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TDA8024AT/C1,112 NXP USA Inc. TDA8024.pdf Description: IC SMART CARD INTERFACE 28SOIC
Packaging: Tube
Produkt ist nicht verfügbar
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TDA8029HL/C207,151 TDA8029HL/C207,151 NXP USA Inc. TDA8029.pdf Description: IC INTERFACE SPECIALIZED 32LQFP
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TEA1703TS/N1,115 TEA1703TS/N1,115 NXP USA Inc. TEA1703TS.pdf Description: IC CTLR SMPS STANDBY 6TSOP
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TEA1723BT/N1,118 TEA1723BT/N1,118 NXP USA Inc. TEA1723BT.pdf Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
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TEA1723FT/N1,118 TEA1723FT/N1,118 NXP USA Inc. TEA1723FT.pdf Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
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TEA1733CP/N1,112 TEA1733CP/N1,112 NXP USA Inc. TEA1733CP.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 66.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Obsolete
Power (Watts): 75 W
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TEA1733CT/N1,118 TEA1733CT/N1,118 NXP USA Inc. TEA1733CT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 66.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Obsolete
Power (Watts): 75 W
Produkt ist nicht verfügbar
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TJA1022T,118 TJA1022T,118 NXP USA Inc. TJA1022.pdf Description: IC TRANSCEIVER 2/2 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 2/2
Data Rate: 20kBd
Protocol: LINbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 175 mV
Part Status: Active
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TJA1022TK,118 TJA1022TK,118 NXP USA Inc. TJA1022.pdf Description: IC TRANSCEIVER 2/2 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 2/2
Data Rate: 20kBd
Protocol: LINbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 175 mV
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TJA1027T/20,118 TJA1027T/20,118 NXP USA Inc. TJA1027.pdf Description: IC TXRX 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
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TJA1027TK/20,118 TJA1027TK/20,118 NXP USA Inc. TJA1027.pdf Description: IC TXRX 8-HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
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TLVH431AQDBVR,115 TLVH431AQDBVR,115 NXP USA Inc. TLVH431_Family.pdf Description: IC VREF SHUNT 18V 1% 5TSOP
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TLVH431DMQDBZR,215 TLVH431DMQDBZR,215 NXP USA Inc. TLVH431_Family.pdf Description: IC VREF SHUNT ADJ 0.75% TO236AB
Tolerance: ±0.75%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
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TLVH431DQDBVR,115 TLVH431DQDBVR,115 NXP USA Inc. TLVH431_Family.pdf Description: IC VREF SHUNT ADJ 0.75% 5TSOP
Tolerance: ±0.75%
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
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TLVH431DQDBZR,215 TLVH431DQDBZR,215 NXP USA Inc. TLVH431_Family.pdf Description: IC VREF SHUNT ADJ 0.75% TO236AB
Tolerance: ±0.75%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
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UBA2080P/1,112 NXP USA Inc. UBA2080%28A%29%2C2081.pdf Description: IC DRIVER HALF BRIDGE 8DIP
Packaging: Tube
Produkt ist nicht verfügbar
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UBA2081P/1,112 NXP USA Inc. UBA2080(A),2081.pdf Description: IC DRIVER HALF BRIDGE 8DIP
Produkt ist nicht verfügbar
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UBA2081T/1,518 NXP USA Inc. UBA2080%28A%29%2C2081.pdf Description: IC DRIVER HALF BRIDGE 8SOIC
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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UBA2213AP/N1,112 NXP USA Inc. Description: IC DVR HALF BRIDGE CFL 8DIP
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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UBA2213BP/N1,112 NXP USA Inc. Description: IC DVR HALF BRIDGE CFL 8DIP
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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UBA2213BT/N1,518 NXP USA Inc. Description: IC DVR HALF BRIDGE CFL 14SOIC
Produkt ist nicht verfügbar
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X3G-OH048,005 NXP USA Inc. X3G_T_OH047_048.pdf Description: IC MAGN FIELD SENSOR SGL DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Bare Die
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 9V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: Die
Resistance: 3.7 kOhms
Produkt ist nicht verfügbar
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SC16IS741IPW,118 SC16IS741IPW,118 NXP USA Inc. SC16IS741.pdf Description: IC UART SGL I2C BUS SPI 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA8595SD/N2S,112 NXP USA Inc. TDA8595.pdf Description: IC AUDIO AMP BTL 4X45W RDBS27P
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8596TH/N1S,118 NXP USA Inc. Description: IC AUDIO AMP BTL 4X45W 36HSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TDF8541JS/N2,512 TDF8541JS/N2,512 NXP USA Inc. TDF8541.PDF Description: IC AUDIO AMP AB 27-DBSMSP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 27-PowerSMD Module
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 27-DBSMSP
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEA1716T/1,518 TEA1716T/1,518 NXP USA Inc. TEA1716T.pdf Description: IC PFC CTRLR DCM 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
Produkt ist nicht verfügbar
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JENNET-IP-EK040 JENNET-IP-EK040 NXP USA Inc. JENNET-IP-EK040_PB.pdf Description: KIT EVALUATION JENNET IP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC11U34FBD48/311, LPC11U34FBD48/311, NXP USA Inc. LPC11U3x.pdf Description: IC MCU 32BIT 40KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 40KB (40K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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100+8.08 EUR
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LPC11U34FHN33/311, LPC11U34FHN33/311, NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 40KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 40KB (40K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC11U35FBD48/401, LPC11U35FBD48/401, NXP USA Inc. LPC11U3x.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC11U35FHI33/501, LPC11U35FHI33/501, NXP USA Inc. LPC11U3X.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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25+8.34 EUR
100+7.59 EUR
490+7.02 EUR
980+6.84 EUR
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LPC11U36FBD48/401, LPC11U36FBD48/401, NXP USA Inc. LPC11U3x.pdf Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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50+9.81 EUR
100+9.4 EUR
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LPC11U37FBD48/401, LPC11U37FBD48/401, NXP USA Inc. LPC11U3X.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
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LPC1315FBD48,551 LPC1315FBD48,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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3+10.28 EUR
10+6.31 EUR
25+6.18 EUR
100+6.03 EUR
250+5.66 EUR
500+5.62 EUR
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LPC1316FBD48,551 LPC1316FBD48,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1317FBD48,551 LPC1317FBD48,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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2+11.91 EUR
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LPC1345FBD48,151 LPC1345FBD48,151 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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LPC1347FBD48,151 LPC1347FBD48,151 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 772 Stücke:
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LPC1317FBD64,551 LPC1317FBD64,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
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LPC1347FBD64,551 LPC1347FBD64,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
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LPC1316FHN33,551 LPC1316FHN33,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 48KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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LPC1317FHN33,551 LPC1317FHN33,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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LPC1347FHN33,551 LPC1347FHN33,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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100+9.28 EUR
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TWR-K60D100M TWR-K60D100M NXP USA Inc. TWR-K60D100MQSG.pdf Description: TOWER SYSTEM K60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K60
Platform: Tower System
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LPC4357FET256,551 LPC4357FET256,551 NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OM13039,598 OM13039,598 NXP USA Inc. OM13039_Web.pdf Description: LPC1857 EVAL BRD
Produkt ist nicht verfügbar
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OM13040,598 OM13040,598 NXP USA Inc. OM13040_Web.pdf Description: LPC4357 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC4357
Part Status: Active
Produkt ist nicht verfügbar
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MK10DN512ZVLK10R MK10DN512ZVLK10R NXP USA Inc. K10P81M100SF2.pdf Description: IC MCU 32BIT 512KB FLASH 80FQFP
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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MK50DX256ZCLQ10 MK50DX256ZCLQ10 NXP USA Inc. K50PB.pdf Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 300 Stücke
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MK51DN512ZCLL10 MK51DN512ZCLL10 NXP USA Inc. KNTSK50FMLYFS.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 35x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 450 Stücke
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MC9S08PA32VLH MC9S08PA32VLH NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 700 Stücke:
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4+6.97 EUR
10+5.45 EUR
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MC9S08PA60VLH MC9S08PA60VLH NXP USA Inc. MC9S08PA60_Rev1.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AFT05MS031NR1 AFT05MS031NR1 NXP USA Inc. AFT05MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
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500+18.28 EUR
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AFT09MS031NR1 AFT09MS031NR1 NXP USA Inc. AFT09MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 500 Stücke
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P1022NXN2LFB P1022NXN2LFB NXP USA Inc. QP1022FS.pdf Description: IC MPU QORIQ P1 1.067GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.067GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
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MK10DN512ZVLK10R MK10DN512ZVLK10R NXP USA Inc. K10P81M100SF2.pdf Description: IC MCU 32BIT 512KB FLASH 80FQFP
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AFT05MS031NR1 AFT05MS031NR1 NXP USA Inc. AFT05MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
auf Bestellung 2179 Stücke:
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1+28.8 EUR
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100+19.55 EUR
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AFT09MS031NR1 AFT09MS031NR1 NXP USA Inc. AFT09MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
auf Bestellung 420 Stücke:
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100+25.55 EUR
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MK20DN512ZVLK10 MK20DN512ZVLK10 NXP USA Inc. K20P81M100SF2.pdf Description: IC MCU 32BIT 512KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Not For New Designs
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 480 Stücke
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TDA8024AT/C1,112 TDA8024.pdf
Hersteller: NXP USA Inc.
Description: IC SMART CARD INTERFACE 28SOIC
Packaging: Tube
Produkt ist nicht verfügbar
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TDA8029HL/C207,151 TDA8029.pdf
TDA8029HL/C207,151
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32LQFP
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TEA1703TS/N1,115 TEA1703TS.pdf
TEA1703TS/N1,115
Hersteller: NXP USA Inc.
Description: IC CTLR SMPS STANDBY 6TSOP
Produkt ist nicht verfügbar
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TEA1723BT/N1,118 TEA1723BT.pdf
TEA1723BT/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+1.68 EUR
5000+1.64 EUR
7500+1.62 EUR
Mindestbestellmenge: 2500 Stücke
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TEA1723FT/N1,118 TEA1723FT.pdf
TEA1723FT/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
auf Bestellung 5000 Stücke:
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AnzahlPrivatkunde
2500+1.89 EUR
5000+1.86 EUR
Mindestbestellmenge: 2500 Stücke
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TEA1733CP/N1,112 TEA1733CP.pdf
TEA1733CP/N1,112
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 66.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Obsolete
Power (Watts): 75 W
Produkt ist nicht verfügbar
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TEA1733CT/N1,118 TEA1733CT.pdf
TEA1733CT/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 66.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Obsolete
Power (Watts): 75 W
Produkt ist nicht verfügbar
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TJA1022T,118 TJA1022.pdf
TJA1022T,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 2/2
Data Rate: 20kBd
Protocol: LINbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+2.49 EUR
5000+2.44 EUR
Mindestbestellmenge: 2500 Stücke
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TJA1022TK,118 TJA1022.pdf
TJA1022TK,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 2/2
Data Rate: 20kBd
Protocol: LINbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 175 mV
Produkt ist nicht verfügbar
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TJA1027T/20,118 TJA1027.pdf
TJA1027T/20,118
Hersteller: NXP USA Inc.
Description: IC TXRX 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
Produkt ist nicht verfügbar
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TJA1027TK/20,118 TJA1027.pdf
TJA1027TK/20,118
Hersteller: NXP USA Inc.
Description: IC TXRX 8-HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
Produkt ist nicht verfügbar
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TLVH431AQDBVR,115 TLVH431_Family.pdf
TLVH431AQDBVR,115
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT 18V 1% 5TSOP
Produkt ist nicht verfügbar
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TLVH431DMQDBZR,215 TLVH431_Family.pdf
TLVH431DMQDBZR,215
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 0.75% TO236AB
Tolerance: ±0.75%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
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TLVH431DQDBVR,115 TLVH431_Family.pdf
TLVH431DQDBVR,115
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 0.75% 5TSOP
Tolerance: ±0.75%
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
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TLVH431DQDBZR,215 TLVH431_Family.pdf
TLVH431DQDBZR,215
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 0.75% TO236AB
Tolerance: ±0.75%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Part Status: Obsolete
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Produkt ist nicht verfügbar
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UBA2080P/1,112 UBA2080%28A%29%2C2081.pdf
Hersteller: NXP USA Inc.
Description: IC DRIVER HALF BRIDGE 8DIP
Packaging: Tube
Produkt ist nicht verfügbar
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UBA2081P/1,112 UBA2080(A),2081.pdf
Hersteller: NXP USA Inc.
Description: IC DRIVER HALF BRIDGE 8DIP
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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UBA2081T/1,518 UBA2080%28A%29%2C2081.pdf
Hersteller: NXP USA Inc.
Description: IC DRIVER HALF BRIDGE 8SOIC
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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UBA2213AP/N1,112
Hersteller: NXP USA Inc.
Description: IC DVR HALF BRIDGE CFL 8DIP
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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UBA2213BP/N1,112
Hersteller: NXP USA Inc.
Description: IC DVR HALF BRIDGE CFL 8DIP
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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UBA2213BT/N1,518
Hersteller: NXP USA Inc.
Description: IC DVR HALF BRIDGE CFL 14SOIC
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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X3G-OH048,005 X3G_T_OH047_048.pdf
Hersteller: NXP USA Inc.
Description: IC MAGN FIELD SENSOR SGL DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Bare Die
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 9V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: Die
Resistance: 3.7 kOhms
Produkt ist nicht verfügbar
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SC16IS741IPW,118 SC16IS741.pdf
SC16IS741IPW,118
Hersteller: NXP USA Inc.
Description: IC UART SGL I2C BUS SPI 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA8595SD/N2S,112 TDA8595.pdf
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP BTL 4X45W RDBS27P
Packaging: Tube
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8596TH/N1S,118
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP BTL 4X45W 36HSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TDF8541JS/N2,512 TDF8541.PDF
TDF8541JS/N2,512
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP AB 27-DBSMSP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 27-PowerSMD Module
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 27-DBSMSP
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEA1716T/1,518 TEA1716T.pdf
TEA1716T/1,518
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR DCM 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
Produkt ist nicht verfügbar
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JENNET-IP-EK040 JENNET-IP-EK040_PB.pdf
JENNET-IP-EK040
Hersteller: NXP USA Inc.
Description: KIT EVALUATION JENNET IP
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 2 Stücke
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LPC11U34FBD48/311, LPC11U3x.pdf
LPC11U34FBD48/311,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 40KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 40KB (40K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 115 Stücke:
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2+12.48 EUR
10+9.59 EUR
50+8.44 EUR
100+8.08 EUR
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LPC11U34FHN33/311, LPC11U6X.pdf
LPC11U34FHN33/311,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 40KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 40KB (40K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC11U35FBD48/401, LPC11U3x.pdf
LPC11U35FBD48/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC11U35FHI33/501, LPC11U3X.pdf
LPC11U35FHI33/501,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 1298 Stücke:
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2+11.75 EUR
10+9.02 EUR
25+8.34 EUR
100+7.59 EUR
490+7.02 EUR
980+6.84 EUR
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LPC11U36FBD48/401, LPC11U3x.pdf
LPC11U36FBD48/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 249 Stücke:
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AnzahlPrivatkunde
2+14.36 EUR
10+11.11 EUR
50+9.81 EUR
100+9.4 EUR
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LPC11U37FBD48/401, LPC11U3X.pdf
LPC11U37FBD48/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
auf Bestellung 1 Stücke:
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LPC1315FBD48,551 LPC1315_16_17_45_46_47.pdf
LPC1315FBD48,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 2589 Stücke:
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3+10.28 EUR
10+6.31 EUR
25+6.18 EUR
100+6.03 EUR
250+5.66 EUR
500+5.62 EUR
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LPC1316FBD48,551 LPC1315_16_17_45_46_47.pdf
LPC1316FBD48,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1317FBD48,551 LPC1315_16_17_45_46_47.pdf
LPC1317FBD48,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 85 Stücke:
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2+11.91 EUR
10+9.16 EUR
25+8.48 EUR
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LPC1345FBD48,151 LPC1315_16_17_45_46_47.pdf
LPC1345FBD48,151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 148 Stücke:
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2+13.86 EUR
10+10.69 EUR
25+9.89 EUR
100+9.01 EUR
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LPC1347FBD48,151 LPC1315_16_17_45_46_47.pdf
LPC1347FBD48,151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 772 Stücke:
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2+13.42 EUR
10+8.47 EUR
25+8.33 EUR
100+8.2 EUR
250+8.09 EUR
500+8.01 EUR
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LPC1317FBD64,551 LPC1315_16_17_45_46_47.pdf
LPC1317FBD64,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 99 Stücke:
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2+12.4 EUR
10+9.56 EUR
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LPC1347FBD64,551 LPC1315_16_17_45_46_47.pdf
LPC1347FBD64,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 250 Stücke:
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AnzahlPrivatkunde
2+19.48 EUR
10+15.2 EUR
50+13.48 EUR
100+12.96 EUR
160+12.65 EUR
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LPC1316FHN33,551 LPC1315_16_17_45_46_47.pdf
LPC1316FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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LPC1317FHN33,551 LPC1315_16_17_45_46_47.pdf
LPC1317FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 231 Stücke:
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LPC1347FHN33,551 LPC1315_16_17_45_46_47.pdf
LPC1347FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 268 Stücke:
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2+14.2 EUR
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25+10.16 EUR
100+9.28 EUR
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TWR-K60D100M TWR-K60D100MQSG.pdf
TWR-K60D100M
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K60
Platform: Tower System
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LPC4357FET256,551 LPC435X_3X_2X_1X.pdf
LPC4357FET256,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OM13039,598 OM13039_Web.pdf
OM13039,598
Hersteller: NXP USA Inc.
Description: LPC1857 EVAL BRD
Produkt ist nicht verfügbar
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OM13040,598 OM13040_Web.pdf
OM13040,598
Hersteller: NXP USA Inc.
Description: LPC4357 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC4357
Part Status: Active
Produkt ist nicht verfügbar
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MK10DN512ZVLK10R K10P81M100SF2.pdf
MK10DN512ZVLK10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Produkt ist nicht verfügbar
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MK50DX256ZCLQ10 K50PB.pdf
MK50DX256ZCLQ10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK51DN512ZCLL10 KNTSK50FMLYFS.pdf
MK51DN512ZCLL10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 35x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PA32VLH
MC9S08PA32VLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 700 Stücke:
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4+6.97 EUR
10+5.45 EUR
160+4.47 EUR
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MC9S08PA60VLH MC9S08PA60_Rev1.pdf
MC9S08PA60VLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AFT05MS031NR1 AFT05MS031N.pdf
AFT05MS031NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
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500+18.28 EUR
1000+17.89 EUR
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AFT09MS031NR1 AFT09MS031N.pdf
AFT09MS031NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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P1022NXN2LFB QP1022FS.pdf
P1022NXN2LFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.067GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.067GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
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MK10DN512ZVLK10R K10P81M100SF2.pdf
MK10DN512ZVLK10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Produkt ist nicht verfügbar
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AFT05MS031NR1 AFT05MS031N.pdf
AFT05MS031NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
auf Bestellung 2179 Stücke:
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1+28.8 EUR
10+22.73 EUR
25+21.22 EUR
100+19.55 EUR
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AFT09MS031NR1 AFT09MS031N.pdf
AFT09MS031NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
auf Bestellung 420 Stücke:
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1+35.22 EUR
10+28.1 EUR
25+26.31 EUR
100+25.55 EUR
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MK20DN512ZVLK10 K20P81M100SF2.pdf
MK20DN512ZVLK10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Not For New Designs
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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