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TFA9881UK/N1,023 TFA9881UK/N1,023 NXP Semiconductors PHGLS27948-1.pdf?t.download=true&u=5oefqw Description: IC AMP AUDIO CLASSD 3.4W 9WLCSP
Packaging: Bulk
auf Bestellung 70000 Stücke:
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485+1.01 EUR
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74AUP1G17GN,132 74AUP1G17GN,132 NXP Semiconductors PHGL-S-A0000283103-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
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1920+0.26 EUR
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74AUP2G3404GN,125 74AUP2G3404GN,125 NXP Semiconductors 74AUP2G3404.pdf Description: NEXPERIA 74AUP2G3404GN - INVERTE
Packaging: Bulk
auf Bestellung 225000 Stücke:
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CBT3257AD,118 CBT3257AD,118 NXP Semiconductors CBT3257A.pdf Description: NEXPERIA CBT3257AD - MULTIPLEXER
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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1665+0.29 EUR
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CBTL06122AHF,518 CBTL06122AHF,518 NXP Semiconductors CBTL06122.pdf Description: IC MULTIPLEXER HEX 1X2 56HWQFN
Features: Bi-Directional
Packaging: Bulk
Package / Case: 56-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe
-3db Bandwidth: 2.5GHz
Supplier Device Package: 56-HWQFN (5x11)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 6
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MC9S08AC128MFUE NXP Semiconductors FSCL-S-A0001039679-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 16x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
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MIMX8ML4DVNLZAB NXP Semiconductors Description: IC MPU I.MX8M 1.8GHZ 486LFBGA
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CANbus, I2C, I2S, PCIe, SD/SDIO, SPI, UART
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MCIMX6Q4AVT10AC NXP Semiconductors FSCL-S-A0001020796-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6 1GHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6S8DVM10AC NXP Semiconductors FSCL-S-A0000998349-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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MCIMX6U5EVM10AC NXP Semiconductors FSCL-S-A0000998349-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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MCIMX6U4AVM08AC NXP Semiconductors FSCL-S-A0000998349-1.pdf?t.download=true&u=5oefqw Description: IC MPU 800MHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 697 Stücke:
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MCIMX6U1AVM10AC NXP Semiconductors FSCLS11779-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 600 Stücke:
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7+76.82 EUR
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MCIMX6D4AVT08ADR NXP Semiconductors PHGL-S-A0006627490-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6 852MHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 782 Stücke:
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5+105.99 EUR
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PN7462AUEV/C300Y PN7462AUEV/C300Y NXP Semiconductors PN7462.pdf Description: PN7462AUEV - NFC Cortex®
Packaging: Bulk
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
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LPC1114JBD48/303QL LPC1114JBD48/303QL NXP Semiconductors PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
auf Bestellung 220 Stücke:
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110+4.46 EUR
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TDF8544J/N2,112 TDF8544J/N2,112 NXP Semiconductors TDF8544.pdf Description: IC AMP AUDIO BTL DBS27P
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
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29+16.08 EUR
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TFF1012HN/N1,115 TFF1012HN/N1,115 NXP Semiconductors TFF1012HN.pdf Description: TFF1012HN - INTEGRATED MIXER OSC
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 10.7GHz ~ 12.75GHz
RF Type: Ku-Band
Voltage - Supply: 4.5V ~ 5.5V
Gain: 30dB
Current - Supply: 52mA
Secondary Attributes: Down Converter
Noise Figure: 9dB
Number of Mixers: 1
Supplier Device Package: 16-DHVQFN (2.5x3.5)
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1807+0.28 EUR
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74LVC157APW,112 74LVC157APW,112 NXP Semiconductors 74LVC157A.pdf Description: NEXPERIA 74LVC157APW - MULTIPLEX
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
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2367+0.22 EUR
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BUK7575-55A,127 BUK7575-55A,127 NXP Semiconductors PHGLS22290-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA BUK7575 - N-CHANNEL MO
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 20.3A (Tc)
Rds On (Max) @ Id, Vgs: 75mOhm @ 10A, 10V
Power Dissipation (Max): 62W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 483 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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BAP50-04,215 BAP50-04,215 NXP Semiconductors BAP50-04.pdf Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 50 mA
Power Dissipation (Max): 250 mW
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MW7IC930NR1 NXP Semiconductors FSCLS05412-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 28V TO270-16
Packaging: Bulk
Package / Case: TO-270-16 Variant, Flat Leads
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 920MHz ~ 960MHz
Configuration: 2 N-Channel
Power - Output: 3.2W
Gain: 35.9dB
Technology: LDMOS (Dual)
Supplier Device Package: TO-270WB-16
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 285 mA
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74LVT244ADB,118 74LVT244ADB,118 NXP Semiconductors 74LVT_LVTH244A.pdf Description: IC BUFFER NON-INVERT 3.6V 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SSOP
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1019+0.49 EUR
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74LVT16244BDGG,118 74LVT16244BDGG,118 NXP Semiconductors PHGLS24271-1.pdf?t.download=true&u=5oefqw Description: IC BUFF NON-INVERT 3.6V 48TSSOP
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-TSSOP
auf Bestellung 2002 Stücke:
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790+0.64 EUR
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LS1012AXN7KKB NXP Semiconductors LS1012AFS.pdf Description: IC MPU QORLQ LS1 1GHZ 211FCLGA
Packaging: Bulk
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, GPIO, I2C, I2S, SPI, UART
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13+39.3 EUR
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P1010NSE5HFB NXP Semiconductors FSCLS11925-1.pdf?t.download=true&u=5oefqw Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Bulk
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: CANbus, DUART, I2C, MMC/SD, SPI
auf Bestellung 521 Stücke:
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7+77.66 EUR
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LPC4078FBD144,551 LPC4078FBD144,551 NXP Semiconductors PHGLS25790-1.pdf?t.download=true&u=5oefqw Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 109
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MC68HC11E9BCFNE2 NXP Semiconductors M68HC11E.pdf Description: M68HC11E - 8BIT MCU,12K BUFFALO
Packaging: Bulk
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROM
EEPROM Size: 512 x 8
Core Processor: M68HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.13x19.13)
Number of I/O: 16
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PSMN018-100ESFQ PSMN018-100ESFQ NXP Semiconductors PSMN018-100ESF.pdf Description: NEXPERIA PSMN018 - NEXTPOWER 100
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 53A (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 15A, 10V
Power Dissipation (Max): 111W (Ta)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 7V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 21.4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1482 pF @ 50 V
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MMA2201KEGR2 MMA2201KEGR2 NXP Semiconductors MMA2201KEG.pdf Description: MMA2201KE - MEDIUM-G, ANALOG ACC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X
Acceleration Range: ±40g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 50
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74HCT10PW,112 74HCT10PW,112 NXP Semiconductors PHGL-S-A0002307496-1.pdf?t.download=true&u=5oefqw Description: IC GATE NAND
Packaging: Bulk
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74HCT109PW,112 74HCT109PW,112 NXP Semiconductors PHGL-S-A0002303329-1.pdf?t.download=true&u=5oefqw Description: IC FF JK TYPE DUAL 1BIT 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 55 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-TSSOP
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Number of Bits per Element: 1
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74LVC1G98GM,132 74LVC1G98GM,132 NXP Semiconductors 74LVC1G98.pdf Description: NEXPERIA 74LVC1G98 - LOWPOWER CO
Packaging: Bulk
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74AUP2G3407GMH 74AUP2G3407GMH NXP Semiconductors PHGLS28868-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA; 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
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LPC1112FDH28/102:5 LPC1112FDH28/102:5 NXP Semiconductors PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: LPC1112 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
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201+2.51 EUR
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LPC1112LVFHN24/003 LPC1112LVFHN24/003 NXP Semiconductors PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: LPC1112 - Scalable Entry Level 3
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: FIFO, I2C, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Number of I/O: 20
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193+2.61 EUR
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MRFX1K80H-230MHZ NXP Semiconductors MRFX1K80H.pdf Description: RF MOSFET LDMOS 65V NI1230
Packaging: Bulk
Package / Case: SOT-979A
Current Rating (Amps): 100mA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: Dual
Power - Output: 1800W
Gain: 25.1dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 1.5 A
Produkt ist nicht verfügbar
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BC859B,215 BC859B,215 NXP Semiconductors BC859_BC860.pdf Description: TRANS PNP 30V 0.1A TO-236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 250 mW
Qualification: AEC-Q101
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MKW20Z160VHT4 NXP Semiconductors PHGL-S-A0005067296-1.pdf?t.download=true&u=5oefqw Description: IC RF TXRX+MCU 802.15.4
Packaging: Bulk
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 160kB Flash, 20kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.45V ~ 3.6V
Power - Output: 5dBm
Protocol: ZigbeePRO®
Current - Receiving: 6.5mA ~ 15.4mA
Data Rate (Max): 250kbps
Current - Transmitting: 8.4mA ~ 18.5mA
GPIO: 28
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
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74LVC139D,112 74LVC139D,112 NXP Semiconductors PHGLS23390-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74LVC139D - DECODER/DRI
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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MRFE6VP8600HR5 NXP Semiconductors MRFE6VP8600H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230
Current Rating (Amps): 20µA
Mounting Type: Chassis Mount
Frequency: 470MHz ~ 860MHz
Configuration: Dual, Common Source
Power - Output: 600W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 1.4 A
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BAT18,235 BAT18,235 NXP Semiconductors BAT18.pdf Description: RF DIODE STANDARD 35V SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Standard - Single
Operating Temperature: 125°C (TJ)
Capacitance @ Vr, F: 1pF @ 20V, 1MHz
Resistance @ If, F: 700mOhm @ 5mA, 200MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
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PCF7961XTT/D1AC09J NXP Semiconductors Description: IMMO COMBI CHIP
Features: Programmable
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Memory Size: 192B RAM, 512B EEPROM
Modulation or Protocol: UHF
Voltage - Supply: 2.1V ~ 3.6V
Applications: Remote Keyless Entry
Supplier Device Package: 20-TSSOP
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PDTA115EU,115 PDTA115EU,115 NXP Semiconductors PIRSS13039-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS
Packaging: Bulk
auf Bestellung 174000 Stücke:
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74AUP1G79GM,115 74AUP1G79GM,115 NXP Semiconductors PHGLS24882-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 50pF
Number of Bits per Element: 1
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74LVC2G02GN,115 74LVC2G02GN,115 NXP Semiconductors 74LVC2G02.pdf Description: IC DUAL 2-INP
Packaging: Bulk
auf Bestellung 40000 Stücke:
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74HCT2G17GW-Q100H 74HCT2G17GW-Q100H NXP Semiconductors 74HC_HCT2G17_Q100.pdf Description: IC BUFFER NON-INVERT 5.5V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-TSSOP
Grade: Automotive
Qualification: AEC-Q100
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2796+0.19 EUR
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MPC860DTCZQ50D4 NXP Semiconductors FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 384 Stücke:
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2+277.16 EUR
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NVT4555UKZ NVT4555UKZ NXP Semiconductors PHGLS28214-1.pdf?t.download=true&u=5oefqw Description: NVT4555UK - SIM card interface l
Packaging: Bulk
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Voltage - Supply: 1.1V ~ 3.6V
Applications: SIM Card
Supplier Device Package: 12-WLCSP (1.62x1.19)
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454+1.11 EUR
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PN7362BNHN/C300Y PN7362BNHN/C300Y NXP Semiconductors PN7462.pdf Description: PN7362 - NFC CORTEX-M0 MICROCONT
Packaging: Bulk
DigiKey Programmable: Not Verified
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48+10.51 EUR
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PESD2NFC-LYL PESD2NFC-LYL NXP Semiconductors PESD5V0F1BL.pdf Description: TVS DIODE 24VWM DFN1006-2
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Voltage - Reverse Standoff (Typ): 24V (Max)
Supplier Device Package: DFN1006-2
Bidirectional Channels: 1
Power Line Protection: No
auf Bestellung 10000 Stücke:
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3309+0.15 EUR
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BZX79-C22,133 BZX79-C22,133 NXP Semiconductors BZX79.pdf Description: DIODE ZENER 22V 400MW ALF2
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 55 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15.4 V
auf Bestellung 89940 Stücke:
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BZX79-C22,143 BZX79-C22,143 NXP Semiconductors BZX79.pdf Description: DIODE ZENER 22V 400MW ALF2
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 55 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
auf Bestellung 75000 Stücke:
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PBSS4130QAZ PBSS4130QAZ NXP Semiconductors NEXP-S-A0003560291-1.pdf?t.download=true&u=5oefqw Description: TRANS NPN 30V 1A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 245mV @ 50mA, 1A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 1A, 2V
Frequency - Transition: 190MHz
Supplier Device Package: DFN1010D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 325 mW
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MC68302AG25C NXP Semiconductors FSCLS09687-1.pdf?t.download=true&u=5oefqw Description: IC MPU 25MHZ 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
auf Bestellung 144 Stücke:
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MC68302EH25CB1 MC68302EH25CB1 NXP Semiconductors FSCLS09687-1.pdf?t.download=true&u=5oefqw Description: IC MPU M683XX 25MHZ 132PQFP
Packaging: Bulk
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5V
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
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4+130.68 EUR
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A7101CLTK2/T0BC2WJ A7101CLTK2/T0BC2WJ NXP Semiconductors PHGL-S-A0006349687-1.pdf?t.download=true&amp;u=5oefqw Description: RF MOSFET
Packaging: Bulk
auf Bestellung 111264 Stücke:
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260+1.77 EUR
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PMBTA14,215 PMBTA14,215 NXP Semiconductors PMBTA13_PMBTA14.pdf Description: TRANS NPN DARL 30V 0.5A TO-236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN - Darlington
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.5V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 20000 @ 100mA, 5V
Frequency - Transition: 125MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 250 mW
Qualification: AEC-Q101
auf Bestellung 96000 Stücke:
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6968+0.068 EUR
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SPC5746CHK1AMMH6 SPC5746CHK1AMMH6 NXP Semiconductors SPC5746CFK1ACKU6.pdf?t.download=true&u=axiww2 Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
auf Bestellung 334 Stücke:
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14+38.36 EUR
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74HCT597DB,112 74HCT597DB,112 NXP Semiconductors PHGLS29568-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74HCT597DB - PARALLEL I
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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BZV55-B33,115 BZV55-B33,115 NXP Semiconductors BZV55_SER.pdf Description: DIODE ZENER 33V 500MW LLDS
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: LLDS; MiniMelf
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
auf Bestellung 127500 Stücke:
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13172+0.034 EUR
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TFA9881UK/N1,023 PHGLS27948-1.pdf?t.download=true&u=5oefqw
TFA9881UK/N1,023
Hersteller: NXP Semiconductors
Description: IC AMP AUDIO CLASSD 3.4W 9WLCSP
Packaging: Bulk
auf Bestellung 70000 Stücke:
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Anzahl Preis
485+1.01 EUR
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74AUP1G17GN,132 PHGL-S-A0000283103-1.pdf?t.download=true&u=5oefqw
74AUP1G17GN,132
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
auf Bestellung 5000 Stücke:
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1920+0.26 EUR
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74AUP2G3404GN,125 74AUP2G3404.pdf
74AUP2G3404GN,125
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP2G3404GN - INVERTE
Packaging: Bulk
auf Bestellung 225000 Stücke:
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Anzahl Preis
1227+0.39 EUR
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CBT3257AD,118 CBT3257A.pdf
CBT3257AD,118
Hersteller: NXP Semiconductors
Description: NEXPERIA CBT3257AD - MULTIPLEXER
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 45080 Stücke:
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1665+0.29 EUR
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CBTL06122AHF,518 CBTL06122.pdf
CBTL06122AHF,518
Hersteller: NXP Semiconductors
Description: IC MULTIPLEXER HEX 1X2 56HWQFN
Features: Bi-Directional
Packaging: Bulk
Package / Case: 56-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe
-3db Bandwidth: 2.5GHz
Supplier Device Package: 56-HWQFN (5x11)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 6
auf Bestellung 65 Stücke:
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65+1.35 EUR
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MC9S08AC128MFUE FSCL-S-A0001039679-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 16x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 40 Stücke:
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Anzahl Preis
40+11.93 EUR
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MIMX8ML4DVNLZAB
Hersteller: NXP Semiconductors
Description: IC MPU I.MX8M 1.8GHZ 486LFBGA
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CANbus, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 11643 Stücke:
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Anzahl Preis
11+44.99 EUR
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MCIMX6Q4AVT10AC FSCL-S-A0001020796-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6 1GHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 184 Stücke:
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Anzahl Preis
4+123.68 EUR
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MCIMX6S8DVM10AC FSCL-S-A0000998349-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 180 Stücke:
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Anzahl Preis
11+47.44 EUR
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MCIMX6U5EVM10AC FSCL-S-A0000998349-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 300 Stücke:
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Anzahl Preis
8+62.11 EUR
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MCIMX6U4AVM08AC FSCL-S-A0000998349-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU 800MHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 697 Stücke:
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Anzahl Preis
8+64.93 EUR
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MCIMX6U1AVM10AC FSCLS11779-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 600 Stücke:
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Anzahl Preis
7+76.82 EUR
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MCIMX6D4AVT08ADR PHGL-S-A0006627490-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6 852MHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 782 Stücke:
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Anzahl Preis
5+105.99 EUR
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PN7462AUEV/C300Y PN7462.pdf
PN7462AUEV/C300Y
Hersteller: NXP Semiconductors
Description: PN7462AUEV - NFC Cortex®
Packaging: Bulk
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
auf Bestellung 4000 Stücke:
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Anzahl Preis
44+10.58 EUR
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LPC1114JBD48/303QL PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114JBD48/303QL
Hersteller: NXP Semiconductors
Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
auf Bestellung 220 Stücke:
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Anzahl Preis
110+4.46 EUR
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TDF8544J/N2,112 TDF8544.pdf
TDF8544J/N2,112
Hersteller: NXP Semiconductors
Description: IC AMP AUDIO BTL DBS27P
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
auf Bestellung 53 Stücke:
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Anzahl Preis
29+16.08 EUR
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TFF1012HN/N1,115 TFF1012HN.pdf
TFF1012HN/N1,115
Hersteller: NXP Semiconductors
Description: TFF1012HN - INTEGRATED MIXER OSC
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 10.7GHz ~ 12.75GHz
RF Type: Ku-Band
Voltage - Supply: 4.5V ~ 5.5V
Gain: 30dB
Current - Supply: 52mA
Secondary Attributes: Down Converter
Noise Figure: 9dB
Number of Mixers: 1
Supplier Device Package: 16-DHVQFN (2.5x3.5)
auf Bestellung 70570 Stücke:
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Anzahl Preis
1807+0.28 EUR
Mindestbestellmenge: 1807
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74LVC157APW,112 74LVC157A.pdf
74LVC157APW,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC157APW - MULTIPLEX
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
auf Bestellung 58254 Stücke:
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Anzahl Preis
2367+0.22 EUR
Mindestbestellmenge: 2367
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BUK7575-55A,127 PHGLS22290-1.pdf?t.download=true&u=5oefqw
BUK7575-55A,127
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK7575 - N-CHANNEL MO
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 20.3A (Tc)
Rds On (Max) @ Id, Vgs: 75mOhm @ 10A, 10V
Power Dissipation (Max): 62W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 483 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 4013 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
833+0.61 EUR
Mindestbestellmenge: 833
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BAP50-04,215 BAP50-04.pdf
BAP50-04,215
Hersteller: NXP Semiconductors
Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 50 mA
Power Dissipation (Max): 250 mW
auf Bestellung 19695 Stücke:
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Anzahl Preis
2712+0.18 EUR
Mindestbestellmenge: 2712
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MW7IC930NR1 FSCLS05412-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 28V TO270-16
Packaging: Bulk
Package / Case: TO-270-16 Variant, Flat Leads
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 920MHz ~ 960MHz
Configuration: 2 N-Channel
Power - Output: 3.2W
Gain: 35.9dB
Technology: LDMOS (Dual)
Supplier Device Package: TO-270WB-16
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 285 mA
auf Bestellung 1287 Stücke:
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Anzahl Preis
7+73.57 EUR
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74LVT244ADB,118 74LVT_LVTH244A.pdf
74LVT244ADB,118
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SSOP
auf Bestellung 2327 Stücke:
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Anzahl Preis
1019+0.49 EUR
Mindestbestellmenge: 1019
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74LVT16244BDGG,118 PHGLS24271-1.pdf?t.download=true&u=5oefqw
74LVT16244BDGG,118
Hersteller: NXP Semiconductors
Description: IC BUFF NON-INVERT 3.6V 48TSSOP
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-TSSOP
auf Bestellung 2002 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
790+0.64 EUR
Mindestbestellmenge: 790
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LS1012AXN7KKB LS1012AFS.pdf
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ LS1 1GHZ 211FCLGA
Packaging: Bulk
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, GPIO, I2C, I2S, SPI, UART
auf Bestellung 672 Stücke:
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Anzahl Preis
13+39.3 EUR
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P1010NSE5HFB FSCLS11925-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Bulk
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: CANbus, DUART, I2C, MMC/SD, SPI
auf Bestellung 521 Stücke:
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Anzahl Preis
7+77.66 EUR
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LPC4078FBD144,551 PHGLS25790-1.pdf?t.download=true&u=5oefqw
LPC4078FBD144,551
Hersteller: NXP Semiconductors
Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 109
auf Bestellung 13087 Stücke:
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36+13.25 EUR
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MC68HC11E9BCFNE2 M68HC11E.pdf
Hersteller: NXP Semiconductors
Description: M68HC11E - 8BIT MCU,12K BUFFALO
Packaging: Bulk
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROM
EEPROM Size: 512 x 8
Core Processor: M68HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.13x19.13)
Number of I/O: 16
auf Bestellung 3266 Stücke:
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Anzahl Preis
17+29.85 EUR
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PSMN018-100ESFQ PSMN018-100ESF.pdf
PSMN018-100ESFQ
Hersteller: NXP Semiconductors
Description: NEXPERIA PSMN018 - NEXTPOWER 100
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 53A (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 15A, 10V
Power Dissipation (Max): 111W (Ta)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 7V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 21.4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1482 pF @ 50 V
auf Bestellung 4976 Stücke:
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Anzahl Preis
751+0.67 EUR
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MMA2201KEGR2 MMA2201KEG.pdf
MMA2201KEGR2
Hersteller: NXP Semiconductors
Description: MMA2201KE - MEDIUM-G, ANALOG ACC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X
Acceleration Range: ±40g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 50
auf Bestellung 16730 Stücke:
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37+13.64 EUR
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74HCT10PW,112 PHGL-S-A0002307496-1.pdf?t.download=true&u=5oefqw
74HCT10PW,112
Hersteller: NXP Semiconductors
Description: IC GATE NAND
Packaging: Bulk
auf Bestellung 8352 Stücke:
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Anzahl Preis
1755+0.28 EUR
Mindestbestellmenge: 1755
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74HCT109PW,112 PHGL-S-A0002303329-1.pdf?t.download=true&u=5oefqw
74HCT109PW,112
Hersteller: NXP Semiconductors
Description: IC FF JK TYPE DUAL 1BIT 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 55 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-TSSOP
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Number of Bits per Element: 1
auf Bestellung 5496 Stücke:
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1296+0.39 EUR
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74LVC1G98GM,132 74LVC1G98.pdf
74LVC1G98GM,132
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC1G98 - LOWPOWER CO
Packaging: Bulk
auf Bestellung 49013 Stücke:
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Anzahl Preis
4661+0.1 EUR
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74AUP2G3407GMH PHGLS28868-1.pdf?t.download=true&u=5oefqw
74AUP2G3407GMH
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA; 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
auf Bestellung 116080 Stücke:
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Anzahl Preis
2160+0.23 EUR
Mindestbestellmenge: 2160
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LPC1112FDH28/102:5 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112FDH28/102:5
Hersteller: NXP Semiconductors
Description: LPC1112 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
auf Bestellung 8647 Stücke:
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Anzahl Preis
201+2.51 EUR
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LPC1112LVFHN24/003 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112LVFHN24/003
Hersteller: NXP Semiconductors
Description: LPC1112 - Scalable Entry Level 3
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: FIFO, I2C, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Number of I/O: 20
auf Bestellung 486 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
193+2.61 EUR
Mindestbestellmenge: 193
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MRFX1K80H-230MHZ MRFX1K80H.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 65V NI1230
Packaging: Bulk
Package / Case: SOT-979A
Current Rating (Amps): 100mA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: Dual
Power - Output: 1800W
Gain: 25.1dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 1.5 A
Produkt ist nicht verfügbar
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BC859B,215 BC859_BC860.pdf
BC859B,215
Hersteller: NXP Semiconductors
Description: TRANS PNP 30V 0.1A TO-236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 250 mW
Qualification: AEC-Q101
auf Bestellung 7850000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13172+0.034 EUR
Mindestbestellmenge: 13172
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MKW20Z160VHT4 PHGL-S-A0005067296-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC RF TXRX+MCU 802.15.4
Packaging: Bulk
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 160kB Flash, 20kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.45V ~ 3.6V
Power - Output: 5dBm
Protocol: ZigbeePRO®
Current - Receiving: 6.5mA ~ 15.4mA
Data Rate (Max): 250kbps
Current - Transmitting: 8.4mA ~ 18.5mA
GPIO: 28
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
auf Bestellung 220 Stücke:
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Anzahl Preis
77+6.6 EUR
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74LVC139D,112 PHGLS23390-1.pdf?t.download=true&u=5oefqw
74LVC139D,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC139D - DECODER/DRI
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 28668 Stücke:
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Anzahl Preis
1871+0.27 EUR
Mindestbestellmenge: 1871
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MRFE6VP8600HR5 MRFE6VP8600H.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230
Current Rating (Amps): 20µA
Mounting Type: Chassis Mount
Frequency: 470MHz ~ 860MHz
Configuration: Dual, Common Source
Power - Output: 600W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 1.4 A
auf Bestellung 890 Stücke:
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1+564.82 EUR
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BAT18,235 BAT18.pdf
BAT18,235
Hersteller: NXP Semiconductors
Description: RF DIODE STANDARD 35V SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Standard - Single
Operating Temperature: 125°C (TJ)
Capacitance @ Vr, F: 1pF @ 20V, 1MHz
Resistance @ If, F: 700mOhm @ 5mA, 200MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
auf Bestellung 150016 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1865+0.25 EUR
Mindestbestellmenge: 1865
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PCF7961XTT/D1AC09J
Hersteller: NXP Semiconductors
Description: IMMO COMBI CHIP
Features: Programmable
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Memory Size: 192B RAM, 512B EEPROM
Modulation or Protocol: UHF
Voltage - Supply: 2.1V ~ 3.6V
Applications: Remote Keyless Entry
Supplier Device Package: 20-TSSOP
auf Bestellung 2490 Stücke:
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Anzahl Preis
73+6.95 EUR
Mindestbestellmenge: 73
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PDTA115EU,115 PIRSS13039-1.pdf?t.download=true&u=5oefqw
PDTA115EU,115
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS
Packaging: Bulk
auf Bestellung 174000 Stücke:
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Anzahl Preis
13172+0.034 EUR
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74AUP1G79GM,115 PHGLS24882-1.pdf?t.download=true&u=5oefqw
74AUP1G79GM,115
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 50pF
Number of Bits per Element: 1
auf Bestellung 180000 Stücke:
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Anzahl Preis
4139+0.12 EUR
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74LVC2G02GN,115 74LVC2G02.pdf
74LVC2G02GN,115
Hersteller: NXP Semiconductors
Description: IC DUAL 2-INP
Packaging: Bulk
auf Bestellung 40000 Stücke:
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Anzahl Preis
1708+0.3 EUR
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74HCT2G17GW-Q100H 74HC_HCT2G17_Q100.pdf
74HCT2G17GW-Q100H
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-TSSOP
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2796+0.19 EUR
Mindestbestellmenge: 2796
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MPC860DTCZQ50D4 FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 384 Stücke:
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Anzahl Preis
2+277.16 EUR
Mindestbestellmenge: 2
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NVT4555UKZ PHGLS28214-1.pdf?t.download=true&u=5oefqw
NVT4555UKZ
Hersteller: NXP Semiconductors
Description: NVT4555UK - SIM card interface l
Packaging: Bulk
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Voltage - Supply: 1.1V ~ 3.6V
Applications: SIM Card
Supplier Device Package: 12-WLCSP (1.62x1.19)
auf Bestellung 2867 Stücke:
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Anzahl Preis
454+1.11 EUR
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PN7362BNHN/C300Y PN7462.pdf
PN7362BNHN/C300Y
Hersteller: NXP Semiconductors
Description: PN7362 - NFC CORTEX-M0 MICROCONT
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 59948 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
48+10.51 EUR
Mindestbestellmenge: 48
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PESD2NFC-LYL PESD5V0F1BL.pdf
PESD2NFC-LYL
Hersteller: NXP Semiconductors
Description: TVS DIODE 24VWM DFN1006-2
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Voltage - Reverse Standoff (Typ): 24V (Max)
Supplier Device Package: DFN1006-2
Bidirectional Channels: 1
Power Line Protection: No
auf Bestellung 10000 Stücke:
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Anzahl Preis
3309+0.15 EUR
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BZX79-C22,133 BZX79.pdf
BZX79-C22,133
Hersteller: NXP Semiconductors
Description: DIODE ZENER 22V 400MW ALF2
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 55 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15.4 V
auf Bestellung 89940 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13172+0.034 EUR
Mindestbestellmenge: 13172
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BZX79-C22,143 BZX79.pdf
BZX79-C22,143
Hersteller: NXP Semiconductors
Description: DIODE ZENER 22V 400MW ALF2
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 55 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
auf Bestellung 75000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13172+0.034 EUR
Mindestbestellmenge: 13172
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PBSS4130QAZ NEXP-S-A0003560291-1.pdf?t.download=true&u=5oefqw
PBSS4130QAZ
Hersteller: NXP Semiconductors
Description: TRANS NPN 30V 1A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 245mV @ 50mA, 1A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 1A, 2V
Frequency - Transition: 190MHz
Supplier Device Package: DFN1010D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 325 mW
auf Bestellung 243300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3414+0.14 EUR
Mindestbestellmenge: 3414
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MC68302AG25C FSCLS09687-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU 25MHZ 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
auf Bestellung 144 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+116.21 EUR
Mindestbestellmenge: 5
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MC68302EH25CB1 FSCLS09687-1.pdf?t.download=true&u=5oefqw
MC68302EH25CB1
Hersteller: NXP Semiconductors
Description: IC MPU M683XX 25MHZ 132PQFP
Packaging: Bulk
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5V
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+130.68 EUR
Mindestbestellmenge: 4
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A7101CLTK2/T0BC2WJ PHGL-S-A0006349687-1.pdf?t.download=true&amp;u=5oefqw
A7101CLTK2/T0BC2WJ
Hersteller: NXP Semiconductors
Description: RF MOSFET
Packaging: Bulk
auf Bestellung 111264 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
260+1.77 EUR
Mindestbestellmenge: 260
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PMBTA14,215 PMBTA13_PMBTA14.pdf
PMBTA14,215
Hersteller: NXP Semiconductors
Description: TRANS NPN DARL 30V 0.5A TO-236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN - Darlington
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.5V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 20000 @ 100mA, 5V
Frequency - Transition: 125MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 250 mW
Qualification: AEC-Q101
auf Bestellung 96000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6968+0.068 EUR
Mindestbestellmenge: 6968
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SPC5746CHK1AMMH6 SPC5746CFK1ACKU6.pdf?t.download=true&u=axiww2
SPC5746CHK1AMMH6
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
auf Bestellung 334 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
14+38.36 EUR
Mindestbestellmenge: 14
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74HCT597DB,112 PHGLS29568-1.pdf?t.download=true&u=5oefqw
74HCT597DB,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HCT597DB - PARALLEL I
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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BZV55-B33,115 BZV55_SER.pdf
BZV55-B33,115
Hersteller: NXP Semiconductors
Description: DIODE ZENER 33V 500MW LLDS
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: LLDS; MiniMelf
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
auf Bestellung 127500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13172+0.034 EUR
Mindestbestellmenge: 13172
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