Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35767) > Seite 198 nach 597
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
S9S12G96F0CLH | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 3K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
S9S12G96F0MLL | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 100LQFP |
auf Bestellung 450 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
S9S12GN16F0CLF | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 48LQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: 12V1 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
|
S9S12GN16F0VLF | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 48LQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: 12V1 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
S9S12GN32F0MFT | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 48QFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
S9S12GN32F0MLF | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 48LQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: 12V1 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
S9S12GN32F0VLF | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
S9S12XS128J1CALR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
SPC5534MVM80R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA Packaging: Tape & Reel (TR) Package / Case: 208-BGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1MB (1M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 34x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-BGA (17x17) Number of I/O: 192 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
SPC5606SF2VLU6 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 176LQFPPackaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 136 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
SPC5632MF1MLQ60 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 144LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
SPC5633MF1MLU60 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 176LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
SPC5634MF1MLQ60 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 94K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z3 Data Converters: A/D 32x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 80 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
SPC5634MF1MLU60 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 94K x 8 Operating Temperature: -40°C ~ 150°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z3 Data Converters: A/D 34x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 114 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
SPC5634MF1MLU80 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 94K x 8 Operating Temperature: -40°C ~ 150°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z3 Data Converters: A/D 34x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 114 DigiKey Programmable: Not Verified |
auf Bestellung 520 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
BGA2817,115 | NXP USA Inc. |
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOPPackaging: Tape & Reel (TR) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 0Hz ~ 2.2GHz RF Type: General Purpose Voltage - Supply: 3V ~ 3.6V Gain: 25.1dB Current - Supply: 20mA Noise Figure: 3.8dB P1dB: 5dBm Test Frequency: 2.15GHz Supplier Device Package: 6-TSSOP |
auf Bestellung 12000 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
BGA2817,115 | NXP USA Inc. |
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOPPackaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 0Hz ~ 2.2GHz RF Type: General Purpose Voltage - Supply: 3V ~ 3.6V Gain: 25.1dB Current - Supply: 20mA Noise Figure: 3.8dB P1dB: 5dBm Test Frequency: 2.15GHz Supplier Device Package: 6-TSSOP |
auf Bestellung 12462 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
LPC4330FBD144,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 204MHz RAM Size: 264K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 83 DigiKey Programmable: Not Verified |
auf Bestellung 193 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
LPC4330FET100,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100TFBGAPackaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 204MHz RAM Size: 264K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 4x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 49 DigiKey Programmable: Not Verified |
auf Bestellung 502 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
PTN3460BS/F2,518 | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 56HVQFNPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: LVDS Supplier Device Package: 56-HVQFN (7x7) Part Status: Active |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
PTN3460BS/F2,518 | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 56HVQFNPackaging: Cut Tape (CT) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: LVDS Supplier Device Package: 56-HVQFN (7x7) Part Status: Active |
auf Bestellung 5250 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
TDF8530TH/N1,518 | NXP USA Inc. |
Description: IC AMP CLASS D QUAD 100W 44HSOPFeatures: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby Packaging: Tape & Reel (TR) Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 6V ~ 24V Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm Supplier Device Package: 44-HSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
TDF8541TH/N2,518 | NXP USA Inc. |
Description: IC AMP CLASS AB QUAD 64W 36HSOPFeatures: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby Packaging: Tape & Reel (TR) Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm Supplier Device Package: 36-HSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
TDF8546TH/N1,518 | NXP USA Inc. |
Description: IC AMP CLASS AB QUAD 64W 36HSOPFeatures: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby Packaging: Tape & Reel (TR) Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class AB Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm Supplier Device Package: 36-HSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
TDF8599CTH/N1,118 | NXP USA Inc. |
Description: IC AMP D MONO/STEREO 300W 36HSOPFeatures: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby Packaging: Tape & Reel (TR) Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 8V ~ 48V Max Output Power x Channels @ Load: 300W x 1 @ 3Ohm; 155W x 2 @ 6Ohm Supplier Device Package: 36-HSOP Part Status: Active |
auf Bestellung 500 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
TDF8530TH/N1,512 | NXP USA Inc. |
Description: IC AMP CLASS D QUAD 100W 44HSOPFeatures: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby Packaging: Tube Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 6V ~ 24V Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm Supplier Device Package: 44-HSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
TDF8541J/N2,112 | NXP USA Inc. |
Description: IC AMP CLASS AB QUAD 64W DBS27PFeatures: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby Packaging: Tube Package / Case: 27-SIP, Formed Leads Output Type: 4-Channel (Quad) Mounting Type: Through Hole Type: Class AB Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm Supplier Device Package: DBS27P Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| TDF8541SD/N2,112 | NXP USA Inc. |
Description: IC AMP CLASS AB QUAD 64W 27RDBSFeatures: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby Packaging: Tube Package / Case: 27-SIP Formed Leads Output Type: 4-Channel (Quad) Mounting Type: Through Hole Type: Class AB Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm Supplier Device Package: 27-RDBS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
|
TDF8599CTH/N1,112 | NXP USA Inc. |
Description: IC AMP D MONO/STEREO 300W 36HSOP Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby Packaging: Tube Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 8V ~ 48V Max Output Power x Channels @ Load: 300W x 1 @ 3Ohm; 155W x 2 @ 6Ohm Supplier Device Package: 36-HSOP Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
TDF8530TH/N1,518 | NXP USA Inc. |
Description: IC AMP CLASS D QUAD 100W 44HSOPFeatures: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby Packaging: Cut Tape (CT) Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 6V ~ 24V Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm Supplier Device Package: 44-HSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
TDF8541TH/N2,518 | NXP USA Inc. |
Description: IC AMP CLASS AB QUAD 64W 36HSOPFeatures: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby Packaging: Cut Tape (CT) Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm Supplier Device Package: 36-HSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
TDF8546TH/N1,518 | NXP USA Inc. |
Description: IC AMP CLASS AB QUAD 64W 36HSOPFeatures: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby Packaging: Cut Tape (CT) Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class AB Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm Supplier Device Package: 36-HSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
TDF8599CTH/N1,118 | NXP USA Inc. |
Description: IC AMP D MONO/STEREO 300W 36HSOPFeatures: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby Packaging: Cut Tape (CT) Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 8V ~ 48V Max Output Power x Channels @ Load: 300W x 1 @ 3Ohm; 155W x 2 @ 6Ohm Supplier Device Package: 36-HSOP Part Status: Active |
auf Bestellung 500 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
MMA3202KEGR2 | NXP USA Inc. |
Description: ACCEL 112.5G/56.3G ANALOG 20SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
MMA3202KEGR2 | NXP USA Inc. |
Description: ACCEL 112.5G/56.3G ANALOG 20SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
|
OM13035,598 | NXP USA Inc. |
Description: LPCXPRESSO LPC111X EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0 Utilized IC / Part: LPC111x Platform: LPCXpresso™ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
OM7827/BFU6AND7XXK | NXP USA Inc. |
Description: KIT STARTER FOR BFU6X0F/BFU7X0FPackaging: Bulk For Use With/Related Products: BFU690F Type: Transistor Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
|
OM6297,598 | NXP USA Inc. |
Description: EVAL BOARD PCF2123 PCA2125 LM75BPackaging: Bulk Function: Real Time Clock (RTC) Type: Timing Utilized IC / Part: PCF2123, PCA2125, LM75B, P89LPC932A1 Supplied Contents: Board(s) Primary Attributes: Resolution - Sec, Minutes, Hours, Weekday, Day, Month, Year Embedded: Yes, MCU, 8-Bit Part Status: Obsolete Contents: Board(s) Secondary Attributes: SPI Interface(s) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
LPC1114FHI33/302,5 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFNPackaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 1380 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
PCF8885TS/1,118 | NXP USA Inc. |
Description: IC PROXIMITY SW 8CH CAP 28-TSSOPPackaging: Tape & Reel (TR) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad Mounting Type: Surface Mount Interface: I2C Type: Buttons Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.5V ~ 5.5V Current - Supply: 10µA Number of Inputs: 8 Supplier Device Package: 28-TSSOP Proximity Detection: Yes Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
PCA9629PW,118 | NXP USA Inc. |
Description: IC MTR DRVR BIPLR/UNIPLR 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Function: Controller - Commutation, Direction Management Interface: I²C Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: Pre-Driver - Half Bridge (4) Voltage - Supply: 4.5V ~ 5.5V Applications: General Purpose Technology: CMOS Supplier Device Package: 16-TSSOP Motor Type - Stepper: Bipolar, Unipolar Step Resolution: 1 ~ 1/128 Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
PCA9509AGM,125 | NXP USA Inc. |
Description: IC REDRIVER I2C 2CH 400KHZ 8XQFNPackaging: Tape & Reel (TR) Package / Case: 8-XFQFN Exposed Pad Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Applications: I2C Current - Supply: 5µA Data Rate (Max): 400kHz Supplier Device Package: 8-XQFN (1.6x1.6) Part Status: Obsolete Capacitance - Input: 2 pF |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
PCA9509ADP,118 | NXP USA Inc. |
Description: IC REDRIVER I2C 2CH 8TSSOPPackaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Applications: I2C Current - Supply: 5µA Data Rate (Max): 400kHz Supplier Device Package: 8-TSSOP Part Status: Obsolete Capacitance - Input: 2 pF |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
PCF8885TS/1,118 | NXP USA Inc. |
Description: IC PROXIMITY SW 8CH CAP 28-TSSOPPackaging: Cut Tape (CT) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad Mounting Type: Surface Mount Interface: I2C Type: Buttons Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.5V ~ 5.5V Current - Supply: 10µA Number of Inputs: 8 Supplier Device Package: 28-TSSOP Proximity Detection: Yes Part Status: Obsolete DigiKey Programmable: Not Verified |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
PCA9629PW,118 | NXP USA Inc. |
Description: IC MTR DRVR BIPLR/UNIPLR 16TSSOP Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Function: Controller - Commutation, Direction Management Interface: I²C Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: Pre-Driver - Half Bridge (4) Voltage - Supply: 4.5V ~ 5.5V Applications: General Purpose Technology: CMOS Supplier Device Package: 16-TSSOP Motor Type - Stepper: Bipolar, Unipolar Step Resolution: 1 ~ 1/128 Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
PCA9509ADP,118 | NXP USA Inc. |
Description: IC REDRIVER I2C 2CH 8TSSOPPackaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Applications: I2C Current - Supply: 5µA Data Rate (Max): 400kHz Supplier Device Package: 8-TSSOP Part Status: Obsolete Capacitance - Input: 2 pF |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
BGA7204,115 | NXP USA Inc. |
Description: IC AMP GP 400MHZ-2.75GHZ 32HVQFNPackaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 400MHz ~ 2.75GHz RF Type: General Purpose Voltage - Supply: 4.75V ~ 5.25V Gain: 16.5dB ~ 18.5dB Current - Supply: 115mA Noise Figure: 7dB P1dB: 20.5dBm Test Frequency: 2.1GHz Supplier Device Package: 32-HVQFN (5x5) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
BGA7204,115 | NXP USA Inc. |
Description: IC AMP GP 400MHZ-2.75GHZ 32HVQFNPackaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 400MHz ~ 2.75GHz RF Type: General Purpose Voltage - Supply: 4.75V ~ 5.25V Gain: 16.5dB ~ 18.5dB Current - Supply: 115mA Noise Figure: 7dB P1dB: 20.5dBm Test Frequency: 2.1GHz Supplier Device Package: 32-HVQFN (5x5) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
BGA7210,515 | NXP USA Inc. |
Description: IC AMP GPS 700MHZ-3.8GHZ 32HVQFNPackaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 700MHz ~ 3.8GHz RF Type: General Purpose Voltage - Supply: 4.75V ~ 5.25V Gain: 28dB Current - Supply: 195mA Noise Figure: 6.5dB ~ 8dB P1dB: 23dBm Test Frequency: 2.5GHz Supplier Device Package: 32-HVQFN (5x5) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
NX1117C33Z,115 | NXP USA Inc. |
Description: IC REG LINEAR 3.3V 1A SOT223Packaging: Cut Tape (CT) Package / Case: TO-261-4, TO-261AA Output Type: Fixed Mounting Type: Surface Mount Current - Output: 1A Operating Temperature: -40°C ~ 125°C Output Configuration: Positive Current - Quiescent (Iq): 6 mA Voltage - Input (Max): 20V Number of Regulators: 1 Supplier Device Package: SC-73 Voltage - Output (Min/Fixed): 3.3V Part Status: Obsolete PSRR: 62dB (120Hz) Voltage Dropout (Max): 1.2V @ 800mA Protection Features: Over Current, Over Temperature |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
NX1117C50Z,115 | NXP USA Inc. |
Description: IC REG LINEAR 5V 1A SOT223Packaging: Cut Tape (CT) Package / Case: TO-261-4, TO-261AA Output Type: Fixed Mounting Type: Surface Mount Current - Output: 1A Operating Temperature: -40°C ~ 125°C Output Configuration: Positive Current - Quiescent (Iq): 6 mA Voltage - Input (Max): 20V Number of Regulators: 1 Supplier Device Package: SC-73 Voltage - Output (Min/Fixed): 5V Part Status: Obsolete PSRR: 59dB (120Hz) Voltage Dropout (Max): 1.2V @ 800mA Protection Features: Over Current, Over Temperature |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
TWR-P1025 | NXP USA Inc. |
Description: TOWER SYSTEM P1025 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: e500 Utilized IC / Part: P1025 Platform: Tower System |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
TWR-MPC8309 | NXP USA Inc. |
Description: TOWER SYSTEM MPC8309 EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
TWR-K60F120M | NXP USA Inc. |
Description: TOWER SYSTEM K60 EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M4 Utilized IC / Part: K60 Platform: Tower System |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
TWR-K60F120M-KIT | NXP USA Inc. |
Description: TOWER SYSTEM K60 EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M4 Utilized IC / Part: K60 Platform: Tower System |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
TWR-K70F120M | NXP USA Inc. |
Description: TOWER SYSTEM K70 EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M4 Utilized IC / Part: K70 Platform: Tower System |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
TWR-K70F120M-KIT | NXP USA Inc. |
Description: TOWER SYSTEM K70 EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M4 Utilized IC / Part: K70 Platform: Tower System |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
TWR-S08DC-PT60 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08P EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s), Cable(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08P Platform: Tower System Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
TWR-S12G240 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S12G EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s), Cable(s) Core Processor: HCS12 Board Type: Evaluation Platform Utilized IC / Part: MC9S12G Platform: Tower System Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
TWR-S12G64 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S12G EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s), Cable(s) Core Processor: HCS12 Board Type: Evaluation Platform Utilized IC / Part: MC9S12G Platform: Tower System Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
|
| S9S12G96F0CLH |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12G96F0MLL |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 100LQFP
Description: IC MCU 16BIT 96KB FLASH 100LQFP
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| S9S12GN16F0CLF |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12GN16F0VLF |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12GN32F0MFT |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48QFN
Description: IC MCU 16BIT 32KB FLASH 48QFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12GN32F0MLF |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12GN32F0VLF |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12XS128J1CALR |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5534MVM80R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 192
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 192
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5606SF2VLU6 |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 136
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5632MF1MLQ60 |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5633MF1MLU60 |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5634MF1MLQ60 |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 80
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5634MF1MLU60 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 150°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 114
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 150°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 114
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5634MF1MLU80 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 150°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 114
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 150°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 114
DigiKey Programmable: Not Verified
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 51.76 EUR |
| 10+ | 41.51 EUR |
| 80+ | 35.45 EUR |
| 440+ | 34.98 EUR |
| BGA2817,115 |
![]() |
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 25.1dB
Current - Supply: 20mA
Noise Figure: 3.8dB
P1dB: 5dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 25.1dB
Current - Supply: 20mA
Noise Figure: 3.8dB
P1dB: 5dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3000+ | 0.29 EUR |
| 6000+ | 0.28 EUR |
| 9000+ | 0.27 EUR |
| BGA2817,115 |
![]() |
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 25.1dB
Current - Supply: 20mA
Noise Figure: 3.8dB
P1dB: 5dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 25.1dB
Current - Supply: 20mA
Noise Figure: 3.8dB
P1dB: 5dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
auf Bestellung 12462 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 36+ | 0.49 EUR |
| 42+ | 0.42 EUR |
| 45+ | 0.4 EUR |
| 100+ | 0.36 EUR |
| 250+ | 0.34 EUR |
| 500+ | 0.33 EUR |
| 1000+ | 0.31 EUR |
| LPC4330FBD144,551 |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 193 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 13.62 EUR |
| 10+ | 10.06 EUR |
| 60+ | 9.74 EUR |
| LPC4330FET100,551 |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 502 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 9.31 EUR |
| 10+ | 9.3 EUR |
| 25+ | 9.29 EUR |
| 100+ | 9.28 EUR |
| PTN3460BS/F2,518 |
![]() |
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2000+ | 3.38 EUR |
| PTN3460BS/F2,518 |
![]() |
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
auf Bestellung 5250 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 6.69 EUR |
| 10+ | 5.08 EUR |
| 25+ | 4.68 EUR |
| 100+ | 4.23 EUR |
| 250+ | 4.02 EUR |
| 500+ | 3.89 EUR |
| 1000+ | 3.79 EUR |
| TDF8530TH/N1,518 |
![]() |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D QUAD 100W 44HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
Part Status: Obsolete
Description: IC AMP CLASS D QUAD 100W 44HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDF8541TH/N2,518 |
![]() |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W 36HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
Description: IC AMP CLASS AB QUAD 64W 36HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDF8546TH/N1,518 |
![]() |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W 36HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
Description: IC AMP CLASS AB QUAD 64W 36HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDF8599CTH/N1,118 |
![]() |
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 300W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 48V
Max Output Power x Channels @ Load: 300W x 1 @ 3Ohm; 155W x 2 @ 6Ohm
Supplier Device Package: 36-HSOP
Part Status: Active
Description: IC AMP D MONO/STEREO 300W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 48V
Max Output Power x Channels @ Load: 300W x 1 @ 3Ohm; 155W x 2 @ 6Ohm
Supplier Device Package: 36-HSOP
Part Status: Active
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 500+ | 44.32 EUR |
| TDF8530TH/N1,512 |
![]() |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D QUAD 100W 44HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
Part Status: Obsolete
Description: IC AMP CLASS D QUAD 100W 44HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDF8541J/N2,112 |
![]() |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W DBS27P
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Description: IC AMP CLASS AB QUAD 64W DBS27P
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDF8541SD/N2,112 |
![]() |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W 27RDBS
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 27-SIP Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 27-RDBS
Description: IC AMP CLASS AB QUAD 64W 27RDBS
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 27-SIP Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 27-RDBS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDF8599CTH/N1,112 |
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 300W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 48V
Max Output Power x Channels @ Load: 300W x 1 @ 3Ohm; 155W x 2 @ 6Ohm
Supplier Device Package: 36-HSOP
Part Status: Active
Description: IC AMP D MONO/STEREO 300W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 48V
Max Output Power x Channels @ Load: 300W x 1 @ 3Ohm; 155W x 2 @ 6Ohm
Supplier Device Package: 36-HSOP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDF8530TH/N1,518 |
![]() |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D QUAD 100W 44HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
Part Status: Obsolete
Description: IC AMP CLASS D QUAD 100W 44HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDF8541TH/N2,518 |
![]() |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W 36HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
Description: IC AMP CLASS AB QUAD 64W 36HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDF8546TH/N1,518 |
![]() |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W 36HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
Description: IC AMP CLASS AB QUAD 64W 36HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDF8599CTH/N1,118 |
![]() |
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 300W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 48V
Max Output Power x Channels @ Load: 300W x 1 @ 3Ohm; 155W x 2 @ 6Ohm
Supplier Device Package: 36-HSOP
Part Status: Active
Description: IC AMP D MONO/STEREO 300W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 48V
Max Output Power x Channels @ Load: 300W x 1 @ 3Ohm; 155W x 2 @ 6Ohm
Supplier Device Package: 36-HSOP
Part Status: Active
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 65.24 EUR |
| 10+ | 49.64 EUR |
| 25+ | 45.64 EUR |
| 100+ | 41.19 EUR |
| 250+ | 40.9 EUR |
| MMA3202KEGR2 |
![]() |
Hersteller: NXP USA Inc.
Description: ACCEL 112.5G/56.3G ANALOG 20SOIC
Description: ACCEL 112.5G/56.3G ANALOG 20SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MMA3202KEGR2 |
![]() |
Hersteller: NXP USA Inc.
Description: ACCEL 112.5G/56.3G ANALOG 20SOIC
Description: ACCEL 112.5G/56.3G ANALOG 20SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| OM13035,598 |
![]() |
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC111X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC111x
Platform: LPCXpresso™
Description: LPCXPRESSO LPC111X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC111x
Platform: LPCXpresso™
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| OM7827/BFU6AND7XXK |
![]() |
Hersteller: NXP USA Inc.
Description: KIT STARTER FOR BFU6X0F/BFU7X0F
Packaging: Bulk
For Use With/Related Products: BFU690F
Type: Transistor
Supplied Contents: Board(s)
Description: KIT STARTER FOR BFU6X0F/BFU7X0F
Packaging: Bulk
For Use With/Related Products: BFU690F
Type: Transistor
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| OM6297,598 |
![]() |
Hersteller: NXP USA Inc.
Description: EVAL BOARD PCF2123 PCA2125 LM75B
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCF2123, PCA2125, LM75B, P89LPC932A1
Supplied Contents: Board(s)
Primary Attributes: Resolution - Sec, Minutes, Hours, Weekday, Day, Month, Year
Embedded: Yes, MCU, 8-Bit
Part Status: Obsolete
Contents: Board(s)
Secondary Attributes: SPI Interface(s)
Description: EVAL BOARD PCF2123 PCA2125 LM75B
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCF2123, PCA2125, LM75B, P89LPC932A1
Supplied Contents: Board(s)
Primary Attributes: Resolution - Sec, Minutes, Hours, Weekday, Day, Month, Year
Embedded: Yes, MCU, 8-Bit
Part Status: Obsolete
Contents: Board(s)
Secondary Attributes: SPI Interface(s)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC1114FHI33/302,5 |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1380 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 5.97 EUR |
| 10+ | 3.46 EUR |
| 25+ | 3.35 EUR |
| 100+ | 3.25 EUR |
| 490+ | 3.13 EUR |
| 980+ | 3.05 EUR |
| PCF8885TS/1,118 |
![]() |
Hersteller: NXP USA Inc.
Description: IC PROXIMITY SW 8CH CAP 28-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Current - Supply: 10µA
Number of Inputs: 8
Supplier Device Package: 28-TSSOP
Proximity Detection: Yes
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC PROXIMITY SW 8CH CAP 28-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Current - Supply: 10µA
Number of Inputs: 8
Supplier Device Package: 28-TSSOP
Proximity Detection: Yes
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9629PW,118 |
Hersteller: NXP USA Inc.
Description: IC MTR DRVR BIPLR/UNIPLR 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: I²C
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Pre-Driver - Half Bridge (4)
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Purpose
Technology: CMOS
Supplier Device Package: 16-TSSOP
Motor Type - Stepper: Bipolar, Unipolar
Step Resolution: 1 ~ 1/128
Part Status: Obsolete
Description: IC MTR DRVR BIPLR/UNIPLR 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: I²C
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Pre-Driver - Half Bridge (4)
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Purpose
Technology: CMOS
Supplier Device Package: 16-TSSOP
Motor Type - Stepper: Bipolar, Unipolar
Step Resolution: 1 ~ 1/128
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9509AGM,125 |
![]() |
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Obsolete
Capacitance - Input: 2 pF
Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Obsolete
Capacitance - Input: 2 pF
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9509ADP,118 |
![]() |
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 2 pF
Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 2 pF
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCF8885TS/1,118 |
![]() |
Hersteller: NXP USA Inc.
Description: IC PROXIMITY SW 8CH CAP 28-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Current - Supply: 10µA
Number of Inputs: 8
Supplier Device Package: 28-TSSOP
Proximity Detection: Yes
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC PROXIMITY SW 8CH CAP 28-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Current - Supply: 10µA
Number of Inputs: 8
Supplier Device Package: 28-TSSOP
Proximity Detection: Yes
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 5.32 EUR |
| 5+ | 4.61 EUR |
| 10+ | 4.36 EUR |
| PCA9629PW,118 |
Hersteller: NXP USA Inc.
Description: IC MTR DRVR BIPLR/UNIPLR 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: I²C
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Pre-Driver - Half Bridge (4)
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Purpose
Technology: CMOS
Supplier Device Package: 16-TSSOP
Motor Type - Stepper: Bipolar, Unipolar
Step Resolution: 1 ~ 1/128
Part Status: Obsolete
Description: IC MTR DRVR BIPLR/UNIPLR 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: I²C
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Pre-Driver - Half Bridge (4)
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Purpose
Technology: CMOS
Supplier Device Package: 16-TSSOP
Motor Type - Stepper: Bipolar, Unipolar
Step Resolution: 1 ~ 1/128
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9509ADP,118 |
![]() |
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 2 pF
Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 2 pF
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BGA7204,115 |
![]() |
Hersteller: NXP USA Inc.
Description: IC AMP GP 400MHZ-2.75GHZ 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.75GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 16.5dB ~ 18.5dB
Current - Supply: 115mA
Noise Figure: 7dB
P1dB: 20.5dBm
Test Frequency: 2.1GHz
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
Description: IC AMP GP 400MHZ-2.75GHZ 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.75GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 16.5dB ~ 18.5dB
Current - Supply: 115mA
Noise Figure: 7dB
P1dB: 20.5dBm
Test Frequency: 2.1GHz
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BGA7204,115 |
![]() |
Hersteller: NXP USA Inc.
Description: IC AMP GP 400MHZ-2.75GHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.75GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 16.5dB ~ 18.5dB
Current - Supply: 115mA
Noise Figure: 7dB
P1dB: 20.5dBm
Test Frequency: 2.1GHz
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
Description: IC AMP GP 400MHZ-2.75GHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.75GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 16.5dB ~ 18.5dB
Current - Supply: 115mA
Noise Figure: 7dB
P1dB: 20.5dBm
Test Frequency: 2.1GHz
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BGA7210,515 |
![]() |
Hersteller: NXP USA Inc.
Description: IC AMP GPS 700MHZ-3.8GHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 700MHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 28dB
Current - Supply: 195mA
Noise Figure: 6.5dB ~ 8dB
P1dB: 23dBm
Test Frequency: 2.5GHz
Supplier Device Package: 32-HVQFN (5x5)
Description: IC AMP GPS 700MHZ-3.8GHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 700MHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 28dB
Current - Supply: 195mA
Noise Figure: 6.5dB ~ 8dB
P1dB: 23dBm
Test Frequency: 2.5GHz
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NX1117C33Z,115 |
![]() |
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.3V 1A SOT223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 6 mA
Voltage - Input (Max): 20V
Number of Regulators: 1
Supplier Device Package: SC-73
Voltage - Output (Min/Fixed): 3.3V
Part Status: Obsolete
PSRR: 62dB (120Hz)
Voltage Dropout (Max): 1.2V @ 800mA
Protection Features: Over Current, Over Temperature
Description: IC REG LINEAR 3.3V 1A SOT223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 6 mA
Voltage - Input (Max): 20V
Number of Regulators: 1
Supplier Device Package: SC-73
Voltage - Output (Min/Fixed): 3.3V
Part Status: Obsolete
PSRR: 62dB (120Hz)
Voltage Dropout (Max): 1.2V @ 800mA
Protection Features: Over Current, Over Temperature
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NX1117C50Z,115 |
![]() |
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 5V 1A SOT223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 6 mA
Voltage - Input (Max): 20V
Number of Regulators: 1
Supplier Device Package: SC-73
Voltage - Output (Min/Fixed): 5V
Part Status: Obsolete
PSRR: 59dB (120Hz)
Voltage Dropout (Max): 1.2V @ 800mA
Protection Features: Over Current, Over Temperature
Description: IC REG LINEAR 5V 1A SOT223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 6 mA
Voltage - Input (Max): 20V
Number of Regulators: 1
Supplier Device Package: SC-73
Voltage - Output (Min/Fixed): 5V
Part Status: Obsolete
PSRR: 59dB (120Hz)
Voltage Dropout (Max): 1.2V @ 800mA
Protection Features: Over Current, Over Temperature
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-P1025 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM P1025 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e500
Utilized IC / Part: P1025
Platform: Tower System
Description: TOWER SYSTEM P1025 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e500
Utilized IC / Part: P1025
Platform: Tower System
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-MPC8309 |
![]() |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MPC8309 EVAL BRD
Description: TOWER SYSTEM MPC8309 EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-K60F120M |
![]() |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K60 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K60
Platform: Tower System
Description: TOWER SYSTEM K60 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K60
Platform: Tower System
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 255.75 EUR |
| TWR-K60F120M-KIT |
![]() |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K60 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K60
Platform: Tower System
Description: TOWER SYSTEM K60 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K60
Platform: Tower System
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-K70F120M |
![]() |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K70 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K70
Platform: Tower System
Description: TOWER SYSTEM K70 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K70
Platform: Tower System
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-K70F120M-KIT |
![]() |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K70 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K70
Platform: Tower System
Description: TOWER SYSTEM K70 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K70
Platform: Tower System
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-S08DC-PT60 |
![]() |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08P EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08P
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9S08P EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08P
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-S12G240 |
![]() |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S12G EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12G
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9S12G EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12G
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-S12G64 |
![]() |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S12G EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12G
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9S12G EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12G
Platform: Tower System
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 496 EUR |






































