Suchergebnisse für "163241" : > 61

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COB нить 26мм 3V/50mA, белый COB нить 26мм 3V/50mA, белый
Produktcode: 163241
Optoelektronik > Laternen, Lampen usw
Beschreibung: COB світлодіодна трубочка довжина: 26мм. Живлення: 3V/50mA
auf Bestellung 117 Stück:
Lieferzeit 21-28 Tag (e)
1632417 Pomona CON, Adaptor, Bnc Male/Phono Jack
auf Bestellung 7 Stücke:
Lieferzeit 14-21 Tag (e)
3+70.41 EUR
Mindestbestellmenge: 3
110-41-632-41-001000 110-41-632-41-001000 Mill-Max MMMC_S_A0004812437_1-2556233.pdf IC & Component Sockets 32 PIN SKT 200u Sn
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+5.58 EUR
110-41-632-41-001000 110-41-632-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 1059 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.24 EUR
12+ 4.76 EUR
36+ 4.51 EUR
60+ 4.4 EUR
108+ 4.19 EUR
252+ 3.67 EUR
504+ 3.57 EUR
1008+ 3.04 EUR
Mindestbestellmenge: 4
110-91-632-41-001000 110-91-632-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.19 EUR
FWLF163241-C FWLF163241-C ATGBICS product-pdf?productId=107492201&lang=en Description: DWDM Ch41 SFP OC-48/STM-16 2.7G
Packaging: Tray
Connector Type: LC
Wavelength: 1544.53nm
Mounting Type: Pluggable, SFP+
Voltage - Supply: 3.3V
Applications: General Purpose
Data Rate: 2.7Gbps
Part Status: Active
auf Bestellung 9751 Stücke:
Lieferzeit 10-14 Tag (e)
1+1112.32 EUR
50+ 1056.79 EUR
150+ 1001.09 EUR
1000+ 945.56 EUR
SP001632410 Infineon
auf Bestellung 200 Stücke:
Lieferzeit 21-28 Tag (e)
241-3-24 241-3-24 Signal Transformer ds-st-241-series.pdf Description: PWR XFMR LAMINATED 2.4VA CHAS MT
Packaging: Bulk
Size / Dimension: 52.60mm L x 29.60mm W
Mounting Type: Chassis Mount
Type: Laminated Core
Weight: 0.25 lb (113.4 g)
Termination Style: Solder, Quick Connect
Primary Winding(s): Single
Secondary Winding(s): Single
Power - Max: 2.4VA
Voltage - Isolation: 2500Vrms
Current - Output (Max): 100mA
Voltage - Primary: 115V
Height - Seated (Max): 31.20mm
Voltage - Secondary (Full Load): 24V
Center Tap: Yes
Part Status: Active
auf Bestellung 147 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.43 EUR
75+ 13.47 EUR
241-8-120L 241-8-120L Signal Transformer ds-st-241-l-series.pdf Description: PWR XFMR LAMINATED 100VA CHAS MT
Packaging: Bulk
Size / Dimension: 102.40mm L x 58.50mm W
Mounting Type: Chassis Mount
Type: Laminated Core
Weight: 2.8 lbs (1.3 kg)
Termination Style: Wire Leads
Primary Winding(s): Single
Secondary Winding(s): Single
Power - Max: 100VA
Voltage - Isolation: 2500Vrms
Current - Output (Max): 850mA
Voltage - Primary: 115V
Height - Seated (Max): 67.70mm
Voltage - Secondary (Full Load): 120V
Center Tap: Yes
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
1+48.8 EUR
10+ 43.07 EUR
4054 4054 Pomona Electronics 2074413g-en-2019_Pomona_Catalog_w.pdf Description: ADAPT BNC PLUG TO RCA JACK
Packaging: Bulk
Convert From (Adapter End): BNC Plug, Male Pin
Convert To (Adapter End): Phono (RCA) Jack
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+49.26 EUR
63241-1 63241-1 TE Connectivity / AMP product-63241-1.datasheet.pdf Terminals 110 FF RCPT 22-18
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)
9000+0.1 EUR
Mindestbestellmenge: 9000
63241-3 63241-3 TE Connectivity / AMP ENG_CS_82004_FASTIN_FASTON_Product_Line_0311-3351203.pdf Terminals RCPT FASTIN- FASTON 110 SERIES
auf Bestellung 81000 Stücke:
Lieferzeit 10-14 Tag (e)
9000+0.11 EUR
27000+ 0.099 EUR
45000+ 0.095 EUR
Mindestbestellmenge: 9000
63241-3 (Mouser Reel) 63241-3 (Mouser Reel) TE Connectivity NG_CD_63241_M_baseFilename-972206.pdf Terminals RCPT FASTIN- Reel of 1000
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+0.14 EUR
Mindestbestellmenge: 1000
CBR04C819B2GAC CBR04C819B2GAC KEMET CBR04C819B2GAC Description: CAP CER 8.1PF 200V C0G/NP0 0402
Tolerance: ±0.1pF
Features: High Q, Low Loss, Ultra Low ESR
Packaging: Cut Tape (CT)
Voltage - Rated: 200V
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: RF, Microwave, High Frequency
Thickness (Max): 0.022" (0.55mm)
Part Status: Active
Capacitance: 8.1 pF
auf Bestellung 793 Stücke:
Lieferzeit 10-14 Tag (e)
17+1.09 EUR
25+ 0.73 EUR
50+ 0.58 EUR
100+ 0.48 EUR
500+ 0.38 EUR
Mindestbestellmenge: 17
IDH02G65C5XKSA2 IDH02G65C5XKSA2 Infineon Technologies Infineon-IDH02G65C5-DS-v02_02-en.pdf?fileId=db3a304339dcf4b1013a030ab96758eb Description: DIODE SIL CARB 650V 2A TO220-2
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 70pF @ 1V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: PG-TO220-2
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 2 A
auf Bestellung 475 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.34 EUR
50+ 1.88 EUR
100+ 1.49 EUR
Mindestbestellmenge: 8
IDH02G65C5XKSA2 IDH02G65C5XKSA2 Infineon Technologies Infineon_IDH02G65C5_DS_v02_02_en-1731476.pdf Schottky Diodes & Rectifiers SIC DIODES
auf Bestellung 443 Stücke:
Lieferzeit 10-14 Tag (e)
2+2.32 EUR
10+ 1.88 EUR
100+ 1.48 EUR
500+ 1.25 EUR
1000+ 0.96 EUR
5000+ 0.92 EUR
Mindestbestellmenge: 2
IDH02G65C5XKSA2 IDH02G65C5XKSA2 Infineon Technologies idh02g65c5_final_datasheet_v2_2.pdf Rectifier Diode Schottky SiC 650V 2A 2-Pin(2+Tab) TO-220 Tube
auf Bestellung 970 Stücke:
Lieferzeit 14-21 Tag (e)
IDH10G65C5XKSA2 IDH10G65C5XKSA2 Infineon Technologies Infineon_IDH10G65C5_DS_v02_02_en-1226829.pdf Schottky Diodes & Rectifiers SIC DIODES
auf Bestellung 1253 Stücke:
Lieferzeit 10-14 Tag (e)
1+6.9 EUR
10+ 5.47 EUR
100+ 4.68 EUR
250+ 4.54 EUR
500+ 3.63 EUR
1000+ 3.34 EUR
IDH10G65C5XKSA2 IDH10G65C5XKSA2 Infineon Technologies IDH10G65C5_Final_Datasheet_v_2_1.pdf?folderId=db3a30431ddc9372011ed0010fda1bd3&fileId=db3a30433a047ba0013a06a8f03d0169 Description: DIODE SIL CARB 650V 10A TO220-1
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 300pF @ 1V, 1MHz
Current - Average Rectified (Io): 10A
Supplier Device Package: PG-TO220-2-1
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 10 A
Current - Reverse Leakage @ Vr: 180 µA @ 650 V
auf Bestellung 1389 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.88 EUR
50+ 3.86 EUR
100+ 3.31 EUR
500+ 3.24 EUR
Mindestbestellmenge: 4
IDH20G65C5XKSA2 IDH20G65C5XKSA2 Infineon Technologies Infineon_IDH20G65C5_DS_v02_02_en-1226722.pdf Schottky Diodes & Rectifiers SIC DIODES
auf Bestellung 235 Stücke:
Lieferzeit 10-14 Tag (e)
1+12.06 EUR
10+ 8.57 EUR
100+ 8.17 EUR
500+ 7.62 EUR
1000+ 6.55 EUR
IDH20G65C5XKSA2 IDH20G65C5XKSA2 Infineon Technologies IDH20G65C5_Final_Datasheet_v_2_1.pdf?folderId=db3a30431ddc9372011ed0010fda1bd3&fileId=db3a30433a047ba0013a06d5f79701c6 Description: DIODE SIL CARB 650V 20A TO220-1
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 590pF @ 1V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: PG-TO220-2-1
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 20 A
Current - Reverse Leakage @ Vr: 210 µA @ 650 V
auf Bestellung 864 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.21 EUR
50+ 9.74 EUR
100+ 8.72 EUR
500+ 7.69 EUR
Mindestbestellmenge: 2
IDH20G65C5XKSA2 IDH20G65C5XKSA2 Infineon Technologies idh20g65c5_final_datasheet_v2_2.pdf Rectifier Diode Schottky SiC 650V 20A 2-Pin(2+Tab) TO-220 Tube
auf Bestellung 600 Stücke:
Lieferzeit 14-21 Tag (e)
MLG1005SR11JTD25 MLG1005SR11JTD25 TDK Corporation inductor_automotive_high-frequency_mlg1005s_en.pdf Description: FIXED IND 110NH 150MA 2.2OHM SMD
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: 0402 (1005 Metric)
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Multilayer
Operating Temperature: -55°C ~ 125°C
DC Resistance (DCR): 2.2Ohm Max
Q @ Freq: 8 @ 100MHz
Frequency - Self Resonant: 700MHz
Ratings: AEC-Q200
Material - Core: Ceramic, Non-Magnetic
Inductance Frequency - Test: 100 MHz
Supplier Device Package: 0402 (1005 Metric)
Height - Seated (Max): 0.022" (0.55mm)
Part Status: Active
Inductance: 110 nH
Current Rating (Amps): 150 mA
auf Bestellung 2735 Stücke:
Lieferzeit 10-14 Tag (e)
112+0.16 EUR
129+ 0.14 EUR
141+ 0.13 EUR
160+ 0.11 EUR
182+ 0.097 EUR
250+ 0.092 EUR
500+ 0.087 EUR
1000+ 0.066 EUR
2500+ 0.065 EUR
Mindestbestellmenge: 112
RMCF0603FT324R RMCF0603FT324R Stackpole Electronics Inc sei-rmcf_rmcp.pdf Description: RES 324 OHM 1% 1/10W 0603
Packaging: Tape & Reel (TR)
Power (Watts): 0.1W, 1/10W
Tolerance: ±1%
Features: Automotive AEC-Q200
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Ratings: AEC-Q200
Number of Terminations: 2
Supplier Device Package: 0603
Height - Seated (Max): 0.022" (0.55mm)
Part Status: Active
Resistance: 324 Ohms
auf Bestellung 55000 Stücke:
Lieferzeit 10-14 Tag (e)
5026+0.0035 EUR
10000+ 0.0031 EUR
25000+ 0.0026 EUR
50000+ 0.0024 EUR
Mindestbestellmenge: 5026
RMCF0603FT324R RMCF0603FT324R Stackpole Electronics Inc sei-rmcf_rmcp.pdf Description: RES 324 OHM 1% 1/10W 0603
Power (Watts): 0.1W, 1/10W
Tolerance: ±1%
Features: Automotive AEC-Q200
Packaging: Cut Tape (CT)
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Ratings: AEC-Q200
Number of Terminations: 2
Supplier Device Package: 0603
Height - Seated (Max): 0.022" (0.55mm)
Part Status: Active
Resistance: 324 Ohms
auf Bestellung 65333 Stücke:
Lieferzeit 10-14 Tag (e)
112+0.16 EUR
715+ 0.025 EUR
1191+ 0.015 EUR
1429+ 0.012 EUR
2146+ 0.0082 EUR
2513+ 0.007 EUR
Mindestbestellmenge: 112
104-11-632-41-770000 Mill-Max Manufacturing Corp. 2017-11%3A096.pdf Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
104-11-632-41-780000 Mill-Max mill-max_mmmc-s-a0000088332-1-1738417.pdf IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
110-11-632-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-11-632-41-001000 110-11-632-41-001000 Mill-Max MMMC_S_A0003128414_1-2554850.pdf IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
110-41-632-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-41-632-41-105000 110-41-632-41-105000 Mill-Max 098-259748.pdf IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
110-41-632-41-605000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
110-41-632-41-605000 110-41-632-41-605000 Mill-Max MMMC_S_A0000088326_1-2552877.pdf IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
110-81-632-41-001101 Preci-Dip DIL SOCKET SOLDER TAIL 2.54 LOW PROFILE
Produkt ist nicht verfügbar
110-91-632-41-001000 110-91-632-41-001000 Mill-Max MMMC_S_A0004812459_1-2556177.pdf IC & Component Sockets 32P TIN PIN CONT
Produkt ist nicht verfügbar
110-91-632-41-001000 Preci-Dip 110-13-950-41-001.pdf Conn DIP Socket SKT 32 POS 2.54mm Solder ST Thru-Hole
Produkt ist nicht verfügbar
110-91-632-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-91-632-41-605000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
111-41-632-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A091.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
111-41-632-41-001000 Mill-Max MMMC_S_A0003128315_1-2554876.pdf IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
111-91-632-41-001000 Mill-Max MMMC_S_A0003128315_1-2554876.pdf IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
111-91-632-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A091.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
114-41-632-41-117000 Mill-Max mill-max_mmmc-s-a0003128317-1-1738572.pdf IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
114-41-632-41-117000 Mill-Max Manufacturing Corp. 2017-11%3A106.pdf Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
114-91-632-41-117000 Mill-Max Manufacturing Corp. 2017-11%3A106.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
114-91-632-41-117000 Mill-Max mill-max_mmmc-s-a0003128317-1-1738572.pdf IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
114-91-632-41-117101 114-91-632-41-117101 Preci-Dip catalog.pdf Conn DIP Socket SKT 32 POS 2.54mm Solder ST SMD T/R
Produkt ist nicht verfügbar
114-91-632-41-134161 114-91-632-41-134161 Preci-Dip catalog.pdf Conn DIP Socket SKT 32 POS 2.54mm Solder ST SMD
Produkt ist nicht verfügbar
115-41-632-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A092.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
115-41-632-41-001000 Mill-Max MMMC_S_A0000088319_1-2552833.pdf IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
115-41-632-41-003000 Mill-Max Manufacturing Corp. 2017-11%3A093.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
115-41-632-41-003000 Mill-Max MMMC_S_A0000088324_1-2553081.pdf IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
115-91-632-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A092.pdf Description: SKT IC OPEN LOWPRO
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
115-91-632-41-003000 Mill-Max Manufacturing Corp. Description: SOCKET IC OPEN LOWPRO .600 32POS
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
115-91-632-41-003000 Mill-Max MMMC_S_A0000088324_1-2553081.pdf IC & Component Sockets 32P IC SOCKET
Produkt ist nicht verfügbar
116-41-632-41-001000 Mill-Max MMMC_S_A0000089115_1-2552886.pdf IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
116-41-632-41-007000 Mill-Max MMMC_S_A0000089115_1-2552886.pdf IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
116-41-632-41-008000 Mill-Max MMMC_S_A0000089115_1-2552886.pdf IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
116-91-632-41-001000 Mill-Max MMMC_S_A0000089115_1-2552886.pdf IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
116-91-632-41-003000 Mill-Max MMMC_S_A0000089115_1-2552886.pdf IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
116-91-632-41-007000 Mill-Max MMMC_S_A0000089115_1-2552886.pdf IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
COB нить 26мм 3V/50mA, белый
Produktcode: 163241
COB нить 26мм 3V/50mA, белый
Optoelektronik > Laternen, Lampen usw
Beschreibung: COB світлодіодна трубочка довжина: 26мм. Живлення: 3V/50mA
auf Bestellung 117 Stück:
Lieferzeit 21-28 Tag (e)
1632417
Hersteller: Pomona
CON, Adaptor, Bnc Male/Phono Jack
auf Bestellung 7 Stücke:
Lieferzeit 14-21 Tag (e)
Anzahl Preis ohne MwSt
3+70.41 EUR
Mindestbestellmenge: 3
110-41-632-41-001000 MMMC_S_A0004812437_1-2556233.pdf
110-41-632-41-001000
Hersteller: Mill-Max
IC & Component Sockets 32 PIN SKT 200u Sn
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+5.58 EUR
110-41-632-41-001000 2017-11%3A090.pdf
110-41-632-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 1059 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.24 EUR
12+ 4.76 EUR
36+ 4.51 EUR
60+ 4.4 EUR
108+ 4.19 EUR
252+ 3.67 EUR
504+ 3.57 EUR
1008+ 3.04 EUR
Mindestbestellmenge: 4
110-91-632-41-001000 2017-11%3A090.pdf
110-91-632-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+27.19 EUR
FWLF163241-C product-pdf?productId=107492201&lang=en
FWLF163241-C
Hersteller: ATGBICS
Description: DWDM Ch41 SFP OC-48/STM-16 2.7G
Packaging: Tray
Connector Type: LC
Wavelength: 1544.53nm
Mounting Type: Pluggable, SFP+
Voltage - Supply: 3.3V
Applications: General Purpose
Data Rate: 2.7Gbps
Part Status: Active
auf Bestellung 9751 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+1112.32 EUR
50+ 1056.79 EUR
150+ 1001.09 EUR
1000+ 945.56 EUR
SP001632410
Hersteller: Infineon
auf Bestellung 200 Stücke:
Lieferzeit 21-28 Tag (e)
241-3-24 ds-st-241-series.pdf
241-3-24
Hersteller: Signal Transformer
Description: PWR XFMR LAMINATED 2.4VA CHAS MT
Packaging: Bulk
Size / Dimension: 52.60mm L x 29.60mm W
Mounting Type: Chassis Mount
Type: Laminated Core
Weight: 0.25 lb (113.4 g)
Termination Style: Solder, Quick Connect
Primary Winding(s): Single
Secondary Winding(s): Single
Power - Max: 2.4VA
Voltage - Isolation: 2500Vrms
Current - Output (Max): 100mA
Voltage - Primary: 115V
Height - Seated (Max): 31.20mm
Voltage - Secondary (Full Load): 24V
Center Tap: Yes
Part Status: Active
auf Bestellung 147 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+20.43 EUR
75+ 13.47 EUR
241-8-120L ds-st-241-l-series.pdf
241-8-120L
Hersteller: Signal Transformer
Description: PWR XFMR LAMINATED 100VA CHAS MT
Packaging: Bulk
Size / Dimension: 102.40mm L x 58.50mm W
Mounting Type: Chassis Mount
Type: Laminated Core
Weight: 2.8 lbs (1.3 kg)
Termination Style: Wire Leads
Primary Winding(s): Single
Secondary Winding(s): Single
Power - Max: 100VA
Voltage - Isolation: 2500Vrms
Current - Output (Max): 850mA
Voltage - Primary: 115V
Height - Seated (Max): 67.70mm
Voltage - Secondary (Full Load): 120V
Center Tap: Yes
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+48.8 EUR
10+ 43.07 EUR
4054 2074413g-en-2019_Pomona_Catalog_w.pdf
4054
Hersteller: Pomona Electronics
Description: ADAPT BNC PLUG TO RCA JACK
Packaging: Bulk
Convert From (Adapter End): BNC Plug, Male Pin
Convert To (Adapter End): Phono (RCA) Jack
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+49.26 EUR
63241-1 product-63241-1.datasheet.pdf
63241-1
Hersteller: TE Connectivity / AMP
Terminals 110 FF RCPT 22-18
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
9000+0.1 EUR
Mindestbestellmenge: 9000
63241-3 ENG_CS_82004_FASTIN_FASTON_Product_Line_0311-3351203.pdf
63241-3
Hersteller: TE Connectivity / AMP
Terminals RCPT FASTIN- FASTON 110 SERIES
auf Bestellung 81000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
9000+0.11 EUR
27000+ 0.099 EUR
45000+ 0.095 EUR
Mindestbestellmenge: 9000
63241-3 (Mouser Reel) NG_CD_63241_M_baseFilename-972206.pdf
63241-3 (Mouser Reel)
Hersteller: TE Connectivity
Terminals RCPT FASTIN- Reel of 1000
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1000+0.14 EUR
Mindestbestellmenge: 1000
CBR04C819B2GAC CBR04C819B2GAC
CBR04C819B2GAC
Hersteller: KEMET
Description: CAP CER 8.1PF 200V C0G/NP0 0402
Tolerance: ±0.1pF
Features: High Q, Low Loss, Ultra Low ESR
Packaging: Cut Tape (CT)
Voltage - Rated: 200V
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: RF, Microwave, High Frequency
Thickness (Max): 0.022" (0.55mm)
Part Status: Active
Capacitance: 8.1 pF
auf Bestellung 793 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
17+1.09 EUR
25+ 0.73 EUR
50+ 0.58 EUR
100+ 0.48 EUR
500+ 0.38 EUR
Mindestbestellmenge: 17
IDH02G65C5XKSA2 Infineon-IDH02G65C5-DS-v02_02-en.pdf?fileId=db3a304339dcf4b1013a030ab96758eb
IDH02G65C5XKSA2
Hersteller: Infineon Technologies
Description: DIODE SIL CARB 650V 2A TO220-2
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 70pF @ 1V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: PG-TO220-2
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 2 A
auf Bestellung 475 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
8+2.34 EUR
50+ 1.88 EUR
100+ 1.49 EUR
Mindestbestellmenge: 8
IDH02G65C5XKSA2 Infineon_IDH02G65C5_DS_v02_02_en-1731476.pdf
IDH02G65C5XKSA2
Hersteller: Infineon Technologies
Schottky Diodes & Rectifiers SIC DIODES
auf Bestellung 443 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+2.32 EUR
10+ 1.88 EUR
100+ 1.48 EUR
500+ 1.25 EUR
1000+ 0.96 EUR
5000+ 0.92 EUR
Mindestbestellmenge: 2
IDH02G65C5XKSA2 idh02g65c5_final_datasheet_v2_2.pdf
IDH02G65C5XKSA2
Hersteller: Infineon Technologies
Rectifier Diode Schottky SiC 650V 2A 2-Pin(2+Tab) TO-220 Tube
auf Bestellung 970 Stücke:
Lieferzeit 14-21 Tag (e)
IDH10G65C5XKSA2 Infineon_IDH10G65C5_DS_v02_02_en-1226829.pdf
IDH10G65C5XKSA2
Hersteller: Infineon Technologies
Schottky Diodes & Rectifiers SIC DIODES
auf Bestellung 1253 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+6.9 EUR
10+ 5.47 EUR
100+ 4.68 EUR
250+ 4.54 EUR
500+ 3.63 EUR
1000+ 3.34 EUR
IDH10G65C5XKSA2 IDH10G65C5_Final_Datasheet_v_2_1.pdf?folderId=db3a30431ddc9372011ed0010fda1bd3&fileId=db3a30433a047ba0013a06a8f03d0169
IDH10G65C5XKSA2
Hersteller: Infineon Technologies
Description: DIODE SIL CARB 650V 10A TO220-1
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 300pF @ 1V, 1MHz
Current - Average Rectified (Io): 10A
Supplier Device Package: PG-TO220-2-1
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 10 A
Current - Reverse Leakage @ Vr: 180 µA @ 650 V
auf Bestellung 1389 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+4.88 EUR
50+ 3.86 EUR
100+ 3.31 EUR
500+ 3.24 EUR
Mindestbestellmenge: 4
IDH20G65C5XKSA2 Infineon_IDH20G65C5_DS_v02_02_en-1226722.pdf
IDH20G65C5XKSA2
Hersteller: Infineon Technologies
Schottky Diodes & Rectifiers SIC DIODES
auf Bestellung 235 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+12.06 EUR
10+ 8.57 EUR
100+ 8.17 EUR
500+ 7.62 EUR
1000+ 6.55 EUR
IDH20G65C5XKSA2 IDH20G65C5_Final_Datasheet_v_2_1.pdf?folderId=db3a30431ddc9372011ed0010fda1bd3&fileId=db3a30433a047ba0013a06d5f79701c6
IDH20G65C5XKSA2
Hersteller: Infineon Technologies
Description: DIODE SIL CARB 650V 20A TO220-1
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 590pF @ 1V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: PG-TO220-2-1
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 20 A
Current - Reverse Leakage @ Vr: 210 µA @ 650 V
auf Bestellung 864 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.21 EUR
50+ 9.74 EUR
100+ 8.72 EUR
500+ 7.69 EUR
Mindestbestellmenge: 2
IDH20G65C5XKSA2 idh20g65c5_final_datasheet_v2_2.pdf
IDH20G65C5XKSA2
Hersteller: Infineon Technologies
Rectifier Diode Schottky SiC 650V 20A 2-Pin(2+Tab) TO-220 Tube
auf Bestellung 600 Stücke:
Lieferzeit 14-21 Tag (e)
MLG1005SR11JTD25 inductor_automotive_high-frequency_mlg1005s_en.pdf
MLG1005SR11JTD25
Hersteller: TDK Corporation
Description: FIXED IND 110NH 150MA 2.2OHM SMD
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: 0402 (1005 Metric)
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Multilayer
Operating Temperature: -55°C ~ 125°C
DC Resistance (DCR): 2.2Ohm Max
Q @ Freq: 8 @ 100MHz
Frequency - Self Resonant: 700MHz
Ratings: AEC-Q200
Material - Core: Ceramic, Non-Magnetic
Inductance Frequency - Test: 100 MHz
Supplier Device Package: 0402 (1005 Metric)
Height - Seated (Max): 0.022" (0.55mm)
Part Status: Active
Inductance: 110 nH
Current Rating (Amps): 150 mA
auf Bestellung 2735 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
112+0.16 EUR
129+ 0.14 EUR
141+ 0.13 EUR
160+ 0.11 EUR
182+ 0.097 EUR
250+ 0.092 EUR
500+ 0.087 EUR
1000+ 0.066 EUR
2500+ 0.065 EUR
Mindestbestellmenge: 112
RMCF0603FT324R sei-rmcf_rmcp.pdf
RMCF0603FT324R
Hersteller: Stackpole Electronics Inc
Description: RES 324 OHM 1% 1/10W 0603
Packaging: Tape & Reel (TR)
Power (Watts): 0.1W, 1/10W
Tolerance: ±1%
Features: Automotive AEC-Q200
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Ratings: AEC-Q200
Number of Terminations: 2
Supplier Device Package: 0603
Height - Seated (Max): 0.022" (0.55mm)
Part Status: Active
Resistance: 324 Ohms
auf Bestellung 55000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5026+0.0035 EUR
10000+ 0.0031 EUR
25000+ 0.0026 EUR
50000+ 0.0024 EUR
Mindestbestellmenge: 5026
RMCF0603FT324R sei-rmcf_rmcp.pdf
RMCF0603FT324R
Hersteller: Stackpole Electronics Inc
Description: RES 324 OHM 1% 1/10W 0603
Power (Watts): 0.1W, 1/10W
Tolerance: ±1%
Features: Automotive AEC-Q200
Packaging: Cut Tape (CT)
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Ratings: AEC-Q200
Number of Terminations: 2
Supplier Device Package: 0603
Height - Seated (Max): 0.022" (0.55mm)
Part Status: Active
Resistance: 324 Ohms
auf Bestellung 65333 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
112+0.16 EUR
715+ 0.025 EUR
1191+ 0.015 EUR
1429+ 0.012 EUR
2146+ 0.0082 EUR
2513+ 0.007 EUR
Mindestbestellmenge: 112
104-11-632-41-770000 2017-11%3A096.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
104-11-632-41-780000 mill-max_mmmc-s-a0000088332-1-1738417.pdf
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
110-11-632-41-001000 2017-11%3A090.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-11-632-41-001000 MMMC_S_A0003128414_1-2554850.pdf
110-11-632-41-001000
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
110-41-632-41-105000 2017-11%3A090.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-41-632-41-105000 098-259748.pdf
110-41-632-41-105000
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
110-41-632-41-605000 2017-11%3A090.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
110-41-632-41-605000 MMMC_S_A0000088326_1-2552877.pdf
110-41-632-41-605000
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
110-81-632-41-001101
Hersteller: Preci-Dip
DIL SOCKET SOLDER TAIL 2.54 LOW PROFILE
Produkt ist nicht verfügbar
110-91-632-41-001000 MMMC_S_A0004812459_1-2556177.pdf
110-91-632-41-001000
Hersteller: Mill-Max
IC & Component Sockets 32P TIN PIN CONT
Produkt ist nicht verfügbar
110-91-632-41-001000 110-13-950-41-001.pdf
Hersteller: Preci-Dip
Conn DIP Socket SKT 32 POS 2.54mm Solder ST Thru-Hole
Produkt ist nicht verfügbar
110-91-632-41-105000 2017-11%3A090.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-91-632-41-605000 2017-11%3A090.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
111-41-632-41-001000 2017-11%3A091.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
111-41-632-41-001000 MMMC_S_A0003128315_1-2554876.pdf
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
111-91-632-41-001000 MMMC_S_A0003128315_1-2554876.pdf
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
111-91-632-41-001000 2017-11%3A091.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
114-41-632-41-117000 mill-max_mmmc-s-a0003128317-1-1738572.pdf
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
114-41-632-41-117000 2017-11%3A106.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
114-91-632-41-117000 2017-11%3A106.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
114-91-632-41-117000 mill-max_mmmc-s-a0003128317-1-1738572.pdf
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
114-91-632-41-117101 catalog.pdf
114-91-632-41-117101
Hersteller: Preci-Dip
Conn DIP Socket SKT 32 POS 2.54mm Solder ST SMD T/R
Produkt ist nicht verfügbar
114-91-632-41-134161 catalog.pdf
114-91-632-41-134161
Hersteller: Preci-Dip
Conn DIP Socket SKT 32 POS 2.54mm Solder ST SMD
Produkt ist nicht verfügbar
115-41-632-41-001000 2017-11%3A092.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
115-41-632-41-001000 MMMC_S_A0000088319_1-2552833.pdf
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
115-41-632-41-003000 2017-11%3A093.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
115-41-632-41-003000 MMMC_S_A0000088324_1-2553081.pdf
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
115-91-632-41-001000 2017-11%3A092.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT IC OPEN LOWPRO
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
115-91-632-41-003000
Hersteller: Mill-Max Manufacturing Corp.
Description: SOCKET IC OPEN LOWPRO .600 32POS
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
115-91-632-41-003000 MMMC_S_A0000088324_1-2553081.pdf
Hersteller: Mill-Max
IC & Component Sockets 32P IC SOCKET
Produkt ist nicht verfügbar
116-41-632-41-001000 MMMC_S_A0000089115_1-2552886.pdf
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
116-41-632-41-007000 MMMC_S_A0000089115_1-2552886.pdf
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
116-41-632-41-008000 MMMC_S_A0000089115_1-2552886.pdf
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
116-91-632-41-001000 MMMC_S_A0000089115_1-2552886.pdf
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
116-91-632-41-003000 MMMC_S_A0000089115_1-2552886.pdf
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
116-91-632-41-007000 MMMC_S_A0000089115_1-2552886.pdf
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
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