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BAP50-02,115 BAP50-02,115 NXP Semiconductors BAP50-02_N.pdf Description: RF DIODE PIN 50V 715MW SOD-523
Packaging: Bulk
Package / Case: SC-79, SOD-523
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD-523
Current - Max: 50 mA
Power Dissipation (Max): 715 mW
auf Bestellung 5215 Stücke:
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2712+0.17 EUR
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LPC2102FBD48,151 LPC2102FBD48,151 NXP Semiconductors LPC2101_02_03.pdf Description: IC MCU 16/32BIT 16KB FLSH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 70MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 245 Stücke:
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70+6.68 EUR
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LPC802UKZ NXP Semiconductors PHGL-S-A0001056910-1.pdf?t.download=true&u=5oefqw Description: LPC802UKZ - Low-Cost Microcontro
Packaging: Bulk
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-WLCSP (1.84x1.84)
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 106692 Stücke:
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377+1.34 EUR
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PDTC144TM,315 PDTC144TM,315 NXP Semiconductors PDTC144T_SERIES.pdf Description: TRANS PREBIAS
Packaging: Bulk
auf Bestellung 38937 Stücke:
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11871+0.051 EUR
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PDTC143EQAZ PDTC143EQAZ NXP Semiconductors PDTC143_114_124_144EQA_SER.pdf Description: TRANS PREBIAS 50V 100MA
Packaging: Bulk
auf Bestellung 39000 Stücke:
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PMEG045T150EPDAZ PMEG045T150EPDAZ NXP Semiconductors PMEG045T150EPD.pdf Description: DIODE SCHOTTKY 45V 15A CFP15
Packaging: Bulk
Package / Case: TO-277, 3-PowerDFN
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 20 ns
Technology: Schottky
Capacitance @ Vr, F: 800pF @ 10V, 1MHz
Current - Average Rectified (Io): 15A
Supplier Device Package: CFP15
Operating Temperature - Junction: 175°C (Max)
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 45 V
Voltage - Forward (Vf) (Max) @ If: 550 mV @ 15 A
Current - Reverse Leakage @ Vr: 100 µA @ 45 V
Qualification: AEC-Q101
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791+0.64 EUR
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74AUP1G04GM,115 74AUP1G04GM,115 NXP Semiconductors PHGLS24869-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (1.45x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
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LPC2925FBD100,551 LPC2925FBD100,551 NXP Semiconductors PHGLS20650-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 16x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 1.89V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
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LPC43S20FBD144E NXP Semiconductors LPC43S50_30_20.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M0, ARM® Cortex®-M4
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
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74HCT154PW,112 74HCT154PW,112 NXP Semiconductors PHGL-S-A0001573442-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74HCT154PW - DECODER/DR
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 4:16
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 24-TSSOP
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P89LPC917FDH,129 P89LPC917FDH,129 NXP Semiconductors P89LPC915_916_917.pdf Description: IC MCU 8BIT 2KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Verified
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150+3.02 EUR
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MC33907LAER2 MC33907LAER2 NXP Semiconductors MC33907-MC33908D2.pdf Description: MC33907 - System Basis chip, DCD
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
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35+13.96 EUR
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74LVC08AD,112 74LVC08AD,112 NXP Semiconductors PHGL-S-A0001763577-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND
Packaging: Bulk
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LPC3131FET180,551 NXP Semiconductors PHGLS25043-1.pdf?t.download=true&u=5oefqw Description: LPC3131 - Low-cost, low-power AR
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 4x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.2V ~ 3.6V
Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
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30+16.49 EUR
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88MW302-B0-NXUE/AK NXP Semiconductors User-manual-2777835.pdf Description: IC RF TXRX+MCU BLE 88HVQFN
Packaging: Bulk
Package / Case: 88-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 512kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V
Protocol: 802.11n/g/b, Bluetooth, Zigbee®, Z-Wave®
Data Rate (Max): 72.2Mbps
Supplier Device Package: 88-HVQFN (10x10)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, PWM, SPI, UART
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43+11.92 EUR
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74AHCT126PW,112 74AHCT126PW,112 NXP Semiconductors PHGLS19988-1.pdf?t.download=true&u=5oefqw Description: IC BUFF NON-INVERT 5.5V 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 14-TSSOP
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2244+0.2 EUR
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PZU22B2,115 PZU22B2,115 NXP Semiconductors PHGLS19743-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PZU22B2 - ZENER DIODE,
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOD-323F
Power - Max: 310 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 17 V
auf Bestellung 21000 Stücke:
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MM908E622ACPEK MM908E622ACPEK NXP Semiconductors MM908E622.pdf Description: MM908E622 - Integrated motor dri
Packaging: Bulk
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 16V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
Number of I/O: 12
auf Bestellung 105 Stücke:
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26+19.46 EUR
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PHN203,518 PHN203,518 NXP Semiconductors PHGLS20699-1.pdf?t.download=true&u=5oefqw Description: MOSFET 2N-CH 30V 6.3A 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Configuration: 2 N-Channel
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 2W (Ta)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 6.3A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 560pF @ 20V
Rds On (Max) @ Id, Vgs: 30mOhm @ 7A, 10V
Gate Charge (Qg) (Max) @ Vgs: 14.6nC @ 10V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: 8-SO
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74LV74PW,118 74LV74PW,118 NXP Semiconductors 74LV74.pdf Description: IC FF D-TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 80 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 110 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Number of Bits per Element: 1
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74LV74D,112 74LV74D,112 NXP Semiconductors 74LV74.pdf Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 110 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Number of Bits per Element: 1
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BC846BW/ZLF BC846BW/ZLF NXP Semiconductors BC846XW_SER.pdf Description: NEXPERIA BC846 - 65V, 100MA NPN
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Supplier Device Package: SOT-323
auf Bestellung 180000 Stücke:
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74AUP1G58GF,132 74AUP1G58GF,132 NXP Semiconductors PHGL-S-A0001284262-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74AUP1G58GF - LOGIC CIR
Packaging: Bulk
auf Bestellung 30270 Stücke:
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BGU8H1X BGU8H1X NXP Semiconductors PHGL-S-A0005068069-1.pdf?t.download=true&u=5oefqw Description: BGU8H1 - SiGe:C Low Noise Amplif
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13dB
Current - Supply: 5mA
Noise Figure: 0.9dB
P1dB: -3dBm
Test Frequency: 3.35GHz
Supplier Device Package: 6-XSON (1.1x0.7)
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74AHCT139D,118 74AHCT139D,118 NXP Semiconductors PHGLS15529-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74AHCT139D - DECODER/DR
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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PDTC115EMB,315 PDTC115EMB,315 NXP Semiconductors PDTC115EMB.pdf Description: TRANS PREBIAS NPN 50V 0.02A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 20 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 100 kOhms
Resistor - Emitter Base (R2): 100 kOhms
Resistors Included: R1 and R2
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11225+0.051 EUR
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74LVT14DB,112 74LVT14DB,112 NXP Semiconductors 74LVT14.pdf Description: IC INVERTER
Packaging: Bulk
auf Bestellung 496 Stücke:
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496+1.09 EUR
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BZX84-B13,215 BZX84-B13,215 NXP Semiconductors BZX84_SER.pdf Description: NEXPERIA BZX84-B13 - ZENER DIODE
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: TO-236AB
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Qualification: AEC-Q101
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13172+0.034 EUR
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KMI23/2Z NXP Semiconductors KMI23_2_4.pdf Description: KMI23/2 - High performance rotat
Packaging: Bulk
Package / Case: SOT-453A
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 150°C
Termination Style: PC Pin
Voltage - Supply: 6.8V ~ 16V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Rotary Position
Supplier Device Package: 2-SIP
Output Signal: Clockwise Increase
Grade: Automotive
Resistance: 50 Ohms
Qualification: AEC-Q100
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KTY82/151,215 KTY82/151,215 NXP Semiconductors KTY82_SER.pdf Description: SENSOR PTC 975OHM TO236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: TO-236AB
Resistance @ 25°C: 975 Ohms
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KTY81/150,112 KTY81/150,112 NXP Semiconductors KTY81_SER.pdf Description: SILICON TEMPERATURE SENSOR
Packaging: Tube
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Resistance @ 25°C: 1 kOhms
auf Bestellung 1979 Stücke:
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556+0.82 EUR
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BUK6E2R3-40C,127 BUK6E2R3-40C,127 NXP Semiconductors BUK6E2R3-40C.pdf Description: NEXPERIA BUK6E2R3-40C - 120A, 40
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: I2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 260 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 15100 pF @ 25 V
Qualification: AEC-Q101
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LPC12H27FBD64/301, LPC12H27FBD64/301, NXP Semiconductors PHGLS23259-1.pdf?t.download=true&u=5oefqw Description: LPC1200 - Cortex-M0 32-Bit RISC
Packaging: Bulk
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LS1048ASE7Q1A NXP Semiconductors LS1088AFS.pdf Description: IC MPU QORLQ LS1 1.6GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1.2V
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, IFC, PCI, SPI, UART
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T4240NSN7PQB NXP Semiconductors T4240.pdf Description: IC MPU 1.8GHZ 1932FCPBGA
Packaging: Bulk
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (16), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
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MC9328MX1VM20 NXP Semiconductors FSCLS05269-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX1 200MHZ 225MAPBGA
Packaging: Bulk
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
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LPC11E36FBD64/501E LPC11E36FBD64/501E NXP Semiconductors PHGLS25742-1.pdf?t.download=true&u=5oefqw Description: LPC11E36 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
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PCA9675PW,118 PCA9675PW,118 NXP Semiconductors PCA9675.pdf Description: PCA9675PW - Remote 16-Bit I/O Ex
Features: POR
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 300µA, 42mA
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74LV4066PW,112 74LV4066PW,112 NXP Semiconductors 74LV4066.pdf Description: NEXPERIA 74LV4066PW - SPST, 4 FU
Packaging: Bulk
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PCA9468UKBZ NXP Semiconductors FASTCHARGTS.pdf Description: PCA9468UK - 2:1 switched cap dir
Packaging: Bulk
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MRF6V2150NBR1 NXP Semiconductors FSCLS05116-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 50V TO272-4
Packaging: Bulk
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 450MHz
Configuration: N-Channel
Power - Output: 150W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
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BGA3031X NXP Semiconductors BGA3031.pdf Description: BGA3031 - DOCSIS 3.0 PLUS UPSTRE
Packaging: Bulk
Package / Case: 20-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Amplifier
Applications: CATV
Supplier Device Package: 20-HVQFN (5x5)
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IP4223CZ6,125 IP4223CZ6,125 NXP Semiconductors PHGLS23372-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA IP4223 - TRANS VOLTAGE
Packaging: Bulk
Package / Case: SOT-23-6 Thin, TSOT-23-6
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 1.5pF @ 1MHz (Max)
Voltage - Reverse Standoff (Typ): 5.5V (Max)
Supplier Device Package: 6-TSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
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MC9S08AC128MFGE NXP Semiconductors MC9S08AC60AD.pdf Description: MC9S08AC - 8-bit MCU, 128KB Flas
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
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74AUP1GU04GS,132 74AUP1GU04GS,132 NXP Semiconductors PHGLS24886-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 4.3ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
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MC33797BPEW NXP Semiconductors FSCLS11648-1.pdf?t.download=true&u=5oefqw Description: Four Channel Squib Driver IC
Packaging: Bulk
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Applications: Squib Driver
Supplier Device Package: 32-SOIC
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40+12.21 EUR
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LPC2926FBD144,557 LPC2926FBD144,557 NXP Semiconductors PHGLS20650-1.pdf?t.download=true&u=5oefqw Description: LPC2926FBD144 - ARM9 microcontro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
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TFA9881UK/N1,023 TFA9881UK/N1,023 NXP Semiconductors PHGLS27948-1.pdf?t.download=true&u=5oefqw Description: IC AMP AUDIO CLASSD 3.4W 9WLCSP
Packaging: Bulk
auf Bestellung 70000 Stücke:
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398+1.14 EUR
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74AUP1G17GN,132 74AUP1G17GN,132 NXP Semiconductors PHGL-S-A0000283103-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
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1920+0.26 EUR
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CBT3257AD,118 CBT3257AD,118 NXP Semiconductors CBT3257A.pdf Description: NEXPERIA CBT3257AD - MULTIPLEXER
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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1665+0.29 EUR
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CBTL06122AHF,518 CBTL06122AHF,518 NXP Semiconductors CBTL06122.pdf Description: IC MULTIPLEXER HEX 1X2 56HWQFN
Features: Bi-Directional
Packaging: Bulk
Package / Case: 56-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe
-3db Bandwidth: 2.5GHz
Supplier Device Package: 56-HWQFN (5x11)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 6
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MC9S08AC128MFUE NXP Semiconductors FSCL-S-A0001039679-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 16x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
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MIMX8ML4DVNLZAB NXP Semiconductors Description: IC MPU I.MX8M 1.8GHZ 486LFBGA
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CANbus, I2C, I2S, PCIe, SD/SDIO, SPI, UART
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MCIMX6Q4AVT10AC NXP Semiconductors FSCL-S-A0001020796-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6 1GHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6S8DVM10AC NXP Semiconductors FSCL-S-A0000998349-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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MCIMX6U5EVM10AC NXP Semiconductors FSCL-S-A0000998349-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 310 Stücke:
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9+53.96 EUR
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MCIMX6U4AVM08AC NXP Semiconductors FSCL-S-A0000998349-1.pdf?t.download=true&u=5oefqw Description: IC MPU 800MHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 697 Stücke:
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8+56.4 EUR
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MCIMX6U1AVM10AC NXP Semiconductors FSCLS11779-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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MCIMX6D4AVT08ADR NXP Semiconductors PHGL-S-A0006627490-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6 852MHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 782 Stücke:
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5+92.07 EUR
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PN7462AUEV/C300Y PN7462AUEV/C300Y NXP Semiconductors PN7462.pdf Description: PN7462AUEV - NFC Cortex®
Packaging: Bulk
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
auf Bestellung 4000 Stücke:
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44+10.58 EUR
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BAP50-02,115 BAP50-02_N.pdf
BAP50-02,115
Hersteller: NXP Semiconductors
Description: RF DIODE PIN 50V 715MW SOD-523
Packaging: Bulk
Package / Case: SC-79, SOD-523
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD-523
Current - Max: 50 mA
Power Dissipation (Max): 715 mW
auf Bestellung 5215 Stücke:
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2712+0.17 EUR
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LPC2102FBD48,151 LPC2101_02_03.pdf
LPC2102FBD48,151
Hersteller: NXP Semiconductors
Description: IC MCU 16/32BIT 16KB FLSH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 70MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 245 Stücke:
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70+6.68 EUR
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LPC802UKZ PHGL-S-A0001056910-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC802UKZ - Low-Cost Microcontro
Packaging: Bulk
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-WLCSP (1.84x1.84)
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 106692 Stücke:
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377+1.34 EUR
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PDTC144TM,315 PDTC144T_SERIES.pdf
PDTC144TM,315
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS
Packaging: Bulk
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Anzahl Preis
11871+0.051 EUR
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PDTC143EQAZ PDTC143_114_124_144EQA_SER.pdf
PDTC143EQAZ
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS 50V 100MA
Packaging: Bulk
auf Bestellung 39000 Stücke:
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Anzahl Preis
3647+0.12 EUR
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PMEG045T150EPDAZ PMEG045T150EPD.pdf
PMEG045T150EPDAZ
Hersteller: NXP Semiconductors
Description: DIODE SCHOTTKY 45V 15A CFP15
Packaging: Bulk
Package / Case: TO-277, 3-PowerDFN
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 20 ns
Technology: Schottky
Capacitance @ Vr, F: 800pF @ 10V, 1MHz
Current - Average Rectified (Io): 15A
Supplier Device Package: CFP15
Operating Temperature - Junction: 175°C (Max)
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 45 V
Voltage - Forward (Vf) (Max) @ If: 550 mV @ 15 A
Current - Reverse Leakage @ Vr: 100 µA @ 45 V
Qualification: AEC-Q101
auf Bestellung 91846 Stücke:
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Anzahl Preis
791+0.64 EUR
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74AUP1G04GM,115 PHGLS24869-1.pdf?t.download=true&u=5oefqw
74AUP1G04GM,115
Hersteller: NXP Semiconductors
Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (1.45x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
auf Bestellung 1313125 Stücke:
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3974+0.13 EUR
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LPC2925FBD100,551 PHGLS20650-1.pdf?t.download=true&u=5oefqw
LPC2925FBD100,551
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 16x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 1.89V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
auf Bestellung 49 Stücke:
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26+17.76 EUR
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LPC43S20FBD144E LPC43S50_30_20.pdf
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M0, ARM® Cortex®-M4
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 410 Stücke:
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41+11.9 EUR
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74HCT154PW,112 PHGL-S-A0001573442-1.pdf?t.download=true&u=5oefqw
74HCT154PW,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HCT154PW - DECODER/DR
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 4:16
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 24-TSSOP
auf Bestellung 1006 Stücke:
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725+0.69 EUR
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P89LPC917FDH,129 P89LPC915_916_917.pdf
P89LPC917FDH,129
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 2KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Verified
auf Bestellung 25778 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
150+3.02 EUR
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MC33907LAER2 MC33907-MC33908D2.pdf
MC33907LAER2
Hersteller: NXP Semiconductors
Description: MC33907 - System Basis chip, DCD
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
auf Bestellung 15950 Stücke:
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Anzahl Preis
35+13.96 EUR
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74LVC08AD,112 PHGL-S-A0001763577-1.pdf?t.download=true&u=5oefqw
74LVC08AD,112
Hersteller: NXP Semiconductors
Description: IC GATE AND
Packaging: Bulk
auf Bestellung 28366 Stücke:
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Anzahl Preis
2640+0.19 EUR
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LPC3131FET180,551 PHGLS25043-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC3131 - Low-cost, low-power AR
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 4x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.2V ~ 3.6V
Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
auf Bestellung 3366 Stücke:
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30+16.49 EUR
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88MW302-B0-NXUE/AK User-manual-2777835.pdf
Hersteller: NXP Semiconductors
Description: IC RF TXRX+MCU BLE 88HVQFN
Packaging: Bulk
Package / Case: 88-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 512kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V
Protocol: 802.11n/g/b, Bluetooth, Zigbee®, Z-Wave®
Data Rate (Max): 72.2Mbps
Supplier Device Package: 88-HVQFN (10x10)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, PWM, SPI, UART
auf Bestellung 400 Stücke:
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Anzahl Preis
43+11.92 EUR
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74AHCT126PW,112 PHGLS19988-1.pdf?t.download=true&u=5oefqw
74AHCT126PW,112
Hersteller: NXP Semiconductors
Description: IC BUFF NON-INVERT 5.5V 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 14-TSSOP
auf Bestellung 8650 Stücke:
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Anzahl Preis
2244+0.2 EUR
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PZU22B2,115 PHGLS19743-1.pdf?t.download=true&u=5oefqw
PZU22B2,115
Hersteller: NXP Semiconductors
Description: NEXPERIA PZU22B2 - ZENER DIODE,
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOD-323F
Power - Max: 310 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 17 V
auf Bestellung 21000 Stücke:
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10804+0.049 EUR
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MM908E622ACPEK MM908E622.pdf
MM908E622ACPEK
Hersteller: NXP Semiconductors
Description: MM908E622 - Integrated motor dri
Packaging: Bulk
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 16V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
Number of I/O: 12
auf Bestellung 105 Stücke:
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Anzahl Preis
26+19.46 EUR
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PHN203,518 PHGLS20699-1.pdf?t.download=true&u=5oefqw
PHN203,518
Hersteller: NXP Semiconductors
Description: MOSFET 2N-CH 30V 6.3A 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Configuration: 2 N-Channel
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 2W (Ta)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 6.3A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 560pF @ 20V
Rds On (Max) @ Id, Vgs: 30mOhm @ 7A, 10V
Gate Charge (Qg) (Max) @ Vgs: 14.6nC @ 10V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: 8-SO
auf Bestellung 2200 Stücke:
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Anzahl Preis
1211+0.41 EUR
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74LV74PW,118 74LV74.pdf
74LV74PW,118
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 80 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 110 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Number of Bits per Element: 1
auf Bestellung 3969 Stücke:
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Anzahl Preis
2831+0.18 EUR
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74LV74D,112 74LV74.pdf
74LV74D,112
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 110 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Number of Bits per Element: 1
auf Bestellung 27710 Stücke:
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Anzahl Preis
2406+0.2 EUR
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BC846BW/ZLF BC846XW_SER.pdf
BC846BW/ZLF
Hersteller: NXP Semiconductors
Description: NEXPERIA BC846 - 65V, 100MA NPN
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Supplier Device Package: SOT-323
auf Bestellung 180000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4589+0.11 EUR
Mindestbestellmenge: 4589
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74AUP1G58GF,132 PHGL-S-A0001284262-1.pdf?t.download=true&u=5oefqw
74AUP1G58GF,132
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP1G58GF - LOGIC CIR
Packaging: Bulk
auf Bestellung 30270 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1972+0.24 EUR
Mindestbestellmenge: 1972
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BGU8H1X PHGL-S-A0005068069-1.pdf?t.download=true&u=5oefqw
BGU8H1X
Hersteller: NXP Semiconductors
Description: BGU8H1 - SiGe:C Low Noise Amplif
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13dB
Current - Supply: 5mA
Noise Figure: 0.9dB
P1dB: -3dBm
Test Frequency: 3.35GHz
Supplier Device Package: 6-XSON (1.1x0.7)
auf Bestellung 1873853 Stücke:
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Anzahl Preis
1348+0.33 EUR
Mindestbestellmenge: 1348
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74AHCT139D,118 PHGLS15529-1.pdf?t.download=true&u=5oefqw
74AHCT139D,118
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AHCT139D - DECODER/DR
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 3786 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2826+0.18 EUR
Mindestbestellmenge: 2826
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PDTC115EMB,315 PDTC115EMB.pdf
PDTC115EMB,315
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS NPN 50V 0.02A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 20 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 100 kOhms
Resistor - Emitter Base (R2): 100 kOhms
Resistors Included: R1 and R2
auf Bestellung 180000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11225+0.051 EUR
Mindestbestellmenge: 11225
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74LVT14DB,112 74LVT14.pdf
74LVT14DB,112
Hersteller: NXP Semiconductors
Description: IC INVERTER
Packaging: Bulk
auf Bestellung 496 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
496+1.09 EUR
Mindestbestellmenge: 496
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BZX84-B13,215 BZX84_SER.pdf
BZX84-B13,215
Hersteller: NXP Semiconductors
Description: NEXPERIA BZX84-B13 - ZENER DIODE
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: TO-236AB
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Qualification: AEC-Q101
auf Bestellung 190630 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13172+0.034 EUR
Mindestbestellmenge: 13172
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KMI23/2Z KMI23_2_4.pdf
Hersteller: NXP Semiconductors
Description: KMI23/2 - High performance rotat
Packaging: Bulk
Package / Case: SOT-453A
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 150°C
Termination Style: PC Pin
Voltage - Supply: 6.8V ~ 16V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Rotary Position
Supplier Device Package: 2-SIP
Output Signal: Clockwise Increase
Grade: Automotive
Resistance: 50 Ohms
Qualification: AEC-Q100
auf Bestellung 1167 Stücke:
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Anzahl Preis
179+2.81 EUR
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KTY82/151,215 KTY82_SER.pdf
KTY82/151,215
Hersteller: NXP Semiconductors
Description: SENSOR PTC 975OHM TO236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: TO-236AB
Resistance @ 25°C: 975 Ohms
auf Bestellung 1619 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
706+0.72 EUR
Mindestbestellmenge: 706
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KTY81/150,112 KTY81_SER.pdf
KTY81/150,112
Hersteller: NXP Semiconductors
Description: SILICON TEMPERATURE SENSOR
Packaging: Tube
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Resistance @ 25°C: 1 kOhms
auf Bestellung 1979 Stücke:
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Anzahl Preis
556+0.82 EUR
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BUK6E2R3-40C,127 BUK6E2R3-40C.pdf
BUK6E2R3-40C,127
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK6E2R3-40C - 120A, 40
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: I2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 260 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 15100 pF @ 25 V
Qualification: AEC-Q101
auf Bestellung 2000 Stücke:
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Anzahl Preis
310+1.53 EUR
Mindestbestellmenge: 310
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LPC12H27FBD64/301, PHGLS23259-1.pdf?t.download=true&u=5oefqw
LPC12H27FBD64/301,
Hersteller: NXP Semiconductors
Description: LPC1200 - Cortex-M0 32-Bit RISC
Packaging: Bulk
auf Bestellung 282 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
64+7.41 EUR
Mindestbestellmenge: 64
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LS1048ASE7Q1A LS1088AFS.pdf
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ LS1 1.6GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1.2V
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, IFC, PCI, SPI, UART
auf Bestellung 120 Stücke:
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Anzahl Preis
2+286.62 EUR
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T4240NSN7PQB T4240.pdf
Hersteller: NXP Semiconductors
Description: IC MPU 1.8GHZ 1932FCPBGA
Packaging: Bulk
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (16), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
auf Bestellung 15 Stücke:
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Anzahl Preis
1+1732.49 EUR
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MC9328MX1VM20 FSCLS05269-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX1 200MHZ 225MAPBGA
Packaging: Bulk
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
auf Bestellung 442 Stücke:
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Anzahl Preis
11+44.58 EUR
Mindestbestellmenge: 11
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LPC11E36FBD64/501E PHGLS25742-1.pdf?t.download=true&u=5oefqw
LPC11E36FBD64/501E
Hersteller: NXP Semiconductors
Description: LPC11E36 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
auf Bestellung 615 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
80+5.96 EUR
Mindestbestellmenge: 80
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PCA9675PW,118 PCA9675.pdf
PCA9675PW,118
Hersteller: NXP Semiconductors
Description: PCA9675PW - Remote 16-Bit I/O Ex
Features: POR
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 300µA, 42mA
auf Bestellung 6128 Stücke:
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Anzahl Preis
204+2.42 EUR
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74LV4066PW,112 74LV4066.pdf
74LV4066PW,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LV4066PW - SPST, 4 FU
Packaging: Bulk
auf Bestellung 12466 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1667+0.3 EUR
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PCA9468UKBZ FASTCHARGTS.pdf
Hersteller: NXP Semiconductors
Description: PCA9468UK - 2:1 switched cap dir
Packaging: Bulk
auf Bestellung 41266 Stücke:
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Anzahl Preis
113+4.5 EUR
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MRF6V2150NBR1 FSCLS05116-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 50V TO272-4
Packaging: Bulk
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 450MHz
Configuration: N-Channel
Power - Output: 150W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
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BGA3031X BGA3031.pdf
Hersteller: NXP Semiconductors
Description: BGA3031 - DOCSIS 3.0 PLUS UPSTRE
Packaging: Bulk
Package / Case: 20-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Amplifier
Applications: CATV
Supplier Device Package: 20-HVQFN (5x5)
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
371+1.33 EUR
Mindestbestellmenge: 371
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IP4223CZ6,125 PHGLS23372-1.pdf?t.download=true&u=5oefqw
IP4223CZ6,125
Hersteller: NXP Semiconductors
Description: NEXPERIA IP4223 - TRANS VOLTAGE
Packaging: Bulk
Package / Case: SOT-23-6 Thin, TSOT-23-6
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 1.5pF @ 1MHz (Max)
Voltage - Reverse Standoff (Typ): 5.5V (Max)
Supplier Device Package: 6-TSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
auf Bestellung 1392588 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2959+0.16 EUR
Mindestbestellmenge: 2959
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MC9S08AC128MFGE MC9S08AC60AD.pdf
Hersteller: NXP Semiconductors
Description: MC9S08AC - 8-bit MCU, 128KB Flas
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
auf Bestellung 444 Stücke:
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Anzahl Preis
34+13.5 EUR
Mindestbestellmenge: 34
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74AUP1GU04GS,132 PHGLS24886-1.pdf?t.download=true&u=5oefqw
74AUP1GU04GS,132
Hersteller: NXP Semiconductors
Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 4.3ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1765+0.27 EUR
Mindestbestellmenge: 1765
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MC33797BPEW FSCLS11648-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: Four Channel Squib Driver IC
Packaging: Bulk
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Applications: Squib Driver
Supplier Device Package: 32-SOIC
auf Bestellung 4726 Stücke:
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Anzahl Preis
40+12.21 EUR
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LPC2926FBD144,557 PHGLS20650-1.pdf?t.download=true&u=5oefqw
LPC2926FBD144,557
Hersteller: NXP Semiconductors
Description: LPC2926FBD144 - ARM9 microcontro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
auf Bestellung 298 Stücke:
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Anzahl Preis
23+19.92 EUR
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TFA9881UK/N1,023 PHGLS27948-1.pdf?t.download=true&u=5oefqw
TFA9881UK/N1,023
Hersteller: NXP Semiconductors
Description: IC AMP AUDIO CLASSD 3.4W 9WLCSP
Packaging: Bulk
auf Bestellung 70000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
398+1.14 EUR
Mindestbestellmenge: 398
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74AUP1G17GN,132 PHGL-S-A0000283103-1.pdf?t.download=true&u=5oefqw
74AUP1G17GN,132
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
auf Bestellung 5000 Stücke:
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Anzahl Preis
1920+0.26 EUR
Mindestbestellmenge: 1920
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CBT3257AD,118 CBT3257A.pdf
CBT3257AD,118
Hersteller: NXP Semiconductors
Description: NEXPERIA CBT3257AD - MULTIPLEXER
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 45080 Stücke:
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Anzahl Preis
1665+0.29 EUR
Mindestbestellmenge: 1665
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CBTL06122AHF,518 CBTL06122.pdf
CBTL06122AHF,518
Hersteller: NXP Semiconductors
Description: IC MULTIPLEXER HEX 1X2 56HWQFN
Features: Bi-Directional
Packaging: Bulk
Package / Case: 56-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe
-3db Bandwidth: 2.5GHz
Supplier Device Package: 56-HWQFN (5x11)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 6
auf Bestellung 65 Stücke:
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65+7.02 EUR
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MC9S08AC128MFUE FSCL-S-A0001039679-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 16x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 40 Stücke:
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Anzahl Preis
32+14.43 EUR
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MIMX8ML4DVNLZAB
Hersteller: NXP Semiconductors
Description: IC MPU I.MX8M 1.8GHZ 486LFBGA
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CANbus, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 6315 Stücke:
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Anzahl Preis
9+50.76 EUR
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MCIMX6Q4AVT10AC FSCL-S-A0001020796-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6 1GHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 184 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+120.36 EUR
Mindestbestellmenge: 4
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MCIMX6S8DVM10AC FSCL-S-A0000998349-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 180 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+41.21 EUR
Mindestbestellmenge: 11
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MCIMX6U5EVM10AC FSCL-S-A0000998349-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 310 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+53.96 EUR
Mindestbestellmenge: 9
Im Einkaufswagen  Stück im Wert von  UAH
MCIMX6U4AVM08AC FSCL-S-A0000998349-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU 800MHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 697 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+56.4 EUR
Mindestbestellmenge: 8
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MCIMX6U1AVM10AC FSCLS11779-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Bulk
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+66.74 EUR
Mindestbestellmenge: 7
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MCIMX6D4AVT08ADR PHGL-S-A0006627490-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6 852MHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 782 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+92.07 EUR
Mindestbestellmenge: 5
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PN7462AUEV/C300Y PN7462.pdf
PN7462AUEV/C300Y
Hersteller: NXP Semiconductors
Description: PN7462AUEV - NFC Cortex®
Packaging: Bulk
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
44+10.58 EUR
Mindestbestellmenge: 44
Im Einkaufswagen  Stück im Wert von  UAH
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