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S1JVMJD31CT4G NXP Semiconductors Description: S1JVMJDBDPNTRANSISTA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BC847CW/DG/B4115 NXP Semiconductors Description: NEXPERBC84SMASIGNBIPOLTRANSISTO0
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S908QY1E0CDTER NXP Semiconductors Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified
auf Bestellung 20000 Stücke:
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177+2.99 EUR
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S908GR8E0CDWE NXP Semiconductors FSCLS06440-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 7.5KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 7.5KB (7.5K x 8)
RAM Size: 384 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 21
DigiKey Programmable: Not Verified
auf Bestellung 320 Stücke:
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39+13.87 EUR
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S908GZ32G3MFAE S908GZ32G3MFAE NXP Semiconductors Description: S908GZ32G3MFAE - AUTO 8 BIT MCU
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V, 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
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27+19.82 EUR
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S908GZ60H0CFJE NXP Semiconductors Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
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21+24.07 EUR
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S908AB32AG0MFUE NXP Semiconductors Description: S908AB32AG0MFUE
Packaging: Bulk
auf Bestellung 84 Stücke:
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21+25.52 EUR
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BZB784-C11115 BZB784-C11115 NXP Semiconductors BZB784_SERIES.pdf Description: NOW NEXPERIA BZB784-C10 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
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PCA9450AHNY NXP Semiconductors PCA9450DS.pdf Description: PCA9450AHN - Power Management IC
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
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AFSC5G37E38T2 NXP Semiconductors AFSC5G37E38.pdf Description: AFSC5G37E38 - Airfast Power Ampl
Packaging: Bulk
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.3dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
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MC68040RC25V NXP Semiconductors MOTOS08162-1.pdf?t.download=true&u=5oefqw MC68040UM.pdf Description: MICROPROCESSOR, 32-BIT, MC68000
Packaging: Bulk
Package / Case: 179-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: 68040
Voltage - I/O: 5V
Supplier Device Package: 179-PGA (47.24x47.24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68040FE33A157 NXP Semiconductors Description: MC68MICROPROCESSO32-BIMC680FAMIL
Packaging: Tray
Produkt ist nicht verfügbar
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MC68040RC40A NXP Semiconductors MC68040UM.pdf Description: MC68RI32-BMICROPROCESS40MHZ
Packaging: Tray
Produkt ist nicht verfügbar
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IP5311CX5/LF/P,135 NXP Semiconductors Description: 1P5311CDALIFILTPIN(SPLASTIC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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A3I35D012WNR1 NXP Semiconductors Description: A3I35D012 - Airfast RF LDMOS Wid
Packaging: Bulk
Package / Case: TO-270-17 Variant, Flat Leads
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 3.2GHz ~ 4GHz
Configuration: 2 N-Channel
Power - Output: 1.8W
Gain: 27.8dB
Technology: LDMOS (Dual)
Supplier Device Package: TO-270WB-17
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 138 mA
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10+58.08 EUR
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BGU8M1UKAZ BGU8M1UKAZ NXP Semiconductors Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 16dB
Current - Supply: 5mA
Noise Figure: 0.8dB
P1dB: -3dBm
Test Frequency: 2.14GHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
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3116+0.18 EUR
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RN5RK251A-TR-FE NXP Semiconductors rn5rk-ea.pdf Description: RNINPVSTEP-DC/CONVERTER
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MAX823MEXK-T NXP Semiconductors Description: MAX5-PMICROPROCESSSUPERVISOCIRCU
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LPC11A12FBD48/101, LPC11A12FBD48/101, NXP Semiconductors PHGLS25712-1.pdf?t.download=true&u=5oefqw Description: LPC11A12 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
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128+3.70 EUR
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LPC11A13JHI33/201E LPC11A13JHI33/201E NXP Semiconductors PHGLS25712-1.pdf?t.download=true&u=5oefqw Description: LPC11A13 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
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115+4.11 EUR
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HEF4013BTT-Q100118 HEF4013BTT-Q100118 NXP Semiconductors HEF4013B_Q100.pdf Description: NEXPERIA HEF4013BTT-Q100 - D FLI
Packaging: Bulk
Produkt ist nicht verfügbar
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PN5120A0HN/C2,551 PN5120A0HN/C2,551 NXP Semiconductors PHGLS29855-1.pdf?t.download=true&u=5oefqw Description: PN5120A0HN/C2 - Full NFC Fronten
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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53+9.66 EUR
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FXTH87EH11DT1 FXTH87EH11DT1 NXP Semiconductors FXTH87ERM.pdf Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
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67+7.30 EUR
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FXTH871511DT1 FXTH871511DT1 NXP Semiconductors www.nxp.com Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
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45+11.77 EUR
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2N7002BKM/V,315 2N7002BKM/V,315 NXP Semiconductors PHGLS21629-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 2N7002BKM - SMALL SIGNA
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6U8DVM10AD557 NXP Semiconductors IMX6SDLIEC.pdf Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Produkt ist nicht verfügbar
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74ABT32D,112 74ABT32D,112 NXP Semiconductors PHGL-S-A0002323554-1.pdf?t.download=true&u=5oefqw Description: IC GATE OR
Packaging: Bulk
auf Bestellung 10964 Stücke:
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701+0.69 EUR
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BC847C/DG/B4215 NXP Semiconductors Description: NEXPERBC8SMASIGNBIPOLTRANSISTO0.
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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HEF4094BTT118 HEF4094BTT118 NXP Semiconductors HEF4094B.pdf Description: NEXPERIA HEF4094BTT - SERIAL IN
Packaging: Bulk
Produkt ist nicht verfügbar
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PESD15VL1BAZ PESD15VL1BAZ NXP Semiconductors PESD15VL1BA.pdf Description: TVS DIODE 15VWM 44VC SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: CAN, Telecom
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 15V (Max)
Supplier Device Package: SOD-323
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 44V
Power - Peak Pulse: 200W
Power Line Protection: No
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5735+0.08 EUR
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LTC1148HVCS#PBF NXP Semiconductors 1148fd.pdf Description: LTC1SWITCHICONTROLLE250KSWITCHIF
Packaging: Tube
Produkt ist nicht verfügbar
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BAV21-T50A NXP Semiconductors ONSM-S-A0003585514-1.pdf?t.download=true&u=5oefqw Description: DIODE STD 250V 200MA DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Capacitance @ Vr, F: 5pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: 175°C
Voltage - DC Reverse (Vr) (Max): 250 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 200 V
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MCIMX7S3EVK08SC NXP Semiconductors PHGL-S-A0003204178-1.pdf?t.download=true&u=5oefqw Description: IC MPU 800MHZ 488MAPBGA
Packaging: Bulk
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
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MIMX8MN2DVTJZAA NXP Semiconductors IMX8MNIEC.pdf Description: IC MPU 1.5GHZ/750MHZ 486LFBGA
Packaging: Bulk
Package / Case: 486-LFBGA
Mounting Type: Surface Mount
Speed: 1.5GHz, 750MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
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MCIMX6X1CVK08AB MCIMX6X1CVK08AB NXP Semiconductors PHGL-S-A0006655092-1.pdf?t.download=true&u=5oefqw Description: IC MPU 200MHZ/800MHZ 400MAPBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, LPDDR2, LVDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
auf Bestellung 3151 Stücke:
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13+41.89 EUR
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MVF30NN151CKU26 MVF30NN151CKU26 NXP Semiconductors FSCL-S-A0000149012-1.pdf?t.download=true&u=5oefqw Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: ARM® Cortex®-M4, Multimedia; NEON™ MPE
RAM Controllers: DDR3, DRAM, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CANbus, I2C, IrDA, SCI, SDHC, SPI, UART/USART
auf Bestellung 720 Stücke:
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12+43.11 EUR
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NX3P191UK,023 NX3P191UK,023 NXP Semiconductors PHGLS29357-1.pdf?t.download=true&u=5oefqw Description: SPST, 1 FUNC, 1 CHANNEL, PBGA4
Packaging: Bulk
auf Bestellung 9000 Stücke:
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1332+0.39 EUR
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74LVCH16245ADGG-Q100118 74LVCH16245ADGG-Q100118 NXP Semiconductors 74LVC_LVCH16245A_Q100.pdf Description: NEXPERIA 74LVCH16245ADGG-Q100 -
Packaging: Bulk
Produkt ist nicht verfügbar
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BZX384-C47115 NXP Semiconductors Description: NOW NEXPERIA BZX384-C43 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 170 Ohms
Supplier Device Package: SOD-323
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 50 V
Produkt ist nicht verfügbar
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MPC860TCZQ50D4 NXP Semiconductors FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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PUMD9115 NXP Semiconductors PEMD9_PUMD9.pdf Description: PUMD9 - NPN/PNP RESISTOR-EQUIPPE
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: 6-TSSOP
Produkt ist nicht verfügbar
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PC33772ASP1AE PC33772ASP1AE NXP Semiconductors MC33772SM.pdf Description: PC33772ASP1AE - LI-ION BATTERY C
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-LQFP (7x7)
Fault Protection: Over/Under Voltage
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22+22.02 EUR
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74AUP1Z125GM,115 74AUP1Z125GM,115 NXP Semiconductors PHGLS25191-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74AUP1Z125GM - BUS DRIV
Packaging: Bulk
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PCF8551BTT/AY NXP Semiconductors Description: PCF8551BTT - Universal 36 ×
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 36 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 1.2 µA
Produkt ist nicht verfügbar
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BC857BW/ZL115 BC857BW/ZL115 NXP Semiconductors BC856W_BC857W_BC858W.pdf Description: NEXPERIA BC857BW - SMALL SIGNAL
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SC-70
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
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PQMD10147 PQMD10147 NXP Semiconductors PQMD10.pdf Description: PQMD10 - NPN/PNP RESISTOR-EQUIPP
Packaging: Bulk
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PQMD2147 PQMD2147 NXP Semiconductors PQMD2.pdf Description: PQMD2 - NPN/PNP RESISTOR-EQUIPPE
Packaging: Bulk
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PTVS7V5U1UPA,147 PTVS7V5U1UPA,147 NXP Semiconductors NEXP-S-A0002907440-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PTVS7V5U1 - 300W TRANSI
Packaging: Bulk
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PQMD16147 PQMD16147 NXP Semiconductors PQMD16.pdf Description: PQMD16 - NPN/PNP RESISTOR-EQUIPP
Packaging: Bulk
Produkt ist nicht verfügbar
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74AHC244D,112 74AHC244D,112 NXP Semiconductors PHGLS15239-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
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74LVC14APW 74LVC14APW NXP Semiconductors PHGLS24066-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74LVC14APW - INVERT
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
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PDTC114TMB315 PDTC114TMB315 NXP Semiconductors PDTC114TMB.pdf Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Grade: Automotive
Qualification: AEC-Q101
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PCF7952LTT/M1CC15, PCF7952LTT/M1CC15, NXP Semiconductors 75017275.pdf?fsrch=1&sr=1&pageNum=1 Description: PCF7952LTT - IMMO ACTIC
Packaging: Bulk
Features: RSSI Equipped
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512B RAM, 16kB EEPROM, 8kB ROM
Modulation or Protocol: UHF
Applications: Remote Keyless Entry
Supplier Device Package: 24-TSSOP
DigiKey Programmable: Not Verified
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MRFX600GSR5 NXP Semiconductors MRFX600H.pdf Description: RF MOSFET LDMOS 65V NI780
Packaging: Bulk
Package / Case: NI-780GS-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: 2 N-Channel
Power - Output: 600W
Gain: 26.4dB
Technology: LDMOS (Dual)
Supplier Device Package: NI-780GS-4L
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
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MSC8156SAG1000B NXP Semiconductors FSCLS11257-1.pdf?t.download=true&u=5oefqw Description: Digital Signal Processor, 32-Bit
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Six Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 1.03125MB
Voltage - I/O: 2.5V
Voltage - Core: 1V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
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PUMB24,115 PUMB24,115 NXP Semiconductors PHGLS19622-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PUMB24 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 20mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Resistor - Base (R1): 100kOhms
Resistor - Emitter Base (R2): 100kOhms
Supplier Device Package: 6-TSSOP
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11225+0.05 EUR
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PEMD19,115 PEMD19,115 NXP Semiconductors PIRSS13192-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PEMD19 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Resistor - Base (R1): 22kOhms
Supplier Device Package: SOT-666
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6772+0.07 EUR
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PEMB18,115 PEMB18,115 NXP Semiconductors PHGLS24212-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PEMB18 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Resistor - Base (R1): 4.7kOhms
Resistor - Emitter Base (R2): 10kOhms
Supplier Device Package: SOT-666
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6772+0.07 EUR
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PEMB16,115 PEMB16,115 NXP Semiconductors PHGLS19131-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PEMB16 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: SOT-666
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6772+0.07 EUR
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PESD3V3C1BSF,315 PESD3V3C1BSF,315 NXP Semiconductors PESD3V3C1BSF.pdf Description: NOW NEXPERIA PESD3V3C1B TRANS VO
Packaging: Bulk
Produkt ist nicht verfügbar
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S1JVMJD31CT4G
Hersteller: NXP Semiconductors
Description: S1JVMJDBDPNTRANSISTA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BC847CW/DG/B4115
Hersteller: NXP Semiconductors
Description: NEXPERBC84SMASIGNBIPOLTRANSISTO0
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S908QY1E0CDTER
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified
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Anzahl Preis
177+2.99 EUR
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S908GR8E0CDWE FSCLS06440-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 7.5KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 7.5KB (7.5K x 8)
RAM Size: 384 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 21
DigiKey Programmable: Not Verified
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39+13.87 EUR
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S908GZ32G3MFAE
S908GZ32G3MFAE
Hersteller: NXP Semiconductors
Description: S908GZ32G3MFAE - AUTO 8 BIT MCU
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V, 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
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27+19.82 EUR
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S908GZ60H0CFJE
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
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21+24.07 EUR
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S908AB32AG0MFUE
Hersteller: NXP Semiconductors
Description: S908AB32AG0MFUE
Packaging: Bulk
auf Bestellung 84 Stücke:
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21+25.52 EUR
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BZB784-C11115 BZB784_SERIES.pdf
BZB784-C11115
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA BZB784-C10 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Produkt ist nicht verfügbar
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PCA9450AHNY PCA9450DS.pdf
Hersteller: NXP Semiconductors
Description: PCA9450AHN - Power Management IC
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
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77+6.92 EUR
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AFSC5G37E38T2 AFSC5G37E38.pdf
Hersteller: NXP Semiconductors
Description: AFSC5G37E38 - Airfast Power Ampl
Packaging: Bulk
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.3dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
auf Bestellung 1992 Stücke:
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13+38.37 EUR
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MC68040RC25V MOTOS08162-1.pdf?t.download=true&u=5oefqw MC68040UM.pdf
Hersteller: NXP Semiconductors
Description: MICROPROCESSOR, 32-BIT, MC68000
Packaging: Bulk
Package / Case: 179-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: 68040
Voltage - I/O: 5V
Supplier Device Package: 179-PGA (47.24x47.24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC68040FE33A157
Hersteller: NXP Semiconductors
Description: MC68MICROPROCESSO32-BIMC680FAMIL
Packaging: Tray
Produkt ist nicht verfügbar
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MC68040RC40A MC68040UM.pdf
Hersteller: NXP Semiconductors
Description: MC68RI32-BMICROPROCESS40MHZ
Packaging: Tray
Produkt ist nicht verfügbar
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IP5311CX5/LF/P,135
Hersteller: NXP Semiconductors
Description: 1P5311CDALIFILTPIN(SPLASTIC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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A3I35D012WNR1
Hersteller: NXP Semiconductors
Description: A3I35D012 - Airfast RF LDMOS Wid
Packaging: Bulk
Package / Case: TO-270-17 Variant, Flat Leads
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 3.2GHz ~ 4GHz
Configuration: 2 N-Channel
Power - Output: 1.8W
Gain: 27.8dB
Technology: LDMOS (Dual)
Supplier Device Package: TO-270WB-17
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 138 mA
auf Bestellung 396 Stücke:
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10+58.08 EUR
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BGU8M1UKAZ
BGU8M1UKAZ
Hersteller: NXP Semiconductors
Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 16dB
Current - Supply: 5mA
Noise Figure: 0.8dB
P1dB: -3dBm
Test Frequency: 2.14GHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
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Anzahl Preis
3116+0.18 EUR
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RN5RK251A-TR-FE rn5rk-ea.pdf
Hersteller: NXP Semiconductors
Description: RNINPVSTEP-DC/CONVERTER
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MAX823MEXK-T
Hersteller: NXP Semiconductors
Description: MAX5-PMICROPROCESSSUPERVISOCIRCU
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LPC11A12FBD48/101, PHGLS25712-1.pdf?t.download=true&u=5oefqw
LPC11A12FBD48/101,
Hersteller: NXP Semiconductors
Description: LPC11A12 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
auf Bestellung 207 Stücke:
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Anzahl Preis
128+3.70 EUR
Mindestbestellmenge: 128
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LPC11A13JHI33/201E PHGLS25712-1.pdf?t.download=true&u=5oefqw
LPC11A13JHI33/201E
Hersteller: NXP Semiconductors
Description: LPC11A13 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
auf Bestellung 580 Stücke:
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Anzahl Preis
115+4.11 EUR
Mindestbestellmenge: 115
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HEF4013BTT-Q100118 HEF4013B_Q100.pdf
HEF4013BTT-Q100118
Hersteller: NXP Semiconductors
Description: NEXPERIA HEF4013BTT-Q100 - D FLI
Packaging: Bulk
Produkt ist nicht verfügbar
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PN5120A0HN/C2,551 PHGLS29855-1.pdf?t.download=true&u=5oefqw
PN5120A0HN/C2,551
Hersteller: NXP Semiconductors
Description: PN5120A0HN/C2 - Full NFC Fronten
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2420 Stücke:
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Anzahl Preis
53+9.66 EUR
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FXTH87EH11DT1 FXTH87ERM.pdf
FXTH87EH11DT1
Hersteller: NXP Semiconductors
Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 2000 Stücke:
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Anzahl Preis
67+7.30 EUR
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FXTH871511DT1 www.nxp.com
FXTH871511DT1
Hersteller: NXP Semiconductors
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 41435 Stücke:
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Anzahl Preis
45+11.77 EUR
Mindestbestellmenge: 45
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2N7002BKM/V,315 PHGLS21629-1.pdf?t.download=true&u=5oefqw
2N7002BKM/V,315
Hersteller: NXP Semiconductors
Description: NEXPERIA 2N7002BKM - SMALL SIGNA
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6U8DVM10AD557 IMX6SDLIEC.pdf
Hersteller: NXP Semiconductors
Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Produkt ist nicht verfügbar
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74ABT32D,112 PHGL-S-A0002323554-1.pdf?t.download=true&u=5oefqw
74ABT32D,112
Hersteller: NXP Semiconductors
Description: IC GATE OR
Packaging: Bulk
auf Bestellung 10964 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
701+0.69 EUR
Mindestbestellmenge: 701
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BC847C/DG/B4215
Hersteller: NXP Semiconductors
Description: NEXPERBC8SMASIGNBIPOLTRANSISTO0.
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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HEF4094BTT118 HEF4094B.pdf
HEF4094BTT118
Hersteller: NXP Semiconductors
Description: NEXPERIA HEF4094BTT - SERIAL IN
Packaging: Bulk
Produkt ist nicht verfügbar
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PESD15VL1BAZ PESD15VL1BA.pdf
PESD15VL1BAZ
Hersteller: NXP Semiconductors
Description: TVS DIODE 15VWM 44VC SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: CAN, Telecom
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 15V (Max)
Supplier Device Package: SOD-323
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 44V
Power - Peak Pulse: 200W
Power Line Protection: No
auf Bestellung 22948 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5735+0.08 EUR
Mindestbestellmenge: 5735
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LTC1148HVCS#PBF 1148fd.pdf
Hersteller: NXP Semiconductors
Description: LTC1SWITCHICONTROLLE250KSWITCHIF
Packaging: Tube
Produkt ist nicht verfügbar
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BAV21-T50A ONSM-S-A0003585514-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: DIODE STD 250V 200MA DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Capacitance @ Vr, F: 5pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: 175°C
Voltage - DC Reverse (Vr) (Max): 250 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 200 V
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2+352.87 EUR
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MCIMX7S3EVK08SC PHGL-S-A0003204178-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU 800MHZ 488MAPBGA
Packaging: Bulk
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
auf Bestellung 6080 Stücke:
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Anzahl Preis
18+29.10 EUR
Mindestbestellmenge: 18
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MIMX8MN2DVTJZAA IMX8MNIEC.pdf
Hersteller: NXP Semiconductors
Description: IC MPU 1.5GHZ/750MHZ 486LFBGA
Packaging: Bulk
Package / Case: 486-LFBGA
Mounting Type: Surface Mount
Speed: 1.5GHz, 750MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
auf Bestellung 250 Stücke:
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Anzahl Preis
15+33.82 EUR
Mindestbestellmenge: 15
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MCIMX6X1CVK08AB PHGL-S-A0006655092-1.pdf?t.download=true&u=5oefqw
MCIMX6X1CVK08AB
Hersteller: NXP Semiconductors
Description: IC MPU 200MHZ/800MHZ 400MAPBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, LPDDR2, LVDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
auf Bestellung 3151 Stücke:
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Anzahl Preis
13+41.89 EUR
Mindestbestellmenge: 13
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MVF30NN151CKU26 FSCL-S-A0000149012-1.pdf?t.download=true&u=5oefqw
MVF30NN151CKU26
Hersteller: NXP Semiconductors
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: ARM® Cortex®-M4, Multimedia; NEON™ MPE
RAM Controllers: DDR3, DRAM, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CANbus, I2C, IrDA, SCI, SDHC, SPI, UART/USART
auf Bestellung 720 Stücke:
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Anzahl Preis
12+43.11 EUR
Mindestbestellmenge: 12
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NX3P191UK,023 PHGLS29357-1.pdf?t.download=true&u=5oefqw
NX3P191UK,023
Hersteller: NXP Semiconductors
Description: SPST, 1 FUNC, 1 CHANNEL, PBGA4
Packaging: Bulk
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1332+0.39 EUR
Mindestbestellmenge: 1332
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74LVCH16245ADGG-Q100118 74LVC_LVCH16245A_Q100.pdf
74LVCH16245ADGG-Q100118
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVCH16245ADGG-Q100 -
Packaging: Bulk
Produkt ist nicht verfügbar
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BZX384-C47115
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA BZX384-C43 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 170 Ohms
Supplier Device Package: SOD-323
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 50 V
Produkt ist nicht verfügbar
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MPC860TCZQ50D4 FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 2634 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+273.80 EUR
Mindestbestellmenge: 2
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PUMD9115 PEMD9_PUMD9.pdf
Hersteller: NXP Semiconductors
Description: PUMD9 - NPN/PNP RESISTOR-EQUIPPE
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: 6-TSSOP
Produkt ist nicht verfügbar
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PC33772ASP1AE MC33772SM.pdf
PC33772ASP1AE
Hersteller: NXP Semiconductors
Description: PC33772ASP1AE - LI-ION BATTERY C
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-LQFP (7x7)
Fault Protection: Over/Under Voltage
auf Bestellung 93 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
22+22.02 EUR
Mindestbestellmenge: 22
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74AUP1Z125GM,115 PHGLS25191-1.pdf?t.download=true&u=5oefqw
74AUP1Z125GM,115
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP1Z125GM - BUS DRIV
Packaging: Bulk
auf Bestellung 25144 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1490+0.32 EUR
Mindestbestellmenge: 1490
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PCF8551BTT/AY
Hersteller: NXP Semiconductors
Description: PCF8551BTT - Universal 36 ×
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 36 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 1.2 µA
Produkt ist nicht verfügbar
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BC857BW/ZL115 BC856W_BC857W_BC858W.pdf
BC857BW/ZL115
Hersteller: NXP Semiconductors
Description: NEXPERIA BC857BW - SMALL SIGNAL
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SC-70
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
auf Bestellung 114000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15000+0.03 EUR
Mindestbestellmenge: 15000
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PQMD10147 PQMD10.pdf
PQMD10147
Hersteller: NXP Semiconductors
Description: PQMD10 - NPN/PNP RESISTOR-EQUIPP
Packaging: Bulk
auf Bestellung 13699 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8460+0.07 EUR
Mindestbestellmenge: 8460
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PQMD2147 PQMD2.pdf
PQMD2147
Hersteller: NXP Semiconductors
Description: PQMD2 - NPN/PNP RESISTOR-EQUIPPE
Packaging: Bulk
auf Bestellung 13697 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8460+0.06 EUR
Mindestbestellmenge: 8460
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PTVS7V5U1UPA,147 NEXP-S-A0002907440-1.pdf?t.download=true&u=5oefqw
PTVS7V5U1UPA,147
Hersteller: NXP Semiconductors
Description: NEXPERIA PTVS7V5U1 - 300W TRANSI
Packaging: Bulk
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3050+0.16 EUR
Mindestbestellmenge: 3050
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PQMD16147 PQMD16.pdf
PQMD16147
Hersteller: NXP Semiconductors
Description: PQMD16 - NPN/PNP RESISTOR-EQUIPP
Packaging: Bulk
Produkt ist nicht verfügbar
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74AHC244D,112 PHGLS15239-1.pdf?t.download=true&u=5oefqw
74AHC244D,112
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
auf Bestellung 12422 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1216+0.42 EUR
Mindestbestellmenge: 1216
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74LVC14APW PHGLS24066-1.pdf?t.download=true&u=5oefqw
74LVC14APW
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA 74LVC14APW - INVERT
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
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PDTC114TMB315 PDTC114TMB.pdf
PDTC114TMB315
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 276400 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11225+0.05 EUR
Mindestbestellmenge: 11225
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PCF7952LTT/M1CC15, 75017275.pdf?fsrch=1&sr=1&pageNum=1
PCF7952LTT/M1CC15,
Hersteller: NXP Semiconductors
Description: PCF7952LTT - IMMO ACTIC
Packaging: Bulk
Features: RSSI Equipped
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512B RAM, 16kB EEPROM, 8kB ROM
Modulation or Protocol: UHF
Applications: Remote Keyless Entry
Supplier Device Package: 24-TSSOP
DigiKey Programmable: Not Verified
auf Bestellung 29944 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
54+9.52 EUR
Mindestbestellmenge: 54
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MRFX600GSR5 MRFX600H.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 65V NI780
Packaging: Bulk
Package / Case: NI-780GS-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: 2 N-Channel
Power - Output: 600W
Gain: 26.4dB
Technology: LDMOS (Dual)
Supplier Device Package: NI-780GS-4L
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+228.65 EUR
Mindestbestellmenge: 3
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MSC8156SAG1000B FSCLS11257-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: Digital Signal Processor, 32-Bit
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Six Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 1.03125MB
Voltage - I/O: 2.5V
Voltage - Core: 1V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
auf Bestellung 307 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+442.16 EUR
Mindestbestellmenge: 2
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PUMB24,115 PHGLS19622-1.pdf?t.download=true&u=5oefqw
PUMB24,115
Hersteller: NXP Semiconductors
Description: NEXPERIA PUMB24 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 20mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Resistor - Base (R1): 100kOhms
Resistor - Emitter Base (R2): 100kOhms
Supplier Device Package: 6-TSSOP
auf Bestellung 365303 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11225+0.05 EUR
Mindestbestellmenge: 11225
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PEMD19,115 PIRSS13192-1.pdf?t.download=true&u=5oefqw
PEMD19,115
Hersteller: NXP Semiconductors
Description: NEXPERIA PEMD19 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Resistor - Base (R1): 22kOhms
Supplier Device Package: SOT-666
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6772+0.07 EUR
Mindestbestellmenge: 6772
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PEMB18,115 PHGLS24212-1.pdf?t.download=true&u=5oefqw
PEMB18,115
Hersteller: NXP Semiconductors
Description: NEXPERIA PEMB18 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Resistor - Base (R1): 4.7kOhms
Resistor - Emitter Base (R2): 10kOhms
Supplier Device Package: SOT-666
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6772+0.07 EUR
Mindestbestellmenge: 6772
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PEMB16,115 PHGLS19131-1.pdf?t.download=true&u=5oefqw
PEMB16,115
Hersteller: NXP Semiconductors
Description: NEXPERIA PEMB16 - SMALL SIGNAL B
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: SOT-666
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6772+0.07 EUR
Mindestbestellmenge: 6772
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PESD3V3C1BSF,315 PESD3V3C1BSF.pdf
PESD3V3C1BSF,315
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA PESD3V3C1B TRANS VO
Packaging: Bulk
Produkt ist nicht verfügbar
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