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LPC2926FBD144,557 LPC2926FBD144,557 NXP Semiconductors PHGLS20650-1.pdf?t.download=true&u=5oefqw Description: LPC2926FBD144 - ARM9 microcontro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
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TFA9881UK/N1,023 TFA9881UK/N1,023 NXP Semiconductors PHGLS27948-1.pdf?t.download=true&u=5oefqw Description: IC AMP AUDIO CLASSD 3.4W 9WLCSP
Packaging: Bulk
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74AUP1G17GN,132 74AUP1G17GN,132 NXP Semiconductors PHGL-S-A0000283103-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
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CBTL06122AHF,518 CBTL06122AHF,518 NXP Semiconductors CBTL06122.pdf Description: IC MULTIPLEXER HEX 1X2 56HWQFN
Features: Bi-Directional
Packaging: Bulk
Package / Case: 56-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe
-3db Bandwidth: 2.5GHz
Supplier Device Package: 56-HWQFN (5x11)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 6
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MCIMX6Q4AVT10AC NXP Semiconductors FSCL-S-A0001020796-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6 1GHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6U5EVM10AC NXP Semiconductors FSCL-S-A0000998349-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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MCIMX6U1AVM10AC NXP Semiconductors FSCLS11779-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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PN7462AUEV/C300Y PN7462AUEV/C300Y NXP Semiconductors PN7462.pdf Description: PN7462AUEV - NFC Cortex®
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, MIFARE, NFC
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, UART, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Bulk
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LPC1114JBD48/303QL LPC1114JBD48/303QL NXP Semiconductors PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Number of I/O: 42
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b SAR
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
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TDF8544J/N2,112 TDF8544J/N2,112 NXP Semiconductors TDF8544.pdf Description: IC AMP AUDIO BTL DBS27P
Packaging: Tube
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
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BUK7575-55A,127 BUK7575-55A,127 NXP Semiconductors PHGLS22290-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA BUK7575 - N-CHANNEL MO
Qualification: AEC-Q101
Grade: Automotive
Input Capacitance (Ciss) (Max) @ Vds: 483 pF @ 25 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 62W (Tc)
Rds On (Max) @ Id, Vgs: 75mOhm @ 10A, 10V
Current - Continuous Drain (Id) @ 25°C: 20.3A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Bulk
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MW7IC930NR1 NXP Semiconductors FSCLS05412-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 28V TO270-16
Packaging: Bulk
Package / Case: TO-270-16 Variant, Flat Leads
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 920MHz ~ 960MHz
Configuration: 2 N-Channel
Power - Output: 3.2W
Gain: 35.9dB
Technology: LDMOS (Dual)
Supplier Device Package: TO-270WB-16
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 285 mA
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LS1012AXN7KKB NXP Semiconductors LS1012AFS.pdf Description: IC MPU QORLQ LS1 1GHZ 211FCLGA
Additional Interfaces: eMMC/SD/SDIO, GPIO, I2C, I2S, SPI, UART
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 (1), USB 3.0 + PHY
Ethernet: GbE (2)
Supplier Device Package: 211-FCLGA (9.6x9.6)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 211-VFLGA
Packaging: Bulk
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P1010NSE5HFB NXP Semiconductors FSCLS11925-1.pdf?t.download=true&u=5oefqw Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Additional Interfaces: CANbus, DUART, I2C, MMC/SD, SPI
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 425-TEPBGA I (19x19)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 425-FBGA
Packaging: Bulk
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MC68HC11E9BCFNE2 NXP Semiconductors M68HC11E.pdf Description: M68HC11E - 8BIT MCU,12K BUFFALO
Number of I/O: 16
Supplier Device Package: 52-PLCC (19.13x19.13)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: M68HC11
EEPROM Size: 512 x 8
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 12KB (12K x 8)
Speed: 2MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Bulk
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PSMN018-100ESFQ PSMN018-100ESFQ NXP Semiconductors PSMN018-100ESF.pdf Description: NEXPERIA PSMN018 - NEXTPOWER 100
Input Capacitance (Ciss) (Max) @ Vds: 1482 pF @ 50 V
Gate Charge (Qg) (Max) @ Vgs: 21.4 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 7V, 10V
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 111W (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 15A, 10V
Current - Continuous Drain (Id) @ 25°C: 53A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Bulk
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MMA2201KEGR2 MMA2201KEGR2 NXP Semiconductors MMA2201KEG.pdf Description: MMA2201KE - MEDIUM-G, ANALOG ACC
Sensitivity (mV/g): 50
Supplier Device Package: 16-SOIC
Bandwidth: 400Hz
Voltage - Supply: 5.25V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±40g
Axis: X
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
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74AUP2G3407GMH 74AUP2G3407GMH NXP Semiconductors PHGLS28868-1.pdf?t.download=true&u=5oefqw Description: IC BUFF 0.8V/3.6V 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA; 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
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LPC1112FDH28/102:5 LPC1112FDH28/102:5 NXP Semiconductors PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: LPC1112 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
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BC859B,215 BC859B,215 NXP Semiconductors BC859_BC860.pdf Description: TRANS PNP 30V 0.1A TO-236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 250 mW
Qualification: AEC-Q101
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MKW20Z160VHT4 NXP Semiconductors PHGL-S-A0005067296-1.pdf?t.download=true&u=5oefqw Description: IC RF TXRX+MCU 802.15.4
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 28
Current - Transmitting: 8.4mA ~ 18.5mA
Data Rate (Max): 250kbps
Current - Receiving: 6.5mA ~ 15.4mA
Protocol: ZigbeePRO®
Power - Output: 5dBm
Voltage - Supply: 1.45V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 160kB Flash, 20kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Packaging: Bulk
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74LVC139D,112 74LVC139D,112 NXP Semiconductors PHGLS23390-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74LVC139D - DECODER/DRI
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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MRFE6VP8600HR5 NXP Semiconductors MRFE6VP8600H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230
Current Rating (Amps): 20µA
Mounting Type: Chassis Mount
Frequency: 470MHz ~ 860MHz
Configuration: Dual, Common Source
Power - Output: 600W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 1.4 A
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BAT18,235 BAT18,235 NXP Semiconductors BAT18.pdf Description: RF DIODE STANDARD 35V SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Standard - Single
Operating Temperature: 125°C (TJ)
Capacitance @ Vr, F: 1pF @ 20V, 1MHz
Resistance @ If, F: 700mOhm @ 5mA, 200MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
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PDTA115EU,115 PDTA115EU,115 NXP Semiconductors PIRSS13039-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS
Packaging: Bulk
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74HCT2G17GW-Q100H 74HCT2G17GW-Q100H NXP Semiconductors 74HC_HCT2G17_Q100.pdf Description: IC BUFF NON-INVERT 5.5V 6-TSSOP
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 6-TSSOP
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Input Type: Schmitt Trigger
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Bulk
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MPC860DTCZQ50D4 NXP Semiconductors FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC86XX 50MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (2), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TJ)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
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NVT4555UKZ NVT4555UKZ NXP Semiconductors PHGLS28214-1.pdf?t.download=true&u=5oefqw Description: NVT4555UK - SIM card interface l
Supplier Device Package: 12-WLCSP (1.62x1.19)
Applications: SIM Card
Voltage - Supply: 1.1V ~ 3.6V
Mounting Type: Surface Mount
Package / Case: 12-UFBGA, WLCSP
Packaging: Bulk
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PN7362BNHN/C300Y PN7362BNHN/C300Y NXP Semiconductors PN7462.pdf Description: PN7362 - NFC CORTEX-M0 MICROCONT
DigiKey Programmable: Not Verified
Packaging: Bulk
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PESD2NFC-LYL PESD2NFC-LYL NXP Semiconductors PESD5V0F1BL.pdf Description: TVS DIODE 24VWM DFN1006-2
Power Line Protection: No
Bidirectional Channels: 1
Supplier Device Package: DFN1006-2
Voltage - Reverse Standoff (Typ): 24V (Max)
Type: Zener
Mounting Type: Surface Mount
Package / Case: SOD-882
Packaging: Bulk
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BZX79-C22,143 BZX79-C22,143 NXP Semiconductors BZX79.pdf Description: DIODE ZENER 22V 400MW ALF2
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 400 mW
Supplier Device Package: ALF2
Impedance (Max) (Zzt): 55 Ohms
Voltage - Zener (Nom) (Vz): 22 V
Operating Temperature: -65°C ~ 200°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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MC68302AG25C NXP Semiconductors FSCLS09687-1.pdf?t.download=true&u=5oefqw Description: IC MPU 25MHZ 144LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Supplier Device Package: 144-LQFP (20x20)
Voltage - I/O: 5V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
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MC68302EH25CB1 MC68302EH25CB1 NXP Semiconductors FSCLS09687-1.pdf?t.download=true&u=5oefqw Description: IC MPU M683XX 25MHZ 132PQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Supplier Device Package: 132-PQFP (24.13x24.13)
Voltage - I/O: 5V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Bulk
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SPC5746CHK1AMMH6 SPC5746CHK1AMMH6 NXP Semiconductors SPC5746CFK1ACKU6.pdf?t.download=true&u=axiww2 Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
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74AUP1G157GF,132 74AUP1G157GF,132 NXP Semiconductors PHGLS24877-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74AUP1G157GF - MULTIPLE
Supplier Device Package: 6-XSON, SOT891 (1x1)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: Multiplexer
Circuit: 1 x 2:1
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
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A2V09H400-04NR3 NXP Semiconductors PHGL-S-A0003207742-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 720MHz ~ 960MHz
Configuration: 2 N-Channel
Power - Output: 107W
Gain: 17.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 688 mA
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PTN5110DHQZ NXP Semiconductors Description: USB Type-C Rev 3.0 PD PHY, Dongl
Interface: Bus, I2C
Mounting Type: Surface Mount
Package / Case: 16-XFQFN Exposed Pad
Packaging: Bulk
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Voltage - Supply: 2.7V ~ 5.5V
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74LV04PW,118 74LV04PW,118 NXP Semiconductors PHGL-S-A0001366847-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER
Packaging: Bulk
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BGU8L1X BGU8L1X NXP Semiconductors PHGL-S-A0005068106-1.pdf?t.download=true&u=5oefqw Description: BGU8L1 - C Low Noise Amplifier M
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 14.5dB
Current - Supply: 4.6mA
Noise Figure: 0.7dB
P1dB: -3dBm
Test Frequency: 882MHz
Supplier Device Package: 6-XSON (1.1x0.7)
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MC9S08SU8VFK NXP Semiconductors PHGL-S-A0003028296-1.pdf?t.download=true&u=5oefqw Description: MC9S08SU - 8 bit MCU with S08L c
Packaging: Bulk
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08L
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 17
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74AUP1G07GF,132 74AUP1G07GF,132 NXP Semiconductors PHGLS25181-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON, SOT891 (1x1)
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CBT3306D,112 CBT3306D,112 NXP Semiconductors CBT3306.pdf Description: C3306 - NOW NEXPERIA CBT3306D -
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SO
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74LV00DB,118 74LV00DB,118 NXP Semiconductors 74LV00.pdf Description: IC GATE NAND
Packaging: Bulk
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74HCT163D,653 74HCT163D,653 NXP Semiconductors PHGL-S-A0001367747-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74HCT163D - BINARY COUN
Packaging: Bulk
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PCMF1USB30Z PCMF1USB30Z NXP Semiconductors PCMFXUSB30_SER.pdf Description: NEXPERIA PCMF1USB - ELECTRONIC I
Packaging: Bulk
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PZU20BA,115 PZU20BA,115 NXP Semiconductors PZUXBA_SER.pdf Description: DIODE ZENER 20V 320MW SOD323
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
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PZU20B1A,115 PZU20B1A,115 NXP Semiconductors PZUXBA_SER.pdf Description: DIODE ZENER 20V 320MW SOD323
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 320 mW
Supplier Device Package: SOD-323
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 20 V
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Tolerance: ±2%
Packaging: Bulk
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PZU20B2,115 PZU20B2,115 NXP Semiconductors PHGLS19743-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 20V 310MW SOD323F
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 310 mW
Supplier Device Package: SOD-323F
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 20 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-90, SOD-323F
Tolerance: ±2%
Packaging: Bulk
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MPC8545VJATGD NXP Semiconductors FSCLS11828-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC85XX 1.2GHZ 783BGA
Packaging: Bulk
Package / Case: 783-BBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-PBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: AES, Cryptography, Kasumi, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, RapidIO
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SCC2698BC1A84,512 SCC2698BC1A84,512 NXP Semiconductors SCC2698B.pdf Description: IC UART OCTAL ENHANCED 84-PLCC
With Modem Control: Yes
With False Start Bit Detection: Yes
With Auto Flow Control: Yes
Supplier Device Package: 84-PLCC (29.26x29.26)
Protocol: RS485
Voltage - Supply: 5V
Mounting Type: Surface Mount
Number of Channels: 8
Package / Case: 84-LCC (J-Lead)
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Bulk
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MFRC53101T/0FE,112 MFRC53101T/0FE,112 NXP Semiconductors Description: STANDARD ISO/IEC 14443 A/B READE
Packaging: Bulk
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PMEG6010ESBYL NXP Semiconductors PMEG6010ESB.pdf Description: DIODE SCHOTTKY 60V 1A DSN1006-2
Current - Reverse Leakage @ Vr: 30 µA @ 60 V
Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 60 V
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: DSN1006-2
Current - Average Rectified (Io): 1A
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Technology: Schottky
Reverse Recovery Time (trr): 2.4 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: 2-XDFN
Packaging: Bulk
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BZX884-C12,315 BZX884-C12,315 NXP Semiconductors PHGLS19465-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 12V 250MW DFN1006-2
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Supplier Device Package: DFN1006-2
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-882
Tolerance: ±5%
Packaging: Bulk
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BFG505/X,215 BFG505/X,215 NXP Semiconductors BFG505_X_Rev4.pdf Description: RF TRANS NPN 15V 9GHZ SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 18mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz
Supplier Device Package: SOT-143B
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PBSS5230QAZ PBSS5230QAZ NXP Semiconductors PBSS5230QA.pdf Description: TRANS PNP 30V 2A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 210mV @ 50mA, 1A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V
Frequency - Transition: 170MHz
Supplier Device Package: DFN1010D-3
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 325 mW
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TDA3664AT/N1,118 TDA3664AT/N1,118 NXP Semiconductors TDA3664.pdf Description: IC REG LINEAR 5V 100MA 8-SO
Operating Temperature: -40°C ~ 125°C
Current - Output: 100mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Current - Quiescent (Iq): 30 µA
Output Configuration: Positive
Current - Supply (Max): 2.5 mA
Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage
Voltage Dropout (Max): 0.3V @ 50mA
PSRR: 60dB (120Hz)
Voltage - Output (Min/Fixed): 5V
Supplier Device Package: 8-SO
Number of Regulators: 1
Voltage - Input (Max): 45V
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74AUP3G17GTX 74AUP3G17GTX NXP Semiconductors 74AUP3G17.pdf Description: NEXPERIA 74AUP3G17 - LOW-POWER T
Packaging: Bulk
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MC33886PVWR2 NXP Semiconductors FSCLS11623-1.pdf?t.download=true&u=5oefqw Description: 5.0 A H-Bridge
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 20-HSOP
Voltage - Load: 5V ~ 40V
Technology: CMOS
Applications: General Purpose
Voltage - Supply: 5V ~ 40V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 125°C (TA)
Interface: Parallel
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Packaging: Bulk
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TEA1733MT/N2,118 TEA1733MT/N2,118 NXP Semiconductors TEA1733MT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 91.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Power (Watts): 75 W
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TEA1703T/N1,118 TEA1703T/N1,118 NXP Semiconductors TEA1703T.pdf Description: IC CTRLR SMPS GREEN OVP 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V ~ 30V
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 30V
Applications: Secondary-Side Controller
Supplier Device Package: 8-SO
Current - Supply: 30 µA
DigiKey Programmable: Not Verified
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LPC2926FBD144,557 PHGLS20650-1.pdf?t.download=true&u=5oefqw
LPC2926FBD144,557
Hersteller: NXP Semiconductors
Description: LPC2926FBD144 - ARM9 microcontro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
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TFA9881UK/N1,023 PHGLS27948-1.pdf?t.download=true&u=5oefqw
TFA9881UK/N1,023
Hersteller: NXP Semiconductors
Description: IC AMP AUDIO CLASSD 3.4W 9WLCSP
Packaging: Bulk
auf Bestellung 70000 Stücke:
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398+1.36 EUR
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74AUP1G17GN,132 PHGL-S-A0000283103-1.pdf?t.download=true&u=5oefqw
74AUP1G17GN,132
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
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1920+0.31 EUR
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CBTL06122AHF,518 CBTL06122.pdf
CBTL06122AHF,518
Hersteller: NXP Semiconductors
Description: IC MULTIPLEXER HEX 1X2 56HWQFN
Features: Bi-Directional
Packaging: Bulk
Package / Case: 56-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe
-3db Bandwidth: 2.5GHz
Supplier Device Package: 56-HWQFN (5x11)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 6
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65+8.29 EUR
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MCIMX6Q4AVT10AC FSCL-S-A0001020796-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6 1GHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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4+143.23 EUR
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MCIMX6U5EVM10AC FSCL-S-A0000998349-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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MCIMX6U1AVM10AC FSCLS11779-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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7+79.42 EUR
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PN7462AUEV/C300Y PN7462.pdf
PN7462AUEV/C300Y
Hersteller: NXP Semiconductors
Description: PN7462AUEV - NFC Cortex®
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, MIFARE, NFC
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, UART, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Bulk
auf Bestellung 3456 Stücke:
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30+18.27 EUR
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LPC1114JBD48/303QL PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114JBD48/303QL
Hersteller: NXP Semiconductors
Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Number of I/O: 42
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b SAR
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
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110+5.31 EUR
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TDF8544J/N2,112 TDF8544.pdf
TDF8544J/N2,112
Hersteller: NXP Semiconductors
Description: IC AMP AUDIO BTL DBS27P
Packaging: Tube
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
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24+22.5 EUR
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BUK7575-55A,127 PHGLS22290-1.pdf?t.download=true&u=5oefqw
BUK7575-55A,127
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK7575 - N-CHANNEL MO
Qualification: AEC-Q101
Grade: Automotive
Input Capacitance (Ciss) (Max) @ Vds: 483 pF @ 25 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 62W (Tc)
Rds On (Max) @ Id, Vgs: 75mOhm @ 10A, 10V
Current - Continuous Drain (Id) @ 25°C: 20.3A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Bulk
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MW7IC930NR1 FSCLS05412-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 28V TO270-16
Packaging: Bulk
Package / Case: TO-270-16 Variant, Flat Leads
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 920MHz ~ 960MHz
Configuration: 2 N-Channel
Power - Output: 3.2W
Gain: 35.9dB
Technology: LDMOS (Dual)
Supplier Device Package: TO-270WB-16
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 285 mA
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LS1012AXN7KKB LS1012AFS.pdf
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ LS1 1GHZ 211FCLGA
Additional Interfaces: eMMC/SD/SDIO, GPIO, I2C, I2S, SPI, UART
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 (1), USB 3.0 + PHY
Ethernet: GbE (2)
Supplier Device Package: 211-FCLGA (9.6x9.6)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 211-VFLGA
Packaging: Bulk
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13+46.77 EUR
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P1010NSE5HFB FSCLS11925-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Additional Interfaces: CANbus, DUART, I2C, MMC/SD, SPI
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.4
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 425-TEPBGA I (19x19)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 425-FBGA
Packaging: Bulk
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7+92.42 EUR
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MC68HC11E9BCFNE2 M68HC11E.pdf
Hersteller: NXP Semiconductors
Description: M68HC11E - 8BIT MCU,12K BUFFALO
Number of I/O: 16
Supplier Device Package: 52-PLCC (19.13x19.13)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: M68HC11
EEPROM Size: 512 x 8
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 12KB (12K x 8)
Speed: 2MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Bulk
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17+35.52 EUR
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PSMN018-100ESFQ PSMN018-100ESF.pdf
PSMN018-100ESFQ
Hersteller: NXP Semiconductors
Description: NEXPERIA PSMN018 - NEXTPOWER 100
Input Capacitance (Ciss) (Max) @ Vds: 1482 pF @ 50 V
Gate Charge (Qg) (Max) @ Vgs: 21.4 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 7V, 10V
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 111W (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 15A, 10V
Current - Continuous Drain (Id) @ 25°C: 53A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Bulk
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263+2.06 EUR
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MMA2201KEGR2 MMA2201KEG.pdf
MMA2201KEGR2
Hersteller: NXP Semiconductors
Description: MMA2201KE - MEDIUM-G, ANALOG ACC
Sensitivity (mV/g): 50
Supplier Device Package: 16-SOIC
Bandwidth: 400Hz
Voltage - Supply: 5.25V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±40g
Axis: X
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
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74AUP2G3407GMH PHGLS28868-1.pdf?t.download=true&u=5oefqw
74AUP2G3407GMH
Hersteller: NXP Semiconductors
Description: IC BUFF 0.8V/3.6V 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA; 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
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678+0.81 EUR
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LPC1112FDH28/102:5 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112FDH28/102:5
Hersteller: NXP Semiconductors
Description: LPC1112 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
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201+2.99 EUR
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BC859B,215 BC859_BC860.pdf
BC859B,215
Hersteller: NXP Semiconductors
Description: TRANS PNP 30V 0.1A TO-236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 250 mW
Qualification: AEC-Q101
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13172+0.04 EUR
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MKW20Z160VHT4 PHGL-S-A0005067296-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC RF TXRX+MCU 802.15.4
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 28
Current - Transmitting: 8.4mA ~ 18.5mA
Data Rate (Max): 250kbps
Current - Receiving: 6.5mA ~ 15.4mA
Protocol: ZigbeePRO®
Power - Output: 5dBm
Voltage - Supply: 1.45V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 160kB Flash, 20kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Packaging: Bulk
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77+7.85 EUR
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74LVC139D,112 PHGLS23390-1.pdf?t.download=true&u=5oefqw
74LVC139D,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC139D - DECODER/DRI
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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MRFE6VP8600HR5 MRFE6VP8600H.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230
Current Rating (Amps): 20µA
Mounting Type: Chassis Mount
Frequency: 470MHz ~ 860MHz
Configuration: Dual, Common Source
Power - Output: 600W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 1.4 A
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1+672.14 EUR
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BAT18,235 BAT18.pdf
BAT18,235
Hersteller: NXP Semiconductors
Description: RF DIODE STANDARD 35V SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Standard - Single
Operating Temperature: 125°C (TJ)
Capacitance @ Vr, F: 1pF @ 20V, 1MHz
Resistance @ If, F: 700mOhm @ 5mA, 200MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
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1551+0.35 EUR
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PDTA115EU,115 PIRSS13039-1.pdf?t.download=true&u=5oefqw
PDTA115EU,115
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS
Packaging: Bulk
auf Bestellung 284480 Stücke:
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7407+0.071 EUR
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74HCT2G17GW-Q100H 74HC_HCT2G17_Q100.pdf
74HCT2G17GW-Q100H
Hersteller: NXP Semiconductors
Description: IC BUFF NON-INVERT 5.5V 6-TSSOP
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 6-TSSOP
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Input Type: Schmitt Trigger
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Bulk
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MPC860DTCZQ50D4 FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 50MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (2), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TJ)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
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NVT4555UKZ PHGLS28214-1.pdf?t.download=true&u=5oefqw
NVT4555UKZ
Hersteller: NXP Semiconductors
Description: NVT4555UK - SIM card interface l
Supplier Device Package: 12-WLCSP (1.62x1.19)
Applications: SIM Card
Voltage - Supply: 1.1V ~ 3.6V
Mounting Type: Surface Mount
Package / Case: 12-UFBGA, WLCSP
Packaging: Bulk
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PN7362BNHN/C300Y PN7462.pdf
PN7362BNHN/C300Y
Hersteller: NXP Semiconductors
Description: PN7362 - NFC CORTEX-M0 MICROCONT
DigiKey Programmable: Not Verified
Packaging: Bulk
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48+12.51 EUR
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PESD2NFC-LYL PESD5V0F1BL.pdf
PESD2NFC-LYL
Hersteller: NXP Semiconductors
Description: TVS DIODE 24VWM DFN1006-2
Power Line Protection: No
Bidirectional Channels: 1
Supplier Device Package: DFN1006-2
Voltage - Reverse Standoff (Typ): 24V (Max)
Type: Zener
Mounting Type: Surface Mount
Package / Case: SOD-882
Packaging: Bulk
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3309+0.18 EUR
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BZX79-C22,143 BZX79.pdf
BZX79-C22,143
Hersteller: NXP Semiconductors
Description: DIODE ZENER 22V 400MW ALF2
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 400 mW
Supplier Device Package: ALF2
Impedance (Max) (Zzt): 55 Ohms
Voltage - Zener (Nom) (Vz): 22 V
Operating Temperature: -65°C ~ 200°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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MC68302AG25C FSCLS09687-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU 25MHZ 144LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Supplier Device Package: 144-LQFP (20x20)
Voltage - I/O: 5V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
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MC68302EH25CB1 FSCLS09687-1.pdf?t.download=true&u=5oefqw
MC68302EH25CB1
Hersteller: NXP Semiconductors
Description: IC MPU M683XX 25MHZ 132PQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Supplier Device Package: 132-PQFP (24.13x24.13)
Voltage - I/O: 5V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Bulk
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SPC5746CHK1AMMH6 SPC5746CFK1ACKU6.pdf?t.download=true&u=axiww2
SPC5746CHK1AMMH6
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
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12+46.16 EUR
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74AUP1G157GF,132 PHGLS24877-1.pdf?t.download=true&u=5oefqw
74AUP1G157GF,132
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP1G157GF - MULTIPLE
Supplier Device Package: 6-XSON, SOT891 (1x1)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: Multiplexer
Circuit: 1 x 2:1
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
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1972+0.3 EUR
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A2V09H400-04NR3 PHGL-S-A0003207742-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 720MHz ~ 960MHz
Configuration: 2 N-Channel
Power - Output: 107W
Gain: 17.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 688 mA
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4+186.69 EUR
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PTN5110DHQZ
Hersteller: NXP Semiconductors
Description: USB Type-C Rev 3.0 PD PHY, Dongl
Interface: Bus, I2C
Mounting Type: Surface Mount
Package / Case: 16-XFQFN Exposed Pad
Packaging: Bulk
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Voltage - Supply: 2.7V ~ 5.5V
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192+3.03 EUR
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74LV04PW,118 PHGL-S-A0001366847-1.pdf?t.download=true&u=5oefqw
74LV04PW,118
Hersteller: NXP Semiconductors
Description: IC INVERTER
Packaging: Bulk
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3217+0.23 EUR
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BGU8L1X PHGL-S-A0005068106-1.pdf?t.download=true&u=5oefqw
BGU8L1X
Hersteller: NXP Semiconductors
Description: BGU8L1 - C Low Noise Amplifier M
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 14.5dB
Current - Supply: 4.6mA
Noise Figure: 0.7dB
P1dB: -3dBm
Test Frequency: 882MHz
Supplier Device Package: 6-XSON (1.1x0.7)
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MC9S08SU8VFK PHGL-S-A0003028296-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: MC9S08SU - 8 bit MCU with S08L c
Packaging: Bulk
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08L
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 17
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118+5.13 EUR
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74AUP1G07GF,132 PHGLS25181-1.pdf?t.download=true&u=5oefqw
74AUP1G07GF,132
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON, SOT891 (1x1)
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3493+0.18 EUR
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CBT3306D,112 CBT3306.pdf
CBT3306D,112
Hersteller: NXP Semiconductors
Description: C3306 - NOW NEXPERIA CBT3306D -
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SO
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952+0.64 EUR
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74LV00DB,118 74LV00.pdf
74LV00DB,118
Hersteller: NXP Semiconductors
Description: IC GATE NAND
Packaging: Bulk
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1803+0.35 EUR
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74HCT163D,653 PHGL-S-A0001367747-1.pdf?t.download=true&u=5oefqw
74HCT163D,653
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HCT163D - BINARY COUN
Packaging: Bulk
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PCMF1USB30Z PCMFXUSB30_SER.pdf
PCMF1USB30Z
Hersteller: NXP Semiconductors
Description: NEXPERIA PCMF1USB - ELECTRONIC I
Packaging: Bulk
auf Bestellung 20495 Stücke:
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1998+0.3 EUR
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PZU20BA,115 PZUXBA_SER.pdf
PZU20BA,115
Hersteller: NXP Semiconductors
Description: DIODE ZENER 20V 320MW SOD323
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
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PZU20B1A,115 PZUXBA_SER.pdf
PZU20B1A,115
Hersteller: NXP Semiconductors
Description: DIODE ZENER 20V 320MW SOD323
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 320 mW
Supplier Device Package: SOD-323
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 20 V
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Tolerance: ±2%
Packaging: Bulk
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15000+0.04 EUR
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PZU20B2,115 PHGLS19743-1.pdf?t.download=true&u=5oefqw
PZU20B2,115
Hersteller: NXP Semiconductors
Description: DIODE ZENER 20V 310MW SOD323F
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 310 mW
Supplier Device Package: SOD-323F
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 20 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-90, SOD-323F
Tolerance: ±2%
Packaging: Bulk
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10804+0.061 EUR
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MPC8545VJATGD FSCLS11828-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC85XX 1.2GHZ 783BGA
Packaging: Bulk
Package / Case: 783-BBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-PBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: AES, Cryptography, Kasumi, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, RapidIO
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2+441.73 EUR
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SCC2698BC1A84,512 SCC2698B.pdf
SCC2698BC1A84,512
Hersteller: NXP Semiconductors
Description: IC UART OCTAL ENHANCED 84-PLCC
With Modem Control: Yes
With False Start Bit Detection: Yes
With Auto Flow Control: Yes
Supplier Device Package: 84-PLCC (29.26x29.26)
Protocol: RS485
Voltage - Supply: 5V
Mounting Type: Surface Mount
Number of Channels: 8
Package / Case: 84-LCC (J-Lead)
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Bulk
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9+62.81 EUR
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MFRC53101T/0FE,112
MFRC53101T/0FE,112
Hersteller: NXP Semiconductors
Description: STANDARD ISO/IEC 14443 A/B READE
Packaging: Bulk
auf Bestellung 55 Stücke:
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18+30.19 EUR
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PMEG6010ESBYL PMEG6010ESB.pdf
Hersteller: NXP Semiconductors
Description: DIODE SCHOTTKY 60V 1A DSN1006-2
Current - Reverse Leakage @ Vr: 30 µA @ 60 V
Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 60 V
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: DSN1006-2
Current - Average Rectified (Io): 1A
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Technology: Schottky
Reverse Recovery Time (trr): 2.4 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: 2-XDFN
Packaging: Bulk
auf Bestellung 199680 Stücke:
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7088+0.08 EUR
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BZX884-C12,315 PHGLS19465-1.pdf?t.download=true&u=5oefqw
BZX884-C12,315
Hersteller: NXP Semiconductors
Description: DIODE ZENER 12V 250MW DFN1006-2
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Supplier Device Package: DFN1006-2
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-882
Tolerance: ±5%
Packaging: Bulk
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18159+0.04 EUR
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BFG505/X,215 BFG505_X_Rev4.pdf
BFG505/X,215
Hersteller: NXP Semiconductors
Description: RF TRANS NPN 15V 9GHZ SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 18mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz
Supplier Device Package: SOT-143B
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1135+0.48 EUR
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PBSS5230QAZ PBSS5230QA.pdf
PBSS5230QAZ
Hersteller: NXP Semiconductors
Description: TRANS PNP 30V 2A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 210mV @ 50mA, 1A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V
Frequency - Transition: 170MHz
Supplier Device Package: DFN1010D-3
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 325 mW
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4691+0.12 EUR
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TDA3664AT/N1,118 TDA3664.pdf
TDA3664AT/N1,118
Hersteller: NXP Semiconductors
Description: IC REG LINEAR 5V 100MA 8-SO
Operating Temperature: -40°C ~ 125°C
Current - Output: 100mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Current - Quiescent (Iq): 30 µA
Output Configuration: Positive
Current - Supply (Max): 2.5 mA
Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage
Voltage Dropout (Max): 0.3V @ 50mA
PSRR: 60dB (120Hz)
Voltage - Output (Min/Fixed): 5V
Supplier Device Package: 8-SO
Number of Regulators: 1
Voltage - Input (Max): 45V
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59+9.12 EUR
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74AUP3G17GTX 74AUP3G17.pdf
74AUP3G17GTX
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP3G17 - LOW-POWER T
Packaging: Bulk
auf Bestellung 4973 Stücke:
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2565+0.23 EUR
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MC33886PVWR2 FSCLS11623-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: 5.0 A H-Bridge
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 20-HSOP
Voltage - Load: 5V ~ 40V
Technology: CMOS
Applications: General Purpose
Voltage - Supply: 5V ~ 40V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 125°C (TA)
Interface: Parallel
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Packaging: Bulk
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52+10.73 EUR
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TEA1733MT/N2,118 TEA1733MT.pdf
TEA1733MT/N2,118
Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 91.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Power (Watts): 75 W
auf Bestellung 2500 Stücke:
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TEA1703T/N1,118 TEA1703T.pdf
TEA1703T/N1,118
Hersteller: NXP Semiconductors
Description: IC CTRLR SMPS GREEN OVP 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V ~ 30V
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 30V
Applications: Secondary-Side Controller
Supplier Device Package: 8-SO
Current - Supply: 30 µA
DigiKey Programmable: Not Verified
auf Bestellung 9883 Stücke:
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