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10-0518-10H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 10POS GOLD
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10-0518-10T Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 10POS GOLD
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10-0518-11 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 10POS GOLD
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10-0518-11H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 10POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (1 x 10)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-1518-10 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-1518-10H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-1518-10T Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-1518-11 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
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10-1518-11H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
11-0518-10 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 11POS GOLD
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11-0518-10H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 11POS GOLD
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11-0518-10T Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 11POS GOLD
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11-0518-11 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 11POS GOLD
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11-0518-11H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 11POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 11 (1 x 11)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-0518-10 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 12POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 12 (1 x 12)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-0518-10H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 12POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 12 (1 x 12)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-0518-10T Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 12POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 12 (1 x 12)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-0518-11 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 12POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 12 (1 x 12)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-0518-11H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 12POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 12 (1 x 12)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
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12-1518-10 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 12POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 12 (2 x 6)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-1518-10H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 12POS GOLD
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 12 (2 x 6)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-1518-10T Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 12POS GOLD
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 12 (2 x 6)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-1518-11 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 12POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-1518-11H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 12POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 12 (2 x 6)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
13-0518-10 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 13POS GOLD
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13-0518-10H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 13POS GOLD
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13-0518-10T Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 13POS GOLD
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13-0518-11 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 13POS GOLD
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Im Einkaufswagen  Stück im Wert von  UAH
13-0518-11H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 13POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 13 (1 x 13)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-0518-10H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 14POS GOLD
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Im Einkaufswagen  Stück im Wert von  UAH
14-0518-10T Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 14POS GOLD
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Im Einkaufswagen  Stück im Wert von  UAH
14-0518-11 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 14POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-0518-11H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 14POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (1 x 14)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-1518-10 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-1518-10H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-1518-10T Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-1518-11 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-1518-11H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
15-0518-10 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 15POS GOLD
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Im Einkaufswagen  Stück im Wert von  UAH
15-0518-10H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 15POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
15-0518-10T Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 15POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
15-0518-11 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 15POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
15-0518-11H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 15POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 15 (1 x 15)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-0518-10 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-0518-10H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-0518-10T Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-0518-11 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-0518-11H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 16POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (1 x 16)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-1518-10 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-1518-10H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-1518-10T Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-1518-11 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-1518-11H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
17-0518-10 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 17POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 17 (1 x 17)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
17-0518-10H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 17POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 17 (1 x 17)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
17-0518-10T Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 17POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 17 (1 x 17)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
17-0518-11 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 17POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 17 (1 x 17)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
17-0518-11H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 17POS GOLD
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 17 (1 x 17)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-0518-10 Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 18POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-0518-10H Aries Electronics 12020-single-dual-row-solder-pin-tails-collet-socket.pdf Description: CONN SOCKET SIP 18POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-0518-10H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-0518-10T 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-0518-11 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-0518-11H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 10POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (1 x 10)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-1518-10 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-1518-10H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-1518-10T 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-1518-11 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10-1518-11H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
11-0518-10 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 11POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
11-0518-10H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 11POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
11-0518-10T 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 11POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
11-0518-11 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 11POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
11-0518-11H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 11POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 11 (1 x 11)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-0518-10 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 12POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 12 (1 x 12)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-0518-10H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 12POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 12 (1 x 12)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-0518-10T 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 12POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 12 (1 x 12)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-0518-11 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 12POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 12 (1 x 12)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-0518-11H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 12POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 12 (1 x 12)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-1518-10 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 12 (2 x 6)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-1518-10H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 12 (2 x 6)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-1518-10T 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 12 (2 x 6)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-1518-11 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
12-1518-11H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 12 (2 x 6)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
13-0518-10 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 13POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
13-0518-10H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 13POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
13-0518-10T 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 13POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
13-0518-11 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 13POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
13-0518-11H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 13POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 13 (1 x 13)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-0518-10H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 14POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-0518-10T 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 14POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-0518-11 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 14POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-0518-11H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 14POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (1 x 14)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-1518-10 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-1518-10H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-1518-10T 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-1518-11 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
14-1518-11H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
15-0518-10 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 15POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
15-0518-10H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 15POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
15-0518-10T 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 15POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
15-0518-11 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 15POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
15-0518-11H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 15POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 15 (1 x 15)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-0518-10 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-0518-10H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-0518-10T 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-0518-11 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-0518-11H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 16POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (1 x 16)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-1518-10 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-1518-10H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-1518-10T 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-1518-11 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
16-1518-11H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
17-0518-10 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 17POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 17 (1 x 17)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
17-0518-10H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 17POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 17 (1 x 17)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
17-0518-10T 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 17POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 17 (1 x 17)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
17-0518-11 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 17POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 17 (1 x 17)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
17-0518-11H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 17POS GOLD
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 17 (1 x 17)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-0518-10 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 18POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
18-0518-10H 12020-single-dual-row-solder-pin-tails-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 18POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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