Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35543) > Seite 206 nach 593
Foto | Bezeichnung | Hersteller | Beschreibung |
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LPC4357FET256,551 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 204MHz Program Memory Size: 1MB (1M x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 256-LBGA (17x17) Number of I/O: 164 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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OM13039,598 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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OM13040,598 | NXP USA Inc. |
![]() Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), LCD Core Processor: ARM® Cortex®-M4 Board Type: Evaluation Platform Utilized IC / Part: LPC4357 Part Status: Active |
Produkt ist nicht verfügbar |
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MK10DN512ZVLK10R | NXP USA Inc. |
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MK50DX256ZCLQ10 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 41x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 96 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MK51DN512ZCLL10 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 35x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S08PA32VLH | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 57 DigiKey Programmable: Not Verified |
auf Bestellung 700 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08PA60VLH | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Not For New Designs Number of I/O: 57 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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AFT05MS031NR1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 520MHz Power - Output: 31W Gain: 17.7dB Technology: LDMOS Supplier Device Package: TO-270-2 Part Status: Active Voltage - Rated: 40 V Voltage - Test: 13.6 V Current - Test: 10 mA |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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AFT09MS031NR1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 870MHz Power - Output: 31W Gain: 17.2dB Technology: LDMOS Supplier Device Package: TO-270-2 Part Status: Active Voltage - Rated: 40 V Voltage - Test: 13.6 V Current - Test: 500 mA |
Produkt ist nicht verfügbar |
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P1022NXN2LFB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.067GHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI |
Produkt ist nicht verfügbar |
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MK10DN512ZVLK10R | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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AFT05MS031NR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 520MHz Power - Output: 31W Gain: 17.7dB Technology: LDMOS Supplier Device Package: TO-270-2 Part Status: Active Voltage - Rated: 40 V Voltage - Test: 13.6 V Current - Test: 10 mA |
auf Bestellung 2179 Stücke: Lieferzeit 10-14 Tag (e) |
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AFT09MS031NR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 870MHz Power - Output: 31W Gain: 17.2dB Technology: LDMOS Supplier Device Package: TO-270-2 Part Status: Active Voltage - Rated: 40 V Voltage - Test: 13.6 V Current - Test: 500 mA |
auf Bestellung 384 Stücke: Lieferzeit 10-14 Tag (e) |
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MK20DN512ZVLK10 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 27x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Part Status: Not For New Designs Number of I/O: 52 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MK10DX128VFM5 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 10x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Part Status: Active Number of I/O: 24 DigiKey Programmable: Not Verified |
auf Bestellung 2036 Stücke: Lieferzeit 10-14 Tag (e) |
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MK20DX128VFM5 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 6x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Part Status: Active Number of I/O: 20 DigiKey Programmable: Not Verified |
auf Bestellung 876 Stücke: Lieferzeit 10-14 Tag (e) |
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MK20DX128VMP5 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 13x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-MAPBGA (5x5) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MK20DX128VLH5 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 13x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 1568 Stücke: Lieferzeit 10-14 Tag (e) |
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MK20DX128VLF5 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 11x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 29 DigiKey Programmable: Verified |
auf Bestellung 474 Stücke: Lieferzeit 10-14 Tag (e) |
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TWR-K40D100M | NXP USA Inc. |
![]() Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), LCD Core Processor: ARM® Cortex®-M4 Board Type: Evaluation Platform Utilized IC / Part: K40 Platform: Tower System Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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TWR-K20D72M | NXP USA Inc. |
Description: TOWER SYSTEM K20 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M4 Utilized IC / Part: K20 Platform: Tower System |
Produkt ist nicht verfügbar |
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SSL21151T/1,118 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads Mounting Type: Surface Mount Number of Outputs: 1 Frequency: 50.5kHz Type: DC DC Regulator Operating Temperature: -40°C ~ 85°C (TA) Current - Output / Channel: 700mA (Switch) Internal Switch(s): Yes Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost) Supplier Device Package: 8-SOIC Voltage - Supply (Max): 35V Part Status: Discontinued at Digi-Key |
Produkt ist nicht verfügbar |
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SSL21153T/1,118 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads Mounting Type: Surface Mount Number of Outputs: 1 Frequency: 50.5kHz Type: DC DC Regulator Operating Temperature: -40°C ~ 85°C (TA) Current - Output / Channel: 1.5A (Switch) Internal Switch(s): Yes Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost) Supplier Device Package: 7-SOIC Voltage - Supply (Max): 35V |
Produkt ist nicht verfügbar |
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SSL2109T/1,118 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Voltage - Output: 600V Mounting Type: Surface Mount Number of Outputs: 1 Type: AC DC Offline Switcher Operating Temperature: -40°C ~ 125°C (TA) Internal Switch(s): No Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost) Supplier Device Package: 8-SO Voltage - Supply (Min): 8V Voltage - Supply (Max): 16V |
Produkt ist nicht verfügbar |
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MW7IC2020NT1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-PowerQFN Mounting Type: Surface Mount Frequency: 2.14GHz Power - Output: 2.4W Gain: 32.6dB Technology: LDMOS Supplier Device Package: 24-PQFN (8x8) Part Status: Active Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 40 mA |
Produkt ist nicht verfügbar |
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MW7IC2020NT1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 24-PowerQFN Mounting Type: Surface Mount Frequency: 2.14GHz Power - Output: 2.4W Gain: 32.6dB Technology: LDMOS Supplier Device Package: 24-PQFN (8x8) Part Status: Active Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 40 mA |
auf Bestellung 930 Stücke: Lieferzeit 10-14 Tag (e) |
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MPXH6300AC6T1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Features: Temperature Compensated Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.3 V ~ 4.9 V Operating Pressure: 2.9PSI ~ 44.09PSI (20kPa ~ 304kPa) Pressure Type: Absolute Accuracy: ±1.5% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 4.74V ~ 5.46V Port Size: Male - 0.13" (3.3mm) Tube Applications: Board Mount Supplier Device Package: 8-SSOP Port Style: Barbless Maximum Pressure: 174.05PSI (1200kPa) Part Status: Active |
auf Bestellung 408 Stücke: Lieferzeit 10-14 Tag (e) |
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MPXV7002DPT1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Features: Temperature Compensated Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.5 V ~ 4.5 V Operating Pressure: ±0.29PSI (±2kPa) Pressure Type: Differential Accuracy: ±5% Operating Temperature: 10°C ~ 60°C Termination Style: Gull Wing Voltage - Supply: 4.75V ~ 5.25V Port Size: Male - 0.13" (3.3mm) Tube, Dual Applications: Board Mount Supplier Device Package: 8-SOP Port Style: Barbed Maximum Pressure: ±10.88PSI (±75kPa) Part Status: Active |
auf Bestellung 4056 Stücke: Lieferzeit 10-14 Tag (e) |
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MC13783VK5R2 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 247-TFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Applications: Handheld/Mobile Devices Supplier Device Package: 247-MAPBGA (10x10) |
Produkt ist nicht verfügbar |
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MC33886PVWR2 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 5A Interface: Parallel Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 40V Applications: General Purpose Technology: CMOS Voltage - Load: 5V ~ 40V Supplier Device Package: 20-HSOP Motor Type - AC, DC: Brushed DC Part Status: Active |
auf Bestellung 4827 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33887APVWR2 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 5A Interface: Parallel Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Applications: General Purpose Technology: Power MOSFET Voltage - Load: 5V ~ 28V Supplier Device Package: 20-HSOP Motor Type - AC, DC: Brushed DC Part Status: Active |
auf Bestellung 3725 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33926PNBR2 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 32-PowerQFN Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 5A Interface: Parallel Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Technology: CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 32-PQFN (8x8) Motor Type - AC, DC: Brushed DC Part Status: Active Grade: Automotive |
auf Bestellung 2229 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33972ATEWR2 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 3.1V ~ 5.25V Applications: Switch Monitoring Supplier Device Package: 32-SOIC Part Status: Active |
auf Bestellung 3685 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9RS08KA2CSCR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 10MHz Program Memory Size: 2KB (2K x 8) RAM Size: 63 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: RS08 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Peripherals: LVD, POR, WDT Supplier Device Package: 8-SOIC Part Status: Active Number of I/O: 4 DigiKey Programmable: Verified |
auf Bestellung 2321 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08QD4CSCR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Part Status: Active Number of I/O: 4 DigiKey Programmable: Verified |
auf Bestellung 6914 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08SH8CTJR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 17 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MPX2300DT1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Features: Temperature Compensated Package / Case: 4-SSIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 3.006 mV (6V) Operating Pressure: 5.8PSI (40kPa) Pressure Type: Differential Accuracy: ±1.5% Operating Temperature: 15°C ~ 40°C Termination Style: PC Pin Voltage - Supply: 6V ~ 10V Applications: Board Mount Port Style: No Port Maximum Pressure: 125PSI (861.84kPa) Part Status: Active |
Produkt ist nicht verfügbar |
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MPXM2010GST1 | NXP USA Inc. |
![]() ![]() Packaging: Cut Tape (CT) Features: Temperature Compensated Package / Case: 5-SMD Module, Top Port Output Type: Wheatstone Bridge Mounting Type: Surface Mount Output: 0 mV ~ 25 mV (10V) Operating Pressure: 1.45PSI (10kPa) Pressure Type: Vented Gauge Accuracy: ±1% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 10V ~ 16V Port Size: Male - 0.12" (2.97mm) Tube Applications: Board Mount Supplier Device Package: 5-MPAK Port Style: Barbless Maximum Pressure: 10.88PSI (75kPa) Part Status: Active |
auf Bestellung 6565 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF1535NT1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-272AA Current Rating (Amps): 6A Mounting Type: Chassis Mount Frequency: 520MHz Power - Output: 35W Gain: 13.5dB Technology: LDMOS Supplier Device Package: TO-272-6 Voltage - Rated: 40 V Voltage - Test: 12.5 V Current - Test: 500 mA |
Produkt ist nicht verfügbar |
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MRF1550NT1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-272AA Current Rating (Amps): 12A Mounting Type: Chassis Mount Frequency: 175MHz Power - Output: 50W Gain: 14.5dB Technology: LDMOS Supplier Device Package: TO-272-6 Voltage - Rated: 40 V Voltage - Test: 12.5 V Current - Test: 500 mA |
Produkt ist nicht verfügbar |
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MRF1570FNT1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-272-8 Mounting Type: Chassis Mount Frequency: 470MHz Power - Output: 70W Gain: 11.5dB Technology: LDMOS Supplier Device Package: TO-272-8 Voltage - Rated: 40 V Voltage - Test: 12.5 V Current - Test: 800 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRF6S18060NR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-270AB Mounting Type: Surface Mount Frequency: 1.99GHz Power - Output: 60W Gain: 15dB Technology: LDMOS Supplier Device Package: TO-270 WB-4 Part Status: Obsolete Voltage - Rated: 68 V Voltage - Test: 26 V Current - Test: 600 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRF6S20010GNR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-270BA Mounting Type: Surface Mount Frequency: 2.17GHz Power - Output: 10W Gain: 15.5dB Technology: LDMOS Supplier Device Package: TO-270-2 GULL Part Status: Obsolete Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 130 mA |
auf Bestellung 157 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF6S21050LR3 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRF6V12250HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Cut Tape (CT) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 1.03GHz Power - Output: 275W Gain: 20.3dB Technology: LDMOS Supplier Device Package: NI-780H-2L Voltage - Rated: 100 V Voltage - Test: 50 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRF6V2010NR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 220MHz Power - Output: 10W Gain: 23.9dB Technology: LDMOS Supplier Device Package: TO-270-2 Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 30 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRF6V2150NBR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-272BB Mounting Type: Chassis Mount Frequency: 220MHz Power - Output: 150W Gain: 25dB Technology: LDMOS Supplier Device Package: TO-272 WB-4 Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 450 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRF6V2300NBR1 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRF6V3090NBR5 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-272BB Mounting Type: Chassis Mount Frequency: 860MHz Power - Output: 18W Gain: 22dB Technology: LDMOS Supplier Device Package: TO-272 WB-4 Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 350 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRF6VP2600HR6 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 225MHz Configuration: Dual Power - Output: 125W Gain: 25dB Technology: LDMOS Supplier Device Package: NI-1230 Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 2.6 A |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRFE6S9125NR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-270AB Mounting Type: Surface Mount Frequency: 880MHz Power - Output: 27W Gain: 20.2dB Technology: LDMOS Supplier Device Package: TO-270 WB-4 Part Status: Obsolete Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 950 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRFE6VP61K25HR6 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 1250W Gain: 24dB Technology: LDMOS Supplier Device Package: NI-1230 Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
auf Bestellung 149 Stücke: Lieferzeit 10-14 Tag (e) |
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MW6S010GNR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-270BA Mounting Type: Surface Mount Frequency: 960MHz Power - Output: 10W Gain: 18dB Technology: LDMOS Supplier Device Package: TO-270-2 GULL Part Status: Active Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 125 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MW7IC008NT1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 24-PowerQFN Mounting Type: Surface Mount Frequency: 100MHz ~ 1GHz RF Type: General Purpose Voltage - Supply: 32V Gain: 23.5dB Current - Supply: 75mA P1dB: 40.4dBm Test Frequency: 100MHz Supplier Device Package: 24-PQFN (8x8) Part Status: Not For New Designs |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MW7IC2040NBR1 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MW7IC2725NBR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-272-16 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 2.7GHz RF Type: WiMax Voltage - Supply: 32V Gain: 28.5dB Current - Supply: 275mA P1dB: 44dBm Test Frequency: 2.7GHz Supplier Device Package: TO-272 WB-16 Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MW7IC915NT1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 24-PowerQFN Mounting Type: Surface Mount Frequency: 728MHz ~ 960MHz RF Type: W-CDMA Voltage - Supply: 28V Gain: 38dB P1dB: 15.5W Supplier Device Package: 24-PQFN (8x8) Part Status: Active |
auf Bestellung 2914 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08SG8E2VTJR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Part Status: Active Number of I/O: 16 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SGTL5000XNAA3R2 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Stereo Audio Data Interface: I2C, Serial, SPI™ Operating Temperature: -40°C ~ 85°C Voltage - Supply, Analog: 1.62V ~ 3.6V Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V Number of ADCs / DACs: 1 / 1 S/N Ratio, ADCs / DACs (db) Typ: 90 / 100 Sigma Delta: No Supplier Device Package: 32-QFN-EP (5x5) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
LPC4357FET256,551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
OM13039,598 |
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Hersteller: NXP USA Inc.
Description: LPC1857 EVAL BRD
Description: LPC1857 EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
OM13040,598 |
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Hersteller: NXP USA Inc.
Description: LPC4357 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC4357
Part Status: Active
Description: LPC4357 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC4357
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MK10DN512ZVLK10R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MK50DX256ZCLQ10 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MK51DN512ZCLL10 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 35x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 35x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC9S08PA32VLH |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 700 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 5.86 EUR |
10+ | 4.58 EUR |
160+ | 3.76 EUR |
480+ | 3.68 EUR |
MC9S08PA60VLH |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AFT05MS031NR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
500+ | 15.36 EUR |
1000+ | 15.03 EUR |
AFT09MS031NR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
P1022NXN2LFB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.067GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.067GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Description: IC MPU QORIQ P1 1.067GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.067GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MK10DN512ZVLK10R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AFT05MS031NR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
auf Bestellung 2179 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 24.20 EUR |
10+ | 19.10 EUR |
25+ | 17.83 EUR |
100+ | 16.43 EUR |
250+ | 15.77 EUR |
AFT09MS031NR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
auf Bestellung 384 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 24.24 EUR |
10+ | 19.13 EUR |
25+ | 17.85 EUR |
100+ | 16.46 EUR |
250+ | 15.79 EUR |
MK20DN512ZVLK10 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Not For New Designs
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Not For New Designs
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MK10DX128VFM5 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
auf Bestellung 2036 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 6.95 EUR |
10+ | 5.41 EUR |
MK20DX128VFM5 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 6x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 20
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 6x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 20
DigiKey Programmable: Not Verified
auf Bestellung 876 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 11.32 EUR |
10+ | 6.76 EUR |
25+ | 6.63 EUR |
100+ | 6.50 EUR |
MK20DX128VMP5 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 13x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 13x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MK20DX128VLH5 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 13x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 13x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1568 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 10.44 EUR |
10+ | 8.52 EUR |
25+ | 8.28 EUR |
160+ | 7.95 EUR |
320+ | 7.85 EUR |
MK20DX128VLF5 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 11x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Verified
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 11x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Verified
auf Bestellung 474 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 11.33 EUR |
10+ | 8.69 EUR |
25+ | 7.66 EUR |
100+ | 7.63 EUR |
250+ | 7.09 EUR |
TWR-K40D100M |
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Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K40 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: K40
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM K40 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: K40
Platform: Tower System
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 198.53 EUR |
TWR-K20D72M |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K20 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K20
Platform: Tower System
Description: TOWER SYSTEM K20 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K20
Platform: Tower System
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SSL21151T/1,118 |
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Hersteller: NXP USA Inc.
Description: IC LED DRIVER RGLTR 700MA 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 700mA (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-SOIC
Voltage - Supply (Max): 35V
Part Status: Discontinued at Digi-Key
Description: IC LED DRIVER RGLTR 700MA 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 700mA (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-SOIC
Voltage - Supply (Max): 35V
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SSL21153T/1,118 |
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Hersteller: NXP USA Inc.
Description: IC LED DRIVER RGLTR 1.5A 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 1.5A (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 7-SOIC
Voltage - Supply (Max): 35V
Description: IC LED DRIVER RGLTR 1.5A 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 1.5A (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 7-SOIC
Voltage - Supply (Max): 35V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SSL2109T/1,118 |
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Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Voltage - Output: 600V
Mounting Type: Surface Mount
Number of Outputs: 1
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 125°C (TA)
Internal Switch(s): No
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-SO
Voltage - Supply (Min): 8V
Voltage - Supply (Max): 16V
Description: IC LED DRIVER OFFL SWITCHER 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Voltage - Output: 600V
Mounting Type: Surface Mount
Number of Outputs: 1
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 125°C (TA)
Internal Switch(s): No
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-SO
Voltage - Supply (Min): 8V
Voltage - Supply (Max): 16V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MW7IC2020NT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V 24PQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 2.4W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 40 mA
Description: RF MOSFET LDMOS 28V 24PQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 2.4W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 40 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MW7IC2020NT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V 24PQFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 2.4W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 40 mA
Description: RF MOSFET LDMOS 28V 24PQFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 2.4W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 40 mA
auf Bestellung 930 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
MPXH6300AC6T1 |
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Hersteller: NXP USA Inc.
Description: SENSOR 44.09PSIA 0.13" 4.9V SSOP
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.9 V
Operating Pressure: 2.9PSI ~ 44.09PSI (20kPa ~ 304kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.74V ~ 5.46V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 174.05PSI (1200kPa)
Part Status: Active
Description: SENSOR 44.09PSIA 0.13" 4.9V SSOP
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.9 V
Operating Pressure: 2.9PSI ~ 44.09PSI (20kPa ~ 304kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.74V ~ 5.46V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 174.05PSI (1200kPa)
Part Status: Active
auf Bestellung 408 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 27.33 EUR |
5+ | 24.90 EUR |
10+ | 23.99 EUR |
25+ | 22.91 EUR |
50+ | 22.17 EUR |
100+ | 21.49 EUR |
MPXV7002DPT1 |
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Hersteller: NXP USA Inc.
Description: SENSOR 0.29PSID 0.13" 4.5V 8SOP
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.5 V ~ 4.5 V
Operating Pressure: ±0.29PSI (±2kPa)
Pressure Type: Differential
Accuracy: ±5%
Operating Temperature: 10°C ~ 60°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: ±10.88PSI (±75kPa)
Part Status: Active
Description: SENSOR 0.29PSID 0.13" 4.5V 8SOP
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.5 V ~ 4.5 V
Operating Pressure: ±0.29PSI (±2kPa)
Pressure Type: Differential
Accuracy: ±5%
Operating Temperature: 10°C ~ 60°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: ±10.88PSI (±75kPa)
Part Status: Active
auf Bestellung 4056 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 30.38 EUR |
5+ | 27.70 EUR |
10+ | 26.70 EUR |
25+ | 25.51 EUR |
50+ | 24.70 EUR |
MC13783VK5R2 |
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Hersteller: NXP USA Inc.
Description: IC PWR MNGMNT ATLAS 3G 247MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 247-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Handheld/Mobile Devices
Supplier Device Package: 247-MAPBGA (10x10)
Description: IC PWR MNGMNT ATLAS 3G 247MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 247-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Handheld/Mobile Devices
Supplier Device Package: 247-MAPBGA (10x10)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC33886PVWR2 |
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Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-40V 20HSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
Description: IC MOTOR DRIVER 5V-40V 20HSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
auf Bestellung 4827 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 16.16 EUR |
10+ | 12.60 EUR |
25+ | 11.71 EUR |
100+ | 10.73 EUR |
250+ | 10.27 EUR |
MC33887APVWR2 |
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Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 20HSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
Description: IC MOTOR DRIVER 5V-28V 20HSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
auf Bestellung 3725 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 18.41 EUR |
10+ | 14.41 EUR |
25+ | 13.41 EUR |
100+ | 12.31 EUR |
250+ | 11.78 EUR |
MC33926PNBR2 |
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Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 32PQFN
Packaging: Cut Tape (CT)
Package / Case: 32-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-PQFN (8x8)
Motor Type - AC, DC: Brushed DC
Part Status: Active
Grade: Automotive
Description: IC MOTOR DRIVER 5V-28V 32PQFN
Packaging: Cut Tape (CT)
Package / Case: 32-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-PQFN (8x8)
Motor Type - AC, DC: Brushed DC
Part Status: Active
Grade: Automotive
auf Bestellung 2229 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 14.15 EUR |
10+ | 10.99 EUR |
25+ | 10.20 EUR |
100+ | 9.33 EUR |
250+ | 8.92 EUR |
500+ | 8.67 EUR |
1000+ | 8.46 EUR |
MC33972ATEWR2 |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Part Status: Active
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Part Status: Active
auf Bestellung 3685 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 9.17 EUR |
10+ | 7.01 EUR |
25+ | 6.47 EUR |
100+ | 5.87 EUR |
250+ | 5.59 EUR |
500+ | 5.42 EUR |
MC9RS08KA2CSCR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 63 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Peripherals: LVD, POR, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 63 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Peripherals: LVD, POR, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
auf Bestellung 2321 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
6+ | 2.97 EUR |
10+ | 2.18 EUR |
25+ | 1.98 EUR |
100+ | 1.76 EUR |
250+ | 1.66 EUR |
500+ | 1.60 EUR |
1000+ | 1.55 EUR |
MC9S08QD4CSCR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
auf Bestellung 6914 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 5.21 EUR |
10+ | 3.90 EUR |
25+ | 3.57 EUR |
100+ | 3.21 EUR |
250+ | 3.04 EUR |
500+ | 2.94 EUR |
1000+ | 2.86 EUR |
MC9S08SH8CTJR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPX2300DT1 |
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Hersteller: NXP USA Inc.
Description: SENSOR 5.8PSID .003006V
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 4-SSIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 3.006 mV (6V)
Operating Pressure: 5.8PSI (40kPa)
Pressure Type: Differential
Accuracy: ±1.5%
Operating Temperature: 15°C ~ 40°C
Termination Style: PC Pin
Voltage - Supply: 6V ~ 10V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 125PSI (861.84kPa)
Part Status: Active
Description: SENSOR 5.8PSID .003006V
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 4-SSIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 3.006 mV (6V)
Operating Pressure: 5.8PSI (40kPa)
Pressure Type: Differential
Accuracy: ±1.5%
Operating Temperature: 15°C ~ 40°C
Termination Style: PC Pin
Voltage - Supply: 6V ~ 10V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 125PSI (861.84kPa)
Part Status: Active
Produkt ist nicht verfügbar
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MPXM2010GST1 | ![]() |
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Hersteller: NXP USA Inc.
Description: SENSOR 1.45PSIG 0.12" .025V MPAK
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 5-SMD Module, Top Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.12" (2.97mm) Tube
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
Part Status: Active
Description: SENSOR 1.45PSIG 0.12" .025V MPAK
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 5-SMD Module, Top Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.12" (2.97mm) Tube
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
Part Status: Active
auf Bestellung 6565 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 17.25 EUR |
5+ | 15.64 EUR |
10+ | 15.04 EUR |
25+ | 14.33 EUR |
50+ | 13.84 EUR |
100+ | 13.39 EUR |
MRF1535NT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272AA
Current Rating (Amps): 6A
Mounting Type: Chassis Mount
Frequency: 520MHz
Power - Output: 35W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272AA
Current Rating (Amps): 6A
Mounting Type: Chassis Mount
Frequency: 520MHz
Power - Output: 35W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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MRF1550NT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272AA
Current Rating (Amps): 12A
Mounting Type: Chassis Mount
Frequency: 175MHz
Power - Output: 50W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272AA
Current Rating (Amps): 12A
Mounting Type: Chassis Mount
Frequency: 175MHz
Power - Output: 50W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
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MRF1570FNT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO272-8
Packaging: Cut Tape (CT)
Package / Case: TO-272-8
Mounting Type: Chassis Mount
Frequency: 470MHz
Power - Output: 70W
Gain: 11.5dB
Technology: LDMOS
Supplier Device Package: TO-272-8
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 800 mA
Description: RF MOSFET LDMOS 12.5V TO272-8
Packaging: Cut Tape (CT)
Package / Case: TO-272-8
Mounting Type: Chassis Mount
Frequency: 470MHz
Power - Output: 70W
Gain: 11.5dB
Technology: LDMOS
Supplier Device Package: TO-272-8
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MRF6S18060NR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 1.99GHz
Power - Output: 60W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 600 mA
Description: RF MOSFET LDMOS 26V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 1.99GHz
Power - Output: 60W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 600 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MRF6S20010GNR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA
auf Bestellung 157 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 83.74 EUR |
10+ | 68.73 EUR |
25+ | 64.98 EUR |
100+ | 60.87 EUR |
MRF6S21050LR3 |
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Hersteller: NXP USA Inc.
Description: FET RF 68V 2.16GHZ NI-400
Description: FET RF 68V 2.16GHZ NI-400
Produkt ist nicht verfügbar
Im Einkaufswagen
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MRF6V12250HR5 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MRF6V2010NR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA
Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA
Produkt ist nicht verfügbar
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Stück im Wert von UAH
MRF6V2150NBR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO272-4
Packaging: Cut Tape (CT)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 150W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 450 mA
Description: RF MOSFET LDMOS 50V TO272-4
Packaging: Cut Tape (CT)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 150W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
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MRF6V2300NBR1 |
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Hersteller: NXP USA Inc.
Description: FET RF 110V 220MHZ TO-272-4
Description: FET RF 110V 220MHZ TO-272-4
Produkt ist nicht verfügbar
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Stück im Wert von UAH
MRF6V3090NBR5 |
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Hersteller: NXP USA Inc.
Description: FET RF 110V 860MHZ TO272-4
Packaging: Cut Tape (CT)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 18W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 350 mA
Description: FET RF 110V 860MHZ TO272-4
Packaging: Cut Tape (CT)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 18W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 350 mA
Produkt ist nicht verfügbar
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MRF6VP2600HR6 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 125W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 2.6 A
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 125W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 2.6 A
Produkt ist nicht verfügbar
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MRFE6S9125NR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 27W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 950 mA
Description: RF MOSFET LDMOS 28V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 27W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 950 mA
Produkt ist nicht verfügbar
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Stück im Wert von UAH
MRFE6VP61K25HR6 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 149 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 403.94 EUR |
10+ | 356.36 EUR |
MW6S010GNR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
Produkt ist nicht verfügbar
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MW7IC008NT1 |
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Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 100MHZ-1GHZ 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 100MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 32V
Gain: 23.5dB
Current - Supply: 75mA
P1dB: 40.4dBm
Test Frequency: 100MHz
Supplier Device Package: 24-PQFN (8x8)
Part Status: Not For New Designs
Description: IC RF AMP GPS 100MHZ-1GHZ 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 100MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 32V
Gain: 23.5dB
Current - Supply: 75mA
P1dB: 40.4dBm
Test Frequency: 100MHz
Supplier Device Package: 24-PQFN (8x8)
Part Status: Not For New Designs
Produkt ist nicht verfügbar
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MW7IC2040NBR1 |
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Hersteller: NXP USA Inc.
Description: IC AMP GP 100MHZ-1GHZ TO272 WB16
Description: IC AMP GP 100MHZ-1GHZ TO272 WB16
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MW7IC2725NBR1 |
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Hersteller: NXP USA Inc.
Description: IC RF AMP WIMAX 2.7GHZ TO272WB
Packaging: Cut Tape (CT)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.7GHz
RF Type: WiMax
Voltage - Supply: 32V
Gain: 28.5dB
Current - Supply: 275mA
P1dB: 44dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
Description: IC RF AMP WIMAX 2.7GHZ TO272WB
Packaging: Cut Tape (CT)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.7GHz
RF Type: WiMax
Voltage - Supply: 32V
Gain: 28.5dB
Current - Supply: 275mA
P1dB: 44dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
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MW7IC915NT1 |
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Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 728-960MHZ 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 38dB
P1dB: 15.5W
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Description: IC AMP W-CDMA 728-960MHZ 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 38dB
P1dB: 15.5W
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
auf Bestellung 2914 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 47.33 EUR |
10+ | 41.34 EUR |
25+ | 39.27 EUR |
100+ | 36.43 EUR |
250+ | 36.32 EUR |
S9S08SG8E2VTJR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
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SGTL5000XNAA3R2 |
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Hersteller: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 32-QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Obsolete
Description: IC AUDIO CODEC STEREO 32-QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Obsolete
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