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16-820-90CTL Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-6820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-6822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
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18-6823-90C 18-6823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
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18-822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
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18-823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
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20-6820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
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20-6822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-6823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-820-90C 20-820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.96 EUR
10+16.26 EUR
25+14.99 EUR
Im Einkaufswagen  Stück im Wert von  UAH
20-822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
22-4820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
22-6820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
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22-6822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
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22-6823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-6820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
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24-6822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-6823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
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24-820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
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24-823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
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26-6820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
Produkt ist nicht verfügbar
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26-6822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
Produkt ist nicht verfügbar
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26-6823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
Produkt ist nicht verfügbar
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26-820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
Produkt ist nicht verfügbar
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26-822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
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26-823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-6820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-6822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-6823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-823-90C 28-823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+26.00 EUR
Im Einkaufswagen  Stück im Wert von  UAH
30-6820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
30-6822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
30-6823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
30-820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
30-822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
30-823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
32-6820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
32-6822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
32-6823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
32-820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
32-822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
32-823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
34-6820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 34POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (2 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
34-6822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 34POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
34-6823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 34POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
36-6820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 36POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
36-6822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
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36-6823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 36POS GOLD
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38-6820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 38POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 38 (2 x 19)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
38-6822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 38POS GOLD
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Im Einkaufswagen  Stück im Wert von  UAH
38-6823-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 38POS GOLD
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40-6820-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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40-6822-90C Aries Electronics 13005-horizontal-display-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
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16-820-90CTL 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-823-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
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18-6820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-6822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-6823-90C 13005-horizontal-display-socket.pdf
18-6823-90C
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-823-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-6820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-6822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-6823-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-820-90C 13005-horizontal-display-socket.pdf
20-820-90C
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+19.96 EUR
10+16.26 EUR
25+14.99 EUR
Im Einkaufswagen  Stück im Wert von  UAH
20-822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
20-823-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
22-4820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
22-6820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
22-6822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
22-6823-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-6820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-6822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-6823-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
24-823-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
26-6820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
26-6822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
26-6823-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
26-820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
26-822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
26-823-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-6820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-6822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-6823-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
28-823-90C 13005-horizontal-display-socket.pdf
28-823-90C
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+26.00 EUR
Im Einkaufswagen  Stück im Wert von  UAH
30-6820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
30-6822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
30-6823-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
30-820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
30-822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
30-823-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
32-6820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
32-6822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
32-6823-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
32-820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
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32-822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
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32-823-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
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34-6820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 34POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 34 (2 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
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34-6822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 34POS GOLD
Produkt ist nicht verfügbar
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34-6823-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 34POS GOLD
Produkt ist nicht verfügbar
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36-6820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
36-6822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
36-6823-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
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38-6820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 38POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 38 (2 x 19)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
38-6822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 38POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
38-6823-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 38POS GOLD
Produkt ist nicht verfügbar
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40-6820-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
40-6822-90C 13005-horizontal-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
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