Produkte > NXP SEMICONDUCTORS > Alle Produkte des Herstellers NXP SEMICONDUCTORS (69065) > Seite 40 nach 1152
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PDTC114TMB315 | NXP Semiconductors |
Description: TRANS PREBIASPackaging: Bulk Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V Supplier Device Package: DFN1006B-3 Grade: Automotive Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Frequency - Transition: 230 MHz Resistor - Base (R1): 10 kOhms Qualification: AEC-Q101 |
auf Bestellung 276400 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF7952LTT/M1CC15, | NXP Semiconductors |
Description: PCF7952LTT - IMMO ACTICFeatures: RSSI Equipped Packaging: Bulk Package / Case: 24-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Memory Size: 512B RAM, 16kB EEPROM, 8kB ROM Modulation or Protocol: UHF Applications: Remote Keyless Entry Supplier Device Package: 24-TSSOP DigiKey Programmable: Not Verified |
auf Bestellung 29944 Stücke: Lieferzeit 10-14 Tag (e) |
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| MRFX600GSR5 | NXP Semiconductors |
Description: RF MOSFET LDMOS 65V NI780Packaging: Bulk Package / Case: NI-780GS-4L Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 1.8MHz ~ 400MHz Configuration: 2 N-Channel Power - Output: 600W Gain: 26.4dB Technology: LDMOS (Dual) Supplier Device Package: NI-780GS-4L Voltage - Rated: 179 V Voltage - Test: 65 V Current - Test: 100 mA |
auf Bestellung 100 Stücke: Lieferzeit 10-14 Tag (e) |
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| MSC8156SAG1000B | NXP Semiconductors |
Description: Digital Signal Processor, 32-BitPackaging: Bulk Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Type: SC3850 Six Core Operating Temperature: 0°C ~ 105°C (TJ) Non-Volatile Memory: ROM (96KB) On-Chip RAM: 1.03125MB Voltage - I/O: 2.5V Voltage - Core: 1V Clock Rate: 1GHz Supplier Device Package: 783-FCPBGA (29x29) |
auf Bestellung 307 Stücke: Lieferzeit 10-14 Tag (e) |
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PUMB24,115 | NXP Semiconductors |
Description: NEXPERIA PUMB24 - SMALL SIGNAL BPackaging: Bulk Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Transistor Type: 2 PNP - Pre-Biased (Dual) Power - Max: 300mW Current - Collector (Ic) (Max): 20mA Voltage - Collector Emitter Breakdown (Max): 50V Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V Resistor - Base (R1): 100kOhms Resistor - Emitter Base (R2): 100kOhms Supplier Device Package: 6-TSSOP |
auf Bestellung 365303 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMD19,115 | NXP Semiconductors |
Description: NEXPERIA PEMD19 - SMALL SIGNAL BPackaging: Bulk Package / Case: SOT-563, SOT-666 Mounting Type: Surface Mount Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual) Power - Max: 300mW Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V Resistor - Base (R1): 22kOhms Supplier Device Package: SOT-666 |
auf Bestellung 12000 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMB18,115 | NXP Semiconductors |
Description: NEXPERIA PEMB18 - SMALL SIGNAL BPackaging: Bulk Package / Case: SOT-563, SOT-666 Mounting Type: Surface Mount Transistor Type: 2 PNP - Pre-Biased (Dual) Power - Max: 300mW Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V Resistor - Base (R1): 4.7kOhms Resistor - Emitter Base (R2): 10kOhms Supplier Device Package: SOT-666 |
auf Bestellung 12000 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMB16,115 | NXP Semiconductors |
Description: NEXPERIA PEMB16 - SMALL SIGNAL BPackaging: Bulk Package / Case: SOT-563, SOT-666 Mounting Type: Surface Mount Transistor Type: 2 PNP - Pre-Biased (Dual) Power - Max: 300mW Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V Resistor - Base (R1): 22kOhms Resistor - Emitter Base (R2): 47kOhms Supplier Device Package: SOT-666 |
auf Bestellung 12000 Stücke: Lieferzeit 10-14 Tag (e) |
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PESD3V3C1BSF,315 | NXP Semiconductors |
Description: NOW NEXPERIA PESD3V3C1B TRANS VOPackaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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MC8640VU1067NE557 | NXP Semiconductors |
Description: MPC8640 - MICROPROCESSORS (MPU)Packaging: Bulk DigiKey Programmable: Not Verified |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74ALVC08D,112 | NXP Semiconductors |
Description: IC GATE AND 4CH 2-INP 14SOPackaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: AND Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 3.6V Current - Output High, Low: 24mA, 24mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 1.7V ~ 2V Input Logic Level - Low: 0.7V ~ 0.8V Max Propagation Delay @ V, Max CL: 2.9ns @ 3.3V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 20 µA |
auf Bestellung 5200 Stücke: Lieferzeit 10-14 Tag (e) |
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| MPC860DTCVR50D4 | NXP Semiconductors |
Description: IC MPU MPC86XX 50MHZ 357BGAPackaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 95°C (TJ) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
auf Bestellung 572 Stücke: Lieferzeit 10-14 Tag (e) |
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| MPC860TCVR50D4 | NXP Semiconductors |
Description: IC MPU MPC86XX 50MHZ 357BGAPackaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 95°C (TJ) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
auf Bestellung 445 Stücke: Lieferzeit 10-14 Tag (e) |
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| MPC860TCZQ66D4 | NXP Semiconductors |
Description: IC MPU MPC86XX 66MHZ 357BGA Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 95°C (TJ) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
auf Bestellung 4280 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVT16244BDGG,112 | NXP Semiconductors |
Description: IC BUFF NON-INVERT 3.6V 48TSSOPPackaging: Bulk Package / Case: 48-TFSOP (0.240", 6.10mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 48-TSSOP |
auf Bestellung 1777 Stücke: Lieferzeit 10-14 Tag (e) |
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| PTN5110NDHQZ | NXP Semiconductors |
Description: PTN5110NDHQ - USB PD TCPC PHY ICPackaging: Bulk Package / Case: 16-XFQFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Voltage - Supply: 2.7V ~ 5.5V Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet Supplier Device Package: 16-HX2QFN (2.6x2.6) |
auf Bestellung 3113 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC11DB,118 | NXP Semiconductors |
Description: IC GATE ANDPackaging: Bulk |
auf Bestellung 3853 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC11DB,112 | NXP Semiconductors |
Description: IC GATE ANDPackaging: Bulk |
auf Bestellung 3432 Stücke: Lieferzeit 10-14 Tag (e) |
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TYN16X-600CT127 | NXP Semiconductors |
Description: NOW WEEN - TYN16X-600CT - SILICOPackaging: Bulk Package / Case: TO-220-3 Full Pack, Isolated Tab Mounting Type: Through Hole SCR Type: Standard Recovery Operating Temperature: 150°C (TJ) Current - Hold (Ih) (Max): 40 mA Current - Gate Trigger (Igt) (Max): 15 mA Current - Non Rep. Surge 50, 60Hz (Itsm): 180A, 198A Current - On State (It (AV)) (Max): 10.2 A Voltage - Gate Trigger (Vgt) (Max): 1.3 V Voltage - On State (Vtm) (Max): 1.6 V Current - Off State (Max): 1 mA Supplier Device Package: TO-220F Current - On State (It (RMS)) (Max): 16 A Voltage - Off State: 600 V |
auf Bestellung 283000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC2G02GF,115 | NXP Semiconductors |
Description: IC GATE NORPackaging: Bulk |
auf Bestellung 2040 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1G27GF,132 | NXP Semiconductors |
Description: IC GATE NORPackaging: Bulk |
auf Bestellung 94890 Stücke: Lieferzeit 10-14 Tag (e) |
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| P4080NSN7PNAC | NXP Semiconductors |
Description: IC MPU QORIQ P4 1.5GHZ 1295BGA Packaging: Bulk Package / Case: 1295-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500mc Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 1295-FCPBGA (37.5x37.5) Ethernet: 1Gbps (8), 10Gbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 8 Core, 32-Bit Co-Processors/DSP: Security; SEC 4.0 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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| MF1SEP1031DA4/03KJ | NXP Semiconductors |
Description: MF1SEP1031DA4 - MIFARE Plus SE,Packaging: Bulk Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Interface: UART Type: RFID Transponder Operating Temperature: -25°C ~ 70°C (TA) Standards: ISO 14443 Supplier Device Package: PLLMC |
auf Bestellung 249588 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC56F83769AVLLA | NXP Semiconductors |
Description: MC56F837XX - Performance Level DPackaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 20x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, I2C, LINbus, SCI, SPI, USB Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 82 |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA18254AHN/C1,518 | NXP Semiconductors |
Description: TDA18254AH - CABLE SILICON TUNERPackaging: Bulk Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.3V Applications: Consumer Video Supplier Device Package: 48-HVQFN (7x7) Control Interface: I2C |
auf Bestellung 287950 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT253D,652 | NXP Semiconductors |
Description: NEXPERIA 74HCT253D - MULTIPLEXERPackaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 6mA, 6mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
auf Bestellung 25486 Stücke: Lieferzeit 10-14 Tag (e) |
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MC908AP16ACFAE | NXP Semiconductors |
Description: IC MCU 8BIT 16KB FLASH 48LQFP Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: M68HC08 Data Converters: A/D 8x10b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LED, LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Number of I/O: 31 DigiKey Programmable: Not Verified |
auf Bestellung 582 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC908LJ12CFUER | NXP Semiconductors |
Description: IC MCU 8BIT 12KB FLASH 64QFPPackaging: Bulk Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 12KB (12K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: M68HC08 Data Converters: A/D 6x10b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: I2C, IRSCI, SPI Peripherals: LCD, LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 1330 Stücke: Lieferzeit 10-14 Tag (e) |
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TDZ5V6J135 | NXP Semiconductors |
Description: TDZ5V6J - GENERAL-PURPOSE ZENER Tolerance: ±1.96% Packaging: Bulk Package / Case: SC-90, SOD-323F Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 5.6 V Impedance (Max) (Zzt): 40 Ohms Supplier Device Package: SOD-323F Grade: Automotive Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 10 µA @ 2.5 V Qualification: AEC-Q101 |
auf Bestellung 18900 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC8640TVJ1067NE557 | NXP Semiconductors |
Description: RISC Microprocessor, 32-Bit, Pow Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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LPC2926FBD144,551 | NXP Semiconductors |
Description: LPC2900 - Arm9, 32-Bit RISC MicrPackaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 125MHz Program Memory Size: 256KB (256K x 8) RAM Size: 56K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM968E-S Data Converters: A/D 24x10b SAR Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 104 |
auf Bestellung 208 Stücke: Lieferzeit 10-14 Tag (e) |
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| MPC8548VJAQGD | NXP Semiconductors |
Description: IC MPU 1GHZ 783FCPBGAPackaging: Bulk Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: AES, Cryptography, Kasumi, Random Number Generator |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC40105D,652 | NXP Semiconductors |
Description: IC FIFO 16X4Packaging: Bulk DigiKey Programmable: Not Verified |
auf Bestellung 4426 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC56F8006VWL | NXP Semiconductors |
Description: IC MCU 16BIT 16KB FLASH 28SOICPackaging: Bulk Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 16KB (8K x 16) RAM Size: 1K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 15x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 28-SOIC Number of I/O: 23 DigiKey Programmable: Not Verified |
auf Bestellung 78 Stücke: Lieferzeit 10-14 Tag (e) |
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P83C557E4EFB/215557 | NXP Semiconductors |
Description: P83C557E4EFB/215:5 - Microcontro Packaging: Bulk |
auf Bestellung 330 Stücke: Lieferzeit 10-14 Tag (e) |
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| M86291G12 | NXP Semiconductors |
Description: TEMP MS PART - C2K 900MHz Device Packaging: Bulk Package / Case: 625-BFBGA, FCBGA Mounting Type: Surface Mount Interface: SPI, USB Supplier Device Package: 625-FCPBGA (21x21) |
auf Bestellung 300 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC1830-UK012 | NXP Semiconductors |
Description: LPC1800 - High-Performance Micro Packaging: Bulk |
auf Bestellung 49443 Stücke: Lieferzeit 10-14 Tag (e) |
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| NXH2280UK/C1012 | NXP Semiconductors |
Description: NXH2280UK - Power Distribution S Packaging: Bulk |
auf Bestellung 78000 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC1112FD20/102,52 | NXP Semiconductors |
Description: LPC1112 - Scalable Entry Level 3Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 5x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 20-SO Number of I/O: 16 |
auf Bestellung 190 Stücke: Lieferzeit 10-14 Tag (e) |
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74ALVCH16823DGGS | NXP Semiconductors |
Description: IC FF D-TYPE DUAL 9BIT 56TSSOPPackaging: Bulk Package / Case: 56-TFSOP (0.240", 6.10mm Width) Output Type: Tri-State Mounting Type: Surface Mount Number of Elements: 2 Function: Master Reset Type: D-Type Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V Current - Output High, Low: 24mA, 24mA Trigger Type: Positive Edge Clock Frequency: 350 MHz Input Capacitance: 5 pF Supplier Device Package: 56-TSSOP Max Propagation Delay @ V, Max CL: 3.7ns @ 3.3V, 50pF Number of Bits per Element: 9 |
auf Bestellung 875 Stücke: Lieferzeit 10-14 Tag (e) |
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| BLF888BS,112 | NXP Semiconductors |
Description: RF MOSFET LDMOS 50V SOT539BPackaging: Bulk Package / Case: SOT-539B Current Rating (Amps): 2.8µA Mounting Type: Chassis Mount Frequency: 470MHz ~ 860MHz Configuration: 2 N-Channel Power - Output: 650W Gain: 21dB Technology: LDMOS (Dual), Common Source Supplier Device Package: SOT539B Voltage - Rated: 104 V Voltage - Test: 50 V Current - Test: 1.3 A |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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TEF7000HN/V2S,557 | NXP Semiconductors |
Description: TEF7000HN - DIGITAL LOW-IF CAR RPackaging: Bulk |
auf Bestellung 697 Stücke: Lieferzeit 10-14 Tag (e) |
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TEF7000HN/V3,557 | NXP Semiconductors |
Description: TEF7000HN - DIGITAL LOW-IF CAR RPackaging: Bulk |
auf Bestellung 7800 Stücke: Lieferzeit 10-14 Tag (e) |
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MM912G634DV1AE | NXP Semiconductors |
Description: MM912G634 - Integrated HCS12 Bas Packaging: Bulk Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.25V ~ 5.25V Controller Series: HCS12 Program Memory Type: FLASH (48kB) Supplier Device Package: 48-LQFP (7x7) Number of I/O: 9 |
auf Bestellung 235 Stücke: Lieferzeit 10-14 Tag (e) |
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MM912H634DV1AE | NXP Semiconductors |
Description: MM912H634 - Integrated HCS12 Bas Packaging: Bulk Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Function: Battery Monitor Interface: Serial Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lead Acid Supplier Device Package: 48-HLQFP (7x7) |
auf Bestellung 6985 Stücke: Lieferzeit 10-14 Tag (e) |
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MM912H634DM1AE | NXP Semiconductors |
Description: MM912H634 - INTEGRATED HCS12 BASPackaging: Bulk Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Function: Battery Monitor Interface: Serial Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lead Acid Supplier Device Package: 48-LQFP (7x7) |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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| NX1WP10012 | NXP Semiconductors |
Description: NX1WP10 - Specialized Power Mana Packaging: Bulk Package / Case: 42-UFBGA, WLCSP Mounting Type: Surface Mount Function: Receiver Frequency: 6.78MHz RF Type: General Purpose Secondary Attributes: I²C Interface Supplier Device Package: 42-WLCSP (3.56x3.41) |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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NX3P190UK,012 | NXP Semiconductors |
Description: IC PWR SWITCH HI SIDE LOG 4WLCSPPackaging: Bulk |
auf Bestellung 595151 Stücke: Lieferzeit 10-14 Tag (e) |
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MPF5020AVNA0ES | NXP Semiconductors |
Description: PF5020 - POWER MANAGEMENT IC, PRPackaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 40-HVQFN (6x6) |
auf Bestellung 1958 Stücke: Lieferzeit 10-14 Tag (e) |
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MPF5023AMMA0ES | NXP Semiconductors |
Description: PF5023 - POWER MANAGEMENT IC, PR Packaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 200µA Supplier Device Package: 40-HVQFN (6x6) |
auf Bestellung 2450 Stücke: Lieferzeit 10-14 Tag (e) |
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MPF5023AVNA0ES | NXP Semiconductors |
Description: PF5023 - POWER MANAGEMENT IC, PRPackaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 200µA Supplier Device Package: 40-HVQFN (6x6) |
auf Bestellung 2450 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCIMX507CVK8B | NXP Semiconductors |
Description: IC MPU I.MX50 800MHZ 416MAPBGAPackaging: Bulk Package / Case: 416-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.2V, 1.875V, 2.775V, 3V Supplier Device Package: 416-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR2, LPDDR, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: EPDC, LCD Security Features: Boot Security, Cryptography, Secure JTAG Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART |
auf Bestellung 160 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT154D,653 | NXP Semiconductors |
Description: NEXPERIA 74HCT154D - DECODER/DRIPackaging: Bulk Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Circuit: 1 x 4:16 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 4mA, 4mA Voltage Supply Source: Single Supply Supplier Device Package: 24-SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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PSMN6R0-25YLD115 | NXP Semiconductors |
Description: NEXPERIA PSMN6R0-25YLD - POWER FPackaging: Bulk |
auf Bestellung 9000 Stücke: Lieferzeit 10-14 Tag (e) |
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MCZ33905DD5EK | NXP Semiconductors |
Description: MCZ33905 - SYSTEM BASIS CHIP, POPackaging: Bulk Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Current - Supply: 2.8mA Supplier Device Package: 54-SOIC-EP Grade: Automotive |
auf Bestellung 1182 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK6C3R3-75C,118 | NXP Semiconductors |
Description: NEXPERIA BUK6C3R3 - N-CHANNEL TRPackaging: Bulk Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 181A (Tc) Rds On (Max) @ Id, Vgs: 3.4mOhm @ 90A, 10V Power Dissipation (Max): 300W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: D2PAK-7 Grade: Automotive Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 75 V Gate Charge (Qg) (Max) @ Vgs: 253 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 15800 pF @ 25 V Qualification: AEC-Q101 |
auf Bestellung 480 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC33689DPEWR2 | NXP Semiconductors |
Description: MC33689 - SYSTEM BASIS CHIP, LINPackaging: Bulk Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5.5V ~ 27V Applications: System Basis Chip Current - Supply: 5mA Supplier Device Package: 32-SOIC Grade: Automotive |
auf Bestellung 6475 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTC124EM,315 | NXP Semiconductors |
Description: TRANS PREBIASPackaging: Bulk |
auf Bestellung 1011557 Stücke: Lieferzeit 10-14 Tag (e) |
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S912D60CE1VPVER528 | NXP Semiconductors |
Description: S912D60CE - 16 BIT MICROCONTROLLPackaging: Bulk DigiKey Programmable: Not Verified |
auf Bestellung 150 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC7448HX1700LD | NXP Semiconductors |
Description: IC MPU MPC74XX 1.7GHZ 360FCCBGAPackaging: Bulk Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.7GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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| PDTC114TMB315 |
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Hersteller: NXP Semiconductors
Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Qualification: AEC-Q101
Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Qualification: AEC-Q101
auf Bestellung 276400 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 11225+ | 0.048 EUR |
| PCF7952LTT/M1CC15, |
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Hersteller: NXP Semiconductors
Description: PCF7952LTT - IMMO ACTIC
Features: RSSI Equipped
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512B RAM, 16kB EEPROM, 8kB ROM
Modulation or Protocol: UHF
Applications: Remote Keyless Entry
Supplier Device Package: 24-TSSOP
DigiKey Programmable: Not Verified
Description: PCF7952LTT - IMMO ACTIC
Features: RSSI Equipped
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512B RAM, 16kB EEPROM, 8kB ROM
Modulation or Protocol: UHF
Applications: Remote Keyless Entry
Supplier Device Package: 24-TSSOP
DigiKey Programmable: Not Verified
auf Bestellung 29944 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 54+ | 9.52 EUR |
| MRFX600GSR5 |
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Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 65V NI780
Packaging: Bulk
Package / Case: NI-780GS-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: 2 N-Channel
Power - Output: 600W
Gain: 26.4dB
Technology: LDMOS (Dual)
Supplier Device Package: NI-780GS-4L
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 65V NI780
Packaging: Bulk
Package / Case: NI-780GS-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: 2 N-Channel
Power - Output: 600W
Gain: 26.4dB
Technology: LDMOS (Dual)
Supplier Device Package: NI-780GS-4L
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 228.65 EUR |
| MSC8156SAG1000B |
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Hersteller: NXP Semiconductors
Description: Digital Signal Processor, 32-Bit
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Six Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 1.03125MB
Voltage - I/O: 2.5V
Voltage - Core: 1V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Description: Digital Signal Processor, 32-Bit
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Six Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 1.03125MB
Voltage - I/O: 2.5V
Voltage - Core: 1V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
auf Bestellung 307 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 442.16 EUR |
| PUMB24,115 |
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Hersteller: NXP Semiconductors
Description: NEXPERIA PUMB24 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 20mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Resistor - Base (R1): 100kOhms
Resistor - Emitter Base (R2): 100kOhms
Supplier Device Package: 6-TSSOP
Description: NEXPERIA PUMB24 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 20mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Resistor - Base (R1): 100kOhms
Resistor - Emitter Base (R2): 100kOhms
Supplier Device Package: 6-TSSOP
auf Bestellung 365303 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 11225+ | 0.05 EUR |
| PEMD19,115 |
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Hersteller: NXP Semiconductors
Description: NEXPERIA PEMD19 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Resistor - Base (R1): 22kOhms
Supplier Device Package: SOT-666
Description: NEXPERIA PEMD19 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Resistor - Base (R1): 22kOhms
Supplier Device Package: SOT-666
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 6772+ | 0.066 EUR |
| PEMB18,115 |
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Hersteller: NXP Semiconductors
Description: NEXPERIA PEMB18 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Resistor - Base (R1): 4.7kOhms
Resistor - Emitter Base (R2): 10kOhms
Supplier Device Package: SOT-666
Description: NEXPERIA PEMB18 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Resistor - Base (R1): 4.7kOhms
Resistor - Emitter Base (R2): 10kOhms
Supplier Device Package: SOT-666
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 6772+ | 0.067 EUR |
| PEMB16,115 |
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Hersteller: NXP Semiconductors
Description: NEXPERIA PEMB16 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: SOT-666
Description: NEXPERIA PEMB16 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: SOT-666
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 6772+ | 0.067 EUR |
| MC8640VU1067NE557 |
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Hersteller: NXP Semiconductors
Description: MPC8640 - MICROPROCESSORS (MPU)
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: MPC8640 - MICROPROCESSORS (MPU)
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 481.02 EUR |
| 74ALVC08D,112 |
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Hersteller: NXP Semiconductors
Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2.9ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 20 µA
Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2.9ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 20 µA
auf Bestellung 5200 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 5200+ | 0.16 EUR |
| MPC860DTCVR50D4 |
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Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 572 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 267.78 EUR |
| MPC860TCVR50D4 |
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Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 445 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 305.12 EUR |
| MPC860TCZQ66D4 |
Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC86XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
auf Bestellung 4280 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 409.93 EUR |
| 74LVT16244BDGG,112 |
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Hersteller: NXP Semiconductors
Description: IC BUFF NON-INVERT 3.6V 48TSSOP
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-TSSOP
Description: IC BUFF NON-INVERT 3.6V 48TSSOP
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-TSSOP
auf Bestellung 1777 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 703+ | 0.72 EUR |
| PTN5110NDHQZ |
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Hersteller: NXP Semiconductors
Description: PTN5110NDHQ - USB PD TCPC PHY IC
Packaging: Bulk
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Description: PTN5110NDHQ - USB PD TCPC PHY IC
Packaging: Bulk
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Supplier Device Package: 16-HX2QFN (2.6x2.6)
auf Bestellung 3113 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 211+ | 2.31 EUR |
| 74HC11DB,118 |
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auf Bestellung 3853 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1762+ | 0.28 EUR |
| 74HC11DB,112 |
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auf Bestellung 3432 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1610+ | 0.31 EUR |
| TYN16X-600CT127 |
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Hersteller: NXP Semiconductors
Description: NOW WEEN - TYN16X-600CT - SILICO
Packaging: Bulk
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
SCR Type: Standard Recovery
Operating Temperature: 150°C (TJ)
Current - Hold (Ih) (Max): 40 mA
Current - Gate Trigger (Igt) (Max): 15 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 180A, 198A
Current - On State (It (AV)) (Max): 10.2 A
Voltage - Gate Trigger (Vgt) (Max): 1.3 V
Voltage - On State (Vtm) (Max): 1.6 V
Current - Off State (Max): 1 mA
Supplier Device Package: TO-220F
Current - On State (It (RMS)) (Max): 16 A
Voltage - Off State: 600 V
Description: NOW WEEN - TYN16X-600CT - SILICO
Packaging: Bulk
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
SCR Type: Standard Recovery
Operating Temperature: 150°C (TJ)
Current - Hold (Ih) (Max): 40 mA
Current - Gate Trigger (Igt) (Max): 15 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 180A, 198A
Current - On State (It (AV)) (Max): 10.2 A
Voltage - Gate Trigger (Vgt) (Max): 1.3 V
Voltage - On State (Vtm) (Max): 1.6 V
Current - Off State (Max): 1 mA
Supplier Device Package: TO-220F
Current - On State (It (RMS)) (Max): 16 A
Voltage - Off State: 600 V
auf Bestellung 283000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 859+ | 0.56 EUR |
| 74LVC2G02GF,115 |
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auf Bestellung 2040 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2040+ | 0.27 EUR |
| 74LVC1G27GF,132 |
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auf Bestellung 94890 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3909+ | 0.13 EUR |
| P4080NSN7PNAC |
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ P4 1.5GHZ 1295BGA
Packaging: Bulk
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (8), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.0
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Description: IC MPU QORIQ P4 1.5GHZ 1295BGA
Packaging: Bulk
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (8), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.0
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 1419.14 EUR |
| MF1SEP1031DA4/03KJ |
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Hersteller: NXP Semiconductors
Description: MF1SEP1031DA4 - MIFARE Plus SE,
Packaging: Bulk
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443
Supplier Device Package: PLLMC
Description: MF1SEP1031DA4 - MIFARE Plus SE,
Packaging: Bulk
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443
Supplier Device Package: PLLMC
auf Bestellung 249588 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 959+ | 0.5 EUR |
| MC56F83769AVLLA |
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Hersteller: NXP Semiconductors
Description: MC56F837XX - Performance Level D
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI, USB
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 82
Description: MC56F837XX - Performance Level D
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI, USB
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 82
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 26+ | 19.54 EUR |
| TDA18254AHN/C1,518 |
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Hersteller: NXP Semiconductors
Description: TDA18254AH - CABLE SILICON TUNER
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
Description: TDA18254AH - CABLE SILICON TUNER
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
auf Bestellung 287950 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 154+ | 3.03 EUR |
| 74HCT253D,652 |
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Hersteller: NXP Semiconductors
Description: NEXPERIA 74HCT253D - MULTIPLEXER
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: NEXPERIA 74HCT253D - MULTIPLEXER
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 25486 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1410+ | 0.35 EUR |
| MC908AP16ACFAE |
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
auf Bestellung 582 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 39+ | 12.98 EUR |
| MC908LJ12CFUER |
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Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 12KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 6x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I2C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 12KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 6x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I2C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1330 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 26+ | 19.29 EUR |
| TDZ5V6J135 |
Hersteller: NXP Semiconductors
Description: TDZ5V6J - GENERAL-PURPOSE ZENER
Tolerance: ±1.96%
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOD-323F
Grade: Automotive
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 10 µA @ 2.5 V
Qualification: AEC-Q101
Description: TDZ5V6J - GENERAL-PURPOSE ZENER
Tolerance: ±1.96%
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOD-323F
Grade: Automotive
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 10 µA @ 2.5 V
Qualification: AEC-Q101
auf Bestellung 18900 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 9072+ | 0.05 EUR |
| LPC2926FBD144,551 |
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Hersteller: NXP Semiconductors
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
auf Bestellung 208 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 23+ | 19.92 EUR |
| MPC8548VJAQGD |
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Hersteller: NXP Semiconductors
Description: IC MPU 1GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: AES, Cryptography, Kasumi, Random Number Generator
Description: IC MPU 1GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: AES, Cryptography, Kasumi, Random Number Generator
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 383.38 EUR |
| 74HC40105D,652 |
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Hersteller: NXP Semiconductors
Description: IC FIFO 16X4
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC FIFO 16X4
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 4426 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 612+ | 0.79 EUR |
| MC56F8006VWL |
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Hersteller: NXP Semiconductors
Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
auf Bestellung 78 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 78+ | 7.53 EUR |
| P83C557E4EFB/215557 |
auf Bestellung 330 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 54+ | 9.08 EUR |
| M86291G12 |
Hersteller: NXP Semiconductors
Description: TEMP MS PART - C2K 900MHz Device
Packaging: Bulk
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: SPI, USB
Supplier Device Package: 625-FCPBGA (21x21)
Description: TEMP MS PART - C2K 900MHz Device
Packaging: Bulk
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: SPI, USB
Supplier Device Package: 625-FCPBGA (21x21)
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 6+ | 85.8 EUR |
| LPC1830-UK012 |
auf Bestellung 49443 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 31+ | 16.54 EUR |
| NXH2280UK/C1012 |
auf Bestellung 78000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 30+ | 16.41 EUR |
| LPC1112FD20/102,52 |
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Hersteller: NXP Semiconductors
Description: LPC1112 - Scalable Entry Level 3
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-SO
Number of I/O: 16
Description: LPC1112 - Scalable Entry Level 3
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-SO
Number of I/O: 16
auf Bestellung 190 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 190+ | 2.66 EUR |
| 74ALVCH16823DGGS |
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Hersteller: NXP Semiconductors
Description: IC FF D-TYPE DUAL 9BIT 56TSSOP
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 2
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 350 MHz
Input Capacitance: 5 pF
Supplier Device Package: 56-TSSOP
Max Propagation Delay @ V, Max CL: 3.7ns @ 3.3V, 50pF
Number of Bits per Element: 9
Description: IC FF D-TYPE DUAL 9BIT 56TSSOP
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 2
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 350 MHz
Input Capacitance: 5 pF
Supplier Device Package: 56-TSSOP
Max Propagation Delay @ V, Max CL: 3.7ns @ 3.3V, 50pF
Number of Bits per Element: 9
auf Bestellung 875 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 371+ | 1.3 EUR |
| BLF888BS,112 |
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Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 50V SOT539B
Packaging: Bulk
Package / Case: SOT-539B
Current Rating (Amps): 2.8µA
Mounting Type: Chassis Mount
Frequency: 470MHz ~ 860MHz
Configuration: 2 N-Channel
Power - Output: 650W
Gain: 21dB
Technology: LDMOS (Dual), Common Source
Supplier Device Package: SOT539B
Voltage - Rated: 104 V
Voltage - Test: 50 V
Current - Test: 1.3 A
Description: RF MOSFET LDMOS 50V SOT539B
Packaging: Bulk
Package / Case: SOT-539B
Current Rating (Amps): 2.8µA
Mounting Type: Chassis Mount
Frequency: 470MHz ~ 860MHz
Configuration: 2 N-Channel
Power - Output: 650W
Gain: 21dB
Technology: LDMOS (Dual), Common Source
Supplier Device Package: SOT539B
Voltage - Rated: 104 V
Voltage - Test: 50 V
Current - Test: 1.3 A
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 380.48 EUR |
| TEF7000HN/V2S,557 |
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auf Bestellung 697 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 130+ | 3.75 EUR |
| TEF7000HN/V3,557 |
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auf Bestellung 7800 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 66+ | 7.55 EUR |
| MM912G634DV1AE |
Hersteller: NXP Semiconductors
Description: MM912G634 - Integrated HCS12 Bas
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.25V ~ 5.25V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 9
Description: MM912G634 - Integrated HCS12 Bas
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.25V ~ 5.25V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 9
auf Bestellung 235 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 75+ | 6.5 EUR |
| MM912H634DV1AE |
Hersteller: NXP Semiconductors
Description: MM912H634 - Integrated HCS12 Bas
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: Serial
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lead Acid
Supplier Device Package: 48-HLQFP (7x7)
Description: MM912H634 - Integrated HCS12 Bas
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: Serial
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lead Acid
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 6985 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 69+ | 7.04 EUR |
| MM912H634DM1AE |
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Hersteller: NXP Semiconductors
Description: MM912H634 - INTEGRATED HCS12 BAS
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: Serial
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lead Acid
Supplier Device Package: 48-LQFP (7x7)
Description: MM912H634 - INTEGRATED HCS12 BAS
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: Serial
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lead Acid
Supplier Device Package: 48-LQFP (7x7)
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 62+ | 7.88 EUR |
| NX1WP10012 |
Hersteller: NXP Semiconductors
Description: NX1WP10 - Specialized Power Mana
Packaging: Bulk
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Receiver
Frequency: 6.78MHz
RF Type: General Purpose
Secondary Attributes: I²C Interface
Supplier Device Package: 42-WLCSP (3.56x3.41)
Description: NX1WP10 - Specialized Power Mana
Packaging: Bulk
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Receiver
Frequency: 6.78MHz
RF Type: General Purpose
Secondary Attributes: I²C Interface
Supplier Device Package: 42-WLCSP (3.56x3.41)
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 129+ | 3.74 EUR |
| NX3P190UK,012 |
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auf Bestellung 595151 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1150+ | 0.4 EUR |
| MPF5020AVNA0ES |
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Hersteller: NXP Semiconductors
Description: PF5020 - POWER MANAGEMENT IC, PR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Description: PF5020 - POWER MANAGEMENT IC, PR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 1958 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 77+ | 6.34 EUR |
| MPF5023AMMA0ES |
Hersteller: NXP Semiconductors
Description: PF5023 - POWER MANAGEMENT IC, PR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Description: PF5023 - POWER MANAGEMENT IC, PR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 75+ | 6.46 EUR |
| MPF5023AVNA0ES |
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Hersteller: NXP Semiconductors
Description: PF5023 - POWER MANAGEMENT IC, PR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Description: PF5023 - POWER MANAGEMENT IC, PR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 75+ | 6.46 EUR |
| MCIMX507CVK8B |
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Hersteller: NXP Semiconductors
Description: IC MPU I.MX50 800MHZ 416MAPBGA
Packaging: Bulk
Package / Case: 416-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3V
Supplier Device Package: 416-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, LPDDR, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Security Features: Boot Security, Cryptography, Secure JTAG
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Description: IC MPU I.MX50 800MHZ 416MAPBGA
Packaging: Bulk
Package / Case: 416-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3V
Supplier Device Package: 416-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, LPDDR, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Security Features: Boot Security, Cryptography, Secure JTAG
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 17+ | 31.09 EUR |
| 74HCT154D,653 |
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Hersteller: NXP Semiconductors
Description: NEXPERIA 74HCT154D - DECODER/DRI
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 4:16
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 24-SO
Description: NEXPERIA 74HCT154D - DECODER/DRI
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 4:16
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 24-SO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PSMN6R0-25YLD115 |
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auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1429+ | 0.34 EUR |
| MCZ33905DD5EK |
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Hersteller: NXP Semiconductors
Description: MCZ33905 - SYSTEM BASIS CHIP, PO
Packaging: Bulk
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2.8mA
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
Description: MCZ33905 - SYSTEM BASIS CHIP, PO
Packaging: Bulk
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2.8mA
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
auf Bestellung 1182 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 52+ | 9.49 EUR |
| BUK6C3R3-75C,118 |
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Hersteller: NXP Semiconductors
Description: NEXPERIA BUK6C3R3 - N-CHANNEL TR
Packaging: Bulk
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 181A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 90A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: D2PAK-7
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 253 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 15800 pF @ 25 V
Qualification: AEC-Q101
Description: NEXPERIA BUK6C3R3 - N-CHANNEL TR
Packaging: Bulk
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 181A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 90A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: D2PAK-7
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 253 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 15800 pF @ 25 V
Qualification: AEC-Q101
auf Bestellung 480 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 189+ | 2.55 EUR |
| MC33689DPEWR2 |
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Hersteller: NXP Semiconductors
Description: MC33689 - SYSTEM BASIS CHIP, LIN
Packaging: Bulk
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 5mA
Supplier Device Package: 32-SOIC
Grade: Automotive
Description: MC33689 - SYSTEM BASIS CHIP, LIN
Packaging: Bulk
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 5mA
Supplier Device Package: 32-SOIC
Grade: Automotive
auf Bestellung 6475 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 81+ | 6.06 EUR |
| PDTC124EM,315 |
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auf Bestellung 1011557 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 11871+ | 0.049 EUR |
| S912D60CE1VPVER528 |
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Hersteller: NXP Semiconductors
Description: S912D60CE - 16 BIT MICROCONTROLL
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: S912D60CE - 16 BIT MICROCONTROLL
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 150 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 38+ | 12.87 EUR |
| MC7448HX1700LD |
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Hersteller: NXP Semiconductors
Description: IC MPU MPC74XX 1.7GHZ 360FCCBGA
Packaging: Bulk
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.7GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.7GHZ 360FCCBGA
Packaging: Bulk
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.7GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 1233.14 EUR |





























