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10-8440-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
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10-8500-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
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10-8535-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
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10-8600-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
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10-8620-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
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10-8723-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
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10-8745-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
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10-8796-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Part Status: Active
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Produkt ist nicht verfügbar
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10-8800-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
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10-8810-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
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10-8828-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
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10-8850-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
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10-8875-210C Aries Electronics 13007-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Produkt ist nicht verfügbar
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14-8500-311C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
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14-8500-611C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
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16-8325-311C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
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06-81000-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
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06-81140-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
06-81250-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
06-8285-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
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06-8300-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
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06-8590-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
06-8950-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-81000-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
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08-81000-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-81250-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-81250-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8240-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
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08-8240-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
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08-8305-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
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Im Einkaufswagen  Stück im Wert von  UAH
08-8350-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8370-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
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08-8400-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
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Im Einkaufswagen  Stück im Wert von  UAH
08-8400-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8415-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
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08-8430-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8480-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8500-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8510-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8550-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8560-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8600-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8620-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8625-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8640-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8650-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8690-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8750-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8750-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8770-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8900-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8937-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-81000-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-81070-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-81250-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-81250-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8250-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8270-310C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8335-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8340-610C Aries Electronics 13008-elevated-display-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8440-210C 13007-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8500-210C 13007-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8535-210C 13007-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8600-210C 13007-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8620-210C 13007-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8723-210C 13007-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8745-210C 13007-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8796-210C 13007-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Part Status: Active
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8800-210C 13007-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8810-210C 13007-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8828-210C 13007-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8850-210C 13007-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8875-210C 13007-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-8500-311C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-8500-611C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-8325-311C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
06-81000-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
06-81140-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
06-81250-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
06-8285-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
06-8300-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
06-8590-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
06-8950-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-81000-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-81000-610C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-81250-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-81250-610C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8240-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8240-610C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8305-610C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8350-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8370-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8400-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8400-610C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8415-610C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8430-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8480-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8500-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8510-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8550-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8560-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8600-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8620-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8625-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8640-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8650-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8690-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8750-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8750-610C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8770-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8900-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
08-8937-610C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-81000-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-81070-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-81250-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-81250-610C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8250-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8270-310C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8335-610C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-8340-610C 13008-elevated-display-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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