Description: LPC11U14- Scalable Entry Level 3
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
auf Bestellung 861 Stücke:
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Anzahl Preis
124+3.65 EUR
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LPC11U13FBD48/201, PHGLS29590-1.pdf?t.download=true&u=5oefqw
LPC11U13FBD48/201,
Hersteller: NXP Semiconductors
Description: LPC11U13 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
auf Bestellung 1095 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
135+3.37 EUR
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TDA10025HN/C1,518 TDA10025HN_SDS.pdf
TDA10025HN/C1,518
Hersteller: NXP Semiconductors
Description: IC DEMODULATOR DUAL 48-HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Processor
Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
auf Bestellung 4000 Stücke:
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Anzahl Preis
141+3.2 EUR
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LPC4076FBD144E PHGLS25790-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 109
auf Bestellung 654 Stücke:
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Anzahl Preis
37+12.61 EUR
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BC54-10PASX NEXP-S-A0002912161-1.pdf?t.download=true&u=5oefqw
BC54-10PASX
Hersteller: NXP Semiconductors
Description: TRANS NPN 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 180MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
auf Bestellung 146990 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3904+0.12 EUR
Mindestbestellmenge: 3904
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BC51PASX NEXP-S-A0002912151-1.pdf?t.download=true&u=5oefqw
BC51PASX
Hersteller: NXP Semiconductors
Description: TRANS PNP 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 145MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
auf Bestellung 51000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3904+0.12 EUR
Mindestbestellmenge: 3904
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PCAL9538APWJ PCAL9538A.pdf
Hersteller: NXP Semiconductors
Description: PCAL9538A - LOW-VOLTAGE 8-BIT I2
Packaging: Bulk
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
auf Bestellung 15557 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
249+1.87 EUR
Mindestbestellmenge: 249
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MC9S08GT8ACFDE FSCL-S-A0001034636-1.pdf?t.download=true&u=5oefqw
MC9S08GT8ACFDE
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 8KB FLASH 48MAPQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-MAPQFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 393 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
73+6.23 EUR
Mindestbestellmenge: 73
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MCF51AC128CCFGE FSCLS07439-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50.33MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 125 Stücke:
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Anzahl Preis
29+15.72 EUR
Mindestbestellmenge: 29
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AFT27S010NT1 AFT27S010N.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Bulk
Package / Case: PLD-1.5W
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 728MHz ~ 3.6GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
Produkt ist nicht verfügbar
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MKM33Z64CLH5 FSCL-S-A0000577355-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR, 24b Sigma-Delta
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
89+5.06 EUR
Mindestbestellmenge: 89
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MWPR1516CFM FSCL-S-A0000210124-1.pdf?t.download=true&u=5oefqw
MWPR1516CFM
Hersteller: NXP Semiconductors
Description: WIRELESS CHARGER RECEIVER ASSP W
Packaging: Bulk
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.5V ~ 20V
Applications: Wireless Power Transmitter
Supplier Device Package: 32-QFN (5x5)
auf Bestellung 49239 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
132+3.41 EUR
Mindestbestellmenge: 132
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TEA1738GT/N1,118 TEA1738GT.pdf
TEA1738GT/N1,118
Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 118kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature
Voltage - Start Up: 13.2 V
Power (Watts): 75 W
auf Bestellung 3861 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
466+0.97 EUR
Mindestbestellmenge: 466
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BAP1321-03,115 BAP1321-03_Rev_Oct2010.pdf
BAP1321-03,115
Hersteller: NXP Semiconductors
Description: RF DIODE PIN 60V 500MW SOD-323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD-323
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
auf Bestellung 9190 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3122+0.15 EUR
Mindestbestellmenge: 3122
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