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NX1WP10012 NXP Semiconductors Description: NX1WP10 - Specialized Power Mana
Packaging: Bulk
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Receiver
Frequency: 6.78MHz
RF Type: General Purpose
Secondary Attributes: I²C Interface
Supplier Device Package: 42-WLCSP (3.56x3.41)
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NX3P190UK,012 NX3P190UK,012 NXP Semiconductors PHGLS25714-1.pdf?t.download=true&u=5oefqw Description: IC PWR SWITCH HI SIDE LOG 4WLCSP
Packaging: Bulk
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MPF5020AVNA0ES MPF5020AVNA0ES NXP Semiconductors PF5020.pdf Description: PF5020 - POWER MANAGEMENT IC, PR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
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MPF5023AMMA0ES MPF5023AMMA0ES NXP Semiconductors Description: PF5023 - POWER MANAGEMENT IC, PR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
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MPF5023AVNA0ES MPF5023AVNA0ES NXP Semiconductors PF5023.pdf Description: PF5023 - POWER MANAGEMENT IC, PR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
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MCIMX507CVK8B NXP Semiconductors FSCLS11473-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX50 800MHZ 416MAPBGA
Packaging: Bulk
Package / Case: 416-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3V
Supplier Device Package: 416-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, LPDDR, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Security Features: Boot Security, Cryptography, Secure JTAG
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
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PSMN6R0-25YLD115 PSMN6R0-25YLD115 NXP Semiconductors PSMN6R0-25YLD.pdf Description: NEXPERIA PSMN6R0-25YLD - POWER F
Packaging: Bulk
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MCZ33905DD5EK MCZ33905DD5EK NXP Semiconductors FSCLS11899-1.pdf?t.download=true&u=5oefqw Description: MCZ33905 - SYSTEM BASIS CHIP, PO
Grade: Automotive
Supplier Device Package: 54-SOIC-EP
Current - Supply: 2.8mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Bulk
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BUK6C3R3-75C,118 BUK6C3R3-75C,118 NXP Semiconductors BUK6C3R3-75C.pdf Description: NEXPERIA BUK6C3R3 - N-CHANNEL TR
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 15800 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 253 nC @ 10 V
Drain to Source Voltage (Vdss): 75 V
Vgs (Max): ±16V
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Packaging: Bulk
Drive Voltage (Max Rds On, Min Rds On): 10V
Grade: Automotive
Supplier Device Package: D2PAK-7
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 90A, 10V
Current - Continuous Drain (Id) @ 25°C: 181A (Tc)
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PDTC124EM,315 PDTC124EM,315 NXP Semiconductors PDTC124E_SER.pdf Description: TRANS PREBIAS
Packaging: Bulk
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S912D60CE1VPVER528 S912D60CE1VPVER528 NXP Semiconductors MC68HC912D60A.pdf Description: S912D60CE - 16 BIT MICROCONTROLL
DigiKey Programmable: Not Verified
Packaging: Bulk
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MC7448HX1700LD NXP Semiconductors FSCLS03804-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC74XX 1.7GHZ 360FCCBGA
Packaging: Bulk
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.7GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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PCA9541AD/01,118 PCA9541AD/01,118 NXP Semiconductors PCA9541A.pdf Description: PCA9541AD/01 - C-Bus Controller
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I²C, SMBus
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I²C Multiplexer
Supplier Device Package: 16-SO
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PCF7953VTTC1AC1900 PCF7953VTTC1AC1900 NXP Semiconductors NXP_75017275.pdf?t.download=true&u=ovmfp3 Description: PKE CHIPS
Features: RSSI Equipped
Packaging: Bulk
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512B RAM, 8kB ROM, 2kB EEPROM
Modulation or Protocol: UHF
Data Interface: SPI
Applications: Remote Keyless Entry
Supplier Device Package: 38-TSSOP
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KCF5212CAE66 NXP Semiconductors Description: MCF5212CAE66 - RISC Microcontrol
Packaging: Bulk
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SA2T18H450W19SR6 NXP Semiconductors A2T18H450W19S.pdf Description: RF MOSFET LDMOS 30V NI1230
Packaging: Bulk
Package / Case: NI-1230S-4S4S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Configuration: Dual
Power - Output: 89W
Gain: 16.6dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4S4S
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 800 mA
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74HCT32D,652 74HCT32D,652 NXP Semiconductors 74HC_HCT32.pdf Description: IC GATE OR
Packaging: Bulk
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MC9S08SH4CSC NXP Semiconductors MC9S08SH8.pdf Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 4x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 5
DigiKey Programmable: Not Verified
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MC34910BAC NXP Semiconductors FSCL-S-A0001160768-1.pdf?t.download=true&u=5oefqw Description: SYSTEM BASIS CHIP, LIN, 1X 5.0V/
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 5.5V ~ 18V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
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BFU768F,115 BFU768F,115 NXP Semiconductors BFU768F.pdf Description: BFU768F - NPN WIDEBAND SILICON G
Packaging: Bulk
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Frequency - Transition: 110GHz
Noise Figure (dB Typ @ f): 1.1dB ~ 1.2dB @ 5GHz ~ 5.9GHz
Supplier Device Package: 4-DFP
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BFU520XRR NXP Semiconductors BFU520XR.pdf Description: RF TRANS NPN 12V 10GHZ SOT-143R
Packaging: Bulk
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 17.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Frequency - Transition: 10GHz
Noise Figure (dB Typ @ f): 0.65dB @ 900MHz
Supplier Device Package: SOT-143R
Grade: Automotive
Qualification: AEC-Q101
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MCF51QE96CLH557 MCF51QE96CLH557 NXP Semiconductors Description: MCF51QE 32-bit MCU, ColdFire V1
Packaging: Bulk
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PTN3944EWY NXP Semiconductors PTN3944.pdf Description: PTN3944 - Multi-Channel PCIe Gen
Packaging: Bulk
Package / Case: 36-WFLGA Exposed Pad
Delay Time: 70ps
Number of Channels: 4
Output: Differential
Input: Differential
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: PCIe
Current - Supply: 250mA
Data Rate (Max): 16Gbps
Supplier Device Package: 36-HWFLGA (2.1x6)
Signal Conditioning: Input Equalization
Capacitance - Input: 10 pF
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MMA3201KEGR2 NXP Semiconductors FSCLS07536-1.pdf?t.download=true&u=5oefqw Description: MICROMACHINED ACCELEROMETER, DUA
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y
Acceleration Range: ±45g
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.25V
Bandwidth: 400Hz
Supplier Device Package: 20-SOIC
Sensitivity (mV/g): 50
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74LVT244ADB,112 74LVT244ADB,112 NXP Semiconductors 74LVT_LVTH244A.pdf Description: IC BUFFER NON-INVERT 3.6V 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SSOP
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TEA1532CT/N1,118 TEA1532CT/N1,118 NXP Semiconductors TEA1532BT_CT.pdf Description: IC CTLR SMPS 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 8.7V ~ 20V
Frequency - Switching: 100kHz ~ 150kHz
Mode: Continuous Conduction (CCM)
Supplier Device Package: 8-SO
Current - Startup: 1.2 mA
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TEA1520P/N2,112 TEA1520P/N2,112 NXP Semiconductors TEA152X.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Power (Watts): 30 W
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TEA1533AT/N1,518 TEA1533AT/N1,518 NXP Semiconductors TEA1533T_AT.pdf Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 145°C (TJ)
Frequency - Switching: 25kHz ~ 175kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.7V ~ 20V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 11 V
Power (Watts): 250 W
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TEA1521T/N2,518 TEA1521T/N2,518 NXP Semiconductors TEA152X.pdf Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Power (Watts): 30 W
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TEA1520T/N2,518 TEA1520T/N2,518 NXP Semiconductors TEA152X.pdf Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Power (Watts): 30 W
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G9S08AW32E5CFDE G9S08AW32E5CFDE NXP Semiconductors _MC9S08AW60.pdf?t.download=true&u=ovmfp3 Description: G9S08AW32 - S08AW: 8-BIT GENERAL
Packaging: Bulk
DigiKey Programmable: Not Verified
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74HCT374PW,112 74HCT374PW,112 NXP Semiconductors PHGLS06009-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 44 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Number of Bits per Element: 8
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PCF8584T/2,518 PCF8584T/2,518 NXP Semiconductors PCF8584.pdf Description: IC CTRL PARALLEL/I2C BUS 20-SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Supply: 1.5mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
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AFT09MP055NR1 NXP Semiconductors AFT09MP055N.pdf Description: RF MOSFET LDMOS 12.5V TO270-4
Package / Case: TO-270AB
Packaging: Bulk
Current - Test: 550 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Supplier Device Package: TO-270 WB-4
Technology: LDMOS (Dual)
Gain: 15.7dB
Power - Output: 57W
Configuration: 2 N-Channel
Frequency: 764MHz ~ 941MHz
Mounting Type: Surface Mount
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BC860B,235 BC860B,235 NXP Semiconductors BC859_BC860.pdf Description: TRANS PNP 45V 0.1A TO-236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 250 mW
Qualification: AEC-Q101
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PCA9554AD,112 PCA9554AD,112 NXP Semiconductors PCA9554%28A%29.pdf Description: IC XPNDR 400KHZ I2C SMBUS 16SO
Features: POR
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SO
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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LS1023AXN8QQB NXP Semiconductors Description: IC MPU QORLQ LS1 1.6GHZ 780BGA
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
SATA: SATA 6Gbps (1)
Security Features: ARM TZ, Boot Security
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 3.0 + PHY (3)
Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Bulk
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LS1028ACE7NQA NXP Semiconductors Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Bulk
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
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MC9S08QE32CFM MC9S08QE32CFM NXP Semiconductors MC9S08QE32.pdf Description: S08QE 8-BIT MCU, S08 CORE, 32KB
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 50.33MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 10x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
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KC9S08GT60ACFDE KC9S08GT60ACFDE NXP Semiconductors FSCL-S-A0001054932-1.pdf?t.download=true&u=5oefqw Description: MC9S08GT60ACFDE - Microcontrolle
Packaging: Bulk
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K9S08SG16E1MTG K9S08SG16E1MTG NXP Semiconductors Description: SAMPLE PACK DEVICE
Packaging: Bulk
DigiKey Programmable: Not Verified
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UBA2071AT/N1,118 UBA2071AT/N1,118 NXP Semiconductors UBA2071_A.pdf Description: IC DVR HALF BRIDGE 24-SOIC
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 38kHz ~ 42kHz
Type: CCFL/EEFL Controller
Operating Temperature: -25°C ~ 100°C
Voltage - Supply: 14V
Supplier Device Package: 24-SO
Dimming: Yes
Current - Supply: 1.5 mA
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PMK50XP,518 PMK50XP,518 NXP Semiconductors PMK50XP.pdf Description: NEXPERIA PMK50XP - 7.9A, 20V, 0.
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 7.9A (Tc)
Rds On (Max) @ Id, Vgs: 50mOhm @ 2.8A, 4.5V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: 8-SO
Drive Voltage (Max Rds On, Min Rds On): 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1020 pF @ 20 V
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NXH2280UK/C1Z NXP Semiconductors Description: NXH2280 - NFMI RADIO FOR WIRELES
Packaging: Bulk
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PDTA114TMB,315 PDTA114TMB,315 NXP Semiconductors PHGLS24956-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS
Packaging: Bulk
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TDA18219HN/C1,557 TDA18219HN/C1,557 NXP Semiconductors TDA18219HN.pdf Description: IC TV SILICON TUNER 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Standards: ATSC, DTMB, DVB-C, DVB-T/T2, ISDB-T
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I2C
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MPC8544CVJALFA NXP Semiconductors FSCLS11192-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
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BF904AWR,115 BF904AWR,115 NXP Semiconductors BF904A%2CAR%2CAWR.pdf Description: RF MOSFET 5V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 200MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 7 V
Voltage - Test: 5 V
Current - Test: 10 mA
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SC16IS850LIBS,157 SC16IS850LIBS,157 NXP Semiconductors SC16IS850L.pdf Description: IC CONTROLLER 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 24-HVQFN (4x4)
DigiKey Programmable: Not Verified
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SC16C750BIBS,151 SC16C750BIBS,151 NXP Semiconductors SC16C750B.pdf Description: IC UART SINGLE W/FIFO 32-HVQFN
With Auto Flow Control: Yes
Supplier Device Package: 32-HVQFN (5x5)
Data Rate (Max): 3Mbps
FIFO's: 64 Byte
Voltage - Supply: 2.5V, 3.3V, 5V
Mounting Type: Surface Mount
With Modem Control: Yes
With False Start Bit Detection: Yes
Number of Channels: 1, UART
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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74LVC1G332GXZ 74LVC1G332GXZ NXP Semiconductors 74LVC1G332.pdf Description: IC SNGL
Packaging: Bulk
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74HC377PW,112 74HC377PW,112 NXP Semiconductors PHGL-S-A0001541547-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE 1-ELE 8-BIT
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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PCA9534PW,112 PCA9534PW,112 NXP Semiconductors PCA9534.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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RP115L271D-E2 RP115L271D-E2 NXP Semiconductors ?product=rp115 Description: RP115L - Low Voltage 500mA/1A LD
Packaging: Bulk
Package / Case: 8-XFDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Current - Quiescent (Iq): 160 µA
Voltage - Input (Max): 5.25V
Number of Regulators: 1
Supplier Device Package: DFN1216-8
Voltage - Output (Min/Fixed): 2.7V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.09V @ 500mA
Protection Features: Over Current, Over Temperature, Reverse Current
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BUK7225-55A,118 NXP Semiconductors BUK7225-55A.pdf Description: N-CHANNEL TRENCHMOS STANDARD LEV
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Ta)
Rds On (Max) @ Id, Vgs: 25mOhm @ 25A, 10V
Power Dissipation (Max): 94W (Ta)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: DPAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1310 pF @ 25 V
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TDA8579T/N1,118 TDA8579T/N1,118 NXP Semiconductors TDA8579T.pdf Description: IC TRANSCEIVER 0/2 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Receiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 0/2
Supplier Device Package: 8-SO
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PBSS5612PA,115 PBSS5612PA,115 NXP Semiconductors PHGLS20771-1.pdf?t.download=true&u=5oefqw Description: TRANS PNP 12V 6A 3HUSON
Packaging: Bulk
Package / Case: 3-PowerUDFN
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 300mA, 6A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 190 @ 2A, 2V
Frequency - Transition: 60MHz
Supplier Device Package: 3-HUSON (2x2)
Current - Collector (Ic) (Max): 6 A
Voltage - Collector Emitter Breakdown (Max): 12 V
Power - Max: 2.1 W
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74HC137D,652 74HC137D,652 NXP Semiconductors 74HC137.pdf Description: NEXPERIA 74HC137D - DECODER/DRIV
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Current - Output High, Low: 5.2mA, 5.2mA
Independent Circuits: 1
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Type: Decoder/Demultiplexer
Circuit: 1 x 3:8
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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TJA1054T/N1,518 TJA1054T/N1,518 NXP Semiconductors TJA1054.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
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LPC2214FBD144/01,5 LPC2214FBD144/01,5 NXP Semiconductors LPC2212_2214.pdf Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 112
DigiKey Programmable: Not Verified
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NX1WP10012
Hersteller: NXP Semiconductors
Description: NX1WP10 - Specialized Power Mana
Packaging: Bulk
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Receiver
Frequency: 6.78MHz
RF Type: General Purpose
Secondary Attributes: I²C Interface
Supplier Device Package: 42-WLCSP (3.56x3.41)
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NX3P190UK,012 PHGLS25714-1.pdf?t.download=true&u=5oefqw
NX3P190UK,012
Hersteller: NXP Semiconductors
Description: IC PWR SWITCH HI SIDE LOG 4WLCSP
Packaging: Bulk
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MPF5020AVNA0ES PF5020.pdf
MPF5020AVNA0ES
Hersteller: NXP Semiconductors
Description: PF5020 - POWER MANAGEMENT IC, PR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
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MPF5023AMMA0ES
MPF5023AMMA0ES
Hersteller: NXP Semiconductors
Description: PF5023 - POWER MANAGEMENT IC, PR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
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MPF5023AVNA0ES PF5023.pdf
MPF5023AVNA0ES
Hersteller: NXP Semiconductors
Description: PF5023 - POWER MANAGEMENT IC, PR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
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MCIMX507CVK8B FSCLS11473-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX50 800MHZ 416MAPBGA
Packaging: Bulk
Package / Case: 416-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3V
Supplier Device Package: 416-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, LPDDR, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Security Features: Boot Security, Cryptography, Secure JTAG
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
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PSMN6R0-25YLD115 PSMN6R0-25YLD.pdf
PSMN6R0-25YLD115
Hersteller: NXP Semiconductors
Description: NEXPERIA PSMN6R0-25YLD - POWER F
Packaging: Bulk
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MCZ33905DD5EK FSCLS11899-1.pdf?t.download=true&u=5oefqw
MCZ33905DD5EK
Hersteller: NXP Semiconductors
Description: MCZ33905 - SYSTEM BASIS CHIP, PO
Grade: Automotive
Supplier Device Package: 54-SOIC-EP
Current - Supply: 2.8mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Bulk
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BUK6C3R3-75C,118 BUK6C3R3-75C.pdf
BUK6C3R3-75C,118
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK6C3R3 - N-CHANNEL TR
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 15800 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 253 nC @ 10 V
Drain to Source Voltage (Vdss): 75 V
Vgs (Max): ±16V
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Packaging: Bulk
Drive Voltage (Max Rds On, Min Rds On): 10V
Grade: Automotive
Supplier Device Package: D2PAK-7
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 90A, 10V
Current - Continuous Drain (Id) @ 25°C: 181A (Tc)
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PDTC124EM,315 PDTC124E_SER.pdf
PDTC124EM,315
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS
Packaging: Bulk
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S912D60CE1VPVER528 MC68HC912D60A.pdf
S912D60CE1VPVER528
Hersteller: NXP Semiconductors
Description: S912D60CE - 16 BIT MICROCONTROLL
DigiKey Programmable: Not Verified
Packaging: Bulk
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MC7448HX1700LD FSCLS03804-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC74XX 1.7GHZ 360FCCBGA
Packaging: Bulk
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.7GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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PCA9541AD/01,118 PCA9541A.pdf
PCA9541AD/01,118
Hersteller: NXP Semiconductors
Description: PCA9541AD/01 - C-Bus Controller
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I²C, SMBus
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I²C Multiplexer
Supplier Device Package: 16-SO
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PCF7953VTTC1AC1900 NXP_75017275.pdf?t.download=true&u=ovmfp3
PCF7953VTTC1AC1900
Hersteller: NXP Semiconductors
Description: PKE CHIPS
Features: RSSI Equipped
Packaging: Bulk
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512B RAM, 8kB ROM, 2kB EEPROM
Modulation or Protocol: UHF
Data Interface: SPI
Applications: Remote Keyless Entry
Supplier Device Package: 38-TSSOP
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KCF5212CAE66
Hersteller: NXP Semiconductors
Description: MCF5212CAE66 - RISC Microcontrol
Packaging: Bulk
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SA2T18H450W19SR6 A2T18H450W19S.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 30V NI1230
Packaging: Bulk
Package / Case: NI-1230S-4S4S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Configuration: Dual
Power - Output: 89W
Gain: 16.6dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4S4S
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 800 mA
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74HCT32D,652 74HC_HCT32.pdf
74HCT32D,652
Hersteller: NXP Semiconductors
Description: IC GATE OR
Packaging: Bulk
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MC9S08SH4CSC MC9S08SH8.pdf
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 4x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 5
DigiKey Programmable: Not Verified
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MC34910BAC FSCL-S-A0001160768-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: SYSTEM BASIS CHIP, LIN, 1X 5.0V/
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 5.5V ~ 18V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
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BFU768F,115 BFU768F.pdf
BFU768F,115
Hersteller: NXP Semiconductors
Description: BFU768F - NPN WIDEBAND SILICON G
Packaging: Bulk
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Frequency - Transition: 110GHz
Noise Figure (dB Typ @ f): 1.1dB ~ 1.2dB @ 5GHz ~ 5.9GHz
Supplier Device Package: 4-DFP
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BFU520XRR BFU520XR.pdf
Hersteller: NXP Semiconductors
Description: RF TRANS NPN 12V 10GHZ SOT-143R
Packaging: Bulk
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 17.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Frequency - Transition: 10GHz
Noise Figure (dB Typ @ f): 0.65dB @ 900MHz
Supplier Device Package: SOT-143R
Grade: Automotive
Qualification: AEC-Q101
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MCF51QE96CLH557
MCF51QE96CLH557
Hersteller: NXP Semiconductors
Description: MCF51QE 32-bit MCU, ColdFire V1
Packaging: Bulk
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PTN3944EWY PTN3944.pdf
Hersteller: NXP Semiconductors
Description: PTN3944 - Multi-Channel PCIe Gen
Packaging: Bulk
Package / Case: 36-WFLGA Exposed Pad
Delay Time: 70ps
Number of Channels: 4
Output: Differential
Input: Differential
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: PCIe
Current - Supply: 250mA
Data Rate (Max): 16Gbps
Supplier Device Package: 36-HWFLGA (2.1x6)
Signal Conditioning: Input Equalization
Capacitance - Input: 10 pF
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MMA3201KEGR2 FSCLS07536-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: MICROMACHINED ACCELEROMETER, DUA
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y
Acceleration Range: ±45g
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.25V
Bandwidth: 400Hz
Supplier Device Package: 20-SOIC
Sensitivity (mV/g): 50
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74LVT244ADB,112 74LVT_LVTH244A.pdf
74LVT244ADB,112
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SSOP
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TEA1532CT/N1,118 TEA1532BT_CT.pdf
TEA1532CT/N1,118
Hersteller: NXP Semiconductors
Description: IC CTLR SMPS 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 8.7V ~ 20V
Frequency - Switching: 100kHz ~ 150kHz
Mode: Continuous Conduction (CCM)
Supplier Device Package: 8-SO
Current - Startup: 1.2 mA
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TEA1520P/N2,112 TEA152X.pdf
TEA1520P/N2,112
Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Power (Watts): 30 W
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466+1.14 EUR
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TEA1533AT/N1,518 TEA1533T_AT.pdf
TEA1533AT/N1,518
Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 145°C (TJ)
Frequency - Switching: 25kHz ~ 175kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.7V ~ 20V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 11 V
Power (Watts): 250 W
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TEA1521T/N2,518 TEA152X.pdf
TEA1521T/N2,518
Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Power (Watts): 30 W
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371+1.45 EUR
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TEA1520T/N2,518 TEA152X.pdf
TEA1520T/N2,518
Hersteller: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Power (Watts): 30 W
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466+1.14 EUR
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G9S08AW32E5CFDE _MC9S08AW60.pdf?t.download=true&u=ovmfp3
G9S08AW32E5CFDE
Hersteller: NXP Semiconductors
Description: G9S08AW32 - S08AW: 8-BIT GENERAL
Packaging: Bulk
DigiKey Programmable: Not Verified
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74HCT374PW,112 PHGLS06009-1.pdf?t.download=true&u=5oefqw
74HCT374PW,112
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 44 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Number of Bits per Element: 8
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PCF8584T/2,518 PCF8584.pdf
PCF8584T/2,518
Hersteller: NXP Semiconductors
Description: IC CTRL PARALLEL/I2C BUS 20-SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Supply: 1.5mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
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AFT09MP055NR1 AFT09MP055N.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 12.5V TO270-4
Package / Case: TO-270AB
Packaging: Bulk
Current - Test: 550 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Supplier Device Package: TO-270 WB-4
Technology: LDMOS (Dual)
Gain: 15.7dB
Power - Output: 57W
Configuration: 2 N-Channel
Frequency: 764MHz ~ 941MHz
Mounting Type: Surface Mount
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BC860B,235 BC859_BC860.pdf
BC860B,235
Hersteller: NXP Semiconductors
Description: TRANS PNP 45V 0.1A TO-236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 250 mW
Qualification: AEC-Q101
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7407+0.074 EUR
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PCA9554AD,112 PCA9554%28A%29.pdf
PCA9554AD,112
Hersteller: NXP Semiconductors
Description: IC XPNDR 400KHZ I2C SMBUS 16SO
Features: POR
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SO
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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275+1.95 EUR
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LS1023AXN8QQB
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ LS1 1.6GHZ 780BGA
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
SATA: SATA 6Gbps (1)
Security Features: ARM TZ, Boot Security
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 3.0 + PHY (3)
Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Bulk
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4+170.5 EUR
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LS1028ACE7NQA
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Bulk
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
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MC9S08QE32CFM MC9S08QE32.pdf
MC9S08QE32CFM
Hersteller: NXP Semiconductors
Description: S08QE 8-BIT MCU, S08 CORE, 32KB
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 50.33MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 10x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
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KC9S08GT60ACFDE FSCL-S-A0001054932-1.pdf?t.download=true&u=5oefqw
KC9S08GT60ACFDE
Hersteller: NXP Semiconductors
Description: MC9S08GT60ACFDE - Microcontrolle
Packaging: Bulk
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K9S08SG16E1MTG
K9S08SG16E1MTG
Hersteller: NXP Semiconductors
Description: SAMPLE PACK DEVICE
Packaging: Bulk
DigiKey Programmable: Not Verified
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UBA2071AT/N1,118 UBA2071_A.pdf
UBA2071AT/N1,118
Hersteller: NXP Semiconductors
Description: IC DVR HALF BRIDGE 24-SOIC
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 38kHz ~ 42kHz
Type: CCFL/EEFL Controller
Operating Temperature: -25°C ~ 100°C
Voltage - Supply: 14V
Supplier Device Package: 24-SO
Dimming: Yes
Current - Supply: 1.5 mA
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PMK50XP,518 PMK50XP.pdf
PMK50XP,518
Hersteller: NXP Semiconductors
Description: NEXPERIA PMK50XP - 7.9A, 20V, 0.
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 7.9A (Tc)
Rds On (Max) @ Id, Vgs: 50mOhm @ 2.8A, 4.5V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: 8-SO
Drive Voltage (Max Rds On, Min Rds On): 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1020 pF @ 20 V
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NXH2280UK/C1Z
Hersteller: NXP Semiconductors
Description: NXH2280 - NFMI RADIO FOR WIRELES
Packaging: Bulk
auf Bestellung 78000 Stücke:
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PDTA114TMB,315 PHGLS24956-1.pdf?t.download=true&u=5oefqw
PDTA114TMB,315
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS
Packaging: Bulk
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TDA18219HN/C1,557 TDA18219HN.pdf
TDA18219HN/C1,557
Hersteller: NXP Semiconductors
Description: IC TV SILICON TUNER 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Standards: ATSC, DTMB, DVB-C, DVB-T/T2, ISDB-T
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I2C
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MPC8544CVJALFA FSCLS11192-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
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BF904AWR,115 BF904A%2CAR%2CAWR.pdf
BF904AWR,115
Hersteller: NXP Semiconductors
Description: RF MOSFET 5V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 200MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 7 V
Voltage - Test: 5 V
Current - Test: 10 mA
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SC16IS850LIBS,157 SC16IS850L.pdf
SC16IS850LIBS,157
Hersteller: NXP Semiconductors
Description: IC CONTROLLER 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 24-HVQFN (4x4)
DigiKey Programmable: Not Verified
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SC16C750BIBS,151 SC16C750B.pdf
SC16C750BIBS,151
Hersteller: NXP Semiconductors
Description: IC UART SINGLE W/FIFO 32-HVQFN
With Auto Flow Control: Yes
Supplier Device Package: 32-HVQFN (5x5)
Data Rate (Max): 3Mbps
FIFO's: 64 Byte
Voltage - Supply: 2.5V, 3.3V, 5V
Mounting Type: Surface Mount
With Modem Control: Yes
With False Start Bit Detection: Yes
Number of Channels: 1, UART
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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74LVC1G332GXZ 74LVC1G332.pdf
74LVC1G332GXZ
Hersteller: NXP Semiconductors
Description: IC SNGL
Packaging: Bulk
auf Bestellung 9950 Stücke:
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74HC377PW,112 PHGL-S-A0001541547-1.pdf?t.download=true&u=5oefqw
74HC377PW,112
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE 1-ELE 8-BIT
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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PCA9534PW,112 PCA9534.pdf
PCA9534PW,112
Hersteller: NXP Semiconductors
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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RP115L271D-E2 ?product=rp115
RP115L271D-E2
Hersteller: NXP Semiconductors
Description: RP115L - Low Voltage 500mA/1A LD
Packaging: Bulk
Package / Case: 8-XFDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Current - Quiescent (Iq): 160 µA
Voltage - Input (Max): 5.25V
Number of Regulators: 1
Supplier Device Package: DFN1216-8
Voltage - Output (Min/Fixed): 2.7V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.09V @ 500mA
Protection Features: Over Current, Over Temperature, Reverse Current
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BUK7225-55A,118 BUK7225-55A.pdf
Hersteller: NXP Semiconductors
Description: N-CHANNEL TRENCHMOS STANDARD LEV
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Ta)
Rds On (Max) @ Id, Vgs: 25mOhm @ 25A, 10V
Power Dissipation (Max): 94W (Ta)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: DPAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1310 pF @ 25 V
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TDA8579T/N1,118 TDA8579T.pdf
TDA8579T/N1,118
Hersteller: NXP Semiconductors
Description: IC TRANSCEIVER 0/2 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Receiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 0/2
Supplier Device Package: 8-SO
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PBSS5612PA,115 PHGLS20771-1.pdf?t.download=true&u=5oefqw
PBSS5612PA,115
Hersteller: NXP Semiconductors
Description: TRANS PNP 12V 6A 3HUSON
Packaging: Bulk
Package / Case: 3-PowerUDFN
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 300mA, 6A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 190 @ 2A, 2V
Frequency - Transition: 60MHz
Supplier Device Package: 3-HUSON (2x2)
Current - Collector (Ic) (Max): 6 A
Voltage - Collector Emitter Breakdown (Max): 12 V
Power - Max: 2.1 W
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74HC137D,652 74HC137.pdf
74HC137D,652
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HC137D - DECODER/DRIV
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Current - Output High, Low: 5.2mA, 5.2mA
Independent Circuits: 1
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Type: Decoder/Demultiplexer
Circuit: 1 x 3:8
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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TJA1054T/N1,518 TJA1054.pdf
TJA1054T/N1,518
Hersteller: NXP Semiconductors
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
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LPC2214FBD144/01,5 LPC2212_2214.pdf
LPC2214FBD144/01,5
Hersteller: NXP Semiconductors
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 112
DigiKey Programmable: Not Verified
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