Produkte > NXP SEMICONDUCTORS > Alle Produkte des Herstellers NXP SEMICONDUCTORS (56375) > Seite 49 nach 940
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
||
---|---|---|---|---|---|---|---|
74LVC273DB,112 | NXP Semiconductors | Description: NEXPERIA 74LVC273DB - D FLIP-FLO |
Produkt ist nicht verfügbar |
||||
HEF40098BT,653 | NXP Semiconductors |
Description: IC BUFFER INVERT 15V 16SO Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 15V Number of Bits per Element: 2, 4 (Hex) Current - Output High, Low: 10mA, 20mA Supplier Device Package: 16-SO Part Status: Active |
Produkt ist nicht verfügbar |
||||
HEF40098BT,653 | NXP Semiconductors |
Description: IC BUFFER INVERT 15V 16SO Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 15V Number of Bits per Element: 2, 4 (Hex) Current - Output High, Low: 10mA, 20mA Supplier Device Package: 16-SO Part Status: Active |
Produkt ist nicht verfügbar |
||||
HEF40098BT,652 | NXP Semiconductors |
Description: IC BUFFER INVERT 15V 16SO Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 15V Number of Bits per Element: 2, 4 Current - Output High, Low: 10mA, 20mA Supplier Device Package: 16-SO Part Status: Obsolete |
auf Bestellung 2378 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
74AVC1T1022GUX | NXP Semiconductors | Description: IC CLK BUFFER 1:4 10XQFN |
auf Bestellung 15347 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
PDTC144TM,315 | NXP Semiconductors |
Description: TRANS PREBIAS Packaging: Bulk Part Status: Active |
auf Bestellung 38937 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
HVP-MC3PH598 | NXP Semiconductors |
Description: HIGH VOLTAGE MOTOR CONTROL PLATF Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||
BZB784-C2V7,115 | NXP Semiconductors |
Description: NEXPERIA BZB784-C2V7 - ZENER DIO Packaging: Bulk Tolerance: ±5% Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 2.7 V Impedance (Max) (Zzt): 100 Ohms Supplier Device Package: SOT-323 Part Status: Active Power - Max: 180 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 20 µA @ 1 V |
auf Bestellung 75000 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
NX5P1100UK,012 | NXP Semiconductors |
Description: LOGIC CONTROLLED HIGH-SIDE POWER Packaging: Bulk Part Status: Active |
auf Bestellung 9000 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
74LVC2G241GS,115 | NXP Semiconductors |
Description: IC BUFFER NON-INVERT 5.5V 8XSON Packaging: Bulk Package / Case: 8-XFDFN Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 32mA, 32mA Supplier Device Package: 8-XSON (1.35x1) Part Status: Active |
auf Bestellung 79800 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
BUK9880-55/CU135 | NXP Semiconductors |
Description: NEXPERIA BUK9880-55 3.5A, 55V, 0 Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
||||
MKW31Z256VHT4557 | NXP Semiconductors |
Description: KINETIS KW31Z - BLE 4.2 WIRELES Packaging: Bulk Package / Case: 64-VFLGA Sensitivity: -102dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 64kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.71V ~ 3.6V Power - Output: 4dBm Protocol: Bluetooth v4.2 Current - Receiving: 6.2mA Current - Transmitting: 6mA Supplier Device Package: 64-VFLGA (7x7) Modulation: FSK, GFSK, MSK, O-QPSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I²C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 260 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
TDZ5V6J/ZL,135 | NXP Semiconductors |
Description: NEXPERIA TDZ5V6J - ZENER DIODE, Packaging: Bulk Tolerance: ±2% Package / Case: SC-90, SOD-323F Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 5.6 V Impedance (Max) (Zzt): 40 Ohms Supplier Device Package: SOD-323F Part Status: Active Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 10 µA @ 2.5 V Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 1080000 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
74HCT139PW,118 | NXP Semiconductors |
Description: NEXPERIA 74HCT139PW - DECODER/DR Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 1 x 2:4 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 2 Current - Output High, Low: 4mA, 4mA Voltage Supply Source: Single Supply Supplier Device Package: 16-TSSOP Part Status: Active |
auf Bestellung 21581 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
74AVCH2T45GD,125 | NXP Semiconductors |
Description: NEXPERIA 74AVCH2T45GD - BUS TRAN Packaging: Bulk Part Status: Active |
auf Bestellung 157318 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
NZX16C,133 | NXP Semiconductors |
Description: NEXPERIA NZX16C - ZENER DIODE, 1 Packaging: Bulk Tolerance: ±2% Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C Voltage - Zener (Nom) (Vz): 16 V Impedance (Max) (Zzt): 45 Ohms Supplier Device Package: ALF2 Part Status: Active Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA Current - Reverse Leakage @ Vr: 50 nA @ 11.2 V |
auf Bestellung 26160 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
LPC2919FBD144/01/, | NXP Semiconductors |
Description: IC MCU 32BIT 768KB FLASH 144LQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 125MHz Program Memory Size: 768KB (768K x 8) RAM Size: 88K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM968E-S Data Converters: A/D 16x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 1.89V Connectivity: CANbus, EBI/EMI, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Obsolete Number of I/O: 108 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||
74AXP1G17GXH | NXP Semiconductors |
Description: IC BUFF NON-INVERT 2.75V 5X2SON Packaging: Bulk Package / Case: 4-XFDFN Exposed Pad Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 0.7V ~ 2.75V Input Type: Schmitt Trigger Number of Bits per Element: 1 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 5-X2SON (0.80x0.80) Part Status: Active |
auf Bestellung 4500 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
PZU6.8B2L,315 | NXP Semiconductors |
Description: NOW NEXPERIA PZU6.8B2L - ZENER D Packaging: Bulk Tolerance: ±2% Package / Case: SOD-882 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 6.8 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: DFN1006-2 Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 500 nA @ 3.5 V |
Produkt ist nicht verfügbar |
||||
PZU6.8B2L,315 | NXP Semiconductors |
Description: DIODE ZENER 6.8V 250MW DFN1006-2 Packaging: Bulk Tolerance: ±2% Package / Case: SOD-882 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 6.8 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: DFN1006-2 Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 500 nA @ 3.5 V |
Produkt ist nicht verfügbar |
||||
TIP42CTU-F129 | NXP Semiconductors |
Description: TIP42C - PNP Epitaxial Silicon T Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
||||
74LVC1G74GD,125 | NXP Semiconductors |
Description: IC FF D-TYPE SNGL 1BIT 8XSON Packaging: Bulk Package / Case: 8-XFDFN Output Type: Complementary Mounting Type: Surface Mount Number of Elements: 1 Function: Set(Preset) and Reset Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Current - Quiescent (Iq): 40 µA Current - Output High, Low: 32mA, 32mA Trigger Type: Positive Edge Clock Frequency: 200 MHz Input Capacitance: 4 pF Supplier Device Package: 8-XSON (2x3) Max Propagation Delay @ V, Max CL: 4.1ns @ 5V, 50pF Part Status: Active Number of Bits per Element: 1 |
auf Bestellung 174594 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
74LVT16244BDL,118 | NXP Semiconductors |
Description: IC BUFFER NON-INVERT 3.6V 48SSOP Packaging: Bulk Package / Case: 48-BSSOP (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 48-SSOP Part Status: Active |
auf Bestellung 10113 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
MPC8349VVAJDB | NXP Semiconductors |
Description: IC MPU MPC83XX 533MHZ 672TBGA Packaging: Bulk Package / Case: 672-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 672-TBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI, UART Part Status: Obsolete |
auf Bestellung 24 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
BC857BQAZ | NXP Semiconductors |
Description: NEXPERIA BC857 - 45 V, 100 MA PN Packaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V Frequency - Transition: 100MHz Supplier Device Package: DFN1010D-3 Grade: Automotive Part Status: Active Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 280 mW Qualification: AEC-Q101 |
auf Bestellung 85000 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
74AUP1GU04GS,132 | NXP Semiconductors |
Description: NEXPERIA 74AUP1GU04GS - INVERTER Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 1 Supplier Device Package: 6-XSON, SOT1202 (1x1) Max Propagation Delay @ V, Max CL: 4.3ns @ 3.3V, 30pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 500 nA |
auf Bestellung 5000 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
BLS7G2729L-350P,11 | NXP Semiconductors |
Description: BLS7G2729L-350P - Power LDMOS tr Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
||||
74ALVCH162245DGG,112 | NXP Semiconductors |
Description: NEXPERIA 74ALVCH162245DGG - BUS Packaging: Bulk Part Status: Active |
auf Bestellung 711 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
74AVC16245DGG-Q10J | NXP Semiconductors |
Description: IC TXRX NON-INVERT 3.6V 48TSSOP Packaging: Bulk Package / Case: 48-TFSOP (0.240", 6.10mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.2V ~ 3.6V Number of Bits per Element: 8 Current - Output High, Low: 12mA, 12mA Supplier Device Package: 48-TSSOP Part Status: Obsolete |
auf Bestellung 2267 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
HEF4521BT,652 | NXP Semiconductors |
Description: NEXPERIA HEF4521BT - BINARY COUN Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Divide-by-2 Reset: Asynchronous Operating Temperature: -40°C ~ 85°C (TA) Direction: Up Trigger Type: Negative Edge Supplier Device Package: 16-SO Part Status: Active Voltage - Supply: 4.5 V ~ 5.5 V Count Rate: 35 MHz Number of Bits per Element: 24 |
auf Bestellung 8691 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
74HCT3G14DC,125 | NXP Semiconductors |
Description: NEXPERIA 74HCT3G14DC - INVERTER, Packaging: Bulk Features: Schmitt Trigger Package / Case: 8-VFSOP (0.091", 2.30mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Supplier Device Package: 8-VSSOP Input Logic Level - High: 1.9V ~ 2.1V Input Logic Level - Low: 0.5V ~ 0.6V Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF Part Status: Active Number of Circuits: 3 Current - Quiescent (Max): 1 µA |
auf Bestellung 103002 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
PMV20EN215 | NXP Semiconductors |
Description: NEXPERIA PMV20EN - SMALL SIGNAL Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
||||
PCA9543BPW,118 | NXP Semiconductors |
Description: PCA9543BPW - 2-channel I2C-bus s Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
||||
BUK7Y98-80E,115 | NXP Semiconductors |
Description: NEXPERIA BUK7Y98 - N-CHANNEL 80 Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
||||
S25FL064P0XMFV003 | NXP Semiconductors |
Description: S25FL064P - 64-Mbit 3.0 V Flash Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
||||
MCF54450ACVM180 | NXP Semiconductors |
Description: MCF5445x - 32-bit MPU, ColdFire Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
||||
PZU9.1BL,315 | NXP Semiconductors |
Description: NEXPERIA PZU9.1BL - ZENER DIODE, Packaging: Bulk Tolerance: ±5% Package / Case: SOD-882 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 9.1 V Impedance (Max) (Zzt): 10 Ohms Supplier Device Package: DFN1006-2 Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 500 nA @ 6 V |
auf Bestellung 92499 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
BZX884-B11,315 | NXP Semiconductors |
Description: NEXPERIA BZX884-B11 - ZENER DIOD Packaging: Bulk Tolerance: ±2% Package / Case: SOD-882 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 11 V Impedance (Max) (Zzt): 10 Ohms Supplier Device Package: DFN1006-2 Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 100 nA @ 8 V |
auf Bestellung 70000 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
PZU3.6B2L,315 | NXP Semiconductors |
Description: NEXPERIA PZU3.6B2L - ZENER DIODE Packaging: Bulk Tolerance: ±2% Package / Case: SOD-882 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 3.6 V Impedance (Max) (Zzt): 90 Ohms Supplier Device Package: DFN1006-2 Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 5 µA @ 1 V |
auf Bestellung 20000 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
BZX884-B30,315 | NXP Semiconductors |
Description: NEXPERIA BZX884-B30 - ZENER DIOD Packaging: Bulk Tolerance: ±2% Package / Case: SOD-882 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 30 V Impedance (Max) (Zzt): 80 Ohms Supplier Device Package: DFN1006-2 Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 21 V |
auf Bestellung 16905 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
TDA18219HN/C1518 | NXP Semiconductors |
Description: TDA18SILICTUN40HVQFN Packaging: Bulk Part Status: Obsolete Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.3V ~ 3.6V Standards: DTMB, DVB-C, DVB-T, ISDB-T Supplier Device Package: 40-HVQFN (6x6) Control Interface: I²C |
auf Bestellung 4000 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
NXQ1TXH5/101118 | NXP Semiconductors |
Description: NXQ1TXH5 - One-chip 5 V Qi wirel Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
||||
PCA9663B/S911118 | NXP Semiconductors |
Description: PCA9663 - Parallel Bus to Three- Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
||||
MCIMX31LDVMN5DR2 | NXP Semiconductors |
Description: IC MPU I.MX31 532MHZ 473BGA Packaging: Bulk Part Status: Active Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2V, 2.5V, 2.7V, 3V Supplier Device Package: 473-PBGA (19x19) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP RAM Controllers: DDR Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, Keypad, LCD Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART |
auf Bestellung 5250 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
74HCT27PW,112 | NXP Semiconductors |
Description: IC GATE NOR Packaging: Bulk Part Status: Active |
auf Bestellung 12686 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
LS1012AXN7KKB | NXP Semiconductors |
Description: IC MPU QORLQ LS1 1GHZ 211FCLGA Packaging: Bulk Part Status: Active Package / Case: 211-VFLGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 211-FCLGA (9.6x9.6) Ethernet: GbE (2) USB: USB 2.0 (1), USB 3.0 + PHY Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
auf Bestellung 336 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
74CBTLV3257D,118 | NXP Semiconductors |
Description: NEXPERIA 74CBTLV3257 - QUAD 1-OF Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 4 x 1:2 Type: Multiplexer/Demultiplexer Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.3V ~ 3.6V Independent Circuits: 4 Voltage Supply Source: Single Supply Supplier Device Package: 16-SO Part Status: Active |
auf Bestellung 2400 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
MCIMX6Q4AVT10AE | NXP Semiconductors |
Description: MCIMX6Q4AVT10AE - i.MX 6 series Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
||||
MCIMX6Q5EZK08AD | NXP Semiconductors |
Description: IC MPU I.MX6Q 800MHZ 569MAPBGA Packaging: Bulk Part Status: Active Package / Case: 569-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 569-MAPBGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 258 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
74LVC3G17GN,115 | NXP Semiconductors |
Description: IC BUFFER NON-INVERT 5.5V 8XSON Packaging: Bulk Package / Case: 8-XFDFN Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 3 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Input Type: Schmitt Trigger Number of Bits per Element: 1 Current - Output High, Low: 32mA, 32mA Supplier Device Package: 8-XSON (1.2x1) Part Status: Active |
auf Bestellung 78500 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
PCA9430HKZ | NXP Semiconductors |
Description: RF Evaluation/Development Kits Packaging: Bulk Part Status: Active |
auf Bestellung 34988 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
PMEG100T20ELPX | NXP Semiconductors |
Description: PMEG100T20ELP - 100 V, 2 A low l Packaging: Bulk Package / Case: SOD-128 Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 12 ns Technology: Schottky Capacitance @ Vr, F: 200pF @ 1V, 1MHz Current - Average Rectified (Io): 2A Supplier Device Package: SOD-128/CFP5 Operating Temperature - Junction: 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 100 V Voltage - Forward (Vf) (Max) @ If: 800 mV @ 2 A Current - Reverse Leakage @ Vr: 1.25 µA @ 100 V |
auf Bestellung 7781 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
SPC5748GK0AMMJ6 | NXP Semiconductors |
Description: TRIPLE CORE, 6M FLASH, 768K RAM, Packaging: Bulk Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz, 160MHz, 160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b SAR Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 1.32V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 |
auf Bestellung 553 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
MC34GD3000EP | NXP Semiconductors |
Description: GD3000 - Brushless DC Motor Gate Packaging: Bulk Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Controller - Commutation, Direction Management Interface: SPI Operating Temperature: -20°C ~ 105°C (TA) Output Configuration: Half Bridge (3) Voltage - Supply: 6V ~ 58V Applications: General Purpose Technology: Power MOSFET Voltage - Load: 6V ~ 58V Supplier Device Package: 56-QFN (8x8) Motor Type - Stepper: Multiphase Motor Type - AC, DC: Brushless DC (BLDC) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 208 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
BZX79-C36143 | NXP Semiconductors |
Description: NOW NEXPERIA BZX79-C36 - ZENER D Packaging: Bulk Part Status: Active Tolerance: ±5% Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 200°C (TJ) Voltage - Zener (Nom) (Vz): 36 V Impedance (Max) (Zzt): 90 Ohms Supplier Device Package: ALF2 Power - Max: 400 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V |
Produkt ist nicht verfügbar |
||||
KC912DG128CCPVE | NXP Semiconductors |
Description: MC912DG128CCPVE - Microcontrolle Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
||||
NT2H1611G0DA8J | NXP Semiconductors |
Description: NT2H1611G0DA8 - NTAG NFC Forum T Packaging: Bulk Package / Case: MOA8, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader/Transponder Operating Temperature: -25°C ~ 70°C (TA) Standards: ISO 14443, NFC Supplier Device Package: PLLMC Part Status: Active |
auf Bestellung 22951 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
LX2080XE72232B | NXP Semiconductors |
Description: IC MPU QORIQ LX 2.2GHZ 1517BGA Packaging: Bulk Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Speed: 2.2GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A72 Voltage - I/O: 1.2V, 1.8V, 3.3V Supplier Device Package: 1517-FCPBGA (40x40) Ethernet: 100Gbps (2) USB: USB 3.0 (2) + PHY (2) Number of Cores/Bus Width: 8 Core, 64-Bit RAM Controllers: DDR4 SDRAM Graphics Acceleration: Yes Security Features: Secure Boot, TrustZone® SATA: SATA 3.0 (4) Part Status: Active Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART |
auf Bestellung 744 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
LX2120SE72029B | NXP Semiconductors |
Description: IC MPU QORIQ LX 2GHZ 1517FCPBGA Packaging: Bulk Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Speed: 2GHz Operating Temperature: 0°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A72 Voltage - I/O: 1.2V, 1.8V, 3.3V Supplier Device Package: 1517-FCPBGA (40x40) Ethernet: 100Gbps (2) USB: USB 3.0 (2) + PHY (2) Number of Cores/Bus Width: 12 Core, 64-Bit RAM Controllers: DDR4 SDRAM Graphics Acceleration: Yes Security Features: Secure Boot, TrustZone® SATA: SATA 3.0 (4) Part Status: Active |
auf Bestellung 21 Stücke: Lieferzeit 21-28 Tag (e) |
|
|||
LX2160SC72232B | NXP Semiconductors |
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA Packaging: Bulk Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Speed: 2.2GHz Operating Temperature: 0°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A72 Voltage - I/O: 1.2V, 1.8V, 3.3V Supplier Device Package: 1517-FCPBGA (40x40) Ethernet: 100Gbps (2) USB: USB 3.0 (2) + PHY (2) Number of Cores/Bus Width: 16 Core, 64-Bit RAM Controllers: DDR4 SDRAM Graphics Acceleration: Yes Security Features: Secure Boot, TrustZone® SATA: SATA 3.0 (4) Part Status: Active |
auf Bestellung 17 Stücke: Lieferzeit 21-28 Tag (e) |
|
74LVC273DB,112 |
Hersteller: NXP Semiconductors
Description: NEXPERIA 74LVC273DB - D FLIP-FLO
Description: NEXPERIA 74LVC273DB - D FLIP-FLO
Produkt ist nicht verfügbar
HEF40098BT,653 |
Hersteller: NXP Semiconductors
Description: IC BUFFER INVERT 15V 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 15V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 10mA, 20mA
Supplier Device Package: 16-SO
Part Status: Active
Description: IC BUFFER INVERT 15V 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 15V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 10mA, 20mA
Supplier Device Package: 16-SO
Part Status: Active
Produkt ist nicht verfügbar
HEF40098BT,653 |
Hersteller: NXP Semiconductors
Description: IC BUFFER INVERT 15V 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 15V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 10mA, 20mA
Supplier Device Package: 16-SO
Part Status: Active
Description: IC BUFFER INVERT 15V 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 15V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 10mA, 20mA
Supplier Device Package: 16-SO
Part Status: Active
Produkt ist nicht verfügbar
HEF40098BT,652 |
Hersteller: NXP Semiconductors
Description: IC BUFFER INVERT 15V 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 15V
Number of Bits per Element: 2, 4
Current - Output High, Low: 10mA, 20mA
Supplier Device Package: 16-SO
Part Status: Obsolete
Description: IC BUFFER INVERT 15V 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 15V
Number of Bits per Element: 2, 4
Current - Output High, Low: 10mA, 20mA
Supplier Device Package: 16-SO
Part Status: Obsolete
auf Bestellung 2378 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
641+ | 1.22 EUR |
74AVC1T1022GUX |
Hersteller: NXP Semiconductors
Description: IC CLK BUFFER 1:4 10XQFN
Description: IC CLK BUFFER 1:4 10XQFN
auf Bestellung 15347 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2184+ | 0.33 EUR |
PDTC144TM,315 |
auf Bestellung 38937 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
11871+ | 0.072 EUR |
HVP-MC3PH598 |
Hersteller: NXP Semiconductors
Description: HIGH VOLTAGE MOTOR CONTROL PLATF
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: HIGH VOLTAGE MOTOR CONTROL PLATF
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BZB784-C2V7,115 |
Hersteller: NXP Semiconductors
Description: NEXPERIA BZB784-C2V7 - ZENER DIO
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-323
Part Status: Active
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Description: NEXPERIA BZB784-C2V7 - ZENER DIO
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-323
Part Status: Active
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
auf Bestellung 75000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
10452+ | 0.071 EUR |
NX5P1100UK,012 |
Hersteller: NXP Semiconductors
Description: LOGIC CONTROLLED HIGH-SIDE POWER
Packaging: Bulk
Part Status: Active
Description: LOGIC CONTROLLED HIGH-SIDE POWER
Packaging: Bulk
Part Status: Active
auf Bestellung 9000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
543+ | 1.34 EUR |
74LVC2G241GS,115 |
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-XSON (1.35x1)
Part Status: Active
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-XSON (1.35x1)
Part Status: Active
auf Bestellung 79800 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3727+ | 0.19 EUR |
BUK9880-55/CU135 |
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK9880-55 3.5A, 55V, 0
Packaging: Bulk
Part Status: Active
Description: NEXPERIA BUK9880-55 3.5A, 55V, 0
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MKW31Z256VHT4557 |
Hersteller: NXP Semiconductors
Description: KINETIS KW31Z - BLE 4.2 WIRELES
Packaging: Bulk
Package / Case: 64-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.2mA
Current - Transmitting: 6mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, GPIO, I²C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: KINETIS KW31Z - BLE 4.2 WIRELES
Packaging: Bulk
Package / Case: 64-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.2mA
Current - Transmitting: 6mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, GPIO, I²C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 260 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
49+ | 15.96 EUR |
TDZ5V6J/ZL,135 |
Hersteller: NXP Semiconductors
Description: NEXPERIA TDZ5V6J - ZENER DIODE,
Packaging: Bulk
Tolerance: ±2%
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOD-323F
Part Status: Active
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 10 µA @ 2.5 V
Grade: Automotive
Qualification: AEC-Q101
Description: NEXPERIA TDZ5V6J - ZENER DIODE,
Packaging: Bulk
Tolerance: ±2%
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOD-323F
Part Status: Active
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 10 µA @ 2.5 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 1080000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8876+ | 0.074 EUR |
74HCT139PW,118 |
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HCT139PW - DECODER/DR
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Active
Description: NEXPERIA 74HCT139PW - DECODER/DR
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Active
auf Bestellung 21581 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2275+ | 0.31 EUR |
74AVCH2T45GD,125 |
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AVCH2T45GD - BUS TRAN
Packaging: Bulk
Part Status: Active
Description: NEXPERIA 74AVCH2T45GD - BUS TRAN
Packaging: Bulk
Part Status: Active
auf Bestellung 157318 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1255+ | 0.59 EUR |
NZX16C,133 |
Hersteller: NXP Semiconductors
Description: NEXPERIA NZX16C - ZENER DIODE, 1
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: ALF2
Part Status: Active
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 11.2 V
Description: NEXPERIA NZX16C - ZENER DIODE, 1
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: ALF2
Part Status: Active
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 11.2 V
auf Bestellung 26160 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
15000+ | 0.049 EUR |
LPC2919FBD144/01/, |
Hersteller: NXP Semiconductors
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 88K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM968E-S
Data Converters: A/D 16x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 1.89V
Connectivity: CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 108
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 88K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM968E-S
Data Converters: A/D 16x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 1.89V
Connectivity: CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74AXP1G17GXH |
Hersteller: NXP Semiconductors
Description: IC BUFF NON-INVERT 2.75V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.7V ~ 2.75V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 5-X2SON (0.80x0.80)
Part Status: Active
Description: IC BUFF NON-INVERT 2.75V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.7V ~ 2.75V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 5-X2SON (0.80x0.80)
Part Status: Active
auf Bestellung 4500 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3082+ | 0.24 EUR |
PZU6.8B2L,315 |
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA PZU6.8B2L - ZENER D
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 500 nA @ 3.5 V
Description: NOW NEXPERIA PZU6.8B2L - ZENER D
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 500 nA @ 3.5 V
Produkt ist nicht verfügbar
PZU6.8B2L,315 |
Hersteller: NXP Semiconductors
Description: DIODE ZENER 6.8V 250MW DFN1006-2
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 500 nA @ 3.5 V
Description: DIODE ZENER 6.8V 250MW DFN1006-2
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 500 nA @ 3.5 V
Produkt ist nicht verfügbar
TIP42CTU-F129 |
Hersteller: NXP Semiconductors
Description: TIP42C - PNP Epitaxial Silicon T
Packaging: Bulk
Part Status: Obsolete
Description: TIP42C - PNP Epitaxial Silicon T
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
74LVC1G74GD,125 |
Hersteller: NXP Semiconductors
Description: IC FF D-TYPE SNGL 1BIT 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 200 MHz
Input Capacitance: 4 pF
Supplier Device Package: 8-XSON (2x3)
Max Propagation Delay @ V, Max CL: 4.1ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 1
Description: IC FF D-TYPE SNGL 1BIT 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 200 MHz
Input Capacitance: 4 pF
Supplier Device Package: 8-XSON (2x3)
Max Propagation Delay @ V, Max CL: 4.1ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 174594 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2049+ | 0.36 EUR |
74LVT16244BDL,118 |
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 3.6V 48SSOP
Packaging: Bulk
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-SSOP
Part Status: Active
Description: IC BUFFER NON-INVERT 3.6V 48SSOP
Packaging: Bulk
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-SSOP
Part Status: Active
auf Bestellung 10113 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
567+ | 1.29 EUR |
MPC8349VVAJDB |
Hersteller: NXP Semiconductors
Description: IC MPU MPC83XX 533MHZ 672TBGA
Packaging: Bulk
Package / Case: 672-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-TBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, UART
Part Status: Obsolete
Description: IC MPU MPC83XX 533MHZ 672TBGA
Packaging: Bulk
Package / Case: 672-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-TBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, UART
Part Status: Obsolete
auf Bestellung 24 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 378.52 EUR |
BC857BQAZ |
Hersteller: NXP Semiconductors
Description: NEXPERIA BC857 - 45 V, 100 MA PN
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1010D-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 280 mW
Qualification: AEC-Q101
Description: NEXPERIA BC857 - 45 V, 100 MA PN
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1010D-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 280 mW
Qualification: AEC-Q101
auf Bestellung 85000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
9947+ | 0.071 EUR |
74AUP1GU04GS,132 |
Hersteller: NXP Semiconductors
Description: NEXPERIA 74AUP1GU04GS - INVERTER
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 4.3ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
Description: NEXPERIA 74AUP1GU04GS - INVERTER
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 4.3ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
auf Bestellung 5000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1814+ | 0.44 EUR |
BLS7G2729L-350P,11 |
Hersteller: NXP Semiconductors
Description: BLS7G2729L-350P - Power LDMOS tr
Packaging: Bulk
Part Status: Active
Description: BLS7G2729L-350P - Power LDMOS tr
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
74ALVCH162245DGG,112 |
Hersteller: NXP Semiconductors
Description: NEXPERIA 74ALVCH162245DGG - BUS
Packaging: Bulk
Part Status: Active
Description: NEXPERIA 74ALVCH162245DGG - BUS
Packaging: Bulk
Part Status: Active
auf Bestellung 711 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
711+ | 1.11 EUR |
74AVC16245DGG-Q10J |
Hersteller: NXP Semiconductors
Description: IC TXRX NON-INVERT 3.6V 48TSSOP
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
Description: IC TXRX NON-INVERT 3.6V 48TSSOP
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
auf Bestellung 2267 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
304+ | 2.38 EUR |
HEF4521BT,652 |
Hersteller: NXP Semiconductors
Description: NEXPERIA HEF4521BT - BINARY COUN
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Divide-by-2
Reset: Asynchronous
Operating Temperature: -40°C ~ 85°C (TA)
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SO
Part Status: Active
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 35 MHz
Number of Bits per Element: 24
Description: NEXPERIA HEF4521BT - BINARY COUN
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Divide-by-2
Reset: Asynchronous
Operating Temperature: -40°C ~ 85°C (TA)
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SO
Part Status: Active
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 35 MHz
Number of Bits per Element: 24
auf Bestellung 8691 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
747+ | 0.96 EUR |
74HCT3G14DC,125 |
Hersteller: NXP Semiconductors
Description: NEXPERIA 74HCT3G14DC - INVERTER,
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 8-VSSOP
Input Logic Level - High: 1.9V ~ 2.1V
Input Logic Level - Low: 0.5V ~ 0.6V
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 1 µA
Description: NEXPERIA 74HCT3G14DC - INVERTER,
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 8-VSSOP
Input Logic Level - High: 1.9V ~ 2.1V
Input Logic Level - Low: 0.5V ~ 0.6V
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 1 µA
auf Bestellung 103002 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2173+ | 0.36 EUR |
PMV20EN215 |
Hersteller: NXP Semiconductors
Description: NEXPERIA PMV20EN - SMALL SIGNAL
Packaging: Bulk
Part Status: Active
Description: NEXPERIA PMV20EN - SMALL SIGNAL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
PCA9543BPW,118 |
Hersteller: NXP Semiconductors
Description: PCA9543BPW - 2-channel I2C-bus s
Packaging: Bulk
Part Status: Obsolete
Description: PCA9543BPW - 2-channel I2C-bus s
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
BUK7Y98-80E,115 |
Hersteller: NXP Semiconductors
Description: NEXPERIA BUK7Y98 - N-CHANNEL 80
Packaging: Bulk
Part Status: Active
Description: NEXPERIA BUK7Y98 - N-CHANNEL 80
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
S25FL064P0XMFV003 |
Hersteller: NXP Semiconductors
Description: S25FL064P - 64-Mbit 3.0 V Flash
Packaging: Bulk
Part Status: Active
Description: S25FL064P - 64-Mbit 3.0 V Flash
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MCF54450ACVM180 |
Hersteller: NXP Semiconductors
Description: MCF5445x - 32-bit MPU, ColdFire
Packaging: Bulk
Part Status: Active
Description: MCF5445x - 32-bit MPU, ColdFire
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
PZU9.1BL,315 |
Hersteller: NXP Semiconductors
Description: NEXPERIA PZU9.1BL - ZENER DIODE,
Packaging: Bulk
Tolerance: ±5%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Description: NEXPERIA PZU9.1BL - ZENER DIODE,
Packaging: Bulk
Tolerance: ±5%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
auf Bestellung 92499 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
12070+ | 0.048 EUR |
BZX884-B11,315 |
Hersteller: NXP Semiconductors
Description: NEXPERIA BZX884-B11 - ZENER DIOD
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Description: NEXPERIA BZX884-B11 - ZENER DIOD
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
auf Bestellung 70000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
11727+ | 0.072 EUR |
PZU3.6B2L,315 |
Hersteller: NXP Semiconductors
Description: NEXPERIA PZU3.6B2L - ZENER DIODE
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Description: NEXPERIA PZU3.6B2L - ZENER DIODE
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
auf Bestellung 20000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
10764+ | 0.078 EUR |
BZX884-B30,315 |
Hersteller: NXP Semiconductors
Description: NEXPERIA BZX884-B30 - ZENER DIOD
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 30 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 21 V
Description: NEXPERIA BZX884-B30 - ZENER DIOD
Packaging: Bulk
Tolerance: ±2%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 30 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 21 V
auf Bestellung 16905 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
11727+ | 0.072 EUR |
TDA18219HN/C1518 |
Hersteller: NXP Semiconductors
Description: TDA18SILICTUN40HVQFN
Packaging: Bulk
Part Status: Obsolete
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Standards: DTMB, DVB-C, DVB-T, ISDB-T
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I²C
Description: TDA18SILICTUN40HVQFN
Packaging: Bulk
Part Status: Obsolete
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Standards: DTMB, DVB-C, DVB-T, ISDB-T
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I²C
auf Bestellung 4000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
174+ | 4.1 EUR |
NXQ1TXH5/101118 |
Hersteller: NXP Semiconductors
Description: NXQ1TXH5 - One-chip 5 V Qi wirel
Packaging: Bulk
Part Status: Active
Description: NXQ1TXH5 - One-chip 5 V Qi wirel
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
PCA9663B/S911118 |
Hersteller: NXP Semiconductors
Description: PCA9663 - Parallel Bus to Three-
Packaging: Bulk
Part Status: Obsolete
Description: PCA9663 - Parallel Bus to Three-
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
MCIMX31LDVMN5DR2 |
Hersteller: NXP Semiconductors
Description: IC MPU I.MX31 532MHZ 473BGA
Packaging: Bulk
Part Status: Active
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2V, 2.5V, 2.7V, 3V
Supplier Device Package: 473-PBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
Description: IC MPU I.MX31 532MHZ 473BGA
Packaging: Bulk
Part Status: Active
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2V, 2.5V, 2.7V, 3V
Supplier Device Package: 473-PBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
auf Bestellung 5250 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
10+ | 78.17 EUR |
74HCT27PW,112 |
auf Bestellung 12686 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2329+ | 0.31 EUR |
LS1012AXN7KKB |
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ LS1 1GHZ 211FCLGA
Packaging: Bulk
Part Status: Active
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORLQ LS1 1GHZ 211FCLGA
Packaging: Bulk
Part Status: Active
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
auf Bestellung 336 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
11+ | 76.49 EUR |
74CBTLV3257D,118 |
Hersteller: NXP Semiconductors
Description: NEXPERIA 74CBTLV3257 - QUAD 1-OF
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 1:2
Type: Multiplexer/Demultiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Active
Description: NEXPERIA 74CBTLV3257 - QUAD 1-OF
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 1:2
Type: Multiplexer/Demultiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Active
auf Bestellung 2400 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2400+ | 0.42 EUR |
MCIMX6Q4AVT10AE |
Hersteller: NXP Semiconductors
Description: MCIMX6Q4AVT10AE - i.MX 6 series
Packaging: Bulk
Part Status: Active
Description: MCIMX6Q4AVT10AE - i.MX 6 series
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MCIMX6Q5EZK08AD |
Hersteller: NXP Semiconductors
Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Bulk
Part Status: Active
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Bulk
Part Status: Active
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 258 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 186.04 EUR |
74LVC3G17GN,115 |
Hersteller: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-XSON (1.2x1)
Part Status: Active
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-XSON (1.2x1)
Part Status: Active
auf Bestellung 78500 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1381+ | 0.54 EUR |
PCA9430HKZ |
Hersteller: NXP Semiconductors
Description: RF Evaluation/Development Kits
Packaging: Bulk
Part Status: Active
Description: RF Evaluation/Development Kits
Packaging: Bulk
Part Status: Active
auf Bestellung 34988 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
198+ | 3.7 EUR |
PMEG100T20ELPX |
Hersteller: NXP Semiconductors
Description: PMEG100T20ELP - 100 V, 2 A low l
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 12 ns
Technology: Schottky
Capacitance @ Vr, F: 200pF @ 1V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: SOD-128/CFP5
Operating Temperature - Junction: 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 2 A
Current - Reverse Leakage @ Vr: 1.25 µA @ 100 V
Description: PMEG100T20ELP - 100 V, 2 A low l
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 12 ns
Technology: Schottky
Capacitance @ Vr, F: 200pF @ 1V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: SOD-128/CFP5
Operating Temperature - Junction: 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 2 A
Current - Reverse Leakage @ Vr: 1.25 µA @ 100 V
auf Bestellung 7781 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3000+ | 0.26 EUR |
SPC5748GK0AMMJ6 |
Hersteller: NXP Semiconductors
Description: TRIPLE CORE, 6M FLASH, 768K RAM,
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 1.32V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
Description: TRIPLE CORE, 6M FLASH, 768K RAM,
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 1.32V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
auf Bestellung 553 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
7+ | 103.21 EUR |
MC34GD3000EP |
Hersteller: NXP Semiconductors
Description: GD3000 - Brushless DC Motor Gate
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: SPI
Operating Temperature: -20°C ~ 105°C (TA)
Output Configuration: Half Bridge (3)
Voltage - Supply: 6V ~ 58V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 6V ~ 58V
Supplier Device Package: 56-QFN (8x8)
Motor Type - Stepper: Multiphase
Motor Type - AC, DC: Brushless DC (BLDC)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: GD3000 - Brushless DC Motor Gate
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: SPI
Operating Temperature: -20°C ~ 105°C (TA)
Output Configuration: Half Bridge (3)
Voltage - Supply: 6V ~ 58V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 6V ~ 58V
Supplier Device Package: 56-QFN (8x8)
Motor Type - Stepper: Multiphase
Motor Type - AC, DC: Brushless DC (BLDC)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 208 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
93+ | 7.75 EUR |
BZX79-C36143 |
Hersteller: NXP Semiconductors
Description: NOW NEXPERIA BZX79-C36 - ZENER D
Packaging: Bulk
Part Status: Active
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Description: NOW NEXPERIA BZX79-C36 - ZENER D
Packaging: Bulk
Part Status: Active
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Produkt ist nicht verfügbar
KC912DG128CCPVE |
Hersteller: NXP Semiconductors
Description: MC912DG128CCPVE - Microcontrolle
Packaging: Bulk
Part Status: Active
Description: MC912DG128CCPVE - Microcontrolle
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
NT2H1611G0DA8J |
Hersteller: NXP Semiconductors
Description: NT2H1611G0DA8 - NTAG NFC Forum T
Packaging: Bulk
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: PLLMC
Part Status: Active
Description: NT2H1611G0DA8 - NTAG NFC Forum T
Packaging: Bulk
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: PLLMC
Part Status: Active
auf Bestellung 22951 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
713+ | 1.01 EUR |
LX2080XE72232B |
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ LX 2.2GHZ 1517BGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4 SDRAM
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Description: IC MPU QORIQ LX 2.2GHZ 1517BGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4 SDRAM
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
auf Bestellung 744 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 1517.96 EUR |
LX2120SE72029B |
Hersteller: NXP Semiconductors
Description: IC MPU QORIQ LX 2GHZ 1517FCPBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4 SDRAM
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
Description: IC MPU QORIQ LX 2GHZ 1517FCPBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4 SDRAM
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 1440.5 EUR |
LX2160SC72232B |
Hersteller: NXP Semiconductors
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4 SDRAM
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4 SDRAM
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
auf Bestellung 17 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 2033.59 EUR |