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PIC18F26K83-E/SP PIC18F26K83-E/SP Microchip Technology PIC18(L)F2526K83-Data-Sheet-DS40001943C.pdf Description: IC MCU 8BIT 64KB FLASH 28SPDIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F26K83-E/SS PIC18F26K83-E/SS Microchip Technology PIC18(L)F2526K83-Data-Sheet-DS40001943C.pdf Description: IC MCU 8BIT 64KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F26K83-I/ML PIC18F26K83-I/ML Microchip Technology PIC18%28L%29F2526K83-Data-Sheet-DS40001943C.pdf Description: IC MCU 8BIT 64KB FLASH 28QFN
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F26K83-I/MX PIC18F26K83-I/MX Microchip Technology filehandler.aspx?ddocname=en599873 Description: IC MCU 8BIT 64KB FLASH 28UQFN
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PIC18F26K83-I/SO PIC18F26K83-I/SO Microchip Technology PIC18%28L%29F2526K83-Data-Sheet-DS40001943C.pdf Description: IC MCU 8BIT 64KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F26K83-I/SP PIC18F26K83-I/SP Microchip Technology PIC18%28L%29F2526K83-Data-Sheet-DS40001943C.pdf Description: IC MCU 8BIT 64KB FLASH 28SPDIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F26K83-I/SS PIC18F26K83-I/SS Microchip Technology PIC18%28L%29F2526K83-Data-Sheet-DS40001943C.pdf Description: IC MCU 8BIT 64KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18LF25K83-E/SS PIC18LF25K83-E/SS Microchip Technology PIC18(L)F2526K83-Data-Sheet-DS40001943C.pdf Description: IC MCU 8BIT 32KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18LF25K83-I/ML PIC18LF25K83-I/ML Microchip Technology PIC18(L)F2526K83-Data-Sheet-DS40001943C.pdf Description: IC MCU 8BIT 32KB FLASH 28QFN
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18LF26K83-I/SS PIC18LF26K83-I/SS Microchip Technology PIC18(L)F2526K83-Data-Sheet-DS40001943C.pdf Description: IC MCU 8BIT 64KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
DigiKey Programmable: Not Verified
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ATECC608A-MAHCZ-S ATECC608A-MAHCZ-S Microchip Technology ATECC608A-CryptoAuthentication-Device-Summary-Data-Sheet-DS40001977B.pdf Description: IC AUTHENTICATION CHIP 8-UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Applications: Networking and Communications
Supplier Device Package: 8-UDFN (2x3)
Part Status: Active
DigiKey Programmable: Not Verified
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ATECC608A-MAHCZ-T ATECC608A-MAHCZ-T Microchip Technology ATECC608A-CryptoAuthentication-Device-Summary-Data-Sheet-DS40001977B.pdf Description: IC AUTHENTICATION CHIP 8-UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Applications: Networking and Communications
Supplier Device Package: 8-UDFN (2x3)
Part Status: Active
DigiKey Programmable: Not Verified
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ATECC608A-MAHDA-S ATECC608A-MAHDA-S Microchip Technology ATECC608A-CryptoAuthentication-Device-Summary-Data-Sheet-DS40001977B.pdf Description: IC AUTHENTICATION CHIP 8-UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Applications: Networking and Communications
Supplier Device Package: 8-UDFN (2x3)
Part Status: Active
DigiKey Programmable: Not Verified
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ATECC608A-MAHDA-T ATECC608A-MAHDA-T Microchip Technology ATECC608A-CryptoAuthentication-Device-Summary-Data-Sheet-DS40001977B.pdf Description: IC AUTHENTICATION CHIP 8-UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Applications: Networking and Communications
Supplier Device Package: 8-UDFN (2x3)
Part Status: Active
DigiKey Programmable: Not Verified
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ATECC608A-SSHCZ-T ATECC608A-SSHCZ-T Microchip Technology ATECC608A-CryptoAuthentication-Device-Summary-Data-Sheet-DS40001977B.pdf Description: IC AUTHENTICATION CHIP 8-SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Applications: Networking and Communications
Supplier Device Package: 8-SOIC
Part Status: Active
DigiKey Programmable: Not Verified
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ATECC608A-SSHDA-T ATECC608A-SSHDA-T Microchip Technology ATECC608A-CryptoAuthentication-Device-Summary-Data-Sheet-DS40001977B.pdf Description: IC AUTHENTICATION CHIP 8-SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Applications: Networking and Communications
Supplier Device Package: 8-SOIC
Part Status: Active
DigiKey Programmable: Not Verified
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ATSAMA5D41B-CUR ATSAMA5D41B-CUR Microchip Technology SAMA5D4-Series-Data-Sheet-DS60001525.pdf Description: IC MPU SAMA5D4 600MHZ 289LFBGA
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ATSAMA5D43B-CUR ATSAMA5D43B-CUR Microchip Technology SAMA5D4-Series-Data-Sheet-DS60001525.pdf Description: IC MPU SAMA5D4 600MHZ 289LFBGA
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 289-LFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, LPDDR2, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: EBI, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART
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ATSAME70Q21B-CNT ATSAME70Q21B-CNT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 2MB FLASH 144LFBGA
Packaging: Cut Tape (CT)
Package / Case: 144-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LFBGA (10x10)
Number of I/O: 114
DigiKey Programmable: Not Verified
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MCP73871T-1AAI/ML MCP73871T-1AAI/ML Microchip Technology 30009610F.pdf Description: IC BATT CHG LI-ION 1CELL 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Interface: USB
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 20-QFN (4x4)
Charge Current - Max: 1.1A
Programmable Features: Timer
Fault Protection: Over Temperature
Voltage - Supply (Max): 6V
Battery Pack Voltage: 4.1V
Current - Charging: Constant - Programmable
Part Status: Active
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MCP73871T-1CAI/ML MCP73871T-1CAI/ML Microchip Technology 30009610F.pdf Description: IC BATT CHG LI-ION 1CELL 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Interface: USB
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 20-QFN (4x4)
Charge Current - Max: 1.1A
Programmable Features: Timer
Fault Protection: Over Temperature
Voltage - Supply (Max): 6V
Battery Pack Voltage: 4.1V
Current - Charging: Constant - Programmable
Part Status: Active
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MCP73871T-1CCI/ML MCP73871T-1CCI/ML Microchip Technology 30009610F.pdf Description: IC BATT CHG LI-ION 1CELL 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Interface: USB
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 20-QFN (4x4)
Charge Current - Max: 1.1A
Programmable Features: Timer
Fault Protection: Over Temperature
Voltage - Supply (Max): 6V
Battery Pack Voltage: 4.1V
Current - Charging: Constant - Programmable
Part Status: Active
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MCP73871T-4CAI/ML MCP73871T-4CAI/ML Microchip Technology 30009610F.pdf Description: IC BATT CHG LI-ION 1CELL 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Interface: USB
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 20-QFN (4x4)
Charge Current - Max: 1.1A
Programmable Features: Timer
Fault Protection: Over Temperature
Voltage - Supply (Max): 6V
Battery Pack Voltage: 4.4V
Current - Charging: Constant - Programmable
Part Status: Active
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MCP73871T-4CCI/ML MCP73871T-4CCI/ML Microchip Technology 30009610F.pdf Description: IC BATT CHG LI-ION 1CELL 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Interface: USB
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 20-QFN (4x4)
Charge Current - Max: 1.1A
Programmable Features: Timer
Fault Protection: Over Temperature
Voltage - Supply (Max): 6V
Battery Pack Voltage: 4.4V
Current - Charging: Constant - Programmable
Part Status: Active
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25+3.74 EUR
100+3.72 EUR
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PIC18F25K83T-I/ML PIC18F25K83T-I/ML Microchip Technology PIC18%28L%29F2526K83-Data-Sheet-DS40001943C.pdf Description: IC MCU 8BIT 32KB FLASH 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F25K83T-I/MX PIC18F25K83T-I/MX Microchip Technology PIC18(L)F2526K83-Data-Sheet-DS40001943C.pdf Description: IC MCU 8BIT 32KB FLASH 28UQFN
Packaging: Cut Tape (CT)
Package / Case: 28-UQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-UQFN (6x6)
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F25K83T-I/SO PIC18F25K83T-I/SO Microchip Technology filehandler.aspx?ddocname=en599873 Description: IC MCU 8BIT 32KB FLASH 28SOIC
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PIC18F25K83T-I/SS PIC18F25K83T-I/SS Microchip Technology PIC18%28L%29F2526K83-Data-Sheet-DS40001943C.pdf Description: IC MCU 8BIT 32KB FLASH 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F26K83T-I/ML PIC18F26K83T-I/ML Microchip Technology PIC18%28L%29F2526K83-Data-Sheet-DS40001943C.pdf Description: IC MCU 8BIT 64KB FLASH 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F26K83T-I/MX PIC18F26K83T-I/MX Microchip Technology filehandler.aspx?ddocname=en599873 Description: IC MCU 8BIT 64KB FLASH 28UQFN
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PIC18F26K83T-I/SO PIC18F26K83T-I/SO Microchip Technology PIC18(L)F2526K83-Data-Sheet-DS40001943C.pdf Description: IC MCU 8BIT 64KB FLASH 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F26K83T-I/SS PIC18F26K83T-I/SS Microchip Technology PIC18%28L%29F2526K83-Data-Sheet-DS40001943C.pdf Description: IC MCU 8BIT 64KB FLASH 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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1N5615US/TR 1N5615US/TR Microchip Technology 11062-sd47a-datasheet Description: DIODE GEN PURP 200V 1A D-5A
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Capacitance @ Vr, F: 45pF @ 12V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: D-5A
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 3 A
Current - Reverse Leakage @ Vr: 500 nA @ 200 V
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CDLL4696E3 CDLL4696E3 Microchip Technology CDLL4678-4717.pdf Description: DIODE ZENER 9.1V 500MW DO213AA
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CDLL5535B/TR CDLL5535B/TR Microchip Technology 8860-lds-0037-datasheet Description: DIODE ZENER 15V 500MW DO213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 13.5 V
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JAN1N6316US JAN1N6316US Microchip Technology 11083-lds-0193-1-datasheet Description: DIODE ZENER 4.7V 500MW SQ-MELF
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: B, SQ-MELF
Grade: Military
Part Status: Active
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 5 µA @ 1.5 V
Qualification: MIL-PRF-19500/533
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JAN1N6319US Microchip Technology 11083-lds-0193-1-datasheet Description: DIODE ZENER 6.2V 500MW MELF
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JAN1N6320 JAN1N6320 Microchip Technology 10924-lds-0193-datasheet Description: DIODE ZENER 6.8V 500MW DO35
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 4 V
Qualification: MIL-PRF-19500/533
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JAN1N6320C JAN1N6320C Microchip Technology 10924-lds-0193-datasheet Description: DIODE ZENER 6.8V 500MW DO35
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 4 V
Qualification: MIL-PRF-19500/533
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JAN1N6320US Microchip Technology 11083-lds-0193-1-datasheet Description: DIODE ZENER 6.8V 500MW MELF
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JANTX1N6320C JANTX1N6320C Microchip Technology 10924-lds-0193-datasheet Description: DIODE ZENER 6.8V 500MW DO35
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 4 V
Qualification: MIL-PRF-19500/533
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JANTX1N6320D JANTX1N6320D Microchip Technology 10924-lds-0193-datasheet Description: DIODE ZENER 6.8V 500MW DO35
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 4 V
Qualification: MIL-PRF-19500/533
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JANS1N6320C JANS1N6320C Microchip Technology 10924-lds-0193-datasheet Description: DIODE ZENER 6.8V 500MW DO35
Tolerance: ±2%
Packaging: Tray
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 4 V
Qualification: MIL-PRF-19500/533
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JAN1N6320/TR JAN1N6320/TR Microchip Technology 10924-lds-0193-datasheet Description: DIODE ZENER 6.8V 500MW DO35
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 4 V
Qualification: MIL-PRF-19500/533
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2N2222AE3 2N2222AE3 Microchip Technology Description: TRANS NPN 50V 0.8A TO-18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18 (TO-206AA)
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
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2N3439U4 2N3439U4 Microchip Technology 125351-lds-0022-2-datasheet Description: TRANS NPN 350V 1A U4
Packaging: Tray
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 4mA, 50mA
Current - Collector Cutoff (Max): 2µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 20mA, 10V
Supplier Device Package: U4
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 350 V
Power - Max: 800 mW
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2N5416UA/TR Microchip Technology 2N5415UA-2N5416UA-LDS-0305-3-MIL-PRF-19500-485.pdf Description: TRANS PNP 300V 1A UA
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 2V @ 5mA, 50mA
Current - Collector Cutoff (Max): 50µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 50mA, 10V
Supplier Device Package: UA
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 300 V
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JANSR2N2920U Microchip Technology Description: RH SMALL-SIGNAL BJT
Packaging: Tray
Package / Case: 6-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: 2 NPN (Dual)
Operating Temperature: -65°C ~ 200°C (TJ)
Power - Max: 350mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 60V
Vce Saturation (Max) @ Ib, Ic: 300mV @ 100µA, 1mA
Current - Collector Cutoff (Max): 10µA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 1mA, 5V
Supplier Device Package: 6-SMD
Grade: Military
Qualification: MIL-PRF-19500/355
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JANS2N3499L JANS2N3499L Microchip Technology lds-0276-1_2N3498L-01L.pdf Description: TRANS NPN 100V 0.5A TO-5AA
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JANSF2N2222A JANSF2N2222A Microchip Technology 8868-lds-0042-datasheet Description: TRANS NPN 50V 0.8A TO-18
Packaging: Tray
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18 (TO-206AA)
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/255
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JANSF2N2222AL JANSF2N2222AL Microchip Technology 8868-lds-0042-datasheet Description: TRANS NPN 50V 0.8A TO-18
Packaging: Tray
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18 (TO-206AA)
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/255
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JANSF2N2222AUA JANSF2N2222AUA Microchip Technology Description: TRANS NPN 50V 0.8A UA
Packaging: Tray
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UA
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 650 mW
Qualification: MIL-PRF-19500/255
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JANSF2N2484 JANSF2N2484 Microchip Technology Description: TRANS NPN 60V 0.05A TO18
Packaging: Tray
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 100µA, 1mA
Current - Collector Cutoff (Max): 2nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 225 @ 10mA, 5V
Supplier Device Package: TO-18 (TO-206AA)
Current - Collector (Ic) (Max): 50 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
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JANSR2N2222AUB JANSR2N2222AUB Microchip Technology Description: TRANS NPN 50V 0.8A UB
Packaging: Tray
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/255
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JANSR2N3440 JANSR2N3440 Microchip Technology 8947-lds-0134-datasheet Description: TRANS NPN 250V 1A TO39
Packaging: Tray
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 4mA, 50mA
Current - Collector Cutoff (Max): 2µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 20mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 250 V
Qualification: MIL-PRF-19500/368
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JANSR2N3700UB JANSR2N3700UB Microchip Technology 125349-lds-0185-3.pdf Description: TRANS NPN 80V 1A UB
Packaging: Tray
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 10nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 500mA, 10V
Supplier Device Package: UB
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/391
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JANTX1N5711-1/TR JANTX1N5711-1/TR Microchip Technology LDS-0040_r4%2C+1N5711-12_1N6857-58_DSB2810_5712%2C+MIL-PRF-19500-444.pdf Description: DIODE SCHOTTKY 50V 33MA DO204AH
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 33mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 150°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 15 mA
Current - Reverse Leakage @ Vr: 200 nA @ 50 V
Qualification: MIL-PRF-19500/444
Produkt ist nicht verfügbar
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JANTX1N5811/TR JANTX1N5811/TR Microchip Technology LDS-0168-1%2C+1N5807US-1N5809US-1N5811US%28URS%29%2C+MIL-PRF-19500-477.pdf Description: DIODE STANDARD 150V 3A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
Produkt ist nicht verfügbar
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JANTX1N5822US/TR JANTX1N5822US/TR Microchip Technology LDS-0303-1%2C+1N5820US-1N5822US%2C1N6864US%2C+MIL-PRF-19500-620.pdf Description: DIODE SCHOTTKY 40V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 125°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 500 mV @ 3 A
Current - Reverse Leakage @ Vr: 100 µA @ 40 V
Qualification: MIL-PRF-19500/620
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JANTX1N6316US/TR JANTX1N6316US/TR Microchip Technology 11083-lds-0193-1-datasheet Description: DIODE ZENER 4.7V 500MW MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: B, SQ-MELF
Part Status: Active
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 5 µA @ 1.5 V
Produkt ist nicht verfügbar
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PIC18F26K83-E/SP PIC18(L)F2526K83-Data-Sheet-DS40001943C.pdf
PIC18F26K83-E/SP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28SPDIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F26K83-E/SS PIC18(L)F2526K83-Data-Sheet-DS40001943C.pdf
PIC18F26K83-E/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F26K83-I/ML PIC18%28L%29F2526K83-Data-Sheet-DS40001943C.pdf
PIC18F26K83-I/ML
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28QFN
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F26K83-I/MX filehandler.aspx?ddocname=en599873
PIC18F26K83-I/MX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28UQFN
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PIC18F26K83-I/SO PIC18%28L%29F2526K83-Data-Sheet-DS40001943C.pdf
PIC18F26K83-I/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F26K83-I/SP PIC18%28L%29F2526K83-Data-Sheet-DS40001943C.pdf
PIC18F26K83-I/SP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28SPDIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F26K83-I/SS PIC18%28L%29F2526K83-Data-Sheet-DS40001943C.pdf
PIC18F26K83-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18LF25K83-E/SS PIC18(L)F2526K83-Data-Sheet-DS40001943C.pdf
PIC18LF25K83-E/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
DigiKey Programmable: Not Verified
auf Bestellung 376 Stücke:
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PIC18LF25K83-I/ML PIC18(L)F2526K83-Data-Sheet-DS40001943C.pdf
PIC18LF25K83-I/ML
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28QFN
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18LF26K83-I/SS PIC18(L)F2526K83-Data-Sheet-DS40001943C.pdf
PIC18LF26K83-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
DigiKey Programmable: Not Verified
auf Bestellung 335 Stücke:
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ATECC608A-MAHCZ-S ATECC608A-CryptoAuthentication-Device-Summary-Data-Sheet-DS40001977B.pdf
ATECC608A-MAHCZ-S
Hersteller: Microchip Technology
Description: IC AUTHENTICATION CHIP 8-UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Applications: Networking and Communications
Supplier Device Package: 8-UDFN (2x3)
Part Status: Active
DigiKey Programmable: Not Verified
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ATECC608A-MAHCZ-T ATECC608A-CryptoAuthentication-Device-Summary-Data-Sheet-DS40001977B.pdf
ATECC608A-MAHCZ-T
Hersteller: Microchip Technology
Description: IC AUTHENTICATION CHIP 8-UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Applications: Networking and Communications
Supplier Device Package: 8-UDFN (2x3)
Part Status: Active
DigiKey Programmable: Not Verified
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ATECC608A-MAHDA-S ATECC608A-CryptoAuthentication-Device-Summary-Data-Sheet-DS40001977B.pdf
ATECC608A-MAHDA-S
Hersteller: Microchip Technology
Description: IC AUTHENTICATION CHIP 8-UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Applications: Networking and Communications
Supplier Device Package: 8-UDFN (2x3)
Part Status: Active
DigiKey Programmable: Not Verified
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12+1.84 EUR
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ATECC608A-MAHDA-T ATECC608A-CryptoAuthentication-Device-Summary-Data-Sheet-DS40001977B.pdf
ATECC608A-MAHDA-T
Hersteller: Microchip Technology
Description: IC AUTHENTICATION CHIP 8-UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Applications: Networking and Communications
Supplier Device Package: 8-UDFN (2x3)
Part Status: Active
DigiKey Programmable: Not Verified
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ATECC608A-SSHCZ-T ATECC608A-CryptoAuthentication-Device-Summary-Data-Sheet-DS40001977B.pdf
ATECC608A-SSHCZ-T
Hersteller: Microchip Technology
Description: IC AUTHENTICATION CHIP 8-SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Applications: Networking and Communications
Supplier Device Package: 8-SOIC
Part Status: Active
DigiKey Programmable: Not Verified
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ATECC608A-SSHDA-T ATECC608A-CryptoAuthentication-Device-Summary-Data-Sheet-DS40001977B.pdf
ATECC608A-SSHDA-T
Hersteller: Microchip Technology
Description: IC AUTHENTICATION CHIP 8-SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Applications: Networking and Communications
Supplier Device Package: 8-SOIC
Part Status: Active
DigiKey Programmable: Not Verified
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ATSAMA5D41B-CUR SAMA5D4-Series-Data-Sheet-DS60001525.pdf
ATSAMA5D41B-CUR
Hersteller: Microchip Technology
Description: IC MPU SAMA5D4 600MHZ 289LFBGA
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ATSAMA5D43B-CUR SAMA5D4-Series-Data-Sheet-DS60001525.pdf
ATSAMA5D43B-CUR
Hersteller: Microchip Technology
Description: IC MPU SAMA5D4 600MHZ 289LFBGA
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 289-LFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, LPDDR2, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: EBI, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART
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ATSAME70Q21B-CNT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAME70Q21B-CNT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 144LFBGA
Packaging: Cut Tape (CT)
Package / Case: 144-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LFBGA (10x10)
Number of I/O: 114
DigiKey Programmable: Not Verified
auf Bestellung 1286 Stücke:
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MCP73871T-1AAI/ML 30009610F.pdf
MCP73871T-1AAI/ML
Hersteller: Microchip Technology
Description: IC BATT CHG LI-ION 1CELL 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Interface: USB
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 20-QFN (4x4)
Charge Current - Max: 1.1A
Programmable Features: Timer
Fault Protection: Over Temperature
Voltage - Supply (Max): 6V
Battery Pack Voltage: 4.1V
Current - Charging: Constant - Programmable
Part Status: Active
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MCP73871T-1CAI/ML 30009610F.pdf
MCP73871T-1CAI/ML
Hersteller: Microchip Technology
Description: IC BATT CHG LI-ION 1CELL 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Interface: USB
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 20-QFN (4x4)
Charge Current - Max: 1.1A
Programmable Features: Timer
Fault Protection: Over Temperature
Voltage - Supply (Max): 6V
Battery Pack Voltage: 4.1V
Current - Charging: Constant - Programmable
Part Status: Active
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MCP73871T-1CCI/ML 30009610F.pdf
MCP73871T-1CCI/ML
Hersteller: Microchip Technology
Description: IC BATT CHG LI-ION 1CELL 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Interface: USB
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 20-QFN (4x4)
Charge Current - Max: 1.1A
Programmable Features: Timer
Fault Protection: Over Temperature
Voltage - Supply (Max): 6V
Battery Pack Voltage: 4.1V
Current - Charging: Constant - Programmable
Part Status: Active
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MCP73871T-4CAI/ML 30009610F.pdf
MCP73871T-4CAI/ML
Hersteller: Microchip Technology
Description: IC BATT CHG LI-ION 1CELL 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Interface: USB
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 20-QFN (4x4)
Charge Current - Max: 1.1A
Programmable Features: Timer
Fault Protection: Over Temperature
Voltage - Supply (Max): 6V
Battery Pack Voltage: 4.4V
Current - Charging: Constant - Programmable
Part Status: Active
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MCP73871T-4CCI/ML 30009610F.pdf
MCP73871T-4CCI/ML
Hersteller: Microchip Technology
Description: IC BATT CHG LI-ION 1CELL 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Interface: USB
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 20-QFN (4x4)
Charge Current - Max: 1.1A
Programmable Features: Timer
Fault Protection: Over Temperature
Voltage - Supply (Max): 6V
Battery Pack Voltage: 4.4V
Current - Charging: Constant - Programmable
Part Status: Active
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PIC18F25K83T-I/ML PIC18%28L%29F2526K83-Data-Sheet-DS40001943C.pdf
PIC18F25K83T-I/ML
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F25K83T-I/MX PIC18(L)F2526K83-Data-Sheet-DS40001943C.pdf
PIC18F25K83T-I/MX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28UQFN
Packaging: Cut Tape (CT)
Package / Case: 28-UQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-UQFN (6x6)
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F25K83T-I/SO filehandler.aspx?ddocname=en599873
PIC18F25K83T-I/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28SOIC
Produkt ist nicht verfügbar
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PIC18F25K83T-I/SS PIC18%28L%29F2526K83-Data-Sheet-DS40001943C.pdf
PIC18F25K83T-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F26K83T-I/ML PIC18%28L%29F2526K83-Data-Sheet-DS40001943C.pdf
PIC18F26K83T-I/ML
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F26K83T-I/MX filehandler.aspx?ddocname=en599873
PIC18F26K83T-I/MX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28UQFN
Produkt ist nicht verfügbar
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PIC18F26K83T-I/SO PIC18(L)F2526K83-Data-Sheet-DS40001943C.pdf
PIC18F26K83T-I/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
auf Bestellung 1264 Stücke:
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PIC18F26K83T-I/SS PIC18%28L%29F2526K83-Data-Sheet-DS40001943C.pdf
PIC18F26K83T-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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1N5615US/TR 11062-sd47a-datasheet
1N5615US/TR
Hersteller: Microchip Technology
Description: DIODE GEN PURP 200V 1A D-5A
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Capacitance @ Vr, F: 45pF @ 12V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: D-5A
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 3 A
Current - Reverse Leakage @ Vr: 500 nA @ 200 V
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CDLL4696E3 CDLL4678-4717.pdf
CDLL4696E3
Hersteller: Microchip Technology
Description: DIODE ZENER 9.1V 500MW DO213AA
Produkt ist nicht verfügbar
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CDLL5535B/TR 8860-lds-0037-datasheet
CDLL5535B/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 15V 500MW DO213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 13.5 V
Produkt ist nicht verfügbar
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JAN1N6316US 11083-lds-0193-1-datasheet
JAN1N6316US
Hersteller: Microchip Technology
Description: DIODE ZENER 4.7V 500MW SQ-MELF
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: B, SQ-MELF
Grade: Military
Part Status: Active
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 5 µA @ 1.5 V
Qualification: MIL-PRF-19500/533
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JAN1N6319US 11083-lds-0193-1-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER 6.2V 500MW MELF
Produkt ist nicht verfügbar
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JAN1N6320 10924-lds-0193-datasheet
JAN1N6320
Hersteller: Microchip Technology
Description: DIODE ZENER 6.8V 500MW DO35
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 4 V
Qualification: MIL-PRF-19500/533
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JAN1N6320C 10924-lds-0193-datasheet
JAN1N6320C
Hersteller: Microchip Technology
Description: DIODE ZENER 6.8V 500MW DO35
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 4 V
Qualification: MIL-PRF-19500/533
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JAN1N6320US 11083-lds-0193-1-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER 6.8V 500MW MELF
Produkt ist nicht verfügbar
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JANTX1N6320C 10924-lds-0193-datasheet
JANTX1N6320C
Hersteller: Microchip Technology
Description: DIODE ZENER 6.8V 500MW DO35
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 4 V
Qualification: MIL-PRF-19500/533
Produkt ist nicht verfügbar
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JANTX1N6320D 10924-lds-0193-datasheet
JANTX1N6320D
Hersteller: Microchip Technology
Description: DIODE ZENER 6.8V 500MW DO35
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 4 V
Qualification: MIL-PRF-19500/533
Produkt ist nicht verfügbar
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JANS1N6320C 10924-lds-0193-datasheet
JANS1N6320C
Hersteller: Microchip Technology
Description: DIODE ZENER 6.8V 500MW DO35
Tolerance: ±2%
Packaging: Tray
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 4 V
Qualification: MIL-PRF-19500/533
Produkt ist nicht verfügbar
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JAN1N6320/TR 10924-lds-0193-datasheet
JAN1N6320/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 6.8V 500MW DO35
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 4 V
Qualification: MIL-PRF-19500/533
Produkt ist nicht verfügbar
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2N2222AE3
2N2222AE3
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A TO-18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18 (TO-206AA)
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
auf Bestellung 285 Stücke:
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3+8.38 EUR
100+7.79 EUR
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2N3439U4 125351-lds-0022-2-datasheet
2N3439U4
Hersteller: Microchip Technology
Description: TRANS NPN 350V 1A U4
Packaging: Tray
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 4mA, 50mA
Current - Collector Cutoff (Max): 2µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 20mA, 10V
Supplier Device Package: U4
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 350 V
Power - Max: 800 mW
Produkt ist nicht verfügbar
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2N5416UA/TR 2N5415UA-2N5416UA-LDS-0305-3-MIL-PRF-19500-485.pdf
Hersteller: Microchip Technology
Description: TRANS PNP 300V 1A UA
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 2V @ 5mA, 50mA
Current - Collector Cutoff (Max): 50µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 50mA, 10V
Supplier Device Package: UA
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 300 V
Produkt ist nicht verfügbar
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JANSR2N2920U
Hersteller: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Packaging: Tray
Package / Case: 6-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: 2 NPN (Dual)
Operating Temperature: -65°C ~ 200°C (TJ)
Power - Max: 350mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 60V
Vce Saturation (Max) @ Ib, Ic: 300mV @ 100µA, 1mA
Current - Collector Cutoff (Max): 10µA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 1mA, 5V
Supplier Device Package: 6-SMD
Grade: Military
Qualification: MIL-PRF-19500/355
Produkt ist nicht verfügbar
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JANS2N3499L lds-0276-1_2N3498L-01L.pdf
JANS2N3499L
Hersteller: Microchip Technology
Description: TRANS NPN 100V 0.5A TO-5AA
Produkt ist nicht verfügbar
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JANSF2N2222A 8868-lds-0042-datasheet
JANSF2N2222A
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A TO-18
Packaging: Tray
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18 (TO-206AA)
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/255
Produkt ist nicht verfügbar
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JANSF2N2222AL 8868-lds-0042-datasheet
JANSF2N2222AL
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A TO-18
Packaging: Tray
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18 (TO-206AA)
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/255
Produkt ist nicht verfügbar
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JANSF2N2222AUA
JANSF2N2222AUA
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A UA
Packaging: Tray
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UA
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 650 mW
Qualification: MIL-PRF-19500/255
Produkt ist nicht verfügbar
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JANSF2N2484
JANSF2N2484
Hersteller: Microchip Technology
Description: TRANS NPN 60V 0.05A TO18
Packaging: Tray
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 100µA, 1mA
Current - Collector Cutoff (Max): 2nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 225 @ 10mA, 5V
Supplier Device Package: TO-18 (TO-206AA)
Current - Collector (Ic) (Max): 50 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
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JANSR2N2222AUB
JANSR2N2222AUB
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A UB
Packaging: Tray
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/255
Produkt ist nicht verfügbar
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JANSR2N3440 8947-lds-0134-datasheet
JANSR2N3440
Hersteller: Microchip Technology
Description: TRANS NPN 250V 1A TO39
Packaging: Tray
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 4mA, 50mA
Current - Collector Cutoff (Max): 2µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 20mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 250 V
Qualification: MIL-PRF-19500/368
Produkt ist nicht verfügbar
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JANSR2N3700UB 125349-lds-0185-3.pdf
JANSR2N3700UB
Hersteller: Microchip Technology
Description: TRANS NPN 80V 1A UB
Packaging: Tray
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 10nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 500mA, 10V
Supplier Device Package: UB
Grade: Military
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/391
Produkt ist nicht verfügbar
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JANTX1N5711-1/TR LDS-0040_r4%2C+1N5711-12_1N6857-58_DSB2810_5712%2C+MIL-PRF-19500-444.pdf
JANTX1N5711-1/TR
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 50V 33MA DO204AH
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 33mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 150°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 15 mA
Current - Reverse Leakage @ Vr: 200 nA @ 50 V
Qualification: MIL-PRF-19500/444
Produkt ist nicht verfügbar
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JANTX1N5811/TR LDS-0168-1%2C+1N5807US-1N5809US-1N5811US%28URS%29%2C+MIL-PRF-19500-477.pdf
JANTX1N5811/TR
Hersteller: Microchip Technology
Description: DIODE STANDARD 150V 3A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
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JANTX1N5822US/TR LDS-0303-1%2C+1N5820US-1N5822US%2C1N6864US%2C+MIL-PRF-19500-620.pdf
JANTX1N5822US/TR
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 40V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 125°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 500 mV @ 3 A
Current - Reverse Leakage @ Vr: 100 µA @ 40 V
Qualification: MIL-PRF-19500/620
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JANTX1N6316US/TR 11083-lds-0193-1-datasheet
JANTX1N6316US/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 4.7V 500MW MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: B, SQ-MELF
Part Status: Active
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 5 µA @ 1.5 V
Produkt ist nicht verfügbar
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