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TEA1750T/N1,518 TEA1750T/N1,518 NXP Semiconductors TEA1750.pdf Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 125kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Power (Watts): 250 W
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NTS0103GU10,115 NTS0103GU10,115 NXP Semiconductors NTS0103.pdf Description: NTS0103 - DUAL SUPPLY TRANSLATIN
Packaging: Bulk
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74LVC1G58GM,132 74LVC1G58GM,132 NXP Semiconductors 74LVC1G58.pdf Description: NEXPERIA 74LVC1G58GM - LOGIC CIR
Packaging: Bulk
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CGY1047,112 CGY1047,112 NXP Semiconductors CGY1047.pdf Description: NARROW BAND HIGH POWER AMPLIFIER
Current - Supply: 250 mA
Number of Circuits: 1
Supplier Device Package: SOT115J
Applications: CATV
Mounting Type: Chassis Mount
Output Type: Push-Pull
Package / Case: SOT-115J
Packaging: Tube
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PMXB350UPEZ PMXB350UPEZ NXP Semiconductors PMXB350UPE.pdf Description: NEXPERIA PMXB350UPE - 20 V, P-CH
Input Capacitance (Ciss) (Max) @ Vds: 116 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 2.3 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Supplier Device Package: DFN1010D-3
Vgs(th) (Max) @ Id: 950mV @ 250µA
Power Dissipation (Max): 360mW (Ta), 5.68W (Tc)
Rds On (Max) @ Id, Vgs: 447mOhm @ 1.2A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 1.2A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Packaging: Bulk
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MPC8377VRAGDA NXP Semiconductors FSCLS06714-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8536EBVJAULA NXP Semiconductors FSCL-S-A0001024010-1.pdf?t.download=true&u=5oefqw Description: IC MPU 1.333GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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LPC11U14FET48/201, LPC11U14FET48/201, NXP Semiconductors PHGLS29590-1.pdf?t.download=true&u=5oefqw Description: LPC11U14- Scalable Entry Level 3
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
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LPC11U13FBD48/201, LPC11U13FBD48/201, NXP Semiconductors PHGLS29590-1.pdf?t.download=true&u=5oefqw Description: LPC11U13 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
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TDA10025HN/C1,518 TDA10025HN/C1,518 NXP Semiconductors TDA10025HN_SDS.pdf Description: IC DEMODULATOR DUAL 48-HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Processor
Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
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LPC4076FBD144E NXP Semiconductors PHGLS25790-1.pdf?t.download=true&u=5oefqw Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 109
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BC54-10PASX BC54-10PASX NXP Semiconductors NEXP-S-A0002912161-1.pdf?t.download=true&u=5oefqw Description: TRANS NPN 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 180MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
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MC9S08GT8ACFDE MC9S08GT8ACFDE NXP Semiconductors FSCL-S-A0001034636-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 8KB FLASH 48MAPQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-MAPQFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MCF51AC128CCFGE NXP Semiconductors FSCLS07439-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50.33MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
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AFT27S010NT1 NXP Semiconductors AFT27S010N.pdf Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Bulk
Package / Case: PLD-1.5W
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 728MHz ~ 3.6GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
Produkt ist nicht verfügbar
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MKM33Z64CLH5 NXP Semiconductors FSCL-S-A0000577355-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR, 24b Sigma-Delta
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
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TEA1738GT/N1,118 TEA1738GT/N1,118 NXP Semiconductors TEA1738GT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 118kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature
Voltage - Start Up: 13.2 V
Power (Watts): 75 W
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BAP1321-03,115 BAP1321-03,115 NXP Semiconductors BAP1321-03_Rev_Oct2010.pdf Description: RF DIODE PIN 60V 500MW SOD-323
Power Dissipation (Max): 500 mW
Current - Max: 100 mA
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 60V
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SC-76, SOD-323
Packaging: Bulk
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HT2MOA4S20/E/3/RJ NXP Semiconductors HT2X_SDS.pdf Description: HITAG 2 transponder IC
Packaging: Bulk
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -55°C ~ 140°C
Voltage - Supply: 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: PLLMC
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74AUP3G34GDH 74AUP3G34GDH NXP Semiconductors 74AUP3G34.pdf Description: NEXPERIA 74AUP3G34 - NON INVERTI
Packaging: Bulk
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74AUP3G34GNX 74AUP3G34GNX NXP Semiconductors 74AUP3G34.pdf Description: NEXPERIA 74AUP3G34 - LOW-POWER T
Packaging: Bulk
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MC9S08JM16CLD NXP Semiconductors FSCLS07475-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
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MCIMX6Q5EZK08AD NXP Semiconductors PHGL-S-A0006627490-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Bulk
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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PMEG4002ESFYL PMEG4002ESFYL NXP Semiconductors PMEG4002ESF.pdf Description: DIODE SCHOTTK 40V 200MA DSN06032
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 1.28 ns
Technology: Schottky
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 600 mV @ 200 mA
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
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MCIMX6X3EVK10AB MCIMX6X3EVK10AB NXP Semiconductors PHGL-S-A0006655202-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Bulk
Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: DDR3, DDR3L, LPDDR2
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1GHz, 227MHz
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MCIMX6X3EVN10AB MCIMX6X3EVN10AB NXP Semiconductors FSCL-S-A0001130441-1.pdf?t.download=true&u=5oefqw Description: IC MPU 227MHZ/1GHZ 400MAPBGA
Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: DDR3, DDR3L, LPDDR2
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Bulk
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
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12+45.65 EUR
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74HCT4538D,112 74HCT4538D,112 NXP Semiconductors 74HCT4538.pdf Description: NEXPERIA 74HCT4538D - MONOSTABLE
Packaging: Bulk
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LPC11U35FBD64/401, LPC11U35FBD64/401, NXP Semiconductors PHGLS29590-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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LPC11U37FBD64/501, LPC11U37FBD64/501, NXP Semiconductors PHGLS29590-1.pdf?t.download=true&u=5oefqw Description: LPC11U37 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
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LPC11U24FHI33/301, LPC11U24FHI33/301, NXP Semiconductors PHGLS29590-1.pdf?t.download=true&u=5oefqw Description: LPC11U24 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
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LPC11U34FHN33/311, LPC11U34FHN33/311, NXP Semiconductors PHGLS29590-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 40KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 40KB (40K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
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LPC11U34FBD48/311, LPC11U34FBD48/311, NXP Semiconductors PHGLS29590-1.pdf?t.download=true&u=5oefqw Description: LPC11U34 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 40KB (40K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
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LPC11U35FET48/501, LPC11U35FET48/501, NXP Semiconductors LPC11U3X.pdf Description: IC MCU 32BIT 64KB FLASH 48TFBGA
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
DigiKey Programmable: Not Verified
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LPC11U66JBD48E LPC11U66JBD48E NXP Semiconductors PHGLS29590-1.pdf?t.download=true&u=5oefqw Description: LPC11U66 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
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BZV85-C27,113 BZV85-C27,113 NXP Semiconductors PHGLS22780-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 27V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 19 V
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JN5168-001-M00Z JN5168-001-M00Z NXP Semiconductors PHGLS29857-1.pdf?t.download=true&u=5oefqw Description: RF TXRX MOD 802.15.4 TH SMD
Package / Case: 40-VFQFN Exposed Pad
Packaging: Bulk
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
Antenna Type: Integrated, Trace
Current - Transmitting: 15.3mA
Current - Receiving: 17mA
Protocol: Zigbee®
Power - Output: 2.5dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -95dBm
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BAP65-05,215 BAP65-05,215 NXP Semiconductors BAP65-05.pdf Description: RF DIODE PIN 30V 250MW SOT-23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
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AFV10700HR5 NXP Semiconductors AFV10700H.pdf Description: RF MOSFET LDMOS 52V NI780
Current - Test: 100 mA
Voltage - Test: 52 V
Voltage - Rated: 105 V
Supplier Device Package: NI-780-4
Technology: LDMOS (Dual)
Gain: 19.2dB
Power - Output: 700W
Configuration: 2 N-Channel
Frequency: 960MHz ~ 1.215GHz
Mounting Type: Chassis Mount
Current Rating (Amps): 1µA
Package / Case: NI-780-4
Packaging: Bulk
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BF1100R,215 BF1100R,215 NXP Semiconductors BF1100%28R%29.pdf Description: RF MOSFET 9V SOT143R
Packaging: Bulk
Package / Case: SOT-143R
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: SOT-143R
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
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TDA18273HN/C1,518 TDA18273HN/C1,518 NXP Semiconductors TDA18273HN_SDS.pdf Description: IC SILICON TUNER HYBRID 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Professional Video
Standards: DVB-T2, DVB-C2
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I2C
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PCA9306GF,115 PCA9306GF,115 NXP Semiconductors PCA9306.pdf Description: IC XLTR VL BIDIR 8-XSON/SOT1089
Packaging: Bulk
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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BC857CMB,315 BC857CMB,315 NXP Semiconductors PHGLS24397-1.pdf?t.download=true&u=5oefqw Description: TRANS PNP 45V 0.1A DFN1006B-3
Packaging: Bulk
Package / Case: 3-XFDFN
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 250 mW
Qualification: AEC-Q101
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TJA1055T/C,512 TJA1055T/C,512 NXP Semiconductors TJA1055.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
Produkt ist nicht verfügbar
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LPC54018J2MET180E NXP Semiconductors LPC54018JxM-LPC54S018JxM.pdf Description: LPC54018 - ARM Cortex-M4, Bosch
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Bulk
Number of I/O: 137
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Program Memory Size: 2MB (2M x 8)
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BZV85-C6V2,133 BZV85-C6V2,133 NXP Semiconductors BZV85_SER.pdf Description: DIODE ZENER 6.2V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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BAP50-04,215 BAP50-04,215 NXP Semiconductors BAP50-04.pdf Description: RF DIODE PIN 50V 250MW SOT-23
Power Dissipation (Max): 250 mW
Current - Max: 50 mA
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
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A7101CLTK2/T0BC2WJ A7101CLTK2/T0BC2WJ NXP Semiconductors PHGL-S-A0006349687-1.pdf?t.download=true&amp;u=5oefqw Description: RF MOSFET
Packaging: Bulk
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LPC1751FBD80,551 LPC1751FBD80,551 NXP Semiconductors LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 32KB FLASH 80LQFP
Packaging: Bulk
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HCT85D,653 74HCT85D,653 NXP Semiconductors PHGLS05972-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74HCT85D - MAGNITUDE CO
Packaging: Bulk
auf Bestellung 1394 Stücke:
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TDA8787AHL/C3,151 TDA8787AHL/C3,151 NXP Semiconductors TDA8787A.pdf Description: ADC 10BIT 18MSPS 48-LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Type: CCD (Charged Coupled Device)
Data Interface: Serial
Operating Temperature: -20°C ~ 75°C
Voltage - Supply: 2.7V ~ 3.6V
Sampling Rate (Per Second): 18m
Resolution (Bits): 10 b
Voltage Supply Source: Analog and Digital
Supplier Device Package: 48-LQFP (7x7)
Number of Channels: 1
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1N4749A,133 1N4749A,133 NXP Semiconductors 1N4728A_SER.pdf Description: DIODE ZENER 24V 1W DO41
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 18.2 V
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MC33PF8201A0ES MC33PF8201A0ES NXP Semiconductors PF8101_PF8201.pdf Description: PF8201 - POWER MANAGEMENT IC
Supplier Device Package: 56-HVQFN (8x8)
Voltage - Supply: 2.5V ~ 5.5V, 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Bulk
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PCA9554ADB,112 PCA9554ADB,112 NXP Semiconductors PCA9554%28A%29.pdf Description: IC XPNDR 400KHZ I2C SMBUS 16SSOP
DigiKey Programmable: Not Verified
Current - Output Source/Sink: 10mA, 25mA
Supplier Device Package: 16-SSOP
Interrupt Output: Yes
Clock Frequency: 400 kHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C, SMBus
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Features: POR
Packaging: Tube
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CBTL05023BS,118 CBTL05023BS,118 NXP Semiconductors CBTL05023.pdf Description: DIFFERENTIAL MULTIPLEXER, PQCC24
Packaging: Bulk
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PDTD123YQAZ PDTD123YQAZ NXP Semiconductors PDTD113Z_123Y_143XQA_SER.pdf Description: TRANS PREBIAS 50V 500MA
Packaging: Bulk
auf Bestellung 24000 Stücke:
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2814+0.2 EUR
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T1014NSN7MQA NXP Semiconductors FSCL-S-A0001108389-1.pdf?t.download=true&u=5oefqw Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1GbE (3), 10GbE (1), 2.5GbE (3)
Supplier Device Package: 780-FBGA (23x23)
Voltage - I/O: 1.2V, 1.8V
Core Processor: PowerPC e5500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.2GHz
SATA: SATA 3Gbps (1)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Display & Interface Controllers: LCD
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4
Additional Interfaces: DMA, GPIO, I2C, MMC/SD, PCIe, SPI, UART
Mounting Type: Surface Mount
Package / Case: 780-FBGA
Packaging: Bulk
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LPC11U68JBD64K LPC11U68JBD64K NXP Semiconductors PHGLS29590-1.pdf?t.download=true&u=5oefqw Description: LPC11U68 - Cortex-M0+/M0 RISC Mi
Number of I/O: 48
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x12b SAR
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 36K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
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PSMN8R5-100ESFQ PSMN8R5-100ESFQ NXP Semiconductors PSMN8R5-100ESF.pdf Description: NEXPERIA PSMN8R5 - NEXTPOWER 100
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 183W (Ta)
Rds On (Max) @ Id, Vgs: 8.8mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 97A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Bulk
Input Capacitance (Ciss) (Max) @ Vds: 3181 pF @ 50 V
Gate Charge (Qg) (Max) @ Vgs: 44.5 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 7V, 10V
Supplier Device Package: I2PAK
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PCA9538PW,112 PCA9538PW,112 NXP Semiconductors PCA9538.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Tube
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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BF1216,115 BF1216,115 NXP Semiconductors BF1216_Rev1.pdf Description: RF MOSFET 5V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 30dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: 6-TSSOP
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 19 mA
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TEA1750T/N1,518 TEA1750.pdf
TEA1750T/N1,518
Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 125kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Power (Watts): 250 W
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NTS0103GU10,115 NTS0103.pdf
NTS0103GU10,115
Hersteller: NXP Semiconductors
Description: NTS0103 - DUAL SUPPLY TRANSLATIN
Packaging: Bulk
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74LVC1G58GM,132 74LVC1G58.pdf
74LVC1G58GM,132
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC1G58GM - LOGIC CIR
Packaging: Bulk
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CGY1047,112 CGY1047.pdf
CGY1047,112
Hersteller: NXP Semiconductors
Description: NARROW BAND HIGH POWER AMPLIFIER
Current - Supply: 250 mA
Number of Circuits: 1
Supplier Device Package: SOT115J
Applications: CATV
Mounting Type: Chassis Mount
Output Type: Push-Pull
Package / Case: SOT-115J
Packaging: Tube
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PMXB350UPEZ PMXB350UPE.pdf
PMXB350UPEZ
Hersteller: NXP Semiconductors
Description: NEXPERIA PMXB350UPE - 20 V, P-CH
Input Capacitance (Ciss) (Max) @ Vds: 116 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 2.3 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Supplier Device Package: DFN1010D-3
Vgs(th) (Max) @ Id: 950mV @ 250µA
Power Dissipation (Max): 360mW (Ta), 5.68W (Tc)
Rds On (Max) @ Id, Vgs: 447mOhm @ 1.2A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 1.2A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Packaging: Bulk
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MPC8377VRAGDA FSCLS06714-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8536EBVJAULA FSCL-S-A0001024010-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU 1.333GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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LPC11U14FET48/201, PHGLS29590-1.pdf?t.download=true&u=5oefqw
LPC11U14FET48/201,
Hersteller: NXP Semiconductors
Description: LPC11U14- Scalable Entry Level 3
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
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LPC11U13FBD48/201, PHGLS29590-1.pdf?t.download=true&u=5oefqw
LPC11U13FBD48/201,
Hersteller: NXP Semiconductors
Description: LPC11U13 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
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TDA10025HN/C1,518 TDA10025HN_SDS.pdf
TDA10025HN/C1,518
Hersteller: NXP Semiconductors
Description: IC DEMODULATOR DUAL 48-HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Processor
Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
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LPC4076FBD144E PHGLS25790-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 109
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BC54-10PASX NEXP-S-A0002912161-1.pdf?t.download=true&u=5oefqw
BC54-10PASX
Hersteller: NXP Semiconductors
Description: TRANS NPN 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 180MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
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MC9S08GT8ACFDE FSCL-S-A0001034636-1.pdf?t.download=true&u=5oefqw
MC9S08GT8ACFDE
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 8KB FLASH 48MAPQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-MAPQFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MCF51AC128CCFGE FSCLS07439-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50.33MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
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AFT27S010NT1 AFT27S010N.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Bulk
Package / Case: PLD-1.5W
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 728MHz ~ 3.6GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
Produkt ist nicht verfügbar
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MKM33Z64CLH5 FSCL-S-A0000577355-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR, 24b Sigma-Delta
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
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TEA1738GT/N1,118 TEA1738GT.pdf
TEA1738GT/N1,118
Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 118kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature
Voltage - Start Up: 13.2 V
Power (Watts): 75 W
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BAP1321-03,115 BAP1321-03_Rev_Oct2010.pdf
BAP1321-03,115
Hersteller: NXP Semiconductors
Description: RF DIODE PIN 60V 500MW SOD-323
Power Dissipation (Max): 500 mW
Current - Max: 100 mA
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 60V
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SC-76, SOD-323
Packaging: Bulk
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HT2MOA4S20/E/3/RJ HT2X_SDS.pdf
Hersteller: NXP Semiconductors
Description: HITAG 2 transponder IC
Packaging: Bulk
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -55°C ~ 140°C
Voltage - Supply: 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: PLLMC
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74AUP3G34GDH 74AUP3G34.pdf
74AUP3G34GDH
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP3G34 - NON INVERTI
Packaging: Bulk
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74AUP3G34GNX 74AUP3G34.pdf
74AUP3G34GNX
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP3G34 - LOW-POWER T
Packaging: Bulk
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MC9S08JM16CLD FSCLS07475-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
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MCIMX6Q5EZK08AD PHGL-S-A0006627490-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Bulk
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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PMEG4002ESFYL PMEG4002ESF.pdf
PMEG4002ESFYL
Hersteller: NXP Semiconductors
Description: DIODE SCHOTTK 40V 200MA DSN06032
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 1.28 ns
Technology: Schottky
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 600 mV @ 200 mA
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
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MCIMX6X3EVK10AB PHGL-S-A0006655202-1.pdf?t.download=true&u=5oefqw
MCIMX6X3EVK10AB
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Bulk
Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: DDR3, DDR3L, LPDDR2
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1GHz, 227MHz
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MCIMX6X3EVN10AB FSCL-S-A0001130441-1.pdf?t.download=true&u=5oefqw
MCIMX6X3EVN10AB
Hersteller: NXP Semiconductors
Description: IC MPU 227MHZ/1GHZ 400MAPBGA
Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: DDR3, DDR3L, LPDDR2
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Bulk
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
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74HCT4538D,112 74HCT4538.pdf
74HCT4538D,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HCT4538D - MONOSTABLE
Packaging: Bulk
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LPC11U35FBD64/401, PHGLS29590-1.pdf?t.download=true&u=5oefqw
LPC11U35FBD64/401,
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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LPC11U37FBD64/501, PHGLS29590-1.pdf?t.download=true&u=5oefqw
LPC11U37FBD64/501,
Hersteller: NXP Semiconductors
Description: LPC11U37 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
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LPC11U24FHI33/301, PHGLS29590-1.pdf?t.download=true&u=5oefqw
LPC11U24FHI33/301,
Hersteller: NXP Semiconductors
Description: LPC11U24 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
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LPC11U34FHN33/311, PHGLS29590-1.pdf?t.download=true&u=5oefqw
LPC11U34FHN33/311,
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 40KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 40KB (40K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
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LPC11U34FBD48/311, PHGLS29590-1.pdf?t.download=true&u=5oefqw
LPC11U34FBD48/311,
Hersteller: NXP Semiconductors
Description: LPC11U34 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 40KB (40K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
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LPC11U35FET48/501, LPC11U3X.pdf
LPC11U35FET48/501,
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 64KB FLASH 48TFBGA
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
DigiKey Programmable: Not Verified
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LPC11U66JBD48E PHGLS29590-1.pdf?t.download=true&u=5oefqw
LPC11U66JBD48E
Hersteller: NXP Semiconductors
Description: LPC11U66 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
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73+7.44 EUR
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BZV85-C27,113 PHGLS22780-1.pdf?t.download=true&u=5oefqw
BZV85-C27,113
Hersteller: NXP Semiconductors
Description: DIODE ZENER 27V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 19 V
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JN5168-001-M00Z PHGLS29857-1.pdf?t.download=true&u=5oefqw
JN5168-001-M00Z
Hersteller: NXP Semiconductors
Description: RF TXRX MOD 802.15.4 TH SMD
Package / Case: 40-VFQFN Exposed Pad
Packaging: Bulk
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
Antenna Type: Integrated, Trace
Current - Transmitting: 15.3mA
Current - Receiving: 17mA
Protocol: Zigbee®
Power - Output: 2.5dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -95dBm
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BAP65-05,215 BAP65-05.pdf
BAP65-05,215
Hersteller: NXP Semiconductors
Description: RF DIODE PIN 30V 250MW SOT-23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
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AFV10700HR5 AFV10700H.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 52V NI780
Current - Test: 100 mA
Voltage - Test: 52 V
Voltage - Rated: 105 V
Supplier Device Package: NI-780-4
Technology: LDMOS (Dual)
Gain: 19.2dB
Power - Output: 700W
Configuration: 2 N-Channel
Frequency: 960MHz ~ 1.215GHz
Mounting Type: Chassis Mount
Current Rating (Amps): 1µA
Package / Case: NI-780-4
Packaging: Bulk
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BF1100R,215 BF1100%28R%29.pdf
BF1100R,215
Hersteller: NXP Semiconductors
Description: RF MOSFET 9V SOT143R
Packaging: Bulk
Package / Case: SOT-143R
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: SOT-143R
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
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TDA18273HN/C1,518 TDA18273HN_SDS.pdf
TDA18273HN/C1,518
Hersteller: NXP Semiconductors
Description: IC SILICON TUNER HYBRID 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Professional Video
Standards: DVB-T2, DVB-C2
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I2C
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PCA9306GF,115 PCA9306.pdf
PCA9306GF,115
Hersteller: NXP Semiconductors
Description: IC XLTR VL BIDIR 8-XSON/SOT1089
Packaging: Bulk
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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BC857CMB,315 PHGLS24397-1.pdf?t.download=true&u=5oefqw
BC857CMB,315
Hersteller: NXP Semiconductors
Description: TRANS PNP 45V 0.1A DFN1006B-3
Packaging: Bulk
Package / Case: 3-XFDFN
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 250 mW
Qualification: AEC-Q101
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3980+0.14 EUR
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TJA1055T/C,512 TJA1055.pdf
TJA1055T/C,512
Hersteller: NXP Semiconductors
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
Produkt ist nicht verfügbar
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LPC54018J2MET180E LPC54018JxM-LPC54S018JxM.pdf
Hersteller: NXP Semiconductors
Description: LPC54018 - ARM Cortex-M4, Bosch
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Bulk
Number of I/O: 137
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Program Memory Size: 2MB (2M x 8)
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9+60.29 EUR
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BZV85-C6V2,133 BZV85_SER.pdf
BZV85-C6V2,133
Hersteller: NXP Semiconductors
Description: DIODE ZENER 6.2V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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BAP50-04,215 BAP50-04.pdf
BAP50-04,215
Hersteller: NXP Semiconductors
Description: RF DIODE PIN 50V 250MW SOT-23
Power Dissipation (Max): 250 mW
Current - Max: 50 mA
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
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1846+0.3 EUR
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A7101CLTK2/T0BC2WJ PHGL-S-A0006349687-1.pdf?t.download=true&amp;u=5oefqw
A7101CLTK2/T0BC2WJ
Hersteller: NXP Semiconductors
Description: RF MOSFET
Packaging: Bulk
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LPC1751FBD80,551 LPC1759_58_56_54_52_51.pdf
LPC1751FBD80,551
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 32KB FLASH 80LQFP
Packaging: Bulk
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HCT85D,653 PHGLS05972-1.pdf?t.download=true&u=5oefqw
74HCT85D,653
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HCT85D - MAGNITUDE CO
Packaging: Bulk
auf Bestellung 1394 Stücke:
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397+1.38 EUR
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TDA8787AHL/C3,151 TDA8787A.pdf
TDA8787AHL/C3,151
Hersteller: NXP Semiconductors
Description: ADC 10BIT 18MSPS 48-LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Type: CCD (Charged Coupled Device)
Data Interface: Serial
Operating Temperature: -20°C ~ 75°C
Voltage - Supply: 2.7V ~ 3.6V
Sampling Rate (Per Second): 18m
Resolution (Bits): 10 b
Voltage Supply Source: Analog and Digital
Supplier Device Package: 48-LQFP (7x7)
Number of Channels: 1
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1N4749A,133 1N4728A_SER.pdf
1N4749A,133
Hersteller: NXP Semiconductors
Description: DIODE ZENER 24V 1W DO41
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 18.2 V
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MC33PF8201A0ES PF8101_PF8201.pdf
MC33PF8201A0ES
Hersteller: NXP Semiconductors
Description: PF8201 - POWER MANAGEMENT IC
Supplier Device Package: 56-HVQFN (8x8)
Voltage - Supply: 2.5V ~ 5.5V, 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Bulk
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PCA9554ADB,112 PCA9554%28A%29.pdf
PCA9554ADB,112
Hersteller: NXP Semiconductors
Description: IC XPNDR 400KHZ I2C SMBUS 16SSOP
DigiKey Programmable: Not Verified
Current - Output Source/Sink: 10mA, 25mA
Supplier Device Package: 16-SSOP
Interrupt Output: Yes
Clock Frequency: 400 kHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C, SMBus
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Features: POR
Packaging: Tube
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CBTL05023BS,118 CBTL05023.pdf
CBTL05023BS,118
Hersteller: NXP Semiconductors
Description: DIFFERENTIAL MULTIPLEXER, PQCC24
Packaging: Bulk
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PDTD123YQAZ PDTD113Z_123Y_143XQA_SER.pdf
PDTD123YQAZ
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS 50V 500MA
Packaging: Bulk
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T1014NSN7MQA FSCL-S-A0001108389-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1GbE (3), 10GbE (1), 2.5GbE (3)
Supplier Device Package: 780-FBGA (23x23)
Voltage - I/O: 1.2V, 1.8V
Core Processor: PowerPC e5500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.2GHz
SATA: SATA 3Gbps (1)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Display & Interface Controllers: LCD
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4
Additional Interfaces: DMA, GPIO, I2C, MMC/SD, PCIe, SPI, UART
Mounting Type: Surface Mount
Package / Case: 780-FBGA
Packaging: Bulk
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LPC11U68JBD64K PHGLS29590-1.pdf?t.download=true&u=5oefqw
LPC11U68JBD64K
Hersteller: NXP Semiconductors
Description: LPC11U68 - Cortex-M0+/M0 RISC Mi
Number of I/O: 48
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x12b SAR
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 36K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
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PSMN8R5-100ESFQ PSMN8R5-100ESF.pdf
PSMN8R5-100ESFQ
Hersteller: NXP Semiconductors
Description: NEXPERIA PSMN8R5 - NEXTPOWER 100
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 183W (Ta)
Rds On (Max) @ Id, Vgs: 8.8mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 97A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Bulk
Input Capacitance (Ciss) (Max) @ Vds: 3181 pF @ 50 V
Gate Charge (Qg) (Max) @ Vgs: 44.5 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 7V, 10V
Supplier Device Package: I2PAK
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PCA9538PW,112 PCA9538.pdf
PCA9538PW,112
Hersteller: NXP Semiconductors
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Tube
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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BF1216,115 BF1216_Rev1.pdf
BF1216,115
Hersteller: NXP Semiconductors
Description: RF MOSFET 5V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 30dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: 6-TSSOP
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 19 mA
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