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Hersteller: NXP USA Inc.
Description: FET RF 65V 1.99GHZ SOT502B

Hersteller: NXP USA Inc.
Description: FET RF 65V 2.17GHZ SOT502B
Packaging: Tray
Package / Case: SOT-502B
Current Rating (Amps): 12A
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.17GHz
Power - Output: 25W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 900 mA

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 1.02A SOT323-3
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.02A (Tc)
Rds On (Max) @ Id, Vgs: 340mOhm @ 200mA, 4.5V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 0.89 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 45 pF @ 20 V

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 1A SOT323-3
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1A (Tc)
Rds On (Max) @ Id, Vgs: 350mOhm @ 200mA, 4.5V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SC-70
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 0.72 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 34 pF @ 20 V

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 260MA SOT323-3
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 260mA (Ta)
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 500mA, 10V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 1mA
Supplier Device Package: SC-70
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 0.85 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 40 pF @ 10 V

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 830MA SOT323-3
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 830mA (Ta)
Rds On (Max) @ Id, Vgs: 480mOhm @ 200mA, 4.5V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.89 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 43 pF @ 25 V

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 570MA SOT323-3
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 570mA (Ta)
Rds On (Max) @ Id, Vgs: 920mOhm @ 300mA, 10V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 1.05 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 23 pF @ 30 V

Hersteller: NXP USA Inc.
Description: IC OR CTRLR N+1 D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-7, D2PAK (6 Leads + Tab)
Mounting Type: Surface Mount
Type: N+1 ORing Controller
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 6.3V ~ 20V
Applications: CompactPCI™ High Reliability Power Supply Networks
Internal Switch(s): Yes
FET Type: N-Channel
Delay Time - ON: 7 µs
Delay Time - OFF: 200 ns
Current - Output (Max): 75A
Ratio - Input:Output: N:1
Supplier Device Package: D2PAK-7
Part Status: Obsolete
Current - Supply: 3 mA

Hersteller: NXP USA Inc.
Description: IC HALF BRIDGE DRVR 25A 68HVQFN
Features: Bootstrap Circuit
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: PWM
Operating Temperature: -55°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 3.3V ~ 12V
Applications: Synchronous Buck Converters
Current - Output / Channel: 25A
Current - Peak Output: 200A
Technology: Power MOSFET
Voltage - Load: 25V (Max)
Supplier Device Package: 68-HVQFN (10x10)
Load Type: Inductive
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC HALF BRIDGE DRVR 20A 68HVQFN
Features: Bootstrap Circuit
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: PWM
Operating Temperature: -55°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 12V
Applications: Synchronous Buck Converters
Current - Output / Channel: 20A
Current - Peak Output: 200A
Technology: Power MOSFET
Voltage - Load: 25V (Max)
Supplier Device Package: 68-HVQFN (10x10)
Load Type: Inductive
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC REG CONV DDR 1OUT 5SPAK
Packaging: Tape & Reel (TR)
Package / Case: SPak-5 (5 leads + Tab)
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 1.6V ~ 3.6V
Operating Temperature: 0°C ~ 70°C
Applications: Converter, DDR
Supplier Device Package: 5-SPAK

Hersteller: NXP USA Inc.
Description: IC REG CONV DDR 1OUT 5SPAK
Packaging: Tape & Reel (TR)
Package / Case: SPak-5 (5 leads + Tab)
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 1.6V ~ 3.6V
Operating Temperature: 0°C ~ 70°C
Applications: Converter, DDR
Supplier Device Package: 5-SPAK

Hersteller: NXP USA Inc.
Description: IC DDR TERM W/STANDBY 8-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.6V ~ 3.6V
Applications: Memory, DDR/DDR2 Regulator
Current - Supply: 14mA
Supplier Device Package: 8-HSO

Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 145°C (TJ)
Frequency - Switching: 25kHz ~ 175kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.7V ~ 20V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 11 V
Part Status: Obsolete
Power (Watts): 150 W

Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 145°C (TJ)
Frequency - Switching: 6.5kHz ~ 175kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.7V ~ 20V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 11 V
Part Status: Obsolete
Power (Watts): 250 W

Hersteller: NXP USA Inc.
Description: IC PFC CTRLR CCM 75KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 8.7V ~ 20V
Frequency - Switching: 50kHz ~ 75kHz
Mode: Continuous Conduction (CCM)
Supplier Device Package: 8-SO
Part Status: Obsolete
Current - Startup: 1.2 mA

Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 145°C (TJ)
Frequency - Switching: 25kHz ~ 175kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.7V ~ 20V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 11 V
Part Status: Obsolete
Power (Watts): 250 W

Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 145°C (TJ)
Frequency - Switching: 25kHz ~ 125kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.7V ~ 20V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Short Circuit
Voltage - Start Up: 11 V
Power (Watts): 250 W

Hersteller: NXP USA Inc.
Description: IC RESONANT CONVRTR CTRLR 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 0V ~ 15V
Applications: Resonant Converter Controller
Supplier Device Package: 16-SO
Part Status: Obsolete
Current - Supply: 2.4 mA
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 98A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 98A (Tc)
Rds On (Max) @ Id, Vgs: 3.8mOhm @ 25A, 10V
Power Dissipation (Max): 62.5W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 33 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 3190 pF @ 10 V

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 80A LFPAK56

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 68A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 68A (Tc)
Rds On (Max) @ Id, Vgs: 7.9mOhm @ 10A, 10V
Power Dissipation (Max): 62.5W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 1362 pF @ 10 V

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 5.7A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.7A (Tc)
Rds On (Max) @ Id, Vgs: 36mOhm @ 2A, 4.5V
Power Dissipation (Max): 1.9W (Tc)
Vgs(th) (Max) @ Id: 700mV @ 1mA (Typ)
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 7.4 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 460 pF @ 20 V

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 4.9A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.9A (Tc)
Rds On (Max) @ Id, Vgs: 47mOhm @ 2A, 4.5V
Power Dissipation (Max): 1.9W (Tc)
Vgs(th) (Max) @ Id: 700mV @ 1mA (Typ)
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 9.3 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 445 pF @ 30 V

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 5.4A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.4A (Tc)
Rds On (Max) @ Id, Vgs: 42mOhm @ 2A, 10V
Power Dissipation (Max): 280mW (Tj)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 9.4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 350 pF @ 30 V

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 4.7A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.7A (Tc)
Rds On (Max) @ Id, Vgs: 55mOhm @ 2A, 10V
Power Dissipation (Max): 280mW (Tj)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 9.4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 350 pF @ 30 V

Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 20V 11.6A 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 4.2W
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 11.6A
Input Capacitance (Ciss) (Max) @ Vds: 1450pF @ 16V
Rds On (Max) @ Id, Vgs: 18.5mOhm @ 5A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 22.2nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 700mV @ 1mA
Supplier Device Package: 8-TSSOP

Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 20V 9.9A 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 3.1W
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 9.9A
Input Capacitance (Ciss) (Max) @ Vds: 1366pF @ 16V
Rds On (Max) @ Id, Vgs: 19mOhm @ 3.5A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 23.6nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 700mV @ 1mA
Supplier Device Package: 8-TSSOP

Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 30V 5.6A 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 2.3W
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 5.6A
Input Capacitance (Ciss) (Max) @ Vds: 1478pF @ 10V
Rds On (Max) @ Id, Vgs: 23mOhm @ 3.5A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 28nC @ 5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 700mV @ 1mA
Supplier Device Package: 8-TSSOP

Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 20V 7.8A 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 3.1W
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 7.8A
Input Capacitance (Ciss) (Max) @ Vds: 1366pF @ 16V
Rds On (Max) @ Id, Vgs: 30mOhm @ 3.5A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 23.6nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 700mV @ 1mA
Supplier Device Package: 8-TSSOP

Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 30V 5A 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 2.3W
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 5A
Input Capacitance (Ciss) (Max) @ Vds: 1478pF @ 10V
Rds On (Max) @ Id, Vgs: 33mOhm @ 3.5A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 28nC @ 5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 700mV @ 1mA
Supplier Device Package: 8-TSSOP

Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 30V 0.71A 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 410mW
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 710mA
Input Capacitance (Ciss) (Max) @ Vds: 43pF @ 25V
Rds On (Max) @ Id, Vgs: 480mOhm @ 200mA, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 0.89nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-TSSOP

Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 30V 0.125A 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 200mW
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 125mA
Input Capacitance (Ciss) (Max) @ Vds: 18.5pF @ 5V
Rds On (Max) @ Id, Vgs: 8Ohm @ 10mA, 4V
Gate Charge (Qg) (Max) @ Vgs: 0.35nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1.5V @ 100µA
Supplier Device Package: 6-TSSOP

Hersteller: NXP USA Inc.
Description: IC MIXER LNA 1GHZ 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 1GHz
Voltage - Supply: 2.7V ~ 5.5V
Gain: 11.5dB
Current - Supply: 7.4mA
Noise Figure: 1.6dB
Number of Mixers: 1
Supplier Device Package: 20-SSOP

Hersteller: NXP USA Inc.
Description: IC AMP UHF 800MHZ-1.2GHZ 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 800MHz ~ 1.2GHz
RF Type: Cordless Phones, UHF
Voltage - Supply: 2.7V ~ 5.5V
Gain: 11.5dB
Current - Supply: 10.4mA
Noise Figure: 1.3dB ~ 1.9dB
P1dB: 16dBm
Test Frequency: 900MHz
Supplier Device Package: 20-SSOP

Hersteller: NXP USA Inc.
Description: IC DIGITAL IF RCVR 20-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Function: IF Receiver
Frequency: 200MHz
RF Type: Cellular, NADC
Secondary Attributes: RSSI Equipped
Supplier Device Package: 20-TSSOP

Hersteller: NXP USA Inc.
Description: IC FRACT N SYNTH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 2.5GHz
Type: Fractional N Synthesizer
Input: Clock
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Ratio - Input:Output: 2:3
Differential - Input:Output: Yes/No
Supplier Device Package: 20-TSSOP
PLL: Yes
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC RF SWITCH SPDT 1GHZ 8TSSOP
Features: Single Line Control
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Impedance: 50Ohm
Mounting Type: Surface Mount
Circuit: SPDT
RF Type: 802.11a/b/g/WiFi, WLAN
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Insertion Loss: 2dB
Frequency Range: 0Hz ~ 1GHz
Topology: Absorptive
P1dB: 18dBm OP1dB
Test Frequency: 900MHz
Isolation: 30dB
Supplier Device Package: 8-TSSOP
IIP3: 33dBm
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC MIXER 500MHZ UP CONVRT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 500MHz
RF Type: Cellular, ASK, DECT, FSK, UHF, VHF
Voltage - Supply: 4.5V ~ 5.5V
Gain: 11dB
Current - Supply: 8.5mA
Secondary Attributes: Up Converter
Noise Figure: 12dB
Number of Mixers: 2
Supplier Device Package: 20-SSOP
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC AUDIO AMP AB 20-SSOP
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Supplier Device Package: 20-SSOP
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC AUDIO AMP AB 16-SO
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 2.2W x 1 @ 8Ohm
Supplier Device Package: 16-SO
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC DDR TERM W/STANDBY 8-SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.6V ~ 3.6V
Applications: Memory, DDR/DDR2 Regulator
Current - Supply: 14mA
Supplier Device Package: 8-HSO

Hersteller: NXP USA Inc.
Description: IC PFC CTRLR CCM 75KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 8.7V ~ 20V
Frequency - Switching: 50kHz ~ 75kHz
Mode: Continuous Conduction (CCM)
Supplier Device Package: 8-SO
Part Status: Obsolete
Current - Startup: 1.2 mA

Hersteller: NXP USA Inc.
Description: IC RESONANT CONVRTR CTRLR 16SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 0V ~ 15V
Applications: Resonant Converter Controller
Supplier Device Package: 16-SO
Part Status: Obsolete
Current - Supply: 2.4 mA
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 98A LFPAK56
Packaging: Cut Tape (CT)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 98A (Tc)
Rds On (Max) @ Id, Vgs: 3.8mOhm @ 25A, 10V
Power Dissipation (Max): 62.5W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 33 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 3190 pF @ 10 V

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 80A LFPAK56

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 4.7A TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.7A (Tc)
Rds On (Max) @ Id, Vgs: 55mOhm @ 2A, 10V
Power Dissipation (Max): 280mW (Tj)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 9.4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 350 pF @ 30 V

Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 20V 11.6A 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 4.2W
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 11.6A
Input Capacitance (Ciss) (Max) @ Vds: 1450pF @ 16V
Rds On (Max) @ Id, Vgs: 18.5mOhm @ 5A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 22.2nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 700mV @ 1mA
Supplier Device Package: 8-TSSOP

Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 20V 9.9A 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 3.1W
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 9.9A
Input Capacitance (Ciss) (Max) @ Vds: 1366pF @ 16V
Rds On (Max) @ Id, Vgs: 19mOhm @ 3.5A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 23.6nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 700mV @ 1mA
Supplier Device Package: 8-TSSOP

Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 20V 7.8A 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 3.1W
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 7.8A
Input Capacitance (Ciss) (Max) @ Vds: 1366pF @ 16V
Rds On (Max) @ Id, Vgs: 30mOhm @ 3.5A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 23.6nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 700mV @ 1mA
Supplier Device Package: 8-TSSOP

Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 30V 0.71A 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 410mW
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 710mA
Input Capacitance (Ciss) (Max) @ Vds: 43pF @ 25V
Rds On (Max) @ Id, Vgs: 480mOhm @ 200mA, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 0.89nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-TSSOP

Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 30V 0.125A 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 200mW
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 125mA
Input Capacitance (Ciss) (Max) @ Vds: 18.5pF @ 5V
Rds On (Max) @ Id, Vgs: 8Ohm @ 10mA, 4V
Gate Charge (Qg) (Max) @ Vgs: 0.35nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1.5V @ 100µA
Supplier Device Package: 6-TSSOP

Hersteller: NXP USA Inc.
Description: IC MIXER LNA 1GHZ 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 1GHz
Voltage - Supply: 2.7V ~ 5.5V
Gain: 11.5dB
Current - Supply: 7.4mA
Noise Figure: 1.6dB
Number of Mixers: 1
Supplier Device Package: 20-SSOP

Hersteller: NXP USA Inc.
Description: IC MIXER 500MHZ UP CONVRT 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 500MHz
RF Type: Cellular, ASK, DECT, FSK, UHF, VHF
Voltage - Supply: 4.5V ~ 5.5V
Gain: 11dB
Current - Supply: 8.5mA
Secondary Attributes: Up Converter
Noise Figure: 12dB
Number of Mixers: 2
Supplier Device Package: 20-SSOP
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Verified

Hersteller: NXP USA Inc.
Description: KIT EVAL FOR MMA7260Q
Packaging: Box
Sensitivity: 800, 600, 300 or 200mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7260
Supplied Contents: Board(s)
Embedded: No
Sensing Range: ±1.5g, 2g, 4g, 6g
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: BOARD DEMO STAR FOR MMA7260Q
Packaging: Bulk
Sensitivity: 800, 600, 300 or 200mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7260, MC68HC908KX8
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 8-Bit
Sensing Range: ±1.5g, 2g, 4g, 6g
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: SENSOR 1.45PSIG 0.19" .055V
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 55 mV (3V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Accuracy: ±5%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 6V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 10.88PSI (75kPa)

Hersteller: NXP USA Inc.
Description: SENSOR 1.45PSIG 0.19" .025V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 10.88PSI (75kPa)
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.19" .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)