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0015-35035A Boyd Laconia, LLC Description: 0015-35035A,REV A,00,04
Packaging: Bulk
Produkt ist nicht verfügbar
0S517-100-B Boyd Laconia, LLC Description: 0S517-100-B
Packaging: Bulk
Produkt ist nicht verfügbar
0SY76-127-B Boyd Laconia, LLC Description: FG-HTSK-AL-0SY76-127-B, ROHS COM
Packaging: Bulk
Produkt ist nicht verfügbar
100000F00000G Boyd Laconia, LLC Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 1 gram Ampule
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Produkt ist nicht verfügbar
100100F00000G Boyd Laconia, LLC Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 1.25 oz Syringe
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Produkt ist nicht verfügbar
100500F00000G Boyd Laconia, LLC Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 5 oz Tube
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Produkt ist nicht verfügbar
100800F00000G Boyd Laconia, LLC Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 8 oz Can
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Produkt ist nicht verfügbar
101600F00000G Boyd Laconia, LLC Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 16 oz Jar
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Produkt ist nicht verfügbar
103900F00000G Boyd Laconia, LLC Boyd-Thermal-Grease-Sil-Free-Plus.pdf Description: 12 OZ. SEMCO CARTRIDGE GREASE NO
Packaging: Dispenser
Color: White
Size / Dimension: 12 oz Cartridge
Type: Non-Silicone Grease
Thermal Conductivity: 1.40W/m-K
Part Status: Active
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 356°F (-40°C ~ 180°C)
Produkt ist nicht verfügbar
10-6327-01,MOD EARS Boyd Laconia, LLC Description: 10-6327-01 MOD EARS,REV 00,00,04
Packaging: Bulk
Material: Aluminum
Length: 1.122" (28.50mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.122" (28.50mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 9.26°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
115000F00000G 115000F00000G Boyd Laconia, LLC Description: STANDARD CLIP CODE 50
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
auf Bestellung 17583 Stücke:
Lieferzeit 10-14 Tag (e)
24+0.76 EUR
25+ 0.73 EUR
26+ 0.69 EUR
50+ 0.67 EUR
100+ 0.66 EUR
250+ 0.62 EUR
500+ 0.58 EUR
2500+ 0.53 EUR
5000+ 0.51 EUR
Mindestbestellmenge: 24
116200F00000G 116200F00000G Boyd Laconia, LLC Description: STANDARD CLIP CODE 62
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
auf Bestellung 11400 Stücke:
Lieferzeit 10-14 Tag (e)
25+0.7 EUR
27+ 0.67 EUR
100+ 0.61 EUR
1000+ 0.49 EUR
5000+ 0.47 EUR
10000+ 0.44 EUR
Mindestbestellmenge: 25
118300F00000G 118300F00000G Boyd Laconia, LLC BoydBoardLevelHeatsinksCatalog.pdf Description: STANDARD CLIP CODE 83
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
auf Bestellung 12429 Stücke:
Lieferzeit 10-14 Tag (e)
20+0.9 EUR
21+ 0.85 EUR
25+ 0.81 EUR
50+ 0.79 EUR
100+ 0.78 EUR
250+ 0.73 EUR
500+ 0.68 EUR
2500+ 0.62 EUR
5000+ 0.6 EUR
Mindestbestellmenge: 20
125700D00000G 125700D00000G Boyd Laconia, LLC BoydBoardLevelHeatsinksCatalog.pdf Description: SOLDER ANCHOR FOR BGA HEATSINKS
Packaging: Bulk
For Use With/Related Products: BGA Heat Sinks
Accessory Type: Solder Anchor (2 required)
Part Status: Active
auf Bestellung 64418 Stücke:
Lieferzeit 10-14 Tag (e)
17+1.04 EUR
18+ 0.99 EUR
25+ 0.94 EUR
50+ 0.92 EUR
100+ 0.91 EUR
250+ 0.84 EUR
500+ 0.79 EUR
1000+ 0.72 EUR
5000+ 0.7 EUR
Mindestbestellmenge: 17
125800D00000G 125800D00000G Boyd Laconia, LLC Description: SOLDER ANCHOR FOR BGA HEATSINKS
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Solder Anchor (2 required)
Part Status: Active
auf Bestellung 48623 Stücke:
Lieferzeit 10-14 Tag (e)
42+0.42 EUR
44+ 0.4 EUR
100+ 0.37 EUR
1000+ 0.29 EUR
5000+ 0.28 EUR
10000+ 0.26 EUR
Mindestbestellmenge: 42
188635F00000G Boyd Laconia, LLC Description: THERM PAD HEATSINK GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Type: Pad, Sheet
Usage: TO-218, TO-220, TO-247
Produkt ist nicht verfügbar
188651F00000G Boyd Laconia, LLC Description: THERM PAD 17.45MMX14.27MM GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Thermal Resistivity: 1.40°C/W, 0.93°C/W
Usage: TO-218, TO-220, TO-247
Outline: 17.45mm x 14.27mm
Part Status: Active
Produkt ist nicht verfügbar
189660F00000G Boyd Laconia, LLC Description: 189660F00000G
Packaging: Bulk
Produkt ist nicht verfügbar
189751F00000G Boyd Laconia, LLC Description: PAD,97,0.562X00.687,W/.125HOLE
Packaging: Bulk
Produkt ist nicht verfügbar
189758F00000G Boyd Laconia, LLC Description: PAD,97,0.500X00.750,W/.125HOLE
Packaging: Bulk
Produkt ist nicht verfügbar
189890F00000G Boyd Laconia, LLC Description: PAD,98,0.740X00.860,W/.160HOLG
Packaging: Bulk
Produkt ist nicht verfügbar
2000346-001 REV A Boyd Laconia, LLC Description: 2000346-001 REV A
Packaging: Bulk
Produkt ist nicht verfügbar
2292B Boyd Laconia, LLC Description: THM,17368B REV C-G
Packaging: Bulk
Produkt ist nicht verfügbar
2342BG Boyd Laconia, LLC Description: THM,18917B REV H
Packaging: Bulk
Produkt ist nicht verfügbar
241402B92203G Boyd Laconia, LLC Description: H/S ASS'Y(RD002356)241402B92203G
Packaging: Bulk
Length: 2.283" (58.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.457" (37.00mm)
Package Cooled: Quarter Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 1.80°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.90°C/W
Fin Height: 0.236" (6.00mm)
Produkt ist nicht verfügbar
241804B92200G Boyd Laconia, LLC Description: 241804B92200G
Packaging: Bulk
Length: 2.280" (57.90mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.902" (22.90mm)
Package Cooled: Eighth Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.60°C/W
Fin Height: 0.449" (11.40mm)
Produkt ist nicht verfügbar
321527B00000G 321527B00000G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK TO-5 2W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5, TO-39
Attachment Method: Threaded Coupling
Power Dissipation @ Temperature Rise: 0.5W @ 20°C
Thermal Resistance @ Forced Air Flow: 20.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 35.20°C/W
Fin Height: 0.290" (7.37mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 401 Stücke:
Lieferzeit 10-14 Tag (e)
1+33.09 EUR
10+ 31.26 EUR
25+ 29.42 EUR
50+ 27.58 EUR
100+ 25.74 EUR
250+ 23.9 EUR
322400B00000G 322400B00000G Boyd Laconia, LLC Aavid3200.pdf Description: HEAT SINK TO-18 1W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.180" (4.57mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-18
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.6W @ 60°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 100.00°C/W
Fin Height: 0.235" (5.97mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 812 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.7 EUR
10+ 3.59 EUR
25+ 3.5 EUR
50+ 3.3 EUR
100+ 3.11 EUR
250+ 2.91 EUR
500+ 2.82 EUR
Mindestbestellmenge: 5
322605B00000G 322605B00000G Boyd Laconia, LLC Aavid3200.pdf Description: HEATSINK TO-5 1.25W H=.25" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 54.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2288 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.93 EUR
10+ 4.8 EUR
25+ 4.67 EUR
50+ 4.41 EUR
100+ 4.15 EUR
250+ 3.89 EUR
500+ 3.76 EUR
1000+ 3.37 EUR
Mindestbestellmenge: 4
325705B00000G 325705B00000G Boyd Laconia, LLC Board-Level-Cooling-Extruded-Collar-3250.pdf Description: TO-5 PUSH-ON HEATSINK 6.35MM
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 923 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.38 EUR
10+ 2.25 EUR
100+ 2.01 EUR
Mindestbestellmenge: 8
325705R00000G Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Red Anodized
Produkt ist nicht verfügbar
335824B00032G Boyd Laconia, LLC Description: PGA,335824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
335824B00034G 335824B00034G Boyd Laconia, LLC %283747%2C3718%2924B000%2832%2C34%29G%20Top.jpg Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1267 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.61 EUR
10+ 14.22 EUR
672+ 10.27 EUR
Mindestbestellmenge: 2
342941 342941 Boyd Laconia, LLC Board_Level_Cooling_Square_Skived_Fin-3044617.pdf Description: COPPER HEATSINK 40X40.5X13.5MM
Packaging: Tray
Material: Copper
Length: 1.594" (40.50mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.30°C/W
Fin Height: 0.531" (13.50mm)
Material Finish: AavSHIELD 3C
auf Bestellung 248 Stücke:
Lieferzeit 10-14 Tag (e)
1+56.48 EUR
10+ 53.16 EUR
25+ 49.84 EUR
40+ 46.51 EUR
80+ 44.85 EUR
342948 342948 Boyd Laconia, LLC Board-Level-Cooling-Square-Skived-Fin.pdf Description: COPPER HEATSINK 70X69X14MM
Packaging: Tray
Material: Copper
Length: 2.717" (69.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.756" (70.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.60°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
Produkt ist nicht verfügbar
342948-copper skivfin Boyd Laconia, LLC Description: 342948,REV03(GP)
Packaging: Bulk
Material: Copper
Length: 2.717" (69.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 2.756" (70.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.551" (14.00mm)
Produkt ist nicht verfügbar
342949 342949 Boyd Laconia, LLC Board-Level-Cooling-Square-Skived-Fin.pdf Description: COPPER HEATSINK 80X80X12MM
Packaging: Tray
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.150" (80.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.10°C/W
Fin Height: 0.472" (12.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
auf Bestellung 177 Stücke:
Lieferzeit 10-14 Tag (e)
1+100.57 EUR
10+ 94.66 EUR
25+ 88.74 EUR
50+ 82.83 EUR
100+ 79.87 EUR
342950 342950 Boyd Laconia, LLC Board-Level-Cooling-Square-Skived-Fin.pdf Description: COPPER HEATSINK 90X90X10MM
Packaging: Tray
Material: Copper
Length: 3.543" (90.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.543" (90.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: AavSHIELD 3C
Produkt ist nicht verfügbar
371824B00032G 371824B00032G Boyd Laconia, LLC 371824B00034G%20Side.jpg Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.275" (7.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 447 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.11 EUR
10+ 11.77 EUR
25+ 11.12 EUR
40+ 10.47 EUR
80+ 9.81 EUR
230+ 9.16 EUR
Mindestbestellmenge: 2
371924B00032G Boyd Laconia, LLC Description: 371924B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
372924M02000G( 10-5597-02G ) Boyd Laconia, LLC Description: 372924M02000G( 10-5597-02G )
Packaging: Bulk
Produkt ist nicht verfügbar
374024B00035G 374024B00035G Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: HEATSINK BGA 23X23X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 11.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 40.00°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1194 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.19 EUR
10+ 3.01 EUR
100+ 2.7 EUR
1078+ 2.22 EUR
Mindestbestellmenge: 6
374024B60024G-MOD W/STAB PAD Boyd Laconia, LLC Description: 374024B60024G-MOD W/STAB PAD
Packaging: Bulk
Produkt ist nicht verfügbar
374324B60023G 374324B60023G Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 3464 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.96 EUR
10+ 3.87 EUR
25+ 3.76 EUR
50+ 3.68 EUR
Mindestbestellmenge: 5
374424B00035G 374424B00035G Boyd Laconia, LLC 371824B00034G%20Side.jpg Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2315 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.44 EUR
10+ 5.3 EUR
540+ 4.15 EUR
1080+ 3.72 EUR
Mindestbestellmenge: 4
374524B00000G Boyd Laconia, LLC Description: 374524B00000G
Packaging: Bulk
Produkt ist nicht verfügbar
374624B00000G W/3M8810 Boyd Laconia, LLC Description: 374624B00000G W/3M8810
Packaging: Bulk
Produkt ist nicht verfügbar
374624B00032G 374624B00032G Boyd Laconia, LLC 371824B00034G%20Side.jpg Description: HEATSINK BGA 35X35X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 580 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.67 EUR
10+ 5.52 EUR
510+ 4.33 EUR
Mindestbestellmenge: 4
374724B00032G 374724B00032G Boyd Laconia, LLC Board-Level-Cooling-3747.pdf Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1611 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.77 EUR
10+ 5.62 EUR
25+ 5.47 EUR
50+ 5.17 EUR
100+ 4.86 EUR
250+ 4.56 EUR
672+ 4.41 EUR
1344+ 3.95 EUR
Mindestbestellmenge: 4
374724B00035G 374724B00035G Boyd Laconia, LLC Board-Level-Cooling-3747.pdf Description: HEATSINK BGA 35X35X18MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 915 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.28 EUR
10+ 9.03 EUR
672+ 7.08 EUR
Mindestbestellmenge: 2
374724B60024G 374724B60024G Boyd Laconia, LLC Board-Level-Cooling-3747.pdf Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 854 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.44 EUR
10+ 11.13 EUR
168+ 9.27 EUR
Mindestbestellmenge: 2
374824B00000G Boyd Laconia, LLC Description: 374824B00000G
Packaging: Bulk
Produkt ist nicht verfügbar
374824B00032G Boyd Laconia, LLC Description: 374824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
374924B00032G 374924B00032G Boyd Laconia, LLC 374924B00032G%20Side.jpg Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 639 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.33 EUR
10+ 5.19 EUR
390+ 4.21 EUR
Mindestbestellmenge: 4
375024B00032G 375024B00032G Boyd Laconia, LLC Aavid_Boyd_Board_Level_Heatsinks_Catalog-3043646.pdf Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1401 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.17 EUR
10+ 5.03 EUR
450+ 3.94 EUR
1350+ 3.53 EUR
Mindestbestellmenge: 4
3751320-PAH14010-P0 Boyd Laconia, LLC Description: 3751320-PAH14010-P0
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
375424B00034G 375424B00034G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK PIN-FIN W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.598" (15.19mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.598" (15.19mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 62.50°C/W
Fin Height: 0.252" (6.40mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1421 Stücke:
Lieferzeit 10-14 Tag (e)
9+2.18 EUR
10+ 2.08 EUR
25+ 2.02 EUR
50+ 1.96 EUR
100+ 1.86 EUR
250+ 1.75 EUR
500+ 1.64 EUR
1000+ 1.53 EUR
Mindestbestellmenge: 9
416101U00000G 416101U00000G Boyd Laconia, LLC Boyd-Hi-Contact-6-Pass-Datasheet.pdf Description: COLD PLATE HEAT SINK 0.010C/W
Packaging: Box
Dimensions - Overall: 9.19" L x 7.00" W x 0.64" H (233.4mm x 177.8mm x 16.3mm)
Product Type: Passive, Cold Plate
Thermal Resistance @ GPM: 0.010°C/W @ 1.5 GPM
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)
1+165.26 EUR
12+ 154.93 EUR
28+ 144.61 EUR
52+ 139.44 EUR
100+ 134.28 EUR
416201U00000G 416201U00000G Boyd Laconia, LLC Boyd-Hi-Contact-6-Pass-Datasheet.pdf Description: COLD PLATE HEAT SINK 0.01C/W
Packaging: Box
Dimensions - Overall: 15.20" L x 7.00" W x 0.64" H (386.1mm x 177.8mm x 16.3mm)
Product Type: Passive, Cold Plate
Thermal Resistance @ GPM: 0.010°C/W @ 1.0 GPM
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
1+262.19 EUR
10+ 244.71 EUR
25+ 227.23 EUR
416301U00000G 416301U00000G Boyd Laconia, LLC Boyd-Hi-Contact-6-Pass-Datasheet.pdf Description: COLD PLATE HEAT SINK 0.006C/W
Packaging: Box
Dimensions - Overall: 27.21" L x 7.00" W x 0.64" H (691.1mm x 177.8mm x 16.3mm)
Product Type: Passive, Cold Plate
Thermal Resistance @ GPM: 0.006°C/W @ 1.0 GPM
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
1+408.37 EUR
10+ 381.15 EUR
0015-35035A
Hersteller: Boyd Laconia, LLC
Description: 0015-35035A,REV A,00,04
Packaging: Bulk
Produkt ist nicht verfügbar
0S517-100-B
Hersteller: Boyd Laconia, LLC
Description: 0S517-100-B
Packaging: Bulk
Produkt ist nicht verfügbar
0SY76-127-B
Hersteller: Boyd Laconia, LLC
Description: FG-HTSK-AL-0SY76-127-B, ROHS COM
Packaging: Bulk
Produkt ist nicht verfügbar
100000F00000G
Hersteller: Boyd Laconia, LLC
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 1 gram Ampule
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Produkt ist nicht verfügbar
100100F00000G
Hersteller: Boyd Laconia, LLC
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 1.25 oz Syringe
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Produkt ist nicht verfügbar
100500F00000G
Hersteller: Boyd Laconia, LLC
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 5 oz Tube
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Produkt ist nicht verfügbar
100800F00000G
Hersteller: Boyd Laconia, LLC
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 8 oz Can
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Produkt ist nicht verfügbar
101600F00000G
Hersteller: Boyd Laconia, LLC
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 16 oz Jar
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Produkt ist nicht verfügbar
103900F00000G Boyd-Thermal-Grease-Sil-Free-Plus.pdf
Hersteller: Boyd Laconia, LLC
Description: 12 OZ. SEMCO CARTRIDGE GREASE NO
Packaging: Dispenser
Color: White
Size / Dimension: 12 oz Cartridge
Type: Non-Silicone Grease
Thermal Conductivity: 1.40W/m-K
Part Status: Active
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 356°F (-40°C ~ 180°C)
Produkt ist nicht verfügbar
10-6327-01,MOD EARS
Hersteller: Boyd Laconia, LLC
Description: 10-6327-01 MOD EARS,REV 00,00,04
Packaging: Bulk
Material: Aluminum
Length: 1.122" (28.50mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.122" (28.50mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 9.26°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
115000F00000G
115000F00000G
Hersteller: Boyd Laconia, LLC
Description: STANDARD CLIP CODE 50
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
auf Bestellung 17583 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
24+0.76 EUR
25+ 0.73 EUR
26+ 0.69 EUR
50+ 0.67 EUR
100+ 0.66 EUR
250+ 0.62 EUR
500+ 0.58 EUR
2500+ 0.53 EUR
5000+ 0.51 EUR
Mindestbestellmenge: 24
116200F00000G
116200F00000G
Hersteller: Boyd Laconia, LLC
Description: STANDARD CLIP CODE 62
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
auf Bestellung 11400 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
25+0.7 EUR
27+ 0.67 EUR
100+ 0.61 EUR
1000+ 0.49 EUR
5000+ 0.47 EUR
10000+ 0.44 EUR
Mindestbestellmenge: 25
118300F00000G BoydBoardLevelHeatsinksCatalog.pdf
118300F00000G
Hersteller: Boyd Laconia, LLC
Description: STANDARD CLIP CODE 83
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
auf Bestellung 12429 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
20+0.9 EUR
21+ 0.85 EUR
25+ 0.81 EUR
50+ 0.79 EUR
100+ 0.78 EUR
250+ 0.73 EUR
500+ 0.68 EUR
2500+ 0.62 EUR
5000+ 0.6 EUR
Mindestbestellmenge: 20
125700D00000G BoydBoardLevelHeatsinksCatalog.pdf
125700D00000G
Hersteller: Boyd Laconia, LLC
Description: SOLDER ANCHOR FOR BGA HEATSINKS
Packaging: Bulk
For Use With/Related Products: BGA Heat Sinks
Accessory Type: Solder Anchor (2 required)
Part Status: Active
auf Bestellung 64418 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
17+1.04 EUR
18+ 0.99 EUR
25+ 0.94 EUR
50+ 0.92 EUR
100+ 0.91 EUR
250+ 0.84 EUR
500+ 0.79 EUR
1000+ 0.72 EUR
5000+ 0.7 EUR
Mindestbestellmenge: 17
125800D00000G
125800D00000G
Hersteller: Boyd Laconia, LLC
Description: SOLDER ANCHOR FOR BGA HEATSINKS
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Solder Anchor (2 required)
Part Status: Active
auf Bestellung 48623 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
42+0.42 EUR
44+ 0.4 EUR
100+ 0.37 EUR
1000+ 0.29 EUR
5000+ 0.28 EUR
10000+ 0.26 EUR
Mindestbestellmenge: 42
188635F00000G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD HEATSINK GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Type: Pad, Sheet
Usage: TO-218, TO-220, TO-247
Produkt ist nicht verfügbar
188651F00000G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 17.45MMX14.27MM GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Thermal Resistivity: 1.40°C/W, 0.93°C/W
Usage: TO-218, TO-220, TO-247
Outline: 17.45mm x 14.27mm
Part Status: Active
Produkt ist nicht verfügbar
189660F00000G
Hersteller: Boyd Laconia, LLC
Description: 189660F00000G
Packaging: Bulk
Produkt ist nicht verfügbar
189751F00000G
Hersteller: Boyd Laconia, LLC
Description: PAD,97,0.562X00.687,W/.125HOLE
Packaging: Bulk
Produkt ist nicht verfügbar
189758F00000G
Hersteller: Boyd Laconia, LLC
Description: PAD,97,0.500X00.750,W/.125HOLE
Packaging: Bulk
Produkt ist nicht verfügbar
189890F00000G
Hersteller: Boyd Laconia, LLC
Description: PAD,98,0.740X00.860,W/.160HOLG
Packaging: Bulk
Produkt ist nicht verfügbar
2000346-001 REV A
Hersteller: Boyd Laconia, LLC
Description: 2000346-001 REV A
Packaging: Bulk
Produkt ist nicht verfügbar
2292B
Hersteller: Boyd Laconia, LLC
Description: THM,17368B REV C-G
Packaging: Bulk
Produkt ist nicht verfügbar
2342BG
Hersteller: Boyd Laconia, LLC
Description: THM,18917B REV H
Packaging: Bulk
Produkt ist nicht verfügbar
241402B92203G
Hersteller: Boyd Laconia, LLC
Description: H/S ASS'Y(RD002356)241402B92203G
Packaging: Bulk
Length: 2.283" (58.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.457" (37.00mm)
Package Cooled: Quarter Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 1.80°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.90°C/W
Fin Height: 0.236" (6.00mm)
Produkt ist nicht verfügbar
241804B92200G
Hersteller: Boyd Laconia, LLC
Description: 241804B92200G
Packaging: Bulk
Length: 2.280" (57.90mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.902" (22.90mm)
Package Cooled: Eighth Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.60°C/W
Fin Height: 0.449" (11.40mm)
Produkt ist nicht verfügbar
321527B00000G Board-Level-Heatsinks_Cat.pdf
321527B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-5 2W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5, TO-39
Attachment Method: Threaded Coupling
Power Dissipation @ Temperature Rise: 0.5W @ 20°C
Thermal Resistance @ Forced Air Flow: 20.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 35.20°C/W
Fin Height: 0.290" (7.37mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 401 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+33.09 EUR
10+ 31.26 EUR
25+ 29.42 EUR
50+ 27.58 EUR
100+ 25.74 EUR
250+ 23.9 EUR
322400B00000G Aavid3200.pdf
322400B00000G
Hersteller: Boyd Laconia, LLC
Description: HEAT SINK TO-18 1W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.180" (4.57mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-18
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.6W @ 60°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 100.00°C/W
Fin Height: 0.235" (5.97mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 812 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+3.7 EUR
10+ 3.59 EUR
25+ 3.5 EUR
50+ 3.3 EUR
100+ 3.11 EUR
250+ 2.91 EUR
500+ 2.82 EUR
Mindestbestellmenge: 5
322605B00000G Aavid3200.pdf
322605B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-5 1.25W H=.25" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 54.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2288 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+4.93 EUR
10+ 4.8 EUR
25+ 4.67 EUR
50+ 4.41 EUR
100+ 4.15 EUR
250+ 3.89 EUR
500+ 3.76 EUR
1000+ 3.37 EUR
Mindestbestellmenge: 4
325705B00000G Board-Level-Cooling-Extruded-Collar-3250.pdf
325705B00000G
Hersteller: Boyd Laconia, LLC
Description: TO-5 PUSH-ON HEATSINK 6.35MM
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 923 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
8+2.38 EUR
10+ 2.25 EUR
100+ 2.01 EUR
Mindestbestellmenge: 8
325705R00000G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Red Anodized
Produkt ist nicht verfügbar
335824B00032G
Hersteller: Boyd Laconia, LLC
Description: PGA,335824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
335824B00034G %283747%2C3718%2924B000%2832%2C34%29G%20Top.jpg
335824B00034G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1267 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+14.61 EUR
10+ 14.22 EUR
672+ 10.27 EUR
Mindestbestellmenge: 2
342941 Board_Level_Cooling_Square_Skived_Fin-3044617.pdf
342941
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 40X40.5X13.5MM
Packaging: Tray
Material: Copper
Length: 1.594" (40.50mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.30°C/W
Fin Height: 0.531" (13.50mm)
Material Finish: AavSHIELD 3C
auf Bestellung 248 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+56.48 EUR
10+ 53.16 EUR
25+ 49.84 EUR
40+ 46.51 EUR
80+ 44.85 EUR
342948 Board-Level-Cooling-Square-Skived-Fin.pdf
342948
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 70X69X14MM
Packaging: Tray
Material: Copper
Length: 2.717" (69.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.756" (70.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.60°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
Produkt ist nicht verfügbar
342948-copper skivfin
Hersteller: Boyd Laconia, LLC
Description: 342948,REV03(GP)
Packaging: Bulk
Material: Copper
Length: 2.717" (69.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 2.756" (70.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.551" (14.00mm)
Produkt ist nicht verfügbar
342949 Board-Level-Cooling-Square-Skived-Fin.pdf
342949
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 80X80X12MM
Packaging: Tray
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.150" (80.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.10°C/W
Fin Height: 0.472" (12.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
auf Bestellung 177 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+100.57 EUR
10+ 94.66 EUR
25+ 88.74 EUR
50+ 82.83 EUR
100+ 79.87 EUR
342950 Board-Level-Cooling-Square-Skived-Fin.pdf
342950
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 90X90X10MM
Packaging: Tray
Material: Copper
Length: 3.543" (90.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.543" (90.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: AavSHIELD 3C
Produkt ist nicht verfügbar
371824B00032G 371824B00034G%20Side.jpg
371824B00032G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.275" (7.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 447 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.11 EUR
10+ 11.77 EUR
25+ 11.12 EUR
40+ 10.47 EUR
80+ 9.81 EUR
230+ 9.16 EUR
Mindestbestellmenge: 2
371924B00032G
Hersteller: Boyd Laconia, LLC
Description: 371924B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
372924M02000G( 10-5597-02G )
Hersteller: Boyd Laconia, LLC
Description: 372924M02000G( 10-5597-02G )
Packaging: Bulk
Produkt ist nicht verfügbar
374024B00035G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
374024B00035G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA 23X23X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 11.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 40.00°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1194 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6+3.19 EUR
10+ 3.01 EUR
100+ 2.7 EUR
1078+ 2.22 EUR
Mindestbestellmenge: 6
374024B60024G-MOD W/STAB PAD
Hersteller: Boyd Laconia, LLC
Description: 374024B60024G-MOD W/STAB PAD
Packaging: Bulk
Produkt ist nicht verfügbar
374324B60023G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
374324B60023G
Hersteller: Boyd Laconia, LLC
Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 3464 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+3.96 EUR
10+ 3.87 EUR
25+ 3.76 EUR
50+ 3.68 EUR
Mindestbestellmenge: 5
374424B00035G 371824B00034G%20Side.jpg
374424B00035G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2315 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.44 EUR
10+ 5.3 EUR
540+ 4.15 EUR
1080+ 3.72 EUR
Mindestbestellmenge: 4
374524B00000G
Hersteller: Boyd Laconia, LLC
Description: 374524B00000G
Packaging: Bulk
Produkt ist nicht verfügbar
374624B00000G W/3M8810
Hersteller: Boyd Laconia, LLC
Description: 374624B00000G W/3M8810
Packaging: Bulk
Produkt ist nicht verfügbar
374624B00032G 371824B00034G%20Side.jpg
374624B00032G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 580 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.67 EUR
10+ 5.52 EUR
510+ 4.33 EUR
Mindestbestellmenge: 4
374724B00032G Board-Level-Cooling-3747.pdf
374724B00032G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1611 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.77 EUR
10+ 5.62 EUR
25+ 5.47 EUR
50+ 5.17 EUR
100+ 4.86 EUR
250+ 4.56 EUR
672+ 4.41 EUR
1344+ 3.95 EUR
Mindestbestellmenge: 4
374724B00035G Board-Level-Cooling-3747.pdf
374724B00035G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X18MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 915 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+9.28 EUR
10+ 9.03 EUR
672+ 7.08 EUR
Mindestbestellmenge: 2
374724B60024G Board-Level-Cooling-3747.pdf
374724B60024G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 854 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.44 EUR
10+ 11.13 EUR
168+ 9.27 EUR
Mindestbestellmenge: 2
374824B00000G
Hersteller: Boyd Laconia, LLC
Description: 374824B00000G
Packaging: Bulk
Produkt ist nicht verfügbar
374824B00032G
Hersteller: Boyd Laconia, LLC
Description: 374824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
374924B00032G 374924B00032G%20Side.jpg
374924B00032G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 639 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.33 EUR
10+ 5.19 EUR
390+ 4.21 EUR
Mindestbestellmenge: 4
375024B00032G Aavid_Boyd_Board_Level_Heatsinks_Catalog-3043646.pdf
375024B00032G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1401 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.17 EUR
10+ 5.03 EUR
450+ 3.94 EUR
1350+ 3.53 EUR
Mindestbestellmenge: 4
3751320-PAH14010-P0
Hersteller: Boyd Laconia, LLC
Description: 3751320-PAH14010-P0
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
375424B00034G Board-Level-Heatsinks_Cat.pdf
375424B00034G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK PIN-FIN W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.598" (15.19mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.598" (15.19mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 62.50°C/W
Fin Height: 0.252" (6.40mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1421 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
9+2.18 EUR
10+ 2.08 EUR
25+ 2.02 EUR
50+ 1.96 EUR
100+ 1.86 EUR
250+ 1.75 EUR
500+ 1.64 EUR
1000+ 1.53 EUR
Mindestbestellmenge: 9
416101U00000G Boyd-Hi-Contact-6-Pass-Datasheet.pdf
416101U00000G
Hersteller: Boyd Laconia, LLC
Description: COLD PLATE HEAT SINK 0.010C/W
Packaging: Box
Dimensions - Overall: 9.19" L x 7.00" W x 0.64" H (233.4mm x 177.8mm x 16.3mm)
Product Type: Passive, Cold Plate
Thermal Resistance @ GPM: 0.010°C/W @ 1.5 GPM
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+165.26 EUR
12+ 154.93 EUR
28+ 144.61 EUR
52+ 139.44 EUR
100+ 134.28 EUR
416201U00000G Boyd-Hi-Contact-6-Pass-Datasheet.pdf
416201U00000G
Hersteller: Boyd Laconia, LLC
Description: COLD PLATE HEAT SINK 0.01C/W
Packaging: Box
Dimensions - Overall: 15.20" L x 7.00" W x 0.64" H (386.1mm x 177.8mm x 16.3mm)
Product Type: Passive, Cold Plate
Thermal Resistance @ GPM: 0.010°C/W @ 1.0 GPM
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+262.19 EUR
10+ 244.71 EUR
25+ 227.23 EUR
416301U00000G Boyd-Hi-Contact-6-Pass-Datasheet.pdf
416301U00000G
Hersteller: Boyd Laconia, LLC
Description: COLD PLATE HEAT SINK 0.006C/W
Packaging: Box
Dimensions - Overall: 27.21" L x 7.00" W x 0.64" H (691.1mm x 177.8mm x 16.3mm)
Product Type: Passive, Cold Plate
Thermal Resistance @ GPM: 0.006°C/W @ 1.0 GPM
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+408.37 EUR
10+ 381.15 EUR
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