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PCA9554AD,112 PCA9554AD,112 NXP Semiconductors PCA9554%28A%29.pdf Description: IC XPNDR 400KHZ I2C SMBUS 16SO
Features: POR
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SO
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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LS1023AXN8QQB NXP Semiconductors Description: IC MPU QORLQ LS1 1.6GHZ 780BGA
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
SATA: SATA 6Gbps (1)
Security Features: ARM TZ, Boot Security
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 3.0 + PHY (3)
Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Bulk
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LS1028ACE7NQA NXP Semiconductors Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Bulk
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
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MC9S08QE32CFM MC9S08QE32CFM NXP Semiconductors MC9S08QE32.pdf Description: S08QE 8-BIT MCU, S08 CORE, 32KB
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 50.33MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 10x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
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KC9S08GT60ACFDE KC9S08GT60ACFDE NXP Semiconductors FSCL-S-A0001054932-1.pdf?t.download=true&u=5oefqw Description: MC9S08GT60ACFDE - Microcontrolle
Packaging: Bulk
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K9S08SG16E1MTG K9S08SG16E1MTG NXP Semiconductors Description: SAMPLE PACK DEVICE
Packaging: Bulk
DigiKey Programmable: Not Verified
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UBA2071AT/N1,118 UBA2071AT/N1,118 NXP Semiconductors UBA2071_A.pdf Description: IC DVR HALF BRIDGE 24-SOIC
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 38kHz ~ 42kHz
Type: CCFL/EEFL Controller
Operating Temperature: -25°C ~ 100°C
Voltage - Supply: 14V
Supplier Device Package: 24-SO
Dimming: Yes
Current - Supply: 1.5 mA
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PMK50XP,518 PMK50XP,518 NXP Semiconductors PMK50XP.pdf Description: NEXPERIA PMK50XP - 7.9A, 20V, 0.
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 7.9A (Tc)
Rds On (Max) @ Id, Vgs: 50mOhm @ 2.8A, 4.5V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: 8-SO
Drive Voltage (Max Rds On, Min Rds On): 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1020 pF @ 20 V
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NXH2280UK/C1Z NXP Semiconductors Description: NXH2280 - NFMI RADIO FOR WIRELES
Packaging: Bulk
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PDTA114TMB,315 PDTA114TMB,315 NXP Semiconductors PHGLS24956-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS
Packaging: Bulk
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TDA18219HN/C1,557 TDA18219HN/C1,557 NXP Semiconductors TDA18219HN.pdf Description: IC TV SILICON TUNER 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Standards: ATSC, DTMB, DVB-C, DVB-T/T2, ISDB-T
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I2C
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MPC8544CVJALFA NXP Semiconductors FSCLS11192-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
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BF904AWR,115 BF904AWR,115 NXP Semiconductors BF904A%2CAR%2CAWR.pdf Description: RF MOSFET 5V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 200MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 7 V
Voltage - Test: 5 V
Current - Test: 10 mA
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SC16IS850LIBS,157 SC16IS850LIBS,157 NXP Semiconductors SC16IS850L.pdf Description: IC CONTROLLER 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 24-HVQFN (4x4)
DigiKey Programmable: Not Verified
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SC16C750BIBS,151 SC16C750BIBS,151 NXP Semiconductors SC16C750B.pdf Description: IC UART SINGLE W/FIFO 32-HVQFN
With Auto Flow Control: Yes
Supplier Device Package: 32-HVQFN (5x5)
Data Rate (Max): 3Mbps
FIFO's: 64 Byte
Voltage - Supply: 2.5V, 3.3V, 5V
Mounting Type: Surface Mount
With Modem Control: Yes
With False Start Bit Detection: Yes
Number of Channels: 1, UART
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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74LVC1G332GXZ 74LVC1G332GXZ NXP Semiconductors 74LVC1G332.pdf Description: IC SNGL
Packaging: Bulk
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74HC377PW,112 74HC377PW,112 NXP Semiconductors PHGL-S-A0001541547-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE 1-ELE 8-BIT
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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PCA9534PW,112 PCA9534PW,112 NXP Semiconductors PCA9534.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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RP115L271D-E2 RP115L271D-E2 NXP Semiconductors ?product=rp115 Description: RP115L - Low Voltage 500mA/1A LD
Packaging: Bulk
Package / Case: 8-XFDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Current - Quiescent (Iq): 160 µA
Voltage - Input (Max): 5.25V
Number of Regulators: 1
Supplier Device Package: DFN1216-8
Voltage - Output (Min/Fixed): 2.7V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.09V @ 500mA
Protection Features: Over Current, Over Temperature, Reverse Current
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BUK7225-55A,118 NXP Semiconductors BUK7225-55A.pdf Description: N-CHANNEL TRENCHMOS STANDARD LEV
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Ta)
Rds On (Max) @ Id, Vgs: 25mOhm @ 25A, 10V
Power Dissipation (Max): 94W (Ta)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: DPAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1310 pF @ 25 V
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TDA8579T/N1,118 TDA8579T/N1,118 NXP Semiconductors TDA8579T.pdf Description: IC TRANSCEIVER 0/2 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Receiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 0/2
Supplier Device Package: 8-SO
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TJA1054T/N1,518 TJA1054T/N1,518 NXP Semiconductors TJA1054.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
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LPC2214FBD144/01,5 LPC2214FBD144/01,5 NXP Semiconductors LPC2212_2214.pdf Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 112
DigiKey Programmable: Not Verified
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TDA19997HL/C1,551 NXP Semiconductors Description: IC DVI/HDMI SWITCH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Function: Switch
Voltage - Supply: 1.65V ~ 1.95V, 3.0V ~ 3.6V
Applications: Video Display
Standards: CEA-861D, DVI 1.0, HDCP 1.3, HDMI 1.4, IEC 61000-4-2
Supplier Device Package: 100-LQFP (14x14)
Control Interface: I2C
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PCA8543AHL/AY NXP Semiconductors PCA8543.pdf Description: PCA8543AHL - 4 x 60 automotive L
Packaging: Bulk
Package / Case: 80-LQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.5V ~ 5.5V
Digits or Characters: 15 Characters, 30 Characters, 240 Elements
Supplier Device Package: 80-LQFP (12x12)
Current - Supply: 250 µA
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74HC112PW,112 74HC112PW,112 NXP Semiconductors PHGL-S-A0002312769-1.pdf?t.download=true&u=5oefqw Description: IC FF JK-TYPE DUAL 1BIT 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-TSSOP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
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SC16C754BIA68,529 SC16C754BIA68,529 NXP Semiconductors PHGLS15907-1.pdf?t.download=true&u=5oefqw Description: IC UART QUAD 64BYTE 68PLCC
With Modem Control: Yes
With False Start Bit Detection: Yes
With IrDA Encoder/Decoder: No
With Auto Flow Control: Yes
Supplier Device Package: 68-PLCC (24.23x24.23)
Data Rate (Max): 5Mbps
FIFO's: 64 Byte
Voltage - Supply: 2.25V ~ 2.75V, 2.97V ~ 3.63V, 4.5V ~ 5.5V
Mounting Type: Surface Mount
Number of Channels: 4, QUART
Package / Case: 68-LCC (J-Lead)
Packaging: Bulk
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PCA9550D,118 PCA9550D,118 NXP Semiconductors PCA9550.pdf Description: IC LED DRVR LINEAR I2C 25MA 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 400kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 8-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
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TDA8766G/C1,118 TDA8766G/C1,118 NXP Semiconductors TDA8766.pdf Description: IC ADC 10BIT SIGMA-DELTA 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: 20°C ~ 75°C
Voltage - Supply, Analog: 3V ~ 5.25V
Voltage - Supply, Digital: 3V ~ 5.25V
Sampling Rate (Per Second): 20M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 32-LQFP (5x5)
Architecture: Sigma-Delta
Number of A/D Converters: 1
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MAX9286S32V234 NXP Semiconductors Description: MAX9286 - S32V MIPI CAMERAS AND
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
Utilized IC / Part: S32V234
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MC08XS6421CEKR2 NXP Semiconductors PHGL-S-A0002207203-1.pdf?t.download=true&u=5oefqw Description: MC08XS6421CEK - External Automot
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Input Type: CMOS
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
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PMV100XPEA215 PMV100XPEA215 NXP Semiconductors PMV100XPEA.pdf Description: NEXPERIA PMV100 - P-CHANNEL MOSF
Input Capacitance (Ciss) (Max) @ Vds: 386 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 6 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±12V
Supplier Device Package: SOT-23
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Power Dissipation (Max): 463mW (Ta), 4.45W (Tc)
Rds On (Max) @ Id, Vgs: 128mOhm @ 2.4A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 2.4A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
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LPC3230FET296/01,5 LPC3230FET296/01,5 NXP Semiconductors PHGLS30266-1.pdf?t.download=true&u=5oefqw Description: LPC3230 - Arm9, 32-Bit Microcont
Packaging: Bulk
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
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PIMXRT595SFFOA NXP Semiconductors IMXRT500EC.pdf Description: IMXRT595 - I.MX RT500 CROSSOVER
Packaging: Bulk
DigiKey Programmable: Not Verified
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BGY66B,112 BGY66B,112 NXP Semiconductors BGY66B.pdf Description: IC AMPLIFIER REVERSE SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 135 mA
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74LVC2G07GXZ 74LVC2G07GXZ NXP Semiconductors 74LVC2G07.pdf Description: IC BUFF 1.65V 6-X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-X2SON (1.0x0.8)
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74LVT573PW,112 74LVT573PW,112 NXP Semiconductors PHGLS23935-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74LVT573PW - BUS DRIVER
Packaging: Bulk
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TEF7006HN/V1,518 TEF7006HN/V1,518 NXP Semiconductors PHGL-S-A0003531970-1.pdf?t.download=true&u=5oefqw Description: IC CONSUMER CIRC PQCC32
Packaging: Bulk
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MC8641DHX1500KE NXP Semiconductors _MPC8641DEC.pdf?t.download=true&u=ovmfp3 Description: IC MPU MPC86XX 1.5GHZ 1023FCCBGA
Packaging: Bulk
Package / Case: 1023-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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BGU8L1UKAZ BGU8L1UKAZ NXP Semiconductors BGU8L1.pdf Description: IC AMP CELL 728-960MHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 15.5dB
Current - Supply: 4.7mA
Noise Figure: 0.8dB
P1dB: -5dBm
Test Frequency: 943MHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
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BGU8L1UK/SZ BGU8L1UK/SZ NXP Semiconductors BGU8L1.pdf Description: IC AMP CELL 728-960MHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 15.5dB
Current - Supply: 4.7mA
Noise Figure: 0.8dB
P1dB: -5dBm
Test Frequency: 943MHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
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TDA18260HN/C1,551 TDA18260HN/C1,551 NXP Semiconductors TDA18260HN_SDS.pdf Description: TDA18260HN - DUAL CABLE SILICON
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
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74AUP1G332GN,132 74AUP1G332GN,132 NXP Semiconductors 74AUP1G332.pdf Description: NEXPERIA 74AUP1G332 - LOW-POWER
Packaging: Bulk
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FXTH87EH116T1 FXTH87EH116T1 NXP Semiconductors FXTH87EH116?lang_cd=en Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
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PHP225,118 PHP225,118 NXP Semiconductors PHGLS22918-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PHP225 - SMALL SIGNAL F
Packaging: Bulk
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JN5179/001K JN5179/001K NXP Semiconductors PHGL-S-A0003845997-1.pdf?t.download=true&u=5oefqw Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 3.6V
Power - Output: 10dBm
Protocol: Zigbee®
Current - Receiving: 12.7mA ~ 14.8mA
Data Rate (Max): 16Mbps
Current - Transmitting: 14mA ~ 22.5mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
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LPC2102FBD48,151 LPC2102FBD48,151 NXP Semiconductors LPC2101_02_03.pdf Description: IC MCU 16/32BIT 16KB FLSH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 70MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
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LPC802UKZ NXP Semiconductors PHGL-S-A0001056910-1.pdf?t.download=true&u=5oefqw Description: LPC802UKZ - Low-Cost Microcontro
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-WLCSP (1.84x1.84)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 15MHz
Mounting Type: Surface Mount
Package / Case: 16-UFBGA, WLCSP
Packaging: Bulk
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PDTC144TM,315 PDTC144TM,315 NXP Semiconductors PDTC144T_SERIES.pdf Description: TRANS PREBIAS
Packaging: Bulk
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LPC2925FBD100,551 LPC2925FBD100,551 NXP Semiconductors PHGLS20650-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 16x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 1.89V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
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LPC43S20FBD144E NXP Semiconductors LPC43S50_30_20.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M0, ARM® Cortex®-M4
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
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P89LPC917FDH,129 P89LPC917FDH,129 NXP Semiconductors P89LPC915_916_917.pdf Description: IC MCU 8BIT 2KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Verified
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LPC3131FET180,551 NXP Semiconductors PHGLS25043-1.pdf?t.download=true&u=5oefqw Description: LPC3131 - Low-cost, low-power AR
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 4x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.2V ~ 3.6V
Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
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88MW302-B0-NXUE/AK NXP Semiconductors User-manual-2777835.pdf Description: IC RF TXRX+MCU BLE 88HVQFN
Packaging: Bulk
Package / Case: 88-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 512kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V
Protocol: 802.11n/g/b, Bluetooth, Zigbee®, Z-Wave®
Data Rate (Max): 72.2Mbps
Supplier Device Package: 88-HVQFN (10x10)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, PWM, SPI, UART
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PZU22B2,115 PZU22B2,115 NXP Semiconductors PHGLS19743-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PZU22B2 - ZENER DIODE,
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOD-323F
Power - Max: 310 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 17 V
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MM908E622ACPEK MM908E622ACPEK NXP Semiconductors MM908E622.pdf Description: MM908E622 - Integrated motor dri
Packaging: Bulk
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 16V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
Number of I/O: 12
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PHN203,518 PHN203,518 NXP Semiconductors PHGLS20699-1.pdf?t.download=true&u=5oefqw Description: MOSFET 2N-CH 30V 6.3A 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Configuration: 2 N-Channel
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 2W (Ta)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 6.3A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 560pF @ 20V
Rds On (Max) @ Id, Vgs: 30mOhm @ 7A, 10V
Gate Charge (Qg) (Max) @ Vgs: 14.6nC @ 10V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: 8-SO
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74LV74PW,118 74LV74PW,118 NXP Semiconductors 74LV74.pdf Description: IC FF D-TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 80 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 110 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Number of Bits per Element: 1
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74LV74D,112 74LV74D,112 NXP Semiconductors 74LV74.pdf Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 110 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Number of Bits per Element: 1
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BC846BW/ZLF BC846BW/ZLF NXP Semiconductors BC846XW_SER.pdf Description: NEXPERIA BC846 - 65V, 100MA NPN
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Supplier Device Package: SOT-323
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PCA9554AD,112 PCA9554%28A%29.pdf
PCA9554AD,112
Hersteller: NXP Semiconductors
Description: IC XPNDR 400KHZ I2C SMBUS 16SO
Features: POR
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SO
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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LS1023AXN8QQB
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ LS1 1.6GHZ 780BGA
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
SATA: SATA 6Gbps (1)
Security Features: ARM TZ, Boot Security
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 3.0 + PHY (3)
Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Bulk
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4+170.5 EUR
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LS1028ACE7NQA
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Bulk
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
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MC9S08QE32CFM MC9S08QE32.pdf
MC9S08QE32CFM
Hersteller: NXP Semiconductors
Description: S08QE 8-BIT MCU, S08 CORE, 32KB
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 50.33MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 10x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
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KC9S08GT60ACFDE FSCL-S-A0001054932-1.pdf?t.download=true&u=5oefqw
KC9S08GT60ACFDE
Hersteller: NXP Semiconductors
Description: MC9S08GT60ACFDE - Microcontrolle
Packaging: Bulk
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K9S08SG16E1MTG
K9S08SG16E1MTG
Hersteller: NXP Semiconductors
Description: SAMPLE PACK DEVICE
Packaging: Bulk
DigiKey Programmable: Not Verified
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UBA2071AT/N1,118 UBA2071_A.pdf
UBA2071AT/N1,118
Hersteller: NXP Semiconductors
Description: IC DVR HALF BRIDGE 24-SOIC
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 38kHz ~ 42kHz
Type: CCFL/EEFL Controller
Operating Temperature: -25°C ~ 100°C
Voltage - Supply: 14V
Supplier Device Package: 24-SO
Dimming: Yes
Current - Supply: 1.5 mA
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PMK50XP,518 PMK50XP.pdf
PMK50XP,518
Hersteller: NXP Semiconductors
Description: NEXPERIA PMK50XP - 7.9A, 20V, 0.
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 7.9A (Tc)
Rds On (Max) @ Id, Vgs: 50mOhm @ 2.8A, 4.5V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: 8-SO
Drive Voltage (Max Rds On, Min Rds On): 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1020 pF @ 20 V
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NXH2280UK/C1Z
Hersteller: NXP Semiconductors
Description: NXH2280 - NFMI RADIO FOR WIRELES
Packaging: Bulk
auf Bestellung 78000 Stücke:
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PDTA114TMB,315 PHGLS24956-1.pdf?t.download=true&u=5oefqw
PDTA114TMB,315
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS
Packaging: Bulk
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TDA18219HN/C1,557 TDA18219HN.pdf
TDA18219HN/C1,557
Hersteller: NXP Semiconductors
Description: IC TV SILICON TUNER 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Standards: ATSC, DTMB, DVB-C, DVB-T/T2, ISDB-T
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I2C
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MPC8544CVJALFA FSCLS11192-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
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BF904AWR,115 BF904A%2CAR%2CAWR.pdf
BF904AWR,115
Hersteller: NXP Semiconductors
Description: RF MOSFET 5V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 200MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 7 V
Voltage - Test: 5 V
Current - Test: 10 mA
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SC16IS850LIBS,157 SC16IS850L.pdf
SC16IS850LIBS,157
Hersteller: NXP Semiconductors
Description: IC CONTROLLER 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 24-HVQFN (4x4)
DigiKey Programmable: Not Verified
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131+4.19 EUR
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SC16C750BIBS,151 SC16C750B.pdf
SC16C750BIBS,151
Hersteller: NXP Semiconductors
Description: IC UART SINGLE W/FIFO 32-HVQFN
With Auto Flow Control: Yes
Supplier Device Package: 32-HVQFN (5x5)
Data Rate (Max): 3Mbps
FIFO's: 64 Byte
Voltage - Supply: 2.5V, 3.3V, 5V
Mounting Type: Surface Mount
With Modem Control: Yes
With False Start Bit Detection: Yes
Number of Channels: 1, UART
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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74LVC1G332GXZ 74LVC1G332.pdf
74LVC1G332GXZ
Hersteller: NXP Semiconductors
Description: IC SNGL
Packaging: Bulk
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74HC377PW,112 PHGL-S-A0001541547-1.pdf?t.download=true&u=5oefqw
74HC377PW,112
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE 1-ELE 8-BIT
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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PCA9534PW,112 PCA9534.pdf
PCA9534PW,112
Hersteller: NXP Semiconductors
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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RP115L271D-E2 ?product=rp115
RP115L271D-E2
Hersteller: NXP Semiconductors
Description: RP115L - Low Voltage 500mA/1A LD
Packaging: Bulk
Package / Case: 8-XFDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Current - Quiescent (Iq): 160 µA
Voltage - Input (Max): 5.25V
Number of Regulators: 1
Supplier Device Package: DFN1216-8
Voltage - Output (Min/Fixed): 2.7V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.09V @ 500mA
Protection Features: Over Current, Over Temperature, Reverse Current
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BUK7225-55A,118 BUK7225-55A.pdf
Hersteller: NXP Semiconductors
Description: N-CHANNEL TRENCHMOS STANDARD LEV
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Ta)
Rds On (Max) @ Id, Vgs: 25mOhm @ 25A, 10V
Power Dissipation (Max): 94W (Ta)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: DPAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1310 pF @ 25 V
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TDA8579T/N1,118 TDA8579T.pdf
TDA8579T/N1,118
Hersteller: NXP Semiconductors
Description: IC TRANSCEIVER 0/2 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Receiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 0/2
Supplier Device Package: 8-SO
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TJA1054T/N1,518 TJA1054.pdf
TJA1054T/N1,518
Hersteller: NXP Semiconductors
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
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LPC2214FBD144/01,5 LPC2212_2214.pdf
LPC2214FBD144/01,5
Hersteller: NXP Semiconductors
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 112
DigiKey Programmable: Not Verified
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TDA19997HL/C1,551
Hersteller: NXP Semiconductors
Description: IC DVI/HDMI SWITCH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Function: Switch
Voltage - Supply: 1.65V ~ 1.95V, 3.0V ~ 3.6V
Applications: Video Display
Standards: CEA-861D, DVI 1.0, HDCP 1.3, HDMI 1.4, IEC 61000-4-2
Supplier Device Package: 100-LQFP (14x14)
Control Interface: I2C
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PCA8543AHL/AY PCA8543.pdf
Hersteller: NXP Semiconductors
Description: PCA8543AHL - 4 x 60 automotive L
Packaging: Bulk
Package / Case: 80-LQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.5V ~ 5.5V
Digits or Characters: 15 Characters, 30 Characters, 240 Elements
Supplier Device Package: 80-LQFP (12x12)
Current - Supply: 250 µA
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74HC112PW,112 PHGL-S-A0002312769-1.pdf?t.download=true&u=5oefqw
74HC112PW,112
Hersteller: NXP Semiconductors
Description: IC FF JK-TYPE DUAL 1BIT 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-TSSOP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
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SC16C754BIA68,529 PHGLS15907-1.pdf?t.download=true&u=5oefqw
SC16C754BIA68,529
Hersteller: NXP Semiconductors
Description: IC UART QUAD 64BYTE 68PLCC
With Modem Control: Yes
With False Start Bit Detection: Yes
With IrDA Encoder/Decoder: No
With Auto Flow Control: Yes
Supplier Device Package: 68-PLCC (24.23x24.23)
Data Rate (Max): 5Mbps
FIFO's: 64 Byte
Voltage - Supply: 2.25V ~ 2.75V, 2.97V ~ 3.63V, 4.5V ~ 5.5V
Mounting Type: Surface Mount
Number of Channels: 4, QUART
Package / Case: 68-LCC (J-Lead)
Packaging: Bulk
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PCA9550D,118 PCA9550.pdf
PCA9550D,118
Hersteller: NXP Semiconductors
Description: IC LED DRVR LINEAR I2C 25MA 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 400kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 8-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
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TDA8766G/C1,118 TDA8766.pdf
TDA8766G/C1,118
Hersteller: NXP Semiconductors
Description: IC ADC 10BIT SIGMA-DELTA 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: 20°C ~ 75°C
Voltage - Supply, Analog: 3V ~ 5.25V
Voltage - Supply, Digital: 3V ~ 5.25V
Sampling Rate (Per Second): 20M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 32-LQFP (5x5)
Architecture: Sigma-Delta
Number of A/D Converters: 1
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MAX9286S32V234
Hersteller: NXP Semiconductors
Description: MAX9286 - S32V MIPI CAMERAS AND
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
Utilized IC / Part: S32V234
auf Bestellung 135 Stücke:
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1+1302.19 EUR
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MC08XS6421CEKR2 PHGL-S-A0002207203-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: MC08XS6421CEK - External Automot
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Input Type: CMOS
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
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64+9.4 EUR
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PMV100XPEA215 PMV100XPEA.pdf
PMV100XPEA215
Hersteller: NXP Semiconductors
Description: NEXPERIA PMV100 - P-CHANNEL MOSF
Input Capacitance (Ciss) (Max) @ Vds: 386 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 6 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±12V
Supplier Device Package: SOT-23
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Power Dissipation (Max): 463mW (Ta), 4.45W (Tc)
Rds On (Max) @ Id, Vgs: 128mOhm @ 2.4A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 2.4A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
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6693+0.075 EUR
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LPC3230FET296/01,5 PHGLS30266-1.pdf?t.download=true&u=5oefqw
LPC3230FET296/01,5
Hersteller: NXP Semiconductors
Description: LPC3230 - Arm9, 32-Bit Microcont
Packaging: Bulk
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
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PIMXRT595SFFOA IMXRT500EC.pdf
Hersteller: NXP Semiconductors
Description: IMXRT595 - I.MX RT500 CROSSOVER
Packaging: Bulk
DigiKey Programmable: Not Verified
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BGY66B,112 BGY66B.pdf
BGY66B,112
Hersteller: NXP Semiconductors
Description: IC AMPLIFIER REVERSE SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 135 mA
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74LVC2G07GXZ 74LVC2G07.pdf
74LVC2G07GXZ
Hersteller: NXP Semiconductors
Description: IC BUFF 1.65V 6-X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-X2SON (1.0x0.8)
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74LVT573PW,112 PHGLS23935-1.pdf?t.download=true&u=5oefqw
74LVT573PW,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVT573PW - BUS DRIVER
Packaging: Bulk
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TEF7006HN/V1,518 PHGL-S-A0003531970-1.pdf?t.download=true&u=5oefqw
TEF7006HN/V1,518
Hersteller: NXP Semiconductors
Description: IC CONSUMER CIRC PQCC32
Packaging: Bulk
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MC8641DHX1500KE _MPC8641DEC.pdf?t.download=true&u=ovmfp3
Hersteller: NXP Semiconductors
Description: IC MPU MPC86XX 1.5GHZ 1023FCCBGA
Packaging: Bulk
Package / Case: 1023-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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BGU8L1UKAZ BGU8L1.pdf
BGU8L1UKAZ
Hersteller: NXP Semiconductors
Description: IC AMP CELL 728-960MHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 15.5dB
Current - Supply: 4.7mA
Noise Figure: 0.8dB
P1dB: -5dBm
Test Frequency: 943MHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
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BGU8L1UK/SZ BGU8L1.pdf
BGU8L1UK/SZ
Hersteller: NXP Semiconductors
Description: IC AMP CELL 728-960MHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 15.5dB
Current - Supply: 4.7mA
Noise Figure: 0.8dB
P1dB: -5dBm
Test Frequency: 943MHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
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TDA18260HN/C1,551 TDA18260HN_SDS.pdf
TDA18260HN/C1,551
Hersteller: NXP Semiconductors
Description: TDA18260HN - DUAL CABLE SILICON
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
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84+6.34 EUR
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74AUP1G332GN,132 74AUP1G332.pdf
74AUP1G332GN,132
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP1G332 - LOW-POWER
Packaging: Bulk
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FXTH87EH116T1 FXTH87EH116?lang_cd=en
FXTH87EH116T1
Hersteller: NXP Semiconductors
Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
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64+9.03 EUR
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PHP225,118 PHGLS22918-1.pdf?t.download=true&u=5oefqw
PHP225,118
Hersteller: NXP Semiconductors
Description: NEXPERIA PHP225 - SMALL SIGNAL F
Packaging: Bulk
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JN5179/001K PHGL-S-A0003845997-1.pdf?t.download=true&u=5oefqw
JN5179/001K
Hersteller: NXP Semiconductors
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 3.6V
Power - Output: 10dBm
Protocol: Zigbee®
Current - Receiving: 12.7mA ~ 14.8mA
Data Rate (Max): 16Mbps
Current - Transmitting: 14mA ~ 22.5mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
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LPC2102FBD48,151 LPC2101_02_03.pdf
LPC2102FBD48,151
Hersteller: NXP Semiconductors
Description: IC MCU 16/32BIT 16KB FLSH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 70MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
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53+10.46 EUR
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LPC802UKZ PHGL-S-A0001056910-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC802UKZ - Low-Cost Microcontro
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-WLCSP (1.84x1.84)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 15MHz
Mounting Type: Surface Mount
Package / Case: 16-UFBGA, WLCSP
Packaging: Bulk
auf Bestellung 106692 Stücke:
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377+1.59 EUR
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PDTC144TM,315 PDTC144T_SERIES.pdf
PDTC144TM,315
Hersteller: NXP Semiconductors
Description: TRANS PREBIAS
Packaging: Bulk
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LPC2925FBD100,551 PHGLS20650-1.pdf?t.download=true&u=5oefqw
LPC2925FBD100,551
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 16x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 1.89V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
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LPC43S20FBD144E LPC43S50_30_20.pdf
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M0, ARM® Cortex®-M4
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
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P89LPC917FDH,129 P89LPC915_916_917.pdf
P89LPC917FDH,129
Hersteller: NXP Semiconductors
Description: IC MCU 8BIT 2KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Verified
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150+3.58 EUR
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LPC3131FET180,551 PHGLS25043-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: LPC3131 - Low-cost, low-power AR
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 4x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.2V ~ 3.6V
Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
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88MW302-B0-NXUE/AK User-manual-2777835.pdf
Hersteller: NXP Semiconductors
Description: IC RF TXRX+MCU BLE 88HVQFN
Packaging: Bulk
Package / Case: 88-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 512kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V
Protocol: 802.11n/g/b, Bluetooth, Zigbee®, Z-Wave®
Data Rate (Max): 72.2Mbps
Supplier Device Package: 88-HVQFN (10x10)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, PWM, SPI, UART
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PZU22B2,115 PHGLS19743-1.pdf?t.download=true&u=5oefqw
PZU22B2,115
Hersteller: NXP Semiconductors
Description: NEXPERIA PZU22B2 - ZENER DIODE,
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOD-323F
Power - Max: 310 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 17 V
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MM908E622ACPEK MM908E622.pdf
MM908E622ACPEK
Hersteller: NXP Semiconductors
Description: MM908E622 - Integrated motor dri
Packaging: Bulk
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 16V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
Number of I/O: 12
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PHN203,518 PHGLS20699-1.pdf?t.download=true&u=5oefqw
PHN203,518
Hersteller: NXP Semiconductors
Description: MOSFET 2N-CH 30V 6.3A 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Configuration: 2 N-Channel
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 2W (Ta)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 6.3A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 560pF @ 20V
Rds On (Max) @ Id, Vgs: 30mOhm @ 7A, 10V
Gate Charge (Qg) (Max) @ Vgs: 14.6nC @ 10V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: 8-SO
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74LV74PW,118 74LV74.pdf
74LV74PW,118
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 80 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 110 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Number of Bits per Element: 1
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74LV74D,112 74LV74.pdf
74LV74D,112
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 110 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Number of Bits per Element: 1
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BC846BW/ZLF BC846XW_SER.pdf
BC846BW/ZLF
Hersteller: NXP Semiconductors
Description: NEXPERIA BC846 - 65V, 100MA NPN
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Supplier Device Package: SOT-323
auf Bestellung 180000 Stücke:
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6557+0.092 EUR
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