Produkte > NXP SEMICONDUCTORS > Alle Produkte des Herstellers NXP SEMICONDUCTORS (53103) > Seite 40 nach 886
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
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CBT3306D,112 | NXP Semiconductors |
Description: C3306 - NOW NEXPERIA CBT3306D -Packaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 2 Voltage Supply Source: Single Supply Supplier Device Package: 8-SO |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV00DB,118 | NXP Semiconductors |
Description: IC GATE NANDPackaging: Bulk |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT163D,653 | NXP Semiconductors |
Description: NEXPERIA 74HCT163D - BINARY COUNPackaging: Bulk |
auf Bestellung 6805 Stücke: Lieferzeit 10-14 Tag (e) |
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PCMF1USB30Z | NXP Semiconductors |
Description: NEXPERIA PCMF1USB - ELECTRONIC IPackaging: Bulk |
auf Bestellung 20495 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU20BA,115 | NXP Semiconductors |
Description: DIODE ZENER 20V 320MW SOD323Tolerance: ±5% Packaging: Bulk Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 20 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: SOD-323 Power - Max: 320 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 50 nA @ 15 V |
auf Bestellung 48000 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU20B1A,115 | NXP Semiconductors |
Description: DIODE ZENER 20V 320MW SOD323Current - Reverse Leakage @ Vr: 50 nA @ 15 V Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Power - Max: 320 mW Supplier Device Package: SOD-323 Impedance (Max) (Zzt): 20 Ohms Voltage - Zener (Nom) (Vz): 20 V Operating Temperature: -55°C ~ 150°C Mounting Type: Surface Mount Package / Case: SC-76, SOD-323 Tolerance: ±2% Packaging: Bulk |
auf Bestellung 15000 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU20B2,115 | NXP Semiconductors |
Description: DIODE ZENER 20V 310MW SOD323FCurrent - Reverse Leakage @ Vr: 50 nA @ 15 V Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Power - Max: 310 mW Supplier Device Package: SOD-323F Impedance (Max) (Zzt): 20 Ohms Voltage - Zener (Nom) (Vz): 20 V Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SC-90, SOD-323F Tolerance: ±2% Packaging: Bulk |
auf Bestellung 27000 Stücke: Lieferzeit 10-14 Tag (e) |
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| MPC8545VJATGD | NXP Semiconductors |
Description: IC MPU MPC85XX 1.2GHZ 783BGAPackaging: Bulk Package / Case: 783-BBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-PBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: AES, Cryptography, Kasumi, Random Number Generator Additional Interfaces: DUART, I2C, PCI, RapidIO |
auf Bestellung 118 Stücke: Lieferzeit 10-14 Tag (e) |
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SCC2698BC1A84,512 | NXP Semiconductors |
Description: IC UART OCTAL ENHANCED 84-PLCCWith Modem Control: Yes With False Start Bit Detection: Yes With Auto Flow Control: Yes Supplier Device Package: 84-PLCC (29.26x29.26) Protocol: RS485 Voltage - Supply: 5V Mounting Type: Surface Mount Number of Channels: 8 Package / Case: 84-LCC (J-Lead) Features: Configurable GPIO, Internal Oscillator, Timer/Counter Packaging: Bulk |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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MFRC53101T/0FE,112 | NXP Semiconductors |
Description: STANDARD ISO/IEC 14443 A/B READE Packaging: Bulk |
auf Bestellung 55 Stücke: Lieferzeit 10-14 Tag (e) |
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| PMEG6010ESBYL | NXP Semiconductors |
Description: DIODE SCHOTTKY 60V 1A DSN1006-2Current - Reverse Leakage @ Vr: 30 µA @ 60 V Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A Voltage - DC Reverse (Vr) (Max): 60 V Operating Temperature - Junction: 150°C (Max) Supplier Device Package: DSN1006-2 Current - Average Rectified (Io): 1A Capacitance @ Vr, F: 20pF @ 10V, 1MHz Technology: Schottky Reverse Recovery Time (trr): 2.4 ns Speed: Fast Recovery =< 500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: 2-XDFN Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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BZX884-C12,315 | NXP Semiconductors |
Description: DIODE ZENER 12V 250MW DFN1006-2Current - Reverse Leakage @ Vr: 100 nA @ 8 V Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Power - Max: 250 mW Supplier Device Package: DFN1006-2 Impedance (Max) (Zzt): 10 Ohms Voltage - Zener (Nom) (Vz): 12 V Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-882 Tolerance: ±5% Packaging: Bulk |
auf Bestellung 18159 Stücke: Lieferzeit 10-14 Tag (e) |
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BFG505/X,215 | NXP Semiconductors |
Description: RF TRANS NPN 15V 9GHZ SOT-143BPackaging: Bulk Package / Case: TO-253-4, TO-253AA Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 150mW Current - Collector (Ic) (Max): 18mA Voltage - Collector Emitter Breakdown (Max): 15V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz Supplier Device Package: SOT-143B |
auf Bestellung 4610 Stücke: Lieferzeit 10-14 Tag (e) |
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PBSS5230QAZ | NXP Semiconductors |
Description: TRANS PNP 30V 2A DFN1010D-3Packaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 210mV @ 50mA, 1A Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V Frequency - Transition: 170MHz Supplier Device Package: DFN1010D-3 Current - Collector (Ic) (Max): 2 A Voltage - Collector Emitter Breakdown (Max): 30 V Power - Max: 325 mW |
auf Bestellung 554308 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA3664AT/N1,118 | NXP Semiconductors |
Description: IC REG LINEAR 5V 100MA 8-SOOperating Temperature: -40°C ~ 125°C Current - Output: 100mA Mounting Type: Surface Mount Output Type: Fixed Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Bulk Current - Quiescent (Iq): 30 µA Output Configuration: Positive Current - Supply (Max): 2.5 mA Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage Voltage Dropout (Max): 0.3V @ 50mA PSRR: 60dB (120Hz) Voltage - Output (Min/Fixed): 5V Supplier Device Package: 8-SO Number of Regulators: 1 Voltage - Input (Max): 45V |
auf Bestellung 59 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP3G17GTX | NXP Semiconductors |
Description: NEXPERIA 74AUP3G17 - LOW-POWER TPackaging: Bulk |
auf Bestellung 4973 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC33886PVWR2 | NXP Semiconductors |
Description: 5.0 A H-BridgeMotor Type - AC, DC: Brushed DC Motor Type - Stepper: Bipolar Supplier Device Package: 20-HSOP Voltage - Load: 5V ~ 40V Technology: CMOS Applications: General Purpose Voltage - Supply: 5V ~ 40V Output Configuration: Half Bridge (2) Operating Temperature: -40°C ~ 125°C (TA) Interface: Parallel Current - Output: 5A Function: Driver - Fully Integrated, Control and Power Stage Mounting Type: Surface Mount Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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TEA1733MT/N2,118 | NXP Semiconductors |
Description: IC OFFLINE SWITCH FLYBACK 8SOPackaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 72% Frequency - Switching: 91.5kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 12V ~ 30V Supplier Device Package: 8-SO Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage Voltage - Start Up: 20.6 V Power (Watts): 75 W |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA1703T/N1,118 | NXP Semiconductors |
Description: IC CTRLR SMPS GREEN OVP 8SOPackaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Voltage - Input: 5V ~ 30V Operating Temperature: -40°C ~ 150°C Voltage - Supply: 5V ~ 30V Applications: Secondary-Side Controller Supplier Device Package: 8-SO Current - Supply: 30 µA DigiKey Programmable: Not Verified |
auf Bestellung 9883 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA1750T/N1,518 | NXP Semiconductors |
Description: IC OFFLINE SWITCH FLYBACK 16SOPackaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Frequency - Switching: 125kHz Internal Switch(s): No Voltage - Breakdown: 650V Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 15V ~ 38V Supplier Device Package: 16-SO Fault Protection: Current Limiting, Over Temperature, Over Voltage Voltage - Start Up: 22 V Power (Watts): 250 W |
auf Bestellung 4502 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1G58GM,132 | NXP Semiconductors |
Description: NEXPERIA 74LVC1G58GM - LOGIC CIRPackaging: Bulk |
auf Bestellung 1069960 Stücke: Lieferzeit 10-14 Tag (e) |
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CGY1047,112 | NXP Semiconductors |
Description: NARROW BAND HIGH POWER AMPLIFIERCurrent - Supply: 250 mA Number of Circuits: 1 Supplier Device Package: SOT115J Applications: CATV Mounting Type: Chassis Mount Output Type: Push-Pull Package / Case: SOT-115J Packaging: Tube |
auf Bestellung 2169 Stücke: Lieferzeit 10-14 Tag (e) |
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PMXB350UPEZ | NXP Semiconductors |
Description: NEXPERIA PMXB350UPE - 20 V, P-CHInput Capacitance (Ciss) (Max) @ Vds: 116 pF @ 10 V Gate Charge (Qg) (Max) @ Vgs: 2.3 nC @ 4.5 V Drain to Source Voltage (Vdss): 20 V Vgs (Max): ±8V Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V Supplier Device Package: DFN1010D-3 Vgs(th) (Max) @ Id: 950mV @ 250µA Power Dissipation (Max): 360mW (Ta), 5.68W (Tc) Rds On (Max) @ Id, Vgs: 447mOhm @ 1.2A, 4.5V Current - Continuous Drain (Id) @ 25°C: 1.2A (Ta) FET Type: P-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 3-XDFN Exposed Pad Packaging: Bulk |
auf Bestellung 659217 Stücke: Lieferzeit 10-14 Tag (e) |
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| MPC8377VRAGDA | NXP Semiconductors |
Description: IC MPU MPC83XX 400MHZ PBGA689Packaging: Bulk Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e300c4s Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
auf Bestellung 382 Stücke: Lieferzeit 10-14 Tag (e) |
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| MPC8536EBVJAULA | NXP Semiconductors |
Description: IC MPU 1.333GHZ 783FCPBGAPackaging: Bulk Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11U14FET48/201, | NXP Semiconductors |
Description: LPC11U14- Scalable Entry Level 3Packaging: Bulk Package / Case: 48-TFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-TFBGA (4.5x4.5) Number of I/O: 40 |
auf Bestellung 861 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11U13FBD48/201, | NXP Semiconductors |
Description: LPC11U13 - Scalable 32-bit MicroPackaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 24KB (24K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
auf Bestellung 1095 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA10025HN/C1,518 | NXP Semiconductors |
Description: IC DEMODULATOR DUAL 48-HVQFNPackaging: Bulk Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Processor Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V Applications: Consumer Video Supplier Device Package: 48-HVQFN (7x7) Control Interface: I2C |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC4076FBD144E | NXP Semiconductors |
Description: LPC4000 - Mid-range 32-bit MicroPackaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 8x12b SAR; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 109 |
auf Bestellung 624 Stücke: Lieferzeit 10-14 Tag (e) |
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BC54-10PASX | NXP Semiconductors |
Description: TRANS NPN 45V 1A DFN2020D-3Packaging: Bulk Package / Case: 3-UDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V Frequency - Transition: 180MHz Supplier Device Package: DFN2020D-3 Current - Collector (Ic) (Max): 1 A Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 420 mW |
auf Bestellung 146990 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08GT8ACFDE | NXP Semiconductors |
Description: IC MCU 8BIT 8KB FLASH 48MAPQFNPackaging: Bulk Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: HCS08 Data Converters: A/D 8x10b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-MAPQFN-EP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
auf Bestellung 393 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCF51AC128CCFGE | NXP Semiconductors |
Description: IC MCU 32BIT 128KB FLASH 44LQFPPackaging: Bulk Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 50.33MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 9x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 36 DigiKey Programmable: Not Verified |
auf Bestellung 125 Stücke: Lieferzeit 10-14 Tag (e) |
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| AFT27S010NT1 | NXP Semiconductors |
Description: RF MOSFET LDMOS 28V PLD-1.5WPackaging: Bulk Package / Case: PLD-1.5W Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 728MHz ~ 3.6GHz Power - Output: 1.26W Gain: 21.7dB Technology: LDMOS Supplier Device Package: PLD-1.5W Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 90 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| MKM33Z64CLH5 | NXP Semiconductors |
Description: IC MCU 32BIT 64KB FLASH 64LQFPPackaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16b SAR, 24b Sigma-Delta Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LCD, LVD, POR, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 38 DigiKey Programmable: Not Verified |
auf Bestellung 160 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA1738GT/N1,118 | NXP Semiconductors |
Description: IC OFFLINE SWITCH FLYBACK 8SOPackaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 80% Frequency - Switching: 26.5kHz ~ 118kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V Supplier Device Package: 8-SO Fault Protection: Current Limiting, Over Power, Over Temperature Voltage - Start Up: 13.2 V Power (Watts): 75 W |
auf Bestellung 3861 Stücke: Lieferzeit 10-14 Tag (e) |
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BAP1321-03,115 | NXP Semiconductors |
Description: RF DIODE PIN 60V 500MW SOD-323Power Dissipation (Max): 500 mW Current - Max: 100 mA Supplier Device Package: SOD-323 Voltage - Peak Reverse (Max): 60V Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz Operating Temperature: -65°C ~ 150°C (TJ) Diode Type: PIN - Single Package / Case: SC-76, SOD-323 Packaging: Bulk |
auf Bestellung 9190 Stücke: Lieferzeit 10-14 Tag (e) |
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| HT2MOA4S20/E/3/RJ | NXP Semiconductors |
Description: HITAG 2 transponder ICPackaging: Bulk Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 125kHz Type: RFID Transponder Operating Temperature: -55°C ~ 140°C Voltage - Supply: 6.5V Standards: ISO 11784, ISO 11785 Supplier Device Package: PLLMC |
auf Bestellung 33666 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP3G34GDH | NXP Semiconductors |
Description: NEXPERIA 74AUP3G34 - NON INVERTIPackaging: Bulk |
auf Bestellung 2928 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP3G34GNX | NXP Semiconductors |
Description: NEXPERIA 74AUP3G34 - LOW-POWER TPackaging: Bulk |
auf Bestellung 69900 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC9S08JM16CLD | NXP Semiconductors |
Description: IC MCU 8BIT 16KB FLASH 44LQFPPackaging: Bulk Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: HCS08 Data Converters: A/D 8x12b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI, USB Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 33 DigiKey Programmable: Not Verified |
auf Bestellung 2327 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCIMX6Q5EZK08AD | NXP Semiconductors |
Description: IC MPU I.MX6Q 800MHZ 569MAPBGAPackaging: Bulk Package / Case: 569-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 569-MAPBGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 2208 Stücke: Lieferzeit 10-14 Tag (e) |
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PMEG4002ESFYL | NXP Semiconductors |
Description: DIODE SCHOTTK 40V 200MA DSN06032Packaging: Bulk Package / Case: 0201 (0603 Metric) Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 1.28 ns Technology: Schottky Capacitance @ Vr, F: 17pF @ 1V, 1MHz Current - Average Rectified (Io): 200mA Supplier Device Package: DSN0603-2 Operating Temperature - Junction: 150°C (Max) Voltage - DC Reverse (Vr) (Max): 40 V Voltage - Forward (Vf) (Max) @ If: 600 mV @ 200 mA Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V |
auf Bestellung 1278000 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6X3EVK10AB | NXP Semiconductors |
Description: IC MPU I.MX6SX 1GHZ 400MAPBGAMounting Type: Surface Mount Package / Case: 400-LFBGA Packaging: Bulk Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: DDR3, DDR3L, LPDDR2 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 400-MAPBGA (14x14) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Operating Temperature: -20°C ~ 105°C (TJ) Speed: 1GHz, 227MHz |
auf Bestellung 139 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6X3EVN10AB | NXP Semiconductors |
Description: IC MPU 227MHZ/1GHZ 400MAPBGAAdditional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: DDR3, DDR3L, LPDDR2 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 400-MAPBGA (14x14) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Operating Temperature: -20°C ~ 105°C (TJ) Speed: 227MHz, 1GHz Mounting Type: Surface Mount Package / Case: 400-LFBGA Packaging: Bulk Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE |
auf Bestellung 207 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT4538D,112 | NXP Semiconductors |
Description: NEXPERIA 74HCT4538D - MONOSTABLEPackaging: Bulk |
auf Bestellung 7143 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11U35FBD64/401, | NXP Semiconductors |
Description: IC MCU 32BIT 64KB FLASH 64LQFPPackaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 10K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 40841 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11U37FBD64/501, | NXP Semiconductors |
Description: LPC11U37 - Scalable 32-bit MicroPackaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 |
auf Bestellung 4759 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11U24FHI33/301, | NXP Semiconductors |
Description: LPC11U24 - Scalable 32-bit MicroPackaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 26 |
auf Bestellung 15263 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11U34FHN33/311, | NXP Semiconductors |
Description: IC MCU 32BIT 40KB FLASH 32HVQFNPackaging: Bulk Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 40KB (40K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
auf Bestellung 504 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11U35FET48/501, | NXP Semiconductors |
Description: IC MCU 32BIT 64KB FLASH 48TFBGAPackaging: Bulk Package / Case: 48-TFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-TFBGA (4.5x4.5) Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 15316 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11U66JBD48E | NXP Semiconductors |
Description: LPC11U66 - Scalable 32-bit MicroPackaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 8x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 34 |
auf Bestellung 87 Stücke: Lieferzeit 10-14 Tag (e) |
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JN5168-001-M00Z | NXP Semiconductors |
Description: RF TXRX MOD 802.15.4 TH SMDPackage / Case: 40-VFQFN Exposed Pad Packaging: Bulk Serial Interfaces: I2C, SPI, UART RF Family/Standard: 802.15.4 Modulation: O-QPSK Antenna Type: Integrated, Trace Current - Transmitting: 15.3mA Current - Receiving: 17mA Protocol: Zigbee® Power - Output: 2.5dBm Voltage - Supply: 2V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -95dBm |
auf Bestellung 417 Stücke: Lieferzeit 10-14 Tag (e) |
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| AFV10700HR5 | NXP Semiconductors |
Description: RF MOSFET LDMOS 52V NI780Current - Test: 100 mA Voltage - Test: 52 V Voltage - Rated: 105 V Supplier Device Package: NI-780-4 Technology: LDMOS (Dual) Gain: 19.2dB Power - Output: 700W Configuration: 2 N-Channel Frequency: 960MHz ~ 1.215GHz Mounting Type: Chassis Mount Current Rating (Amps): 1µA Package / Case: NI-780-4 Packaging: Bulk |
auf Bestellung 237 Stücke: Lieferzeit 10-14 Tag (e) |
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BF1100R,215 | NXP Semiconductors |
Description: RF MOSFET 9V SOT143RPackaging: Bulk Package / Case: SOT-143R Current Rating (Amps): 30mA Mounting Type: Surface Mount Frequency: 800MHz Configuration: N-Channel Dual Gate Technology: MOSFET (Metal Oxide) Noise Figure: 2dB Supplier Device Package: SOT-143R Voltage - Rated: 14 V Voltage - Test: 9 V Current - Test: 10 mA |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA18273HN/C1,518 | NXP Semiconductors |
Description: IC SILICON TUNER HYBRID 40HVQFNPackaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.3V ~ 3.6V Applications: Professional Video Standards: DVB-T2, DVB-C2 Supplier Device Package: 40-HVQFN (6x6) Control Interface: I2C |
auf Bestellung 218821 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9306GF,115 | NXP Semiconductors |
Description: IC XLTR VL BIDIR 8-XSON/SOT1089Packaging: Bulk Features: Auto-Direction Sensing Package / Case: 8-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Supplier Device Package: 8-XSON, SOT1089 (1.35x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Number of Circuits: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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BC857CMB,315 | NXP Semiconductors |
Description: TRANS PNP 45V 0.1A DFN1006B-3Packaging: Bulk Package / Case: 3-XFDFN Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V Frequency - Transition: 100MHz Supplier Device Package: DFN1006B-3 Grade: Automotive Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 250 mW Qualification: AEC-Q101 |
auf Bestellung 133179 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1055T/C,512 | NXP Semiconductors |
Description: IC TRANSCEIVER HALF 1/1 14SOPackaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 14-SO Duplex: Half |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| LPC54018J2MET180E | NXP Semiconductors |
Description: LPC54018 - ARM Cortex-M4, BoschSpeed: 180MHz Mounting Type: Surface Mount Package / Case: 180-TFBGA Packaging: Bulk Number of I/O: 137 Supplier Device Package: 180-TFBGA (12x12) Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 12x12b SAR Core Processor: ARM® Cortex®-M4 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 360K x 8 Program Memory Size: 2MB (2M x 8) |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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BZV85-C6V2,133 | NXP Semiconductors |
Description: DIODE ZENER 6.2V 1W DO41Tolerance: ±5% Packaging: Bulk Package / Case: DO-204AL, DO-41, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 200°C Voltage - Zener (Nom) (Vz): 6.2 V Impedance (Max) (Zzt): 4 Ohms Supplier Device Package: DO-41 Power - Max: 1 W Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Current - Reverse Leakage @ Vr: 2 µA @ 3 V |
auf Bestellung 96214 Stücke: Lieferzeit 10-14 Tag (e) |
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| CBT3306D,112 |
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Hersteller: NXP Semiconductors
Description: C3306 - NOW NEXPERIA CBT3306D -
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SO
Description: C3306 - NOW NEXPERIA CBT3306D -
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SO
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 952+ | 0.64 EUR |
| 74LV00DB,118 |
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auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1803+ | 0.35 EUR |
| 74HCT163D,653 |
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auf Bestellung 6805 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1622+ | 0.38 EUR |
| PCMF1USB30Z |
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auf Bestellung 20495 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1998+ | 0.3 EUR |
| PZU20BA,115 |
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Hersteller: NXP Semiconductors
Description: DIODE ZENER 20V 320MW SOD323
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
Description: DIODE ZENER 20V 320MW SOD323
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
auf Bestellung 48000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12488+ | 0.04 EUR |
| PZU20B1A,115 |
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Hersteller: NXP Semiconductors
Description: DIODE ZENER 20V 320MW SOD323
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 320 mW
Supplier Device Package: SOD-323
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 20 V
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Tolerance: ±2%
Packaging: Bulk
Description: DIODE ZENER 20V 320MW SOD323
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 320 mW
Supplier Device Package: SOD-323
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 20 V
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Tolerance: ±2%
Packaging: Bulk
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 15000+ | 0.04 EUR |
| PZU20B2,115 |
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Hersteller: NXP Semiconductors
Description: DIODE ZENER 20V 310MW SOD323F
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 310 mW
Supplier Device Package: SOD-323F
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 20 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-90, SOD-323F
Tolerance: ±2%
Packaging: Bulk
Description: DIODE ZENER 20V 310MW SOD323F
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 310 mW
Supplier Device Package: SOD-323F
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 20 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-90, SOD-323F
Tolerance: ±2%
Packaging: Bulk
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10804+ | 0.061 EUR |
| MPC8545VJATGD |
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Hersteller: NXP Semiconductors
Description: IC MPU MPC85XX 1.2GHZ 783BGA
Packaging: Bulk
Package / Case: 783-BBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-PBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: AES, Cryptography, Kasumi, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, RapidIO
Description: IC MPU MPC85XX 1.2GHZ 783BGA
Packaging: Bulk
Package / Case: 783-BBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-PBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: AES, Cryptography, Kasumi, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, RapidIO
auf Bestellung 118 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 441.73 EUR |
| SCC2698BC1A84,512 |
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Hersteller: NXP Semiconductors
Description: IC UART OCTAL ENHANCED 84-PLCC
With Modem Control: Yes
With False Start Bit Detection: Yes
With Auto Flow Control: Yes
Supplier Device Package: 84-PLCC (29.26x29.26)
Protocol: RS485
Voltage - Supply: 5V
Mounting Type: Surface Mount
Number of Channels: 8
Package / Case: 84-LCC (J-Lead)
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Bulk
Description: IC UART OCTAL ENHANCED 84-PLCC
With Modem Control: Yes
With False Start Bit Detection: Yes
With Auto Flow Control: Yes
Supplier Device Package: 84-PLCC (29.26x29.26)
Protocol: RS485
Voltage - Supply: 5V
Mounting Type: Surface Mount
Number of Channels: 8
Package / Case: 84-LCC (J-Lead)
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Bulk
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9+ | 62.81 EUR |
| MFRC53101T/0FE,112 |
auf Bestellung 55 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 18+ | 30.19 EUR |
| PMEG6010ESBYL |
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Hersteller: NXP Semiconductors
Description: DIODE SCHOTTKY 60V 1A DSN1006-2
Current - Reverse Leakage @ Vr: 30 µA @ 60 V
Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 60 V
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: DSN1006-2
Current - Average Rectified (Io): 1A
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Technology: Schottky
Reverse Recovery Time (trr): 2.4 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: 2-XDFN
Packaging: Bulk
Description: DIODE SCHOTTKY 60V 1A DSN1006-2
Current - Reverse Leakage @ Vr: 30 µA @ 60 V
Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 60 V
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: DSN1006-2
Current - Average Rectified (Io): 1A
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Technology: Schottky
Reverse Recovery Time (trr): 2.4 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: 2-XDFN
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX884-C12,315 |
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Hersteller: NXP Semiconductors
Description: DIODE ZENER 12V 250MW DFN1006-2
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Supplier Device Package: DFN1006-2
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-882
Tolerance: ±5%
Packaging: Bulk
Description: DIODE ZENER 12V 250MW DFN1006-2
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Supplier Device Package: DFN1006-2
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-882
Tolerance: ±5%
Packaging: Bulk
auf Bestellung 18159 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 18159+ | 0.04 EUR |
| BFG505/X,215 |
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Hersteller: NXP Semiconductors
Description: RF TRANS NPN 15V 9GHZ SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 18mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz
Supplier Device Package: SOT-143B
Description: RF TRANS NPN 15V 9GHZ SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 18mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz
Supplier Device Package: SOT-143B
auf Bestellung 4610 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1135+ | 0.48 EUR |
| PBSS5230QAZ |
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Hersteller: NXP Semiconductors
Description: TRANS PNP 30V 2A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 210mV @ 50mA, 1A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V
Frequency - Transition: 170MHz
Supplier Device Package: DFN1010D-3
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 325 mW
Description: TRANS PNP 30V 2A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 210mV @ 50mA, 1A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V
Frequency - Transition: 170MHz
Supplier Device Package: DFN1010D-3
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 325 mW
auf Bestellung 554308 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4691+ | 0.12 EUR |
| TDA3664AT/N1,118 |
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Hersteller: NXP Semiconductors
Description: IC REG LINEAR 5V 100MA 8-SO
Operating Temperature: -40°C ~ 125°C
Current - Output: 100mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Current - Quiescent (Iq): 30 µA
Output Configuration: Positive
Current - Supply (Max): 2.5 mA
Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage
Voltage Dropout (Max): 0.3V @ 50mA
PSRR: 60dB (120Hz)
Voltage - Output (Min/Fixed): 5V
Supplier Device Package: 8-SO
Number of Regulators: 1
Voltage - Input (Max): 45V
Description: IC REG LINEAR 5V 100MA 8-SO
Operating Temperature: -40°C ~ 125°C
Current - Output: 100mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Current - Quiescent (Iq): 30 µA
Output Configuration: Positive
Current - Supply (Max): 2.5 mA
Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage
Voltage Dropout (Max): 0.3V @ 50mA
PSRR: 60dB (120Hz)
Voltage - Output (Min/Fixed): 5V
Supplier Device Package: 8-SO
Number of Regulators: 1
Voltage - Input (Max): 45V
auf Bestellung 59 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 59+ | 9.1 EUR |
| 74AUP3G17GTX |
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auf Bestellung 4973 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2565+ | 0.23 EUR |
| MC33886PVWR2 |
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Hersteller: NXP Semiconductors
Description: 5.0 A H-Bridge
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 20-HSOP
Voltage - Load: 5V ~ 40V
Technology: CMOS
Applications: General Purpose
Voltage - Supply: 5V ~ 40V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 125°C (TA)
Interface: Parallel
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Packaging: Bulk
Description: 5.0 A H-Bridge
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 20-HSOP
Voltage - Load: 5V ~ 40V
Technology: CMOS
Applications: General Purpose
Voltage - Supply: 5V ~ 40V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 125°C (TA)
Interface: Parallel
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA1733MT/N2,118 |
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Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 91.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Power (Watts): 75 W
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 91.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Power (Watts): 75 W
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 519+ | 1.06 EUR |
| TEA1703T/N1,118 |
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Hersteller: NXP Semiconductors
Description: IC CTRLR SMPS GREEN OVP 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V ~ 30V
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 30V
Applications: Secondary-Side Controller
Supplier Device Package: 8-SO
Current - Supply: 30 µA
DigiKey Programmable: Not Verified
Description: IC CTRLR SMPS GREEN OVP 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V ~ 30V
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 30V
Applications: Secondary-Side Controller
Supplier Device Package: 8-SO
Current - Supply: 30 µA
DigiKey Programmable: Not Verified
auf Bestellung 9883 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 404+ | 1.36 EUR |
| TEA1750T/N1,518 |
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Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 125kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Power (Watts): 250 W
Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 125kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Power (Watts): 250 W
auf Bestellung 4502 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 202+ | 2.74 EUR |
| 74LVC1G58GM,132 |
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auf Bestellung 1069960 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1625+ | 0.32 EUR |
| CGY1047,112 |
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Hersteller: NXP Semiconductors
Description: NARROW BAND HIGH POWER AMPLIFIER
Current - Supply: 250 mA
Number of Circuits: 1
Supplier Device Package: SOT115J
Applications: CATV
Mounting Type: Chassis Mount
Output Type: Push-Pull
Package / Case: SOT-115J
Packaging: Tube
Description: NARROW BAND HIGH POWER AMPLIFIER
Current - Supply: 250 mA
Number of Circuits: 1
Supplier Device Package: SOT115J
Applications: CATV
Mounting Type: Chassis Mount
Output Type: Push-Pull
Package / Case: SOT-115J
Packaging: Tube
auf Bestellung 2169 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 55.48 EUR |
| PMXB350UPEZ |
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Hersteller: NXP Semiconductors
Description: NEXPERIA PMXB350UPE - 20 V, P-CH
Input Capacitance (Ciss) (Max) @ Vds: 116 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 2.3 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Supplier Device Package: DFN1010D-3
Vgs(th) (Max) @ Id: 950mV @ 250µA
Power Dissipation (Max): 360mW (Ta), 5.68W (Tc)
Rds On (Max) @ Id, Vgs: 447mOhm @ 1.2A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 1.2A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Packaging: Bulk
Description: NEXPERIA PMXB350UPE - 20 V, P-CH
Input Capacitance (Ciss) (Max) @ Vds: 116 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 2.3 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Supplier Device Package: DFN1010D-3
Vgs(th) (Max) @ Id: 950mV @ 250µA
Power Dissipation (Max): 360mW (Ta), 5.68W (Tc)
Rds On (Max) @ Id, Vgs: 447mOhm @ 1.2A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 1.2A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Packaging: Bulk
auf Bestellung 659217 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3703+ | 0.14 EUR |
| MPC8377VRAGDA |
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Hersteller: NXP Semiconductors
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
auf Bestellung 382 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 143.13 EUR |
| MPC8536EBVJAULA |
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Hersteller: NXP Semiconductors
Description: IC MPU 1.333GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU 1.333GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 550.61 EUR |
| LPC11U14FET48/201, |
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Hersteller: NXP Semiconductors
Description: LPC11U14- Scalable Entry Level 3
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
Description: LPC11U14- Scalable Entry Level 3
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
auf Bestellung 861 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 103+ | 5.26 EUR |
| LPC11U13FBD48/201, |
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Hersteller: NXP Semiconductors
Description: LPC11U13 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: LPC11U13 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
auf Bestellung 1095 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 112+ | 4.84 EUR |
| TDA10025HN/C1,518 |
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Hersteller: NXP Semiconductors
Description: IC DEMODULATOR DUAL 48-HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Processor
Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
Description: IC DEMODULATOR DUAL 48-HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Processor
Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 117+ | 4.56 EUR |
| LPC4076FBD144E |
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Hersteller: NXP Semiconductors
Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 109
Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 109
auf Bestellung 624 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 25+ | 21.72 EUR |
| BC54-10PASX |
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Hersteller: NXP Semiconductors
Description: TRANS NPN 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 180MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
Description: TRANS NPN 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 180MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
auf Bestellung 146990 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3904+ | 0.14 EUR |
| MC9S08GT8ACFDE |
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Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 8KB FLASH 48MAPQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-MAPQFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 48MAPQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-MAPQFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 393 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 60+ | 9.03 EUR |
| MCF51AC128CCFGE |
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Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50.33MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50.33MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 125 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 24+ | 22.94 EUR |
| AFT27S010NT1 |
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Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Bulk
Package / Case: PLD-1.5W
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 728MHz ~ 3.6GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Bulk
Package / Case: PLD-1.5W
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 728MHz ~ 3.6GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MKM33Z64CLH5 |
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Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR, 24b Sigma-Delta
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR, 24b Sigma-Delta
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 89+ | 6.02 EUR |
| TEA1738GT/N1,118 |
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Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 118kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature
Voltage - Start Up: 13.2 V
Power (Watts): 75 W
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 118kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature
Voltage - Start Up: 13.2 V
Power (Watts): 75 W
auf Bestellung 3861 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 466+ | 1.18 EUR |
| BAP1321-03,115 |
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Hersteller: NXP Semiconductors
Description: RF DIODE PIN 60V 500MW SOD-323
Power Dissipation (Max): 500 mW
Current - Max: 100 mA
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 60V
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SC-76, SOD-323
Packaging: Bulk
Description: RF DIODE PIN 60V 500MW SOD-323
Power Dissipation (Max): 500 mW
Current - Max: 100 mA
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 60V
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SC-76, SOD-323
Packaging: Bulk
auf Bestellung 9190 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2597+ | 0.21 EUR |
| HT2MOA4S20/E/3/RJ |
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Hersteller: NXP Semiconductors
Description: HITAG 2 transponder IC
Packaging: Bulk
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -55°C ~ 140°C
Voltage - Supply: 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: PLLMC
Description: HITAG 2 transponder IC
Packaging: Bulk
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -55°C ~ 140°C
Voltage - Supply: 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: PLLMC
auf Bestellung 33666 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 175+ | 3.03 EUR |
| 74AUP3G34GDH |
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auf Bestellung 2928 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1457+ | 0.38 EUR |
| 74AUP3G34GNX |
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auf Bestellung 69900 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1139+ | 0.46 EUR |
| MC9S08JM16CLD |
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Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
auf Bestellung 2327 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 73+ | 7.39 EUR |
| MCIMX6Q5EZK08AD |
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Hersteller: NXP Semiconductors
Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Bulk
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Bulk
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 2208 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 184.96 EUR |
| PMEG4002ESFYL |
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Hersteller: NXP Semiconductors
Description: DIODE SCHOTTK 40V 200MA DSN06032
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 1.28 ns
Technology: Schottky
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 600 mV @ 200 mA
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
Description: DIODE SCHOTTK 40V 200MA DSN06032
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 1.28 ns
Technology: Schottky
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 600 mV @ 200 mA
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
auf Bestellung 1278000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2497+ | 0.21 EUR |
| MCIMX6X3EVK10AB |
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Hersteller: NXP Semiconductors
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Bulk
Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: DDR3, DDR3L, LPDDR2
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1GHz, 227MHz
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Bulk
Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: DDR3, DDR3L, LPDDR2
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1GHz, 227MHz
auf Bestellung 139 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 45.18 EUR |
| MCIMX6X3EVN10AB |
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Hersteller: NXP Semiconductors
Description: IC MPU 227MHZ/1GHZ 400MAPBGA
Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: DDR3, DDR3L, LPDDR2
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Bulk
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Description: IC MPU 227MHZ/1GHZ 400MAPBGA
Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: DDR3, DDR3L, LPDDR2
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Bulk
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
auf Bestellung 207 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 45.65 EUR |
| 74HCT4538D,112 |
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auf Bestellung 7143 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 281+ | 1.96 EUR |
| LPC11U35FBD64/401, |
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Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 40841 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 73+ | 7.44 EUR |
| LPC11U37FBD64/501, |
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Hersteller: NXP Semiconductors
Description: LPC11U37 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Description: LPC11U37 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
auf Bestellung 4759 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 64+ | 8.5 EUR |
| LPC11U24FHI33/301, |
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Hersteller: NXP Semiconductors
Description: LPC11U24 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
Description: LPC11U24 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
auf Bestellung 15263 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 98+ | 5.53 EUR |
| LPC11U34FHN33/311, |
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Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 40KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 40KB (40K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 40KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 40KB (40K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 504 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 94+ | 5.77 EUR |
| LPC11U35FET48/501, |
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Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 64KB FLASH 48TFBGA
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48TFBGA
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 15316 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 73+ | 7.44 EUR |
| LPC11U66JBD48E |
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Hersteller: NXP Semiconductors
Description: LPC11U66 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Description: LPC11U66 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
auf Bestellung 87 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 73+ | 7.44 EUR |
| JN5168-001-M00Z |
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Hersteller: NXP Semiconductors
Description: RF TXRX MOD 802.15.4 TH SMD
Package / Case: 40-VFQFN Exposed Pad
Packaging: Bulk
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
Antenna Type: Integrated, Trace
Current - Transmitting: 15.3mA
Current - Receiving: 17mA
Protocol: Zigbee®
Power - Output: 2.5dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -95dBm
Description: RF TXRX MOD 802.15.4 TH SMD
Package / Case: 40-VFQFN Exposed Pad
Packaging: Bulk
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
Antenna Type: Integrated, Trace
Current - Transmitting: 15.3mA
Current - Receiving: 17mA
Protocol: Zigbee®
Power - Output: 2.5dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -95dBm
auf Bestellung 417 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 22+ | 24.6 EUR |
| AFV10700HR5 |
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Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 52V NI780
Current - Test: 100 mA
Voltage - Test: 52 V
Voltage - Rated: 105 V
Supplier Device Package: NI-780-4
Technology: LDMOS (Dual)
Gain: 19.2dB
Power - Output: 700W
Configuration: 2 N-Channel
Frequency: 960MHz ~ 1.215GHz
Mounting Type: Chassis Mount
Current Rating (Amps): 1µA
Package / Case: NI-780-4
Packaging: Bulk
Description: RF MOSFET LDMOS 52V NI780
Current - Test: 100 mA
Voltage - Test: 52 V
Voltage - Rated: 105 V
Supplier Device Package: NI-780-4
Technology: LDMOS (Dual)
Gain: 19.2dB
Power - Output: 700W
Configuration: 2 N-Channel
Frequency: 960MHz ~ 1.215GHz
Mounting Type: Chassis Mount
Current Rating (Amps): 1µA
Package / Case: NI-780-4
Packaging: Bulk
auf Bestellung 237 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1259.72 EUR |
| BF1100R,215 |
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Hersteller: NXP Semiconductors
Description: RF MOSFET 9V SOT143R
Packaging: Bulk
Package / Case: SOT-143R
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: SOT-143R
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
Description: RF MOSFET 9V SOT143R
Packaging: Bulk
Package / Case: SOT-143R
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: SOT-143R
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1069+ | 0.5 EUR |
| TDA18273HN/C1,518 |
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Hersteller: NXP Semiconductors
Description: IC SILICON TUNER HYBRID 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Professional Video
Standards: DVB-T2, DVB-C2
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I2C
Description: IC SILICON TUNER HYBRID 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Professional Video
Standards: DVB-T2, DVB-C2
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I2C
auf Bestellung 218821 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 170+ | 3.22 EUR |
| PCA9306GF,115 |
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Hersteller: NXP Semiconductors
Description: IC XLTR VL BIDIR 8-XSON/SOT1089
Packaging: Bulk
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
Description: IC XLTR VL BIDIR 8-XSON/SOT1089
Packaging: Bulk
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BC857CMB,315 |
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Hersteller: NXP Semiconductors
Description: TRANS PNP 45V 0.1A DFN1006B-3
Packaging: Bulk
Package / Case: 3-XFDFN
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 250 mW
Qualification: AEC-Q101
Description: TRANS PNP 45V 0.1A DFN1006B-3
Packaging: Bulk
Package / Case: 3-XFDFN
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 250 mW
Qualification: AEC-Q101
auf Bestellung 133179 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3980+ | 0.14 EUR |
| TJA1055T/C,512 |
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Hersteller: NXP Semiconductors
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC54018J2MET180E |
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Hersteller: NXP Semiconductors
Description: LPC54018 - ARM Cortex-M4, Bosch
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Bulk
Number of I/O: 137
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Program Memory Size: 2MB (2M x 8)
Description: LPC54018 - ARM Cortex-M4, Bosch
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Bulk
Number of I/O: 137
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Program Memory Size: 2MB (2M x 8)
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9+ | 60.29 EUR |
| BZV85-C6V2,133 |
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Hersteller: NXP Semiconductors
Description: DIODE ZENER 6.2V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Description: DIODE ZENER 6.2V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
auf Bestellung 96214 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2844+ | 0.19 EUR |










































