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1N5953B 1N5953B Microchip Technology 10922-sa5-57-datasheet Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 150 V
Impedance (Max) (Zzt): 600 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 114 V
Produkt ist nicht verfügbar
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2N5302 2N5302 Microchip Technology 6088-2n5302-datasheet Description: NPN TRANSISTOR
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 3V @ 6A, 30A
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 15 @ 15A, 2V
Supplier Device Package: TO-204AD (TO-3)
Part Status: Active
Current - Collector (Ic) (Max): 30 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 5 W
Produkt ist nicht verfügbar
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2N5885 2N5885 Microchip Technology Description: PNP POWER TRANSISTOR SILICON AMP
Packaging: Bulk
Produkt ist nicht verfügbar
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2N5886 2N5886 Microchip Technology Description: PNP POWER TRANSISTOR SILICON AMP
Packaging: Bulk
Produkt ist nicht verfügbar
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2N6286 2N6286 Microchip Technology 6116-2n6286-87-datasheet Description: TRANS PNP DARL 80V 20A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: PNP - Darlington
Operating Temperature: -65°C ~ 175°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 3V @ 200mA, 20A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 1500 @ 1A, 3V
Supplier Device Package: TO-204AA (TO-3)
Current - Collector (Ic) (Max): 20 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 175 W
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1N4462US 1N4462US Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER 7.5V 1.5W SQ-MELF
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: A, SQ-MELF
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Produkt ist nicht verfügbar
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1N4467US 1N4467US Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 7 Ohms
Supplier Device Package: A, SQ-MELF
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 200 nA @ 9.6 V
Produkt ist nicht verfügbar
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1N4475US 1N4475US Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 18 Ohms
Supplier Device Package: A, SQ-MELF
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 50 nA @ 21.6 V
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1N4487US 1N4487US Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 82 V
Impedance (Max) (Zzt): 160 Ohms
Supplier Device Package: D-5A
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 250 nA @ 65.6 V
Produkt ist nicht verfügbar
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1N4488US 1N4488US Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 91 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: A, SQ-MELF
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 250 nA @ 72.8 V
Produkt ist nicht verfügbar
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1N4494US 1N4494US Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 160 V
Impedance (Max) (Zzt): 1000 Ohms
Supplier Device Package: A, SQ-MELF
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 250 nA @ 128 V
Produkt ist nicht verfügbar
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1N6123 Microchip Technology 127891-lds-0277-datasheet Description: TVS DIODE
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1N6638US 1N6638US Microchip Technology 5895-1n6638-42-43us-datasheet Description: DIODE STANDARD 125V 300MA D5D
Packaging: Bulk
Package / Case: SQ-MELF, D
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4.5 ns
Technology: Standard
Capacitance @ Vr, F: 2.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 300mA
Supplier Device Package: D-5D
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 125 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 125 V
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1N1199B 1N1199B Microchip Technology 8545-coe-3-datasheet Description: STANDARD RECTIFIER
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 12A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
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1N1200B 1N1200B Microchip Technology 8545-coe-3-datasheet Description: STANDARD RECTIFIER
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 12A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
Produkt ist nicht verfügbar
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1N1204B 1N1204B Microchip Technology 8545-coe-3-datasheet Description: STANDARD RECTIFIER
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 12A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 400 V
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1N1183AR Microchip Technology 8540-coe-18-datasheet Description: STANDARD RECTIFIER
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 40A
Supplier Device Package: DO-203AB (DO-5)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.19 V @ 90 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
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1N1184AR Microchip Technology 8540-coe-18-datasheet Description: STANDARD RECTIFIER
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 40A
Supplier Device Package: DO-203AB (DO-5)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.19 V @ 90 A
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
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1N5833 Microchip Technology 5868-1n5832-34-datasheet Description: DIODE SCHOTTKY 30V 40A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 40A
Supplier Device Package: DO-5
Operating Temperature - Junction: -65°C ~ 125°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 550 mV @ 40 A
Current - Reverse Leakage @ Vr: 20 mA @ 30 V
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1N5834 Microchip Technology 5868-1n5832-34-datasheet Description: 5A SCHOTTKY RECTIFIER
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2N2218A 2N2218A Microchip Technology 8917-lds-0091-datasheet Description: TRANS NPN 30V 0.8A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -55°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 10nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 150mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 800 mW
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2N3716 2N3716 Microchip Technology 6049-2n3715-datasheet Description: NPN POWER SILICON TRANSISTORS
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 2.5V @ 2A, 10A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 1A, 2V
Supplier Device Package: TO-204AD (TO-3)
Current - Collector (Ic) (Max): 10 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 5 W
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2N5878 2N5878 Microchip Technology Description: PNP POWER TRANSISTOR SILICON AMP
Packaging: Bulk
Produkt ist nicht verfügbar
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2N918 Microchip Technology 8811-lds-0010-datasheet Description: TRANS NPN 15V 0.05A TO-72
Packaging: Bulk
Package / Case: TO-206AF, TO-72-4 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 400mV @ 1mA, 10mA
Current - Collector Cutoff (Max): 1µA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 10mA, 10V
Supplier Device Package: TO-72
Part Status: Active
Current - Collector (Ic) (Max): 50 mA
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 200 mW
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APTGLQ200H65G Microchip Technology 136242-aptglq200h65g-datasheet Description: IGBT MODULE 650V 270A 680W SP6
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: SP6
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 270 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Power - Max: 680 W
Current - Collector Cutoff (Max): 75 µA
Input Capacitance (Cies) @ Vce: 12.2 nF @ 25 V
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APTGLQ300SK120G Microchip Technology 136244-aptglq300sk120g-datasheet Description: IGBT MODULE 1200V 500A 1500W SP6
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Buck Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.42V @ 15V, 300A
NTC Thermistor: No
Supplier Device Package: SP6
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 500 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1500 W
Current - Collector Cutoff (Max): 200 µA
Input Capacitance (Cies) @ Vce: 17.6 nF @ 25 V
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APTGLQ50DDA65T3G Microchip Technology 136230-aptglq50dda65t3g-datasheet Description: IGBT MODULE 650V 70A 175W
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APTGLQ50TL65T3G Microchip Technology 136233-aptglq50tl65t3g-datasheet Description: IGBT MODULE 650V 70A 175W SP3F
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Level Inverter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: SP3F
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Power - Max: 175 W
Current - Collector Cutoff (Max): 50 µA
Input Capacitance (Cies) @ Vce: 3.1 nF @ 25 V
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APTGLQ50VDA65T3G Microchip Technology 136234-aptglq50vda65t3g-datasheet Description: IGBT MODULE 650V 70A 175W SP3F
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APTGTQ200A65T3G Microchip Technology 135989-aptgtq200a65t3g-datasheet Description: IGBT MODULE 650V 200A 483W SP3F
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.2V @ 15V, 200A
NTC Thermistor: Yes
Supplier Device Package: SP3F
Current - Collector (Ic) (Max): 200 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Power - Max: 483 W
Current - Collector Cutoff (Max): 200 µA
Input Capacitance (Cies) @ Vce: 12 nF @ 25 V
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APTGTQ200DA65T3G Microchip Technology 135990-aptgtq200da65t3g-datasheet Description: IGBT MODULE 650V 200A 483W SP3F
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APTGTQ200SK65T3G Microchip Technology 135991-aptgtq200sk65t3g-datasheet Description: IGBT MODULE 650V 200A 483W SP3F
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Buck Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.2V @ 15V, 200A
NTC Thermistor: Yes
Supplier Device Package: SP3F
Current - Collector (Ic) (Max): 200 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Power - Max: 483 W
Current - Collector Cutoff (Max): 200 µA
Input Capacitance (Cies) @ Vce: 12 nF @ 25 V
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PD69204T4ILQ-TR PD69204T4ILQ-TR Microchip Technology 136500-pd69204t4-datasheet Description: IC POE CNTRL 4 CHANNEL 56QFN
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PD69208MILQ-TR PD69208MILQ-TR Microchip Technology 136498-pd69208m-and-pd69200-datasheet Description: IC POE CNTRL 8 CHANNEL 56QFN
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PD69208T4ILQ-TR PD69208T4ILQ-TR Microchip Technology Description: IC POE CNTRL 8 CHANNEL 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Controller (PSE)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 32V ~ 57V
Internal Switch(s): Yes
Standards: 802.3at (PoE+), 802.3af (PoE)
Supplier Device Package: 56-QFN (8x8)
Auxiliary Sense: Yes
Part Status: Obsolete
Number of Channels: 8
Power - Max: 95 W
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VSC7223XJV Microchip Technology download.php?fid=5010&number=vsc7223 Description: MULTIRATE 16 GBPS QUAD RETIMER/R
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VSC7438YIH-02 Microchip Technology VMDS-10497_VSC7438-02_VSC7464-02_VSC7468-02.pdf Description: IC TELECOM INTERFACE
Packaging: Tray
Package / Case: 672-BGA, FCBGA
Mounting Type: Surface Mount
Function: Ethernet Switch
Interface: Ethernet
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 672-FCBGA (27x27)
Number of Circuits: 1
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VSC7464YIH-02 VSC7464YIH-02 Microchip Technology filehandler.aspx?ddocname=en609809 Description: IC TELECOM INTERFACE
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VSC8522XJQ-04 VSC8522XJQ-04 Microchip Technology filehandler.aspx?ddocname=en950033 Description: IC TELECOM INTERFACE 302TQFP
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ZL79124GDG2 Microchip Technology Description: IC AUDIO PROCESSOR 144BGA
Packaging: Bulk
Package / Case: 144-BGA
Mounting Type: Surface Mount
Function: Audio Processor
Supplier Device Package: 144-BGA
Part Status: Active
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SY100EL16VDWC Microchip Technology filehandler.aspx?ddocname=en582597 Description: 5V/3.3V ENHANCED DIFFERENTIAL RE
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ADM00745 ADM00745 Microchip Technology MCP19124-MCP19125-Data-Sheet-DS20005619B.pdf Description: FLYBACK BATTERY CHARGER EVAL BD
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: MCP19125
Supplied Contents: Board(s)
Embedded: Yes
Part Status: Active
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ADM00810 ADM00810 Microchip Technology MIC24046.pdf Description: EVAL KIT
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DM160230 DM160230 Microchip Technology Description: PIC18 POE MAIN BOARD
Packaging: Bulk
Function: Power Over Ethernet (PoE)
Type: Power Management
Utilized IC / Part: PIC18F67J60
Supplied Contents: Board(s)
Embedded: Yes, MCU, 8-Bit
Part Status: Active
Contents: Board(s)
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DM160236 DM160236 Microchip Technology Description: POE PROGRAMMER ADAPTER
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DV161001 DV161001 Microchip Technology Description: PIC18 POE DEVELOPMENT KIT
Packaging: Bulk
Function: Power Over Ethernet (PoE)
Type: Power Management
Utilized IC / Part: PIC18F67J60
Supplied Contents: Board(s), Power Supply
Embedded: Yes, MCU, 8-Bit
Part Status: Active
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TPG100002-G3 TPG100002-G3 Microchip Technology Description: ICSP PRODUCTION PROGRAMMER
Packaging: Bulk
For Use With/Related Products: PIC Micro® MCU
Type: Programmer (In-Circuit/In-System)
Contents: Board(s)
Part Status: Active
auf Bestellung 2 Stücke:
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ATSAMV70N19B-AABT ATSAMV70N19B-AABT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Grade: Automotive
Number of I/O: 75
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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ATSAMV70N20B-AABT ATSAMV70N20B-AABT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Grade: Automotive
Number of I/O: 75
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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ATSAMV71N19B-AABT ATSAMV71N19B-AABT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 75
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAMV71N20B-AABT ATSAMV71N20B-AABT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Grade: Automotive
Number of I/O: 75
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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1000+19.15 EUR
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ATSAMV71N21B-AABT ATSAMV71N21B-AABT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 75
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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1000+23.52 EUR
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ATSAMV71N21B-CBT ATSAMV71N21B-CBT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 2MB FLASH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 75
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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MEC1428-TF-C1-TR MEC1428-TF-C1-TR Microchip Technology 00002518a.pdf Description: SRAM
Produkt ist nicht verfügbar
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ATSAMV70Q20B-AABT ATSAMV70Q20B-AABT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 114
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAMV71Q19B-AABT ATSAMV71Q19B-AABT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 114
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAMV71Q20B-AABT ATSAMV71Q20B-AABT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 114
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAMV70Q20B-CBT ATSAMV70Q20B-CBT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 1MB FLASH 144TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
DigiKey Programmable: Not Verified
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ATSAMV71Q19B-CBT ATSAMV71Q19B-CBT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 512KB FLSH 144TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
DigiKey Programmable: Not Verified
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1000+21.01 EUR
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MEC1428-SZ-C1-TR MEC1428-SZ-C1-TR Microchip Technology 00002518a.pdf Description: SRAM
Packaging: Tape & Reel (TR)
Package / Case: 144-WFBGA
Mounting Type: Surface Mount
Interface: I²C, LPC, SMBus, SPI, UART
RAM Size: 192kB
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.71V ~ 3.465V
Program Memory Type: External Program Memory
Applications: Keyboard and Embedded Controller
Core Processor: MIPS32® M14K™
Supplier Device Package: 144-WFBGA (9x9)
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1N5953B 10922-sa5-57-datasheet
1N5953B
Hersteller: Microchip Technology
Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 150 V
Impedance (Max) (Zzt): 600 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 114 V
Produkt ist nicht verfügbar
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2N5302 6088-2n5302-datasheet
2N5302
Hersteller: Microchip Technology
Description: NPN TRANSISTOR
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 3V @ 6A, 30A
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 15 @ 15A, 2V
Supplier Device Package: TO-204AD (TO-3)
Part Status: Active
Current - Collector (Ic) (Max): 30 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 5 W
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2N5885
2N5885
Hersteller: Microchip Technology
Description: PNP POWER TRANSISTOR SILICON AMP
Packaging: Bulk
Produkt ist nicht verfügbar
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2N5886
2N5886
Hersteller: Microchip Technology
Description: PNP POWER TRANSISTOR SILICON AMP
Packaging: Bulk
Produkt ist nicht verfügbar
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2N6286 6116-2n6286-87-datasheet
2N6286
Hersteller: Microchip Technology
Description: TRANS PNP DARL 80V 20A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: PNP - Darlington
Operating Temperature: -65°C ~ 175°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 3V @ 200mA, 20A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 1500 @ 1A, 3V
Supplier Device Package: TO-204AA (TO-3)
Current - Collector (Ic) (Max): 20 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 175 W
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1N4462US 124793-lds-0183-1-datasheet
1N4462US
Hersteller: Microchip Technology
Description: DIODE ZENER 7.5V 1.5W SQ-MELF
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: A, SQ-MELF
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Produkt ist nicht verfügbar
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1N4467US 124793-lds-0183-1-datasheet
1N4467US
Hersteller: Microchip Technology
Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 7 Ohms
Supplier Device Package: A, SQ-MELF
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 200 nA @ 9.6 V
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1N4475US 124793-lds-0183-1-datasheet
1N4475US
Hersteller: Microchip Technology
Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 18 Ohms
Supplier Device Package: A, SQ-MELF
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 50 nA @ 21.6 V
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1N4487US 124793-lds-0183-1-datasheet
1N4487US
Hersteller: Microchip Technology
Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 82 V
Impedance (Max) (Zzt): 160 Ohms
Supplier Device Package: D-5A
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 250 nA @ 65.6 V
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1N4488US 124793-lds-0183-1-datasheet
1N4488US
Hersteller: Microchip Technology
Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 91 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: A, SQ-MELF
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 250 nA @ 72.8 V
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1N4494US 124793-lds-0183-1-datasheet
1N4494US
Hersteller: Microchip Technology
Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 160 V
Impedance (Max) (Zzt): 1000 Ohms
Supplier Device Package: A, SQ-MELF
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 250 nA @ 128 V
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1N6123 127891-lds-0277-datasheet
Hersteller: Microchip Technology
Description: TVS DIODE
Produkt ist nicht verfügbar
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1N6638US 5895-1n6638-42-43us-datasheet
1N6638US
Hersteller: Microchip Technology
Description: DIODE STANDARD 125V 300MA D5D
Packaging: Bulk
Package / Case: SQ-MELF, D
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4.5 ns
Technology: Standard
Capacitance @ Vr, F: 2.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 300mA
Supplier Device Package: D-5D
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 125 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 125 V
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100+11.04 EUR
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1N1199B 8545-coe-3-datasheet
1N1199B
Hersteller: Microchip Technology
Description: STANDARD RECTIFIER
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 12A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
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1N1200B 8545-coe-3-datasheet
1N1200B
Hersteller: Microchip Technology
Description: STANDARD RECTIFIER
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 12A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
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1N1204B 8545-coe-3-datasheet
1N1204B
Hersteller: Microchip Technology
Description: STANDARD RECTIFIER
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 12A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 400 V
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1N1183AR 8540-coe-18-datasheet
Hersteller: Microchip Technology
Description: STANDARD RECTIFIER
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 40A
Supplier Device Package: DO-203AB (DO-5)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.19 V @ 90 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
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1N1184AR 8540-coe-18-datasheet
Hersteller: Microchip Technology
Description: STANDARD RECTIFIER
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 40A
Supplier Device Package: DO-203AB (DO-5)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.19 V @ 90 A
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
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1N5833 5868-1n5832-34-datasheet
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 30V 40A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 40A
Supplier Device Package: DO-5
Operating Temperature - Junction: -65°C ~ 125°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 550 mV @ 40 A
Current - Reverse Leakage @ Vr: 20 mA @ 30 V
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1N5834 5868-1n5832-34-datasheet
Hersteller: Microchip Technology
Description: 5A SCHOTTKY RECTIFIER
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2N2218A 8917-lds-0091-datasheet
2N2218A
Hersteller: Microchip Technology
Description: TRANS NPN 30V 0.8A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -55°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
Current - Collector Cutoff (Max): 10nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 150mA, 10V
Supplier Device Package: TO-39 (TO-205AD)
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 800 mW
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2N3716 6049-2n3715-datasheet
2N3716
Hersteller: Microchip Technology
Description: NPN POWER SILICON TRANSISTORS
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 2.5V @ 2A, 10A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 1A, 2V
Supplier Device Package: TO-204AD (TO-3)
Current - Collector (Ic) (Max): 10 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 5 W
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2N5878
2N5878
Hersteller: Microchip Technology
Description: PNP POWER TRANSISTOR SILICON AMP
Packaging: Bulk
Produkt ist nicht verfügbar
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2N918 8811-lds-0010-datasheet
Hersteller: Microchip Technology
Description: TRANS NPN 15V 0.05A TO-72
Packaging: Bulk
Package / Case: TO-206AF, TO-72-4 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 400mV @ 1mA, 10mA
Current - Collector Cutoff (Max): 1µA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 10mA, 10V
Supplier Device Package: TO-72
Part Status: Active
Current - Collector (Ic) (Max): 50 mA
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 200 mW
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APTGLQ200H65G 136242-aptglq200h65g-datasheet
Hersteller: Microchip Technology
Description: IGBT MODULE 650V 270A 680W SP6
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: SP6
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 270 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Power - Max: 680 W
Current - Collector Cutoff (Max): 75 µA
Input Capacitance (Cies) @ Vce: 12.2 nF @ 25 V
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APTGLQ300SK120G 136244-aptglq300sk120g-datasheet
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 500A 1500W SP6
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Buck Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.42V @ 15V, 300A
NTC Thermistor: No
Supplier Device Package: SP6
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 500 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1500 W
Current - Collector Cutoff (Max): 200 µA
Input Capacitance (Cies) @ Vce: 17.6 nF @ 25 V
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APTGLQ50DDA65T3G 136230-aptglq50dda65t3g-datasheet
Hersteller: Microchip Technology
Description: IGBT MODULE 650V 70A 175W
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APTGLQ50TL65T3G 136233-aptglq50tl65t3g-datasheet
Hersteller: Microchip Technology
Description: IGBT MODULE 650V 70A 175W SP3F
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Level Inverter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: SP3F
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Power - Max: 175 W
Current - Collector Cutoff (Max): 50 µA
Input Capacitance (Cies) @ Vce: 3.1 nF @ 25 V
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APTGLQ50VDA65T3G 136234-aptglq50vda65t3g-datasheet
Hersteller: Microchip Technology
Description: IGBT MODULE 650V 70A 175W SP3F
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APTGTQ200A65T3G 135989-aptgtq200a65t3g-datasheet
Hersteller: Microchip Technology
Description: IGBT MODULE 650V 200A 483W SP3F
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.2V @ 15V, 200A
NTC Thermistor: Yes
Supplier Device Package: SP3F
Current - Collector (Ic) (Max): 200 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Power - Max: 483 W
Current - Collector Cutoff (Max): 200 µA
Input Capacitance (Cies) @ Vce: 12 nF @ 25 V
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APTGTQ200DA65T3G 135990-aptgtq200da65t3g-datasheet
Hersteller: Microchip Technology
Description: IGBT MODULE 650V 200A 483W SP3F
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APTGTQ200SK65T3G 135991-aptgtq200sk65t3g-datasheet
Hersteller: Microchip Technology
Description: IGBT MODULE 650V 200A 483W SP3F
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Buck Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.2V @ 15V, 200A
NTC Thermistor: Yes
Supplier Device Package: SP3F
Current - Collector (Ic) (Max): 200 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Power - Max: 483 W
Current - Collector Cutoff (Max): 200 µA
Input Capacitance (Cies) @ Vce: 12 nF @ 25 V
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PD69204T4ILQ-TR 136500-pd69204t4-datasheet
PD69204T4ILQ-TR
Hersteller: Microchip Technology
Description: IC POE CNTRL 4 CHANNEL 56QFN
auf Bestellung 2000 Stücke:
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PD69208MILQ-TR 136498-pd69208m-and-pd69200-datasheet
PD69208MILQ-TR
Hersteller: Microchip Technology
Description: IC POE CNTRL 8 CHANNEL 56QFN
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PD69208T4ILQ-TR
PD69208T4ILQ-TR
Hersteller: Microchip Technology
Description: IC POE CNTRL 8 CHANNEL 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Controller (PSE)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 32V ~ 57V
Internal Switch(s): Yes
Standards: 802.3at (PoE+), 802.3af (PoE)
Supplier Device Package: 56-QFN (8x8)
Auxiliary Sense: Yes
Part Status: Obsolete
Number of Channels: 8
Power - Max: 95 W
Produkt ist nicht verfügbar
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VSC7223XJV download.php?fid=5010&number=vsc7223
Hersteller: Microchip Technology
Description: MULTIRATE 16 GBPS QUAD RETIMER/R
auf Bestellung 334 Stücke:
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VSC7438YIH-02 VMDS-10497_VSC7438-02_VSC7464-02_VSC7468-02.pdf
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE
Packaging: Tray
Package / Case: 672-BGA, FCBGA
Mounting Type: Surface Mount
Function: Ethernet Switch
Interface: Ethernet
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 672-FCBGA (27x27)
Number of Circuits: 1
Produkt ist nicht verfügbar
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VSC7464YIH-02 filehandler.aspx?ddocname=en609809
VSC7464YIH-02
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE
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VSC8522XJQ-04 filehandler.aspx?ddocname=en950033
VSC8522XJQ-04
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE 302TQFP
auf Bestellung 23 Stücke:
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ZL79124GDG2
Hersteller: Microchip Technology
Description: IC AUDIO PROCESSOR 144BGA
Packaging: Bulk
Package / Case: 144-BGA
Mounting Type: Surface Mount
Function: Audio Processor
Supplier Device Package: 144-BGA
Part Status: Active
Produkt ist nicht verfügbar
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SY100EL16VDWC filehandler.aspx?ddocname=en582597
Hersteller: Microchip Technology
Description: 5V/3.3V ENHANCED DIFFERENTIAL RE
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ADM00745 MCP19124-MCP19125-Data-Sheet-DS20005619B.pdf
ADM00745
Hersteller: Microchip Technology
Description: FLYBACK BATTERY CHARGER EVAL BD
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: MCP19125
Supplied Contents: Board(s)
Embedded: Yes
Part Status: Active
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Anzahl Preis
1+238.41 EUR
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ADM00810 MIC24046.pdf
ADM00810
Hersteller: Microchip Technology
Description: EVAL KIT
Produkt ist nicht verfügbar
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DM160230
DM160230
Hersteller: Microchip Technology
Description: PIC18 POE MAIN BOARD
Packaging: Bulk
Function: Power Over Ethernet (PoE)
Type: Power Management
Utilized IC / Part: PIC18F67J60
Supplied Contents: Board(s)
Embedded: Yes, MCU, 8-Bit
Part Status: Active
Contents: Board(s)
Produkt ist nicht verfügbar
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DM160236
DM160236
Hersteller: Microchip Technology
Description: POE PROGRAMMER ADAPTER
Produkt ist nicht verfügbar
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DV161001
DV161001
Hersteller: Microchip Technology
Description: PIC18 POE DEVELOPMENT KIT
Packaging: Bulk
Function: Power Over Ethernet (PoE)
Type: Power Management
Utilized IC / Part: PIC18F67J60
Supplied Contents: Board(s), Power Supply
Embedded: Yes, MCU, 8-Bit
Part Status: Active
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Anzahl Preis
1+522.30 EUR
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TPG100002-G3
TPG100002-G3
Hersteller: Microchip Technology
Description: ICSP PRODUCTION PROGRAMMER
Packaging: Bulk
For Use With/Related Products: PIC Micro® MCU
Type: Programmer (In-Circuit/In-System)
Contents: Board(s)
Part Status: Active
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ATSAMV70N19B-AABT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMV70N19B-AABT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Grade: Automotive
Number of I/O: 75
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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ATSAMV70N20B-AABT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMV70N20B-AABT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Grade: Automotive
Number of I/O: 75
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+17.59 EUR
Mindestbestellmenge: 1000
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ATSAMV71N19B-AABT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMV71N19B-AABT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 75
DigiKey Programmable: Not Verified
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ATSAMV71N20B-AABT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMV71N20B-AABT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Grade: Automotive
Number of I/O: 75
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+19.15 EUR
Mindestbestellmenge: 1000
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ATSAMV71N21B-AABT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMV71N21B-AABT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 75
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+23.52 EUR
Mindestbestellmenge: 1000
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ATSAMV71N21B-CBT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMV71N21B-CBT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 75
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MEC1428-TF-C1-TR 00002518a.pdf
MEC1428-TF-C1-TR
Hersteller: Microchip Technology
Description: SRAM
Produkt ist nicht verfügbar
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ATSAMV70Q20B-AABT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMV70Q20B-AABT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 114
DigiKey Programmable: Not Verified
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ATSAMV71Q19B-AABT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMV71Q19B-AABT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 114
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAMV71Q20B-AABT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMV71Q20B-AABT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 114
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAMV70Q20B-CBT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMV70Q20B-CBT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 144TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAMV71Q19B-CBT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMV71Q19B-CBT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLSH 144TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+21.01 EUR
Mindestbestellmenge: 1000
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MEC1428-SZ-C1-TR 00002518a.pdf
MEC1428-SZ-C1-TR
Hersteller: Microchip Technology
Description: SRAM
Packaging: Tape & Reel (TR)
Package / Case: 144-WFBGA
Mounting Type: Surface Mount
Interface: I²C, LPC, SMBus, SPI, UART
RAM Size: 192kB
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.71V ~ 3.465V
Program Memory Type: External Program Memory
Applications: Keyboard and Embedded Controller
Core Processor: MIPS32® M14K™
Supplier Device Package: 144-WFBGA (9x9)
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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