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531002B02500G 531002B02500G Boyd Laconia, LLC Board-Level-Cooling-Extruded-5310.pdf Description: HEATSINK TO-220 W/PINS 1" TALL
Packaging: Bulk
Material: Aluminum
Length: 1.000" (25.40mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 7630 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.52 EUR
10+ 2.39 EUR
25+ 2.33 EUR
50+ 2.26 EUR
100+ 2.14 EUR
250+ 2.01 EUR
500+ 1.89 EUR
1000+ 1.76 EUR
5000+ 1.7 EUR
Mindestbestellmenge: 7
531102B00000G 531102B00000G Boyd Laconia, LLC Board-Level-Cooling-Extruded-5310.pdf Description: HEATSINK TO-220 H=1.5" BLK
Packaging: Box
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220, TO-202
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 7.0W @ 70°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 10.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 1013 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.87 EUR
10+ 12.53 EUR
25+ 11.83 EUR
50+ 11.14 EUR
100+ 10.44 EUR
250+ 9.74 EUR
500+ 9.05 EUR
1000+ 8.87 EUR
Mindestbestellmenge: 2
531102B02100G Boyd Laconia, LLC Board-Level-Cooling-Extruded-5310.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.374" (34.90mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 7.0W @ 70°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 10.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 970 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.54 EUR
10+ 10.26 EUR
510+ 7.41 EUR
Mindestbestellmenge: 2
531102B02500G 531102B02500G Boyd Laconia, LLC Board-Level-Cooling-Extruded-5310.pdf Description: HEATSINK TO-220 W/PINS 1.5"TALL
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 7.0W @ 70°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 10.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 5615 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.76 EUR
10+ 2.62 EUR
25+ 2.55 EUR
50+ 2.48 EUR
100+ 2.35 EUR
250+ 2.21 EUR
510+ 2.07 EUR
1020+ 1.93 EUR
5100+ 1.86 EUR
Mindestbestellmenge: 7
531202B02100G 531202B02100G Boyd Laconia, LLC Board-Level-Cooling-Extruded-5310.pdf Description: HEATSINK TO-220 SOLDERPIN 50.8MM
Packaging: Bulk
Material: Aluminum
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220, TO-202
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 8.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 7.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 3190 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.07 EUR
10+ 3.97 EUR
25+ 3.86 EUR
50+ 3.64 EUR
100+ 3.43 EUR
250+ 3.22 EUR
500+ 3.11 EUR
1000+ 2.79 EUR
Mindestbestellmenge: 5
531202B02500G 531202B02500G Boyd Laconia, LLC Board-Level-Cooling-Extruded-5310.pdf Description: HEATSINK TO-220 POWER W/PINS BK
Packaging: Bulk
Material: Aluminum
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220, TO-202
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 5.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 7.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 3683 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.06 EUR
10+ 2.92 EUR
25+ 2.84 EUR
50+ 2.77 EUR
100+ 2.61 EUR
250+ 2.46 EUR
500+ 2.3 EUR
1000+ 2.15 EUR
Mindestbestellmenge: 6
531302B02500G 531302B02500G Boyd Laconia, LLC Board-Level-Cooling-Extruded-5310.pdf Description: HEATSINK TO-220 H=2.5" BLK W/PIN
Packaging: Bulk
Material: Aluminum
Length: 2.500" (63.50mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220, TO-202
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 8.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2014 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.25 EUR
10+ 7.05 EUR
25+ 6.86 EUR
50+ 6.48 EUR
100+ 6.1 EUR
250+ 5.72 EUR
750+ 5.53 EUR
1500+ 4.96 EUR
Mindestbestellmenge: 3
532602B00000 Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.650" (41.91mm)
Package Cooled: TO-220
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 6.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 5.50°C/W
Fin Height: 1.000" (25.40mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
532602B02500G 532602B02500G Boyd Laconia, LLC Board-Level-Cooling-High-Power-Extruded-5320.pdf Description: HEATSINK TO-220 SOLDERPIN 38.1MM
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.650" (41.91mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 5.50°C/W
Fin Height: 1.000" (25.40mm)
Material Finish: Black Anodized
auf Bestellung 1715 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.56 EUR
10+ 3.45 EUR
240+ 2.8 EUR
1200+ 2.43 EUR
Mindestbestellmenge: 5
532802B02500G Boyd Laconia, LLC Board-Level-Cooling-High-Power-Extruded-5320.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 2.500" (63.50mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.650" (41.91mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 4.20°C/W
Fin Height: 1.000" (25.40mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
533002B02551G 533002B02551G Boyd Laconia, LLC Board-Level-Cooling-Extruded-5330.pdf Description: HEATSINK TO-220 SOLDERPIN/CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.000" (25.40mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 1467 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.5 EUR
10+ 3.4 EUR
750+ 2.67 EUR
Mindestbestellmenge: 6
533201B02500G Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-218, TO-247
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 9.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
533201B12500G Boyd Laconia, LLC Description: STD,533201B12500G
Packaging: Bulk
Produkt ist nicht verfügbar
533422B02552G 533422B02552G Boyd Laconia, LLC Board-Level-Cooling-Extruded-5334.pdf Description: HEATSINK TO-220 SOLDERPIN/CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.650" (41.91mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 10.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 200 LFM
Fin Height: 1.500" (38.10mm)
Material Finish: Black Anodized
auf Bestellung 8087 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.23 EUR
10+ 6.06 EUR
25+ 5.9 EUR
50+ 5.57 EUR
100+ 5.24 EUR
250+ 4.92 EUR
500+ 4.75 EUR
1000+ 4.26 EUR
Mindestbestellmenge: 3
533502B02552G 533502B02552G Boyd Laconia, LLC Board-Level-Cooling-Extruded-5334.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.650" (41.91mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 2.000" (50.80mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
533522B02552G Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.650" (41.91mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Thermal Resistance @ Natural: 2.70°C/W
Fin Height: 1.000" (25.40mm)
Material Finish: Black Anodized
Part Status: Active
Produkt ist nicht verfügbar
533766B42152G Boyd Laconia, LLC Description: STD,533766B42152G
Packaging: Bulk
Produkt ist nicht verfügbar
533802B02500G 533802B02500G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.000" (25.40mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 2466 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.84 EUR
10+ 5.69 EUR
25+ 5.54 EUR
50+ 5.42 EUR
Mindestbestellmenge: 4
534202B02853G 534202B02853G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK TO-220 W/SHURLOCK-CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 20099 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.73 EUR
10+ 2.6 EUR
25+ 2.53 EUR
50+ 2.46 EUR
100+ 2.32 EUR
250+ 2.19 EUR
500+ 2.05 EUR
1000+ 1.91 EUR
5000+ 1.85 EUR
Mindestbestellmenge: 7
534202B03453G 534202B03453G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: BOARD LEVEL HEATSINK .5" TO-220
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 1640 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.06 EUR
10+ 8.82 EUR
500+ 6.91 EUR
1000+ 6.2 EUR
Mindestbestellmenge: 2
534302B03553G 534302B03553G Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: HEATSINK TO-220 W/TAB-KOOLCLIP
Packaging: Bulk
Material: Aluminum
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.380" (35.05mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.40°C/W
Fin Height: 0.480" (12.19mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
534302B13553 Boyd Laconia, LLC Description: STD,534302B13553
Packaging: Bulk
Produkt ist nicht verfügbar
53-77-2G 53-77-2G Boyd Laconia, LLC LA034744.pdf Description: THERM PAD 17.5MMX14.27MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 17.50mm x 14.27mm
Thermal Conductivity: 0.9W/m-K
auf Bestellung 3016 Stücke:
Lieferzeit 10-14 Tag (e)
19+0.93 EUR
20+ 0.89 EUR
100+ 0.81 EUR
1000+ 0.64 EUR
Mindestbestellmenge: 19
53-77-4ACG 53-77-4ACG Boyd Laconia, LLC Description: THERM PAD 19.05X12.7MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
auf Bestellung 6137 Stücke:
Lieferzeit 10-14 Tag (e)
14+1.28 EUR
15+ 1.23 EUR
25+ 1.17 EUR
50+ 1.14 EUR
100+ 1.12 EUR
250+ 1.05 EUR
500+ 0.99 EUR
1000+ 0.89 EUR
5000+ 0.86 EUR
Mindestbestellmenge: 14
53-77-4G 53-77-4G Boyd Laconia, LLC Description: THERM PAD 19.05MMX12.7MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
auf Bestellung 4635 Stücke:
Lieferzeit 10-14 Tag (e)
14+1.28 EUR
15+ 1.22 EUR
25+ 1.17 EUR
50+ 1.13 EUR
100+ 1.12 EUR
250+ 1.04 EUR
500+ 0.98 EUR
1000+ 0.89 EUR
Mindestbestellmenge: 14
53-77-9G 53-77-9G Boyd Laconia, LLC Aavid_Board_Level_Heatsinks_Catalog_2018.pdf Description: THERM PAD 18.42X13.21MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Thermal Conductivity: 0.9W/m-K
Part Status: Active
auf Bestellung 44258 Stücke:
Lieferzeit 10-14 Tag (e)
17+1.06 EUR
18+ 1 EUR
25+ 0.96 EUR
50+ 0.93 EUR
100+ 0.92 EUR
250+ 0.85 EUR
500+ 0.8 EUR
1000+ 0.73 EUR
5000+ 0.7 EUR
Mindestbestellmenge: 17
542502B00000G 542502B00000G Boyd Laconia, LLC Board-Level-Cooling-Space-Saving-5425.pdf Description: HEATSINK TO-220 TAB BLACK
Packaging: Bulk
Material: Aluminum
Length: 1.250" (31.75mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.875" (22.22mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 24.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
auf Bestellung 6595 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.28 EUR
10+ 5.14 EUR
25+ 5 EUR
50+ 4.72 EUR
100+ 4.44 EUR
250+ 4.17 EUR
500+ 4.03 EUR
1000+ 3.61 EUR
Mindestbestellmenge: 4
542502D00000G 542502D00000G Boyd Laconia, LLC Board-Level-Cooling-Space-Saving-5425.pdf Description: HEATSINK TO-220 TAB TIN
Packaging: Bulk
Material: Aluminum
Length: 1.250" (31.75mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.875" (22.22mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 24.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Tin
auf Bestellung 8037 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.53 EUR
10+ 6.36 EUR
25+ 6.19 EUR
50+ 5.85 EUR
100+ 5.5 EUR
250+ 5.16 EUR
500+ 4.99 EUR
1000+ 4.47 EUR
Mindestbestellmenge: 3
552844B00000 Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.780" (45.21mm)
Shape: Square, Fins
Type: Board Level
Width: 1.780" (45.21mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 3.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 8.70°C/W
Fin Height: 0.720" (18.29mm)
Material Finish: Black Anodized
Part Status: Active
Produkt ist nicht verfügbar
552844B00000G Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: HEATSINK
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
56-02-101G Boyd Laconia, LLC Description: THERM PAD 26.16MMX22.61MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rectangular
Thickness: 0.0030" (0.076mm)
Type: Insulator
Usage: TO-218, TO-247, TO-3P
Outline: 26.16mm x 22.61mm
Produkt ist nicht verfügbar
56-03-8G 56-03-8G Boyd Laconia, LLC Description: THERM PAD 42.85X30.15MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rhombus
Thickness: 0.0020" (0.051mm)
Type: Insulator
Usage: TO-3
Outline: 42.85mm x 30.15mm
Part Status: Active
auf Bestellung 3806 Stücke:
Lieferzeit 10-14 Tag (e)
14+1.27 EUR
15+ 1.21 EUR
100+ 1.1 EUR
Mindestbestellmenge: 14
563002B00000G 563002B00000G Boyd Laconia, LLC Board-Level-Cooling-Channel-5600.pdf Description: HEATSINK TO-220 VERT MNT 1.18"
Packaging: Bag
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 970 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.66 EUR
10+ 7.46 EUR
25+ 7.25 EUR
50+ 6.85 EUR
100+ 6.45 EUR
250+ 6.05 EUR
500+ 5.84 EUR
Mindestbestellmenge: 3
563002D00000G 563002D00000G Boyd Laconia, LLC Board-Level-Cooling-Channel-5600.pdf Description: HEATSINK TO-220 TAB TIN
Packaging: Bulk
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Tin
auf Bestellung 990 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.8 EUR
10+ 12.44 EUR
25+ 11.75 EUR
50+ 11.06 EUR
100+ 10.37 EUR
250+ 9.68 EUR
500+ 8.99 EUR
Mindestbestellmenge: 2
563202D00000G 563202D00000G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.380" (35.05mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 9.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Tin
auf Bestellung 2719 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.7 EUR
10+ 3.6 EUR
420+ 2.92 EUR
1260+ 2.53 EUR
Mindestbestellmenge: 5
566010B02800G 566010B02800G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK TO-220 CLIP-ON W/TABS
Packaging: Bulk
Material: Aluminum
Length: 1.220" (30.99mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: Multiwatt, SIP
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
566010B03400G 566010B03400G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK W/TAB BLACK
Packaging: Bulk
Material: Aluminum
Length: 1.220" (30.99mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: Multiwatt, SIP
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 4978 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.75 EUR
10+ 2.6 EUR
800+ 2.06 EUR
1600+ 1.92 EUR
Mindestbestellmenge: 7
566102B00000G Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Produkt ist nicht verfügbar
56-77-11G 56-77-11G Boyd Laconia, LLC Description: THERM PAD 18.92MMX13.84MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Type: Insulator
Usage: TO-220
Outline: 18.92mm x 13.84mm
auf Bestellung 10635 Stücke:
Lieferzeit 10-14 Tag (e)
39+0.46 EUR
40+ 0.44 EUR
42+ 0.42 EUR
50+ 0.41 EUR
100+ 0.4 EUR
250+ 0.38 EUR
500+ 0.36 EUR
1000+ 0.32 EUR
5000+ 0.31 EUR
Mindestbestellmenge: 39
56-77-8G 56-77-8G Boyd Laconia, LLC Description: THERM PAD 18.92MMX13.84MM Clear
Packaging: Bulk
Color: Clear
Material: Mica
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Usage: TO-220
Outline: 18.92mm x 13.84mm
auf Bestellung 6271 Stücke:
Lieferzeit 10-14 Tag (e)
36+0.49 EUR
38+ 0.47 EUR
100+ 0.43 EUR
1000+ 0.34 EUR
6000+ 0.33 EUR
Mindestbestellmenge: 36
568303B00000G 568303B00000G Boyd Laconia, LLC 568303-v1.jpg Description: HEATSINK TO-3 1.25" 25WATT
Packaging: Bulk
Material: Aluminum
Length: 1.810" (45.97mm)
Shape: Square
Type: Board Level
Width: 1.810" (45.97mm)
Package Cooled: TO-3
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 5.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.40°C/W
Fin Height: 1.250" (31.75mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
569003B00000G 569003B00000G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: COOLER FOR TO-3 20 WATTS
Packaging: Tray
Material: Aluminum
Length: 1.830" (46.48mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.830" (46.48mm)
Package Cooled: TO-3
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 12.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 1.50°C/W @ 500 LFM
Thermal Resistance @ Natural: 5.50°C/W
Fin Height: 1.310" (33.27mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 916 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.74 EUR
10+ 21.48 EUR
25+ 20.22 EUR
40+ 18.95 EUR
80+ 17.69 EUR
230+ 16.43 EUR
500+ 16.11 EUR
573100D00000G 573100D00000G Boyd Laconia, LLC Board-Level-Cooling-Surface-Mount-5731.pdf Description: TOP MOUNT HEATSINK .4" D-PAK
Packaging: Bulk
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 15.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 3505 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.2 EUR
10+ 3.12 EUR
500+ 2.44 EUR
1000+ 2.19 EUR
Mindestbestellmenge: 6
573100D00010G 573100D00010G Boyd Laconia, LLC Board-Level-Cooling-Surface-Mount-5731.pdf Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
auf Bestellung 13296 Stücke:
Lieferzeit 10-14 Tag (e)
9+2.06 EUR
10+ 1.96 EUR
25+ 1.91 EUR
50+ 1.85 EUR
100+ 1.75 EUR
Mindestbestellmenge: 9
573100D00010G 573100D00010G Boyd Laconia, LLC Board-Level-Cooling-Surface-Mount-5731.pdf Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
auf Bestellung 13218 Stücke:
Lieferzeit 10-14 Tag (e)
250+1.65 EUR
500+ 1.54 EUR
1250+ 1.44 EUR
6250+ 1.39 EUR
Mindestbestellmenge: 250
573300D00000G 573300D00000G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: TOP MOUNT HEATSINK .4" D2PAK
Packaging: Bulk
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 3965 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.23 EUR
10+ 6.07 EUR
25+ 5.9 EUR
50+ 5.58 EUR
100+ 5.25 EUR
250+ 4.92 EUR
500+ 4.76 EUR
Mindestbestellmenge: 3
573300D00010G 573300D00010G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 2550 Stücke:
Lieferzeit 10-14 Tag (e)
250+1.21 EUR
500+ 1.14 EUR
1250+ 1.03 EUR
Mindestbestellmenge: 250
573300D00010G 573300D00010G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 2559 Stücke:
Lieferzeit 10-14 Tag (e)
12+1.48 EUR
13+ 1.42 EUR
25+ 1.35 EUR
50+ 1.31 EUR
100+ 1.3 EUR
Mindestbestellmenge: 12
573400D00000G 573400D00000G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 370 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.68 EUR
10+ 3.57 EUR
Mindestbestellmenge: 5
573400D00010G 573400D00010G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK D-PAK3 TIN PLATED SMD
Packaging: Tape & Reel (TR)
Material: Copper
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
250+1.55 EUR
500+ 1.45 EUR
1250+ 1.36 EUR
Mindestbestellmenge: 250
573400D00010G 573400D00010G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK D-PAK3 TIN PLATED SMD
Packaging: Cut Tape (CT)
Material: Copper
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 1901 Stücke:
Lieferzeit 10-14 Tag (e)
10+1.84 EUR
25+ 1.79 EUR
50+ 1.74 EUR
100+ 1.65 EUR
Mindestbestellmenge: 10
573902B00000G 573902B00000G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: HEATSINK TO-220 BLACK CLIP-ON
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1561 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.19 EUR
10+ 4.07 EUR
100+ 3.52 EUR
Mindestbestellmenge: 5
574102B00000G 574102B00000G Boyd Laconia, LLC Board-Level-Cooling-Slide-On-5741.pdf Description: HEATSINK TO-220 CLIP-ON BLK
Packaging: Bag
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 23.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 5805 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.29 EUR
10+ 2.18 EUR
25+ 2.12 EUR
50+ 2.06 EUR
100+ 1.95 EUR
250+ 1.83 EUR
500+ 1.72 EUR
2000+ 1.6 EUR
Mindestbestellmenge: 8
574402B03200G 574402B03200G Boyd Laconia, LLC Board-Level-Cooling-Slide-On-5744.pdf Description: HEATSINK TO220 HOR MNT W/TAB.75"
Packaging: Bulk
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 12.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1829 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.71 EUR
10+ 2.58 EUR
500+ 2.04 EUR
1000+ 1.9 EUR
Mindestbestellmenge: 7
574502B03200G 574502B03200G Boyd Laconia, LLC Board-Level-Cooling-Slide-On-5744.pdf Description: HEATSINK TO-220 CLIP-ON/TAB
Packaging: Bulk
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 21.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 4654 Stücke:
Lieferzeit 10-14 Tag (e)
3+5.88 EUR
10+ 5.73 EUR
25+ 5.58 EUR
50+ 5.27 EUR
100+ 4.96 EUR
250+ 4.65 EUR
500+ 4.49 EUR
1000+ 4.03 EUR
Mindestbestellmenge: 3
574502B03300G 574502B03300G Boyd Laconia, LLC Board-Level-Cooling-Slide-On-5744.pdf Description: HEATSINK TO-220 VERT MNT W/TAB
Packaging: Bulk
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.810" (20.57mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 21.20°C/W
Fin Height: 0.390" (9.91mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 11741 Stücke:
Lieferzeit 10-14 Tag (e)
13+1.43 EUR
14+ 1.35 EUR
25+ 1.29 EUR
50+ 1.25 EUR
100+ 1.23 EUR
250+ 1.15 EUR
500+ 1.08 EUR
1000+ 0.98 EUR
5000+ 0.95 EUR
Mindestbestellmenge: 13
574502B03700G 574502B03700G Boyd Laconia, LLC Board-Level-Cooling-Slide-On-5744.pdf Description: HEATSINK TO220 VER MNT W/TAB.75"
Packaging: Bulk
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.810" (20.57mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 21.20°C/W
Fin Height: 0.390" (9.91mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 4580 Stücke:
Lieferzeit 10-14 Tag (e)
12+1.49 EUR
100+ 1.36 EUR
1000+ 1.08 EUR
Mindestbestellmenge: 12
574602B03700G 574602B03700G Boyd Laconia, LLC Board-Level-Cooling-Slide-On-5744.pdf Description: HEATSINK TO220 VER MNT W/TAB.69"
Packaging: Bulk
Material: Aluminum
Length: 0.690" (17.53mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 21.60°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 9904 Stücke:
Lieferzeit 10-14 Tag (e)
11+1.65 EUR
12+ 1.57 EUR
100+ 1.44 EUR
2000+ 1.14 EUR
6000+ 1.1 EUR
Mindestbestellmenge: 11
574802B03300G Boyd Laconia, LLC Board-Level-Heatsinks_Cat.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.900" (22.86mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.020" (25.91mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 20.40°C/W
Fin Height: 0.420" (10.67mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
574802B03700G Boyd Laconia, LLC Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.900" (22.86mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.020" (25.91mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 20.40°C/W
Fin Height: 0.420" (10.67mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
531002B02500G Board-Level-Cooling-Extruded-5310.pdf
531002B02500G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 W/PINS 1" TALL
Packaging: Bulk
Material: Aluminum
Length: 1.000" (25.40mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 7630 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
7+2.52 EUR
10+ 2.39 EUR
25+ 2.33 EUR
50+ 2.26 EUR
100+ 2.14 EUR
250+ 2.01 EUR
500+ 1.89 EUR
1000+ 1.76 EUR
5000+ 1.7 EUR
Mindestbestellmenge: 7
531102B00000G Board-Level-Cooling-Extruded-5310.pdf
531102B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 H=1.5" BLK
Packaging: Box
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220, TO-202
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 7.0W @ 70°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 10.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 1013 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.87 EUR
10+ 12.53 EUR
25+ 11.83 EUR
50+ 11.14 EUR
100+ 10.44 EUR
250+ 9.74 EUR
500+ 9.05 EUR
1000+ 8.87 EUR
Mindestbestellmenge: 2
531102B02100G Board-Level-Cooling-Extruded-5310.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.374" (34.90mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 7.0W @ 70°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 10.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 970 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.54 EUR
10+ 10.26 EUR
510+ 7.41 EUR
Mindestbestellmenge: 2
531102B02500G Board-Level-Cooling-Extruded-5310.pdf
531102B02500G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 W/PINS 1.5"TALL
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 7.0W @ 70°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 10.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 5615 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
7+2.76 EUR
10+ 2.62 EUR
25+ 2.55 EUR
50+ 2.48 EUR
100+ 2.35 EUR
250+ 2.21 EUR
510+ 2.07 EUR
1020+ 1.93 EUR
5100+ 1.86 EUR
Mindestbestellmenge: 7
531202B02100G Board-Level-Cooling-Extruded-5310.pdf
531202B02100G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 SOLDERPIN 50.8MM
Packaging: Bulk
Material: Aluminum
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220, TO-202
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 8.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 7.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 3190 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+4.07 EUR
10+ 3.97 EUR
25+ 3.86 EUR
50+ 3.64 EUR
100+ 3.43 EUR
250+ 3.22 EUR
500+ 3.11 EUR
1000+ 2.79 EUR
Mindestbestellmenge: 5
531202B02500G Board-Level-Cooling-Extruded-5310.pdf
531202B02500G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 POWER W/PINS BK
Packaging: Bulk
Material: Aluminum
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220, TO-202
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 5.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 7.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 3683 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6+3.06 EUR
10+ 2.92 EUR
25+ 2.84 EUR
50+ 2.77 EUR
100+ 2.61 EUR
250+ 2.46 EUR
500+ 2.3 EUR
1000+ 2.15 EUR
Mindestbestellmenge: 6
531302B02500G Board-Level-Cooling-Extruded-5310.pdf
531302B02500G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 H=2.5" BLK W/PIN
Packaging: Bulk
Material: Aluminum
Length: 2.500" (63.50mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220, TO-202
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 8.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2014 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+7.25 EUR
10+ 7.05 EUR
25+ 6.86 EUR
50+ 6.48 EUR
100+ 6.1 EUR
250+ 5.72 EUR
750+ 5.53 EUR
1500+ 4.96 EUR
Mindestbestellmenge: 3
532602B00000 Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.650" (41.91mm)
Package Cooled: TO-220
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 6.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 5.50°C/W
Fin Height: 1.000" (25.40mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
532602B02500G Board-Level-Cooling-High-Power-Extruded-5320.pdf
532602B02500G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 SOLDERPIN 38.1MM
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.650" (41.91mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 5.50°C/W
Fin Height: 1.000" (25.40mm)
Material Finish: Black Anodized
auf Bestellung 1715 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+3.56 EUR
10+ 3.45 EUR
240+ 2.8 EUR
1200+ 2.43 EUR
Mindestbestellmenge: 5
532802B02500G Board-Level-Cooling-High-Power-Extruded-5320.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 2.500" (63.50mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.650" (41.91mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 4.20°C/W
Fin Height: 1.000" (25.40mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
533002B02551G Board-Level-Cooling-Extruded-5330.pdf
533002B02551G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 SOLDERPIN/CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.000" (25.40mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 1467 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6+3.5 EUR
10+ 3.4 EUR
750+ 2.67 EUR
Mindestbestellmenge: 6
533201B02500G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-218, TO-247
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 9.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
533201B12500G
Hersteller: Boyd Laconia, LLC
Description: STD,533201B12500G
Packaging: Bulk
Produkt ist nicht verfügbar
533422B02552G Board-Level-Cooling-Extruded-5334.pdf
533422B02552G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 SOLDERPIN/CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.650" (41.91mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 10.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 200 LFM
Fin Height: 1.500" (38.10mm)
Material Finish: Black Anodized
auf Bestellung 8087 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.23 EUR
10+ 6.06 EUR
25+ 5.9 EUR
50+ 5.57 EUR
100+ 5.24 EUR
250+ 4.92 EUR
500+ 4.75 EUR
1000+ 4.26 EUR
Mindestbestellmenge: 3
533502B02552G Board-Level-Cooling-Extruded-5334.pdf
533502B02552G
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.650" (41.91mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 2.000" (50.80mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
533522B02552G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.650" (41.91mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Thermal Resistance @ Natural: 2.70°C/W
Fin Height: 1.000" (25.40mm)
Material Finish: Black Anodized
Part Status: Active
Produkt ist nicht verfügbar
533766B42152G
Hersteller: Boyd Laconia, LLC
Description: STD,533766B42152G
Packaging: Bulk
Produkt ist nicht verfügbar
533802B02500G Board-Level-Heatsinks_Cat.pdf
533802B02500G
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.000" (25.40mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 2466 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.84 EUR
10+ 5.69 EUR
25+ 5.54 EUR
50+ 5.42 EUR
Mindestbestellmenge: 4
534202B02853G Board-Level-Heatsinks_Cat.pdf
534202B02853G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 W/SHURLOCK-CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 20099 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
7+2.73 EUR
10+ 2.6 EUR
25+ 2.53 EUR
50+ 2.46 EUR
100+ 2.32 EUR
250+ 2.19 EUR
500+ 2.05 EUR
1000+ 1.91 EUR
5000+ 1.85 EUR
Mindestbestellmenge: 7
534202B03453G Board-Level-Heatsinks_Cat.pdf
534202B03453G
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEATSINK .5" TO-220
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 1640 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+9.06 EUR
10+ 8.82 EUR
500+ 6.91 EUR
1000+ 6.2 EUR
Mindestbestellmenge: 2
534302B03553G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
534302B03553G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 W/TAB-KOOLCLIP
Packaging: Bulk
Material: Aluminum
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.380" (35.05mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.40°C/W
Fin Height: 0.480" (12.19mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
534302B13553
Hersteller: Boyd Laconia, LLC
Description: STD,534302B13553
Packaging: Bulk
Produkt ist nicht verfügbar
53-77-2G LA034744.pdf
53-77-2G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 17.5MMX14.27MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 17.50mm x 14.27mm
Thermal Conductivity: 0.9W/m-K
auf Bestellung 3016 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
19+0.93 EUR
20+ 0.89 EUR
100+ 0.81 EUR
1000+ 0.64 EUR
Mindestbestellmenge: 19
53-77-4ACG
53-77-4ACG
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 19.05X12.7MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
auf Bestellung 6137 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
14+1.28 EUR
15+ 1.23 EUR
25+ 1.17 EUR
50+ 1.14 EUR
100+ 1.12 EUR
250+ 1.05 EUR
500+ 0.99 EUR
1000+ 0.89 EUR
5000+ 0.86 EUR
Mindestbestellmenge: 14
53-77-4G
53-77-4G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 19.05MMX12.7MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
auf Bestellung 4635 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
14+1.28 EUR
15+ 1.22 EUR
25+ 1.17 EUR
50+ 1.13 EUR
100+ 1.12 EUR
250+ 1.04 EUR
500+ 0.98 EUR
1000+ 0.89 EUR
Mindestbestellmenge: 14
53-77-9G Aavid_Board_Level_Heatsinks_Catalog_2018.pdf
53-77-9G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 18.42X13.21MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Thermal Conductivity: 0.9W/m-K
Part Status: Active
auf Bestellung 44258 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
17+1.06 EUR
18+ 1 EUR
25+ 0.96 EUR
50+ 0.93 EUR
100+ 0.92 EUR
250+ 0.85 EUR
500+ 0.8 EUR
1000+ 0.73 EUR
5000+ 0.7 EUR
Mindestbestellmenge: 17
542502B00000G Board-Level-Cooling-Space-Saving-5425.pdf
542502B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 TAB BLACK
Packaging: Bulk
Material: Aluminum
Length: 1.250" (31.75mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.875" (22.22mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 24.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
auf Bestellung 6595 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.28 EUR
10+ 5.14 EUR
25+ 5 EUR
50+ 4.72 EUR
100+ 4.44 EUR
250+ 4.17 EUR
500+ 4.03 EUR
1000+ 3.61 EUR
Mindestbestellmenge: 4
542502D00000G Board-Level-Cooling-Space-Saving-5425.pdf
542502D00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 TAB TIN
Packaging: Bulk
Material: Aluminum
Length: 1.250" (31.75mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.875" (22.22mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 24.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Tin
auf Bestellung 8037 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.53 EUR
10+ 6.36 EUR
25+ 6.19 EUR
50+ 5.85 EUR
100+ 5.5 EUR
250+ 5.16 EUR
500+ 4.99 EUR
1000+ 4.47 EUR
Mindestbestellmenge: 3
552844B00000 Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.780" (45.21mm)
Shape: Square, Fins
Type: Board Level
Width: 1.780" (45.21mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 3.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 8.70°C/W
Fin Height: 0.720" (18.29mm)
Material Finish: Black Anodized
Part Status: Active
Produkt ist nicht verfügbar
552844B00000G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: Boyd Laconia, LLC
Description: HEATSINK
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
56-02-101G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 26.16MMX22.61MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rectangular
Thickness: 0.0030" (0.076mm)
Type: Insulator
Usage: TO-218, TO-247, TO-3P
Outline: 26.16mm x 22.61mm
Produkt ist nicht verfügbar
56-03-8G
56-03-8G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 42.85X30.15MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rhombus
Thickness: 0.0020" (0.051mm)
Type: Insulator
Usage: TO-3
Outline: 42.85mm x 30.15mm
Part Status: Active
auf Bestellung 3806 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
14+1.27 EUR
15+ 1.21 EUR
100+ 1.1 EUR
Mindestbestellmenge: 14
563002B00000G Board-Level-Cooling-Channel-5600.pdf
563002B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 VERT MNT 1.18"
Packaging: Bag
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 970 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+7.66 EUR
10+ 7.46 EUR
25+ 7.25 EUR
50+ 6.85 EUR
100+ 6.45 EUR
250+ 6.05 EUR
500+ 5.84 EUR
Mindestbestellmenge: 3
563002D00000G Board-Level-Cooling-Channel-5600.pdf
563002D00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 TAB TIN
Packaging: Bulk
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Tin
auf Bestellung 990 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.8 EUR
10+ 12.44 EUR
25+ 11.75 EUR
50+ 11.06 EUR
100+ 10.37 EUR
250+ 9.68 EUR
500+ 8.99 EUR
Mindestbestellmenge: 2
563202D00000G Board-Level-Heatsinks_Cat.pdf
563202D00000G
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.380" (35.05mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 9.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Tin
auf Bestellung 2719 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+3.7 EUR
10+ 3.6 EUR
420+ 2.92 EUR
1260+ 2.53 EUR
Mindestbestellmenge: 5
566010B02800G Board-Level-Heatsinks_Cat.pdf
566010B02800G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 CLIP-ON W/TABS
Packaging: Bulk
Material: Aluminum
Length: 1.220" (30.99mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: Multiwatt, SIP
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
566010B03400G Board-Level-Heatsinks_Cat.pdf
566010B03400G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK W/TAB BLACK
Packaging: Bulk
Material: Aluminum
Length: 1.220" (30.99mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: Multiwatt, SIP
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 4978 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
7+2.75 EUR
10+ 2.6 EUR
800+ 2.06 EUR
1600+ 1.92 EUR
Mindestbestellmenge: 7
566102B00000G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Produkt ist nicht verfügbar
56-77-11G
56-77-11G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 18.92MMX13.84MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Type: Insulator
Usage: TO-220
Outline: 18.92mm x 13.84mm
auf Bestellung 10635 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
39+0.46 EUR
40+ 0.44 EUR
42+ 0.42 EUR
50+ 0.41 EUR
100+ 0.4 EUR
250+ 0.38 EUR
500+ 0.36 EUR
1000+ 0.32 EUR
5000+ 0.31 EUR
Mindestbestellmenge: 39
56-77-8G
56-77-8G
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 18.92MMX13.84MM Clear
Packaging: Bulk
Color: Clear
Material: Mica
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Usage: TO-220
Outline: 18.92mm x 13.84mm
auf Bestellung 6271 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
36+0.49 EUR
38+ 0.47 EUR
100+ 0.43 EUR
1000+ 0.34 EUR
6000+ 0.33 EUR
Mindestbestellmenge: 36
568303B00000G 568303-v1.jpg
568303B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-3 1.25" 25WATT
Packaging: Bulk
Material: Aluminum
Length: 1.810" (45.97mm)
Shape: Square
Type: Board Level
Width: 1.810" (45.97mm)
Package Cooled: TO-3
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 5.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.40°C/W
Fin Height: 1.250" (31.75mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
569003B00000G Board-Level-Heatsinks_Cat.pdf
569003B00000G
Hersteller: Boyd Laconia, LLC
Description: COOLER FOR TO-3 20 WATTS
Packaging: Tray
Material: Aluminum
Length: 1.830" (46.48mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.830" (46.48mm)
Package Cooled: TO-3
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 12.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 1.50°C/W @ 500 LFM
Thermal Resistance @ Natural: 5.50°C/W
Fin Height: 1.310" (33.27mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 916 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+22.74 EUR
10+ 21.48 EUR
25+ 20.22 EUR
40+ 18.95 EUR
80+ 17.69 EUR
230+ 16.43 EUR
500+ 16.11 EUR
573100D00000G Board-Level-Cooling-Surface-Mount-5731.pdf
573100D00000G
Hersteller: Boyd Laconia, LLC
Description: TOP MOUNT HEATSINK .4" D-PAK
Packaging: Bulk
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 15.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 3505 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6+3.2 EUR
10+ 3.12 EUR
500+ 2.44 EUR
1000+ 2.19 EUR
Mindestbestellmenge: 6
573100D00010G Board-Level-Cooling-Surface-Mount-5731.pdf
573100D00010G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
auf Bestellung 13296 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
9+2.06 EUR
10+ 1.96 EUR
25+ 1.91 EUR
50+ 1.85 EUR
100+ 1.75 EUR
Mindestbestellmenge: 9
573100D00010G Board-Level-Cooling-Surface-Mount-5731.pdf
573100D00010G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
auf Bestellung 13218 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
250+1.65 EUR
500+ 1.54 EUR
1250+ 1.44 EUR
6250+ 1.39 EUR
Mindestbestellmenge: 250
573300D00000G Board-Level-Heatsinks_Cat.pdf
573300D00000G
Hersteller: Boyd Laconia, LLC
Description: TOP MOUNT HEATSINK .4" D2PAK
Packaging: Bulk
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 3965 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.23 EUR
10+ 6.07 EUR
25+ 5.9 EUR
50+ 5.58 EUR
100+ 5.25 EUR
250+ 4.92 EUR
500+ 4.76 EUR
Mindestbestellmenge: 3
573300D00010G Board-Level-Heatsinks_Cat.pdf
573300D00010G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 2550 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
250+1.21 EUR
500+ 1.14 EUR
1250+ 1.03 EUR
Mindestbestellmenge: 250
573300D00010G Board-Level-Heatsinks_Cat.pdf
573300D00010G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 2559 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
12+1.48 EUR
13+ 1.42 EUR
25+ 1.35 EUR
50+ 1.31 EUR
100+ 1.3 EUR
Mindestbestellmenge: 12
573400D00000G Board-Level-Heatsinks_Cat.pdf
573400D00000G
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 370 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+3.68 EUR
10+ 3.57 EUR
Mindestbestellmenge: 5
573400D00010G Board-Level-Heatsinks_Cat.pdf
573400D00010G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK D-PAK3 TIN PLATED SMD
Packaging: Tape & Reel (TR)
Material: Copper
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
250+1.55 EUR
500+ 1.45 EUR
1250+ 1.36 EUR
Mindestbestellmenge: 250
573400D00010G Board-Level-Heatsinks_Cat.pdf
573400D00010G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK D-PAK3 TIN PLATED SMD
Packaging: Cut Tape (CT)
Material: Copper
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 1901 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
10+1.84 EUR
25+ 1.79 EUR
50+ 1.74 EUR
100+ 1.65 EUR
Mindestbestellmenge: 10
573902B00000G Board-Level-Heatsinks_Cat.pdf
573902B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 BLACK CLIP-ON
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1561 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+4.19 EUR
10+ 4.07 EUR
100+ 3.52 EUR
Mindestbestellmenge: 5
574102B00000G Board-Level-Cooling-Slide-On-5741.pdf
574102B00000G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 CLIP-ON BLK
Packaging: Bag
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 23.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 5805 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
8+2.29 EUR
10+ 2.18 EUR
25+ 2.12 EUR
50+ 2.06 EUR
100+ 1.95 EUR
250+ 1.83 EUR
500+ 1.72 EUR
2000+ 1.6 EUR
Mindestbestellmenge: 8
574402B03200G Board-Level-Cooling-Slide-On-5744.pdf
574402B03200G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO220 HOR MNT W/TAB.75"
Packaging: Bulk
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 12.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1829 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
7+2.71 EUR
10+ 2.58 EUR
500+ 2.04 EUR
1000+ 1.9 EUR
Mindestbestellmenge: 7
574502B03200G Board-Level-Cooling-Slide-On-5744.pdf
574502B03200G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 CLIP-ON/TAB
Packaging: Bulk
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 21.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 4654 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+5.88 EUR
10+ 5.73 EUR
25+ 5.58 EUR
50+ 5.27 EUR
100+ 4.96 EUR
250+ 4.65 EUR
500+ 4.49 EUR
1000+ 4.03 EUR
Mindestbestellmenge: 3
574502B03300G Board-Level-Cooling-Slide-On-5744.pdf
574502B03300G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-220 VERT MNT W/TAB
Packaging: Bulk
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.810" (20.57mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 21.20°C/W
Fin Height: 0.390" (9.91mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 11741 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13+1.43 EUR
14+ 1.35 EUR
25+ 1.29 EUR
50+ 1.25 EUR
100+ 1.23 EUR
250+ 1.15 EUR
500+ 1.08 EUR
1000+ 0.98 EUR
5000+ 0.95 EUR
Mindestbestellmenge: 13
574502B03700G Board-Level-Cooling-Slide-On-5744.pdf
574502B03700G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO220 VER MNT W/TAB.75"
Packaging: Bulk
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.810" (20.57mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 21.20°C/W
Fin Height: 0.390" (9.91mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 4580 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
12+1.49 EUR
100+ 1.36 EUR
1000+ 1.08 EUR
Mindestbestellmenge: 12
574602B03700G Board-Level-Cooling-Slide-On-5744.pdf
574602B03700G
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO220 VER MNT W/TAB.69"
Packaging: Bulk
Material: Aluminum
Length: 0.690" (17.53mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 21.60°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 9904 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
11+1.65 EUR
12+ 1.57 EUR
100+ 1.44 EUR
2000+ 1.14 EUR
6000+ 1.1 EUR
Mindestbestellmenge: 11
574802B03300G Board-Level-Heatsinks_Cat.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.900" (22.86mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.020" (25.91mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 20.40°C/W
Fin Height: 0.420" (10.67mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
574802B03700G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.900" (22.86mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.020" (25.91mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 20.40°C/W
Fin Height: 0.420" (10.67mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
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