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TDA19997HL/C1,551 NXP Semiconductors Description: IC DVI/HDMI SWITCH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Function: Switch
Voltage - Supply: 1.65V ~ 1.95V, 3.0V ~ 3.6V
Applications: Video Display
Standards: CEA-861D, DVI 1.0, HDCP 1.3, HDMI 1.4, IEC 61000-4-2
Supplier Device Package: 100-LQFP (14x14)
Control Interface: I2C
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PCA8543AHL/AY NXP Semiconductors PCA8543.pdf Description: PCA8543AHL - 4 x 60 automotive L
Packaging: Bulk
Package / Case: 80-LQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.5V ~ 5.5V
Digits or Characters: 15 Characters, 30 Characters, 240 Elements
Supplier Device Package: 80-LQFP (12x12)
Current - Supply: 250 µA
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74HC112PW,112 74HC112PW,112 NXP Semiconductors PHGL-S-A0002312769-1.pdf?t.download=true&u=5oefqw Description: IC FF JK-TYPE DUAL 1BIT 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-TSSOP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
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SC16C754BIA68,529 SC16C754BIA68,529 NXP Semiconductors PHGLS15907-1.pdf?t.download=true&u=5oefqw Description: IC UART QUAD 64BYTE 68PLCC
With Modem Control: Yes
With False Start Bit Detection: Yes
With IrDA Encoder/Decoder: No
With Auto Flow Control: Yes
Supplier Device Package: 68-PLCC (24.23x24.23)
Data Rate (Max): 5Mbps
FIFO's: 64 Byte
Voltage - Supply: 2.25V ~ 2.75V, 2.97V ~ 3.63V, 4.5V ~ 5.5V
Mounting Type: Surface Mount
Number of Channels: 4, QUART
Package / Case: 68-LCC (J-Lead)
Packaging: Bulk
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PCA9550D,118 PCA9550D,118 NXP Semiconductors PCA9550.pdf Description: IC LED DRVR LINEAR I2C 25MA 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 400kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 8-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
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TDA8766G/C1,118 TDA8766G/C1,118 NXP Semiconductors TDA8766.pdf Description: IC ADC 10BIT SIGMA-DELTA 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: 20°C ~ 75°C
Voltage - Supply, Analog: 3V ~ 5.25V
Voltage - Supply, Digital: 3V ~ 5.25V
Sampling Rate (Per Second): 20M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 32-LQFP (5x5)
Architecture: Sigma-Delta
Number of A/D Converters: 1
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MAX9286S32V234 NXP Semiconductors Description: MAX9286 - S32V MIPI CAMERAS AND
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
Utilized IC / Part: S32V234
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MC08XS6421CEKR2 NXP Semiconductors PHGL-S-A0002207203-1.pdf?t.download=true&u=5oefqw Description: MC08XS6421CEK - External Automot
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Input Type: CMOS
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
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PMV100XPEA215 PMV100XPEA215 NXP Semiconductors PMV100XPEA.pdf Description: NEXPERIA PMV100 - P-CHANNEL MOSF
Input Capacitance (Ciss) (Max) @ Vds: 386 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 6 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±12V
Supplier Device Package: SOT-23
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Power Dissipation (Max): 463mW (Ta), 4.45W (Tc)
Rds On (Max) @ Id, Vgs: 128mOhm @ 2.4A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 2.4A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
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LPC3230FET296/01,5 LPC3230FET296/01,5 NXP Semiconductors PHGLS30266-1.pdf?t.download=true&u=5oefqw Description: LPC3230 - Arm9, 32-Bit Microcont
Packaging: Bulk
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
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PIMXRT595SFFOA NXP Semiconductors IMXRT500EC.pdf Description: IMXRT595 - I.MX RT500 CROSSOVER
Packaging: Bulk
DigiKey Programmable: Not Verified
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74LVC2G07GXZ 74LVC2G07GXZ NXP Semiconductors 74LVC2G07.pdf Description: IC BUFFER NON-INVERT 5.5V 6X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-X2SON (1.0x0.8)
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74LVT573PW,112 74LVT573PW,112 NXP Semiconductors PHGLS23935-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74LVT573PW - BUS DRIVER
Packaging: Bulk
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TEF7006HN/V1,518 TEF7006HN/V1,518 NXP Semiconductors PHGL-S-A0003531970-1.pdf?t.download=true&u=5oefqw Description: IC CONSUMER CIRC PQCC32
Packaging: Bulk
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MC8641DHX1500KE NXP Semiconductors _MPC8641DEC.pdf?t.download=true&u=ovmfp3 Description: IC MPU MPC86XX 1.5GHZ 1023FCCBGA
Packaging: Bulk
Package / Case: 1023-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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BGU8L1UKAZ BGU8L1UKAZ NXP Semiconductors BGU8L1.pdf Description: IC AMP CELL 728-960MHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 15.5dB
Current - Supply: 4.7mA
Noise Figure: 0.8dB
P1dB: -5dBm
Test Frequency: 943MHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
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BGU8L1UK/SZ BGU8L1UK/SZ NXP Semiconductors BGU8L1.pdf Description: IC AMP CELL 728-960MHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 15.5dB
Current - Supply: 4.7mA
Noise Figure: 0.8dB
P1dB: -5dBm
Test Frequency: 943MHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
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TDA18260HN/C1,551 TDA18260HN/C1,551 NXP Semiconductors TDA18260HN_SDS.pdf Description: TDA18260HN - DUAL CABLE SILICON
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
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74AUP1G332GN,132 74AUP1G332GN,132 NXP Semiconductors 74AUP1G332.pdf Description: NEXPERIA 74AUP1G332 - LOW-POWER
Packaging: Bulk
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FXTH87EH116T1 FXTH87EH116T1 NXP Semiconductors FXTH87EH116?lang_cd=en Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
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PHP225,118 PHP225,118 NXP Semiconductors PHGLS22918-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PHP225 - SMALL SIGNAL F
Packaging: Bulk
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JN5179/001K JN5179/001K NXP Semiconductors PHGL-S-A0003845997-1.pdf?t.download=true&u=5oefqw Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 3.6V
Power - Output: 10dBm
Protocol: Zigbee®
Current - Receiving: 12.7mA ~ 14.8mA
Data Rate (Max): 16Mbps
Current - Transmitting: 14mA ~ 22.5mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
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LPC2102FBD48,151 LPC2102FBD48,151 NXP Semiconductors LPC2101_02_03.pdf Description: IC MCU 16/32BIT 16KB FLSH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 70MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
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LPC802UKZ NXP Semiconductors PHGL-S-A0001056910-1.pdf?t.download=true&u=5oefqw Description: LPC802UKZ - Low-Cost Microcontro
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-WLCSP (1.84x1.84)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 15MHz
Mounting Type: Surface Mount
Package / Case: 16-UFBGA, WLCSP
Packaging: Bulk
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PDTC144TM,315 PDTC144TM,315 NXP Semiconductors PDTC144T_SERIES.pdf Description: TRANS PREBIAS
Packaging: Bulk
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LPC2925FBD100,551 LPC2925FBD100,551 NXP Semiconductors PHGLS20650-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 16x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 1.89V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
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LPC43S20FBD144E NXP Semiconductors LPC43S50_30_20.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M0, ARM® Cortex®-M4
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
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P89LPC917FDH,129 P89LPC917FDH,129 NXP Semiconductors P89LPC915_916_917.pdf Description: IC MCU 8BIT 2KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Verified
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LPC3131FET180,551 NXP Semiconductors PHGLS25043-1.pdf?t.download=true&u=5oefqw Description: LPC3131 - Low-cost, low-power AR
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 4x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.2V ~ 3.6V
Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
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88MW302-B0-NXUE/AK NXP Semiconductors User-manual-2777835.pdf Description: IC RF TXRX+MCU BLE 88HVQFN
Packaging: Bulk
Package / Case: 88-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 512kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V
Protocol: 802.11n/g/b, Bluetooth, Zigbee®, Z-Wave®
Data Rate (Max): 72.2Mbps
Supplier Device Package: 88-HVQFN (10x10)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, PWM, SPI, UART
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74AHCT126PW,112 74AHCT126PW,112 NXP Semiconductors PHGLS19988-1.pdf?t.download=true&u=5oefqw Description: IC BUFF NON-INVERT 5.5V 14TSSOP
Supplier Device Package: 14-TSSOP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
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PZU22B2,115 PZU22B2,115 NXP Semiconductors PHGLS19743-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PZU22B2 - ZENER DIODE,
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOD-323F
Power - Max: 310 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 17 V
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MM908E622ACPEK MM908E622ACPEK NXP Semiconductors MM908E622.pdf Description: MM908E622 - Integrated motor dri
Packaging: Bulk
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 16V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
Number of I/O: 12
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PHN203,518 PHN203,518 NXP Semiconductors PHGLS20699-1.pdf?t.download=true&u=5oefqw Description: MOSFET 2N-CH 30V 6.3A 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Configuration: 2 N-Channel
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 2W (Ta)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 6.3A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 560pF @ 20V
Rds On (Max) @ Id, Vgs: 30mOhm @ 7A, 10V
Gate Charge (Qg) (Max) @ Vgs: 14.6nC @ 10V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: 8-SO
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74LV74PW,118 74LV74PW,118 NXP Semiconductors 74LV74.pdf Description: IC FF D-TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 80 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 110 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Number of Bits per Element: 1
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74LV74D,112 74LV74D,112 NXP Semiconductors 74LV74.pdf Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 110 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Number of Bits per Element: 1
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BC846BW/ZLF BC846BW/ZLF NXP Semiconductors BC846XW_SER.pdf Description: NEXPERIA BC846 - 65V, 100MA NPN
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Supplier Device Package: SOT-323
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74AUP1G58GF,132 74AUP1G58GF,132 NXP Semiconductors PHGL-S-A0001284262-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74AUP1G58GF - LOGIC CIR
Packaging: Bulk
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BGU8H1X BGU8H1X NXP Semiconductors PHGL-S-A0005068069-1.pdf?t.download=true&u=5oefqw Description: BGU8H1 - SiGe:C Low Noise Amplif
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 3.35GHz
P1dB: -3dBm
Noise Figure: 0.9dB
Current - Supply: 5mA
Gain: 13dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: LTE, WiMax
Frequency: 2.3GHz ~ 2.69GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
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74AHCT139D,118 74AHCT139D,118 NXP Semiconductors PHGLS15529-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74AHCT139D - DECODER/DR
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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74LVT14DB,112 74LVT14DB,112 NXP Semiconductors 74LVT14.pdf Description: IC INVERTER
Packaging: Bulk
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74HC85PW,112 74HC85PW,112 NXP Semiconductors PHGLS05972-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74HC85PW - MAGNITUDE CO
Packaging: Bulk
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BZX84-B13,215 BZX84-B13,215 NXP Semiconductors BZX84_SER.pdf Description: NEXPERIA BZX84-B13 - ZENER DIODE
Qualification: AEC-Q101
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Grade: Automotive
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 30 Ohms
Voltage - Zener (Nom) (Vz): 13 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±2%
Packaging: Bulk
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KMI23/2Z NXP Semiconductors KMI23_2_4.pdf Description: KMI23/2 - High performance rotat
Qualification: AEC-Q100
Resistance: 50 Ohms
Grade: Automotive
Output Signal: Clockwise Increase
Supplier Device Package: 2-SIP
For Measuring: Rotary Position
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Voltage - Supply: 6.8V ~ 16V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 150°C
Output: Analog Voltage
Mounting Type: Through Hole
Package / Case: SOT-453A
Packaging: Bulk
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KTY82/151,215 KTY82/151,215 NXP Semiconductors KTY82_SER.pdf Description: SENSOR PTC 975OHM TO236AB
Resistance @ 25°C: 975 Ohms
Supplier Device Package: TO-236AB
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
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KTY81/150,112 KTY81/150,112 NXP Semiconductors KTY81_SER.pdf Description: SILICON TEMPERATURE SENSOR
Packaging: Tube
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Resistance @ 25°C: 1 kOhms
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BUK6E2R3-40C,127 BUK6E2R3-40C,127 NXP Semiconductors BUK6E2R3-40C.pdf Description: NEXPERIA BUK6E2R3-40C - 120A, 40
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 15100 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 260 nC @ 10 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±16V
Drive Voltage (Max Rds On, Min Rds On): 10V
Grade: Automotive
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Power Dissipation (Max): 306W (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Bulk
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LPC12H27FBD64/301, LPC12H27FBD64/301, NXP Semiconductors PHGLS23259-1.pdf?t.download=true&u=5oefqw Description: LPC1200 - Cortex-M0 32-Bit RISC
Packaging: Bulk
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NX3L1T53GD,125 NX3L1T53GD,125 NXP Semiconductors NX3L1T53.pdf Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Crosstalk: -90dB @ 100kHz
Charge Injection: 15pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
Number of Circuits: 1
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel-to-Channel Matching (ΔRon): 20mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
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LS1048ASE7Q1A NXP Semiconductors LS1088AFS.pdf Description: IC MPU QORLQ LS1 1.6GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1.2V
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, IFC, PCI, SPI, UART
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T4240NSN7PQB NXP Semiconductors T4240.pdf Description: IC MPU 1.8GHZ 1932FCPBGA
Packaging: Bulk
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (16), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
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MC9328MX1VM20 NXP Semiconductors FSCLS05269-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX1 200MHZ 225MAPBGA
Packaging: Bulk
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
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LPC11E36FBD64/501E LPC11E36FBD64/501E NXP Semiconductors PHGLS25742-1.pdf?t.download=true&u=5oefqw Description: LPC11E36 - Cortex-M0+/M0 RISC Mi
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b SAR
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
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PCA9675PW,118 PCA9675PW,118 NXP Semiconductors PCA9675.pdf Description: PCA9675PW - Remote 16-Bit I/O Ex
Features: POR
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 300µA, 42mA
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PCA9468UKBZ NXP Semiconductors FASTCHARGTS.pdf Description: PCA9468UK - 2:1 switched cap dir
Packaging: Bulk
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MRF6V2150NBR1 NXP Semiconductors FSCLS05116-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 50V TO272-4
Packaging: Bulk
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 450MHz
Configuration: N-Channel
Power - Output: 150W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
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BGA3031X NXP Semiconductors BGA3031.pdf Description: BGA3031 - DOCSIS 3.0 PLUS UPSTRE
Packaging: Bulk
Package / Case: 20-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Amplifier
Applications: CATV
Supplier Device Package: 20-HVQFN (5x5)
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IP4223CZ6,125 IP4223CZ6,125 NXP Semiconductors PHGLS23372-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA IP4223 - TRANS VOLTAGE
Packaging: Bulk
Package / Case: SOT-23-6 Thin, TSOT-23-6
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 1.5pF @ 1MHz (Max)
Voltage - Reverse Standoff (Typ): 5.5V (Max)
Supplier Device Package: 6-TSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
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MC9S08AC128MFGE NXP Semiconductors MC9S08AC60.pdf Description: MC9S08AC - 8-bit MCU, 128KB Flas
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
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74AUP1GU04GS,132 74AUP1GU04GS,132 NXP Semiconductors PHGLS24886-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 4.3ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
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TDA19997HL/C1,551
Hersteller: NXP Semiconductors
Description: IC DVI/HDMI SWITCH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Function: Switch
Voltage - Supply: 1.65V ~ 1.95V, 3.0V ~ 3.6V
Applications: Video Display
Standards: CEA-861D, DVI 1.0, HDCP 1.3, HDMI 1.4, IEC 61000-4-2
Supplier Device Package: 100-LQFP (14x14)
Control Interface: I2C
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102+5.25 EUR
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PCA8543AHL/AY PCA8543.pdf
Hersteller: NXP Semiconductors
Description: PCA8543AHL - 4 x 60 automotive L
Packaging: Bulk
Package / Case: 80-LQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.5V ~ 5.5V
Digits or Characters: 15 Characters, 30 Characters, 240 Elements
Supplier Device Package: 80-LQFP (12x12)
Current - Supply: 250 µA
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126+4.75 EUR
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74HC112PW,112 PHGL-S-A0002312769-1.pdf?t.download=true&u=5oefqw
74HC112PW,112
Hersteller: NXP Semiconductors
Description: IC FF JK-TYPE DUAL 1BIT 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-TSSOP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
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SC16C754BIA68,529 PHGLS15907-1.pdf?t.download=true&u=5oefqw
SC16C754BIA68,529
Hersteller: NXP Semiconductors
Description: IC UART QUAD 64BYTE 68PLCC
With Modem Control: Yes
With False Start Bit Detection: Yes
With IrDA Encoder/Decoder: No
With Auto Flow Control: Yes
Supplier Device Package: 68-PLCC (24.23x24.23)
Data Rate (Max): 5Mbps
FIFO's: 64 Byte
Voltage - Supply: 2.25V ~ 2.75V, 2.97V ~ 3.63V, 4.5V ~ 5.5V
Mounting Type: Surface Mount
Number of Channels: 4, QUART
Package / Case: 68-LCC (J-Lead)
Packaging: Bulk
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PCA9550D,118 PCA9550.pdf
PCA9550D,118
Hersteller: NXP Semiconductors
Description: IC LED DRVR LINEAR I2C 25MA 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 400kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 8-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
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TDA8766G/C1,118 TDA8766.pdf
TDA8766G/C1,118
Hersteller: NXP Semiconductors
Description: IC ADC 10BIT SIGMA-DELTA 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: 20°C ~ 75°C
Voltage - Supply, Analog: 3V ~ 5.25V
Voltage - Supply, Digital: 3V ~ 5.25V
Sampling Rate (Per Second): 20M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 32-LQFP (5x5)
Architecture: Sigma-Delta
Number of A/D Converters: 1
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MAX9286S32V234
Hersteller: NXP Semiconductors
Description: MAX9286 - S32V MIPI CAMERAS AND
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
Utilized IC / Part: S32V234
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MC08XS6421CEKR2 PHGL-S-A0002207203-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: MC08XS6421CEK - External Automot
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Input Type: CMOS
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
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64+9.4 EUR
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PMV100XPEA215 PMV100XPEA.pdf
PMV100XPEA215
Hersteller: NXP Semiconductors
Description: NEXPERIA PMV100 - P-CHANNEL MOSF
Input Capacitance (Ciss) (Max) @ Vds: 386 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 6 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±12V
Supplier Device Package: SOT-23
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Power Dissipation (Max): 463mW (Ta), 4.45W (Tc)
Rds On (Max) @ Id, Vgs: 128mOhm @ 2.4A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 2.4A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
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LPC3230FET296/01,5 PHGLS30266-1.pdf?t.download=true&u=5oefqw
LPC3230FET296/01,5
Hersteller: NXP Semiconductors
Description: LPC3230 - Arm9, 32-Bit Microcont
Packaging: Bulk
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
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PIMXRT595SFFOA IMXRT500EC.pdf
Hersteller: NXP Semiconductors
Description: IMXRT595 - I.MX RT500 CROSSOVER
Packaging: Bulk
DigiKey Programmable: Not Verified
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74LVC2G07GXZ 74LVC2G07.pdf
74LVC2G07GXZ
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 6X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-X2SON (1.0x0.8)
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4480+0.14 EUR
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74LVT573PW,112 PHGLS23935-1.pdf?t.download=true&u=5oefqw
74LVT573PW,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVT573PW - BUS DRIVER
Packaging: Bulk
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TEF7006HN/V1,518 PHGL-S-A0003531970-1.pdf?t.download=true&u=5oefqw
TEF7006HN/V1,518
Hersteller: NXP Semiconductors
Description: IC CONSUMER CIRC PQCC32
Packaging: Bulk
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MC8641DHX1500KE _MPC8641DEC.pdf?t.download=true&u=ovmfp3
Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 1.5GHZ 1023FCCBGA
Packaging: Bulk
Package / Case: 1023-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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BGU8L1UKAZ BGU8L1.pdf
BGU8L1UKAZ
Hersteller: NXP Semiconductors
Description: IC AMP CELL 728-960MHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 15.5dB
Current - Supply: 4.7mA
Noise Figure: 0.8dB
P1dB: -5dBm
Test Frequency: 943MHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
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BGU8L1UK/SZ BGU8L1.pdf
BGU8L1UK/SZ
Hersteller: NXP Semiconductors
Description: IC AMP CELL 728-960MHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 15.5dB
Current - Supply: 4.7mA
Noise Figure: 0.8dB
P1dB: -5dBm
Test Frequency: 943MHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
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TDA18260HN/C1,551 TDA18260HN_SDS.pdf
TDA18260HN/C1,551
Hersteller: NXP Semiconductors
Description: TDA18260HN - DUAL CABLE SILICON
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
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74AUP1G332GN,132 74AUP1G332.pdf
74AUP1G332GN,132
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP1G332 - LOW-POWER
Packaging: Bulk
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FXTH87EH116T1 FXTH87EH116?lang_cd=en
FXTH87EH116T1
Hersteller: NXP Semiconductors
Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
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PHP225,118 PHGLS22918-1.pdf?t.download=true&u=5oefqw
PHP225,118
Hersteller: NXP Semiconductors
Description: NEXPERIA PHP225 - SMALL SIGNAL F
Packaging: Bulk
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JN5179/001K PHGL-S-A0003845997-1.pdf?t.download=true&u=5oefqw
JN5179/001K
Hersteller: NXP Semiconductors
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 3.6V
Power - Output: 10dBm
Protocol: Zigbee®
Current - Receiving: 12.7mA ~ 14.8mA
Data Rate (Max): 16Mbps
Current - Transmitting: 14mA ~ 22.5mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
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LPC2102FBD48,151 LPC2101_02_03.pdf
LPC2102FBD48,151
Hersteller: NXP Semiconductors
Description: IC MCU 16/32BIT 16KB FLSH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 70MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
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LPC802UKZ PHGL-S-A0001056910-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC802UKZ - Low-Cost Microcontro
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-WLCSP (1.84x1.84)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 15MHz
Mounting Type: Surface Mount
Package / Case: 16-UFBGA, WLCSP
Packaging: Bulk
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377+1.59 EUR
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PDTC144TM,315 PDTC144T_SERIES.pdf
PDTC144TM,315
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS
Packaging: Bulk
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LPC2925FBD100,551 PHGLS20650-1.pdf?t.download=true&u=5oefqw
LPC2925FBD100,551
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 16x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 1.89V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
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LPC43S20FBD144E LPC43S50_30_20.pdf
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M0, ARM® Cortex®-M4
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
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P89LPC917FDH,129 P89LPC915_916_917.pdf
P89LPC917FDH,129
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 2KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Verified
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LPC3131FET180,551 PHGLS25043-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC3131 - Low-cost, low-power AR
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 4x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.2V ~ 3.6V
Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
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88MW302-B0-NXUE/AK User-manual-2777835.pdf
Hersteller: NXP Semiconductors
Description: IC RF TXRX+MCU BLE 88HVQFN
Packaging: Bulk
Package / Case: 88-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 512kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V
Protocol: 802.11n/g/b, Bluetooth, Zigbee®, Z-Wave®
Data Rate (Max): 72.2Mbps
Supplier Device Package: 88-HVQFN (10x10)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, PWM, SPI, UART
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74AHCT126PW,112 PHGLS19988-1.pdf?t.download=true&u=5oefqw
74AHCT126PW,112
Hersteller: NXP Semiconductors
Description: IC BUFF NON-INVERT 5.5V 14TSSOP
Supplier Device Package: 14-TSSOP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
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PZU22B2,115 PHGLS19743-1.pdf?t.download=true&u=5oefqw
PZU22B2,115
Hersteller: NXP Semiconductors
Description: NEXPERIA PZU22B2 - ZENER DIODE,
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOD-323F
Power - Max: 310 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 17 V
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MM908E622ACPEK MM908E622.pdf
MM908E622ACPEK
Hersteller: NXP Semiconductors
Description: MM908E622 - Integrated motor dri
Packaging: Bulk
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 16V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
Number of I/O: 12
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PHN203,518 PHGLS20699-1.pdf?t.download=true&u=5oefqw
PHN203,518
Hersteller: NXP Semiconductors
Description: MOSFET 2N-CH 30V 6.3A 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Configuration: 2 N-Channel
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 2W (Ta)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 6.3A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 560pF @ 20V
Rds On (Max) @ Id, Vgs: 30mOhm @ 7A, 10V
Gate Charge (Qg) (Max) @ Vgs: 14.6nC @ 10V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: 8-SO
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74LV74PW,118 74LV74.pdf
74LV74PW,118
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 80 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 110 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Number of Bits per Element: 1
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74LV74D,112 74LV74.pdf
74LV74D,112
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 110 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Number of Bits per Element: 1
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BC846BW/ZLF BC846XW_SER.pdf
BC846BW/ZLF
Hersteller: NXP Semiconductors
Description: NEXPERIA BC846 - 65V, 100MA NPN
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Supplier Device Package: SOT-323
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74AUP1G58GF,132 PHGL-S-A0001284262-1.pdf?t.download=true&u=5oefqw
74AUP1G58GF,132
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP1G58GF - LOGIC CIR
Packaging: Bulk
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BGU8H1X PHGL-S-A0005068069-1.pdf?t.download=true&u=5oefqw
BGU8H1X
Hersteller: NXP Semiconductors
Description: BGU8H1 - SiGe:C Low Noise Amplif
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 3.35GHz
P1dB: -3dBm
Noise Figure: 0.9dB
Current - Supply: 5mA
Gain: 13dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: LTE, WiMax
Frequency: 2.3GHz ~ 2.69GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
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74AHCT139D,118 PHGLS15529-1.pdf?t.download=true&u=5oefqw
74AHCT139D,118
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AHCT139D - DECODER/DR
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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2826+0.21 EUR
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74LVT14DB,112 74LVT14.pdf
74LVT14DB,112
Hersteller: NXP Semiconductors
Description: IC INVERTER
Packaging: Bulk
auf Bestellung 496 Stücke:
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496+1.3 EUR
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74HC85PW,112 PHGLS05972-1.pdf?t.download=true&u=5oefqw
74HC85PW,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HC85PW - MAGNITUDE CO
Packaging: Bulk
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BZX84-B13,215 BZX84_SER.pdf
BZX84-B13,215
Hersteller: NXP Semiconductors
Description: NEXPERIA BZX84-B13 - ZENER DIODE
Qualification: AEC-Q101
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Grade: Automotive
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 30 Ohms
Voltage - Zener (Nom) (Vz): 13 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±2%
Packaging: Bulk
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KMI23/2Z KMI23_2_4.pdf
Hersteller: NXP Semiconductors
Description: KMI23/2 - High performance rotat
Qualification: AEC-Q100
Resistance: 50 Ohms
Grade: Automotive
Output Signal: Clockwise Increase
Supplier Device Package: 2-SIP
For Measuring: Rotary Position
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Voltage - Supply: 6.8V ~ 16V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 150°C
Output: Analog Voltage
Mounting Type: Through Hole
Package / Case: SOT-453A
Packaging: Bulk
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KTY82/151,215 KTY82_SER.pdf
KTY82/151,215
Hersteller: NXP Semiconductors
Description: SENSOR PTC 975OHM TO236AB
Resistance @ 25°C: 975 Ohms
Supplier Device Package: TO-236AB
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
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KTY81/150,112 KTY81_SER.pdf
KTY81/150,112
Hersteller: NXP Semiconductors
Description: SILICON TEMPERATURE SENSOR
Packaging: Tube
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Resistance @ 25°C: 1 kOhms
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BUK6E2R3-40C,127 BUK6E2R3-40C.pdf
BUK6E2R3-40C,127
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK6E2R3-40C - 120A, 40
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 15100 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 260 nC @ 10 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±16V
Drive Voltage (Max Rds On, Min Rds On): 10V
Grade: Automotive
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Power Dissipation (Max): 306W (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Bulk
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310+1.82 EUR
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LPC12H27FBD64/301, PHGLS23259-1.pdf?t.download=true&u=5oefqw
LPC12H27FBD64/301,
Hersteller: NXP Semiconductors
Description: LPC1200 - Cortex-M0 32-Bit RISC
Packaging: Bulk
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NX3L1T53GD,125 NX3L1T53.pdf
NX3L1T53GD,125
Hersteller: NXP Semiconductors
Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Crosstalk: -90dB @ 100kHz
Charge Injection: 15pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
Number of Circuits: 1
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel-to-Channel Matching (ΔRon): 20mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
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LS1048ASE7Q1A LS1088AFS.pdf
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ LS1 1.6GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1.2V
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, IFC, PCI, SPI, UART
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T4240NSN7PQB T4240.pdf
Hersteller: NXP Semiconductors
Description: IC MPU 1.8GHZ 1932FCPBGA
Packaging: Bulk
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (16), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
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MC9328MX1VM20 FSCLS05269-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX1 200MHZ 225MAPBGA
Packaging: Bulk
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
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LPC11E36FBD64/501E PHGLS25742-1.pdf?t.download=true&u=5oefqw
LPC11E36FBD64/501E
Hersteller: NXP Semiconductors
Description: LPC11E36 - Cortex-M0+/M0 RISC Mi
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b SAR
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
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PCA9675PW,118 PCA9675.pdf
PCA9675PW,118
Hersteller: NXP Semiconductors
Description: PCA9675PW - Remote 16-Bit I/O Ex
Features: POR
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 300µA, 42mA
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PCA9468UKBZ FASTCHARGTS.pdf
Hersteller: NXP Semiconductors
Description: PCA9468UK - 2:1 switched cap dir
Packaging: Bulk
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MRF6V2150NBR1 FSCLS05116-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 50V TO272-4
Packaging: Bulk
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 450MHz
Configuration: N-Channel
Power - Output: 150W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
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BGA3031X BGA3031.pdf
Hersteller: NXP Semiconductors
Description: BGA3031 - DOCSIS 3.0 PLUS UPSTRE
Packaging: Bulk
Package / Case: 20-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Amplifier
Applications: CATV
Supplier Device Package: 20-HVQFN (5x5)
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IP4223CZ6,125 PHGLS23372-1.pdf?t.download=true&u=5oefqw
IP4223CZ6,125
Hersteller: NXP Semiconductors
Description: NEXPERIA IP4223 - TRANS VOLTAGE
Packaging: Bulk
Package / Case: SOT-23-6 Thin, TSOT-23-6
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 1.5pF @ 1MHz (Max)
Voltage - Reverse Standoff (Typ): 5.5V (Max)
Supplier Device Package: 6-TSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
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MC9S08AC128MFGE MC9S08AC60.pdf
Hersteller: NXP Semiconductors
Description: MC9S08AC - 8-bit MCU, 128KB Flas
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
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28+19.56 EUR
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74AUP1GU04GS,132 PHGLS24886-1.pdf?t.download=true&u=5oefqw
74AUP1GU04GS,132
Hersteller: NXP Semiconductors
Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 4.3ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
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1765+0.32 EUR
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