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MC7457RX1000NC NXP Semiconductors FSCLS04525-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC7457 1GHZ 483FCCBGA
Packaging: Bulk
Package / Case: 483-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Active
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MC68MH360AI25L557 NXP Semiconductors MC68360C1.pdf Description: IC CONTROLLER 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Type: Controller
Supplier Device Package: 240-FQFP (32x32)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MKL81Z128VMP7 MKL81Z128VMP7 NXP Semiconductors FSCL-S-A0001383122-1.pdf?t.download=true&u=5oefqw Description: MKL8 - Kinetis KL8 72MHz Cortex-
Packaging: Bulk
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x6/12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 41
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PMP5201V/S711115 PMP5201V/S711115 NXP Semiconductors PHGLS19184-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PMP5201V - SMALL SIGNAL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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A2T21H450W19SR6 NXP Semiconductors A2T21H450W19S.pdf Description: RF MOSFET LDMOS 30V NI1230
Packaging: Bulk
Package / Case: NI-1230S-4S4S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.2GHz
Power - Output: 89W
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4S4S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 800 mA
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PSMN4R3-80PS,127 PSMN4R3-80PS,127 NXP Semiconductors PSMN4R3-80PS.pdf Description: NEXPERIA PSMN4R3-80PS - 120A, 80
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 111 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8161 pF @ 40 V
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T2081NXE8P1B NXP Semiconductors T2080FS.pdf Description: IC MPU QORIQ T2 1.533GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Obsolete
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S912XEG128J2CAAR NXP Semiconductors Description: MC9S12XE - KIPPER-16-bit MCU, 12
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
Produkt ist nicht verfügbar
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MC33VR5500V1ES NXP Semiconductors VR5500.pdf Description: MC33VR5500V1ES - High Voltage PM
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 60V
Topology: Step-Down (Buck) (4), Linear (LDO) (2)
Supplier Device Package: 56-HVQFN (8x8)
w/LED Driver: No
w/Supervisor: Yes
w/Sequencer: Yes
Part Status: Active
Number of Outputs: 6
Grade: Automotive
Qualification: AEC-Q100
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MPC561CVR40 NXP Semiconductors MPC561FACT.pdf Description: MPC561 - SILVER OAK-NXP 32-bit M
Packaging: Bulk
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Active
Number of I/O: 16
Produkt ist nicht verfügbar
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BUK764R0-75C,118 BUK764R0-75C,118 NXP Semiconductors BUK764R0-75C.pdf Description: NEXPERIA BUK764 - N-CHANNEL MOSF
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
Produkt ist nicht verfügbar
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LS1027AXN7NQA NXP Semiconductors Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Bulk
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
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LS2084AXN711B NXP Semiconductors Description: IC MPU QORIQ 2.1GHZ 1292FCPBGA
Packaging: Bulk
Package / Case: 1292-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (2)
Part Status: Active
Additional Interfaces: GPIO, DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
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P5020NXN7QMB557 NXP Semiconductors FSCL-S-A0000576586-1.pdf?t.download=true&u=5oefqw Description: QORIQ, 64-BIT POWER ARCH SOC, 2
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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KMZ80J NXP Semiconductors KMZ80.pdf Description: KMZ80 - Programmable Angle Senso
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Analog Voltage
Operating Temperature: -40°C ~ 150°C
Termination Style: Gull Wing
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±0.95°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 8-SOIC
Output Signal: Clockwise Increase
Part Status: Active
Resistance: 5 kOhms
Grade: Automotive
Qualification: AEC-Q100
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LPC54101J512UK49Z NXP Semiconductors LPC5410X.pdf Description: LPC54101 - Cortex-M4/M0 32-bit M
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
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LPC54101J256UK49Z NXP Semiconductors LPC5411X.pdf Description: LPC5410 - Low Power 32-bit Micro
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
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P1014NSN5DFB NXP Semiconductors FSCLS11835-1.pdf?t.download=true&u=5oefqw Description: IC MPU QORIQ P1 533MHZ 425TEPBGA
Packaging: Bulk
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CANbus, DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
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PCA9670PW,112 NXP Semiconductors Description: Remote 8-bit I\/O expander for F
Packaging: Bulk
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 300µA, 41mA
Part Status: Obsolete
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PCA9672BS,118 NXP Semiconductors PCA9672.pdf Description: IC XPNDR 1MHZ I2C SMBUS 16HVQFN
Packaging: Bulk
Features: POR
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 300µA, 43mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC34PF1510A1EPR2 NXP Semiconductors Description: PF1510 - PMIC with 1A Li+ Linear
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 4.1V ~ 6V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (3), Linear (LDO) (3)
Supplier Device Package: 40-HVQFN (5x5)
Voltage/Current - Output 1: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 2: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 3: 1.8V ~ 3.3V, 1A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: Yes
Part Status: Active
Number of Outputs: 6
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74HCT30PW,112 74HCT30PW,112 NXP Semiconductors PHGL-S-A0001295603-1.pdf?t.download=true&u=5oefqw Description: IC GATE NAND
Packaging: Bulk
Part Status: Active
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74AHCT30PW,118 74AHCT30PW,118 NXP Semiconductors 74AHC_AHCT30.pdf Description: NEXPERIA 74AHCT30PW - NAND GATE,
Packaging: Bulk
Part Status: Active
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S25FL127SABMFI000 NXP Semiconductors Infineon-S25FL127S_128-Mb_(16_MB)_3.0_V_SPI_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecfa58c49f7&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: S25FL127S - (16 MB) 3.0 V SPI Fl
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVC257ADB,112 74LVC257ADB,112 NXP Semiconductors 74LVC257A.pdf Description: NEXPERIA 74LVC257ADB - MULTIPLEX
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
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PDTD113EQAZ PDTD113EQAZ NXP Semiconductors PDTD113_123_143_114EQA_SER.pdf Description: TRANS PREBIAS 50V 500MA
Packaging: Bulk
Part Status: Active
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S2ZMMBZ27VALT1G NXP Semiconductors Description: S2ZMMBZ - ZEN SOT23 REG .225W SP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MC10XS3435BHFKR2 NXP Semiconductors Description: MC10XS3435 - 12 V Automotive Ext
Packaging: Bulk
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 35mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
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BAS321135 NXP Semiconductors NEXP-S-A0003060012-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BAS321 - RECTIFIER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX79-B15143 NXP Semiconductors Description: NEXPERIA ZENER DIODE, 15V, 2%, 0
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08AW60MFGE NXP Semiconductors MC9S08AW60.pdf Description: MC9S08AW - Microcontroller, 8-Bi
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
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MIMXRT1051DVL6A NXP Semiconductors Description: MXRT1050 - i.MX RT1050 Crossover
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Obsolete
Number of I/O: 127
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LPC1102LVUKZ NXP Semiconductors PHGLS25606-1.pdf?t.download=true&u=5oefqw Description: LPC1102 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 25-WLCSP (2.17x2.32)
Part Status: Active
Number of I/O: 21
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SAF7741HV/N125ZK SAF7741HV/N125ZK NXP Semiconductors Description: SAF7741HV - CAR RADIO DIGITAL SI
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, LSB, SPDIF
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Clock Rate: 44.1kHz, 48kHz, 96kHz
Supplier Device Package: 144-HLQFP
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AHCT2G241GD,125 74AHCT2G241GD,125 NXP Semiconductors PHGLS28139-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
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MK21DX128AVMC5 MK21DX128AVMC5 NXP Semiconductors FSCL-S-A0000576977-1.pdf?t.download=true&u=5oefqw Description: MK21DX128AVMC5 - Kinetis K21: 50
Packaging: Bulk
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 64
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74AHC1G04GW-Q100125 74AHC1G04GW-Q100125 NXP Semiconductors 74AHC_AHCT1G04_Q100.pdf Description: NEXPERIA 74AHC1G04GW-Q100 - INVE
Packaging: Bulk
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74AHC541PW-Q100118 NXP Semiconductors 74AHC_AHCT541_Q100.pdf Description: NEXPERIA 74AHC541PW-Q100 - BUS D
Packaging: Bulk
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S912XDG128F2VAA NXP Semiconductors FSCLS07359-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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BC847RA147 NXP Semiconductors Description: BC1NPN/PGENERAL-PURPODOUBTRANSIS
Packaging: Tape & Reel (TR)
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MC74HC42D NXP Semiconductors Description: 74HBDECIMDECOD1-OF-10
Packaging: Bulk
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S32V-SONYCAM NXP Semiconductors Description: S32V - MIPI CAMERAS AND DE-SERIA
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
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S912XEG128J2MAA NXP Semiconductors Description: MC9S12XE - KIPPER-16-BIT MCU, 12
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
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MPC875CVR66 NXP Semiconductors MPC875EC.pdf Description: IC MPU MPC87XX 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC, I2C, PCMCIA, SPI, TDM, UART
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AFT20P060-4NR3 NXP Semiconductors AFT20P060-4N.pdf Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: 2 N-Channel
Power - Output: 60W
Gain: 18.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
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BC847BS/DG/B3115 NXP Semiconductors Description: BCSMASIGNBIPOLTRANSISTO0.1452-EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PMEG2020EJ/ZL135 PMEG2020EJ/ZL135 NXP Semiconductors Description: PMEG2020EJ - Nexperia PMEG2020EJ
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 50pF @ 5V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: SOD-323F
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 525 mV @ 2 A
Current - Reverse Leakage @ Vr: 200 µA @ 20 V
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LPC2294U029 NXP Semiconductors Description: LPC2294 - Arm7, 32-Bit RISC Micr
Packaging: Bulk
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74HC125DAUJ NXP Semiconductors Description: 74HC1BDRIVEHC/SERIE4-FUN1-BITROU
Packaging: Tape & Reel (TR)
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BC860CW/ZL115 NXP Semiconductors Description: BC8PGENERPURPOTRANSISTORS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SIT8924AA-23-33N-30.000000G NXP Semiconductors Description: SIT89LPOWPROGRAMMABOSCILLATOAUTE
Packaging: Bulk
Produkt ist nicht verfügbar
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SIT8924AA-23-18E-27.000000G NXP Semiconductors Description: SIT8LPOWPROGRAMMABOSCILLATOAUTEM
Packaging: Bulk
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74HC73PW112 NXP Semiconductors 74HC73.pdf Description: IC FF JK TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
Produkt ist nicht verfügbar
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74HCT04DAUJ NXP Semiconductors Description: 74HCTINVERTEHSERIE6-FUN1-INPUCMO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC34717EPR2 MC34717EPR2 NXP Semiconductors FSCL-S-A0000149009-1.pdf?t.download=true&u=5oefqw Description: MC34717 - Switch-Mode Power Supp
Packaging: Bulk
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
Produkt ist nicht verfügbar
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MC908JK3EMDWE NXP Semiconductors MC68HC08JL3.pdf MC68HC908Jx(1,3).pdf Description: MC9S08JK - MICROCONTROLLER, 8-BI
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 10x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
Produkt ist nicht verfügbar
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MC33790HEGR2 MC33790HEGR2 NXP Semiconductors MC33790.pdf Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Output Type: Logic
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Current - Supply: 1 mA
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MC33790HEG MC33790HEG NXP Semiconductors MC33790.pdf Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Supplier Device Package: 16-SOIC
Output Type: Logic
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Current - Supply: 1 mA
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MCIMX7S3EVK08SC557 NXP Semiconductors PHGL-S-A0003204178-1.pdf?t.download=true&u=5oefqw Description: I.MX 7SOLO:1X CORTEX A7, 1X USB
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2930FBD208,551 LPC2930FBD208,551 NXP Semiconductors PHGLS21387-1.pdf?t.download=true&u=5oefqw Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
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26+19.22 EUR
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MC7457RX1000NC FSCLS04525-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC7457 1GHZ 483FCCBGA
Packaging: Bulk
Package / Case: 483-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Active
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MC68MH360AI25L557 MC68360C1.pdf
Hersteller: NXP Semiconductors
Description: IC CONTROLLER 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Type: Controller
Supplier Device Package: 240-FQFP (32x32)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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4+158.08 EUR
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MKL81Z128VMP7 FSCL-S-A0001383122-1.pdf?t.download=true&u=5oefqw
MKL81Z128VMP7
Hersteller: NXP Semiconductors
Description: MKL8 - Kinetis KL8 72MHz Cortex-
Packaging: Bulk
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x6/12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 41
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PMP5201V/S711115 PHGLS19184-1.pdf?t.download=true&u=5oefqw
PMP5201V/S711115
Hersteller: NXP Semiconductors
Description: NEXPERIA PMP5201V - SMALL SIGNAL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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A2T21H450W19SR6 A2T21H450W19S.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 30V NI1230
Packaging: Bulk
Package / Case: NI-1230S-4S4S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.2GHz
Power - Output: 89W
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4S4S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 800 mA
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PSMN4R3-80PS,127 PSMN4R3-80PS.pdf
PSMN4R3-80PS,127
Hersteller: NXP Semiconductors
Description: NEXPERIA PSMN4R3-80PS - 120A, 80
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 111 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8161 pF @ 40 V
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T2081NXE8P1B T2080FS.pdf
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ T2 1.533GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Obsolete
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S912XEG128J2CAAR
Hersteller: NXP Semiconductors
Description: MC9S12XE - KIPPER-16-bit MCU, 12
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
Produkt ist nicht verfügbar
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MC33VR5500V1ES VR5500.pdf
Hersteller: NXP Semiconductors
Description: MC33VR5500V1ES - High Voltage PM
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 60V
Topology: Step-Down (Buck) (4), Linear (LDO) (2)
Supplier Device Package: 56-HVQFN (8x8)
w/LED Driver: No
w/Supervisor: Yes
w/Sequencer: Yes
Part Status: Active
Number of Outputs: 6
Grade: Automotive
Qualification: AEC-Q100
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50+9.77 EUR
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MPC561CVR40 MPC561FACT.pdf
Hersteller: NXP Semiconductors
Description: MPC561 - SILVER OAK-NXP 32-bit M
Packaging: Bulk
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Active
Number of I/O: 16
Produkt ist nicht verfügbar
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BUK764R0-75C,118 BUK764R0-75C.pdf
BUK764R0-75C,118
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK764 - N-CHANNEL MOSF
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
Produkt ist nicht verfügbar
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LS1027AXN7NQA
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Bulk
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
auf Bestellung 11 Stücke:
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Anzahl Preis
6+98.79 EUR
Mindestbestellmenge: 6
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LS2084AXN711B
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ 2.1GHZ 1292FCPBGA
Packaging: Bulk
Package / Case: 1292-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (2)
Part Status: Active
Additional Interfaces: GPIO, DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
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P5020NXN7QMB557 FSCL-S-A0000576586-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: QORIQ, 64-BIT POWER ARCH SOC, 2
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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1+942.30 EUR
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KMZ80J KMZ80.pdf
Hersteller: NXP Semiconductors
Description: KMZ80 - Programmable Angle Senso
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Analog Voltage
Operating Temperature: -40°C ~ 150°C
Termination Style: Gull Wing
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±0.95°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 8-SOIC
Output Signal: Clockwise Increase
Part Status: Active
Resistance: 5 kOhms
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 112726 Stücke:
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Anzahl Preis
133+3.51 EUR
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LPC54101J512UK49Z LPC5410X.pdf
Hersteller: NXP Semiconductors
Description: LPC54101 - Cortex-M4/M0 32-bit M
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
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Anzahl Preis
61+7.81 EUR
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LPC54101J256UK49Z LPC5411X.pdf
Hersteller: NXP Semiconductors
Description: LPC5410 - Low Power 32-bit Micro
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
auf Bestellung 2469 Stücke:
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Anzahl Preis
72+7.04 EUR
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P1014NSN5DFB FSCLS11835-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ P1 533MHZ 425TEPBGA
Packaging: Bulk
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CANbus, DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
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Anzahl Preis
9+58.49 EUR
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PCA9670PW,112
Hersteller: NXP Semiconductors
Description: Remote 8-bit I\/O expander for F
Packaging: Bulk
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 300µA, 41mA
Part Status: Obsolete
auf Bestellung 1269 Stücke:
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Anzahl Preis
367+1.44 EUR
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PCA9672BS,118 PCA9672.pdf
Hersteller: NXP Semiconductors
Description: IC XPNDR 1MHZ I2C SMBUS 16HVQFN
Packaging: Bulk
Features: POR
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 300µA, 43mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 80038 Stücke:
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Anzahl Preis
222+2.13 EUR
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MC34PF1510A1EPR2
Hersteller: NXP Semiconductors
Description: PF1510 - PMIC with 1A Li+ Linear
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 4.1V ~ 6V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (3), Linear (LDO) (3)
Supplier Device Package: 40-HVQFN (5x5)
Voltage/Current - Output 1: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 2: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 3: 1.8V ~ 3.3V, 1A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: Yes
Part Status: Active
Number of Outputs: 6
auf Bestellung 5000 Stücke:
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Anzahl Preis
106+5.02 EUR
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74HCT30PW,112 PHGL-S-A0001295603-1.pdf?t.download=true&u=5oefqw
74HCT30PW,112
Hersteller: NXP Semiconductors
Description: IC GATE NAND
Packaging: Bulk
Part Status: Active
auf Bestellung 14405 Stücke:
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Anzahl Preis
1697+0.30 EUR
Mindestbestellmenge: 1697
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74AHCT30PW,118 74AHC_AHCT30.pdf
74AHCT30PW,118
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AHCT30PW - NAND GATE,
Packaging: Bulk
Part Status: Active
auf Bestellung 11547 Stücke:
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Anzahl Preis
2133+0.25 EUR
Mindestbestellmenge: 2133
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S25FL127SABMFI000 Infineon-S25FL127S_128-Mb_(16_MB)_3.0_V_SPI_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecfa58c49f7&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
Hersteller: NXP Semiconductors
Description: S25FL127S - (16 MB) 3.0 V SPI Fl
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVC257ADB,112 74LVC257A.pdf
74LVC257ADB,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC257ADB - MULTIPLEX
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
auf Bestellung 6102 Stücke:
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Anzahl Preis
1410+0.37 EUR
Mindestbestellmenge: 1410
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PDTD113EQAZ PDTD113_123_143_114EQA_SER.pdf
PDTD113EQAZ
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS 50V 500MA
Packaging: Bulk
Part Status: Active
auf Bestellung 25000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8959+0.05 EUR
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S2ZMMBZ27VALT1G
Hersteller: NXP Semiconductors
Description: S2ZMMBZ - ZEN SOT23 REG .225W SP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MC10XS3435BHFKR2
Hersteller: NXP Semiconductors
Description: MC10XS3435 - 12 V Automotive Ext
Packaging: Bulk
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 35mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
auf Bestellung 1175 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
61+8.75 EUR
Mindestbestellmenge: 61
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BAS321135 NEXP-S-A0003060012-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA BAS321 - RECTIFIER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX79-B15143
Hersteller: NXP Semiconductors
Description: NEXPERIA ZENER DIODE, 15V, 2%, 0
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08AW60MFGE MC9S08AW60.pdf
Hersteller: NXP Semiconductors
Description: MC9S08AW - Microcontroller, 8-Bi
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
auf Bestellung 780 Stücke:
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Anzahl Preis
34+14.64 EUR
Mindestbestellmenge: 34
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MIMXRT1051DVL6A
Hersteller: NXP Semiconductors
Description: MXRT1050 - i.MX RT1050 Crossover
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Obsolete
Number of I/O: 127
auf Bestellung 700 Stücke:
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Anzahl Preis
47+11.32 EUR
Mindestbestellmenge: 47
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LPC1102LVUKZ PHGLS25606-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC1102 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 25-WLCSP (2.17x2.32)
Part Status: Active
Number of I/O: 21
auf Bestellung 9651 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
111+4.55 EUR
Mindestbestellmenge: 111
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SAF7741HV/N125ZK
SAF7741HV/N125ZK
Hersteller: NXP Semiconductors
Description: SAF7741HV - CAR RADIO DIGITAL SI
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, LSB, SPDIF
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Clock Rate: 44.1kHz, 48kHz, 96kHz
Supplier Device Package: 144-HLQFP
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AHCT2G241GD,125 PHGLS28139-1.pdf?t.download=true&u=5oefqw
74AHCT2G241GD,125
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
auf Bestellung 25005 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.24 EUR
Mindestbestellmenge: 2049
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MK21DX128AVMC5 FSCL-S-A0000576977-1.pdf?t.download=true&u=5oefqw
MK21DX128AVMC5
Hersteller: NXP Semiconductors
Description: MK21DX128AVMC5 - Kinetis K21: 50
Packaging: Bulk
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 64
auf Bestellung 161 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
46+11.09 EUR
Mindestbestellmenge: 46
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74AHC1G04GW-Q100125 74AHC_AHCT1G04_Q100.pdf
74AHC1G04GW-Q100125
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AHC1G04GW-Q100 - INVE
Packaging: Bulk
Produkt ist nicht verfügbar
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74AHC541PW-Q100118 74AHC_AHCT541_Q100.pdf
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AHC541PW-Q100 - BUS D
Packaging: Bulk
Produkt ist nicht verfügbar
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S912XDG128F2VAA FSCLS07359-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 84 Stücke:
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Anzahl Preis
22+22.35 EUR
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BC847RA147
Hersteller: NXP Semiconductors
Description: BC1NPN/PGENERAL-PURPODOUBTRANSIS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC74HC42D
Hersteller: NXP Semiconductors
Description: 74HBDECIMDECOD1-OF-10
Packaging: Bulk
Produkt ist nicht verfügbar
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S32V-SONYCAM
Hersteller: NXP Semiconductors
Description: S32V - MIPI CAMERAS AND DE-SERIA
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
auf Bestellung 4 Stücke:
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Anzahl Preis
2+435.63 EUR
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S912XEG128J2MAA
Hersteller: NXP Semiconductors
Description: MC9S12XE - KIPPER-16-BIT MCU, 12
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
Produkt ist nicht verfügbar
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MPC875CVR66 MPC875EC.pdf
Hersteller: NXP Semiconductors
Description: IC MPU MPC87XX 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC, I2C, PCMCIA, SPI, TDM, UART
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+62.15 EUR
Mindestbestellmenge: 8
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AFT20P060-4NR3 AFT20P060-4N.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: 2 N-Channel
Power - Output: 60W
Gain: 18.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
auf Bestellung 1730 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+63.84 EUR
Mindestbestellmenge: 8
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BC847BS/DG/B3115
Hersteller: NXP Semiconductors
Description: BCSMASIGNBIPOLTRANSISTO0.1452-EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PMEG2020EJ/ZL135
PMEG2020EJ/ZL135
Hersteller: NXP Semiconductors
Description: PMEG2020EJ - Nexperia PMEG2020EJ
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 50pF @ 5V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: SOD-323F
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 525 mV @ 2 A
Current - Reverse Leakage @ Vr: 200 µA @ 20 V
Produkt ist nicht verfügbar
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LPC2294U029
Hersteller: NXP Semiconductors
Description: LPC2294 - Arm7, 32-Bit RISC Micr
Packaging: Bulk
auf Bestellung 6327 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
21+25.77 EUR
Mindestbestellmenge: 21
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74HC125DAUJ
Hersteller: NXP Semiconductors
Description: 74HC1BDRIVEHC/SERIE4-FUN1-BITROU
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BC860CW/ZL115
Hersteller: NXP Semiconductors
Description: BC8PGENERPURPOTRANSISTORS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SIT8924AA-23-33N-30.000000G
Hersteller: NXP Semiconductors
Description: SIT89LPOWPROGRAMMABOSCILLATOAUTE
Packaging: Bulk
Produkt ist nicht verfügbar
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SIT8924AA-23-18E-27.000000G
Hersteller: NXP Semiconductors
Description: SIT8LPOWPROGRAMMABOSCILLATOAUTEM
Packaging: Bulk
Produkt ist nicht verfügbar
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74HC73PW112 74HC73.pdf
Hersteller: NXP Semiconductors
Description: IC FF JK TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
Produkt ist nicht verfügbar
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74HCT04DAUJ
Hersteller: NXP Semiconductors
Description: 74HCTINVERTEHSERIE6-FUN1-INPUCMO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC34717EPR2 FSCL-S-A0000149009-1.pdf?t.download=true&u=5oefqw
MC34717EPR2
Hersteller: NXP Semiconductors
Description: MC34717 - Switch-Mode Power Supp
Packaging: Bulk
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
Produkt ist nicht verfügbar
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MC908JK3EMDWE MC68HC08JL3.pdf MC68HC908Jx(1,3).pdf
Hersteller: NXP Semiconductors
Description: MC9S08JK - MICROCONTROLLER, 8-BI
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 10x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
Produkt ist nicht verfügbar
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MC33790HEGR2 MC33790.pdf
MC33790HEGR2
Hersteller: NXP Semiconductors
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Output Type: Logic
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Current - Supply: 1 mA
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
72+6.71 EUR
Mindestbestellmenge: 72
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MC33790HEG MC33790.pdf
MC33790HEG
Hersteller: NXP Semiconductors
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Supplier Device Package: 16-SOIC
Output Type: Logic
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Current - Supply: 1 mA
auf Bestellung 89 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
89+6.71 EUR
Mindestbestellmenge: 89
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MCIMX7S3EVK08SC557 PHGL-S-A0003204178-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: I.MX 7SOLO:1X CORTEX A7, 1X USB
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2930FBD208,551 PHGLS21387-1.pdf?t.download=true&u=5oefqw
LPC2930FBD208,551
Hersteller: NXP Semiconductors
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
auf Bestellung 103 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
26+19.22 EUR
Mindestbestellmenge: 26
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