Produkte > NXP SEMICONDUCTORS > Alle Produkte des Herstellers NXP SEMICONDUCTORS (52721) > Seite 36 nach 879
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
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SAF7741HV/N125ZK | NXP Semiconductors |
Description: SAF7741HV - CAR RADIO DIGITAL SI Packaging: Bulk Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Interface: I²C, I²S, LSB, SPDIF Type: Car Signal Processor Operating Temperature: -40°C ~ 85°C (TA) Voltage - I/O: 3.30V Voltage - Core: 1.80V Clock Rate: 44.1kHz, 48kHz, 96kHz Supplier Device Package: 144-HLQFP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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74AHCT2G241GD,125 | NXP Semiconductors |
Description: IC BUFFER NON-INVERT 5.5V 8XSONVoltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 2 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 8-XFDFN Packaging: Bulk Part Status: Active Supplier Device Package: 8-XSON (2x3) Current - Output High, Low: 8mA, 8mA Number of Bits per Element: 1 |
auf Bestellung 25005 Stücke: Lieferzeit 10-14 Tag (e) |
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MK21DX128AVMC5 | NXP Semiconductors |
Description: MK21DX128AVMC5 - Kinetis K21: 50Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 128KB (128K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 121-LFBGA Packaging: Bulk Number of I/O: 64 Part Status: Active Supplier Device Package: 121-MAPBGA (8x8) Peripherals: DMA, I2S, LVD, POR, PWM, WDT Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 1x16b SAR; D/A 1x12b Core Processor: ARM® Cortex®-M4 EEPROM Size: 4K x 8 |
auf Bestellung 161 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHC1G04GW-Q100125 | NXP Semiconductors |
Description: NEXPERIA 74AHC1G04GW-Q100 - INVEPackaging: Bulk |
Produkt ist nicht verfügbar |
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PCK351DB,112 | NXP Semiconductors |
Description: IC CLK BUFFER 1:10 125MHZ 24SSOPPackaging: Tube Package / Case: 24-SSOP (0.209", 5.30mm Width) Number of Circuits: 1 Mounting Type: Surface Mount Output: LVTTL Type: Fanout Buffer (Distribution) Input: LVTTL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Ratio - Input:Output: 1:10 Differential - Input:Output: No/No Supplier Device Package: 24-SSOP Frequency - Max: 125 MHz |
auf Bestellung 654 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74AHC541PW-Q100118 | NXP Semiconductors |
Description: NEXPERIA 74AHC541PW-Q100 - BUS DPackaging: Bulk |
Produkt ist nicht verfügbar |
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| S912XDG128F2VAA | NXP Semiconductors |
Description: IC MCU 16BIT 128KB FLASH 80QFPPackaging: Bulk Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
auf Bestellung 84 Stücke: Lieferzeit 10-14 Tag (e) |
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| BC847RA147 | NXP Semiconductors |
Description: BC1NPN/PGENERAL-PURPODOUBTRANSIS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| MC74HC42D | NXP Semiconductors |
Description: 74HBDECIMDECOD1-OF-10 Packaging: Bulk |
Produkt ist nicht verfügbar |
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| S32V-SONYCAM | NXP Semiconductors |
Description: S32V - MIPI CAMERAS AND DE-SERIA Packaging: Bulk For Use With/Related Products: S32V234 Accessory Type: Camera |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| S912XEG128J2MAA | NXP Semiconductors |
Description: MC9S12XE - KIPPER-16-BIT MCU, 12 Number of I/O: 59 Supplier Device Package: 80-QFP (14x14) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V Core Size: 16-Bit Data Converters: A/D 8x12b SAR Core Processor: HCS12X EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 12K x 8 Program Memory Size: 128KB (128K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 80-QFP Packaging: Bulk |
Produkt ist nicht verfügbar |
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| MPC875CVR66 | NXP Semiconductors |
Description: IC MPU MPC87XX 66MHZ 256BGAPackaging: Bulk Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: HDLC, I2C, PCMCIA, SPI, TDM, UART |
auf Bestellung 43 Stücke: Lieferzeit 10-14 Tag (e) |
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| AFT20P060-4NR3 | NXP Semiconductors |
Description: RF MOSFET LDMOS 28V OM780-4Packaging: Bulk Package / Case: OM-780-4L Mounting Type: Surface Mount Frequency: 2.17GHz Configuration: 2 N-Channel Power - Output: 60W Gain: 18.9dB Technology: LDMOS (Dual) Supplier Device Package: OM-780-4L Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 450 mA |
auf Bestellung 1730 Stücke: Lieferzeit 10-14 Tag (e) |
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| BC847BS/DG/B3115 | NXP Semiconductors |
Description: BCSMASIGNBIPOLTRANSISTO0.1452-EL Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PMEG2020EJ/ZL135 | NXP Semiconductors |
Description: PMEG2020EJ - Nexperia PMEG2020EJ Current - Reverse Leakage @ Vr: 200 µA @ 20 V Voltage - Forward (Vf) (Max) @ If: 525 mV @ 2 A Voltage - DC Reverse (Vr) (Max): 20 V Operating Temperature - Junction: 150°C Supplier Device Package: SOD-323F Current - Average Rectified (Io): 2A Capacitance @ Vr, F: 50pF @ 5V, 1MHz Technology: Schottky Speed: Fast Recovery =< 500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: SC-90, SOD-323F Packaging: Bulk |
Produkt ist nicht verfügbar |
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| LPC2294U029 | NXP Semiconductors |
Description: LPC2294 - Arm7, 32-Bit RISC Micr Packaging: Bulk |
auf Bestellung 6327 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74HC125DAUJ | NXP Semiconductors |
Description: 74HC1BDRIVEHC/SERIE4-FUN1-BITROU Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BC860CW/ZL115 | NXP Semiconductors |
Description: BC8PGENERPURPOTRANSISTORS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| SIT8924AA-23-33N-30.000000G | NXP Semiconductors |
Description: SIT89LPOWPROGRAMMABOSCILLATOAUTE Packaging: Bulk |
Produkt ist nicht verfügbar |
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| SIT8924AA-23-18E-27.000000G | NXP Semiconductors |
Description: SIT8LPOWPROGRAMMABOSCILLATOAUTEM Packaging: Bulk |
Produkt ist nicht verfügbar |
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| 74HC73PW112 | NXP Semiconductors |
Description: IC FF JK TYPE DUAL 1BIT 14TSSOPNumber of Bits per Element: 1 Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF Supplier Device Package: 14-TSSOP Input Capacitance: 3.5 pF Clock Frequency: 83 MHz Trigger Type: Negative Edge Current - Output High, Low: 5.2mA, 5.2mA Current - Quiescent (Iq): 4 µA Voltage - Supply: 2V ~ 6V Operating Temperature: -40°C ~ 125°C (TA) Type: JK Type Function: Reset Number of Elements: 2 Mounting Type: Surface Mount Output Type: Complementary Package / Case: 14-TSSOP (0.173", 4.40mm Width) Packaging: Bulk |
Produkt ist nicht verfügbar |
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BZV85-C3V9,113 | NXP Semiconductors |
Description: DIODE ZENER 3.9V 1.3W DO41Tolerance: ±5% Packaging: Bulk Package / Case: DO-204AL, DO-41, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 200°C Voltage - Zener (Nom) (Vz): 3.9 V Impedance (Max) (Zzt): 15 Ohms Supplier Device Package: DO-41 Power - Max: 1.3 W Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Current - Reverse Leakage @ Vr: 10 µA @ 1 V |
auf Bestellung 75000 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74HCT04DAUJ | NXP Semiconductors |
Description: 74HCTINVERTEHSERIE6-FUN1-INPUCMO Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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MC34717EPR2 | NXP Semiconductors |
Description: MC34717 - Switch-Mode Power SuppPackaging: Bulk Package / Case: 26-VFQFN Exposed Pad Voltage - Output: 0.7V ~ 3.6V Mounting Type: Surface Mount Number of Outputs: 2 Voltage - Input: 3V ~ 6V Operating Temperature: -40°C ~ 85°C Applications: Converter, DDR Supplier Device Package: 26-QFN (5x5) |
Produkt ist nicht verfügbar |
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| MC908JK3EMDWE | NXP Semiconductors |
Description: MC9S08JK - MICROCONTROLLER, 8-BIPackaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: M68HC08 Data Converters: A/D 10x8b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LED, LVD, POR, PWM Supplier Device Package: 20-SOIC Number of I/O: 15 |
Produkt ist nicht verfügbar |
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MC33790HEGR2 | NXP Semiconductors |
Description: IC DIST SYST INTERFACE 16SOICPackaging: Bulk Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Logic Mounting Type: Surface Mount Type: Distributed Systems Interface Operating Temperature: -40°C ~ 85°C Input Type: Logic Supplier Device Package: 16-SOIC Current - Supply: 1 mA DigiKey Programmable: Not Verified |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33790HEG | NXP Semiconductors |
Description: IC DIST SYST INTERFACE 16SOICPackaging: Bulk Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Logic Mounting Type: Surface Mount Type: Distributed Systems Interface Operating Temperature: -40°C ~ 85°C Input Type: Logic Supplier Device Package: 16-SOIC Current - Supply: 1 mA |
auf Bestellung 89 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCIMX7S3EVK08SC557 | NXP Semiconductors |
Description: I.MX 7SOLO:1X CORTEX A7, 1X USBPackaging: Bulk |
Produkt ist nicht verfügbar |
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LPC2930FBD208,551 | NXP Semiconductors |
Description: LPC2900 - Arm9, 32-Bit RISC MicrPackaging: Bulk Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 125MHz RAM Size: 56K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM968E-S Data Converters: A/D 24x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 152 |
auf Bestellung 103 Stücke: Lieferzeit 10-14 Tag (e) |
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| S1JVMJD31CT4G | NXP Semiconductors |
Description: S1JVMJDBDPNTRANSISTA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BC847CW/DG/B4115 | NXP Semiconductors |
Description: NEXPERBC84SMASIGNBIPOLTRANSISTO0 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| S908QY1E0CDTER | NXP Semiconductors |
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: HC08 Core Size: 8-Bit Supplier Device Package: 16-TSSOP DigiKey Programmable: Not Verified |
auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
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| S908GR8E0CDWE | NXP Semiconductors |
Description: IC MCU 8BIT 7.5KB FLASH 28SOICPackaging: Bulk Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 7.5KB (7.5K x 8) RAM Size: 384 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x8b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 28-SOIC Number of I/O: 21 DigiKey Programmable: Not Verified |
auf Bestellung 320 Stücke: Lieferzeit 10-14 Tag (e) |
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S908GZ32G3MFAE | NXP Semiconductors |
Description: S908GZ32G3MFAE - AUTO 8 BIT MCU Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.5K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 24x10b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V, 4.5V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Number of I/O: 37 |
auf Bestellung 7000 Stücke: Lieferzeit 10-14 Tag (e) |
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| S908GZ60H0CFJE | NXP Semiconductors |
Description: IC MCU 8BIT 60KB FLASH 32LQFP Packaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: M68HC08 Data Converters: A/D 24x10b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 32-LQFP (7x7) Number of I/O: 21 DigiKey Programmable: Not Verified |
auf Bestellung 3967 Stücke: Lieferzeit 10-14 Tag (e) |
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| S908AB32AG0MFUE | NXP Semiconductors |
Description: S908AB32AG0MFUE Packaging: Bulk |
auf Bestellung 84 Stücke: Lieferzeit 10-14 Tag (e) |
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BZB784-C11115 | NXP Semiconductors |
Description: NOW NEXPERIA BZB784-C10 - ZENERConfiguration: 1 Pair Common Anode Mounting Type: Surface Mount Package / Case: SC-70, SOT-323 Tolerance: ±5% Packaging: Bulk Current - Reverse Leakage @ Vr: 100 nA @ 8 V Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Power - Max: 180 mW Supplier Device Package: SOT-323 Impedance (Max) (Zzt): 20 Ohms Voltage - Zener (Nom) (Vz): 11 V |
Produkt ist nicht verfügbar |
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| PCA9450AHNY | NXP Semiconductors |
Description: PCA9450AHN - Power Management ICPackaging: Bulk Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 5.5V Applications: i.MX Processors Current - Supply: 23µA Supplier Device Package: 56-HVQFN (7x7) |
auf Bestellung 4210 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC68040RC25V | NXP Semiconductors |
Description: MICROPROCESSOR, 32-BIT, MC68000Graphics Acceleration: No Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 179-PGA (47.24x47.24) Voltage - I/O: 5V Core Processor: 68040 Operating Temperature: 0°C ~ 110°C (TJ) Speed: 25MHz Mounting Type: Through Hole Package / Case: 179-BPGA Packaging: Bulk |
Produkt ist nicht verfügbar |
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| MC68040FE33A157 | NXP Semiconductors |
Description: MC68MICROPROCESSO32-BIMC680FAMIL Packaging: Tray |
Produkt ist nicht verfügbar |
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| MC68040RC40A | NXP Semiconductors |
Description: MC68RI32-BMICROPROCESS40MHZPackaging: Tray |
Produkt ist nicht verfügbar |
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| IP5311CX5/LF/P,135 | NXP Semiconductors |
Description: 1P5311CDALIFILTPIN(SPLASTIC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| A3I35D012WNR1 | NXP Semiconductors |
Description: A3I35D012 - Airfast RF LDMOS Wid Packaging: Bulk Package / Case: TO-270-17 Variant, Flat Leads Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 3.2GHz ~ 4GHz Configuration: 2 N-Channel Power - Output: 1.8W Gain: 27.8dB Technology: LDMOS (Dual) Supplier Device Package: TO-270WB-17 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 138 mA |
auf Bestellung 396 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU8M1UKAZ | NXP Semiconductors |
Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP Packaging: Bulk Package / Case: 6-XFBGA, WLCSP Mounting Type: Surface Mount Frequency: 1.805GHz ~ 2.2GHz RF Type: Cellular, LTE Voltage - Supply: 1.5V ~ 3.1V Gain: 16dB Current - Supply: 5mA Noise Figure: 0.8dB P1dB: -3dBm Test Frequency: 2.14GHz Supplier Device Package: 6-WLCSP (0.65x0.44) |
auf Bestellung 2800000 Stücke: Lieferzeit 10-14 Tag (e) |
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| RN5RK251A-TR-FE | NXP Semiconductors |
Description: RNINPVSTEP-DC/CONVERTERPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| MAX823MEXK-T | NXP Semiconductors |
Description: MAX5-PMICROPROCESSSUPERVISOCIRCU Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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LPC11A12FBD48/101, | NXP Semiconductors |
Description: LPC11A12 - Cortex-M0+/M0 RISC MiPackaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 42 |
auf Bestellung 207 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11A13JHI33/201E | NXP Semiconductors |
Description: LPC11A13 - Cortex-M0+/M0 RISC MiPackaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 24KB (24K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 28 |
auf Bestellung 580 Stücke: Lieferzeit 10-14 Tag (e) |
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HEF4013BTT-Q100118 | NXP Semiconductors |
Description: NEXPERIA HEF4013BTT-Q100 - D FLIPackaging: Bulk |
Produkt ist nicht verfügbar |
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PN5120A0HN/C2,551 | NXP Semiconductors |
Description: PN5120A0HN/C2 - Full NFC FrontenPackaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART Type: RFID Reader/Transponder Operating Temperature: -30°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 3.6V Standards: FeliCa, ISO 14443, MIFARE, NFC Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 436 Stücke: Lieferzeit 10-14 Tag (e) |
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FXTH87EH11DT1 | NXP Semiconductors |
Description: SENSOR TIRE PRESSURE RFPackaging: Bulk Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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FXTH871511DT1 | NXP Semiconductors |
Description: SENSOR TIRE PRESSURE RF OUTPUTPackaging: Bulk Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
auf Bestellung 41435 Stücke: Lieferzeit 10-14 Tag (e) |
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2N7002BKM/V,315 | NXP Semiconductors |
Description: NEXPERIA 2N7002BKM - SMALL SIGNAPackaging: Bulk |
Produkt ist nicht verfügbar |
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| MCIMX6U8DVM10AD557 | NXP Semiconductors |
Description: CORTEX A9 RISC MICROPROCESSOR 32Packaging: Bulk |
Produkt ist nicht verfügbar |
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74ABT32D,112 | NXP Semiconductors |
Description: IC GATE ORPackaging: Bulk |
auf Bestellung 10964 Stücke: Lieferzeit 10-14 Tag (e) |
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| BC847C/DG/B4215 | NXP Semiconductors |
Description: NEXPERBC8SMASIGNBIPOLTRANSISTO0. Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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HEF4094BTT118 | NXP Semiconductors |
Description: NEXPERIA HEF4094BTT - SERIAL INPackaging: Bulk |
Produkt ist nicht verfügbar |
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| PESD15VL1BAZ | NXP Semiconductors |
Description: TVS DIODE 15VWM 44VC SOD323 Packaging: Bulk Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TA) Applications: CAN, Telecom Capacitance @ Frequency: 16pF @ 1MHz Current - Peak Pulse (10/1000µs): 5A (8/20µs) Voltage - Reverse Standoff (Typ): 15V (Max) Supplier Device Package: SOD-323 Bidirectional Channels: 1 Voltage - Breakdown (Min): 17.1V Voltage - Clamping (Max) @ Ipp: 44V Power - Peak Pulse: 200W Power Line Protection: No |
auf Bestellung 3690 Stücke: Lieferzeit 10-14 Tag (e) |
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BZV85-C13,113 | NXP Semiconductors |
Description: DIODE ZENER 13V 1.3W DO41Tolerance: ±5% Packaging: Bulk Package / Case: DO-204AL, DO-41, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 200°C Voltage - Zener (Nom) (Vz): 13 V Impedance (Max) (Zzt): 10 Ohms Supplier Device Package: DO-41 Power - Max: 1.3 W Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Current - Reverse Leakage @ Vr: 200 nA @ 9.1 V |
auf Bestellung 122922 Stücke: Lieferzeit 10-14 Tag (e) |
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| LTC1148HVCS#PBF | NXP Semiconductors |
Description: LTC1SWITCHICONTROLLE250KSWITCHIFPackaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| SAF7741HV/N125ZK |
Hersteller: NXP Semiconductors
Description: SAF7741HV - CAR RADIO DIGITAL SI
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, LSB, SPDIF
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Clock Rate: 44.1kHz, 48kHz, 96kHz
Supplier Device Package: 144-HLQFP
Part Status: Obsolete
Description: SAF7741HV - CAR RADIO DIGITAL SI
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, LSB, SPDIF
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Clock Rate: 44.1kHz, 48kHz, 96kHz
Supplier Device Package: 144-HLQFP
Part Status: Obsolete
Produkt ist nicht verfügbar
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| 74AHCT2G241GD,125 |
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Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
Part Status: Active
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
Part Status: Active
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
auf Bestellung 25005 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2049+ | 0.29 EUR |
| MK21DX128AVMC5 |
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Hersteller: NXP Semiconductors
Description: MK21DX128AVMC5 - Kinetis K21: 50
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Bulk
Number of I/O: 64
Part Status: Active
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 1x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Description: MK21DX128AVMC5 - Kinetis K21: 50
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Bulk
Number of I/O: 64
Part Status: Active
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 1x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
auf Bestellung 161 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 46+ | 13.2 EUR |
| PCK351DB,112 |
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Hersteller: NXP Semiconductors
Description: IC CLK BUFFER 1:10 125MHZ 24SSOP
Packaging: Tube
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVTTL
Type: Fanout Buffer (Distribution)
Input: LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:10
Differential - Input:Output: No/No
Supplier Device Package: 24-SSOP
Frequency - Max: 125 MHz
Description: IC CLK BUFFER 1:10 125MHZ 24SSOP
Packaging: Tube
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVTTL
Type: Fanout Buffer (Distribution)
Input: LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:10
Differential - Input:Output: No/No
Supplier Device Package: 24-SSOP
Frequency - Max: 125 MHz
auf Bestellung 654 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 186+ | 2.92 EUR |
| S912XDG128F2VAA |
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Hersteller: NXP Semiconductors
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 16+ | 32.75 EUR |
| BC847RA147 |
Hersteller: NXP Semiconductors
Description: BC1NPN/PGENERAL-PURPODOUBTRANSIS
Packaging: Tape & Reel (TR)
Description: BC1NPN/PGENERAL-PURPODOUBTRANSIS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32V-SONYCAM |
Hersteller: NXP Semiconductors
Description: S32V - MIPI CAMERAS AND DE-SERIA
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
Description: S32V - MIPI CAMERAS AND DE-SERIA
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 518.4 EUR |
| S912XEG128J2MAA |
Hersteller: NXP Semiconductors
Description: MC9S12XE - KIPPER-16-BIT MCU, 12
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Core Size: 16-Bit
Data Converters: A/D 8x12b SAR
Core Processor: HCS12X
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Bulk
Description: MC9S12XE - KIPPER-16-BIT MCU, 12
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Core Size: 16-Bit
Data Converters: A/D 8x12b SAR
Core Processor: HCS12X
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPC875CVR66 |
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Hersteller: NXP Semiconductors
Description: IC MPU MPC87XX 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC, I2C, PCMCIA, SPI, TDM, UART
Description: IC MPU MPC87XX 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC, I2C, PCMCIA, SPI, TDM, UART
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 73.96 EUR |
| AFT20P060-4NR3 |
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Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: 2 N-Channel
Power - Output: 60W
Gain: 18.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: 2 N-Channel
Power - Output: 60W
Gain: 18.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
auf Bestellung 1730 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 7+ | 79 EUR |
| BC847BS/DG/B3115 |
Hersteller: NXP Semiconductors
Description: BCSMASIGNBIPOLTRANSISTO0.1452-EL
Packaging: Tape & Reel (TR)
Description: BCSMASIGNBIPOLTRANSISTO0.1452-EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PMEG2020EJ/ZL135 |
Hersteller: NXP Semiconductors
Description: PMEG2020EJ - Nexperia PMEG2020EJ
Current - Reverse Leakage @ Vr: 200 µA @ 20 V
Voltage - Forward (Vf) (Max) @ If: 525 mV @ 2 A
Voltage - DC Reverse (Vr) (Max): 20 V
Operating Temperature - Junction: 150°C
Supplier Device Package: SOD-323F
Current - Average Rectified (Io): 2A
Capacitance @ Vr, F: 50pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SC-90, SOD-323F
Packaging: Bulk
Description: PMEG2020EJ - Nexperia PMEG2020EJ
Current - Reverse Leakage @ Vr: 200 µA @ 20 V
Voltage - Forward (Vf) (Max) @ If: 525 mV @ 2 A
Voltage - DC Reverse (Vr) (Max): 20 V
Operating Temperature - Junction: 150°C
Supplier Device Package: SOD-323F
Current - Average Rectified (Io): 2A
Capacitance @ Vr, F: 50pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SC-90, SOD-323F
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
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| LPC2294U029 |
auf Bestellung 6327 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 21+ | 30.67 EUR |
| 74HC125DAUJ |
Hersteller: NXP Semiconductors
Description: 74HC1BDRIVEHC/SERIE4-FUN1-BITROU
Packaging: Tape & Reel (TR)
Description: 74HC1BDRIVEHC/SERIE4-FUN1-BITROU
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| 74HC73PW112 |
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Hersteller: NXP Semiconductors
Description: IC FF JK TYPE DUAL 1BIT 14TSSOP
Number of Bits per Element: 1
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Supplier Device Package: 14-TSSOP
Input Capacitance: 3.5 pF
Clock Frequency: 83 MHz
Trigger Type: Negative Edge
Current - Output High, Low: 5.2mA, 5.2mA
Current - Quiescent (Iq): 4 µA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: JK Type
Function: Reset
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Description: IC FF JK TYPE DUAL 1BIT 14TSSOP
Number of Bits per Element: 1
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Supplier Device Package: 14-TSSOP
Input Capacitance: 3.5 pF
Clock Frequency: 83 MHz
Trigger Type: Negative Edge
Current - Output High, Low: 5.2mA, 5.2mA
Current - Quiescent (Iq): 4 µA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: JK Type
Function: Reset
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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| BZV85-C3V9,113 |
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Hersteller: NXP Semiconductors
Description: DIODE ZENER 3.9V 1.3W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-41
Power - Max: 1.3 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
Description: DIODE ZENER 3.9V 1.3W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-41
Power - Max: 1.3 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
auf Bestellung 75000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2844+ | 0.19 EUR |
| 74HCT04DAUJ |
Hersteller: NXP Semiconductors
Description: 74HCTINVERTEHSERIE6-FUN1-INPUCMO
Packaging: Tape & Reel (TR)
Description: 74HCTINVERTEHSERIE6-FUN1-INPUCMO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MC34717EPR2 |
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Hersteller: NXP Semiconductors
Description: MC34717 - Switch-Mode Power Supp
Packaging: Bulk
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
Description: MC34717 - Switch-Mode Power Supp
Packaging: Bulk
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
Produkt ist nicht verfügbar
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| MC908JK3EMDWE |
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Hersteller: NXP Semiconductors
Description: MC9S08JK - MICROCONTROLLER, 8-BI
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 10x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
Description: MC9S08JK - MICROCONTROLLER, 8-BI
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 10x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
Produkt ist nicht verfügbar
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| MC33790HEGR2 |
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Hersteller: NXP Semiconductors
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 1 mA
DigiKey Programmable: Not Verified
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 1 mA
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 72+ | 7.98 EUR |
| MC33790HEG |
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Hersteller: NXP Semiconductors
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 1 mA
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 1 mA
auf Bestellung 89 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 89+ | 7.98 EUR |
| LPC2930FBD208,551 |
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Hersteller: NXP Semiconductors
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
auf Bestellung 103 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 21+ | 25.2 EUR |
| BC847CW/DG/B4115 |
Hersteller: NXP Semiconductors
Description: NEXPERBC84SMASIGNBIPOLTRANSISTO0
Packaging: Tape & Reel (TR)
Description: NEXPERBC84SMASIGNBIPOLTRANSISTO0
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S908QY1E0CDTER |
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 177+ | 3.56 EUR |
| S908GR8E0CDWE |
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Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 7.5KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 7.5KB (7.5K x 8)
RAM Size: 384 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 7.5KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 7.5KB (7.5K x 8)
RAM Size: 384 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 21
DigiKey Programmable: Not Verified
auf Bestellung 320 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 39+ | 16.51 EUR |
| S908GZ32G3MFAE |
Hersteller: NXP Semiconductors
Description: S908GZ32G3MFAE - AUTO 8 BIT MCU
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V, 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
Description: S908GZ32G3MFAE - AUTO 8 BIT MCU
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V, 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
auf Bestellung 7000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 27+ | 23.59 EUR |
| S908GZ60H0CFJE |
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
auf Bestellung 3967 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 21+ | 28.64 EUR |
| S908AB32AG0MFUE |
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 21+ | 30.37 EUR |
| BZB784-C11115 |
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Hersteller: NXP Semiconductors
Description: NOW NEXPERIA BZB784-C10 - ZENER
Configuration: 1 Pair Common Anode
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Tolerance: ±5%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 180 mW
Supplier Device Package: SOT-323
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 11 V
Description: NOW NEXPERIA BZB784-C10 - ZENER
Configuration: 1 Pair Common Anode
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Tolerance: ±5%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 180 mW
Supplier Device Package: SOT-323
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 11 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9450AHNY |
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Hersteller: NXP Semiconductors
Description: PCA9450AHN - Power Management IC
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
Description: PCA9450AHN - Power Management IC
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
auf Bestellung 4210 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 77+ | 8.23 EUR |
| MC68040RC25V |
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Hersteller: NXP Semiconductors
Description: MICROPROCESSOR, 32-BIT, MC68000
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 179-PGA (47.24x47.24)
Voltage - I/O: 5V
Core Processor: 68040
Operating Temperature: 0°C ~ 110°C (TJ)
Speed: 25MHz
Mounting Type: Through Hole
Package / Case: 179-BPGA
Packaging: Bulk
Description: MICROPROCESSOR, 32-BIT, MC68000
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 179-PGA (47.24x47.24)
Voltage - I/O: 5V
Core Processor: 68040
Operating Temperature: 0°C ~ 110°C (TJ)
Speed: 25MHz
Mounting Type: Through Hole
Package / Case: 179-BPGA
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A3I35D012WNR1 |
Hersteller: NXP Semiconductors
Description: A3I35D012 - Airfast RF LDMOS Wid
Packaging: Bulk
Package / Case: TO-270-17 Variant, Flat Leads
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 3.2GHz ~ 4GHz
Configuration: 2 N-Channel
Power - Output: 1.8W
Gain: 27.8dB
Technology: LDMOS (Dual)
Supplier Device Package: TO-270WB-17
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 138 mA
Description: A3I35D012 - Airfast RF LDMOS Wid
Packaging: Bulk
Package / Case: TO-270-17 Variant, Flat Leads
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 3.2GHz ~ 4GHz
Configuration: 2 N-Channel
Power - Output: 1.8W
Gain: 27.8dB
Technology: LDMOS (Dual)
Supplier Device Package: TO-270WB-17
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 138 mA
auf Bestellung 396 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 69.12 EUR |
| BGU8M1UKAZ |
Hersteller: NXP Semiconductors
Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 16dB
Current - Supply: 5mA
Noise Figure: 0.8dB
P1dB: -3dBm
Test Frequency: 2.14GHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 16dB
Current - Supply: 5mA
Noise Figure: 0.8dB
P1dB: -3dBm
Test Frequency: 2.14GHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
auf Bestellung 2800000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3116+ | 0.21 EUR |
| MAX823MEXK-T |
Hersteller: NXP Semiconductors
Description: MAX5-PMICROPROCESSSUPERVISOCIRCU
Packaging: Tape & Reel (TR)
Description: MAX5-PMICROPROCESSSUPERVISOCIRCU
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC11A12FBD48/101, |
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Hersteller: NXP Semiconductors
Description: LPC11A12 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
Description: LPC11A12 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
auf Bestellung 207 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 128+ | 4.4 EUR |
| LPC11A13JHI33/201E |
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Hersteller: NXP Semiconductors
Description: LPC11A13 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
Description: LPC11A13 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
auf Bestellung 580 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 92+ | 5.99 EUR |
| PN5120A0HN/C2,551 |
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Hersteller: NXP Semiconductors
Description: PN5120A0HN/C2 - Full NFC Fronten
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: PN5120A0HN/C2 - Full NFC Fronten
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 436 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 46+ | 11.59 EUR |
| FXTH87EH11DT1 |
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Hersteller: NXP Semiconductors
Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 67+ | 8.69 EUR |
| FXTH871511DT1 |
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Hersteller: NXP Semiconductors
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 41435 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 45+ | 14.01 EUR |
| 74ABT32D,112 |
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auf Bestellung 10964 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 701+ | 0.82 EUR |
| BC847C/DG/B4215 |
Hersteller: NXP Semiconductors
Description: NEXPERBC8SMASIGNBIPOLTRANSISTO0.
Packaging: Tape & Reel (TR)
Description: NEXPERBC8SMASIGNBIPOLTRANSISTO0.
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PESD15VL1BAZ |
Hersteller: NXP Semiconductors
Description: TVS DIODE 15VWM 44VC SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: CAN, Telecom
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 15V (Max)
Supplier Device Package: SOD-323
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 44V
Power - Peak Pulse: 200W
Power Line Protection: No
Description: TVS DIODE 15VWM 44VC SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: CAN, Telecom
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 15V (Max)
Supplier Device Package: SOD-323
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 44V
Power - Peak Pulse: 200W
Power Line Protection: No
auf Bestellung 3690 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2194+ | 0.25 EUR |
| BZV85-C13,113 |
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Hersteller: NXP Semiconductors
Description: DIODE ZENER 13V 1.3W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-41
Power - Max: 1.3 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 200 nA @ 9.1 V
Description: DIODE ZENER 13V 1.3W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-41
Power - Max: 1.3 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 200 nA @ 9.1 V
auf Bestellung 122922 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2844+ | 0.19 EUR |























