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533402B02552G 533402B02552G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK TO-220 SOLDERPIN/CLIP
Thermal Resistance @ Natural: 5.00°C/W
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 500 LFM
Power Dissipation @ Temperature Rise: 8.0W @ 40°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.650" (41.91mm)
Material: Aluminum
Packaging: Bulk
Material Finish: Black Anodized
Fin Height: 1.500" (38.10mm)
auf Bestellung 223 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.2 EUR
10+11.68 EUR
25+11.13 EUR
50+10.73 EUR
100+10.34 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
533422B02552G 533422B02552G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK TO-220 SOLDERPIN/CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.650" (41.91mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 10.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 200 LFM
Fin Height: 1.500" (38.10mm)
Material Finish: Black Anodized
auf Bestellung 5719 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.12 EUR
10+5.42 EUR
25+5.16 EUR
50+4.97 EUR
240+4.58 EUR
480+4.41 EUR
720+4.32 EUR
1200+4.2 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
533501B12552G Boyd Laconia, LLC Description: STD,533501B12552G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
533502B02552G 533502B02552G Boyd Laconia, LLC Board-Level-Cooling-Extruded-5334.pdf Description: BOARD LEVEL HEAT SINK
Shape: Rectangular, Fins
Length: 1.650" (41.91mm)
Material: Aluminum
Packaging: Bulk
Material Finish: Black Anodized
Fin Height: 2.000" (50.80mm)
Thermal Resistance @ Natural: 4.50°C/W
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
533522B02552G Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: BOARD LEVEL HEAT SINK
Part Status: Active
Material Finish: Black Anodized
Fin Height: 1.000" (25.40mm)
Thermal Resistance @ Natural: 2.70°C/W
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220 (Dual)
Width: 1.650" (41.91mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
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533566B42552G Boyd Laconia, LLC Description: 533566B42552G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
533602B02552G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 1.000" (25.40mm)
Thermal Resistance @ Natural: 3.80°C/W
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Power Dissipation @ Temperature Rise: 16.0W @ 50°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.650" (41.91mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.500" (63.50mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
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533621B02500G Boyd Laconia, LLC Description: STD,533621B02500G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
533766B42152G Boyd Laconia, LLC Description: STD,533766B42152G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
533802B02500G 533802B02500G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 13.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Attachment Method: PC Pin
Package Cooled: TO-220
Width: 1.375" (34.93mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.000" (25.40mm)
Material: Aluminum
Packaging: Bulk
auf Bestellung 2091 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.78 EUR
10+6.9 EUR
25+6.57 EUR
50+6.33 EUR
100+6.1 EUR
250+5.81 EUR
540+5.58 EUR
1080+5.38 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
534202B02853G 534202B02853G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK TO-220 W/SHURLOCK-CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 16467 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.32 EUR
10+7.36 EUR
25+7.01 EUR
50+6.76 EUR
100+6.51 EUR
486+5.99 EUR
972+5.77 EUR
1458+5.65 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
534202B03453G 534202B03453G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: BOARD LEVEL HEATSINK .5" TO-220
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 705 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.59 EUR
10+8.5 EUR
25+8.1 EUR
50+7.8 EUR
100+7.52 EUR
250+7.16 EUR
500+6.9 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
534302B03553G 534302B03553G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK TO-220 W/TAB-KOOLCLIP
Thermal Resistance @ Natural: 10.40°C/W
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 60°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.380" (35.05mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Material: Aluminum
Packaging: Bulk
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.480" (12.19mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
534302B13553 Boyd Laconia, LLC Description: STD,534302B13553
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
53-77-13ACG Boyd Laconia, LLC Description: THERM PAD 18.03X12.7MM W/ADH
Part Status: Active
Adhesive: Adhesive - One Side
Thermal Conductivity: 0.9W/m-K
Outline: 18.03mm x 12.70mm
Usage: TO-220
Type: Pad, Sheet
Thickness: 0.0060" (0.152mm)
Shape: Rectangular
Material: Silicone Rubber
Color: Gray, Green
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
53-77-2G 53-77-2G Boyd Laconia, LLC Boyd-Thermal-Interface-Materials-Catalog.pdf Description: THERM PAD 17.5MMX14.27MM GRY/GRN
Thermal Conductivity: 0.9W/m-K
Outline: 17.50mm x 14.27mm
Usage: TO-220
Type: Pad, Sheet
Thickness: 0.0060" (0.152mm)
Shape: Rectangular
Material: Silicone Rubber
Color: Gray, Green
Packaging: Bulk
auf Bestellung 2840 Stücke:
Lieferzeit 10-14 Tag (e)
9+2.15 EUR
10+1.91 EUR
25+1.82 EUR
50+1.75 EUR
100+1.69 EUR
250+1.61 EUR
500+1.55 EUR
1000+1.5 EUR
Mindestbestellmenge: 9
Im Einkaufswagen  Stück im Wert von  UAH
53-77-3G Boyd Laconia, LLC Description: THERM PAD 17.5MMX14.27MM GRY/GRN
Thermal Conductivity: 0.9W/m-K
Outline: 17.50mm x 14.27mm
Usage: TO-220
Type: Pad, Sheet
Thickness: 0.0060" (0.152mm)
Shape: Rectangular
Material: Silicone Rubber
Color: Gray, Green
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
53-77-4ACG 53-77-4ACG Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: THERM PAD 19.05X12.7MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
auf Bestellung 11801 Stücke:
Lieferzeit 10-14 Tag (e)
14+1.28 EUR
16+1.14 EUR
25+1.09 EUR
50+1.05 EUR
100+1.01 EUR
250+0.96 EUR
500+0.93 EUR
1000+0.89 EUR
5000+0.82 EUR
Mindestbestellmenge: 14
Im Einkaufswagen  Stück im Wert von  UAH
53-77-4G 53-77-4G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: THERM PAD 19.05MMX12.7MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
auf Bestellung 5292 Stücke:
Lieferzeit 10-14 Tag (e)
16+1.16 EUR
18+1.02 EUR
25+0.98 EUR
50+0.94 EUR
100+0.91 EUR
250+0.86 EUR
500+0.83 EUR
1000+0.8 EUR
5000+0.74 EUR
Mindestbestellmenge: 16
Im Einkaufswagen  Stück im Wert von  UAH
53-77-9ACG 53-77-9ACG Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: THERM PAD 18.42X13.21MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
auf Bestellung 9606 Stücke:
Lieferzeit 10-14 Tag (e)
12+1.53 EUR
13+1.36 EUR
25+1.29 EUR
50+1.24 EUR
100+1.2 EUR
250+1.14 EUR
500+1.1 EUR
2000+1.02 EUR
6000+0.97 EUR
Mindestbestellmenge: 12
Im Einkaufswagen  Stück im Wert von  UAH
53-77-9G 53-77-9G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: THERM PAD 18.42X13.21MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Thermal Conductivity: 0.9W/m-K
Part Status: Active
auf Bestellung 8466 Stücke:
Lieferzeit 10-14 Tag (e)
22+0.81 EUR
25+0.72 EUR
26+0.69 EUR
50+0.66 EUR
100+0.64 EUR
250+0.61 EUR
500+0.59 EUR
2000+0.54 EUR
6000+0.51 EUR
Mindestbestellmenge: 22
Im Einkaufswagen  Stück im Wert von  UAH
53-78-3AC Boyd Laconia, LLC Description: THERM PAD 25.4X20.32MM W/ADH
Part Status: Active
Adhesive: Adhesive - One Side
Thermal Conductivity: 0.9W/m-K
Outline: 25.40mm x 20.32mm
Usage: TO-218
Type: Pad, Sheet
Thickness: 0.0060" (0.152mm)
Shape: Polygon, 5-sided
Material: Silicone Rubber
Color: Gray, Green
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
542502B00000G 542502B00000G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK TO-220 TAB BLACK
Material Finish: Black Anodized
Fin Height: 0.250" (6.35mm)
Thermal Resistance @ Natural: 24.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 0.875" (22.22mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.250" (31.75mm)
Material: Aluminum
Packaging: Bulk
auf Bestellung 5275 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.26 EUR
10+4.66 EUR
25+4.44 EUR
50+4.28 EUR
100+4.12 EUR
250+3.93 EUR
500+3.79 EUR
1000+3.65 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
542502D00000G 542502D00000G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK TO-220 TAB TIN
Material Finish: Tin
Fin Height: 0.250" (6.35mm)
Thermal Resistance @ Natural: 24.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 0.875" (22.22mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.250" (31.75mm)
Material: Aluminum
Packaging: Bulk
auf Bestellung 6525 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.3 EUR
10+5.57 EUR
25+5.31 EUR
50+5.11 EUR
100+4.93 EUR
250+4.7 EUR
500+4.53 EUR
1000+4.36 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
551002B00000G 551002B00000G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK TO-220 1.45" HIGH
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.787" (19.99mm)
Thermal Resistance @ Natural: 12.40°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 1.5W @ 20°C
Attachment Method: Bolt On
Package Cooled: TO-220
Width: 1.006" (25.55mm)
Type: Board Level
Shape: Rectangular, Fins
Length: 1.450" (36.83mm)
Material: Aluminum
Packaging: Bag
auf Bestellung 1284 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.67 EUR
10+6.49 EUR
25+6.31 EUR
50+5.96 EUR
100+5.61 EUR
250+5.26 EUR
500+5.09 EUR
1000+4.56 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
552844B00000 Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: BOARD LEVEL HEAT SINK
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.720" (18.29mm)
Thermal Resistance @ Natural: 8.70°C/W
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 30°C
Attachment Method: Bolt On
Package Cooled: TO-220 (Dual)
Width: 1.780" (45.21mm)
Type: Board Level
Shape: Square, Fins
Length: 1.780" (45.21mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
552844B00000G Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: HEATSINK
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
56-02-101G Boyd Laconia, LLC Description: THERM PAD 26.16MMX22.61MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rectangular
Thickness: 0.0030" (0.076mm)
Type: Insulator
Usage: TO-218, TO-247, TO-3P
Outline: 26.16mm x 22.61mm
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
56-03-8G 56-03-8G Boyd Laconia, LLC Description: THERM PAD 42.85X30.15MM OPAQUE
Part Status: Active
Outline: 42.85mm x 30.15mm
Type: Insulator
Thickness: 0.0020" (0.051mm)
Shape: Rhombus
Material: Mica
Color: Opaque
Packaging: Bulk
Usage: TO-3
auf Bestellung 2740 Stücke:
Lieferzeit 10-14 Tag (e)
13+1.36 EUR
15+1.21 EUR
25+1.16 EUR
50+1.11 EUR
100+1.08 EUR
250+1.03 EUR
500+0.99 EUR
Mindestbestellmenge: 13
Im Einkaufswagen  Stück im Wert von  UAH
563002B00000G 563002B00000G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK TO-220 VERT MNT 1.18"
Packaging: Bag
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 1667 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.55 EUR
10+6.68 EUR
25+6.36 EUR
50+6.13 EUR
100+5.91 EUR
250+5.63 EUR
500+5.43 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
563002D00000G 563002D00000G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK TO-220 TAB TIN
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 13.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.180" (29.97mm)
Packaging: Bulk
Material Finish: Tin
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.01 EUR
10+2.67 EUR
25+2.54 EUR
50+2.45 EUR
100+2.36 EUR
250+2.25 EUR
500+2.17 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
563202D00000G 563202D00000G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: BOARD LEVEL HEAT SINK
Material Finish: Tin
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 9.40°C/W
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 1.380" (35.05mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Packaging: Bulk
auf Bestellung 2732 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.29 EUR
10+2.92 EUR
25+2.78 EUR
50+2.68 EUR
100+2.59 EUR
420+2.5 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
566010B00000G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 11.50°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 40°C
Attachment Method: Clip
Package Cooled: Multiwatt, SIP
Width: 1.000" (25.40mm)
Type: Board Level
Shape: Rectangular, Fins
Length: 1.220" (30.99mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
566010B02800G 566010B02800G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK TO-220 CLIP-ON W/TABS
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 11.50°C/W
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Attachment Method: Clip and Board Locks
Package Cooled: Multiwatt, SIP
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.220" (30.99mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
566010B03400G 566010B03400G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK W/TAB BLACK
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 11.50°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Attachment Method: Clip and PC Pin
Package Cooled: Multiwatt, SIP
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.220" (30.99mm)
Material: Aluminum
Packaging: Bulk
auf Bestellung 1574 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.9 EUR
10+12.3 EUR
25+11.72 EUR
50+11.29 EUR
100+10.89 EUR
250+10.37 EUR
800+9.74 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
566102B00000G Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
566902B04000G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: BOARD LEVEL HEAT SINK
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 18.80°C/W
Thermal Resistance @ Forced Air Flow: 9.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220, TO-262
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 0.850" (21.59mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
56-77-11G 56-77-11G Boyd Laconia, LLC Description: THERM PAD 18.92MMX13.84MM OPAQUE
Outline: 18.92mm x 13.84mm
Usage: TO-220
Type: Insulator
Thickness: 0.0020" (0.051mm)
Shape: Rectangular
Material: Mica
Color: Opaque
Packaging: Bulk
auf Bestellung 9799 Stücke:
Lieferzeit 10-14 Tag (e)
21+0.84 EUR
24+0.74 EUR
26+0.7 EUR
50+0.68 EUR
100+0.65 EUR
250+0.62 EUR
500+0.6 EUR
1000+0.58 EUR
5000+0.53 EUR
Mindestbestellmenge: 21
Im Einkaufswagen  Stück im Wert von  UAH
56-77-8G 56-77-8G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: THERM PAD 18.92MMX13.84MM Clear
Packaging: Bulk
Color: Clear
Material: Mica
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Usage: TO-220
Outline: 18.92mm x 13.84mm
auf Bestellung 8184 Stücke:
Lieferzeit 10-14 Tag (e)
17+1.04 EUR
20+0.91 EUR
25+0.86 EUR
50+0.83 EUR
100+0.8 EUR
250+0.77 EUR
500+0.74 EUR
1000+0.71 EUR
5000+0.65 EUR
Mindestbestellmenge: 17
Im Einkaufswagen  Stück im Wert von  UAH
568303B00000G 568303B00000G Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: HEATSINK TO-3 1.25" 25WATT
Material Finish: Black Anodized
Fin Height: 1.250" (31.75mm)
Thermal Resistance @ Natural: 5.40°C/W
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 5.0W @ 30°C
Attachment Method: Bolt On
Package Cooled: TO-3
Width: 1.810" (45.97mm)
Type: Board Level
Shape: Square
Length: 1.810" (45.97mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
568403B00000 Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 1.500" (38.10mm)
Thermal Resistance @ Natural: 4.70°C/W
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 5.0W @ 30°C
Attachment Method: Bolt On
Package Cooled: TO-3
Width: 1.810" (45.97mm)
Type: Top Mount
Shape: Rectangular, Pin Fins
Length: 1.810" (45.97mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
569003B00000G 569003B00000G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: COOLER FOR TO-3 20 WATTS
Part Status: Active
Material Finish: Black Anodized
Fin Height: 1.310" (33.27mm)
Thermal Resistance @ Natural: 5.50°C/W
Thermal Resistance @ Forced Air Flow: 1.50°C/W @ 500 LFM
Power Dissipation @ Temperature Rise: 12.0W @ 60°C
Attachment Method: Bolt On
Package Cooled: TO-3
Width: 1.830" (46.48mm)
Type: Board Level
Shape: Square, Pin Fins
Length: 1.830" (46.48mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 690 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.23 EUR
10+10.83 EUR
25+10.31 EUR
50+9.94 EUR
100+9.58 EUR
250+9.13 EUR
500+8.8 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
573100D00000G 573100D00000G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: TOP MOUNT HEATSINK .4" D-PAK
Length: 0.315" (8.00mm)
Material: Aluminum
Packaging: Bulk
Part Status: Active
Material Finish: Tin
Fin Height: 0.400" (10.16mm)
Thermal Resistance @ Natural: 15.00°C/W
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Attachment Method: SMD Pad
Package Cooled: TO-252 (DPAK)
Width: 0.900" (22.86mm)
Type: Top Mount
Shape: Rectangular, Fins
auf Bestellung 3237 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.88 EUR
10+6.99 EUR
25+6.66 EUR
50+6.42 EUR
100+6.18 EUR
250+5.89 EUR
500+5.68 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
573100D00010G 573100D00010G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
auf Bestellung 12750 Stücke:
Lieferzeit 10-14 Tag (e)
250+0.67 EUR
500+0.64 EUR
750+0.63 EUR
1250+0.61 EUR
1750+0.6 EUR
2500+0.59 EUR
6250+0.56 EUR
12500+0.54 EUR
Mindestbestellmenge: 250
Im Einkaufswagen  Stück im Wert von  UAH
573100D00010G 573100D00010G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
auf Bestellung 12944 Stücke:
Lieferzeit 10-14 Tag (e)
20+0.9 EUR
23+0.79 EUR
25+0.75 EUR
50+0.73 EUR
100+0.7 EUR
Mindestbestellmenge: 20
Im Einkaufswagen  Stück im Wert von  UAH
573300D00000G 573300D00000G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: TOP MOUNT HEATSINK .4" D2PAK
Packaging: Bulk
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 2692 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.28 EUR
10+5.56 EUR
25+5.3 EUR
50+5.11 EUR
100+4.92 EUR
250+4.69 EUR
500+4.52 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
573300D00010G 573300D00010G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 11523 Stücke:
Lieferzeit 10-14 Tag (e)
250+0.79 EUR
500+0.76 EUR
750+0.75 EUR
1250+0.73 EUR
1750+0.71 EUR
2500+0.7 EUR
6250+0.67 EUR
Mindestbestellmenge: 250
Im Einkaufswagen  Stück im Wert von  UAH
573300D00010G 573300D00010G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 11523 Stücke:
Lieferzeit 10-14 Tag (e)
17+1.06 EUR
19+0.94 EUR
25+0.9 EUR
50+0.86 EUR
100+0.83 EUR
Mindestbestellmenge: 17
Im Einkaufswagen  Stück im Wert von  UAH
573400D00000G 573400D00000G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: BOARD LEVEL HEAT SINK
Part Status: Active
Material Finish: Tin
Fin Height: 0.401" (10.20mm)
Thermal Resistance @ Natural: 14.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Attachment Method: SMD Pad
Package Cooled: TO-268 (D³Pak)
Width: 1.220" (30.99mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 0.500" (12.70mm)
Packaging: Bulk
auf Bestellung 2248 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.79 EUR
10+4.67 EUR
25+4.55 EUR
50+4.29 EUR
100+4.04 EUR
250+3.79 EUR
500+3.66 EUR
1000+3.28 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
573400D00010G 573400D00010G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK D-PAK3 TIN PLATED SMD
Part Status: Active
Material Finish: Tin
Fin Height: 0.401" (10.20mm)
Thermal Resistance @ Natural: 14.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Attachment Method: SMD Pad
Package Cooled: TO-268 (D³Pak)
Width: 1.220" (30.99mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 0.500" (12.70mm)
Material: Copper
Packaging: Tape & Reel (TR)
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
250+4.79 EUR
500+4.61 EUR
750+4.51 EUR
1250+4.39 EUR
1750+4.31 EUR
2500+4.23 EUR
Mindestbestellmenge: 250
Im Einkaufswagen  Stück im Wert von  UAH
573400D00010G 573400D00010G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK D-PAK3 TIN PLATED SMD
Part Status: Active
Material Finish: Tin
Fin Height: 0.401" (10.20mm)
Thermal Resistance @ Natural: 14.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Attachment Method: SMD Pad
Package Cooled: TO-268 (D³Pak)
Width: 1.220" (30.99mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 0.500" (12.70mm)
Material: Copper
Packaging: Cut Tape (CT)
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.48 EUR
10+5.75 EUR
25+5.48 EUR
50+5.29 EUR
100+5.1 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
573902B00000G 573902B00000G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK TO-220 BLACK CLIP-ON
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 18.80°C/W
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Attachment Method: Clip
Package Cooled: TO-220
Width: 0.500" (12.70mm)
Type: Board Level
Shape: Rectangular, Fins
Length: 1.500" (38.10mm)
Material: Aluminum
Packaging: Bulk
auf Bestellung 1497 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.08 EUR
10+3.61 EUR
25+3.44 EUR
50+3.32 EUR
100+3.2 EUR
250+3.04 EUR
500+2.93 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
573902B03100G Boyd Laconia, LLC Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 18.80°C/W
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 0.500" (12.70mm)
Type: Board Level
Shape: Rectangular, Fins
Length: 1.500" (38.10mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
573902B03900G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
573902B04000G 573902B04000G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK TO-220 CLIP-ON/TAB
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 18.80°C/W
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 0.500" (12.70mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.500" (38.10mm)
Material: Aluminum
Packaging: Bulk
auf Bestellung 4665 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.69 EUR
10+2.38 EUR
25+2.27 EUR
50+2.18 EUR
100+2.1 EUR
250+2 EUR
500+1.93 EUR
2000+1.91 EUR
Mindestbestellmenge: 7
Im Einkaufswagen  Stück im Wert von  UAH
574004B00000G 574004B00000G Boyd Laconia, LLC AA-574004B00000G.pdf Description: HEATSINK TO-202 CLIP-ON .58" BK
Packaging: Bag
Material: Aluminum
Length: 0.800" (20.32mm)
Shape: Rectangular
Type: Board Level
Width: 0.577" (14.66mm)
Package Cooled: TO-202
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 28.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
574102B00000G 574102B00000G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK TO-220 CLIP-ON BLK
Packaging: Bag
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 23.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2023 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.04 EUR
10+2.7 EUR
25+2.57 EUR
50+2.48 EUR
100+2.39 EUR
250+2.28 EUR
500+2.2 EUR
2000+2.04 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
574204B03300G Boyd Laconia, LLC Board-Level-Cooling-Slide-On-5742.pdf Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 0.420" (10.67mm)
Thermal Resistance @ Natural: 16.80°C/W
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-202
Width: 1.020" (25.91mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 0.900" (22.86mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
574402B03200G 574402B03200G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK TO220 HOR MNT W/TAB.75"
Material: Aluminum
Packaging: Bulk
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.395" (10.03mm)
Thermal Resistance @ Natural: 23.20°C/W
Thermal Resistance @ Forced Air Flow: 12.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 0.860" (21.84mm)
Type: Board Level
Shape: Rectangular, Fins
Length: 0.750" (19.05mm)
auf Bestellung 13359 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.63 EUR
10+3.2 EUR
25+3.05 EUR
50+2.94 EUR
100+2.83 EUR
250+2.7 EUR
500+2.6 EUR
3000+2.36 EUR
6000+2.28 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
574502B00000G 574502B00000G Boyd Laconia, LLC Boyd-Board-Level-Heatsinks-Catalog.pdf Description: HEATSINK TO-220 VERT MNT .75"
Packaging: Bag
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 21.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 34862 Stücke:
Lieferzeit 10-14 Tag (e)
27+0.67 EUR
30+0.6 EUR
31+0.57 EUR
50+0.55 EUR
100+0.53 EUR
250+0.51 EUR
500+0.49 EUR
3000+0.44 EUR
6000+0.43 EUR
Mindestbestellmenge: 27
Im Einkaufswagen  Stück im Wert von  UAH
533402B02552G Boyd-Board-Level-Heatsinks-Catalog.pdf
533402B02552G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 SOLDERPIN/CLIP
Thermal Resistance @ Natural: 5.00°C/W
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 500 LFM
Power Dissipation @ Temperature Rise: 8.0W @ 40°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.650" (41.91mm)
Material: Aluminum
Packaging: Bulk
Material Finish: Black Anodized
Fin Height: 1.500" (38.10mm)
auf Bestellung 223 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.2 EUR
10+11.68 EUR
25+11.13 EUR
50+10.73 EUR
100+10.34 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
533422B02552G Boyd-Board-Level-Heatsinks-Catalog.pdf
533422B02552G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 SOLDERPIN/CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.650" (41.91mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 10.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 200 LFM
Fin Height: 1.500" (38.10mm)
Material Finish: Black Anodized
auf Bestellung 5719 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.12 EUR
10+5.42 EUR
25+5.16 EUR
50+4.97 EUR
240+4.58 EUR
480+4.41 EUR
720+4.32 EUR
1200+4.2 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
533501B12552G
Hersteller: Boyd Laconia, LLC
Description: STD,533501B12552G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
533502B02552G Board-Level-Cooling-Extruded-5334.pdf
533502B02552G
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Shape: Rectangular, Fins
Length: 1.650" (41.91mm)
Material: Aluminum
Packaging: Bulk
Material Finish: Black Anodized
Fin Height: 2.000" (50.80mm)
Thermal Resistance @ Natural: 4.50°C/W
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
533522B02552G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Part Status: Active
Material Finish: Black Anodized
Fin Height: 1.000" (25.40mm)
Thermal Resistance @ Natural: 2.70°C/W
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220 (Dual)
Width: 1.650" (41.91mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
533566B42552G
Hersteller: Boyd Laconia, LLC
Description: 533566B42552G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
533602B02552G Board-Level-Heatsinks_Cat.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 1.000" (25.40mm)
Thermal Resistance @ Natural: 3.80°C/W
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Power Dissipation @ Temperature Rise: 16.0W @ 50°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.650" (41.91mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.500" (63.50mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
533621B02500G
Hersteller: Boyd Laconia, LLC
Description: STD,533621B02500G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
533766B42152G
Hersteller: Boyd Laconia, LLC
Description: STD,533766B42152G
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
533802B02500G Boyd-Board-Level-Heatsinks-Catalog.pdf
533802B02500G
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 13.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Attachment Method: PC Pin
Package Cooled: TO-220
Width: 1.375" (34.93mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.000" (25.40mm)
Material: Aluminum
Packaging: Bulk
auf Bestellung 2091 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.78 EUR
10+6.9 EUR
25+6.57 EUR
50+6.33 EUR
100+6.1 EUR
250+5.81 EUR
540+5.58 EUR
1080+5.38 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
534202B02853G Boyd-Board-Level-Heatsinks-Catalog.pdf
534202B02853G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 W/SHURLOCK-CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 16467 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.32 EUR
10+7.36 EUR
25+7.01 EUR
50+6.76 EUR
100+6.51 EUR
486+5.99 EUR
972+5.77 EUR
1458+5.65 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
534202B03453G Boyd-Board-Level-Heatsinks-Catalog.pdf
534202B03453G
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEATSINK .5" TO-220
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 705 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.59 EUR
10+8.5 EUR
25+8.1 EUR
50+7.8 EUR
100+7.52 EUR
250+7.16 EUR
500+6.9 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
534302B03553G Board-Level-Heatsinks_Cat.pdf
534302B03553G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 W/TAB-KOOLCLIP
Thermal Resistance @ Natural: 10.40°C/W
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 60°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.380" (35.05mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Material: Aluminum
Packaging: Bulk
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.480" (12.19mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
534302B13553
Hersteller: Boyd Laconia, LLC
Description: STD,534302B13553
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
53-77-13ACG
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 18.03X12.7MM W/ADH
Part Status: Active
Adhesive: Adhesive - One Side
Thermal Conductivity: 0.9W/m-K
Outline: 18.03mm x 12.70mm
Usage: TO-220
Type: Pad, Sheet
Thickness: 0.0060" (0.152mm)
Shape: Rectangular
Material: Silicone Rubber
Color: Gray, Green
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
53-77-2G Boyd-Thermal-Interface-Materials-Catalog.pdf
53-77-2G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 17.5MMX14.27MM GRY/GRN
Thermal Conductivity: 0.9W/m-K
Outline: 17.50mm x 14.27mm
Usage: TO-220
Type: Pad, Sheet
Thickness: 0.0060" (0.152mm)
Shape: Rectangular
Material: Silicone Rubber
Color: Gray, Green
Packaging: Bulk
auf Bestellung 2840 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.15 EUR
10+1.91 EUR
25+1.82 EUR
50+1.75 EUR
100+1.69 EUR
250+1.61 EUR
500+1.55 EUR
1000+1.5 EUR
Mindestbestellmenge: 9
Im Einkaufswagen  Stück im Wert von  UAH
53-77-3G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 17.5MMX14.27MM GRY/GRN
Thermal Conductivity: 0.9W/m-K
Outline: 17.50mm x 14.27mm
Usage: TO-220
Type: Pad, Sheet
Thickness: 0.0060" (0.152mm)
Shape: Rectangular
Material: Silicone Rubber
Color: Gray, Green
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
53-77-4ACG Boyd-Board-Level-Heatsinks-Catalog.pdf
53-77-4ACG
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 19.05X12.7MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
auf Bestellung 11801 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
14+1.28 EUR
16+1.14 EUR
25+1.09 EUR
50+1.05 EUR
100+1.01 EUR
250+0.96 EUR
500+0.93 EUR
1000+0.89 EUR
5000+0.82 EUR
Mindestbestellmenge: 14
Im Einkaufswagen  Stück im Wert von  UAH
53-77-4G Boyd-Board-Level-Heatsinks-Catalog.pdf
53-77-4G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 19.05MMX12.7MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
auf Bestellung 5292 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
16+1.16 EUR
18+1.02 EUR
25+0.98 EUR
50+0.94 EUR
100+0.91 EUR
250+0.86 EUR
500+0.83 EUR
1000+0.8 EUR
5000+0.74 EUR
Mindestbestellmenge: 16
Im Einkaufswagen  Stück im Wert von  UAH
53-77-9ACG Boyd-Board-Level-Heatsinks-Catalog.pdf
53-77-9ACG
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 18.42X13.21MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
auf Bestellung 9606 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12+1.53 EUR
13+1.36 EUR
25+1.29 EUR
50+1.24 EUR
100+1.2 EUR
250+1.14 EUR
500+1.1 EUR
2000+1.02 EUR
6000+0.97 EUR
Mindestbestellmenge: 12
Im Einkaufswagen  Stück im Wert von  UAH
53-77-9G Boyd-Board-Level-Heatsinks-Catalog.pdf
53-77-9G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 18.42X13.21MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Thermal Conductivity: 0.9W/m-K
Part Status: Active
auf Bestellung 8466 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
22+0.81 EUR
25+0.72 EUR
26+0.69 EUR
50+0.66 EUR
100+0.64 EUR
250+0.61 EUR
500+0.59 EUR
2000+0.54 EUR
6000+0.51 EUR
Mindestbestellmenge: 22
Im Einkaufswagen  Stück im Wert von  UAH
53-78-3AC
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 25.4X20.32MM W/ADH
Part Status: Active
Adhesive: Adhesive - One Side
Thermal Conductivity: 0.9W/m-K
Outline: 25.40mm x 20.32mm
Usage: TO-218
Type: Pad, Sheet
Thickness: 0.0060" (0.152mm)
Shape: Polygon, 5-sided
Material: Silicone Rubber
Color: Gray, Green
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
542502B00000G Boyd-Board-Level-Heatsinks-Catalog.pdf
542502B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 TAB BLACK
Material Finish: Black Anodized
Fin Height: 0.250" (6.35mm)
Thermal Resistance @ Natural: 24.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 0.875" (22.22mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.250" (31.75mm)
Material: Aluminum
Packaging: Bulk
auf Bestellung 5275 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.26 EUR
10+4.66 EUR
25+4.44 EUR
50+4.28 EUR
100+4.12 EUR
250+3.93 EUR
500+3.79 EUR
1000+3.65 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
542502D00000G Boyd-Board-Level-Heatsinks-Catalog.pdf
542502D00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 TAB TIN
Material Finish: Tin
Fin Height: 0.250" (6.35mm)
Thermal Resistance @ Natural: 24.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 0.875" (22.22mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.250" (31.75mm)
Material: Aluminum
Packaging: Bulk
auf Bestellung 6525 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.3 EUR
10+5.57 EUR
25+5.31 EUR
50+5.11 EUR
100+4.93 EUR
250+4.7 EUR
500+4.53 EUR
1000+4.36 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
551002B00000G Board-Level-Heatsinks_Cat.pdf
551002B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 1.45" HIGH
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.787" (19.99mm)
Thermal Resistance @ Natural: 12.40°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 1.5W @ 20°C
Attachment Method: Bolt On
Package Cooled: TO-220
Width: 1.006" (25.55mm)
Type: Board Level
Shape: Rectangular, Fins
Length: 1.450" (36.83mm)
Material: Aluminum
Packaging: Bag
auf Bestellung 1284 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.67 EUR
10+6.49 EUR
25+6.31 EUR
50+5.96 EUR
100+5.61 EUR
250+5.26 EUR
500+5.09 EUR
1000+4.56 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
552844B00000 Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.720" (18.29mm)
Thermal Resistance @ Natural: 8.70°C/W
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 30°C
Attachment Method: Bolt On
Package Cooled: TO-220 (Dual)
Width: 1.780" (45.21mm)
Type: Board Level
Shape: Square, Fins
Length: 1.780" (45.21mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
552844B00000G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: Boyd Laconia, LLC
Description: HEATSINK
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
56-02-101G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 26.16MMX22.61MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rectangular
Thickness: 0.0030" (0.076mm)
Type: Insulator
Usage: TO-218, TO-247, TO-3P
Outline: 26.16mm x 22.61mm
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
56-03-8G
56-03-8G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 42.85X30.15MM OPAQUE
Part Status: Active
Outline: 42.85mm x 30.15mm
Type: Insulator
Thickness: 0.0020" (0.051mm)
Shape: Rhombus
Material: Mica
Color: Opaque
Packaging: Bulk
Usage: TO-3
auf Bestellung 2740 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13+1.36 EUR
15+1.21 EUR
25+1.16 EUR
50+1.11 EUR
100+1.08 EUR
250+1.03 EUR
500+0.99 EUR
Mindestbestellmenge: 13
Im Einkaufswagen  Stück im Wert von  UAH
563002B00000G Boyd-Board-Level-Heatsinks-Catalog.pdf
563002B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 VERT MNT 1.18"
Packaging: Bag
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 1667 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.55 EUR
10+6.68 EUR
25+6.36 EUR
50+6.13 EUR
100+5.91 EUR
250+5.63 EUR
500+5.43 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
563002D00000G Boyd-Board-Level-Heatsinks-Catalog.pdf
563002D00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 TAB TIN
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 13.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.180" (29.97mm)
Packaging: Bulk
Material Finish: Tin
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.01 EUR
10+2.67 EUR
25+2.54 EUR
50+2.45 EUR
100+2.36 EUR
250+2.25 EUR
500+2.17 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
563202D00000G Board-Level-Heatsinks_Cat.pdf
563202D00000G
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Material Finish: Tin
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 9.40°C/W
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 1.380" (35.05mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Packaging: Bulk
auf Bestellung 2732 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.29 EUR
10+2.92 EUR
25+2.78 EUR
50+2.68 EUR
100+2.59 EUR
420+2.5 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
566010B00000G Board-Level-Heatsinks_Cat.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 11.50°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 40°C
Attachment Method: Clip
Package Cooled: Multiwatt, SIP
Width: 1.000" (25.40mm)
Type: Board Level
Shape: Rectangular, Fins
Length: 1.220" (30.99mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
566010B02800G Board-Level-Heatsinks_Cat.pdf
566010B02800G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 CLIP-ON W/TABS
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 11.50°C/W
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Attachment Method: Clip and Board Locks
Package Cooled: Multiwatt, SIP
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.220" (30.99mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
566010B03400G Boyd-Board-Level-Heatsinks-Catalog.pdf
566010B03400G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK W/TAB BLACK
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 11.50°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Attachment Method: Clip and PC Pin
Package Cooled: Multiwatt, SIP
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.220" (30.99mm)
Material: Aluminum
Packaging: Bulk
auf Bestellung 1574 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.9 EUR
10+12.3 EUR
25+11.72 EUR
50+11.29 EUR
100+10.89 EUR
250+10.37 EUR
800+9.74 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
566102B00000G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
566902B04000G Board-Level-Heatsinks_Cat.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 18.80°C/W
Thermal Resistance @ Forced Air Flow: 9.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220, TO-262
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 0.850" (21.59mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
56-77-11G
56-77-11G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 18.92MMX13.84MM OPAQUE
Outline: 18.92mm x 13.84mm
Usage: TO-220
Type: Insulator
Thickness: 0.0020" (0.051mm)
Shape: Rectangular
Material: Mica
Color: Opaque
Packaging: Bulk
auf Bestellung 9799 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
21+0.84 EUR
24+0.74 EUR
26+0.7 EUR
50+0.68 EUR
100+0.65 EUR
250+0.62 EUR
500+0.6 EUR
1000+0.58 EUR
5000+0.53 EUR
Mindestbestellmenge: 21
Im Einkaufswagen  Stück im Wert von  UAH
56-77-8G Boyd-Board-Level-Heatsinks-Catalog.pdf
56-77-8G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 18.92MMX13.84MM Clear
Packaging: Bulk
Color: Clear
Material: Mica
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Usage: TO-220
Outline: 18.92mm x 13.84mm
auf Bestellung 8184 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
17+1.04 EUR
20+0.91 EUR
25+0.86 EUR
50+0.83 EUR
100+0.8 EUR
250+0.77 EUR
500+0.74 EUR
1000+0.71 EUR
5000+0.65 EUR
Mindestbestellmenge: 17
Im Einkaufswagen  Stück im Wert von  UAH
568303B00000G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
568303B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-3 1.25" 25WATT
Material Finish: Black Anodized
Fin Height: 1.250" (31.75mm)
Thermal Resistance @ Natural: 5.40°C/W
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 5.0W @ 30°C
Attachment Method: Bolt On
Package Cooled: TO-3
Width: 1.810" (45.97mm)
Type: Board Level
Shape: Square
Length: 1.810" (45.97mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
568403B00000 Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 1.500" (38.10mm)
Thermal Resistance @ Natural: 4.70°C/W
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 5.0W @ 30°C
Attachment Method: Bolt On
Package Cooled: TO-3
Width: 1.810" (45.97mm)
Type: Top Mount
Shape: Rectangular, Pin Fins
Length: 1.810" (45.97mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
569003B00000G Boyd-Board-Level-Heatsinks-Catalog.pdf
569003B00000G
Hersteller: Boyd Laconia, LLC
Description: COOLER FOR TO-3 20 WATTS
Part Status: Active
Material Finish: Black Anodized
Fin Height: 1.310" (33.27mm)
Thermal Resistance @ Natural: 5.50°C/W
Thermal Resistance @ Forced Air Flow: 1.50°C/W @ 500 LFM
Power Dissipation @ Temperature Rise: 12.0W @ 60°C
Attachment Method: Bolt On
Package Cooled: TO-3
Width: 1.830" (46.48mm)
Type: Board Level
Shape: Square, Pin Fins
Length: 1.830" (46.48mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 690 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.23 EUR
10+10.83 EUR
25+10.31 EUR
50+9.94 EUR
100+9.58 EUR
250+9.13 EUR
500+8.8 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
573100D00000G Boyd-Board-Level-Heatsinks-Catalog.pdf
573100D00000G
Hersteller: Boyd Laconia, LLC
Description: TOP MOUNT HEATSINK .4" D-PAK
Length: 0.315" (8.00mm)
Material: Aluminum
Packaging: Bulk
Part Status: Active
Material Finish: Tin
Fin Height: 0.400" (10.16mm)
Thermal Resistance @ Natural: 15.00°C/W
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Attachment Method: SMD Pad
Package Cooled: TO-252 (DPAK)
Width: 0.900" (22.86mm)
Type: Top Mount
Shape: Rectangular, Fins
auf Bestellung 3237 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.88 EUR
10+6.99 EUR
25+6.66 EUR
50+6.42 EUR
100+6.18 EUR
250+5.89 EUR
500+5.68 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
573100D00010G Boyd-Board-Level-Heatsinks-Catalog.pdf
573100D00010G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
auf Bestellung 12750 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
250+0.67 EUR
500+0.64 EUR
750+0.63 EUR
1250+0.61 EUR
1750+0.6 EUR
2500+0.59 EUR
6250+0.56 EUR
12500+0.54 EUR
Mindestbestellmenge: 250
Im Einkaufswagen  Stück im Wert von  UAH
573100D00010G Boyd-Board-Level-Heatsinks-Catalog.pdf
573100D00010G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
auf Bestellung 12944 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
20+0.9 EUR
23+0.79 EUR
25+0.75 EUR
50+0.73 EUR
100+0.7 EUR
Mindestbestellmenge: 20
Im Einkaufswagen  Stück im Wert von  UAH
573300D00000G Boyd-Board-Level-Heatsinks-Catalog.pdf
573300D00000G
Hersteller: Boyd Laconia, LLC
Description: TOP MOUNT HEATSINK .4" D2PAK
Packaging: Bulk
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 2692 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.28 EUR
10+5.56 EUR
25+5.3 EUR
50+5.11 EUR
100+4.92 EUR
250+4.69 EUR
500+4.52 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
573300D00010G Boyd-Board-Level-Heatsinks-Catalog.pdf
573300D00010G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 11523 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
250+0.79 EUR
500+0.76 EUR
750+0.75 EUR
1250+0.73 EUR
1750+0.71 EUR
2500+0.7 EUR
6250+0.67 EUR
Mindestbestellmenge: 250
Im Einkaufswagen  Stück im Wert von  UAH
573300D00010G Boyd-Board-Level-Heatsinks-Catalog.pdf
573300D00010G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 11523 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
17+1.06 EUR
19+0.94 EUR
25+0.9 EUR
50+0.86 EUR
100+0.83 EUR
Mindestbestellmenge: 17
Im Einkaufswagen  Stück im Wert von  UAH
573400D00000G Board-Level-Heatsinks_Cat.pdf
573400D00000G
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Part Status: Active
Material Finish: Tin
Fin Height: 0.401" (10.20mm)
Thermal Resistance @ Natural: 14.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Attachment Method: SMD Pad
Package Cooled: TO-268 (D³Pak)
Width: 1.220" (30.99mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 0.500" (12.70mm)
Packaging: Bulk
auf Bestellung 2248 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.79 EUR
10+4.67 EUR
25+4.55 EUR
50+4.29 EUR
100+4.04 EUR
250+3.79 EUR
500+3.66 EUR
1000+3.28 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
573400D00010G Board-Level-Heatsinks_Cat.pdf
573400D00010G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK D-PAK3 TIN PLATED SMD
Part Status: Active
Material Finish: Tin
Fin Height: 0.401" (10.20mm)
Thermal Resistance @ Natural: 14.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Attachment Method: SMD Pad
Package Cooled: TO-268 (D³Pak)
Width: 1.220" (30.99mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 0.500" (12.70mm)
Material: Copper
Packaging: Tape & Reel (TR)
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
250+4.79 EUR
500+4.61 EUR
750+4.51 EUR
1250+4.39 EUR
1750+4.31 EUR
2500+4.23 EUR
Mindestbestellmenge: 250
Im Einkaufswagen  Stück im Wert von  UAH
573400D00010G Board-Level-Heatsinks_Cat.pdf
573400D00010G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK D-PAK3 TIN PLATED SMD
Part Status: Active
Material Finish: Tin
Fin Height: 0.401" (10.20mm)
Thermal Resistance @ Natural: 14.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Attachment Method: SMD Pad
Package Cooled: TO-268 (D³Pak)
Width: 1.220" (30.99mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 0.500" (12.70mm)
Material: Copper
Packaging: Cut Tape (CT)
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.48 EUR
10+5.75 EUR
25+5.48 EUR
50+5.29 EUR
100+5.1 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
573902B00000G Board-Level-Heatsinks_Cat.pdf
573902B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 BLACK CLIP-ON
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 18.80°C/W
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Attachment Method: Clip
Package Cooled: TO-220
Width: 0.500" (12.70mm)
Type: Board Level
Shape: Rectangular, Fins
Length: 1.500" (38.10mm)
Material: Aluminum
Packaging: Bulk
auf Bestellung 1497 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+4.08 EUR
10+3.61 EUR
25+3.44 EUR
50+3.32 EUR
100+3.2 EUR
250+3.04 EUR
500+2.93 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
573902B03100G
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 18.80°C/W
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 0.500" (12.70mm)
Type: Board Level
Shape: Rectangular, Fins
Length: 1.500" (38.10mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
573902B03900G Board-Level-Heatsinks_Cat.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
573902B04000G Board-Level-Heatsinks_Cat.pdf
573902B04000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 CLIP-ON/TAB
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 18.80°C/W
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 0.500" (12.70mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.500" (38.10mm)
Material: Aluminum
Packaging: Bulk
auf Bestellung 4665 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.69 EUR
10+2.38 EUR
25+2.27 EUR
50+2.18 EUR
100+2.1 EUR
250+2 EUR
500+1.93 EUR
2000+1.91 EUR
Mindestbestellmenge: 7
Im Einkaufswagen  Stück im Wert von  UAH
574004B00000G AA-574004B00000G.pdf
574004B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-202 CLIP-ON .58" BK
Packaging: Bag
Material: Aluminum
Length: 0.800" (20.32mm)
Shape: Rectangular
Type: Board Level
Width: 0.577" (14.66mm)
Package Cooled: TO-202
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 28.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
574102B00000G Boyd-Board-Level-Heatsinks-Catalog.pdf
574102B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 CLIP-ON BLK
Packaging: Bag
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 23.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2023 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.04 EUR
10+2.7 EUR
25+2.57 EUR
50+2.48 EUR
100+2.39 EUR
250+2.28 EUR
500+2.2 EUR
2000+2.04 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
574204B03300G Board-Level-Cooling-Slide-On-5742.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 0.420" (10.67mm)
Thermal Resistance @ Natural: 16.80°C/W
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-202
Width: 1.020" (25.91mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 0.900" (22.86mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
574402B03200G Boyd-Board-Level-Heatsinks-Catalog.pdf
574402B03200G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO220 HOR MNT W/TAB.75"
Material: Aluminum
Packaging: Bulk
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.395" (10.03mm)
Thermal Resistance @ Natural: 23.20°C/W
Thermal Resistance @ Forced Air Flow: 12.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 0.860" (21.84mm)
Type: Board Level
Shape: Rectangular, Fins
Length: 0.750" (19.05mm)
auf Bestellung 13359 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.63 EUR
10+3.2 EUR
25+3.05 EUR
50+2.94 EUR
100+2.83 EUR
250+2.7 EUR
500+2.6 EUR
3000+2.36 EUR
6000+2.28 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
574502B00000G Boyd-Board-Level-Heatsinks-Catalog.pdf
574502B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 VERT MNT .75"
Packaging: Bag
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 21.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 34862 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
27+0.67 EUR
30+0.6 EUR
31+0.57 EUR
50+0.55 EUR
100+0.53 EUR
250+0.51 EUR
500+0.49 EUR
3000+0.44 EUR
6000+0.43 EUR
Mindestbestellmenge: 27
Im Einkaufswagen  Stück im Wert von  UAH
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