Produkte > ARIES ELECTRONICS > Alle Produkte des Herstellers ARIES ELECTRONICS (15920) > Seite 86 nach 266
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||||
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| 02-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 2POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 2 (1 x 2) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1191 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 02-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 2POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 2 (1 x 2) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 807 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 02-1518-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 2POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 2 (1 x 2) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1563 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 02-1518-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 2POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 2 (1 x 2) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1316 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 02-1518-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 2POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 2 (1 x 2) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1316 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 02-1518-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 2POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 295 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 02-1518-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 2POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 2 (1 x 2) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 807 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 03-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 3POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 264 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 03-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 3POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 278 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 03-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 3POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 239 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 03-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 3POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 3 (1 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 582 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 04-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 4POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 04-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 4POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 173 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 04-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 4POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 179 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 04-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 4POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 152 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 04-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 4POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 4 (1 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 463 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 04-1518-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 4POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 04-1518-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 4POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 863 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 04-1518-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 4POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 893 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 04-1518-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 4POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 193 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 04-1518-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 4POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 463 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 05-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 5POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 218 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 05-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 5POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 186 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 05-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 5POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 193 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 05-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 5POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 157 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 05-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 5POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 5 (1 x 5) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 391 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
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06-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLD |
auf Bestellung 143 Stücke: Lieferzeit 10-14 Tag (e) |
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06-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 6 (1 x 6) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
auf Bestellung 107 Stücke: Lieferzeit 10-14 Tag (e) |
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| 06-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 167 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 06-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 136 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 06-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 6 (1 x 6) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 334 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 06-1518-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 736 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 06-1518-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 642 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 06-1518-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 658 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 06-1518-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 136 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 06-1518-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 334 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 07-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 7POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 132 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 07-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 7POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 143 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 07-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 7POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 148 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 07-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 7POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 120 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 07-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 7POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 7 (1 x 7) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 295 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
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08-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 8POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 8 (1 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 4159 Stücke: Lieferzeit 10-14 Tag (e) |
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| 08-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 8POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 90 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 08-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 8POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 93 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 08-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 8POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 74 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 08-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 8POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 8 (1 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 261 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 08-1518-10 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 582 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 08-1518-10H | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 511 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 08-1518-10T | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 544 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 08-1518-11 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 107 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 08-1518-11H | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 261 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 09-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 9POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 136 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 09-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 9POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 117 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 09-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 9POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 122 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 09-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 9POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 09-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 9POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 9 (1 x 9) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 232 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
|
|
10-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 10POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 10 (1 x 10) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 1077 Stücke: Lieferzeit 10-14 Tag (e) |
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| 10-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 10POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 105 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 10-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 10POS GOLD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 112 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| 10-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 10POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 02-0518-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 2POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 2POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1191 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 02-0518-11H |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 2POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 2POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 807 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 02-1518-10 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 2POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 2POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1563 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 02-1518-10H |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 2POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 2POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1316 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 02-1518-10T |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 2POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 2POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1316 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 02-1518-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 2POS GOLD
Description: CONN IC DIP SOCKET 2POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 295 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 02-1518-11H |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 2POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 2POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 807 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 03-0518-10H |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
Description: CONN SOCKET SIP 3POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 264 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 03-0518-10T |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
Description: CONN SOCKET SIP 3POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 278 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 03-0518-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
Description: CONN SOCKET SIP 3POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 239 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 03-0518-11H |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 3POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 3POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 582 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 04-0518-10 |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 4POS GOLD
Description: CONN SOCKET SIP 4POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 04-0518-10H |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 4POS GOLD
Description: CONN SOCKET SIP 4POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 173 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 04-0518-10T |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 4POS GOLD
Description: CONN SOCKET SIP 4POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 179 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 04-0518-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 4POS GOLD
Description: CONN SOCKET SIP 4POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 152 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 04-0518-11H |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 4POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 4POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 463 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 04-1518-10 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 04-1518-10H |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 863 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 04-1518-10T |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 893 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 04-1518-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 4POS GOLD
Description: CONN IC DIP SOCKET 4POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 193 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 04-1518-11H |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 463 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 05-0518-10 |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Description: CONN SOCKET SIP 5POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 218 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 05-0518-10H |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Description: CONN SOCKET SIP 5POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 186 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 05-0518-10T |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Description: CONN SOCKET SIP 5POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 193 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 05-0518-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Description: CONN SOCKET SIP 5POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 157 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 05-0518-11H |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 5POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 391 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 06-0518-10 |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Description: CONN SOCKET SIP 6POS GOLD
auf Bestellung 143 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11+ | 1.96 EUR |
| 13+ | 1.65 EUR |
| 25+ | 1.59 EUR |
| 50+ | 1.56 EUR |
| 100+ | 1.49 EUR |
| 06-0518-10H |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 6 (1 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 6 (1 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
auf Bestellung 107 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.2 EUR |
| 12+ | 1.87 EUR |
| 100+ | 1.68 EUR |
| 06-0518-10T |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Description: CONN SOCKET SIP 6POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 167 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 06-0518-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Description: CONN SOCKET SIP 6POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 136 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 06-0518-11H |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 6 (1 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 6 (1 x 6)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 334 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 06-1518-10 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 736 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 06-1518-10H |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 642 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 06-1518-10T |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 658 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 06-1518-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 136 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 06-1518-11H |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 334 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 07-0518-10 |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
Description: CONN SOCKET SIP 7POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 132 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 07-0518-10H |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
Description: CONN SOCKET SIP 7POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 143 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 07-0518-10T |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
Description: CONN SOCKET SIP 7POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 148 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 07-0518-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
Description: CONN SOCKET SIP 7POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 120 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 07-0518-11H |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 7POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 7POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 295 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 08-0518-10 |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 4159 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 2.7 EUR |
| 10+ | 2.3 EUR |
| 25+ | 2.15 EUR |
| 50+ | 2.05 EUR |
| 100+ | 1.95 EUR |
| 250+ | 1.83 EUR |
| 500+ | 1.75 EUR |
| 1000+ | 1.67 EUR |
| 2500+ | 1.56 EUR |
| 08-0518-10H |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD
Description: CONN SOCKET SIP 8POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 08-0518-10T |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD
Description: CONN SOCKET SIP 8POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 93 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 08-0518-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD
Description: CONN SOCKET SIP 8POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 74 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 08-0518-11H |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 261 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 08-1518-10 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 582 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 08-1518-10H |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 511 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 08-1518-10T |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 544 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 08-1518-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 107 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 08-1518-11H |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 261 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 09-0518-10 |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
Description: CONN SOCKET SIP 9POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 136 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 09-0518-10H |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
Description: CONN SOCKET SIP 9POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 117 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 09-0518-10T |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
Description: CONN SOCKET SIP 9POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 122 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 09-0518-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
Description: CONN SOCKET SIP 9POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 09-0518-11H |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 9 (1 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 9POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 9 (1 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 232 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 10-0518-10 |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 1077 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 2.81 EUR |
| 10+ | 2.38 EUR |
| 25+ | 2.24 EUR |
| 50+ | 2.13 EUR |
| 100+ | 2.02 EUR |
| 250+ | 1.89 EUR |
| 500+ | 1.81 EUR |
| 1000+ | 1.73 EUR |
| 10-0518-10H |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 10POS GOLD
Description: CONN SOCKET SIP 10POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 105 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 10-0518-10T |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 10POS GOLD
Description: CONN SOCKET SIP 10POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 112 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 10-0518-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 10POS GOLD
Description: CONN SOCKET SIP 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH

