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PCF8577CU/F3,026 NXP USA Inc. PCF8577C_Rev2014.pdf Description: IC LCD DIRECT/DUPLEX DRIVER DIE
Packaging: Tray
Produkt ist nicht verfügbar
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PESD5V0L1USF-H250, PESD5V0L1USF-H250, NXP USA Inc. PESD5V0L1USF.pdf Description: TVS DIODE 5VWM 10.5VC 2DSN
Power Line Protection: No
Power - Peak Pulse: 11W
Voltage - Clamping (Max) @ Ipp: 10.5V
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 1
Supplier Device Package: DSN0603-2
Voltage - Reverse Standoff (Typ): 5V (Max)
Current - Peak Pulse (10/1000µs): 1.2A (8/20µs)
Capacitance @ Frequency: 12pF @ 1MHz
Applications: General Purpose
Operating Temperature: -55°C ~ 150°C (TA)
Type: Zener
Mounting Type: Surface Mount
Package / Case: 2-XFDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PH5030ALS,115 NXP USA Inc. Description: MOSFET N-CH 30V TRENCH LFPACK
Part Status: Obsolete
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PH7030ALS,115 NXP USA Inc. Description: MOSFET N-CH 30V TRENCH LFPACK
Part Status: Obsolete
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PMF63UN,115 PMF63UN,115 NXP USA Inc. PMF63UN.pdf Description: MOSFET N-CH 20V 1.8A SOT323-3
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 185 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 3.3 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Supplier Device Package: SC-70
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 275mW (Ta), 1.785W (Tc)
Rds On (Max) @ Id, Vgs: 74mOhm @ 1.8A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
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PMG45UN,115 PMG45UN,115 NXP USA Inc. PMG45UN_Rev_Nov_2012.pdf Description: MOSFET N-CH 20V 3A SOT363
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PMV65UN,215 PMV65UN,215 NXP USA Inc. PMV65UN_Rev_Nov_2012.pdf Description: MOSFET N-CH 20V 2.2A TO236AB
Input Capacitance (Ciss) (Max) @ Vds: 183 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 3.9 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Part Status: Obsolete
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Tape & Reel (TR)
Supplier Device Package: SOT-23 (TO-236AB)
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 310mW (Ta), 2.17W (Tc)
Rds On (Max) @ Id, Vgs: 76mOhm @ 2A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 2.2A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
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PMV90EN,215 PMV90EN,215 NXP USA Inc. PMV90EN.pdf Description: MOSFET N-CH 30V 1.9A TO236AB
Rds On (Max) @ Id, Vgs: 84mOhm @ 1.9A, 10V
Current - Continuous Drain (Id) @ 25°C: 1.9A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 132 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 4 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: SOT-23 (TO-236AB)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 310mW (Ta), 2.09W (Tc)
Produkt ist nicht verfügbar
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SA616BS,115 SA616BS,115 NXP USA Inc. SA616.pdf Description: IC MIXER FM IF SYSTEM LV 20HVQFN
Noise Figure: 6.8dB
Secondary Attributes: With Amplifier
Current - Supply: 3.5mA
Gain: 17dB
Voltage - Supply: 2.7V ~ 7V
RF Type: General Purpose
Frequency: 150MHz
Mounting Type: Surface Mount
Package / Case: 20-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 20-HVQFN (4x4)
Number of Mixers: 2
Produkt ist nicht verfügbar
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SL2ICS5401EW/V7,00 NXP USA Inc. SL113730.pdf Description: IC I-CODE SLI SMART LABEL DIE
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SL3S1013FTB0,115 SL3S1013FTB0,115 NXP USA Inc. SL3S1003_1013.pdf Description: RFID TAG R/W 840-960MHZ INLAY
Part Status: Active
Writable Memory: 256b (EPC)
Standards: EPC
Technology: Passive
Operating Temperature: -40°C ~ 85°C
Memory Type: Read/Write
Frequency: 840MHz ~ 960MHz
Style: Inlay
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Packaging: Tape & Reel (TR)
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SSL1523AP/N2,112 NXP USA Inc. SSL1523A.pdf Description: IC LED DVR SMPS CTLR 8DIP
Packaging: Tube
Produkt ist nicht verfügbar
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SSL2109T/1,118 SSL2109T/1,118 NXP USA Inc. SSL2109T.pdf Description: IC LED DRIVER OFFL SWITCHER 8SO
Voltage - Supply (Max): 16V
Voltage - Supply (Min): 8V
Supplier Device Package: 8-SO
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Internal Switch(s): No
Operating Temperature: -40°C ~ 125°C (TA)
Type: AC DC Offline Switcher
Number of Outputs: 1
Mounting Type: Surface Mount
Voltage - Output: 600V
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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SSL3252UK/C2,515 NXP USA Inc. SSL3252.pdf Description: IC LED DVR PHOTO FLASH UNCASED
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TDA19977AHV/15C184 NXP USA Inc. TDA19977A%2CB.pdf Description: IC HDMI RECEIVER 144HLQFP
Packaging: Tray
Produkt ist nicht verfügbar
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TDA19977AHV15C184, NXP USA Inc. TDA19977A,B.pdf Description: IC HDMI RECEIVER 144HLQFP
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TDA19977AHV15C184: NXP USA Inc. TDA19977A,B.pdf Description: IC HDMI RECEIVER 144HLQFP
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TDA8020HL/C2,151 NXP USA Inc. TDA8020HL.pdf Description: IC SMART CARD INTERFACE 32LQFP
Part Status: Obsolete
Packaging: Tray
Produkt ist nicht verfügbar
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TDA8024AT/C1,112 NXP USA Inc. TDA8024.pdf Description: IC SMART CARD INTERFACE 28SOIC
Packaging: Tube
Produkt ist nicht verfügbar
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TDA8029HL/C207,151 TDA8029HL/C207,151 NXP USA Inc. TDA8029.pdf Description: IC INTERFACE SPECIALIZED 32LQFP
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TEA1703TS/N1,115 TEA1703TS/N1,115 NXP USA Inc. TEA1703TS.pdf Description: IC CTLR SMPS STANDBY 6TSOP
Produkt ist nicht verfügbar
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TEA1723BT/N1,118 TEA1723BT/N1,118 NXP USA Inc. TEA1723BT.pdf Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
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TEA1723FT/N1,118 TEA1723FT/N1,118 NXP USA Inc. TEA1723FT.pdf Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
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TEA1733CP/N1,112 TEA1733CP/N1,112 NXP USA Inc. TEA1733CP.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 66.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Obsolete
Power (Watts): 75 W
Produkt ist nicht verfügbar
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TEA1733CT/N1,118 TEA1733CT/N1,118 NXP USA Inc. TEA1733CT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 66.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Obsolete
Power (Watts): 75 W
Produkt ist nicht verfügbar
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TJA1022T,118 TJA1022T,118 NXP USA Inc. TJA1022.pdf Description: IC TRANSCEIVER 2/2 14SO
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 14-SO
Protocol: LINbus
Data Rate: 20kBd
Number of Drivers/Receivers: 2/2
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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TJA1022TK,118 TJA1022TK,118 NXP USA Inc. TJA1022.pdf Description: IC TRANSCEIVER 2/2 14HVSON
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Receiver Hysteresis: 175 mV
Supplier Device Package: 14-HVSON (3x4.5)
Protocol: LINbus
Data Rate: 20kBd
Number of Drivers/Receivers: 2/2
Produkt ist nicht verfügbar
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TJA1027T/20,118 TJA1027T/20,118 NXP USA Inc. TJA1027.pdf Description: IC TRANSCEIVER 1/1 8SO
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SO
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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TJA1027TK/20,118 TJA1027TK/20,118 NXP USA Inc. TJA1027.pdf Description: IC TRANSCEIVER 1/1 8HVSON
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
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TLVH431AQDBVR,115 TLVH431AQDBVR,115 NXP USA Inc. TLVH431_Family.pdf Description: IC VREF SHUNT 18V 1% 5TSOP
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TLVH431DMQDBZR,215 TLVH431DMQDBZR,215 NXP USA Inc. TLVH431_Family.pdf Description: IC VREF SHUNT ADJ 0.75% TO236AB
Tolerance: ±0.75%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
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TLVH431DQDBVR,115 TLVH431DQDBVR,115 NXP USA Inc. TLVH431_Family.pdf Description: IC VREF SHUNT ADJ 0.75% 5TSOP
Tolerance: ±0.75%
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
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TLVH431DQDBZR,215 TLVH431DQDBZR,215 NXP USA Inc. TLVH431_Family.pdf Description: IC VREF SHUNT ADJ 0.75% TO236AB
Tolerance: ±0.75%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
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UBA2080P/1,112 NXP USA Inc. UBA2080%28A%29%2C2081.pdf Description: IC DRIVER HALF BRIDGE 8DIP
Packaging: Tube
Produkt ist nicht verfügbar
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UBA2081P/1,112 NXP USA Inc. UBA2080(A),2081.pdf Description: IC DRIVER HALF BRIDGE 8DIP
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UBA2081T/1,518 NXP USA Inc. UBA2080%28A%29%2C2081.pdf Description: IC DRIVER HALF BRIDGE 8SOIC
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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UBA2213AP/N1,112 NXP USA Inc. Description: IC DVR HALF BRIDGE CFL 8DIP
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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UBA2213BP/N1,112 NXP USA Inc. Description: IC DVR HALF BRIDGE CFL 8DIP
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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UBA2213BT/N1,518 NXP USA Inc. Description: IC DVR HALF BRIDGE CFL 14SOIC
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X3G-OH048,005 NXP USA Inc. X3G_T_OH047_048.pdf Description: IC MAGN FIELD SENSOR SGL DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Bare Die
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 9V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: Die
Resistance: 3.7 kOhms
Produkt ist nicht verfügbar
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CBTL06DP213EE,118 CBTL06DP213EE,118 NXP USA Inc. CBTL06DP213.pdf Description: IC MUX 6CH DISPLAY PORT 48TFBGA
Features: Bi-Directional
Packaging: Tape & Reel (TR)
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Applications: DisplayPort, PCIe
On-State Resistance (Max): 14Ohm (Typ)
-3db Bandwidth: 11.1GHz
Supplier Device Package: 48-TFBGA (5x5)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1, 4:1
Part Status: Active
Number of Channels: 6
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SC16IS741IPW,118 SC16IS741IPW,118 NXP USA Inc. SC16IS741.pdf Description: IC UART SGL I2C BUS SPI 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA8595SD/N2S,112 NXP USA Inc. TDA8595.pdf Description: IC AUDIO AMP BTL 4X45W RDBS27P
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8596TH/N1S,118 NXP USA Inc. Description: IC AUDIO AMP BTL 4X45W 36HSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TDF8541JS/N2,512 TDF8541JS/N2,512 NXP USA Inc. TDF8541.PDF Description: IC AMP CLSS AB QUAD 64W 27DBSMSP
Packaging: Tube
Part Status: Obsolete
Supplier Device Package: 27-DBSMSP
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Voltage - Supply: 6V ~ 18V
Operating Temperature: -40°C ~ 105°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Output Type: 4-Channel (Quad)
Package / Case: 27-PowerSMD Module
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Produkt ist nicht verfügbar
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TEA1716T/1,518 TEA1716T/1,518 NXP USA Inc. TEA1716T.pdf Description: IC PFC CTRLR DCM 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
Produkt ist nicht verfügbar
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JENNET-IP-EK040 JENNET-IP-EK040 NXP USA Inc. JENNET-IP-EK040_PB.pdf Description: KIT EVALUATION JENNET IP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC11U34FBD48/311, LPC11U34FBD48/311, NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 40KB FLASH 48LQFP
Program Memory Size: 40KB (40K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
DigiKey Programmable: Not Verified
auf Bestellung 116 Stücke:
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LPC11U34FHN33/311, LPC11U34FHN33/311, NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 40KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 40KB (40K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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LPC11U35FBD48/401, LPC11U35FBD48/401, NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC11U35FHI33/501, LPC11U35FHI33/501, NXP USA Inc. LPC11U3X.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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2+11.75 EUR
10+9.02 EUR
25+8.34 EUR
100+7.59 EUR
490+7.02 EUR
980+6.84 EUR
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LPC11U36FBD48/401, LPC11U36FBD48/401, NXP USA Inc. LPC11U3x.pdf Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 249 Stücke:
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2+14.41 EUR
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25+10.32 EUR
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LPC11U37FBD48/401, LPC11U37FBD48/401, NXP USA Inc. LPC11U3X.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
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LPC1315FBD48,551 LPC1315FBD48,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 2589 Stücke:
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3+10.28 EUR
10+6.31 EUR
25+6.18 EUR
100+6.03 EUR
250+5.66 EUR
500+5.62 EUR
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LPC1316FBD48,551 LPC1316FBD48,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1317FBD48,551 LPC1317FBD48,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 85 Stücke:
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2+11.91 EUR
10+9.16 EUR
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LPC1345FBD48,151 LPC1345FBD48,151 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 10K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
auf Bestellung 148 Stücke:
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2+13.86 EUR
10+10.69 EUR
25+9.89 EUR
100+9.01 EUR
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LPC1347FBD48,151 LPC1347FBD48,151 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 772 Stücke:
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2+13.42 EUR
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25+8.33 EUR
100+8.2 EUR
250+8.09 EUR
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LPC1317FBD64,551 LPC1317FBD64,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 10K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 99 Stücke:
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2+12.4 EUR
10+9.56 EUR
25+8.84 EUR
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LPC1347FBD64,551 LPC1347FBD64,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 140 Stücke:
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2+10.91 EUR
10+9.44 EUR
25+9.17 EUR
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PCF8577CU/F3,026 PCF8577C_Rev2014.pdf
Hersteller: NXP USA Inc.
Description: IC LCD DIRECT/DUPLEX DRIVER DIE
Packaging: Tray
Produkt ist nicht verfügbar
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PESD5V0L1USF-H250, PESD5V0L1USF.pdf
PESD5V0L1USF-H250,
Hersteller: NXP USA Inc.
Description: TVS DIODE 5VWM 10.5VC 2DSN
Power Line Protection: No
Power - Peak Pulse: 11W
Voltage - Clamping (Max) @ Ipp: 10.5V
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 1
Supplier Device Package: DSN0603-2
Voltage - Reverse Standoff (Typ): 5V (Max)
Current - Peak Pulse (10/1000µs): 1.2A (8/20µs)
Capacitance @ Frequency: 12pF @ 1MHz
Applications: General Purpose
Operating Temperature: -55°C ~ 150°C (TA)
Type: Zener
Mounting Type: Surface Mount
Package / Case: 2-XFDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PH5030ALS,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V TRENCH LFPACK
Part Status: Obsolete
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PH7030ALS,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V TRENCH LFPACK
Part Status: Obsolete
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PMF63UN,115 PMF63UN.pdf
PMF63UN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 1.8A SOT323-3
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 185 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 3.3 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Supplier Device Package: SC-70
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 275mW (Ta), 1.785W (Tc)
Rds On (Max) @ Id, Vgs: 74mOhm @ 1.8A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Produkt ist nicht verfügbar
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PMG45UN,115 PMG45UN_Rev_Nov_2012.pdf
PMG45UN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 3A SOT363
Produkt ist nicht verfügbar
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PMV65UN,215 PMV65UN_Rev_Nov_2012.pdf
PMV65UN,215
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 2.2A TO236AB
Input Capacitance (Ciss) (Max) @ Vds: 183 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 3.9 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Part Status: Obsolete
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Tape & Reel (TR)
Supplier Device Package: SOT-23 (TO-236AB)
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 310mW (Ta), 2.17W (Tc)
Rds On (Max) @ Id, Vgs: 76mOhm @ 2A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 2.2A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Produkt ist nicht verfügbar
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PMV90EN,215 PMV90EN.pdf
PMV90EN,215
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 1.9A TO236AB
Rds On (Max) @ Id, Vgs: 84mOhm @ 1.9A, 10V
Current - Continuous Drain (Id) @ 25°C: 1.9A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 132 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 4 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: SOT-23 (TO-236AB)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 310mW (Ta), 2.09W (Tc)
Produkt ist nicht verfügbar
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SA616BS,115 SA616.pdf
SA616BS,115
Hersteller: NXP USA Inc.
Description: IC MIXER FM IF SYSTEM LV 20HVQFN
Noise Figure: 6.8dB
Secondary Attributes: With Amplifier
Current - Supply: 3.5mA
Gain: 17dB
Voltage - Supply: 2.7V ~ 7V
RF Type: General Purpose
Frequency: 150MHz
Mounting Type: Surface Mount
Package / Case: 20-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 20-HVQFN (4x4)
Number of Mixers: 2
Produkt ist nicht verfügbar
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SL2ICS5401EW/V7,00 SL113730.pdf
Hersteller: NXP USA Inc.
Description: IC I-CODE SLI SMART LABEL DIE
Produkt ist nicht verfügbar
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SL3S1013FTB0,115 SL3S1003_1013.pdf
SL3S1013FTB0,115
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 840-960MHZ INLAY
Part Status: Active
Writable Memory: 256b (EPC)
Standards: EPC
Technology: Passive
Operating Temperature: -40°C ~ 85°C
Memory Type: Read/Write
Frequency: 840MHz ~ 960MHz
Style: Inlay
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Packaging: Tape & Reel (TR)
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5000+0.46 EUR
10000+0.44 EUR
15000+0.43 EUR
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SSL1523AP/N2,112 SSL1523A.pdf
Hersteller: NXP USA Inc.
Description: IC LED DVR SMPS CTLR 8DIP
Packaging: Tube
Produkt ist nicht verfügbar
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SSL2109T/1,118 SSL2109T.pdf
SSL2109T/1,118
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 8SO
Voltage - Supply (Max): 16V
Voltage - Supply (Min): 8V
Supplier Device Package: 8-SO
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Internal Switch(s): No
Operating Temperature: -40°C ~ 125°C (TA)
Type: AC DC Offline Switcher
Number of Outputs: 1
Mounting Type: Surface Mount
Voltage - Output: 600V
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SSL3252UK/C2,515 SSL3252.pdf
Hersteller: NXP USA Inc.
Description: IC LED DVR PHOTO FLASH UNCASED
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TDA19977AHV/15C184 TDA19977A%2CB.pdf
Hersteller: NXP USA Inc.
Description: IC HDMI RECEIVER 144HLQFP
Packaging: Tray
Produkt ist nicht verfügbar
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TDA19977AHV15C184, TDA19977A,B.pdf
Hersteller: NXP USA Inc.
Description: IC HDMI RECEIVER 144HLQFP
Produkt ist nicht verfügbar
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TDA19977AHV15C184: TDA19977A,B.pdf
Hersteller: NXP USA Inc.
Description: IC HDMI RECEIVER 144HLQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 750 Stücke
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TDA8020HL/C2,151 TDA8020HL.pdf
Hersteller: NXP USA Inc.
Description: IC SMART CARD INTERFACE 32LQFP
Part Status: Obsolete
Packaging: Tray
Produkt ist nicht verfügbar
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TDA8024AT/C1,112 TDA8024.pdf
Hersteller: NXP USA Inc.
Description: IC SMART CARD INTERFACE 28SOIC
Packaging: Tube
Produkt ist nicht verfügbar
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TDA8029HL/C207,151 TDA8029.pdf
TDA8029HL/C207,151
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32LQFP
auf Bestellung 162 Stücke:
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TEA1703TS/N1,115 TEA1703TS.pdf
TEA1703TS/N1,115
Hersteller: NXP USA Inc.
Description: IC CTLR SMPS STANDBY 6TSOP
Produkt ist nicht verfügbar
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TEA1723BT/N1,118 TEA1723BT.pdf
TEA1723BT/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+1.68 EUR
5000+1.64 EUR
7500+1.62 EUR
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TEA1723FT/N1,118 TEA1723FT.pdf
TEA1723FT/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+1.59 EUR
5000+1.56 EUR
Mindestbestellmenge: 2500 Stücke
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TEA1733CP/N1,112 TEA1733CP.pdf
TEA1733CP/N1,112
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 66.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Obsolete
Power (Watts): 75 W
Produkt ist nicht verfügbar
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TEA1733CT/N1,118 TEA1733CT.pdf
TEA1733CT/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 66.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Obsolete
Power (Watts): 75 W
Produkt ist nicht verfügbar
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TJA1022T,118 TJA1022.pdf
TJA1022T,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14SO
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 14-SO
Protocol: LINbus
Data Rate: 20kBd
Number of Drivers/Receivers: 2/2
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+1.61 EUR
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TJA1022TK,118 TJA1022.pdf
TJA1022TK,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14HVSON
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Receiver Hysteresis: 175 mV
Supplier Device Package: 14-HVSON (3x4.5)
Protocol: LINbus
Data Rate: 20kBd
Number of Drivers/Receivers: 2/2
Produkt ist nicht verfügbar
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TJA1027T/20,118 TJA1027.pdf
TJA1027T/20,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SO
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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TJA1027TK/20,118 TJA1027.pdf
TJA1027TK/20,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
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TLVH431AQDBVR,115 TLVH431_Family.pdf
TLVH431AQDBVR,115
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT 18V 1% 5TSOP
Produkt ist nicht verfügbar
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TLVH431DMQDBZR,215 TLVH431_Family.pdf
TLVH431DMQDBZR,215
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 0.75% TO236AB
Tolerance: ±0.75%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
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TLVH431DQDBVR,115 TLVH431_Family.pdf
TLVH431DQDBVR,115
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 0.75% 5TSOP
Tolerance: ±0.75%
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
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TLVH431DQDBZR,215 TLVH431_Family.pdf
TLVH431DQDBZR,215
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 0.75% TO236AB
Tolerance: ±0.75%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
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UBA2080P/1,112 UBA2080%28A%29%2C2081.pdf
Hersteller: NXP USA Inc.
Description: IC DRIVER HALF BRIDGE 8DIP
Packaging: Tube
Produkt ist nicht verfügbar
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UBA2081P/1,112 UBA2080(A),2081.pdf
Hersteller: NXP USA Inc.
Description: IC DRIVER HALF BRIDGE 8DIP
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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UBA2081T/1,518 UBA2080%28A%29%2C2081.pdf
Hersteller: NXP USA Inc.
Description: IC DRIVER HALF BRIDGE 8SOIC
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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UBA2213AP/N1,112
Hersteller: NXP USA Inc.
Description: IC DVR HALF BRIDGE CFL 8DIP
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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UBA2213BP/N1,112
Hersteller: NXP USA Inc.
Description: IC DVR HALF BRIDGE CFL 8DIP
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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UBA2213BT/N1,518
Hersteller: NXP USA Inc.
Description: IC DVR HALF BRIDGE CFL 14SOIC
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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X3G-OH048,005 X3G_T_OH047_048.pdf
Hersteller: NXP USA Inc.
Description: IC MAGN FIELD SENSOR SGL DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Bare Die
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 9V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: Die
Resistance: 3.7 kOhms
Produkt ist nicht verfügbar
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CBTL06DP213EE,118 CBTL06DP213.pdf
CBTL06DP213EE,118
Hersteller: NXP USA Inc.
Description: IC MUX 6CH DISPLAY PORT 48TFBGA
Features: Bi-Directional
Packaging: Tape & Reel (TR)
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Applications: DisplayPort, PCIe
On-State Resistance (Max): 14Ohm (Typ)
-3db Bandwidth: 11.1GHz
Supplier Device Package: 48-TFBGA (5x5)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1, 4:1
Part Status: Active
Number of Channels: 6
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3000+3.42 EUR
Mindestbestellmenge: 3000 Stücke
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SC16IS741IPW,118 SC16IS741.pdf
SC16IS741IPW,118
Hersteller: NXP USA Inc.
Description: IC UART SGL I2C BUS SPI 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA8595SD/N2S,112 TDA8595.pdf
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP BTL 4X45W RDBS27P
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8596TH/N1S,118
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP BTL 4X45W 36HSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TDF8541JS/N2,512 TDF8541.PDF
TDF8541JS/N2,512
Hersteller: NXP USA Inc.
Description: IC AMP CLSS AB QUAD 64W 27DBSMSP
Packaging: Tube
Part Status: Obsolete
Supplier Device Package: 27-DBSMSP
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Voltage - Supply: 6V ~ 18V
Operating Temperature: -40°C ~ 105°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Output Type: 4-Channel (Quad)
Package / Case: 27-PowerSMD Module
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Produkt ist nicht verfügbar
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TEA1716T/1,518 TEA1716T.pdf
TEA1716T/1,518
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR DCM 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
Produkt ist nicht verfügbar
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JENNET-IP-EK040 JENNET-IP-EK040_PB.pdf
JENNET-IP-EK040
Hersteller: NXP USA Inc.
Description: KIT EVALUATION JENNET IP
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 2 Stücke
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LPC11U34FBD48/311, LPC11U6X.pdf
LPC11U34FBD48/311,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 40KB FLASH 48LQFP
Program Memory Size: 40KB (40K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
DigiKey Programmable: Not Verified
auf Bestellung 116 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+8.51 EUR
10+4.63 EUR
Mindestbestellmenge: 3 Stücke
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LPC11U34FHN33/311, LPC11U6X.pdf
LPC11U34FHN33/311,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 40KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 40KB (40K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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LPC11U35FBD48/401, LPC11U6X.pdf
LPC11U35FBD48/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC11U35FHI33/501, LPC11U3X.pdf
LPC11U35FHI33/501,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 1298 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+11.75 EUR
10+9.02 EUR
25+8.34 EUR
100+7.59 EUR
490+7.02 EUR
980+6.84 EUR
Mindestbestellmenge: 2 Stücke
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LPC11U36FBD48/401, LPC11U3x.pdf
LPC11U36FBD48/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 249 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+14.41 EUR
10+11.14 EUR
25+10.32 EUR
100+9.41 EUR
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LPC11U37FBD48/401, LPC11U3X.pdf
LPC11U37FBD48/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
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LPC1315FBD48,551 LPC1315_16_17_45_46_47.pdf
LPC1315FBD48,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 2589 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+10.28 EUR
10+6.31 EUR
25+6.18 EUR
100+6.03 EUR
250+5.66 EUR
500+5.62 EUR
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LPC1316FBD48,551 LPC1315_16_17_45_46_47.pdf
LPC1316FBD48,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
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LPC1317FBD48,551 LPC1315_16_17_45_46_47.pdf
LPC1317FBD48,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 85 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+11.91 EUR
10+9.16 EUR
25+8.48 EUR
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LPC1345FBD48,151 LPC1315_16_17_45_46_47.pdf
LPC1345FBD48,151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 10K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
auf Bestellung 148 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+13.86 EUR
10+10.69 EUR
25+9.89 EUR
100+9.01 EUR
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LPC1347FBD48,151 LPC1315_16_17_45_46_47.pdf
LPC1347FBD48,151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 772 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+13.42 EUR
10+8.47 EUR
25+8.33 EUR
100+8.2 EUR
250+8.09 EUR
500+8.01 EUR
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LPC1317FBD64,551 LPC1315_16_17_45_46_47.pdf
LPC1317FBD64,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 10K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 99 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+12.4 EUR
10+9.56 EUR
25+8.84 EUR
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LPC1347FBD64,551 LPC1315_16_17_45_46_47.pdf
LPC1347FBD64,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 140 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+10.91 EUR
10+9.44 EUR
25+9.17 EUR
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