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MC33661PEFR2 MC33661PEFR2 NXP USA Inc. MC33661.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Part Status: Obsolete
Duplex: Half
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SOIC
Protocol: LINbus
Data Rate: 20kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 6V ~ 18V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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MC33662JEF MC33662JEF NXP USA Inc. MC33662.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Duplex: Half
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SOIC
Protocol: LINbus
Data Rate: 10kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 7V ~ 18V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Produkt ist nicht verfügbar
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MC33662LEF MC33662LEF NXP USA Inc. MC33662.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Duplex: Half
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SOIC
Protocol: LINbus
Data Rate: 20kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 7V ~ 18V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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MC33662LEFR2 MC33662LEFR2 NXP USA Inc. MC33662.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Duplex: Half
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SOIC
Protocol: LINbus
Data Rate: 20kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 7V ~ 18V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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MC33662SEF MC33662SEF NXP USA Inc. MC33662.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MC33662SEFR2 MC33662SEFR2 NXP USA Inc. MC33662.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
Produkt ist nicht verfügbar
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MC33742PEGR2 MC33742PEGR2 NXP USA Inc. Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 28-SOIC
Grade: Automotive
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MC33742SPEG MC33742SPEG NXP USA Inc. Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 28-SOIC
Grade: Automotive
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MC33742SPEGR2 MC33742SPEGR2 NXP USA Inc. Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 28-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
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MC33879APEK MC33879APEK NXP USA Inc. MC33879.pdf Description: IC PWR SWITCH N-CHAN 1:4 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side or Low Side
Rds On (Typ): 750mOhm
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): 3.1V ~ 5.5V
Current - Output (Max): 600mA
Ratio - Input:Output: 1:4
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Produkt ist nicht verfügbar
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MC33879APEKR2 MC33879APEKR2 NXP USA Inc. MC33879.pdf Description: IC PWR SWITCH N-CHAN 1:4 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side or Low Side
Rds On (Typ): 750mOhm
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): 3.1V ~ 5.5V
Current - Output (Max): 600mA
Ratio - Input:Output: 1:4
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33879TEKR2 MC33879TEKR2 NXP USA Inc. MC33879.pdf Description: IC SW SERIAL OCTAL 32SOIC
Produkt ist nicht verfügbar
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MC33882PEP MC33882PEP NXP USA Inc. MC33882.pdf Description: IC PWR SWITCH N-CHAN 1:1 32QFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI, Parallel
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 400mOhm
Voltage - Load: 8V ~ 25V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HVQFN (7x7)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Active
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MC33882PEPR2 MC33882PEPR2 NXP USA Inc. MC33882.pdf Description: IC PWR SWITCH N-CHAN 1:1 32QFN
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MC33882PVWR2 MC33882PVWR2 NXP USA Inc. MC33882.pdf Description: IC PWR SWITCH N-CHAN 1:1 30HSOP
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MC33886PVW MC33886PVW NXP USA Inc. MC33886.pdf Description: IC MOTOR DRIVER 5V-40V 20HSOP
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
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MC33886PVWR2 MC33886PVWR2 NXP USA Inc. MC33886.pdf Description: IC MOTOR DRIVER 5V-40V 20HSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
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MC33887APVW MC33887APVW NXP USA Inc. MC33887.pdf Description: IC MOTOR DRIVER 5V-28V 20HSOP
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
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MC33887APVWR2 MC33887APVWR2 NXP USA Inc. MC33887.pdf Description: IC MOTOR DRIVER 5V-28V 20HSOP
Applications: General Purpose
Voltage - Supply: 5V ~ 28V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Motor Type - AC, DC: Brushed DC
Supplier Device Package: 20-HSOP
Voltage - Load: 5V ~ 28V
Technology: Power MOSFET
Produkt ist nicht verfügbar
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MC33887PEK MC33887PEK NXP USA Inc. Description: IC MOTOR DRIVER 5V-28V 54SOIC
Motor Type - AC, DC: Brushed DC
Supplier Device Package: 54-SOIC-EP
Voltage - Load: 5V ~ 28V
Technology: Power MOSFET
Applications: General Purpose
Voltage - Supply: 5V ~ 28V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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MC33887PFK MC33887PFK NXP USA Inc. MC33887.pdf Description: IC MOTOR DRIVER 5V-28V 36PQFN
Part Status: Active
Motor Type - AC, DC: Brushed DC
Supplier Device Package: 36-PWR QFN (9x9)
Voltage - Load: 5V ~ 28V
Technology: Power MOSFET
Applications: General Purpose
Voltage - Supply: 5V ~ 28V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 36-PowerQFN
Packaging: Tray
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25+18.49 EUR
100+17.02 EUR
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MC33887PFKR2 MC33887PFKR2 NXP USA Inc. MC33887.pdf Description: IC MOTOR DRIVER 5V-28V 36PQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 36-PWR QFN (9x9)
Motor Type - AC, DC: Brushed DC
Produkt ist nicht verfügbar
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MC33981BHFKR2 MC33981BHFKR2 NXP USA Inc. MC33981.pdf Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: PWM
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 4mOhm
Voltage - Load: 6V ~ 27V
Current - Output (Max): 40A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33982CHFK MC33982CHFK NXP USA Inc. Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Features: Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 2mOhm
Voltage - Load: 6V ~ 27V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33984CHFK MC33984CHFK NXP USA Inc. MC33984.pdf Description: IC PWR SWITCH N-CHAN 1:2 16QFN
Features: Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 4mOhm (Max)
Voltage - Load: 6V ~ 27V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Ratio - Input:Output: 1:2
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33984CHFKR2 MC33984CHFKR2 NXP USA Inc. MC33984.pdf Description: IC PWR SWITCH N-CHAN 1:2 16QFN
Features: Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 4mOhm (Max)
Voltage - Load: 6V ~ 27V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Ratio - Input:Output: 1:2
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34708VK NXP USA Inc. MC34708.pdf Description: IC POWER MANAGEMENT 206MAPBGA
Packaging: Tray
Package / Case: 206-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.5V
Applications: General Purpose
Supplier Device Package: 206-MAPBGA (8x8)
Produkt ist nicht verfügbar
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MC34708VKR2 NXP USA Inc. MC34708.pdf Description: IC POWER MANAGEMENT 206MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 206-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.5V
Applications: General Purpose
Supplier Device Package: 206-MAPBGA (8x8)
Produkt ist nicht verfügbar
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MC34708VM MC34708VM NXP USA Inc. MC34708.pdf Description: IC POWER MANAGEMENT 206MAPBGA
Packaging: Tray
Package / Case: 206-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.5V
Applications: General Purpose
Supplier Device Package: 206-MAPBGA (13x13)
Part Status: Active
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10+23.66 EUR
25+22.1 EUR
100+20.38 EUR
250+19.58 EUR
800+18.8 EUR
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MC34708VMR2 MC34708VMR2 NXP USA Inc. MC34708.pdf Description: IC POWER MANAGEMENT 206MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 206-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.5V
Applications: General Purpose
Supplier Device Package: 206-MAPBGA (13x13)
Produkt ist nicht verfügbar
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MC56F8006VWLR MC56F8006VWLR NXP USA Inc. MC56F8006.pdf Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC56F8025MLD MC56F8025MLD NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
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MC56F8027VLHR MC56F8027VLHR NXP USA Inc. MC56F8037.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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MC56F8037VLHR MC56F8037VLHR NXP USA Inc. MC56F8037.pdf Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
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MC9RS08KA4CTGR MC9RS08KA4CTGR NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 126 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: RS08
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
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MC9S08AW32CFUER MC9S08AW32CFUER NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
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MC9S08JM60CLDR MC9S08JM60CLDR NXP USA Inc. MC9S08JM60.pdf Description: IC MCU 8BIT 60KB FLASH 44LQFP
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 33
Part Status: Active
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x12b
Core Processor: S08
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MC9S08SH32CWLR MC9S08SH32CWLR NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 32KB FLASH 28SOIC
DigiKey Programmable: Not Verified
Number of I/O: 23
Supplier Device Package: 28-SOIC
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC9S12DG128CPVER MC9S12DG128CPVER NXP USA Inc. MC9S12DP256.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Verified
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MC9S12P32MFT MC9S12P32MFT NXP USA Inc. MC9S12P128RMV1.pdf Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-TFQFN Exposed Pad
Produkt ist nicht verfügbar
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MC9S12XD128CAA MC9S12XD128CAA NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 80QFP
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MC9S12XEG128CALR MC9S12XEG128CALR NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 112LQFP
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MC9S12XEP100CVL MC9S12XEP100CVL NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 1MB FLASH 208MAPBGA
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MC9S12XS256CAE MC9S12XS256CAE NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MCF51JM128VLHR MCF51JM128VLHR NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
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MCIMX233CJM4CR2 MCIMX233CJM4CR2 NXP USA Inc. IMX233FS.pdf Description: IC MPU I.MX23 454MHZ 169MAPBGA
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Cryptography, Hardware ID
Display & Interface Controllers: LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Supplier Device Package: 169-MAPBGA (11x11)
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 169-LFBGA
Packaging: Tape & Reel (TR)
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MCIMX233DJM4CR2 MCIMX233DJM4CR2 NXP USA Inc. IMX233FS.pdf Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
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MCIMX280CVM4B MCIMX280CVM4B NXP USA Inc. IMX28CEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
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MCZ33903BS3EKR2 MCZ33903BS3EKR2 NXP USA Inc. MC33903,4,5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
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MCZ33905BD3EKR2 MCZ33905BD3EKR2 NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
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MCZ33905BD5EKR2 MCZ33905BD5EKR2 NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
Produkt ist nicht verfügbar
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MD7IC2250NBR1 MD7IC2250NBR1 NXP USA Inc. FSCLS05772-1.pdf?t.download=true&u=5oefqw Description: IC AMP W-CDMA 2GHZ-2.2GHZ TO272
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MD8IC970GNR1 NXP USA Inc. Description: IC AMP GPS 850MHZ-940MHZ TO270
Part Status: Obsolete
Supplier Device Package: TO-270 WBL-16 GULL
Test Frequency: 940MHz
Voltage - Supply: 32V
RF Type: General Purpose
Frequency: 850MHz ~ 940MHz
Mounting Type: Surface Mount
Package / Case: TO-270-16 Variant, Gull Wing
Packaging: Tape & Reel (TR)
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MD8IC970NR1 NXP USA Inc. Description: IC AMP GPS 850MHZ-940MHZ TO270
Part Status: Active
Supplier Device Package: TO-270 WBL-16
Test Frequency: 940MHz
Voltage - Supply: 32V
RF Type: General Purpose
Frequency: 850MHz ~ 940MHz
Mounting Type: Surface Mount
Package / Case: TO-270-16 Variant, Flat Leads
Packaging: Tape & Reel (TR)
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MK10DN512ZVLL10R MK10DN512ZVLL10R NXP USA Inc. K10P100M100SF2.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
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MK10DX256ZVLQ10R MK10DX256ZVLQ10R NXP USA Inc. K10_Sub-Family_K10P144M100SF2.pdf Description: IC MCU 32BIT 256KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 104
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 46x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
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MK30DN512ZVLQ10R MK30DN512ZVLQ10R NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 46x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 102
DigiKey Programmable: Not Verified
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MM908E621ACPEK NXP USA Inc. Description: IC QUAD HALF BRDG TRPL SW 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SCI, SPI
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 16V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Applications: Mirror Control
Core Processor: HC08
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
Number of I/O: 12
DigiKey Programmable: Not Verified
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MM908E621ACPEKR2 NXP USA Inc. MM908E621.pdf Description: IC QUAD HALF BRDG TRPL SW 54SOIC
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MM908E622ACPEKR2 MM908E622ACPEKR2 NXP USA Inc. MM908E622.pdf Description: IC QUAD HALF BRDG TRPL SW 54SOIC
Produkt ist nicht verfügbar
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MC33661PEFR2 MC33661.pdf
MC33661PEFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Part Status: Obsolete
Duplex: Half
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SOIC
Protocol: LINbus
Data Rate: 20kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 6V ~ 18V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33662JEF MC33662.pdf
MC33662JEF
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Duplex: Half
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SOIC
Protocol: LINbus
Data Rate: 10kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 7V ~ 18V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
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MC33662LEF MC33662.pdf
MC33662LEF
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Duplex: Half
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SOIC
Protocol: LINbus
Data Rate: 20kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 7V ~ 18V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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10+3.07 EUR
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196+2.4 EUR
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MC33662LEFR2 MC33662.pdf
MC33662LEFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Duplex: Half
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SOIC
Protocol: LINbus
Data Rate: 20kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 7V ~ 18V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33662SEF MC33662.pdf
MC33662SEF
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MC33662SEFR2 MC33662.pdf
MC33662SEFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 175 mV
Duplex: Half
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MC33742PEGR2
MC33742PEGR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 28-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
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MC33742SPEG
MC33742SPEG
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 28-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
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MC33742SPEGR2
MC33742SPEGR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 28-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
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MC33879APEK MC33879.pdf
MC33879APEK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:4 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side or Low Side
Rds On (Typ): 750mOhm
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): 3.1V ~ 5.5V
Current - Output (Max): 600mA
Ratio - Input:Output: 1:4
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
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MC33879APEKR2 MC33879.pdf
MC33879APEKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:4 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side or Low Side
Rds On (Typ): 750mOhm
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): 3.1V ~ 5.5V
Current - Output (Max): 600mA
Ratio - Input:Output: 1:4
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33879TEKR2 MC33879.pdf
MC33879TEKR2
Hersteller: NXP USA Inc.
Description: IC SW SERIAL OCTAL 32SOIC
Produkt ist nicht verfügbar
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MC33882PEP MC33882.pdf
MC33882PEP
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32QFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI, Parallel
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 400mOhm
Voltage - Load: 8V ~ 25V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HVQFN (7x7)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Active
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MC33882PEPR2 MC33882.pdf
MC33882PEPR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32QFN
Produkt ist nicht verfügbar
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MC33882PVWR2 MC33882.pdf
MC33882PVWR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 30HSOP
Produkt ist nicht verfügbar
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MC33886PVW MC33886.pdf
MC33886PVW
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-40V 20HSOP
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
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MC33886PVWR2 MC33886.pdf
MC33886PVWR2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-40V 20HSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
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750+11.17 EUR
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MC33887APVW MC33887.pdf
MC33887APVW
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 20HSOP
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
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MC33887APVWR2 MC33887.pdf
MC33887APVWR2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 20HSOP
Applications: General Purpose
Voltage - Supply: 5V ~ 28V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Motor Type - AC, DC: Brushed DC
Supplier Device Package: 20-HSOP
Voltage - Load: 5V ~ 28V
Technology: Power MOSFET
Produkt ist nicht verfügbar
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MC33887PEK
MC33887PEK
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 54SOIC
Motor Type - AC, DC: Brushed DC
Supplier Device Package: 54-SOIC-EP
Voltage - Load: 5V ~ 28V
Technology: Power MOSFET
Applications: General Purpose
Voltage - Supply: 5V ~ 28V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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MC33887PFK MC33887.pdf
MC33887PFK
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 36PQFN
Part Status: Active
Motor Type - AC, DC: Brushed DC
Supplier Device Package: 36-PWR QFN (9x9)
Voltage - Load: 5V ~ 28V
Technology: Power MOSFET
Applications: General Purpose
Voltage - Supply: 5V ~ 28V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 36-PowerQFN
Packaging: Tray
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1+25.19 EUR
10+19.83 EUR
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250+16.31 EUR
500+15.89 EUR
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MC33887PFKR2 MC33887.pdf
MC33887PFKR2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 36PQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 36-PWR QFN (9x9)
Motor Type - AC, DC: Brushed DC
Produkt ist nicht verfügbar
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MC33981BHFKR2 MC33981.pdf
MC33981BHFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: PWM
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 4mOhm
Voltage - Load: 6V ~ 27V
Current - Output (Max): 40A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33982CHFK
MC33982CHFK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Features: Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 2mOhm
Voltage - Load: 6V ~ 27V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33984CHFK MC33984.pdf
MC33984CHFK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:2 16QFN
Features: Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 4mOhm (Max)
Voltage - Load: 6V ~ 27V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Ratio - Input:Output: 1:2
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33984CHFKR2 MC33984.pdf
MC33984CHFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:2 16QFN
Features: Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 4mOhm (Max)
Voltage - Load: 6V ~ 27V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Ratio - Input:Output: 1:2
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34708VK MC34708.pdf
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 206MAPBGA
Packaging: Tray
Package / Case: 206-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.5V
Applications: General Purpose
Supplier Device Package: 206-MAPBGA (8x8)
Produkt ist nicht verfügbar
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MC34708VKR2 MC34708.pdf
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 206MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 206-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.5V
Applications: General Purpose
Supplier Device Package: 206-MAPBGA (8x8)
Produkt ist nicht verfügbar
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MC34708VM MC34708.pdf
MC34708VM
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 206MAPBGA
Packaging: Tray
Package / Case: 206-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.5V
Applications: General Purpose
Supplier Device Package: 206-MAPBGA (13x13)
Part Status: Active
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1+29.89 EUR
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25+22.1 EUR
100+20.38 EUR
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800+18.8 EUR
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MC34708VMR2 MC34708.pdf
MC34708VMR2
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 206MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 206-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.5V
Applications: General Purpose
Supplier Device Package: 206-MAPBGA (13x13)
Produkt ist nicht verfügbar
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MC56F8006VWLR MC56F8006.pdf
MC56F8006VWLR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC56F8025MLD
MC56F8025MLD
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC56F8027VLHR MC56F8037.pdf
MC56F8027VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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1500+16.92 EUR
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MC56F8037VLHR MC56F8037.pdf
MC56F8037VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
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1500+18.89 EUR
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MC9RS08KA4CTGR
MC9RS08KA4CTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 126 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: RS08
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
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MC9S08AW32CFUER
MC9S08AW32CFUER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC9S08JM60CLDR MC9S08JM60.pdf
MC9S08JM60CLDR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 33
Part Status: Active
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x12b
Core Processor: S08
Produkt ist nicht verfügbar
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MC9S08SH32CWLR MC9S08SH32.pdf
MC9S08SH32CWLR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28SOIC
DigiKey Programmable: Not Verified
Number of I/O: 23
Supplier Device Package: 28-SOIC
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC9S12DG128CPVER MC9S12DP256.pdf
MC9S12DG128CPVER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MC9S12P32MFT MC9S12P128RMV1.pdf
MC9S12P32MFT
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-TFQFN Exposed Pad
Produkt ist nicht verfügbar
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MC9S12XD128CAA
MC9S12XD128CAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Produkt ist nicht verfügbar
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MC9S12XEG128CALR
MC9S12XEG128CALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Produkt ist nicht verfügbar
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MC9S12XEP100CVL MC9S12XEPB.pdf
MC9S12XEP100CVL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 208MAPBGA
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MC9S12XS256CAE
MC9S12XS256CAE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MCF51JM128VLHR MCF51JM128.pdf
MCF51JM128VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
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MCIMX233CJM4CR2 IMX233FS.pdf
MCIMX233CJM4CR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Cryptography, Hardware ID
Display & Interface Controllers: LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Supplier Device Package: 169-MAPBGA (11x11)
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 169-LFBGA
Packaging: Tape & Reel (TR)
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MCIMX233DJM4CR2 IMX233FS.pdf
MCIMX233DJM4CR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
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MCIMX280CVM4B IMX28CEC.pdf
MCIMX280CVM4B
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
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1+44.64 EUR
10+35.81 EUR
25+33.61 EUR
100+31.19 EUR
250+30.04 EUR
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MCZ33903BS3EKR2 MC33903,4,5.pdf
MCZ33903BS3EKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
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MCZ33905BD3EKR2 MC33903%2C4%2C5.pdf
MCZ33905BD3EKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
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MCZ33905BD5EKR2 MC33903%2C4%2C5.pdf
MCZ33905BD5EKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
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MD7IC2250NBR1 FSCLS05772-1.pdf?t.download=true&u=5oefqw
MD7IC2250NBR1
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 2GHZ-2.2GHZ TO272
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MD8IC970GNR1
Hersteller: NXP USA Inc.
Description: IC AMP GPS 850MHZ-940MHZ TO270
Part Status: Obsolete
Supplier Device Package: TO-270 WBL-16 GULL
Test Frequency: 940MHz
Voltage - Supply: 32V
RF Type: General Purpose
Frequency: 850MHz ~ 940MHz
Mounting Type: Surface Mount
Package / Case: TO-270-16 Variant, Gull Wing
Packaging: Tape & Reel (TR)
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MD8IC970NR1
Hersteller: NXP USA Inc.
Description: IC AMP GPS 850MHZ-940MHZ TO270
Part Status: Active
Supplier Device Package: TO-270 WBL-16
Test Frequency: 940MHz
Voltage - Supply: 32V
RF Type: General Purpose
Frequency: 850MHz ~ 940MHz
Mounting Type: Surface Mount
Package / Case: TO-270-16 Variant, Flat Leads
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MK10DN512ZVLL10R K10P100M100SF2.pdf
MK10DN512ZVLL10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
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MK10DX256ZVLQ10R K10_Sub-Family_K10P144M100SF2.pdf
MK10DX256ZVLQ10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 104
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 46x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MK30DN512ZVLQ10R
MK30DN512ZVLQ10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 46x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 102
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MM908E621ACPEK
Hersteller: NXP USA Inc.
Description: IC QUAD HALF BRDG TRPL SW 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SCI, SPI
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 16V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Applications: Mirror Control
Core Processor: HC08
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
Number of I/O: 12
DigiKey Programmable: Not Verified
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MM908E621ACPEKR2 MM908E621.pdf
Hersteller: NXP USA Inc.
Description: IC QUAD HALF BRDG TRPL SW 54SOIC
Produkt ist nicht verfügbar
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MM908E622ACPEKR2 MM908E622.pdf
MM908E622ACPEKR2
Hersteller: NXP USA Inc.
Description: IC QUAD HALF BRDG TRPL SW 54SOIC
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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