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P2010NXN2HHC P2010NXN2HHC NXP USA Inc. QP20XXFS.pdf Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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P2020NXN2HHC P2020NXN2HHC NXP USA Inc. QP20XXFS.pdf Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 36 Stücke
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P2020NXN2KHC P2020NXN2KHC NXP USA Inc. QP20XXFS.pdf Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 27 Stücke
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P1010NSN5DFA P1010NSN5DFA NXP USA Inc. QP1010FS.pdf Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1010NXE5DFA P1010NXE5DFA NXP USA Inc. QP1010FS.pdf Description: IC MPU Q OR IQ 1.0GHZ 425TEBGA
Produkt ist nicht verfügbar
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P1010NXE5HHA P1010NXE5HHA NXP USA Inc. QP1010FS.pdf Description: IC MPU Q OR IQ 1.0GHZ 425TEBGA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 77 Stücke
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P1014NSN5HHA P1014NSN5HHA NXP USA Inc. P1_Series_FS.pdf Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1014NXE5DFA P1014NXE5DFA NXP USA Inc. P1_Series_FS.pdf Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1014NXE5HFA P1014NXE5HFA NXP USA Inc. P1_Series_FS.pdf Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1014NXN5HHA P1014NXN5HHA NXP USA Inc. P1_Series_FS.pdf Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1013NSN2EFB P1013NSN2EFB NXP USA Inc. QP1022FS.pdf Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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P1013NSN2MHB P1013NSN2MHB NXP USA Inc. QP1022FS.pdf Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
 Mindestbestellmenge: 44 Stücke
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P1013NXE2EFB P1013NXE2EFB NXP USA Inc. QP1022FS.pdf Description: IC MPU Q OR IQ 1.055GHZ 689TBGA
Produkt ist nicht verfügbar
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P1013NXN2EFB P1013NXN2EFB NXP USA Inc. QP1022FS.pdf Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1013NXN2HFB P1013NXN2HFB NXP USA Inc. QP1022FS.pdf Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1022NSE2LFB P1022NSE2LFB NXP USA Inc. QP1022FS.pdf Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1022NSN2HFB P1022NSN2HFB NXP USA Inc. QP1022FS.pdf Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1022NSN2LFB P1022NSN2LFB NXP USA Inc. QP1022FS.pdf Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
1+209.3 EUR
10+176.86 EUR
27+168.17 EUR
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P1022NXE2EFB P1022NXE2EFB NXP USA Inc. QP1022FS.pdf Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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P1022NXN2EFB P1022NXN2EFB NXP USA Inc. QP1022FS.pdf Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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MCIMX534AVV8C MCIMX534AVV8C NXP USA Inc. IMX53AEC.pdf Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX535DVV1C MCIMX535DVV1C NXP USA Inc. IMX53CEC.pdf Description: IC MPU I.MX53 1.0GHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX536AVV8C MCIMX536AVV8C NXP USA Inc. IMX53AEC.pdf Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX537CVV8C MCIMX537CVV8C NXP USA Inc. IMX53IEC.pdf Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
 Mindestbestellmenge: 420 Stücke
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MCIMX53-START-R MCIMX53-START-R NXP USA Inc. IMX53RQKSTRTFS.pdf Description: I.MX53 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A8
Utilized IC / Part: i.MX53
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
1+536.15 EUR
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SC16C654BIA68,518 SC16C654BIA68,518 NXP USA Inc. SC16C654B_654DB.pdf Description: IC UART QUAD W/FIFO 68-PLCC
Packaging: Tape & Reel (TR)
Package / Case: 68-LCC (J-Lead)
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 68-PLCC (24.18x24.18)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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LPC2368FET100,518 LPC2368FET100,518 NXP USA Inc. LPC2364_65_66_67_68.pdf Description: IC MCU 16/32BIT 512KB 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 1100 Stücke:
Lieferzeit 10-14 Tag (e)
1+33.04 EUR
10+26.4 EUR
25+24.74 EUR
100+22.92 EUR
250+22.8 EUR
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TJA1081TS,118 TJA1081TS,118 NXP USA Inc. TJA1081.pdf Description: IC INTERFACE SPECIALIZED 16SSOP
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
Part Status: Active
auf Bestellung 10751 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.17 EUR
10+7.03 EUR
25+6.49 EUR
100+5.9 EUR
250+5.68 EUR
Mindestbestellmenge: 2 Stücke
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TJA1082TT,118 TJA1082TT,118 NXP USA Inc. TJA1082.pdf Description: IC INTERFACE SPECIALIZED 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 14-TSSOP
Grade: Automotive
Part Status: Active
auf Bestellung 4008 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.06 EUR
10+6.95 EUR
25+6.42 EUR
100+5.83 EUR
250+5.61 EUR
Mindestbestellmenge: 2 Stücke
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TDA8922BTH/N2,118 TDA8922BTH/N2,118 NXP USA Inc. TDA8922B.pdf Description: IC AMP D MONO/STEREO 88W 24HSOP
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 30V
Max Output Power x Channels @ Load: 88W x 1 @ 6Ohm; 50W x 2 @ 6Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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TFA9815T/N1,118 TFA9815T/N1,118 NXP USA Inc. TFA9815.pdf Description: IC AMP CLASS D STEREO 18W 32SO
Features: Differential Inputs, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 20V
Max Output Power x Channels @ Load: 18W x 2 @ 4Ohm
Supplier Device Package: 32-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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IP4284CZ10-TBR IP4284CZ10-TBR NXP USA Inc. IP4284CZ10-TBR%28TT%29.pdf Description: TVS DIODE 5.5VWM 9.5VC 10DFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-DFN (2.5x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V (Typ)
Power Line Protection: Yes
Produkt ist nicht verfügbar
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74ABT16374BDGG,118 74ABT16374BDGG,118 NXP USA Inc. 74ABT16374B_4.pdf Description: IC FF D-TYPE DUAL 8BIT 48TSSOP
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74ABT2244PW,118 74ABT2244PW,118 NXP USA Inc. 74ABT2244.pdf Description: IC BUF NON-INVERT 5.5V 20TSSOP
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74ABT2245PW,118 74ABT2245PW,118 NXP USA Inc. 74ABT2245.pdf Description: IC TXRX NON-INVERT 5.5V 20TSSOP
Supplier Device Package: 20-TSSOP
Current - Output High, Low: 32mA, 12mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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74HC258DB,118 74HC258DB,118 NXP USA Inc. 74HC258.pdf Description: IC MULTIPLEXER 4 X 2:1 16-SSOP
Part Status: Obsolete
Supplier Device Package: 16-SSOP
Voltage Supply Source: Single Supply
Current - Output High, Low: 7.8mA, 7.8mA
Independent Circuits: 1
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 4 x 2:1
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Cut Tape (CT)
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74HC564D,653 74HC564D,653 NXP USA Inc. 74HC564.pdf Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 28ns @ 6V, 50pF
Supplier Device Package: 20-SO
Input Capacitance: 3.5 pF
Clock Frequency: 137 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 7.8mA, 7.8mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
Number of Bits per Element: 8
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74HCT2G126DP,125 74HCT2G126DP,125 NXP USA Inc. 74HC%28T%292G126.pdf Description: IC BUF NON-INVERT 5.5V 8TSSOP
Part Status: Obsolete
Supplier Device Package: 8-TSSOP
Current - Output High, Low: 6mA, 6mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Cut Tape (CT)
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74LV139D,118 74LV139D,118 NXP USA Inc. 74LV139.pdf Description: IC DECODER/DEMUX 1 X 2:4 16SO
Part Status: Obsolete
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Current - Output High, Low: 12mA, 12mA
Independent Circuits: 2
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: Decoder/Demultiplexer
Circuit: 1 x 2:4
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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74LV273D,118 74LV273D,118 NXP USA Inc. 74LV273.pdf Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 160 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 100 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 16ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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74LV32PW,118 74LV32PW,118 NXP USA Inc. 74LV32.pdf Description: IC GATE OR 4CH 2-INP 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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74LV574DB,118 74LV574DB,118 NXP USA Inc. 74LV574.pdf Description: IC FF D-TYPE SNGL 8BIT 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 16mA, 16mA
Trigger Type: Positive Edge
Clock Frequency: 70 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Number of Bits per Element: 8
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74LVT273PW,118 74LVT273PW,118 NXP USA Inc. 74LVT273.pdf Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 4 pF
Clock Frequency: 150 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Current - Quiescent (Iq): 190 µA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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74LVT32PW,118 74LVT32PW,118 NXP USA Inc. 74LVT32.pdf Description: IC GATE OR 4CH 2-INP 14TSSOP
Number of Circuits: 4
Max Propagation Delay @ V, Max CL: 3.2ns @ 3.3V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 2
Current - Output High, Low: 20mA, 32mA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Logic Type: OR Gate
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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74LVTH574PW,118 74LVTH574PW,118 NXP USA Inc. 74LVT%28H%29574.pdf Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 4 pF
Clock Frequency: 150 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Current - Quiescent (Iq): 190 µA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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CBT16210DGG,118 CBT16210DGG,118 NXP USA Inc. CBT16210.pdf Description: IC BUS SWITCH 10 X 1:1 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 48-TSSOP
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I74F3037D,518 I74F3037D,518 NXP USA Inc. 74F3037.pdf Description: IC GATE NAND 4CH 2-INP 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 67mA, 160mA
Number of Inputs: 2
Supplier Device Package: 16-SO
Input Logic Level - High: 2.4V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Number of Circuits: 4
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NCX2220GM,125 NCX2220GM,125 NXP USA Inc. NCX2220.pdf Description: IC COMPARATOR 2 GEN PUR 8XQFNU
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XQFNU (1.6x1.6)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Active
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NX3L2G66GM,125 NX3L2G66GM,125 NXP USA Inc. NX3L2G66.pdf Description: IC SW SPST-NOX2 750MOHM 8XQFNU
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 23ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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BGU8007,115 BGU8007,115 NXP USA Inc. BGU8007.pdf Description: IC AMP GPS 1.559-1.61GHZ 6XSON
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Test Frequency: 1.575GHz
P1dB: -7dBm
Noise Figure: 1.1dB
Current - Supply: 11.9mA
Gain: 20.5dB
Voltage - Supply: 1.5V ~ 2.2V
RF Type: GPS/GNSS
Frequency: 1.559GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Tape & Reel (TR)
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BGU8007,115 BGU8007,115 NXP USA Inc. BGU8007.pdf Description: IC AMP GPS 1.559-1.61GHZ 6XSON
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Test Frequency: 1.575GHz
P1dB: -7dBm
Noise Figure: 1.1dB
Current - Supply: 11.9mA
Gain: 20.5dB
Voltage - Supply: 1.5V ~ 2.2V
RF Type: GPS/GNSS
Frequency: 1.559GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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3PHASELV-KIT 3PHASELV-KIT NXP USA Inc. Description: EVAL BD FOR MC56F8006 MC9S08MP16
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: MC56F8006, MC9S08MP16
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Primary Attributes: Motors (BLDC, PMSM)
Secondary Attributes: USB Interface(s)
Part Status: Active
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MAG3110FCR1 MAG3110FCR1 NXP USA Inc. MAG3110.pdf Description: SENSOR MR I2C 10DFN
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN
Output Type: I2C
Mounting Type: Surface Mount
Axis: X, Y, Z
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Technology: Magnetoresistive
Sensing Range: ±1mT
Current - Supply (Max): 900µA (Typ)
Supplier Device Package: 10-DFN (2x2)
Produkt ist nicht verfügbar
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MC33661PEF MC33661PEF NXP USA Inc. MC33661.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
Part Status: Obsolete
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MC33661PEFR2 MC33661PEFR2 NXP USA Inc. MC33661.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Part Status: Obsolete
Duplex: Half
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SOIC
Protocol: LINbus
Data Rate: 20kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 6V ~ 18V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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MC33662JEF MC33662JEF NXP USA Inc. MC33662.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Duplex: Half
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SOIC
Protocol: LINbus
Data Rate: 10kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 7V ~ 18V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Produkt ist nicht verfügbar
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MC33662LEF MC33662LEF NXP USA Inc. MC33662.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Duplex: Half
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SOIC
Protocol: LINbus
Data Rate: 20kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 7V ~ 18V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
auf Bestellung 2188 Stücke:
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10+2.4 EUR
98+1.96 EUR
196+1.87 EUR
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588+1.76 EUR
1078+1.72 EUR
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MC33662LEFR2 MC33662LEFR2 NXP USA Inc. MC33662.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Duplex: Half
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SOIC
Protocol: LINbus
Data Rate: 20kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 7V ~ 18V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33662SEF MC33662SEF NXP USA Inc. MC33662.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MC33662SEFR2 MC33662SEFR2 NXP USA Inc. MC33662.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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P2010NXN2HHC QP20XXFS.pdf
P2010NXN2HHC
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Part Status: Obsolete
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P2020NXN2HHC QP20XXFS.pdf
P2020NXN2HHC
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
Produkt ist nicht verfügbar
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P2020NXN2KHC QP20XXFS.pdf
P2020NXN2KHC
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
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P1010NSN5DFA QP1010FS.pdf
P1010NSN5DFA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
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P1010NXE5DFA QP1010FS.pdf
P1010NXE5DFA
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.0GHZ 425TEBGA
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P1010NXE5HHA QP1010FS.pdf
P1010NXE5HHA
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.0GHZ 425TEBGA
Produkt ist nicht verfügbar
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P1014NSN5HHA P1_Series_FS.pdf
P1014NSN5HHA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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P1014NXE5DFA P1_Series_FS.pdf
P1014NXE5DFA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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P1014NXE5HFA P1_Series_FS.pdf
P1014NXE5HFA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1014NXN5HHA P1_Series_FS.pdf
P1014NXN5HHA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1013NSN2EFB QP1022FS.pdf
P1013NSN2EFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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P1013NSN2MHB QP1022FS.pdf
P1013NSN2MHB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
Mindestbestellmenge: 44 Stücke
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P1013NXE2EFB QP1022FS.pdf
P1013NXE2EFB
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.055GHZ 689TBGA
Produkt ist nicht verfügbar
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P1013NXN2EFB QP1022FS.pdf
P1013NXN2EFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1013NXN2HFB QP1022FS.pdf
P1013NXN2HFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1022NSE2LFB QP1022FS.pdf
P1022NSE2LFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1022NSN2HFB QP1022FS.pdf
P1022NSN2HFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1022NSN2LFB QP1022FS.pdf
P1022NSN2LFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+209.3 EUR
10+176.86 EUR
27+168.17 EUR
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P1022NXE2EFB QP1022FS.pdf
P1022NXE2EFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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P1022NXN2EFB QP1022FS.pdf
P1022NXN2EFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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MCIMX534AVV8C IMX53AEC.pdf
MCIMX534AVV8C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX535DVV1C IMX53CEC.pdf
MCIMX535DVV1C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 1.0GHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX536AVV8C IMX53AEC.pdf
MCIMX536AVV8C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX537CVV8C IMX53IEC.pdf
MCIMX537CVV8C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
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MCIMX53-START-R IMX53RQKSTRTFS.pdf
MCIMX53-START-R
Hersteller: NXP USA Inc.
Description: I.MX53 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A8
Utilized IC / Part: i.MX53
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+536.15 EUR
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SC16C654BIA68,518 SC16C654B_654DB.pdf
SC16C654BIA68,518
Hersteller: NXP USA Inc.
Description: IC UART QUAD W/FIFO 68-PLCC
Packaging: Tape & Reel (TR)
Package / Case: 68-LCC (J-Lead)
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 68-PLCC (24.18x24.18)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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LPC2368FET100,518 LPC2364_65_66_67_68.pdf
LPC2368FET100,518
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 512KB 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 1100 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+33.04 EUR
10+26.4 EUR
25+24.74 EUR
100+22.92 EUR
250+22.8 EUR
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TJA1081TS,118 TJA1081.pdf
TJA1081TS,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 16SSOP
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
Part Status: Active
auf Bestellung 10751 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+9.17 EUR
10+7.03 EUR
25+6.49 EUR
100+5.9 EUR
250+5.68 EUR
Mindestbestellmenge: 2 Stücke
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TJA1082TT,118 TJA1082.pdf
TJA1082TT,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 14-TSSOP
Grade: Automotive
Part Status: Active
auf Bestellung 4008 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+9.06 EUR
10+6.95 EUR
25+6.42 EUR
100+5.83 EUR
250+5.61 EUR
Mindestbestellmenge: 2 Stücke
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TDA8922BTH/N2,118 TDA8922B.pdf
TDA8922BTH/N2,118
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 88W 24HSOP
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 30V
Max Output Power x Channels @ Load: 88W x 1 @ 6Ohm; 50W x 2 @ 6Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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TFA9815T/N1,118 TFA9815.pdf
TFA9815T/N1,118
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D STEREO 18W 32SO
Features: Differential Inputs, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 20V
Max Output Power x Channels @ Load: 18W x 2 @ 4Ohm
Supplier Device Package: 32-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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IP4284CZ10-TBR IP4284CZ10-TBR%28TT%29.pdf
IP4284CZ10-TBR
Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 9.5VC 10DFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-DFN (2.5x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V (Typ)
Power Line Protection: Yes
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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74ABT16374BDGG,118 74ABT16374B_4.pdf
74ABT16374BDGG,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 48TSSOP
Produkt ist nicht verfügbar
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74ABT2244PW,118 74ABT2244.pdf
74ABT2244PW,118
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 20TSSOP
Produkt ist nicht verfügbar
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74ABT2245PW,118 74ABT2245.pdf
74ABT2245PW,118
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 20TSSOP
Supplier Device Package: 20-TSSOP
Current - Output High, Low: 32mA, 12mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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74HC258DB,118 74HC258.pdf
74HC258DB,118
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16-SSOP
Part Status: Obsolete
Supplier Device Package: 16-SSOP
Voltage Supply Source: Single Supply
Current - Output High, Low: 7.8mA, 7.8mA
Independent Circuits: 1
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 4 x 2:1
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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74HC564D,653 74HC564.pdf
74HC564D,653
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 28ns @ 6V, 50pF
Supplier Device Package: 20-SO
Input Capacitance: 3.5 pF
Clock Frequency: 137 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 7.8mA, 7.8mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74HCT2G126DP,125 74HC%28T%292G126.pdf
74HCT2G126DP,125
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 8TSSOP
Part Status: Obsolete
Supplier Device Package: 8-TSSOP
Current - Output High, Low: 6mA, 6mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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74LV139D,118 74LV139.pdf
74LV139D,118
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 2:4 16SO
Part Status: Obsolete
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Current - Output High, Low: 12mA, 12mA
Independent Circuits: 2
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: Decoder/Demultiplexer
Circuit: 1 x 2:4
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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74LV273D,118 74LV273.pdf
74LV273D,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 160 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 100 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 16ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74LV32PW,118 74LV32.pdf
74LV32PW,118
Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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74LV574DB,118 74LV574.pdf
74LV574DB,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 16mA, 16mA
Trigger Type: Positive Edge
Clock Frequency: 70 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Number of Bits per Element: 8
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74LVT273PW,118 74LVT273.pdf
74LVT273PW,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 4 pF
Clock Frequency: 150 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Current - Quiescent (Iq): 190 µA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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74LVT32PW,118 74LVT32.pdf
74LVT32PW,118
Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14TSSOP
Number of Circuits: 4
Max Propagation Delay @ V, Max CL: 3.2ns @ 3.3V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 2
Current - Output High, Low: 20mA, 32mA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Logic Type: OR Gate
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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74LVTH574PW,118 74LVT%28H%29574.pdf
74LVTH574PW,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 4 pF
Clock Frequency: 150 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Current - Quiescent (Iq): 190 µA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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CBT16210DGG,118 CBT16210.pdf
CBT16210DGG,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 48-TSSOP
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I74F3037D,518 74F3037.pdf
I74F3037D,518
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 67mA, 160mA
Number of Inputs: 2
Supplier Device Package: 16-SO
Input Logic Level - High: 2.4V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Number of Circuits: 4
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NCX2220GM,125 NCX2220.pdf
NCX2220GM,125
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8XQFNU
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XQFNU (1.6x1.6)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Active
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NX3L2G66GM,125 NX3L2G66.pdf
NX3L2G66GM,125
Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX2 750MOHM 8XQFNU
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 23ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
Produkt ist nicht verfügbar
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BGU8007,115 BGU8007.pdf
BGU8007,115
Hersteller: NXP USA Inc.
Description: IC AMP GPS 1.559-1.61GHZ 6XSON
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Test Frequency: 1.575GHz
P1dB: -7dBm
Noise Figure: 1.1dB
Current - Supply: 11.9mA
Gain: 20.5dB
Voltage - Supply: 1.5V ~ 2.2V
RF Type: GPS/GNSS
Frequency: 1.559GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BGU8007,115 BGU8007.pdf
BGU8007,115
Hersteller: NXP USA Inc.
Description: IC AMP GPS 1.559-1.61GHZ 6XSON
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Test Frequency: 1.575GHz
P1dB: -7dBm
Noise Figure: 1.1dB
Current - Supply: 11.9mA
Gain: 20.5dB
Voltage - Supply: 1.5V ~ 2.2V
RF Type: GPS/GNSS
Frequency: 1.559GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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3PHASELV-KIT
3PHASELV-KIT
Hersteller: NXP USA Inc.
Description: EVAL BD FOR MC56F8006 MC9S08MP16
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: MC56F8006, MC9S08MP16
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Primary Attributes: Motors (BLDC, PMSM)
Secondary Attributes: USB Interface(s)
Part Status: Active
Produkt ist nicht verfügbar
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MAG3110FCR1 MAG3110.pdf
MAG3110FCR1
Hersteller: NXP USA Inc.
Description: SENSOR MR I2C 10DFN
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN
Output Type: I2C
Mounting Type: Surface Mount
Axis: X, Y, Z
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Technology: Magnetoresistive
Sensing Range: ±1mT
Current - Supply (Max): 900µA (Typ)
Supplier Device Package: 10-DFN (2x2)
Produkt ist nicht verfügbar
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MC33661PEF MC33661.pdf
MC33661PEF
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
Part Status: Obsolete
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MC33661PEFR2 MC33661.pdf
MC33661PEFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Part Status: Obsolete
Duplex: Half
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SOIC
Protocol: LINbus
Data Rate: 20kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 6V ~ 18V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33662JEF MC33662.pdf
MC33662JEF
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Duplex: Half
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SOIC
Protocol: LINbus
Data Rate: 10kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 7V ~ 18V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Produkt ist nicht verfügbar
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MC33662LEF MC33662.pdf
MC33662LEF
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Duplex: Half
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SOIC
Protocol: LINbus
Data Rate: 20kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 7V ~ 18V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
auf Bestellung 2188 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
6+3.24 EUR
10+2.4 EUR
98+1.96 EUR
196+1.87 EUR
294+1.83 EUR
588+1.76 EUR
1078+1.72 EUR
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MC33662LEFR2 MC33662.pdf
MC33662LEFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Duplex: Half
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SOIC
Protocol: LINbus
Data Rate: 20kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 7V ~ 18V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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MC33662SEF MC33662.pdf
MC33662SEF
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
Produkt ist nicht verfügbar
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MC33662SEFR2 MC33662.pdf
MC33662SEFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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