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189990F00000 Boyd Laconia, LLC Description: THERM PAD 21.84MMX18.8MM W/ADH
Packaging: Bulk
Color: Gray
Material: Silicone
Shape: Rectangular
Thickness: 0.0090" (0.229mm)
Type: Pad, Sheet
Thermal Resistivity: 1.50°C/W, 1.16°C/W
Usage: TO-218, TO-220, TO-247
Outline: 21.84mm x 18.80mm
Adhesive: Adhesive - One Side
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2000346-001 REV A Boyd Laconia, LLC Description: 2000346-001 REV A
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2288BG Boyd Laconia, LLC Description: 2288BG
Packaging: Bulk
Diameter: 0.300" (7.62mm) ID, 1.000" (25.40mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2292B Boyd Laconia, LLC Description: THM,17368B REV C-G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2327B-TACHG Boyd Laconia, LLC Description: THM,2327B-TACHG
Packaging: Bulk
Material: Aluminum
Length: 1.105" (28.07mm)
Shape: Rectangular, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Fin Height: 0.600" (15.24mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2327B W/3M 8815 TAPE Boyd Laconia, LLC Description: THM,2327B W/3M 8815 TAPE
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2341BG Boyd Laconia, LLC Description: 2341BG
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2342BG Boyd Laconia, LLC Description: THM,18917B REV H
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
241402B92203G Boyd Laconia, LLC Description: H/S ASS'Y(RD002356)241402B92203G
Packaging: Bulk
Length: 2.283" (58.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.457" (37.00mm)
Package Cooled: Quarter Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 1.80°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.90°C/W
Fin Height: 0.236" (6.00mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
241804B92200G Boyd Laconia, LLC Description: 241804B92200G
Packaging: Bulk
Length: 2.280" (57.90mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.902" (22.90mm)
Package Cooled: Eighth Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.60°C/W
Fin Height: 0.449" (11.40mm)
Produkt ist nicht verfügbar
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250G 250G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: THERMALCOTE GREASE TUBE 2OZ
Packaging: Bulk
Color: White
Size / Dimension: 2 oz Tube
Type: Silicone Compound
Thermal Conductivity: 0.76W/m-K
Shelf Life: Indefinite (Unopened)
Usable Temperature Range: -40°F ~ 399°F (-40°C ~ 204°C)
auf Bestellung 823 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.15 EUR
10+17.84 EUR
25+17 EUR
50+16.38 EUR
100+15.79 EUR
250+15.04 EUR
500+14.49 EUR
Im Einkaufswagen  Stück im Wert von  UAH
311505B00000G 311505B00000G Boyd Laconia, LLC 3100.pdf Description: TO-5 PUSH-ON HEATSINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.317" (8.05mm) ID, 0.375" (9.52mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 70°C
Thermal Resistance @ Forced Air Flow: 45.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 90.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1980 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.36 EUR
10+3.86 EUR
25+3.68 EUR
50+3.54 EUR
100+3.42 EUR
250+3.25 EUR
500+3.14 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
321527B00000G 321527B00000G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK TO-5 2W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5, TO-39
Attachment Method: Threaded Coupling
Power Dissipation @ Temperature Rise: 0.5W @ 20°C
Thermal Resistance @ Forced Air Flow: 20.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 35.20°C/W
Fin Height: 0.290" (7.37mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)
1+31.84 EUR
10+28.17 EUR
25+26.83 EUR
50+25.86 EUR
100+24.92 EUR
Im Einkaufswagen  Stück im Wert von  UAH
322400B00000G 322400B00000G Boyd Laconia, LLC Aavid3200.pdf Description: HEAT SINK TO-18 1W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.180" (4.57mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-18
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.6W @ 60°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 100.00°C/W
Fin Height: 0.235" (5.97mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 4459 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.7 EUR
10+8.58 EUR
25+8.17 EUR
50+7.88 EUR
100+7.59 EUR
250+7.23 EUR
500+6.97 EUR
1000+6.71 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
322505B00000G 322505B00000G Boyd Laconia, LLC Aavid3200.pdf Description: HEATSINK TO-5 .4" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.5W @ 30°C
Thermal Resistance @ Forced Air Flow: 15.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 56.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 5835 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.14 EUR
10+3.67 EUR
25+3.5 EUR
50+3.37 EUR
100+3.25 EUR
250+3.09 EUR
500+2.98 EUR
2000+2.77 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
322605B00000G 322605B00000G Boyd Laconia, LLC Aavid3200.pdf Description: HEATSINK TO-5 1.25W H=.25" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 54.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1373 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.18 EUR
10+5.47 EUR
25+5.21 EUR
50+5.02 EUR
100+4.84 EUR
250+4.61 EUR
500+4.44 EUR
1000+4.28 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
323005B00000G 323005B00000G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK TO-5 2W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.4W @ 70°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 56.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 562 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.85 EUR
10+6.94 EUR
25+6.61 EUR
50+6.38 EUR
100+6.15 EUR
250+5.85 EUR
500+5.64 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
325705B00000G 325705B00000G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: TO-5 PUSH-ON HEATSINK 6.35MM
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2371 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.52 EUR
10+3.11 EUR
25+2.96 EUR
50+2.85 EUR
100+2.75 EUR
250+2.62 EUR
500+2.53 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
325705R00000G Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Red Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
326005B00000G 326005B00000G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK TO-5 1W H=.375" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.8W @ 90°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 57.00°C/W
Fin Height: 0.375" (9.52mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 962 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.98 EUR
10+4.41 EUR
25+4.2 EUR
50+4.05 EUR
100+3.9 EUR
250+3.72 EUR
500+3.58 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
335214B00032G Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.984" (25.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.00°C/W
Fin Height: 0.390" (9.91mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
335824B00032G Boyd Laconia, LLC Description: PGA,335824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
335824B00034G 335824B00034G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 803 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.89 EUR
10+12.29 EUR
25+11.71 EUR
50+11.29 EUR
100+10.88 EUR
250+10.36 EUR
672+9.83 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
342941 342941 Boyd Laconia, LLC Board_Level_Cooling_Square_Skived_Fin-3044617.pdf Description: COPPER HEATSINK 40X40.5X13.5MM
Packaging: Tray
Material: Copper
Length: 1.594" (40.50mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.30°C/W
Fin Height: 0.531" (13.50mm)
Material Finish: AavSHIELD 3C
auf Bestellung 143 Stücke:
Lieferzeit 10-14 Tag (e)
1+59.49 EUR
10+52.78 EUR
25+50.32 EUR
40+49.1 EUR
80+47.36 EUR
Im Einkaufswagen  Stück im Wert von  UAH
342945 342945 Boyd Laconia, LLC Board-Level-Cooling-Square-Skived-Fin.pdf Description: COPPER HEATSINK 60X60X14MM
Packaging: Tray
Material: Copper
Length: 2.362" (60.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.362" (60.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.00°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342947 342947 Boyd Laconia, LLC Board-Level-Cooling-Square-Skived-Fin.pdf Description: COPPER HEATSINK 57.9X59X11MM
Packaging: Tray
Material: Copper
Length: 2.323" (59.00mm)
Shape: Rectangular, Fins
Type: Top Mount, Skived
Width: 2.280" (57.91mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.70°C/W
Fin Height: 0.433" (11.00mm)
Material Finish: AavSHIELD 3C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342948 342948 Boyd Laconia, LLC Board-Level-Cooling-Square-Skived-Fin.pdf Description: COPPER HEATSINK 70X69X14MM
Packaging: Tray
Material: Copper
Length: 2.717" (69.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.756" (70.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.60°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342948-copper skivfin Boyd Laconia, LLC Description: 342948,REV03(GP)
Packaging: Bulk
Material: Copper
Length: 2.717" (69.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 2.756" (70.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.551" (14.00mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342949 342949 Boyd Laconia, LLC Boyd-Board-Level-Cooling-Square-Skived-Fin.pdf Description: COPPER HEATSINK 80X80X12MM
Packaging: Tray
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.150" (80.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.10°C/W
Fin Height: 0.472" (12.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)
1+79.34 EUR
10+70.2 EUR
25+68.76 EUR
Im Einkaufswagen  Stück im Wert von  UAH
342949-copper skivfin Boyd Laconia, LLC Description: 342949
Packaging: Bulk
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Board Level
Width: 3.150" (80.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.472" (12.00mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342950 342950 Boyd Laconia, LLC Board-Level-Cooling-Square-Skived-Fin.pdf Description: COPPER HEATSINK 90X90X10MM
Packaging: Tray
Material: Copper
Length: 3.543" (90.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.543" (90.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: AavSHIELD 3C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
371824B00032G 371824B00032G Boyd Laconia, LLC 371824B00034G%20Side.jpg Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.275" (7.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1215 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.66 EUR
10+8.44 EUR
25+8.25 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
371924B00032G Boyd Laconia, LLC Description: 371924B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
372924M02000G( 10-5597-02G ) Boyd Laconia, LLC Description: 372924M02000G( 10-5597-02G )
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
373324M00000G 373324M00000G Boyd Laconia, LLC Board-Level-Cooling-3733.pdf Description: HEATSINK BGA W/OUT AD-TAPE
Packaging: Box
Material: Aluminum
Length: 1.472" (37.39mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.472" (37.39mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Fin Height: 0.236" (6.00mm)
Material Finish: Green Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374024B00035G 374024B00035G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA 23X23X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 11.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 40.00°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 3239 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.06 EUR
10+2.72 EUR
25+2.59 EUR
50+2.49 EUR
100+2.41 EUR
480+2.21 EUR
960+2.13 EUR
1440+2.09 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
374024B60023G Boyd Laconia, LLC Description: 374024B60023G
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Thermal Resistance @ Forced Air Flow: 11.69°C/W @ 200 LFM
Thermal Resistance @ Natural: 40.00°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374024B60024G-MOD W/STAB PAD Boyd Laconia, LLC Description: 374024B60024G-MOD W/STAB PAD
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374124B00035G 374124B00035G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 7.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2849 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.08 EUR
10+2.73 EUR
25+2.6 EUR
50+2.5 EUR
100+2.41 EUR
250+2.3 EUR
560+2.2 EUR
1120+2.12 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
374124B60023G Boyd Laconia, LLC Description: 374124B60023G
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 7.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374224B60023G 374224B60023G Boyd Laconia, LLC Board-Level-Cooling-3742.pdf Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 19.70°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374324B00032G Boyd Laconia, LLC Description: 374324B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 9.35°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374324B00035G 374324B00035G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Box
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 90°C
Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1657 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.89 EUR
10+3.43 EUR
25+3.27 EUR
50+3.15 EUR
100+3.03 EUR
250+2.89 EUR
756+2.72 EUR
1512+2.63 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
374324B60023G 374324B60023G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2325 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.39 EUR
10+4.78 EUR
25+4.55 EUR
50+4.39 EUR
216+4.06 EUR
432+3.91 EUR
648+3.83 EUR
1080+3.73 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
374424B00035G 374424B00035G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1712 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.72 EUR
10+4.17 EUR
25+3.98 EUR
50+3.83 EUR
100+3.69 EUR
250+3.52 EUR
567+3.37 EUR
1134+3.25 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
374424B60023G Boyd Laconia, LLC Description: 374424B60023G
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374524B00000G Boyd Laconia, LLC Description: 374524B00000G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374524B60023G 374524B60023G Boyd Laconia, LLC Board-Level-Cooling-3745.pdf Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 16.50°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374624B00000G W/3M8810 Boyd Laconia, LLC Description: 374624B00000G W/3M8810
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374624B00032G 374624B00032G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA 35X35X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1060 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.58 EUR
10+4.94 EUR
25+4.7 EUR
50+4.53 EUR
100+4.37 EUR
250+4.16 EUR
510+4 EUR
1020+3.86 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
374724B00032G 374724B00032G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 872 Stücke:
Lieferzeit 10-14 Tag (e)
3+5.95 EUR
10+5.26 EUR
25+5.01 EUR
50+4.83 EUR
100+4.66 EUR
250+4.43 EUR
672+4.21 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
374724B00035G 374724B00035G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA 35X35X18MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1423 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.46 EUR
10+5.72 EUR
25+5.45 EUR
50+5.25 EUR
100+5.06 EUR
250+4.82 EUR
672+4.57 EUR
1344+4.41 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
374724B60024G 374724B60024G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 859 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.03 EUR
10+8 EUR
25+7.62 EUR
50+7.34 EUR
168+6.9 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
374824B00000G Boyd Laconia, LLC Description: 374824B00000G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374824B00032G Boyd Laconia, LLC Description: 374824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374824B60024G 374824B60024G Boyd Laconia, LLC Board-Level-Cooling-3748.pdf Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 3.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374924B00032G 374924B00032G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1114 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.6 EUR
10+6.73 EUR
25+6.41 EUR
50+6.18 EUR
240+5.68 EUR
480+5.48 EUR
720+5.36 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
3749350-PAM04010-P0 Boyd Laconia, LLC Description: 3749350-PAM04010-P0
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
375024B00032G 375024B00032G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 569 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.74 EUR
10+5.09 EUR
25+4.85 EUR
50+4.67 EUR
100+4.51 EUR
450+4.16 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
375124B60024G 375124B60024G Boyd Laconia, LLC Board-Level-Cooling-3751.pdf Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 8.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.30°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
189990F00000
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 21.84MMX18.8MM W/ADH
Packaging: Bulk
Color: Gray
Material: Silicone
Shape: Rectangular
Thickness: 0.0090" (0.229mm)
Type: Pad, Sheet
Thermal Resistivity: 1.50°C/W, 1.16°C/W
Usage: TO-218, TO-220, TO-247
Outline: 21.84mm x 18.80mm
Adhesive: Adhesive - One Side
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2000346-001 REV A
Hersteller: Boyd Laconia, LLC
Description: 2000346-001 REV A
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2288BG
Hersteller: Boyd Laconia, LLC
Description: 2288BG
Packaging: Bulk
Diameter: 0.300" (7.62mm) ID, 1.000" (25.40mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2292B
Hersteller: Boyd Laconia, LLC
Description: THM,17368B REV C-G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2327B-TACHG
Hersteller: Boyd Laconia, LLC
Description: THM,2327B-TACHG
Packaging: Bulk
Material: Aluminum
Length: 1.105" (28.07mm)
Shape: Rectangular, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Fin Height: 0.600" (15.24mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2327B W/3M 8815 TAPE
Hersteller: Boyd Laconia, LLC
Description: THM,2327B W/3M 8815 TAPE
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2341BG
Hersteller: Boyd Laconia, LLC
Description: 2341BG
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2342BG
Hersteller: Boyd Laconia, LLC
Description: THM,18917B REV H
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
241402B92203G
Hersteller: Boyd Laconia, LLC
Description: H/S ASS'Y(RD002356)241402B92203G
Packaging: Bulk
Length: 2.283" (58.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.457" (37.00mm)
Package Cooled: Quarter Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 1.80°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.90°C/W
Fin Height: 0.236" (6.00mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
241804B92200G
Hersteller: Boyd Laconia, LLC
Description: 241804B92200G
Packaging: Bulk
Length: 2.280" (57.90mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.902" (22.90mm)
Package Cooled: Eighth Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.60°C/W
Fin Height: 0.449" (11.40mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
250G Boyd-Board-Level-Heatsinks-Catalog.pdf
250G
Hersteller: Boyd Laconia, LLC
Description: THERMALCOTE GREASE TUBE 2OZ
Packaging: Bulk
Color: White
Size / Dimension: 2 oz Tube
Type: Silicone Compound
Thermal Conductivity: 0.76W/m-K
Shelf Life: Indefinite (Unopened)
Usable Temperature Range: -40°F ~ 399°F (-40°C ~ 204°C)
auf Bestellung 823 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.15 EUR
10+17.84 EUR
25+17 EUR
50+16.38 EUR
100+15.79 EUR
250+15.04 EUR
500+14.49 EUR
Im Einkaufswagen  Stück im Wert von  UAH
311505B00000G 3100.pdf
311505B00000G
Hersteller: Boyd Laconia, LLC
Description: TO-5 PUSH-ON HEATSINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.317" (8.05mm) ID, 0.375" (9.52mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 70°C
Thermal Resistance @ Forced Air Flow: 45.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 90.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1980 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+4.36 EUR
10+3.86 EUR
25+3.68 EUR
50+3.54 EUR
100+3.42 EUR
250+3.25 EUR
500+3.14 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
321527B00000G Board-Level-Heatsinks_Cat.pdf
321527B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-5 2W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5, TO-39
Attachment Method: Threaded Coupling
Power Dissipation @ Temperature Rise: 0.5W @ 20°C
Thermal Resistance @ Forced Air Flow: 20.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 35.20°C/W
Fin Height: 0.290" (7.37mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+31.84 EUR
10+28.17 EUR
25+26.83 EUR
50+25.86 EUR
100+24.92 EUR
Im Einkaufswagen  Stück im Wert von  UAH
322400B00000G Aavid3200.pdf
322400B00000G
Hersteller: Boyd Laconia, LLC
Description: HEAT SINK TO-18 1W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.180" (4.57mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-18
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.6W @ 60°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 100.00°C/W
Fin Height: 0.235" (5.97mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 4459 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.7 EUR
10+8.58 EUR
25+8.17 EUR
50+7.88 EUR
100+7.59 EUR
250+7.23 EUR
500+6.97 EUR
1000+6.71 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
322505B00000G Aavid3200.pdf
322505B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-5 .4" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.5W @ 30°C
Thermal Resistance @ Forced Air Flow: 15.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 56.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 5835 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+4.14 EUR
10+3.67 EUR
25+3.5 EUR
50+3.37 EUR
100+3.25 EUR
250+3.09 EUR
500+2.98 EUR
2000+2.77 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
322605B00000G Aavid3200.pdf
322605B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-5 1.25W H=.25" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 54.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1373 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.18 EUR
10+5.47 EUR
25+5.21 EUR
50+5.02 EUR
100+4.84 EUR
250+4.61 EUR
500+4.44 EUR
1000+4.28 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
323005B00000G Boyd-Board-Level-Heatsinks-Catalog.pdf
323005B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-5 2W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.4W @ 70°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 56.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 562 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.85 EUR
10+6.94 EUR
25+6.61 EUR
50+6.38 EUR
100+6.15 EUR
250+5.85 EUR
500+5.64 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
325705B00000G Boyd-Board-Level-Heatsinks-Catalog.pdf
325705B00000G
Hersteller: Boyd Laconia, LLC
Description: TO-5 PUSH-ON HEATSINK 6.35MM
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2371 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.52 EUR
10+3.11 EUR
25+2.96 EUR
50+2.85 EUR
100+2.75 EUR
250+2.62 EUR
500+2.53 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
325705R00000G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Red Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
326005B00000G Boyd-Board-Level-Heatsinks-Catalog.pdf
326005B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-5 1W H=.375" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.8W @ 90°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 57.00°C/W
Fin Height: 0.375" (9.52mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 962 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.98 EUR
10+4.41 EUR
25+4.2 EUR
50+4.05 EUR
100+3.9 EUR
250+3.72 EUR
500+3.58 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
335214B00032G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: Boyd Laconia, LLC
Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.984" (25.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.00°C/W
Fin Height: 0.390" (9.91mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
335824B00032G
Hersteller: Boyd Laconia, LLC
Description: PGA,335824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
335824B00034G Boyd-Board-Level-Heatsinks-Catalog.pdf
335824B00034G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 803 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.89 EUR
10+12.29 EUR
25+11.71 EUR
50+11.29 EUR
100+10.88 EUR
250+10.36 EUR
672+9.83 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
342941 Board_Level_Cooling_Square_Skived_Fin-3044617.pdf
342941
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 40X40.5X13.5MM
Packaging: Tray
Material: Copper
Length: 1.594" (40.50mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.30°C/W
Fin Height: 0.531" (13.50mm)
Material Finish: AavSHIELD 3C
auf Bestellung 143 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+59.49 EUR
10+52.78 EUR
25+50.32 EUR
40+49.1 EUR
80+47.36 EUR
Im Einkaufswagen  Stück im Wert von  UAH
342945 Board-Level-Cooling-Square-Skived-Fin.pdf
342945
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 60X60X14MM
Packaging: Tray
Material: Copper
Length: 2.362" (60.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.362" (60.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.00°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342947 Board-Level-Cooling-Square-Skived-Fin.pdf
342947
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 57.9X59X11MM
Packaging: Tray
Material: Copper
Length: 2.323" (59.00mm)
Shape: Rectangular, Fins
Type: Top Mount, Skived
Width: 2.280" (57.91mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.70°C/W
Fin Height: 0.433" (11.00mm)
Material Finish: AavSHIELD 3C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342948 Board-Level-Cooling-Square-Skived-Fin.pdf
342948
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 70X69X14MM
Packaging: Tray
Material: Copper
Length: 2.717" (69.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.756" (70.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.60°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342948-copper skivfin
Hersteller: Boyd Laconia, LLC
Description: 342948,REV03(GP)
Packaging: Bulk
Material: Copper
Length: 2.717" (69.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 2.756" (70.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.551" (14.00mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342949 Boyd-Board-Level-Cooling-Square-Skived-Fin.pdf
342949
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 80X80X12MM
Packaging: Tray
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.150" (80.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.10°C/W
Fin Height: 0.472" (12.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+79.34 EUR
10+70.2 EUR
25+68.76 EUR
Im Einkaufswagen  Stück im Wert von  UAH
342949-copper skivfin
Hersteller: Boyd Laconia, LLC
Description: 342949
Packaging: Bulk
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Board Level
Width: 3.150" (80.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.472" (12.00mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342950 Board-Level-Cooling-Square-Skived-Fin.pdf
342950
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 90X90X10MM
Packaging: Tray
Material: Copper
Length: 3.543" (90.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.543" (90.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: AavSHIELD 3C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
371824B00032G 371824B00034G%20Side.jpg
371824B00032G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.275" (7.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1215 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.66 EUR
10+8.44 EUR
25+8.25 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
371924B00032G
Hersteller: Boyd Laconia, LLC
Description: 371924B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
372924M02000G( 10-5597-02G )
Hersteller: Boyd Laconia, LLC
Description: 372924M02000G( 10-5597-02G )
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
373324M00000G Board-Level-Cooling-3733.pdf
373324M00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/OUT AD-TAPE
Packaging: Box
Material: Aluminum
Length: 1.472" (37.39mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.472" (37.39mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Fin Height: 0.236" (6.00mm)
Material Finish: Green Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374024B00035G Boyd-Board-Level-Heatsinks-Catalog.pdf
374024B00035G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA 23X23X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 11.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 40.00°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 3239 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.06 EUR
10+2.72 EUR
25+2.59 EUR
50+2.49 EUR
100+2.41 EUR
480+2.21 EUR
960+2.13 EUR
1440+2.09 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
374024B60023G
Hersteller: Boyd Laconia, LLC
Description: 374024B60023G
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Thermal Resistance @ Forced Air Flow: 11.69°C/W @ 200 LFM
Thermal Resistance @ Natural: 40.00°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374024B60024G-MOD W/STAB PAD
Hersteller: Boyd Laconia, LLC
Description: 374024B60024G-MOD W/STAB PAD
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374124B00035G Boyd-Board-Level-Heatsinks-Catalog.pdf
374124B00035G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 7.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2849 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.08 EUR
10+2.73 EUR
25+2.6 EUR
50+2.5 EUR
100+2.41 EUR
250+2.3 EUR
560+2.2 EUR
1120+2.12 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
374124B60023G
Hersteller: Boyd Laconia, LLC
Description: 374124B60023G
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 7.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374224B60023G Board-Level-Cooling-3742.pdf
374224B60023G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 19.70°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374324B00032G
Hersteller: Boyd Laconia, LLC
Description: 374324B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 9.35°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374324B00035G Boyd-Board-Level-Heatsinks-Catalog.pdf
374324B00035G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Box
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 90°C
Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1657 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.89 EUR
10+3.43 EUR
25+3.27 EUR
50+3.15 EUR
100+3.03 EUR
250+2.89 EUR
756+2.72 EUR
1512+2.63 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
374324B60023G Boyd-Board-Level-Heatsinks-Catalog.pdf
374324B60023G
Hersteller: Boyd Laconia, LLC
Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2325 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.39 EUR
10+4.78 EUR
25+4.55 EUR
50+4.39 EUR
216+4.06 EUR
432+3.91 EUR
648+3.83 EUR
1080+3.73 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
374424B00035G Boyd-Board-Level-Heatsinks-Catalog.pdf
374424B00035G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1712 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.72 EUR
10+4.17 EUR
25+3.98 EUR
50+3.83 EUR
100+3.69 EUR
250+3.52 EUR
567+3.37 EUR
1134+3.25 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
374424B60023G
Hersteller: Boyd Laconia, LLC
Description: 374424B60023G
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374524B00000G
Hersteller: Boyd Laconia, LLC
Description: 374524B00000G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374524B60023G Board-Level-Cooling-3745.pdf
374524B60023G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 16.50°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374624B00000G W/3M8810
Hersteller: Boyd Laconia, LLC
Description: 374624B00000G W/3M8810
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374624B00032G Boyd-Board-Level-Heatsinks-Catalog.pdf
374624B00032G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1060 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.58 EUR
10+4.94 EUR
25+4.7 EUR
50+4.53 EUR
100+4.37 EUR
250+4.16 EUR
510+4 EUR
1020+3.86 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
374724B00032G Boyd-Board-Level-Heatsinks-Catalog.pdf
374724B00032G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 872 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+5.95 EUR
10+5.26 EUR
25+5.01 EUR
50+4.83 EUR
100+4.66 EUR
250+4.43 EUR
672+4.21 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
374724B00035G Boyd-Board-Level-Heatsinks-Catalog.pdf
374724B00035G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X18MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1423 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.46 EUR
10+5.72 EUR
25+5.45 EUR
50+5.25 EUR
100+5.06 EUR
250+4.82 EUR
672+4.57 EUR
1344+4.41 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
374724B60024G Boyd-Board-Level-Heatsinks-Catalog.pdf
374724B60024G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 859 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.03 EUR
10+8 EUR
25+7.62 EUR
50+7.34 EUR
168+6.9 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
374824B00000G
Hersteller: Boyd Laconia, LLC
Description: 374824B00000G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374824B00032G
Hersteller: Boyd Laconia, LLC
Description: 374824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374824B60024G Board-Level-Cooling-3748.pdf
374824B60024G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 3.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374924B00032G Boyd-Board-Level-Heatsinks-Catalog.pdf
374924B00032G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1114 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.6 EUR
10+6.73 EUR
25+6.41 EUR
50+6.18 EUR
240+5.68 EUR
480+5.48 EUR
720+5.36 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
3749350-PAM04010-P0
Hersteller: Boyd Laconia, LLC
Description: 3749350-PAM04010-P0
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
375024B00032G Boyd-Board-Level-Heatsinks-Catalog.pdf
375024B00032G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 569 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.74 EUR
10+5.09 EUR
25+4.85 EUR
50+4.67 EUR
100+4.51 EUR
450+4.16 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
375124B60024G Board-Level-Cooling-3751.pdf
375124B60024G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 8.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.30°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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