Produkte > NXP SEMICONDUCTORS > Alle Produkte des Herstellers NXP SEMICONDUCTORS (69062) > Seite 39 nach 1152
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| 74HC125DAUJ | NXP Semiconductors |
Description: 74HC1BDRIVEHC/SERIE4-FUN1-BITROU Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BC860CW/ZL115 | NXP Semiconductors |
Description: BC8PGENERPURPOTRANSISTORS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| SIT8924AA-23-33N-30.000000G | NXP Semiconductors |
Description: SIT89LPOWPROGRAMMABOSCILLATOAUTE Packaging: Bulk |
Produkt ist nicht verfügbar |
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| SIT8924AA-23-18E-27.000000G | NXP Semiconductors |
Description: SIT8LPOWPROGRAMMABOSCILLATOAUTEM Packaging: Bulk |
Produkt ist nicht verfügbar |
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| 74HC73PW112 | NXP Semiconductors |
Description: IC FF JK TYPE DUAL 1BIT 14TSSOPPackaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Output Type: Complementary Mounting Type: Surface Mount Number of Elements: 2 Function: Reset Type: JK Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 4 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Negative Edge Clock Frequency: 83 MHz Input Capacitance: 3.5 pF Supplier Device Package: 14-TSSOP Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF Number of Bits per Element: 1 |
Produkt ist nicht verfügbar |
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| 74HCT04DAUJ | NXP Semiconductors |
Description: 74HCTINVERTEHSERIE6-FUN1-INPUCMO Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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MC34717EPR2 | NXP Semiconductors |
Description: MC34717 - Switch-Mode Power SuppPackaging: Bulk Package / Case: 26-VFQFN Exposed Pad Voltage - Output: 0.7V ~ 3.6V Mounting Type: Surface Mount Number of Outputs: 2 Voltage - Input: 3V ~ 6V Operating Temperature: -40°C ~ 85°C Applications: Converter, DDR Supplier Device Package: 26-QFN (5x5) |
Produkt ist nicht verfügbar |
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| MC908JK3EMDWE | NXP Semiconductors |
Description: MC9S08JK - MICROCONTROLLER, 8-BIPackaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: M68HC08 Data Converters: A/D 10x8b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LED, LVD, POR, PWM Supplier Device Package: 20-SOIC Number of I/O: 15 |
Produkt ist nicht verfügbar |
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MC33790HEGR2 | NXP Semiconductors |
Description: IC DIST SYST INTERFACE 16SOICPackaging: Bulk Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Logic Mounting Type: Surface Mount Type: Distributed Systems Interface Operating Temperature: -40°C ~ 85°C Input Type: Logic Supplier Device Package: 16-SOIC Current - Supply: 1 mA DigiKey Programmable: Not Verified |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33790HEG | NXP Semiconductors |
Description: IC DIST SYST INTERFACE 16SOICPackaging: Bulk Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Logic Mounting Type: Surface Mount Type: Distributed Systems Interface Operating Temperature: -40°C ~ 85°C Input Type: Logic Supplier Device Package: 16-SOIC Current - Supply: 1 mA |
auf Bestellung 89 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCIMX7S3EVK08SC557 | NXP Semiconductors |
Description: I.MX 7SOLO:1X CORTEX A7, 1X USBPackaging: Bulk |
Produkt ist nicht verfügbar |
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LPC2930FBD208,551 | NXP Semiconductors |
Description: LPC2900 - Arm9, 32-Bit RISC MicrPackaging: Bulk Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 125MHz RAM Size: 56K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM968E-S Data Converters: A/D 24x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 152 |
auf Bestellung 103 Stücke: Lieferzeit 10-14 Tag (e) |
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| S1JVMJD31CT4G | NXP Semiconductors |
Description: S1JVMJDBDPNTRANSISTA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BC847CW/DG/B4115 | NXP Semiconductors |
Description: NEXPERBC84SMASIGNBIPOLTRANSISTO0 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| S908QY1E0CDTER | NXP Semiconductors |
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: HC08 Core Size: 8-Bit Supplier Device Package: 16-TSSOP DigiKey Programmable: Not Verified |
auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
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| S908GR8E0CDWE | NXP Semiconductors |
Description: IC MCU 8BIT 7.5KB FLASH 28SOICPackaging: Bulk Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 7.5KB (7.5K x 8) RAM Size: 384 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x8b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 28-SOIC Number of I/O: 21 DigiKey Programmable: Not Verified |
auf Bestellung 320 Stücke: Lieferzeit 10-14 Tag (e) |
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S908GZ32G3MFAE | NXP Semiconductors |
Description: S908GZ32G3MFAE - AUTO 8 BIT MCU Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.5K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 24x10b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V, 4.5V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Number of I/O: 37 |
auf Bestellung 7000 Stücke: Lieferzeit 10-14 Tag (e) |
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| S908GZ60H0CFJE | NXP Semiconductors |
Description: IC MCU 8BIT 60KB FLASH 32LQFP Packaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: M68HC08 Data Converters: A/D 24x10b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 32-LQFP (7x7) Number of I/O: 21 DigiKey Programmable: Not Verified |
auf Bestellung 3967 Stücke: Lieferzeit 10-14 Tag (e) |
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| S908AB32AG0MFUE | NXP Semiconductors |
Description: S908AB32AG0MFUE Packaging: Bulk |
auf Bestellung 84 Stücke: Lieferzeit 10-14 Tag (e) |
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BZB784-C11115 | NXP Semiconductors |
Description: NOW NEXPERIA BZB784-C10 - ZENERTolerance: ±5% Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 11 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: SOT-323 Power - Max: 180 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 100 nA @ 8 V |
Produkt ist nicht verfügbar |
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| PCA9450AHNY | NXP Semiconductors |
Description: PCA9450AHN - Power Management ICPackaging: Bulk Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 5.5V Applications: i.MX Processors Current - Supply: 23µA Supplier Device Package: 56-HVQFN (7x7) |
auf Bestellung 4210 Stücke: Lieferzeit 10-14 Tag (e) |
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| AFSC5G37E38T2 | NXP Semiconductors |
Description: AFSC5G37E38 - Airfast Power AmplPackaging: Bulk Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.6GHz ~ 3.8GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 27.3dB Test Frequency: 3.6GHz Supplier Device Package: 26-HLQFN (10x6) |
auf Bestellung 1992 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC68040RC25V | NXP Semiconductors |
Description: MICROPROCESSOR, 32-BIT, MC68000Packaging: Bulk Package / Case: 179-BPGA Mounting Type: Through Hole Speed: 25MHz Operating Temperature: 0°C ~ 110°C (TJ) Core Processor: 68040 Voltage - I/O: 5V Supplier Device Package: 179-PGA (47.24x47.24) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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| MC68040FE33A157 | NXP Semiconductors |
Description: MC68MICROPROCESSO32-BIMC680FAMIL Packaging: Tray |
Produkt ist nicht verfügbar |
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| MC68040RC40A | NXP Semiconductors |
Description: MC68RI32-BMICROPROCESS40MHZPackaging: Tray |
Produkt ist nicht verfügbar |
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| IP5311CX5/LF/P,135 | NXP Semiconductors |
Description: 1P5311CDALIFILTPIN(SPLASTIC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| A3I35D012WNR1 | NXP Semiconductors |
Description: A3I35D012 - Airfast RF LDMOS Wid Packaging: Bulk Package / Case: TO-270-17 Variant, Flat Leads Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 3.2GHz ~ 4GHz Configuration: 2 N-Channel Power - Output: 1.8W Gain: 27.8dB Technology: LDMOS (Dual) Supplier Device Package: TO-270WB-17 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 138 mA |
auf Bestellung 396 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU8M1UKAZ | NXP Semiconductors |
Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP Packaging: Bulk Package / Case: 6-XFBGA, WLCSP Mounting Type: Surface Mount Frequency: 1.805GHz ~ 2.2GHz RF Type: Cellular, LTE Voltage - Supply: 1.5V ~ 3.1V Gain: 16dB Current - Supply: 5mA Noise Figure: 0.8dB P1dB: -3dBm Test Frequency: 2.14GHz Supplier Device Package: 6-WLCSP (0.65x0.44) |
auf Bestellung 2800000 Stücke: Lieferzeit 10-14 Tag (e) |
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| RN5RK251A-TR-FE | NXP Semiconductors |
Description: RNINPVSTEP-DC/CONVERTERPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| MAX823MEXK-T | NXP Semiconductors |
Description: MAX5-PMICROPROCESSSUPERVISOCIRCU Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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LPC11A12FBD48/101, | NXP Semiconductors |
Description: LPC11A12 - Cortex-M0+/M0 RISC MiPackaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 42 |
auf Bestellung 207 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11A13JHI33/201E | NXP Semiconductors |
Description: LPC11A13 - Cortex-M0+/M0 RISC MiPackaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 24KB (24K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 28 |
auf Bestellung 580 Stücke: Lieferzeit 10-14 Tag (e) |
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HEF4013BTT-Q100118 | NXP Semiconductors |
Description: NEXPERIA HEF4013BTT-Q100 - D FLIPackaging: Bulk |
Produkt ist nicht verfügbar |
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PN5120A0HN/C2,551 | NXP Semiconductors |
Description: PN5120A0HN/C2 - Full NFC FrontenPackaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART Type: RFID Reader/Transponder Operating Temperature: -30°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 3.6V Standards: FeliCa, ISO 14443, MIFARE, NFC Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 2420 Stücke: Lieferzeit 10-14 Tag (e) |
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FXTH87EH11DT1 | NXP Semiconductors |
Description: SENSOR TIRE PRESSURE RFPackaging: Bulk Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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FXTH871511DT1 | NXP Semiconductors |
Description: SENSOR TIRE PRESSURE RF OUTPUTPackaging: Bulk Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
auf Bestellung 41435 Stücke: Lieferzeit 10-14 Tag (e) |
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2N7002BKM/V,315 | NXP Semiconductors |
Description: NEXPERIA 2N7002BKM - SMALL SIGNAPackaging: Bulk |
Produkt ist nicht verfügbar |
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| MCIMX6U8DVM10AD557 | NXP Semiconductors |
Description: CORTEX A9 RISC MICROPROCESSOR 32Packaging: Bulk |
Produkt ist nicht verfügbar |
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74ABT32D,112 | NXP Semiconductors |
Description: IC GATE ORPackaging: Bulk |
auf Bestellung 10964 Stücke: Lieferzeit 10-14 Tag (e) |
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| BC847C/DG/B4215 | NXP Semiconductors |
Description: NEXPERBC8SMASIGNBIPOLTRANSISTO0. Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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HEF4094BTT118 | NXP Semiconductors |
Description: NEXPERIA HEF4094BTT - SERIAL INPackaging: Bulk |
Produkt ist nicht verfügbar |
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PESD15VL1BAZ | NXP Semiconductors |
Description: TVS DIODE 15VWM 44VC SOD323Packaging: Bulk Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TA) Applications: CAN, Telecom Capacitance @ Frequency: 16pF @ 1MHz Current - Peak Pulse (10/1000µs): 5A (8/20µs) Voltage - Reverse Standoff (Typ): 15V (Max) Supplier Device Package: SOD-323 Bidirectional Channels: 1 Voltage - Breakdown (Min): 17.1V Voltage - Clamping (Max) @ Ipp: 44V Power - Peak Pulse: 200W Power Line Protection: No |
auf Bestellung 22948 Stücke: Lieferzeit 10-14 Tag (e) |
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| LTC1148HVCS#PBF | NXP Semiconductors |
Description: LTC1SWITCHICONTROLLE250KSWITCHIFPackaging: Tube |
Produkt ist nicht verfügbar |
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| BAV21-T50A | NXP Semiconductors |
Description: DIODE STD 250V 200MA DO204AHPackaging: Bulk Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 50 ns Technology: Standard Capacitance @ Vr, F: 5pF @ 0V, 1MHz Current - Average Rectified (Io): 200mA Supplier Device Package: DO-204AH (DO-35) Operating Temperature - Junction: 175°C Voltage - DC Reverse (Vr) (Max): 250 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 mA Current - Reverse Leakage @ Vr: 100 nA @ 200 V |
auf Bestellung 146 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCIMX7S3EVK08SC | NXP Semiconductors |
Description: IC MPU 800MHZ 488MAPBGAPackaging: Bulk Package / Case: 488-TFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 488-MAPBGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, MIPI Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Additional Interfaces: AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART |
auf Bestellung 6080 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6X1CVK08AB | NXP Semiconductors |
Description: IC MPU 200MHZ/800MHZ 400MAPBGAPackaging: Bulk Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 200MHz, 800MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 400-MAPBGA (14x14) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, LPDDR2, LVDDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Additional Interfaces: AC'97, CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC |
auf Bestellung 4671 Stücke: Lieferzeit 10-14 Tag (e) |
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NX3P191UK,023 | NXP Semiconductors |
Description: SPST, 1 FUNC, 1 CHANNEL, PBGA4Packaging: Bulk |
auf Bestellung 9000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVCH16245ADGG-Q100118 | NXP Semiconductors |
Description: NEXPERIA 74LVCH16245ADGG-Q100 -Packaging: Bulk |
Produkt ist nicht verfügbar |
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| BZX384-C47115 | NXP Semiconductors |
Description: NOW NEXPERIA BZX384-C43 - ZENER Tolerance: ±5% Packaging: Bulk Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C (TJ) Voltage - Zener (Nom) (Vz): 47 V Impedance (Max) (Zzt): 170 Ohms Supplier Device Package: SOD-323 Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 50 nA @ 50 V |
Produkt ist nicht verfügbar |
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| MPC860TCZQ50D4 | NXP Semiconductors |
Description: IC MPU MPC86XX 50MHZ 357BGAPackaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 95°C (TJ) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
auf Bestellung 2634 Stücke: Lieferzeit 10-14 Tag (e) |
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| PUMD9115 | NXP Semiconductors |
Description: PUMD9 - NPN/PNP RESISTOR-EQUIPPEPackaging: Bulk Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual) Power - Max: 300mW Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V Resistor - Base (R1): 10kOhms Resistor - Emitter Base (R2): 47kOhms Supplier Device Package: 6-TSSOP |
Produkt ist nicht verfügbar |
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PC33772ASP1AE | NXP Semiconductors |
Description: PC33772ASP1AE - LI-ION BATTERY CPackaging: Bulk Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: I2C, SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-LQFP (7x7) Fault Protection: Over/Under Voltage |
auf Bestellung 93 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP1Z125GM,115 | NXP Semiconductors |
Description: NEXPERIA 74AUP1Z125GM - BUS DRIVPackaging: Bulk |
auf Bestellung 25144 Stücke: Lieferzeit 10-14 Tag (e) |
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| PCF8551BTT/AY | NXP Semiconductors |
Description: PCF8551BTT - Universal 36 × Packaging: Bulk Package / Case: 48-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: SPI Configuration: 36 Segment Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 9 Characters, 18 Characters, 144 Elements Supplier Device Package: 48-TSSOP Current - Supply: 1.2 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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BC857BW/ZL115 | NXP Semiconductors |
Description: NEXPERIA BC857BW - SMALL SIGNALPackaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V Frequency - Transition: 100MHz Supplier Device Package: SC-70 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 200 mW |
auf Bestellung 114000 Stücke: Lieferzeit 10-14 Tag (e) |
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PQMD10147 | NXP Semiconductors |
Description: PQMD10 - NPN/PNP RESISTOR-EQUIPPPackaging: Bulk |
auf Bestellung 13699 Stücke: Lieferzeit 10-14 Tag (e) |
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PQMD2147 | NXP Semiconductors |
Description: PQMD2 - NPN/PNP RESISTOR-EQUIPPEPackaging: Bulk |
auf Bestellung 13697 Stücke: Lieferzeit 10-14 Tag (e) |
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PTVS7V5U1UPA,147 | NXP Semiconductors |
Description: NEXPERIA PTVS7V5U1 - 300W TRANSIPackaging: Bulk |
auf Bestellung 9000 Stücke: Lieferzeit 10-14 Tag (e) |
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PQMD16147 | NXP Semiconductors |
Description: PQMD16 - NPN/PNP RESISTOR-EQUIPPPackaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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74LVC14APW | NXP Semiconductors |
Description: NOW NEXPERIA 74LVC14APW - INVERTFeatures: Schmitt Trigger Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.2V ~ 3.6V Current - Output High, Low: 24mA, 24mA Number of Inputs: 1 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1V ~ 2V Input Logic Level - Low: 0.12V ~ 0.8V Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 50pF Number of Circuits: 6 Current - Quiescent (Max): 40 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 74HC125DAUJ |
Hersteller: NXP Semiconductors
Description: 74HC1BDRIVEHC/SERIE4-FUN1-BITROU
Packaging: Tape & Reel (TR)
Description: 74HC1BDRIVEHC/SERIE4-FUN1-BITROU
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74HC73PW112 |
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Hersteller: NXP Semiconductors
Description: IC FF JK TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
Description: IC FF JK TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74HCT04DAUJ |
Hersteller: NXP Semiconductors
Description: 74HCTINVERTEHSERIE6-FUN1-INPUCMO
Packaging: Tape & Reel (TR)
Description: 74HCTINVERTEHSERIE6-FUN1-INPUCMO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC34717EPR2 |
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Hersteller: NXP Semiconductors
Description: MC34717 - Switch-Mode Power Supp
Packaging: Bulk
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
Description: MC34717 - Switch-Mode Power Supp
Packaging: Bulk
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC908JK3EMDWE |
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Hersteller: NXP Semiconductors
Description: MC9S08JK - MICROCONTROLLER, 8-BI
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 10x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
Description: MC9S08JK - MICROCONTROLLER, 8-BI
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 10x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC33790HEGR2 |
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Hersteller: NXP Semiconductors
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 1 mA
DigiKey Programmable: Not Verified
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 1 mA
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 72+ | 6.71 EUR |
| MC33790HEG |
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Hersteller: NXP Semiconductors
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 1 mA
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 1 mA
auf Bestellung 89 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 89+ | 6.71 EUR |
| LPC2930FBD208,551 |
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Hersteller: NXP Semiconductors
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
auf Bestellung 103 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 26+ | 17.81 EUR |
| BC847CW/DG/B4115 |
Hersteller: NXP Semiconductors
Description: NEXPERBC84SMASIGNBIPOLTRANSISTO0
Packaging: Tape & Reel (TR)
Description: NEXPERBC84SMASIGNBIPOLTRANSISTO0
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S908QY1E0CDTER |
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 177+ | 2.99 EUR |
| S908GR8E0CDWE |
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Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 7.5KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 7.5KB (7.5K x 8)
RAM Size: 384 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 7.5KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 7.5KB (7.5K x 8)
RAM Size: 384 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 21
DigiKey Programmable: Not Verified
auf Bestellung 320 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 39+ | 13.87 EUR |
| S908GZ32G3MFAE |
Hersteller: NXP Semiconductors
Description: S908GZ32G3MFAE - AUTO 8 BIT MCU
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V, 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
Description: S908GZ32G3MFAE - AUTO 8 BIT MCU
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V, 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
auf Bestellung 7000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 27+ | 19.82 EUR |
| S908GZ60H0CFJE |
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
auf Bestellung 3967 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 21+ | 24.07 EUR |
| S908AB32AG0MFUE |
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 21+ | 25.52 EUR |
| BZB784-C11115 |
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Hersteller: NXP Semiconductors
Description: NOW NEXPERIA BZB784-C10 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Description: NOW NEXPERIA BZB784-C10 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9450AHNY |
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Hersteller: NXP Semiconductors
Description: PCA9450AHN - Power Management IC
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
Description: PCA9450AHN - Power Management IC
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
auf Bestellung 4210 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 77+ | 6.92 EUR |
| AFSC5G37E38T2 |
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Hersteller: NXP Semiconductors
Description: AFSC5G37E38 - Airfast Power Ampl
Packaging: Bulk
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.3dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AFSC5G37E38 - Airfast Power Ampl
Packaging: Bulk
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.3dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
auf Bestellung 1992 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 13+ | 38.37 EUR |
| MC68040RC25V |
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Hersteller: NXP Semiconductors
Description: MICROPROCESSOR, 32-BIT, MC68000
Packaging: Bulk
Package / Case: 179-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: 68040
Voltage - I/O: 5V
Supplier Device Package: 179-PGA (47.24x47.24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: MICROPROCESSOR, 32-BIT, MC68000
Packaging: Bulk
Package / Case: 179-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: 68040
Voltage - I/O: 5V
Supplier Device Package: 179-PGA (47.24x47.24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A3I35D012WNR1 |
Hersteller: NXP Semiconductors
Description: A3I35D012 - Airfast RF LDMOS Wid
Packaging: Bulk
Package / Case: TO-270-17 Variant, Flat Leads
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 3.2GHz ~ 4GHz
Configuration: 2 N-Channel
Power - Output: 1.8W
Gain: 27.8dB
Technology: LDMOS (Dual)
Supplier Device Package: TO-270WB-17
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 138 mA
Description: A3I35D012 - Airfast RF LDMOS Wid
Packaging: Bulk
Package / Case: TO-270-17 Variant, Flat Leads
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 3.2GHz ~ 4GHz
Configuration: 2 N-Channel
Power - Output: 1.8W
Gain: 27.8dB
Technology: LDMOS (Dual)
Supplier Device Package: TO-270WB-17
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 138 mA
auf Bestellung 396 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 10+ | 58.08 EUR |
| BGU8M1UKAZ |
Hersteller: NXP Semiconductors
Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 16dB
Current - Supply: 5mA
Noise Figure: 0.8dB
P1dB: -3dBm
Test Frequency: 2.14GHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 16dB
Current - Supply: 5mA
Noise Figure: 0.8dB
P1dB: -3dBm
Test Frequency: 2.14GHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
auf Bestellung 2800000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3116+ | 0.18 EUR |
| MAX823MEXK-T |
Hersteller: NXP Semiconductors
Description: MAX5-PMICROPROCESSSUPERVISOCIRCU
Packaging: Tape & Reel (TR)
Description: MAX5-PMICROPROCESSSUPERVISOCIRCU
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC11A12FBD48/101, |
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Hersteller: NXP Semiconductors
Description: LPC11A12 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
Description: LPC11A12 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
auf Bestellung 207 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 128+ | 3.7 EUR |
| LPC11A13JHI33/201E |
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Hersteller: NXP Semiconductors
Description: LPC11A13 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
Description: LPC11A13 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
auf Bestellung 580 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 115+ | 4.11 EUR |
| PN5120A0HN/C2,551 |
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Hersteller: NXP Semiconductors
Description: PN5120A0HN/C2 - Full NFC Fronten
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: PN5120A0HN/C2 - Full NFC Fronten
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2420 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 53+ | 9.66 EUR |
| FXTH87EH11DT1 |
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Hersteller: NXP Semiconductors
Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 67+ | 7.3 EUR |
| FXTH871511DT1 |
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Hersteller: NXP Semiconductors
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 41435 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 45+ | 11.77 EUR |
| 74ABT32D,112 |
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auf Bestellung 10964 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 701+ | 0.69 EUR |
| BC847C/DG/B4215 |
Hersteller: NXP Semiconductors
Description: NEXPERBC8SMASIGNBIPOLTRANSISTO0.
Packaging: Tape & Reel (TR)
Description: NEXPERBC8SMASIGNBIPOLTRANSISTO0.
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PESD15VL1BAZ |
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Hersteller: NXP Semiconductors
Description: TVS DIODE 15VWM 44VC SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: CAN, Telecom
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 15V (Max)
Supplier Device Package: SOD-323
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 44V
Power - Peak Pulse: 200W
Power Line Protection: No
Description: TVS DIODE 15VWM 44VC SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: CAN, Telecom
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 15V (Max)
Supplier Device Package: SOD-323
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 44V
Power - Peak Pulse: 200W
Power Line Protection: No
auf Bestellung 22948 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 5735+ | 0.077 EUR |
| BAV21-T50A |
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Hersteller: NXP Semiconductors
Description: DIODE STD 250V 200MA DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Capacitance @ Vr, F: 5pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: 175°C
Voltage - DC Reverse (Vr) (Max): 250 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 200 V
Description: DIODE STD 250V 200MA DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Capacitance @ Vr, F: 5pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: 175°C
Voltage - DC Reverse (Vr) (Max): 250 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 200 V
auf Bestellung 146 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 344.28 EUR |
| MCIMX7S3EVK08SC |
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Hersteller: NXP Semiconductors
Description: IC MPU 800MHZ 488MAPBGA
Packaging: Bulk
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Description: IC MPU 800MHZ 488MAPBGA
Packaging: Bulk
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
auf Bestellung 6080 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 18+ | 29.1 EUR |
| MCIMX6X1CVK08AB |
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Hersteller: NXP Semiconductors
Description: IC MPU 200MHZ/800MHZ 400MAPBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, LPDDR2, LVDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Description: IC MPU 200MHZ/800MHZ 400MAPBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, LPDDR2, LVDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
auf Bestellung 4671 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 13+ | 35.25 EUR |
| NX3P191UK,023 |
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auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1332+ | 0.39 EUR |
| BZX384-C47115 |
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA BZX384-C43 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 170 Ohms
Supplier Device Package: SOD-323
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 50 V
Description: NOW NEXPERIA BZX384-C43 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 170 Ohms
Supplier Device Package: SOD-323
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 50 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC860TCZQ50D4 |
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Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 2634 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 273.8 EUR |
| PUMD9115 |
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Hersteller: NXP Semiconductors
Description: PUMD9 - NPN/PNP RESISTOR-EQUIPPE
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: 6-TSSOP
Description: PUMD9 - NPN/PNP RESISTOR-EQUIPPE
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: 6-TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PC33772ASP1AE |
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Hersteller: NXP Semiconductors
Description: PC33772ASP1AE - LI-ION BATTERY C
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-LQFP (7x7)
Fault Protection: Over/Under Voltage
Description: PC33772ASP1AE - LI-ION BATTERY C
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-LQFP (7x7)
Fault Protection: Over/Under Voltage
auf Bestellung 93 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 22+ | 22.02 EUR |
| 74AUP1Z125GM,115 |
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auf Bestellung 25144 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1490+ | 0.32 EUR |
| PCF8551BTT/AY |
Hersteller: NXP Semiconductors
Description: PCF8551BTT - Universal 36 ×
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 36 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 1.2 µA
Description: PCF8551BTT - Universal 36 ×
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 36 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 1.2 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BC857BW/ZL115 |
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Hersteller: NXP Semiconductors
Description: NEXPERIA BC857BW - SMALL SIGNAL
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SC-70
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
Description: NEXPERIA BC857BW - SMALL SIGNAL
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SC-70
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
auf Bestellung 114000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 15000+ | 0.032 EUR |
| PQMD10147 |
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auf Bestellung 13699 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 6935+ | 0.06 EUR |
| PQMD2147 |
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auf Bestellung 13697 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 8460+ | 0.064 EUR |
| PTVS7V5U1UPA,147 |
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auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3050+ | 0.16 EUR |
| 74LVC14APW |
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Hersteller: NXP Semiconductors
Description: NOW NEXPERIA 74LVC14APW - INVERT
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
Description: NOW NEXPERIA 74LVC14APW - INVERT
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
























