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TJA1027T/20,118 TJA1027T/20,118 NXP USA Inc. TJA1027.pdf Description: IC TRANSCEIVER 1/1 8SO
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SO
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
auf Bestellung 5000 Stücke:
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2500+0.73 EUR
Mindestbestellmenge: 2500 Stücke
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TJA1027TK/20,118 TJA1027TK/20,118 NXP USA Inc. TJA1027.pdf Description: IC TRANSCEIVER 1/1 8HVSON
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TLVH431AQDBVR,115 TLVH431AQDBVR,115 NXP USA Inc. TLVH431_Family.pdf Description: IC VREF SHUNT 18V 1% 5TSOP
Produkt ist nicht verfügbar
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TLVH431DMQDBZR,215 TLVH431DMQDBZR,215 NXP USA Inc. TLVH431_Family.pdf Description: IC VREF SHUNT ADJ 0.75% TO236AB
Tolerance: ±0.75%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
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TLVH431DQDBVR,115 TLVH431DQDBVR,115 NXP USA Inc. TLVH431_Family.pdf Description: IC VREF SHUNT ADJ 0.75% 5TSOP
Tolerance: ±0.75%
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
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TLVH431DQDBZR,215 TLVH431DQDBZR,215 NXP USA Inc. TLVH431_Family.pdf Description: IC VREF SHUNT ADJ 0.75% TO236AB
Tolerance: ±0.75%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
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UBA2080P/1,112 NXP USA Inc. UBA2080%28A%29%2C2081.pdf Description: IC DRIVER HALF BRIDGE 8DIP
Packaging: Tube
Produkt ist nicht verfügbar
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UBA2081P/1,112 NXP USA Inc. UBA2080(A),2081.pdf Description: IC DRIVER HALF BRIDGE 8DIP
Produkt ist nicht verfügbar
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UBA2081T/1,518 NXP USA Inc. UBA2080%28A%29%2C2081.pdf Description: IC DRIVER HALF BRIDGE 8SOIC
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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UBA2213AP/N1,112 NXP USA Inc. Description: IC DVR HALF BRIDGE CFL 8DIP
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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UBA2213BP/N1,112 NXP USA Inc. Description: IC DVR HALF BRIDGE CFL 8DIP
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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UBA2213BT/N1,518 NXP USA Inc. Description: IC DVR HALF BRIDGE CFL 14SOIC
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2500 Stücke
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X3G-OH048,005 NXP USA Inc. X3G_T_OH047_048.pdf Description: IC MAGN FIELD SENSOR SGL DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Bare Die
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 9V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: Die
Resistance: 3.7 kOhms
Produkt ist nicht verfügbar
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CBTL06DP213EE,118 CBTL06DP213EE,118 NXP USA Inc. CBTL06DP213.pdf Description: IC MUX 6CH DISPLAY PORT 48TFBGA
Features: Bi-Directional
Packaging: Tape & Reel (TR)
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Applications: DisplayPort, PCIe
On-State Resistance (Max): 14Ohm (Typ)
-3db Bandwidth: 11.1GHz
Supplier Device Package: 48-TFBGA (5x5)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1, 4:1
Part Status: Active
Number of Channels: 6
auf Bestellung 3000 Stücke:
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3000+2.78 EUR
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SC16IS741IPW,118 SC16IS741IPW,118 NXP USA Inc. SC16IS741.pdf Description: IC UART SGL I2C BUS SPI 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA8595SD/N2S,112 NXP USA Inc. TDA8595.pdf Description: IC AUDIO AMP BTL 4X45W RDBS27P
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8596TH/N1S,118 NXP USA Inc. Description: IC AUDIO AMP BTL 4X45W 36HSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TDF8541JS/N2,512 TDF8541JS/N2,512 NXP USA Inc. TDF8541.PDF Description: IC AMP CLSS AB QUAD 64W 27DBSMSP
Packaging: Tube
Part Status: Obsolete
Supplier Device Package: 27-DBSMSP
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Voltage - Supply: 6V ~ 18V
Operating Temperature: -40°C ~ 105°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Output Type: 4-Channel (Quad)
Package / Case: 27-PowerSMD Module
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Produkt ist nicht verfügbar
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TEA1716T/1,518 NXP USA Inc. Description: IC PFC CTRLR DCM 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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JENNET-IP-EK040 JENNET-IP-EK040 NXP USA Inc. JENNET-IP-EK040_PB.pdf Description: KIT EVALUATION JENNET IP
Packaging: Bulk
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2 Stücke
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LPC11U34FBD48/311, LPC11U34FBD48/311, NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 40KB FLASH 48LQFP
Program Memory Size: 40KB (40K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
DigiKey Programmable: Not Verified
auf Bestellung 116 Stücke:
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3+7.15 EUR
10+3.89 EUR
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LPC11U34FHN33/311, LPC11U34FHN33/311, NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 40KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 40KB (40K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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LPC11U35FBD48/401, LPC11U35FBD48/401, NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC11U35FHI33/501, LPC11U35FHI33/501, NXP USA Inc. LPC11U3X.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 1298 Stücke:
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2+9.87 EUR
10+7.58 EUR
25+7.01 EUR
100+6.38 EUR
490+5.9 EUR
980+5.75 EUR
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LPC11U36FBD48/401, LPC11U36FBD48/401, NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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2+10.91 EUR
10+8.41 EUR
25+7.78 EUR
100+7.09 EUR
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LPC11U37FBD48/401, LPC11U37FBD48/401, NXP USA Inc. LPC11U3X.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
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LPC1315FBD48,551 LPC1315FBD48,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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3+8.64 EUR
10+5.3 EUR
25+5.19 EUR
100+5.07 EUR
250+4.76 EUR
500+4.72 EUR
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LPC1316FBD48,551 LPC1316FBD48,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1317FBD48,551 LPC1317FBD48,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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10+7.7 EUR
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LPC1345FBD48,151 LPC1345FBD48,151 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 10K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
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10+8.98 EUR
25+8.31 EUR
100+7.57 EUR
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LPC1347FBD48,151 LPC1347FBD48,151 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 772 Stücke:
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10+7.12 EUR
25+7 EUR
100+6.89 EUR
250+6.8 EUR
500+6.73 EUR
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LPC1317FBD64,551 LPC1317FBD64,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 10K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 99 Stücke:
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LPC1347FBD64,551 LPC1347FBD64,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 140 Stücke:
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2+9.17 EUR
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LPC1316FHN33,551 LPC1316FHN33,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 48KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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LPC1317FHN33,551 LPC1317FHN33,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Number of I/O: 26
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 10K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Packaging: Tray
Part Status: Active
Package / Case: 32-VQFN Exposed Pad
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LPC1347FHN33,551 LPC1347FHN33,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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TWR-K60D100M TWR-K60D100M NXP USA Inc. TWR-K60D100MQSG.pdf Description: TOWER SYSTEM K60 EVAL BRD
Platform: Tower System
Utilized IC / Part: K60
Core Processor: ARM® Cortex®-M4
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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LPC4357FET256,551 LPC4357FET256,551 NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 256LBGA
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 164
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Produkt ist nicht verfügbar
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OM13039,598 OM13039,598 NXP USA Inc. OM13039_Web.pdf Description: LPC1857 EVAL BRD
Produkt ist nicht verfügbar
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OM13040,598 OM13040,598 NXP USA Inc. OM13040_Web.pdf Description: LPC4357 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC4357
Part Status: Active
Produkt ist nicht verfügbar
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MK10DN512ZVLK10R MK10DN512ZVLK10R NXP USA Inc. K10P81M100SF2.pdf Description: IC MCU 32BIT 512KB FLASH 80FQFP
Produkt ist nicht verfügbar
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MK50DX256ZCLQ10 MK50DX256ZCLQ10 NXP USA Inc. K50PB.pdf Description: IC MCU 32BIT 256KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 96
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 41x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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MK51DN512ZCLL10 MK51DN512ZCLL10 NXP USA Inc. KNTSK50FMLYFS.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Connectivity: I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 35x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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MC9S08PA32VLH MC9S08PA32VLH NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MC9S08PA60VLH MC9S08PA60VLH NXP USA Inc. MC9S08PA60_Rev1.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Number of I/O: 57
Part Status: Not For New Designs
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AFT05MS031NR1 AFT05MS031NR1 NXP USA Inc. AFT05MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Current - Test: 10 mA
Voltage - Test: 13.6 V
Voltage - Rated: 40 V
Part Status: Active
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 17.7dB
Power - Output: 31W
Frequency: 520MHz
Mounting Type: Surface Mount
Package / Case: TO-270AA
Packaging: Tape & Reel (TR)
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AFT09MS031NR1 AFT09MS031NR1 NXP USA Inc. AFT09MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
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P1022NXN2LFB P1022NXN2LFB NXP USA Inc. QP1022FS.pdf Description: IC MPU QORIQ P1 1.067GHZ PBGA689
SATA: SATA 3Gbps (2)
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 1.067GHz
Mounting Type: Surface Mount
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MK10DN512ZVLK10R MK10DN512ZVLK10R NXP USA Inc. K10P81M100SF2.pdf Description: IC MCU 32BIT 512KB FLASH 80FQFP
Produkt ist nicht verfügbar
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AFT05MS031NR1 AFT05MS031NR1 NXP USA Inc. AFT05MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Current - Test: 10 mA
Voltage - Test: 13.6 V
Voltage - Rated: 40 V
Part Status: Active
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 17.7dB
Power - Output: 31W
Frequency: 520MHz
Mounting Type: Surface Mount
Package / Case: TO-270AA
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AFT09MS031NR1 AFT09MS031NR1 NXP USA Inc. AFT09MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
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MK20DN512ZVLK10 MK20DN512ZVLK10 NXP USA Inc. K20P81M100SF2.pdf Description: IC MCU 32BIT 512KB FLASH 80FQFP
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Not For New Designs
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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MK10DX128VFM5 MK10DX128VFM5 NXP USA Inc. K10P32M50SF0.pdf Description: IC MCU 32BIT 128KB FLASH 32QFN
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Number of I/O: 24
Part Status: Active
Supplier Device Package: 32-QFN-EP (5x5)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
DigiKey Programmable: Not Verified
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MK20DX128VFM5 MK20DX128VFM5 NXP USA Inc. K20P32M50SF0.pdf Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 6x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 20
DigiKey Programmable: Not Verified
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MK20DX128VMP5 MK20DX128VMP5 NXP USA Inc. K20P64M50SF0.pdf Description: IC MCU 32BIT 128KB FLSH 64MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 64-MAPBGA (5x5)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x16b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Packaging: Tray
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MK20DX128VLH5 MK20DX128VLH5 NXP USA Inc. K20P64M50SF0.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 13x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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2+12.9 EUR
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25+9.28 EUR
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320+8.01 EUR
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MK20DX128VLF5 MK20DX128VLF5 NXP USA Inc. K20P48M50SF0.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 11x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Verified
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2+12.21 EUR
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100+8 EUR
250+7.64 EUR
500+7.42 EUR
1000+7.24 EUR
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TWR-K40D100M TWR-K40D100M NXP USA Inc. K40D100MQSG.pdf Description: TOWER SYSTEM K40 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: K40
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M4
Contents: Board(s), Cable(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
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TWR-K20D72M TWR-K20D72M NXP USA Inc. Description: TOWER SYSTEM K20 EVAL BRD
Platform: Tower System
Utilized IC / Part: K20
Core Processor: ARM® Cortex®-M4
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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SSL21151T/1,118 NXP USA Inc. SSL2115x.pdf Description: IC LED DRIVER RGLTR 700MA 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 700mA (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-SOIC
Voltage - Supply (Max): 35V
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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TJA1027T/20,118 TJA1027.pdf
TJA1027T/20,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SO
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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2500+0.73 EUR
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TJA1027TK/20,118 TJA1027.pdf
TJA1027TK/20,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TLVH431AQDBVR,115 TLVH431_Family.pdf
TLVH431AQDBVR,115
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT 18V 1% 5TSOP
Produkt ist nicht verfügbar
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TLVH431DMQDBZR,215 TLVH431_Family.pdf
TLVH431DMQDBZR,215
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 0.75% TO236AB
Tolerance: ±0.75%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
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TLVH431DQDBVR,115 TLVH431_Family.pdf
TLVH431DQDBVR,115
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 0.75% 5TSOP
Tolerance: ±0.75%
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
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TLVH431DQDBZR,215 TLVH431_Family.pdf
TLVH431DQDBZR,215
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 0.75% TO236AB
Tolerance: ±0.75%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
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UBA2080P/1,112 UBA2080%28A%29%2C2081.pdf
Hersteller: NXP USA Inc.
Description: IC DRIVER HALF BRIDGE 8DIP
Packaging: Tube
Produkt ist nicht verfügbar
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UBA2081P/1,112 UBA2080(A),2081.pdf
Hersteller: NXP USA Inc.
Description: IC DRIVER HALF BRIDGE 8DIP
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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UBA2081T/1,518 UBA2080%28A%29%2C2081.pdf
Hersteller: NXP USA Inc.
Description: IC DRIVER HALF BRIDGE 8SOIC
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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UBA2213AP/N1,112
Hersteller: NXP USA Inc.
Description: IC DVR HALF BRIDGE CFL 8DIP
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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UBA2213BP/N1,112
Hersteller: NXP USA Inc.
Description: IC DVR HALF BRIDGE CFL 8DIP
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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UBA2213BT/N1,518
Hersteller: NXP USA Inc.
Description: IC DVR HALF BRIDGE CFL 14SOIC
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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X3G-OH048,005 X3G_T_OH047_048.pdf
Hersteller: NXP USA Inc.
Description: IC MAGN FIELD SENSOR SGL DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Bare Die
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 9V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: Die
Resistance: 3.7 kOhms
Produkt ist nicht verfügbar
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CBTL06DP213EE,118 CBTL06DP213.pdf
CBTL06DP213EE,118
Hersteller: NXP USA Inc.
Description: IC MUX 6CH DISPLAY PORT 48TFBGA
Features: Bi-Directional
Packaging: Tape & Reel (TR)
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Applications: DisplayPort, PCIe
On-State Resistance (Max): 14Ohm (Typ)
-3db Bandwidth: 11.1GHz
Supplier Device Package: 48-TFBGA (5x5)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1, 4:1
Part Status: Active
Number of Channels: 6
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3000+2.78 EUR
Mindestbestellmenge: 3000 Stücke
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SC16IS741IPW,118 SC16IS741.pdf
SC16IS741IPW,118
Hersteller: NXP USA Inc.
Description: IC UART SGL I2C BUS SPI 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA8595SD/N2S,112 TDA8595.pdf
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP BTL 4X45W RDBS27P
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8596TH/N1S,118
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP BTL 4X45W 36HSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TDF8541JS/N2,512 TDF8541.PDF
TDF8541JS/N2,512
Hersteller: NXP USA Inc.
Description: IC AMP CLSS AB QUAD 64W 27DBSMSP
Packaging: Tube
Part Status: Obsolete
Supplier Device Package: 27-DBSMSP
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Voltage - Supply: 6V ~ 18V
Operating Temperature: -40°C ~ 105°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Output Type: 4-Channel (Quad)
Package / Case: 27-PowerSMD Module
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Produkt ist nicht verfügbar
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TEA1716T/1,518
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR DCM 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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JENNET-IP-EK040 JENNET-IP-EK040_PB.pdf
JENNET-IP-EK040
Hersteller: NXP USA Inc.
Description: KIT EVALUATION JENNET IP
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 2 Stücke
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LPC11U34FBD48/311, LPC11U6X.pdf
LPC11U34FBD48/311,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 40KB FLASH 48LQFP
Program Memory Size: 40KB (40K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
DigiKey Programmable: Not Verified
auf Bestellung 116 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+7.15 EUR
10+3.89 EUR
Mindestbestellmenge: 3 Stücke
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LPC11U34FHN33/311, LPC11U6X.pdf
LPC11U34FHN33/311,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 40KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 40KB (40K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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LPC11U35FBD48/401, LPC11U6X.pdf
LPC11U35FBD48/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC11U35FHI33/501, LPC11U3X.pdf
LPC11U35FHI33/501,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 1298 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+9.87 EUR
10+7.58 EUR
25+7.01 EUR
100+6.38 EUR
490+5.9 EUR
980+5.75 EUR
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LPC11U36FBD48/401, LPC11U6X.pdf
LPC11U36FBD48/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 249 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+10.91 EUR
10+8.41 EUR
25+7.78 EUR
100+7.09 EUR
Mindestbestellmenge: 2 Stücke
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LPC11U37FBD48/401, LPC11U3X.pdf
LPC11U37FBD48/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
auf Bestellung 1 Stücke:
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LPC1315FBD48,551 LPC1315_16_17_45_46_47.pdf
LPC1315FBD48,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 2589 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+8.64 EUR
10+5.3 EUR
25+5.19 EUR
100+5.07 EUR
250+4.76 EUR
500+4.72 EUR
Mindestbestellmenge: 3 Stücke
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LPC1316FBD48,551 LPC1315_16_17_45_46_47.pdf
LPC1316FBD48,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1317FBD48,551 LPC1315_16_17_45_46_47.pdf
LPC1317FBD48,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 85 Stücke:
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AnzahlPreis
2+10.01 EUR
10+7.7 EUR
25+7.13 EUR
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LPC1345FBD48,151 LPC1315_16_17_45_46_47.pdf
LPC1345FBD48,151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 10K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
auf Bestellung 148 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+11.65 EUR
10+8.98 EUR
25+8.31 EUR
100+7.57 EUR
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LPC1347FBD48,151 LPC1315_16_17_45_46_47.pdf
LPC1347FBD48,151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 772 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+11.28 EUR
10+7.12 EUR
25+7 EUR
100+6.89 EUR
250+6.8 EUR
500+6.73 EUR
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LPC1317FBD64,551 LPC1315_16_17_45_46_47.pdf
LPC1317FBD64,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 10K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 99 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+10.42 EUR
10+8.03 EUR
25+7.43 EUR
Mindestbestellmenge: 2 Stücke
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LPC1347FBD64,551 LPC1315_16_17_45_46_47.pdf
LPC1347FBD64,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 140 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+9.17 EUR
10+7.93 EUR
25+7.71 EUR
Mindestbestellmenge: 2 Stücke
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LPC1316FHN33,551 LPC1315_16_17_45_46_47.pdf
LPC1316FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+9.54 EUR
10+7.32 EUR
25+6.76 EUR
100+6.15 EUR
260+5.85 EUR
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LPC1317FHN33,551 LPC1315_16_17_45_46_47.pdf
LPC1317FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Number of I/O: 26
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 10K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Packaging: Tray
Part Status: Active
Package / Case: 32-VQFN Exposed Pad
auf Bestellung 231 Stücke:
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10+5.56 EUR
25+5.53 EUR
100+5.5 EUR
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LPC1347FHN33,551 LPC1315_16_17_45_46_47.pdf
LPC1347FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 268 Stücke:
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2+11.93 EUR
10+9.22 EUR
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100+7.8 EUR
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TWR-K60D100M TWR-K60D100MQSG.pdf
TWR-K60D100M
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K60 EVAL BRD
Platform: Tower System
Utilized IC / Part: K60
Core Processor: ARM® Cortex®-M4
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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LPC4357FET256,551 LPC435X_3X_2X_1X.pdf
LPC4357FET256,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 164
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Produkt ist nicht verfügbar
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OM13039,598 OM13039_Web.pdf
OM13039,598
Hersteller: NXP USA Inc.
Description: LPC1857 EVAL BRD
Produkt ist nicht verfügbar
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OM13040,598 OM13040_Web.pdf
OM13040,598
Hersteller: NXP USA Inc.
Description: LPC4357 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC4357
Part Status: Active
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MK10DN512ZVLK10R K10P81M100SF2.pdf
MK10DN512ZVLK10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Produkt ist nicht verfügbar
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MK50DX256ZCLQ10 K50PB.pdf
MK50DX256ZCLQ10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 96
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 41x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MK51DN512ZCLL10 KNTSK50FMLYFS.pdf
MK51DN512ZCLL10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Connectivity: I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 35x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08PA32VLH
MC9S08PA32VLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 700 Stücke:
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4+5.86 EUR
10+4.58 EUR
160+3.76 EUR
480+3.68 EUR
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MC9S08PA60VLH MC9S08PA60_Rev1.pdf
MC9S08PA60VLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Number of I/O: 57
Part Status: Not For New Designs
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AFT05MS031NR1 AFT05MS031N.pdf
AFT05MS031NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Current - Test: 10 mA
Voltage - Test: 13.6 V
Voltage - Rated: 40 V
Part Status: Active
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 17.7dB
Power - Output: 31W
Frequency: 520MHz
Mounting Type: Surface Mount
Package / Case: TO-270AA
Packaging: Tape & Reel (TR)
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500+15.36 EUR
1000+15.03 EUR
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AFT09MS031NR1 AFT09MS031N.pdf
AFT09MS031NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
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P1022NXN2LFB QP1022FS.pdf
P1022NXN2LFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.067GHZ PBGA689
SATA: SATA 3Gbps (2)
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 1.067GHz
Mounting Type: Surface Mount
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MK10DN512ZVLK10R K10P81M100SF2.pdf
MK10DN512ZVLK10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Produkt ist nicht verfügbar
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AFT05MS031NR1 AFT05MS031N.pdf
AFT05MS031NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Current - Test: 10 mA
Voltage - Test: 13.6 V
Voltage - Rated: 40 V
Part Status: Active
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 17.7dB
Power - Output: 31W
Frequency: 520MHz
Mounting Type: Surface Mount
Package / Case: TO-270AA
auf Bestellung 2179 Stücke:
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1+24.2 EUR
10+19.1 EUR
25+17.83 EUR
100+16.43 EUR
250+15.77 EUR
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AFT09MS031NR1 AFT09MS031N.pdf
AFT09MS031NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
auf Bestellung 420 Stücke:
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1+29.6 EUR
10+23.61 EUR
25+22.11 EUR
100+21.47 EUR
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MK20DN512ZVLK10 K20P81M100SF2.pdf
MK20DN512ZVLK10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Not For New Designs
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MK10DX128VFM5 K10P32M50SF0.pdf
MK10DX128VFM5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Number of I/O: 24
Part Status: Active
Supplier Device Package: 32-QFN-EP (5x5)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
DigiKey Programmable: Not Verified
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3+6.95 EUR
10+5.41 EUR
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MK20DX128VFM5 K20P32M50SF0.pdf
MK20DX128VFM5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 6x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 20
DigiKey Programmable: Not Verified
auf Bestellung 447 Stücke:
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2+11.83 EUR
10+9.14 EUR
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MK20DX128VMP5 K20P64M50SF0.pdf
MK20DX128VMP5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 64MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 64-MAPBGA (5x5)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x16b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MK20DX128VLH5 K20P64M50SF0.pdf
MK20DX128VLH5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 13x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1085 Stücke:
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2+12.9 EUR
10+10 EUR
25+9.28 EUR
160+8.27 EUR
320+8.01 EUR
640+7.79 EUR
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MK20DX128VLF5 K20P48M50SF0.pdf
MK20DX128VLF5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 11x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Verified
auf Bestellung 1108 Stücke:
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AnzahlPreis
2+12.21 EUR
10+9.45 EUR
25+8.76 EUR
100+8 EUR
250+7.64 EUR
500+7.42 EUR
1000+7.24 EUR
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TWR-K40D100M K40D100MQSG.pdf
TWR-K40D100M
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K40 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: K40
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M4
Contents: Board(s), Cable(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
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AnzahlPreis
1+198.53 EUR
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TWR-K20D72M
TWR-K20D72M
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K20 EVAL BRD
Platform: Tower System
Utilized IC / Part: K20
Core Processor: ARM® Cortex®-M4
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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SSL21151T/1,118 SSL2115x.pdf
Hersteller: NXP USA Inc.
Description: IC LED DRIVER RGLTR 700MA 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 700mA (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-SOIC
Voltage - Supply (Max): 35V
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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