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74AUP1G58GF,132 74AUP1G58GF,132 NXP Semiconductors PHGL-S-A0001284262-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74AUP1G58GF - LOGIC CIR
Packaging: Bulk
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BGU8H1X BGU8H1X NXP Semiconductors PHGL-S-A0005068069-1.pdf?t.download=true&u=5oefqw Description: BGU8H1 - SiGe:C Low Noise Amplif
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 3.35GHz
P1dB: -3dBm
Noise Figure: 0.9dB
Current - Supply: 5mA
Gain: 13dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: LTE, WiMax
Frequency: 2.3GHz ~ 2.69GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
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74AHCT139D,118 74AHCT139D,118 NXP Semiconductors PHGLS15529-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74AHCT139D - DECODER/DR
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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74LVT14DB,112 74LVT14DB,112 NXP Semiconductors 74LVT14.pdf Description: IC INVERTER
Packaging: Bulk
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74HC85PW,112 74HC85PW,112 NXP Semiconductors PHGLS05972-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74HC85PW - MAGNITUDE CO
Packaging: Bulk
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BZX84-B13,215 BZX84-B13,215 NXP Semiconductors BZX84_SER.pdf Description: NEXPERIA BZX84-B13 - ZENER DIODE
Qualification: AEC-Q101
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Grade: Automotive
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 30 Ohms
Voltage - Zener (Nom) (Vz): 13 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±2%
Packaging: Bulk
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KTY81/150,112 KTY81/150,112 NXP Semiconductors KTY81_SER.pdf Description: SILICON TEMPERATURE SENSOR
Packaging: Tube
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Resistance @ 25°C: 1 kOhms
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BUK6E2R3-40C,127 BUK6E2R3-40C,127 NXP Semiconductors BUK6E2R3-40C.pdf Description: NEXPERIA BUK6E2R3-40C - 120A, 40
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 15100 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 260 nC @ 10 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±16V
Drive Voltage (Max Rds On, Min Rds On): 10V
Grade: Automotive
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Power Dissipation (Max): 306W (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Bulk
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LPC12H27FBD64/301, LPC12H27FBD64/301, NXP Semiconductors PHGLS23259-1.pdf?t.download=true&u=5oefqw Description: LPC1200 - Cortex-M0 32-Bit RISC
Packaging: Bulk
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NX3L1T53GD,125 NX3L1T53GD,125 NXP Semiconductors NX3L1T53.pdf Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Crosstalk: -90dB @ 100kHz
Charge Injection: 15pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
Number of Circuits: 1
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel-to-Channel Matching (ΔRon): 20mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
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LS1048ASE7Q1A NXP Semiconductors LS1088AFS.pdf Description: IC MPU QORLQ LS1 1.6GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1.2V
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, IFC, PCI, SPI, UART
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T4240NSN7PQB NXP Semiconductors T4240.pdf Description: IC MPU 1.8GHZ 1932FCPBGA
Packaging: Bulk
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (16), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
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MC9328MX1VM20 NXP Semiconductors FSCLS05269-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX1 200MHZ 225MAPBGA
Packaging: Bulk
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
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LPC11E36FBD64/501E LPC11E36FBD64/501E NXP Semiconductors PHGLS25742-1.pdf?t.download=true&u=5oefqw Description: LPC11E36 - Cortex-M0+/M0 RISC Mi
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b SAR
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
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PCA9675PW,118 PCA9675PW,118 NXP Semiconductors PCA9675.pdf Description: PCA9675PW - Remote 16-Bit I/O Ex
Features: POR
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 300µA, 42mA
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PCA9468UKBZ NXP Semiconductors FASTCHARGTS.pdf Description: PCA9468UK - 2:1 switched cap dir
Packaging: Bulk
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MRF6V2150NBR1 NXP Semiconductors FSCLS05116-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 50V TO272-4
Packaging: Bulk
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 450MHz
Configuration: N-Channel
Power - Output: 150W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
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BGA3031X NXP Semiconductors BGA3031.pdf Description: BGA3031 - DOCSIS 3.0 PLUS UPSTRE
Packaging: Bulk
Package / Case: 20-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Amplifier
Applications: CATV
Supplier Device Package: 20-HVQFN (5x5)
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IP4223CZ6,125 IP4223CZ6,125 NXP Semiconductors PHGLS23372-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA IP4223 - TRANS VOLTAGE
Packaging: Bulk
Package / Case: SOT-23-6 Thin, TSOT-23-6
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 1.5pF @ 1MHz (Max)
Voltage - Reverse Standoff (Typ): 5.5V (Max)
Supplier Device Package: 6-TSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
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MC9S08AC128MFGE NXP Semiconductors MC9S08AC60.pdf Description: MC9S08AC - 8-bit MCU, 128KB Flas
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
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74AUP1GU04GS,132 74AUP1GU04GS,132 NXP Semiconductors PHGLS24886-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 4.3ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
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LPC2926FBD144,557 LPC2926FBD144,557 NXP Semiconductors PHGLS20650-1.pdf?t.download=true&u=5oefqw Description: LPC2926FBD144 - ARM9 microcontro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
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TFA9881UK/N1,023 TFA9881UK/N1,023 NXP Semiconductors PHGLS27948-1.pdf?t.download=true&u=5oefqw Description: IC AMP AUDIO CLASSD 3.4W 9WLCSP
Packaging: Bulk
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CBTL06122AHF,518 CBTL06122AHF,518 NXP Semiconductors CBTL06122.pdf Description: IC MULTIPLEXER HEX 1X2 56HWQFN
Features: Bi-Directional
Packaging: Bulk
Package / Case: 56-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe
-3db Bandwidth: 2.5GHz
Supplier Device Package: 56-HWQFN (5x11)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 6
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MCIMX6Q4AVT10AC NXP Semiconductors FSCL-S-A0001020796-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6 1GHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6U5EVM10AC NXP Semiconductors FSCL-S-A0000998349-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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MCIMX6U1AVM10AC NXP Semiconductors FSCLS11779-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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PN7462AUEV/C300Y PN7462AUEV/C300Y NXP Semiconductors PN7462.pdf Description: PN7462AUEV - NFC Cortex®
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, MIFARE, NFC
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, UART, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Bulk
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LPC1114JBD48/303QL LPC1114JBD48/303QL NXP Semiconductors PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Number of I/O: 42
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b SAR
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
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TDF8544J/N2,112 TDF8544J/N2,112 NXP Semiconductors TDF8544.pdf Description: IC AUDIO AMP AB DBS27P
Packaging: Tube
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
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BUK7575-55A,127 BUK7575-55A,127 NXP Semiconductors PHGLS22290-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA BUK7575 - N-CHANNEL MO
Qualification: AEC-Q101
Grade: Automotive
Input Capacitance (Ciss) (Max) @ Vds: 483 pF @ 25 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 62W (Tc)
Rds On (Max) @ Id, Vgs: 75mOhm @ 10A, 10V
Current - Continuous Drain (Id) @ 25°C: 20.3A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Bulk
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MW7IC930NR1 NXP Semiconductors FSCLS05412-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 28V TO270-16
Packaging: Bulk
Package / Case: TO-270-16 Variant, Flat Leads
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 920MHz ~ 960MHz
Configuration: 2 N-Channel
Power - Output: 3.2W
Gain: 35.9dB
Technology: LDMOS (Dual)
Supplier Device Package: TO-270WB-16
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 285 mA
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LS1012AXN7KKB NXP Semiconductors LS1012AFS.pdf Description: IC MPU QORLQ LS1 1GHZ 211FCLGA
Additional Interfaces: eMMC/SD/SDIO, GPIO, I2C, I2S, SPI, UART
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 (1), USB 3.0 + PHY
Ethernet: GbE (2)
Supplier Device Package: 211-FCLGA (9.6x9.6)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 211-VFLGA
Packaging: Bulk
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P1010NSE5HFB NXP Semiconductors FSCLS11925-1.pdf?t.download=true&u=5oefqw Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Additional Interfaces: CANbus, DUART, I2C, MMC/SD, SPI
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 425-TEPBGA I (19x19)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 425-FBGA
Packaging: Bulk
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MC68HC11E9BCFNE2 NXP Semiconductors M68HC11E.pdf Description: M68HC11E - 8BIT MCU,12K BUFFALO
Number of I/O: 16
Supplier Device Package: 52-PLCC (19.13x19.13)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: M68HC11
EEPROM Size: 512 x 8
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 12KB (12K x 8)
Speed: 2MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Bulk
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PSMN018-100ESFQ PSMN018-100ESFQ NXP Semiconductors PSMN018-100ESF.pdf Description: NEXPERIA PSMN018 - NEXTPOWER 100
Input Capacitance (Ciss) (Max) @ Vds: 1482 pF @ 50 V
Gate Charge (Qg) (Max) @ Vgs: 21.4 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 7V, 10V
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 111W (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 15A, 10V
Current - Continuous Drain (Id) @ 25°C: 53A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Bulk
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MMA2201KEGR2 MMA2201KEGR2 NXP Semiconductors MMA2201KEG.pdf Description: MMA2201KE - MEDIUM-G, ANALOG ACC
Sensitivity (mV/g): 50
Supplier Device Package: 16-SOIC
Bandwidth: 400Hz
Voltage - Supply: 5.25V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±40g
Axis: X
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
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74AUP2G3407GMH 74AUP2G3407GMH NXP Semiconductors PHGLS28868-1.pdf?t.download=true&u=5oefqw Description: IC BUFF 0.8V/3.6V 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA; 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
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LPC1112FDH28/102:5 LPC1112FDH28/102:5 NXP Semiconductors PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: LPC1112 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
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BC859B,215 BC859B,215 NXP Semiconductors BC859_BC860.pdf Description: TRANS PNP 30V 0.1A TO-236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 250 mW
Qualification: AEC-Q101
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MKW20Z160VHT4 NXP Semiconductors PHGL-S-A0005067296-1.pdf?t.download=true&u=5oefqw Description: IC RF TXRX+MCU 802.15.4
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 28
Current - Transmitting: 8.4mA ~ 18.5mA
Data Rate (Max): 250kbps
Current - Receiving: 6.5mA ~ 15.4mA
Protocol: ZigbeePRO®
Power - Output: 5dBm
Voltage - Supply: 1.45V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 160kB Flash, 20kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Packaging: Bulk
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74LVC139D,112 74LVC139D,112 NXP Semiconductors PHGLS23390-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74LVC139D - DECODER/DRI
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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MRFE6VP8600HR5 NXP Semiconductors MRFE6VP8600H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230
Current Rating (Amps): 20µA
Mounting Type: Chassis Mount
Frequency: 470MHz ~ 860MHz
Configuration: Dual, Common Source
Power - Output: 600W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 1.4 A
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BAT18,235 BAT18,235 NXP Semiconductors BAT18.pdf Description: RF DIODE STANDARD 35V SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Standard - Single
Operating Temperature: 125°C (TJ)
Capacitance @ Vr, F: 1pF @ 20V, 1MHz
Resistance @ If, F: 700mOhm @ 5mA, 200MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
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PDTA115EU,115 PDTA115EU,115 NXP Semiconductors PIRSS13039-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS
Packaging: Bulk
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74HCT2G17GW-Q100H 74HCT2G17GW-Q100H NXP Semiconductors 74HC_HCT2G17_Q100.pdf Description: IC BUFF NON-INVERT 5.5V 6-TSSOP
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 6-TSSOP
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Input Type: Schmitt Trigger
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Bulk
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MPC860DTCZQ50D4 NXP Semiconductors FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC86XX 50MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (2), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TJ)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
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NVT4555UKZ NVT4555UKZ NXP Semiconductors PHGLS28214-1.pdf?t.download=true&u=5oefqw Description: NVT4555UK - SIM card interface l
Supplier Device Package: 12-WLCSP (1.62x1.19)
Applications: SIM Card
Voltage - Supply: 1.1V ~ 3.6V
Mounting Type: Surface Mount
Package / Case: 12-UFBGA, WLCSP
Packaging: Bulk
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PN7362BNHN/C300Y PN7362BNHN/C300Y NXP Semiconductors PN7462.pdf Description: PN7362 - NFC CORTEX-M0 MICROCONT
DigiKey Programmable: Not Verified
Packaging: Bulk
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BZX79-C22,143 BZX79-C22,143 NXP Semiconductors BZX79.pdf Description: DIODE ZENER 22V 400MW ALF2
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 400 mW
Supplier Device Package: ALF2
Impedance (Max) (Zzt): 55 Ohms
Voltage - Zener (Nom) (Vz): 22 V
Operating Temperature: -65°C ~ 200°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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MC68302AG25C NXP Semiconductors FSCLS09687-1.pdf?t.download=true&u=5oefqw Description: IC MPU 25MHZ 144LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Supplier Device Package: 144-LQFP (20x20)
Voltage - I/O: 5V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
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MC68302EH25CB1 MC68302EH25CB1 NXP Semiconductors FSCLS09687-1.pdf?t.download=true&u=5oefqw Description: IC MPU M683XX 25MHZ 132PQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Supplier Device Package: 132-PQFP (24.13x24.13)
Voltage - I/O: 5V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Bulk
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SPC5746CHK1AMMH6 SPC5746CHK1AMMH6 NXP Semiconductors SPC5746CFK1ACKU6.pdf?t.download=true&u=axiww2 Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
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74AUP1G157GF,132 74AUP1G157GF,132 NXP Semiconductors PHGLS24877-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74AUP1G157GF - MULTIPLE
Supplier Device Package: 6-XSON, SOT891 (1x1)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: Multiplexer
Circuit: 1 x 2:1
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
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A2V09H400-04NR3 NXP Semiconductors PHGL-S-A0003207742-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 720MHz ~ 960MHz
Configuration: 2 N-Channel
Power - Output: 107W
Gain: 17.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 688 mA
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PTN5110DHQZ NXP Semiconductors Description: USB Type-C Rev 3.0 PD PHY, Dongl
Interface: Bus, I2C
Mounting Type: Surface Mount
Package / Case: 16-XFQFN Exposed Pad
Packaging: Bulk
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Voltage - Supply: 2.7V ~ 5.5V
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74LV04PW,118 74LV04PW,118 NXP Semiconductors PHGL-S-A0001366847-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER
Packaging: Bulk
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BGU8L1X BGU8L1X NXP Semiconductors PHGL-S-A0005068106-1.pdf?t.download=true&u=5oefqw Description: BGU8L1 - C Low Noise Amplifier M
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 14.5dB
Current - Supply: 4.6mA
Noise Figure: 0.7dB
P1dB: -3dBm
Test Frequency: 882MHz
Supplier Device Package: 6-XSON (1.1x0.7)
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MC9S08SU8VFK NXP Semiconductors PHGL-S-A0003028296-1.pdf?t.download=true&u=5oefqw Description: MC9S08SU - 8 bit MCU with S08L c
Packaging: Bulk
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08L
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 17
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74AUP1G07GF,132 74AUP1G07GF,132 NXP Semiconductors PHGLS25181-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON, SOT891 (1x1)
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74AUP1G58GF,132 PHGL-S-A0001284262-1.pdf?t.download=true&u=5oefqw
74AUP1G58GF,132
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP1G58GF - LOGIC CIR
Packaging: Bulk
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BGU8H1X PHGL-S-A0005068069-1.pdf?t.download=true&u=5oefqw
BGU8H1X
Hersteller: NXP Semiconductors
Description: BGU8H1 - SiGe:C Low Noise Amplif
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 3.35GHz
P1dB: -3dBm
Noise Figure: 0.9dB
Current - Supply: 5mA
Gain: 13dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: LTE, WiMax
Frequency: 2.3GHz ~ 2.69GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
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74AHCT139D,118 PHGLS15529-1.pdf?t.download=true&u=5oefqw
74AHCT139D,118
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AHCT139D - DECODER/DR
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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74LVT14DB,112 74LVT14.pdf
74LVT14DB,112
Hersteller: NXP Semiconductors
Description: IC INVERTER
Packaging: Bulk
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74HC85PW,112 PHGLS05972-1.pdf?t.download=true&u=5oefqw
74HC85PW,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HC85PW - MAGNITUDE CO
Packaging: Bulk
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BZX84-B13,215 BZX84_SER.pdf
BZX84-B13,215
Hersteller: NXP Semiconductors
Description: NEXPERIA BZX84-B13 - ZENER DIODE
Qualification: AEC-Q101
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Grade: Automotive
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 30 Ohms
Voltage - Zener (Nom) (Vz): 13 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±2%
Packaging: Bulk
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KTY81/150,112 KTY81_SER.pdf
KTY81/150,112
Hersteller: NXP Semiconductors
Description: SILICON TEMPERATURE SENSOR
Packaging: Tube
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Resistance @ 25°C: 1 kOhms
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BUK6E2R3-40C,127 BUK6E2R3-40C.pdf
BUK6E2R3-40C,127
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK6E2R3-40C - 120A, 40
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 15100 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 260 nC @ 10 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±16V
Drive Voltage (Max Rds On, Min Rds On): 10V
Grade: Automotive
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Power Dissipation (Max): 306W (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Bulk
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LPC12H27FBD64/301, PHGLS23259-1.pdf?t.download=true&u=5oefqw
LPC12H27FBD64/301,
Hersteller: NXP Semiconductors
Description: LPC1200 - Cortex-M0 32-Bit RISC
Packaging: Bulk
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NX3L1T53GD,125 NX3L1T53.pdf
NX3L1T53GD,125
Hersteller: NXP Semiconductors
Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Crosstalk: -90dB @ 100kHz
Charge Injection: 15pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
Number of Circuits: 1
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel-to-Channel Matching (ΔRon): 20mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
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LS1048ASE7Q1A LS1088AFS.pdf
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ LS1 1.6GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1.2V
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, IFC, PCI, SPI, UART
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T4240NSN7PQB T4240.pdf
Hersteller: NXP Semiconductors
Description: IC MPU 1.8GHZ 1932FCPBGA
Packaging: Bulk
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (16), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
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MC9328MX1VM20 FSCLS05269-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX1 200MHZ 225MAPBGA
Packaging: Bulk
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
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LPC11E36FBD64/501E PHGLS25742-1.pdf?t.download=true&u=5oefqw
LPC11E36FBD64/501E
Hersteller: NXP Semiconductors
Description: LPC11E36 - Cortex-M0+/M0 RISC Mi
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b SAR
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
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PCA9675PW,118 PCA9675.pdf
PCA9675PW,118
Hersteller: NXP Semiconductors
Description: PCA9675PW - Remote 16-Bit I/O Ex
Features: POR
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 300µA, 42mA
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PCA9468UKBZ FASTCHARGTS.pdf
Hersteller: NXP Semiconductors
Description: PCA9468UK - 2:1 switched cap dir
Packaging: Bulk
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MRF6V2150NBR1 FSCLS05116-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 50V TO272-4
Packaging: Bulk
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 450MHz
Configuration: N-Channel
Power - Output: 150W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
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BGA3031X BGA3031.pdf
Hersteller: NXP Semiconductors
Description: BGA3031 - DOCSIS 3.0 PLUS UPSTRE
Packaging: Bulk
Package / Case: 20-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Amplifier
Applications: CATV
Supplier Device Package: 20-HVQFN (5x5)
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IP4223CZ6,125 PHGLS23372-1.pdf?t.download=true&u=5oefqw
IP4223CZ6,125
Hersteller: NXP Semiconductors
Description: NEXPERIA IP4223 - TRANS VOLTAGE
Packaging: Bulk
Package / Case: SOT-23-6 Thin, TSOT-23-6
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 1.5pF @ 1MHz (Max)
Voltage - Reverse Standoff (Typ): 5.5V (Max)
Supplier Device Package: 6-TSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
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MC9S08AC128MFGE MC9S08AC60.pdf
Hersteller: NXP Semiconductors
Description: MC9S08AC - 8-bit MCU, 128KB Flas
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
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74AUP1GU04GS,132 PHGLS24886-1.pdf?t.download=true&u=5oefqw
74AUP1GU04GS,132
Hersteller: NXP Semiconductors
Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 4.3ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
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LPC2926FBD144,557 PHGLS20650-1.pdf?t.download=true&u=5oefqw
LPC2926FBD144,557
Hersteller: NXP Semiconductors
Description: LPC2926FBD144 - ARM9 microcontro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
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TFA9881UK/N1,023 PHGLS27948-1.pdf?t.download=true&u=5oefqw
TFA9881UK/N1,023
Hersteller: NXP Semiconductors
Description: IC AMP AUDIO CLASSD 3.4W 9WLCSP
Packaging: Bulk
auf Bestellung 70000 Stücke:
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CBTL06122AHF,518 CBTL06122.pdf
CBTL06122AHF,518
Hersteller: NXP Semiconductors
Description: IC MULTIPLEXER HEX 1X2 56HWQFN
Features: Bi-Directional
Packaging: Bulk
Package / Case: 56-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe
-3db Bandwidth: 2.5GHz
Supplier Device Package: 56-HWQFN (5x11)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 6
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MCIMX6Q4AVT10AC FSCL-S-A0001020796-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6 1GHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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2+254.3 EUR
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MCIMX6U5EVM10AC FSCL-S-A0000998349-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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MCIMX6U1AVM10AC FSCLS11779-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 600 Stücke:
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7+79.42 EUR
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PN7462AUEV/C300Y PN7462.pdf
PN7462AUEV/C300Y
Hersteller: NXP Semiconductors
Description: PN7462AUEV - NFC Cortex®
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, MIFARE, NFC
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, UART, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Bulk
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LPC1114JBD48/303QL PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114JBD48/303QL
Hersteller: NXP Semiconductors
Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Number of I/O: 42
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b SAR
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
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TDF8544J/N2,112 TDF8544.pdf
TDF8544J/N2,112
Hersteller: NXP Semiconductors
Description: IC AUDIO AMP AB DBS27P
Packaging: Tube
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
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BUK7575-55A,127 PHGLS22290-1.pdf?t.download=true&u=5oefqw
BUK7575-55A,127
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK7575 - N-CHANNEL MO
Qualification: AEC-Q101
Grade: Automotive
Input Capacitance (Ciss) (Max) @ Vds: 483 pF @ 25 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 62W (Tc)
Rds On (Max) @ Id, Vgs: 75mOhm @ 10A, 10V
Current - Continuous Drain (Id) @ 25°C: 20.3A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Bulk
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MW7IC930NR1 FSCLS05412-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 28V TO270-16
Packaging: Bulk
Package / Case: TO-270-16 Variant, Flat Leads
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 920MHz ~ 960MHz
Configuration: 2 N-Channel
Power - Output: 3.2W
Gain: 35.9dB
Technology: LDMOS (Dual)
Supplier Device Package: TO-270WB-16
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 285 mA
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LS1012AXN7KKB LS1012AFS.pdf
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ LS1 1GHZ 211FCLGA
Additional Interfaces: eMMC/SD/SDIO, GPIO, I2C, I2S, SPI, UART
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 (1), USB 3.0 + PHY
Ethernet: GbE (2)
Supplier Device Package: 211-FCLGA (9.6x9.6)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 211-VFLGA
Packaging: Bulk
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P1010NSE5HFB FSCLS11925-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Additional Interfaces: CANbus, DUART, I2C, MMC/SD, SPI
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 425-TEPBGA I (19x19)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 425-FBGA
Packaging: Bulk
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MC68HC11E9BCFNE2 M68HC11E.pdf
Hersteller: NXP Semiconductors
Description: M68HC11E - 8BIT MCU,12K BUFFALO
Number of I/O: 16
Supplier Device Package: 52-PLCC (19.13x19.13)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: M68HC11
EEPROM Size: 512 x 8
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 12KB (12K x 8)
Speed: 2MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Bulk
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PSMN018-100ESFQ PSMN018-100ESF.pdf
PSMN018-100ESFQ
Hersteller: NXP Semiconductors
Description: NEXPERIA PSMN018 - NEXTPOWER 100
Input Capacitance (Ciss) (Max) @ Vds: 1482 pF @ 50 V
Gate Charge (Qg) (Max) @ Vgs: 21.4 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 7V, 10V
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 111W (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 15A, 10V
Current - Continuous Drain (Id) @ 25°C: 53A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Bulk
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MMA2201KEGR2 MMA2201KEG.pdf
MMA2201KEGR2
Hersteller: NXP Semiconductors
Description: MMA2201KE - MEDIUM-G, ANALOG ACC
Sensitivity (mV/g): 50
Supplier Device Package: 16-SOIC
Bandwidth: 400Hz
Voltage - Supply: 5.25V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±40g
Axis: X
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
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74AUP2G3407GMH PHGLS28868-1.pdf?t.download=true&u=5oefqw
74AUP2G3407GMH
Hersteller: NXP Semiconductors
Description: IC BUFF 0.8V/3.6V 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA; 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
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LPC1112FDH28/102:5 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112FDH28/102:5
Hersteller: NXP Semiconductors
Description: LPC1112 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
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BC859B,215 BC859_BC860.pdf
BC859B,215
Hersteller: NXP Semiconductors
Description: TRANS PNP 30V 0.1A TO-236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 250 mW
Qualification: AEC-Q101
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MKW20Z160VHT4 PHGL-S-A0005067296-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC RF TXRX+MCU 802.15.4
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 28
Current - Transmitting: 8.4mA ~ 18.5mA
Data Rate (Max): 250kbps
Current - Receiving: 6.5mA ~ 15.4mA
Protocol: ZigbeePRO®
Power - Output: 5dBm
Voltage - Supply: 1.45V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 160kB Flash, 20kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Packaging: Bulk
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67+8.22 EUR
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74LVC139D,112 PHGLS23390-1.pdf?t.download=true&u=5oefqw
74LVC139D,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC139D - DECODER/DRI
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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MRFE6VP8600HR5 MRFE6VP8600H.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230
Current Rating (Amps): 20µA
Mounting Type: Chassis Mount
Frequency: 470MHz ~ 860MHz
Configuration: Dual, Common Source
Power - Output: 600W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 1.4 A
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BAT18,235 BAT18.pdf
BAT18,235
Hersteller: NXP Semiconductors
Description: RF DIODE STANDARD 35V SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Standard - Single
Operating Temperature: 125°C (TJ)
Capacitance @ Vr, F: 1pF @ 20V, 1MHz
Resistance @ If, F: 700mOhm @ 5mA, 200MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
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PDTA115EU,115 PIRSS13039-1.pdf?t.download=true&u=5oefqw
PDTA115EU,115
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS
Packaging: Bulk
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74HCT2G17GW-Q100H 74HC_HCT2G17_Q100.pdf
74HCT2G17GW-Q100H
Hersteller: NXP Semiconductors
Description: IC BUFF NON-INVERT 5.5V 6-TSSOP
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 6-TSSOP
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Input Type: Schmitt Trigger
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Bulk
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MPC860DTCZQ50D4 FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 50MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (2), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TJ)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
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NVT4555UKZ PHGLS28214-1.pdf?t.download=true&u=5oefqw
NVT4555UKZ
Hersteller: NXP Semiconductors
Description: NVT4555UK - SIM card interface l
Supplier Device Package: 12-WLCSP (1.62x1.19)
Applications: SIM Card
Voltage - Supply: 1.1V ~ 3.6V
Mounting Type: Surface Mount
Package / Case: 12-UFBGA, WLCSP
Packaging: Bulk
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PN7362BNHN/C300Y PN7462.pdf
PN7362BNHN/C300Y
Hersteller: NXP Semiconductors
Description: PN7362 - NFC CORTEX-M0 MICROCONT
DigiKey Programmable: Not Verified
Packaging: Bulk
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48+12.51 EUR
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BZX79-C22,143 BZX79.pdf
BZX79-C22,143
Hersteller: NXP Semiconductors
Description: DIODE ZENER 22V 400MW ALF2
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 400 mW
Supplier Device Package: ALF2
Impedance (Max) (Zzt): 55 Ohms
Voltage - Zener (Nom) (Vz): 22 V
Operating Temperature: -65°C ~ 200°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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MC68302AG25C FSCLS09687-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU 25MHZ 144LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Supplier Device Package: 144-LQFP (20x20)
Voltage - I/O: 5V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
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MC68302EH25CB1 FSCLS09687-1.pdf?t.download=true&u=5oefqw
MC68302EH25CB1
Hersteller: NXP Semiconductors
Description: IC MPU M683XX 25MHZ 132PQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Supplier Device Package: 132-PQFP (24.13x24.13)
Voltage - I/O: 5V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Bulk
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SPC5746CHK1AMMH6 SPC5746CFK1ACKU6.pdf?t.download=true&u=axiww2
SPC5746CHK1AMMH6
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
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74AUP1G157GF,132 PHGLS24877-1.pdf?t.download=true&u=5oefqw
74AUP1G157GF,132
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP1G157GF - MULTIPLE
Supplier Device Package: 6-XSON, SOT891 (1x1)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: Multiplexer
Circuit: 1 x 2:1
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
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1972+0.3 EUR
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A2V09H400-04NR3 PHGL-S-A0003207742-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 720MHz ~ 960MHz
Configuration: 2 N-Channel
Power - Output: 107W
Gain: 17.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 688 mA
auf Bestellung 454 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+186.69 EUR
Mindestbestellmenge: 4 Stücke
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PTN5110DHQZ
Hersteller: NXP Semiconductors
Description: USB Type-C Rev 3.0 PD PHY, Dongl
Interface: Bus, I2C
Mounting Type: Surface Mount
Package / Case: 16-XFQFN Exposed Pad
Packaging: Bulk
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Voltage - Supply: 2.7V ~ 5.5V
auf Bestellung 1000 Stücke:
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AnzahlPrivatkunde
192+3.03 EUR
Mindestbestellmenge: 192 Stücke
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74LV04PW,118 PHGL-S-A0001366847-1.pdf?t.download=true&u=5oefqw
74LV04PW,118
Hersteller: NXP Semiconductors
Description: IC INVERTER
Packaging: Bulk
auf Bestellung 3217 Stücke:
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AnzahlPrivatkunde
3217+0.23 EUR
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BGU8L1X PHGL-S-A0005068106-1.pdf?t.download=true&u=5oefqw
BGU8L1X
Hersteller: NXP Semiconductors
Description: BGU8L1 - C Low Noise Amplifier M
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 14.5dB
Current - Supply: 4.6mA
Noise Figure: 0.7dB
P1dB: -3dBm
Test Frequency: 882MHz
Supplier Device Package: 6-XSON (1.1x0.7)
auf Bestellung 1352200 Stücke:
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1255+0.48 EUR
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MC9S08SU8VFK PHGL-S-A0003028296-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: MC9S08SU - 8 bit MCU with S08L c
Packaging: Bulk
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08L
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 17
auf Bestellung 463 Stücke:
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118+5.13 EUR
Mindestbestellmenge: 118 Stücke
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74AUP1G07GF,132 PHGLS25181-1.pdf?t.download=true&u=5oefqw
74AUP1G07GF,132
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON, SOT891 (1x1)
auf Bestellung 295000 Stücke:
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AnzahlPrivatkunde
3493+0.18 EUR
Mindestbestellmenge: 3493 Stücke
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