Produkte > NXP SEMICONDUCTORS > Alle Produkte des Herstellers NXP SEMICONDUCTORS (53631) > Seite 39 nach 894
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
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74AUP1G157GF,132 | NXP Semiconductors |
Description: NEXPERIA 74AUP1G157GF - MULTIPLEPackaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Circuit: 1 x 2:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Independent Circuits: 1 Current - Output High, Low: 4mA, 4mA Voltage Supply Source: Single Supply Supplier Device Package: 6-XSON, SOT891 (1x1) |
auf Bestellung 15300 Stücke: Lieferzeit 10-14 Tag (e) |
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| A2V09H400-04NR3 | NXP Semiconductors |
Description: RF MOSFET LDMOS 48V OM780-4Packaging: Bulk Package / Case: OM-780-4L Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 720MHz ~ 960MHz Configuration: 2 N-Channel Power - Output: 107W Gain: 17.9dB Technology: LDMOS (Dual) Supplier Device Package: OM-780-4L Voltage - Rated: 105 V Voltage - Test: 48 V Current - Test: 688 mA |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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| PTN5110DHQZ | NXP Semiconductors |
Description: USB Type-C Rev 3.0 PD PHY, Dongl Packaging: Bulk Package / Case: 16-XFQFN Exposed Pad Mounting Type: Surface Mount Interface: Bus, I2C Voltage - Supply: 2.7V ~ 5.5V Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet Supplier Device Package: 16-HX2QFN (2.6x2.6) |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV04PW,118 | NXP Semiconductors |
Description: IC INVERTERPackaging: Bulk |
auf Bestellung 3217 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU8L1X | NXP Semiconductors |
Description: BGU8L1 - C Low Noise Amplifier MPackaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 728MHz ~ 960MHz RF Type: LTE, WiMax Voltage - Supply: 1.5V ~ 3.1V Gain: 14.5dB Current - Supply: 4.6mA Noise Figure: 0.7dB P1dB: -3dBm Test Frequency: 882MHz Supplier Device Package: 6-XSON (1.1x0.7) |
auf Bestellung 1098932 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC9S08SU8VFK | NXP Semiconductors |
Description: MC9S08SU - 8 bit MCU with S08L cPackaging: Bulk Package / Case: 24-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08L Data Converters: A/D 8x12b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V Connectivity: I2C, SCI Peripherals: PWM, WDT Supplier Device Package: 24-QFN (4x4) Number of I/O: 17 |
auf Bestellung 463 Stücke: Lieferzeit 10-14 Tag (e) |
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CBT3306D,112 | NXP Semiconductors |
Description: C3306 - NOW NEXPERIA CBT3306D -Packaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 2 Voltage Supply Source: Single Supply Supplier Device Package: 8-SO |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV00DB,118 | NXP Semiconductors |
Description: IC GATE NANDPackaging: Bulk |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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PCMF1USB30Z | NXP Semiconductors |
Description: NEXPERIA PCMF1USB - ELECTRONIC IPackaging: Bulk |
auf Bestellung 20495 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU20BA,115 | NXP Semiconductors |
Description: DIODE ZENER 20V 320MW SOD323Tolerance: ±5% Packaging: Bulk Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 20 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: SOD-323 Power - Max: 320 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 50 nA @ 15 V |
auf Bestellung 48000 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU20B1A,115 | NXP Semiconductors |
Description: DIODE ZENER 20V 320MW SOD323Tolerance: ±2% Packaging: Bulk Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 20 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: SOD-323 Power - Max: 320 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 50 nA @ 15 V |
auf Bestellung 15000 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU20B2,115 | NXP Semiconductors |
Description: DIODE ZENER 20V 310MW SOD323FTolerance: ±2% Packaging: Bulk Package / Case: SC-90, SOD-323F Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 20 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: SOD-323F Power - Max: 310 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 50 nA @ 15 V |
auf Bestellung 27000 Stücke: Lieferzeit 10-14 Tag (e) |
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| MPC8545VJATGD | NXP Semiconductors |
Description: IC MPU MPC85XX 1.2GHZ 783BGAPackaging: Bulk Package / Case: 783-BBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-PBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: AES, Cryptography, Kasumi, Random Number Generator Additional Interfaces: DUART, I2C, PCI, RapidIO |
auf Bestellung 118 Stücke: Lieferzeit 10-14 Tag (e) |
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MFRC53101T/0FE,112 | NXP Semiconductors |
Description: STANDARD ISO/IEC 14443 A/B READE Packaging: Bulk |
auf Bestellung 55 Stücke: Lieferzeit 10-14 Tag (e) |
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| PMEG6010ESBYL | NXP Semiconductors |
Description: DIODE SCHOTTKY 60V 1A DSN1006-2Packaging: Bulk Package / Case: 2-XDFN Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 2.4 ns Technology: Schottky Capacitance @ Vr, F: 20pF @ 10V, 1MHz Current - Average Rectified (Io): 1A Supplier Device Package: DSN1006-2 Operating Temperature - Junction: 150°C (Max) Voltage - DC Reverse (Vr) (Max): 60 V Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A Current - Reverse Leakage @ Vr: 30 µA @ 60 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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BFG505/X,215 | NXP Semiconductors |
Description: RF TRANS NPN 15V 9GHZ SOT-143BPackaging: Bulk Package / Case: TO-253-4, TO-253AA Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 150mW Current - Collector (Ic) (Max): 18mA Voltage - Collector Emitter Breakdown (Max): 15V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz Supplier Device Package: SOT-143B |
auf Bestellung 4610 Stücke: Lieferzeit 10-14 Tag (e) |
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PBSS5230QAZ | NXP Semiconductors |
Description: TRANS PNP 30V 2A DFN1010D-3Packaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 210mV @ 50mA, 1A Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V Frequency - Transition: 170MHz Supplier Device Package: DFN1010D-3 Current - Collector (Ic) (Max): 2 A Voltage - Collector Emitter Breakdown (Max): 30 V Power - Max: 325 mW |
auf Bestellung 554308 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA3664AT/N1,118 | NXP Semiconductors |
Description: IC REG LINEAR 5V 100MA 8-SOPackaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Fixed Mounting Type: Surface Mount Current - Output: 100mA Operating Temperature: -40°C ~ 125°C Output Configuration: Positive Current - Quiescent (Iq): 30 µA Voltage - Input (Max): 45V Number of Regulators: 1 Supplier Device Package: 8-SO Voltage - Output (Min/Fixed): 5V PSRR: 60dB (120Hz) Voltage Dropout (Max): 0.3V @ 50mA Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage Current - Supply (Max): 2.5 mA |
auf Bestellung 59 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU24B2L,315 | NXP Semiconductors |
Description: DIODE ZENER 24V 250MW DFN1006-2Tolerance: ±2% Packaging: Bulk Package / Case: SOD-882 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 24 V Impedance (Max) (Zzt): 30 Ohms Supplier Device Package: DFN1006-2 Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 50 nA @ 19 V |
auf Bestellung 30000 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC33886PVWR2 | NXP Semiconductors |
Description: 5.0 A H-BridgePackaging: Bulk Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 5A Interface: Parallel Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 40V Applications: General Purpose Technology: CMOS Voltage - Load: 5V ~ 40V Supplier Device Package: 20-HSOP Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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TEA1733MT/N2,118 | NXP Semiconductors |
Description: IC OFFLINE SWITCH FLYBACK 8SOPackaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 72% Frequency - Switching: 91.5kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 12V ~ 30V Supplier Device Package: 8-SO Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage Voltage - Start Up: 20.6 V Power (Watts): 75 W |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA1703T/N1,118 | NXP Semiconductors |
Description: IC CTRLR SMPS GREEN OVP 8SOPackaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Voltage - Input: 5V ~ 30V Operating Temperature: -40°C ~ 150°C Voltage - Supply: 5V ~ 30V Applications: Secondary-Side Controller Supplier Device Package: 8-SO Current - Supply: 30 µA DigiKey Programmable: Not Verified |
auf Bestellung 9883 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA1750T/N1,518 | NXP Semiconductors |
Description: IC OFFLINE SWITCH FLYBACK 16SOPackaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Frequency - Switching: 125kHz Internal Switch(s): No Voltage - Breakdown: 650V Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 15V ~ 38V Supplier Device Package: 16-SO Fault Protection: Current Limiting, Over Temperature, Over Voltage Voltage - Start Up: 22 V Power (Watts): 250 W |
auf Bestellung 4502 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1G58GM,132 | NXP Semiconductors |
Description: NEXPERIA 74LVC1G58GM - LOGIC CIRPackaging: Bulk |
auf Bestellung 1069960 Stücke: Lieferzeit 10-14 Tag (e) |
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CGY1047,112 | NXP Semiconductors |
Description: NARROW BAND HIGH POWER AMPLIFIERPackaging: Tube Package / Case: SOT-115J Output Type: Push-Pull Mounting Type: Chassis Mount Applications: CATV Supplier Device Package: SOT115J Number of Circuits: 1 Current - Supply: 250 mA |
auf Bestellung 2169 Stücke: Lieferzeit 10-14 Tag (e) |
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PMXB350UPEZ | NXP Semiconductors |
Description: NEXPERIA PMXB350UPE - 20 V, P-CHPackaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 1.2A (Ta) Rds On (Max) @ Id, Vgs: 447mOhm @ 1.2A, 4.5V Power Dissipation (Max): 360mW (Ta), 5.68W (Tc) Vgs(th) (Max) @ Id: 950mV @ 250µA Supplier Device Package: DFN1010D-3 Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 2.3 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 116 pF @ 10 V |
auf Bestellung 659217 Stücke: Lieferzeit 10-14 Tag (e) |
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| MPC8377VRAGDA | NXP Semiconductors |
Description: IC MPU MPC83XX 400MHZ PBGA689Packaging: Bulk Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e300c4s Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
auf Bestellung 392 Stücke: Lieferzeit 10-14 Tag (e) |
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| MPC8536EBVJAULA | NXP Semiconductors |
Description: IC MPU 1.333GHZ 783FCPBGAPackaging: Bulk Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11U14FET48/201, | NXP Semiconductors |
Description: LPC11U14- Scalable Entry Level 3Packaging: Bulk Package / Case: 48-TFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-TFBGA (4.5x4.5) Number of I/O: 40 |
auf Bestellung 861 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA10025HN/C1,518 | NXP Semiconductors |
Description: IC DEMODULATOR DUAL 48-HVQFNPackaging: Bulk Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Processor Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V Applications: Consumer Video Supplier Device Package: 48-HVQFN (7x7) Control Interface: I2C |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC4076FBD144E | NXP Semiconductors |
Description: LPC4000 - Mid-range 32-bit MicroPackaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 8x12b SAR; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 109 |
auf Bestellung 560 Stücke: Lieferzeit 10-14 Tag (e) |
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BC54-10PASX | NXP Semiconductors |
Description: TRANS NPN 45V 1A DFN2020D-3Packaging: Bulk Package / Case: 3-UDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V Frequency - Transition: 180MHz Supplier Device Package: DFN2020D-3 Current - Collector (Ic) (Max): 1 A Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 420 mW |
auf Bestellung 146990 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCF51AC128CCFGE | NXP Semiconductors |
Description: IC MCU 32BIT 128KB FLASH 44LQFPPackaging: Bulk Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 50.33MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 9x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 36 DigiKey Programmable: Not Verified |
auf Bestellung 125 Stücke: Lieferzeit 10-14 Tag (e) |
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| AFT27S010NT1 | NXP Semiconductors |
Description: RF MOSFET LDMOS 28V PLD-1.5WPackaging: Bulk Package / Case: PLD-1.5W Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 728MHz ~ 3.6GHz Power - Output: 1.26W Gain: 21.7dB Technology: LDMOS Supplier Device Package: PLD-1.5W Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 90 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| MKM33Z64CLH5 | NXP Semiconductors |
Description: IC MCU 32BIT 64KB FLASH 64LQFPPackaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16b SAR, 24b Sigma-Delta Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LCD, LVD, POR, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 38 DigiKey Programmable: Not Verified |
auf Bestellung 160 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA1738GT/N1,118 | NXP Semiconductors |
Description: IC OFFLINE SWITCH FLYBACK 8SOPackaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 80% Frequency - Switching: 26.5kHz ~ 118kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V Supplier Device Package: 8-SO Fault Protection: Current Limiting, Over Power, Over Temperature Voltage - Start Up: 13.2 V Power (Watts): 75 W |
auf Bestellung 3861 Stücke: Lieferzeit 10-14 Tag (e) |
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BAP1321-03,115 | NXP Semiconductors |
Description: RF DIODE PIN 60V 500MW SOD-323Packaging: Bulk Package / Case: SC-76, SOD-323 Diode Type: PIN - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 60V Supplier Device Package: SOD-323 Current - Max: 100 mA Power Dissipation (Max): 500 mW |
auf Bestellung 9190 Stücke: Lieferzeit 10-14 Tag (e) |
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| HT2MOA4S20/E/3/RJ | NXP Semiconductors |
Description: HITAG 2 transponder ICPackaging: Bulk Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 125kHz Type: RFID Transponder Operating Temperature: -55°C ~ 140°C Voltage - Supply: 6.5V Standards: ISO 11784, ISO 11785 Supplier Device Package: PLLMC |
auf Bestellung 33666 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP3G34GDH | NXP Semiconductors |
Description: NEXPERIA 74AUP3G34 - NON INVERTIPackaging: Bulk |
auf Bestellung 2928 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP3G34GNX | NXP Semiconductors |
Description: NEXPERIA 74AUP3G34 - LOW-POWER TPackaging: Bulk |
auf Bestellung 69900 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC9S08JM16CLD | NXP Semiconductors |
Description: IC MCU 8BIT 16KB FLASH 44LQFPPackaging: Bulk Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: HCS08 Data Converters: A/D 8x12b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI, USB Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 33 DigiKey Programmable: Not Verified |
auf Bestellung 2327 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCIMX6Q5EZK08AD | NXP Semiconductors |
Description: IC MPU I.MX6Q 800MHZ 569MAPBGAPackaging: Bulk Package / Case: 569-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 569-MAPBGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 2208 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6X3EVK10AB | NXP Semiconductors |
Description: IC MPU I.MX6SX 1GHZ 400MAPBGAPackaging: Bulk Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 1GHz, 227MHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 400-MAPBGA (14x14) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC |
auf Bestellung 139 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11U35FBD64/401, | NXP Semiconductors |
Description: IC MCU 32BIT 64KB FLASH 64LQFPPackaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 10K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 40841 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11U37FBD64/501, | NXP Semiconductors |
Description: LPC11U37 - Scalable 32-bit MicroPackaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 |
auf Bestellung 4759 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11U24FHI33/301, | NXP Semiconductors |
Description: LPC11U24 - Scalable 32-bit MicroPackaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 26 |
auf Bestellung 15263 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11U34FHN33/311, | NXP Semiconductors |
Description: IC MCU 32BIT 40KB FLASH 32HVQFNPackaging: Bulk Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 40KB (40K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
auf Bestellung 504 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11U35FET48/501, | NXP Semiconductors |
Description: IC MCU 32BIT 64KB FLASH 48TFBGAPackaging: Bulk Package / Case: 48-TFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-TFBGA (4.5x4.5) Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 15316 Stücke: Lieferzeit 10-14 Tag (e) |
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JN5168-001-M00Z | NXP Semiconductors |
Description: RF TXRX MOD 802.15.4 TH SMDPackaging: Bulk Package / Case: 40-VFQFN Exposed Pad Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2V ~ 3.6V Power - Output: 2.5dBm Protocol: Zigbee® Current - Receiving: 17mA Current - Transmitting: 15.3mA Antenna Type: Integrated, Trace Modulation: O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART |
auf Bestellung 417 Stücke: Lieferzeit 10-14 Tag (e) |
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| AFV10700HR5 | NXP Semiconductors |
Description: RF MOSFET LDMOS 52V NI780Packaging: Bulk Package / Case: NI-780-4 Current Rating (Amps): 1µA Mounting Type: Chassis Mount Frequency: 960MHz ~ 1.215GHz Configuration: 2 N-Channel Power - Output: 700W Gain: 19.2dB Technology: LDMOS (Dual) Supplier Device Package: NI-780-4 Voltage - Rated: 105 V Voltage - Test: 52 V Current - Test: 100 mA |
auf Bestellung 237 Stücke: Lieferzeit 10-14 Tag (e) |
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BF1100R,215 | NXP Semiconductors |
Description: RF MOSFET 9V SOT143RPackaging: Bulk Package / Case: SOT-143R Current Rating (Amps): 30mA Mounting Type: Surface Mount Frequency: 800MHz Configuration: N-Channel Dual Gate Technology: MOSFET (Metal Oxide) Noise Figure: 2dB Supplier Device Package: SOT-143R Voltage - Rated: 14 V Voltage - Test: 9 V Current - Test: 10 mA |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA18273HN/C1,518 | NXP Semiconductors |
Description: IC SILICON TUNER HYBRID 40HVQFNPackaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.3V ~ 3.6V Applications: Professional Video Standards: DVB-T2, DVB-C2 Supplier Device Package: 40-HVQFN (6x6) Control Interface: I2C |
auf Bestellung 218821 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9306GF,115 | NXP Semiconductors |
Description: IC XLTR VL BIDIR 8-XSON/SOT1089Features: Auto-Direction Sensing Packaging: Bulk Package / Case: 8-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Supplier Device Package: 8-XSON, SOT1089 (1.35x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Number of Circuits: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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BC857CMB,315 | NXP Semiconductors |
Description: TRANS PNP 45V 0.1A DFN1006B-3Packaging: Bulk Package / Case: 3-XFDFN Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V Frequency - Transition: 100MHz Supplier Device Package: DFN1006B-3 Grade: Automotive Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 250 mW Qualification: AEC-Q101 |
auf Bestellung 118179 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1055T/C,512 | NXP Semiconductors |
Description: IC TXRX 14-SOPackaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 14-SO Duplex: Half |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| LPC54018J2MET180E | NXP Semiconductors |
Description: LPC54018 - ARM Cortex-M4, BoschPackaging: Bulk Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2MB (2M x 8) RAM Size: 360K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Number of I/O: 137 |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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BZV85-C6V2,133 | NXP Semiconductors |
Description: DIODE ZENER 6.2V 1W DO41Tolerance: ±5% Packaging: Bulk Package / Case: DO-204AL, DO-41, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 200°C Voltage - Zener (Nom) (Vz): 6.2 V Impedance (Max) (Zzt): 4 Ohms Supplier Device Package: DO-41 Power - Max: 1 W Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Current - Reverse Leakage @ Vr: 2 µA @ 3 V |
auf Bestellung 93370 Stücke: Lieferzeit 10-14 Tag (e) |
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BAP50-04,215 | NXP Semiconductors |
Description: RF DIODE PIN 50V 250MW SOT-23Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Diode Type: PIN - 1 Pair Series Connection Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz Resistance @ If, F: 5Ohm @ 10mA, 100MHz Voltage - Peak Reverse (Max): 50V Supplier Device Package: SOT-23 (TO-236AB) Current - Max: 50 mA Power Dissipation (Max): 250 mW |
auf Bestellung 16914 Stücke: Lieferzeit 10-14 Tag (e) |
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A7101CLTK2/T0BC2WJ | NXP Semiconductors |
Description: RF MOSFETPackaging: Bulk |
auf Bestellung 110586 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1751FBD80,551 | NXP Semiconductors |
Description: IC MCU 32BIT 32KB FLASH 80LQFPPackaging: Bulk Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 6x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 80-LQFP (12x12) Number of I/O: 52 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 74AUP1G157GF,132 |
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Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP1G157GF - MULTIPLE
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT891 (1x1)
Description: NEXPERIA 74AUP1G157GF - MULTIPLE
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT891 (1x1)
auf Bestellung 15300 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1972+ | 0.3 EUR |
| A2V09H400-04NR3 |
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Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 720MHz ~ 960MHz
Configuration: 2 N-Channel
Power - Output: 107W
Gain: 17.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 688 mA
Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 720MHz ~ 960MHz
Configuration: 2 N-Channel
Power - Output: 107W
Gain: 17.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 688 mA
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 266.16 EUR |
| PTN5110DHQZ |
Hersteller: NXP Semiconductors
Description: USB Type-C Rev 3.0 PD PHY, Dongl
Packaging: Bulk
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Bus, I2C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Description: USB Type-C Rev 3.0 PD PHY, Dongl
Packaging: Bulk
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Bus, I2C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Supplier Device Package: 16-HX2QFN (2.6x2.6)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 192+ | 3.03 EUR |
| 74LV04PW,118 |
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auf Bestellung 3217 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3217+ | 0.23 EUR |
| BGU8L1X |
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Hersteller: NXP Semiconductors
Description: BGU8L1 - C Low Noise Amplifier M
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 14.5dB
Current - Supply: 4.6mA
Noise Figure: 0.7dB
P1dB: -3dBm
Test Frequency: 882MHz
Supplier Device Package: 6-XSON (1.1x0.7)
Description: BGU8L1 - C Low Noise Amplifier M
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 14.5dB
Current - Supply: 4.6mA
Noise Figure: 0.7dB
P1dB: -3dBm
Test Frequency: 882MHz
Supplier Device Package: 6-XSON (1.1x0.7)
auf Bestellung 1098932 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 599+ | 1.01 EUR |
| MC9S08SU8VFK |
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Hersteller: NXP Semiconductors
Description: MC9S08SU - 8 bit MCU with S08L c
Packaging: Bulk
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08L
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 17
Description: MC9S08SU - 8 bit MCU with S08L c
Packaging: Bulk
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08L
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 17
auf Bestellung 463 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 118+ | 5.13 EUR |
| CBT3306D,112 |
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Hersteller: NXP Semiconductors
Description: C3306 - NOW NEXPERIA CBT3306D -
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SO
Description: C3306 - NOW NEXPERIA CBT3306D -
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SO
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 952+ | 0.64 EUR |
| 74LV00DB,118 |
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auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1803+ | 0.35 EUR |
| PCMF1USB30Z |
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auf Bestellung 20495 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1998+ | 0.3 EUR |
| PZU20BA,115 |
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Hersteller: NXP Semiconductors
Description: DIODE ZENER 20V 320MW SOD323
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
Description: DIODE ZENER 20V 320MW SOD323
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
auf Bestellung 48000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12488+ | 0.04 EUR |
| PZU20B1A,115 |
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Hersteller: NXP Semiconductors
Description: DIODE ZENER 20V 320MW SOD323
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
Description: DIODE ZENER 20V 320MW SOD323
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 15000+ | 0.04 EUR |
| PZU20B2,115 |
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Hersteller: NXP Semiconductors
Description: DIODE ZENER 20V 310MW SOD323F
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323F
Power - Max: 310 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
Description: DIODE ZENER 20V 310MW SOD323F
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323F
Power - Max: 310 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10804+ | 0.061 EUR |
| MPC8545VJATGD |
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Hersteller: NXP Semiconductors
Description: IC MPU MPC85XX 1.2GHZ 783BGA
Packaging: Bulk
Package / Case: 783-BBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-PBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: AES, Cryptography, Kasumi, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, RapidIO
Description: IC MPU MPC85XX 1.2GHZ 783BGA
Packaging: Bulk
Package / Case: 783-BBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-PBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: AES, Cryptography, Kasumi, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, RapidIO
auf Bestellung 118 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 441.73 EUR |
| MFRC53101T/0FE,112 |
auf Bestellung 55 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 18+ | 30.19 EUR |
| PMEG6010ESBYL |
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Hersteller: NXP Semiconductors
Description: DIODE SCHOTTKY 60V 1A DSN1006-2
Packaging: Bulk
Package / Case: 2-XDFN
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2.4 ns
Technology: Schottky
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DSN1006-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A
Current - Reverse Leakage @ Vr: 30 µA @ 60 V
Description: DIODE SCHOTTKY 60V 1A DSN1006-2
Packaging: Bulk
Package / Case: 2-XDFN
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2.4 ns
Technology: Schottky
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DSN1006-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A
Current - Reverse Leakage @ Vr: 30 µA @ 60 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BFG505/X,215 |
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Hersteller: NXP Semiconductors
Description: RF TRANS NPN 15V 9GHZ SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 18mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz
Supplier Device Package: SOT-143B
Description: RF TRANS NPN 15V 9GHZ SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 18mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz
Supplier Device Package: SOT-143B
auf Bestellung 4610 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1135+ | 0.48 EUR |
| PBSS5230QAZ |
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Hersteller: NXP Semiconductors
Description: TRANS PNP 30V 2A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 210mV @ 50mA, 1A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V
Frequency - Transition: 170MHz
Supplier Device Package: DFN1010D-3
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 325 mW
Description: TRANS PNP 30V 2A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 210mV @ 50mA, 1A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V
Frequency - Transition: 170MHz
Supplier Device Package: DFN1010D-3
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 325 mW
auf Bestellung 554308 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4691+ | 0.12 EUR |
| TDA3664AT/N1,118 |
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Hersteller: NXP Semiconductors
Description: IC REG LINEAR 5V 100MA 8-SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 100mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 30 µA
Voltage - Input (Max): 45V
Number of Regulators: 1
Supplier Device Package: 8-SO
Voltage - Output (Min/Fixed): 5V
PSRR: 60dB (120Hz)
Voltage Dropout (Max): 0.3V @ 50mA
Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage
Current - Supply (Max): 2.5 mA
Description: IC REG LINEAR 5V 100MA 8-SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 100mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 30 µA
Voltage - Input (Max): 45V
Number of Regulators: 1
Supplier Device Package: 8-SO
Voltage - Output (Min/Fixed): 5V
PSRR: 60dB (120Hz)
Voltage Dropout (Max): 0.3V @ 50mA
Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage
Current - Supply (Max): 2.5 mA
auf Bestellung 59 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 59+ | 9.1 EUR |
| PZU24B2L,315 |
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Hersteller: NXP Semiconductors
Description: DIODE ZENER 24V 250MW DFN1006-2
Tolerance: ±2%
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DFN1006-2
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 19 V
Description: DIODE ZENER 24V 250MW DFN1006-2
Tolerance: ±2%
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DFN1006-2
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 19 V
auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3343+ | 0.17 EUR |
| MC33886PVWR2 |
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Hersteller: NXP Semiconductors
Description: 5.0 A H-Bridge
Packaging: Bulk
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Description: 5.0 A H-Bridge
Packaging: Bulk
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA1733MT/N2,118 |
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Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 91.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Power (Watts): 75 W
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 91.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Power (Watts): 75 W
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 519+ | 1.06 EUR |
| TEA1703T/N1,118 |
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Hersteller: NXP Semiconductors
Description: IC CTRLR SMPS GREEN OVP 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V ~ 30V
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 30V
Applications: Secondary-Side Controller
Supplier Device Package: 8-SO
Current - Supply: 30 µA
DigiKey Programmable: Not Verified
Description: IC CTRLR SMPS GREEN OVP 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V ~ 30V
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 30V
Applications: Secondary-Side Controller
Supplier Device Package: 8-SO
Current - Supply: 30 µA
DigiKey Programmable: Not Verified
auf Bestellung 9883 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 404+ | 1.36 EUR |
| TEA1750T/N1,518 |
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Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 125kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Power (Watts): 250 W
Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 125kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Power (Watts): 250 W
auf Bestellung 4502 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 202+ | 2.74 EUR |
| 74LVC1G58GM,132 |
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auf Bestellung 1069960 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1625+ | 0.35 EUR |
| CGY1047,112 |
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Hersteller: NXP Semiconductors
Description: NARROW BAND HIGH POWER AMPLIFIER
Packaging: Tube
Package / Case: SOT-115J
Output Type: Push-Pull
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 250 mA
Description: NARROW BAND HIGH POWER AMPLIFIER
Packaging: Tube
Package / Case: SOT-115J
Output Type: Push-Pull
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 250 mA
auf Bestellung 2169 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 55.48 EUR |
| PMXB350UPEZ |
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Hersteller: NXP Semiconductors
Description: NEXPERIA PMXB350UPE - 20 V, P-CH
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 1.2A (Ta)
Rds On (Max) @ Id, Vgs: 447mOhm @ 1.2A, 4.5V
Power Dissipation (Max): 360mW (Ta), 5.68W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 2.3 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 116 pF @ 10 V
Description: NEXPERIA PMXB350UPE - 20 V, P-CH
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 1.2A (Ta)
Rds On (Max) @ Id, Vgs: 447mOhm @ 1.2A, 4.5V
Power Dissipation (Max): 360mW (Ta), 5.68W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 2.3 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 116 pF @ 10 V
auf Bestellung 659217 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3703+ | 0.14 EUR |
| MPC8377VRAGDA |
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Hersteller: NXP Semiconductors
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
auf Bestellung 392 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 155.19 EUR |
| MPC8536EBVJAULA |
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Hersteller: NXP Semiconductors
Description: IC MPU 1.333GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU 1.333GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 550.61 EUR |
| LPC11U14FET48/201, |
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Hersteller: NXP Semiconductors
Description: LPC11U14- Scalable Entry Level 3
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
Description: LPC11U14- Scalable Entry Level 3
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
auf Bestellung 861 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 103+ | 5.26 EUR |
| TDA10025HN/C1,518 |
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Hersteller: NXP Semiconductors
Description: IC DEMODULATOR DUAL 48-HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Processor
Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
Description: IC DEMODULATOR DUAL 48-HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Processor
Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 117+ | 4.59 EUR |
| LPC4076FBD144E |
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Hersteller: NXP Semiconductors
Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 109
Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 109
auf Bestellung 560 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 23+ | 25.99 EUR |
| BC54-10PASX |
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Hersteller: NXP Semiconductors
Description: TRANS NPN 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 180MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
Description: TRANS NPN 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 180MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
auf Bestellung 146990 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3904+ | 0.14 EUR |
| MCF51AC128CCFGE |
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Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50.33MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50.33MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 125 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 21+ | 29.08 EUR |
| AFT27S010NT1 |
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Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Bulk
Package / Case: PLD-1.5W
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 728MHz ~ 3.6GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Bulk
Package / Case: PLD-1.5W
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 728MHz ~ 3.6GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
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| MKM33Z64CLH5 |
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Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR, 24b Sigma-Delta
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR, 24b Sigma-Delta
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 89+ | 6.02 EUR |
| TEA1738GT/N1,118 |
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Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 118kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature
Voltage - Start Up: 13.2 V
Power (Watts): 75 W
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 118kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature
Voltage - Start Up: 13.2 V
Power (Watts): 75 W
auf Bestellung 3861 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 466+ | 1.18 EUR |
| BAP1321-03,115 |
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Hersteller: NXP Semiconductors
Description: RF DIODE PIN 60V 500MW SOD-323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD-323
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
Description: RF DIODE PIN 60V 500MW SOD-323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD-323
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
auf Bestellung 9190 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2597+ | 0.21 EUR |
| HT2MOA4S20/E/3/RJ |
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Hersteller: NXP Semiconductors
Description: HITAG 2 transponder IC
Packaging: Bulk
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -55°C ~ 140°C
Voltage - Supply: 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: PLLMC
Description: HITAG 2 transponder IC
Packaging: Bulk
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -55°C ~ 140°C
Voltage - Supply: 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: PLLMC
auf Bestellung 33666 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 175+ | 3.03 EUR |
| 74AUP3G34GDH |
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auf Bestellung 2928 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1457+ | 0.38 EUR |
| 74AUP3G34GNX |
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auf Bestellung 69900 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1139+ | 0.46 EUR |
| MC9S08JM16CLD |
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Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
auf Bestellung 2327 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 73+ | 7.39 EUR |
| MCIMX6Q5EZK08AD |
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Hersteller: NXP Semiconductors
Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Bulk
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Bulk
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 2208 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 196.37 EUR |
| MCIMX6X3EVK10AB |
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Hersteller: NXP Semiconductors
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz, 227MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz, 227MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
auf Bestellung 139 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 45.18 EUR |
| LPC11U35FBD64/401, |
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Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 40841 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 73+ | 7.44 EUR |
| LPC11U37FBD64/501, |
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Hersteller: NXP Semiconductors
Description: LPC11U37 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Description: LPC11U37 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
auf Bestellung 4759 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 64+ | 8.5 EUR |
| LPC11U24FHI33/301, |
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Hersteller: NXP Semiconductors
Description: LPC11U24 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
Description: LPC11U24 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
auf Bestellung 15263 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 98+ | 5.53 EUR |
| LPC11U34FHN33/311, |
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Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 40KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 40KB (40K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 40KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 40KB (40K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 504 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 94+ | 5.77 EUR |
| LPC11U35FET48/501, |
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Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 64KB FLASH 48TFBGA
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48TFBGA
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 15316 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 73+ | 7.44 EUR |
| JN5168-001-M00Z |
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Hersteller: NXP Semiconductors
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 17mA
Current - Transmitting: 15.3mA
Antenna Type: Integrated, Trace
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 17mA
Current - Transmitting: 15.3mA
Antenna Type: Integrated, Trace
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
auf Bestellung 417 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 22+ | 24.6 EUR |
| AFV10700HR5 |
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Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 52V NI780
Packaging: Bulk
Package / Case: NI-780-4
Current Rating (Amps): 1µA
Mounting Type: Chassis Mount
Frequency: 960MHz ~ 1.215GHz
Configuration: 2 N-Channel
Power - Output: 700W
Gain: 19.2dB
Technology: LDMOS (Dual)
Supplier Device Package: NI-780-4
Voltage - Rated: 105 V
Voltage - Test: 52 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 52V NI780
Packaging: Bulk
Package / Case: NI-780-4
Current Rating (Amps): 1µA
Mounting Type: Chassis Mount
Frequency: 960MHz ~ 1.215GHz
Configuration: 2 N-Channel
Power - Output: 700W
Gain: 19.2dB
Technology: LDMOS (Dual)
Supplier Device Package: NI-780-4
Voltage - Rated: 105 V
Voltage - Test: 52 V
Current - Test: 100 mA
auf Bestellung 237 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1259.72 EUR |
| BF1100R,215 |
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Hersteller: NXP Semiconductors
Description: RF MOSFET 9V SOT143R
Packaging: Bulk
Package / Case: SOT-143R
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: SOT-143R
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
Description: RF MOSFET 9V SOT143R
Packaging: Bulk
Package / Case: SOT-143R
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: SOT-143R
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1069+ | 0.5 EUR |
| TDA18273HN/C1,518 |
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Hersteller: NXP Semiconductors
Description: IC SILICON TUNER HYBRID 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Professional Video
Standards: DVB-T2, DVB-C2
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I2C
Description: IC SILICON TUNER HYBRID 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Professional Video
Standards: DVB-T2, DVB-C2
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I2C
auf Bestellung 218821 Stücke:
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| Anzahl | Privatkunde |
|---|---|
| 170+ | 3.43 EUR |
| PCA9306GF,115 |
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Hersteller: NXP Semiconductors
Description: IC XLTR VL BIDIR 8-XSON/SOT1089
Features: Auto-Direction Sensing
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
Description: IC XLTR VL BIDIR 8-XSON/SOT1089
Features: Auto-Direction Sensing
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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| BC857CMB,315 |
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Hersteller: NXP Semiconductors
Description: TRANS PNP 45V 0.1A DFN1006B-3
Packaging: Bulk
Package / Case: 3-XFDFN
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 250 mW
Qualification: AEC-Q101
Description: TRANS PNP 45V 0.1A DFN1006B-3
Packaging: Bulk
Package / Case: 3-XFDFN
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 250 mW
Qualification: AEC-Q101
auf Bestellung 118179 Stücke:
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| Anzahl | Privatkunde |
|---|---|
| 3980+ | 0.15 EUR |
| TJA1055T/C,512 |
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Hersteller: NXP Semiconductors
Description: IC TXRX 14-SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
Description: IC TXRX 14-SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
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| LPC54018J2MET180E |
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Hersteller: NXP Semiconductors
Description: LPC54018 - ARM Cortex-M4, Bosch
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 137
Description: LPC54018 - ARM Cortex-M4, Bosch
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 137
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9+ | 60.29 EUR |
| BZV85-C6V2,133 |
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Hersteller: NXP Semiconductors
Description: DIODE ZENER 6.2V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Description: DIODE ZENER 6.2V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
auf Bestellung 93370 Stücke:
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| Anzahl | Privatkunde |
|---|---|
| 2844+ | 0.2 EUR |
| BAP50-04,215 |
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Hersteller: NXP Semiconductors
Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 50 mA
Power Dissipation (Max): 250 mW
Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 50 mA
Power Dissipation (Max): 250 mW
auf Bestellung 16914 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1846+ | 0.3 EUR |
| A7101CLTK2/T0BC2WJ |
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auf Bestellung 110586 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 216+ | 2.51 EUR |
| LPC1751FBD80,551 |
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Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 32KB FLASH 80LQFP
Packaging: Bulk
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 80LQFP
Packaging: Bulk
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
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