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A54SX32A-1FG256M A54SX32A-1FG256M Microchip Technology index.php?option=com_docman&task=doc_download&gid=130722 Description: IC FPGA 203 I/O 256FBGA
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A54SX32A-1FGG256M A54SX32A-1FGG256M Microchip Technology index.php?option=com_docman&task=doc_download&gid=130722 Description: IC FPGA 203 I/O 256FBGA
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A54SX32A-1TQG100M A54SX32A-1TQG100M Microchip Technology sxa_ds.pdf Description: IC FPGA 81 I/O 100TQFP
DigiKey Programmable: Not Verified
Number of I/O: 81
Number of LABs/CLBs: 2880
Supplier Device Package: 100-TQFP (14x14)
Voltage - Supply: 2.25V ~ 5.25V
Operating Temperature: -55°C ~ 125°C (TC)
Number of Gates: 48000
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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A54SX32A-1TQG144M A54SX32A-1TQG144M Microchip Technology sxa_ds.pdf Description: IC FPGA 113 I/O 144TQFP
DigiKey Programmable: Not Verified
Number of I/O: 113
Number of LABs/CLBs: 2880
Supplier Device Package: 144-TQFP (20x20)
Voltage - Supply: 2.25V ~ 5.25V
Operating Temperature: -55°C ~ 125°C (TC)
Number of Gates: 48000
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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APA300-FGG256M APA300-FGG256M Microchip Technology 131796-proasicplusgendes Description: IC FPGA 186 I/O 256FBGA
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APA300-PQG208M APA300-PQG208M Microchip Technology 131796-proasicplusgendes Description: IC FPGA 158 I/O 208QFP
Number of I/O: 158
Part Status: Active
Total RAM Bits: 73728
Supplier Device Package: 208-PQFP (28x28)
Voltage - Supply: 2.3V ~ 2.7V
Operating Temperature: -55°C ~ 125°C (TC)
Number of Gates: 300000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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A54SX32A-CQ208M A54SX32A-CQ208M Microchip Technology index.php?option=com_docman&task=doc_download&gid=130722 Description: IC FPGA 174 I/O 208CQFP
DigiKey Programmable: Not Verified
Number of I/O: 174
Number of LABs/CLBs: 2880
Supplier Device Package: 208-CQFP (75x75)
Voltage - Supply: 2.25V ~ 5.25V
Operating Temperature: -55°C ~ 125°C (TC)
Number of Gates: 48000
Mounting Type: Surface Mount
Package / Case: 208-BFCQFP with Tie Bar
Packaging: Tray
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APA600-CQ208M APA600-CQ208M Microchip Technology 131796-proasicplusgendes Description: IC FPGA 158 I/O 208CQFP
DigiKey Programmable: Not Verified
Number of I/O: 158
Total RAM Bits: 129024
Supplier Device Package: 208-CQFP (75x75)
Voltage - Supply: 2.3V ~ 2.7V
Operating Temperature: -55°C ~ 125°C (TC)
Number of Gates: 600000
Mounting Type: Surface Mount
Package / Case: 208-BFCQFP with Tie Bar
Packaging: Tray
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APA600-FG256M APA600-FG256M Microchip Technology 131796-proasicplusgendes Description: IC FPGA 186 I/O 256FBGA
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APA600-FGG256M APA600-FGG256M Microchip Technology 131796-proasicplusgendes Description: IC FPGA 186 I/O 256FBGA
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A2F500M3G-FGG256M A2F500M3G-FGG256M Microchip Technology 130720-military-grade-smartfusion-customizable-system-on-chip-csoc-datasheet Description: IC SOC CORTEX-M3 80MHZ 256FBGA
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A54SX32A-FGG256M A54SX32A-FGG256M Microchip Technology index.php?option=com_docman&task=doc_download&gid=130722 Description: IC FPGA 203 I/O 256FBGA
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A54SX16A-1PQ208M A54SX16A-1PQ208M Microchip Technology index.php?option=com_docman&task=doc_download&gid=130722 Description: IC FPGA 175 I/O 208QFP
Number of I/O: 175
Part Status: Obsolete
Number of LABs/CLBs: 1452
Supplier Device Package: 208-PQFP (28x28)
Voltage - Supply: 2.25V ~ 5.25V
Operating Temperature: -55°C ~ 125°C (TC)
Number of Gates: 24000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
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APA1000-BG456M APA1000-BG456M Microchip Technology 131796-proasicplusgendes Description: IC FPGA 356 I/O 456BGA
DigiKey Programmable: Not Verified
Number of I/O: 356
Total RAM Bits: 202752
Supplier Device Package: 456-PBGA (35x35)
Voltage - Supply: 2.3V ~ 2.7V
Operating Temperature: -55°C ~ 125°C (TC)
Number of Gates: 1000000
Mounting Type: Surface Mount
Package / Case: 456-BBGA
Packaging: Tray
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APTGL60H120T3G Microchip Technology Description: IGBT MODULE 1200V 80A 280W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 80 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 280 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 2.77 nF @ 25 V
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APT30DF100HJ APT30DF100HJ Microchip Technology 6866-apt30df100hj-datasheet Description: BRIDGE RECT 1P 1KV 45A SOT227
Current - Reverse Leakage @ Vr: 100 µA @ 1000 V
Voltage - Forward (Vf) (Max) @ If: 3 V @ 30 A
Current - Average Rectified (Io): 45 A
Voltage - Peak Reverse (Max): 1 kV
Supplier Device Package: SOT-227
Technology: Standard
Operating Temperature: -55°C ~ 175°C (TJ)
Diode Type: Single Phase
Mounting Type: Chassis Mount
Package / Case: SOT-227-4, miniBLOC
Packaging: Bulk
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APT30DF20HJ APT30DF20HJ Microchip Technology 6868-apt30df20hj-datasheet Description: BRIDGE RECT 1P 200V 45A SOT227
Current - Reverse Leakage @ Vr: 250 µA @ 200 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Average Rectified (Io): 45 A
Voltage - Peak Reverse (Max): 200 V
Supplier Device Package: SOT-227
Technology: Standard
Operating Temperature: -55°C ~ 150°C (TJ)
Diode Type: Single Phase
Mounting Type: Chassis Mount
Package / Case: SOT-227-4, miniBLOC
Packaging: Bulk
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APT50DF170HJ APT50DF170HJ Microchip Technology Description: BRIDGE RECT 1P 1.7KV 50A SOT227
Packaging: Tube
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227 (ISOTOP®)
Part Status: Active
Voltage - Peak Reverse (Max): 1.7 kV
Current - Average Rectified (Io): 50 A
Voltage - Forward (Vf) (Max) @ If: 2.2 V @ 50 A
Current - Reverse Leakage @ Vr: 250 µA @ 1700 V
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APT40GL120JU3 APT40GL120JU3 Microchip Technology 7009-apt40gl120ju3-datasheet Description: IGBT MOD 1200V 65A 220W SOT227
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 220 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 65 A
IGBT Type: Trench Field Stop
Supplier Device Package: SOT-227
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
Operating Temperature: -55°C ~ 175°C (TJ)
Configuration: Single
Input: Standard
Mounting Type: Chassis, Stud Mount
Package / Case: SOT-227-4, miniBLOC
Packaging: Bulk
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APTGF150A60T3AG Microchip Technology APTGF150A60T3AG.pdf Description: IGBT MODULE 600V 230A 833W SP3
Input Capacitance (Cies) @ Vce: 9 nF @ 25 V
Current - Collector Cutoff (Max): 350 µA
Power - Max: 833 W
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector (Ic) (Max): 230 A
Part Status: Obsolete
IGBT Type: NPT
Supplier Device Package: SP3
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 200A
Configuration: Half Bridge
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP3
Packaging: Bulk
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APTGF50DH120T3G Microchip Technology APTGF50DH120T3G.pdf Description: IGBT MODULE 1200V 70A 312W SP3
Input Capacitance (Cies) @ Vce: 3.45 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 312 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Configuration: Asymmetrical Bridge
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP3
Packaging: Bulk
Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 50A
Current - Collector (Ic) (Max): 70 A
IGBT Type: NPT
Supplier Device Package: SP3
NTC Thermistor: Yes
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APTGF50DSK120T3G Microchip Technology APTGF50DSK120T3G.pdf Description: IGBT MODULE 1200V 70A 312W SP3
Power - Max: 312 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 70 A
IGBT Type: NPT
Package / Case: SP3
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 3.45 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Supplier Device Package: SP3
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 50A
Configuration: Dual Buck Chopper
Input: Standard
Mounting Type: Chassis Mount
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APTGL120TDU120TPG Microchip Technology 7624-aptgl120tdu120tpg-datasheet Description: IGBT MODULE 1200V 140A 517W SP6P
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Triple, Dual - Common Source
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 6.2 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 517 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 140 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: SP6-P
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 100A
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APTGL40H120T1G Microchip Technology Description: IGBT MODULE 1200V 65A 220W SP1
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 220 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 65 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: SP1
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Full Bridge
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP1
Packaging: Bulk
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APTGL40X120T3G Microchip Technology 7632-aptgl40x120t3g-datasheet Description: IGBT MODULE 1200V 65A 220W SP3
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP3
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 220 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 65 A
IGBT Type: Trench Field Stop
Supplier Device Package: SP3
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Three Phase Inverter
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APTGL90A120T1G Microchip Technology 7646-aptgl90a120t1g-datasheet Description: IGBT MODULE 1200V 110A 385W SP1
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 385 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 110 A
IGBT Type: Trench Field Stop
Supplier Device Package: SP1
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Half Bridge
Input: Standard
Mounting Type: Through Hole
Package / Case: SP1
Packaging: Bulk
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APTGL90DA120T1G Microchip Technology 7647-aptgl90da120t1g-datasheet Description: IGBT MODULE 1200V 110A 385W SP1
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 385 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 110 A
IGBT Type: Trench Field Stop
Supplier Device Package: SP1
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Single
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP1
Packaging: Bulk
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APT90DR160HJ APT90DR160HJ Microchip Technology 7310-apt90dr160hj-datasheet Description: BRIDGE RECT 1PHASE 1.6KV SOT-227
Voltage - Peak Reverse (Max): 1.6 kV
Supplier Device Package: SOT-227
Technology: Standard
Operating Temperature: -55°C ~ 150°C (TJ)
Diode Type: Single Phase
Mounting Type: Chassis Mount
Package / Case: SOT-227-4, miniBLOC
Packaging: Bulk
Current - Reverse Leakage @ Vr: 50 µA @ 1600 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 90 A
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APTGL90DDA120T3G Microchip Technology 7648-aptgl90dda120t3g-datasheet Description: IGBT MODULE 1200V 110A 385W SP3
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 385 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 110 A
IGBT Type: Trench Field Stop
Supplier Device Package: SP3
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Dual Boost Chopper
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP3
Packaging: Bulk
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APTGL90DSK120T3G Microchip Technology 7650-aptgl90dsk120t3g-datasheet Description: IGBT MODULE 1200V 110A 385W SP3
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 385 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 110 A
IGBT Type: Trench Field Stop
Supplier Device Package: SP3
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Dual Buck Chopper
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP3
Packaging: Bulk
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APTGL90H120T3G Microchip Technology 7651-aptgl90h120t3g-datasheet Description: IGBT MODULE 1200V 110A 385W SP3
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 385 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 110 A
IGBT Type: Trench Field Stop
Supplier Device Package: SP3
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Full Bridge
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP3
Packaging: Bulk
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APTGT200DA60T3AG APTGT200DA60T3AG Microchip Technology 7766-aptgt200da60t3ag-datasheet Description: IGBT MODULE 600V 290A 750W SP3
Input Capacitance (Cies) @ Vce: 12.3 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 750 W
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector (Ic) (Max): 290 A
IGBT Type: Trench Field Stop
Supplier Device Package: SP3
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 200A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Single
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP3
Packaging: Bulk
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APTGT200SK60T3AG Microchip Technology 7779-aptgt200sk60t3ag-datasheet Description: IGBT MODULE 600V 290A 750W SP3
Input Capacitance (Cies) @ Vce: 12.3 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 750 W
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector (Ic) (Max): 290 A
IGBT Type: Trench Field Stop
Supplier Device Package: SP3
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 200A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Single
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP3
Packaging: Bulk
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APTGT20TL601G Microchip Technology 7790-aptgt20tl601g-datasheet Description: IGBT MODULE 600V 32A 62W SP1
Input Capacitance (Cies) @ Vce: 1.1 pF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Current - Collector (Ic) (Max): 32 A
IGBT Type: Trench Field Stop
Supplier Device Package: SP1
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 20A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Three Level Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP1
Packaging: Bulk
Power - Max: 62 W
Voltage - Collector Emitter Breakdown (Max): 600 V
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APT60DF20HJ APT60DF20HJ Microchip Technology 7186-apt60df20hj-datasheet Description: BRIDGE RECT 1P 200V 90A SOT227
Current - Reverse Leakage @ Vr: 250 µA @ 200 V
Voltage - Forward (Vf) (Max) @ If: 1.15 V @ 60 A
Current - Average Rectified (Io): 90 A
Voltage - Peak Reverse (Max): 200 V
Supplier Device Package: SOT-227
Technology: Standard
Operating Temperature: -55°C ~ 150°C (TJ)
Diode Type: Single Phase
Mounting Type: Chassis Mount
Package / Case: SOT-227-4, miniBLOC
Packaging: Bulk
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APT75DF170HJ APT75DF170HJ Microchip Technology 7237-apt75df170hj-datasheet Description: BRIDGE RECT 1P 1.7KV 75A SOT227
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APT75DL120HJ APT75DL120HJ Microchip Technology 7238-apt75dl120hj-datasheet Description: BRIDGE RECT 1P 1.2KV 75A SOT227
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APT40GL120JU2 APT40GL120JU2 Microchip Technology 7008-apt40gl120ju2-datasheet Description: IGBT MOD 1200V 65A 220W SOT227
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 220 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
IGBT Type: Trench Field Stop
Supplier Device Package: SOT-227
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
Operating Temperature: -55°C ~ 175°C (TJ)
Configuration: Single
Input: Standard
Mounting Type: Chassis, Stud Mount
Package / Case: SOT-227-4, miniBLOC
Packaging: Bulk
Current - Collector (Ic) (Max): 65 A
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APT13F120S APT13F120S Microchip Technology 6621-apt13f120b-apt13f120s-datasheet Description: MOSFET N-CH 1200V 14A D3PAK
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APT14F100S APT14F100S Microchip Technology 6625-apt14f100bg-apt14f100sg-datasheet Description: MOSFET N-CH 1000V 14A D3PAK
Input Capacitance (Ciss) (Max) @ Vds: 3965 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 120 nC @ 10 V
Drain to Source Voltage (Vdss): 1000 V
Vgs (Max): ±30V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: D3Pak
Vgs(th) (Max) @ Id: 5V @ 1mA
Power Dissipation (Max): 500W (Tc)
Rds On (Max) @ Id, Vgs: 980mOhm @ 7A, 10V
Current - Continuous Drain (Id) @ 25°C: 14A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Packaging: Tube
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APT17F80S APT17F80S Microchip Technology APT17F80B_S_C.pdf Description: MOSFET N-CH 800V 18A D3PAK
Input Capacitance (Ciss) (Max) @ Vds: 3757 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 122 nC @ 10 V
Drain to Source Voltage (Vdss): 800 V
Vgs (Max): ±30V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: D3Pak
Vgs(th) (Max) @ Id: 5V @ 1mA
Power Dissipation (Max): 500W (Tc)
Rds On (Max) @ Id, Vgs: 580mOhm @ 9A, 10V
Current - Continuous Drain (Id) @ 25°C: 18A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Packaging: Tube
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APT37F50S APT37F50S Microchip Technology 6980-apt37f50b-apt37f50s-datasheet Description: MOSFET N-CH 500V 37A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 37A (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 18A, 10V
Power Dissipation (Max): 520W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 145 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5710 pF @ 25 V
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APT33N90JCU2 APT33N90JCU2 Microchip Technology Description: MOSFET N-CH 900V 33A SOT227
Packaging: Tray
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 33A (Tc)
Rds On (Max) @ Id, Vgs: 120mOhm @ 26A, 10V
Power Dissipation (Max): 290W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 3mA
Supplier Device Package: SOT-227
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 270 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6800 pF @ 100 V
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APT33N90JCU3 APT33N90JCU3 Microchip Technology Description: MOSFET N-CH 900V 33A SOT227
Packaging: Tray
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 33A (Tc)
Rds On (Max) @ Id, Vgs: 120mOhm @ 26A, 10V
Power Dissipation (Max): 290W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 3mA
Supplier Device Package: SOT-227
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 270 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6800 pF @ 100 V
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APTC60DDAM45T1G Microchip Technology 7333-aptc60ddam45t1g-datasheet Description: MOSFET 2N-CH 600V 49A SP1
Packaging: Tray
Package / Case: SP1
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Dual Buck Chopper)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 250W
Drain to Source Voltage (Vdss): 600V
Current - Continuous Drain (Id) @ 25°C: 49A
Input Capacitance (Ciss) (Max) @ Vds: 7200pF @ 25V
Rds On (Max) @ Id, Vgs: 45mOhm @ 24.5A, 10V
Gate Charge (Qg) (Max) @ Vgs: 150nC @ 10V
Vgs(th) (Max) @ Id: 3.9V @ 3mA
Supplier Device Package: SP1
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APTC60DSKM24T3G Microchip Technology Description: MOSFET 2N-CH 600V 95A SP3
Packaging: Tray
Package / Case: SP3
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Dual Buck Chopper)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 462W
Drain to Source Voltage (Vdss): 600V
Current - Continuous Drain (Id) @ 25°C: 95A
Input Capacitance (Ciss) (Max) @ Vds: 14400pF @ 25V
Rds On (Max) @ Id, Vgs: 24mOhm @ 47.5A, 10V
Gate Charge (Qg) (Max) @ Vgs: 300nC @ 10V
Vgs(th) (Max) @ Id: 3.9V @ 5mA
Supplier Device Package: SP3
Part Status: Active
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APTC60HM70BT3G Microchip Technology 123994-aptc60hm70bt3g-datasheet Description: MOSFET 4N-CH 600V 39A SP3
Packaging: Tray
Package / Case: SP3
Mounting Type: Chassis Mount
Configuration: 4 N-Channel (Full Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 250W
Drain to Source Voltage (Vdss): 600V
Current - Continuous Drain (Id) @ 25°C: 39A
Input Capacitance (Ciss) (Max) @ Vds: 700pF @ 25V
Rds On (Max) @ Id, Vgs: 70mOhm @ 39A, 10V
Gate Charge (Qg) (Max) @ Vgs: 259nC @ 10V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 3.9V @ 2.7mA
Supplier Device Package: SP3
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APT30DQ60BHBG APT30DQ60BHBG Microchip Technology APT30DQ60BHB%28G%29_A.pdf Description: DIODE ARRAY GP 600V 30A TO-247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 30A
Supplier Device Package: TO-247
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.4 V @ 30 A
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APT25GN120SG APT25GN120SG Microchip Technology 6785-apt25gn120bg-apt25gn120sg-datasheet Description: IGBT 1200V 67A 272W D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 25A
Supplier Device Package: D3Pak
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 22ns/280ns
Test Condition: 800V, 25A, 1Ohm, 15V
Gate Charge: 155 nC
Current - Collector (Ic) (Max): 67 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 75 A
Power - Max: 272 W
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APT200GT60JR APT200GT60JR Microchip Technology APT200GT60JR_D.pdf Description: IGBT MOD 600V 195A 500W SOT-227
Packaging: Tray
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: SOT-227
IGBT Type: NPT
Current - Collector (Ic) (Max): 195 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 500 W
Current - Collector Cutoff (Max): 25 µA
Input Capacitance (Cies) @ Vce: 8.65 nF @ 25 V
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APT17F100S APT17F100S Microchip Technology APT17F100B_S_D.pdf Description: MOSFET N-CH 1000V 17A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 17A (Tc)
Rds On (Max) @ Id, Vgs: 780mOhm @ 9A, 10V
Power Dissipation (Max): 625W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 150 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4845 pF @ 25 V
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APT42F50S APT42F50S Microchip Technology 7028-apt42f50b-apt42f50s-datasheet Description: MOSFET N-CH 500V 42A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 130mOhm @ 21A, 10V
Power Dissipation (Max): 625W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 170 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6810 pF @ 25 V
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APT30F50S APT30F50S Microchip Technology 6891-apt30f50b-apt30f50s-datasheet Description: MOSFET N-CH 500V 30A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 30A (Tc)
Rds On (Max) @ Id, Vgs: 190mOhm @ 14A, 10V
Power Dissipation (Max): 415W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 115 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4525 pF @ 25 V
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APTC60VDAM45T1G Microchip Technology 7362-aptc60vdam45t1g-datasheet Description: MOSFET 2N-CH 600V 49A SP1
Supplier Device Package: SP1
Vgs(th) (Max) @ Id: 3.9V @ 3mA
Gate Charge (Qg) (Max) @ Vgs: 150nC @ 10V
Rds On (Max) @ Id, Vgs: 45mOhm @ 24.5A, 10V
Input Capacitance (Ciss) (Max) @ Vds: 7200pF @ 25V
Current - Continuous Drain (Id) @ 25°C: 49A
Drain to Source Voltage (Vdss): 600V
Power - Max: 250W
Technology: MOSFET (Metal Oxide)
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: 2 N-Channel (Dual)
Mounting Type: Chassis Mount
Package / Case: SP1
Packaging: Tray
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24LC128T-I/SN 24LC128T-I/SN Microchip Technology 24LC128T-I Description: IC EEPROM 128KBIT I2C 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 128Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 16K x 8
DigiKey Programmable: Verified
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24LC32AT-I/SN 24LC32AT-I/SN Microchip Technology 24AA32A-24LC32A-32-Kbit-I2C-Serial-EEPROM-DS20001713.pdf Description: IC EEPROM 32KBIT I2C 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 32Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 4K x 8
DigiKey Programmable: Verified
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LAN8710A-EZC-TR LAN8710A-EZC-TR Microchip Technology 00002164B.pdf Description: IC TRANSCEIVER FULL 4/4 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.6V ~ 3.6V
Number of Drivers/Receivers: 4/4
Data Rate: 100Mbps
Protocol: MII, RMII
Supplier Device Package: 32-QFN (5x5)
Duplex: Full
Part Status: Active
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LAN8710A-EZK-TR LAN8710A-EZK-TR Microchip Technology 00002164B.pdf Description: IC TRANSCEIVER FULL 4/4 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.6V ~ 3.6V
Number of Drivers/Receivers: 4/4
Data Rate: 100Mbps
Protocol: MII, RMII
Supplier Device Package: 32-QFN (5x5)
Duplex: Full
Part Status: Active
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LAN8720A-CP-TR LAN8720A-CP-TR Microchip Technology LAN8720A-LAN8720Ai-Data-Sheet-DS00002165.pdf Description: IC TRANSCEIVER FULL 2/2 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.6V ~ 3.6V
Number of Drivers/Receivers: 2/2
Data Rate: 100Mbps
Protocol: MII, RMII
Supplier Device Package: 24-QFN (4x4)
Duplex: Full
Part Status: Active
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MCP23S17T-E/SS MCP23S17T-E/SS Microchip Technology MCP23017-Data-Sheet-DS20001952.pdf Description: IC XPNDR 10MHZ SPI 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 16
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 5.5V
Clock Frequency: 10 MHz
Interrupt Output: Yes
Supplier Device Package: 28-SSOP
Current - Output Source/Sink: 25mA
Part Status: Active
DigiKey Programmable: Not Verified
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A54SX32A-1FG256M index.php?option=com_docman&task=doc_download&gid=130722
A54SX32A-1FG256M
Hersteller: Microchip Technology
Description: IC FPGA 203 I/O 256FBGA
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A54SX32A-1FGG256M index.php?option=com_docman&task=doc_download&gid=130722
A54SX32A-1FGG256M
Hersteller: Microchip Technology
Description: IC FPGA 203 I/O 256FBGA
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A54SX32A-1TQG100M sxa_ds.pdf
A54SX32A-1TQG100M
Hersteller: Microchip Technology
Description: IC FPGA 81 I/O 100TQFP
DigiKey Programmable: Not Verified
Number of I/O: 81
Number of LABs/CLBs: 2880
Supplier Device Package: 100-TQFP (14x14)
Voltage - Supply: 2.25V ~ 5.25V
Operating Temperature: -55°C ~ 125°C (TC)
Number of Gates: 48000
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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A54SX32A-1TQG144M sxa_ds.pdf
A54SX32A-1TQG144M
Hersteller: Microchip Technology
Description: IC FPGA 113 I/O 144TQFP
DigiKey Programmable: Not Verified
Number of I/O: 113
Number of LABs/CLBs: 2880
Supplier Device Package: 144-TQFP (20x20)
Voltage - Supply: 2.25V ~ 5.25V
Operating Temperature: -55°C ~ 125°C (TC)
Number of Gates: 48000
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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APA300-FGG256M 131796-proasicplusgendes
APA300-FGG256M
Hersteller: Microchip Technology
Description: IC FPGA 186 I/O 256FBGA
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APA300-PQG208M 131796-proasicplusgendes
APA300-PQG208M
Hersteller: Microchip Technology
Description: IC FPGA 158 I/O 208QFP
Number of I/O: 158
Part Status: Active
Total RAM Bits: 73728
Supplier Device Package: 208-PQFP (28x28)
Voltage - Supply: 2.3V ~ 2.7V
Operating Temperature: -55°C ~ 125°C (TC)
Number of Gates: 300000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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A54SX32A-CQ208M index.php?option=com_docman&task=doc_download&gid=130722
A54SX32A-CQ208M
Hersteller: Microchip Technology
Description: IC FPGA 174 I/O 208CQFP
DigiKey Programmable: Not Verified
Number of I/O: 174
Number of LABs/CLBs: 2880
Supplier Device Package: 208-CQFP (75x75)
Voltage - Supply: 2.25V ~ 5.25V
Operating Temperature: -55°C ~ 125°C (TC)
Number of Gates: 48000
Mounting Type: Surface Mount
Package / Case: 208-BFCQFP with Tie Bar
Packaging: Tray
Produkt ist nicht verfügbar
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APA600-CQ208M 131796-proasicplusgendes
APA600-CQ208M
Hersteller: Microchip Technology
Description: IC FPGA 158 I/O 208CQFP
DigiKey Programmable: Not Verified
Number of I/O: 158
Total RAM Bits: 129024
Supplier Device Package: 208-CQFP (75x75)
Voltage - Supply: 2.3V ~ 2.7V
Operating Temperature: -55°C ~ 125°C (TC)
Number of Gates: 600000
Mounting Type: Surface Mount
Package / Case: 208-BFCQFP with Tie Bar
Packaging: Tray
Produkt ist nicht verfügbar
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APA600-FG256M 131796-proasicplusgendes
APA600-FG256M
Hersteller: Microchip Technology
Description: IC FPGA 186 I/O 256FBGA
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APA600-FGG256M 131796-proasicplusgendes
APA600-FGG256M
Hersteller: Microchip Technology
Description: IC FPGA 186 I/O 256FBGA
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A2F500M3G-FGG256M 130720-military-grade-smartfusion-customizable-system-on-chip-csoc-datasheet
A2F500M3G-FGG256M
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 80MHZ 256FBGA
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A54SX32A-FGG256M index.php?option=com_docman&task=doc_download&gid=130722
A54SX32A-FGG256M
Hersteller: Microchip Technology
Description: IC FPGA 203 I/O 256FBGA
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A54SX16A-1PQ208M index.php?option=com_docman&task=doc_download&gid=130722
A54SX16A-1PQ208M
Hersteller: Microchip Technology
Description: IC FPGA 175 I/O 208QFP
Number of I/O: 175
Part Status: Obsolete
Number of LABs/CLBs: 1452
Supplier Device Package: 208-PQFP (28x28)
Voltage - Supply: 2.25V ~ 5.25V
Operating Temperature: -55°C ~ 125°C (TC)
Number of Gates: 24000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
Produkt ist nicht verfügbar
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APA1000-BG456M 131796-proasicplusgendes
APA1000-BG456M
Hersteller: Microchip Technology
Description: IC FPGA 356 I/O 456BGA
DigiKey Programmable: Not Verified
Number of I/O: 356
Total RAM Bits: 202752
Supplier Device Package: 456-PBGA (35x35)
Voltage - Supply: 2.3V ~ 2.7V
Operating Temperature: -55°C ~ 125°C (TC)
Number of Gates: 1000000
Mounting Type: Surface Mount
Package / Case: 456-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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APTGL60H120T3G
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 80A 280W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 80 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 280 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 2.77 nF @ 25 V
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APT30DF100HJ 6866-apt30df100hj-datasheet
APT30DF100HJ
Hersteller: Microchip Technology
Description: BRIDGE RECT 1P 1KV 45A SOT227
Current - Reverse Leakage @ Vr: 100 µA @ 1000 V
Voltage - Forward (Vf) (Max) @ If: 3 V @ 30 A
Current - Average Rectified (Io): 45 A
Voltage - Peak Reverse (Max): 1 kV
Supplier Device Package: SOT-227
Technology: Standard
Operating Temperature: -55°C ~ 175°C (TJ)
Diode Type: Single Phase
Mounting Type: Chassis Mount
Package / Case: SOT-227-4, miniBLOC
Packaging: Bulk
Produkt ist nicht verfügbar
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APT30DF20HJ 6868-apt30df20hj-datasheet
APT30DF20HJ
Hersteller: Microchip Technology
Description: BRIDGE RECT 1P 200V 45A SOT227
Current - Reverse Leakage @ Vr: 250 µA @ 200 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Average Rectified (Io): 45 A
Voltage - Peak Reverse (Max): 200 V
Supplier Device Package: SOT-227
Technology: Standard
Operating Temperature: -55°C ~ 150°C (TJ)
Diode Type: Single Phase
Mounting Type: Chassis Mount
Package / Case: SOT-227-4, miniBLOC
Packaging: Bulk
Produkt ist nicht verfügbar
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APT50DF170HJ
APT50DF170HJ
Hersteller: Microchip Technology
Description: BRIDGE RECT 1P 1.7KV 50A SOT227
Packaging: Tube
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227 (ISOTOP®)
Part Status: Active
Voltage - Peak Reverse (Max): 1.7 kV
Current - Average Rectified (Io): 50 A
Voltage - Forward (Vf) (Max) @ If: 2.2 V @ 50 A
Current - Reverse Leakage @ Vr: 250 µA @ 1700 V
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AnzahlPreis
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APT40GL120JU3 7009-apt40gl120ju3-datasheet
APT40GL120JU3
Hersteller: Microchip Technology
Description: IGBT MOD 1200V 65A 220W SOT227
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 220 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 65 A
IGBT Type: Trench Field Stop
Supplier Device Package: SOT-227
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
Operating Temperature: -55°C ~ 175°C (TJ)
Configuration: Single
Input: Standard
Mounting Type: Chassis, Stud Mount
Package / Case: SOT-227-4, miniBLOC
Packaging: Bulk
Produkt ist nicht verfügbar
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APTGF150A60T3AG APTGF150A60T3AG.pdf
Hersteller: Microchip Technology
Description: IGBT MODULE 600V 230A 833W SP3
Input Capacitance (Cies) @ Vce: 9 nF @ 25 V
Current - Collector Cutoff (Max): 350 µA
Power - Max: 833 W
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector (Ic) (Max): 230 A
Part Status: Obsolete
IGBT Type: NPT
Supplier Device Package: SP3
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 200A
Configuration: Half Bridge
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP3
Packaging: Bulk
Produkt ist nicht verfügbar
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APTGF50DH120T3G APTGF50DH120T3G.pdf
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 70A 312W SP3
Input Capacitance (Cies) @ Vce: 3.45 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 312 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Configuration: Asymmetrical Bridge
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP3
Packaging: Bulk
Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 50A
Current - Collector (Ic) (Max): 70 A
IGBT Type: NPT
Supplier Device Package: SP3
NTC Thermistor: Yes
Produkt ist nicht verfügbar
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APTGF50DSK120T3G APTGF50DSK120T3G.pdf
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 70A 312W SP3
Power - Max: 312 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 70 A
IGBT Type: NPT
Package / Case: SP3
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 3.45 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Supplier Device Package: SP3
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 50A
Configuration: Dual Buck Chopper
Input: Standard
Mounting Type: Chassis Mount
Produkt ist nicht verfügbar
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APTGL120TDU120TPG 7624-aptgl120tdu120tpg-datasheet
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 140A 517W SP6P
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Triple, Dual - Common Source
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 6.2 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 517 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 140 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: SP6-P
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 100A
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APTGL40H120T1G
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 65A 220W SP1
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 220 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 65 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: SP1
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Full Bridge
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP1
Packaging: Bulk
Produkt ist nicht verfügbar
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APTGL40X120T3G 7632-aptgl40x120t3g-datasheet
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 65A 220W SP3
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP3
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 220 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 65 A
IGBT Type: Trench Field Stop
Supplier Device Package: SP3
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Three Phase Inverter
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APTGL90A120T1G 7646-aptgl90a120t1g-datasheet
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 110A 385W SP1
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 385 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 110 A
IGBT Type: Trench Field Stop
Supplier Device Package: SP1
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Half Bridge
Input: Standard
Mounting Type: Through Hole
Package / Case: SP1
Packaging: Bulk
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APTGL90DA120T1G 7647-aptgl90da120t1g-datasheet
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 110A 385W SP1
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 385 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 110 A
IGBT Type: Trench Field Stop
Supplier Device Package: SP1
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Single
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP1
Packaging: Bulk
Produkt ist nicht verfügbar
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APT90DR160HJ 7310-apt90dr160hj-datasheet
APT90DR160HJ
Hersteller: Microchip Technology
Description: BRIDGE RECT 1PHASE 1.6KV SOT-227
Voltage - Peak Reverse (Max): 1.6 kV
Supplier Device Package: SOT-227
Technology: Standard
Operating Temperature: -55°C ~ 150°C (TJ)
Diode Type: Single Phase
Mounting Type: Chassis Mount
Package / Case: SOT-227-4, miniBLOC
Packaging: Bulk
Current - Reverse Leakage @ Vr: 50 µA @ 1600 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 90 A
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APTGL90DDA120T3G 7648-aptgl90dda120t3g-datasheet
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 110A 385W SP3
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 385 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 110 A
IGBT Type: Trench Field Stop
Supplier Device Package: SP3
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Dual Boost Chopper
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP3
Packaging: Bulk
Produkt ist nicht verfügbar
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APTGL90DSK120T3G 7650-aptgl90dsk120t3g-datasheet
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 110A 385W SP3
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 385 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 110 A
IGBT Type: Trench Field Stop
Supplier Device Package: SP3
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Dual Buck Chopper
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP3
Packaging: Bulk
Produkt ist nicht verfügbar
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APTGL90H120T3G 7651-aptgl90h120t3g-datasheet
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 110A 385W SP3
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 385 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 110 A
IGBT Type: Trench Field Stop
Supplier Device Package: SP3
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Full Bridge
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP3
Packaging: Bulk
Produkt ist nicht verfügbar
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APTGT200DA60T3AG 7766-aptgt200da60t3ag-datasheet
APTGT200DA60T3AG
Hersteller: Microchip Technology
Description: IGBT MODULE 600V 290A 750W SP3
Input Capacitance (Cies) @ Vce: 12.3 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 750 W
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector (Ic) (Max): 290 A
IGBT Type: Trench Field Stop
Supplier Device Package: SP3
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 200A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Single
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP3
Packaging: Bulk
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APTGT200SK60T3AG 7779-aptgt200sk60t3ag-datasheet
Hersteller: Microchip Technology
Description: IGBT MODULE 600V 290A 750W SP3
Input Capacitance (Cies) @ Vce: 12.3 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 750 W
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector (Ic) (Max): 290 A
IGBT Type: Trench Field Stop
Supplier Device Package: SP3
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 200A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Single
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP3
Packaging: Bulk
Produkt ist nicht verfügbar
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APTGT20TL601G 7790-aptgt20tl601g-datasheet
Hersteller: Microchip Technology
Description: IGBT MODULE 600V 32A 62W SP1
Input Capacitance (Cies) @ Vce: 1.1 pF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Current - Collector (Ic) (Max): 32 A
IGBT Type: Trench Field Stop
Supplier Device Package: SP1
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 20A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Three Level Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: SP1
Packaging: Bulk
Power - Max: 62 W
Voltage - Collector Emitter Breakdown (Max): 600 V
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APT60DF20HJ 7186-apt60df20hj-datasheet
APT60DF20HJ
Hersteller: Microchip Technology
Description: BRIDGE RECT 1P 200V 90A SOT227
Current - Reverse Leakage @ Vr: 250 µA @ 200 V
Voltage - Forward (Vf) (Max) @ If: 1.15 V @ 60 A
Current - Average Rectified (Io): 90 A
Voltage - Peak Reverse (Max): 200 V
Supplier Device Package: SOT-227
Technology: Standard
Operating Temperature: -55°C ~ 150°C (TJ)
Diode Type: Single Phase
Mounting Type: Chassis Mount
Package / Case: SOT-227-4, miniBLOC
Packaging: Bulk
Produkt ist nicht verfügbar
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APT75DF170HJ 7237-apt75df170hj-datasheet
APT75DF170HJ
Hersteller: Microchip Technology
Description: BRIDGE RECT 1P 1.7KV 75A SOT227
Produkt ist nicht verfügbar
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APT75DL120HJ 7238-apt75dl120hj-datasheet
APT75DL120HJ
Hersteller: Microchip Technology
Description: BRIDGE RECT 1P 1.2KV 75A SOT227
Produkt ist nicht verfügbar
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APT40GL120JU2 7008-apt40gl120ju2-datasheet
APT40GL120JU2
Hersteller: Microchip Technology
Description: IGBT MOD 1200V 65A 220W SOT227
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
Current - Collector Cutoff (Max): 250 µA
Power - Max: 220 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
IGBT Type: Trench Field Stop
Supplier Device Package: SOT-227
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
Operating Temperature: -55°C ~ 175°C (TJ)
Configuration: Single
Input: Standard
Mounting Type: Chassis, Stud Mount
Package / Case: SOT-227-4, miniBLOC
Packaging: Bulk
Current - Collector (Ic) (Max): 65 A
Produkt ist nicht verfügbar
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APT13F120S 6621-apt13f120b-apt13f120s-datasheet
APT13F120S
Hersteller: Microchip Technology
Description: MOSFET N-CH 1200V 14A D3PAK
Produkt ist nicht verfügbar
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APT14F100S 6625-apt14f100bg-apt14f100sg-datasheet
APT14F100S
Hersteller: Microchip Technology
Description: MOSFET N-CH 1000V 14A D3PAK
Input Capacitance (Ciss) (Max) @ Vds: 3965 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 120 nC @ 10 V
Drain to Source Voltage (Vdss): 1000 V
Vgs (Max): ±30V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: D3Pak
Vgs(th) (Max) @ Id: 5V @ 1mA
Power Dissipation (Max): 500W (Tc)
Rds On (Max) @ Id, Vgs: 980mOhm @ 7A, 10V
Current - Continuous Drain (Id) @ 25°C: 14A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Packaging: Tube
Produkt ist nicht verfügbar
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APT17F80S APT17F80B_S_C.pdf
APT17F80S
Hersteller: Microchip Technology
Description: MOSFET N-CH 800V 18A D3PAK
Input Capacitance (Ciss) (Max) @ Vds: 3757 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 122 nC @ 10 V
Drain to Source Voltage (Vdss): 800 V
Vgs (Max): ±30V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: D3Pak
Vgs(th) (Max) @ Id: 5V @ 1mA
Power Dissipation (Max): 500W (Tc)
Rds On (Max) @ Id, Vgs: 580mOhm @ 9A, 10V
Current - Continuous Drain (Id) @ 25°C: 18A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Packaging: Tube
Produkt ist nicht verfügbar
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APT37F50S 6980-apt37f50b-apt37f50s-datasheet
APT37F50S
Hersteller: Microchip Technology
Description: MOSFET N-CH 500V 37A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 37A (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 18A, 10V
Power Dissipation (Max): 520W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 145 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5710 pF @ 25 V
Produkt ist nicht verfügbar
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APT33N90JCU2
APT33N90JCU2
Hersteller: Microchip Technology
Description: MOSFET N-CH 900V 33A SOT227
Packaging: Tray
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 33A (Tc)
Rds On (Max) @ Id, Vgs: 120mOhm @ 26A, 10V
Power Dissipation (Max): 290W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 3mA
Supplier Device Package: SOT-227
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 270 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6800 pF @ 100 V
Produkt ist nicht verfügbar
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APT33N90JCU3
APT33N90JCU3
Hersteller: Microchip Technology
Description: MOSFET N-CH 900V 33A SOT227
Packaging: Tray
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 33A (Tc)
Rds On (Max) @ Id, Vgs: 120mOhm @ 26A, 10V
Power Dissipation (Max): 290W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 3mA
Supplier Device Package: SOT-227
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 270 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6800 pF @ 100 V
Produkt ist nicht verfügbar
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APTC60DDAM45T1G 7333-aptc60ddam45t1g-datasheet
Hersteller: Microchip Technology
Description: MOSFET 2N-CH 600V 49A SP1
Packaging: Tray
Package / Case: SP1
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Dual Buck Chopper)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 250W
Drain to Source Voltage (Vdss): 600V
Current - Continuous Drain (Id) @ 25°C: 49A
Input Capacitance (Ciss) (Max) @ Vds: 7200pF @ 25V
Rds On (Max) @ Id, Vgs: 45mOhm @ 24.5A, 10V
Gate Charge (Qg) (Max) @ Vgs: 150nC @ 10V
Vgs(th) (Max) @ Id: 3.9V @ 3mA
Supplier Device Package: SP1
Produkt ist nicht verfügbar
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APTC60DSKM24T3G
Hersteller: Microchip Technology
Description: MOSFET 2N-CH 600V 95A SP3
Packaging: Tray
Package / Case: SP3
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Dual Buck Chopper)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 462W
Drain to Source Voltage (Vdss): 600V
Current - Continuous Drain (Id) @ 25°C: 95A
Input Capacitance (Ciss) (Max) @ Vds: 14400pF @ 25V
Rds On (Max) @ Id, Vgs: 24mOhm @ 47.5A, 10V
Gate Charge (Qg) (Max) @ Vgs: 300nC @ 10V
Vgs(th) (Max) @ Id: 3.9V @ 5mA
Supplier Device Package: SP3
Part Status: Active
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APTC60HM70BT3G 123994-aptc60hm70bt3g-datasheet
Hersteller: Microchip Technology
Description: MOSFET 4N-CH 600V 39A SP3
Packaging: Tray
Package / Case: SP3
Mounting Type: Chassis Mount
Configuration: 4 N-Channel (Full Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 250W
Drain to Source Voltage (Vdss): 600V
Current - Continuous Drain (Id) @ 25°C: 39A
Input Capacitance (Ciss) (Max) @ Vds: 700pF @ 25V
Rds On (Max) @ Id, Vgs: 70mOhm @ 39A, 10V
Gate Charge (Qg) (Max) @ Vgs: 259nC @ 10V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 3.9V @ 2.7mA
Supplier Device Package: SP3
Produkt ist nicht verfügbar
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APT30DQ60BHBG APT30DQ60BHB%28G%29_A.pdf
APT30DQ60BHBG
Hersteller: Microchip Technology
Description: DIODE ARRAY GP 600V 30A TO-247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 30A
Supplier Device Package: TO-247
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.4 V @ 30 A
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AnzahlPreis
3+7.83 EUR
100+6.36 EUR
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APT25GN120SG 6785-apt25gn120bg-apt25gn120sg-datasheet
APT25GN120SG
Hersteller: Microchip Technology
Description: IGBT 1200V 67A 272W D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 25A
Supplier Device Package: D3Pak
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 22ns/280ns
Test Condition: 800V, 25A, 1Ohm, 15V
Gate Charge: 155 nC
Current - Collector (Ic) (Max): 67 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 75 A
Power - Max: 272 W
Produkt ist nicht verfügbar
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APT200GT60JR APT200GT60JR_D.pdf
APT200GT60JR
Hersteller: Microchip Technology
Description: IGBT MOD 600V 195A 500W SOT-227
Packaging: Tray
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: SOT-227
IGBT Type: NPT
Current - Collector (Ic) (Max): 195 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 500 W
Current - Collector Cutoff (Max): 25 µA
Input Capacitance (Cies) @ Vce: 8.65 nF @ 25 V
Produkt ist nicht verfügbar
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APT17F100S APT17F100B_S_D.pdf
APT17F100S
Hersteller: Microchip Technology
Description: MOSFET N-CH 1000V 17A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 17A (Tc)
Rds On (Max) @ Id, Vgs: 780mOhm @ 9A, 10V
Power Dissipation (Max): 625W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 150 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4845 pF @ 25 V
Produkt ist nicht verfügbar
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APT42F50S 7028-apt42f50b-apt42f50s-datasheet
APT42F50S
Hersteller: Microchip Technology
Description: MOSFET N-CH 500V 42A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 130mOhm @ 21A, 10V
Power Dissipation (Max): 625W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 170 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6810 pF @ 25 V
Produkt ist nicht verfügbar
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APT30F50S 6891-apt30f50b-apt30f50s-datasheet
APT30F50S
Hersteller: Microchip Technology
Description: MOSFET N-CH 500V 30A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 30A (Tc)
Rds On (Max) @ Id, Vgs: 190mOhm @ 14A, 10V
Power Dissipation (Max): 415W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 115 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4525 pF @ 25 V
Produkt ist nicht verfügbar
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APTC60VDAM45T1G 7362-aptc60vdam45t1g-datasheet
Hersteller: Microchip Technology
Description: MOSFET 2N-CH 600V 49A SP1
Supplier Device Package: SP1
Vgs(th) (Max) @ Id: 3.9V @ 3mA
Gate Charge (Qg) (Max) @ Vgs: 150nC @ 10V
Rds On (Max) @ Id, Vgs: 45mOhm @ 24.5A, 10V
Input Capacitance (Ciss) (Max) @ Vds: 7200pF @ 25V
Current - Continuous Drain (Id) @ 25°C: 49A
Drain to Source Voltage (Vdss): 600V
Power - Max: 250W
Technology: MOSFET (Metal Oxide)
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: 2 N-Channel (Dual)
Mounting Type: Chassis Mount
Package / Case: SP1
Packaging: Tray
Produkt ist nicht verfügbar
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24LC128T-I/SN 24LC128T-I
24LC128T-I/SN
Hersteller: Microchip Technology
Description: IC EEPROM 128KBIT I2C 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 128Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 16K x 8
DigiKey Programmable: Verified
auf Bestellung 5836 Stücke:
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AnzahlPreis
15+1.21 EUR
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24LC32AT-I/SN 24AA32A-24LC32A-32-Kbit-I2C-Serial-EEPROM-DS20001713.pdf
24LC32AT-I/SN
Hersteller: Microchip Technology
Description: IC EEPROM 32KBIT I2C 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 32Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 4K x 8
DigiKey Programmable: Verified
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AnzahlPreis
24+0.76 EUR
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LAN8710A-EZC-TR 00002164B.pdf
LAN8710A-EZC-TR
Hersteller: Microchip Technology
Description: IC TRANSCEIVER FULL 4/4 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.6V ~ 3.6V
Number of Drivers/Receivers: 4/4
Data Rate: 100Mbps
Protocol: MII, RMII
Supplier Device Package: 32-QFN (5x5)
Duplex: Full
Part Status: Active
auf Bestellung 17931 Stücke:
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AnzahlPreis
11+1.67 EUR
25+1.65 EUR
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LAN8710A-EZK-TR 00002164B.pdf
LAN8710A-EZK-TR
Hersteller: Microchip Technology
Description: IC TRANSCEIVER FULL 4/4 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.6V ~ 3.6V
Number of Drivers/Receivers: 4/4
Data Rate: 100Mbps
Protocol: MII, RMII
Supplier Device Package: 32-QFN (5x5)
Duplex: Full
Part Status: Active
auf Bestellung 47545 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5+3.7 EUR
10+2.75 EUR
25+2.51 EUR
100+2.25 EUR
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LAN8720A-CP-TR LAN8720A-LAN8720Ai-Data-Sheet-DS00002165.pdf
LAN8720A-CP-TR
Hersteller: Microchip Technology
Description: IC TRANSCEIVER FULL 2/2 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.6V ~ 3.6V
Number of Drivers/Receivers: 2/2
Data Rate: 100Mbps
Protocol: MII, RMII
Supplier Device Package: 24-QFN (4x4)
Duplex: Full
Part Status: Active
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AnzahlPreis
12+1.55 EUR
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MCP23S17T-E/SS MCP23017-Data-Sheet-DS20001952.pdf
MCP23S17T-E/SS
Hersteller: Microchip Technology
Description: IC XPNDR 10MHZ SPI 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 16
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 5.5V
Clock Frequency: 10 MHz
Interrupt Output: Yes
Supplier Device Package: 28-SSOP
Current - Output Source/Sink: 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 32994 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
7+2.66 EUR
25+2.23 EUR
100+2.17 EUR
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