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74HCT32D,652 74HCT32D,652 NXP Semiconductors 74HC_HCT32.pdf Description: IC GATE OR
Packaging: Bulk
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MC9S08SH4CSC NXP Semiconductors MC9S08SH8.pdf Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 4x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 5
DigiKey Programmable: Not Verified
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MC34910BAC NXP Semiconductors FSCL-S-A0001160768-1.pdf?t.download=true&u=5oefqw Description: SYSTEM BASIS CHIP, LIN, 1X 5.0V/
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 5.5V ~ 18V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
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BFU768F,115 BFU768F,115 NXP Semiconductors BFU768F.pdf Description: BFU768F - NPN WIDEBAND SILICON G
Packaging: Bulk
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Frequency - Transition: 110GHz
Noise Figure (dB Typ @ f): 1.1dB ~ 1.2dB @ 5GHz ~ 5.9GHz
Supplier Device Package: 4-DFP
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BFU520XRR NXP Semiconductors BFU520XR.pdf Description: RF TRANS NPN 12V 10GHZ SOT-143R
Packaging: Bulk
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 17.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Frequency - Transition: 10GHz
Noise Figure (dB Typ @ f): 0.65dB @ 900MHz
Supplier Device Package: SOT-143R
Grade: Automotive
Qualification: AEC-Q101
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MCF51QE96CLH557 MCF51QE96CLH557 NXP Semiconductors Description: MCF51QE 32-bit MCU, ColdFire V1
Packaging: Bulk
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PTN3944EWY NXP Semiconductors PTN3944.pdf Description: PTN3944 - Multi-Channel PCIe Gen
Packaging: Bulk
Package / Case: 36-WFLGA Exposed Pad
Delay Time: 70ps
Number of Channels: 4
Output: Differential
Input: Differential
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: PCIe
Current - Supply: 250mA
Data Rate (Max): 16Gbps
Supplier Device Package: 36-HWFLGA (2.1x6)
Signal Conditioning: Input Equalization
Capacitance - Input: 10 pF
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MMA3201KEGR2 NXP Semiconductors FSCLS07536-1.pdf?t.download=true&u=5oefqw Description: MICROMACHINED ACCELEROMETER, DUA
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y
Acceleration Range: ±45g
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.25V
Bandwidth: 400Hz
Supplier Device Package: 20-SOIC
Sensitivity (mV/g): 50
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74LVT244ADB,112 74LVT244ADB,112 NXP Semiconductors 74LVT_LVTH244A.pdf Description: IC BUFFER NON-INVERT 3.6V 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SSOP
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TEA1532CT/N1,118 TEA1532CT/N1,118 NXP Semiconductors TEA1532BT_CT.pdf Description: IC CTLR SMPS 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 8.7V ~ 20V
Frequency - Switching: 100kHz ~ 150kHz
Mode: Continuous Conduction (CCM)
Supplier Device Package: 8-SO
Current - Startup: 1.2 mA
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TEA1520P/N2,112 TEA1520P/N2,112 NXP Semiconductors TEA152X.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Power (Watts): 30 W
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TEA1533AT/N1,518 TEA1533AT/N1,518 NXP Semiconductors TEA1533T_AT.pdf Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 145°C (TJ)
Frequency - Switching: 25kHz ~ 175kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.7V ~ 20V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 11 V
Power (Watts): 250 W
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TEA1521T/N2,518 TEA1521T/N2,518 NXP Semiconductors TEA152X.pdf Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Power (Watts): 30 W
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TEA1520T/N2,518 TEA1520T/N2,518 NXP Semiconductors TEA152X.pdf Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Power (Watts): 30 W
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G9S08AW32E5CFDE G9S08AW32E5CFDE NXP Semiconductors _MC9S08AW60.pdf?t.download=true&u=ovmfp3 Description: G9S08AW32 - S08AW: 8-BIT GENERAL
Packaging: Bulk
DigiKey Programmable: Not Verified
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PCF8584T/2,518 PCF8584T/2,518 NXP Semiconductors PCF8584.pdf Description: IC CTRL PARALLEL/I2C BUS 20-SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Supply: 1.5mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
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AFT09MP055NR1 NXP Semiconductors AFT09MP055N.pdf Description: RF MOSFET LDMOS 12.5V TO270-4
Packaging: Bulk
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 764MHz ~ 941MHz
Configuration: 2 N-Channel
Power - Output: 57W
Gain: 15.7dB
Technology: LDMOS (Dual)
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 550 mA
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BC860B,235 BC860B,235 NXP Semiconductors BC859_BC860.pdf Description: TRANS PNP 45V 0.1A TO-236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 250 mW
Qualification: AEC-Q101
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PCA9554AD,112 PCA9554AD,112 NXP Semiconductors PCA9554%28A%29.pdf Description: IC XPNDR 400KHZ I2C SMBUS 16SO
Features: POR
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SO
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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LS1023AXN8QQB NXP Semiconductors Description: IC MPU QORLQ LS1 1.6GHZ 780BGA
Packaging: Bulk
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
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LS1028ACE7NQA NXP Semiconductors Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Bulk
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
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MC9S08QE32CFM MC9S08QE32CFM NXP Semiconductors MC9S08QE32.pdf Description: S08QE 8-BIT MCU, S08 CORE, 32KB
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 50.33MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 10x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
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KC9S08GT60ACFDE KC9S08GT60ACFDE NXP Semiconductors FSCL-S-A0001054932-1.pdf?t.download=true&u=5oefqw Description: MC9S08GT60ACFDE - Microcontrolle
Packaging: Bulk
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K9S08SG16E1MTG K9S08SG16E1MTG NXP Semiconductors Description: SAMPLE PACK DEVICE
Packaging: Bulk
DigiKey Programmable: Not Verified
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UBA2071AT/N1,118 UBA2071AT/N1,118 NXP Semiconductors UBA2071_A.pdf Description: IC DVR HALF BRIDGE 24-SOIC
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 38kHz ~ 42kHz
Type: CCFL/EEFL Controller
Operating Temperature: -25°C ~ 100°C
Voltage - Supply: 14V
Supplier Device Package: 24-SO
Dimming: Yes
Current - Supply: 1.5 mA
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PMK50XP,518 PMK50XP,518 NXP Semiconductors PMK50XP.pdf Description: NEXPERIA PMK50XP - 7.9A, 20V, 0.
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 7.9A (Tc)
Rds On (Max) @ Id, Vgs: 50mOhm @ 2.8A, 4.5V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: 8-SO
Drive Voltage (Max Rds On, Min Rds On): 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1020 pF @ 20 V
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NXH2280UK/C1Z NXP Semiconductors Description: NXH2280 - NFMI RADIO FOR WIRELES
Packaging: Bulk
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PDTA114TMB,315 PDTA114TMB,315 NXP Semiconductors PHGLS24956-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS
Packaging: Bulk
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TDA18219HN/C1,557 TDA18219HN/C1,557 NXP Semiconductors TDA18219HN.pdf Description: IC TV SILICON TUNER 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Standards: ATSC, DTMB, DVB-C, DVB-T/T2, ISDB-T
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I2C
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MPC8544CVJALFA NXP Semiconductors FSCLS11192-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
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BF904AWR,115 BF904AWR,115 NXP Semiconductors BF904A%2CAR%2CAWR.pdf Description: RF MOSFET 5V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 200MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 7 V
Voltage - Test: 5 V
Current - Test: 10 mA
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SC16C750BIBS,151 SC16C750BIBS,151 NXP Semiconductors SC16C750B.pdf Description: IC UART SINGLE W/FIFO 32-HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 3Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
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74LVC1G332GXZ 74LVC1G332GXZ NXP Semiconductors 74LVC1G332.pdf Description: IC SNGL
Packaging: Bulk
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74HC377PW,112 74HC377PW,112 NXP Semiconductors PHGL-S-A0001541547-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE 1-ELE 8-BIT
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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PCA9534PW,112 PCA9534PW,112 NXP Semiconductors PCA9534.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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RP115L271D-E2 RP115L271D-E2 NXP Semiconductors ?product=rp115 Description: RP115L - Low Voltage 500mA/1A LD
Packaging: Bulk
Package / Case: 8-XFDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Current - Quiescent (Iq): 160 µA
Voltage - Input (Max): 5.25V
Number of Regulators: 1
Supplier Device Package: DFN1216-8
Voltage - Output (Min/Fixed): 2.7V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.09V @ 500mA
Protection Features: Over Current, Over Temperature, Reverse Current
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BUK7225-55A,118 NXP Semiconductors BUK7225-55A.pdf Description: N-CHANNEL TRENCHMOS STANDARD LEV
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Ta)
Rds On (Max) @ Id, Vgs: 25mOhm @ 25A, 10V
Power Dissipation (Max): 94W (Ta)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: DPAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1310 pF @ 25 V
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TDA8579T/N1,118 TDA8579T/N1,118 NXP Semiconductors TDA8579T.pdf Description: IC TRANSCEIVER 0/2 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Receiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 0/2
Supplier Device Package: 8-SO
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TJA1054T/N1,518 TJA1054T/N1,518 NXP Semiconductors TJA1054.pdf Description: IC TXRX 14-SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
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LPC2214FBD144/01,5 LPC2214FBD144/01,5 NXP Semiconductors LPC2212_2214.pdf Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 112
DigiKey Programmable: Not Verified
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TDA19997HL/C1,551 TDA19997HL/C1,551 NXP Semiconductors Description: IC DVI/HDMI SWITCH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Function: Switch
Voltage - Supply: 1.65V ~ 1.95V, 3.0V ~ 3.6V
Applications: Video Display
Standards: CEA-861D, DVI 1.0, HDCP 1.3, HDMI 1.4, IEC 61000-4-2
Supplier Device Package: 100-LQFP (14x14)
Control Interface: I2C
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74HC112PW,112 74HC112PW,112 NXP Semiconductors PHGL-S-A0002312769-1.pdf?t.download=true&u=5oefqw Description: IC FF JK-TYPE 2-ELE 1-BIT
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-TSSOP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
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SC16C754BIA68,529 SC16C754BIA68,529 NXP Semiconductors PHGLS15907-1.pdf?t.download=true&u=5oefqw Description: IC UART QUAD 64BYTE 68PLCC
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 2.25V ~ 2.75V, 2.97V ~ 3.63V, 4.5V ~ 5.5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 68-PLCC (24.23x24.23)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: No
With False Start Bit Detection: Yes
With Modem Control: Yes
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PCA9550D,118 PCA9550D,118 NXP Semiconductors PCA9550.pdf Description: IC LED DRVR LINEAR I2C 25MA 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 400kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 8-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
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TDA8766G/C1,118 TDA8766G/C1,118 NXP Semiconductors TDA8766.pdf Description: IC ADC 10BIT SIGMA-DELTA 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: 20°C ~ 75°C
Voltage - Supply, Analog: 3V ~ 5.25V
Voltage - Supply, Digital: 3V ~ 5.25V
Sampling Rate (Per Second): 20M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 32-LQFP (5x5)
Architecture: Sigma-Delta
Number of A/D Converters: 1
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MAX9286S32V234 NXP Semiconductors Description: MAX9286 - S32V MIPI CAMERAS AND
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
Utilized IC / Part: S32V234
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PMV100XPEA215 PMV100XPEA215 NXP Semiconductors PMV100XPEA.pdf Description: NEXPERIA PMV100 - P-CHANNEL MOSF
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.4A (Ta)
Rds On (Max) @ Id, Vgs: 128mOhm @ 2.4A, 4.5V
Power Dissipation (Max): 463mW (Ta), 4.45W (Tc)
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Supplier Device Package: SOT-23
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 6 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 386 pF @ 10 V
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LPC3230FET296/01,5 LPC3230FET296/01,5 NXP Semiconductors PHGLS30266-1.pdf?t.download=true&u=5oefqw Description: LPC3230 - Arm9, 32-Bit Microcont
Packaging: Bulk
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
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PIMXRT595SFFOA NXP Semiconductors IMXRT500EC.pdf Description: IMXRT595 - I.MX RT500 CROSSOVER
Packaging: Bulk
DigiKey Programmable: Not Verified
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BGY66B,112 BGY66B,112 NXP Semiconductors BGY66B.pdf Description: IC AMPLIFIER REVERSE SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 135 mA
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74LVC2G07GXZ 74LVC2G07GXZ NXP Semiconductors 74LVC2G07.pdf Description: IC BUFF 1.65V 6-X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-X2SON (1.0x0.8)
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74LVT573PW,112 74LVT573PW,112 NXP Semiconductors PHGLS23935-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74LVT573PW - BUS DRIVER
Packaging: Bulk
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TEF7006HN/V1,518 TEF7006HN/V1,518 NXP Semiconductors PHGL-S-A0003531970-1.pdf?t.download=true&u=5oefqw Description: IC CONSUMER CIRC PQCC32
Packaging: Bulk
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MC8641DHX1500KE NXP Semiconductors _MPC8641DEC.pdf?t.download=true&u=ovmfp3 Description: IC MPU MPC86XX 1.5GHZ 1023FCCBGA
Packaging: Bulk
Package / Case: 1023-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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BGU8L1UKAZ BGU8L1UKAZ NXP Semiconductors BGU8L1.pdf Description: IC AMP CELL 728-960MHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 15.5dB
Current - Supply: 4.7mA
Noise Figure: 0.8dB
P1dB: -5dBm
Test Frequency: 943MHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
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BGU8L1UK/SZ BGU8L1UK/SZ NXP Semiconductors BGU8L1.pdf Description: IC AMP CELL 728-960MHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 15.5dB
Current - Supply: 4.7mA
Noise Figure: 0.8dB
P1dB: -5dBm
Test Frequency: 943MHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
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TDA18260HN/C1,551 TDA18260HN/C1,551 NXP Semiconductors TDA18260HN_SDS.pdf Description: TDA18260HN - DUAL CABLE SILICON
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
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74AUP1G332GN,132 74AUP1G332GN,132 NXP Semiconductors 74AUP1G332.pdf Description: NEXPERIA 74AUP1G332 - LOW-POWER
Packaging: Bulk
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FXTH87EH116T1 FXTH87EH116T1 NXP Semiconductors FXTH87EH116?lang_cd=en Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
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PHP225,118 PHP225,118 NXP Semiconductors PHGLS22918-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PHP225 - SMALL SIGNAL F
Packaging: Bulk
auf Bestellung 4434 Stücke:
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74HCT32D,652 74HC_HCT32.pdf
74HCT32D,652
Hersteller: NXP Semiconductors
Description: IC GATE OR
Packaging: Bulk
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MC9S08SH4CSC MC9S08SH8.pdf
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 4x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 5
DigiKey Programmable: Not Verified
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MC34910BAC FSCL-S-A0001160768-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: SYSTEM BASIS CHIP, LIN, 1X 5.0V/
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 5.5V ~ 18V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
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BFU768F,115 BFU768F.pdf
BFU768F,115
Hersteller: NXP Semiconductors
Description: BFU768F - NPN WIDEBAND SILICON G
Packaging: Bulk
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Frequency - Transition: 110GHz
Noise Figure (dB Typ @ f): 1.1dB ~ 1.2dB @ 5GHz ~ 5.9GHz
Supplier Device Package: 4-DFP
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BFU520XRR BFU520XR.pdf
Hersteller: NXP Semiconductors
Description: RF TRANS NPN 12V 10GHZ SOT-143R
Packaging: Bulk
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 17.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Frequency - Transition: 10GHz
Noise Figure (dB Typ @ f): 0.65dB @ 900MHz
Supplier Device Package: SOT-143R
Grade: Automotive
Qualification: AEC-Q101
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MCF51QE96CLH557
MCF51QE96CLH557
Hersteller: NXP Semiconductors
Description: MCF51QE 32-bit MCU, ColdFire V1
Packaging: Bulk
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PTN3944EWY PTN3944.pdf
Hersteller: NXP Semiconductors
Description: PTN3944 - Multi-Channel PCIe Gen
Packaging: Bulk
Package / Case: 36-WFLGA Exposed Pad
Delay Time: 70ps
Number of Channels: 4
Output: Differential
Input: Differential
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: PCIe
Current - Supply: 250mA
Data Rate (Max): 16Gbps
Supplier Device Package: 36-HWFLGA (2.1x6)
Signal Conditioning: Input Equalization
Capacitance - Input: 10 pF
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MMA3201KEGR2 FSCLS07536-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: MICROMACHINED ACCELEROMETER, DUA
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y
Acceleration Range: ±45g
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.25V
Bandwidth: 400Hz
Supplier Device Package: 20-SOIC
Sensitivity (mV/g): 50
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74LVT244ADB,112 74LVT_LVTH244A.pdf
74LVT244ADB,112
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SSOP
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888+0.67 EUR
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TEA1532CT/N1,118 TEA1532BT_CT.pdf
TEA1532CT/N1,118
Hersteller: NXP Semiconductors
Description: IC CTLR SMPS 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 8.7V ~ 20V
Frequency - Switching: 100kHz ~ 150kHz
Mode: Continuous Conduction (CCM)
Supplier Device Package: 8-SO
Current - Startup: 1.2 mA
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371+1.46 EUR
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TEA1520P/N2,112 TEA152X.pdf
TEA1520P/N2,112
Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Power (Watts): 30 W
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TEA1533AT/N1,518 TEA1533T_AT.pdf
TEA1533AT/N1,518
Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 145°C (TJ)
Frequency - Switching: 25kHz ~ 175kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.7V ~ 20V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 11 V
Power (Watts): 250 W
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TEA1521T/N2,518 TEA152X.pdf
TEA1521T/N2,518
Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Power (Watts): 30 W
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TEA1520T/N2,518 TEA152X.pdf
TEA1520T/N2,518
Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Power (Watts): 30 W
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466+1.25 EUR
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G9S08AW32E5CFDE _MC9S08AW60.pdf?t.download=true&u=ovmfp3
G9S08AW32E5CFDE
Hersteller: NXP Semiconductors
Description: G9S08AW32 - S08AW: 8-BIT GENERAL
Packaging: Bulk
DigiKey Programmable: Not Verified
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PCF8584T/2,518 PCF8584.pdf
PCF8584T/2,518
Hersteller: NXP Semiconductors
Description: IC CTRL PARALLEL/I2C BUS 20-SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Supply: 1.5mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
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AFT09MP055NR1 AFT09MP055N.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 12.5V TO270-4
Packaging: Bulk
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 764MHz ~ 941MHz
Configuration: 2 N-Channel
Power - Output: 57W
Gain: 15.7dB
Technology: LDMOS (Dual)
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 550 mA
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BC860B,235 BC859_BC860.pdf
BC860B,235
Hersteller: NXP Semiconductors
Description: TRANS PNP 45V 0.1A TO-236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 250 mW
Qualification: AEC-Q101
auf Bestellung 100000 Stücke:
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7407+0.08 EUR
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PCA9554AD,112 PCA9554%28A%29.pdf
PCA9554AD,112
Hersteller: NXP Semiconductors
Description: IC XPNDR 400KHZ I2C SMBUS 16SO
Features: POR
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SO
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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LS1023AXN8QQB
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ LS1 1.6GHZ 780BGA
Packaging: Bulk
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
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LS1028ACE7NQA
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Bulk
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
auf Bestellung 167 Stücke:
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MC9S08QE32CFM MC9S08QE32.pdf
MC9S08QE32CFM
Hersteller: NXP Semiconductors
Description: S08QE 8-BIT MCU, S08 CORE, 32KB
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 50.33MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 10x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
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KC9S08GT60ACFDE FSCL-S-A0001054932-1.pdf?t.download=true&u=5oefqw
KC9S08GT60ACFDE
Hersteller: NXP Semiconductors
Description: MC9S08GT60ACFDE - Microcontrolle
Packaging: Bulk
auf Bestellung 250 Stücke:
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K9S08SG16E1MTG
K9S08SG16E1MTG
Hersteller: NXP Semiconductors
Description: SAMPLE PACK DEVICE
Packaging: Bulk
DigiKey Programmable: Not Verified
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UBA2071AT/N1,118 UBA2071_A.pdf
UBA2071AT/N1,118
Hersteller: NXP Semiconductors
Description: IC DVR HALF BRIDGE 24-SOIC
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 38kHz ~ 42kHz
Type: CCFL/EEFL Controller
Operating Temperature: -25°C ~ 100°C
Voltage - Supply: 14V
Supplier Device Package: 24-SO
Dimming: Yes
Current - Supply: 1.5 mA
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PMK50XP,518 PMK50XP.pdf
PMK50XP,518
Hersteller: NXP Semiconductors
Description: NEXPERIA PMK50XP - 7.9A, 20V, 0.
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 7.9A (Tc)
Rds On (Max) @ Id, Vgs: 50mOhm @ 2.8A, 4.5V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: 8-SO
Drive Voltage (Max Rds On, Min Rds On): 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1020 pF @ 20 V
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NXH2280UK/C1Z
Hersteller: NXP Semiconductors
Description: NXH2280 - NFMI RADIO FOR WIRELES
Packaging: Bulk
auf Bestellung 78000 Stücke:
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PDTA114TMB,315 PHGLS24956-1.pdf?t.download=true&u=5oefqw
PDTA114TMB,315
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS
Packaging: Bulk
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3519+0.17 EUR
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TDA18219HN/C1,557 TDA18219HN.pdf
TDA18219HN/C1,557
Hersteller: NXP Semiconductors
Description: IC TV SILICON TUNER 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Standards: ATSC, DTMB, DVB-C, DVB-T/T2, ISDB-T
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I2C
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MPC8544CVJALFA FSCLS11192-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
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3+243.36 EUR
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BF904AWR,115 BF904A%2CAR%2CAWR.pdf
BF904AWR,115
Hersteller: NXP Semiconductors
Description: RF MOSFET 5V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 200MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 7 V
Voltage - Test: 5 V
Current - Test: 10 mA
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SC16C750BIBS,151 SC16C750B.pdf
SC16C750BIBS,151
Hersteller: NXP Semiconductors
Description: IC UART SINGLE W/FIFO 32-HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 3Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
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84+6.44 EUR
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74LVC1G332GXZ 74LVC1G332.pdf
74LVC1G332GXZ
Hersteller: NXP Semiconductors
Description: IC SNGL
Packaging: Bulk
auf Bestellung 9950 Stücke:
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4543+0.14 EUR
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74HC377PW,112 PHGL-S-A0001541547-1.pdf?t.download=true&u=5oefqw
74HC377PW,112
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE 1-ELE 8-BIT
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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PCA9534PW,112 PCA9534.pdf
PCA9534PW,112
Hersteller: NXP Semiconductors
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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89+6.19 EUR
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RP115L271D-E2 ?product=rp115
RP115L271D-E2
Hersteller: NXP Semiconductors
Description: RP115L - Low Voltage 500mA/1A LD
Packaging: Bulk
Package / Case: 8-XFDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Current - Quiescent (Iq): 160 µA
Voltage - Input (Max): 5.25V
Number of Regulators: 1
Supplier Device Package: DFN1216-8
Voltage - Output (Min/Fixed): 2.7V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.09V @ 500mA
Protection Features: Over Current, Over Temperature, Reverse Current
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442+1.32 EUR
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BUK7225-55A,118 BUK7225-55A.pdf
Hersteller: NXP Semiconductors
Description: N-CHANNEL TRENCHMOS STANDARD LEV
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Ta)
Rds On (Max) @ Id, Vgs: 25mOhm @ 25A, 10V
Power Dissipation (Max): 94W (Ta)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: DPAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1310 pF @ 25 V
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TDA8579T/N1,118 TDA8579T.pdf
TDA8579T/N1,118
Hersteller: NXP Semiconductors
Description: IC TRANSCEIVER 0/2 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Receiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 0/2
Supplier Device Package: 8-SO
auf Bestellung 7500 Stücke:
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303+1.81 EUR
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TJA1054T/N1,518 TJA1054.pdf
TJA1054T/N1,518
Hersteller: NXP Semiconductors
Description: IC TXRX 14-SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
auf Bestellung 12432 Stücke:
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LPC2214FBD144/01,5 LPC2212_2214.pdf
LPC2214FBD144/01,5
Hersteller: NXP Semiconductors
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 112
DigiKey Programmable: Not Verified
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14+38.5 EUR
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TDA19997HL/C1,551
TDA19997HL/C1,551
Hersteller: NXP Semiconductors
Description: IC DVI/HDMI SWITCH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Function: Switch
Voltage - Supply: 1.65V ~ 1.95V, 3.0V ~ 3.6V
Applications: Video Display
Standards: CEA-861D, DVI 1.0, HDCP 1.3, HDMI 1.4, IEC 61000-4-2
Supplier Device Package: 100-LQFP (14x14)
Control Interface: I2C
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102+5.94 EUR
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74HC112PW,112 PHGL-S-A0002312769-1.pdf?t.download=true&u=5oefqw
74HC112PW,112
Hersteller: NXP Semiconductors
Description: IC FF JK-TYPE 2-ELE 1-BIT
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-TSSOP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
auf Bestellung 3492 Stücke:
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386+1.56 EUR
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SC16C754BIA68,529 PHGLS15907-1.pdf?t.download=true&u=5oefqw
SC16C754BIA68,529
Hersteller: NXP Semiconductors
Description: IC UART QUAD 64BYTE 68PLCC
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 2.25V ~ 2.75V, 2.97V ~ 3.63V, 4.5V ~ 5.5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 68-PLCC (24.23x24.23)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: No
With False Start Bit Detection: Yes
With Modem Control: Yes
auf Bestellung 98 Stücke:
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29+20.48 EUR
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PCA9550D,118 PCA9550.pdf
PCA9550D,118
Hersteller: NXP Semiconductors
Description: IC LED DRVR LINEAR I2C 25MA 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 400kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 8-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
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TDA8766G/C1,118 TDA8766.pdf
TDA8766G/C1,118
Hersteller: NXP Semiconductors
Description: IC ADC 10BIT SIGMA-DELTA 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: 20°C ~ 75°C
Voltage - Supply, Analog: 3V ~ 5.25V
Voltage - Supply, Digital: 3V ~ 5.25V
Sampling Rate (Per Second): 20M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 32-LQFP (5x5)
Architecture: Sigma-Delta
Number of A/D Converters: 1
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21+26.93 EUR
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MAX9286S32V234
Hersteller: NXP Semiconductors
Description: MAX9286 - S32V MIPI CAMERAS AND
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
Utilized IC / Part: S32V234
auf Bestellung 135 Stücke:
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1+1302.19 EUR
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PMV100XPEA215 PMV100XPEA.pdf
PMV100XPEA215
Hersteller: NXP Semiconductors
Description: NEXPERIA PMV100 - P-CHANNEL MOSF
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.4A (Ta)
Rds On (Max) @ Id, Vgs: 128mOhm @ 2.4A, 4.5V
Power Dissipation (Max): 463mW (Ta), 4.45W (Tc)
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Supplier Device Package: SOT-23
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 6 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 386 pF @ 10 V
auf Bestellung 39000 Stücke:
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6693+0.075 EUR
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LPC3230FET296/01,5 PHGLS30266-1.pdf?t.download=true&u=5oefqw
LPC3230FET296/01,5
Hersteller: NXP Semiconductors
Description: LPC3230 - Arm9, 32-Bit Microcont
Packaging: Bulk
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
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63+8.68 EUR
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PIMXRT595SFFOA IMXRT500EC.pdf
Hersteller: NXP Semiconductors
Description: IMXRT595 - I.MX RT500 CROSSOVER
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 987 Stücke:
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13+47.24 EUR
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BGY66B,112 BGY66B.pdf
BGY66B,112
Hersteller: NXP Semiconductors
Description: IC AMPLIFIER REVERSE SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 135 mA
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14+39.12 EUR
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74LVC2G07GXZ 74LVC2G07.pdf
74LVC2G07GXZ
Hersteller: NXP Semiconductors
Description: IC BUFF 1.65V 6-X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-X2SON (1.0x0.8)
auf Bestellung 110000 Stücke:
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1561+0.35 EUR
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74LVT573PW,112 PHGLS23935-1.pdf?t.download=true&u=5oefqw
74LVT573PW,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVT573PW - BUS DRIVER
Packaging: Bulk
auf Bestellung 3825 Stücke:
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1420+0.42 EUR
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TEF7006HN/V1,518 PHGL-S-A0003531970-1.pdf?t.download=true&u=5oefqw
TEF7006HN/V1,518
Hersteller: NXP Semiconductors
Description: IC CONSUMER CIRC PQCC32
Packaging: Bulk
auf Bestellung 1900 Stücke:
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78+7.44 EUR
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MC8641DHX1500KE _MPC8641DEC.pdf?t.download=true&u=ovmfp3
Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 1.5GHZ 1023FCCBGA
Packaging: Bulk
Package / Case: 1023-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
auf Bestellung 173 Stücke:
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1+1406.09 EUR
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BGU8L1UKAZ BGU8L1.pdf
BGU8L1UKAZ
Hersteller: NXP Semiconductors
Description: IC AMP CELL 728-960MHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 15.5dB
Current - Supply: 4.7mA
Noise Figure: 0.8dB
P1dB: -5dBm
Test Frequency: 943MHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
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BGU8L1UK/SZ BGU8L1.pdf
BGU8L1UK/SZ
Hersteller: NXP Semiconductors
Description: IC AMP CELL 728-960MHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 15.5dB
Current - Supply: 4.7mA
Noise Figure: 0.8dB
P1dB: -5dBm
Test Frequency: 943MHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
auf Bestellung 260000 Stücke:
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2355+0.24 EUR
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TDA18260HN/C1,551 TDA18260HN_SDS.pdf
TDA18260HN/C1,551
Hersteller: NXP Semiconductors
Description: TDA18260HN - DUAL CABLE SILICON
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
auf Bestellung 260 Stücke:
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84+6.34 EUR
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74AUP1G332GN,132 74AUP1G332.pdf
74AUP1G332GN,132
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP1G332 - LOW-POWER
Packaging: Bulk
auf Bestellung 60000 Stücke:
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1296+0.46 EUR
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FXTH87EH116T1 FXTH87EH116?lang_cd=en
FXTH87EH116T1
Hersteller: NXP Semiconductors
Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 4000 Stücke:
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64+9.03 EUR
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PHP225,118 PHGLS22918-1.pdf?t.download=true&u=5oefqw
PHP225,118
Hersteller: NXP Semiconductors
Description: NEXPERIA PHP225 - SMALL SIGNAL F
Packaging: Bulk
auf Bestellung 4434 Stücke:
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1402+0.42 EUR
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