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1109704 Aries Electronics 13001-horizontal-display-socket.pdf Description: 800 VERTISOCKET HORIZONTAL MOUNT
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1110134 Aries Electronics 13001-horizontal-display-socket.pdf Description: 800 VERTISOCKET HORIZONTAL MOUNT
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12-6823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 12POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
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14-6823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
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14-6823-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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14-820-90 14-820-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
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14-820-90T 14-820-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 214 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.85 EUR
10+15.16 EUR
25+14.21 EUR
50+13.53 EUR
100+12.89 EUR
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14-820-90TWR Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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14-820-90WR Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
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14-822-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
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14-822-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
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14-822-90TWR Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
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14-822-90WR Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
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14-823-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
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14-823-90TWR Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
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14-823-90WR Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
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16-6823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
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16-6823-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
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16-820-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
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16-820-90TWR Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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16-820-90WR Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
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16-822-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
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16-822-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
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16-822-90TWR Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
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16-822-90WR Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
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16-823-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
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16-823-90TWR Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
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16-823-90WR Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
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18-6820-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
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18-6820-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
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18-6820-90TWR Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
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18-6823-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
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18-820-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
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18-820-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
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18-820-90TWR Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 65 Stücke
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18-822-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
 Mindestbestellmenge: 25 Stücke
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18-822-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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18-823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
 Mindestbestellmenge: 25 Stücke
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18-823-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
 Mindestbestellmenge: 21 Stücke
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20-6820-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
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20-6820-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS TIN
Produkt ist nicht verfügbar
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20-6820-90TWR Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 59 Stücke
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20-6823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-6823-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-820-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 37 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
20-820-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 41 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
20-820-90TWR Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 37 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
20-822-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-822-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-822-90TWR Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-823-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS TIN
Produkt ist nicht verfügbar
 Mindestbestellmenge: 13 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
20-823-90TWR Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
22-6823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
 Mindestbestellmenge: 30 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
22-6823-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 22POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
 Mindestbestellmenge: 38 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
24-6823-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 24POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2485-111-13 Aries Electronics 13001-horizontal-display-socket.pdf Description: 800 VERTISOCKET HORIZONTAL MOUNT
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2552-111-13 Aries Electronics 13001-horizontal-display-socket.pdf Description: 800 VERTISOCKET HORIZONTAL MOUNT
Produkt ist nicht verfügbar
 Mindestbestellmenge: 12 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
26-6823-90 Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
Produkt ist nicht verfügbar
 Mindestbestellmenge: 8 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
26-6823-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 26POS TIN
Produkt ist nicht verfügbar
 Mindestbestellmenge: 9 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-6823-90T Aries Electronics 13001-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 28POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1109704 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: 800 VERTISOCKET HORIZONTAL MOUNT
Produkt ist nicht verfügbar
Mindestbestellmenge: 15 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
1110134 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: 800 VERTISOCKET HORIZONTAL MOUNT
Produkt ist nicht verfügbar
Mindestbestellmenge: 17 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
12-6823-90 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Mindestbestellmenge: 43 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
14-6823-90 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Mindestbestellmenge: 49 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
14-6823-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Mindestbestellmenge: 74 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
14-820-90 13001-horizontal-display-socket.pdf
14-820-90
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Mindestbestellmenge: 59 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
14-820-90T 13001-horizontal-display-socket.pdf
14-820-90T
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 214 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+17.85 EUR
10+15.16 EUR
25+14.21 EUR
50+13.53 EUR
100+12.89 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
14-820-90TWR 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
14-820-90WR 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Mindestbestellmenge: 44 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
14-822-90 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-822-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-822-90TWR 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-822-90WR 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-823-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-823-90TWR 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-823-90WR 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-6823-90 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 11 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
16-6823-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Produkt ist nicht verfügbar
Mindestbestellmenge: 16 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
16-820-90 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 56 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
16-820-90TWR 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Mindestbestellmenge: 57 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
16-820-90WR 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Mindestbestellmenge: 55 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
16-822-90 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-822-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-822-90TWR 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-822-90WR 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-823-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-823-90TWR 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-823-90WR 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-6820-90 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 42 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
18-6820-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-6820-90TWR 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-6823-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Produkt ist nicht verfügbar
Mindestbestellmenge: 12 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
18-820-90 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 25 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
18-820-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 65 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
18-820-90TWR 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 65 Stücke
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18-822-90 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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18-822-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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18-823-90 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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18-823-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Mindestbestellmenge: 21 Stücke
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20-6820-90 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
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20-6820-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
Produkt ist nicht verfügbar
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20-6820-90TWR 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
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20-6823-90 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
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20-6823-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
Produkt ist nicht verfügbar
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20-820-90 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 37 Stücke
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20-820-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
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20-820-90TWR 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
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20-822-90 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
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20-822-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-822-90TWR 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-823-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
Produkt ist nicht verfügbar
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20-823-90TWR 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
22-6823-90 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
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22-6823-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Mindestbestellmenge: 38 Stücke
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24-6823-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS TIN
Produkt ist nicht verfügbar
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2485-111-13 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: 800 VERTISOCKET HORIZONTAL MOUNT
Produkt ist nicht verfügbar
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2552-111-13 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: 800 VERTISOCKET HORIZONTAL MOUNT
Produkt ist nicht verfügbar
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26-6823-90 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Produkt ist nicht verfügbar
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26-6823-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 26POS TIN
Produkt ist nicht verfügbar
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28-6823-90T 13001-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 28POS TIN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH