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LPC1112FDH28/102:5 LPC1112FDH28/102:5 NXP Semiconductors PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: LPC1112 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
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BC859B,215 BC859B,215 NXP Semiconductors BC859_BC860.pdf Description: TRANS PNP 30V 0.1A TO-236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 250 mW
Qualification: AEC-Q101
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MKW20Z160VHT4 NXP Semiconductors PHGL-S-A0005067296-1.pdf?t.download=true&u=5oefqw Description: IC RF TXRX+MCU 802.15.4
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 28
Current - Transmitting: 8.4mA ~ 18.5mA
Data Rate (Max): 250kbps
Current - Receiving: 6.5mA ~ 15.4mA
Protocol: ZigbeePRO®
Power - Output: 5dBm
Voltage - Supply: 1.45V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 160kB Flash, 20kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Packaging: Bulk
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74LVC139D,112 74LVC139D,112 NXP Semiconductors PHGLS23390-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74LVC139D - DECODER/DRI
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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MRFE6VP8600HR5 NXP Semiconductors MRFE6VP8600H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230
Current Rating (Amps): 20µA
Mounting Type: Chassis Mount
Frequency: 470MHz ~ 860MHz
Configuration: Dual, Common Source
Power - Output: 600W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 1.4 A
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BAT18,235 BAT18,235 NXP Semiconductors BAT18.pdf Description: RF DIODE STANDARD 35V SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Standard - Single
Operating Temperature: 125°C (TJ)
Capacitance @ Vr, F: 1pF @ 20V, 1MHz
Resistance @ If, F: 700mOhm @ 5mA, 200MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
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PCF7961XTT/D1AC09J NXP Semiconductors Description: IMMO COMBI CHIP
Supplier Device Package: 20-TSSOP
Applications: Remote Keyless Entry
Voltage - Supply: 2.1V ~ 3.6V
Modulation or Protocol: UHF
Memory Size: 192B RAM, 512B EEPROM
Frequency: 315MHz, 434MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Features: Programmable
Packaging: Bulk
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PDTA115EU,115 PDTA115EU,115 NXP Semiconductors PIRSS13039-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS
Packaging: Bulk
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74AUP1G79GM,115 74AUP1G79GM,115 NXP Semiconductors PHGLS24882-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 1BIT 6XSON
Number of Bits per Element: 1
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 50pF
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Input Capacitance: 0.8 pF
Clock Frequency: 309 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 4mA
Current - Quiescent (Iq): 500 nA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 6-XFDFN
Packaging: Bulk
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74LVC2G02GN,115 74LVC2G02GN,115 NXP Semiconductors 74LVC2G02.pdf Description: IC DUAL 2-INP
Packaging: Bulk
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74HCT2G17GW-Q100H 74HCT2G17GW-Q100H NXP Semiconductors 74HC_HCT2G17_Q100.pdf Description: IC BUFF NON-INVERT 5.5V 6-TSSOP
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 6-TSSOP
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Input Type: Schmitt Trigger
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Bulk
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MPC860DTCZQ50D4 NXP Semiconductors FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC86XX 50MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (2), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TJ)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
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NVT4555UKZ NVT4555UKZ NXP Semiconductors PHGLS28214-1.pdf?t.download=true&u=5oefqw Description: NVT4555UK - SIM card interface l
Supplier Device Package: 12-WLCSP (1.62x1.19)
Applications: SIM Card
Voltage - Supply: 1.1V ~ 3.6V
Mounting Type: Surface Mount
Package / Case: 12-UFBGA, WLCSP
Packaging: Bulk
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PN7362BNHN/C300Y PN7362BNHN/C300Y NXP Semiconductors PN7462.pdf Description: PN7362 - NFC CORTEX-M0 MICROCONT
DigiKey Programmable: Not Verified
Packaging: Bulk
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PESD2NFC-LYL PESD2NFC-LYL NXP Semiconductors PESD5V0F1BL.pdf Description: TVS DIODE 24VWM DFN1006-2
Power Line Protection: No
Bidirectional Channels: 1
Supplier Device Package: DFN1006-2
Voltage - Reverse Standoff (Typ): 24V (Max)
Type: Zener
Mounting Type: Surface Mount
Package / Case: SOD-882
Packaging: Bulk
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BZX79-C22,143 BZX79-C22,143 NXP Semiconductors BZX79.pdf Description: DIODE ZENER 22V 400MW ALF2
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 400 mW
Supplier Device Package: ALF2
Impedance (Max) (Zzt): 55 Ohms
Voltage - Zener (Nom) (Vz): 22 V
Operating Temperature: -65°C ~ 200°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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MC68302AG25C NXP Semiconductors FSCLS09687-1.pdf?t.download=true&u=5oefqw Description: IC MPU 25MHZ 144LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Supplier Device Package: 144-LQFP (20x20)
Voltage - I/O: 5V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
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MC68302EH25CB1 MC68302EH25CB1 NXP Semiconductors FSCLS09687-1.pdf?t.download=true&u=5oefqw Description: IC MPU M683XX 25MHZ 132PQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Supplier Device Package: 132-PQFP (24.13x24.13)
Voltage - I/O: 5V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Bulk
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SPC5746CHK1AMMH6 SPC5746CHK1AMMH6 NXP Semiconductors SPC5746CFK1ACKU6.pdf?t.download=true&u=axiww2 Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
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74AUP1G157GF,132 74AUP1G157GF,132 NXP Semiconductors PHGLS24877-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74AUP1G157GF - MULTIPLE
Supplier Device Package: 6-XSON, SOT891 (1x1)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: Multiplexer
Circuit: 1 x 2:1
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
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A2V09H400-04NR3 NXP Semiconductors PHGL-S-A0003207742-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 720MHz ~ 960MHz
Configuration: 2 N-Channel
Power - Output: 107W
Gain: 17.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 688 mA
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PTN5110DHQZ NXP Semiconductors Description: USB Type-C Rev 3.0 PD PHY, Dongl
Interface: Bus, I2C
Mounting Type: Surface Mount
Package / Case: 16-XFQFN Exposed Pad
Packaging: Bulk
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Voltage - Supply: 2.7V ~ 5.5V
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74LV04PW,118 74LV04PW,118 NXP Semiconductors PHGL-S-A0001366847-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER
Packaging: Bulk
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BGU8L1X BGU8L1X NXP Semiconductors PHGL-S-A0005068106-1.pdf?t.download=true&u=5oefqw Description: BGU8L1 - C Low Noise Amplifier M
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 14.5dB
Current - Supply: 4.6mA
Noise Figure: 0.7dB
P1dB: -3dBm
Test Frequency: 882MHz
Supplier Device Package: 6-XSON (1.1x0.7)
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MC9S08SU8VFK NXP Semiconductors PHGL-S-A0003028296-1.pdf?t.download=true&u=5oefqw Description: MC9S08SU - 8 bit MCU with S08L c
Packaging: Bulk
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08L
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 17
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74AUP1G07GF,132 74AUP1G07GF,132 NXP Semiconductors PHGLS25181-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON, SOT891 (1x1)
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CBT3306D,112 CBT3306D,112 NXP Semiconductors CBT3306.pdf Description: C3306 - NOW NEXPERIA CBT3306D -
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SO
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BCV65,215 BCV65,215 NXP Semiconductors BCV65.pdf Description: TRANS NPN/PNP 30V 100MA SOT-143B
Qualification: AEC-Q101
Grade: Automotive
Supplier Device Package: SOT-143B
DC Current Gain (hFE) (Min) @ Ic, Vce: 75 @ 2mA, 5V
Current - Collector Cutoff (Max): 15nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Voltage - Collector Emitter Breakdown (Max): 30V
Current - Collector (Ic) (Max): 100mA
Power - Max: 250mW
Operating Temperature: 150°C (TJ)
Transistor Type: 1 NPN, 1 PNP (Emitter Coupled)
Mounting Type: Surface Mount
Package / Case: TO-253-4, TO-253AA
Packaging: Bulk
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74LV00DB,118 74LV00DB,118 NXP Semiconductors 74LV00.pdf Description: IC GATE NAND
Packaging: Bulk
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74HCT163D,653 74HCT163D,653 NXP Semiconductors PHGL-S-A0001367747-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74HCT163D - BINARY COUN
Packaging: Bulk
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PCMF1USB30Z PCMF1USB30Z NXP Semiconductors PCMFXUSB30_SER.pdf Description: NEXPERIA PCMF1USB - ELECTRONIC I
Packaging: Bulk
auf Bestellung 20495 Stücke:
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1998+0.25 EUR
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PZU20BA,115 PZU20BA,115 NXP Semiconductors PZUXBA_SER.pdf Description: DIODE ZENER 20V 320MW SOD323
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
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PZU20B1A,115 PZU20B1A,115 NXP Semiconductors PZUXBA_SER.pdf Description: DIODE ZENER 20V 320MW SOD323
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 320 mW
Supplier Device Package: SOD-323
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 20 V
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Tolerance: ±2%
Packaging: Bulk
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PZU20B2,115 PZU20B2,115 NXP Semiconductors PHGLS19743-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 20V 310MW SOD323F
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 310 mW
Supplier Device Package: SOD-323F
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 20 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-90, SOD-323F
Tolerance: ±2%
Packaging: Bulk
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MPC8545VJATGD NXP Semiconductors FSCLS11828-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC85XX 1.2GHZ 783BGA
Packaging: Bulk
Package / Case: 783-BBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-PBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: AES, Cryptography, Kasumi, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, RapidIO
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SCC2698BC1A84,512 SCC2698BC1A84,512 NXP Semiconductors SCC2698B.pdf Description: IC UART OCTAL ENHANCED 84-PLCC
With Modem Control: Yes
With False Start Bit Detection: Yes
With Auto Flow Control: Yes
Supplier Device Package: 84-PLCC (29.26x29.26)
Protocol: RS485
Voltage - Supply: 5V
Mounting Type: Surface Mount
Number of Channels: 8
Package / Case: 84-LCC (J-Lead)
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Bulk
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MFRC53101T/0FE,112 MFRC53101T/0FE,112 NXP Semiconductors Description: STANDARD ISO/IEC 14443 A/B READE
Packaging: Bulk
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PMEG2010EPASX PMEG2010EPASX NXP Semiconductors NEXP-S-A0003105495-1.pdf?t.download=true&u=5oefqw Description: DIODE SCHOTTKY 20V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Schottky
Capacitance @ Vr, F: 175pF @ 1V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DFN2020D-3
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 375 mV @ 1 A
Current - Reverse Leakage @ Vr: 335 µA @ 20 V
Qualification: AEC-Q101
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PMEG6010ESBYL NXP Semiconductors PMEG6010ESB.pdf Description: DIODE SCHOTTKY 60V 1A DSN1006-2
Current - Reverse Leakage @ Vr: 30 µA @ 60 V
Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 60 V
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: DSN1006-2
Current - Average Rectified (Io): 1A
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Technology: Schottky
Reverse Recovery Time (trr): 2.4 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: 2-XDFN
Packaging: Bulk
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BZX884-C12,315 BZX884-C12,315 NXP Semiconductors PHGLS19465-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 12V 250MW DFN1006-2
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Supplier Device Package: DFN1006-2
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-882
Tolerance: ±5%
Packaging: Bulk
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BFG505/X,215 BFG505/X,215 NXP Semiconductors BFG505_X_Rev4.pdf Description: RF TRANS NPN 15V 9GHZ SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 18mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz
Supplier Device Package: SOT-143B
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PBSS5230QAZ PBSS5230QAZ NXP Semiconductors PBSS5230QA.pdf Description: TRANS PNP 30V 2A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 210mV @ 50mA, 1A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V
Frequency - Transition: 170MHz
Supplier Device Package: DFN1010D-3
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 325 mW
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TDA3664AT/N1,118 TDA3664AT/N1,118 NXP Semiconductors TDA3664.pdf Description: IC REG LINEAR 5V 100MA 8-SO
Operating Temperature: -40°C ~ 125°C
Current - Output: 100mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Current - Quiescent (Iq): 30 µA
Output Configuration: Positive
Current - Supply (Max): 2.5 mA
Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage
Voltage Dropout (Max): 0.3V @ 50mA
PSRR: 60dB (120Hz)
Voltage - Output (Min/Fixed): 5V
Supplier Device Package: 8-SO
Number of Regulators: 1
Voltage - Input (Max): 45V
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74AUP3G17GTX 74AUP3G17GTX NXP Semiconductors 74AUP3G17.pdf Description: NEXPERIA 74AUP3G17 - LOW-POWER T
Packaging: Bulk
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MC33886PVWR2 NXP Semiconductors FSCLS11623-1.pdf?t.download=true&u=5oefqw Description: 5.0 A H-Bridge
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 20-HSOP
Voltage - Load: 5V ~ 40V
Technology: CMOS
Applications: General Purpose
Voltage - Supply: 5V ~ 40V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 125°C (TA)
Interface: Parallel
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Packaging: Bulk
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TEA1733MT/N2,118 TEA1733MT/N2,118 NXP Semiconductors TEA1733MT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 91.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Power (Watts): 75 W
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TEA1703T/N1,118 TEA1703T/N1,118 NXP Semiconductors TEA1703T.pdf Description: IC CTRLR SMPS GREEN OVP 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V ~ 30V
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 30V
Applications: Secondary-Side Controller
Supplier Device Package: 8-SO
Current - Supply: 30 µA
DigiKey Programmable: Not Verified
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TEA1750T/N1,518 TEA1750T/N1,518 NXP Semiconductors TEA1750.pdf Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 125kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Power (Watts): 250 W
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NTS0103GU10,115 NTS0103GU10,115 NXP Semiconductors NTS0103.pdf Description: NTS0103 - DUAL SUPPLY TRANSLATIN
Packaging: Bulk
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74LVC1G58GM,132 74LVC1G58GM,132 NXP Semiconductors 74LVC1G58.pdf Description: NEXPERIA 74LVC1G58GM - LOGIC CIR
Packaging: Bulk
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CGY1047,112 CGY1047,112 NXP Semiconductors CGY1047.pdf Description: NARROW BAND HIGH POWER AMPLIFIER
Current - Supply: 250 mA
Number of Circuits: 1
Supplier Device Package: SOT115J
Applications: CATV
Mounting Type: Chassis Mount
Output Type: Push-Pull
Package / Case: SOT-115J
Packaging: Tube
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PMXB350UPEZ PMXB350UPEZ NXP Semiconductors PMXB350UPE.pdf Description: NEXPERIA PMXB350UPE - 20 V, P-CH
Input Capacitance (Ciss) (Max) @ Vds: 116 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 2.3 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Supplier Device Package: DFN1010D-3
Vgs(th) (Max) @ Id: 950mV @ 250µA
Power Dissipation (Max): 360mW (Ta), 5.68W (Tc)
Rds On (Max) @ Id, Vgs: 447mOhm @ 1.2A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 1.2A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Packaging: Bulk
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MPC8377VRAGDA NXP Semiconductors FSCLS06714-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8536EBVJAULA NXP Semiconductors FSCL-S-A0001024010-1.pdf?t.download=true&u=5oefqw Description: IC MPU 1.333GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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LPC11U14FET48/201, LPC11U14FET48/201, NXP Semiconductors PHGLS29590-1.pdf?t.download=true&u=5oefqw Description: LPC11U14- Scalable Entry Level 3
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
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LPC11U13FBD48/201, LPC11U13FBD48/201, NXP Semiconductors PHGLS29590-1.pdf?t.download=true&u=5oefqw Description: LPC11U13 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
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TDA10025HN/C1,518 TDA10025HN/C1,518 NXP Semiconductors TDA10025HN_SDS.pdf Description: IC DEMODULATOR DUAL 48-HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Processor
Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
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LPC4076FBD144E NXP Semiconductors PHGLS25790-1.pdf?t.download=true&u=5oefqw Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 109
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BC54-10PASX BC54-10PASX NXP Semiconductors NEXP-S-A0002912161-1.pdf?t.download=true&u=5oefqw Description: TRANS NPN 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 180MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
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MC9S08GT8ACFDE MC9S08GT8ACFDE NXP Semiconductors FSCL-S-A0001034636-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 8KB FLASH 48MAPQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-MAPQFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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60+7.59 EUR
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LPC1112FDH28/102:5 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112FDH28/102:5
Hersteller: NXP Semiconductors
Description: LPC1112 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
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BC859B,215 BC859_BC860.pdf
BC859B,215
Hersteller: NXP Semiconductors
Description: TRANS PNP 30V 0.1A TO-236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 250 mW
Qualification: AEC-Q101
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MKW20Z160VHT4 PHGL-S-A0005067296-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC RF TXRX+MCU 802.15.4
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 28
Current - Transmitting: 8.4mA ~ 18.5mA
Data Rate (Max): 250kbps
Current - Receiving: 6.5mA ~ 15.4mA
Protocol: ZigbeePRO®
Power - Output: 5dBm
Voltage - Supply: 1.45V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 160kB Flash, 20kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Packaging: Bulk
auf Bestellung 220 Stücke:
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Anzahl Preis
77+6.6 EUR
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74LVC139D,112 PHGLS23390-1.pdf?t.download=true&u=5oefqw
74LVC139D,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC139D - DECODER/DRI
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 28668 Stücke:
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Anzahl Preis
1871+0.27 EUR
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MRFE6VP8600HR5 MRFE6VP8600H.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230
Current Rating (Amps): 20µA
Mounting Type: Chassis Mount
Frequency: 470MHz ~ 860MHz
Configuration: Dual, Common Source
Power - Output: 600W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 1.4 A
auf Bestellung 890 Stücke:
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Anzahl Preis
1+564.82 EUR
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BAT18,235 BAT18.pdf
BAT18,235
Hersteller: NXP Semiconductors
Description: RF DIODE STANDARD 35V SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Standard - Single
Operating Temperature: 125°C (TJ)
Capacitance @ Vr, F: 1pF @ 20V, 1MHz
Resistance @ If, F: 700mOhm @ 5mA, 200MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
auf Bestellung 138204 Stücke:
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Anzahl Preis
1551+0.29 EUR
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PCF7961XTT/D1AC09J
Hersteller: NXP Semiconductors
Description: IMMO COMBI CHIP
Supplier Device Package: 20-TSSOP
Applications: Remote Keyless Entry
Voltage - Supply: 2.1V ~ 3.6V
Modulation or Protocol: UHF
Memory Size: 192B RAM, 512B EEPROM
Frequency: 315MHz, 434MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Features: Programmable
Packaging: Bulk
auf Bestellung 2490 Stücke:
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73+6.95 EUR
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PDTA115EU,115 PIRSS13039-1.pdf?t.download=true&u=5oefqw
PDTA115EU,115
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS
Packaging: Bulk
auf Bestellung 284480 Stücke:
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Anzahl Preis
7407+0.06 EUR
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74AUP1G79GM,115 PHGLS24882-1.pdf?t.download=true&u=5oefqw
74AUP1G79GM,115
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Number of Bits per Element: 1
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 50pF
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Input Capacitance: 0.8 pF
Clock Frequency: 309 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 4mA
Current - Quiescent (Iq): 500 nA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 6-XFDFN
Packaging: Bulk
auf Bestellung 180000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4139+0.12 EUR
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74LVC2G02GN,115 74LVC2G02.pdf
74LVC2G02GN,115
Hersteller: NXP Semiconductors
Description: IC DUAL 2-INP
Packaging: Bulk
auf Bestellung 40000 Stücke:
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Anzahl Preis
1708+0.3 EUR
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74HCT2G17GW-Q100H 74HC_HCT2G17_Q100.pdf
74HCT2G17GW-Q100H
Hersteller: NXP Semiconductors
Description: IC BUFF NON-INVERT 5.5V 6-TSSOP
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 6-TSSOP
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Input Type: Schmitt Trigger
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Bulk
auf Bestellung 6000 Stücke:
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Anzahl Preis
2294+0.2 EUR
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MPC860DTCZQ50D4 FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 50MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (2), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TJ)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
auf Bestellung 384 Stücke:
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Anzahl Preis
2+277.16 EUR
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NVT4555UKZ PHGLS28214-1.pdf?t.download=true&u=5oefqw
NVT4555UKZ
Hersteller: NXP Semiconductors
Description: NVT4555UK - SIM card interface l
Supplier Device Package: 12-WLCSP (1.62x1.19)
Applications: SIM Card
Voltage - Supply: 1.1V ~ 3.6V
Mounting Type: Surface Mount
Package / Case: 12-UFBGA, WLCSP
Packaging: Bulk
auf Bestellung 2867 Stücke:
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Anzahl Preis
454+1.11 EUR
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PN7362BNHN/C300Y PN7462.pdf
PN7362BNHN/C300Y
Hersteller: NXP Semiconductors
Description: PN7362 - NFC CORTEX-M0 MICROCONT
DigiKey Programmable: Not Verified
Packaging: Bulk
auf Bestellung 59948 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
48+10.51 EUR
Mindestbestellmenge: 48
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PESD2NFC-LYL PESD5V0F1BL.pdf
PESD2NFC-LYL
Hersteller: NXP Semiconductors
Description: TVS DIODE 24VWM DFN1006-2
Power Line Protection: No
Bidirectional Channels: 1
Supplier Device Package: DFN1006-2
Voltage - Reverse Standoff (Typ): 24V (Max)
Type: Zener
Mounting Type: Surface Mount
Package / Case: SOD-882
Packaging: Bulk
auf Bestellung 10000 Stücke:
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Anzahl Preis
3309+0.15 EUR
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BZX79-C22,143 BZX79.pdf
BZX79-C22,143
Hersteller: NXP Semiconductors
Description: DIODE ZENER 22V 400MW ALF2
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 400 mW
Supplier Device Package: ALF2
Impedance (Max) (Zzt): 55 Ohms
Voltage - Zener (Nom) (Vz): 22 V
Operating Temperature: -65°C ~ 200°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
auf Bestellung 75000 Stücke:
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Anzahl Preis
13172+0.034 EUR
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MC68302AG25C FSCLS09687-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU 25MHZ 144LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Supplier Device Package: 144-LQFP (20x20)
Voltage - I/O: 5V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
auf Bestellung 44 Stücke:
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Anzahl Preis
5+98.18 EUR
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MC68302EH25CB1 FSCLS09687-1.pdf?t.download=true&u=5oefqw
MC68302EH25CB1
Hersteller: NXP Semiconductors
Description: IC MPU M683XX 25MHZ 132PQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8-Bit, 16-Bit
Supplier Device Package: 132-PQFP (24.13x24.13)
Voltage - I/O: 5V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Bulk
auf Bestellung 54 Stücke:
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Anzahl Preis
4+130.68 EUR
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SPC5746CHK1AMMH6 SPC5746CFK1ACKU6.pdf?t.download=true&u=axiww2
SPC5746CHK1AMMH6
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
auf Bestellung 359 Stücke:
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Anzahl Preis
12+38.79 EUR
Mindestbestellmenge: 12
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74AUP1G157GF,132 PHGLS24877-1.pdf?t.download=true&u=5oefqw
74AUP1G157GF,132
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP1G157GF - MULTIPLE
Supplier Device Package: 6-XSON, SOT891 (1x1)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: Multiplexer
Circuit: 1 x 2:1
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
auf Bestellung 15300 Stücke:
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Anzahl Preis
1972+0.25 EUR
Mindestbestellmenge: 1972
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A2V09H400-04NR3 PHGL-S-A0003207742-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 48V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 720MHz ~ 960MHz
Configuration: 2 N-Channel
Power - Output: 107W
Gain: 17.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 688 mA
auf Bestellung 454 Stücke:
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Anzahl Preis
4+156.88 EUR
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PTN5110DHQZ
Hersteller: NXP Semiconductors
Description: USB Type-C Rev 3.0 PD PHY, Dongl
Interface: Bus, I2C
Mounting Type: Surface Mount
Package / Case: 16-XFQFN Exposed Pad
Packaging: Bulk
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Applications: Desktop, Monitors, Notebook PCs, Smartphones, Tablet
Voltage - Supply: 2.7V ~ 5.5V
auf Bestellung 1000 Stücke:
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Anzahl Preis
192+2.55 EUR
Mindestbestellmenge: 192
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74LV04PW,118 PHGL-S-A0001366847-1.pdf?t.download=true&u=5oefqw
74LV04PW,118
Hersteller: NXP Semiconductors
Description: IC INVERTER
Packaging: Bulk
auf Bestellung 3217 Stücke:
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Anzahl Preis
3217+0.19 EUR
Mindestbestellmenge: 3217
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BGU8L1X PHGL-S-A0005068106-1.pdf?t.download=true&u=5oefqw
BGU8L1X
Hersteller: NXP Semiconductors
Description: BGU8L1 - C Low Noise Amplifier M
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 14.5dB
Current - Supply: 4.6mA
Noise Figure: 0.7dB
P1dB: -3dBm
Test Frequency: 882MHz
Supplier Device Package: 6-XSON (1.1x0.7)
auf Bestellung 1352200 Stücke:
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Anzahl Preis
1255+0.4 EUR
Mindestbestellmenge: 1255
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MC9S08SU8VFK PHGL-S-A0003028296-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: MC9S08SU - 8 bit MCU with S08L c
Packaging: Bulk
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08L
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 17
auf Bestellung 463 Stücke:
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Anzahl Preis
118+4.31 EUR
Mindestbestellmenge: 118
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74AUP1G07GF,132 PHGLS25181-1.pdf?t.download=true&u=5oefqw
74AUP1G07GF,132
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON, SOT891 (1x1)
auf Bestellung 295000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3493+0.15 EUR
Mindestbestellmenge: 3493
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CBT3306D,112 CBT3306.pdf
CBT3306D,112
Hersteller: NXP Semiconductors
Description: C3306 - NOW NEXPERIA CBT3306D -
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-SO
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
952+0.54 EUR
Mindestbestellmenge: 952
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BCV65,215 BCV65.pdf
BCV65,215
Hersteller: NXP Semiconductors
Description: TRANS NPN/PNP 30V 100MA SOT-143B
Qualification: AEC-Q101
Grade: Automotive
Supplier Device Package: SOT-143B
DC Current Gain (hFE) (Min) @ Ic, Vce: 75 @ 2mA, 5V
Current - Collector Cutoff (Max): 15nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Voltage - Collector Emitter Breakdown (Max): 30V
Current - Collector (Ic) (Max): 100mA
Power - Max: 250mW
Operating Temperature: 150°C (TJ)
Transistor Type: 1 NPN, 1 PNP (Emitter Coupled)
Mounting Type: Surface Mount
Package / Case: TO-253-4, TO-253AA
Packaging: Bulk
auf Bestellung 4561 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4561+0.13 EUR
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74LV00DB,118 74LV00.pdf
74LV00DB,118
Hersteller: NXP Semiconductors
Description: IC GATE NAND
Packaging: Bulk
auf Bestellung 6000 Stücke:
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Anzahl Preis
1803+0.29 EUR
Mindestbestellmenge: 1803
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74HCT163D,653 PHGL-S-A0001367747-1.pdf?t.download=true&u=5oefqw
74HCT163D,653
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HCT163D - BINARY COUN
Packaging: Bulk
auf Bestellung 6805 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1622+0.32 EUR
Mindestbestellmenge: 1622
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PCMF1USB30Z PCMFXUSB30_SER.pdf
PCMF1USB30Z
Hersteller: NXP Semiconductors
Description: NEXPERIA PCMF1USB - ELECTRONIC I
Packaging: Bulk
auf Bestellung 20495 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1998+0.25 EUR
Mindestbestellmenge: 1998
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PZU20BA,115 PZUXBA_SER.pdf
PZU20BA,115
Hersteller: NXP Semiconductors
Description: DIODE ZENER 20V 320MW SOD323
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
auf Bestellung 48000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12488+0.034 EUR
Mindestbestellmenge: 12488
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PZU20B1A,115 PZUXBA_SER.pdf
PZU20B1A,115
Hersteller: NXP Semiconductors
Description: DIODE ZENER 20V 320MW SOD323
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 320 mW
Supplier Device Package: SOD-323
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 20 V
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Tolerance: ±2%
Packaging: Bulk
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15000+0.034 EUR
Mindestbestellmenge: 15000
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PZU20B2,115 PHGLS19743-1.pdf?t.download=true&u=5oefqw
PZU20B2,115
Hersteller: NXP Semiconductors
Description: DIODE ZENER 20V 310MW SOD323F
Current - Reverse Leakage @ Vr: 50 nA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 310 mW
Supplier Device Package: SOD-323F
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 20 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-90, SOD-323F
Tolerance: ±2%
Packaging: Bulk
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10804+0.051 EUR
Mindestbestellmenge: 10804
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MPC8545VJATGD FSCLS11828-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC85XX 1.2GHZ 783BGA
Packaging: Bulk
Package / Case: 783-BBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-PBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: AES, Cryptography, Kasumi, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, RapidIO
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2+371.2 EUR
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SCC2698BC1A84,512 SCC2698B.pdf
SCC2698BC1A84,512
Hersteller: NXP Semiconductors
Description: IC UART OCTAL ENHANCED 84-PLCC
With Modem Control: Yes
With False Start Bit Detection: Yes
With Auto Flow Control: Yes
Supplier Device Package: 84-PLCC (29.26x29.26)
Protocol: RS485
Voltage - Supply: 5V
Mounting Type: Surface Mount
Number of Channels: 8
Package / Case: 84-LCC (J-Lead)
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Bulk
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9+52.78 EUR
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MFRC53101T/0FE,112
MFRC53101T/0FE,112
Hersteller: NXP Semiconductors
Description: STANDARD ISO/IEC 14443 A/B READE
Packaging: Bulk
auf Bestellung 55 Stücke:
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Anzahl Preis
18+25.37 EUR
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PMEG2010EPASX NEXP-S-A0003105495-1.pdf?t.download=true&u=5oefqw
PMEG2010EPASX
Hersteller: NXP Semiconductors
Description: DIODE SCHOTTKY 20V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Schottky
Capacitance @ Vr, F: 175pF @ 1V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DFN2020D-3
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 375 mV @ 1 A
Current - Reverse Leakage @ Vr: 335 µA @ 20 V
Qualification: AEC-Q101
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Anzahl Preis
1013+0.45 EUR
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PMEG6010ESBYL PMEG6010ESB.pdf
Hersteller: NXP Semiconductors
Description: DIODE SCHOTTKY 60V 1A DSN1006-2
Current - Reverse Leakage @ Vr: 30 µA @ 60 V
Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 60 V
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: DSN1006-2
Current - Average Rectified (Io): 1A
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Technology: Schottky
Reverse Recovery Time (trr): 2.4 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: 2-XDFN
Packaging: Bulk
auf Bestellung 199680 Stücke:
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Anzahl Preis
7088+0.067 EUR
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BZX884-C12,315 PHGLS19465-1.pdf?t.download=true&u=5oefqw
BZX884-C12,315
Hersteller: NXP Semiconductors
Description: DIODE ZENER 12V 250MW DFN1006-2
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Supplier Device Package: DFN1006-2
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-882
Tolerance: ±5%
Packaging: Bulk
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18159+0.034 EUR
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BFG505/X,215 BFG505_X_Rev4.pdf
BFG505/X,215
Hersteller: NXP Semiconductors
Description: RF TRANS NPN 15V 9GHZ SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 18mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz
Supplier Device Package: SOT-143B
auf Bestellung 4610 Stücke:
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Anzahl Preis
1135+0.4 EUR
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PBSS5230QAZ PBSS5230QA.pdf
PBSS5230QAZ
Hersteller: NXP Semiconductors
Description: TRANS PNP 30V 2A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 210mV @ 50mA, 1A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V
Frequency - Transition: 170MHz
Supplier Device Package: DFN1010D-3
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 325 mW
auf Bestellung 554308 Stücke:
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Anzahl Preis
4691+0.1 EUR
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TDA3664AT/N1,118 TDA3664.pdf
TDA3664AT/N1,118
Hersteller: NXP Semiconductors
Description: IC REG LINEAR 5V 100MA 8-SO
Operating Temperature: -40°C ~ 125°C
Current - Output: 100mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Current - Quiescent (Iq): 30 µA
Output Configuration: Positive
Current - Supply (Max): 2.5 mA
Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage
Voltage Dropout (Max): 0.3V @ 50mA
PSRR: 60dB (120Hz)
Voltage - Output (Min/Fixed): 5V
Supplier Device Package: 8-SO
Number of Regulators: 1
Voltage - Input (Max): 45V
auf Bestellung 59 Stücke:
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59+7.66 EUR
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74AUP3G17GTX 74AUP3G17.pdf
74AUP3G17GTX
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP3G17 - LOW-POWER T
Packaging: Bulk
auf Bestellung 4973 Stücke:
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Anzahl Preis
2565+0.19 EUR
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MC33886PVWR2 FSCLS11623-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: 5.0 A H-Bridge
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 20-HSOP
Voltage - Load: 5V ~ 40V
Technology: CMOS
Applications: General Purpose
Voltage - Supply: 5V ~ 40V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 125°C (TA)
Interface: Parallel
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Packaging: Bulk
auf Bestellung 625 Stücke:
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52+9.02 EUR
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TEA1733MT/N2,118 TEA1733MT.pdf
TEA1733MT/N2,118
Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 91.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Power (Watts): 75 W
auf Bestellung 2500 Stücke:
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519+0.87 EUR
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TEA1703T/N1,118 TEA1703T.pdf
TEA1703T/N1,118
Hersteller: NXP Semiconductors
Description: IC CTRLR SMPS GREEN OVP 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V ~ 30V
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 30V
Applications: Secondary-Side Controller
Supplier Device Package: 8-SO
Current - Supply: 30 µA
DigiKey Programmable: Not Verified
auf Bestellung 9883 Stücke:
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Anzahl Preis
404+1.12 EUR
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TEA1750T/N1,518 TEA1750.pdf
TEA1750T/N1,518
Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 125kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Power (Watts): 250 W
auf Bestellung 4502 Stücke:
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202+2.25 EUR
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NTS0103GU10,115 NTS0103.pdf
NTS0103GU10,115
Hersteller: NXP Semiconductors
Description: NTS0103 - DUAL SUPPLY TRANSLATIN
Packaging: Bulk
auf Bestellung 6604 Stücke:
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Anzahl Preis
340+1.31 EUR
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74LVC1G58GM,132 74LVC1G58.pdf
74LVC1G58GM,132
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC1G58GM - LOGIC CIR
Packaging: Bulk
auf Bestellung 1069960 Stücke:
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Anzahl Preis
1625+0.27 EUR
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CGY1047,112 CGY1047.pdf
CGY1047,112
Hersteller: NXP Semiconductors
Description: NARROW BAND HIGH POWER AMPLIFIER
Current - Supply: 250 mA
Number of Circuits: 1
Supplier Device Package: SOT115J
Applications: CATV
Mounting Type: Chassis Mount
Output Type: Push-Pull
Package / Case: SOT-115J
Packaging: Tube
auf Bestellung 2194 Stücke:
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12+38.99 EUR
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PMXB350UPEZ PMXB350UPE.pdf
PMXB350UPEZ
Hersteller: NXP Semiconductors
Description: NEXPERIA PMXB350UPE - 20 V, P-CH
Input Capacitance (Ciss) (Max) @ Vds: 116 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 2.3 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Supplier Device Package: DFN1010D-3
Vgs(th) (Max) @ Id: 950mV @ 250µA
Power Dissipation (Max): 360mW (Ta), 5.68W (Tc)
Rds On (Max) @ Id, Vgs: 447mOhm @ 1.2A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 1.2A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Packaging: Bulk
auf Bestellung 659217 Stücke:
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Anzahl Preis
3703+0.12 EUR
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MPC8377VRAGDA FSCLS06714-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
auf Bestellung 339 Stücke:
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Anzahl Preis
4+102.41 EUR
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MPC8536EBVJAULA FSCL-S-A0001024010-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU 1.333GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
auf Bestellung 36 Stücke:
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Anzahl Preis
1+462.7 EUR
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LPC11U14FET48/201, PHGLS29590-1.pdf?t.download=true&u=5oefqw
LPC11U14FET48/201,
Hersteller: NXP Semiconductors
Description: LPC11U14- Scalable Entry Level 3
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
auf Bestellung 861 Stücke:
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103+4.42 EUR
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LPC11U13FBD48/201, PHGLS29590-1.pdf?t.download=true&u=5oefqw
LPC11U13FBD48/201,
Hersteller: NXP Semiconductors
Description: LPC11U13 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
auf Bestellung 1095 Stücke:
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Anzahl Preis
112+4.07 EUR
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TDA10025HN/C1,518 TDA10025HN_SDS.pdf
TDA10025HN/C1,518
Hersteller: NXP Semiconductors
Description: IC DEMODULATOR DUAL 48-HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Processor
Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
auf Bestellung 4000 Stücke:
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Anzahl Preis
117+3.83 EUR
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LPC4076FBD144E PHGLS25790-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 109
auf Bestellung 654 Stücke:
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Anzahl Preis
37+12.61 EUR
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BC54-10PASX NEXP-S-A0002912161-1.pdf?t.download=true&u=5oefqw
BC54-10PASX
Hersteller: NXP Semiconductors
Description: TRANS NPN 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 180MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
auf Bestellung 146990 Stücke:
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Anzahl Preis
3904+0.12 EUR
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MC9S08GT8ACFDE FSCL-S-A0001034636-1.pdf?t.download=true&u=5oefqw
MC9S08GT8ACFDE
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 8KB FLASH 48MAPQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-MAPQFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 393 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
60+7.59 EUR
Mindestbestellmenge: 60
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