Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36588) > Seite 195 nach 610
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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MC9S12P32MFT | NXP USA Inc. |
 Description: IC MCU 16BIT 32KB FLASH 48QFNPackaging: Tray DigiKey Programmable: Not Verified Number of I/O: 34 Part Status: Active Supplier Device Package: 48-QFN-EP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 10x12b Core Processor: HCS12 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 2K x 8 Program Memory Size: 32KB (32K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 48-TFQFN Exposed Pad |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC9S12XD128CAA | NXP USA Inc. | Description: IC MCU 16BIT 128KB FLASH 80QFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC9S12XEG128CALR | NXP USA Inc. | Description: IC MCU 16BIT 128KB FLASH 112LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC9S12XEP100CVL | NXP USA Inc. |
Description: IC MCU 16BIT 1MB FLASH 208MAPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC9S12XS256CAE | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 44 Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x12b Core Processor: HCS12X Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 12K x 8 Program Memory Size: 256KB (256K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCF51JM128VLHR | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 51 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, PWM, WDT Connectivity: CANbus, I2C, SCI, SPI, USB OTG Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 12x12b Core Processor: Coldfire V1 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 128KB (128K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tape & Reel (TR) |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX233CJM4CR2 | NXP USA Inc. |
Description: IC MPU I.MX23 454MHZ 169MAPBGA Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART Security Features: Cryptography, Hardware ID Display & Interface Controllers: LCD, Touchscreen Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Data; DCP Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Supplier Device Package: 169-MAPBGA (11x11) Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Core Processor: ARM926EJ-S Operating Temperature: -40°C ~ 85°C (TA) Speed: 454MHz Mounting Type: Surface Mount Package / Case: 169-LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCIMX233DJM4CR2 | NXP USA Inc. |
Description: IC MPU I.MX23 454MHZ 169MAPBGA Packaging: Tape & Reel (TR) Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -10°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 169-MAPBGA (11x11) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCIMX280CVM4B | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: LVDDR, LVDDR2, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad Security Features: Boot Security, Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
auf Bestellung 320 Stücke: Lieferzeit 10-14 Tag (e) |
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MCZ33903BS3EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SSOP-EP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33905BD3EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOIC Packaging: Tape & Reel (TR) Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 54-SOIC-EP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33905BD5EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOIC Packaging: Tape & Reel (TR) Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 54-SOIC-EP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MD7IC2250NBR1 | NXP USA Inc. |
Description: IC AMP W-CDMA 2GHZ-2.2GHZ TO272 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| MD8IC970GNR1 | NXP USA Inc. |
Description: IC AMP GPS 850MHZ-940MHZ TO270 Part Status: Obsolete Supplier Device Package: TO-270 WBL-16 GULL Test Frequency: 940MHz Voltage - Supply: 32V RF Type: General Purpose Frequency: 850MHz ~ 940MHz Mounting Type: Surface Mount Package / Case: TO-270-16 Variant, Gull Wing Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| MD8IC970NR1 | NXP USA Inc. |
Description: IC AMP GPS 850MHZ-940MHZ TO270 Part Status: Active Supplier Device Package: TO-270 WBL-16 Test Frequency: 940MHz Voltage - Supply: 32V RF Type: General Purpose Frequency: 850MHz ~ 940MHz Mounting Type: Surface Mount Package / Case: TO-270-16 Variant, Flat Leads Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MK10DN512ZVLL10R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MK10DX256ZVLQ10R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 144LQFP DigiKey Programmable: Not Verified Number of I/O: 104 Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, I2S, LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 46x16b; D/A 2x12b Core Processor: ARM® Cortex®-M4 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 64K x 8 Program Memory Size: 256KB (256K x 8) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MK30DN512ZVLQ10R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 46x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 102 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| MM908E621ACPEK | NXP USA Inc. |
Description: IC QUAD HALF BRDG TRPL SW 54SOIC Packaging: Tube Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SCI, SPI RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 9V ~ 16V Controller Series: 908E Program Memory Type: FLASH (16kB) Applications: Mirror Control Core Processor: HC08 Supplier Device Package: 54-SOIC-EP Grade: Automotive Number of I/O: 12 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| MM908E621ACPEKR2 | NXP USA Inc. |
Description: IC QUAD HALF BRDG TRPL SW 54SOIC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MM908E622ACPEKR2 | NXP USA Inc. |
Description: IC QUAD HALF BRDG TRPL SW 54SOIC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMA2300KEG | NXP USA Inc. | Description: IC SENSOR ACCELEROMETER 16SOIC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 47 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMA2300KEGR2 | NXP USA Inc. | Description: IC SENSOR ACCELEROMETER 16SOIC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| MMA2631NKWR2 | NXP USA Inc. |
Description: ACCELEROMETER 312G PCM 16QFN Features: Selectable Low Pass Filter Packaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Output Type: PCM Mounting Type: Surface Mount Type: Digital Axis: X Acceleration Range: ±312g Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 1.64 Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| MMA5224KWR2 | NXP USA Inc. |
Description: ACCELEROMETER 240G PCM/SPI 16QFN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MMA621010AKEG | NXP USA Inc. |
Description: IC SENSOR ACCEL DUAL AXIS 20SOIC Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Axis: X, Y Acceleration Range: ±100g Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V Bandwidth: 3kHz Supplier Device Package: 20-SOIC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 38 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMA621010AKEGR2 | NXP USA Inc. |
Description: ACCELEROMETER 100G ANALOG 20SOIC Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X, Y Acceleration Range: ±100g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.13V ~ 5.25V Bandwidth: 3kHz Supplier Device Package: 20-SOIC Sensitivity (mV/g): 4.68mV/V/g Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMA6222AKEG | NXP USA Inc. |
Description: ACCELEROMETER 20G ANALOG 20SOIC Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X, Y Acceleration Range: ±20g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.13V ~ 5.25V Bandwidth: 3kHz Supplier Device Package: 20-SOIC Sensitivity (mV/g): 23.40mV/V/g Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 38 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMA6222AKEGR2 | NXP USA Inc. |
Description: ACCELEROMETER 20G ANALOG 20SOIC Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X, Y Acceleration Range: ±20g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.13V ~ 5.25V Bandwidth: 3kHz Supplier Device Package: 20-SOIC Sensitivity (mV/g): 23.40mV/V/g Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMA6519KW | NXP USA Inc. |
Description: ACCELEROMETER 80G SPI 16QFN Features: Selectable Low Pass Filter Packaging: Tube Package / Case: 16-QFN Exposed Pad Output Type: SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y Acceleration Range: ±80g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.135V ~ 5.25V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 24 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 75 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMA6519KWR2 | NXP USA Inc. |
Description: ACCELEROMETER 80G SPI 16QFN Features: Selectable Low Pass Filter Packaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Output Type: SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y Acceleration Range: ±80g Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 3.135V ~ 5.25V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 24 Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMA6525KW | NXP USA Inc. |
Description: ACCELEROMETER 105G SPI 16QFN Features: Selectable Low Pass Filter Packaging: Tube Package / Case: 16-QFN Exposed Pad Output Type: SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y Acceleration Range: ±105g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.135V ~ 5.25V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 18.2 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 75 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMA6853KWR2 | NXP USA Inc. |
Description: ACCELEROMETER SPI 16QFN Packaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Output Type: SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.135V ~ 5.25V Supplier Device Package: 16-QFN (6x6) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMA6900KQ | NXP USA Inc. |
Description: ACCELEROMETER 3.5G PCM/SPI 16QFN Features: Temperature Sensor Packaging: Tube Package / Case: 16-QFN Exposed Pad Output Type: PCM, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y Acceleration Range: ±3.5g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.15V ~ 5.25V Bandwidth: 1.2kHz Supplier Device Package: 16-QFN-EP (6x6) Sensitivity (LSB/g): 291 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 80 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMA6900KQR2 | NXP USA Inc. |
Description: ACCELEROMETER 3.5G PCM/SPI 16QFN Features: Temperature Sensor Packaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Output Type: PCM, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y Acceleration Range: ±3.5g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.15V ~ 5.25V Bandwidth: 1.2kHz Supplier Device Package: 16-QFN-EP (6x6) Sensitivity (LSB/g): 291 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMA6901KQR2 | NXP USA Inc. |
Description: ACCELEROMETER 5G PCM/SPI 16QFN Features: Temperature Sensor Packaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Output Type: PCM, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y Acceleration Range: ±5g Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 3.15V ~ 5.25V Bandwidth: 1.2kHz Supplier Device Package: 16-QFN-EP (6x6) Sensitivity (LSB/g): 203 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMA8104KEG | NXP USA Inc. |
Description: ACCELEROMETER 40G DSI/SPI 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: DSI, SPI Mounting Type: Surface Mount Type: Digital Axis: Z Acceleration Range: ±40g Operating Temperature: -40°C ~ 125°C Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-SOIC Sensitivity (LSB/g): 10 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 47 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMA8104KEGR2 | NXP USA Inc. |
Description: ACCELEROMETER 40G DSI/SPI 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: DSI, SPI Mounting Type: Surface Mount Type: Digital Axis: Z Acceleration Range: ±40g Operating Temperature: -40°C ~ 125°C Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-SOIC Sensitivity (LSB/g): 10 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMA8210KEG | NXP USA Inc. |
Description: IC SENSOR ACCEL X-AXIS SOIC16 Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Axis: X or Y Acceleration Range: ±100g Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-SOIC Part Status: Not For New Designs |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 47 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMA8210KEGR2 | NXP USA Inc. |
Description: IC SENSOR ACCEL X-AXIS SOIC16 Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Axis: X or Y Acceleration Range: ±100g Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-SOIC Part Status: Not For New Designs |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMG15241HT1 | NXP USA Inc. |
Description: IC AMP CDMA 500MHZ-2.8GHZ SOT89A Mounting Type: Surface Mount Package / Case: TO-243AA Packaging: Tape & Reel (TR) Part Status: Active Supplier Device Package: SOT-89A Test Frequency: 2.14GHz P1dB: 24dBm Noise Figure: 1.6dB Current - Supply: 85mA Gain: 15.9dB Voltage - Supply: 5V RF Type: W-CDMA Frequency: 500MHz ~ 2.8GHz |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC17531ATEVEL | NXP USA Inc. |
Description: IC MTR DRV BIPLR 2.7-3.6V 20VMFP Current - Output: 700mA Function: Driver - Fully Integrated, Control and Power Stage Mounting Type: Surface Mount Package / Case: 20-SSOP (0.209", 5.30mm Width) Packaging: Tape & Reel (TR) Part Status: Obsolete Motor Type - AC, DC: Brushed DC Motor Type - Stepper: Bipolar Supplier Device Package: 20-VMFP Voltage - Load: 2V ~ 8.6V Technology: Power MOSFET Applications: Battery Powered Voltage - Supply: 2.7V ~ 3.6V Output Configuration: Half Bridge (4) Operating Temperature: -20°C ~ 150°C (TJ) Interface: Parallel |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| MPC5606S-DEMO-V2 | NXP USA Inc. |
Description: MPC5606S EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MPC8306CVMAFDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 369BGA Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 369-PBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 369-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC8306SCVMAFDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 369BGA Additional Interfaces: DUART, I2C, SPI, TDM Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 369-PBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 369-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC8306SVMAFDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 369BGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC8306VMAFDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 369BGA Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM Graphics Acceleration: No RAM Controllers: DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 369-PBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: 0°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 369-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
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MPC8308CVMAGD | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 473MAPBGA Graphics Acceleration: No RAM Controllers: DDR2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100/1000Mbps (3) Supplier Device Package: 473-MAPBGA (19x19) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 473-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC8309CVMAGDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 489BGA Graphics Acceleration: No RAM Controllers: DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 489-PBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 489-LFBGA Packaging: Tray Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC8313CVRAFFC | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516TEPBGA Graphics Acceleration: No RAM Controllers: DDR, DDR2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 516-TEPBGA (27x27) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Packaging: Tray Additional Interfaces: DUART, HSSI, I2C, PCI, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC8313ECVRAFFC | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516TEPBGA Additional Interfaces: DUART, HSSI, I2C, PCI, SPI Security Features: Cryptography Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Security; SEC 2.2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 516-TEPBGA (27x27) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Packaging: Tray |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8313ECZQADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 267MHZ 516TEPBGA Additional Interfaces: DUART, HSSI, I2C, PCI, SPI Security Features: Cryptography Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Security; SEC 2.2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 516-TEPBGA (27x27) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 267MHz Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC8313ECZQAGDC | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 516TEPBGA Additional Interfaces: DUART, HSSI, I2C, PCI, SPI Security Features: Cryptography Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Security; SEC 2.2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 516-TEPBGA (27x27) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC8313EVRAFFC | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516TEPBGA Packaging: Tray Package / Case: 516-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-TEPBGA (27x27) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, HSSI, I2C, PCI, SPI Part Status: Active |
auf Bestellung 37 Stücke: Lieferzeit 10-14 Tag (e) |
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| MPC8313EZQADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 267MHZ 516TEPBGA Packaging: Tray Package / Case: 516-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 267MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-TEPBGA (27x27) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, HSSI, I2C, PCI, SPI Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MPC8313EZQAGDC | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 516TEPBGA Packaging: Tray Package / Case: 516-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-TEPBGA (27x27) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, HSSI, I2C, PCI, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC8313VRAFFC | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516TEPBGA Packaging: Tray Package / Case: 516-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-TEPBGA (27x27) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HSSI, I2C, PCI, SPI Part Status: Active |
auf Bestellung 400 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8548CPXAUJC | NXP USA Inc. |
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC8548CVTAUJC | NXP USA Inc. |
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA Graphics Acceleration: No RAM Controllers: DDR, DDR2, SDRAM Co-Processors/DSP: Signal Processing; SPE Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (4) Supplier Device Package: 783-FCBGA (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500 Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.333GHz Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC8548VTATGC | NXP USA Inc. |
Description: IC MPU MPC85XX 1.2GHZ 783FCBGA Graphics Acceleration: No RAM Controllers: DDR, DDR2, SDRAM Co-Processors/DSP: Signal Processing; SPE Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (4) Supplier Device Package: 783-FCBGA (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500 Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MC9S12P32MFT |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-TFQFN Exposed Pad
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-TFQFN Exposed Pad
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12XD128CAA |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Description: IC MCU 16BIT 128KB FLASH 80QFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12XEG128CALR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12XEP100CVL |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 208MAPBGA
Description: IC MCU 16BIT 1MB FLASH 208MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12XS256CAE |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 16BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCF51JM128VLHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1500+ | 20.93 EUR |
| MCIMX233CJM4CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Cryptography, Hardware ID
Display & Interface Controllers: LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Supplier Device Package: 169-MAPBGA (11x11)
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 169-LFBGA
Packaging: Tape & Reel (TR)
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Cryptography, Hardware ID
Display & Interface Controllers: LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Supplier Device Package: 169-MAPBGA (11x11)
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 169-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX233DJM4CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX280CVM4B |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 320 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 44.64 EUR |
| 10+ | 35.81 EUR |
| 25+ | 33.61 EUR |
| 100+ | 31.19 EUR |
| 250+ | 30.04 EUR |
| MCZ33903BS3EKR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33905BD3EKR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33905BD5EKR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MD7IC2250NBR1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 2GHZ-2.2GHZ TO272
Description: IC AMP W-CDMA 2GHZ-2.2GHZ TO272
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MD8IC970GNR1 |
Hersteller: NXP USA Inc.
Description: IC AMP GPS 850MHZ-940MHZ TO270
Part Status: Obsolete
Supplier Device Package: TO-270 WBL-16 GULL
Test Frequency: 940MHz
Voltage - Supply: 32V
RF Type: General Purpose
Frequency: 850MHz ~ 940MHz
Mounting Type: Surface Mount
Package / Case: TO-270-16 Variant, Gull Wing
Packaging: Tape & Reel (TR)
Description: IC AMP GPS 850MHZ-940MHZ TO270
Part Status: Obsolete
Supplier Device Package: TO-270 WBL-16 GULL
Test Frequency: 940MHz
Voltage - Supply: 32V
RF Type: General Purpose
Frequency: 850MHz ~ 940MHz
Mounting Type: Surface Mount
Package / Case: TO-270-16 Variant, Gull Wing
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MD8IC970NR1 |
Hersteller: NXP USA Inc.
Description: IC AMP GPS 850MHZ-940MHZ TO270
Part Status: Active
Supplier Device Package: TO-270 WBL-16
Test Frequency: 940MHz
Voltage - Supply: 32V
RF Type: General Purpose
Frequency: 850MHz ~ 940MHz
Mounting Type: Surface Mount
Package / Case: TO-270-16 Variant, Flat Leads
Packaging: Tape & Reel (TR)
Description: IC AMP GPS 850MHZ-940MHZ TO270
Part Status: Active
Supplier Device Package: TO-270 WBL-16
Test Frequency: 940MHz
Voltage - Supply: 32V
RF Type: General Purpose
Frequency: 850MHz ~ 940MHz
Mounting Type: Surface Mount
Package / Case: TO-270-16 Variant, Flat Leads
Packaging: Tape & Reel (TR)
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| MK10DN512ZVLL10R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Produkt ist nicht verfügbar
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| MK10DX256ZVLQ10R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 104
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 46x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 256KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 104
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 46x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MK30DN512ZVLQ10R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 46x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 102
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 46x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 102
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MM908E621ACPEK |
Hersteller: NXP USA Inc.
Description: IC QUAD HALF BRDG TRPL SW 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SCI, SPI
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 16V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Applications: Mirror Control
Core Processor: HC08
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC QUAD HALF BRDG TRPL SW 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SCI, SPI
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 16V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Applications: Mirror Control
Core Processor: HC08
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
Number of I/O: 12
DigiKey Programmable: Not Verified
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| MM908E621ACPEKR2 |
|
Hersteller: NXP USA Inc.
Description: IC QUAD HALF BRDG TRPL SW 54SOIC
Description: IC QUAD HALF BRDG TRPL SW 54SOIC
Produkt ist nicht verfügbar
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| MM908E622ACPEKR2 |
|
Hersteller: NXP USA Inc.
Description: IC QUAD HALF BRDG TRPL SW 54SOIC
Description: IC QUAD HALF BRDG TRPL SW 54SOIC
Produkt ist nicht verfügbar
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| MMA2300KEG |
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCELEROMETER 16SOIC
Description: IC SENSOR ACCELEROMETER 16SOIC
Produkt ist nicht verfügbar
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| MMA2300KEGR2 |
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCELEROMETER 16SOIC
Description: IC SENSOR ACCELEROMETER 16SOIC
Produkt ist nicht verfügbar
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| MMA2631NKWR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 312G PCM 16QFN
Features: Selectable Low Pass Filter
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: PCM
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±312g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 1.64
Part Status: Obsolete
Description: ACCELEROMETER 312G PCM 16QFN
Features: Selectable Low Pass Filter
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: PCM
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±312g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 1.64
Part Status: Obsolete
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| MMA5224KWR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 240G PCM/SPI 16QFN
Description: ACCELEROMETER 240G PCM/SPI 16QFN
Produkt ist nicht verfügbar
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| MMA621010AKEG |
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL DUAL AXIS 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X, Y
Acceleration Range: ±100g
Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Description: IC SENSOR ACCEL DUAL AXIS 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X, Y
Acceleration Range: ±100g
Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Produkt ist nicht verfügbar
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| MMA621010AKEGR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 100G ANALOG 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y
Acceleration Range: ±100g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.13V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Sensitivity (mV/g): 4.68mV/V/g
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 100G ANALOG 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y
Acceleration Range: ±100g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.13V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Sensitivity (mV/g): 4.68mV/V/g
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MMA6222AKEG |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 20G ANALOG 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y
Acceleration Range: ±20g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.13V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Sensitivity (mV/g): 23.40mV/V/g
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 20G ANALOG 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y
Acceleration Range: ±20g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.13V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Sensitivity (mV/g): 23.40mV/V/g
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MMA6222AKEGR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 20G ANALOG 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y
Acceleration Range: ±20g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.13V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Sensitivity (mV/g): 23.40mV/V/g
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 20G ANALOG 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y
Acceleration Range: ±20g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.13V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Sensitivity (mV/g): 23.40mV/V/g
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MMA6519KW |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 80G SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±80g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 24
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 80G SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±80g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 24
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MMA6519KWR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 80G SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±80g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 24
Part Status: Obsolete
Description: ACCELEROMETER 80G SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±80g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 24
Part Status: Obsolete
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| MMA6525KW |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 105G SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±105g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 18.2
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 105G SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±105g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 18.2
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MMA6853KWR2 |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Part Status: Obsolete
Description: ACCELEROMETER SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Part Status: Obsolete
Produkt ist nicht verfügbar
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| MMA6900KQ |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 3.5G PCM/SPI 16QFN
Features: Temperature Sensor
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±3.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.15V ~ 5.25V
Bandwidth: 1.2kHz
Supplier Device Package: 16-QFN-EP (6x6)
Sensitivity (LSB/g): 291
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 3.5G PCM/SPI 16QFN
Features: Temperature Sensor
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±3.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.15V ~ 5.25V
Bandwidth: 1.2kHz
Supplier Device Package: 16-QFN-EP (6x6)
Sensitivity (LSB/g): 291
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MMA6900KQR2 |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 3.5G PCM/SPI 16QFN
Features: Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±3.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.15V ~ 5.25V
Bandwidth: 1.2kHz
Supplier Device Package: 16-QFN-EP (6x6)
Sensitivity (LSB/g): 291
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 3.5G PCM/SPI 16QFN
Features: Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±3.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.15V ~ 5.25V
Bandwidth: 1.2kHz
Supplier Device Package: 16-QFN-EP (6x6)
Sensitivity (LSB/g): 291
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MMA6901KQR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 5G PCM/SPI 16QFN
Features: Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±5g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3.15V ~ 5.25V
Bandwidth: 1.2kHz
Supplier Device Package: 16-QFN-EP (6x6)
Sensitivity (LSB/g): 203
Description: ACCELEROMETER 5G PCM/SPI 16QFN
Features: Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±5g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3.15V ~ 5.25V
Bandwidth: 1.2kHz
Supplier Device Package: 16-QFN-EP (6x6)
Sensitivity (LSB/g): 203
Produkt ist nicht verfügbar
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| MMA8104KEG |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 40G DSI/SPI 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: DSI, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: Z
Acceleration Range: ±40g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Sensitivity (LSB/g): 10
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 40G DSI/SPI 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: DSI, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: Z
Acceleration Range: ±40g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Sensitivity (LSB/g): 10
Grade: Automotive
Qualification: AEC-Q100
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| MMA8104KEGR2 |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 40G DSI/SPI 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: DSI, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: Z
Acceleration Range: ±40g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Sensitivity (LSB/g): 10
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 40G DSI/SPI 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: DSI, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: Z
Acceleration Range: ±40g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Sensitivity (LSB/g): 10
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MMA8210KEG |
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±100g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±100g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
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| MMA8210KEGR2 |
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±100g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±100g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| MMG15241HT1 |
Hersteller: NXP USA Inc.
Description: IC AMP CDMA 500MHZ-2.8GHZ SOT89A
Mounting Type: Surface Mount
Package / Case: TO-243AA
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: SOT-89A
Test Frequency: 2.14GHz
P1dB: 24dBm
Noise Figure: 1.6dB
Current - Supply: 85mA
Gain: 15.9dB
Voltage - Supply: 5V
RF Type: W-CDMA
Frequency: 500MHz ~ 2.8GHz
Description: IC AMP CDMA 500MHZ-2.8GHZ SOT89A
Mounting Type: Surface Mount
Package / Case: TO-243AA
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: SOT-89A
Test Frequency: 2.14GHz
P1dB: 24dBm
Noise Figure: 1.6dB
Current - Supply: 85mA
Gain: 15.9dB
Voltage - Supply: 5V
RF Type: W-CDMA
Frequency: 500MHz ~ 2.8GHz
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 5.33 EUR |
| MPC17531ATEVEL |
Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-3.6V 20VMFP
Current - Output: 700mA
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 20-VMFP
Voltage - Load: 2V ~ 8.6V
Technology: Power MOSFET
Applications: Battery Powered
Voltage - Supply: 2.7V ~ 3.6V
Output Configuration: Half Bridge (4)
Operating Temperature: -20°C ~ 150°C (TJ)
Interface: Parallel
Description: IC MTR DRV BIPLR 2.7-3.6V 20VMFP
Current - Output: 700mA
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 20-VMFP
Voltage - Load: 2V ~ 8.6V
Technology: Power MOSFET
Applications: Battery Powered
Voltage - Supply: 2.7V ~ 3.6V
Output Configuration: Half Bridge (4)
Operating Temperature: -20°C ~ 150°C (TJ)
Interface: Parallel
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC5606S-DEMO-V2 |
|
Hersteller: NXP USA Inc.
Description: MPC5606S EVAL BRD
Description: MPC5606S EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8306CVMAFDCA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 369BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
Description: IC MPU MPC83XX 333MHZ 369BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8306SCVMAFDCA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 369BGA
Additional Interfaces: DUART, I2C, SPI, TDM
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
Description: IC MPU MPC83XX 333MHZ 369BGA
Additional Interfaces: DUART, I2C, SPI, TDM
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8306SVMAFDCA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 369BGA
Description: IC MPU MPC83XX 333MHZ 369BGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPC8306VMAFDCA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 369BGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
Description: IC MPU MPC83XX 333MHZ 369BGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8308CVMAGD |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 473MAPBGA
Graphics Acceleration: No
RAM Controllers: DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 473-MAPBGA (19x19)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 473-LFBGA
Packaging: Tray
Description: IC MPU MPC83XX 400MHZ 473MAPBGA
Graphics Acceleration: No
RAM Controllers: DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 473-MAPBGA (19x19)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 473-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8309CVMAGDCA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 489BGA
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Description: IC MPU MPC83XX 400MHZ 489BGA
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8313CVRAFFC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8313ECVRAFFC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 110.23 EUR |
| 10+ | 91.02 EUR |
| MPC8313ECZQADDC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 267MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 267MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8313ECZQAGDC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8313EVRAFFC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Part Status: Active
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Part Status: Active
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 113.75 EUR |
| 10+ | 94.02 EUR |
| MPC8313EZQADDC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Part Status: Obsolete
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8313EZQAGDC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8313VRAFFC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Part Status: Active
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Part Status: Active
auf Bestellung 400 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 84 EUR |
| 10+ | 68.83 EUR |
| 25+ | 65.05 EUR |
| 200+ | 59.33 EUR |
| MPC8548CPXAUJC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8548CVTAUJC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 783-FCBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.333GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 783-FCBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.333GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
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| MPC8548VTATGC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.2GHZ 783FCBGA
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 783-FCBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Description: IC MPU MPC85XX 1.2GHZ 783FCBGA
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 783-FCBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH