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74HCT368D,652 74HCT368D,652 NXP Semiconductors PHGL-S-A0002312836-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER INVERT 5.5V 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SO
Part Status: Active
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MC7457RX1000NC NXP Semiconductors FSCLS04525-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC7457 1GHZ 483FCCBGA
Part Status: Active
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 483-FCCBGA (29x29)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 483-BCBGA, FCBGA
Packaging: Bulk
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MC68MH360AI25L557 NXP Semiconductors MC68360C1.pdf Description: IC CONTROLLER 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Type: Controller
Supplier Device Package: 240-FQFP (32x32)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MKL81Z128VMP7 MKL81Z128VMP7 NXP Semiconductors FSCL-S-A0001383122-1.pdf?t.download=true&u=5oefqw Description: MKL8 - Kinetis KL8 72MHz Cortex-
Packaging: Bulk
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x6/12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 41
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PMP5201V/S711115 PMP5201V/S711115 NXP Semiconductors PHGLS19184-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PMP5201V - SMALL SIGNAL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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A2T21H450W19SR6 NXP Semiconductors A2T21H450W19S.pdf Description: RF MOSFET LDMOS 30V NI1230
Packaging: Bulk
Package / Case: NI-1230S-4S4S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.2GHz
Power - Output: 89W
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4S4S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 800 mA
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PSMN4R3-80PS,127 PSMN4R3-80PS,127 NXP Semiconductors PSMN4R3-80PS.pdf Description: NEXPERIA PSMN4R3-80PS - 120A, 80
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 111 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8161 pF @ 40 V
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T2081NXE8P1B NXP Semiconductors T2080FS.pdf Description: IC MPU QORIQ T2 1.533GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Obsolete
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S912XEG128J2CAAR NXP Semiconductors Description: MC9S12XE - KIPPER-16-bit MCU, 12
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
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MC33VR5500V1ES NXP Semiconductors VR5500.pdf Description: MC33VR5500V1ES - High Voltage PM
Qualification: AEC-Q100
Grade: Automotive
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Bulk
Number of Outputs: 6
Part Status: Active
w/Sequencer: Yes
w/Supervisor: Yes
w/LED Driver: No
Supplier Device Package: 56-HVQFN (8x8)
Topology: Step-Down (Buck) (4), Linear (LDO) (2)
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MPC561CVR40 NXP Semiconductors MPC561FACT.pdf Description: MPC561 - SILVER OAK-NXP 32-bit M
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Bulk
Number of I/O: 16
Part Status: Active
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit
Data Converters: A/D 32x10b SAR
Core Processor: PowerPC
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Produkt ist nicht verfügbar
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BUK764R0-75C,118 BUK764R0-75C,118 NXP Semiconductors BUK764R0-75C.pdf Description: NEXPERIA BUK764 - N-CHANNEL MOSF
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Drain to Source Voltage (Vdss): 75 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 333W (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Bulk
Produkt ist nicht verfügbar
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LS1027AXN7NQA NXP Semiconductors Description: IC MPU QORIQ 1.3GHZ 448FBGA
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 3.0 (2)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Bulk
Part Status: Active
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4
Additional Interfaces: CANbus, I2C, SPI, UART
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LS2084AXN711B NXP Semiconductors Description: IC MPU QORIQ 2.1GHZ 1292FCPBGA
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 2.1GHz
Mounting Type: Surface Mount
Package / Case: 1292-BBGA, FCBGA
Packaging: Bulk
Additional Interfaces: GPIO, DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
Part Status: Active
SATA: SATA 6Gbps (2)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: No
RAM Controllers: DDR4, SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
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P5020NXN7QMB557 NXP Semiconductors FSCL-S-A0000576586-1.pdf?t.download=true&u=5oefqw Description: QORIQ, 64-BIT POWER ARCH SOC, 2
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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KMZ80J NXP Semiconductors KMZ80.pdf Description: KMZ80 - Programmable Angle Senso
Resistance: 5 kOhms
Part Status: Active
Output Signal: Clockwise Increase
Supplier Device Package: 8-SOIC
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Linearity: ±0.95°
Voltage - Supply: 4.5V ~ 5.5V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 150°C
Qualification: AEC-Q100
Grade: Automotive
Output: Analog Voltage
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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LPC54101J512UK49Z NXP Semiconductors LPC5410X.pdf Description: LPC54101 - Cortex-M4/M0 32-bit M
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
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UBA2024P/N1,112 UBA2024P/N1,112 NXP Semiconductors UBA2024.pdf Description: IC DRIVER HALF BRIDGE 8-DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
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P1014NSN5DFB NXP Semiconductors FSCLS11835-1.pdf?t.download=true&u=5oefqw Description: IC MPU QORIQ P1 533MHZ 425TEPBGA
Packaging: Bulk
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CANbus, DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
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PCA9670PW,112 PCA9670PW,112 NXP Semiconductors PHGLS28225-1.pdf?t.download=true&u=5oefqw Description: Remote 8-bit I\/O expander for F
Part Status: Obsolete
Current - Output Source/Sink: 300µA, 41mA
Supplier Device Package: 16-TSSOP
Interrupt Output: Yes
Clock Frequency: 1 MHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C, SMBus
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Features: POR
Packaging: Bulk
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PCA9672BS,118 NXP Semiconductors PCA9672.pdf Description: IC XPNDR 1MHZ I2C SMBUS 16HVQFN
DigiKey Programmable: Not Verified
Part Status: Obsolete
Current - Output Source/Sink: 300µA, 43mA
Supplier Device Package: 16-HVQFN (3x3)
Interrupt Output: Yes
Clock Frequency: 1 MHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C, SMBus
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 16-VFQFN Exposed Pad
Features: POR
Packaging: Bulk
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MC34PF1510A1EPR2 NXP Semiconductors Description: PF1510 - PMIC with 1A Li+ Linear
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 4.1V ~ 6V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (3), Linear (LDO) (3)
Supplier Device Package: 40-HVQFN (5x5)
Voltage/Current - Output 1: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 2: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 3: 1.8V ~ 3.3V, 1A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: Yes
Part Status: Active
Number of Outputs: 6
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74LVC257ADB,112 74LVC257ADB,112 NXP Semiconductors 74LVC257A.pdf Description: NEXPERIA 74LVC257ADB - MULTIPLEX
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
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S2ZMMBZ27VALT1G NXP Semiconductors Description: S2ZMMBZ - ZEN SOT23 REG .225W SP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MC10XS3435BHFKR2 NXP Semiconductors Description: MC10XS3435 - 12 V Automotive Ext
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Bulk
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 35mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
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BAS321135 NXP Semiconductors NEXP-S-A0003060012-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BAS321 - RECTIFIER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX79-B15143 NXP Semiconductors Description: NEXPERIA ZENER DIODE, 15V, 2%, 0
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08AW60MFGE NXP Semiconductors MC9S08AW60.pdf Description: MC9S08AW - Microcontroller, 8-Bi
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
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MIMXRT1051DVL6A NXP Semiconductors Description: MXRT1050 - i.MX RT1050 Crossover
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Obsolete
Number of I/O: 127
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LPC1102LVUKZ NXP Semiconductors PHGLS25606-1.pdf?t.download=true&u=5oefqw Description: LPC1102 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 25-WLCSP (2.17x2.32)
Part Status: Active
Number of I/O: 21
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SAF7741HV/N125ZK SAF7741HV/N125ZK NXP Semiconductors Description: SAF7741HV - CAR RADIO DIGITAL SI
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, LSB, SPDIF
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Clock Rate: 44.1kHz, 48kHz, 96kHz
Supplier Device Package: 144-HLQFP
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AHCT2G241GD,125 74AHCT2G241GD,125 NXP Semiconductors PHGLS28139-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 5.5V 8XSON
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
Part Status: Active
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
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MK21DX128AVMC5 MK21DX128AVMC5 NXP Semiconductors FSCL-S-A0000576977-1.pdf?t.download=true&u=5oefqw Description: MK21DX128AVMC5 - Kinetis K21: 50
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Bulk
Number of I/O: 64
Part Status: Active
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 1x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
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74AHC1G04GW-Q100125 74AHC1G04GW-Q100125 NXP Semiconductors 74AHC_AHCT1G04_Q100.pdf Description: NEXPERIA 74AHC1G04GW-Q100 - INVE
Packaging: Bulk
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PCK351DB,112 PCK351DB,112 NXP Semiconductors PCK351.pdf Description: IC CLK BUFFER 1:10 125MHZ 24SSOP
Packaging: Tube
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVTTL
Type: Fanout Buffer (Distribution)
Input: LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:10
Differential - Input:Output: No/No
Supplier Device Package: 24-SSOP
Frequency - Max: 125 MHz
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74AHC541PW-Q100118 NXP Semiconductors 74AHC_AHCT541_Q100.pdf Description: NEXPERIA 74AHC541PW-Q100 - BUS D
Packaging: Bulk
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S912XDG128F2VAA NXP Semiconductors FSCLS07359-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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BC847RA147 NXP Semiconductors Description: BC1NPN/PGENERAL-PURPODOUBTRANSIS
Packaging: Tape & Reel (TR)
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MC74HC42D NXP Semiconductors Description: 74HBDECIMDECOD1-OF-10
Packaging: Bulk
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S32V-SONYCAM NXP Semiconductors Description: S32V - MIPI CAMERAS AND DE-SERIA
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
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S912XEG128J2MAA NXP Semiconductors Description: MC9S12XE - KIPPER-16-BIT MCU, 12
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Core Size: 16-Bit
Data Converters: A/D 8x12b SAR
Core Processor: HCS12X
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Bulk
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MPC875CVR66 NXP Semiconductors MPC875EC.pdf Description: IC MPU MPC87XX 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC, I2C, PCMCIA, SPI, TDM, UART
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AFT20P060-4NR3 NXP Semiconductors AFT20P060-4N.pdf Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: 2 N-Channel
Power - Output: 60W
Gain: 18.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
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BC847BS/DG/B3115 NXP Semiconductors Description: BCSMASIGNBIPOLTRANSISTO0.1452-EL
Packaging: Tape & Reel (TR)
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PMEG2020EJ/ZL135 PMEG2020EJ/ZL135 NXP Semiconductors Description: PMEG2020EJ - Nexperia PMEG2020EJ
Current - Reverse Leakage @ Vr: 200 µA @ 20 V
Voltage - Forward (Vf) (Max) @ If: 525 mV @ 2 A
Voltage - DC Reverse (Vr) (Max): 20 V
Operating Temperature - Junction: 150°C
Supplier Device Package: SOD-323F
Current - Average Rectified (Io): 2A
Capacitance @ Vr, F: 50pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SC-90, SOD-323F
Packaging: Bulk
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LPC2294U029 NXP Semiconductors Description: LPC2294 - Arm7, 32-Bit RISC Micr
Packaging: Bulk
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74HC125DAUJ NXP Semiconductors Description: 74HC1BDRIVEHC/SERIE4-FUN1-BITROU
Packaging: Tape & Reel (TR)
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BC860CW/ZL115 NXP Semiconductors Description: BC8PGENERPURPOTRANSISTORS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SIT8924AA-23-33N-30.000000G NXP Semiconductors Description: SIT89LPOWPROGRAMMABOSCILLATOAUTE
Packaging: Bulk
Produkt ist nicht verfügbar
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SIT8924AA-23-18E-27.000000G NXP Semiconductors Description: SIT8LPOWPROGRAMMABOSCILLATOAUTEM
Packaging: Bulk
Produkt ist nicht verfügbar
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74HC73PW112 NXP Semiconductors 74HC73.pdf Description: IC FF JK TYPE DUAL 1BIT 14TSSOP
Number of Bits per Element: 1
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Supplier Device Package: 14-TSSOP
Input Capacitance: 3.5 pF
Clock Frequency: 83 MHz
Trigger Type: Negative Edge
Current - Output High, Low: 5.2mA, 5.2mA
Current - Quiescent (Iq): 4 µA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: JK Type
Function: Reset
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
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BZV85-C3V9,113 BZV85-C3V9,113 NXP Semiconductors PHGLS22780-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 3.9V 1.3W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-41
Power - Max: 1.3 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
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74HCT04DAUJ NXP Semiconductors Description: 74HCTINVERTEHSERIE6-FUN1-INPUCMO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC34717EPR2 MC34717EPR2 NXP Semiconductors FSCL-S-A0000149009-1.pdf?t.download=true&u=5oefqw Description: MC34717 - Switch-Mode Power Supp
Packaging: Bulk
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
Produkt ist nicht verfügbar
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MC908JK3EMDWE NXP Semiconductors MC68HC08JL3.pdf MC68HC908Jx(1,3).pdf Description: MC9S08JK - MICROCONTROLLER, 8-BI
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 10x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
Produkt ist nicht verfügbar
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MC33790HEGR2 MC33790HEGR2 NXP Semiconductors MC33790.pdf Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 1 mA
DigiKey Programmable: Not Verified
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72+6.71 EUR
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MC33790HEG MC33790HEG NXP Semiconductors MC33790.pdf Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 1 mA
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89+6.71 EUR
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MCIMX7S3EVK08SC557 NXP Semiconductors PHGL-S-A0003204178-1.pdf?t.download=true&u=5oefqw Description: I.MX 7SOLO:1X CORTEX A7, 1X USB
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2930FBD208,551 LPC2930FBD208,551 NXP Semiconductors PHGLS21387-1.pdf?t.download=true&u=5oefqw Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
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21+21.18 EUR
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S1JVMJD31CT4G NXP Semiconductors Description: S1JVMJDBDPNTRANSISTA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HCT368D,652 PHGL-S-A0002312836-1.pdf?t.download=true&u=5oefqw
74HCT368D,652
Hersteller: NXP Semiconductors
Description: IC BUFFER INVERT 5.5V 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SO
Part Status: Active
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MC7457RX1000NC FSCLS04525-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC7457 1GHZ 483FCCBGA
Part Status: Active
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 483-FCCBGA (29x29)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 483-BCBGA, FCBGA
Packaging: Bulk
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MC68MH360AI25L557 MC68360C1.pdf
Hersteller: NXP Semiconductors
Description: IC CONTROLLER 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Type: Controller
Supplier Device Package: 240-FQFP (32x32)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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4+158.08 EUR
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MKL81Z128VMP7 FSCL-S-A0001383122-1.pdf?t.download=true&u=5oefqw
MKL81Z128VMP7
Hersteller: NXP Semiconductors
Description: MKL8 - Kinetis KL8 72MHz Cortex-
Packaging: Bulk
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x6/12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 41
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41+11.76 EUR
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PMP5201V/S711115 PHGLS19184-1.pdf?t.download=true&u=5oefqw
PMP5201V/S711115
Hersteller: NXP Semiconductors
Description: NEXPERIA PMP5201V - SMALL SIGNAL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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A2T21H450W19SR6 A2T21H450W19S.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 30V NI1230
Packaging: Bulk
Package / Case: NI-1230S-4S4S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.2GHz
Power - Output: 89W
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4S4S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 800 mA
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2+379.28 EUR
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PSMN4R3-80PS,127 PSMN4R3-80PS.pdf
PSMN4R3-80PS,127
Hersteller: NXP Semiconductors
Description: NEXPERIA PSMN4R3-80PS - 120A, 80
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 111 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8161 pF @ 40 V
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T2081NXE8P1B T2080FS.pdf
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ T2 1.533GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Obsolete
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1+550.9 EUR
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S912XEG128J2CAAR
Hersteller: NXP Semiconductors
Description: MC9S12XE - KIPPER-16-bit MCU, 12
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
Produkt ist nicht verfügbar
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MC33VR5500V1ES VR5500.pdf
Hersteller: NXP Semiconductors
Description: MC33VR5500V1ES - High Voltage PM
Qualification: AEC-Q100
Grade: Automotive
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Bulk
Number of Outputs: 6
Part Status: Active
w/Sequencer: Yes
w/Supervisor: Yes
w/LED Driver: No
Supplier Device Package: 56-HVQFN (8x8)
Topology: Step-Down (Buck) (4), Linear (LDO) (2)
auf Bestellung 250 Stücke:
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Anzahl Preis
50+9.77 EUR
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MPC561CVR40 MPC561FACT.pdf
Hersteller: NXP Semiconductors
Description: MPC561 - SILVER OAK-NXP 32-bit M
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Bulk
Number of I/O: 16
Part Status: Active
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit
Data Converters: A/D 32x10b SAR
Core Processor: PowerPC
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Produkt ist nicht verfügbar
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BUK764R0-75C,118 BUK764R0-75C.pdf
BUK764R0-75C,118
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK764 - N-CHANNEL MOSF
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Drain to Source Voltage (Vdss): 75 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 333W (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Bulk
Produkt ist nicht verfügbar
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LS1027AXN7NQA
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 3.0 (2)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Bulk
Part Status: Active
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4
Additional Interfaces: CANbus, I2C, SPI, UART
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LS2084AXN711B
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ 2.1GHZ 1292FCPBGA
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 2.1GHz
Mounting Type: Surface Mount
Package / Case: 1292-BBGA, FCBGA
Packaging: Bulk
Additional Interfaces: GPIO, DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
Part Status: Active
SATA: SATA 6Gbps (2)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: No
RAM Controllers: DDR4, SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
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1+715.62 EUR
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P5020NXN7QMB557 FSCL-S-A0000576586-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: QORIQ, 64-BIT POWER ARCH SOC, 2
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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KMZ80J KMZ80.pdf
Hersteller: NXP Semiconductors
Description: KMZ80 - Programmable Angle Senso
Resistance: 5 kOhms
Part Status: Active
Output Signal: Clockwise Increase
Supplier Device Package: 8-SOIC
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Linearity: ±0.95°
Voltage - Supply: 4.5V ~ 5.5V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 150°C
Qualification: AEC-Q100
Grade: Automotive
Output: Analog Voltage
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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133+3.51 EUR
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LPC54101J512UK49Z LPC5410X.pdf
Hersteller: NXP Semiconductors
Description: LPC54101 - Cortex-M4/M0 32-bit M
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
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61+7.81 EUR
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UBA2024P/N1,112 UBA2024.pdf
UBA2024P/N1,112
Hersteller: NXP Semiconductors
Description: IC DRIVER HALF BRIDGE 8-DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
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P1014NSN5DFB FSCLS11835-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ P1 533MHZ 425TEPBGA
Packaging: Bulk
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CANbus, DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
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8+59.37 EUR
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PCA9670PW,112 PHGLS28225-1.pdf?t.download=true&u=5oefqw
PCA9670PW,112
Hersteller: NXP Semiconductors
Description: Remote 8-bit I\/O expander for F
Part Status: Obsolete
Current - Output Source/Sink: 300µA, 41mA
Supplier Device Package: 16-TSSOP
Interrupt Output: Yes
Clock Frequency: 1 MHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C, SMBus
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Features: POR
Packaging: Bulk
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301+1.55 EUR
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PCA9672BS,118 PCA9672.pdf
Hersteller: NXP Semiconductors
Description: IC XPNDR 1MHZ I2C SMBUS 16HVQFN
DigiKey Programmable: Not Verified
Part Status: Obsolete
Current - Output Source/Sink: 300µA, 43mA
Supplier Device Package: 16-HVQFN (3x3)
Interrupt Output: Yes
Clock Frequency: 1 MHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C, SMBus
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 16-VFQFN Exposed Pad
Features: POR
Packaging: Bulk
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222+2.13 EUR
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MC34PF1510A1EPR2
Hersteller: NXP Semiconductors
Description: PF1510 - PMIC with 1A Li+ Linear
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 4.1V ~ 6V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (3), Linear (LDO) (3)
Supplier Device Package: 40-HVQFN (5x5)
Voltage/Current - Output 1: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 2: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 3: 1.8V ~ 3.3V, 1A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: Yes
Part Status: Active
Number of Outputs: 6
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106+5.02 EUR
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74LVC257ADB,112 74LVC257A.pdf
74LVC257ADB,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC257ADB - MULTIPLEX
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
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1410+0.37 EUR
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S2ZMMBZ27VALT1G
Hersteller: NXP Semiconductors
Description: S2ZMMBZ - ZEN SOT23 REG .225W SP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MC10XS3435BHFKR2
Hersteller: NXP Semiconductors
Description: MC10XS3435 - 12 V Automotive Ext
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Bulk
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 35mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
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61+8.75 EUR
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BAS321135 NEXP-S-A0003060012-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA BAS321 - RECTIFIER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX79-B15143
Hersteller: NXP Semiconductors
Description: NEXPERIA ZENER DIODE, 15V, 2%, 0
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08AW60MFGE MC9S08AW60.pdf
Hersteller: NXP Semiconductors
Description: MC9S08AW - Microcontroller, 8-Bi
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
auf Bestellung 780 Stücke:
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34+14.64 EUR
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MIMXRT1051DVL6A
Hersteller: NXP Semiconductors
Description: MXRT1050 - i.MX RT1050 Crossover
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Obsolete
Number of I/O: 127
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47+11.32 EUR
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LPC1102LVUKZ PHGLS25606-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC1102 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 25-WLCSP (2.17x2.32)
Part Status: Active
Number of I/O: 21
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98+4.64 EUR
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SAF7741HV/N125ZK
SAF7741HV/N125ZK
Hersteller: NXP Semiconductors
Description: SAF7741HV - CAR RADIO DIGITAL SI
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, LSB, SPDIF
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Clock Rate: 44.1kHz, 48kHz, 96kHz
Supplier Device Package: 144-HLQFP
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AHCT2G241GD,125 PHGLS28139-1.pdf?t.download=true&u=5oefqw
74AHCT2G241GD,125
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
Part Status: Active
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
auf Bestellung 25005 Stücke:
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Anzahl Preis
2049+0.24 EUR
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MK21DX128AVMC5 FSCL-S-A0000576977-1.pdf?t.download=true&u=5oefqw
MK21DX128AVMC5
Hersteller: NXP Semiconductors
Description: MK21DX128AVMC5 - Kinetis K21: 50
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Bulk
Number of I/O: 64
Part Status: Active
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 1x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
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46+11.09 EUR
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74AHC1G04GW-Q100125 74AHC_AHCT1G04_Q100.pdf
74AHC1G04GW-Q100125
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AHC1G04GW-Q100 - INVE
Packaging: Bulk
Produkt ist nicht verfügbar
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PCK351DB,112 PCK351.pdf
PCK351DB,112
Hersteller: NXP Semiconductors
Description: IC CLK BUFFER 1:10 125MHZ 24SSOP
Packaging: Tube
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVTTL
Type: Fanout Buffer (Distribution)
Input: LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:10
Differential - Input:Output: No/No
Supplier Device Package: 24-SSOP
Frequency - Max: 125 MHz
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186+2.45 EUR
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74AHC541PW-Q100118 74AHC_AHCT541_Q100.pdf
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AHC541PW-Q100 - BUS D
Packaging: Bulk
Produkt ist nicht verfügbar
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S912XDG128F2VAA FSCLS07359-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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Anzahl Preis
16+27.3 EUR
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BC847RA147
Hersteller: NXP Semiconductors
Description: BC1NPN/PGENERAL-PURPODOUBTRANSIS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC74HC42D
Hersteller: NXP Semiconductors
Description: 74HBDECIMDECOD1-OF-10
Packaging: Bulk
Produkt ist nicht verfügbar
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S32V-SONYCAM
Hersteller: NXP Semiconductors
Description: S32V - MIPI CAMERAS AND DE-SERIA
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
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2+435.63 EUR
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S912XEG128J2MAA
Hersteller: NXP Semiconductors
Description: MC9S12XE - KIPPER-16-BIT MCU, 12
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Core Size: 16-Bit
Data Converters: A/D 8x12b SAR
Core Processor: HCS12X
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Bulk
Produkt ist nicht verfügbar
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MPC875CVR66 MPC875EC.pdf
Hersteller: NXP Semiconductors
Description: IC MPU MPC87XX 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC, I2C, PCMCIA, SPI, TDM, UART
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+62.15 EUR
Mindestbestellmenge: 8
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AFT20P060-4NR3 AFT20P060-4N.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: 2 N-Channel
Power - Output: 60W
Gain: 18.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
auf Bestellung 1730 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+63.84 EUR
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BC847BS/DG/B3115
Hersteller: NXP Semiconductors
Description: BCSMASIGNBIPOLTRANSISTO0.1452-EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PMEG2020EJ/ZL135
PMEG2020EJ/ZL135
Hersteller: NXP Semiconductors
Description: PMEG2020EJ - Nexperia PMEG2020EJ
Current - Reverse Leakage @ Vr: 200 µA @ 20 V
Voltage - Forward (Vf) (Max) @ If: 525 mV @ 2 A
Voltage - DC Reverse (Vr) (Max): 20 V
Operating Temperature - Junction: 150°C
Supplier Device Package: SOD-323F
Current - Average Rectified (Io): 2A
Capacitance @ Vr, F: 50pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SC-90, SOD-323F
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2294U029
Hersteller: NXP Semiconductors
Description: LPC2294 - Arm7, 32-Bit RISC Micr
Packaging: Bulk
auf Bestellung 6327 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
21+25.77 EUR
Mindestbestellmenge: 21
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74HC125DAUJ
Hersteller: NXP Semiconductors
Description: 74HC1BDRIVEHC/SERIE4-FUN1-BITROU
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BC860CW/ZL115
Hersteller: NXP Semiconductors
Description: BC8PGENERPURPOTRANSISTORS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SIT8924AA-23-33N-30.000000G
Hersteller: NXP Semiconductors
Description: SIT89LPOWPROGRAMMABOSCILLATOAUTE
Packaging: Bulk
Produkt ist nicht verfügbar
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SIT8924AA-23-18E-27.000000G
Hersteller: NXP Semiconductors
Description: SIT8LPOWPROGRAMMABOSCILLATOAUTEM
Packaging: Bulk
Produkt ist nicht verfügbar
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74HC73PW112 74HC73.pdf
Hersteller: NXP Semiconductors
Description: IC FF JK TYPE DUAL 1BIT 14TSSOP
Number of Bits per Element: 1
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Supplier Device Package: 14-TSSOP
Input Capacitance: 3.5 pF
Clock Frequency: 83 MHz
Trigger Type: Negative Edge
Current - Output High, Low: 5.2mA, 5.2mA
Current - Quiescent (Iq): 4 µA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: JK Type
Function: Reset
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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BZV85-C3V9,113 PHGLS22780-1.pdf?t.download=true&u=5oefqw
BZV85-C3V9,113
Hersteller: NXP Semiconductors
Description: DIODE ZENER 3.9V 1.3W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-41
Power - Max: 1.3 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
auf Bestellung 75000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2844+0.16 EUR
Mindestbestellmenge: 2844
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74HCT04DAUJ
Hersteller: NXP Semiconductors
Description: 74HCTINVERTEHSERIE6-FUN1-INPUCMO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC34717EPR2 FSCL-S-A0000149009-1.pdf?t.download=true&u=5oefqw
MC34717EPR2
Hersteller: NXP Semiconductors
Description: MC34717 - Switch-Mode Power Supp
Packaging: Bulk
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
Produkt ist nicht verfügbar
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MC908JK3EMDWE MC68HC08JL3.pdf MC68HC908Jx(1,3).pdf
Hersteller: NXP Semiconductors
Description: MC9S08JK - MICROCONTROLLER, 8-BI
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 10x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
Produkt ist nicht verfügbar
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MC33790HEGR2 MC33790.pdf
MC33790HEGR2
Hersteller: NXP Semiconductors
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 1 mA
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
72+6.71 EUR
Mindestbestellmenge: 72
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MC33790HEG MC33790.pdf
MC33790HEG
Hersteller: NXP Semiconductors
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 1 mA
auf Bestellung 89 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
89+6.71 EUR
Mindestbestellmenge: 89
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MCIMX7S3EVK08SC557 PHGL-S-A0003204178-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: I.MX 7SOLO:1X CORTEX A7, 1X USB
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2930FBD208,551 PHGLS21387-1.pdf?t.download=true&u=5oefqw
LPC2930FBD208,551
Hersteller: NXP Semiconductors
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
auf Bestellung 103 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
21+21.18 EUR
Mindestbestellmenge: 21
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S1JVMJD31CT4G
Hersteller: NXP Semiconductors
Description: S1JVMJDBDPNTRANSISTA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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