Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36985) > Seite 201 nach 617

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 6x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 20
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 13x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 40
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 13x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 11x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Verified

Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K40 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: K40
Platform: Tower System
Part Status: Active

Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K20 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K20
Platform: Tower System

Hersteller: NXP USA Inc.
Description: IC LED DRIVER RGLTR 700MA 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 700mA (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-SOIC
Voltage - Supply (Max): 35V
Part Status: Discontinued at Digi-Key

Hersteller: NXP USA Inc.
Description: IC LED DRIVER RGLTR 1.5A 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 1.5A (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 7-SOIC
Voltage - Supply (Max): 35V

Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Voltage - Output: 600V
Mounting Type: Surface Mount
Number of Outputs: 1
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 125°C (TA)
Internal Switch(s): No
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-SO
Voltage - Supply (Min): 8V
Voltage - Supply (Max): 16V

Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V 24PQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 2.4W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 40 mA

Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V 24PQFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 2.4W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 40 mA

Hersteller: NXP USA Inc.
Description: IC PWR MNGMNT ATLAS 3G 247MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 247-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Handheld/Mobile Devices
Supplier Device Package: 247-MAPBGA (10x10)

Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-40V 20HSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active

Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 20HSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active

Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 32PQFN
Packaging: Cut Tape (CT)
Package / Case: 32-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-PQFN (8x8)
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active

Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Part Status: Active

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 63 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Peripherals: LVD, POR, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272AA
Current Rating (Amps): 6A
Mounting Type: Chassis Mount
Frequency: 520MHz
Power - Output: 35W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA

Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272AA
Current Rating (Amps): 12A
Mounting Type: Chassis Mount
Frequency: 175MHz
Power - Output: 50W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA

Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO272-8
Packaging: Cut Tape (CT)
Package / Case: TO-272-8
Mounting Type: Chassis Mount
Frequency: 470MHz
Power - Output: 70W
Gain: 11.5dB
Technology: LDMOS
Supplier Device Package: TO-272-8
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 800 mA

Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 1.99GHz
Power - Output: 60W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 600 mA

Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA

Hersteller: NXP USA Inc.
Description: FET RF 68V 2.16GHZ NI-400

Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA

Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA

Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO272-4
Packaging: Cut Tape (CT)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 150W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 450 mA

Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO272-4
Packaging: Cut Tape (CT)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 300W
Gain: 25.5dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 900 mA

Hersteller: NXP USA Inc.
Description: FET RF 110V 860MHZ TO272-4
Packaging: Cut Tape (CT)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 18W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 350 mA

Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 125W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 2.6 A

Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 27W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 950 mA

Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 100MHZ-1GHZ 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 100MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 32V
Gain: 23.5dB
Current - Supply: 75mA
P1dB: 40.4dBm
Test Frequency: 100MHz
Supplier Device Package: 24-PQFN (8x8)
Part Status: Not For New Designs

Hersteller: NXP USA Inc.
Description: IC AMP GP 100MHZ-1GHZ TO272 WB16

Hersteller: NXP USA Inc.
Description: IC RF AMP WIMAX 2.7GHZ TO272WB
Packaging: Cut Tape (CT)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.7GHz
RF Type: WiMax
Voltage - Supply: 32V
Gain: 28.5dB
Current - Supply: 275mA
P1dB: 44dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 728-960MHZ 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 38dB
P1dB: 15.5W
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active

Hersteller: NXP USA Inc.
Description: ACCELEROMETER 1.5G I2C 10DFN

Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C 16QFN
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN
Output Type: I²C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 100Hz ~ 200Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g)
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC MTR DRVR BIPLR 2.7-5.5V 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 400mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Camera
Technology: Power MOSFET
Voltage - Load: 2.7V ~ 5.5V
Supplier Device Package: 16-QFN (3x3)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC

Hersteller: NXP USA Inc.
Description: HDMI INTERFACE CARD FOR MX535/08
Packaging: Box
For Use With/Related Products: i.MX53
Accessory Type: Interface Board

Hersteller: NXP USA Inc.
Description: KIT DEV FOR MPL3115A2
Packaging: Box
Interface: I2C
Contents: Board(s), Cable(s)
Sensor Type: Pressure
Utilized IC / Part: MPL3115A2
Supplied Contents: Board(s), Cable(s)
Sensing Range: 50 ~ 110 kPa
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: STARTERTRAK SPC5602P EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: SPC5602P
Platform: StarterTRAK
Part Status: Active

Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial Link Bus Interface
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: ACCELEROMETER 281G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±281g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 8

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 516PBGA
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC PMU I.MX35/51/37/27 186BGA

Hersteller: NXP USA Inc.
Description: FRDM KL1X/KL2X DEV EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KL1x, KL2x
Platform: Freedom

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 7A SOT-223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7A (Tc)
Rds On (Max) @ Id, Vgs: 80mOhm @ 10A, 10V
Power Dissipation (Max): 8W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: SC-73
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 25 V
Qualification: AEC-Q101

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 75A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 8mOhm @ 25A, 10V
Power Dissipation (Max): 211W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 60 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 4633 pF @ 25 V
Qualification: AEC-Q101

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 75A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 25A, 10V
Power Dissipation (Max): 200W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 68 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 4307 pF @ 25 V

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 61A D2PAK

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 8HVSON

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 8HVSON

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 8HVSON

Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8HWSON
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-HWSON (2x3)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active

Hersteller: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 20SO
Features: Alarm, Leap Year, Square Wave Output, TCXO/Crystal, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.2V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 20-SO
Voltage - Supply, Battery: 1.8V ~ 4.2V
Current - Timekeeping (Max): 1.5µA @ 3.3V
Part Status: Active
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 16SO
Features: Alarm, Leap Year, Square Wave Output, TCXO/Crystal, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.2V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 16-SO
Voltage - Supply, Battery: 1.8V ~ 4.2V
Current - Timekeeping (Max): 1.5µA @ 3.3V
Part Status: Active
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8HWSON
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-HWSON (2x3)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active

Hersteller: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 20SO
Features: Alarm, Leap Year, Square Wave Output, TCXO/Crystal, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.2V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 20-SO
Voltage - Supply, Battery: 1.8V ~ 4.2V
Current - Timekeeping (Max): 1.5µA @ 3.3V
Part Status: Active
DigiKey Programmable: Not Verified