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PQMD10147 PQMD10147 NXP Semiconductors PQMD10.pdf Description: PQMD10 - NPN/PNP RESISTOR-EQUIPP
Packaging: Bulk
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PQMD2147 PQMD2147 NXP Semiconductors PQMD2.pdf Description: PQMD2 - NPN/PNP RESISTOR-EQUIPPE
Packaging: Bulk
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PTVS7V5U1UPA,147 PTVS7V5U1UPA,147 NXP Semiconductors NEXP-S-A0002907440-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PTVS7V5U1 - 300W TRANSI
Packaging: Bulk
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PQMD16147 PQMD16147 NXP Semiconductors PQMD16.pdf Description: PQMD16 - NPN/PNP RESISTOR-EQUIPP
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC14APW 74LVC14APW NXP Semiconductors PHGLS24066-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74LVC14APW - INVERT
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
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PDTC114TMB315 PDTC114TMB315 NXP Semiconductors PDTC114TMB.pdf Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Qualification: AEC-Q101
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PCF7952LTT/M1CC15, PCF7952LTT/M1CC15, NXP Semiconductors 75017275.pdf?fsrch=1&sr=1&pageNum=1 Description: PCF7952LTT - IMMO ACTIC
Features: RSSI Equipped
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512B RAM, 16kB EEPROM, 8kB ROM
Modulation or Protocol: UHF
Applications: Remote Keyless Entry
Supplier Device Package: 24-TSSOP
DigiKey Programmable: Not Verified
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MRFX600GSR5 NXP Semiconductors MRFX600H.pdf Description: RF MOSFET LDMOS 65V NI780
Packaging: Bulk
Package / Case: NI-780GS-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: 2 N-Channel
Power - Output: 600W
Gain: 26.4dB
Technology: LDMOS (Dual)
Supplier Device Package: NI-780GS-4L
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
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MSC8156SAG1000B NXP Semiconductors FSCLS11257-1.pdf?t.download=true&u=5oefqw Description: Digital Signal Processor, 32-Bit
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Six Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 1.03125MB
Voltage - I/O: 2.5V
Voltage - Core: 1V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
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PUMB24,115 PUMB24,115 NXP Semiconductors PHGLS19622-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PUMB24 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 20mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Resistor - Base (R1): 100kOhms
Resistor - Emitter Base (R2): 100kOhms
Supplier Device Package: 6-TSSOP
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PEMD19,115 PEMD19,115 NXP Semiconductors PIRSS13192-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PEMD19 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Resistor - Base (R1): 22kOhms
Supplier Device Package: SOT-666
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PEMB18,115 PEMB18,115 NXP Semiconductors PHGLS24212-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PEMB18 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Resistor - Base (R1): 4.7kOhms
Resistor - Emitter Base (R2): 10kOhms
Supplier Device Package: SOT-666
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PEMB16,115 PEMB16,115 NXP Semiconductors PHGLS19131-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PEMB16 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: SOT-666
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PESD3V3C1BSF,315 PESD3V3C1BSF,315 NXP Semiconductors PESD3V3C1BSF.pdf Description: NOW NEXPERIA PESD3V3C1B TRANS VO
Packaging: Bulk
Produkt ist nicht verfügbar
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MC8640VU1067NE557 MC8640VU1067NE557 NXP Semiconductors MPC8640DECS01AD.pdf Description: MPC8640 - MICROPROCESSORS (MPU)
Packaging: Bulk
DigiKey Programmable: Not Verified
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74ALVC08D,112 NXP Semiconductors 74ALVC08.pdf Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2.9ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 20 µA
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MPC860DTCVR50D4 NXP Semiconductors FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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MPC860TCVR50D4 NXP Semiconductors FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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PTN5110NDHQZ NXP Semiconductors PHGL-S-A0004665836-1.pdf?t.download=true&u=5oefqw Description: PTN5110NDHQ - USB PD TCPC PHY IC
Packaging: Bulk
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Supplier Device Package: 16-HX2QFN (2.6x2.6)
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TYN16X-600CT127 TYN16X-600CT127 NXP Semiconductors WEEN-S-A0001810749-1.pdf?t.download=true&u=5oefqw Description: NOW WEEN - TYN16X-600CT - SILICO
Packaging: Bulk
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
SCR Type: Standard Recovery
Operating Temperature: 150°C (TJ)
Current - Hold (Ih) (Max): 40 mA
Current - Gate Trigger (Igt) (Max): 15 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 180A, 198A
Current - On State (It (AV)) (Max): 10.2 A
Voltage - Gate Trigger (Vgt) (Max): 1.3 V
Voltage - On State (Vtm) (Max): 1.6 V
Current - Off State (Max): 1 mA
Supplier Device Package: TO-220F
Current - On State (It (RMS)) (Max): 16 A
Voltage - Off State: 600 V
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P4080NSN7PNAC NXP Semiconductors Description: IC MPU QORIQ P4 1.5GHZ 1295BGA
Packaging: Bulk
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (8), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.0
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
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MF1SEP1031DA4/03KJ NXP Semiconductors MF1SEP_H_10X1_SDS.pdf Description: MF1SEP1031DA4 - MIFARE Plus SE,
Packaging: Bulk
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443
Supplier Device Package: PLLMC
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MC56F83769AVLLA NXP Semiconductors MC56F837XXDS.pdf Description: MC56F837XX - Performance Level D
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI, USB
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 82
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TDA18254AHN/C1,518 TDA18254AHN/C1,518 NXP Semiconductors TDA18250AHN_SDS.pdf Description: TDA18254AH - CABLE SILICON TUNER
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
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74HCT253D,652 74HCT253D,652 NXP Semiconductors 74HC_HCT253.pdf Description: IC MULTIPLEXER 2 X 4:1 16-SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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MC908AP16ACFAE MC908AP16ACFAE NXP Semiconductors Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
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MC908LJ12CFUER NXP Semiconductors FSCLS06770-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 12KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 6x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I2C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
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TDZ5V6J135 TDZ5V6J135 NXP Semiconductors Description: TDZ5V6J - GENERAL-PURPOSE ZENER
Tolerance: ±1.96%
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOD-323F
Grade: Automotive
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 10 µA @ 2.5 V
Qualification: AEC-Q101
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BCR16CM-12LBAP#BB0 NXP Semiconductors RNCCS18340-1.pdf Description: TRIAC 600V 10A
Packaging: Bulk
auf Bestellung 376 Stücke:
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MC8640TVJ1067NE557 NXP Semiconductors Description: RISC Microprocessor, 32-Bit, Pow
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2926FBD144,551 LPC2926FBD144,551 NXP Semiconductors PHGLS20650-1.pdf?t.download=true&u=5oefqw Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
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MPC8548VJAQGD NXP Semiconductors MPC8548EEC.pdf Description: IC MPU 1GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: AES, Cryptography, Kasumi, Random Number Generator
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74HC40105D,652 74HC40105D,652 NXP Semiconductors PHGL-S-A0001422798-1.pdf?t.download=true&u=5oefqw Description: IC FIFO 16X4
Packaging: Bulk
DigiKey Programmable: Not Verified
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MC56F8006VWL NXP Semiconductors MC56F8006.pdf Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
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P83C557E4EFB/215557 P83C557E4EFB/215557 NXP Semiconductors Description: P83C557E4EFB/215:5 - Microcontro
Packaging: Bulk
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M86291G12 NXP Semiconductors Description: TEMP MS PART - C2K 900MHz Device
Packaging: Bulk
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: SPI, USB
Supplier Device Package: 625-FCPBGA (21x21)
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LPC1830-UK012 NXP Semiconductors Description: LPC1800 - High-Performance Micro
Packaging: Bulk
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NXH2280UK/C1012 NXP Semiconductors Description: NXH2280UK - Power Distribution S
Packaging: Bulk
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LPC1112FD20/102,52 LPC1112FD20/102,52 NXP Semiconductors PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: LPC1112 - Scalable Entry Level 3
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-SO
Number of I/O: 16
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74ALVCH16823DGGS 74ALVCH16823DGGS NXP Semiconductors PHGLS16184-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE DUAL 9BIT 56TSSOP
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 2
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 350 MHz
Input Capacitance: 5 pF
Supplier Device Package: 56-TSSOP
Max Propagation Delay @ V, Max CL: 3.7ns @ 3.3V, 50pF
Number of Bits per Element: 9
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TEF7000HN/V2S,557 TEF7000HN/V2S,557 NXP Semiconductors PHGL-S-A0010592687-1.pdf?t.download=true&u=5oefqw Description: TEF7000HN - DIGITAL LOW-IF CAR R
Packaging: Bulk
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TEF7000HN/V3,557 TEF7000HN/V3,557 NXP Semiconductors PHGL-S-A0010592687-1.pdf?t.download=true&u=5oefqw Description: TEF7000HN - DIGITAL LOW-IF CAR R
Packaging: Bulk
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MM912H634DV1AE MM912H634DV1AE NXP Semiconductors Description: MM912H634 - Integrated HCS12 Bas
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: Serial
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lead Acid
Supplier Device Package: 48-HLQFP (7x7)
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MM912H634DM1AE MM912H634DM1AE NXP Semiconductors MM912_634D1.pdf Description: MM912H634 - INTEGRATED HCS12 BAS
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: Serial
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lead Acid
Supplier Device Package: 48-LQFP (7x7)
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NX1WP10012 NXP Semiconductors Description: NX1WP10 - Specialized Power Mana
Packaging: Bulk
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Receiver
Frequency: 6.78MHz
RF Type: General Purpose
Secondary Attributes: I²C Interface
Supplier Device Package: 42-WLCSP (3.56x3.41)
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NX3P190UK,012 NX3P190UK,012 NXP Semiconductors PHGLS25714-1.pdf?t.download=true&u=5oefqw Description: IC PWR SWITCH HI SIDE LOG 4WLCSP
Packaging: Bulk
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MPF5020AVNA0ES MPF5020AVNA0ES NXP Semiconductors PF5020.pdf Description: PF5020 - POWER MANAGEMENT IC, PR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
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MPF5023AMMA0ES MPF5023AMMA0ES NXP Semiconductors Description: PF5023 - POWER MANAGEMENT IC, PR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
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MPF5023AVNA0ES MPF5023AVNA0ES NXP Semiconductors PF5023.pdf Description: PF5023 - POWER MANAGEMENT IC, PR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
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MCIMX507CVK8B NXP Semiconductors FSCLS11473-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX50 800MHZ 416MAPBGA
Packaging: Bulk
Package / Case: 416-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3V
Supplier Device Package: 416-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, LPDDR, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Security Features: Boot Security, Cryptography, Secure JTAG
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
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PSMN6R0-25YLD115 PSMN6R0-25YLD115 NXP Semiconductors PSMN6R0-25YLD.pdf Description: NEXPERIA PSMN6R0-25YLD - POWER F
Packaging: Bulk
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MCZ33905DD5EK MCZ33905DD5EK NXP Semiconductors FSCLS11899-1.pdf?t.download=true&u=5oefqw Description: MCZ33905 - SYSTEM BASIS CHIP, PO
Packaging: Bulk
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2.8mA
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
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BUK6C3R3-75C,118 BUK6C3R3-75C,118 NXP Semiconductors BUK6C3R3-75C.pdf Description: NEXPERIA BUK6C3R3 - N-CHANNEL TR
Packaging: Bulk
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 181A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 90A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: D2PAK-7
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 253 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 15800 pF @ 25 V
Qualification: AEC-Q101
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PDTC124EM,315 PDTC124EM,315 NXP Semiconductors PDTC124E_SER.pdf Description: TRANS PREBIAS
Packaging: Bulk
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S912D60CE1VPVER528 S912D60CE1VPVER528 NXP Semiconductors MC68HC912D60A.pdf Description: S912D60CE - 16 BIT MICROCONTROLL
Packaging: Bulk
DigiKey Programmable: Not Verified
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MC7448HX1700LD NXP Semiconductors FSCLS03804-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC74XX 1.7GHZ 360FCCBGA
Packaging: Bulk
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.7GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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PCA9541AD/01,118 PCA9541AD/01,118 NXP Semiconductors PCA9541A.pdf Description: PCA9541AD/01 - C-Bus Controller
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I²C, SMBus
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I²C Multiplexer
Supplier Device Package: 16-SO
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PCF7953VTTC1AC1900 PCF7953VTTC1AC1900 NXP Semiconductors NXP_75017275.pdf?t.download=true&u=ovmfp3 Description: PKE CHIPS
Features: RSSI Equipped
Packaging: Bulk
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512B RAM, 8kB ROM, 2kB EEPROM
Modulation or Protocol: UHF
Data Interface: SPI
Applications: Remote Keyless Entry
Supplier Device Package: 38-TSSOP
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KCF5212CAE66 NXP Semiconductors Description: MCF5212CAE66 - RISC Microcontrol
Packaging: Bulk
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SA2T18H450W19SR6 NXP Semiconductors A2T18H450W19S.pdf Description: RF MOSFET LDMOS 30V NI1230
Packaging: Bulk
Package / Case: NI-1230S-4S4S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Configuration: Dual
Power - Output: 89W
Gain: 16.6dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4S4S
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 800 mA
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PQMD10147 PQMD10.pdf
PQMD10147
Hersteller: NXP Semiconductors
Description: PQMD10 - NPN/PNP RESISTOR-EQUIPP
Packaging: Bulk
auf Bestellung 13699 Stücke:
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PQMD2147 PQMD2.pdf
PQMD2147
Hersteller: NXP Semiconductors
Description: PQMD2 - NPN/PNP RESISTOR-EQUIPPE
Packaging: Bulk
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PTVS7V5U1UPA,147 NEXP-S-A0002907440-1.pdf?t.download=true&u=5oefqw
PTVS7V5U1UPA,147
Hersteller: NXP Semiconductors
Description: NEXPERIA PTVS7V5U1 - 300W TRANSI
Packaging: Bulk
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PQMD16147 PQMD16.pdf
PQMD16147
Hersteller: NXP Semiconductors
Description: PQMD16 - NPN/PNP RESISTOR-EQUIPP
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC14APW PHGLS24066-1.pdf?t.download=true&u=5oefqw
74LVC14APW
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA 74LVC14APW - INVERT
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
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PDTC114TMB315 PDTC114TMB.pdf
PDTC114TMB315
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Qualification: AEC-Q101
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PCF7952LTT/M1CC15, 75017275.pdf?fsrch=1&sr=1&pageNum=1
PCF7952LTT/M1CC15,
Hersteller: NXP Semiconductors
Description: PCF7952LTT - IMMO ACTIC
Features: RSSI Equipped
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512B RAM, 16kB EEPROM, 8kB ROM
Modulation or Protocol: UHF
Applications: Remote Keyless Entry
Supplier Device Package: 24-TSSOP
DigiKey Programmable: Not Verified
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54+11.33 EUR
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MRFX600GSR5 MRFX600H.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 65V NI780
Packaging: Bulk
Package / Case: NI-780GS-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: 2 N-Channel
Power - Output: 600W
Gain: 26.4dB
Technology: LDMOS (Dual)
Supplier Device Package: NI-780GS-4L
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
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MSC8156SAG1000B FSCLS11257-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: Digital Signal Processor, 32-Bit
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Six Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 1.03125MB
Voltage - I/O: 2.5V
Voltage - Core: 1V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
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2+526.17 EUR
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PUMB24,115 PHGLS19622-1.pdf?t.download=true&u=5oefqw
PUMB24,115
Hersteller: NXP Semiconductors
Description: NEXPERIA PUMB24 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 20mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Resistor - Base (R1): 100kOhms
Resistor - Emitter Base (R2): 100kOhms
Supplier Device Package: 6-TSSOP
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11225+0.06 EUR
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PEMD19,115 PIRSS13192-1.pdf?t.download=true&u=5oefqw
PEMD19,115
Hersteller: NXP Semiconductors
Description: NEXPERIA PEMD19 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Resistor - Base (R1): 22kOhms
Supplier Device Package: SOT-666
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PEMB18,115 PHGLS24212-1.pdf?t.download=true&u=5oefqw
PEMB18,115
Hersteller: NXP Semiconductors
Description: NEXPERIA PEMB18 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Resistor - Base (R1): 4.7kOhms
Resistor - Emitter Base (R2): 10kOhms
Supplier Device Package: SOT-666
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6772+0.08 EUR
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PEMB16,115 PHGLS19131-1.pdf?t.download=true&u=5oefqw
PEMB16,115
Hersteller: NXP Semiconductors
Description: NEXPERIA PEMB16 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: SOT-666
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6772+0.08 EUR
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PESD3V3C1BSF,315 PESD3V3C1BSF.pdf
PESD3V3C1BSF,315
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA PESD3V3C1B TRANS VO
Packaging: Bulk
Produkt ist nicht verfügbar
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MC8640VU1067NE557 MPC8640DECS01AD.pdf
MC8640VU1067NE557
Hersteller: NXP Semiconductors
Description: MPC8640 - MICROPROCESSORS (MPU)
Packaging: Bulk
DigiKey Programmable: Not Verified
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74ALVC08D,112 74ALVC08.pdf
Hersteller: NXP Semiconductors
Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2.9ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 20 µA
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5200+0.19 EUR
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MPC860DTCVR50D4 FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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MPC860TCVR50D4 FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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2+363.09 EUR
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PTN5110NDHQZ PHGL-S-A0004665836-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: PTN5110NDHQ - USB PD TCPC PHY IC
Packaging: Bulk
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Supplier Device Package: 16-HX2QFN (2.6x2.6)
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175+3.44 EUR
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TYN16X-600CT127 WEEN-S-A0001810749-1.pdf?t.download=true&u=5oefqw
TYN16X-600CT127
Hersteller: NXP Semiconductors
Description: NOW WEEN - TYN16X-600CT - SILICO
Packaging: Bulk
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
SCR Type: Standard Recovery
Operating Temperature: 150°C (TJ)
Current - Hold (Ih) (Max): 40 mA
Current - Gate Trigger (Igt) (Max): 15 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 180A, 198A
Current - On State (It (AV)) (Max): 10.2 A
Voltage - Gate Trigger (Vgt) (Max): 1.3 V
Voltage - On State (Vtm) (Max): 1.6 V
Current - Off State (Max): 1 mA
Supplier Device Package: TO-220F
Current - On State (It (RMS)) (Max): 16 A
Voltage - Off State: 600 V
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P4080NSN7PNAC
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ P4 1.5GHZ 1295BGA
Packaging: Bulk
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (8), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.0
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
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MF1SEP1031DA4/03KJ MF1SEP_H_10X1_SDS.pdf
Hersteller: NXP Semiconductors
Description: MF1SEP1031DA4 - MIFARE Plus SE,
Packaging: Bulk
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443
Supplier Device Package: PLLMC
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797+0.76 EUR
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MC56F83769AVLLA MC56F837XXDS.pdf
Hersteller: NXP Semiconductors
Description: MC56F837XX - Performance Level D
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI, USB
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 82
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26+23.25 EUR
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TDA18254AHN/C1,518 TDA18250AHN_SDS.pdf
TDA18254AHN/C1,518
Hersteller: NXP Semiconductors
Description: TDA18254AH - CABLE SILICON TUNER
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
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127+4.2 EUR
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74HCT253D,652 74HC_HCT253.pdf
74HCT253D,652
Hersteller: NXP Semiconductors
Description: IC MULTIPLEXER 2 X 4:1 16-SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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MC908AP16ACFAE
MC908AP16ACFAE
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
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39+15.45 EUR
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MC908LJ12CFUER FSCLS06770-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 12KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 6x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I2C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
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18+29.74 EUR
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TDZ5V6J135
TDZ5V6J135
Hersteller: NXP Semiconductors
Description: TDZ5V6J - GENERAL-PURPOSE ZENER
Tolerance: ±1.96%
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOD-323F
Grade: Automotive
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 10 µA @ 2.5 V
Qualification: AEC-Q101
auf Bestellung 18900 Stücke:
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9072+0.06 EUR
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BCR16CM-12LBAP#BB0 RNCCS18340-1.pdf
Hersteller: NXP Semiconductors
Description: TRIAC 600V 10A
Packaging: Bulk
auf Bestellung 376 Stücke:
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76+7.21 EUR
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MC8640TVJ1067NE557
Hersteller: NXP Semiconductors
Description: RISC Microprocessor, 32-Bit, Pow
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2926FBD144,551 PHGLS20650-1.pdf?t.download=true&u=5oefqw
LPC2926FBD144,551
Hersteller: NXP Semiconductors
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
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MPC8548VJAQGD MPC8548EEC.pdf
Hersteller: NXP Semiconductors
Description: IC MPU 1GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: AES, Cryptography, Kasumi, Random Number Generator
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74HC40105D,652 PHGL-S-A0001422798-1.pdf?t.download=true&u=5oefqw
74HC40105D,652
Hersteller: NXP Semiconductors
Description: IC FIFO 16X4
Packaging: Bulk
DigiKey Programmable: Not Verified
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MC56F8006VWL MC56F8006.pdf
Hersteller: NXP Semiconductors
Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
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78+8.96 EUR
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P83C557E4EFB/215557
P83C557E4EFB/215557
Hersteller: NXP Semiconductors
Description: P83C557E4EFB/215:5 - Microcontro
Packaging: Bulk
auf Bestellung 330 Stücke:
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54+10.81 EUR
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M86291G12
Hersteller: NXP Semiconductors
Description: TEMP MS PART - C2K 900MHz Device
Packaging: Bulk
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: SPI, USB
Supplier Device Package: 625-FCPBGA (21x21)
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6+102.1 EUR
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LPC1830-UK012
Hersteller: NXP Semiconductors
Description: LPC1800 - High-Performance Micro
Packaging: Bulk
auf Bestellung 49443 Stücke:
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31+19.68 EUR
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NXH2280UK/C1012
Hersteller: NXP Semiconductors
Description: NXH2280UK - Power Distribution S
Packaging: Bulk
auf Bestellung 78000 Stücke:
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30+19.53 EUR
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LPC1112FD20/102,52 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112FD20/102,52
Hersteller: NXP Semiconductors
Description: LPC1112 - Scalable Entry Level 3
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-SO
Number of I/O: 16
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151+3.65 EUR
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74ALVCH16823DGGS PHGLS16184-1.pdf?t.download=true&u=5oefqw
74ALVCH16823DGGS
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE DUAL 9BIT 56TSSOP
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 2
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 350 MHz
Input Capacitance: 5 pF
Supplier Device Package: 56-TSSOP
Max Propagation Delay @ V, Max CL: 3.7ns @ 3.3V, 50pF
Number of Bits per Element: 9
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371+1.55 EUR
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TEF7000HN/V2S,557 PHGL-S-A0010592687-1.pdf?t.download=true&u=5oefqw
TEF7000HN/V2S,557
Hersteller: NXP Semiconductors
Description: TEF7000HN - DIGITAL LOW-IF CAR R
Packaging: Bulk
auf Bestellung 697 Stücke:
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130+4.46 EUR
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TEF7000HN/V3,557 PHGL-S-A0010592687-1.pdf?t.download=true&u=5oefqw
TEF7000HN/V3,557
Hersteller: NXP Semiconductors
Description: TEF7000HN - DIGITAL LOW-IF CAR R
Packaging: Bulk
auf Bestellung 7800 Stücke:
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66+8.98 EUR
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MM912H634DV1AE
MM912H634DV1AE
Hersteller: NXP Semiconductors
Description: MM912H634 - Integrated HCS12 Bas
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: Serial
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lead Acid
Supplier Device Package: 48-HLQFP (7x7)
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MM912H634DM1AE MM912_634D1.pdf
MM912H634DM1AE
Hersteller: NXP Semiconductors
Description: MM912H634 - INTEGRATED HCS12 BAS
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: Serial
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lead Acid
Supplier Device Package: 48-LQFP (7x7)
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62+9.38 EUR
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NX1WP10012
Hersteller: NXP Semiconductors
Description: NX1WP10 - Specialized Power Mana
Packaging: Bulk
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Receiver
Frequency: 6.78MHz
RF Type: General Purpose
Secondary Attributes: I²C Interface
Supplier Device Package: 42-WLCSP (3.56x3.41)
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NX3P190UK,012 PHGLS25714-1.pdf?t.download=true&u=5oefqw
NX3P190UK,012
Hersteller: NXP Semiconductors
Description: IC PWR SWITCH HI SIDE LOG 4WLCSP
Packaging: Bulk
auf Bestellung 595151 Stücke:
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956+0.56 EUR
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MPF5020AVNA0ES PF5020.pdf
MPF5020AVNA0ES
Hersteller: NXP Semiconductors
Description: PF5020 - POWER MANAGEMENT IC, PR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
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MPF5023AMMA0ES
MPF5023AMMA0ES
Hersteller: NXP Semiconductors
Description: PF5023 - POWER MANAGEMENT IC, PR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
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75+7.69 EUR
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MPF5023AVNA0ES PF5023.pdf
MPF5023AVNA0ES
Hersteller: NXP Semiconductors
Description: PF5023 - POWER MANAGEMENT IC, PR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
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75+7.69 EUR
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MCIMX507CVK8B FSCLS11473-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX50 800MHZ 416MAPBGA
Packaging: Bulk
Package / Case: 416-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3V
Supplier Device Package: 416-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, LPDDR, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Security Features: Boot Security, Cryptography, Secure JTAG
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
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PSMN6R0-25YLD115 PSMN6R0-25YLD.pdf
PSMN6R0-25YLD115
Hersteller: NXP Semiconductors
Description: NEXPERIA PSMN6R0-25YLD - POWER F
Packaging: Bulk
auf Bestellung 9000 Stücke:
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1429+0.4 EUR
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MCZ33905DD5EK FSCLS11899-1.pdf?t.download=true&u=5oefqw
MCZ33905DD5EK
Hersteller: NXP Semiconductors
Description: MCZ33905 - SYSTEM BASIS CHIP, PO
Packaging: Bulk
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2.8mA
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
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52+11.29 EUR
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BUK6C3R3-75C,118 BUK6C3R3-75C.pdf
BUK6C3R3-75C,118
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK6C3R3 - N-CHANNEL TR
Packaging: Bulk
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 181A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 90A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: D2PAK-7
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 253 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 15800 pF @ 25 V
Qualification: AEC-Q101
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PDTC124EM,315 PDTC124E_SER.pdf
PDTC124EM,315
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS
Packaging: Bulk
auf Bestellung 941557 Stücke:
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3738+0.14 EUR
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S912D60CE1VPVER528 MC68HC912D60A.pdf
S912D60CE1VPVER528
Hersteller: NXP Semiconductors
Description: S912D60CE - 16 BIT MICROCONTROLL
Packaging: Bulk
DigiKey Programmable: Not Verified
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MC7448HX1700LD FSCLS03804-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC74XX 1.7GHZ 360FCCBGA
Packaging: Bulk
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.7GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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1+1435.95 EUR
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PCA9541AD/01,118 PCA9541A.pdf
PCA9541AD/01,118
Hersteller: NXP Semiconductors
Description: PCA9541AD/01 - C-Bus Controller
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I²C, SMBus
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I²C Multiplexer
Supplier Device Package: 16-SO
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PCF7953VTTC1AC1900 NXP_75017275.pdf?t.download=true&u=ovmfp3
PCF7953VTTC1AC1900
Hersteller: NXP Semiconductors
Description: PKE CHIPS
Features: RSSI Equipped
Packaging: Bulk
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512B RAM, 8kB ROM, 2kB EEPROM
Modulation or Protocol: UHF
Data Interface: SPI
Applications: Remote Keyless Entry
Supplier Device Package: 38-TSSOP
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52+10.88 EUR
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KCF5212CAE66
Hersteller: NXP Semiconductors
Description: MCF5212CAE66 - RISC Microcontrol
Packaging: Bulk
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SA2T18H450W19SR6 A2T18H450W19S.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 30V NI1230
Packaging: Bulk
Package / Case: NI-1230S-4S4S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Configuration: Dual
Power - Output: 89W
Gain: 16.6dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4S4S
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 800 mA
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2+410.17 EUR
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