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74AUP1G17GF132 74AUP1G17GF132 NXP Semiconductors 74AUP1G17.pdf Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (1x1)
Part Status: Active
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MPC8536BVJAKGA557 NXP Semiconductors PHGL-S-A0002263525-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC RISC MICROPROCESSOR
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TJ)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Part Status: Active
Packaging: Bulk
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74HCT6323AD,112 74HCT6323AD,112 NXP Semiconductors 74HC_HCT6323A.pdf Description: 74HCT6323 - NOW NEXPERIA 74HCT63
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Divide-by-N
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 8-SO
Count Rate: 85 MHz
Number of Bits per Element: 3
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HVP-MC3PH598 NXP Semiconductors Description: HIGH VOLTAGE MOTOR CONTROL PLATF
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NX5P1100UK,012 NX5P1100UK,012 NXP Semiconductors NX5P1100.pdf Description: LOGIC CONTROLLED HIGH-SIDE POWER
Part Status: Active
Packaging: Bulk
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BUK9880-55/CU135 BUK9880-55/CU135 NXP Semiconductors BUK9880-55.pdf Description: NEXPERIA BUK9880-55 3.5A, 55V, 0
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MKW31Z256VHT4557 NXP Semiconductors PHGL-S-A0005068082-1.pdf?t.download=true&u=5oefqw Description: KINETIS KW31Z - BLE 4.2 WIRELES
Part Status: Active
Serial Interfaces: ADC, GPIO, I²C, SPI, UART
RF Family/Standard: Bluetooth
Modulation: FSK, GFSK, MSK, O-QPSK
Supplier Device Package: 64-VFLGA (7x7)
Current - Transmitting: 6mA
Current - Receiving: 6.2mA
Protocol: Bluetooth v4.2
Power - Output: 4dBm
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 256kB Flash, 64kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Package / Case: 64-VFLGA
Packaging: Bulk
DigiKey Programmable: Not Verified
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74AVCH2T45GD,125 74AVCH2T45GD,125 NXP Semiconductors 74AVCH2T45.pdf Description: NEXPERIA 74AVCH2T45GD - BUS TRAN
Part Status: Active
Packaging: Bulk
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BGE787B,112 BGE787B,112 NXP Semiconductors BGE787B_Rev4.pdf Description: IC AMP PUSH PULL SOT115J
Mounting Type: Chassis Mount
Package / Case: SOT-115J
Packaging: Bulk
Part Status: Obsolete
Supplier Device Package: SOT115J
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LPC2919FBD144/01/, NXP Semiconductors Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 88K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM968E-S
Data Converters: A/D 16x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 1.89V
Connectivity: CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PZU6.8B2L,315 PZU6.8B2L,315 NXP Semiconductors PHGLS15647-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA PZU6.8B2L - ZENER D
Current - Reverse Leakage @ Vr: 500 nA @ 3.5 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: DFN1006-2
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-882
Tolerance: ±2%
Packaging: Bulk
Produkt ist nicht verfügbar
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PZU6.8B2L,315 PZU6.8B2L,315 NXP Semiconductors PHGLS15647-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 6.8V 250MW DFN1006-2
Tolerance: ±2%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 500 nA @ 3.5 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: DFN1006-2
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-882
Produkt ist nicht verfügbar
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TIP42CTU-F129 TIP42CTU-F129 NXP Semiconductors Description: TIP42C - PNP Epitaxial Silicon T
Part Status: Obsolete
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVT16244BDL,118 74LVT16244BDL,118 NXP Semiconductors PHGLS24271-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 48SSOP
Packaging: Bulk
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-SSOP
Part Status: Active
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BLS7G2729L-350P,11 NXP Semiconductors Description: BLS7G2729L-350P - Power LDMOS tr
Packaging: Bulk
Part Status: Active
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74ALVCH162245DGG,112 74ALVCH162245DGG,112 NXP Semiconductors NEXP-S-A0002908214-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA 74ALVCH162245DGG - BUS
Packaging: Bulk
Part Status: Active
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74AVC16245DGG-Q10J 74AVC16245DGG-Q10J NXP Semiconductors 74AVC16245_Q100.pdf Description: IC TXRX 1.2V/3.6V 48-TSSOP
Part Status: Obsolete
Supplier Device Package: 48-TSSOP
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 8
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Bulk
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74HCT3G14DC,125 74HCT3G14DC,125 NXP Semiconductors PHGLS18906-1.pdf?t.download=true&u=5oefqw Description: IC INVERT SCHMITT 3CH 3IN 8VSSOP
Features: Schmitt Trigger
Packaging: Bulk
Current - Quiescent (Max): 1 µA
Number of Circuits: 3
Part Status: Active
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Input Logic Level - Low: 0.5V ~ 0.6V
Input Logic Level - High: 1.9V ~ 2.1V
Supplier Device Package: 8-VSSOP
Number of Inputs: 3
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
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PMV20EN215 PMV20EN215 NXP Semiconductors PMV20EN.pdf Description: NEXPERIA PMV20EN - SMALL SIGNAL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BUK7Y98-80E,115 BUK7Y98-80E,115 NXP Semiconductors BUK7Y98-80E.pdf Description: NEXPERIA BUK7Y98 - N-CHANNEL 80
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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S25FL064P0XMFV003 NXP Semiconductors Description: S25FL064P - 64-Mbit 3.0 V Flash
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MCF54450ACVM180 NXP Semiconductors Description: MCF5445x - 32-bit MPU, ColdFire
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PZU9.1BL,315 PZU9.1BL,315 NXP Semiconductors PZUXBL_SER.pdf Description: NEXPERIA PZU9.1BL - ZENER DIODE,
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: DFN1006-2
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 9.1 V
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-882
Tolerance: ±5%
Packaging: Bulk
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PZU3.6B2L,315 PZU3.6B2L,315 NXP Semiconductors PHGLS15647-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA PZU3.6B2L - ZENER DIODE
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: DFN1006-2
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 3.6 V
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-882
Tolerance: ±2%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
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TDA18219HN/C1518 NXP Semiconductors Description: TDA18SILICTUN40HVQFN
Control Interface: I²C
Supplier Device Package: 40-HVQFN (6x6)
Standards: DTMB, DVB-C, DVB-T, ISDB-T
Voltage - Supply: 3.3V ~ 3.6V
Function: Tuner
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Part Status: Obsolete
Packaging: Bulk
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NXQ1TXH5/101118 NXQ1TXH5/101118 NXP Semiconductors Description: NXQ1TXH5 - One-chip 5 V Qi wirel
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9663B/S911118 NXP Semiconductors Description: PCA9663 - Parallel Bus to Three-
Part Status: Obsolete
Packaging: Bulk
Produkt ist nicht verfügbar
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74HCT27PW,112 74HCT27PW,112 NXP Semiconductors 74HC_HCT27.pdf Description: IC GATE NOR
Part Status: Active
Packaging: Bulk
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MCIMX6Q4AVT10AE NXP Semiconductors Description: MCIMX6Q4AVT10AE - i.MX 6 series
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PMEG100T20ELPX NXP Semiconductors Description: PMEG100T20ELP - 100 V, 2 A low l
Current - Reverse Leakage @ Vr: 1.25 µA @ 100 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 2 A
Voltage - DC Reverse (Vr) (Max): 100 V
Part Status: Active
Operating Temperature - Junction: 175°C
Supplier Device Package: SOD-128/CFP5
Current - Average Rectified (Io): 2A
Capacitance @ Vr, F: 200pF @ 1V, 1MHz
Technology: Schottky
Reverse Recovery Time (trr): 12 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SOD-128
Packaging: Bulk
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BZX79-C36143 BZX79-C36143 NXP Semiconductors BZX79.pdf Description: NOW NEXPERIA BZX79-C36 - ZENER D
Part Status: Active
Packaging: Bulk
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 400 mW
Supplier Device Package: ALF2
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 36 V
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
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KC912DG128CCPVE NXP Semiconductors Description: MC912DG128CCPVE - Microcontrolle
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NT2H1611G0DA8J NXP Semiconductors NTAG213_215_216.pdf Description: NT2H1611G0DA8 - NTAG NFC Forum T
Packaging: Bulk
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: PLLMC
Part Status: Active
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LX2080XE72232B NXP Semiconductors LX2160XE72232B.pdf?t.download=true&u=axiww2 Description: IC MPU QORIQ LX 2.2GHZ 1517BGA
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4 SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 2.2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Bulk
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
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LX2120SE72029B NXP Semiconductors Description: IC MPU QORIQ LX 2GHZ 1517FCPBGA
Package / Case: 1517-BBGA, FCBGA
Packaging: Bulk
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4 SDRAM
Number of Cores/Bus Width: 12 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: 0°C ~ 105°C (TJ)
Speed: 2GHz
Mounting Type: Surface Mount
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LX2160SC72232B NXP Semiconductors LX2160XE72232B.pdf?t.download=true&u=axiww2 Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4 SDRAM
Number of Cores/Bus Width: 16 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: 0°C ~ 105°C (TJ)
Speed: 2.2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Bulk
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74LVC1GU04GN,132 74LVC1GU04GN,132 NXP Semiconductors PHGLS27066-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 1CH 1-INP 6XSON
Current - Quiescent (Max): 4 µA
Number of Circuits: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Input Logic Level - Low: 0.33V ~ 1.1V
Input Logic Level - High: 1.32V ~ 4.4V
Supplier Device Package: 6-XSON (0.9x1)
Number of Inputs: 1
Current - Output High, Low: 32mA, 32mA
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
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LPC4074FBD144,551 LPC4074FBD144,551 NXP Semiconductors PHGLS25790-1.pdf?t.download=true&u=5oefqw Description: LPC4000 - Mid-range 32-bit Micro
Number of I/O: 109
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 40K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
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PN7360AUEV/C300Y PN7360AUEV/C300Y NXP Semiconductors PN7462.pdf Description: PN7360AUEV - NFC Cortex®
Packaging: Bulk
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Part Status: Active
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PUMH9/ZL165 NXP Semiconductors Description: Nexperia PUMH9 Small Signal Bipo
Part Status: Obsolete
Supplier Device Package: 6-TSSOP
Resistor - Emitter Base (R2): 47kOhm
Resistor - Base (R1): 10kOhms
Frequency - Transition: 230MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Current - Collector Cutoff (Max): 100nA
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Voltage - Collector Emitter Breakdown (Max): 50V
Current - Collector (Ic) (Max): 100mA
Power - Max: 200mW
Transistor Type: 2 NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2921FBD100,551 LPC2921FBD100,551 NXP Semiconductors PHGLS20650-1.pdf?t.download=true&u=5oefqw Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 16x8b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 60
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LPC1114LVFHN24/103 LPC1114LVFHN24/103 NXP Semiconductors PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Connectivity: I2C, SPI, SSP, UART/USART
Number of I/O: 20
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, WDT
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit
Data Converters: A/D 4x8b SAR
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Bulk
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74AUP2G04GM,132 74AUP2G04GM,132 NXP Semiconductors PHGLS24263-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 2CH 2-INP 6XSON
Current - Quiescent (Max): 500 nA
Number of Circuits: 2
Part Status: Active
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Input Logic Level - Low: 0.7V ~ 0.9V
Input Logic Level - High: 1.6V ~ 2V
Supplier Device Package: 6-XSON (1.45x1)
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
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88W8987-A2-NYEA/AZ NXP Semiconductors Description: 88W8987 - RF Transceiver (Board
Packaging: Bulk
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Data Rate (Max): 433Mbps
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Part Status: Active
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PMEG2015EA115 PMEG2015EA115 NXP Semiconductors PMEG2015EA.pdf Description: DIODE SCHOTTKY 20V 1.5A SOD323
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Bulk
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 660 mV @ 1.5 A
Voltage - DC Reverse (Vr) (Max): 20 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 125°C
Supplier Device Package: SOD-323
Current - Average Rectified (Io): 1.5A
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
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PMDXB600UNEL/S500Z NXP Semiconductors Description: PMDXB600UNEL - N Channel MOSFET
Packaging: Bulk
Part Status: Active
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MRF6VP11KGSR5 NXP Semiconductors FSCLS07342-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 150 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4S GULL
Technology: LDMOS (Dual)
Power - Output: 1000W
Configuration: 2 N-Channel
Mounting Type: Surface Mount
Current Rating (Amps): 100µA
Package / Case: NI-1230-4S GW
Packaging: Bulk
Gain: 26dB
Frequency: 1.8MHz ~ 150MHz
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MIMX8QM6CVUFFAB NXP Semiconductors Description: IC MPU I.MX8Q 264MHZ 1313FCPBGA
Part Status: Active
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Graphics Acceleration: Yes
RAM Controllers: LPDDR4
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 8 Core, 64-Bit
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Packaging: Bulk
Supplier Device Package: 1313-FCPBGA (29x29)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Package / Case: 1313-BBGA, FCBGA
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Additional Interfaces: CANbus, I2C, SPI, UART
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Ethernet: 1Gbps (2)
Speed: 1.6GHz, 1.2GHz, 264MHz
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MC35XS3500HFK NXP Semiconductors MC35XS3500.pdf Description: MC35XS3500HFK - 12 V Automotive
Supplier Device Package: 24-PQFN (12x12)
Ratio - Input:Output: 1:5
Voltage - Supply (Vcc/Vdd): 6V ~ 28V
Voltage - Load: 6V ~ 28V
Input Type: Non-Inverting
Rds On (Typ): 35mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 5
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Bulk
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Battery, UVLO
Current - Output (Max): 65mA
Part Status: Obsolete
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PMN48XPAX PMN48XPAX NXP Semiconductors PMN48XPA.pdf Description: NEXPERIA PMN48XP - 20V, P-CHANNE
Input Capacitance (Ciss) (Max) @ Vds: 1000 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±12V
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Part Status: Active
Supplier Device Package: 6-TSOP
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Power Dissipation (Max): 530mW (Ta), 6.25W (Tc)
Rds On (Max) @ Id, Vgs: 55mOhm @ 2.4A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 4.1A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Bulk
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NX7002AK215 NXP Semiconductors Description: Nexperia NX7002AK - Small Signal
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 100mA, 10V
Current - Continuous Drain (Id) @ 25°C: 190mA (Ta), 300mA (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
Input Capacitance (Ciss) (Max) @ Vds: 20 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 0.43 nC @ 4.5 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Part Status: Active
Supplier Device Package: SOT-23-3 (TO-236)
Vgs(th) (Max) @ Id: 2.1V @ 250µA
Power Dissipation (Max): 265mW (Ta), 1.33W (Tc)
Produkt ist nicht verfügbar
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MPC8358CVRADDDA557 NXP Semiconductors Description: IC MPU MPC83XX 266MHZ 668TEPBGA
Packaging: Bulk
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-TEPBGA (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
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BUK763R1-40B,118 BUK763R1-40B,118 NXP Semiconductors PHGLS22330-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA BUK763R1-40B - 75A, 40V
Packaging: Bulk
Input Capacitance (Ciss) (Max) @ Vds: 6808 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 94 nC @ 10 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
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MC9328MX1DVM15 NXP Semiconductors FSCLS05269-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX1 150MHZ 225MAPBGA
Packaging: Bulk
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Part Status: Active
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PCMF2HDMI14SZ PCMF2HDMI14SZ NXP Semiconductors PCMFXHDMI14S_SER.pdf Description: CMC
Packaging: Bulk
Package / Case: 10-UFBGA, WLCSP
Size / Dimension: 0.062" L x 0.046" W (1.57mm x 1.17mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Height: 0.024" (0.60mm)
Filter Order: 3rd
Applications: General Purpose
Technology: LC
Resistance - Channel (Ohms): 3
ESD Protection: Yes
Part Status: Active
Number of Channels: 2
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88W9068-A0-BWPC/AK NXP Semiconductors Description: 88W9068 - WiFi Access Point SOC.
Part Status: Obsolete
Serial Interfaces: GPIO, I²C, SPI
RF Family/Standard: WiFi
Modulation: 1024QAM
Data Rate (Max): 4.8Gbps
Protocol: 802.11ax
Type: TxRx Only
Packaging: Bulk
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A3G35H100-04SR3 NXP Semiconductors A3G35H100-04S.pdf Description: RF MOSFET GAN 48V NI780
Current - Test: 80 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Active
Supplier Device Package: NI-780S-4L
Technology: GaN
Power - Output: 14W
Configuration: 2 N-Channel
Frequency: 3.4GHz ~ 3.6GHz
Mounting Type: Surface Mount
Package / Case: NI-780S-4L
Packaging: Bulk
Gain: 14dB @ 3.6GHz
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LS1043ASN7MNLB NXP Semiconductors Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Part Status: Active
SATA: SATA 6Gbps (1)
Security Features: ARM TZ, Boot Security
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 + PHY (3)
Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2)
Supplier Device Package: 621-FCPBGA (21x21)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 621-FBGA, FCBGA
Packaging: Bulk
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LS1088ASE7MQA NXP Semiconductors LS1088AXE7MQA.pdf?t.download=true&u=ovmfp3 Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, IFC, PCI, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: No
RAM Controllers: DDR4
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
Ethernet: 10GbE (2), 1GbE (8)
Supplier Device Package: 780-FBGA (23x23)
Voltage - I/O: 1.2V
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 105°C (TJ)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 780-BFBGA
Packaging: Bulk
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MIMXRT105SCVL5B MIMXRT105SCVL5B NXP Semiconductors PHGL-S-A0006456212-1.pdf?t.download=true&u=5oefqw Description: MXRT1050 - i.MXRT105A
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
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74AUP1G17GF132 74AUP1G17.pdf
74AUP1G17GF132
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (1x1)
Part Status: Active
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MPC8536BVJAKGA557 PHGL-S-A0002263525-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: POWERQUICC RISC MICROPROCESSOR
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TJ)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Part Status: Active
Packaging: Bulk
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74HCT6323AD,112 74HC_HCT6323A.pdf
74HCT6323AD,112
Hersteller: NXP Semiconductors
Description: 74HCT6323 - NOW NEXPERIA 74HCT63
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Divide-by-N
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 8-SO
Count Rate: 85 MHz
Number of Bits per Element: 3
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HVP-MC3PH598
Hersteller: NXP Semiconductors
Description: HIGH VOLTAGE MOTOR CONTROL PLATF
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
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NX5P1100UK,012 NX5P1100.pdf
NX5P1100UK,012
Hersteller: NXP Semiconductors
Description: LOGIC CONTROLLED HIGH-SIDE POWER
Part Status: Active
Packaging: Bulk
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BUK9880-55/CU135 BUK9880-55.pdf
BUK9880-55/CU135
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK9880-55 3.5A, 55V, 0
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MKW31Z256VHT4557 PHGL-S-A0005068082-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: KINETIS KW31Z - BLE 4.2 WIRELES
Part Status: Active
Serial Interfaces: ADC, GPIO, I²C, SPI, UART
RF Family/Standard: Bluetooth
Modulation: FSK, GFSK, MSK, O-QPSK
Supplier Device Package: 64-VFLGA (7x7)
Current - Transmitting: 6mA
Current - Receiving: 6.2mA
Protocol: Bluetooth v4.2
Power - Output: 4dBm
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 256kB Flash, 64kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Package / Case: 64-VFLGA
Packaging: Bulk
DigiKey Programmable: Not Verified
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74AVCH2T45GD,125 74AVCH2T45.pdf
74AVCH2T45GD,125
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AVCH2T45GD - BUS TRAN
Part Status: Active
Packaging: Bulk
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BGE787B,112 BGE787B_Rev4.pdf
BGE787B,112
Hersteller: NXP Semiconductors
Description: IC AMP PUSH PULL SOT115J
Mounting Type: Chassis Mount
Package / Case: SOT-115J
Packaging: Bulk
Part Status: Obsolete
Supplier Device Package: SOT115J
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8+68.47 EUR
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LPC2919FBD144/01/,
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 88K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM968E-S
Data Converters: A/D 16x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 1.89V
Connectivity: CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PZU6.8B2L,315 PHGLS15647-1.pdf?t.download=true&u=5oefqw
PZU6.8B2L,315
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA PZU6.8B2L - ZENER D
Current - Reverse Leakage @ Vr: 500 nA @ 3.5 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: DFN1006-2
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-882
Tolerance: ±2%
Packaging: Bulk
Produkt ist nicht verfügbar
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PZU6.8B2L,315 PHGLS15647-1.pdf?t.download=true&u=5oefqw
PZU6.8B2L,315
Hersteller: NXP Semiconductors
Description: DIODE ZENER 6.8V 250MW DFN1006-2
Tolerance: ±2%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 500 nA @ 3.5 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: DFN1006-2
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-882
Produkt ist nicht verfügbar
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TIP42CTU-F129
TIP42CTU-F129
Hersteller: NXP Semiconductors
Description: TIP42C - PNP Epitaxial Silicon T
Part Status: Obsolete
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVT16244BDL,118 PHGLS24271-1.pdf?t.download=true&u=5oefqw
74LVT16244BDL,118
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 48SSOP
Packaging: Bulk
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-SSOP
Part Status: Active
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523+1.13 EUR
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BLS7G2729L-350P,11
Hersteller: NXP Semiconductors
Description: BLS7G2729L-350P - Power LDMOS tr
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74ALVCH162245DGG,112 NEXP-S-A0002908214-1.pdf?t.download=true&u=5oefqw
74ALVCH162245DGG,112
Hersteller: NXP Semiconductors
Description: NEXPERIA 74ALVCH162245DGG - BUS
Packaging: Bulk
Part Status: Active
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711+0.89 EUR
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74AVC16245DGG-Q10J 74AVC16245_Q100.pdf
74AVC16245DGG-Q10J
Hersteller: NXP Semiconductors
Description: IC TXRX 1.2V/3.6V 48-TSSOP
Part Status: Obsolete
Supplier Device Package: 48-TSSOP
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 8
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Bulk
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117+4.72 EUR
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74HCT3G14DC,125 PHGLS18906-1.pdf?t.download=true&u=5oefqw
74HCT3G14DC,125
Hersteller: NXP Semiconductors
Description: IC INVERT SCHMITT 3CH 3IN 8VSSOP
Features: Schmitt Trigger
Packaging: Bulk
Current - Quiescent (Max): 1 µA
Number of Circuits: 3
Part Status: Active
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Input Logic Level - Low: 0.5V ~ 0.6V
Input Logic Level - High: 1.9V ~ 2.1V
Supplier Device Package: 8-VSSOP
Number of Inputs: 3
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
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PMV20EN215 PMV20EN.pdf
PMV20EN215
Hersteller: NXP Semiconductors
Description: NEXPERIA PMV20EN - SMALL SIGNAL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BUK7Y98-80E,115 BUK7Y98-80E.pdf
BUK7Y98-80E,115
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK7Y98 - N-CHANNEL 80
Packaging: Bulk
Part Status: Active
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S25FL064P0XMFV003
Hersteller: NXP Semiconductors
Description: S25FL064P - 64-Mbit 3.0 V Flash
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MCF54450ACVM180
Hersteller: NXP Semiconductors
Description: MCF5445x - 32-bit MPU, ColdFire
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PZU9.1BL,315 PZUXBL_SER.pdf
PZU9.1BL,315
Hersteller: NXP Semiconductors
Description: NEXPERIA PZU9.1BL - ZENER DIODE,
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: DFN1006-2
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 9.1 V
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-882
Tolerance: ±5%
Packaging: Bulk
auf Bestellung 92499 Stücke:
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12070+0.039 EUR
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PZU3.6B2L,315 PHGLS15647-1.pdf?t.download=true&u=5oefqw
PZU3.6B2L,315
Hersteller: NXP Semiconductors
Description: NEXPERIA PZU3.6B2L - ZENER DIODE
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: DFN1006-2
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 3.6 V
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-882
Tolerance: ±2%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
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10764+0.063 EUR
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TDA18219HN/C1518
Hersteller: NXP Semiconductors
Description: TDA18SILICTUN40HVQFN
Control Interface: I²C
Supplier Device Package: 40-HVQFN (6x6)
Standards: DTMB, DVB-C, DVB-T, ISDB-T
Voltage - Supply: 3.3V ~ 3.6V
Function: Tuner
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Part Status: Obsolete
Packaging: Bulk
auf Bestellung 4000 Stücke:
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174+3.31 EUR
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NXQ1TXH5/101118
NXQ1TXH5/101118
Hersteller: NXP Semiconductors
Description: NXQ1TXH5 - One-chip 5 V Qi wirel
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9663B/S911118
Hersteller: NXP Semiconductors
Description: PCA9663 - Parallel Bus to Three-
Part Status: Obsolete
Packaging: Bulk
Produkt ist nicht verfügbar
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74HCT27PW,112 74HC_HCT27.pdf
74HCT27PW,112
Hersteller: NXP Semiconductors
Description: IC GATE NOR
Part Status: Active
Packaging: Bulk
auf Bestellung 12686 Stücke:
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2329+0.25 EUR
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MCIMX6Q4AVT10AE
Hersteller: NXP Semiconductors
Description: MCIMX6Q4AVT10AE - i.MX 6 series
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PMEG100T20ELPX
Hersteller: NXP Semiconductors
Description: PMEG100T20ELP - 100 V, 2 A low l
Current - Reverse Leakage @ Vr: 1.25 µA @ 100 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 2 A
Voltage - DC Reverse (Vr) (Max): 100 V
Part Status: Active
Operating Temperature - Junction: 175°C
Supplier Device Package: SOD-128/CFP5
Current - Average Rectified (Io): 2A
Capacitance @ Vr, F: 200pF @ 1V, 1MHz
Technology: Schottky
Reverse Recovery Time (trr): 12 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SOD-128
Packaging: Bulk
auf Bestellung 7781 Stücke:
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3000+0.21 EUR
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BZX79-C36143 BZX79.pdf
BZX79-C36143
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA BZX79-C36 - ZENER D
Part Status: Active
Packaging: Bulk
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 400 mW
Supplier Device Package: ALF2
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 36 V
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Produkt ist nicht verfügbar
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KC912DG128CCPVE
Hersteller: NXP Semiconductors
Description: MC912DG128CCPVE - Microcontrolle
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NT2H1611G0DA8J NTAG213_215_216.pdf
Hersteller: NXP Semiconductors
Description: NT2H1611G0DA8 - NTAG NFC Forum T
Packaging: Bulk
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: PLLMC
Part Status: Active
auf Bestellung 21672 Stücke:
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485+1.13 EUR
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LX2080XE72232B LX2160XE72232B.pdf?t.download=true&u=axiww2
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ LX 2.2GHZ 1517BGA
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4 SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 2.2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Bulk
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
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LX2120SE72029B
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ LX 2GHZ 1517FCPBGA
Package / Case: 1517-BBGA, FCBGA
Packaging: Bulk
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4 SDRAM
Number of Cores/Bus Width: 12 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: 0°C ~ 105°C (TJ)
Speed: 2GHz
Mounting Type: Surface Mount
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LX2160SC72232B LX2160XE72232B.pdf?t.download=true&u=axiww2
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4 SDRAM
Number of Cores/Bus Width: 16 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: 0°C ~ 105°C (TJ)
Speed: 2.2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Bulk
auf Bestellung 17 Stücke:
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1+1405.51 EUR
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74LVC1GU04GN,132 PHGLS27066-1.pdf?t.download=true&u=5oefqw
74LVC1GU04GN,132
Hersteller: NXP Semiconductors
Description: IC INVERTER 1CH 1-INP 6XSON
Current - Quiescent (Max): 4 µA
Number of Circuits: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Input Logic Level - Low: 0.33V ~ 1.1V
Input Logic Level - High: 1.32V ~ 4.4V
Supplier Device Package: 6-XSON (0.9x1)
Number of Inputs: 1
Current - Output High, Low: 32mA, 32mA
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
auf Bestellung 3750 Stücke:
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AnzahlPrivatkunde
3750+0.2 EUR
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LPC4074FBD144,551 PHGLS25790-1.pdf?t.download=true&u=5oefqw
LPC4074FBD144,551
Hersteller: NXP Semiconductors
Description: LPC4000 - Mid-range 32-bit Micro
Number of I/O: 109
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 40K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
auf Bestellung 623 Stücke:
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35+15.67 EUR
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PN7360AUEV/C300Y PN7462.pdf
PN7360AUEV/C300Y
Hersteller: NXP Semiconductors
Description: PN7360AUEV - NFC Cortex®
Packaging: Bulk
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Part Status: Active
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34+16.41 EUR
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PUMH9/ZL165
Hersteller: NXP Semiconductors
Description: Nexperia PUMH9 Small Signal Bipo
Part Status: Obsolete
Supplier Device Package: 6-TSSOP
Resistor - Emitter Base (R2): 47kOhm
Resistor - Base (R1): 10kOhms
Frequency - Transition: 230MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Current - Collector Cutoff (Max): 100nA
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Voltage - Collector Emitter Breakdown (Max): 50V
Current - Collector (Ic) (Max): 100mA
Power - Max: 200mW
Transistor Type: 2 NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2921FBD100,551 PHGLS20650-1.pdf?t.download=true&u=5oefqw
LPC2921FBD100,551
Hersteller: NXP Semiconductors
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM968E-S
Data Converters: A/D 16x8b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 60
auf Bestellung 287 Stücke:
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31+17.66 EUR
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LPC1114LVFHN24/103 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114LVFHN24/103
Hersteller: NXP Semiconductors
Description: LPC1114 - Cortex-M0+/M0 RISC Mic
Connectivity: I2C, SPI, SSP, UART/USART
Number of I/O: 20
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, WDT
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit
Data Converters: A/D 4x8b SAR
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 964 Stücke:
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AnzahlPrivatkunde
166+3.5 EUR
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74AUP2G04GM,132 PHGLS24263-1.pdf?t.download=true&u=5oefqw
74AUP2G04GM,132
Hersteller: NXP Semiconductors
Description: IC INVERTER 2CH 2-INP 6XSON
Current - Quiescent (Max): 500 nA
Number of Circuits: 2
Part Status: Active
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Input Logic Level - Low: 0.7V ~ 0.9V
Input Logic Level - High: 1.6V ~ 2V
Supplier Device Package: 6-XSON (1.45x1)
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
Produkt ist nicht verfügbar
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88W8987-A2-NYEA/AZ
Hersteller: NXP Semiconductors
Description: 88W8987 - RF Transceiver (Board
Packaging: Bulk
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Data Rate (Max): 433Mbps
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Part Status: Active
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PMEG2015EA115 PMEG2015EA.pdf
PMEG2015EA115
Hersteller: NXP Semiconductors
Description: DIODE SCHOTTKY 20V 1.5A SOD323
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Bulk
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 660 mV @ 1.5 A
Voltage - DC Reverse (Vr) (Max): 20 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 125°C
Supplier Device Package: SOD-323
Current - Average Rectified (Io): 1.5A
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
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PMDXB600UNEL/S500Z
Hersteller: NXP Semiconductors
Description: PMDXB600UNEL - N Channel MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MRF6VP11KGSR5 FSCLS07342-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 150 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4S GULL
Technology: LDMOS (Dual)
Power - Output: 1000W
Configuration: 2 N-Channel
Mounting Type: Surface Mount
Current Rating (Amps): 100µA
Package / Case: NI-1230-4S GW
Packaging: Bulk
Gain: 26dB
Frequency: 1.8MHz ~ 150MHz
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MIMX8QM6CVUFFAB
Hersteller: NXP Semiconductors
Description: IC MPU I.MX8Q 264MHZ 1313FCPBGA
Part Status: Active
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Graphics Acceleration: Yes
RAM Controllers: LPDDR4
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 8 Core, 64-Bit
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Packaging: Bulk
Supplier Device Package: 1313-FCPBGA (29x29)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Package / Case: 1313-BBGA, FCBGA
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Additional Interfaces: CANbus, I2C, SPI, UART
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Ethernet: 1Gbps (2)
Speed: 1.6GHz, 1.2GHz, 264MHz
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MC35XS3500HFK MC35XS3500.pdf
Hersteller: NXP Semiconductors
Description: MC35XS3500HFK - 12 V Automotive
Supplier Device Package: 24-PQFN (12x12)
Ratio - Input:Output: 1:5
Voltage - Supply (Vcc/Vdd): 6V ~ 28V
Voltage - Load: 6V ~ 28V
Input Type: Non-Inverting
Rds On (Typ): 35mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 5
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Bulk
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Battery, UVLO
Current - Output (Max): 65mA
Part Status: Obsolete
Produkt ist nicht verfügbar
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PMN48XPAX PMN48XPA.pdf
PMN48XPAX
Hersteller: NXP Semiconductors
Description: NEXPERIA PMN48XP - 20V, P-CHANNE
Input Capacitance (Ciss) (Max) @ Vds: 1000 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±12V
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Part Status: Active
Supplier Device Package: 6-TSOP
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Power Dissipation (Max): 530mW (Ta), 6.25W (Tc)
Rds On (Max) @ Id, Vgs: 55mOhm @ 2.4A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 4.1A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Bulk
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NX7002AK215
Hersteller: NXP Semiconductors
Description: Nexperia NX7002AK - Small Signal
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 100mA, 10V
Current - Continuous Drain (Id) @ 25°C: 190mA (Ta), 300mA (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
Input Capacitance (Ciss) (Max) @ Vds: 20 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 0.43 nC @ 4.5 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Part Status: Active
Supplier Device Package: SOT-23-3 (TO-236)
Vgs(th) (Max) @ Id: 2.1V @ 250µA
Power Dissipation (Max): 265mW (Ta), 1.33W (Tc)
Produkt ist nicht verfügbar
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MPC8358CVRADDDA557
Hersteller: NXP Semiconductors
Description: IC MPU MPC83XX 266MHZ 668TEPBGA
Packaging: Bulk
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-TEPBGA (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
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BUK763R1-40B,118 PHGLS22330-1.pdf?t.download=true&u=5oefqw
BUK763R1-40B,118
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK763R1-40B - 75A, 40V
Packaging: Bulk
Input Capacitance (Ciss) (Max) @ Vds: 6808 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 94 nC @ 10 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
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MC9328MX1DVM15 FSCLS05269-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP Semiconductors
Description: IC MPU I.MX1 150MHZ 225MAPBGA
Packaging: Bulk
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Part Status: Active
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PCMF2HDMI14SZ PCMFXHDMI14S_SER.pdf
PCMF2HDMI14SZ
Hersteller: NXP Semiconductors
Description: CMC
Packaging: Bulk
Package / Case: 10-UFBGA, WLCSP
Size / Dimension: 0.062" L x 0.046" W (1.57mm x 1.17mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Height: 0.024" (0.60mm)
Filter Order: 3rd
Applications: General Purpose
Technology: LC
Resistance - Channel (Ohms): 3
ESD Protection: Yes
Part Status: Active
Number of Channels: 2
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88W9068-A0-BWPC/AK
Hersteller: NXP Semiconductors
Description: 88W9068 - WiFi Access Point SOC.
Part Status: Obsolete
Serial Interfaces: GPIO, I²C, SPI
RF Family/Standard: WiFi
Modulation: 1024QAM
Data Rate (Max): 4.8Gbps
Protocol: 802.11ax
Type: TxRx Only
Packaging: Bulk
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A3G35H100-04SR3 A3G35H100-04S.pdf
Hersteller: NXP Semiconductors
Description: RF MOSFET GAN 48V NI780
Current - Test: 80 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Active
Supplier Device Package: NI-780S-4L
Technology: GaN
Power - Output: 14W
Configuration: 2 N-Channel
Frequency: 3.4GHz ~ 3.6GHz
Mounting Type: Surface Mount
Package / Case: NI-780S-4L
Packaging: Bulk
Gain: 14dB @ 3.6GHz
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LS1043ASN7MNLB
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Part Status: Active
SATA: SATA 6Gbps (1)
Security Features: ARM TZ, Boot Security
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 + PHY (3)
Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2)
Supplier Device Package: 621-FCPBGA (21x21)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 621-FBGA, FCBGA
Packaging: Bulk
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LS1088ASE7MQA LS1088AXE7MQA.pdf?t.download=true&u=ovmfp3
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, IFC, PCI, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: No
RAM Controllers: DDR4
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
Ethernet: 10GbE (2), 1GbE (8)
Supplier Device Package: 780-FBGA (23x23)
Voltage - I/O: 1.2V
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 105°C (TJ)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 780-BFBGA
Packaging: Bulk
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MIMXRT105SCVL5B PHGL-S-A0006456212-1.pdf?t.download=true&u=5oefqw
MIMXRT105SCVL5B
Hersteller: NXP Semiconductors
Description: MXRT1050 - i.MXRT105A
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
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