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LPC1317FBD48,551 LPC1317FBD48,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 164 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.55 EUR
10+6.86 EUR
25+5.89 EUR
100+5.83 EUR
Mindestbestellmenge: 3
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LPC1345FBD48,151 LPC1345FBD48,151 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 148 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.45 EUR
10+6.21 EUR
25+6.15 EUR
100+6.1 EUR
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LPC1347FBD48,151 LPC1347FBD48,151 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 772 Stücke:
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2+11.28 EUR
10+7.12 EUR
25+7 EUR
100+6.89 EUR
250+6.8 EUR
500+6.73 EUR
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LPC1317FBD64,551 LPC1317FBD64,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 99 Stücke:
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2+10.42 EUR
10+8.03 EUR
25+7.43 EUR
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LPC1347FBD64,551 LPC1347FBD64,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 140 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.17 EUR
10+7.93 EUR
25+7.71 EUR
Mindestbestellmenge: 2
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LPC1316FHN33,551 LPC1316FHN33,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 48KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.12 EUR
10+6.99 EUR
25+6.46 EUR
100+5.88 EUR
260+5.19 EUR
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LPC1317FHN33,551 LPC1317FHN33,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 231 Stücke:
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2+9.7 EUR
10+5.56 EUR
25+5.53 EUR
100+5.5 EUR
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LPC1347FHN33,551 LPC1347FHN33,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 408 Stücke:
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2+11.37 EUR
10+6.63 EUR
25+6.58 EUR
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TWR-K60D100M TWR-K60D100M NXP USA Inc. TWR-K60D100MQSG.pdf Description: TOWER SYSTEM K60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K60
Platform: Tower System
auf Bestellung 5 Stücke:
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1+204.16 EUR
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LPC4357FET256,551 LPC4357FET256,551 NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OM13039,598 OM13039,598 NXP USA Inc. OM13039_Web.pdf Description: LPC1857 EVAL BRD
Produkt ist nicht verfügbar
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OM13040,598 OM13040,598 NXP USA Inc. OM13040_Web.pdf Description: LPC4357 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC4357
Part Status: Active
Produkt ist nicht verfügbar
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MK10DN512ZVLK10R MK10DN512ZVLK10R NXP USA Inc. K10P81M100SF2.pdf Description: IC MCU 32BIT 512KB FLASH 80FQFP
Produkt ist nicht verfügbar
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MK50DX256ZCLQ10 MK50DX256ZCLQ10 NXP USA Inc. K50PB.pdf Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK51DN512ZCLL10 MK51DN512ZCLL10 NXP USA Inc. KNTSK50FMLYFS.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 35x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PA32VLH MC9S08PA32VLH NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 700 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.86 EUR
10+4.58 EUR
160+3.76 EUR
480+3.68 EUR
Mindestbestellmenge: 4
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MC9S08PA60VLH MC9S08PA60VLH NXP USA Inc. MC9S08PA60_Rev1.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AFT05MS031NR1 AFT05MS031NR1 NXP USA Inc. AFT05MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
auf Bestellung 2000 Stücke:
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500+15.36 EUR
1000+15.03 EUR
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AFT09MS031NR1 AFT09MS031NR1 NXP USA Inc. AFT09MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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P1022NXN2LFB P1022NXN2LFB NXP USA Inc. QP1022FS.pdf Description: IC MPU QORIQ P1 1.067GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.067GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
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MK10DN512ZVLK10R MK10DN512ZVLK10R NXP USA Inc. K10P81M100SF2.pdf Description: IC MCU 32BIT 512KB FLASH 80FQFP
Produkt ist nicht verfügbar
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AFT05MS031NR1 AFT05MS031NR1 NXP USA Inc. AFT05MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
auf Bestellung 2179 Stücke:
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1+24.2 EUR
10+19.1 EUR
25+17.83 EUR
100+16.43 EUR
250+15.77 EUR
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AFT09MS031NR1 AFT09MS031NR1 NXP USA Inc. AFT09MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
auf Bestellung 384 Stücke:
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1+24.24 EUR
10+19.13 EUR
25+17.85 EUR
100+16.46 EUR
250+15.79 EUR
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MK20DN512ZVLK10 MK20DN512ZVLK10 NXP USA Inc. K20P81M100SF2.pdf Description: IC MCU 32BIT 512KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Not For New Designs
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK10DX128VFM5 MK10DX128VFM5 NXP USA Inc. K10P32M50SF0.pdf Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
auf Bestellung 2036 Stücke:
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3+6.95 EUR
10+5.41 EUR
Mindestbestellmenge: 3
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MK20DX128VFM5 MK20DX128VFM5 NXP USA Inc. K20P32M50SF0.pdf Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 6x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 20
DigiKey Programmable: Not Verified
auf Bestellung 657 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.79 EUR
10+6.2 EUR
25+6.17 EUR
100+6.16 EUR
490+6.14 EUR
Mindestbestellmenge: 2
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MK20DX128VMP5 MK20DX128VMP5 NXP USA Inc. K20P64M50SF0.pdf Description: IC MCU 32BIT 128KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 13x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK20DX128VLH5 MK20DX128VLH5 NXP USA Inc. K20P64M50SF0.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 13x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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MK20DX128VLF5 MK20DX128VLF5 NXP USA Inc. K20P48M50SF0.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 11x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Verified
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TWR-K40D100M TWR-K40D100M NXP USA Inc. K40D100MQSG.pdf Description: TOWER SYSTEM K40 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: K40
Platform: Tower System
Part Status: Active
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TWR-K20D72M TWR-K20D72M NXP USA Inc. Description: TOWER SYSTEM K20 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K20
Platform: Tower System
Produkt ist nicht verfügbar
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SSL21151T/1,118 NXP USA Inc. SSL2115x.pdf Description: IC LED DRIVER RGLTR 700MA 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 700mA (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-SOIC
Voltage - Supply (Max): 35V
Part Status: Discontinued at Digi-Key
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SSL21153T/1,118 NXP USA Inc. SSL2115x.pdf Description: IC LED DRIVER RGLTR 1.5A 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 1.5A (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 7-SOIC
Voltage - Supply (Max): 35V
Produkt ist nicht verfügbar
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SSL2109T/1,118 SSL2109T/1,118 NXP USA Inc. SSL2109T.pdf Description: IC LED DRIVER OFFL SWITCHER 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Voltage - Output: 600V
Mounting Type: Surface Mount
Number of Outputs: 1
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 125°C (TA)
Internal Switch(s): No
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-SO
Voltage - Supply (Min): 8V
Voltage - Supply (Max): 16V
Produkt ist nicht verfügbar
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MW7IC2020NT1 MW7IC2020NT1 NXP USA Inc. MW7IC2020N.pdf Description: RF MOSFET LDMOS 28V 24PQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 2.4W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 40 mA
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MW7IC2020NT1 MW7IC2020NT1 NXP USA Inc. MW7IC2020N.pdf Description: RF MOSFET LDMOS 28V 24PQFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 2.4W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 40 mA
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MPXH6300AC6T1 MPXH6300AC6T1 NXP USA Inc. MPXH6300A.pdf Description: SENSOR 44.09PSIA 0.13" 4.9V SSOP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.9 V
Operating Pressure: 2.9PSI ~ 44.09PSI (20kPa ~ 304kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.74V ~ 5.46V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 174.05PSI (1200kPa)
Part Status: Active
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MPXV7002DPT1 MPXV7002DPT1 NXP USA Inc. MPXV7002.pdf Description: SENSOR 0.29PSID 0.13" 4.5V 8SOP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.5 V ~ 4.5 V
Operating Pressure: ±0.29PSI (±2kPa)
Pressure Type: Differential
Accuracy: ±5%
Operating Temperature: 10°C ~ 60°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: ±10.88PSI (±75kPa)
Part Status: Active
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MC13783VK5R2 MC13783VK5R2 NXP USA Inc. MC13783.pdf Description: IC PWR MNGMNT ATLAS 3G 247MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 247-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Handheld/Mobile Devices
Supplier Device Package: 247-MAPBGA (10x10)
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MC33886PVWR2 MC33886PVWR2 NXP USA Inc. MC33886.pdf Description: IC MOTOR DRIVER 5V-40V 20HSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
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MC33887APVWR2 MC33887APVWR2 NXP USA Inc. MC33887.pdf Description: IC MOTOR DRIVER 5V-28V 20HSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
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MC33926PNBR2 MC33926PNBR2 NXP USA Inc. MC33926.pdf Description: IC MOTOR DRIVER 5V-28V 32PQFN
Packaging: Cut Tape (CT)
Package / Case: 32-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-PQFN (8x8)
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
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MC33972ATEWR2 MC33972ATEWR2 NXP USA Inc. MC33972.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Part Status: Active
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MC9RS08KA2CSCR MC9RS08KA2CSCR NXP USA Inc. MC9RS08KA2.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 63 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Peripherals: LVD, POR, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
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MC9S08QD4CSCR MC9S08QD4CSCR NXP USA Inc. MC9S08QD4_Fact_Sheet.pdf Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
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MC9S08SH8CTJR MC9S08SH8CTJR NXP USA Inc. MC9S08SH8.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
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MPX2300DT1 MPX2300DT1 NXP USA Inc. MPX2300DT1.pdf Description: SENSOR 5.8PSID .003006V
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 4-SSIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 3.006 mV (6V)
Operating Pressure: 5.8PSI (40kPa)
Pressure Type: Differential
Accuracy: ±1.5%
Operating Temperature: 15°C ~ 40°C
Termination Style: PC Pin
Voltage - Supply: 6V ~ 10V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 125PSI (861.84kPa)
Part Status: Active
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MPXM2010GST1 MPXM2010GST1 NXP USA Inc. MPX2010.pdf description Description: SENSOR 1.45PSIG 0.12" .025V MPAK
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 5-SMD Module, Top Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.12" (2.97mm) Tube
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
Part Status: Active
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MRF1535NT1 MRF1535NT1 NXP USA Inc. MRF1535N.pdf Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272AA
Current Rating (Amps): 6A
Mounting Type: Chassis Mount
Frequency: 520MHz
Power - Output: 35W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA
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MRF1550NT1 MRF1550NT1 NXP USA Inc. MRF1550%28F%29NT1.pdf Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272AA
Current Rating (Amps): 12A
Mounting Type: Chassis Mount
Frequency: 175MHz
Power - Output: 50W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA
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MRF1570FNT1 MRF1570FNT1 NXP USA Inc. MRF1570(F)NT1.pdf Description: RF MOSFET LDMOS 12.5V TO272-8
Packaging: Cut Tape (CT)
Package / Case: TO-272-8
Mounting Type: Chassis Mount
Frequency: 470MHz
Power - Output: 70W
Gain: 11.5dB
Technology: LDMOS
Supplier Device Package: TO-272-8
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 800 mA
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MRF6S18060NR1 MRF6S18060NR1 NXP USA Inc. MRF6S18060NR1%2CNBR1.pdf Description: RF MOSFET LDMOS 26V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 1.99GHz
Power - Output: 60W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 600 mA
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MRF6S20010GNR1 MRF6S20010GNR1 NXP USA Inc. MRF6S20010N.pdf Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA
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MRF6S21050LR3 MRF6S21050LR3 NXP USA Inc. MRF6S21050L.pdf Description: FET RF 68V 2.16GHZ NI-400
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MRF6V12250HR5 MRF6V12250HR5 NXP USA Inc. MRF6V12250H.pdf Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MRF6V2010NR1 MRF6V2010NR1 NXP USA Inc. MRF6V2010N.pdf Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA
Produkt ist nicht verfügbar
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MRF6V2150NBR1 MRF6V2150NBR1 NXP USA Inc. MRF6V2150N%28B%29R1.pdf Description: RF MOSFET LDMOS 50V TO272-4
Packaging: Cut Tape (CT)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 150W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
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MRF6V2300NBR1 MRF6V2300NBR1 NXP USA Inc. MRF6V2300N%28B%29R1.pdf Description: RF MOSFET LDMOS 50V TO272-4
Packaging: Cut Tape (CT)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 300W
Gain: 25.5dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 900 mA
Produkt ist nicht verfügbar
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MRF6V3090NBR5 MRF6V3090NBR5 NXP USA Inc. MRF6V3090NBRx,NRx.pdf Description: FET RF 110V 860MHZ TO272-4
Packaging: Cut Tape (CT)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 18W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 350 mA
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MRF6VP2600HR6 MRF6VP2600HR6 NXP USA Inc. MRF6VP2600HR6.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 125W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 2.6 A
Produkt ist nicht verfügbar
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LPC1317FBD48,551 LPC1315_16_17_45_46_47.pdf
LPC1317FBD48,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 164 Stücke:
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Anzahl Preis
3+8.55 EUR
10+6.86 EUR
25+5.89 EUR
100+5.83 EUR
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LPC1345FBD48,151 LPC1315_16_17_45_46_47.pdf
LPC1345FBD48,151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 148 Stücke:
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Anzahl Preis
2+10.45 EUR
10+6.21 EUR
25+6.15 EUR
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LPC1347FBD48,151 LPC1315_16_17_45_46_47.pdf
LPC1347FBD48,151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 772 Stücke:
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Anzahl Preis
2+11.28 EUR
10+7.12 EUR
25+7 EUR
100+6.89 EUR
250+6.8 EUR
500+6.73 EUR
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LPC1317FBD64,551 LPC1315_16_17_45_46_47.pdf
LPC1317FBD64,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 99 Stücke:
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Anzahl Preis
2+10.42 EUR
10+8.03 EUR
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LPC1347FBD64,551 LPC1315_16_17_45_46_47.pdf
LPC1347FBD64,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 140 Stücke:
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Anzahl Preis
2+9.17 EUR
10+7.93 EUR
25+7.71 EUR
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LPC1316FHN33,551 LPC1315_16_17_45_46_47.pdf
LPC1316FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 260 Stücke:
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Anzahl Preis
2+9.12 EUR
10+6.99 EUR
25+6.46 EUR
100+5.88 EUR
260+5.19 EUR
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LPC1317FHN33,551 LPC1315_16_17_45_46_47.pdf
LPC1317FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 231 Stücke:
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Anzahl Preis
2+9.7 EUR
10+5.56 EUR
25+5.53 EUR
100+5.5 EUR
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LPC1347FHN33,551 LPC1315_16_17_45_46_47.pdf
LPC1347FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 408 Stücke:
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Anzahl Preis
2+11.37 EUR
10+6.63 EUR
25+6.58 EUR
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TWR-K60D100M TWR-K60D100MQSG.pdf
TWR-K60D100M
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K60
Platform: Tower System
auf Bestellung 5 Stücke:
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Anzahl Preis
1+204.16 EUR
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LPC4357FET256,551 LPC435X_3X_2X_1X.pdf
LPC4357FET256,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OM13039,598 OM13039_Web.pdf
OM13039,598
Hersteller: NXP USA Inc.
Description: LPC1857 EVAL BRD
Produkt ist nicht verfügbar
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OM13040,598 OM13040_Web.pdf
OM13040,598
Hersteller: NXP USA Inc.
Description: LPC4357 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC4357
Part Status: Active
Produkt ist nicht verfügbar
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MK10DN512ZVLK10R K10P81M100SF2.pdf
MK10DN512ZVLK10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Produkt ist nicht verfügbar
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MK50DX256ZCLQ10 K50PB.pdf
MK50DX256ZCLQ10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK51DN512ZCLL10 KNTSK50FMLYFS.pdf
MK51DN512ZCLL10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 35x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PA32VLH
MC9S08PA32VLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 700 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.86 EUR
10+4.58 EUR
160+3.76 EUR
480+3.68 EUR
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MC9S08PA60VLH MC9S08PA60_Rev1.pdf
MC9S08PA60VLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AFT05MS031NR1 AFT05MS031N.pdf
AFT05MS031NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
500+15.36 EUR
1000+15.03 EUR
Mindestbestellmenge: 500
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AFT09MS031NR1 AFT09MS031N.pdf
AFT09MS031NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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P1022NXN2LFB QP1022FS.pdf
P1022NXN2LFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.067GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.067GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
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MK10DN512ZVLK10R K10P81M100SF2.pdf
MK10DN512ZVLK10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Produkt ist nicht verfügbar
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AFT05MS031NR1 AFT05MS031N.pdf
AFT05MS031NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
auf Bestellung 2179 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+24.2 EUR
10+19.1 EUR
25+17.83 EUR
100+16.43 EUR
250+15.77 EUR
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AFT09MS031NR1 AFT09MS031N.pdf
AFT09MS031NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
auf Bestellung 384 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+24.24 EUR
10+19.13 EUR
25+17.85 EUR
100+16.46 EUR
250+15.79 EUR
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MK20DN512ZVLK10 K20P81M100SF2.pdf
MK20DN512ZVLK10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Not For New Designs
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK10DX128VFM5 K10P32M50SF0.pdf
MK10DX128VFM5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
auf Bestellung 2036 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.95 EUR
10+5.41 EUR
Mindestbestellmenge: 3
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MK20DX128VFM5 K20P32M50SF0.pdf
MK20DX128VFM5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 6x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 20
DigiKey Programmable: Not Verified
auf Bestellung 657 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.79 EUR
10+6.2 EUR
25+6.17 EUR
100+6.16 EUR
490+6.14 EUR
Mindestbestellmenge: 2
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MK20DX128VMP5 K20P64M50SF0.pdf
MK20DX128VMP5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 13x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK20DX128VLH5 K20P64M50SF0.pdf
MK20DX128VLH5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 13x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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MK20DX128VLF5 K20P48M50SF0.pdf
MK20DX128VLF5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 11x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Verified
auf Bestellung 650 Stücke:
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Anzahl Preis
2+10.82 EUR
10+8.31 EUR
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100+7.22 EUR
250+6.68 EUR
500+6.61 EUR
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TWR-K40D100M K40D100MQSG.pdf
TWR-K40D100M
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K40 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: K40
Platform: Tower System
Part Status: Active
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TWR-K20D72M
TWR-K20D72M
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K20 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K20
Platform: Tower System
Produkt ist nicht verfügbar
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SSL21151T/1,118 SSL2115x.pdf
Hersteller: NXP USA Inc.
Description: IC LED DRIVER RGLTR 700MA 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 700mA (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-SOIC
Voltage - Supply (Max): 35V
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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SSL21153T/1,118 SSL2115x.pdf
Hersteller: NXP USA Inc.
Description: IC LED DRIVER RGLTR 1.5A 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 1.5A (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 7-SOIC
Voltage - Supply (Max): 35V
Produkt ist nicht verfügbar
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SSL2109T/1,118 SSL2109T.pdf
SSL2109T/1,118
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Voltage - Output: 600V
Mounting Type: Surface Mount
Number of Outputs: 1
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 125°C (TA)
Internal Switch(s): No
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-SO
Voltage - Supply (Min): 8V
Voltage - Supply (Max): 16V
Produkt ist nicht verfügbar
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MW7IC2020NT1 MW7IC2020N.pdf
MW7IC2020NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V 24PQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 2.4W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 40 mA
Produkt ist nicht verfügbar
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MW7IC2020NT1 MW7IC2020N.pdf
MW7IC2020NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V 24PQFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 2.4W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 40 mA
auf Bestellung 930 Stücke:
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MPXH6300AC6T1 MPXH6300A.pdf
MPXH6300AC6T1
Hersteller: NXP USA Inc.
Description: SENSOR 44.09PSIA 0.13" 4.9V SSOP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.9 V
Operating Pressure: 2.9PSI ~ 44.09PSI (20kPa ~ 304kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.74V ~ 5.46V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 174.05PSI (1200kPa)
Part Status: Active
auf Bestellung 327 Stücke:
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1+25.59 EUR
5+23.32 EUR
10+22.47 EUR
25+21.45 EUR
50+20.85 EUR
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MPXV7002DPT1 MPXV7002.pdf
MPXV7002DPT1
Hersteller: NXP USA Inc.
Description: SENSOR 0.29PSID 0.13" 4.5V 8SOP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.5 V ~ 4.5 V
Operating Pressure: ±0.29PSI (±2kPa)
Pressure Type: Differential
Accuracy: ±5%
Operating Temperature: 10°C ~ 60°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: ±10.88PSI (±75kPa)
Part Status: Active
auf Bestellung 3581 Stücke:
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Anzahl Preis
1+28.44 EUR
5+25.93 EUR
10+25 EUR
25+23.89 EUR
50+23.43 EUR
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MC13783VK5R2 MC13783.pdf
MC13783VK5R2
Hersteller: NXP USA Inc.
Description: IC PWR MNGMNT ATLAS 3G 247MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 247-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Handheld/Mobile Devices
Supplier Device Package: 247-MAPBGA (10x10)
Produkt ist nicht verfügbar
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MC33886PVWR2 MC33886.pdf
MC33886PVWR2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-40V 20HSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
auf Bestellung 4577 Stücke:
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2+15.4 EUR
10+12.01 EUR
25+11.16 EUR
100+10.23 EUR
250+9.79 EUR
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MC33887APVWR2 MC33887.pdf
MC33887APVWR2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 20HSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
auf Bestellung 3257 Stücke:
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Anzahl Preis
2+16.46 EUR
10+12.88 EUR
25+11.99 EUR
100+11 EUR
250+10.53 EUR
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MC33926PNBR2 MC33926.pdf
MC33926PNBR2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 32PQFN
Packaging: Cut Tape (CT)
Package / Case: 32-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-PQFN (8x8)
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
auf Bestellung 1806 Stücke:
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Anzahl Preis
2+13.25 EUR
10+10.29 EUR
25+9.55 EUR
100+8.74 EUR
250+8.35 EUR
500+8.12 EUR
1000+7.92 EUR
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MC33972ATEWR2 MC33972.pdf
MC33972ATEWR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Part Status: Active
auf Bestellung 1854 Stücke:
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3+8.27 EUR
10+6.32 EUR
25+5.84 EUR
100+5.3 EUR
250+5.04 EUR
500+4.89 EUR
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MC9RS08KA2CSCR MC9RS08KA2.pdf
MC9RS08KA2CSCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 63 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Peripherals: LVD, POR, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
auf Bestellung 2321 Stücke:
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Anzahl Preis
6+2.97 EUR
10+2.18 EUR
25+1.98 EUR
100+1.76 EUR
250+1.66 EUR
500+1.6 EUR
1000+1.55 EUR
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MC9S08QD4CSCR MC9S08QD4_Fact_Sheet.pdf
MC9S08QD4CSCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
auf Bestellung 6914 Stücke:
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4+5.21 EUR
10+3.9 EUR
25+3.57 EUR
100+3.21 EUR
250+3.04 EUR
500+2.94 EUR
1000+2.86 EUR
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MC9S08SH8CTJR MC9S08SH8.pdf
MC9S08SH8CTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPX2300DT1 MPX2300DT1.pdf
MPX2300DT1
Hersteller: NXP USA Inc.
Description: SENSOR 5.8PSID .003006V
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 4-SSIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 3.006 mV (6V)
Operating Pressure: 5.8PSI (40kPa)
Pressure Type: Differential
Accuracy: ±1.5%
Operating Temperature: 15°C ~ 40°C
Termination Style: PC Pin
Voltage - Supply: 6V ~ 10V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 125PSI (861.84kPa)
Part Status: Active
auf Bestellung 858 Stücke:
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Anzahl Preis
2+11.51 EUR
5+10.38 EUR
10+9.96 EUR
25+9.46 EUR
50+9.12 EUR
100+8.81 EUR
500+8.54 EUR
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MPXM2010GST1 description MPX2010.pdf
MPXM2010GST1
Hersteller: NXP USA Inc.
Description: SENSOR 1.45PSIG 0.12" .025V MPAK
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 5-SMD Module, Top Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.12" (2.97mm) Tube
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
Part Status: Active
auf Bestellung 4064 Stücke:
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Anzahl Preis
2+16.95 EUR
5+15.37 EUR
10+14.78 EUR
25+14.07 EUR
50+13.59 EUR
100+13.17 EUR
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MRF1535NT1 MRF1535N.pdf
MRF1535NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272AA
Current Rating (Amps): 6A
Mounting Type: Chassis Mount
Frequency: 520MHz
Power - Output: 35W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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MRF1550NT1 MRF1550%28F%29NT1.pdf
MRF1550NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272AA
Current Rating (Amps): 12A
Mounting Type: Chassis Mount
Frequency: 175MHz
Power - Output: 50W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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MRF1570FNT1 MRF1570(F)NT1.pdf
MRF1570FNT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO272-8
Packaging: Cut Tape (CT)
Package / Case: TO-272-8
Mounting Type: Chassis Mount
Frequency: 470MHz
Power - Output: 70W
Gain: 11.5dB
Technology: LDMOS
Supplier Device Package: TO-272-8
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
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MRF6S18060NR1 MRF6S18060NR1%2CNBR1.pdf
MRF6S18060NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 1.99GHz
Power - Output: 60W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 600 mA
Produkt ist nicht verfügbar
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MRF6S20010GNR1 MRF6S20010N.pdf
MRF6S20010GNR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA
auf Bestellung 157 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+83.74 EUR
10+68.73 EUR
25+64.98 EUR
100+60.87 EUR
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MRF6S21050LR3 MRF6S21050L.pdf
MRF6S21050LR3
Hersteller: NXP USA Inc.
Description: FET RF 68V 2.16GHZ NI-400
Produkt ist nicht verfügbar
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MRF6V12250HR5 MRF6V12250H.pdf
MRF6V12250HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MRF6V2010NR1 MRF6V2010N.pdf
MRF6V2010NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA
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MRF6V2150NBR1 MRF6V2150N%28B%29R1.pdf
MRF6V2150NBR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO272-4
Packaging: Cut Tape (CT)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 150W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 450 mA
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MRF6V2300NBR1 MRF6V2300N%28B%29R1.pdf
MRF6V2300NBR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO272-4
Packaging: Cut Tape (CT)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 300W
Gain: 25.5dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 900 mA
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MRF6V3090NBR5 MRF6V3090NBRx,NRx.pdf
MRF6V3090NBR5
Hersteller: NXP USA Inc.
Description: FET RF 110V 860MHZ TO272-4
Packaging: Cut Tape (CT)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 18W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 350 mA
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MRF6VP2600HR6 MRF6VP2600HR6.pdf
MRF6VP2600HR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 125W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 2.6 A
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