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2288BG Boyd Laconia, LLC Description: 2288BG
Packaging: Bulk
Diameter: 0.300" (7.62mm) ID, 1.000" (25.40mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2292B Boyd Laconia, LLC Description: THM,17368B REV C-G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2327B-TACHG Boyd Laconia, LLC Description: THM,2327B-TACHG
Packaging: Bulk
Material: Aluminum
Length: 1.105" (28.07mm)
Shape: Rectangular, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Fin Height: 0.600" (15.24mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2327B W/3M 8815 TAPE Boyd Laconia, LLC Description: THM,2327B W/3M 8815 TAPE
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2341BG Boyd Laconia, LLC Description: 2341BG
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2342BG Boyd Laconia, LLC Description: THM,18917B REV H
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
241402B92203G Boyd Laconia, LLC Description: H/S ASS'Y(RD002356)241402B92203G
Packaging: Bulk
Length: 2.283" (58.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.457" (37.00mm)
Package Cooled: Quarter Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 1.80°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.90°C/W
Fin Height: 0.236" (6.00mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
241804B92200G Boyd Laconia, LLC Description: 241804B92200G
Packaging: Bulk
Length: 2.280" (57.90mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.902" (22.90mm)
Package Cooled: Eighth Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.60°C/W
Fin Height: 0.449" (11.40mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
311505B00000G 311505B00000G Boyd Laconia, LLC 3100.pdf Description: TO-5 PUSH-ON HEATSINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.317" (8.05mm) ID, 0.375" (9.52mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 70°C
Thermal Resistance @ Forced Air Flow: 45.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 90.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 336 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.00 EUR
10+3.88 EUR
25+3.77 EUR
50+3.56 EUR
100+3.35 EUR
250+3.14 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
321527B00000G 321527B00000G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK TO-5 2W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5, TO-39
Attachment Method: Threaded Coupling
Power Dissipation @ Temperature Rise: 0.5W @ 20°C
Thermal Resistance @ Forced Air Flow: 20.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 35.20°C/W
Fin Height: 0.290" (7.37mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 627 Stücke:
Lieferzeit 10-14 Tag (e)
1+32.40 EUR
10+28.67 EUR
25+27.31 EUR
50+26.32 EUR
100+25.37 EUR
250+24.16 EUR
Im Einkaufswagen  Stück im Wert von  UAH
322400B00000G 322400B00000G Boyd Laconia, LLC Aavid3200.pdf Description: HEAT SINK TO-18 1W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.180" (4.57mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-18
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.6W @ 60°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 100.00°C/W
Fin Height: 0.235" (5.97mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 5978 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.77 EUR
10+9.53 EUR
25+9.08 EUR
50+8.75 EUR
100+8.43 EUR
250+8.03 EUR
500+7.74 EUR
1000+7.46 EUR
Mindestbestellmenge: 2
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322505B00000G 322505B00000G Boyd Laconia, LLC Aavid3200.pdf Description: HEATSINK TO-5 .4" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.5W @ 30°C
Thermal Resistance @ Forced Air Flow: 15.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 56.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 6445 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.71 EUR
10+3.31 EUR
25+3.15 EUR
50+3.04 EUR
100+2.93 EUR
250+2.86 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
322605B00000G 322605B00000G Boyd Laconia, LLC Aavid3200.pdf Description: HEATSINK TO-5 1.25W H=.25" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 54.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
323005B00000G 323005B00000G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK TO-5 2W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.4W @ 70°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 56.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 562 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.85 EUR
10+6.94 EUR
25+6.61 EUR
50+6.38 EUR
100+6.15 EUR
250+5.85 EUR
500+5.64 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
325705B00000G 325705B00000G Boyd Laconia, LLC Board-Level-Cooling-Extruded-Collar-3250.pdf Description: TO-5 PUSH-ON HEATSINK 6.35MM
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 961 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.78 EUR
10+3.36 EUR
25+3.20 EUR
50+3.09 EUR
100+2.98 EUR
250+2.84 EUR
500+2.74 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
325705R00000G Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Red Anodized
Produkt ist nicht verfügbar
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326005B00000G 326005B00000G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK TO-5 1W H=.375" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.8W @ 90°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 57.00°C/W
Fin Height: 0.375" (9.52mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1340 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.19 EUR
10+4.59 EUR
25+4.38 EUR
50+4.22 EUR
100+4.07 EUR
250+3.87 EUR
500+3.73 EUR
1000+3.60 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
335214B00032G Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.984" (25.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.00°C/W
Fin Height: 0.390" (9.91mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
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335824B00032G Boyd Laconia, LLC Description: PGA,335824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
335824B00034G 335824B00034G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 977 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.33 EUR
10+13.57 EUR
25+12.93 EUR
50+12.46 EUR
100+12.01 EUR
250+11.44 EUR
672+10.85 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
342941 342941 Boyd Laconia, LLC Board_Level_Cooling_Square_Skived_Fin-3044617.pdf Description: COPPER HEATSINK 40X40.5X13.5MM
Packaging: Tray
Material: Copper
Length: 1.594" (40.50mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.30°C/W
Fin Height: 0.531" (13.50mm)
Material Finish: AavSHIELD 3C
auf Bestellung 143 Stücke:
Lieferzeit 10-14 Tag (e)
1+59.49 EUR
10+52.78 EUR
25+50.32 EUR
40+49.10 EUR
80+47.36 EUR
Im Einkaufswagen  Stück im Wert von  UAH
342945 342945 Boyd Laconia, LLC Board-Level-Cooling-Square-Skived-Fin.pdf Description: COPPER HEATSINK 60X60X14MM
Packaging: Tray
Material: Copper
Length: 2.362" (60.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.362" (60.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.00°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342947 342947 Boyd Laconia, LLC Board-Level-Cooling-Square-Skived-Fin.pdf Description: COPPER HEATSINK 57.9X59X11MM
Packaging: Tray
Material: Copper
Length: 2.323" (59.00mm)
Shape: Rectangular, Fins
Type: Top Mount, Skived
Width: 2.280" (57.91mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.70°C/W
Fin Height: 0.433" (11.00mm)
Material Finish: AavSHIELD 3C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342948 342948 Boyd Laconia, LLC Board-Level-Cooling-Square-Skived-Fin.pdf Description: COPPER HEATSINK 70X69X14MM
Packaging: Tray
Material: Copper
Length: 2.717" (69.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.756" (70.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.60°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342948-copper skivfin Boyd Laconia, LLC Description: 342948,REV03(GP)
Packaging: Bulk
Material: Copper
Length: 2.717" (69.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 2.756" (70.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.551" (14.00mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342949 342949 Boyd Laconia, LLC Boyd-Board-Level-Cooling-Square-Skived-Fin.pdf Description: COPPER HEATSINK 80X80X12MM
Packaging: Tray
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.150" (80.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.10°C/W
Fin Height: 0.472" (12.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)
1+79.34 EUR
10+70.20 EUR
25+68.76 EUR
Im Einkaufswagen  Stück im Wert von  UAH
342949-copper skivfin Boyd Laconia, LLC Description: 342949
Packaging: Bulk
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Board Level
Width: 3.150" (80.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.472" (12.00mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342950 342950 Boyd Laconia, LLC Board-Level-Cooling-Square-Skived-Fin.pdf Description: COPPER HEATSINK 90X90X10MM
Packaging: Tray
Material: Copper
Length: 3.543" (90.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.543" (90.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: AavSHIELD 3C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
371824B00032G 371824B00032G Boyd Laconia, LLC 371824B00034G%20Side.jpg Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.275" (7.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1215 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.66 EUR
10+8.44 EUR
25+8.25 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
371924B00032G Boyd Laconia, LLC Description: 371924B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
372924M02000G( 10-5597-02G ) Boyd Laconia, LLC Description: 372924M02000G( 10-5597-02G )
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
373324M00000G 373324M00000G Boyd Laconia, LLC Board-Level-Cooling-3733.pdf Description: HEATSINK BGA W/OUT AD-TAPE
Packaging: Box
Material: Aluminum
Length: 1.472" (37.39mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.472" (37.39mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Fin Height: 0.236" (6.00mm)
Material Finish: Green Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374024B00035G 374024B00035G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA 23X23X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 11.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 40.00°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2118 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.20 EUR
10+2.83 EUR
25+2.70 EUR
50+2.60 EUR
100+2.51 EUR
480+2.30 EUR
960+2.22 EUR
1440+2.17 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
374024B60024G-MOD W/STAB PAD Boyd Laconia, LLC Description: 374024B60024G-MOD W/STAB PAD
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374124B00035G 374124B00035G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 7.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1890 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.40 EUR
10+3.00 EUR
25+2.86 EUR
50+2.75 EUR
100+2.65 EUR
250+2.53 EUR
560+2.42 EUR
1120+2.33 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
374324B00032G Boyd Laconia, LLC Description: 374324B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 9.35°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374324B00035G 374324B00035G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Box
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 90°C
Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1708 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.65 EUR
10+4.11 EUR
25+3.92 EUR
50+3.78 EUR
100+3.64 EUR
250+3.47 EUR
756+3.27 EUR
1512+3.15 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
374324B60023G 374324B60023G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2752 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.91 EUR
10+4.33 EUR
25+4.13 EUR
50+3.98 EUR
216+3.82 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
374424B00035G 374424B00035G Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1162 Stücke:
Lieferzeit 10-14 Tag (e)
3+5.88 EUR
10+5.20 EUR
25+4.96 EUR
50+4.78 EUR
100+4.60 EUR
250+4.38 EUR
540+4.21 EUR
1080+4.06 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
374524B00000G Boyd Laconia, LLC Description: 374524B00000G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374624B00000G W/3M8810 Boyd Laconia, LLC Description: 374624B00000G W/3M8810
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374624B00032G 374624B00032G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA 35X35X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 653 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.92 EUR
10+6.12 EUR
25+5.83 EUR
50+5.62 EUR
100+5.41 EUR
250+5.16 EUR
510+4.97 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
374724B00032G 374724B00032G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 532 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.24 EUR
10+7.29 EUR
25+6.95 EUR
50+6.70 EUR
100+6.45 EUR
250+6.15 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
374724B00035G 374724B00035G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA 35X35X18MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 149 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.64 EUR
10+8.54 EUR
25+8.13 EUR
50+7.84 EUR
100+7.55 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
374724B60024G 374724B60024G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 865 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.87 EUR
10+8.74 EUR
25+8.32 EUR
50+8.02 EUR
168+7.54 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
374824B00000G Boyd Laconia, LLC Description: 374824B00000G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374824B00032G Boyd Laconia, LLC Description: 374824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374924B00032G 374924B00032G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1114 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.60 EUR
10+6.73 EUR
25+6.41 EUR
50+6.18 EUR
240+5.68 EUR
480+5.48 EUR
720+5.36 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
3749350-PAM04010-P0 Boyd Laconia, LLC Description: 3749350-PAM04010-P0
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
375024B00032G 375024B00032G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 906 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.63 EUR
10+4.98 EUR
25+4.74 EUR
50+4.57 EUR
100+4.41 EUR
450+4.07 EUR
900+3.92 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
375124B60024G 375124B60024G Boyd Laconia, LLC Board-Level-Cooling-3751.pdf Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 8.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.30°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
3751320-PAH14010-P0 Boyd Laconia, LLC Description: 3751320-PAH14010-P0
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
3751320-PAM04010-P0 Boyd Laconia, LLC Description: 3751320-PAM04010-P0
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
375424B00034G 375424B00034G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK PIN-FIN W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.598" (15.19mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.598" (15.19mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 62.50°C/W
Fin Height: 0.252" (6.40mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 3382 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.22 EUR
10+1.96 EUR
25+1.87 EUR
50+1.80 EUR
100+1.74 EUR
250+1.65 EUR
500+1.59 EUR
3360+1.44 EUR
Mindestbestellmenge: 8
Im Einkaufswagen  Stück im Wert von  UAH
375424B60023G Boyd Laconia, LLC Description: 375424B60023G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
4003G 4003G Boyd Laconia, LLC Description: THERM PAD 39.65X26.67MM WHT
Packaging: Bulk
Color: White
Material: Beryllium Oxide Ceramic
Shape: Rhombus
Thickness: 0.0620" (1.575mm)
Type: Insulator
Usage: TO-3
Outline: 39.65mm x 26.67mm
auf Bestellung 1690 Stücke:
Lieferzeit 10-14 Tag (e)
1+68.18 EUR
10+60.33 EUR
25+57.46 EUR
50+55.38 EUR
100+53.37 EUR
300+50.33 EUR
Im Einkaufswagen  Stück im Wert von  UAH
4028L12B-PF1 Boyd Laconia, LLC 9992b322fbde8741384726092731b050.pdf Description: FAN 12VDC 40X28MM TACH
Features: Speed Sensor (Tach)
Packaging: Bulk
Voltage - Rated: 12VDC
Size / Dimension: Square - 40mm L x 40mm H
Bearing Type: Ball
RPM: 6500 RPM
Air Flow: 9.5 CFM (0.266m³/min)
Width: 28.00mm
Operating Temperature: 14 ~ 158°F (-10 ~ 70°C)
Termination: 3 Wire Leads
Approval Agency: CE, cURus, TUV
Fan Type: Tubeaxial
Noise: 33.5dB(A)
Static Pressure: 0.265 in H2O (66.0 Pa)
Power (Watts): 720 mW
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.11 EUR
10+11.56 EUR
25+10.87 EUR
50+10.46 EUR
100+9.63 EUR
250+9.01 EUR
500+8.88 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
4103G Boyd Laconia, LLC Description: THERM PAD 39.7X26.67MM
Packaging: Bulk
Material: Aluminum Oxide Ceramic
Shape: Rhombus
Thickness: 0.0750" (1.905mm)
Type: Insulator
Usage: TO-3
Outline: 39.70mm x 26.67mm
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
4110G10SB 4110G10SB Boyd Laconia, LLC Boyd-Stainless-Steel-Tube-Fin-Heat-Exchangers.pdf Description: HEAT EXCHANGER
Packaging: Box
Features: Stainless Steel Tubing
Operating Temperature: 200°C
Product Type: Active, Heat Exchanger
Fluid Capacity: 131ML (4.4 oz)
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
1+1730.47 EUR
Im Einkaufswagen  Stück im Wert von  UAH
4120G10SB 4120G10SB Boyd Laconia, LLC Boyd-Stainless-Steel-Tube-Fin-Heat-Exchangers.pdf Description: HEAT EXCHANGER
Packaging: Box
Features: Stainless Steel Tubing
Operating Temperature: 200°C
Product Type: Active, Heat Exchanger
Fluid Capacity: 131ML (4.4 oz)
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
1+2095.74 EUR
Im Einkaufswagen  Stück im Wert von  UAH
2288BG
Hersteller: Boyd Laconia, LLC
Description: 2288BG
Packaging: Bulk
Diameter: 0.300" (7.62mm) ID, 1.000" (25.40mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2292B
Hersteller: Boyd Laconia, LLC
Description: THM,17368B REV C-G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2327B-TACHG
Hersteller: Boyd Laconia, LLC
Description: THM,2327B-TACHG
Packaging: Bulk
Material: Aluminum
Length: 1.105" (28.07mm)
Shape: Rectangular, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Fin Height: 0.600" (15.24mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2327B W/3M 8815 TAPE
Hersteller: Boyd Laconia, LLC
Description: THM,2327B W/3M 8815 TAPE
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2341BG
Hersteller: Boyd Laconia, LLC
Description: 2341BG
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2342BG
Hersteller: Boyd Laconia, LLC
Description: THM,18917B REV H
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
241402B92203G
Hersteller: Boyd Laconia, LLC
Description: H/S ASS'Y(RD002356)241402B92203G
Packaging: Bulk
Length: 2.283" (58.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.457" (37.00mm)
Package Cooled: Quarter Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 1.80°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.90°C/W
Fin Height: 0.236" (6.00mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
241804B92200G
Hersteller: Boyd Laconia, LLC
Description: 241804B92200G
Packaging: Bulk
Length: 2.280" (57.90mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.902" (22.90mm)
Package Cooled: Eighth Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.60°C/W
Fin Height: 0.449" (11.40mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
311505B00000G 3100.pdf
311505B00000G
Hersteller: Boyd Laconia, LLC
Description: TO-5 PUSH-ON HEATSINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.317" (8.05mm) ID, 0.375" (9.52mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 70°C
Thermal Resistance @ Forced Air Flow: 45.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 90.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 336 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+4.00 EUR
10+3.88 EUR
25+3.77 EUR
50+3.56 EUR
100+3.35 EUR
250+3.14 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
321527B00000G Board-Level-Heatsinks_Cat.pdf
321527B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-5 2W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5, TO-39
Attachment Method: Threaded Coupling
Power Dissipation @ Temperature Rise: 0.5W @ 20°C
Thermal Resistance @ Forced Air Flow: 20.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 35.20°C/W
Fin Height: 0.290" (7.37mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 627 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+32.40 EUR
10+28.67 EUR
25+27.31 EUR
50+26.32 EUR
100+25.37 EUR
250+24.16 EUR
Im Einkaufswagen  Stück im Wert von  UAH
322400B00000G Aavid3200.pdf
322400B00000G
Hersteller: Boyd Laconia, LLC
Description: HEAT SINK TO-18 1W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.180" (4.57mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-18
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.6W @ 60°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 100.00°C/W
Fin Height: 0.235" (5.97mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 5978 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.77 EUR
10+9.53 EUR
25+9.08 EUR
50+8.75 EUR
100+8.43 EUR
250+8.03 EUR
500+7.74 EUR
1000+7.46 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
322505B00000G Aavid3200.pdf
322505B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-5 .4" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.5W @ 30°C
Thermal Resistance @ Forced Air Flow: 15.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 56.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 6445 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.71 EUR
10+3.31 EUR
25+3.15 EUR
50+3.04 EUR
100+2.93 EUR
250+2.86 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
322605B00000G Aavid3200.pdf
322605B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-5 1.25W H=.25" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 54.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
323005B00000G Boyd-Board-Level-Heatsinks-Catalog.pdf
323005B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-5 2W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.4W @ 70°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 56.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 562 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.85 EUR
10+6.94 EUR
25+6.61 EUR
50+6.38 EUR
100+6.15 EUR
250+5.85 EUR
500+5.64 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
325705B00000G Board-Level-Cooling-Extruded-Collar-3250.pdf
325705B00000G
Hersteller: Boyd Laconia, LLC
Description: TO-5 PUSH-ON HEATSINK 6.35MM
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 961 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.78 EUR
10+3.36 EUR
25+3.20 EUR
50+3.09 EUR
100+2.98 EUR
250+2.84 EUR
500+2.74 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
325705R00000G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Red Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
326005B00000G Boyd-Board-Level-Heatsinks-Catalog.pdf
326005B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-5 1W H=.375" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.8W @ 90°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 57.00°C/W
Fin Height: 0.375" (9.52mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1340 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.19 EUR
10+4.59 EUR
25+4.38 EUR
50+4.22 EUR
100+4.07 EUR
250+3.87 EUR
500+3.73 EUR
1000+3.60 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
335214B00032G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: Boyd Laconia, LLC
Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.984" (25.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.00°C/W
Fin Height: 0.390" (9.91mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
335824B00032G
Hersteller: Boyd Laconia, LLC
Description: PGA,335824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
335824B00034G Boyd-Board-Level-Heatsinks-Catalog.pdf
335824B00034G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 977 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.33 EUR
10+13.57 EUR
25+12.93 EUR
50+12.46 EUR
100+12.01 EUR
250+11.44 EUR
672+10.85 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
342941 Board_Level_Cooling_Square_Skived_Fin-3044617.pdf
342941
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 40X40.5X13.5MM
Packaging: Tray
Material: Copper
Length: 1.594" (40.50mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.30°C/W
Fin Height: 0.531" (13.50mm)
Material Finish: AavSHIELD 3C
auf Bestellung 143 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+59.49 EUR
10+52.78 EUR
25+50.32 EUR
40+49.10 EUR
80+47.36 EUR
Im Einkaufswagen  Stück im Wert von  UAH
342945 Board-Level-Cooling-Square-Skived-Fin.pdf
342945
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 60X60X14MM
Packaging: Tray
Material: Copper
Length: 2.362" (60.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.362" (60.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.00°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342947 Board-Level-Cooling-Square-Skived-Fin.pdf
342947
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 57.9X59X11MM
Packaging: Tray
Material: Copper
Length: 2.323" (59.00mm)
Shape: Rectangular, Fins
Type: Top Mount, Skived
Width: 2.280" (57.91mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.70°C/W
Fin Height: 0.433" (11.00mm)
Material Finish: AavSHIELD 3C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342948 Board-Level-Cooling-Square-Skived-Fin.pdf
342948
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 70X69X14MM
Packaging: Tray
Material: Copper
Length: 2.717" (69.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.756" (70.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.60°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342948-copper skivfin
Hersteller: Boyd Laconia, LLC
Description: 342948,REV03(GP)
Packaging: Bulk
Material: Copper
Length: 2.717" (69.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 2.756" (70.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.551" (14.00mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342949 Boyd-Board-Level-Cooling-Square-Skived-Fin.pdf
342949
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 80X80X12MM
Packaging: Tray
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.150" (80.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.10°C/W
Fin Height: 0.472" (12.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+79.34 EUR
10+70.20 EUR
25+68.76 EUR
Im Einkaufswagen  Stück im Wert von  UAH
342949-copper skivfin
Hersteller: Boyd Laconia, LLC
Description: 342949
Packaging: Bulk
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Board Level
Width: 3.150" (80.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.472" (12.00mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
342950 Board-Level-Cooling-Square-Skived-Fin.pdf
342950
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 90X90X10MM
Packaging: Tray
Material: Copper
Length: 3.543" (90.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.543" (90.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: AavSHIELD 3C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
371824B00032G 371824B00034G%20Side.jpg
371824B00032G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.275" (7.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1215 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.66 EUR
10+8.44 EUR
25+8.25 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
371924B00032G
Hersteller: Boyd Laconia, LLC
Description: 371924B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
372924M02000G( 10-5597-02G )
Hersteller: Boyd Laconia, LLC
Description: 372924M02000G( 10-5597-02G )
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
373324M00000G Board-Level-Cooling-3733.pdf
373324M00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/OUT AD-TAPE
Packaging: Box
Material: Aluminum
Length: 1.472" (37.39mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.472" (37.39mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Fin Height: 0.236" (6.00mm)
Material Finish: Green Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374024B00035G Boyd-Board-Level-Heatsinks-Catalog.pdf
374024B00035G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA 23X23X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 11.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 40.00°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2118 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.20 EUR
10+2.83 EUR
25+2.70 EUR
50+2.60 EUR
100+2.51 EUR
480+2.30 EUR
960+2.22 EUR
1440+2.17 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
374024B60024G-MOD W/STAB PAD
Hersteller: Boyd Laconia, LLC
Description: 374024B60024G-MOD W/STAB PAD
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374124B00035G Boyd-Board-Level-Heatsinks-Catalog.pdf
374124B00035G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 7.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1890 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.40 EUR
10+3.00 EUR
25+2.86 EUR
50+2.75 EUR
100+2.65 EUR
250+2.53 EUR
560+2.42 EUR
1120+2.33 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
374324B00032G
Hersteller: Boyd Laconia, LLC
Description: 374324B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 9.35°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374324B00035G Boyd-Board-Level-Heatsinks-Catalog.pdf
374324B00035G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Box
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 90°C
Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1708 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.65 EUR
10+4.11 EUR
25+3.92 EUR
50+3.78 EUR
100+3.64 EUR
250+3.47 EUR
756+3.27 EUR
1512+3.15 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
374324B60023G Boyd-Board-Level-Heatsinks-Catalog.pdf
374324B60023G
Hersteller: Boyd Laconia, LLC
Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2752 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.91 EUR
10+4.33 EUR
25+4.13 EUR
50+3.98 EUR
216+3.82 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
374424B00035G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
374424B00035G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1162 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+5.88 EUR
10+5.20 EUR
25+4.96 EUR
50+4.78 EUR
100+4.60 EUR
250+4.38 EUR
540+4.21 EUR
1080+4.06 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
374524B00000G
Hersteller: Boyd Laconia, LLC
Description: 374524B00000G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374624B00000G W/3M8810
Hersteller: Boyd Laconia, LLC
Description: 374624B00000G W/3M8810
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374624B00032G Boyd-Board-Level-Heatsinks-Catalog.pdf
374624B00032G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 653 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.92 EUR
10+6.12 EUR
25+5.83 EUR
50+5.62 EUR
100+5.41 EUR
250+5.16 EUR
510+4.97 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
374724B00032G Boyd-Board-Level-Heatsinks-Catalog.pdf
374724B00032G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 532 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.24 EUR
10+7.29 EUR
25+6.95 EUR
50+6.70 EUR
100+6.45 EUR
250+6.15 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
374724B00035G Boyd-Board-Level-Heatsinks-Catalog.pdf
374724B00035G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X18MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 149 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.64 EUR
10+8.54 EUR
25+8.13 EUR
50+7.84 EUR
100+7.55 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
374724B60024G Boyd-Board-Level-Heatsinks-Catalog.pdf
374724B60024G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 865 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.87 EUR
10+8.74 EUR
25+8.32 EUR
50+8.02 EUR
168+7.54 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
374824B00000G
Hersteller: Boyd Laconia, LLC
Description: 374824B00000G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374824B00032G
Hersteller: Boyd Laconia, LLC
Description: 374824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
374924B00032G Boyd-Board-Level-Heatsinks-Catalog.pdf
374924B00032G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1114 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.60 EUR
10+6.73 EUR
25+6.41 EUR
50+6.18 EUR
240+5.68 EUR
480+5.48 EUR
720+5.36 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
3749350-PAM04010-P0
Hersteller: Boyd Laconia, LLC
Description: 3749350-PAM04010-P0
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
375024B00032G Boyd-Board-Level-Heatsinks-Catalog.pdf
375024B00032G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 906 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.63 EUR
10+4.98 EUR
25+4.74 EUR
50+4.57 EUR
100+4.41 EUR
450+4.07 EUR
900+3.92 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
375124B60024G Board-Level-Cooling-3751.pdf
375124B60024G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 8.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.30°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
3751320-PAH14010-P0
Hersteller: Boyd Laconia, LLC
Description: 3751320-PAH14010-P0
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
3751320-PAM04010-P0
Hersteller: Boyd Laconia, LLC
Description: 3751320-PAM04010-P0
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
375424B00034G Boyd-Board-Level-Heatsinks-Catalog.pdf
375424B00034G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK PIN-FIN W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.598" (15.19mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.598" (15.19mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 62.50°C/W
Fin Height: 0.252" (6.40mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 3382 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.22 EUR
10+1.96 EUR
25+1.87 EUR
50+1.80 EUR
100+1.74 EUR
250+1.65 EUR
500+1.59 EUR
3360+1.44 EUR
Mindestbestellmenge: 8
Im Einkaufswagen  Stück im Wert von  UAH
375424B60023G
Hersteller: Boyd Laconia, LLC
Description: 375424B60023G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
4003G
4003G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 39.65X26.67MM WHT
Packaging: Bulk
Color: White
Material: Beryllium Oxide Ceramic
Shape: Rhombus
Thickness: 0.0620" (1.575mm)
Type: Insulator
Usage: TO-3
Outline: 39.65mm x 26.67mm
auf Bestellung 1690 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+68.18 EUR
10+60.33 EUR
25+57.46 EUR
50+55.38 EUR
100+53.37 EUR
300+50.33 EUR
Im Einkaufswagen  Stück im Wert von  UAH
4028L12B-PF1 9992b322fbde8741384726092731b050.pdf
Hersteller: Boyd Laconia, LLC
Description: FAN 12VDC 40X28MM TACH
Features: Speed Sensor (Tach)
Packaging: Bulk
Voltage - Rated: 12VDC
Size / Dimension: Square - 40mm L x 40mm H
Bearing Type: Ball
RPM: 6500 RPM
Air Flow: 9.5 CFM (0.266m³/min)
Width: 28.00mm
Operating Temperature: 14 ~ 158°F (-10 ~ 70°C)
Termination: 3 Wire Leads
Approval Agency: CE, cURus, TUV
Fan Type: Tubeaxial
Noise: 33.5dB(A)
Static Pressure: 0.265 in H2O (66.0 Pa)
Power (Watts): 720 mW
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.11 EUR
10+11.56 EUR
25+10.87 EUR
50+10.46 EUR
100+9.63 EUR
250+9.01 EUR
500+8.88 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
4103G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 39.7X26.67MM
Packaging: Bulk
Material: Aluminum Oxide Ceramic
Shape: Rhombus
Thickness: 0.0750" (1.905mm)
Type: Insulator
Usage: TO-3
Outline: 39.70mm x 26.67mm
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
4110G10SB Boyd-Stainless-Steel-Tube-Fin-Heat-Exchangers.pdf
4110G10SB
Hersteller: Boyd Laconia, LLC
Description: HEAT EXCHANGER
Packaging: Box
Features: Stainless Steel Tubing
Operating Temperature: 200°C
Product Type: Active, Heat Exchanger
Fluid Capacity: 131ML (4.4 oz)
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1730.47 EUR
Im Einkaufswagen  Stück im Wert von  UAH
4120G10SB Boyd-Stainless-Steel-Tube-Fin-Heat-Exchangers.pdf
4120G10SB
Hersteller: Boyd Laconia, LLC
Description: HEAT EXCHANGER
Packaging: Box
Features: Stainless Steel Tubing
Operating Temperature: 200°C
Product Type: Active, Heat Exchanger
Fluid Capacity: 131ML (4.4 oz)
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+2095.74 EUR
Im Einkaufswagen  Stück im Wert von  UAH
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