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PIC16F1764T-I/ST PIC16F1764T-I/ST Microchip Technology PIC16LF1764-5-8-9-Data-Sheet-40001775E.pdf Description: IC MCU 8BIT 7KB FLASH 14TSSOP
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (4K x 14)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 12
Part Status: Active
Supplier Device Package: 14-TSSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b; D/A 1x5b, 1x10b
Core Processor: PIC
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PIC16F1764-E/ST PIC16F1764-E/ST Microchip Technology PIC16LF1764-5-8-9-Data-Sheet-40001775E.pdf Description: IC MCU 8BIT 7KB FLASH 14TSSOP
RAM Size: 512 x 8
Program Memory Size: 7KB (4K x 14)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 12
Part Status: Active
Supplier Device Package: 14-TSSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b; D/A 1x5b, 1x10b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
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ATMEGA88PV-10AU ATMEGA88PV-10AU Microchip Technology ATmega48P_88P_168P-DS40002065A.pdf description Description: IC MCU 8BIT 8KB FLASH 32TQFP
Packaging: Tray
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 23
DigiKey Programmable: Verified
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RN52UDF-I/RM116 Microchip Technology Description: RF TXRX MODULE BT PCB TRACE SMD
Mounting Type: Surface Mount
Frequency: 2.4GHz
DigiKey Programmable: Not Verified
Part Status: Obsolete
Serial Interfaces: AIO, I²S, SPI, UART, USB
RF Family/Standard: Bluetooth
Modulation: DPSK, DQPSK, GFSK
Antenna Type: PCB Trace
Protocol: Bluetooth v3.0, Class 2
Data Rate: 3Mbps
Power - Output: 4dBm
Operating Temperature: -40°C ~ 85°C
Memory Size: 16MB Flash
Sensitivity: -85dBm
Package / Case: 50-SMD Module
Packaging: Bulk
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RN52CVC-I/RM116 Microchip Technology Description: RF TXRX MODULE BT PCB TRACE SMD
Package / Case: 50-SMD Module
Packaging: Bulk
DigiKey Programmable: Not Verified
Part Status: Obsolete
Serial Interfaces: AIO, I²S, SPI, UART, USB
RF Family/Standard: Bluetooth
Modulation: DPSK, DQPSK, GFSK
Antenna Type: PCB Trace
Protocol: Bluetooth v3.0, Class 2
Data Rate: 3Mbps
Power - Output: 4dBm
Operating Temperature: -40°C ~ 85°C
Memory Size: 16MB Flash
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -85dBm
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SPNY801172 Microchip Technology Description: IC EHTERNET SWITCH SMD
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
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SPNY801169 Microchip Technology Description: IC EHTERNET SWITCH SMD
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
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DSC1001CI5-024.0000T DSC1001CI5-024.0000T Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.3mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 24 MHz
Base Resonator: MEMS
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DSC1001CI5-024.0000T DSC1001CI5-024.0000T Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Cut Tape (CT)
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.3mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 24 MHz
Base Resonator: MEMS
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DSC1004DI2-072.0000T DSC1004DI2-072.0000T Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 72.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 72 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 10.5mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-SMD, No Lead
Packaging: Tape & Reel (TR)
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DSC1004DI2-072.0000T DSC1004DI2-072.0000T Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 72.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 72 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 10.5mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-SMD, No Lead
Packaging: Cut Tape (CT)
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DSC1001BE5-016.0000T DSC1001BE5-016.0000T Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-SMD, No Lead
Packaging: Tape & Reel (TR)
Base Resonator: MEMS
Frequency: 16 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 6.5mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±10ppm
Operating Temperature: -20°C ~ 70°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
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DSC1001BE5-016.0000T DSC1001BE5-016.0000T Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 16 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 6.5mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±10ppm
Operating Temperature: -20°C ~ 70°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-SMD, No Lead
Packaging: Cut Tape (CT)
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DSC1001CI2-100.0000T DSC1001CI2-100.0000T Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 100.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 100 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 8.7mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Tape & Reel (TR)
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DSC1001CI2-100.0000T DSC1001CI2-100.0000T Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 100.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 100 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 8.7mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Cut Tape (CT)
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DSC1001CI2-133.0000T DSC1001CI2-133.0000T Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 133.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 133 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 16.6mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-SMD, No Lead
Packaging: Tape & Reel (TR)
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DSC1001CI2-133.0000T DSC1001CI2-133.0000T Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 133.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 133 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 16.6mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-SMD, No Lead
Packaging: Cut Tape (CT)
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DSC1000DL5-PROGT DSC1000DL5-PROGT Microchip Technology DSC1000_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Programmable Type: Blank (User Must Program)
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSC1000DL5-PROGT DSC1000DL5-PROGT Microchip Technology DSC1000_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Programmable Type: Blank (User Must Program)
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VDFN
Packaging: Cut Tape (CT)
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DSC1000BL3-PROGT DSC1000BL3-PROGT Microchip Technology DSC1000_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Programmable Type: Blank (User Must Program)
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Tape & Reel (TR)
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DSC1000BL3-PROGT DSC1000BL3-PROGT Microchip Technology DSC1000_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Programmable Type: Blank (User Must Program)
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Cut Tape (CT)
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25+2.49 EUR
100+2.31 EUR
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DSC1000CL3-PROGT DSC1000CL3-PROGT Microchip Technology DSC1000_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Programmable Type: Blank (User Must Program)
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Tape & Reel (TR)
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DSC1000CL3-PROGT DSC1000CL3-PROGT Microchip Technology DSC1000_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Programmable Type: Blank (User Must Program)
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Cut Tape (CT)
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DSC1000CL5-PROGT DSC1000CL5-PROGT Microchip Technology DSC1000_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Programmable Type: Blank (User Must Program)
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Tape & Reel (TR)
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DSC1000CL5-PROGT DSC1000CL5-PROGT Microchip Technology DSC1000_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Programmable Type: Blank (User Must Program)
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Cut Tape (CT)
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VX-705-1013-122M880000 Microchip Technology 1243720-vx-705 Description: CUSTOM LOW NOISE CERAMIC VCXO
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Type: VCXO
Height - Seated (Max): 0.082" (2.09mm)
Part Status: Obsolete
Frequency: 122.88 MHz
Base Resonator: Crystal
Produkt ist nicht verfügbar
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MO-9250AE-D3E-HE500M000000 Microchip Technology MO-9250A.pdf Description: MEMS BASED XO +2.5 VDC +/-5% LVD
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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DSPIC33EP64MC503-I/M5 DSPIC33EP64MC503-I/M5 Microchip Technology dsPIC33EPXXXGP50X-dsPIC33EPXXXMC20X-50X-and-PIC24EPXXXGP-MC20X-Family-Data-Sheet-DS70000657J.pdf Description: IC MCU 16BIT 64KB FLASH 36VTLA
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I²C, IrDA, LINbus, QEI, SPI, UART/USART
DigiKey Programmable: Not Verified
Number of I/O: 25
Part Status: Active
Supplier Device Package: 36-VTLA (5x5)
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 8x10b, 8x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 16
Program Memory Size: 64KB (22K x 24)
Speed: 70 MIPs
Mounting Type: Surface Mount
Package / Case: 36-VFTLA Exposed Pad
Packaging: Tube
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DSPIC33EP64MC203-I/M5 DSPIC33EP64MC203-I/M5 Microchip Technology dsPIC33EPXXXGP50X-dsPIC33EPXXXMC20X-50X-and-PIC24EPXXXGP-MC20X-Family-Data-Sheet-DS70000657J.pdf Description: IC MCU 16BIT 64KB FLASH 36VTLA
DigiKey Programmable: Not Verified
Number of I/O: 25
Part Status: Active
Supplier Device Package: 36-VTLA (5x5)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: I²C, IrDA, LINbus, QEI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 8x10b, 8x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 16
Program Memory Size: 64KB (22K x 24)
Speed: 70 MIPs
Mounting Type: Surface Mount
Package / Case: 36-VFTLA Exposed Pad
Packaging: Tube
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DSPIC33EP64MC503-E/M5 DSPIC33EP64MC503-E/M5 Microchip Technology dsPIC33EPXXXGP50X-dsPIC33EPXXXMC20X-50X-and-PIC24EPXXXGP-MC20X-Family-Data-Sheet-DS70000657J.pdf Description: IC MCU 16BIT 64KB FLASH 36VTLA
Speed: 60 MIPs
Mounting Type: Surface Mount
Package / Case: 36-VFTLA Exposed Pad
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 25
Part Status: Active
Supplier Device Package: 36-VTLA (5x5)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I²C, IrDA, LINbus, QEI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 8x10b, 8x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 16
Program Memory Size: 64KB (22K x 24)
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DSC6041MI3B-039.3216 DSC6041MI3B-039.3216 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 39.3216MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Part Status: Active
Frequency: 39.3216 MHz
Base Resonator: MEMS
Supplier Device Package: 4-VFLGA (2x1.6)
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AT45D041A-JI AT45D041A-JI Microchip Technology AT45D041A.pdf Description: IC FLASH 4MBIT SPI 15MHZ 32PLCC
DigiKey Programmable: Not Verified
Memory Organization: 264 Bytes x 2048 pages
Memory Interface: SPI
Write Cycle Time - Word, Page: 14ms
Part Status: Obsolete
Supplier Device Package: 32-PLCC (13.97x11.43)
Memory Format: FLASH
Clock Frequency: 15 MHz
Technology: FLASH
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TC)
Memory Type: Non-Volatile
Memory Size: 4Mbit
Mounting Type: Surface Mount
Package / Case: 32-LCC (J-Lead)
Packaging: Tube
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AT45D041A-JC AT45D041A-JC Microchip Technology AT45D041A.pdf Description: IC FLASH 4MBIT SPI 15MHZ 32PLCC
DigiKey Programmable: Not Verified
Memory Organization: 264 Bytes x 2048 pages
Memory Interface: SPI
Write Cycle Time - Word, Page: 14ms
Part Status: Obsolete
Supplier Device Package: 32-PLCC (13.97x11.43)
Memory Format: FLASH
Clock Frequency: 15 MHz
Technology: FLASH
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TC)
Memory Type: Non-Volatile
Memory Size: 4Mbit
Mounting Type: Surface Mount
Package / Case: 32-LCC (J-Lead)
Packaging: Tube
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AT45D041A-RC AT45D041A-RC Microchip Technology AT45D041A.pdf Description: IC FLASH 4MBIT SPI 15MHZ 28SOIC
DigiKey Programmable: Not Verified
Memory Organization: 264 Bytes x 2048 pages
Memory Interface: SPI
Write Cycle Time - Word, Page: 14ms
Part Status: Obsolete
Supplier Device Package: 28-SOIC
Memory Format: FLASH
Clock Frequency: 15 MHz
Technology: FLASH
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TC)
Memory Type: Non-Volatile
Memory Size: 4Mbit
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Tube
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AT45D041A-TI AT45D041A-TI Microchip Technology AT45D041A.pdf Description: IC FLASH 4MBIT SPI 15MHZ 28TSOP
DigiKey Programmable: Not Verified
Memory Organization: 264 Bytes x 2048 pages
Memory Interface: SPI
Technology: FLASH
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TC)
Memory Type: Non-Volatile
Memory Size: 4Mbit
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.465", 11.80mm Width)
Write Cycle Time - Word, Page: 14ms
Part Status: Obsolete
Supplier Device Package: 28-TSOP
Memory Format: FLASH
Clock Frequency: 15 MHz
Packaging: Tray
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AT45D041A-RI AT45D041A-RI Microchip Technology AT45D041A.pdf Description: IC FLASH 4MBIT SPI 15MHZ 28SOIC
DigiKey Programmable: Not Verified
Memory Organization: 264 Bytes x 2048 pages
Memory Interface: SPI
Write Cycle Time - Word, Page: 14ms
Part Status: Obsolete
Supplier Device Package: 28-SOIC
Memory Format: FLASH
Clock Frequency: 15 MHz
Technology: FLASH
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TC)
Memory Type: Non-Volatile
Memory Size: 4Mbit
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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AT45D041A-TC AT45D041A-TC Microchip Technology AT45D041A.pdf Description: IC FLASH 4MBIT SPI 15MHZ 28TSOP
Packaging: Tray
DigiKey Programmable: Not Verified
Memory Organization: 264 Bytes x 2048 pages
Memory Interface: SPI
Write Cycle Time - Word, Page: 14ms
Part Status: Obsolete
Supplier Device Package: 28-TSOP
Memory Format: FLASH
Clock Frequency: 15 MHz
Technology: FLASH
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TC)
Memory Type: Non-Volatile
Memory Size: 4Mbit
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.465", 11.80mm Width)
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ATMEGA64L-8AUA4 ATMEGA64L-8AUA4 Microchip Technology Description: IC MCU 8BIT 64KB FLASH 64TQFP
Packaging: Bulk
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: AVR
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (14x14)
Part Status: Obsolete
Number of I/O: 53
Produkt ist nicht verfügbar
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MSMCJLCE54Ae3 MSMCJLCE54Ae3 Microchip Technology 10562-msmclce-datasheet Description: TVS DIODE 54VWM 87.1VC DO214AB
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 87.1V
Voltage - Breakdown (Min): 60V
Unidirectional Channels: 1
Supplier Device Package: DO-214AB (SMCJ)
Voltage - Reverse Standoff (Typ): 54V
Current - Peak Pulse (10/1000µs): 17.2A
Capacitance @ Frequency: 100pF @ 1MHz
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AB, SMC
Packaging: Bulk
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ATTINY24-20SSUR ATTINY24-20SSUR Microchip Technology doc8006.pdf Description: IC MCU 8BIT 2KB FLASH 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Verified
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ATTINY24-20SSUR ATTINY24-20SSUR Microchip Technology doc8006.pdf Description: IC MCU 8BIT 2KB FLASH 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Verified
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AT45DB1282-TI AT45DB1282-TI Microchip Technology AT45DB1282.pdf Description: IC FLASH 128MBIT SPI 40TSOP
Packaging: Tray
Package / Case: 40-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 40 MHz
Memory Format: FLASH
Supplier Device Package: 40-TSOP
Part Status: Obsolete
Write Cycle Time - Word, Page: 50ms
Memory Interface: SPI
Memory Organization: 1056 Bytes x 16,384 pages
DigiKey Programmable: Not Verified
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ATMEGA8U2-MU ATMEGA8U2-MU Microchip Technology 7799S.pdf description Description: IC MCU 8BIT 8KB FLASH 32VQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Verified
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MSCSM120VR1M16CTPAG Microchip Technology MSCSM120VR1M16CTPAG-SiC-MOSFET-module-DS00004704.pdf Description: SIC 6N-CH 1200V 171A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 6 N-Channel (Phase Leg)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 728W (Tc)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 171A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 6040pF @ 1000V
Rds On (Max) @ Id, Vgs: 16mOhm @ 80A, 20V
Gate Charge (Qg) (Max) @ Vgs: 464nC @ 20V
Vgs(th) (Max) @ Id: 2.8V @ 6mA
Part Status: Active
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MIC5209YU MIC5209YU Microchip Technology MIC5209-500mA-Low-Noise-LDO-Regulator-DS20005720B.pdf Description: IC REG LIN POS ADJ 500MA TO263-5
Packaging: Tube
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 170 µA
Voltage - Input (Max): 16V
Number of Regulators: 1
Supplier Device Package: TO-263-5
Voltage - Output (Max): 2.5V, 15V
Voltage - Output (Min/Fixed): 1.8V, 2.5V
Control Features: Enable
Part Status: Active
PSRR: 75dB (120Hz)
Voltage Dropout (Max): 0.6V @ 500mA
Protection Features: Over Current, Over Temperature, Reverse Polarity
Current - Supply (Max): 25 mA
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ATTINY13A-SSH ATTINY13A-SSH Microchip Technology ATtiny13A-Data-Sheet-DS40002307A.pdf Description: IC MCU 8BIT 1KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 1KB (512 x 16)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64 x 8
Core Processor: AVR
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Number of I/O: 6
DigiKey Programmable: Verified
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DSC1001CI5-008.1920 DSC1001CI5-008.1920 Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 8.1920MHZ CMOS SMD
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-SMD, No Lead
Packaging: Tube
Base Resonator: MEMS
Frequency: 8.192 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 6.5mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
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ATMEGA164PA-AU ATMEGA164PA-AU Microchip Technology ATmega164A_PA-324A_PA-644A_PA-1284_P_Data-Sheet-40002070B.pdf description Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Verified
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ATSAM4N16CA-CFU ATSAM4N16CA-CFU Microchip Technology Atmel-11158-32-bit%20Cortex-M4-Microcontroller-SAM4N16-SAM4N8_Datasheet.pdf Description: IC MCU 32BIT 1MB FLASH 100VFBGA
Program Memory Type: FLASH
DigiKey Programmable: Not Verified
Number of I/O: 79
Part Status: Active
Supplier Device Package: 100-VFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 17x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tray
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ATSAM4N16CA-CFU ATSAM4N16CA-CFU Microchip Technology Atmel-11158-32-bit%20Cortex-M4-Microcontroller-SAM4N16-SAM4N8_Datasheet.pdf Description: IC MCU 32BIT 1MB FLASH 100VFBGA
Program Memory Size: 1MB (1M x 8)
DigiKey Programmable: Not Verified
Number of I/O: 79
Part Status: Active
Supplier Device Package: 100-VFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 17x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tray
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ATSAM4S16CA-CFU ATSAM4S16CA-CFU Microchip Technology Atmel-11100-32-bit%20Cortex-M4-Microcontroller-SAM4S_Datasheet.pdf Description: IC MCU 32BIT 1MB FLASH 100VFBGA
Packaging: Tray
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, Memory Card, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-VFBGA (7x7)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
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AT89C5131A-PUTUM AT89C5131A-PUTUM Microchip Technology doc4337.pdf Description: IC MCU 8BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: LED, POR, PWM, WDT
Supplier Device Package: 32-QFN (7x7)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
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1N4736UR-1/TR 1N4736UR-1/TR Microchip Technology 1N4728UR-1N4764AUR.pdf Description: DIODE ZENER 6.8V 1W DO213AB
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Part Status: Active
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 3.5 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±10%
Packaging: Tape & Reel (TR)
Current - Reverse Leakage @ Vr: 10 µA @ 4 V
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1N4736UR-1/TR 1N4736UR-1/TR Microchip Technology 1N4728UR-1N4764AUR.pdf Description: DIODE ZENER 6.8V 1W DO213AB
Current - Reverse Leakage @ Vr: 10 µA @ 4 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Part Status: Active
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 3.5 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±10%
Packaging: Cut Tape (CT)
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1N4736UR/TR 1N4736UR/TR Microchip Technology 1N4728UR-1N4764AUR.pdf Description: DIODE ZENER 6.8V 1W DO213AB
Packaging: Tape & Reel (TR)
Current - Reverse Leakage @ Vr: 10 µA @ 4 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Part Status: Active
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 3.5 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±10%
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1N4736UR/TR 1N4736UR/TR Microchip Technology 1N4728UR-1N4764AUR.pdf Description: DIODE ZENER 6.8V 1W DO213AB
Current - Reverse Leakage @ Vr: 10 µA @ 4 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Part Status: Active
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 3.5 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±10%
Packaging: Cut Tape (CT)
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1N3661 Microchip Technology S%2CR35PF.pdf Description: DIODE STANDARD 200V 35A DO21
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 35 A
Voltage - DC Reverse (Vr) (Max): 200 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 175°C
Supplier Device Package: DO-21
Current - Average Rectified (Io): 35A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Press Fit
Package / Case: DO-208AA
Packaging: Bulk
Produkt ist nicht verfügbar
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1N3661R Microchip Technology S%2CR35PF.pdf Description: DIODE STANDARD REV 200V 35A DO21
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 35 A
Voltage - DC Reverse (Vr) (Max): 200 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 175°C
Supplier Device Package: DO-21
Current - Average Rectified (Io): 35A
Technology: Standard, Reverse Polarity
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Press Fit
Package / Case: DO-208AA
Packaging: Bulk
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1N248 Microchip Technology S%2CR304.pdf Description: DIODE GEN PURP 50V 40A DO5
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
Voltage - Forward (Vf) (Max) @ If: 1.19 V @ 90 A
Voltage - DC Reverse (Vr) (Max): 50 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 200°C
Supplier Device Package: DO-5 (DO-203AB)
Current - Average Rectified (Io): 40A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-203AB, DO-5, Stud
Packaging: Bulk
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1N248A Microchip Technology S%2CR304.pdf Description: DIODE GEN PURP 50V 37A DO5
Mounting Type: Stud Mount
Package / Case: DO-203AB, DO-5, Stud
Packaging: Bulk
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
Voltage - Forward (Vf) (Max) @ If: 1.19 V @ 90 A
Voltage - DC Reverse (Vr) (Max): 50 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 200°C
Supplier Device Package: DO-5 (DO-203AB)
Current - Average Rectified (Io): 37A
Technology: Standard
Reverse Recovery Time (trr): 5 µs
Speed: Standard Recovery >500ns, > 200mA (Io)
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PIC16F1764T-I/ST PIC16LF1764-5-8-9-Data-Sheet-40001775E.pdf
PIC16F1764T-I/ST
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 14TSSOP
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (4K x 14)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 12
Part Status: Active
Supplier Device Package: 14-TSSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b; D/A 1x5b, 1x10b
Core Processor: PIC
Produkt ist nicht verfügbar
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PIC16F1764-E/ST PIC16LF1764-5-8-9-Data-Sheet-40001775E.pdf
PIC16F1764-E/ST
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 14TSSOP
RAM Size: 512 x 8
Program Memory Size: 7KB (4K x 14)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 12
Part Status: Active
Supplier Device Package: 14-TSSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b; D/A 1x5b, 1x10b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
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ATMEGA88PV-10AU description ATmega48P_88P_168P-DS40002065A.pdf
ATMEGA88PV-10AU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 32TQFP
Packaging: Tray
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 23
DigiKey Programmable: Verified
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RN52UDF-I/RM116
Hersteller: Microchip Technology
Description: RF TXRX MODULE BT PCB TRACE SMD
Mounting Type: Surface Mount
Frequency: 2.4GHz
DigiKey Programmable: Not Verified
Part Status: Obsolete
Serial Interfaces: AIO, I²S, SPI, UART, USB
RF Family/Standard: Bluetooth
Modulation: DPSK, DQPSK, GFSK
Antenna Type: PCB Trace
Protocol: Bluetooth v3.0, Class 2
Data Rate: 3Mbps
Power - Output: 4dBm
Operating Temperature: -40°C ~ 85°C
Memory Size: 16MB Flash
Sensitivity: -85dBm
Package / Case: 50-SMD Module
Packaging: Bulk
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RN52CVC-I/RM116
Hersteller: Microchip Technology
Description: RF TXRX MODULE BT PCB TRACE SMD
Package / Case: 50-SMD Module
Packaging: Bulk
DigiKey Programmable: Not Verified
Part Status: Obsolete
Serial Interfaces: AIO, I²S, SPI, UART, USB
RF Family/Standard: Bluetooth
Modulation: DPSK, DQPSK, GFSK
Antenna Type: PCB Trace
Protocol: Bluetooth v3.0, Class 2
Data Rate: 3Mbps
Power - Output: 4dBm
Operating Temperature: -40°C ~ 85°C
Memory Size: 16MB Flash
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -85dBm
Produkt ist nicht verfügbar
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SPNY801172
Hersteller: Microchip Technology
Description: IC EHTERNET SWITCH SMD
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPNY801169
Hersteller: Microchip Technology
Description: IC EHTERNET SWITCH SMD
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DSC1001CI5-024.0000T MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
DSC1001CI5-024.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.3mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 24 MHz
Base Resonator: MEMS
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DSC1001CI5-024.0000T MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
DSC1001CI5-024.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Cut Tape (CT)
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.3mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 24 MHz
Base Resonator: MEMS
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DSC1004DI2-072.0000T MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
DSC1004DI2-072.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 72.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 72 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 10.5mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-SMD, No Lead
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSC1004DI2-072.0000T MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
DSC1004DI2-072.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 72.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 72 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 10.5mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-SMD, No Lead
Packaging: Cut Tape (CT)
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DSC1001BE5-016.0000T MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
DSC1001BE5-016.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-SMD, No Lead
Packaging: Tape & Reel (TR)
Base Resonator: MEMS
Frequency: 16 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 6.5mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±10ppm
Operating Temperature: -20°C ~ 70°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Produkt ist nicht verfügbar
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DSC1001BE5-016.0000T MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
DSC1001BE5-016.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 16 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 6.5mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±10ppm
Operating Temperature: -20°C ~ 70°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-SMD, No Lead
Packaging: Cut Tape (CT)
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DSC1001CI2-100.0000T MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
DSC1001CI2-100.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 100.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 100 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 8.7mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSC1001CI2-100.0000T MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
DSC1001CI2-100.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 100.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 100 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 8.7mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Cut Tape (CT)
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DSC1001CI2-133.0000T MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
DSC1001CI2-133.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 133.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 133 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 16.6mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-SMD, No Lead
Packaging: Tape & Reel (TR)
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DSC1001CI2-133.0000T MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
DSC1001CI2-133.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 133.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 133 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 16.6mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-SMD, No Lead
Packaging: Cut Tape (CT)
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DSC1000DL5-PROGT DSC1000_Web.pdf
DSC1000DL5-PROGT
Hersteller: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Programmable Type: Blank (User Must Program)
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSC1000DL5-PROGT DSC1000_Web.pdf
DSC1000DL5-PROGT
Hersteller: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Programmable Type: Blank (User Must Program)
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VDFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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DSC1000BL3-PROGT DSC1000_Web.pdf
DSC1000BL3-PROGT
Hersteller: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Programmable Type: Blank (User Must Program)
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Tape & Reel (TR)
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DSC1000BL3-PROGT DSC1000_Web.pdf
DSC1000BL3-PROGT
Hersteller: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Programmable Type: Blank (User Must Program)
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Cut Tape (CT)
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7+3 EUR
25+2.49 EUR
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DSC1000CL3-PROGT DSC1000_Web.pdf
DSC1000CL3-PROGT
Hersteller: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Programmable Type: Blank (User Must Program)
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSC1000CL3-PROGT DSC1000_Web.pdf
DSC1000CL3-PROGT
Hersteller: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Programmable Type: Blank (User Must Program)
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Cut Tape (CT)
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8+2.7 EUR
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DSC1000CL5-PROGT DSC1000_Web.pdf
DSC1000CL5-PROGT
Hersteller: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Programmable Type: Blank (User Must Program)
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Tape & Reel (TR)
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1000+3.76 EUR
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DSC1000CL5-PROGT DSC1000_Web.pdf
DSC1000CL5-PROGT
Hersteller: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Programmable Type: Blank (User Must Program)
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Cut Tape (CT)
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5+4.66 EUR
25+3.9 EUR
100+3.76 EUR
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VX-705-1013-122M880000 1243720-vx-705
Hersteller: Microchip Technology
Description: CUSTOM LOW NOISE CERAMIC VCXO
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Type: VCXO
Height - Seated (Max): 0.082" (2.09mm)
Part Status: Obsolete
Frequency: 122.88 MHz
Base Resonator: Crystal
Produkt ist nicht verfügbar
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MO-9250AE-D3E-HE500M000000 MO-9250A.pdf
Hersteller: Microchip Technology
Description: MEMS BASED XO +2.5 VDC +/-5% LVD
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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DSPIC33EP64MC503-I/M5 dsPIC33EPXXXGP50X-dsPIC33EPXXXMC20X-50X-and-PIC24EPXXXGP-MC20X-Family-Data-Sheet-DS70000657J.pdf
DSPIC33EP64MC503-I/M5
Hersteller: Microchip Technology
Description: IC MCU 16BIT 64KB FLASH 36VTLA
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I²C, IrDA, LINbus, QEI, SPI, UART/USART
DigiKey Programmable: Not Verified
Number of I/O: 25
Part Status: Active
Supplier Device Package: 36-VTLA (5x5)
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 8x10b, 8x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 16
Program Memory Size: 64KB (22K x 24)
Speed: 70 MIPs
Mounting Type: Surface Mount
Package / Case: 36-VFTLA Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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DSPIC33EP64MC203-I/M5 dsPIC33EPXXXGP50X-dsPIC33EPXXXMC20X-50X-and-PIC24EPXXXGP-MC20X-Family-Data-Sheet-DS70000657J.pdf
DSPIC33EP64MC203-I/M5
Hersteller: Microchip Technology
Description: IC MCU 16BIT 64KB FLASH 36VTLA
DigiKey Programmable: Not Verified
Number of I/O: 25
Part Status: Active
Supplier Device Package: 36-VTLA (5x5)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: I²C, IrDA, LINbus, QEI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 8x10b, 8x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 16
Program Memory Size: 64KB (22K x 24)
Speed: 70 MIPs
Mounting Type: Surface Mount
Package / Case: 36-VFTLA Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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DSPIC33EP64MC503-E/M5 dsPIC33EPXXXGP50X-dsPIC33EPXXXMC20X-50X-and-PIC24EPXXXGP-MC20X-Family-Data-Sheet-DS70000657J.pdf
DSPIC33EP64MC503-E/M5
Hersteller: Microchip Technology
Description: IC MCU 16BIT 64KB FLASH 36VTLA
Speed: 60 MIPs
Mounting Type: Surface Mount
Package / Case: 36-VFTLA Exposed Pad
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 25
Part Status: Active
Supplier Device Package: 36-VTLA (5x5)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I²C, IrDA, LINbus, QEI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 8x10b, 8x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 16
Program Memory Size: 64KB (22K x 24)
Produkt ist nicht verfügbar
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DSC6041MI3B-039.3216 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6041MI3B-039.3216
Hersteller: Microchip Technology
Description: MEMS OSC XO 39.3216MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Part Status: Active
Frequency: 39.3216 MHz
Base Resonator: MEMS
Supplier Device Package: 4-VFLGA (2x1.6)
Produkt ist nicht verfügbar
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AT45D041A-JI AT45D041A.pdf
AT45D041A-JI
Hersteller: Microchip Technology
Description: IC FLASH 4MBIT SPI 15MHZ 32PLCC
DigiKey Programmable: Not Verified
Memory Organization: 264 Bytes x 2048 pages
Memory Interface: SPI
Write Cycle Time - Word, Page: 14ms
Part Status: Obsolete
Supplier Device Package: 32-PLCC (13.97x11.43)
Memory Format: FLASH
Clock Frequency: 15 MHz
Technology: FLASH
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TC)
Memory Type: Non-Volatile
Memory Size: 4Mbit
Mounting Type: Surface Mount
Package / Case: 32-LCC (J-Lead)
Packaging: Tube
Produkt ist nicht verfügbar
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AT45D041A-JC AT45D041A.pdf
AT45D041A-JC
Hersteller: Microchip Technology
Description: IC FLASH 4MBIT SPI 15MHZ 32PLCC
DigiKey Programmable: Not Verified
Memory Organization: 264 Bytes x 2048 pages
Memory Interface: SPI
Write Cycle Time - Word, Page: 14ms
Part Status: Obsolete
Supplier Device Package: 32-PLCC (13.97x11.43)
Memory Format: FLASH
Clock Frequency: 15 MHz
Technology: FLASH
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TC)
Memory Type: Non-Volatile
Memory Size: 4Mbit
Mounting Type: Surface Mount
Package / Case: 32-LCC (J-Lead)
Packaging: Tube
Produkt ist nicht verfügbar
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AT45D041A-RC AT45D041A.pdf
AT45D041A-RC
Hersteller: Microchip Technology
Description: IC FLASH 4MBIT SPI 15MHZ 28SOIC
DigiKey Programmable: Not Verified
Memory Organization: 264 Bytes x 2048 pages
Memory Interface: SPI
Write Cycle Time - Word, Page: 14ms
Part Status: Obsolete
Supplier Device Package: 28-SOIC
Memory Format: FLASH
Clock Frequency: 15 MHz
Technology: FLASH
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TC)
Memory Type: Non-Volatile
Memory Size: 4Mbit
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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AT45D041A-TI AT45D041A.pdf
AT45D041A-TI
Hersteller: Microchip Technology
Description: IC FLASH 4MBIT SPI 15MHZ 28TSOP
DigiKey Programmable: Not Verified
Memory Organization: 264 Bytes x 2048 pages
Memory Interface: SPI
Technology: FLASH
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TC)
Memory Type: Non-Volatile
Memory Size: 4Mbit
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.465", 11.80mm Width)
Write Cycle Time - Word, Page: 14ms
Part Status: Obsolete
Supplier Device Package: 28-TSOP
Memory Format: FLASH
Clock Frequency: 15 MHz
Packaging: Tray
Produkt ist nicht verfügbar
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AT45D041A-RI AT45D041A.pdf
AT45D041A-RI
Hersteller: Microchip Technology
Description: IC FLASH 4MBIT SPI 15MHZ 28SOIC
DigiKey Programmable: Not Verified
Memory Organization: 264 Bytes x 2048 pages
Memory Interface: SPI
Write Cycle Time - Word, Page: 14ms
Part Status: Obsolete
Supplier Device Package: 28-SOIC
Memory Format: FLASH
Clock Frequency: 15 MHz
Technology: FLASH
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TC)
Memory Type: Non-Volatile
Memory Size: 4Mbit
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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AT45D041A-TC AT45D041A.pdf
AT45D041A-TC
Hersteller: Microchip Technology
Description: IC FLASH 4MBIT SPI 15MHZ 28TSOP
Packaging: Tray
DigiKey Programmable: Not Verified
Memory Organization: 264 Bytes x 2048 pages
Memory Interface: SPI
Write Cycle Time - Word, Page: 14ms
Part Status: Obsolete
Supplier Device Package: 28-TSOP
Memory Format: FLASH
Clock Frequency: 15 MHz
Technology: FLASH
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TC)
Memory Type: Non-Volatile
Memory Size: 4Mbit
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.465", 11.80mm Width)
Produkt ist nicht verfügbar
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ATMEGA64L-8AUA4
ATMEGA64L-8AUA4
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 64TQFP
Packaging: Bulk
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: AVR
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (14x14)
Part Status: Obsolete
Number of I/O: 53
Produkt ist nicht verfügbar
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MSMCJLCE54Ae3 10562-msmclce-datasheet
MSMCJLCE54Ae3
Hersteller: Microchip Technology
Description: TVS DIODE 54VWM 87.1VC DO214AB
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 87.1V
Voltage - Breakdown (Min): 60V
Unidirectional Channels: 1
Supplier Device Package: DO-214AB (SMCJ)
Voltage - Reverse Standoff (Typ): 54V
Current - Peak Pulse (10/1000µs): 17.2A
Capacitance @ Frequency: 100pF @ 1MHz
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AB, SMC
Packaging: Bulk
Produkt ist nicht verfügbar
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ATTINY24-20SSUR doc8006.pdf
ATTINY24-20SSUR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 2KB FLASH 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Verified
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ATTINY24-20SSUR doc8006.pdf
ATTINY24-20SSUR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 2KB FLASH 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Verified
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AT45DB1282-TI AT45DB1282.pdf
AT45DB1282-TI
Hersteller: Microchip Technology
Description: IC FLASH 128MBIT SPI 40TSOP
Packaging: Tray
Package / Case: 40-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 40 MHz
Memory Format: FLASH
Supplier Device Package: 40-TSOP
Part Status: Obsolete
Write Cycle Time - Word, Page: 50ms
Memory Interface: SPI
Memory Organization: 1056 Bytes x 16,384 pages
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATMEGA8U2-MU description 7799S.pdf
ATMEGA8U2-MU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 32VQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Verified
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MSCSM120VR1M16CTPAG MSCSM120VR1M16CTPAG-SiC-MOSFET-module-DS00004704.pdf
Hersteller: Microchip Technology
Description: SIC 6N-CH 1200V 171A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 6 N-Channel (Phase Leg)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 728W (Tc)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 171A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 6040pF @ 1000V
Rds On (Max) @ Id, Vgs: 16mOhm @ 80A, 20V
Gate Charge (Qg) (Max) @ Vgs: 464nC @ 20V
Vgs(th) (Max) @ Id: 2.8V @ 6mA
Part Status: Active
Produkt ist nicht verfügbar
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MIC5209YU MIC5209-500mA-Low-Noise-LDO-Regulator-DS20005720B.pdf
MIC5209YU
Hersteller: Microchip Technology
Description: IC REG LIN POS ADJ 500MA TO263-5
Packaging: Tube
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 170 µA
Voltage - Input (Max): 16V
Number of Regulators: 1
Supplier Device Package: TO-263-5
Voltage - Output (Max): 2.5V, 15V
Voltage - Output (Min/Fixed): 1.8V, 2.5V
Control Features: Enable
Part Status: Active
PSRR: 75dB (120Hz)
Voltage Dropout (Max): 0.6V @ 500mA
Protection Features: Over Current, Over Temperature, Reverse Polarity
Current - Supply (Max): 25 mA
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ATTINY13A-SSH ATtiny13A-Data-Sheet-DS40002307A.pdf
ATTINY13A-SSH
Hersteller: Microchip Technology
Description: IC MCU 8BIT 1KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 1KB (512 x 16)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64 x 8
Core Processor: AVR
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Number of I/O: 6
DigiKey Programmable: Verified
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DSC1001CI5-008.1920 MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
DSC1001CI5-008.1920
Hersteller: Microchip Technology
Description: MEMS OSC XO 8.1920MHZ CMOS SMD
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-SMD, No Lead
Packaging: Tube
Base Resonator: MEMS
Frequency: 8.192 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 6.5mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
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ATMEGA164PA-AU description ATmega164A_PA-324A_PA-644A_PA-1284_P_Data-Sheet-40002070B.pdf
ATMEGA164PA-AU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Verified
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ATSAM4N16CA-CFU Atmel-11158-32-bit%20Cortex-M4-Microcontroller-SAM4N16-SAM4N8_Datasheet.pdf
ATSAM4N16CA-CFU
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100VFBGA
Program Memory Type: FLASH
DigiKey Programmable: Not Verified
Number of I/O: 79
Part Status: Active
Supplier Device Package: 100-VFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 17x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tray
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ATSAM4N16CA-CFU Atmel-11158-32-bit%20Cortex-M4-Microcontroller-SAM4N16-SAM4N8_Datasheet.pdf
ATSAM4N16CA-CFU
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100VFBGA
Program Memory Size: 1MB (1M x 8)
DigiKey Programmable: Not Verified
Number of I/O: 79
Part Status: Active
Supplier Device Package: 100-VFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 17x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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ATSAM4S16CA-CFU Atmel-11100-32-bit%20Cortex-M4-Microcontroller-SAM4S_Datasheet.pdf
ATSAM4S16CA-CFU
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100VFBGA
Packaging: Tray
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, Memory Card, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-VFBGA (7x7)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
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AT89C5131A-PUTUM doc4337.pdf
AT89C5131A-PUTUM
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: LED, POR, PWM, WDT
Supplier Device Package: 32-QFN (7x7)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
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AnzahlPrivatkunde
2+13.89 EUR
25+12.72 EUR
100+11.53 EUR
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1N4736UR-1/TR 1N4728UR-1N4764AUR.pdf
1N4736UR-1/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 6.8V 1W DO213AB
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Part Status: Active
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 3.5 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±10%
Packaging: Tape & Reel (TR)
Current - Reverse Leakage @ Vr: 10 µA @ 4 V
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258+7.81 EUR
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1N4736UR-1/TR 1N4728UR-1N4764AUR.pdf
1N4736UR-1/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 6.8V 1W DO213AB
Current - Reverse Leakage @ Vr: 10 µA @ 4 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Part Status: Active
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 3.5 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±10%
Packaging: Cut Tape (CT)
auf Bestellung 258 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.2 EUR
Mindestbestellmenge: 3 Stücke
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1N4736UR/TR 1N4728UR-1N4764AUR.pdf
1N4736UR/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 6.8V 1W DO213AB
Packaging: Tape & Reel (TR)
Current - Reverse Leakage @ Vr: 10 µA @ 4 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Part Status: Active
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 3.5 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±10%
Produkt ist nicht verfügbar
Mindestbestellmenge: 258 Stücke
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1N4736UR/TR 1N4728UR-1N4764AUR.pdf
1N4736UR/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 6.8V 1W DO213AB
Current - Reverse Leakage @ Vr: 10 µA @ 4 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Part Status: Active
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 3.5 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±10%
Packaging: Cut Tape (CT)
auf Bestellung 255 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+7.08 EUR
Mindestbestellmenge: 3 Stücke
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1N3661 S%2CR35PF.pdf
Hersteller: Microchip Technology
Description: DIODE STANDARD 200V 35A DO21
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 35 A
Voltage - DC Reverse (Vr) (Max): 200 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 175°C
Supplier Device Package: DO-21
Current - Average Rectified (Io): 35A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Press Fit
Package / Case: DO-208AA
Packaging: Bulk
Produkt ist nicht verfügbar
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1N3661R S%2CR35PF.pdf
Hersteller: Microchip Technology
Description: DIODE STANDARD REV 200V 35A DO21
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 35 A
Voltage - DC Reverse (Vr) (Max): 200 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 175°C
Supplier Device Package: DO-21
Current - Average Rectified (Io): 35A
Technology: Standard, Reverse Polarity
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Press Fit
Package / Case: DO-208AA
Packaging: Bulk
Produkt ist nicht verfügbar
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1N248 S%2CR304.pdf
Hersteller: Microchip Technology
Description: DIODE GEN PURP 50V 40A DO5
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
Voltage - Forward (Vf) (Max) @ If: 1.19 V @ 90 A
Voltage - DC Reverse (Vr) (Max): 50 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 200°C
Supplier Device Package: DO-5 (DO-203AB)
Current - Average Rectified (Io): 40A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-203AB, DO-5, Stud
Packaging: Bulk
Produkt ist nicht verfügbar
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1N248A S%2CR304.pdf
Hersteller: Microchip Technology
Description: DIODE GEN PURP 50V 37A DO5
Mounting Type: Stud Mount
Package / Case: DO-203AB, DO-5, Stud
Packaging: Bulk
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
Voltage - Forward (Vf) (Max) @ If: 1.19 V @ 90 A
Voltage - DC Reverse (Vr) (Max): 50 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 200°C
Supplier Device Package: DO-5 (DO-203AB)
Current - Average Rectified (Io): 37A
Technology: Standard
Reverse Recovery Time (trr): 5 µs
Speed: Standard Recovery >500ns, > 200mA (Io)
Produkt ist nicht verfügbar
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