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PZU6.8B2L,315 PZU6.8B2L,315 NXP Semiconductors PHGLS15647-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 6.8V 250MW DFN1006-2
Tolerance: ±2%
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 500 nA @ 3.5 V
Produkt ist nicht verfügbar
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TIP42CTU-F129 TIP42CTU-F129 NXP Semiconductors Description: TIP42C - PNP Epitaxial Silicon T
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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74LVT16244BDL,118 74LVT16244BDL,118 NXP Semiconductors PHGLS24271-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 48SSOP
Packaging: Bulk
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-SSOP
Part Status: Active
auf Bestellung 10113 Stücke:
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523+0.95 EUR
Mindestbestellmenge: 523
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MPC8349VVAJDB NXP Semiconductors FSCLS06085-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC83XX 533MHZ 672TBGA
Packaging: Bulk
Package / Case: 672-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-TBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, UART
Part Status: Obsolete
auf Bestellung 24 Stücke:
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2+253.68 EUR
Mindestbestellmenge: 2
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BLS7G2729L-350P,11 NXP Semiconductors Description: BLS7G2729L-350P - Power LDMOS tr
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74ALVCH162245DGG,112 74ALVCH162245DGG,112 NXP Semiconductors NEXP-S-A0002908214-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74ALVCH162245DGG - BUS
Packaging: Bulk
Part Status: Active
auf Bestellung 711 Stücke:
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711+0.75 EUR
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74AVC16245DGG-Q10J 74AVC16245DGG-Q10J NXP Semiconductors 74AVC16245_Q100.pdf Description: IC TXRX NON-INVERT 3.6V 48TSSOP
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
auf Bestellung 2267 Stücke:
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304+1.67 EUR
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74HCT3G14DC,125 74HCT3G14DC,125 NXP Semiconductors PHGLS18906-1.pdf?t.download=true&u=5oefqw Description: IC INVERT SCHMITT 3CH 3IN 8VSSOP
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 8-VSSOP
Input Logic Level - High: 1.9V ~ 2.1V
Input Logic Level - Low: 0.5V ~ 0.6V
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 1 µA
auf Bestellung 103202 Stücke:
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2331+0.21 EUR
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PMV20EN215 PMV20EN215 NXP Semiconductors PMV20EN.pdf Description: NEXPERIA PMV20EN - SMALL SIGNAL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BUK7Y98-80E,115 BUK7Y98-80E,115 NXP Semiconductors BUK7Y98-80E.pdf Description: NEXPERIA BUK7Y98 - N-CHANNEL 80
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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S25FL064P0XMFV003 NXP Semiconductors Description: S25FL064P - 64-Mbit 3.0 V Flash
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCF54450ACVM180 NXP Semiconductors Description: MCF5445x - 32-bit MPU, ColdFire
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PZU9.1BL,315 PZU9.1BL,315 NXP Semiconductors PZUXBL_SER.pdf Description: NEXPERIA PZU9.1BL - ZENER DIODE,
Packaging: Bulk
Tolerance: ±5%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
auf Bestellung 92499 Stücke:
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12070+0.03 EUR
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PZU3.6B2L,315 PZU3.6B2L,315 NXP Semiconductors PHGLS15647-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PZU3.6B2L - ZENER DIODE
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
auf Bestellung 20000 Stücke:
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10764+0.05 EUR
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BZX884-B30,315 BZX884-B30,315 NXP Semiconductors PHGLS19465-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA BZX884-B30 - ZENER DIOD
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 30 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 21 V
auf Bestellung 16905 Stücke:
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11727+0.05 EUR
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TDA18219HN/C1518 NXP Semiconductors Description: TDA18SILICTUN40HVQFN
Packaging: Bulk
Part Status: Obsolete
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Standards: DTMB, DVB-C, DVB-T, ISDB-T
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I²C
auf Bestellung 4000 Stücke:
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174+2.78 EUR
Mindestbestellmenge: 174
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NXQ1TXH5/101118 NXQ1TXH5/101118 NXP Semiconductors Description: NXQ1TXH5 - One-chip 5 V Qi wirel
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCA9663B/S911118 NXP Semiconductors Description: PCA9663 - Parallel Bus to Three-
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX31LDVMN5DR2 NXP Semiconductors FSCLS05432-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX31 532MHZ 473BGA
Packaging: Bulk
Part Status: Active
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2V, 2.5V, 2.7V, 3V
Supplier Device Package: 473-PBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
auf Bestellung 5250 Stücke:
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10+49.97 EUR
Mindestbestellmenge: 10
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74HCT27PW,112 74HCT27PW,112 NXP Semiconductors 74HC_HCT27.pdf Description: IC GATE NOR
Packaging: Bulk
Part Status: Active
auf Bestellung 12686 Stücke:
Lieferzeit 10-14 Tag (e)
2329+0.21 EUR
Mindestbestellmenge: 2329
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MCIMX6Q4AVT10AE NXP Semiconductors Description: MCIMX6Q4AVT10AE - i.MX 6 series
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PMEG100T20ELPX NXP Semiconductors Description: PMEG100T20ELP - 100 V, 2 A low l
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 12 ns
Technology: Schottky
Capacitance @ Vr, F: 200pF @ 1V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: SOD-128/CFP5
Operating Temperature - Junction: 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 2 A
Current - Reverse Leakage @ Vr: 1.25 µA @ 100 V
auf Bestellung 7781 Stücke:
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3000+0.18 EUR
Mindestbestellmenge: 3000
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BZX79-C36143 BZX79-C36143 NXP Semiconductors BZX79.pdf Description: NOW NEXPERIA BZX79-C36 - ZENER D
Packaging: Bulk
Part Status: Active
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Produkt ist nicht verfügbar
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KC912DG128CCPVE KC912DG128CCPVE NXP Semiconductors Description: MC912DG128CCPVE - Microcontrolle
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NT2H1611G0DA8J NXP Semiconductors NTAG213_215_216.pdf Description: NT2H1611G0DA8 - NTAG NFC Forum T
Packaging: Bulk
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: PLLMC
Part Status: Active
auf Bestellung 22551 Stücke:
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784+0.62 EUR
Mindestbestellmenge: 784
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LX2080XE72232B NXP Semiconductors LX2160XE72232B.pdf?t.download=true&u=axiww2 Description: IC MPU QORIQ LX 2.2GHZ 1517BGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4 SDRAM
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
auf Bestellung 737 Stücke:
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1+970.64 EUR
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LX2120SE72029B NXP Semiconductors Description: IC MPU QORIQ LX 2GHZ 1517FCPBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4 SDRAM
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
auf Bestellung 21 Stücke:
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1+975.11 EUR
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LX2160SC72232B NXP Semiconductors LX2160XE72232B.pdf?t.download=true&u=axiww2 Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4 SDRAM
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Part Status: Active
auf Bestellung 17 Stücke:
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1+1181.10 EUR
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74LVC1GU04GN,132 74LVC1GU04GN,132 NXP Semiconductors PHGLS27066-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 3750 Stücke:
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3750+0.17 EUR
Mindestbestellmenge: 3750
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LPC4074FBD144,551 LPC4074FBD144,551 NXP Semiconductors PHGLS25790-1.pdf?t.download=true&u=5oefqw Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 109
auf Bestellung 623 Stücke:
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44+11.49 EUR
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PN7360AUEV/C300Y NXP Semiconductors Description: PN7360AUEV - NFC Cortex®
Packaging: Bulk
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Part Status: Active
auf Bestellung 4000 Stücke:
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40+13.32 EUR
Mindestbestellmenge: 40
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PUMH9/ZL165 NXP Semiconductors Description: Nexperia PUMH9 Small Signal Bipo
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 2 NPN - Pre-Biased
Power - Max: 200mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Frequency - Transition: 230MHz
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 47kOhm
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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LPC2921FBD100,551 LPC2921FBD100,551 NXP Semiconductors PHGLS20650-1.pdf?t.download=true&u=5oefqw Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 16x8b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 60
auf Bestellung 287 Stücke:
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38+13.04 EUR
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LPC1112FHI33/102,5 LPC1112FHI33/102,5 NXP Semiconductors Description: LPC1112 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
auf Bestellung 2351 Stücke:
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158+3.34 EUR
Mindestbestellmenge: 158
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LPC1114LVFHN24/103 LPC1114LVFHN24/103 NXP Semiconductors PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 4x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 20
Connectivity: I2C, SPI, SSP, UART/USART
auf Bestellung 964 Stücke:
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166+2.94 EUR
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74AUP2G04GM,132 74AUP2G04GM,132 NXP Semiconductors PHGLS24263-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 2CH 2-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (1.45x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
Produkt ist nicht verfügbar
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88W8987-A2-NYEA/AZ NXP Semiconductors Description: 88W8987 - RF Transceiver (Board
Packaging: Bulk
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Data Rate (Max): 433Mbps
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Part Status: Active
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74AUP2G241DC,125 74AUP2G241DC,125 NXP Semiconductors PHGLS26016-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 8VSSOP
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-VSSOP
Part Status: Active
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PMEG2015EA115 PMEG2015EA115 NXP Semiconductors PMEG2015EA.pdf Description: DIODE SCHOTTKY 20V 1.5A SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Current - Average Rectified (Io): 1.5A
Supplier Device Package: SOD-323
Operating Temperature - Junction: -65°C ~ 125°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 660 mV @ 1.5 A
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
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PMDXB600UNEL/S500Z NXP Semiconductors Description: PMDXB600UNEL - N Channel MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MRF6VP11KGSR5 NXP Semiconductors FSCLS07342-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230-4S GW
Current Rating (Amps): 100µA
Mounting Type: Surface Mount
Configuration: 2 N-Channel
Power - Output: 1000W
Technology: LDMOS (Dual)
Supplier Device Package: NI-1230-4S GULL
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
Frequency: 1.8MHz ~ 150MHz
Gain: 26dB
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MIMX8QM6CVUFFAB NXP Semiconductors Description: IC MPU I.MX8Q 264MHZ 1313FCPBGA
Packaging: Bulk
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: LPDDR4
Graphics Acceleration: Yes
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Part Status: Active
Package / Case: 1313-BBGA, FCBGA
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Supplier Device Package: 1313-FCPBGA (29x29)
Speed: 1.6GHz, 1.2GHz, 264MHz
Ethernet: 1Gbps (2)
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Additional Interfaces: CANbus, I2C, SPI, UART
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MC35XS3500HFK NXP Semiconductors MC35XS3500.pdf Description: MC35XS3500HFK - 12 V Automotive
Packaging: Bulk
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 5
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 35mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 6V ~ 28V
Voltage - Supply (Vcc/Vdd): 6V ~ 28V
Ratio - Input:Output: 1:5
Supplier Device Package: 24-PQFN (12x12)
Part Status: Obsolete
Current - Output (Max): 65mA
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Battery, UVLO
Produkt ist nicht verfügbar
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74LVC257AD,112 74LVC257AD,112 NXP Semiconductors 74LVC257A.pdf Description: NEXPERIA 74LVC257AD - MULTIPLEXE
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Active
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PMN48XPAX PMN48XPAX NXP Semiconductors PMN48XPA.pdf Description: NEXPERIA PMN48XP - 20V, P-CHANNE
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 4.1A (Ta)
Rds On (Max) @ Id, Vgs: 55mOhm @ 2.4A, 4.5V
Power Dissipation (Max): 530mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Supplier Device Package: 6-TSOP
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1000 pF @ 10 V
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NX7002AK215 NXP Semiconductors Description: Nexperia NX7002AK - Small Signal
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 190mA (Ta), 300mA (Tc)
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 100mA, 10V
Power Dissipation (Max): 265mW (Ta), 1.33W (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 250µA
Supplier Device Package: SOT-23-3 (TO-236)
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 0.43 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 20 pF @ 10 V
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MPC8358CVRADDDA557 NXP Semiconductors Description: IC MPU MPC83XX 266MHZ 668TEPBGA
Packaging: Bulk
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-TEPBGA (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
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BUK763R1-40B,118 NXP Semiconductors PHGLS22330-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA BUK763R1-40B - 75A, 40V
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 94 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6808 pF @ 25 V
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MC9328MX1DVM15 NXP Semiconductors FSCLS05269-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX1 150MHZ 225MAPBGA
Packaging: Bulk
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Part Status: Active
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
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PCMF2HDMI14SZ PCMF2HDMI14SZ NXP Semiconductors PCMFXHDMI14S_SER.pdf Description: CMC
Packaging: Bulk
Package / Case: 10-UFBGA, WLCSP
Size / Dimension: 0.062" L x 0.046" W (1.57mm x 1.17mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Height: 0.024" (0.60mm)
Filter Order: 3rd
Applications: General Purpose
Technology: LC
Resistance - Channel (Ohms): 3
ESD Protection: Yes
Part Status: Active
Number of Channels: 2
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BUK7509-55A,127 BUK7509-55A,127 NXP Semiconductors PHGLS22268-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA BUK7509-55A - 75A, 55V,
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 25A, 10V
Power Dissipation (Max): 211W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 0 V
Input Capacitance (Ciss) (Max) @ Vds: 3271 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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74HC4020DB,112 74HC4020DB,112 NXP Semiconductors 74HC_HCT4020.pdf Description: NEXPERIA 74HC4020DB - BINARY COU
Packaging: Bulk
Part Status: Active
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88W9068-A0-BWPC/AK NXP Semiconductors Description: 88W9068 - WiFi Access Point SOC.
Packaging: Bulk
Type: TxRx Only
Protocol: 802.11ax
Data Rate (Max): 4.8Gbps
Modulation: 1024QAM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, I²C, SPI
Part Status: Obsolete
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A3G35H100-04SR3 NXP Semiconductors A3G35H100-04S.pdf Description: RF MOSFET GAN 48V NI780
Packaging: Bulk
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Configuration: 2 N-Channel
Power - Output: 14W
Technology: GaN
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 80 mA
Gain: 14dB @ 3.6GHz
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LS1043ASN7MNLB NXP Semiconductors Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Part Status: Active
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LS1088ASE7MQA NXP Semiconductors LS1088AXE7MQA.pdf?t.download=true&u=ovmfp3 Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1.2V
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, IFC, PCI, SPI, UART
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74LVC1G19GM,115 74LVC1G19GM,115 NXP Semiconductors PHGLS30449-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74LVC1G19GM - DECODER/D
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 1:2
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 32mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
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MIMXRT105SCVL5B MIMXRT105SCVL5B NXP Semiconductors PHGL-S-A0006456212-1.pdf?t.download=true&u=5oefqw Description: MXRT1050 - i.MXRT105A
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
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74HCT3G07GD,125 74HCT3G07GD,125 NXP Semiconductors 74HC_HCT3G07.pdf Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
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74HCT368D,652 74HCT368D,652 NXP Semiconductors PHGL-S-A0002312836-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER INVERT 5.5V 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SO
Part Status: Active
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PZU6.8B2L,315 PHGLS15647-1.pdf?t.download=true&u=5oefqw
PZU6.8B2L,315
Hersteller: NXP Semiconductors
Description: DIODE ZENER 6.8V 250MW DFN1006-2
Tolerance: ±2%
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 500 nA @ 3.5 V
Produkt ist nicht verfügbar
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TIP42CTU-F129
TIP42CTU-F129
Hersteller: NXP Semiconductors
Description: TIP42C - PNP Epitaxial Silicon T
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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74LVT16244BDL,118 PHGLS24271-1.pdf?t.download=true&u=5oefqw
74LVT16244BDL,118
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 48SSOP
Packaging: Bulk
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-SSOP
Part Status: Active
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MPC8349VVAJDB FSCLS06085-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC83XX 533MHZ 672TBGA
Packaging: Bulk
Package / Case: 672-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-TBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, UART
Part Status: Obsolete
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BLS7G2729L-350P,11
Hersteller: NXP Semiconductors
Description: BLS7G2729L-350P - Power LDMOS tr
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74ALVCH162245DGG,112 NEXP-S-A0002908214-1.pdf?t.download=true&u=5oefqw
74ALVCH162245DGG,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74ALVCH162245DGG - BUS
Packaging: Bulk
Part Status: Active
auf Bestellung 711 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
711+0.75 EUR
Mindestbestellmenge: 711
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74AVC16245DGG-Q10J 74AVC16245_Q100.pdf
74AVC16245DGG-Q10J
Hersteller: NXP Semiconductors
Description: IC TXRX NON-INVERT 3.6V 48TSSOP
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
auf Bestellung 2267 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
304+1.67 EUR
Mindestbestellmenge: 304
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74HCT3G14DC,125 PHGLS18906-1.pdf?t.download=true&u=5oefqw
74HCT3G14DC,125
Hersteller: NXP Semiconductors
Description: IC INVERT SCHMITT 3CH 3IN 8VSSOP
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 8-VSSOP
Input Logic Level - High: 1.9V ~ 2.1V
Input Logic Level - Low: 0.5V ~ 0.6V
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 1 µA
auf Bestellung 103202 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2331+0.21 EUR
Mindestbestellmenge: 2331
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PMV20EN215 PMV20EN.pdf
PMV20EN215
Hersteller: NXP Semiconductors
Description: NEXPERIA PMV20EN - SMALL SIGNAL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BUK7Y98-80E,115 BUK7Y98-80E.pdf
BUK7Y98-80E,115
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK7Y98 - N-CHANNEL 80
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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S25FL064P0XMFV003
Hersteller: NXP Semiconductors
Description: S25FL064P - 64-Mbit 3.0 V Flash
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCF54450ACVM180
Hersteller: NXP Semiconductors
Description: MCF5445x - 32-bit MPU, ColdFire
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PZU9.1BL,315 PZUXBL_SER.pdf
PZU9.1BL,315
Hersteller: NXP Semiconductors
Description: NEXPERIA PZU9.1BL - ZENER DIODE,
Packaging: Bulk
Tolerance: ±5%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
auf Bestellung 92499 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12070+0.03 EUR
Mindestbestellmenge: 12070
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PZU3.6B2L,315 PHGLS15647-1.pdf?t.download=true&u=5oefqw
PZU3.6B2L,315
Hersteller: NXP Semiconductors
Description: NEXPERIA PZU3.6B2L - ZENER DIODE
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10764+0.05 EUR
Mindestbestellmenge: 10764
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BZX884-B30,315 PHGLS19465-1.pdf?t.download=true&u=5oefqw
BZX884-B30,315
Hersteller: NXP Semiconductors
Description: NEXPERIA BZX884-B30 - ZENER DIOD
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 30 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 21 V
auf Bestellung 16905 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11727+0.05 EUR
Mindestbestellmenge: 11727
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TDA18219HN/C1518
Hersteller: NXP Semiconductors
Description: TDA18SILICTUN40HVQFN
Packaging: Bulk
Part Status: Obsolete
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Standards: DTMB, DVB-C, DVB-T, ISDB-T
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I²C
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
174+2.78 EUR
Mindestbestellmenge: 174
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NXQ1TXH5/101118
NXQ1TXH5/101118
Hersteller: NXP Semiconductors
Description: NXQ1TXH5 - One-chip 5 V Qi wirel
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCA9663B/S911118
Hersteller: NXP Semiconductors
Description: PCA9663 - Parallel Bus to Three-
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX31LDVMN5DR2 FSCLS05432-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX31 532MHZ 473BGA
Packaging: Bulk
Part Status: Active
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2V, 2.5V, 2.7V, 3V
Supplier Device Package: 473-PBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
auf Bestellung 5250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+49.97 EUR
Mindestbestellmenge: 10
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74HCT27PW,112 74HC_HCT27.pdf
74HCT27PW,112
Hersteller: NXP Semiconductors
Description: IC GATE NOR
Packaging: Bulk
Part Status: Active
auf Bestellung 12686 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2329+0.21 EUR
Mindestbestellmenge: 2329
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MCIMX6Q4AVT10AE
Hersteller: NXP Semiconductors
Description: MCIMX6Q4AVT10AE - i.MX 6 series
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PMEG100T20ELPX
Hersteller: NXP Semiconductors
Description: PMEG100T20ELP - 100 V, 2 A low l
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 12 ns
Technology: Schottky
Capacitance @ Vr, F: 200pF @ 1V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: SOD-128/CFP5
Operating Temperature - Junction: 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 2 A
Current - Reverse Leakage @ Vr: 1.25 µA @ 100 V
auf Bestellung 7781 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+0.18 EUR
Mindestbestellmenge: 3000
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BZX79-C36143 BZX79.pdf
BZX79-C36143
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA BZX79-C36 - ZENER D
Packaging: Bulk
Part Status: Active
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Produkt ist nicht verfügbar
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KC912DG128CCPVE
KC912DG128CCPVE
Hersteller: NXP Semiconductors
Description: MC912DG128CCPVE - Microcontrolle
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NT2H1611G0DA8J NTAG213_215_216.pdf
Hersteller: NXP Semiconductors
Description: NT2H1611G0DA8 - NTAG NFC Forum T
Packaging: Bulk
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: PLLMC
Part Status: Active
auf Bestellung 22551 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
784+0.62 EUR
Mindestbestellmenge: 784
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LX2080XE72232B LX2160XE72232B.pdf?t.download=true&u=axiww2
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ LX 2.2GHZ 1517BGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4 SDRAM
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
auf Bestellung 737 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+970.64 EUR
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LX2120SE72029B
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ LX 2GHZ 1517FCPBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4 SDRAM
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+975.11 EUR
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LX2160SC72232B LX2160XE72232B.pdf?t.download=true&u=axiww2
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4 SDRAM
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Part Status: Active
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1181.10 EUR
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74LVC1GU04GN,132 PHGLS27066-1.pdf?t.download=true&u=5oefqw
74LVC1GU04GN,132
Hersteller: NXP Semiconductors
Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 3750 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3750+0.17 EUR
Mindestbestellmenge: 3750
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LPC4074FBD144,551 PHGLS25790-1.pdf?t.download=true&u=5oefqw
LPC4074FBD144,551
Hersteller: NXP Semiconductors
Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 109
auf Bestellung 623 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
44+11.49 EUR
Mindestbestellmenge: 44
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PN7360AUEV/C300Y
Hersteller: NXP Semiconductors
Description: PN7360AUEV - NFC Cortex®
Packaging: Bulk
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
40+13.32 EUR
Mindestbestellmenge: 40
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PUMH9/ZL165
Hersteller: NXP Semiconductors
Description: Nexperia PUMH9 Small Signal Bipo
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 2 NPN - Pre-Biased
Power - Max: 200mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Frequency - Transition: 230MHz
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 47kOhm
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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LPC2921FBD100,551 PHGLS20650-1.pdf?t.download=true&u=5oefqw
LPC2921FBD100,551
Hersteller: NXP Semiconductors
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 16x8b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 60
auf Bestellung 287 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
38+13.04 EUR
Mindestbestellmenge: 38
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LPC1112FHI33/102,5
LPC1112FHI33/102,5
Hersteller: NXP Semiconductors
Description: LPC1112 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
auf Bestellung 2351 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
158+3.34 EUR
Mindestbestellmenge: 158
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LPC1114LVFHN24/103 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114LVFHN24/103
Hersteller: NXP Semiconductors
Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 4x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 20
Connectivity: I2C, SPI, SSP, UART/USART
auf Bestellung 964 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
166+2.94 EUR
Mindestbestellmenge: 166
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74AUP2G04GM,132 PHGLS24263-1.pdf?t.download=true&u=5oefqw
74AUP2G04GM,132
Hersteller: NXP Semiconductors
Description: IC INVERTER 2CH 2-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (1.45x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
Produkt ist nicht verfügbar
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88W8987-A2-NYEA/AZ
Hersteller: NXP Semiconductors
Description: 88W8987 - RF Transceiver (Board
Packaging: Bulk
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Data Rate (Max): 433Mbps
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Part Status: Active
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
35+13.94 EUR
Mindestbestellmenge: 35
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74AUP2G241DC,125 PHGLS26016-1.pdf?t.download=true&u=5oefqw
74AUP2G241DC,125
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 8VSSOP
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-VSSOP
Part Status: Active
auf Bestellung 35459 Stücke:
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Anzahl Preis
1815+0.30 EUR
Mindestbestellmenge: 1815
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PMEG2015EA115 PMEG2015EA.pdf
PMEG2015EA115
Hersteller: NXP Semiconductors
Description: DIODE SCHOTTKY 20V 1.5A SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Current - Average Rectified (Io): 1.5A
Supplier Device Package: SOD-323
Operating Temperature - Junction: -65°C ~ 125°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 660 mV @ 1.5 A
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Produkt ist nicht verfügbar
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PMDXB600UNEL/S500Z
Hersteller: NXP Semiconductors
Description: PMDXB600UNEL - N Channel MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MRF6VP11KGSR5 FSCLS07342-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230-4S GW
Current Rating (Amps): 100µA
Mounting Type: Surface Mount
Configuration: 2 N-Channel
Power - Output: 1000W
Technology: LDMOS (Dual)
Supplier Device Package: NI-1230-4S GULL
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
Frequency: 1.8MHz ~ 150MHz
Gain: 26dB
auf Bestellung 1750 Stücke:
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Anzahl Preis
2+495.26 EUR
Mindestbestellmenge: 2
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MIMX8QM6CVUFFAB
Hersteller: NXP Semiconductors
Description: IC MPU I.MX8Q 264MHZ 1313FCPBGA
Packaging: Bulk
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: LPDDR4
Graphics Acceleration: Yes
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Part Status: Active
Package / Case: 1313-BBGA, FCBGA
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Supplier Device Package: 1313-FCPBGA (29x29)
Speed: 1.6GHz, 1.2GHz, 264MHz
Ethernet: 1Gbps (2)
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Additional Interfaces: CANbus, I2C, SPI, UART
auf Bestellung 44 Stücke:
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Anzahl Preis
3+231.55 EUR
Mindestbestellmenge: 3
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MC35XS3500HFK MC35XS3500.pdf
Hersteller: NXP Semiconductors
Description: MC35XS3500HFK - 12 V Automotive
Packaging: Bulk
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 5
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 35mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 6V ~ 28V
Voltage - Supply (Vcc/Vdd): 6V ~ 28V
Ratio - Input:Output: 1:5
Supplier Device Package: 24-PQFN (12x12)
Part Status: Obsolete
Current - Output (Max): 65mA
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Battery, UVLO
Produkt ist nicht verfügbar
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74LVC257AD,112 74LVC257A.pdf
74LVC257AD,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC257AD - MULTIPLEXE
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Active
auf Bestellung 8260 Stücke:
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Anzahl Preis
2142+0.25 EUR
Mindestbestellmenge: 2142
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PMN48XPAX PMN48XPA.pdf
PMN48XPAX
Hersteller: NXP Semiconductors
Description: NEXPERIA PMN48XP - 20V, P-CHANNE
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 4.1A (Ta)
Rds On (Max) @ Id, Vgs: 55mOhm @ 2.4A, 4.5V
Power Dissipation (Max): 530mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Supplier Device Package: 6-TSOP
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1000 pF @ 10 V
Produkt ist nicht verfügbar
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NX7002AK215
Hersteller: NXP Semiconductors
Description: Nexperia NX7002AK - Small Signal
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 190mA (Ta), 300mA (Tc)
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 100mA, 10V
Power Dissipation (Max): 265mW (Ta), 1.33W (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 250µA
Supplier Device Package: SOT-23-3 (TO-236)
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 0.43 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 20 pF @ 10 V
Produkt ist nicht verfügbar
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MPC8358CVRADDDA557
Hersteller: NXP Semiconductors
Description: IC MPU MPC83XX 266MHZ 668TEPBGA
Packaging: Bulk
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-TEPBGA (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
auf Bestellung 36 Stücke:
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Anzahl Preis
4+143.88 EUR
Mindestbestellmenge: 4
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BUK763R1-40B,118 PHGLS22330-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK763R1-40B - 75A, 40V
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 94 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6808 pF @ 25 V
auf Bestellung 12400 Stücke:
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Anzahl Preis
233+2.27 EUR
Mindestbestellmenge: 233
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MC9328MX1DVM15 FSCLS05269-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX1 150MHZ 225MAPBGA
Packaging: Bulk
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Part Status: Active
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
auf Bestellung 207 Stücke:
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Anzahl Preis
13+39.86 EUR
Mindestbestellmenge: 13
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PCMF2HDMI14SZ PCMFXHDMI14S_SER.pdf
PCMF2HDMI14SZ
Hersteller: NXP Semiconductors
Description: CMC
Packaging: Bulk
Package / Case: 10-UFBGA, WLCSP
Size / Dimension: 0.062" L x 0.046" W (1.57mm x 1.17mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Height: 0.024" (0.60mm)
Filter Order: 3rd
Applications: General Purpose
Technology: LC
Resistance - Channel (Ohms): 3
ESD Protection: Yes
Part Status: Active
Number of Channels: 2
auf Bestellung 4480 Stücke:
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Anzahl Preis
1332+0.37 EUR
Mindestbestellmenge: 1332
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BUK7509-55A,127 PHGLS22268-1.pdf?t.download=true&u=5oefqw
BUK7509-55A,127
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK7509-55A - 75A, 55V,
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 25A, 10V
Power Dissipation (Max): 211W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 0 V
Input Capacitance (Ciss) (Max) @ Vds: 3271 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 3370 Stücke:
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Anzahl Preis
533+0.94 EUR
Mindestbestellmenge: 533
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74HC4020DB,112 74HC_HCT4020.pdf
74HC4020DB,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HC4020DB - BINARY COU
Packaging: Bulk
Part Status: Active
auf Bestellung 3276 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
710+0.71 EUR
Mindestbestellmenge: 710
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88W9068-A0-BWPC/AK
Hersteller: NXP Semiconductors
Description: 88W9068 - WiFi Access Point SOC.
Packaging: Bulk
Type: TxRx Only
Protocol: 802.11ax
Data Rate (Max): 4.8Gbps
Modulation: 1024QAM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, I²C, SPI
Part Status: Obsolete
auf Bestellung 4760 Stücke:
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Anzahl Preis
10+55.25 EUR
Mindestbestellmenge: 10
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A3G35H100-04SR3 A3G35H100-04S.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET GAN 48V NI780
Packaging: Bulk
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Configuration: 2 N-Channel
Power - Output: 14W
Technology: GaN
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 80 mA
Gain: 14dB @ 3.6GHz
auf Bestellung 137 Stücke:
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Anzahl Preis
3+166.65 EUR
Mindestbestellmenge: 3
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LS1043ASN7MNLB
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Part Status: Active
auf Bestellung 25 Stücke:
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Anzahl Preis
5+123.73 EUR
Mindestbestellmenge: 5
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LS1088ASE7MQA LS1088AXE7MQA.pdf?t.download=true&u=ovmfp3
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1.2V
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, IFC, PCI, SPI, UART
auf Bestellung 40 Stücke:
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Anzahl Preis
2+254.72 EUR
Mindestbestellmenge: 2
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74LVC1G19GM,115 PHGLS30449-1.pdf?t.download=true&u=5oefqw
74LVC1G19GM,115
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC1G19GM - DECODER/D
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 1:2
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 32mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
auf Bestellung 142500 Stücke:
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Anzahl Preis
4661+0.10 EUR
Mindestbestellmenge: 4661
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MIMXRT105SCVL5B PHGL-S-A0006456212-1.pdf?t.download=true&u=5oefqw
MIMXRT105SCVL5B
Hersteller: NXP Semiconductors
Description: MXRT1050 - i.MXRT105A
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
auf Bestellung 720 Stücke:
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Anzahl Preis
37+12.87 EUR
Mindestbestellmenge: 37
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74HCT3G07GD,125 74HC_HCT3G07.pdf
74HCT3G07GD,125
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
auf Bestellung 104522 Stücke:
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Anzahl Preis
1519+0.35 EUR
Mindestbestellmenge: 1519
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74HCT368D,652 PHGL-S-A0002312836-1.pdf?t.download=true&u=5oefqw
74HCT368D,652
Hersteller: NXP Semiconductors
Description: IC BUFFER INVERT 5.5V 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SO
Part Status: Active
auf Bestellung 10682 Stücke:
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