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LPC4072FBD80E LPC4072FBD80E NXP USA Inc. LPC408x_7x.pdf Description: IC MCU 32BIT 64KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 80-LQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC4074FBD80,551 LPC4074FBD80,551 NXP USA Inc. LPC408X_7X.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 80-LQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 40K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
auf Bestellung 322 Stücke:
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10+13.44 EUR
25+13.42 EUR
119+12.92 EUR
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LPC4076FET180,551 LPC4076FET180,551 NXP USA Inc. LPC408X_7X.pdf Description: IC MCU 32BIT 256KB FLSH 180TFBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC4078FBD80,551 LPC4078FBD80,551 NXP USA Inc. LPC408X_7X.pdf Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
DigiKey Programmable: Not Verified
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LPC4078FET180,551 LPC4078FET180,551 NXP USA Inc. LPC408X_7X.pdf Description: IC MCU 32BIT 512KB FLSH 180TFBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4032 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 96K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC4088FET180,551 LPC4088FET180,551 NXP USA Inc. LPC408X_7X.pdf_ Description: IC MCU 32BIT 512KB FLSH 180TFBGA
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LPC4312JET100E LPC4312JET100E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
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LPC4313JET100E LPC4313JET100E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC4315JET100E LPC4315JET100E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 768KB FLSH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
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LPC4317JET100E LPC4317JET100E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
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LPC4322JET100E LPC4322JET100E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
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LPC4323JET100E LPC4323JET100E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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LPC4325JET100E LPC4325JET100E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 768KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
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LPC4327JET100E LPC4327JET100E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
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LPC4333FET256,551 LPC4333FET256,551 NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 256LBGA
DigiKey Programmable: Not Verified
Number of I/O: 164
Part Status: Active
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 136K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
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LPC4333JET100E LPC4333JET100E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
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LPC4333JET256,551 LPC4333JET256,551 NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 256LBGA
DigiKey Programmable: Not Verified
Number of I/O: 164
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC4337FET256,551 LPC4337FET256,551 NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
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LPC4337JET100E LPC4337JET100E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
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LPC4337JET256,551 LPC4337JET256,551 NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
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LPC4353FET256,551 LPC4353FET256,551 NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC4357JET256,551 LPC4357JET256,551 NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
auf Bestellung 2874 Stücke:
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10+33.05 EUR
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180+28.55 EUR
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MF1PLUS6031DA4/03, MF1PLUS6031DA4/03, NXP USA Inc. Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
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MF1PLUS8031DA4/03, MF1PLUS8031DA4/03, NXP USA Inc. Description: IC RFID TRANSP 13.56MHZ PLLMC
Supplier Device Package: PLLMC
Standards: ISO 14443, MIFARE
Operating Temperature: -25°C ~ 70°C
Type: RFID Transponder
Interface: UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
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MF1SPLUS6031DA4/03 MF1SPLUS6031DA4/03 NXP USA Inc. Description: IC RFID TRANSP 13.56MHZ PLLMC
Supplier Device Package: PLLMC
Standards: ISO 14443, MIFARE
Operating Temperature: -25°C ~ 70°C
Type: RFID Transponder
Interface: UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1SPLUS8031DA4/03 MF1SPLUS8031DA4/03 NXP USA Inc. Description: IC RFID TRANSP 13.56MHZ PLLMC
Supplier Device Package: PLLMC
Standards: ISO 14443, MIFARE
Operating Temperature: -25°C ~ 70°C
Type: RFID Transponder
Interface: UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
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MFRC63002HN,518 MFRC63002HN,518 NXP USA Inc. MFRC630.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 14443, MIFARE
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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MFRC63002HN,551 MFRC63002HN,551 NXP USA Inc. MFRC630.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 14443, MIFARE
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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MFRC63002HN,557 MFRC63002HN,557 NXP USA Inc. MFRC630.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 14443, MIFARE
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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MFRC63102HN,518 MFRC63102HN,518 NXP USA Inc. MFRC631.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 14443, MIFARE
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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MFRC63102HN,551 MFRC63102HN,551 NXP USA Inc. MFRC631.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 14443, MIFARE
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MFRC63102HN,557 MFRC63102HN,557 NXP USA Inc. MFRC631.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 14443, MIFARE
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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NCX2200GF3,132 NCX2200GF3,132 NXP USA Inc. NCX2200.pdf Description: IC COMPARATOR 1 GEN PUR 6XSON
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 6-XFDFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA @ 5.5V
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 6µA
Propagation Delay (Max): 800ns
Supplier Device Package: 6-XSON, SOT891 (1x1)
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Produkt ist nicht verfügbar
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NCX2202GM,115 NCX2202GM,115 NXP USA Inc. NCX2202.pdf Description: IC COMPARATOR 1 GEN PUR 6XSON
Part Status: Obsolete
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 6µA
Propagation Delay (Max): 0.8µs
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 6-XFDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCX2202GW,125 NCX2202GW,125 NXP USA Inc. NCX2202.pdf Description: IC COMPARATOR 1 GEN PUR 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 1
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 5-TSSOP
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Not For New Designs
Produkt ist nicht verfügbar
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NCX2220DP,125 NCX2220DP,125 NXP USA Inc. NCX2220.pdf Description: IC COMPARATOR 2 GEN PUR 8TSSOP
Part Status: Obsolete
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 6µA
Propagation Delay (Max): 0.8µs
Supplier Device Package: 8-TSSOP
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NTB0101GW,125 NTB0101GW,125 NXP USA Inc. NTB0101.pdf Description: IC XLTR VL BIDIR 6-TSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NTB0102DP,125 NTB0102DP,125 NXP USA Inc. NTB0102.pdf Description: IC XLTR VL BIDIR 8-TSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTB0102GD,125 NTB0102GD,125 NXP USA Inc. NTB0102.pdf Description: IC XLTR VL BIDIR 8-XSON/SOT996-2
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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NTS0102DP,125 NTS0102DP,125 NXP USA Inc. NTS0102.pdf Description: IC XLTR VL BIDIR 8-TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0102GD,125 NTS0102GD,125 NXP USA Inc. NTS0102.pdf Description: IC XLTR VL BIDIR 8-XSON/SOT996-2
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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NTS0102GU8,125 NTS0102GU8,125 NXP USA Inc. NTS0102.pdf Description: IC XLTR VL BIDIR 8-XQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFQFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XQFN (1.4x1.2)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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NX3020NAKT,115 NX3020NAKT,115 NXP USA Inc. Description: MOSFET N-CH 30V 180MA SC75
Input Capacitance (Ciss) (Max) @ Vds: 13 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 0.44 nC @ 4.5 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 10V
Supplier Device Package: SC-75
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Power Dissipation (Max): 230mW (Ta), 1.06W (Tc)
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 100mA, 10V
Current - Continuous Drain (Id) @ 25°C: 180mA (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NX3DV221GM,115 NX3DV221GM,115 NXP USA Inc. NX3DV221.pdf Description: IC USB 2.0 SWITCH HS 10XQFN
Packaging: Tape & Reel (TR)
Features: Bi-Directional
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: USB
On-State Resistance (Max): 7Ohm
-3db Bandwidth: 1GHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 2.3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 1
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NX3DV221GM,132 NX3DV221GM,132 NXP USA Inc. NX3DV221.pdf Description: IC USB 2.0 SWITCH HS 10XQFN
Number of Channels: 1
Multiplexer/Demultiplexer Circuit: 2:1
Voltage - Supply, Single (V+): 2.3V ~ 3.6V
Supplier Device Package: 10-XQFN (1.55x2)
-3db Bandwidth: 1GHz
On-State Resistance (Max): 7Ohm
Applications: USB
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 10-XFQFN
Features: Bi-Directional
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NX3L2267GM,115 NX3L2267GM,115 NXP USA Inc. NX3L2267.pdf Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
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NX3L2267SGU,115 NX3L2267SGU,115 NXP USA Inc. NX3L2267.pdf Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Last Time Buy
Number of Circuits: 2
Produkt ist nicht verfügbar
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NX3L4051PW,118 NX3L4051PW,118 NXP USA Inc. NX3L4051.pdf Description: IC MUX 8:1 750MOHM 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
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NX3L4053PW,118 NX3L4053PW,118 NXP USA Inc. NX3L4053.pdf Description: IC SWITCH SPDTX3 800MOHM 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 800mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 120mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 3
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NX3L4357GM,115 NX3L4357GM,115 NXP USA Inc. NX3L4357.pdf Description: IC SWITCH SP3TX1 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SP3T
Multiplexer/Demultiplexer Circuit: 3:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
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NX3L4684GM,115 NX3L4684GM,115 NXP USA Inc. NX3L4684.pdf Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 20MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 50pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 40mOhm
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
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NX3L4684TK,115 NX3L4684TK,115 NXP USA Inc. NX3L4684.pdf Description: IC SWITCH SPDTX2 750MOHM 10HVSON
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 20MHz
Supplier Device Package: 10-HVSON (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 50pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 40mOhm
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
Produkt ist nicht verfügbar
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NX5DV713EHF,118 NX5DV713EHF,118 NXP USA Inc. NX5DV713E.pdf Description: IC VIDEO VGA 32HWQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Switch
Voltage - Supply: 2.0V ~ 5.5V, 4.5V ~ 5.5V
Applications: Consumer Video
Supplier Device Package: 32-HWQFN (3x6)
Part Status: Obsolete
Control Interface: I²C
Produkt ist nicht verfügbar
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NX5DV713HF,118 NX5DV713HF,118 NXP USA Inc. NX5DV713.pdf Description: IC VIDEO VGA 32HWQFN
Produkt ist nicht verfügbar
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PCA8802CX8/B/1,027 NXP USA Inc. PCA8802.pdf Description: IC RTC BINARY COUNTER I2C DIE
Features: Square Wave Output, Unique ID
Packaging: Tape & Reel (TR)
Package / Case: Die
Interface: I²C, 2-Wire Serial
Type: Binary Counter
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: Binary
Date Format: Binary
Supplier Device Package: Die
Current - Timekeeping (Max): 0.4µA @ 1.6V ~ 5.5V
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9515ATP,147 PCA9515ATP,147 NXP USA Inc. PCA9515A_Rev2012.pdf Description: IC REDRIVER I2C 2CH 8HWSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Applications: I2C
Current - Supply: 800µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-HWSON (2x3)
Part Status: Obsolete
Capacitance - Input: 6 pF
Produkt ist nicht verfügbar
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PCA9538PW/Q900,118 PCA9538PW/Q900,118 NXP USA Inc. PCA9538.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF7935AS/3851,122 NXP USA Inc. Description: RFID TAG R/W 125KHZ PLLMC
Packaging: Bulk
Part Status: Obsolete
Memory Type: Read/Write
Frequency: 125kHz
Produkt ist nicht verfügbar
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PCF7991AT/1081,112 PCF7991AT/1081,112 NXP USA Inc. Description: IC RFID TRANSP 4-16MHZ 14SO
Part Status: Obsolete
Supplier Device Package: 14-SO
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Frequency: 4MHz ~ 16MHz
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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PCF8885T/1,518 PCF8885T/1,518 NXP USA Inc. PCF8885.pdf Description: IC PROXIMITY SWITCH 8CH 28SOIC
Produkt ist nicht verfügbar
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LPC4072FBD80E LPC408x_7x.pdf
LPC4072FBD80E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 80-LQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC4074FBD80,551 LPC408X_7X.pdf
LPC4074FBD80,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 80-LQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 40K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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2+18.24 EUR
10+13.44 EUR
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119+12.92 EUR
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LPC4076FET180,551 LPC408X_7X.pdf
LPC4076FET180,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC4078FBD80,551 LPC408X_7X.pdf
LPC4078FBD80,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
DigiKey Programmable: Not Verified
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LPC4078FET180,551 LPC408X_7X.pdf
LPC4078FET180,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4032 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 96K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC4088FET180,551 LPC408X_7X.pdf_
LPC4088FET180,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Produkt ist nicht verfügbar
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LPC4312JET100E LPC435X_3X_2X_1X.pdf
LPC4312JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
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LPC4313JET100E LPC435X_3X_2X_1X.pdf
LPC4313JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC4315JET100E LPC435X_3X_2X_1X.pdf
LPC4315JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLSH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC4317JET100E LPC435X_3X_2X_1X.pdf
LPC4317JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
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LPC4322JET100E LPC435X_3X_2X_1X.pdf
LPC4322JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
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LPC4323JET100E LPC435X_3X_2X_1X.pdf
LPC4323JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Produkt ist nicht verfügbar
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LPC4325JET100E LPC435X_3X_2X_1X.pdf
LPC4325JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
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LPC4327JET100E LPC435X_3X_2X_1X.pdf
LPC4327JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC4333FET256,551 LPC435X_3X_2X_1X.pdf
LPC4333FET256,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 256LBGA
DigiKey Programmable: Not Verified
Number of I/O: 164
Part Status: Active
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 136K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
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1+37.68 EUR
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LPC4333JET100E LPC435X_3X_2X_1X.pdf
LPC4333JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
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1+35.58 EUR
10+28.33 EUR
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100+24.54 EUR
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LPC4333JET256,551 LPC435X_3X_2X_1X.pdf
LPC4333JET256,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 256LBGA
DigiKey Programmable: Not Verified
Number of I/O: 164
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC4337FET256,551 LPC435X_3X_2X_1X.pdf
LPC4337FET256,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
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1+38.18 EUR
10+30.45 EUR
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LPC4337JET100E LPC435X_3X_2X_1X.pdf
LPC4337JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
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10+31.69 EUR
25+29.7 EUR
100+27.51 EUR
260+26.43 EUR
520+25.8 EUR
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LPC4337JET256,551 LPC435X_3X_2X_1X.pdf
LPC4337JET256,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
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LPC4353FET256,551 LPC435X_3X_2X_1X.pdf
LPC4353FET256,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC4357JET256,551 LPC435X_3X_2X_1X.pdf
LPC4357JET256,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
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1+41.26 EUR
10+33.05 EUR
90+28.89 EUR
180+28.55 EUR
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MF1PLUS6031DA4/03,
MF1PLUS6031DA4/03,
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
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MF1PLUS8031DA4/03,
MF1PLUS8031DA4/03,
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Supplier Device Package: PLLMC
Standards: ISO 14443, MIFARE
Operating Temperature: -25°C ~ 70°C
Type: RFID Transponder
Interface: UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1SPLUS6031DA4/03
MF1SPLUS6031DA4/03
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Supplier Device Package: PLLMC
Standards: ISO 14443, MIFARE
Operating Temperature: -25°C ~ 70°C
Type: RFID Transponder
Interface: UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1SPLUS8031DA4/03
MF1SPLUS8031DA4/03
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Supplier Device Package: PLLMC
Standards: ISO 14443, MIFARE
Operating Temperature: -25°C ~ 70°C
Type: RFID Transponder
Interface: UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFRC63002HN,518 MFRC630.pdf
MFRC63002HN,518
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 14443, MIFARE
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFRC63002HN,551 MFRC630.pdf
MFRC63002HN,551
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 14443, MIFARE
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MFRC63002HN,557 MFRC630.pdf
MFRC63002HN,557
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 14443, MIFARE
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MFRC63102HN,518 MFRC631.pdf
MFRC63102HN,518
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 14443, MIFARE
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFRC63102HN,551 MFRC631.pdf
MFRC63102HN,551
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 14443, MIFARE
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MFRC63102HN,557 MFRC631.pdf
MFRC63102HN,557
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 14443, MIFARE
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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NCX2200GF3,132 NCX2200.pdf
NCX2200GF3,132
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 6-XFDFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA @ 5.5V
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 6µA
Propagation Delay (Max): 800ns
Supplier Device Package: 6-XSON, SOT891 (1x1)
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Produkt ist nicht verfügbar
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NCX2202GM,115 NCX2202.pdf
NCX2202GM,115
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Part Status: Obsolete
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 6µA
Propagation Delay (Max): 0.8µs
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 6-XFDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCX2202GW,125 NCX2202.pdf
NCX2202GW,125
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 1
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 5-TSSOP
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Not For New Designs
Produkt ist nicht verfügbar
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NCX2220DP,125 NCX2220.pdf
NCX2220DP,125
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8TSSOP
Part Status: Obsolete
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 6µA
Propagation Delay (Max): 0.8µs
Supplier Device Package: 8-TSSOP
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NTB0101GW,125 NTB0101.pdf
NTB0101GW,125
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 6-TSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
Produkt ist nicht verfügbar
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NTB0102DP,125 NTB0102.pdf
NTB0102DP,125
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-TSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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3000+0.79 EUR
6000+0.76 EUR
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NTB0102GD,125 NTB0102.pdf
NTB0102GD,125
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT996-2
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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NTS0102DP,125 NTS0102.pdf
NTS0102DP,125
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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AnzahlPrivatkunde
3000+0.6 EUR
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NTS0102GD,125 NTS0102.pdf
NTS0102GD,125
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT996-2
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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NTS0102GU8,125 NTS0102.pdf
NTS0102GU8,125
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFQFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XQFN (1.4x1.2)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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NX3020NAKT,115
NX3020NAKT,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 180MA SC75
Input Capacitance (Ciss) (Max) @ Vds: 13 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 0.44 nC @ 4.5 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 10V
Supplier Device Package: SC-75
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Power Dissipation (Max): 230mW (Ta), 1.06W (Tc)
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 100mA, 10V
Current - Continuous Drain (Id) @ 25°C: 180mA (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NX3DV221GM,115 NX3DV221.pdf
NX3DV221GM,115
Hersteller: NXP USA Inc.
Description: IC USB 2.0 SWITCH HS 10XQFN
Packaging: Tape & Reel (TR)
Features: Bi-Directional
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: USB
On-State Resistance (Max): 7Ohm
-3db Bandwidth: 1GHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 2.3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 1
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5000+0.8 EUR
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NX3DV221GM,132 NX3DV221.pdf
NX3DV221GM,132
Hersteller: NXP USA Inc.
Description: IC USB 2.0 SWITCH HS 10XQFN
Number of Channels: 1
Multiplexer/Demultiplexer Circuit: 2:1
Voltage - Supply, Single (V+): 2.3V ~ 3.6V
Supplier Device Package: 10-XQFN (1.55x2)
-3db Bandwidth: 1GHz
On-State Resistance (Max): 7Ohm
Applications: USB
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 10-XFQFN
Features: Bi-Directional
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NX3L2267GM,115 NX3L2267.pdf
NX3L2267GM,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
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5000+0.87 EUR
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15000+0.84 EUR
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NX3L2267SGU,115 NX3L2267.pdf
NX3L2267SGU,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Last Time Buy
Number of Circuits: 2
Produkt ist nicht verfügbar
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NX3L4051PW,118 NX3L4051.pdf
NX3L4051PW,118
Hersteller: NXP USA Inc.
Description: IC MUX 8:1 750MOHM 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
auf Bestellung 37500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+1.5 EUR
5000+1.48 EUR
7500+1.45 EUR
12500+1.44 EUR
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NX3L4053PW,118 NX3L4053.pdf
NX3L4053PW,118
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX3 800MOHM 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 800mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 120mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 3
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+1.12 EUR
5000+1.09 EUR
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NX3L4357GM,115 NX3L4357.pdf
NX3L4357GM,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SP3TX1 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SP3T
Multiplexer/Demultiplexer Circuit: 3:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5000+1.43 EUR
10000+1.39 EUR
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NX3L4684GM,115 NX3L4684.pdf
NX3L4684GM,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 20MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 50pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 40mOhm
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5000+0.74 EUR
Mindestbestellmenge: 5000 Stücke
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NX3L4684TK,115 NX3L4684.pdf
NX3L4684TK,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10HVSON
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 20MHz
Supplier Device Package: 10-HVSON (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 50pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 40mOhm
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
Produkt ist nicht verfügbar
Mindestbestellmenge: 1400 Stücke
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NX5DV713EHF,118 NX5DV713E.pdf
NX5DV713EHF,118
Hersteller: NXP USA Inc.
Description: IC VIDEO VGA 32HWQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Switch
Voltage - Supply: 2.0V ~ 5.5V, 4.5V ~ 5.5V
Applications: Consumer Video
Supplier Device Package: 32-HWQFN (3x6)
Part Status: Obsolete
Control Interface: I²C
Produkt ist nicht verfügbar
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NX5DV713HF,118 NX5DV713.pdf
NX5DV713HF,118
Hersteller: NXP USA Inc.
Description: IC VIDEO VGA 32HWQFN
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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PCA8802CX8/B/1,027 PCA8802.pdf
Hersteller: NXP USA Inc.
Description: IC RTC BINARY COUNTER I2C DIE
Features: Square Wave Output, Unique ID
Packaging: Tape & Reel (TR)
Package / Case: Die
Interface: I²C, 2-Wire Serial
Type: Binary Counter
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: Binary
Date Format: Binary
Supplier Device Package: Die
Current - Timekeeping (Max): 0.4µA @ 1.6V ~ 5.5V
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9515ATP,147 PCA9515A_Rev2012.pdf
PCA9515ATP,147
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 8HWSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Applications: I2C
Current - Supply: 800µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-HWSON (2x3)
Part Status: Obsolete
Capacitance - Input: 6 pF
Produkt ist nicht verfügbar
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PCA9538PW/Q900,118 PCA9538.pdf
PCA9538PW/Q900,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF7935AS/3851,122
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 125KHZ PLLMC
Packaging: Bulk
Part Status: Obsolete
Memory Type: Read/Write
Frequency: 125kHz
Produkt ist nicht verfügbar
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PCF7991AT/1081,112
PCF7991AT/1081,112
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 4-16MHZ 14SO
Part Status: Obsolete
Supplier Device Package: 14-SO
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Frequency: 4MHz ~ 16MHz
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
Mindestbestellmenge: 1140 Stücke
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PCF8885T/1,518 PCF8885.pdf
PCF8885T/1,518
Hersteller: NXP USA Inc.
Description: IC PROXIMITY SWITCH 8CH 28SOIC
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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