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MPC860DECVR66D4 MPC860DECVR66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
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MPC860DEVR50D4 MPC860DEVR50D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (2)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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MPC860DPCVR66D4 MPC860DPCVR66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
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MPC860DTVR50D4 MPC860DTVR50D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (2), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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MPC860ENCVR66D4 MPC860ENCVR66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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MPC860ENVR50D4 MPC860ENVR50D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Package / Case: 357-BBGA
Packaging: Tray
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
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MPC860PCVR50D4 MPC860PCVR50D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
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MPC860PVR50D4 MPC860PVR50D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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MPC860SRCVR50D4 MPC860SRCVR50D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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MPC860TCVR66D4 MPC860TCVR66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
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MPC862PVR100B MPC862PVR100B NXP USA Inc. MPC862EC%2C857%28T%2CDSL%29.pdf Description: IC MPU MPC8XX 100MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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MPC862TCVR66B MPC862TCVR66B NXP USA Inc. MPC862EC,857(T,DSL).pdf Description: IC MPU MPC8XX 66MHZ 357BGA
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MPC862TVR100B MPC862TVR100B NXP USA Inc. MPC862EC,857(T,DSL).pdf Description: IC MPU MPC8XX 100MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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MPC862TVR66B MPC862TVR66B NXP USA Inc. MPC862EC,857(T,DSL).pdf Description: IC MPU MPC8XX 66MHZ 357BGA
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MPC866PCVR100A MPC866PCVR100A NXP USA Inc. MPC866EC.pdf Description: IC MPU MPC8XX 100MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 100°C (TA)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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MPC866PVR100A MPC866PVR100A NXP USA Inc. MPC866EC.pdf Description: IC MPU MPC8XX 100MHZ 357BGA
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
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MPC866PVR133A MPC866PVR133A NXP USA Inc. MPC866EC.pdf Description: IC MPU MPC8XX 133MHZ 357BGA
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 133MHz
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MPC866TCVR100A MPC866TCVR100A NXP USA Inc. MPC866EC.pdf Description: IC MPU MPC8XX 100MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 100°C (TA)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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MPC866TVR100A MPC866TVR100A NXP USA Inc. MPC866EC.pdf Description: IC MPU MPC8XX 100MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Part Status: Obsolete
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MPC866TVR133A MPC866TVR133A NXP USA Inc. MPC866EC.pdf Description: IC MPU MPC8XX 133MHZ 357BGA
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 133MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
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MPC870VR133 MPC870VR133 NXP USA Inc. MPC875EC.pdf Description: IC MPU MPC8XX 133MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
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MPC870VR66 MPC870VR66 NXP USA Inc. MPC875EC.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
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MPC870VR80 MPC870VR80 NXP USA Inc. MPC875EC.pdf Description: IC MPU MPC8XX 80MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
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MPC875VR80 MPC875VR80 NXP USA Inc. MPC875EC.pdf Description: IC MPU MPC8XX 80MHZ 256BGA
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MPC880CVR133 MPC880CVR133 NXP USA Inc. MPC885EC.pdf Description: IC MPU MPC8XX 133MHZ 357BGA
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MPC880VR133 MPC880VR133 NXP USA Inc. MPC885EC.pdf Description: IC MPU MPC8XX 133MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10Mbps (2), 10/100Mbps (2)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 133MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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MPC880VR66 MPC880VR66 NXP USA Inc. MPC885EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10Mbps (2), 10/100Mbps (2)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
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MPC880VR80 MPC880VR80 NXP USA Inc. Description: IC MPU MPC8XX 80MHZ 357BGA
auf Bestellung 3300 Stücke:
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MPC885CVR133 MPC885CVR133 NXP USA Inc. MPC885EC.pdf Description: IC MPU MPC8XX 133MHZ 357BGA
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10Mbps (3), 10/100Mbps (2)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 100°C (TA)
Speed: 133MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Security Features: Cryptography
Graphics Acceleration: No
Packaging: Tray
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MPC885CVR66 MPC885CVR66 NXP USA Inc. MPC885EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 100°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10Mbps (3), 10/100Mbps (2)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
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MPC885VR133 MPC885VR133 NXP USA Inc. MPC885EC.pdf Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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MRF5S19060NR1 MRF5S19060NR1 NXP USA Inc. MRF5S19060N.pdf Description: FET RF 65V 1.99GHZ TO-270-4
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MRF5S9100NBR1 MRF5S9100NBR1 NXP USA Inc. MRF5S9100.pdf Description: FET RF 68V 880MHZ TO-272-4
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MRF5S9101NBR1 MRF5S9101NBR1 NXP USA Inc. MRF5S9101.pdf Description: FET RF 68V 960MHZ TO-272-4
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MSC8101VT1375F MSC8101VT1375F NXP USA Inc. MSC8101.pdf Description: IC DSP 16BIT 250MHZ 332FCBGA
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MSC8103VT1100F MSC8103VT1100F NXP USA Inc. MSC8103.pdf Description: IC DSP 16BIT 275MHZ 332FCBGA
Packaging: Tray
Package / Case: 332-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Communications Processor Module (CPM)
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 512KB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 275MHz
Supplier Device Package: 332-FCBGA (17x17)
Part Status: Obsolete
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MSC8122TVT4800V MSC8122TVT4800V NXP USA Inc. MSC8122.pdf Description: IC DSP QUAD 16B 300MHZ 431FCBGA
Supplier Device Package: 431-FCPBGA (20x20)
Clock Rate: 300MHz
Voltage - Core: 1.10V
Voltage - I/O: 3.30V
On-Chip RAM: 1.436MB
Non-Volatile Memory: External
Operating Temperature: -40°C ~ 105°C (TJ)
Type: SC140 Core
Interface: DSI, Ethernet, RS-232
Mounting Type: Surface Mount
Package / Case: 431-BFBGA, FCBGA
Packaging: Tray
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MSC8122TVT6400V MSC8122TVT6400V NXP USA Inc. MSC8122.pdf Description: IC DSP QUAD 16B 400MHZ 431FCBGA
Supplier Device Package: 431-FCPBGA (20x20)
Clock Rate: 400MHz
Voltage - Core: 1.10V
Voltage - I/O: 3.30V
On-Chip RAM: 1.436MB
Non-Volatile Memory: External
Operating Temperature: -40°C ~ 105°C (TJ)
Type: SC140 Core
Interface: DSI, Ethernet, RS-232
Mounting Type: Surface Mount
Package / Case: 431-BFBGA, FCBGA
Packaging: Tray
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MSC8126VT8000 MSC8126VT8000 NXP USA Inc. MSC8126.pdf Description: IC DSP QUAD 16B 500MHZ 431FCBGA
Operating Temperature: 0°C ~ 90°C (TJ)
Type: SC140 Core
Interface: DSI, Ethernet, RS-232
Mounting Type: Surface Mount
Package / Case: 431-BFBGA, FCBGA
Packaging: Tray
Part Status: Obsolete
Supplier Device Package: 431-FCPBGA (20x20)
Clock Rate: 500MHz
Voltage - Core: 1.20V
Voltage - I/O: 3.30V
On-Chip RAM: 1.436MB
Non-Volatile Memory: External
Produkt ist nicht verfügbar
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MW4IC2230GNBR1 MW4IC2230GNBR1 NXP USA Inc. MW4IC2230.pdf Description: IC AMP CELL 1.6-2.4GHZ TO272WB
Supplier Device Package: TO-272 WB-16 GULL
Current - Supply: 60mA
Gain: 31dB
Voltage - Supply: 26V
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Frequency: 1.6GHz ~ 2.4GHz
Mounting Type: Chassis Mount
Package / Case: TO-272-16 Variant, Gull Wing
Packaging: Tape & Reel (TR)
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MWIC930GNR1 MWIC930GNR1 NXP USA Inc. MWIC930(G)R1.pdf Description: IC RF AMP CEL 900MHZ TO272 WB-16
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MWIC930NR1 MWIC930NR1 NXP USA Inc. MWIC930(G)R1.pdf Description: IC AMP CELLULAR 900MHZ TO272WB
Part Status: Obsolete
Supplier Device Package: TO-272 WB-16
Current - Supply: 90mA
Gain: 30dB
Voltage - Supply: 26V
RF Type: Cellular, GSM, EDGE, N-CDMA
Frequency: 900MHz
Mounting Type: Chassis Mount
Package / Case: TO-272-16 Variant, Flat Leads
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MW4IC2230GNBR1 MW4IC2230GNBR1 NXP USA Inc. MW4IC2230.pdf Description: IC AMP CELL 1.6-2.4GHZ TO272WB
Supplier Device Package: TO-272 WB-16 GULL
Current - Supply: 60mA
Gain: 31dB
Voltage - Supply: 26V
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Frequency: 1.6GHz ~ 2.4GHz
Mounting Type: Chassis Mount
Package / Case: TO-272-16 Variant, Gull Wing
Packaging: Cut Tape (CT)
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MWIC930GNR1 MWIC930GNR1 NXP USA Inc. MWIC930(G)R1.pdf Description: IC RF AMP CEL 900MHZ TO272 WB-16
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MWIC930NR1 MWIC930NR1 NXP USA Inc. MWIC930(G)R1.pdf Description: IC AMP CELLULAR 900MHZ TO272WB
Part Status: Obsolete
Supplier Device Package: TO-272 WB-16
Current - Supply: 90mA
Gain: 30dB
Voltage - Supply: 26V
RF Type: Cellular, GSM, EDGE, N-CDMA
Frequency: 900MHz
Mounting Type: Chassis Mount
Package / Case: TO-272-16 Variant, Flat Leads
Packaging: Cut Tape (CT)
auf Bestellung 266 Stücke:
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1+159.89 EUR
10+149.07 EUR
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100+129.63 EUR
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MRF5S19060NR1 MRF5S19060NR1 NXP USA Inc. MRF5S19060N.pdf Description: FET RF 65V 1.99GHZ TO-270-4
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MRF5S9100NBR1 MRF5S9100NBR1 NXP USA Inc. MRF5S9100.pdf Description: FET RF 68V 880MHZ TO-272-4
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MC908GP32CFBER MC908GP32CFBER NXP USA Inc. MC68HC08GR32A.pdf Description: IC MCU 8BIT 32KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Part Status: Not For New Designs
Number of I/O: 33
DigiKey Programmable: Not Verified
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MC33897EFR2 MC33897EFR2 NXP USA Inc. 33897%28A%2CB%2CC%2CD%2CT%29.pdf Description: IC TRANSCEIVER HALF 1/1 14SOIC
Part Status: Obsolete
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
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PCA9555BS,118 PCA9555BS,118 NXP USA Inc. PCA9555.pdf Description: IC XPND 400KHZ I2C SMBUS 24HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
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LPC2294HBD144,551 LPC2294HBD144,551 NXP USA Inc. LPC2292_2294.pdf Description: IC MCU 16/32B 256KB FLSH 144LQFP
Number of I/O: 112
Part Status: Obsolete
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
DigiKey Programmable: Not Verified
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PCA9555BS,118 PCA9555BS,118 NXP USA Inc. PCA9555.pdf Description: IC XPND 400KHZ I2C SMBUS 24HVQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1283 Stücke:
Lieferzeit 10-14 Tag (e)
5+5.05 EUR
10+3.76 EUR
25+3.44 EUR
100+3.09 EUR
250+2.92 EUR
500+2.86 EUR
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KMZ51,115 KMZ51,115 NXP USA Inc. kmz51_3.pdf Description: SENSOR MR ANALOG 8SO
Part Status: Obsolete
Supplier Device Package: 8-SO
Technology: Magnetoresistive
Voltage - Supply: 5V ~ 8V
Operating Temperature: -40°C ~ 125°C
Axis: Single
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMZ52,118 KMZ52,118 NXP USA Inc. kmz52_1.pdf Description: SENSOR MR ANALOG 16SO
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 16-SO
Technology: Magnetoresistive
Voltage - Supply: 5V ~ 8V
Operating Temperature: -40°C ~ 125°C (TA)
Axis: Single
Mounting Type: Surface Mount
Output Type: Analog Voltage
Produkt ist nicht verfügbar
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KMZ51,115 KMZ51,115 NXP USA Inc. kmz51_3.pdf Description: SENSOR MR ANALOG 8SO
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Part Status: Obsolete
Supplier Device Package: 8-SO
Technology: Magnetoresistive
Voltage - Supply: 5V ~ 8V
Operating Temperature: -40°C ~ 125°C
Axis: Single
Produkt ist nicht verfügbar
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KMZ52,118 KMZ52,118 NXP USA Inc. kmz52_1.pdf Description: SENSOR MR ANALOG 16SO
Part Status: Obsolete
Supplier Device Package: 16-SO
Technology: Magnetoresistive
Voltage - Supply: 5V ~ 8V
Operating Temperature: -40°C ~ 125°C (TA)
Axis: Single
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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DSP56303VL100 DSP56303VL100 NXP USA Inc. DSP56303.pdf Description: IC DSP 24BIT 100MHZ 196-MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 100°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 196-LBGA (15x15)
Part Status: Obsolete
Produkt ist nicht verfügbar
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DSP56321VL200R2 DSP56321VL200R2 NXP USA Inc. DSP56321.pdf Description: IC DSP 24BIT 200MHZ 196MAPBGA
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M68LC302CAF16VCT M68LC302CAF16VCT NXP USA Inc. MC68LC302.pdf Description: IC MPU M683XX 166MHZ 100LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 100-LQFP (14x14)
Voltage - I/O: 3.3V
Core Processor: M68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 166MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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M68LC302CAF20VCT M68LC302CAF20VCT NXP USA Inc. MC68LC302.pdf Description: IC MPU M683XX 20MHZ 100LQFP
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MPC860DECVR66D4 MPC860EC.pdf
MPC860DECVR66D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Produkt ist nicht verfügbar
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MPC860DEVR50D4 MPC860EC.pdf
MPC860DEVR50D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (2)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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MPC860DPCVR66D4 MPC860EC.pdf
MPC860DPCVR66D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Produkt ist nicht verfügbar
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MPC860DTVR50D4 MPC860EC.pdf
MPC860DTVR50D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (2), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC860ENCVR66D4 MPC860EC.pdf
MPC860ENCVR66D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC860ENVR50D4 MPC860EC.pdf
MPC860ENVR50D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Package / Case: 357-BBGA
Packaging: Tray
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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MPC860PCVR50D4 MPC860EC.pdf
MPC860PCVR50D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Produkt ist nicht verfügbar
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MPC860PVR50D4 MPC860EC.pdf
MPC860PVR50D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC860SRCVR50D4 MPC860EC.pdf
MPC860SRCVR50D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC860TCVR66D4 MPC860EC.pdf
MPC860TCVR66D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 44 Stücke
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MPC862PVR100B MPC862EC%2C857%28T%2CDSL%29.pdf
MPC862PVR100B
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC862TCVR66B MPC862EC,857(T,DSL).pdf
MPC862TCVR66B
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 44 Stücke
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MPC862TVR100B MPC862EC,857(T,DSL).pdf
MPC862TVR100B
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC862TVR66B MPC862EC,857(T,DSL).pdf
MPC862TVR66B
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 44 Stücke
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MPC866PCVR100A MPC866EC.pdf
MPC866PCVR100A
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 100°C (TA)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC866PVR100A MPC866EC.pdf
MPC866PVR100A
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Produkt ist nicht verfügbar
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MPC866PVR133A MPC866EC.pdf
MPC866PVR133A
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 133MHz
Produkt ist nicht verfügbar
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MPC866TCVR100A MPC866EC.pdf
MPC866TCVR100A
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 100°C (TA)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC866TVR100A MPC866EC.pdf
MPC866TVR100A
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC866TVR133A MPC866EC.pdf
MPC866TVR133A
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 133MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Produkt ist nicht verfügbar
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MPC870VR133 MPC875EC.pdf
MPC870VR133
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Produkt ist nicht verfügbar
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MPC870VR66 MPC875EC.pdf
MPC870VR66
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Produkt ist nicht verfügbar
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MPC870VR80 MPC875EC.pdf
MPC870VR80
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Produkt ist nicht verfügbar
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MPC875VR80 MPC875EC.pdf
MPC875VR80
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 256BGA
auf Bestellung 70 Stücke:
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MPC880CVR133 MPC885EC.pdf
MPC880CVR133
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Produkt ist nicht verfügbar
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MPC880VR133 MPC885EC.pdf
MPC880VR133
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10Mbps (2), 10/100Mbps (2)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 133MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC880VR66 MPC885EC.pdf
MPC880VR66
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10Mbps (2), 10/100Mbps (2)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Produkt ist nicht verfügbar
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MPC880VR80
MPC880VR80
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 357BGA
auf Bestellung 3300 Stücke:
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MPC885CVR133 MPC885EC.pdf
MPC885CVR133
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10Mbps (3), 10/100Mbps (2)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 100°C (TA)
Speed: 133MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Security Features: Cryptography
Graphics Acceleration: No
Packaging: Tray
Produkt ist nicht verfügbar
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MPC885CVR66 MPC885EC.pdf
MPC885CVR66
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 100°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10Mbps (3), 10/100Mbps (2)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Produkt ist nicht verfügbar
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MPC885VR133 MPC885EC.pdf
MPC885VR133
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MRF5S19060NR1 MRF5S19060N.pdf
MRF5S19060NR1
Hersteller: NXP USA Inc.
Description: FET RF 65V 1.99GHZ TO-270-4
Produkt ist nicht verfügbar
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MRF5S9100NBR1 MRF5S9100.pdf
MRF5S9100NBR1
Hersteller: NXP USA Inc.
Description: FET RF 68V 880MHZ TO-272-4
Produkt ist nicht verfügbar
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MRF5S9101NBR1 MRF5S9101.pdf
MRF5S9101NBR1
Hersteller: NXP USA Inc.
Description: FET RF 68V 960MHZ TO-272-4
Produkt ist nicht verfügbar
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MSC8101VT1375F MSC8101.pdf
MSC8101VT1375F
Hersteller: NXP USA Inc.
Description: IC DSP 16BIT 250MHZ 332FCBGA
Produkt ist nicht verfügbar
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MSC8103VT1100F MSC8103.pdf
MSC8103VT1100F
Hersteller: NXP USA Inc.
Description: IC DSP 16BIT 275MHZ 332FCBGA
Packaging: Tray
Package / Case: 332-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Communications Processor Module (CPM)
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 512KB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 275MHz
Supplier Device Package: 332-FCBGA (17x17)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MSC8122TVT4800V MSC8122.pdf
MSC8122TVT4800V
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 16B 300MHZ 431FCBGA
Supplier Device Package: 431-FCPBGA (20x20)
Clock Rate: 300MHz
Voltage - Core: 1.10V
Voltage - I/O: 3.30V
On-Chip RAM: 1.436MB
Non-Volatile Memory: External
Operating Temperature: -40°C ~ 105°C (TJ)
Type: SC140 Core
Interface: DSI, Ethernet, RS-232
Mounting Type: Surface Mount
Package / Case: 431-BFBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MSC8122TVT6400V MSC8122.pdf
MSC8122TVT6400V
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 16B 400MHZ 431FCBGA
Supplier Device Package: 431-FCPBGA (20x20)
Clock Rate: 400MHz
Voltage - Core: 1.10V
Voltage - I/O: 3.30V
On-Chip RAM: 1.436MB
Non-Volatile Memory: External
Operating Temperature: -40°C ~ 105°C (TJ)
Type: SC140 Core
Interface: DSI, Ethernet, RS-232
Mounting Type: Surface Mount
Package / Case: 431-BFBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MSC8126VT8000 MSC8126.pdf
MSC8126VT8000
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 16B 500MHZ 431FCBGA
Operating Temperature: 0°C ~ 90°C (TJ)
Type: SC140 Core
Interface: DSI, Ethernet, RS-232
Mounting Type: Surface Mount
Package / Case: 431-BFBGA, FCBGA
Packaging: Tray
Part Status: Obsolete
Supplier Device Package: 431-FCPBGA (20x20)
Clock Rate: 500MHz
Voltage - Core: 1.20V
Voltage - I/O: 3.30V
On-Chip RAM: 1.436MB
Non-Volatile Memory: External
Produkt ist nicht verfügbar
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MW4IC2230GNBR1 MW4IC2230.pdf
MW4IC2230GNBR1
Hersteller: NXP USA Inc.
Description: IC AMP CELL 1.6-2.4GHZ TO272WB
Supplier Device Package: TO-272 WB-16 GULL
Current - Supply: 60mA
Gain: 31dB
Voltage - Supply: 26V
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Frequency: 1.6GHz ~ 2.4GHz
Mounting Type: Chassis Mount
Package / Case: TO-272-16 Variant, Gull Wing
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MWIC930GNR1 MWIC930(G)R1.pdf
MWIC930GNR1
Hersteller: NXP USA Inc.
Description: IC RF AMP CEL 900MHZ TO272 WB-16
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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MWIC930NR1 MWIC930(G)R1.pdf
MWIC930NR1
Hersteller: NXP USA Inc.
Description: IC AMP CELLULAR 900MHZ TO272WB
Part Status: Obsolete
Supplier Device Package: TO-272 WB-16
Current - Supply: 90mA
Gain: 30dB
Voltage - Supply: 26V
RF Type: Cellular, GSM, EDGE, N-CDMA
Frequency: 900MHz
Mounting Type: Chassis Mount
Package / Case: TO-272-16 Variant, Flat Leads
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MW4IC2230GNBR1 MW4IC2230.pdf
MW4IC2230GNBR1
Hersteller: NXP USA Inc.
Description: IC AMP CELL 1.6-2.4GHZ TO272WB
Supplier Device Package: TO-272 WB-16 GULL
Current - Supply: 60mA
Gain: 31dB
Voltage - Supply: 26V
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Frequency: 1.6GHz ~ 2.4GHz
Mounting Type: Chassis Mount
Package / Case: TO-272-16 Variant, Gull Wing
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MWIC930GNR1 MWIC930(G)R1.pdf
MWIC930GNR1
Hersteller: NXP USA Inc.
Description: IC RF AMP CEL 900MHZ TO272 WB-16
Produkt ist nicht verfügbar
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MWIC930NR1 MWIC930(G)R1.pdf
MWIC930NR1
Hersteller: NXP USA Inc.
Description: IC AMP CELLULAR 900MHZ TO272WB
Part Status: Obsolete
Supplier Device Package: TO-272 WB-16
Current - Supply: 90mA
Gain: 30dB
Voltage - Supply: 26V
RF Type: Cellular, GSM, EDGE, N-CDMA
Frequency: 900MHz
Mounting Type: Chassis Mount
Package / Case: TO-272-16 Variant, Flat Leads
Packaging: Cut Tape (CT)
auf Bestellung 266 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+159.89 EUR
10+149.07 EUR
25+138.28 EUR
100+129.63 EUR
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MRF5S19060NR1 MRF5S19060N.pdf
MRF5S19060NR1
Hersteller: NXP USA Inc.
Description: FET RF 65V 1.99GHZ TO-270-4
Produkt ist nicht verfügbar
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MRF5S9100NBR1 MRF5S9100.pdf
MRF5S9100NBR1
Hersteller: NXP USA Inc.
Description: FET RF 68V 880MHZ TO-272-4
Produkt ist nicht verfügbar
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MC908GP32CFBER MC68HC08GR32A.pdf
MC908GP32CFBER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Part Status: Not For New Designs
Number of I/O: 33
DigiKey Programmable: Not Verified
auf Bestellung 886 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+55.28 EUR
10+44.62 EUR
25+41.97 EUR
100+39.7 EUR
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MC33897EFR2 33897%28A%2CB%2CC%2CD%2CT%29.pdf
MC33897EFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Part Status: Obsolete
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
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PCA9555BS,118 PCA9555.pdf
PCA9555BS,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2294HBD144,551 LPC2292_2294.pdf
LPC2294HBD144,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Number of I/O: 112
Part Status: Obsolete
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9555BS,118 PCA9555.pdf
PCA9555BS,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HVQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1283 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5+5.05 EUR
10+3.76 EUR
25+3.44 EUR
100+3.09 EUR
250+2.92 EUR
500+2.86 EUR
Mindestbestellmenge: 5 Stücke
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KMZ51,115 kmz51_3.pdf
KMZ51,115
Hersteller: NXP USA Inc.
Description: SENSOR MR ANALOG 8SO
Part Status: Obsolete
Supplier Device Package: 8-SO
Technology: Magnetoresistive
Voltage - Supply: 5V ~ 8V
Operating Temperature: -40°C ~ 125°C
Axis: Single
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KMZ52,118 kmz52_1.pdf
KMZ52,118
Hersteller: NXP USA Inc.
Description: SENSOR MR ANALOG 16SO
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 16-SO
Technology: Magnetoresistive
Voltage - Supply: 5V ~ 8V
Operating Temperature: -40°C ~ 125°C (TA)
Axis: Single
Mounting Type: Surface Mount
Output Type: Analog Voltage
Produkt ist nicht verfügbar
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KMZ51,115 kmz51_3.pdf
KMZ51,115
Hersteller: NXP USA Inc.
Description: SENSOR MR ANALOG 8SO
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Part Status: Obsolete
Supplier Device Package: 8-SO
Technology: Magnetoresistive
Voltage - Supply: 5V ~ 8V
Operating Temperature: -40°C ~ 125°C
Axis: Single
Produkt ist nicht verfügbar
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KMZ52,118 kmz52_1.pdf
KMZ52,118
Hersteller: NXP USA Inc.
Description: SENSOR MR ANALOG 16SO
Part Status: Obsolete
Supplier Device Package: 16-SO
Technology: Magnetoresistive
Voltage - Supply: 5V ~ 8V
Operating Temperature: -40°C ~ 125°C (TA)
Axis: Single
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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DSP56303VL100 DSP56303.pdf
DSP56303VL100
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 196-MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 100°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 196-LBGA (15x15)
Part Status: Obsolete
Produkt ist nicht verfügbar
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DSP56321VL200R2 DSP56321.pdf
DSP56321VL200R2
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 200MHZ 196MAPBGA
Produkt ist nicht verfügbar
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M68LC302CAF16VCT MC68LC302.pdf
M68LC302CAF16VCT
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 166MHZ 100LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 100-LQFP (14x14)
Voltage - I/O: 3.3V
Core Processor: M68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 166MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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M68LC302CAF20VCT MC68LC302.pdf
M68LC302CAF20VCT
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 100LQFP
Produkt ist nicht verfügbar
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