Produkte > NXP SEMICONDUCTORS > Alle Produkte des Herstellers NXP SEMICONDUCTORS (69062) > Seite 38 nach 1152
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| BUK763R1-40B,118 | NXP Semiconductors |
Description: NEXPERIA BUK763R1-40B - 75A, 40VPackaging: Bulk Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V Power Dissipation (Max): 300W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: D2PAK Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 94 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 6808 pF @ 25 V |
auf Bestellung 12400 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC9328MX1DVM15 | NXP Semiconductors |
Description: IC MPU I.MX1 150MHZ 225MAPBGAPackaging: Bulk Package / Case: 225-LFBGA Mounting Type: Surface Mount Speed: 150MHz Operating Temperature: -30°C ~ 70°C (TA) Core Processor: ARM920T Voltage - I/O: 1.8V, 3V Supplier Device Package: 225-MAPBGA (13x13) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touch Panel Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART Part Status: Active |
auf Bestellung 207 Stücke: Lieferzeit 10-14 Tag (e) |
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PCMF2HDMI14SZ | NXP Semiconductors |
Description: CMCPackaging: Bulk Package / Case: 10-UFBGA, WLCSP Size / Dimension: 0.062" L x 0.046" W (1.57mm x 1.17mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Height: 0.024" (0.60mm) Filter Order: 3rd Applications: General Purpose Technology: LC Resistance - Channel (Ohms): 3 ESD Protection: Yes Part Status: Active Number of Channels: 2 |
auf Bestellung 4480 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK7509-55A,127 | NXP Semiconductors |
Description: NEXPERIA BUK7509-55A - 75A, 55V,Packaging: Bulk Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 9mOhm @ 25A, 10V Power Dissipation (Max): 211W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: TO-220AB Grade: Automotive Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 55 V Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 0 V Input Capacitance (Ciss) (Max) @ Vds: 3271 pF @ 25 V Qualification: AEC-Q101 |
auf Bestellung 3370 Stücke: Lieferzeit 10-14 Tag (e) |
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| 88W9068-A0-BWPC/AK | NXP Semiconductors |
Description: 88W9068 - WiFi Access Point SOC. Packaging: Bulk Type: TxRx Only Protocol: 802.11ax Data Rate (Max): 4.8Gbps Modulation: 1024QAM RF Family/Standard: WiFi Serial Interfaces: GPIO, I²C, SPI Part Status: Obsolete |
auf Bestellung 4760 Stücke: Lieferzeit 10-14 Tag (e) |
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| A3G35H100-04SR3 | NXP Semiconductors |
Description: RF MOSFET GAN 48V NI780Packaging: Bulk Package / Case: NI-780S-4L Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.6GHz Configuration: 2 N-Channel Power - Output: 14W Gain: 14dB @ 3.6GHz Technology: GaN Supplier Device Package: NI-780S-4L Part Status: Active Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 80 mA |
auf Bestellung 137 Stücke: Lieferzeit 10-14 Tag (e) |
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| LS1043ASN7MNLB | NXP Semiconductors |
Description: IC MPU QORIQ 1.2GHZ 621FCPBGA Packaging: Bulk Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (21x21) Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2) USB: USB 3.0 + PHY (3) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: ARM TZ, Boot Security SATA: SATA 6Gbps (1) Part Status: Active |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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| LS1088ASE7MQA | NXP Semiconductors |
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGAPackaging: Bulk Package / Case: 780-BFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53 Voltage - I/O: 1.2V Supplier Device Package: 780-FBGA (23x23) Ethernet: 10GbE (2), 1GbE (8) USB: USB 3.0 + PHY (2) Number of Cores/Bus Width: 8 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR4 Graphics Acceleration: No Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, IFC, PCI, SPI, UART Part Status: Active |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT105SCVL5B | NXP Semiconductors |
Description: MXRT1050 - i.MXRT105APackaging: Bulk Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz Program Memory Size: 96KB (96K x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Part Status: Active Number of I/O: 127 |
auf Bestellung 720 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT3G07GD,125 | NXP Semiconductors |
Description: IC BUFFER NON-INVERT 5.5V 8XSONPackaging: Bulk Package / Case: 8-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 3 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: -, 4mA Supplier Device Package: 8-XSON (2x3) Part Status: Active |
auf Bestellung 104522 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT368D,652 | NXP Semiconductors |
Description: IC BUFFER INVERT 5.5V 16SOPackaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 2, 4 (Hex) Current - Output High, Low: 6mA, 6mA Supplier Device Package: 16-SO Part Status: Active |
auf Bestellung 10682 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||
| MC7457RX1000NC | NXP Semiconductors |
Description: IC MPU MPC7457 1GHZ 483FCCBGAPackaging: Bulk Package / Case: 483-BCBGA, FCBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 483-FCCBGA (29x29) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC68MH360AI25L557 | NXP Semiconductors |
Description: IC CONTROLLER 240FQFPPackaging: Bulk Package / Case: 240-BFQFP Mounting Type: Surface Mount Type: Controller Supplier Device Package: 240-FQFP (32x32) Part Status: Obsolete DigiKey Programmable: Not Verified |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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UBA2024BT/N1,518 | NXP Semiconductors |
Description: IC DRIVER HALF BRIDGE 14SOPackaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 14-SO Dimming: No Current - Output Source/Sink: 2.5A Part Status: Obsolete Current - Supply: 5 mA |
auf Bestellung 315 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL81Z128VMP7 | NXP Semiconductors |
Description: MKL8 - Kinetis KL8 72MHz Cortex-Packaging: Bulk Package / Case: 64-LFBGA Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 128KB (128K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 11x16b; D/A 1x6/12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 64-MAPBGA (5x5) Part Status: Active Number of I/O: 41 |
auf Bestellung 620 Stücke: Lieferzeit 10-14 Tag (e) |
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PMP5201V/S711115 | NXP Semiconductors |
Description: NEXPERIA PMP5201V - SMALL SIGNALPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| A2T21H450W19SR6 | NXP Semiconductors |
Description: RF MOSFET LDMOS 30V NI1230Packaging: Bulk Package / Case: NI-1230S-4S4S Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 2.11GHz ~ 2.2GHz Power - Output: 89W Gain: 15.7dB Technology: LDMOS Supplier Device Package: NI-1230S-4S4S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 800 mA |
auf Bestellung 277 Stücke: Lieferzeit 10-14 Tag (e) |
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PSMN4R3-80PS,127 | NXP Semiconductors |
Description: NEXPERIA PSMN4R3-80PS - 120A, 80Packaging: Bulk Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V Power Dissipation (Max): 306W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: TO-220AB Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 80 V Gate Charge (Qg) (Max) @ Vgs: 111 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 8161 pF @ 40 V |
auf Bestellung 4206 Stücke: Lieferzeit 10-14 Tag (e) |
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| T2081NXE8P1B | NXP Semiconductors |
Description: IC MPU QORIQ T2 1.533GHZ 780FBGAPackaging: Bulk Package / Case: 780-BFBGA Mounting Type: Surface Mount Speed: 1.533GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 780-FBGA (23x23) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 8 Core, 64-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Obsolete |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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| S912XEG128J2CAAR | NXP Semiconductors |
Description: MC9S12XE - KIPPER-16-bit MCU, 12 Packaging: Bulk Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 59 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| MC33VR5500V1ES | NXP Semiconductors |
Description: MC33VR5500V1ES - High Voltage PMPackaging: Bulk Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C Voltage - Supply: 60V Topology: Step-Down (Buck) (4), Linear (LDO) (2) Supplier Device Package: 56-HVQFN (8x8) w/LED Driver: No w/Supervisor: Yes w/Sequencer: Yes Grade: Automotive Part Status: Active Number of Outputs: 6 Qualification: AEC-Q100 |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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| MPC561CVR40 | NXP Semiconductors |
Description: MPC561 - SILVER OAK-NXP 32-bit MPackaging: Bulk Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 40MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: PowerPC Data Converters: A/D 32x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Part Status: Active Number of I/O: 16 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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BUK764R0-75C,118 | NXP Semiconductors |
Description: NEXPERIA BUK764 - N-CHANNEL MOSFPackaging: Bulk Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V Power Dissipation (Max): 333W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: D2PAK Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 75 V Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| LS1027AXN7NQA | NXP Semiconductors |
Description: IC MPU QORIQ 1.3GHZ 448FBGA Packaging: Bulk Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) USB: USB 3.0 (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) Additional Interfaces: CANbus, I2C, SPI, UART Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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| LS2084AXN711B | NXP Semiconductors |
Description: IC MPU QORIQ 2.1GHZ 1292FCPBGA Packaging: Bulk Package / Case: 1292-BBGA, FCBGA Mounting Type: Surface Mount Speed: 2.1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 1292-FCPBGA (37.5x37.5) Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16) USB: USB 3.0 + PHY (2) Number of Cores/Bus Width: 8 Core, 64-Bit RAM Controllers: DDR4, SDRAM Graphics Acceleration: No Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (2) Additional Interfaces: GPIO, DUART, eMMC/SD/SDIO, I2C, PCIe, SPI Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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| P5020NXN7QMB557 | NXP Semiconductors |
Description: QORIQ, 64-BIT POWER ARCH SOC, 2Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| KMZ80J | NXP Semiconductors |
Description: KMZ80 - Programmable Angle SensoPackaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Output: Analog Voltage Operating Temperature: -40°C ~ 150°C Termination Style: Gull Wing Voltage - Supply: 4.5V ~ 5.5V Linearity: ±0.95° Actuator Type: External Magnet, Not Included Technology: Magnetoresistive For Measuring: Angle Supplier Device Package: 8-SOIC Output Signal: Clockwise Increase Grade: Automotive Part Status: Active Resistance: 5 kOhms Qualification: AEC-Q100 |
auf Bestellung 112726 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC54101J512UK49Z | NXP Semiconductors |
Description: LPC54101 - Cortex-M4/M0 32-bit MPackaging: Bulk Package / Case: 49-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0+ Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 49-WLCSP (3.29x3.29) Part Status: Active Number of I/O: 39 |
auf Bestellung 32000 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC54101J256UK49Z | NXP Semiconductors |
Description: LPC5410 - Low Power 32-bit MicroPackaging: Bulk Package / Case: 49-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0+ Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 49-WLCSP (3.29x3.29) Part Status: Active Number of I/O: 39 |
auf Bestellung 2469 Stücke: Lieferzeit 10-14 Tag (e) |
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UBA2024P/N1,112 | NXP Semiconductors |
Description: IC DRIVER HALF BRIDGE 8-DIPPackaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 8-DIP Dimming: No Current - Output Source/Sink: 900mA Part Status: Obsolete Current - Supply: 5 mA |
auf Bestellung 335266 Stücke: Lieferzeit 10-14 Tag (e) |
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| P1014NSN5DFB | NXP Semiconductors |
Description: IC MPU QORIQ P1 533MHZ 425TEPBGAPackaging: Bulk Package / Case: 425-FBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 425-TEPBGA I (19x19) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: CANbus, DUART, I2C, MMC/SD, SPI Part Status: Obsolete |
auf Bestellung 65 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9670PW,112 | NXP Semiconductors |
Description: Remote 8-bit I\/O expander for FFeatures: POR Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 1 MHz Interrupt Output: Yes Supplier Device Package: 16-TSSOP Current - Output Source/Sink: 300µA, 41mA Part Status: Obsolete |
auf Bestellung 1269 Stücke: Lieferzeit 10-14 Tag (e) |
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| PCA9672BS,118 | NXP Semiconductors |
Description: IC XPNDR 1MHZ I2C SMBUS 16HVQFNFeatures: POR Packaging: Bulk Package / Case: 16-VFQFN Exposed Pad Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 1 MHz Interrupt Output: Yes Supplier Device Package: 16-HVQFN (3x3) Current - Output Source/Sink: 300µA, 43mA Part Status: Obsolete DigiKey Programmable: Not Verified |
auf Bestellung 80038 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC34PF1510A1EPR2 | NXP Semiconductors |
Description: PF1510 - PMIC with 1A Li+ Linear Packaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 4.1V ~ 6V Frequency - Switching: 2MHz Topology: Step-Down (Buck) (3), Linear (LDO) (3) Supplier Device Package: 40-HVQFN (5x5) Voltage/Current - Output 1: 0.6V ~ 1.3875V, 1A Voltage/Current - Output 2: 0.6V ~ 1.3875V, 1A Voltage/Current - Output 3: 1.8V ~ 3.3V, 1A w/LED Driver: No w/Supervisor: No w/Sequencer: Yes Part Status: Active Number of Outputs: 6 |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT30PW,112 | NXP Semiconductors |
Description: IC GATE NANDPackaging: Bulk Part Status: Active |
auf Bestellung 14405 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHCT30PW,118 | NXP Semiconductors |
Description: NEXPERIA 74AHCT30PW - NAND GATE,Packaging: Bulk Part Status: Active |
auf Bestellung 11547 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC257ADB,112 | NXP Semiconductors |
Description: NEXPERIA 74LVC257ADB - MULTIPLEXPackaging: Bulk Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 4 x 2:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.2V ~ 3.6V Independent Circuits: 1 Current - Output High, Low: 24mA, 24mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP Part Status: Active |
auf Bestellung 6102 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTD113EQAZ | NXP Semiconductors |
Description: TRANS PREBIAS 50V 500MAPackaging: Bulk Part Status: Active |
auf Bestellung 30000 Stücke: Lieferzeit 10-14 Tag (e) |
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| S2ZMMBZ27VALT1G | NXP Semiconductors |
Description: S2ZMMBZ - ZEN SOT23 REG .225W SP Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| MC10XS3435BHFKR2 | NXP Semiconductors |
Description: MC10XS3435 - 12 V Automotive Ext Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Packaging: Bulk Package / Case: 24-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 4 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: High Side Rds On (Typ): 10mOhm, 35mOhm Input Type: Non-Inverting Voltage - Load: 6V ~ 20V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 6A Ratio - Input:Output: 1:1 Supplier Device Package: 24-PQFN (12x12) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Part Status: Obsolete |
auf Bestellung 1175 Stücke: Lieferzeit 10-14 Tag (e) |
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| BAS321135 | NXP Semiconductors |
Description: NOW NEXPERIA BAS321 - RECTIFIERPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| BZX79-B15143 | NXP Semiconductors |
Description: NEXPERIA ZENER DIODE, 15V, 2%, 0 Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| MC9S08AW60MFGE | NXP Semiconductors |
Description: MC9S08AW - Microcontroller, 8-BiPackaging: Bulk Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 34 |
auf Bestellung 780 Stücke: Lieferzeit 10-14 Tag (e) |
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| MIMXRT1051DVL6A | NXP Semiconductors |
Description: MXRT1050 - i.MX RT1050 Crossover Packaging: Bulk Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz Program Memory Size: 96KB (96K x 8) RAM Size: 512K x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-LFBGA (10x10) Part Status: Obsolete Number of I/O: 127 |
auf Bestellung 700 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC1102LVUKZ | NXP Semiconductors |
Description: LPC1102 - Scalable 32-bit MicrocPackaging: Bulk Package / Case: 25-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 6x8b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V Connectivity: I2C, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 25-WLCSP (2.17x2.32) Part Status: Active Number of I/O: 21 |
auf Bestellung 9651 Stücke: Lieferzeit 10-14 Tag (e) |
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SAF7741HV/N125ZK | NXP Semiconductors |
Description: SAF7741HV - CAR RADIO DIGITAL SI Packaging: Bulk Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Interface: I²C, I²S, LSB, SPDIF Type: Car Signal Processor Operating Temperature: -40°C ~ 85°C (TA) Voltage - I/O: 3.30V Voltage - Core: 1.80V Clock Rate: 44.1kHz, 48kHz, 96kHz Supplier Device Package: 144-HLQFP Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
|
74AHCT2G241GD,125 | NXP Semiconductors |
Description: IC BUFFER NON-INVERT 5.5V 8XSONPackaging: Bulk Package / Case: 8-XFDFN Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 8-XSON (2x3) Part Status: Active |
auf Bestellung 25005 Stücke: Lieferzeit 10-14 Tag (e) |
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MK21DX128AVMC5 | NXP Semiconductors |
Description: MK21DX128AVMC5 - Kinetis K21: 50Packaging: Bulk Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 1x16b SAR; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Part Status: Active Number of I/O: 64 |
auf Bestellung 161 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHC1G04GW-Q100125 | NXP Semiconductors |
Description: NEXPERIA 74AHC1G04GW-Q100 - INVEPackaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| 74AHC541PW-Q100118 | NXP Semiconductors |
Description: NEXPERIA 74AHC541PW-Q100 - BUS DPackaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| S912XDG128F2VAA | NXP Semiconductors |
Description: IC MCU 16BIT 128KB FLASH 80QFPPackaging: Bulk Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
auf Bestellung 84 Stücke: Lieferzeit 10-14 Tag (e) |
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| BC847RA147 | NXP Semiconductors |
Description: BC1NPN/PGENERAL-PURPODOUBTRANSIS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| MC74HC42D | NXP Semiconductors |
Description: 74HBDECIMDECOD1-OF-10 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| S32V-SONYCAM | NXP Semiconductors |
Description: S32V - MIPI CAMERAS AND DE-SERIA Packaging: Bulk For Use With/Related Products: S32V234 Accessory Type: Camera |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| S912XEG128J2MAA | NXP Semiconductors |
Description: MC9S12XE - KIPPER-16-BIT MCU, 12 Packaging: Bulk Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| MPC875CVR66 | NXP Semiconductors |
Description: IC MPU MPC87XX 66MHZ 256BGAPackaging: Bulk Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: HDLC, I2C, PCMCIA, SPI, TDM, UART |
auf Bestellung 43 Stücke: Lieferzeit 10-14 Tag (e) |
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| AFT20P060-4NR3 | NXP Semiconductors |
Description: RF MOSFET LDMOS 28V OM780-4Packaging: Bulk Package / Case: OM-780-4L Mounting Type: Surface Mount Frequency: 2.17GHz Configuration: 2 N-Channel Power - Output: 60W Gain: 18.9dB Technology: LDMOS (Dual) Supplier Device Package: OM-780-4L Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 450 mA |
auf Bestellung 1730 Stücke: Lieferzeit 10-14 Tag (e) |
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| BC847BS/DG/B3115 | NXP Semiconductors |
Description: BCSMASIGNBIPOLTRANSISTO0.1452-EL Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
|
PMEG2020EJ/ZL135 | NXP Semiconductors |
Description: PMEG2020EJ - Nexperia PMEG2020EJ Packaging: Bulk Package / Case: SC-90, SOD-323F Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Technology: Schottky Capacitance @ Vr, F: 50pF @ 5V, 1MHz Current - Average Rectified (Io): 2A Supplier Device Package: SOD-323F Operating Temperature - Junction: 150°C Voltage - DC Reverse (Vr) (Max): 20 V Voltage - Forward (Vf) (Max) @ If: 525 mV @ 2 A Current - Reverse Leakage @ Vr: 200 µA @ 20 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
| LPC2294U029 | NXP Semiconductors |
Description: LPC2294 - Arm7, 32-Bit RISC Micr Packaging: Bulk |
auf Bestellung 6327 Stücke: Lieferzeit 10-14 Tag (e) |
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| BUK763R1-40B,118 |
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Hersteller: NXP Semiconductors
Description: NEXPERIA BUK763R1-40B - 75A, 40V
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 94 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6808 pF @ 25 V
Description: NEXPERIA BUK763R1-40B - 75A, 40V
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 94 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6808 pF @ 25 V
auf Bestellung 12400 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 233+ | 2.27 EUR |
| MC9328MX1DVM15 |
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Hersteller: NXP Semiconductors
Description: IC MPU I.MX1 150MHZ 225MAPBGA
Packaging: Bulk
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Part Status: Active
Description: IC MPU I.MX1 150MHZ 225MAPBGA
Packaging: Bulk
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Part Status: Active
auf Bestellung 207 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 13+ | 39.86 EUR |
| PCMF2HDMI14SZ |
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Hersteller: NXP Semiconductors
Description: CMC
Packaging: Bulk
Package / Case: 10-UFBGA, WLCSP
Size / Dimension: 0.062" L x 0.046" W (1.57mm x 1.17mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Height: 0.024" (0.60mm)
Filter Order: 3rd
Applications: General Purpose
Technology: LC
Resistance - Channel (Ohms): 3
ESD Protection: Yes
Part Status: Active
Number of Channels: 2
Description: CMC
Packaging: Bulk
Package / Case: 10-UFBGA, WLCSP
Size / Dimension: 0.062" L x 0.046" W (1.57mm x 1.17mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Height: 0.024" (0.60mm)
Filter Order: 3rd
Applications: General Purpose
Technology: LC
Resistance - Channel (Ohms): 3
ESD Protection: Yes
Part Status: Active
Number of Channels: 2
auf Bestellung 4480 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1332+ | 0.37 EUR |
| BUK7509-55A,127 |
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Hersteller: NXP Semiconductors
Description: NEXPERIA BUK7509-55A - 75A, 55V,
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 25A, 10V
Power Dissipation (Max): 211W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 0 V
Input Capacitance (Ciss) (Max) @ Vds: 3271 pF @ 25 V
Qualification: AEC-Q101
Description: NEXPERIA BUK7509-55A - 75A, 55V,
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 25A, 10V
Power Dissipation (Max): 211W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 0 V
Input Capacitance (Ciss) (Max) @ Vds: 3271 pF @ 25 V
Qualification: AEC-Q101
auf Bestellung 3370 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 533+ | 0.94 EUR |
| 88W9068-A0-BWPC/AK |
Hersteller: NXP Semiconductors
Description: 88W9068 - WiFi Access Point SOC.
Packaging: Bulk
Type: TxRx Only
Protocol: 802.11ax
Data Rate (Max): 4.8Gbps
Modulation: 1024QAM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, I²C, SPI
Part Status: Obsolete
Description: 88W9068 - WiFi Access Point SOC.
Packaging: Bulk
Type: TxRx Only
Protocol: 802.11ax
Data Rate (Max): 4.8Gbps
Modulation: 1024QAM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, I²C, SPI
Part Status: Obsolete
auf Bestellung 4760 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 10+ | 55.25 EUR |
| A3G35H100-04SR3 |
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Hersteller: NXP Semiconductors
Description: RF MOSFET GAN 48V NI780
Packaging: Bulk
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Configuration: 2 N-Channel
Power - Output: 14W
Gain: 14dB @ 3.6GHz
Technology: GaN
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 80 mA
Description: RF MOSFET GAN 48V NI780
Packaging: Bulk
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Configuration: 2 N-Channel
Power - Output: 14W
Gain: 14dB @ 3.6GHz
Technology: GaN
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 80 mA
auf Bestellung 137 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 166.65 EUR |
| LS1043ASN7MNLB |
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Part Status: Active
Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 5+ | 123.73 EUR |
| LS1088ASE7MQA |
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Hersteller: NXP Semiconductors
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1.2V
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, IFC, PCI, SPI, UART
Part Status: Active
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1.2V
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, IFC, PCI, SPI, UART
Part Status: Active
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 254.72 EUR |
| MIMXRT105SCVL5B |
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Hersteller: NXP Semiconductors
Description: MXRT1050 - i.MXRT105A
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
Description: MXRT1050 - i.MXRT105A
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
auf Bestellung 720 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 37+ | 12.87 EUR |
| 74HCT3G07GD,125 |
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Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
auf Bestellung 104522 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1519+ | 0.35 EUR |
| 74HCT368D,652 |
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Hersteller: NXP Semiconductors
Description: IC BUFFER INVERT 5.5V 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SO
Part Status: Active
Description: IC BUFFER INVERT 5.5V 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SO
Part Status: Active
auf Bestellung 10682 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| MC7457RX1000NC |
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Hersteller: NXP Semiconductors
Description: IC MPU MPC7457 1GHZ 483FCCBGA
Packaging: Bulk
Package / Case: 483-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Active
Description: IC MPU MPC7457 1GHZ 483FCCBGA
Packaging: Bulk
Package / Case: 483-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 749.43 EUR |
| MC68MH360AI25L557 |
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Hersteller: NXP Semiconductors
Description: IC CONTROLLER 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Type: Controller
Supplier Device Package: 240-FQFP (32x32)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC CONTROLLER 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Type: Controller
Supplier Device Package: 240-FQFP (32x32)
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 158.08 EUR |
| UBA2024BT/N1,518 |
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Hersteller: NXP Semiconductors
Description: IC DRIVER HALF BRIDGE 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 2.5A
Part Status: Obsolete
Current - Supply: 5 mA
Description: IC DRIVER HALF BRIDGE 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 2.5A
Part Status: Obsolete
Current - Supply: 5 mA
auf Bestellung 315 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 237+ | 1.91 EUR |
| MKL81Z128VMP7 |
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Hersteller: NXP Semiconductors
Description: MKL8 - Kinetis KL8 72MHz Cortex-
Packaging: Bulk
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x6/12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 41
Description: MKL8 - Kinetis KL8 72MHz Cortex-
Packaging: Bulk
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x6/12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 41
auf Bestellung 620 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 41+ | 11.76 EUR |
| PMP5201V/S711115 |
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Hersteller: NXP Semiconductors
Description: NEXPERIA PMP5201V - SMALL SIGNAL
Packaging: Bulk
Part Status: Active
Description: NEXPERIA PMP5201V - SMALL SIGNAL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A2T21H450W19SR6 |
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Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 30V NI1230
Packaging: Bulk
Package / Case: NI-1230S-4S4S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.2GHz
Power - Output: 89W
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4S4S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 800 mA
Description: RF MOSFET LDMOS 30V NI1230
Packaging: Bulk
Package / Case: NI-1230S-4S4S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.2GHz
Power - Output: 89W
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4S4S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 800 mA
auf Bestellung 277 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 379.28 EUR |
| PSMN4R3-80PS,127 |
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Hersteller: NXP Semiconductors
Description: NEXPERIA PSMN4R3-80PS - 120A, 80
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 111 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8161 pF @ 40 V
Description: NEXPERIA PSMN4R3-80PS - 120A, 80
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 111 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8161 pF @ 40 V
auf Bestellung 4206 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 207+ | 2.57 EUR |
| T2081NXE8P1B |
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Hersteller: NXP Semiconductors
Description: IC MPU QORIQ T2 1.533GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Description: IC MPU QORIQ T2 1.533GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Obsolete
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 550.9 EUR |
| S912XEG128J2CAAR |
Hersteller: NXP Semiconductors
Description: MC9S12XE - KIPPER-16-bit MCU, 12
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
Description: MC9S12XE - KIPPER-16-bit MCU, 12
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33VR5500V1ES |
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Hersteller: NXP Semiconductors
Description: MC33VR5500V1ES - High Voltage PM
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 60V
Topology: Step-Down (Buck) (4), Linear (LDO) (2)
Supplier Device Package: 56-HVQFN (8x8)
w/LED Driver: No
w/Supervisor: Yes
w/Sequencer: Yes
Grade: Automotive
Part Status: Active
Number of Outputs: 6
Qualification: AEC-Q100
Description: MC33VR5500V1ES - High Voltage PM
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 60V
Topology: Step-Down (Buck) (4), Linear (LDO) (2)
Supplier Device Package: 56-HVQFN (8x8)
w/LED Driver: No
w/Supervisor: Yes
w/Sequencer: Yes
Grade: Automotive
Part Status: Active
Number of Outputs: 6
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 50+ | 9.77 EUR |
| MPC561CVR40 |
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Hersteller: NXP Semiconductors
Description: MPC561 - SILVER OAK-NXP 32-bit M
Packaging: Bulk
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Active
Number of I/O: 16
Description: MPC561 - SILVER OAK-NXP 32-bit M
Packaging: Bulk
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Active
Number of I/O: 16
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BUK764R0-75C,118 |
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Hersteller: NXP Semiconductors
Description: NEXPERIA BUK764 - N-CHANNEL MOSF
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
Description: NEXPERIA BUK764 - N-CHANNEL MOSF
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LS1027AXN7NQA |
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Bulk
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Bulk
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 6+ | 98.79 EUR |
| LS2084AXN711B |
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ 2.1GHZ 1292FCPBGA
Packaging: Bulk
Package / Case: 1292-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (2)
Additional Interfaces: GPIO, DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
Part Status: Active
Description: IC MPU QORIQ 2.1GHZ 1292FCPBGA
Packaging: Bulk
Package / Case: 1292-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (2)
Additional Interfaces: GPIO, DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 715.62 EUR |
| P5020NXN7QMB557 |
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Hersteller: NXP Semiconductors
Description: QORIQ, 64-BIT POWER ARCH SOC, 2
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: QORIQ, 64-BIT POWER ARCH SOC, 2
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 942.3 EUR |
| KMZ80J |
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Hersteller: NXP Semiconductors
Description: KMZ80 - Programmable Angle Senso
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Analog Voltage
Operating Temperature: -40°C ~ 150°C
Termination Style: Gull Wing
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±0.95°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 8-SOIC
Output Signal: Clockwise Increase
Grade: Automotive
Part Status: Active
Resistance: 5 kOhms
Qualification: AEC-Q100
Description: KMZ80 - Programmable Angle Senso
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Analog Voltage
Operating Temperature: -40°C ~ 150°C
Termination Style: Gull Wing
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±0.95°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 8-SOIC
Output Signal: Clockwise Increase
Grade: Automotive
Part Status: Active
Resistance: 5 kOhms
Qualification: AEC-Q100
auf Bestellung 112726 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 133+ | 3.51 EUR |
| LPC54101J512UK49Z |
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Hersteller: NXP Semiconductors
Description: LPC54101 - Cortex-M4/M0 32-bit M
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
Description: LPC54101 - Cortex-M4/M0 32-bit M
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
auf Bestellung 32000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 61+ | 7.81 EUR |
| LPC54101J256UK49Z |
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Hersteller: NXP Semiconductors
Description: LPC5410 - Low Power 32-bit Micro
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
Description: LPC5410 - Low Power 32-bit Micro
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
auf Bestellung 2469 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 72+ | 7.04 EUR |
| UBA2024P/N1,112 |
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Hersteller: NXP Semiconductors
Description: IC DRIVER HALF BRIDGE 8-DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
Description: IC DRIVER HALF BRIDGE 8-DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
auf Bestellung 335266 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 241+ | 1.89 EUR |
| P1014NSN5DFB |
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Hersteller: NXP Semiconductors
Description: IC MPU QORIQ P1 533MHZ 425TEPBGA
Packaging: Bulk
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CANbus, DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
Description: IC MPU QORIQ P1 533MHZ 425TEPBGA
Packaging: Bulk
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CANbus, DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
auf Bestellung 65 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 10+ | 49.55 EUR |
| PCA9670PW,112 |
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Hersteller: NXP Semiconductors
Description: Remote 8-bit I\/O expander for F
Features: POR
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 300µA, 41mA
Part Status: Obsolete
Description: Remote 8-bit I\/O expander for F
Features: POR
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 300µA, 41mA
Part Status: Obsolete
auf Bestellung 1269 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 301+ | 1.55 EUR |
| PCA9672BS,118 |
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Hersteller: NXP Semiconductors
Description: IC XPNDR 1MHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 300µA, 43mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC XPNDR 1MHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 300µA, 43mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 80038 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 222+ | 2.13 EUR |
| MC34PF1510A1EPR2 |
Hersteller: NXP Semiconductors
Description: PF1510 - PMIC with 1A Li+ Linear
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 4.1V ~ 6V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (3), Linear (LDO) (3)
Supplier Device Package: 40-HVQFN (5x5)
Voltage/Current - Output 1: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 2: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 3: 1.8V ~ 3.3V, 1A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: Yes
Part Status: Active
Number of Outputs: 6
Description: PF1510 - PMIC with 1A Li+ Linear
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 4.1V ~ 6V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (3), Linear (LDO) (3)
Supplier Device Package: 40-HVQFN (5x5)
Voltage/Current - Output 1: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 2: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 3: 1.8V ~ 3.3V, 1A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: Yes
Part Status: Active
Number of Outputs: 6
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 106+ | 5.02 EUR |
| 74HCT30PW,112 |
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auf Bestellung 14405 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1697+ | 0.3 EUR |
| 74AHCT30PW,118 |
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Hersteller: NXP Semiconductors
Description: NEXPERIA 74AHCT30PW - NAND GATE,
Packaging: Bulk
Part Status: Active
Description: NEXPERIA 74AHCT30PW - NAND GATE,
Packaging: Bulk
Part Status: Active
auf Bestellung 11547 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2133+ | 0.25 EUR |
| 74LVC257ADB,112 |
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Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC257ADB - MULTIPLEX
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
Description: NEXPERIA 74LVC257ADB - MULTIPLEX
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
auf Bestellung 6102 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1410+ | 0.37 EUR |
| PDTD113EQAZ |
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Hersteller: NXP Semiconductors
Description: TRANS PREBIAS 50V 500MA
Packaging: Bulk
Part Status: Active
Description: TRANS PREBIAS 50V 500MA
Packaging: Bulk
Part Status: Active
auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 7322+ | 0.062 EUR |
| S2ZMMBZ27VALT1G |
Hersteller: NXP Semiconductors
Description: S2ZMMBZ - ZEN SOT23 REG .225W SP
Packaging: Bulk
Part Status: Active
Description: S2ZMMBZ - ZEN SOT23 REG .225W SP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC10XS3435BHFKR2 |
Hersteller: NXP Semiconductors
Description: MC10XS3435 - 12 V Automotive Ext
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Bulk
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 35mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Description: MC10XS3435 - 12 V Automotive Ext
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Bulk
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 35mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
auf Bestellung 1175 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 61+ | 8.75 EUR |
| BAS321135 |
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Hersteller: NXP Semiconductors
Description: NOW NEXPERIA BAS321 - RECTIFIER
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BAS321 - RECTIFIER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX79-B15143 |
Hersteller: NXP Semiconductors
Description: NEXPERIA ZENER DIODE, 15V, 2%, 0
Packaging: Bulk
Part Status: Active
Description: NEXPERIA ZENER DIODE, 15V, 2%, 0
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08AW60MFGE |
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Hersteller: NXP Semiconductors
Description: MC9S08AW - Microcontroller, 8-Bi
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
Description: MC9S08AW - Microcontroller, 8-Bi
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
auf Bestellung 780 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 34+ | 14.64 EUR |
| MIMXRT1051DVL6A |
Hersteller: NXP Semiconductors
Description: MXRT1050 - i.MX RT1050 Crossover
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Obsolete
Number of I/O: 127
Description: MXRT1050 - i.MX RT1050 Crossover
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Obsolete
Number of I/O: 127
auf Bestellung 700 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 47+ | 11.32 EUR |
| LPC1102LVUKZ |
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Hersteller: NXP Semiconductors
Description: LPC1102 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 25-WLCSP (2.17x2.32)
Part Status: Active
Number of I/O: 21
Description: LPC1102 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 25-WLCSP (2.17x2.32)
Part Status: Active
Number of I/O: 21
auf Bestellung 9651 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 111+ | 4.55 EUR |
| SAF7741HV/N125ZK |
Hersteller: NXP Semiconductors
Description: SAF7741HV - CAR RADIO DIGITAL SI
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, LSB, SPDIF
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Clock Rate: 44.1kHz, 48kHz, 96kHz
Supplier Device Package: 144-HLQFP
Part Status: Obsolete
Description: SAF7741HV - CAR RADIO DIGITAL SI
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, LSB, SPDIF
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Clock Rate: 44.1kHz, 48kHz, 96kHz
Supplier Device Package: 144-HLQFP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AHCT2G241GD,125 |
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Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
auf Bestellung 25005 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2049+ | 0.24 EUR |
| MK21DX128AVMC5 |
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Hersteller: NXP Semiconductors
Description: MK21DX128AVMC5 - Kinetis K21: 50
Packaging: Bulk
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 64
Description: MK21DX128AVMC5 - Kinetis K21: 50
Packaging: Bulk
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 64
auf Bestellung 161 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 46+ | 11.09 EUR |
| S912XDG128F2VAA |
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Hersteller: NXP Semiconductors
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 18+ | 25.06 EUR |
| BC847RA147 |
Hersteller: NXP Semiconductors
Description: BC1NPN/PGENERAL-PURPODOUBTRANSIS
Packaging: Tape & Reel (TR)
Description: BC1NPN/PGENERAL-PURPODOUBTRANSIS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32V-SONYCAM |
Hersteller: NXP Semiconductors
Description: S32V - MIPI CAMERAS AND DE-SERIA
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
Description: S32V - MIPI CAMERAS AND DE-SERIA
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 435.63 EUR |
| S912XEG128J2MAA |
Hersteller: NXP Semiconductors
Description: MC9S12XE - KIPPER-16-BIT MCU, 12
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
Description: MC9S12XE - KIPPER-16-BIT MCU, 12
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
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| MPC875CVR66 |
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Hersteller: NXP Semiconductors
Description: IC MPU MPC87XX 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC, I2C, PCMCIA, SPI, TDM, UART
Description: IC MPU MPC87XX 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC, I2C, PCMCIA, SPI, TDM, UART
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 8+ | 62.15 EUR |
| AFT20P060-4NR3 |
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Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: 2 N-Channel
Power - Output: 60W
Gain: 18.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: 2 N-Channel
Power - Output: 60W
Gain: 18.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
auf Bestellung 1730 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 8+ | 63.84 EUR |
| BC847BS/DG/B3115 |
Hersteller: NXP Semiconductors
Description: BCSMASIGNBIPOLTRANSISTO0.1452-EL
Packaging: Tape & Reel (TR)
Description: BCSMASIGNBIPOLTRANSISTO0.1452-EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| PMEG2020EJ/ZL135 |
Hersteller: NXP Semiconductors
Description: PMEG2020EJ - Nexperia PMEG2020EJ
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 50pF @ 5V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: SOD-323F
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 525 mV @ 2 A
Current - Reverse Leakage @ Vr: 200 µA @ 20 V
Description: PMEG2020EJ - Nexperia PMEG2020EJ
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 50pF @ 5V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: SOD-323F
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 525 mV @ 2 A
Current - Reverse Leakage @ Vr: 200 µA @ 20 V
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| LPC2294U029 |
auf Bestellung 6327 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 21+ | 25.77 EUR |





















