Suchergebnisse für "163241" : > 61
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Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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COB нить 26мм 3V/50mA, белый Produktcode: 163241 |
Optoelektronik > Laternen, Lampen usw Beschreibung: COB світлодіодна трубочка довжина: 26мм. Живлення: 3V/50mA |
auf Bestellung 117 Stück: Lieferzeit 21-28 Tag (e) |
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1632417 | Pomona | CON, Adaptor, Bnc Male/Phono Jack |
auf Bestellung 7 Stücke: Lieferzeit 14-21 Tag (e) |
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110-41-632-41-001000 | Mill-Max | IC & Component Sockets 32 PIN SKT 200u Sn |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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110-41-632-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
auf Bestellung 1059 Stücke: Lieferzeit 10-14 Tag (e) |
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110-91-632-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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FWLF163241-C | ATGBICS |
Description: DWDM Ch41 SFP OC-48/STM-16 2.7G Packaging: Tray Connector Type: LC Wavelength: 1544.53nm Mounting Type: Pluggable, SFP+ Voltage - Supply: 3.3V Applications: General Purpose Data Rate: 2.7Gbps Part Status: Active |
auf Bestellung 9751 Stücke: Lieferzeit 10-14 Tag (e) |
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SP001632410 | Infineon |
auf Bestellung 200 Stücke: Lieferzeit 21-28 Tag (e) |
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241-3-24 | Signal Transformer |
Description: PWR XFMR LAMINATED 2.4VA CHAS MT Packaging: Bulk Size / Dimension: 52.60mm L x 29.60mm W Mounting Type: Chassis Mount Type: Laminated Core Weight: 0.25 lb (113.4 g) Termination Style: Solder, Quick Connect Primary Winding(s): Single Secondary Winding(s): Single Power - Max: 2.4VA Voltage - Isolation: 2500Vrms Current - Output (Max): 100mA Voltage - Primary: 115V Height - Seated (Max): 31.20mm Voltage - Secondary (Full Load): 24V Center Tap: Yes Part Status: Active |
auf Bestellung 147 Stücke: Lieferzeit 10-14 Tag (e) |
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241-8-120L | Signal Transformer |
Description: PWR XFMR LAMINATED 100VA CHAS MT Packaging: Bulk Size / Dimension: 102.40mm L x 58.50mm W Mounting Type: Chassis Mount Type: Laminated Core Weight: 2.8 lbs (1.3 kg) Termination Style: Wire Leads Primary Winding(s): Single Secondary Winding(s): Single Power - Max: 100VA Voltage - Isolation: 2500Vrms Current - Output (Max): 850mA Voltage - Primary: 115V Height - Seated (Max): 67.70mm Voltage - Secondary (Full Load): 120V Center Tap: Yes Part Status: Active |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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4054 | Pomona Electronics |
Description: ADAPT BNC PLUG TO RCA JACK Packaging: Bulk Convert From (Adapter End): BNC Plug, Male Pin Convert To (Adapter End): Phono (RCA) Jack |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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63241-1 | TE Connectivity / AMP | Terminals 110 FF RCPT 22-18 |
auf Bestellung 18000 Stücke: Lieferzeit 10-14 Tag (e) |
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63241-3 | TE Connectivity / AMP | Terminals RCPT FASTIN- FASTON 110 SERIES |
auf Bestellung 81000 Stücke: Lieferzeit 10-14 Tag (e) |
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63241-3 (Mouser Reel) | TE Connectivity | Terminals RCPT FASTIN- Reel of 1000 |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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CBR04C819B2GAC | KEMET |
Description: CAP CER 8.1PF 200V C0G/NP0 0402 Tolerance: ±0.1pF Features: High Q, Low Loss, Ultra Low ESR Packaging: Cut Tape (CT) Voltage - Rated: 200V Package / Case: 0402 (1005 Metric) Temperature Coefficient: C0G, NP0 Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 125°C Applications: RF, Microwave, High Frequency Thickness (Max): 0.022" (0.55mm) Part Status: Active Capacitance: 8.1 pF |
auf Bestellung 793 Stücke: Lieferzeit 10-14 Tag (e) |
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IDH02G65C5XKSA2 | Infineon Technologies |
Description: DIODE SIL CARB 650V 2A TO220-2 Packaging: Tube Package / Case: TO-220-2 Mounting Type: Through Hole Speed: No Recovery Time > 500mA (Io) Reverse Recovery Time (trr): 0 ns Technology: SiC (Silicon Carbide) Schottky Capacitance @ Vr, F: 70pF @ 1V, 1MHz Current - Average Rectified (Io): 2A Supplier Device Package: PG-TO220-2 Operating Temperature - Junction: -55°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 650 V Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 2 A |
auf Bestellung 475 Stücke: Lieferzeit 10-14 Tag (e) |
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IDH02G65C5XKSA2 | Infineon Technologies | Schottky Diodes & Rectifiers SIC DIODES |
auf Bestellung 443 Stücke: Lieferzeit 10-14 Tag (e) |
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IDH02G65C5XKSA2 | Infineon Technologies | Rectifier Diode Schottky SiC 650V 2A 2-Pin(2+Tab) TO-220 Tube |
auf Bestellung 970 Stücke: Lieferzeit 14-21 Tag (e) |
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IDH10G65C5XKSA2 | Infineon Technologies | Schottky Diodes & Rectifiers SIC DIODES |
auf Bestellung 1253 Stücke: Lieferzeit 10-14 Tag (e) |
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IDH10G65C5XKSA2 | Infineon Technologies |
Description: DIODE SIL CARB 650V 10A TO220-1 Packaging: Tube Package / Case: TO-220-2 Mounting Type: Through Hole Speed: No Recovery Time > 500mA (Io) Reverse Recovery Time (trr): 0 ns Technology: SiC (Silicon Carbide) Schottky Capacitance @ Vr, F: 300pF @ 1V, 1MHz Current - Average Rectified (Io): 10A Supplier Device Package: PG-TO220-2-1 Operating Temperature - Junction: -55°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 650 V Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 10 A Current - Reverse Leakage @ Vr: 180 µA @ 650 V |
auf Bestellung 1389 Stücke: Lieferzeit 10-14 Tag (e) |
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IDH20G65C5XKSA2 | Infineon Technologies | Schottky Diodes & Rectifiers SIC DIODES |
auf Bestellung 235 Stücke: Lieferzeit 10-14 Tag (e) |
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IDH20G65C5XKSA2 | Infineon Technologies |
Description: DIODE SIL CARB 650V 20A TO220-1 Packaging: Tube Package / Case: TO-220-2 Mounting Type: Through Hole Speed: No Recovery Time > 500mA (Io) Reverse Recovery Time (trr): 0 ns Technology: SiC (Silicon Carbide) Schottky Capacitance @ Vr, F: 590pF @ 1V, 1MHz Current - Average Rectified (Io): 20A Supplier Device Package: PG-TO220-2-1 Operating Temperature - Junction: -55°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 650 V Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 20 A Current - Reverse Leakage @ Vr: 210 µA @ 650 V |
auf Bestellung 864 Stücke: Lieferzeit 10-14 Tag (e) |
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IDH20G65C5XKSA2 | Infineon Technologies | Rectifier Diode Schottky SiC 650V 20A 2-Pin(2+Tab) TO-220 Tube |
auf Bestellung 600 Stücke: Lieferzeit 14-21 Tag (e) |
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MLG1005SR11JTD25 | TDK Corporation |
Description: FIXED IND 110NH 150MA 2.2OHM SMD Tolerance: ±5% Packaging: Cut Tape (CT) Package / Case: 0402 (1005 Metric) Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm) Mounting Type: Surface Mount Shielding: Unshielded Type: Multilayer Operating Temperature: -55°C ~ 125°C DC Resistance (DCR): 2.2Ohm Max Q @ Freq: 8 @ 100MHz Frequency - Self Resonant: 700MHz Ratings: AEC-Q200 Material - Core: Ceramic, Non-Magnetic Inductance Frequency - Test: 100 MHz Supplier Device Package: 0402 (1005 Metric) Height - Seated (Max): 0.022" (0.55mm) Part Status: Active Inductance: 110 nH Current Rating (Amps): 150 mA |
auf Bestellung 2735 Stücke: Lieferzeit 10-14 Tag (e) |
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RMCF0603FT324R | Stackpole Electronics Inc |
Description: RES 324 OHM 1% 1/10W 0603 Packaging: Tape & Reel (TR) Power (Watts): 0.1W, 1/10W Tolerance: ±1% Features: Automotive AEC-Q200 Package / Case: 0603 (1608 Metric) Temperature Coefficient: ±100ppm/°C Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm) Composition: Thick Film Operating Temperature: -55°C ~ 155°C Ratings: AEC-Q200 Number of Terminations: 2 Supplier Device Package: 0603 Height - Seated (Max): 0.022" (0.55mm) Part Status: Active Resistance: 324 Ohms |
auf Bestellung 55000 Stücke: Lieferzeit 10-14 Tag (e) |
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RMCF0603FT324R | Stackpole Electronics Inc |
Description: RES 324 OHM 1% 1/10W 0603 Power (Watts): 0.1W, 1/10W Tolerance: ±1% Features: Automotive AEC-Q200 Packaging: Cut Tape (CT) Package / Case: 0603 (1608 Metric) Temperature Coefficient: ±100ppm/°C Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm) Composition: Thick Film Operating Temperature: -55°C ~ 155°C Ratings: AEC-Q200 Number of Terminations: 2 Supplier Device Package: 0603 Height - Seated (Max): 0.022" (0.55mm) Part Status: Active Resistance: 324 Ohms |
auf Bestellung 65333 Stücke: Lieferzeit 10-14 Tag (e) |
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104-11-632-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Press-Fit Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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104-11-632-41-780000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
Produkt ist nicht verfügbar |
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110-11-632-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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110-11-632-41-001000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
Produkt ist nicht verfügbar |
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110-41-632-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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110-41-632-41-105000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
Produkt ist nicht verfügbar |
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110-41-632-41-605000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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110-41-632-41-605000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
Produkt ist nicht verfügbar |
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110-81-632-41-001101 | Preci-Dip | DIL SOCKET SOLDER TAIL 2.54 LOW PROFILE |
Produkt ist nicht verfügbar |
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110-91-632-41-001000 | Mill-Max | IC & Component Sockets 32P TIN PIN CONT |
Produkt ist nicht verfügbar |
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110-91-632-41-001000 | Preci-Dip | Conn DIP Socket SKT 32 POS 2.54mm Solder ST Thru-Hole |
Produkt ist nicht verfügbar |
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110-91-632-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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110-91-632-41-605000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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111-41-632-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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111-41-632-41-001000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
Produkt ist nicht verfügbar |
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111-91-632-41-001000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
Produkt ist nicht verfügbar |
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111-91-632-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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114-41-632-41-117000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
Produkt ist nicht verfügbar |
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114-41-632-41-117000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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114-91-632-41-117000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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114-91-632-41-117000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
Produkt ist nicht verfügbar |
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114-91-632-41-117101 | Preci-Dip | Conn DIP Socket SKT 32 POS 2.54mm Solder ST SMD T/R |
Produkt ist nicht verfügbar |
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114-91-632-41-134161 | Preci-Dip | Conn DIP Socket SKT 32 POS 2.54mm Solder ST SMD |
Produkt ist nicht verfügbar |
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115-41-632-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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115-41-632-41-001000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
Produkt ist nicht verfügbar |
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115-41-632-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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115-41-632-41-003000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
Produkt ist nicht verfügbar |
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115-91-632-41-001000 | Mill-Max Manufacturing Corp. |
Description: SKT IC OPEN LOWPRO Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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115-91-632-41-003000 | Mill-Max Manufacturing Corp. |
Description: SOCKET IC OPEN LOWPRO .600 32POS Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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115-91-632-41-003000 | Mill-Max | IC & Component Sockets 32P IC SOCKET |
Produkt ist nicht verfügbar |
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116-41-632-41-001000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
Produkt ist nicht verfügbar |
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116-41-632-41-007000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
Produkt ist nicht verfügbar |
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116-41-632-41-008000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
Produkt ist nicht verfügbar |
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116-91-632-41-001000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
Produkt ist nicht verfügbar |
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116-91-632-41-003000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
Produkt ist nicht verfügbar |
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116-91-632-41-007000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
Produkt ist nicht verfügbar |
COB нить 26мм 3V/50mA, белый Produktcode: 163241 |
Optoelektronik > Laternen, Lampen usw
Beschreibung: COB світлодіодна трубочка довжина: 26мм. Живлення: 3V/50mA
Beschreibung: COB світлодіодна трубочка довжина: 26мм. Живлення: 3V/50mA
auf Bestellung 117 Stück:
Lieferzeit 21-28 Tag (e)1632417 |
Hersteller: Pomona
CON, Adaptor, Bnc Male/Phono Jack
CON, Adaptor, Bnc Male/Phono Jack
auf Bestellung 7 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 70.41 EUR |
110-41-632-41-001000 |
Hersteller: Mill-Max
IC & Component Sockets 32 PIN SKT 200u Sn
IC & Component Sockets 32 PIN SKT 200u Sn
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 5.58 EUR |
110-41-632-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 1059 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 5.24 EUR |
12+ | 4.76 EUR |
36+ | 4.51 EUR |
60+ | 4.4 EUR |
108+ | 4.19 EUR |
252+ | 3.67 EUR |
504+ | 3.57 EUR |
1008+ | 3.04 EUR |
110-91-632-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 27.19 EUR |
FWLF163241-C |
Hersteller: ATGBICS
Description: DWDM Ch41 SFP OC-48/STM-16 2.7G
Packaging: Tray
Connector Type: LC
Wavelength: 1544.53nm
Mounting Type: Pluggable, SFP+
Voltage - Supply: 3.3V
Applications: General Purpose
Data Rate: 2.7Gbps
Part Status: Active
Description: DWDM Ch41 SFP OC-48/STM-16 2.7G
Packaging: Tray
Connector Type: LC
Wavelength: 1544.53nm
Mounting Type: Pluggable, SFP+
Voltage - Supply: 3.3V
Applications: General Purpose
Data Rate: 2.7Gbps
Part Status: Active
auf Bestellung 9751 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 1112.32 EUR |
50+ | 1056.79 EUR |
150+ | 1001.09 EUR |
1000+ | 945.56 EUR |
241-3-24 |
Hersteller: Signal Transformer
Description: PWR XFMR LAMINATED 2.4VA CHAS MT
Packaging: Bulk
Size / Dimension: 52.60mm L x 29.60mm W
Mounting Type: Chassis Mount
Type: Laminated Core
Weight: 0.25 lb (113.4 g)
Termination Style: Solder, Quick Connect
Primary Winding(s): Single
Secondary Winding(s): Single
Power - Max: 2.4VA
Voltage - Isolation: 2500Vrms
Current - Output (Max): 100mA
Voltage - Primary: 115V
Height - Seated (Max): 31.20mm
Voltage - Secondary (Full Load): 24V
Center Tap: Yes
Part Status: Active
Description: PWR XFMR LAMINATED 2.4VA CHAS MT
Packaging: Bulk
Size / Dimension: 52.60mm L x 29.60mm W
Mounting Type: Chassis Mount
Type: Laminated Core
Weight: 0.25 lb (113.4 g)
Termination Style: Solder, Quick Connect
Primary Winding(s): Single
Secondary Winding(s): Single
Power - Max: 2.4VA
Voltage - Isolation: 2500Vrms
Current - Output (Max): 100mA
Voltage - Primary: 115V
Height - Seated (Max): 31.20mm
Voltage - Secondary (Full Load): 24V
Center Tap: Yes
Part Status: Active
auf Bestellung 147 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 20.43 EUR |
75+ | 13.47 EUR |
241-8-120L |
Hersteller: Signal Transformer
Description: PWR XFMR LAMINATED 100VA CHAS MT
Packaging: Bulk
Size / Dimension: 102.40mm L x 58.50mm W
Mounting Type: Chassis Mount
Type: Laminated Core
Weight: 2.8 lbs (1.3 kg)
Termination Style: Wire Leads
Primary Winding(s): Single
Secondary Winding(s): Single
Power - Max: 100VA
Voltage - Isolation: 2500Vrms
Current - Output (Max): 850mA
Voltage - Primary: 115V
Height - Seated (Max): 67.70mm
Voltage - Secondary (Full Load): 120V
Center Tap: Yes
Part Status: Active
Description: PWR XFMR LAMINATED 100VA CHAS MT
Packaging: Bulk
Size / Dimension: 102.40mm L x 58.50mm W
Mounting Type: Chassis Mount
Type: Laminated Core
Weight: 2.8 lbs (1.3 kg)
Termination Style: Wire Leads
Primary Winding(s): Single
Secondary Winding(s): Single
Power - Max: 100VA
Voltage - Isolation: 2500Vrms
Current - Output (Max): 850mA
Voltage - Primary: 115V
Height - Seated (Max): 67.70mm
Voltage - Secondary (Full Load): 120V
Center Tap: Yes
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 48.8 EUR |
10+ | 43.07 EUR |
4054 |
Hersteller: Pomona Electronics
Description: ADAPT BNC PLUG TO RCA JACK
Packaging: Bulk
Convert From (Adapter End): BNC Plug, Male Pin
Convert To (Adapter End): Phono (RCA) Jack
Description: ADAPT BNC PLUG TO RCA JACK
Packaging: Bulk
Convert From (Adapter End): BNC Plug, Male Pin
Convert To (Adapter End): Phono (RCA) Jack
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 49.26 EUR |
63241-1 |
Hersteller: TE Connectivity / AMP
Terminals 110 FF RCPT 22-18
Terminals 110 FF RCPT 22-18
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
9000+ | 0.1 EUR |
63241-3 |
Hersteller: TE Connectivity / AMP
Terminals RCPT FASTIN- FASTON 110 SERIES
Terminals RCPT FASTIN- FASTON 110 SERIES
auf Bestellung 81000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
9000+ | 0.11 EUR |
27000+ | 0.099 EUR |
45000+ | 0.095 EUR |
63241-3 (Mouser Reel) |
Hersteller: TE Connectivity
Terminals RCPT FASTIN- Reel of 1000
Terminals RCPT FASTIN- Reel of 1000
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1000+ | 0.14 EUR |
CBR04C819B2GAC |
Hersteller: KEMET
Description: CAP CER 8.1PF 200V C0G/NP0 0402
Tolerance: ±0.1pF
Features: High Q, Low Loss, Ultra Low ESR
Packaging: Cut Tape (CT)
Voltage - Rated: 200V
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: RF, Microwave, High Frequency
Thickness (Max): 0.022" (0.55mm)
Part Status: Active
Capacitance: 8.1 pF
Description: CAP CER 8.1PF 200V C0G/NP0 0402
Tolerance: ±0.1pF
Features: High Q, Low Loss, Ultra Low ESR
Packaging: Cut Tape (CT)
Voltage - Rated: 200V
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: RF, Microwave, High Frequency
Thickness (Max): 0.022" (0.55mm)
Part Status: Active
Capacitance: 8.1 pF
auf Bestellung 793 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
17+ | 1.09 EUR |
25+ | 0.73 EUR |
50+ | 0.58 EUR |
100+ | 0.48 EUR |
500+ | 0.38 EUR |
IDH02G65C5XKSA2 |
Hersteller: Infineon Technologies
Description: DIODE SIL CARB 650V 2A TO220-2
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 70pF @ 1V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: PG-TO220-2
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 2 A
Description: DIODE SIL CARB 650V 2A TO220-2
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 70pF @ 1V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: PG-TO220-2
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 2 A
auf Bestellung 475 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8+ | 2.34 EUR |
50+ | 1.88 EUR |
100+ | 1.49 EUR |
IDH02G65C5XKSA2 |
Hersteller: Infineon Technologies
Schottky Diodes & Rectifiers SIC DIODES
Schottky Diodes & Rectifiers SIC DIODES
auf Bestellung 443 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 2.32 EUR |
10+ | 1.88 EUR |
100+ | 1.48 EUR |
500+ | 1.25 EUR |
1000+ | 0.96 EUR |
5000+ | 0.92 EUR |
IDH02G65C5XKSA2 |
Hersteller: Infineon Technologies
Rectifier Diode Schottky SiC 650V 2A 2-Pin(2+Tab) TO-220 Tube
Rectifier Diode Schottky SiC 650V 2A 2-Pin(2+Tab) TO-220 Tube
auf Bestellung 970 Stücke:
Lieferzeit 14-21 Tag (e)IDH10G65C5XKSA2 |
Hersteller: Infineon Technologies
Schottky Diodes & Rectifiers SIC DIODES
Schottky Diodes & Rectifiers SIC DIODES
auf Bestellung 1253 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 6.9 EUR |
10+ | 5.47 EUR |
100+ | 4.68 EUR |
250+ | 4.54 EUR |
500+ | 3.63 EUR |
1000+ | 3.34 EUR |
IDH10G65C5XKSA2 |
Hersteller: Infineon Technologies
Description: DIODE SIL CARB 650V 10A TO220-1
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 300pF @ 1V, 1MHz
Current - Average Rectified (Io): 10A
Supplier Device Package: PG-TO220-2-1
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 10 A
Current - Reverse Leakage @ Vr: 180 µA @ 650 V
Description: DIODE SIL CARB 650V 10A TO220-1
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 300pF @ 1V, 1MHz
Current - Average Rectified (Io): 10A
Supplier Device Package: PG-TO220-2-1
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 10 A
Current - Reverse Leakage @ Vr: 180 µA @ 650 V
auf Bestellung 1389 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 4.88 EUR |
50+ | 3.86 EUR |
100+ | 3.31 EUR |
500+ | 3.24 EUR |
IDH20G65C5XKSA2 |
Hersteller: Infineon Technologies
Schottky Diodes & Rectifiers SIC DIODES
Schottky Diodes & Rectifiers SIC DIODES
auf Bestellung 235 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 12.06 EUR |
10+ | 8.57 EUR |
100+ | 8.17 EUR |
500+ | 7.62 EUR |
1000+ | 6.55 EUR |
IDH20G65C5XKSA2 |
Hersteller: Infineon Technologies
Description: DIODE SIL CARB 650V 20A TO220-1
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 590pF @ 1V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: PG-TO220-2-1
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 20 A
Current - Reverse Leakage @ Vr: 210 µA @ 650 V
Description: DIODE SIL CARB 650V 20A TO220-1
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 590pF @ 1V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: PG-TO220-2-1
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 20 A
Current - Reverse Leakage @ Vr: 210 µA @ 650 V
auf Bestellung 864 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 12.21 EUR |
50+ | 9.74 EUR |
100+ | 8.72 EUR |
500+ | 7.69 EUR |
IDH20G65C5XKSA2 |
Hersteller: Infineon Technologies
Rectifier Diode Schottky SiC 650V 20A 2-Pin(2+Tab) TO-220 Tube
Rectifier Diode Schottky SiC 650V 20A 2-Pin(2+Tab) TO-220 Tube
auf Bestellung 600 Stücke:
Lieferzeit 14-21 Tag (e)MLG1005SR11JTD25 |
Hersteller: TDK Corporation
Description: FIXED IND 110NH 150MA 2.2OHM SMD
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: 0402 (1005 Metric)
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Multilayer
Operating Temperature: -55°C ~ 125°C
DC Resistance (DCR): 2.2Ohm Max
Q @ Freq: 8 @ 100MHz
Frequency - Self Resonant: 700MHz
Ratings: AEC-Q200
Material - Core: Ceramic, Non-Magnetic
Inductance Frequency - Test: 100 MHz
Supplier Device Package: 0402 (1005 Metric)
Height - Seated (Max): 0.022" (0.55mm)
Part Status: Active
Inductance: 110 nH
Current Rating (Amps): 150 mA
Description: FIXED IND 110NH 150MA 2.2OHM SMD
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: 0402 (1005 Metric)
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Multilayer
Operating Temperature: -55°C ~ 125°C
DC Resistance (DCR): 2.2Ohm Max
Q @ Freq: 8 @ 100MHz
Frequency - Self Resonant: 700MHz
Ratings: AEC-Q200
Material - Core: Ceramic, Non-Magnetic
Inductance Frequency - Test: 100 MHz
Supplier Device Package: 0402 (1005 Metric)
Height - Seated (Max): 0.022" (0.55mm)
Part Status: Active
Inductance: 110 nH
Current Rating (Amps): 150 mA
auf Bestellung 2735 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
112+ | 0.16 EUR |
129+ | 0.14 EUR |
141+ | 0.13 EUR |
160+ | 0.11 EUR |
182+ | 0.097 EUR |
250+ | 0.092 EUR |
500+ | 0.087 EUR |
1000+ | 0.066 EUR |
2500+ | 0.065 EUR |
RMCF0603FT324R |
Hersteller: Stackpole Electronics Inc
Description: RES 324 OHM 1% 1/10W 0603
Packaging: Tape & Reel (TR)
Power (Watts): 0.1W, 1/10W
Tolerance: ±1%
Features: Automotive AEC-Q200
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Ratings: AEC-Q200
Number of Terminations: 2
Supplier Device Package: 0603
Height - Seated (Max): 0.022" (0.55mm)
Part Status: Active
Resistance: 324 Ohms
Description: RES 324 OHM 1% 1/10W 0603
Packaging: Tape & Reel (TR)
Power (Watts): 0.1W, 1/10W
Tolerance: ±1%
Features: Automotive AEC-Q200
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Ratings: AEC-Q200
Number of Terminations: 2
Supplier Device Package: 0603
Height - Seated (Max): 0.022" (0.55mm)
Part Status: Active
Resistance: 324 Ohms
auf Bestellung 55000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5026+ | 0.0035 EUR |
10000+ | 0.0031 EUR |
25000+ | 0.0026 EUR |
50000+ | 0.0024 EUR |
RMCF0603FT324R |
Hersteller: Stackpole Electronics Inc
Description: RES 324 OHM 1% 1/10W 0603
Power (Watts): 0.1W, 1/10W
Tolerance: ±1%
Features: Automotive AEC-Q200
Packaging: Cut Tape (CT)
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Ratings: AEC-Q200
Number of Terminations: 2
Supplier Device Package: 0603
Height - Seated (Max): 0.022" (0.55mm)
Part Status: Active
Resistance: 324 Ohms
Description: RES 324 OHM 1% 1/10W 0603
Power (Watts): 0.1W, 1/10W
Tolerance: ±1%
Features: Automotive AEC-Q200
Packaging: Cut Tape (CT)
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Ratings: AEC-Q200
Number of Terminations: 2
Supplier Device Package: 0603
Height - Seated (Max): 0.022" (0.55mm)
Part Status: Active
Resistance: 324 Ohms
auf Bestellung 65333 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
112+ | 0.16 EUR |
715+ | 0.025 EUR |
1191+ | 0.015 EUR |
1429+ | 0.012 EUR |
2146+ | 0.0082 EUR |
2513+ | 0.007 EUR |
104-11-632-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
104-11-632-41-780000 |
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
110-11-632-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-11-632-41-001000 |
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
110-41-632-41-105000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-41-632-41-105000 |
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
110-41-632-41-605000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
110-41-632-41-605000 |
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
110-81-632-41-001101 |
Hersteller: Preci-Dip
DIL SOCKET SOLDER TAIL 2.54 LOW PROFILE
DIL SOCKET SOLDER TAIL 2.54 LOW PROFILE
Produkt ist nicht verfügbar
110-91-632-41-001000 |
Hersteller: Mill-Max
IC & Component Sockets 32P TIN PIN CONT
IC & Component Sockets 32P TIN PIN CONT
Produkt ist nicht verfügbar
110-91-632-41-001000 |
Hersteller: Preci-Dip
Conn DIP Socket SKT 32 POS 2.54mm Solder ST Thru-Hole
Conn DIP Socket SKT 32 POS 2.54mm Solder ST Thru-Hole
Produkt ist nicht verfügbar
110-91-632-41-105000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-91-632-41-605000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
111-41-632-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
111-41-632-41-001000 |
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
111-91-632-41-001000 |
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
111-91-632-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
114-41-632-41-117000 |
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
114-41-632-41-117000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
114-91-632-41-117000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
114-91-632-41-117000 |
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
114-91-632-41-117101 |
Hersteller: Preci-Dip
Conn DIP Socket SKT 32 POS 2.54mm Solder ST SMD T/R
Conn DIP Socket SKT 32 POS 2.54mm Solder ST SMD T/R
Produkt ist nicht verfügbar
114-91-632-41-134161 |
Hersteller: Preci-Dip
Conn DIP Socket SKT 32 POS 2.54mm Solder ST SMD
Conn DIP Socket SKT 32 POS 2.54mm Solder ST SMD
Produkt ist nicht verfügbar
115-41-632-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
115-41-632-41-001000 |
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
115-41-632-41-003000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
115-41-632-41-003000 |
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
115-91-632-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT IC OPEN LOWPRO
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT IC OPEN LOWPRO
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
115-91-632-41-003000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SOCKET IC OPEN LOWPRO .600 32POS
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SOCKET IC OPEN LOWPRO .600 32POS
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
115-91-632-41-003000 |
Hersteller: Mill-Max
IC & Component Sockets 32P IC SOCKET
IC & Component Sockets 32P IC SOCKET
Produkt ist nicht verfügbar
116-41-632-41-001000 |
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
116-41-632-41-007000 |
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
116-41-632-41-008000 |
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
116-91-632-41-001000 |
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
116-91-632-41-003000 |
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
116-91-632-41-007000 |
Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
Produkt ist nicht verfügbar
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