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LPC11U34FBD48/311, LPC11U34FBD48/311, NXP USA Inc. LPC11U3x.pdf Description: IC MCU 32BIT 40KB FLASH 48LQFP
Program Memory Size: 40KB (40K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
DigiKey Programmable: Not Verified
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LPC11U34FHN33/311, LPC11U34FHN33/311, NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 40KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 40KB (40K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
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LPC11U35FBD48/401, LPC11U35FBD48/401, NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC11U35FHI33/501, LPC11U35FHI33/501, NXP USA Inc. LPC11U3X.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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100+7.59 EUR
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LPC11U36FBD48/401, LPC11U36FBD48/401, NXP USA Inc. LPC11U3x.pdf Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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LPC11U37FBD48/401, LPC11U37FBD48/401, NXP USA Inc. LPC11U3X.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
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LPC1315FBD48,551 LPC1315FBD48,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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100+6.03 EUR
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LPC1316FBD48,551 LPC1316FBD48,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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LPC1317FBD48,551 LPC1317FBD48,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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LPC1345FBD48,151 LPC1345FBD48,151 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 10K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
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LPC1347FBD48,151 LPC1347FBD48,151 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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LPC1317FBD64,551 LPC1317FBD64,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 10K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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LPC1347FBD64,551 LPC1347FBD64,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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LPC1316FHN33,551 LPC1316FHN33,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 48KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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LPC1317FHN33,551 LPC1317FHN33,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Number of I/O: 26
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 10K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Packaging: Tray
Part Status: Active
Package / Case: 32-VQFN Exposed Pad
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LPC1347FHN33,551 LPC1347FHN33,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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100+9.28 EUR
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TWR-K60D100M TWR-K60D100M NXP USA Inc. TWR-K60D100MQSG.pdf Description: TOWER SYSTEM K60 EVAL BRD
Platform: Tower System
Utilized IC / Part: K60
Core Processor: ARM® Cortex®-M4
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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LPC4357FET256,551 LPC4357FET256,551 NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 256LBGA
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 164
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Produkt ist nicht verfügbar
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OM13039,598 OM13039,598 NXP USA Inc. OM13039_Web.pdf Description: LPC1857 EVAL BRD
Produkt ist nicht verfügbar
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OM13040,598 OM13040,598 NXP USA Inc. OM13040_Web.pdf Description: LPC4357 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC4357
Part Status: Active
Produkt ist nicht verfügbar
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MK10DN512ZVLK10R MK10DN512ZVLK10R NXP USA Inc. K10P81M100SF2.pdf Description: IC MCU 32BIT 512KB FLASH 80FQFP
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MK50DX256ZCLQ10 MK50DX256ZCLQ10 NXP USA Inc. K50PB.pdf Description: IC MCU 32BIT 256KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 96
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 41x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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MK51DN512ZCLL10 MK51DN512ZCLL10 NXP USA Inc. KNTSK50FMLYFS.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Connectivity: I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 35x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08PA32VLH MC9S08PA32VLH NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 700 Stücke:
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4+6.97 EUR
10+5.45 EUR
160+4.47 EUR
480+4.38 EUR
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MC9S08PA60VLH MC9S08PA60VLH NXP USA Inc. MC9S08PA60_Rev1.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Number of I/O: 57
Part Status: Not For New Designs
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AFT05MS031NR1 AFT05MS031NR1 NXP USA Inc. AFT05MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Current - Test: 10 mA
Voltage - Test: 13.6 V
Voltage - Rated: 40 V
Part Status: Active
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 17.7dB
Power - Output: 31W
Frequency: 520MHz
Mounting Type: Surface Mount
Package / Case: TO-270AA
Packaging: Tape & Reel (TR)
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AFT09MS031NR1 AFT09MS031NR1 NXP USA Inc. AFT09MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
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P1022NXN2LFB P1022NXN2LFB NXP USA Inc. QP1022FS.pdf Description: IC MPU QORIQ P1 1.067GHZ PBGA689
SATA: SATA 3Gbps (2)
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 1.067GHz
Mounting Type: Surface Mount
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MK10DN512ZVLK10R MK10DN512ZVLK10R NXP USA Inc. K10P81M100SF2.pdf Description: IC MCU 32BIT 512KB FLASH 80FQFP
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AFT05MS031NR1 AFT05MS031NR1 NXP USA Inc. AFT05MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Current - Test: 10 mA
Voltage - Test: 13.6 V
Voltage - Rated: 40 V
Part Status: Active
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 17.7dB
Power - Output: 31W
Frequency: 520MHz
Mounting Type: Surface Mount
Package / Case: TO-270AA
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AFT09MS031NR1 AFT09MS031NR1 NXP USA Inc. AFT09MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
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MK20DN512ZVLK10 MK20DN512ZVLK10 NXP USA Inc. K20P81M100SF2.pdf Description: IC MCU 32BIT 512KB FLASH 80FQFP
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Not For New Designs
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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MK10DX128VFM5 MK10DX128VFM5 NXP USA Inc. K10P32M50SF0.pdf Description: IC MCU 32BIT 128KB FLASH 32QFN
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Number of I/O: 24
Part Status: Active
Supplier Device Package: 32-QFN-EP (5x5)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
DigiKey Programmable: Not Verified
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MK20DX128VFM5 MK20DX128VFM5 NXP USA Inc. K20P32M50SF0.pdf Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 6x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 20
DigiKey Programmable: Not Verified
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MK20DX128VMP5 MK20DX128VMP5 NXP USA Inc. K20P64M50SF0.pdf Description: IC MCU 32BIT 128KB FLSH 64MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 64-MAPBGA (5x5)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x16b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Packaging: Tray
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MK20DX128VLH5 MK20DX128VLH5 NXP USA Inc. K20P64M50SF0.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 13x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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MK20DX128VLF5 MK20DX128VLF5 NXP USA Inc. K20P48M50SF0.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 11x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Verified
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TWR-K40D100M TWR-K40D100M NXP USA Inc. K40D100MQSG.pdf Description: TOWER SYSTEM K40 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: K40
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M4
Contents: Board(s), Cable(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
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TWR-K20D72M TWR-K20D72M NXP USA Inc. Description: TOWER SYSTEM K20 EVAL BRD
Platform: Tower System
Utilized IC / Part: K20
Core Processor: ARM® Cortex®-M4
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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SSL21151T/1,118 NXP USA Inc. SSL2115x.pdf Description: IC LED DRIVER RGLTR 700MA 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 700mA (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-SOIC
Voltage - Supply (Max): 35V
Part Status: Discontinued at Digi-Key
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SSL21153T/1,118 NXP USA Inc. SSL2115x.pdf Description: IC LED DRIVER RGLTR 1.5A 7SOIC
Voltage - Supply (Max): 35V
Supplier Device Package: 7-SOIC
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Internal Switch(s): Yes
Current - Output / Channel: 1.5A (Switch)
Operating Temperature: -40°C ~ 85°C (TA)
Type: DC DC Regulator
Frequency: 50.5kHz
Number of Outputs: 1
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Packaging: Tape & Reel (TR)
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SSL2109T/1,118 SSL2109T/1,118 NXP USA Inc. SSL2109T.pdf Description: IC LED DRIVER OFFL SWITCHER 8SO
Voltage - Supply (Max): 16V
Voltage - Supply (Min): 8V
Supplier Device Package: 8-SO
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Internal Switch(s): No
Operating Temperature: -40°C ~ 125°C (TA)
Type: AC DC Offline Switcher
Number of Outputs: 1
Mounting Type: Surface Mount
Voltage - Output: 600V
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MW7IC2020NT1 MW7IC2020NT1 NXP USA Inc. MW7IC2020N.pdf Description: RF MOSFET LDMOS 28V 24PQFN
Current - Test: 40 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Active
Supplier Device Package: 24-PQFN (8x8)
Technology: LDMOS
Gain: 32.6dB
Power - Output: 2.4W
Frequency: 2.14GHz
Mounting Type: Surface Mount
Package / Case: 24-PowerQFN
Packaging: Tape & Reel (TR)
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MW7IC2020NT1 MW7IC2020NT1 NXP USA Inc. MW7IC2020N.pdf Description: RF MOSFET LDMOS 28V 24PQFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 2.4W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 40 mA
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MPXH6300AC6T1 MPXH6300AC6T1 NXP USA Inc. MPXH6300A.pdf Description: SENSOR 44.09PSIA 0.13" 4.9V SSOP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.9 V
Operating Pressure: 2.9PSI ~ 44.09PSI (20kPa ~ 304kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.74V ~ 5.46V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 174.05PSI (1200kPa)
Part Status: Active
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MC13783VK5R2 MC13783VK5R2 NXP USA Inc. MC13783.pdf Description: IC PWR MNGMNT ATLAS 3G 247MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 247-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Handheld/Mobile Devices
Supplier Device Package: 247-MAPBGA (10x10)
Produkt ist nicht verfügbar
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MC33886PVWR2 MC33886PVWR2 NXP USA Inc. MC33886.pdf Description: IC MOTOR DRIVER 5V-40V 20HSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
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MC33887APVWR2 MC33887APVWR2 NXP USA Inc. MC33887.pdf Description: IC MOTOR DRIVER 5V-28V 20HSOP
Part Status: Active
Motor Type - AC, DC: Brushed DC
Supplier Device Package: 20-HSOP
Voltage - Load: 5V ~ 28V
Technology: Power MOSFET
Applications: General Purpose
Voltage - Supply: 5V ~ 28V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Packaging: Cut Tape (CT)
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MC33926PNBR2 MC33926PNBR2 NXP USA Inc. MC33926.pdf Description: IC MOTOR DRIVER 5V-28V 32PQFN
Packaging: Cut Tape (CT)
Package / Case: 32-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-PQFN (8x8)
Motor Type - AC, DC: Brushed DC
Part Status: Active
Grade: Automotive
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MC33972ATEWR2 MC33972ATEWR2 NXP USA Inc. MC33972.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Part Status: Active
Supplier Device Package: 32-SOIC
Applications: Switch Monitoring
Voltage - Supply: 3.1V ~ 5.25V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
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MC9RS08KA2CSCR MC9RS08KA2CSCR NXP USA Inc. MC9RS08KA2.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
DigiKey Programmable: Verified
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, WDT
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Core Processor: RS08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 63 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 10MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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MC9S08QD4CSCR MC9S08QD4CSCR NXP USA Inc. MC9S08QD4_Fact_Sheet.pdf Description: IC MCU 8BIT 4KB FLASH 8SOIC
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Verified
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MC9S08SH8CTJR MC9S08SH8CTJR NXP USA Inc. MC9S08SH8.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MRF1535NT1 MRF1535NT1 NXP USA Inc. MRF1535N.pdf Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272AA
Current Rating (Amps): 6A
Mounting Type: Chassis Mount
Frequency: 520MHz
Power - Output: 35W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA
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MRF1550NT1 MRF1550NT1 NXP USA Inc. MRF1550%28F%29NT1.pdf Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272AA
Current Rating (Amps): 12A
Mounting Type: Chassis Mount
Frequency: 175MHz
Power - Output: 50W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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MRF1570FNT1 MRF1570FNT1 NXP USA Inc. MRF1570(F)NT1.pdf Description: RF MOSFET LDMOS 12.5V TO272-8
Packaging: Cut Tape (CT)
Package / Case: TO-272-8
Mounting Type: Chassis Mount
Frequency: 470MHz
Power - Output: 70W
Gain: 11.5dB
Technology: LDMOS
Supplier Device Package: TO-272-8
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
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MRF6S18060NR1 MRF6S18060NR1 NXP USA Inc. MRF6S18060NR1%2CNBR1.pdf Description: RF MOSFET LDMOS 26V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 1.99GHz
Power - Output: 60W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 600 mA
Produkt ist nicht verfügbar
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MRF6S20010GNR1 MRF6S20010GNR1 NXP USA Inc. MRF6S20010N.pdf Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA
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MRF6S21050LR3 MRF6S21050LR3 NXP USA Inc. MRF6S21050L.pdf Description: FET RF 68V 2.16GHZ NI-400
Produkt ist nicht verfügbar
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MRF6V12250HR5 MRF6V12250HR5 NXP USA Inc. MRF6V12250H.pdf Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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LPC11U34FBD48/311, LPC11U3x.pdf
LPC11U34FBD48/311,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 40KB FLASH 48LQFP
Program Memory Size: 40KB (40K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
DigiKey Programmable: Not Verified
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LPC11U34FHN33/311, LPC11U6X.pdf
LPC11U34FHN33/311,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 40KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 40KB (40K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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LPC11U35FBD48/401, LPC11U6X.pdf
LPC11U35FBD48/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC11U35FHI33/501, LPC11U3X.pdf
LPC11U35FHI33/501,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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LPC11U36FBD48/401, LPC11U3x.pdf
LPC11U36FBD48/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 249 Stücke:
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LPC11U37FBD48/401, LPC11U3X.pdf
LPC11U37FBD48/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
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LPC1315FBD48,551 LPC1315_16_17_45_46_47.pdf
LPC1315FBD48,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 2589 Stücke:
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3+10.28 EUR
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LPC1316FBD48,551 LPC1315_16_17_45_46_47.pdf
LPC1316FBD48,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1317FBD48,551 LPC1315_16_17_45_46_47.pdf
LPC1317FBD48,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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LPC1345FBD48,151 LPC1315_16_17_45_46_47.pdf
LPC1345FBD48,151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 10K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
auf Bestellung 148 Stücke:
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2+13.86 EUR
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LPC1347FBD48,151 LPC1315_16_17_45_46_47.pdf
LPC1347FBD48,151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 772 Stücke:
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2+13.42 EUR
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100+8.2 EUR
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500+8.01 EUR
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LPC1317FBD64,551 LPC1315_16_17_45_46_47.pdf
LPC1317FBD64,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 10K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 99 Stücke:
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2+12.4 EUR
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LPC1347FBD64,551 LPC1315_16_17_45_46_47.pdf
LPC1347FBD64,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 140 Stücke:
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2+10.91 EUR
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LPC1316FHN33,551 LPC1315_16_17_45_46_47.pdf
LPC1316FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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LPC1317FHN33,551 LPC1315_16_17_45_46_47.pdf
LPC1317FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Number of I/O: 26
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 10K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Packaging: Tray
Part Status: Active
Package / Case: 32-VQFN Exposed Pad
auf Bestellung 231 Stücke:
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2+11.54 EUR
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LPC1347FHN33,551 LPC1315_16_17_45_46_47.pdf
LPC1347FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 268 Stücke:
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2+14.2 EUR
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TWR-K60D100M TWR-K60D100MQSG.pdf
TWR-K60D100M
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K60 EVAL BRD
Platform: Tower System
Utilized IC / Part: K60
Core Processor: ARM® Cortex®-M4
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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LPC4357FET256,551 LPC435X_3X_2X_1X.pdf
LPC4357FET256,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 164
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Produkt ist nicht verfügbar
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OM13039,598 OM13039_Web.pdf
OM13039,598
Hersteller: NXP USA Inc.
Description: LPC1857 EVAL BRD
Produkt ist nicht verfügbar
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OM13040,598 OM13040_Web.pdf
OM13040,598
Hersteller: NXP USA Inc.
Description: LPC4357 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC4357
Part Status: Active
Produkt ist nicht verfügbar
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MK10DN512ZVLK10R K10P81M100SF2.pdf
MK10DN512ZVLK10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Produkt ist nicht verfügbar
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MK50DX256ZCLQ10 K50PB.pdf
MK50DX256ZCLQ10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 96
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 41x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MK51DN512ZCLL10 KNTSK50FMLYFS.pdf
MK51DN512ZCLL10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Connectivity: I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 35x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08PA32VLH
MC9S08PA32VLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MC9S08PA60VLH MC9S08PA60_Rev1.pdf
MC9S08PA60VLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Number of I/O: 57
Part Status: Not For New Designs
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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AFT05MS031NR1 AFT05MS031N.pdf
AFT05MS031NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Current - Test: 10 mA
Voltage - Test: 13.6 V
Voltage - Rated: 40 V
Part Status: Active
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 17.7dB
Power - Output: 31W
Frequency: 520MHz
Mounting Type: Surface Mount
Package / Case: TO-270AA
Packaging: Tape & Reel (TR)
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AFT09MS031NR1 AFT09MS031N.pdf
AFT09MS031NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
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P1022NXN2LFB QP1022FS.pdf
P1022NXN2LFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.067GHZ PBGA689
SATA: SATA 3Gbps (2)
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 1.067GHz
Mounting Type: Surface Mount
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MK10DN512ZVLK10R K10P81M100SF2.pdf
MK10DN512ZVLK10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Produkt ist nicht verfügbar
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AFT05MS031NR1 AFT05MS031N.pdf
AFT05MS031NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Current - Test: 10 mA
Voltage - Test: 13.6 V
Voltage - Rated: 40 V
Part Status: Active
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 17.7dB
Power - Output: 31W
Frequency: 520MHz
Mounting Type: Surface Mount
Package / Case: TO-270AA
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AFT09MS031NR1 AFT09MS031N.pdf
AFT09MS031NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
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MK20DN512ZVLK10 K20P81M100SF2.pdf
MK20DN512ZVLK10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Not For New Designs
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MK10DX128VFM5 K10P32M50SF0.pdf
MK10DX128VFM5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Number of I/O: 24
Part Status: Active
Supplier Device Package: 32-QFN-EP (5x5)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
DigiKey Programmable: Not Verified
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MK20DX128VFM5 K20P32M50SF0.pdf
MK20DX128VFM5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 6x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 20
DigiKey Programmable: Not Verified
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MK20DX128VMP5 K20P64M50SF0.pdf
MK20DX128VMP5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 64MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 64-MAPBGA (5x5)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x16b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Packaging: Tray
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MK20DX128VLH5 K20P64M50SF0.pdf
MK20DX128VLH5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 13x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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MK20DX128VLF5 K20P48M50SF0.pdf
MK20DX128VLF5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 11x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Verified
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TWR-K40D100M K40D100MQSG.pdf
TWR-K40D100M
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K40 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: K40
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M4
Contents: Board(s), Cable(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
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TWR-K20D72M
TWR-K20D72M
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K20 EVAL BRD
Platform: Tower System
Utilized IC / Part: K20
Core Processor: ARM® Cortex®-M4
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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SSL21151T/1,118 SSL2115x.pdf
Hersteller: NXP USA Inc.
Description: IC LED DRIVER RGLTR 700MA 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 700mA (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-SOIC
Voltage - Supply (Max): 35V
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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SSL21153T/1,118 SSL2115x.pdf
Hersteller: NXP USA Inc.
Description: IC LED DRIVER RGLTR 1.5A 7SOIC
Voltage - Supply (Max): 35V
Supplier Device Package: 7-SOIC
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Internal Switch(s): Yes
Current - Output / Channel: 1.5A (Switch)
Operating Temperature: -40°C ~ 85°C (TA)
Type: DC DC Regulator
Frequency: 50.5kHz
Number of Outputs: 1
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SSL2109T/1,118 SSL2109T.pdf
SSL2109T/1,118
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 8SO
Voltage - Supply (Max): 16V
Voltage - Supply (Min): 8V
Supplier Device Package: 8-SO
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Internal Switch(s): No
Operating Temperature: -40°C ~ 125°C (TA)
Type: AC DC Offline Switcher
Number of Outputs: 1
Mounting Type: Surface Mount
Voltage - Output: 600V
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MW7IC2020NT1 MW7IC2020N.pdf
MW7IC2020NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V 24PQFN
Current - Test: 40 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Active
Supplier Device Package: 24-PQFN (8x8)
Technology: LDMOS
Gain: 32.6dB
Power - Output: 2.4W
Frequency: 2.14GHz
Mounting Type: Surface Mount
Package / Case: 24-PowerQFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MW7IC2020NT1 MW7IC2020N.pdf
MW7IC2020NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V 24PQFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 2.4W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 40 mA
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MPXH6300AC6T1 MPXH6300A.pdf
MPXH6300AC6T1
Hersteller: NXP USA Inc.
Description: SENSOR 44.09PSIA 0.13" 4.9V SSOP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.9 V
Operating Pressure: 2.9PSI ~ 44.09PSI (20kPa ~ 304kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.74V ~ 5.46V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 174.05PSI (1200kPa)
Part Status: Active
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MC13783VK5R2 MC13783.pdf
MC13783VK5R2
Hersteller: NXP USA Inc.
Description: IC PWR MNGMNT ATLAS 3G 247MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 247-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Handheld/Mobile Devices
Supplier Device Package: 247-MAPBGA (10x10)
Produkt ist nicht verfügbar
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MC33886PVWR2 MC33886.pdf
MC33886PVWR2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-40V 20HSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
auf Bestellung 4577 Stücke:
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2+18.33 EUR
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MC33887APVWR2 MC33887.pdf
MC33887APVWR2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 20HSOP
Part Status: Active
Motor Type - AC, DC: Brushed DC
Supplier Device Package: 20-HSOP
Voltage - Load: 5V ~ 28V
Technology: Power MOSFET
Applications: General Purpose
Voltage - Supply: 5V ~ 28V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Packaging: Cut Tape (CT)
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MC33926PNBR2 MC33926.pdf
MC33926PNBR2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 32PQFN
Packaging: Cut Tape (CT)
Package / Case: 32-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-PQFN (8x8)
Motor Type - AC, DC: Brushed DC
Part Status: Active
Grade: Automotive
auf Bestellung 431 Stücke:
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2+15.98 EUR
10+12.41 EUR
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MC33972ATEWR2 MC33972.pdf
MC33972ATEWR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Part Status: Active
Supplier Device Package: 32-SOIC
Applications: Switch Monitoring
Voltage - Supply: 3.1V ~ 5.25V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+11.88 EUR
10+9.12 EUR
25+8.43 EUR
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MC9RS08KA2CSCR MC9RS08KA2.pdf
MC9RS08KA2CSCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
DigiKey Programmable: Verified
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, WDT
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Core Processor: RS08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 63 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 10MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 2321 Stücke:
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6+3.53 EUR
10+2.59 EUR
25+2.36 EUR
100+2.09 EUR
250+1.98 EUR
500+1.9 EUR
1000+1.84 EUR
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MC9S08QD4CSCR MC9S08QD4_Fact_Sheet.pdf
MC9S08QD4CSCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Verified
auf Bestellung 6914 Stücke:
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4+6.2 EUR
10+4.64 EUR
25+4.25 EUR
100+3.82 EUR
250+3.62 EUR
500+3.5 EUR
1000+3.4 EUR
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MC9S08SH8CTJR MC9S08SH8.pdf
MC9S08SH8CTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MRF1535NT1 MRF1535N.pdf
MRF1535NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272AA
Current Rating (Amps): 6A
Mounting Type: Chassis Mount
Frequency: 520MHz
Power - Output: 35W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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MRF1550NT1 MRF1550%28F%29NT1.pdf
MRF1550NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272AA
Current Rating (Amps): 12A
Mounting Type: Chassis Mount
Frequency: 175MHz
Power - Output: 50W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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MRF1570FNT1 MRF1570(F)NT1.pdf
MRF1570FNT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO272-8
Packaging: Cut Tape (CT)
Package / Case: TO-272-8
Mounting Type: Chassis Mount
Frequency: 470MHz
Power - Output: 70W
Gain: 11.5dB
Technology: LDMOS
Supplier Device Package: TO-272-8
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
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MRF6S18060NR1 MRF6S18060NR1%2CNBR1.pdf
MRF6S18060NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 1.99GHz
Power - Output: 60W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 600 mA
Produkt ist nicht verfügbar
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MRF6S20010GNR1 MRF6S20010N.pdf
MRF6S20010GNR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA
auf Bestellung 157 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+99.65 EUR
10+81.79 EUR
25+77.33 EUR
100+72.44 EUR
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MRF6S21050LR3 MRF6S21050L.pdf
MRF6S21050LR3
Hersteller: NXP USA Inc.
Description: FET RF 68V 2.16GHZ NI-400
Produkt ist nicht verfügbar
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MRF6V12250HR5 MRF6V12250H.pdf
MRF6V12250HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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