Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36403) > Seite 195 nach 607
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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MMA6222AKEG | NXP USA Inc. |
 Description: ACCELEROMETER 20G ANALOG 20SOICPackaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X, Y Acceleration Range: ±20g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.13V ~ 5.25V Bandwidth: 3kHz Supplier Device Package: 20-SOIC Sensitivity (mV/g): 23.40mV/V/g Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 38 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MMA6222AKEGR2 | NXP USA Inc. |
Description: ACCELEROMETER 20G ANALOG 20SOIC Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X, Y Acceleration Range: ±20g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.13V ~ 5.25V Bandwidth: 3kHz Supplier Device Package: 20-SOIC Sensitivity (mV/g): 23.40mV/V/g Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MMA6519KW | NXP USA Inc. |
Description: ACCELEROMETER 80G SPI 16QFN Features: Selectable Low Pass Filter Packaging: Tube Package / Case: 16-QFN Exposed Pad Output Type: SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y Acceleration Range: ±80g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.135V ~ 5.25V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 24 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 75 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MMA6519KWR2 | NXP USA Inc. |
Description: ACCELEROMETER 80G SPI 16QFN Features: Selectable Low Pass Filter Packaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Output Type: SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y Acceleration Range: ±80g Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 3.135V ~ 5.25V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 24 Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MMA6525KW | NXP USA Inc. |
Description: ACCELEROMETER 105G SPI 16QFN Features: Selectable Low Pass Filter Packaging: Tube Package / Case: 16-QFN Exposed Pad Output Type: SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y Acceleration Range: ±105g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.135V ~ 5.25V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 18.2 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 75 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MMA6853KWR2 | NXP USA Inc. |
Description: ACCELEROMETER SPI 16QFN Packaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Output Type: SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.135V ~ 5.25V Supplier Device Package: 16-QFN (6x6) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MMA6900KQ | NXP USA Inc. |
Description: ACCELEROMETER 3.5G PCM/SPI 16QFN Features: Temperature Sensor Packaging: Tube Package / Case: 16-QFN Exposed Pad Output Type: PCM, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y Acceleration Range: ±3.5g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.15V ~ 5.25V Bandwidth: 1.2kHz Supplier Device Package: 16-QFN-EP (6x6) Sensitivity (LSB/g): 291 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 80 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MMA6900KQR2 | NXP USA Inc. |
Description: ACCELEROMETER 3.5G PCM/SPI 16QFN Features: Temperature Sensor Packaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Output Type: PCM, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y Acceleration Range: ±3.5g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.15V ~ 5.25V Bandwidth: 1.2kHz Supplier Device Package: 16-QFN-EP (6x6) Sensitivity (LSB/g): 291 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MMA6901KQR2 | NXP USA Inc. |
Description: ACCELEROMETER 5G PCM/SPI 16QFN Features: Temperature Sensor Packaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Output Type: PCM, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y Acceleration Range: ±5g Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 3.15V ~ 5.25V Bandwidth: 1.2kHz Supplier Device Package: 16-QFN-EP (6x6) Sensitivity (LSB/g): 203 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MMA8104KEG | NXP USA Inc. |
Description: ACCELEROMETER 40G DSI/SPI 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: DSI, SPI Mounting Type: Surface Mount Type: Digital Axis: Z Acceleration Range: ±40g Operating Temperature: -40°C ~ 125°C Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-SOIC Sensitivity (LSB/g): 10 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 47 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MMA8104KEGR2 | NXP USA Inc. |
Description: ACCELEROMETER 40G DSI/SPI 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: DSI, SPI Mounting Type: Surface Mount Type: Digital Axis: Z Acceleration Range: ±40g Operating Temperature: -40°C ~ 125°C Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-SOIC Sensitivity (LSB/g): 10 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MMA8210KEG | NXP USA Inc. |
Description: IC SENSOR ACCEL X-AXIS SOIC16 Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Axis: X or Y Acceleration Range: ±100g Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-SOIC Part Status: Not For New Designs |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 47 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MMA8210KEGR2 | NXP USA Inc. |
Description: IC SENSOR ACCEL X-AXIS SOIC16 Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Axis: X or Y Acceleration Range: ±100g Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-SOIC Part Status: Not For New Designs |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MMG15241HT1 | NXP USA Inc. |
Description: IC AMP CDMA 500MHZ-2.8GHZ SOT89A Mounting Type: Surface Mount Package / Case: TO-243AA Packaging: Tape & Reel (TR) Part Status: Active Supplier Device Package: SOT-89A Test Frequency: 2.14GHz P1dB: 24dBm Noise Figure: 1.6dB Current - Supply: 85mA Gain: 15.9dB Voltage - Supply: 5V RF Type: W-CDMA Frequency: 500MHz ~ 2.8GHz |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC17531ATEVEL | NXP USA Inc. |
Description: IC MTR DRV BIPLR 2.7-3.6V 20VMFP Current - Output: 700mA Function: Driver - Fully Integrated, Control and Power Stage Mounting Type: Surface Mount Package / Case: 20-SSOP (0.209", 5.30mm Width) Packaging: Tape & Reel (TR) Part Status: Obsolete Motor Type - AC, DC: Brushed DC Motor Type - Stepper: Bipolar Supplier Device Package: 20-VMFP Voltage - Load: 2V ~ 8.6V Technology: Power MOSFET Applications: Battery Powered Voltage - Supply: 2.7V ~ 3.6V Output Configuration: Half Bridge (4) Operating Temperature: -20°C ~ 150°C (TJ) Interface: Parallel |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
| MPC5606S-DEMO-V2 | NXP USA Inc. |
Description: MPC5606S EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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MPC8306CVMAFDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 369BGA Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 369-PBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 369-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MPC8306SCVMAFDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 369BGA Additional Interfaces: DUART, I2C, SPI, TDM Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 369-PBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 369-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MPC8306SVMAFDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 369BGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MPC8306VMAFDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 369BGA Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM Graphics Acceleration: No RAM Controllers: DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 369-PBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: 0°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 369-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MPC8308CVMAGD | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 473MAPBGA Graphics Acceleration: No RAM Controllers: DDR2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100/1000Mbps (3) Supplier Device Package: 473-MAPBGA (19x19) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 473-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MPC8309CVMAGDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 489BGA Graphics Acceleration: No RAM Controllers: DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 489-PBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 489-LFBGA Packaging: Tray Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MPC8313CVRAFFC | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516TEPBGA Graphics Acceleration: No RAM Controllers: DDR, DDR2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 516-TEPBGA (27x27) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Packaging: Tray Additional Interfaces: DUART, HSSI, I2C, PCI, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MPC8313ECVRAFFC | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516TEPBGA Additional Interfaces: DUART, HSSI, I2C, PCI, SPI Security Features: Cryptography Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Security; SEC 2.2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 516-TEPBGA (27x27) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Packaging: Tray |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8313ECZQADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 267MHZ 516TEPBGA Additional Interfaces: DUART, HSSI, I2C, PCI, SPI Security Features: Cryptography Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Security; SEC 2.2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 516-TEPBGA (27x27) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 267MHz Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MPC8313ECZQAGDC | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 516TEPBGA Additional Interfaces: DUART, HSSI, I2C, PCI, SPI Security Features: Cryptography Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Security; SEC 2.2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 516-TEPBGA (27x27) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MPC8313EVRAFFC | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516TEPBGA Packaging: Tray Package / Case: 516-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-TEPBGA (27x27) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, HSSI, I2C, PCI, SPI Part Status: Active |
auf Bestellung 37 Stücke: Lieferzeit 10-14 Tag (e) |
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| MPC8313EZQADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 267MHZ 516TEPBGA Packaging: Tray Package / Case: 516-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 267MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-TEPBGA (27x27) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, HSSI, I2C, PCI, SPI Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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MPC8313EZQAGDC | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 516TEPBGA Packaging: Tray Package / Case: 516-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-TEPBGA (27x27) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, HSSI, I2C, PCI, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MPC8313VRAFFC | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516TEPBGA Packaging: Tray Package / Case: 516-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-TEPBGA (27x27) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HSSI, I2C, PCI, SPI Part Status: Active |
auf Bestellung 400 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8548CPXAUJC | NXP USA Inc. |
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MPC8548CVTAUJC | NXP USA Inc. |
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA Graphics Acceleration: No RAM Controllers: DDR, DDR2, SDRAM Co-Processors/DSP: Signal Processing; SPE Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (4) Supplier Device Package: 783-FCBGA (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500 Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.333GHz Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
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MPC8548VTATGC | NXP USA Inc. |
Description: IC MPU MPC85XX 1.2GHZ 783FCBGA Graphics Acceleration: No RAM Controllers: DDR, DDR2, SDRAM Co-Processors/DSP: Signal Processing; SPE Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (4) Supplier Device Package: 783-FCBGA (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500 Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MPC8548VTAUJC | NXP USA Inc. |
Description: IC MPU MPC85XX 1.333GHZ 783BGA Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Packaging: Tray Graphics Acceleration: No RAM Controllers: DDR, DDR2, SDRAM Co-Processors/DSP: Signal Processing; SPE Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (4) Supplier Device Package: 783-FCPBGA (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500 Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.333GHz |
Produkt ist nicht verfügbar |
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MPC8572ELPXAVNE | NXP USA Inc. |
Description: IC MPU MPC85XX 1.5GHZ 1023FCBGA Part Status: Obsolete Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR2, DDR3 Co-Processors/DSP: Signal Processing; SPE, Security; SEC Number of Cores/Bus Width: 2 Core, 32-Bit Ethernet: 10/100/1000Mbps (4) Supplier Device Package: 1023-FCBGA (33x33) Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500 Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.5GHz Mounting Type: Surface Mount Package / Case: 1023-BFBGA, FCBGA Packaging: Box |
Produkt ist nicht verfügbar |
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MPL3115A2 | NXP USA Inc. |
Description: SENSOR 15.95PSIA 24BIT 8LGA Output: 24 b Mounting Type: Surface Mount Output Type: I2C Package / Case: 8-TLGA Features: Temperature Compensated Packaging: Tray Part Status: Obsolete Maximum Pressure: 72.52PSI (500kPa) Port Style: No Port Supplier Device Package: 8-LGA (3x5) Applications: Board Mount Voltage - Supply: 1.95V ~ 3.6V Termination Style: SMD (SMT) Tab Operating Temperature: -40°C ~ 85°C Accuracy: ±0.058PSI (±0.4kPa) Pressure Type: Absolute Operating Pressure: 7.25PSI ~ 15.95PSI (50kPa ~ 110kPa) |
Produkt ist nicht verfügbar |
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MRF6V13250HSR3 | NXP USA Inc. | Description: FET RF 120V 1.3GHZ NI780S |
Produkt ist nicht verfügbar |
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MRF6V13250HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 1.3GHz Power - Output: 250W Gain: 22.7dB Technology: LDMOS Supplier Device Package: NI-780S Part Status: Obsolete Voltage - Rated: 120 V Voltage - Test: 50 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
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MRF8HP21080HSR3 | NXP USA Inc. |
Description: FET RF 2CH 65V 2.17GHZ NI780S-4 Current - Test: 150 mA Voltage - Test: 28 V Voltage - Rated: 65 V Part Status: Obsolete Supplier Device Package: NI-780S-4L Technology: LDMOS Gain: 14.4dB Power - Output: 16W Configuration: Dual Frequency: 2.17GHz Mounting Type: Surface Mount Package / Case: NI-780S-4L Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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MRF8P26080HR3 | NXP USA Inc. | Description: FET RF 2CH 65V 2.62GHZ NI780-4 |
Produkt ist nicht verfügbar |
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MRF8P26080HSR5 | NXP USA Inc. | Description: FET RF 2CH 65V 2.62GHZ NI780S-4 |
Produkt ist nicht verfügbar |
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MRF8P29300HR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 30V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 2.9GHz Configuration: Dual Power - Output: 320W Gain: 13.3dB Technology: LDMOS Supplier Device Package: NI-1230 Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
 |
MRF8P29300HSR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 30V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230S Mounting Type: Chassis Mount Frequency: 2.9GHz Configuration: Dual Power - Output: 320W Gain: 13.3dB Technology: LDMOS Supplier Device Package: NI-1230S Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
 |
MRF8P8300HSR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230S Mounting Type: Chassis Mount Frequency: 820MHz Configuration: Dual Power - Output: 96W Gain: 20.9dB Technology: LDMOS Supplier Device Package: NI-1230S Part Status: Active Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 2 A |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
 |
MRF8S8260HR3 | NXP USA Inc. | Description: FET RF 70V 895MHZ NI880 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
| MRF8S8260HSR3 | NXP USA Inc. | Description: FET RF 70V 895MHZ NI880S |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
 |
MRFE6VP5600HR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Tape & Reel (TR) Package / Case: SOT-979A Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 600W Gain: 25dB Technology: LDMOS Supplier Device Package: NI-1230-4H Part Status: Active Voltage - Rated: 130 V Voltage - Test: 50 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 150 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
|
|
MRFE6VP5600HSR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230-4S Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 600W Gain: 25dB Technology: LDMOS Supplier Device Package: NI-1230-4S Voltage - Rated: 130 V Voltage - Test: 50 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
 |
MSC8151TVT1000B | NXP USA Inc. |
Description: IC PROCESSOR SGL DGTL 783FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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|
MSC8152SVT1000B | NXP USA Inc. |
Description: IC PROCESSOR DUAL DGTL 783FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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|
MSC8152TVT1000B | NXP USA Inc. |
Description: IC PROCESSOR DUAL DGTL 783FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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|
MSC8154ESVT1000B | NXP USA Inc. |
Description: IC PROCESSOR QUAD DGTL 783FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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|
MSC8154SVT1000B | NXP USA Inc. |
Description: IC PROCESSOR QUAD DGTL 783FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
| MSC8154VT1000B | NXP USA Inc. | Description: IC PROCESSOR QUAD DGTL 783FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MSC8157ADS | NXP USA Inc. |
Description: MSC8157 EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MSC8157EADS | NXP USA Inc. | Description: MSC8157 EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
 |
PK50N512CLQ100 | NXP USA Inc. | Description: IC MCU 32BIT 512KB FLASH 144LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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|
PK51N256CLQ100 | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 144LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
 |
PK51N256CMD100 | NXP USA Inc. | Description: IC MCU 32B 256KB FLASH 144MAPBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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PK51N512CLQ100 | NXP USA Inc. | Description: IC MCU 32BIT 512KB FLASH 144LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MMA6222AKEG |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 20G ANALOG 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y
Acceleration Range: ±20g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.13V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Sensitivity (mV/g): 23.40mV/V/g
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 20G ANALOG 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y
Acceleration Range: ±20g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.13V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Sensitivity (mV/g): 23.40mV/V/g
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 38 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MMA6222AKEGR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 20G ANALOG 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y
Acceleration Range: ±20g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.13V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Sensitivity (mV/g): 23.40mV/V/g
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 20G ANALOG 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y
Acceleration Range: ±20g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.13V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Sensitivity (mV/g): 23.40mV/V/g
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MMA6519KW |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 80G SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±80g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 24
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 80G SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±80g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 24
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 75 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MMA6519KWR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 80G SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±80g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 24
Part Status: Obsolete
Description: ACCELEROMETER 80G SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±80g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 24
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MMA6525KW |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 105G SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±105g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 18.2
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 105G SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±105g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 18.2
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 75 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MMA6853KWR2 |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Part Status: Obsolete
Description: ACCELEROMETER SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MMA6900KQ |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 3.5G PCM/SPI 16QFN
Features: Temperature Sensor
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±3.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.15V ~ 5.25V
Bandwidth: 1.2kHz
Supplier Device Package: 16-QFN-EP (6x6)
Sensitivity (LSB/g): 291
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 3.5G PCM/SPI 16QFN
Features: Temperature Sensor
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±3.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.15V ~ 5.25V
Bandwidth: 1.2kHz
Supplier Device Package: 16-QFN-EP (6x6)
Sensitivity (LSB/g): 291
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 80 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MMA6900KQR2 |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 3.5G PCM/SPI 16QFN
Features: Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±3.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.15V ~ 5.25V
Bandwidth: 1.2kHz
Supplier Device Package: 16-QFN-EP (6x6)
Sensitivity (LSB/g): 291
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 3.5G PCM/SPI 16QFN
Features: Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±3.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.15V ~ 5.25V
Bandwidth: 1.2kHz
Supplier Device Package: 16-QFN-EP (6x6)
Sensitivity (LSB/g): 291
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MMA6901KQR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 5G PCM/SPI 16QFN
Features: Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±5g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3.15V ~ 5.25V
Bandwidth: 1.2kHz
Supplier Device Package: 16-QFN-EP (6x6)
Sensitivity (LSB/g): 203
Description: ACCELEROMETER 5G PCM/SPI 16QFN
Features: Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±5g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3.15V ~ 5.25V
Bandwidth: 1.2kHz
Supplier Device Package: 16-QFN-EP (6x6)
Sensitivity (LSB/g): 203
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MMA8104KEG |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 40G DSI/SPI 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: DSI, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: Z
Acceleration Range: ±40g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Sensitivity (LSB/g): 10
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 40G DSI/SPI 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: DSI, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: Z
Acceleration Range: ±40g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Sensitivity (LSB/g): 10
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 47 Stücke
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| MMA8104KEGR2 |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 40G DSI/SPI 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: DSI, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: Z
Acceleration Range: ±40g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Sensitivity (LSB/g): 10
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 40G DSI/SPI 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: DSI, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: Z
Acceleration Range: ±40g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Sensitivity (LSB/g): 10
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MMA8210KEG |
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±100g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±100g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Produkt ist nicht verfügbar
Mindestbestellmenge: 47 Stücke
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Stück im Wert von UAH
| MMA8210KEGR2 |
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±100g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±100g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| MMG15241HT1 |
Hersteller: NXP USA Inc.
Description: IC AMP CDMA 500MHZ-2.8GHZ SOT89A
Mounting Type: Surface Mount
Package / Case: TO-243AA
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: SOT-89A
Test Frequency: 2.14GHz
P1dB: 24dBm
Noise Figure: 1.6dB
Current - Supply: 85mA
Gain: 15.9dB
Voltage - Supply: 5V
RF Type: W-CDMA
Frequency: 500MHz ~ 2.8GHz
Description: IC AMP CDMA 500MHZ-2.8GHZ SOT89A
Mounting Type: Surface Mount
Package / Case: TO-243AA
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: SOT-89A
Test Frequency: 2.14GHz
P1dB: 24dBm
Noise Figure: 1.6dB
Current - Supply: 85mA
Gain: 15.9dB
Voltage - Supply: 5V
RF Type: W-CDMA
Frequency: 500MHz ~ 2.8GHz
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1000+ | 4.48 EUR |
| MPC17531ATEVEL |
Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-3.6V 20VMFP
Current - Output: 700mA
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 20-VMFP
Voltage - Load: 2V ~ 8.6V
Technology: Power MOSFET
Applications: Battery Powered
Voltage - Supply: 2.7V ~ 3.6V
Output Configuration: Half Bridge (4)
Operating Temperature: -20°C ~ 150°C (TJ)
Interface: Parallel
Description: IC MTR DRV BIPLR 2.7-3.6V 20VMFP
Current - Output: 700mA
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 20-VMFP
Voltage - Load: 2V ~ 8.6V
Technology: Power MOSFET
Applications: Battery Powered
Voltage - Supply: 2.7V ~ 3.6V
Output Configuration: Half Bridge (4)
Operating Temperature: -20°C ~ 150°C (TJ)
Interface: Parallel
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC5606S-DEMO-V2 |
|
Hersteller: NXP USA Inc.
Description: MPC5606S EVAL BRD
Description: MPC5606S EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8306CVMAFDCA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 369BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
Description: IC MPU MPC83XX 333MHZ 369BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8306SCVMAFDCA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 369BGA
Additional Interfaces: DUART, I2C, SPI, TDM
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
Description: IC MPU MPC83XX 333MHZ 369BGA
Additional Interfaces: DUART, I2C, SPI, TDM
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8306SVMAFDCA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 369BGA
Description: IC MPU MPC83XX 333MHZ 369BGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPC8306VMAFDCA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 369BGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
Description: IC MPU MPC83XX 333MHZ 369BGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8308CVMAGD |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 473MAPBGA
Graphics Acceleration: No
RAM Controllers: DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 473-MAPBGA (19x19)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 473-LFBGA
Packaging: Tray
Description: IC MPU MPC83XX 400MHZ 473MAPBGA
Graphics Acceleration: No
RAM Controllers: DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 473-MAPBGA (19x19)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 473-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8309CVMAGDCA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 489BGA
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Description: IC MPU MPC83XX 400MHZ 489BGA
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8313CVRAFFC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8313ECVRAFFC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 92.63 EUR |
| 10+ | 76.49 EUR |
| MPC8313ECZQADDC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 267MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 267MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8313ECZQAGDC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8313EVRAFFC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Part Status: Active
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Part Status: Active
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 81.38 EUR |
| 10+ | 66.95 EUR |
| MPC8313EZQADDC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Part Status: Obsolete
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8313EZQAGDC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8313VRAFFC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Part Status: Active
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Part Status: Active
auf Bestellung 400 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 70.59 EUR |
| 10+ | 57.84 EUR |
| 25+ | 54.66 EUR |
| 200+ | 49.86 EUR |
| MPC8548CPXAUJC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8548CVTAUJC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 783-FCBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.333GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 783-FCBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.333GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8548VTATGC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.2GHZ 783FCBGA
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 783-FCBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Description: IC MPU MPC85XX 1.2GHZ 783FCBGA
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 783-FCBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8548VTAUJC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.333GHz
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.333GHz
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8572ELPXAVNE |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.5GHZ 1023FCBGA
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
Number of Cores/Bus Width: 2 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 1023-FCBGA (33x33)
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.5GHz
Mounting Type: Surface Mount
Package / Case: 1023-BFBGA, FCBGA
Packaging: Box
Description: IC MPU MPC85XX 1.5GHZ 1023FCBGA
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
Number of Cores/Bus Width: 2 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 1023-FCBGA (33x33)
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.5GHz
Mounting Type: Surface Mount
Package / Case: 1023-BFBGA, FCBGA
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPL3115A2 |
|
Hersteller: NXP USA Inc.
Description: SENSOR 15.95PSIA 24BIT 8LGA
Output: 24 b
Mounting Type: Surface Mount
Output Type: I2C
Package / Case: 8-TLGA
Features: Temperature Compensated
Packaging: Tray
Part Status: Obsolete
Maximum Pressure: 72.52PSI (500kPa)
Port Style: No Port
Supplier Device Package: 8-LGA (3x5)
Applications: Board Mount
Voltage - Supply: 1.95V ~ 3.6V
Termination Style: SMD (SMT) Tab
Operating Temperature: -40°C ~ 85°C
Accuracy: ±0.058PSI (±0.4kPa)
Pressure Type: Absolute
Operating Pressure: 7.25PSI ~ 15.95PSI (50kPa ~ 110kPa)
Description: SENSOR 15.95PSIA 24BIT 8LGA
Output: 24 b
Mounting Type: Surface Mount
Output Type: I2C
Package / Case: 8-TLGA
Features: Temperature Compensated
Packaging: Tray
Part Status: Obsolete
Maximum Pressure: 72.52PSI (500kPa)
Port Style: No Port
Supplier Device Package: 8-LGA (3x5)
Applications: Board Mount
Voltage - Supply: 1.95V ~ 3.6V
Termination Style: SMD (SMT) Tab
Operating Temperature: -40°C ~ 85°C
Accuracy: ±0.058PSI (±0.4kPa)
Pressure Type: Absolute
Operating Pressure: 7.25PSI ~ 15.95PSI (50kPa ~ 110kPa)
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| MRF6V13250HSR3 |
Hersteller: NXP USA Inc.
Description: FET RF 120V 1.3GHZ NI780S
Description: FET RF 120V 1.3GHZ NI780S
Produkt ist nicht verfügbar
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| MRF6V13250HSR5 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.3GHz
Power - Output: 250W
Gain: 22.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.3GHz
Power - Output: 250W
Gain: 22.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 100 mA
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| MRF8HP21080HSR3 |
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 2.17GHZ NI780S-4
Current - Test: 150 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-780S-4L
Technology: LDMOS
Gain: 14.4dB
Power - Output: 16W
Configuration: Dual
Frequency: 2.17GHz
Mounting Type: Surface Mount
Package / Case: NI-780S-4L
Packaging: Tape & Reel (TR)
Description: FET RF 2CH 65V 2.17GHZ NI780S-4
Current - Test: 150 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-780S-4L
Technology: LDMOS
Gain: 14.4dB
Power - Output: 16W
Configuration: Dual
Frequency: 2.17GHz
Mounting Type: Surface Mount
Package / Case: NI-780S-4L
Packaging: Tape & Reel (TR)
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| MRF8P26080HR3 |
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 2.62GHZ NI780-4
Description: FET RF 2CH 65V 2.62GHZ NI780-4
Produkt ist nicht verfügbar
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| MRF8P26080HSR5 |
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 2.62GHZ NI780S-4
Description: FET RF 2CH 65V 2.62GHZ NI780S-4
Produkt ist nicht verfügbar
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| MRF8P29300HR6 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 30V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 2.9GHz
Configuration: Dual
Power - Output: 320W
Gain: 13.3dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 30V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 2.9GHz
Configuration: Dual
Power - Output: 320W
Gain: 13.3dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 100 mA
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| MRF8P29300HSR6 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 30V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 2.9GHz
Configuration: Dual
Power - Output: 320W
Gain: 13.3dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 30V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 2.9GHz
Configuration: Dual
Power - Output: 320W
Gain: 13.3dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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| MRF8P8300HSR6 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 820MHz
Configuration: Dual
Power - Output: 96W
Gain: 20.9dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Part Status: Active
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 2 A
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 820MHz
Configuration: Dual
Power - Output: 96W
Gain: 20.9dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Part Status: Active
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 2 A
Produkt ist nicht verfügbar
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| MRF8S8260HR3 |
Hersteller: NXP USA Inc.
Description: FET RF 70V 895MHZ NI880
Description: FET RF 70V 895MHZ NI880
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
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| MRF8S8260HSR3 |
Hersteller: NXP USA Inc.
Description: FET RF 70V 895MHZ NI880S
Description: FET RF 70V 895MHZ NI880S
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
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| MRFE6VP5600HR6 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
Mindestbestellmenge: 150 Stücke
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| MRFE6VP5600HSR6 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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| MSC8151TVT1000B |
|
Hersteller: NXP USA Inc.
Description: IC PROCESSOR SGL DGTL 783FCBGA
Description: IC PROCESSOR SGL DGTL 783FCBGA
Produkt ist nicht verfügbar
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| MSC8152SVT1000B |
|
Hersteller: NXP USA Inc.
Description: IC PROCESSOR DUAL DGTL 783FCBGA
Description: IC PROCESSOR DUAL DGTL 783FCBGA
Produkt ist nicht verfügbar
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| MSC8152TVT1000B |
|
Hersteller: NXP USA Inc.
Description: IC PROCESSOR DUAL DGTL 783FCBGA
Description: IC PROCESSOR DUAL DGTL 783FCBGA
Produkt ist nicht verfügbar
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| MSC8154ESVT1000B |
|
Hersteller: NXP USA Inc.
Description: IC PROCESSOR QUAD DGTL 783FCBGA
Description: IC PROCESSOR QUAD DGTL 783FCBGA
Produkt ist nicht verfügbar
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| MSC8154SVT1000B |
|
Hersteller: NXP USA Inc.
Description: IC PROCESSOR QUAD DGTL 783FCBGA
Description: IC PROCESSOR QUAD DGTL 783FCBGA
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| MSC8154VT1000B |
Hersteller: NXP USA Inc.
Description: IC PROCESSOR QUAD DGTL 783FCBGA
Description: IC PROCESSOR QUAD DGTL 783FCBGA
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| MSC8157ADS |
|
Hersteller: NXP USA Inc.
Description: MSC8157 EVAL BRD
Description: MSC8157 EVAL BRD
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| MSC8157EADS |
Hersteller: NXP USA Inc.
Description: MSC8157 EVAL BRD
Description: MSC8157 EVAL BRD
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| PK50N512CLQ100 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Produkt ist nicht verfügbar
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| PK51N256CLQ100 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Description: IC MCU 32BIT 256KB FLASH 144LQFP
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| PK51N256CMD100 |
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 144MAPBGA
Description: IC MCU 32B 256KB FLASH 144MAPBGA
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| PK51N512CLQ100 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Description: IC MCU 32BIT 512KB FLASH 144LQFP
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