Produkte > HARWIN INC. > Alle Produkte des Herstellers HARWIN INC. (12536) > Seite 33 nach 209
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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D01-9970742 | Harwin Inc. |
 Description: CONN SOCKET SIP 7POS GOLDPackaging: Tube Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 7 (1 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 5129 Stücke: Lieferzeit 21-28 Tag (e) |
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D01-9970842 | Harwin Inc. |
Description: CONN SOCKET SIP 8POS GOLD Packaging: Tube Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (1 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass |
auf Bestellung 8076 Stücke: Lieferzeit 21-28 Tag (e) |
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D01-9970942 | Harwin Inc. |
Description: CONN SOCKET SIP 9POS GOLD Packaging: Tube Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 9 (1 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass |
auf Bestellung 6144 Stücke: Lieferzeit 21-28 Tag (e) |
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| D01-9971042 | Harwin Inc. |
Description: CONN SOCKET SIP 10POS GOLD |
Produkt ist nicht verfügbar |
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| D01-9971142 | Harwin Inc. |
Description: CONN SOCKET SIP 11POS GOLD |
Produkt ist nicht verfügbar |
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D01-9971242 | Harwin Inc. |
Description: CONN SOCKET SIP 12POS GOLD Packaging: Tube Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (1 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 4183 Stücke: Lieferzeit 21-28 Tag (e) |
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D01-9971342 | Harwin Inc. |
Description: CONN SOCKET SIP 13POS GOLD Packaging: Tube Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 13 (1 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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| D01-9971442 | Harwin Inc. |
Description: CONN SOCKET SIP 14POS GOLD |
Produkt ist nicht verfügbar |
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| D01-9971542 | Harwin Inc. |
Description: CONN SOCKET SIP 15POS GOLD |
Produkt ist nicht verfügbar |
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| D01-9971642 | Harwin Inc. |
Description: CONN SOCKET SIP 16POS GOLD |
Produkt ist nicht verfügbar |
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| D01-9971742 | Harwin Inc. |
Description: CONN SOCKET SIP 17POS GOLD |
Produkt ist nicht verfügbar |
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| D01-9971842 | Harwin Inc. |
Description: CONN SOCKET SIP 18POS GOLD |
Produkt ist nicht verfügbar |
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D01-9971942 | Harwin Inc. |
Description: CONN SOCKET SIP 19POS GOLD Packaging: Tube Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 19 (1 x 19) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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D01-9972042 | Harwin Inc. |
Description: CONN SOCKET SIP 20POS GOLD Packaging: Tube Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (1 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass |
auf Bestellung 13314 Stücke: Lieferzeit 21-28 Tag (e) |
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| D01-9972142 | Harwin Inc. |
Description: CONN SOCKET SIP 21POS GOLD |
Produkt ist nicht verfügbar |
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| D01-9972242 | Harwin Inc. |
Description: CONN SOCKET SIP 22POS GOLD |
Produkt ist nicht verfügbar |
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| D01-9972342 | Harwin Inc. |
Description: CONN SOCKET SIP 23POS GOLD |
Produkt ist nicht verfügbar |
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| D01-9972442 | Harwin Inc. |
Description: CONN SOCKET SIP 24POS GOLD |
Produkt ist nicht verfügbar |
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| D01-9972542 | Harwin Inc. |
Description: CONN SOCKET SIP 25POS GOLD |
Produkt ist nicht verfügbar |
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| D01-9972642 | Harwin Inc. |
Description: CONN SOCKET SIP 26POS GOLD |
Produkt ist nicht verfügbar |
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| D01-9972742 | Harwin Inc. |
Description: CONN SOCKET SIP 27POS GOLD |
Produkt ist nicht verfügbar |
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D01-9972842 | Harwin Inc. |
Description: CONN SOCKET SIP 28POS GOLD Packaging: Tube Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (1 x 28) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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D01-9972942 | Harwin Inc. |
Description: CONN SOCKET SIP 29POS GOLD Packaging: Tube Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 29 (1 x 29) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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| D01-9973042 | Harwin Inc. |
Description: CONN SOCKET SIP 30POS GOLD |
Produkt ist nicht verfügbar |
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| D01-9973142 | Harwin Inc. |
Description: CONN SOCKET SIP 31POS GOLD |
Produkt ist nicht verfügbar |
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| D0724-01 | Harwin Inc. |
Description: CONN IC DIP SOCKET 24POS GOLD |
Produkt ist nicht verfügbar |
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| D0724-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 24POS GOLD |
Produkt ist nicht verfügbar |
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| D0806-01 | Harwin Inc. |
Description: CONN IC DIP SOCKET 6POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass Part Status: Obsolete |
Produkt ist nicht verfügbar |
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D0806-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 6POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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| D0808-01 | Harwin Inc. |
Description: CONN IC DIP SOCKET 8POS GOLD |
Produkt ist nicht verfügbar |
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D0808-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 124 Stücke: Lieferzeit 21-28 Tag (e) |
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| D0814-01 | Harwin Inc. |
Description: CONN IC DIP SOCKET 14POS GOLD |
Produkt ist nicht verfügbar |
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| D0814-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 14POS GOLD |
Produkt ist nicht verfügbar |
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| D0816-01 | Harwin Inc. |
Description: CONN IC DIP SOCKET 16POS GOLD |
Produkt ist nicht verfügbar |
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D0816-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 16POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 64 Stücke: Lieferzeit 21-28 Tag (e) |
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| D0818-01 | Harwin Inc. |
Description: CONN IC DIP SOCKET 18POS GOLD |
Produkt ist nicht verfügbar |
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| D0818-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 18POS GOLD |
Produkt ist nicht verfügbar |
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| D0820-01 | Harwin Inc. |
Description: CONN IC DIP SOCKET 20POS GOLD |
Produkt ist nicht verfügbar |
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| D0820-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 20POS GOLD |
Produkt ist nicht verfügbar |
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| D0822-01 | Harwin Inc. |
Description: CONN IC DIP SOCKET 22POS GOLD |
Produkt ist nicht verfügbar |
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| D0822-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 22POS GOLD |
Produkt ist nicht verfügbar |
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| D0824-01 | Harwin Inc. |
Description: CONN IC DIP SOCKET 24POS GOLD |
Produkt ist nicht verfügbar |
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| D0824-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 24POS GOLD |
Produkt ist nicht verfügbar |
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| D0828-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 28POS GOLD |
Produkt ist nicht verfügbar |
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| D0832-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 32POS GOLD |
Produkt ist nicht verfügbar |
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| D0836-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 36POS GOLD |
Produkt ist nicht verfügbar |
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| D0840-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 40POS GOLD |
Produkt ist nicht verfügbar |
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D0922-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 22POS GOLD |
Produkt ist nicht verfügbar |
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D0924-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 24POS GOLD |
Produkt ist nicht verfügbar |
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| D0948-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 48POS GOLD |
Produkt ist nicht verfügbar |
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D2608-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Press-Fit Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 2340 Stücke: Lieferzeit 21-28 Tag (e) |
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| D2614-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 14POS GOLD |
Produkt ist nicht verfügbar |
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| D2616-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 16POS GOLD |
Produkt ist nicht verfügbar |
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| D2620-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 20POS GOLD |
Produkt ist nicht verfügbar |
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| D2624-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 24POS GOLD |
Produkt ist nicht verfügbar |
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| D2628-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 28POS GOLD |
Produkt ist nicht verfügbar |
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| D2632-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 32POS GOLD |
Produkt ist nicht verfügbar |
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| D2640-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 40POS GOLD |
Produkt ist nicht verfügbar |
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D2806-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 6POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Plastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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D2822-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 22POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Plastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 144 Stücke: Lieferzeit 21-28 Tag (e) |
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| D01-9970742 |
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Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 7POS GOLD
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 7POS GOLD
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 5129 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 11+ | 2.5 EUR |
| 13+ | 2.1 EUR |
| 100+ | 1.89 EUR |
| 1600+ | 1.29 EUR |
| D01-9970842 |
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Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 8POS GOLD
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 8POS GOLD
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
auf Bestellung 8076 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 11+ | 2.57 EUR |
| 12+ | 2.18 EUR |
| 100+ | 1.96 EUR |
| 1400+ | 1.42 EUR |
| 5600+ | 1.25 EUR |
| D01-9970942 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 9POS GOLD
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 9 (1 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 9POS GOLD
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 9 (1 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
auf Bestellung 6144 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 10+ | 2.76 EUR |
| 12+ | 2.34 EUR |
| 100+ | 2.1 EUR |
| 1200+ | 1.53 EUR |
| 6000+ | 1.34 EUR |
| D01-9971042 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 10POS GOLD
Description: CONN SOCKET SIP 10POS GOLD
Produkt ist nicht verfügbar
| D01-9971142 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 11POS GOLD
Description: CONN SOCKET SIP 11POS GOLD
Produkt ist nicht verfügbar
| D01-9971242 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 12POS GOLD
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 12POS GOLD
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 4183 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 10+ | 2.73 EUR |
| 12+ | 2.32 EUR |
| 800+ | 1.65 EUR |
| 1600+ | 1.42 EUR |
| D01-9971342 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 13POS GOLD
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 13POS GOLD
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
| D01-9971442 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 14POS GOLD
Description: CONN SOCKET SIP 14POS GOLD
Produkt ist nicht verfügbar
| D01-9971542 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 15POS GOLD
Description: CONN SOCKET SIP 15POS GOLD
Produkt ist nicht verfügbar
| D01-9971642 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 16POS GOLD
Description: CONN SOCKET SIP 16POS GOLD
Produkt ist nicht verfügbar
| D01-9971742 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 17POS GOLD
Description: CONN SOCKET SIP 17POS GOLD
Produkt ist nicht verfügbar
| D01-9971842 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 18POS GOLD
Description: CONN SOCKET SIP 18POS GOLD
Produkt ist nicht verfügbar
| D01-9971942 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 19POS GOLD
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 19POS GOLD
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
| D01-9972042 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 20POS GOLD
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 20POS GOLD
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
auf Bestellung 13314 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 4.63 EUR |
| 10+ | 4.03 EUR |
| 300+ | 3.26 EUR |
| 600+ | 3 EUR |
| 1200+ | 2.57 EUR |
| 5100+ | 2.28 EUR |
| 10200+ | 2.23 EUR |
| D01-9972142 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 21POS GOLD
Description: CONN SOCKET SIP 21POS GOLD
Produkt ist nicht verfügbar
| D01-9972242 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 22POS GOLD
Description: CONN SOCKET SIP 22POS GOLD
Produkt ist nicht verfügbar
| D01-9972342 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 23POS GOLD
Description: CONN SOCKET SIP 23POS GOLD
Produkt ist nicht verfügbar
| D01-9972442 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 24POS GOLD
Description: CONN SOCKET SIP 24POS GOLD
Produkt ist nicht verfügbar
| D01-9972542 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 25POS GOLD
Description: CONN SOCKET SIP 25POS GOLD
Produkt ist nicht verfügbar
| D01-9972642 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 26POS GOLD
Description: CONN SOCKET SIP 26POS GOLD
Produkt ist nicht verfügbar
| D01-9972742 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 27POS GOLD
Description: CONN SOCKET SIP 27POS GOLD
Produkt ist nicht verfügbar
| D01-9972842 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 28POS GOLD
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (1 x 28)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 28POS GOLD
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (1 x 28)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
| D01-9972942 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 29POS GOLD
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 29 (1 x 29)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 29POS GOLD
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 29 (1 x 29)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
| D01-9973042 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 30POS GOLD
Description: CONN SOCKET SIP 30POS GOLD
Produkt ist nicht verfügbar
| D01-9973142 |
|
Hersteller: Harwin Inc.
Description: CONN SOCKET SIP 31POS GOLD
Description: CONN SOCKET SIP 31POS GOLD
Produkt ist nicht verfügbar
| D0724-01 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
| D0724-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
| D0806-01 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Obsolete
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Obsolete
Produkt ist nicht verfügbar
| D0806-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
| D0808-01 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
| D0808-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 124 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 5.62 EUR |
| 10+ | 4.89 EUR |
| 25+ | 4.68 EUR |
| 50+ | 4.58 EUR |
| 100+ | 4.37 EUR |
| D0814-01 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
| D0814-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
| D0816-01 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
| D0816-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 64 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 10.37 EUR |
| 10+ | 9.42 EUR |
| 25+ | 8.93 EUR |
| 50+ | 8.72 EUR |
| D0818-01 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
| D0818-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
| D0820-01 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
| D0820-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
| D0822-01 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
| D0822-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
| D0824-01 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
| D0824-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
| D0828-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
| D0832-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
| D0836-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
| D0840-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
| D0922-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
| D0924-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
| D0948-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 48POS GOLD
Description: CONN IC DIP SOCKET 48POS GOLD
Produkt ist nicht verfügbar
| D2608-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 2340 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 6.21 EUR |
| 10+ | 5.41 EUR |
| 25+ | 5.18 EUR |
| 50+ | 5.07 EUR |
| 100+ | 4.84 EUR |
| 250+ | 4.38 EUR |
| 500+ | 4.03 EUR |
| 1000+ | 3.45 EUR |
| D2614-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
| D2616-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
| D2620-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
| D2624-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
| D2628-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
| D2632-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
| D2640-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
| D2806-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Plastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Plastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
| D2822-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Plastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Plastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 144 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 6.16 EUR |
| 18+ | 5.6 EUR |
| 36+ | 5.3 EUR |
| 54+ | 5.18 EUR |
| 108+ | 4.93 EUR |