Produkte > BOYD LACONIA, LLC > Alle Produkte des Herstellers BOYD LACONIA, LLC (725) > Seite 1 nach 13
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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000DB-120-B-SKIMMED | Boyd Laconia, LLC |
Description: FG-HTSK-AL-000DB-120-B-SKIMMED, Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
0015-35035A | Boyd Laconia, LLC |
Description: 0015-35035A,REV A,00,04 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
0S515-150-B | Boyd Laconia, LLC |
Description: KIT-AL-400986 S515-150-B-ROHS CO Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
0S517-100-B | Boyd Laconia, LLC |
Description: 0S517-100-B Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
0SY76-127-B | Boyd Laconia, LLC |
Description: FG-HTSK-AL-0SY76-127-B, ROHS COM Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
100000F00000G | Boyd Laconia, LLC |
Description: THERMAL PASTE Packaging: Bulk Color: White Size / Dimension: 1 gram Ampule Type: Silicone Compound Thermal Conductivity: 0.73W/m-K Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
100100F00000G | Boyd Laconia, LLC |
Description: THERMAL PASTE Packaging: Bulk Color: White Size / Dimension: 1.25 oz Syringe Type: Silicone Compound Thermal Conductivity: 0.73W/m-K Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
100500F00000G | Boyd Laconia, LLC |
Description: THERMAL PASTE Packaging: Bulk Color: White Size / Dimension: 5 oz Tube Type: Silicone Compound Thermal Conductivity: 0.73W/m-K Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
100800F00000G | Boyd Laconia, LLC |
Description: THERMAL PASTE Packaging: Bulk Color: White Size / Dimension: 8 oz Can Type: Silicone Compound Thermal Conductivity: 0.73W/m-K Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
101600F00000G | Boyd Laconia, LLC |
Description: THERMAL PASTE Packaging: Bulk Color: White Size / Dimension: 16 oz Jar Type: Silicone Compound Thermal Conductivity: 0.73W/m-K Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
103900F00000G | Boyd Laconia, LLC |
![]() Packaging: Dispenser Color: White Size / Dimension: 12 oz Cartridge Type: Non-Silicone Grease Thermal Conductivity: 1.40W/m-K Part Status: Active Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 356°F (-40°C ~ 180°C) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
10-6326-28G | Boyd Laconia, LLC |
Description: 10-6326-28G Packaging: Bulk Material: Aluminum Length: 1.102" (28.00mm) Shape: Square, Fins Type: Top Mount Width: 1.102" (28.00mm) Package Cooled: BGA Attachment Method: Push Pin, Thermal Material Thermal Resistance @ Forced Air Flow: 13.13°C/W @ 200 LFM Thermal Resistance @ Natural: 44.10°C/W Fin Height: 0.236" (6.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
10-6327-01,MOD EARS | Boyd Laconia, LLC |
Description: 10-6327-01 MOD EARS,REV 00,00,04 Packaging: Bulk Material: Aluminum Length: 1.122" (28.50mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.122" (28.50mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 9.26°C/W @ 200 LFM Thermal Resistance @ Natural: 30.60°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
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10-6327-01G | Boyd Laconia, LLC |
Description: HEATSINK BGA W/PUSH PINS Packaging: Bulk Material: Aluminum Length: 1.122" (28.50mm) Shape: Square Type: Top Mount Width: 1.122" (28.50mm) Package Cooled: BGA Attachment Method: Push Pin Power Dissipation @ Temperature Rise: 2.0W @ 60°C Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 200 LFM Thermal Resistance @ Natural: 30.60°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
10-6327-01G + T725 PAD | Boyd Laconia, LLC |
Description: 10-6327-01G + T725 PAD Packaging: Bulk Material: Aluminum Length: 1.122" (28.50mm) Shape: Square, Pin Fins Type: Board Level Width: 1.122" (28.50mm) Package Cooled: BGA, FPGA Attachment Method: Push Pin Power Dissipation @ Temperature Rise: 1.0W @ 30°C Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
10-6327-02G | Boyd Laconia, LLC |
Description: 10-6327-02G Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
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115000F00000G | Boyd Laconia, LLC |
![]() Packaging: Bulk For Use With/Related Products: Heat Sinks Accessory Type: Clip |
auf Bestellung 11722 Stücke: Lieferzeit 10-14 Tag (e) |
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115300F00000G | Boyd Laconia, LLC |
![]() Packaging: Bulk For Use With/Related Products: Heat Sinks Accessory Type: Clip |
auf Bestellung 19482 Stücke: Lieferzeit 10-14 Tag (e) |
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11-5602-51 | Boyd Laconia, LLC |
Description: 11-5602-51 REV F Packaging: Bulk Material: Brass Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Natural: 3.70°C/W Fin Height: 0.453" (11.50mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
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116200F00000G | Boyd Laconia, LLC |
![]() Packaging: Bulk For Use With/Related Products: Heat Sinks Accessory Type: Clip |
auf Bestellung 6257 Stücke: Lieferzeit 10-14 Tag (e) |
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118300F00000G | Boyd Laconia, LLC |
![]() Packaging: Bulk For Use With/Related Products: Heat Sinks Accessory Type: Clip |
auf Bestellung 17280 Stücke: Lieferzeit 10-14 Tag (e) |
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125700D00000G | Boyd Laconia, LLC |
![]() Packaging: Bulk For Use With/Related Products: BGA Heat Sinks Accessory Type: Solder Anchor (2 required) Part Status: Active |
auf Bestellung 58265 Stücke: Lieferzeit 10-14 Tag (e) |
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125800D00000G | Boyd Laconia, LLC |
![]() Packaging: Bulk For Use With/Related Products: Heat Sinks Accessory Type: Solder Anchor (2 required) Part Status: Active |
auf Bestellung 39946 Stücke: Lieferzeit 10-14 Tag (e) |
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188623F00000G | Boyd Laconia, LLC |
Description: THERM PAD 40.46X27.94MM GRAY Packaging: Bulk Color: Gray Material: Silicone Shape: Rhombus Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Thermal Resistivity: 0.40°C/W Usage: TO-3 Outline: 40.46mm x 27.94mm Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
188635F00000G | Boyd Laconia, LLC |
Description: THERM PAD HEATSINK GRAY Packaging: Bulk Color: Gray Material: Silicone Type: Pad, Sheet Usage: TO-218, TO-220, TO-247 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
188651F00000G | Boyd Laconia, LLC |
Description: THERM PAD 17.45MMX14.27MM GRAY Packaging: Bulk Color: Gray Material: Silicone Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Thermal Resistivity: 1.40°C/W, 0.93°C/W Usage: TO-218, TO-220, TO-247 Outline: 17.45mm x 14.27mm Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
188790F00000G | Boyd Laconia, LLC |
Description: PAD,87,0.740X00.860,W/.160HOLG Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
188854F00000G | Boyd Laconia, LLC |
Description: THERM PAD HEATSINK GRAY Packaging: Bulk Color: Gray Material: Silicone Type: Pad, Sheet Usage: TO-218, TO-220, TO-247 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
188858F00000G | Boyd Laconia, LLC |
Description: THERM PAD HEATSINK GRAY Packaging: Bulk Color: Gray Material: Silicone Type: Pad, Sheet Usage: TO-218, TO-220, TO-247 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
188923F00000G | Boyd Laconia, LLC |
Description: PAD,89,1.100X01.593,MODG Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
188961F00000 | Boyd Laconia, LLC |
Description: THERM PAD 19.05MMX10.41MM GRAY Packaging: Bulk Color: Gray Material: Silicone Shape: Rectangular Thickness: 0.0090" (0.229mm) Type: Pad, Sheet Thermal Resistivity: 1.50°C/W, 1.16°C/W Usage: TO-218, TO-220, TO-247 Outline: 19.05mm x 10.41mm Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
189660F00000G | Boyd Laconia, LLC |
Description: 189660F00000G Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
189751F00000G | Boyd Laconia, LLC |
Description: PAD,97,0.562X00.687,W/.125HOLE Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
189758F00000G | Boyd Laconia, LLC |
Description: PAD,97,0.500X00.750,W/.125HOLE Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
189890F00000G | Boyd Laconia, LLC |
Description: PAD,98,0.740X00.860,W/.160HOLG Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
189990F00000 | Boyd Laconia, LLC |
Description: THERM PAD 21.84MMX18.8MM W/ADH Packaging: Bulk Color: Gray Material: Silicone Shape: Rectangular Thickness: 0.0090" (0.229mm) Type: Pad, Sheet Thermal Resistivity: 1.50°C/W, 1.16°C/W Usage: TO-218, TO-220, TO-247 Outline: 21.84mm x 18.80mm Adhesive: Adhesive - One Side |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
2000346-001 REV A | Boyd Laconia, LLC |
Description: 2000346-001 REV A Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
2288BG | Boyd Laconia, LLC |
Description: 2288BG Packaging: Bulk Diameter: 0.300" (7.62mm) ID, 1.000" (25.40mm) OD Shape: Cylindrical Type: Board Level Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Not Included) Power Dissipation @ Temperature Rise: 1.5W @ 40°C Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM |
Produkt ist nicht verfügbar |
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2292B | Boyd Laconia, LLC |
Description: THM,17368B REV C-G Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
2327B-TACHG | Boyd Laconia, LLC |
Description: THM,2327B-TACHG Packaging: Bulk Material: Aluminum Length: 1.105" (28.07mm) Shape: Rectangular, Pin Fins Type: Top Mount Width: 1.100" (27.94mm) Package Cooled: BGA, FPGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 2W @ 50°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM Fin Height: 0.600" (15.24mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
2327B W/3M 8815 TAPE | Boyd Laconia, LLC |
Description: THM,2327B W/3M 8815 TAPE Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
2341BG | Boyd Laconia, LLC |
Description: 2341BG Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
2342BG | Boyd Laconia, LLC |
Description: THM,18917B REV H Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
241402B92203G | Boyd Laconia, LLC |
Description: H/S ASS'Y(RD002356)241402B92203G Packaging: Bulk Length: 2.283" (58.00mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.457" (37.00mm) Package Cooled: Quarter Brick DC/DC Converter Attachment Method: Bolt On Thermal Resistance @ Forced Air Flow: 1.80°C/W @ 600 LFM Thermal Resistance @ Natural: 3.90°C/W Fin Height: 0.236" (6.00mm) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
241804B92200G | Boyd Laconia, LLC |
Description: 241804B92200G Packaging: Bulk Length: 2.280" (57.90mm) Shape: Rectangular, Fins Type: Top Mount Width: 0.902" (22.90mm) Package Cooled: Eighth Brick DC/DC Converter Attachment Method: Bolt On Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 600 LFM Thermal Resistance @ Natural: 3.60°C/W Fin Height: 0.449" (11.40mm) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
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311505B00000G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Diameter: 0.317" (8.05mm) ID, 0.375" (9.52mm) OD Shape: Cylindrical Type: Board Level Package Cooled: TO-5 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 1.0W @ 70°C Thermal Resistance @ Forced Air Flow: 45.00°C/W @ 200 LFM Thermal Resistance @ Natural: 90.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 336 Stücke: Lieferzeit 10-14 Tag (e) |
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321527B00000G | Boyd Laconia, LLC |
![]() Packaging: Bag Material: Aluminum Diameter: 0.750" (19.05mm) OD Shape: Cylindrical Type: Top Mount Package Cooled: TO-5, TO-39 Attachment Method: Threaded Coupling Power Dissipation @ Temperature Rise: 0.5W @ 20°C Thermal Resistance @ Forced Air Flow: 20.00°C/W @ 300 LFM Thermal Resistance @ Natural: 35.20°C/W Fin Height: 0.290" (7.37mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 641 Stücke: Lieferzeit 10-14 Tag (e) |
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322400B00000G | Boyd Laconia, LLC |
![]() Packaging: Bag Material: Aluminum Diameter: 0.180" (4.57mm) ID, 0.500" (12.70mm) OD Shape: Cylindrical Type: Top Mount Package Cooled: TO-18 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 0.6W @ 60°C Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 500 LFM Thermal Resistance @ Natural: 100.00°C/W Fin Height: 0.235" (5.97mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 5978 Stücke: Lieferzeit 10-14 Tag (e) |
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322505B00000G | Boyd Laconia, LLC |
![]() Packaging: Bag Material: Aluminum Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD Shape: Cylindrical Type: Top Mount Package Cooled: TO-5 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 0.5W @ 30°C Thermal Resistance @ Forced Air Flow: 15.00°C/W @ 400 LFM Thermal Resistance @ Natural: 56.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 6445 Stücke: Lieferzeit 10-14 Tag (e) |
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322605B00000G | Boyd Laconia, LLC |
![]() Packaging: Bag Material: Aluminum Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD Shape: Cylindrical Type: Top Mount Package Cooled: TO-5 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 1.0W @ 60°C Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 200 LFM Thermal Resistance @ Natural: 54.00°C/W Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 773 Stücke: Lieferzeit 10-14 Tag (e) |
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323005B00000G | Boyd Laconia, LLC |
![]() Packaging: Bag Material: Aluminum Diameter: 0.318" (8.07mm) ID, 0.750" (19.05mm) OD Shape: Cylindrical Type: Board Level Package Cooled: TO-5 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 1.4W @ 70°C Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM Thermal Resistance @ Natural: 56.00°C/W Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 565 Stücke: Lieferzeit 10-14 Tag (e) |
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325705B00000G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD Shape: Cylindrical Type: Board Level Package Cooled: TO-5 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 1.0W @ 60°C Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM Thermal Resistance @ Natural: 60.00°C/W Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 961 Stücke: Lieferzeit 10-14 Tag (e) |
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325705R00000G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD Shape: Cylindrical Type: Board Level Package Cooled: TO-5 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 1.0W @ 60°C Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM Thermal Resistance @ Natural: 60.00°C/W Fin Height: 0.250" (6.35mm) Material Finish: Red Anodized |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
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326005B00000G | Boyd Laconia, LLC |
![]() Packaging: Bag Material: Aluminum Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD Shape: Cylindrical Type: Board Level Package Cooled: TO-5 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 1.8W @ 90°C Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 200 LFM Thermal Resistance @ Natural: 57.00°C/W Fin Height: 0.375" (9.52mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1362 Stücke: Lieferzeit 10-14 Tag (e) |
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335214B00032G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Length: 0.984" (25.00mm) Shape: Square, Fins Type: Top Mount Width: 0.984" (25.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM Thermal Resistance @ Natural: 10.00°C/W Fin Height: 0.390" (9.91mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
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335824B00032G | Boyd Laconia, LLC |
Description: PGA,335824B00032G Packaging: Bulk Material: Aluminum Length: 1.180" (29.97mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.180" (29.97mm) Package Cooled: BGA, FPGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.5W @ 50°C Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM Thermal Resistance @ Natural: 29.40°C/W Fin Height: 0.370" (9.40mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
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335824B00034G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Length: 1.180" (29.97mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.180" (29.97mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 2.0W @ 60°C Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM Thermal Resistance @ Natural: 29.40°C/W Fin Height: 0.370" (9.40mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1267 Stücke: Lieferzeit 10-14 Tag (e) |
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342941 | Boyd Laconia, LLC |
![]() Packaging: Tray Material: Copper Length: 1.594" (40.50mm) Shape: Square, Fins Type: Top Mount, Skived Width: 1.575" (40.00mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM Thermal Resistance @ Natural: 13.30°C/W Fin Height: 0.531" (13.50mm) Material Finish: AavSHIELD 3C |
auf Bestellung 143 Stücke: Lieferzeit 10-14 Tag (e) |
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342947 | Boyd Laconia, LLC |
![]() Packaging: Tray Material: Copper Length: 2.323" (59.00mm) Shape: Rectangular, Fins Type: Top Mount, Skived Width: 2.280" (57.91mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM Thermal Resistance @ Natural: 7.70°C/W Fin Height: 0.433" (11.00mm) Material Finish: AavSHIELD 3C |
Produkt ist nicht verfügbar |
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342948 | Boyd Laconia, LLC |
![]() Packaging: Tray Material: Copper Length: 2.717" (69.00mm) Shape: Square, Fins Type: Top Mount, Skived Width: 2.756" (70.00mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM Thermal Resistance @ Natural: 5.60°C/W Fin Height: 0.551" (14.00mm) Material Finish: AavSHIELD 3C Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
100000F00000G |
Hersteller: Boyd Laconia, LLC
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 1 gram Ampule
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 1 gram Ampule
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
100100F00000G |
Hersteller: Boyd Laconia, LLC
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 1.25 oz Syringe
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 1.25 oz Syringe
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
100500F00000G |
Hersteller: Boyd Laconia, LLC
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 5 oz Tube
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 5 oz Tube
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
100800F00000G |
Hersteller: Boyd Laconia, LLC
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 8 oz Can
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 8 oz Can
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
101600F00000G |
Hersteller: Boyd Laconia, LLC
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 16 oz Jar
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 16 oz Jar
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
103900F00000G |
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Hersteller: Boyd Laconia, LLC
Description: 12 OZ. SEMCO CARTRIDGE GREASE NO
Packaging: Dispenser
Color: White
Size / Dimension: 12 oz Cartridge
Type: Non-Silicone Grease
Thermal Conductivity: 1.40W/m-K
Part Status: Active
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 356°F (-40°C ~ 180°C)
Description: 12 OZ. SEMCO CARTRIDGE GREASE NO
Packaging: Dispenser
Color: White
Size / Dimension: 12 oz Cartridge
Type: Non-Silicone Grease
Thermal Conductivity: 1.40W/m-K
Part Status: Active
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 356°F (-40°C ~ 180°C)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
10-6326-28G |
Hersteller: Boyd Laconia, LLC
Description: 10-6326-28G
Packaging: Bulk
Material: Aluminum
Length: 1.102" (28.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.102" (28.00mm)
Package Cooled: BGA
Attachment Method: Push Pin, Thermal Material
Thermal Resistance @ Forced Air Flow: 13.13°C/W @ 200 LFM
Thermal Resistance @ Natural: 44.10°C/W
Fin Height: 0.236" (6.00mm)
Material Finish: Black Anodized
Description: 10-6326-28G
Packaging: Bulk
Material: Aluminum
Length: 1.102" (28.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.102" (28.00mm)
Package Cooled: BGA
Attachment Method: Push Pin, Thermal Material
Thermal Resistance @ Forced Air Flow: 13.13°C/W @ 200 LFM
Thermal Resistance @ Natural: 44.10°C/W
Fin Height: 0.236" (6.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
10-6327-01,MOD EARS |
Hersteller: Boyd Laconia, LLC
Description: 10-6327-01 MOD EARS,REV 00,00,04
Packaging: Bulk
Material: Aluminum
Length: 1.122" (28.50mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.122" (28.50mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 9.26°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Description: 10-6327-01 MOD EARS,REV 00,00,04
Packaging: Bulk
Material: Aluminum
Length: 1.122" (28.50mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.122" (28.50mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 9.26°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
10-6327-01G |
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/PUSH PINS
Packaging: Bulk
Material: Aluminum
Length: 1.122" (28.50mm)
Shape: Square
Type: Top Mount
Width: 1.122" (28.50mm)
Package Cooled: BGA
Attachment Method: Push Pin
Power Dissipation @ Temperature Rise: 2.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Description: HEATSINK BGA W/PUSH PINS
Packaging: Bulk
Material: Aluminum
Length: 1.122" (28.50mm)
Shape: Square
Type: Top Mount
Width: 1.122" (28.50mm)
Package Cooled: BGA
Attachment Method: Push Pin
Power Dissipation @ Temperature Rise: 2.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
10-6327-01G + T725 PAD |
Hersteller: Boyd Laconia, LLC
Description: 10-6327-01G + T725 PAD
Packaging: Bulk
Material: Aluminum
Length: 1.122" (28.50mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.122" (28.50mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Description: 10-6327-01G + T725 PAD
Packaging: Bulk
Material: Aluminum
Length: 1.122" (28.50mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.122" (28.50mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
115000F00000G |
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Hersteller: Boyd Laconia, LLC
Description: STANDARD CLIP CODE 50
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
Description: STANDARD CLIP CODE 50
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
auf Bestellung 11722 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
24+ | 0.74 EUR |
26+ | 0.70 EUR |
27+ | 0.67 EUR |
50+ | 0.65 EUR |
100+ | 0.64 EUR |
250+ | 0.60 EUR |
500+ | 0.56 EUR |
2500+ | 0.51 EUR |
5000+ | 0.49 EUR |
115300F00000G |
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Hersteller: Boyd Laconia, LLC
Description: STANDARD CLIP CODE 53
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
Description: STANDARD CLIP CODE 53
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
auf Bestellung 19482 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
35+ | 0.51 EUR |
40+ | 0.44 EUR |
42+ | 0.42 EUR |
50+ | 0.41 EUR |
100+ | 0.39 EUR |
250+ | 0.37 EUR |
500+ | 0.36 EUR |
2500+ | 0.33 EUR |
5000+ | 0.32 EUR |
11-5602-51 |
Hersteller: Boyd Laconia, LLC
Description: 11-5602-51 REV F
Packaging: Bulk
Material: Brass
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Natural: 3.70°C/W
Fin Height: 0.453" (11.50mm)
Material Finish: Black Anodized
Description: 11-5602-51 REV F
Packaging: Bulk
Material: Brass
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Natural: 3.70°C/W
Fin Height: 0.453" (11.50mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
116200F00000G |
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Hersteller: Boyd Laconia, LLC
Description: STANDARD CLIP CODE 62
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
Description: STANDARD CLIP CODE 62
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
auf Bestellung 6257 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
23+ | 0.77 EUR |
26+ | 0.69 EUR |
27+ | 0.66 EUR |
50+ | 0.64 EUR |
100+ | 0.61 EUR |
250+ | 0.59 EUR |
500+ | 0.56 EUR |
1000+ | 0.54 EUR |
5000+ | 0.50 EUR |
118300F00000G |
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Hersteller: Boyd Laconia, LLC
Description: STANDARD CLIP CODE 83
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
Description: STANDARD CLIP CODE 83
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
auf Bestellung 17280 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
18+ | 0.99 EUR |
20+ | 0.88 EUR |
25+ | 0.84 EUR |
50+ | 0.81 EUR |
100+ | 0.78 EUR |
250+ | 0.74 EUR |
500+ | 0.71 EUR |
2500+ | 0.66 EUR |
5000+ | 0.63 EUR |
125700D00000G |
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Hersteller: Boyd Laconia, LLC
Description: SOLDER ANCHOR FOR BGA HEATSINKS
Packaging: Bulk
For Use With/Related Products: BGA Heat Sinks
Accessory Type: Solder Anchor (2 required)
Part Status: Active
Description: SOLDER ANCHOR FOR BGA HEATSINKS
Packaging: Bulk
For Use With/Related Products: BGA Heat Sinks
Accessory Type: Solder Anchor (2 required)
Part Status: Active
auf Bestellung 58265 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
16+ | 1.11 EUR |
18+ | 0.99 EUR |
25+ | 0.94 EUR |
50+ | 0.91 EUR |
100+ | 0.88 EUR |
250+ | 0.83 EUR |
500+ | 0.80 EUR |
1000+ | 0.78 EUR |
5000+ | 0.71 EUR |
125800D00000G |
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Hersteller: Boyd Laconia, LLC
Description: SOLDER ANCHOR FOR BGA HEATSINKS
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Solder Anchor (2 required)
Part Status: Active
Description: SOLDER ANCHOR FOR BGA HEATSINKS
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Solder Anchor (2 required)
Part Status: Active
auf Bestellung 39946 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
38+ | 0.48 EUR |
42+ | 0.42 EUR |
45+ | 0.40 EUR |
50+ | 0.39 EUR |
100+ | 0.37 EUR |
250+ | 0.35 EUR |
500+ | 0.34 EUR |
1000+ | 0.33 EUR |
5000+ | 0.30 EUR |
188623F00000G |
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 40.46X27.94MM GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Shape: Rhombus
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Thermal Resistivity: 0.40°C/W
Usage: TO-3
Outline: 40.46mm x 27.94mm
Part Status: Active
Description: THERM PAD 40.46X27.94MM GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Shape: Rhombus
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Thermal Resistivity: 0.40°C/W
Usage: TO-3
Outline: 40.46mm x 27.94mm
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
188635F00000G |
Hersteller: Boyd Laconia, LLC
Description: THERM PAD HEATSINK GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Type: Pad, Sheet
Usage: TO-218, TO-220, TO-247
Description: THERM PAD HEATSINK GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Type: Pad, Sheet
Usage: TO-218, TO-220, TO-247
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
188651F00000G |
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 17.45MMX14.27MM GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Thermal Resistivity: 1.40°C/W, 0.93°C/W
Usage: TO-218, TO-220, TO-247
Outline: 17.45mm x 14.27mm
Part Status: Active
Description: THERM PAD 17.45MMX14.27MM GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Thermal Resistivity: 1.40°C/W, 0.93°C/W
Usage: TO-218, TO-220, TO-247
Outline: 17.45mm x 14.27mm
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
188854F00000G |
Hersteller: Boyd Laconia, LLC
Description: THERM PAD HEATSINK GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Type: Pad, Sheet
Usage: TO-218, TO-220, TO-247
Description: THERM PAD HEATSINK GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Type: Pad, Sheet
Usage: TO-218, TO-220, TO-247
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
188858F00000G |
Hersteller: Boyd Laconia, LLC
Description: THERM PAD HEATSINK GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Type: Pad, Sheet
Usage: TO-218, TO-220, TO-247
Description: THERM PAD HEATSINK GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Type: Pad, Sheet
Usage: TO-218, TO-220, TO-247
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
188961F00000 |
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 19.05MMX10.41MM GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Shape: Rectangular
Thickness: 0.0090" (0.229mm)
Type: Pad, Sheet
Thermal Resistivity: 1.50°C/W, 1.16°C/W
Usage: TO-218, TO-220, TO-247
Outline: 19.05mm x 10.41mm
Part Status: Active
Description: THERM PAD 19.05MMX10.41MM GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Shape: Rectangular
Thickness: 0.0090" (0.229mm)
Type: Pad, Sheet
Thermal Resistivity: 1.50°C/W, 1.16°C/W
Usage: TO-218, TO-220, TO-247
Outline: 19.05mm x 10.41mm
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
189990F00000 |
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 21.84MMX18.8MM W/ADH
Packaging: Bulk
Color: Gray
Material: Silicone
Shape: Rectangular
Thickness: 0.0090" (0.229mm)
Type: Pad, Sheet
Thermal Resistivity: 1.50°C/W, 1.16°C/W
Usage: TO-218, TO-220, TO-247
Outline: 21.84mm x 18.80mm
Adhesive: Adhesive - One Side
Description: THERM PAD 21.84MMX18.8MM W/ADH
Packaging: Bulk
Color: Gray
Material: Silicone
Shape: Rectangular
Thickness: 0.0090" (0.229mm)
Type: Pad, Sheet
Thermal Resistivity: 1.50°C/W, 1.16°C/W
Usage: TO-218, TO-220, TO-247
Outline: 21.84mm x 18.80mm
Adhesive: Adhesive - One Side
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
2288BG |
Hersteller: Boyd Laconia, LLC
Description: 2288BG
Packaging: Bulk
Diameter: 0.300" (7.62mm) ID, 1.000" (25.40mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
Description: 2288BG
Packaging: Bulk
Diameter: 0.300" (7.62mm) ID, 1.000" (25.40mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
2327B-TACHG |
Hersteller: Boyd Laconia, LLC
Description: THM,2327B-TACHG
Packaging: Bulk
Material: Aluminum
Length: 1.105" (28.07mm)
Shape: Rectangular, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Fin Height: 0.600" (15.24mm)
Material Finish: Black Anodized
Description: THM,2327B-TACHG
Packaging: Bulk
Material: Aluminum
Length: 1.105" (28.07mm)
Shape: Rectangular, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Fin Height: 0.600" (15.24mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
241402B92203G |
Hersteller: Boyd Laconia, LLC
Description: H/S ASS'Y(RD002356)241402B92203G
Packaging: Bulk
Length: 2.283" (58.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.457" (37.00mm)
Package Cooled: Quarter Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 1.80°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.90°C/W
Fin Height: 0.236" (6.00mm)
Description: H/S ASS'Y(RD002356)241402B92203G
Packaging: Bulk
Length: 2.283" (58.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.457" (37.00mm)
Package Cooled: Quarter Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 1.80°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.90°C/W
Fin Height: 0.236" (6.00mm)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
241804B92200G |
Hersteller: Boyd Laconia, LLC
Description: 241804B92200G
Packaging: Bulk
Length: 2.280" (57.90mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.902" (22.90mm)
Package Cooled: Eighth Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.60°C/W
Fin Height: 0.449" (11.40mm)
Description: 241804B92200G
Packaging: Bulk
Length: 2.280" (57.90mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.902" (22.90mm)
Package Cooled: Eighth Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.60°C/W
Fin Height: 0.449" (11.40mm)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
311505B00000G |
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Hersteller: Boyd Laconia, LLC
Description: TO-5 PUSH-ON HEATSINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.317" (8.05mm) ID, 0.375" (9.52mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 70°C
Thermal Resistance @ Forced Air Flow: 45.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 90.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Black Anodized
Part Status: Active
Description: TO-5 PUSH-ON HEATSINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.317" (8.05mm) ID, 0.375" (9.52mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 70°C
Thermal Resistance @ Forced Air Flow: 45.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 90.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 336 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
5+ | 4.00 EUR |
10+ | 3.88 EUR |
25+ | 3.77 EUR |
50+ | 3.56 EUR |
100+ | 3.35 EUR |
250+ | 3.14 EUR |
321527B00000G |
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Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-5 2W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5, TO-39
Attachment Method: Threaded Coupling
Power Dissipation @ Temperature Rise: 0.5W @ 20°C
Thermal Resistance @ Forced Air Flow: 20.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 35.20°C/W
Fin Height: 0.290" (7.37mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-5 2W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5, TO-39
Attachment Method: Threaded Coupling
Power Dissipation @ Temperature Rise: 0.5W @ 20°C
Thermal Resistance @ Forced Air Flow: 20.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 35.20°C/W
Fin Height: 0.290" (7.37mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 641 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 35.29 EUR |
10+ | 31.22 EUR |
25+ | 29.74 EUR |
50+ | 28.66 EUR |
100+ | 27.62 EUR |
250+ | 26.31 EUR |
322400B00000G |
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Hersteller: Boyd Laconia, LLC
Description: HEAT SINK TO-18 1W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.180" (4.57mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-18
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.6W @ 60°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 100.00°C/W
Fin Height: 0.235" (5.97mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK TO-18 1W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.180" (4.57mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-18
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.6W @ 60°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 100.00°C/W
Fin Height: 0.235" (5.97mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 5978 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 10.77 EUR |
10+ | 9.53 EUR |
25+ | 9.08 EUR |
50+ | 8.75 EUR |
100+ | 8.43 EUR |
250+ | 8.03 EUR |
500+ | 7.74 EUR |
1000+ | 7.46 EUR |
322505B00000G |
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Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-5 .4" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.5W @ 30°C
Thermal Resistance @ Forced Air Flow: 15.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 56.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-5 .4" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.5W @ 30°C
Thermal Resistance @ Forced Air Flow: 15.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 56.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 6445 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
5+ | 3.71 EUR |
10+ | 3.31 EUR |
25+ | 3.15 EUR |
50+ | 3.04 EUR |
100+ | 2.93 EUR |
250+ | 2.86 EUR |
322605B00000G |
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Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-5 1.25W H=.25" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 54.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-5 1.25W H=.25" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 54.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 773 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 5.32 EUR |
10+ | 4.70 EUR |
25+ | 4.48 EUR |
50+ | 4.32 EUR |
100+ | 4.16 EUR |
250+ | 3.96 EUR |
500+ | 3.82 EUR |
323005B00000G |
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Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-5 2W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.4W @ 70°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 56.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-5 2W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.4W @ 70°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 56.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 565 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 7.87 EUR |
10+ | 6.96 EUR |
25+ | 6.63 EUR |
50+ | 6.39 EUR |
100+ | 6.16 EUR |
250+ | 5.87 EUR |
500+ | 5.65 EUR |
325705B00000G |
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Hersteller: Boyd Laconia, LLC
Description: TO-5 PUSH-ON HEATSINK 6.35MM
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
Description: TO-5 PUSH-ON HEATSINK 6.35MM
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 961 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
5+ | 3.78 EUR |
10+ | 3.36 EUR |
25+ | 3.20 EUR |
50+ | 3.09 EUR |
100+ | 2.98 EUR |
250+ | 2.84 EUR |
500+ | 2.74 EUR |
325705R00000G |
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Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Red Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Red Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
326005B00000G |
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Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-5 1W H=.375" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.8W @ 90°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 57.00°C/W
Fin Height: 0.375" (9.52mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-5 1W H=.375" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.8W @ 90°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 57.00°C/W
Fin Height: 0.375" (9.52mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1362 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 5.65 EUR |
10+ | 5.00 EUR |
25+ | 4.76 EUR |
50+ | 4.59 EUR |
100+ | 4.43 EUR |
250+ | 4.22 EUR |
500+ | 4.06 EUR |
1000+ | 3.92 EUR |
335214B00032G |
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Hersteller: Boyd Laconia, LLC
Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.984" (25.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.00°C/W
Fin Height: 0.390" (9.91mm)
Material Finish: Black Anodized
Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.984" (25.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.00°C/W
Fin Height: 0.390" (9.91mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
335824B00032G |
Hersteller: Boyd Laconia, LLC
Description: PGA,335824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Description: PGA,335824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
335824B00034G |
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Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1267 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 14.61 EUR |
10+ | 14.22 EUR |
672+ | 10.27 EUR |
342941 |
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Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 40X40.5X13.5MM
Packaging: Tray
Material: Copper
Length: 1.594" (40.50mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.30°C/W
Fin Height: 0.531" (13.50mm)
Material Finish: AavSHIELD 3C
Description: COPPER HEATSINK 40X40.5X13.5MM
Packaging: Tray
Material: Copper
Length: 1.594" (40.50mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.30°C/W
Fin Height: 0.531" (13.50mm)
Material Finish: AavSHIELD 3C
auf Bestellung 143 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 59.49 EUR |
10+ | 52.78 EUR |
25+ | 50.32 EUR |
40+ | 49.10 EUR |
80+ | 47.36 EUR |
342947 |
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Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 57.9X59X11MM
Packaging: Tray
Material: Copper
Length: 2.323" (59.00mm)
Shape: Rectangular, Fins
Type: Top Mount, Skived
Width: 2.280" (57.91mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.70°C/W
Fin Height: 0.433" (11.00mm)
Material Finish: AavSHIELD 3C
Description: COPPER HEATSINK 57.9X59X11MM
Packaging: Tray
Material: Copper
Length: 2.323" (59.00mm)
Shape: Rectangular, Fins
Type: Top Mount, Skived
Width: 2.280" (57.91mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.70°C/W
Fin Height: 0.433" (11.00mm)
Material Finish: AavSHIELD 3C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
342948 |
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Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 70X69X14MM
Packaging: Tray
Material: Copper
Length: 2.717" (69.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.756" (70.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.60°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
Description: COPPER HEATSINK 70X69X14MM
Packaging: Tray
Material: Copper
Length: 2.717" (69.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.756" (70.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.60°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH