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MCIMX6Q4AVT10AE NXP Semiconductors Description: MCIMX6Q4AVT10AE - i.MX 6 series
Packaging: Bulk
Part Status: Active
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PMEG100T20ELPX NXP Semiconductors Description: PMEG100T20ELP - 100 V, 2 A low l
Current - Reverse Leakage @ Vr: 1.25 µA @ 100 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 2 A
Voltage - DC Reverse (Vr) (Max): 100 V
Part Status: Active
Operating Temperature - Junction: 175°C
Supplier Device Package: SOD-128/CFP5
Current - Average Rectified (Io): 2A
Capacitance @ Vr, F: 200pF @ 1V, 1MHz
Technology: Schottky
Reverse Recovery Time (trr): 12 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SOD-128
Packaging: Bulk
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BZX79-C36143 BZX79-C36143 NXP Semiconductors BZX79.pdf Description: NOW NEXPERIA BZX79-C36 - ZENER D
Part Status: Active
Packaging: Bulk
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 400 mW
Supplier Device Package: ALF2
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 36 V
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
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KC912DG128CCPVE NXP Semiconductors Description: MC912DG128CCPVE - Microcontrolle
Packaging: Bulk
Part Status: Active
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NT2H1611G0DA8J NXP Semiconductors NTAG213_215_216.pdf Description: NT2H1611G0DA8 - NTAG NFC Forum T
Packaging: Bulk
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: PLLMC
Part Status: Active
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LX2080XE72232B NXP Semiconductors LX2160XE72232B.pdf?t.download=true&u=axiww2 Description: IC MPU QORIQ LX 2.2GHZ 1517BGA
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4 SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 2.2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Bulk
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
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LX2120SE72029B NXP Semiconductors Description: IC MPU QORIQ LX 2GHZ 1517FCPBGA
Package / Case: 1517-BBGA, FCBGA
Packaging: Bulk
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4 SDRAM
Number of Cores/Bus Width: 12 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: 0°C ~ 105°C (TJ)
Speed: 2GHz
Mounting Type: Surface Mount
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LX2160SC72232B NXP Semiconductors LX2160XE72232B.pdf?t.download=true&u=axiww2 Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4 SDRAM
Number of Cores/Bus Width: 16 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: 0°C ~ 105°C (TJ)
Speed: 2.2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Bulk
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74LVC1GU04GN,132 74LVC1GU04GN,132 NXP Semiconductors PHGLS27066-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 1CH 1-INP 6XSON
Current - Quiescent (Max): 4 µA
Number of Circuits: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Input Logic Level - Low: 0.33V ~ 1.1V
Input Logic Level - High: 1.32V ~ 4.4V
Supplier Device Package: 6-XSON (0.9x1)
Number of Inputs: 1
Current - Output High, Low: 32mA, 32mA
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
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LPC4074FBD144,551 LPC4074FBD144,551 NXP Semiconductors PHGLS25790-1.pdf?t.download=true&u=5oefqw Description: LPC4000 - Mid-range 32-bit Micro
Number of I/O: 109
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 40K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
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PN7360AUEV/C300Y PN7360AUEV/C300Y NXP Semiconductors PN7462.pdf Description: PN7360AUEV - NFC Cortex®
Packaging: Bulk
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Part Status: Active
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PUMH9/ZL165 NXP Semiconductors Description: Nexperia PUMH9 Small Signal Bipo
Part Status: Obsolete
Supplier Device Package: 6-TSSOP
Resistor - Emitter Base (R2): 47kOhm
Resistor - Base (R1): 10kOhms
Frequency - Transition: 230MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Current - Collector Cutoff (Max): 100nA
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Voltage - Collector Emitter Breakdown (Max): 50V
Current - Collector (Ic) (Max): 100mA
Power - Max: 200mW
Transistor Type: 2 NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Bulk
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LPC2921FBD100,551 LPC2921FBD100,551 NXP Semiconductors PHGLS20650-1.pdf?t.download=true&u=5oefqw Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 16x8b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 60
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LPC1112FHI33/102,5 LPC1112FHI33/102,5 NXP Semiconductors Description: LPC1112 - Scalable 32-bit Microc
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b SAR
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Number of I/O: 28
Part Status: Active
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LPC1114LVFHN24/103 LPC1114LVFHN24/103 NXP Semiconductors PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Connectivity: I2C, SPI, SSP, UART/USART
Number of I/O: 20
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, WDT
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit
Data Converters: A/D 4x8b SAR
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Bulk
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74AUP2G04GM,132 74AUP2G04GM,132 NXP Semiconductors PHGLS24263-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 2CH 2-INP 6XSON
Current - Quiescent (Max): 500 nA
Number of Circuits: 2
Part Status: Active
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Input Logic Level - Low: 0.7V ~ 0.9V
Input Logic Level - High: 1.6V ~ 2V
Supplier Device Package: 6-XSON (1.45x1)
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
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88W8987-A2-NYEA/AZ NXP Semiconductors Description: 88W8987 - RF Transceiver (Board
Packaging: Bulk
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Data Rate (Max): 433Mbps
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Part Status: Active
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PMEG2015EA115 PMEG2015EA115 NXP Semiconductors PMEG2015EA.pdf Description: DIODE SCHOTTKY 20V 1.5A SOD323
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Bulk
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 660 mV @ 1.5 A
Voltage - DC Reverse (Vr) (Max): 20 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 125°C
Supplier Device Package: SOD-323
Current - Average Rectified (Io): 1.5A
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
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PMDXB600UNEL/S500Z NXP Semiconductors Description: PMDXB600UNEL - N Channel MOSFET
Packaging: Bulk
Part Status: Active
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MRF6VP11KGSR5 NXP Semiconductors FSCLS07342-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 150 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4S GULL
Technology: LDMOS (Dual)
Power - Output: 1000W
Configuration: 2 N-Channel
Mounting Type: Surface Mount
Current Rating (Amps): 100µA
Package / Case: NI-1230-4S GW
Packaging: Bulk
Gain: 26dB
Frequency: 1.8MHz ~ 150MHz
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MIMX8QM6CVUFFAB NXP Semiconductors Description: IC MPU I.MX8Q 264MHZ 1313FCPBGA
Part Status: Active
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Graphics Acceleration: Yes
RAM Controllers: LPDDR4
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 8 Core, 64-Bit
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Packaging: Bulk
Supplier Device Package: 1313-FCPBGA (29x29)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Package / Case: 1313-BBGA, FCBGA
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Additional Interfaces: CANbus, I2C, SPI, UART
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Ethernet: 1Gbps (2)
Speed: 1.6GHz, 1.2GHz, 264MHz
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MC35XS3500HFK NXP Semiconductors MC35XS3500.pdf Description: MC35XS3500HFK - 12 V Automotive
Supplier Device Package: 24-PQFN (12x12)
Ratio - Input:Output: 1:5
Voltage - Supply (Vcc/Vdd): 6V ~ 28V
Voltage - Load: 6V ~ 28V
Input Type: Non-Inverting
Rds On (Typ): 35mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 5
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Bulk
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Battery, UVLO
Current - Output (Max): 65mA
Part Status: Obsolete
Produkt ist nicht verfügbar
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PMN48XPAX PMN48XPAX NXP Semiconductors PMN48XPA.pdf Description: NEXPERIA PMN48XP - 20V, P-CHANNE
Input Capacitance (Ciss) (Max) @ Vds: 1000 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±12V
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Part Status: Active
Supplier Device Package: 6-TSOP
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Power Dissipation (Max): 530mW (Ta), 6.25W (Tc)
Rds On (Max) @ Id, Vgs: 55mOhm @ 2.4A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 4.1A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Bulk
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NX7002AK215 NXP Semiconductors Description: Nexperia NX7002AK - Small Signal
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 100mA, 10V
Current - Continuous Drain (Id) @ 25°C: 190mA (Ta), 300mA (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
Input Capacitance (Ciss) (Max) @ Vds: 20 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 0.43 nC @ 4.5 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Part Status: Active
Supplier Device Package: SOT-23-3 (TO-236)
Vgs(th) (Max) @ Id: 2.1V @ 250µA
Power Dissipation (Max): 265mW (Ta), 1.33W (Tc)
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MPC8358CVRADDDA557 NXP Semiconductors Description: IC MPU MPC83XX 266MHZ 668TEPBGA
Packaging: Bulk
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-TEPBGA (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
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BUK763R1-40B,118 NXP Semiconductors PHGLS22330-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA BUK763R1-40B - 75A, 40V
Packaging: Bulk
Input Capacitance (Ciss) (Max) @ Vds: 6808 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 94 nC @ 10 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
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MC9328MX1DVM15 NXP Semiconductors FSCLS05269-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX1 150MHZ 225MAPBGA
Packaging: Bulk
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Part Status: Active
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PCMF2HDMI14SZ PCMF2HDMI14SZ NXP Semiconductors PCMFXHDMI14S_SER.pdf Description: CMC
Packaging: Bulk
Package / Case: 10-UFBGA, WLCSP
Size / Dimension: 0.062" L x 0.046" W (1.57mm x 1.17mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Height: 0.024" (0.60mm)
Filter Order: 3rd
Applications: General Purpose
Technology: LC
Resistance - Channel (Ohms): 3
ESD Protection: Yes
Part Status: Active
Number of Channels: 2
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88W9068-A0-BWPC/AK NXP Semiconductors Description: 88W9068 - WiFi Access Point SOC.
Part Status: Obsolete
Serial Interfaces: GPIO, I²C, SPI
RF Family/Standard: WiFi
Modulation: 1024QAM
Data Rate (Max): 4.8Gbps
Protocol: 802.11ax
Type: TxRx Only
Packaging: Bulk
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A3G35H100-04SR3 NXP Semiconductors A3G35H100-04S.pdf Description: RF MOSFET GAN 48V NI780
Current - Test: 80 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Active
Supplier Device Package: NI-780S-4L
Technology: GaN
Power - Output: 14W
Configuration: 2 N-Channel
Frequency: 3.4GHz ~ 3.6GHz
Mounting Type: Surface Mount
Package / Case: NI-780S-4L
Packaging: Bulk
Gain: 14dB @ 3.6GHz
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LS1043ASN7MNLB NXP Semiconductors Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Part Status: Active
SATA: SATA 6Gbps (1)
Security Features: ARM TZ, Boot Security
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 + PHY (3)
Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2)
Supplier Device Package: 621-FCPBGA (21x21)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 621-FBGA, FCBGA
Packaging: Bulk
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LS1088ASE7MQA NXP Semiconductors LS1088AXE7MQA.pdf?t.download=true&u=ovmfp3 Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, IFC, PCI, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: No
RAM Controllers: DDR4
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
Ethernet: 10GbE (2), 1GbE (8)
Supplier Device Package: 780-FBGA (23x23)
Voltage - I/O: 1.2V
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 105°C (TJ)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 780-BFBGA
Packaging: Bulk
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MIMXRT105SCVL5B MIMXRT105SCVL5B NXP Semiconductors PHGL-S-A0006456212-1.pdf?t.download=true&u=5oefqw Description: MXRT1050 - i.MXRT105A
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
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74HCT368D,652 74HCT368D,652 NXP Semiconductors PHGL-S-A0002312836-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER INVERT 5.5V 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SO
Part Status: Active
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MC7457RX1000NC NXP Semiconductors FSCLS04525-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC7457 1GHZ 483FCCBGA
Part Status: Active
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 483-FCCBGA (29x29)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 483-BCBGA, FCBGA
Packaging: Bulk
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MC68MH360AI25L557 NXP Semiconductors MC68360C1.pdf Description: IC CONTROLLER 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Type: Controller
Supplier Device Package: 240-FQFP (32x32)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MKL81Z128VMP7 MKL81Z128VMP7 NXP Semiconductors FSCL-S-A0001383122-1.pdf?t.download=true&u=5oefqw Description: MKL8 - Kinetis KL8 72MHz Cortex-
Packaging: Bulk
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x6/12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 41
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PMP5201V/S711115 PMP5201V/S711115 NXP Semiconductors PHGLS19184-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PMP5201V - SMALL SIGNAL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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A2T21H450W19SR6 NXP Semiconductors A2T21H450W19S.pdf Description: RF MOSFET LDMOS 30V NI1230
Packaging: Bulk
Package / Case: NI-1230S-4S4S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.2GHz
Power - Output: 89W
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4S4S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 800 mA
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PSMN4R3-80PS,127 PSMN4R3-80PS,127 NXP Semiconductors PSMN4R3-80PS.pdf Description: NEXPERIA PSMN4R3-80PS - 120A, 80
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 111 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8161 pF @ 40 V
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T2081NXE8P1B NXP Semiconductors T2080FS.pdf Description: IC MPU QORIQ T2 1.533GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Obsolete
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S912XEG128J2CAAR NXP Semiconductors Description: MC9S12XE - KIPPER-16-bit MCU, 12
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
Produkt ist nicht verfügbar
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MC33VR5500V1ES NXP Semiconductors VR5500.pdf Description: MC33VR5500V1ES - High Voltage PM
Qualification: AEC-Q100
Grade: Automotive
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Bulk
Number of Outputs: 6
Part Status: Active
w/Sequencer: Yes
w/Supervisor: Yes
w/LED Driver: No
Supplier Device Package: 56-HVQFN (8x8)
Topology: Step-Down (Buck) (4), Linear (LDO) (2)
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MPC561CVR40 NXP Semiconductors MPC561FACT.pdf Description: MPC561 - SILVER OAK-NXP 32-bit M
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Bulk
Number of I/O: 16
Part Status: Active
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit
Data Converters: A/D 32x10b SAR
Core Processor: PowerPC
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Produkt ist nicht verfügbar
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BUK764R0-75C,118 BUK764R0-75C,118 NXP Semiconductors BUK764R0-75C.pdf Description: NEXPERIA BUK764 - N-CHANNEL MOSF
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Drain to Source Voltage (Vdss): 75 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 333W (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Bulk
Produkt ist nicht verfügbar
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LS1027AXN7NQA NXP Semiconductors Description: IC MPU QORIQ 1.3GHZ 448FBGA
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 3.0 (2)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Bulk
Part Status: Active
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4
Additional Interfaces: CANbus, I2C, SPI, UART
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LS2084AXN711B NXP Semiconductors Description: IC MPU QORIQ 2.1GHZ 1292FCPBGA
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 2.1GHz
Mounting Type: Surface Mount
Package / Case: 1292-BBGA, FCBGA
Packaging: Bulk
Additional Interfaces: GPIO, DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
Part Status: Active
SATA: SATA 6Gbps (2)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: No
RAM Controllers: DDR4, SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
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P5020NXN7QMB557 NXP Semiconductors FSCL-S-A0000576586-1.pdf?t.download=true&u=5oefqw Description: QORIQ, 64-BIT POWER ARCH SOC, 2
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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KMZ80J NXP Semiconductors KMZ80.pdf Description: KMZ80 - Programmable Angle Senso
Resistance: 5 kOhms
Part Status: Active
Output Signal: Clockwise Increase
Supplier Device Package: 8-SOIC
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Linearity: ±0.95°
Voltage - Supply: 4.5V ~ 5.5V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 150°C
Qualification: AEC-Q100
Grade: Automotive
Output: Analog Voltage
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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UBA2024P/N1,112 UBA2024P/N1,112 NXP Semiconductors UBA2024.pdf Description: IC DRIVER HALF BRIDGE 8-DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
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P1014NSN5DFB NXP Semiconductors FSCLS11835-1.pdf?t.download=true&u=5oefqw Description: IC MPU QORIQ P1 533MHZ 425TEPBGA
Packaging: Bulk
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CANbus, DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
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PCA9672BS,118 NXP Semiconductors PCA9672.pdf Description: IC XPNDR 1MHZ I2C SMBUS 16HVQFN
DigiKey Programmable: Not Verified
Part Status: Obsolete
Current - Output Source/Sink: 300µA, 43mA
Supplier Device Package: 16-HVQFN (3x3)
Interrupt Output: Yes
Clock Frequency: 1 MHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C, SMBus
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 16-VFQFN Exposed Pad
Features: POR
Packaging: Bulk
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MC34PF1510A1EPR2 NXP Semiconductors Description: PF1510 - PMIC with 1A Li+ Linear
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 4.1V ~ 6V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (3), Linear (LDO) (3)
Supplier Device Package: 40-HVQFN (5x5)
Voltage/Current - Output 1: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 2: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 3: 1.8V ~ 3.3V, 1A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: Yes
Part Status: Active
Number of Outputs: 6
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S2ZMMBZ27VALT1G NXP Semiconductors Description: S2ZMMBZ - ZEN SOT23 REG .225W SP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MC10XS3435BHFKR2 NXP Semiconductors Description: MC10XS3435 - 12 V Automotive Ext
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Bulk
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 35mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
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BAS321135 NXP Semiconductors NEXP-S-A0003060012-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BAS321 - RECTIFIER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX79-B15143 NXP Semiconductors Description: NEXPERIA ZENER DIODE, 15V, 2%, 0
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08AW60MFGE NXP Semiconductors MC9S08AW60.pdf Description: MC9S08AW - Microcontroller, 8-Bi
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
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MIMXRT1051DVL6A NXP Semiconductors Description: MXRT1050 - i.MX RT1050 Crossover
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Obsolete
Number of I/O: 127
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LPC1102LVUKZ NXP Semiconductors PHGLS25606-1.pdf?t.download=true&u=5oefqw Description: LPC1102 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 25-WLCSP (2.17x2.32)
Part Status: Active
Number of I/O: 21
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MCIMX6Q4AVT10AE
Hersteller: NXP Semiconductors
Description: MCIMX6Q4AVT10AE - i.MX 6 series
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PMEG100T20ELPX
Hersteller: NXP Semiconductors
Description: PMEG100T20ELP - 100 V, 2 A low l
Current - Reverse Leakage @ Vr: 1.25 µA @ 100 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 2 A
Voltage - DC Reverse (Vr) (Max): 100 V
Part Status: Active
Operating Temperature - Junction: 175°C
Supplier Device Package: SOD-128/CFP5
Current - Average Rectified (Io): 2A
Capacitance @ Vr, F: 200pF @ 1V, 1MHz
Technology: Schottky
Reverse Recovery Time (trr): 12 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SOD-128
Packaging: Bulk
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BZX79-C36143 BZX79.pdf
BZX79-C36143
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA BZX79-C36 - ZENER D
Part Status: Active
Packaging: Bulk
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 400 mW
Supplier Device Package: ALF2
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 36 V
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Produkt ist nicht verfügbar
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KC912DG128CCPVE
Hersteller: NXP Semiconductors
Description: MC912DG128CCPVE - Microcontrolle
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NT2H1611G0DA8J NTAG213_215_216.pdf
Hersteller: NXP Semiconductors
Description: NT2H1611G0DA8 - NTAG NFC Forum T
Packaging: Bulk
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: PLLMC
Part Status: Active
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485+1.14 EUR
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LX2080XE72232B LX2160XE72232B.pdf?t.download=true&u=axiww2
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ LX 2.2GHZ 1517BGA
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4 SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 2.2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Bulk
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
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LX2120SE72029B
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ LX 2GHZ 1517FCPBGA
Package / Case: 1517-BBGA, FCBGA
Packaging: Bulk
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4 SDRAM
Number of Cores/Bus Width: 12 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: 0°C ~ 105°C (TJ)
Speed: 2GHz
Mounting Type: Surface Mount
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LX2160SC72232B LX2160XE72232B.pdf?t.download=true&u=axiww2
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4 SDRAM
Number of Cores/Bus Width: 16 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: 0°C ~ 105°C (TJ)
Speed: 2.2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Bulk
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74LVC1GU04GN,132 PHGLS27066-1.pdf?t.download=true&u=5oefqw
74LVC1GU04GN,132
Hersteller: NXP Semiconductors
Description: IC INVERTER 1CH 1-INP 6XSON
Current - Quiescent (Max): 4 µA
Number of Circuits: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Input Logic Level - Low: 0.33V ~ 1.1V
Input Logic Level - High: 1.32V ~ 4.4V
Supplier Device Package: 6-XSON (0.9x1)
Number of Inputs: 1
Current - Output High, Low: 32mA, 32mA
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
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3750+0.2 EUR
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LPC4074FBD144,551 PHGLS25790-1.pdf?t.download=true&u=5oefqw
LPC4074FBD144,551
Hersteller: NXP Semiconductors
Description: LPC4000 - Mid-range 32-bit Micro
Number of I/O: 109
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 40K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
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35+15.67 EUR
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PN7360AUEV/C300Y PN7462.pdf
PN7360AUEV/C300Y
Hersteller: NXP Semiconductors
Description: PN7360AUEV - NFC Cortex®
Packaging: Bulk
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Part Status: Active
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34+16.41 EUR
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PUMH9/ZL165
Hersteller: NXP Semiconductors
Description: Nexperia PUMH9 Small Signal Bipo
Part Status: Obsolete
Supplier Device Package: 6-TSSOP
Resistor - Emitter Base (R2): 47kOhm
Resistor - Base (R1): 10kOhms
Frequency - Transition: 230MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Current - Collector Cutoff (Max): 100nA
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Voltage - Collector Emitter Breakdown (Max): 50V
Current - Collector (Ic) (Max): 100mA
Power - Max: 200mW
Transistor Type: 2 NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2921FBD100,551 PHGLS20650-1.pdf?t.download=true&u=5oefqw
LPC2921FBD100,551
Hersteller: NXP Semiconductors
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 16x8b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 60
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LPC1112FHI33/102,5
LPC1112FHI33/102,5
Hersteller: NXP Semiconductors
Description: LPC1112 - Scalable 32-bit Microc
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b SAR
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Number of I/O: 28
Part Status: Active
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LPC1114LVFHN24/103 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114LVFHN24/103
Hersteller: NXP Semiconductors
Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Connectivity: I2C, SPI, SSP, UART/USART
Number of I/O: 20
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, WDT
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit
Data Converters: A/D 4x8b SAR
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 964 Stücke:
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166+3.5 EUR
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74AUP2G04GM,132 PHGLS24263-1.pdf?t.download=true&u=5oefqw
74AUP2G04GM,132
Hersteller: NXP Semiconductors
Description: IC INVERTER 2CH 2-INP 6XSON
Current - Quiescent (Max): 500 nA
Number of Circuits: 2
Part Status: Active
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Input Logic Level - Low: 0.7V ~ 0.9V
Input Logic Level - High: 1.6V ~ 2V
Supplier Device Package: 6-XSON (1.45x1)
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
Produkt ist nicht verfügbar
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88W8987-A2-NYEA/AZ
Hersteller: NXP Semiconductors
Description: 88W8987 - RF Transceiver (Board
Packaging: Bulk
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Data Rate (Max): 433Mbps
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Part Status: Active
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35+16.59 EUR
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PMEG2015EA115 PMEG2015EA.pdf
PMEG2015EA115
Hersteller: NXP Semiconductors
Description: DIODE SCHOTTKY 20V 1.5A SOD323
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Bulk
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 660 mV @ 1.5 A
Voltage - DC Reverse (Vr) (Max): 20 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 125°C
Supplier Device Package: SOD-323
Current - Average Rectified (Io): 1.5A
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Produkt ist nicht verfügbar
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PMDXB600UNEL/S500Z
Hersteller: NXP Semiconductors
Description: PMDXB600UNEL - N Channel MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MRF6VP11KGSR5 FSCLS07342-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 150 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4S GULL
Technology: LDMOS (Dual)
Power - Output: 1000W
Configuration: 2 N-Channel
Mounting Type: Surface Mount
Current Rating (Amps): 100µA
Package / Case: NI-1230-4S GW
Packaging: Bulk
Gain: 26dB
Frequency: 1.8MHz ~ 150MHz
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MIMX8QM6CVUFFAB
Hersteller: NXP Semiconductors
Description: IC MPU I.MX8Q 264MHZ 1313FCPBGA
Part Status: Active
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Graphics Acceleration: Yes
RAM Controllers: LPDDR4
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 8 Core, 64-Bit
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Packaging: Bulk
Supplier Device Package: 1313-FCPBGA (29x29)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Package / Case: 1313-BBGA, FCBGA
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Additional Interfaces: CANbus, I2C, SPI, UART
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Ethernet: 1Gbps (2)
Speed: 1.6GHz, 1.2GHz, 264MHz
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2+230.99 EUR
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MC35XS3500HFK MC35XS3500.pdf
Hersteller: NXP Semiconductors
Description: MC35XS3500HFK - 12 V Automotive
Supplier Device Package: 24-PQFN (12x12)
Ratio - Input:Output: 1:5
Voltage - Supply (Vcc/Vdd): 6V ~ 28V
Voltage - Load: 6V ~ 28V
Input Type: Non-Inverting
Rds On (Typ): 35mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 5
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Bulk
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Battery, UVLO
Current - Output (Max): 65mA
Part Status: Obsolete
Produkt ist nicht verfügbar
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PMN48XPAX PMN48XPA.pdf
PMN48XPAX
Hersteller: NXP Semiconductors
Description: NEXPERIA PMN48XP - 20V, P-CHANNE
Input Capacitance (Ciss) (Max) @ Vds: 1000 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±12V
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Part Status: Active
Supplier Device Package: 6-TSOP
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Power Dissipation (Max): 530mW (Ta), 6.25W (Tc)
Rds On (Max) @ Id, Vgs: 55mOhm @ 2.4A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 4.1A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Bulk
Produkt ist nicht verfügbar
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NX7002AK215
Hersteller: NXP Semiconductors
Description: Nexperia NX7002AK - Small Signal
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 100mA, 10V
Current - Continuous Drain (Id) @ 25°C: 190mA (Ta), 300mA (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
Input Capacitance (Ciss) (Max) @ Vds: 20 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 0.43 nC @ 4.5 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Part Status: Active
Supplier Device Package: SOT-23-3 (TO-236)
Vgs(th) (Max) @ Id: 2.1V @ 250µA
Power Dissipation (Max): 265mW (Ta), 1.33W (Tc)
Produkt ist nicht verfügbar
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MPC8358CVRADDDA557
Hersteller: NXP Semiconductors
Description: IC MPU MPC83XX 266MHZ 668TEPBGA
Packaging: Bulk
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-TEPBGA (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
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4+171.22 EUR
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BUK763R1-40B,118 PHGLS22330-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK763R1-40B - 75A, 40V
Packaging: Bulk
Input Capacitance (Ciss) (Max) @ Vds: 6808 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 94 nC @ 10 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
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MC9328MX1DVM15 FSCLS05269-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX1 150MHZ 225MAPBGA
Packaging: Bulk
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Part Status: Active
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PCMF2HDMI14SZ PCMFXHDMI14S_SER.pdf
PCMF2HDMI14SZ
Hersteller: NXP Semiconductors
Description: CMC
Packaging: Bulk
Package / Case: 10-UFBGA, WLCSP
Size / Dimension: 0.062" L x 0.046" W (1.57mm x 1.17mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Height: 0.024" (0.60mm)
Filter Order: 3rd
Applications: General Purpose
Technology: LC
Resistance - Channel (Ohms): 3
ESD Protection: Yes
Part Status: Active
Number of Channels: 2
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88W9068-A0-BWPC/AK
Hersteller: NXP Semiconductors
Description: 88W9068 - WiFi Access Point SOC.
Part Status: Obsolete
Serial Interfaces: GPIO, I²C, SPI
RF Family/Standard: WiFi
Modulation: 1024QAM
Data Rate (Max): 4.8Gbps
Protocol: 802.11ax
Type: TxRx Only
Packaging: Bulk
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A3G35H100-04SR3 A3G35H100-04S.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET GAN 48V NI780
Current - Test: 80 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Active
Supplier Device Package: NI-780S-4L
Technology: GaN
Power - Output: 14W
Configuration: 2 N-Channel
Frequency: 3.4GHz ~ 3.6GHz
Mounting Type: Surface Mount
Package / Case: NI-780S-4L
Packaging: Bulk
Gain: 14dB @ 3.6GHz
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LS1043ASN7MNLB
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Part Status: Active
SATA: SATA 6Gbps (1)
Security Features: ARM TZ, Boot Security
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 + PHY (3)
Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2)
Supplier Device Package: 621-FCPBGA (21x21)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 621-FBGA, FCBGA
Packaging: Bulk
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LS1088ASE7MQA LS1088AXE7MQA.pdf?t.download=true&u=ovmfp3
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, IFC, PCI, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: No
RAM Controllers: DDR4
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
Ethernet: 10GbE (2), 1GbE (8)
Supplier Device Package: 780-FBGA (23x23)
Voltage - I/O: 1.2V
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 105°C (TJ)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 780-BFBGA
Packaging: Bulk
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MIMXRT105SCVL5B PHGL-S-A0006456212-1.pdf?t.download=true&u=5oefqw
MIMXRT105SCVL5B
Hersteller: NXP Semiconductors
Description: MXRT1050 - i.MXRT105A
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
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74HCT368D,652 PHGL-S-A0002312836-1.pdf?t.download=true&u=5oefqw
74HCT368D,652
Hersteller: NXP Semiconductors
Description: IC BUFFER INVERT 5.5V 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SO
Part Status: Active
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MC7457RX1000NC FSCLS04525-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC7457 1GHZ 483FCCBGA
Part Status: Active
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 483-FCCBGA (29x29)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 483-BCBGA, FCBGA
Packaging: Bulk
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MC68MH360AI25L557 MC68360C1.pdf
Hersteller: NXP Semiconductors
Description: IC CONTROLLER 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Type: Controller
Supplier Device Package: 240-FQFP (32x32)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MKL81Z128VMP7 FSCL-S-A0001383122-1.pdf?t.download=true&u=5oefqw
MKL81Z128VMP7
Hersteller: NXP Semiconductors
Description: MKL8 - Kinetis KL8 72MHz Cortex-
Packaging: Bulk
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x6/12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 41
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PMP5201V/S711115 PHGLS19184-1.pdf?t.download=true&u=5oefqw
PMP5201V/S711115
Hersteller: NXP Semiconductors
Description: NEXPERIA PMP5201V - SMALL SIGNAL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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A2T21H450W19SR6 A2T21H450W19S.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 30V NI1230
Packaging: Bulk
Package / Case: NI-1230S-4S4S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.2GHz
Power - Output: 89W
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4S4S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 800 mA
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PSMN4R3-80PS,127 PSMN4R3-80PS.pdf
PSMN4R3-80PS,127
Hersteller: NXP Semiconductors
Description: NEXPERIA PSMN4R3-80PS - 120A, 80
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 111 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8161 pF @ 40 V
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T2081NXE8P1B T2080FS.pdf
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ T2 1.533GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Obsolete
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S912XEG128J2CAAR
Hersteller: NXP Semiconductors
Description: MC9S12XE - KIPPER-16-bit MCU, 12
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
Produkt ist nicht verfügbar
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MC33VR5500V1ES VR5500.pdf
Hersteller: NXP Semiconductors
Description: MC33VR5500V1ES - High Voltage PM
Qualification: AEC-Q100
Grade: Automotive
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Bulk
Number of Outputs: 6
Part Status: Active
w/Sequencer: Yes
w/Supervisor: Yes
w/LED Driver: No
Supplier Device Package: 56-HVQFN (8x8)
Topology: Step-Down (Buck) (4), Linear (LDO) (2)
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MPC561CVR40 MPC561FACT.pdf
Hersteller: NXP Semiconductors
Description: MPC561 - SILVER OAK-NXP 32-bit M
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Bulk
Number of I/O: 16
Part Status: Active
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit
Data Converters: A/D 32x10b SAR
Core Processor: PowerPC
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Produkt ist nicht verfügbar
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BUK764R0-75C,118 BUK764R0-75C.pdf
BUK764R0-75C,118
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK764 - N-CHANNEL MOSF
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Drain to Source Voltage (Vdss): 75 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 333W (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Bulk
Produkt ist nicht verfügbar
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LS1027AXN7NQA
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 3.0 (2)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Bulk
Part Status: Active
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4
Additional Interfaces: CANbus, I2C, SPI, UART
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6+117.56 EUR
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LS2084AXN711B
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ 2.1GHZ 1292FCPBGA
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 2.1GHz
Mounting Type: Surface Mount
Package / Case: 1292-BBGA, FCBGA
Packaging: Bulk
Additional Interfaces: GPIO, DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
Part Status: Active
SATA: SATA 6Gbps (2)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: No
RAM Controllers: DDR4, SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
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P5020NXN7QMB557 FSCL-S-A0000576586-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: QORIQ, 64-BIT POWER ARCH SOC, 2
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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KMZ80J KMZ80.pdf
Hersteller: NXP Semiconductors
Description: KMZ80 - Programmable Angle Senso
Resistance: 5 kOhms
Part Status: Active
Output Signal: Clockwise Increase
Supplier Device Package: 8-SOIC
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Linearity: ±0.95°
Voltage - Supply: 4.5V ~ 5.5V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 150°C
Qualification: AEC-Q100
Grade: Automotive
Output: Analog Voltage
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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UBA2024P/N1,112 UBA2024.pdf
UBA2024P/N1,112
Hersteller: NXP Semiconductors
Description: IC DRIVER HALF BRIDGE 8-DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
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P1014NSN5DFB FSCLS11835-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ P1 533MHZ 425TEPBGA
Packaging: Bulk
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CANbus, DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
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7+83.79 EUR
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PCA9672BS,118 PCA9672.pdf
Hersteller: NXP Semiconductors
Description: IC XPNDR 1MHZ I2C SMBUS 16HVQFN
DigiKey Programmable: Not Verified
Part Status: Obsolete
Current - Output Source/Sink: 300µA, 43mA
Supplier Device Package: 16-HVQFN (3x3)
Interrupt Output: Yes
Clock Frequency: 1 MHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C, SMBus
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 16-VFQFN Exposed Pad
Features: POR
Packaging: Bulk
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MC34PF1510A1EPR2
Hersteller: NXP Semiconductors
Description: PF1510 - PMIC with 1A Li+ Linear
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 4.1V ~ 6V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (3), Linear (LDO) (3)
Supplier Device Package: 40-HVQFN (5x5)
Voltage/Current - Output 1: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 2: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 3: 1.8V ~ 3.3V, 1A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: Yes
Part Status: Active
Number of Outputs: 6
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106+5.97 EUR
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S2ZMMBZ27VALT1G
Hersteller: NXP Semiconductors
Description: S2ZMMBZ - ZEN SOT23 REG .225W SP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MC10XS3435BHFKR2
Hersteller: NXP Semiconductors
Description: MC10XS3435 - 12 V Automotive Ext
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Bulk
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 35mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
auf Bestellung 1175 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
61+10.41 EUR
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BAS321135 NEXP-S-A0003060012-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA BAS321 - RECTIFIER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX79-B15143
Hersteller: NXP Semiconductors
Description: NEXPERIA ZENER DIODE, 15V, 2%, 0
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08AW60MFGE MC9S08AW60.pdf
Hersteller: NXP Semiconductors
Description: MC9S08AW - Microcontroller, 8-Bi
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
auf Bestellung 780 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
34+17.42 EUR
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MIMXRT1051DVL6A
Hersteller: NXP Semiconductors
Description: MXRT1050 - i.MX RT1050 Crossover
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Obsolete
Number of I/O: 127
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47+13.47 EUR
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LPC1102LVUKZ PHGLS25606-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC1102 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 25-WLCSP (2.17x2.32)
Part Status: Active
Number of I/O: 21
auf Bestellung 6651 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
98+5.52 EUR
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