Produkte > MICROCHIP TECHNOLOGY > Alle Produkte des Herstellers MICROCHIP TECHNOLOGY (337862) > Seite 791 nach 5632
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A3P1000-1FG484M | Microchip Technology |
 Description: IC FPGA 300 I/O 484FBGAPackaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Number of Gates: 1000000 Operating Temperature: -55°C ~ 125°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Supplier Device Package: 484-FPBGA (23x23) Total RAM Bits: 147456 Number of I/O: 300 DigiKey Programmable: Not Verified |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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A3P1000-PQG208M | Microchip Technology |
Description: IC FPGA 154 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 1000000 Operating Temperature: -55°C ~ 125°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Supplier Device Package: 208-PQFP (28x28) Total RAM Bits: 147456 Number of I/O: 154 DigiKey Programmable: Not Verified |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
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A3P250-VQ100M | Microchip Technology |
Description: IC FPGA 68 I/O 100VQFP Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: -55°C ~ 125°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Supplier Device Package: 100-VQFP (14x14) Total RAM Bits: 36864 Number of I/O: 68 DigiKey Programmable: Not Verified |
auf Bestellung 57 Stücke: Lieferzeit 10-14 Tag (e) |
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A3PE3000L-1FG484M | Microchip Technology |
Description: IC FPGA 341 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Number of Gates: 3000000 Operating Temperature: -55°C ~ 125°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Supplier Device Package: 484-FPBGA (23x23) Total RAM Bits: 516096 Part Status: Active Number of I/O: 341 |
Produkt ist nicht verfügbar |
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APA1000-BGG456M | Microchip Technology |
Description: IC FPGA 356 I/O 456BGA Packaging: Tray Package / Case: 456-BBGA Mounting Type: Surface Mount Number of Gates: 1000000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.3V ~ 2.7V Supplier Device Package: 456-PBGA (35x35) Total RAM Bits: 202752 Number of I/O: 356 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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A3PE3000L-1FGG484M | Microchip Technology |
Description: IC FPGA 341 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Number of Gates: 3000000 Operating Temperature: -55°C ~ 125°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Supplier Device Package: 484-FPBGA (23x23) Total RAM Bits: 516096 Part Status: Active Number of I/O: 341 |
Produkt ist nicht verfügbar |
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A54SX16A-1PQG208M | Microchip Technology |
Description: IC FPGA 175 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 24000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 1452 Part Status: Active Number of I/O: 175 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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A54SX16A-1TQG100M | Microchip Technology |
Description: IC FPGA 81 I/O 100TQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Number of Gates: 24000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 100-TQFP (14x14) Number of LABs/CLBs: 1452 Number of I/O: 81 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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A54SX16A-1TQG144M | Microchip Technology |
Description: IC FPGA 111 I/O 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 24000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 1452 Number of I/O: 111 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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APA300-BG456M | Microchip Technology |
Description: IC FPGA 290 I/O 456BGA |
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APA300-CQ208M | Microchip Technology |
Description: IC FPGA 158 I/O 208CQFP Packaging: Tray Package / Case: 208-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 300000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.3V ~ 2.7V Supplier Device Package: 208-CQFP (75x75) Total RAM Bits: 73728 Number of I/O: 158 DigiKey Programmable: Not Verified |
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APA300-FG256M | Microchip Technology |
Description: IC FPGA 186 I/O 256FBGA |
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A54SX16A-PQG208M | Microchip Technology |
Description: IC FPGA 175 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 24000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 1452 Number of I/O: 175 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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A54SX16A-TQG100M | Microchip Technology |
Description: IC FPGA 81 I/O 100TQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Number of Gates: 24000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 100-TQFP (14x14) Number of LABs/CLBs: 1452 Number of I/O: 81 DigiKey Programmable: Not Verified |
auf Bestellung 180 Stücke: Lieferzeit 10-14 Tag (e) |
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A54SX16A-TQG144M | Microchip Technology |
Description: IC FPGA 113 I/O 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 24000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 1452 Number of I/O: 113 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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A54SX32A-1CQ208M | Microchip Technology |
Description: IC FPGA 174 I/O 208CQFP Packaging: Tray Package / Case: 208-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 48000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 208-CQFP (75x75) Number of LABs/CLBs: 2880 Number of I/O: 174 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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A54SX32A-1CQ256M | Microchip Technology |
Description: IC FPGA 228 I/O 256CQFP Packaging: Tray Package / Case: 256-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 48000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 256-CQFP (75x75) Number of LABs/CLBs: 2880 Number of I/O: 228 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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A54SX32A-1FG256M | Microchip Technology |
Description: IC FPGA 203 I/O 256FBGA |
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A54SX32A-1FGG256M | Microchip Technology |
Description: IC FPGA 203 I/O 256FBGA |
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A54SX32A-1TQG100M | Microchip Technology |
Description: IC FPGA 81 I/O 100TQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Number of Gates: 48000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 100-TQFP (14x14) Number of LABs/CLBs: 2880 Number of I/O: 81 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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A54SX32A-1TQG144M | Microchip Technology |
Description: IC FPGA 113 I/O 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 48000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 2880 Number of I/O: 113 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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APA300-FGG256M | Microchip Technology |
Description: IC FPGA 186 I/O 256FBGA |
Produkt ist nicht verfügbar |
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APA300-PQG208M | Microchip Technology |
Description: IC FPGA 158 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 300000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.3V ~ 2.7V Supplier Device Package: 208-PQFP (28x28) Total RAM Bits: 73728 Part Status: Active Number of I/O: 158 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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A54SX32A-CQ208M | Microchip Technology |
Description: IC FPGA 174 I/O 208CQFP Packaging: Tray Package / Case: 208-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 48000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 208-CQFP (75x75) Number of LABs/CLBs: 2880 Number of I/O: 174 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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APA600-CQ208M | Microchip Technology |
Description: IC FPGA 158 I/O 208CQFP Packaging: Tray Package / Case: 208-BFCQFP with Tie Bar Mounting Type: Surface Mount Number of Gates: 600000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.3V ~ 2.7V Supplier Device Package: 208-CQFP (75x75) Total RAM Bits: 129024 Number of I/O: 158 DigiKey Programmable: Not Verified |
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APA600-FG256M | Microchip Technology |
Description: IC FPGA 186 I/O 256FBGA |
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APA600-FGG256M | Microchip Technology |
Description: IC FPGA 186 I/O 256FBGA |
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A2F500M3G-FGG256M | Microchip Technology |
Description: IC SOC CORTEX-M3 80MHZ 256FBGA |
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A54SX32A-FGG256M | Microchip Technology |
Description: IC FPGA 203 I/O 256FBGA |
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A54SX16A-1PQ208M | Microchip Technology |
Description: IC FPGA 175 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 24000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.25V ~ 5.25V Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 1452 Part Status: Obsolete Number of I/O: 175 |
Produkt ist nicht verfügbar |
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APA1000-BG456M | Microchip Technology |
Description: IC FPGA 356 I/O 456BGA Packaging: Tray Package / Case: 456-BBGA Mounting Type: Surface Mount Number of Gates: 1000000 Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 2.3V ~ 2.7V Supplier Device Package: 456-PBGA (35x35) Total RAM Bits: 202752 Number of I/O: 356 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| APTGL60H120T3G | Microchip Technology |
Description: IGBT MODULE 1200V 80A 280W SP3 Packaging: Bulk Package / Case: SP3 Mounting Type: Chassis Mount Input: Standard Configuration: Full Bridge Operating Temperature: -40°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 50A NTC Thermistor: Yes Supplier Device Package: SP3 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 80 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 280 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 2.77 nF @ 25 V |
Produkt ist nicht verfügbar |
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APT30DF100HJ | Microchip Technology |
Description: BRIDGE RECT 1P 1KV 45A SOT227 Packaging: Bulk Package / Case: SOT-227-4, miniBLOC Mounting Type: Chassis Mount Diode Type: Single Phase Operating Temperature: -55°C ~ 175°C (TJ) Technology: Standard Supplier Device Package: SOT-227 Voltage - Peak Reverse (Max): 1 kV Current - Average Rectified (Io): 45 A Voltage - Forward (Vf) (Max) @ If: 3 V @ 30 A Current - Reverse Leakage @ Vr: 100 µA @ 1000 V |
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APT30DF20HJ | Microchip Technology |
Description: BRIDGE RECT 1P 200V 45A SOT227 Packaging: Bulk Package / Case: SOT-227-4, miniBLOC Mounting Type: Chassis Mount Diode Type: Single Phase Operating Temperature: -55°C ~ 150°C (TJ) Technology: Standard Supplier Device Package: SOT-227 Voltage - Peak Reverse (Max): 200 V Current - Average Rectified (Io): 45 A Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A Current - Reverse Leakage @ Vr: 250 µA @ 200 V |
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APT50DF170HJ | Microchip Technology |
Description: BRIDGE RECT 1P 1.7KV 50A SOT227 Packaging: Tube Package / Case: SOT-227-4, miniBLOC Mounting Type: Chassis Mount Diode Type: Single Phase Operating Temperature: -55°C ~ 150°C (TJ) Technology: Standard Supplier Device Package: SOT-227 (ISOTOP®) Part Status: Active Voltage - Peak Reverse (Max): 1.7 kV Current - Average Rectified (Io): 50 A Voltage - Forward (Vf) (Max) @ If: 2.2 V @ 50 A Current - Reverse Leakage @ Vr: 250 µA @ 1700 V |
auf Bestellung 84 Stücke: Lieferzeit 10-14 Tag (e) |
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APT40GL120JU3 | Microchip Technology |
Description: IGBT MOD 1200V 65A 220W SOT227 Packaging: Bulk Package / Case: SOT-227-4, miniBLOC Mounting Type: Chassis, Stud Mount Input: Standard Configuration: Single Operating Temperature: -55°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A NTC Thermistor: No Supplier Device Package: SOT-227 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 65 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 220 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V |
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| APTGF150A60T3AG | Microchip Technology |
Description: IGBT MODULE 600V 230A 833W SP3 Packaging: Bulk Package / Case: SP3 Mounting Type: Chassis Mount Input: Standard Configuration: Half Bridge Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 200A NTC Thermistor: Yes Supplier Device Package: SP3 IGBT Type: NPT Part Status: Obsolete Current - Collector (Ic) (Max): 230 A Voltage - Collector Emitter Breakdown (Max): 600 V Power - Max: 833 W Current - Collector Cutoff (Max): 350 µA Input Capacitance (Cies) @ Vce: 9 nF @ 25 V |
Produkt ist nicht verfügbar |
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| APTGF50DH120T3G | Microchip Technology |
Description: IGBT MODULE 1200V 70A 312W SP3 Packaging: Bulk Package / Case: SP3 Mounting Type: Chassis Mount Input: Standard Configuration: Asymmetrical Bridge Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 50A NTC Thermistor: Yes Supplier Device Package: SP3 IGBT Type: NPT Current - Collector (Ic) (Max): 70 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 312 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 3.45 nF @ 25 V |
Produkt ist nicht verfügbar |
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| APTGF50DSK120T3G | Microchip Technology |
Description: IGBT MODULE 1200V 70A 312W SP3 Packaging: Bulk Package / Case: SP3 Mounting Type: Chassis Mount Input: Standard Configuration: Dual Buck Chopper Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 50A NTC Thermistor: Yes Supplier Device Package: SP3 IGBT Type: NPT Current - Collector (Ic) (Max): 70 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 312 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 3.45 nF @ 25 V |
Produkt ist nicht verfügbar |
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| APTGL120TDU120TPG | Microchip Technology |
Description: IGBT MODULE 1200V 140A 517W SP6P Packaging: Bulk Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: Triple, Dual - Common Source Operating Temperature: -40°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 100A NTC Thermistor: Yes Supplier Device Package: SP6-P IGBT Type: Trench Field Stop Part Status: Active Current - Collector (Ic) (Max): 140 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 517 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 6.2 nF @ 25 V |
Produkt ist nicht verfügbar |
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| APTGL40H120T1G | Microchip Technology |
Description: IGBT MODULE 1200V 65A 220W SP1 Packaging: Bulk Package / Case: SP1 Mounting Type: Chassis Mount Input: Standard Configuration: Full Bridge Operating Temperature: -40°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A NTC Thermistor: Yes Supplier Device Package: SP1 IGBT Type: Trench Field Stop Part Status: Active Current - Collector (Ic) (Max): 65 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 220 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V |
Produkt ist nicht verfügbar |
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| APTGL40X120T3G | Microchip Technology |
Description: IGBT MODULE 1200V 65A 220W SP3 Packaging: Bulk Package / Case: SP3 Mounting Type: Chassis Mount Input: Standard Configuration: Three Phase Inverter Operating Temperature: -40°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A NTC Thermistor: Yes Supplier Device Package: SP3 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 65 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 220 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V |
Produkt ist nicht verfügbar |
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| APTGL90A120T1G | Microchip Technology |
Description: IGBT MODULE 1200V 110A 385W SP1 Packaging: Bulk Package / Case: SP1 Mounting Type: Through Hole Input: Standard Configuration: Half Bridge Operating Temperature: -40°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A NTC Thermistor: Yes Supplier Device Package: SP1 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 110 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 385 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V |
Produkt ist nicht verfügbar |
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| APTGL90DA120T1G | Microchip Technology |
Description: IGBT MODULE 1200V 110A 385W SP1 Packaging: Bulk Package / Case: SP1 Mounting Type: Chassis Mount Input: Standard Configuration: Single Operating Temperature: -40°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A NTC Thermistor: Yes Supplier Device Package: SP1 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 110 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 385 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V |
Produkt ist nicht verfügbar |
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APT90DR160HJ | Microchip Technology |
Description: BRIDGE RECT 1PHASE 1.6KV SOT-227 Packaging: Bulk Package / Case: SOT-227-4, miniBLOC Mounting Type: Chassis Mount Diode Type: Single Phase Operating Temperature: -55°C ~ 150°C (TJ) Technology: Standard Supplier Device Package: SOT-227 Voltage - Peak Reverse (Max): 1.6 kV Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 90 A Current - Reverse Leakage @ Vr: 50 µA @ 1600 V |
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| APTGL90DDA120T3G | Microchip Technology |
Description: IGBT MODULE 1200V 110A 385W SP3 Packaging: Bulk Package / Case: SP3 Mounting Type: Chassis Mount Input: Standard Configuration: Dual Boost Chopper Operating Temperature: -40°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A NTC Thermistor: Yes Supplier Device Package: SP3 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 110 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 385 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V |
Produkt ist nicht verfügbar |
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| APTGL90DSK120T3G | Microchip Technology |
Description: IGBT MODULE 1200V 110A 385W SP3 Packaging: Bulk Package / Case: SP3 Mounting Type: Chassis Mount Input: Standard Configuration: Dual Buck Chopper Operating Temperature: -40°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A NTC Thermistor: Yes Supplier Device Package: SP3 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 110 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 385 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V |
Produkt ist nicht verfügbar |
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| APTGL90H120T3G | Microchip Technology |
Description: IGBT MODULE 1200V 110A 385W SP3 Packaging: Bulk Package / Case: SP3 Mounting Type: Chassis Mount Input: Standard Configuration: Full Bridge Operating Temperature: -40°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A NTC Thermistor: Yes Supplier Device Package: SP3 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 110 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 385 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V |
Produkt ist nicht verfügbar |
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APTGT200DA60T3AG | Microchip Technology |
Description: IGBT MODULE 600V 290A 750W SP3 Packaging: Bulk Package / Case: SP3 Mounting Type: Chassis Mount Input: Standard Configuration: Single Operating Temperature: -40°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 200A NTC Thermistor: Yes Supplier Device Package: SP3 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 290 A Voltage - Collector Emitter Breakdown (Max): 600 V Power - Max: 750 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 12.3 nF @ 25 V |
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| APTGT200SK60T3AG | Microchip Technology |
Description: IGBT MODULE 600V 290A 750W SP3 Packaging: Bulk Package / Case: SP3 Mounting Type: Chassis Mount Input: Standard Configuration: Single Operating Temperature: -40°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 200A NTC Thermistor: Yes Supplier Device Package: SP3 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 290 A Voltage - Collector Emitter Breakdown (Max): 600 V Power - Max: 750 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 12.3 nF @ 25 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
| APTGT20TL601G | Microchip Technology |
Description: IGBT MODULE 600V 32A 62W SP1 Packaging: Bulk Package / Case: SP1 Mounting Type: Chassis Mount Input: Standard Configuration: Three Level Inverter Operating Temperature: -40°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 20A NTC Thermistor: No Supplier Device Package: SP1 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 32 A Voltage - Collector Emitter Breakdown (Max): 600 V Power - Max: 62 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 1.1 pF @ 25 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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APT60DF20HJ | Microchip Technology |
Description: BRIDGE RECT 1P 200V 90A SOT227 Packaging: Bulk Package / Case: SOT-227-4, miniBLOC Mounting Type: Chassis Mount Diode Type: Single Phase Operating Temperature: -55°C ~ 150°C (TJ) Technology: Standard Supplier Device Package: SOT-227 Voltage - Peak Reverse (Max): 200 V Current - Average Rectified (Io): 90 A Voltage - Forward (Vf) (Max) @ If: 1.15 V @ 60 A Current - Reverse Leakage @ Vr: 250 µA @ 200 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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APT75DF170HJ | Microchip Technology |
Description: BRIDGE RECT 1P 1.7KV 75A SOT227 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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APT75DL120HJ | Microchip Technology |
Description: BRIDGE RECT 1P 1.2KV 75A SOT227 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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APT40GL120JU2 | Microchip Technology |
Description: IGBT MOD 1200V 65A 220W SOT227 Packaging: Bulk Package / Case: SOT-227-4, miniBLOC Mounting Type: Chassis, Stud Mount Input: Standard Configuration: Single Operating Temperature: -55°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A NTC Thermistor: No Supplier Device Package: SOT-227 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 65 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 220 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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APT13F120S | Microchip Technology |
Description: MOSFET N-CH 1200V 14A D3PAK |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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APT14F100S | Microchip Technology |
Description: MOSFET N-CH 1000V 14A D3PAK Packaging: Tube Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 14A (Tc) Rds On (Max) @ Id, Vgs: 980mOhm @ 7A, 10V Power Dissipation (Max): 500W (Tc) Vgs(th) (Max) @ Id: 5V @ 1mA Supplier Device Package: D3Pak Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±30V Drain to Source Voltage (Vdss): 1000 V Gate Charge (Qg) (Max) @ Vgs: 120 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 3965 pF @ 25 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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APT17F80S | Microchip Technology |
Description: MOSFET N-CH 800V 18A D3PAK Packaging: Tube Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 18A (Tc) Rds On (Max) @ Id, Vgs: 580mOhm @ 9A, 10V Power Dissipation (Max): 500W (Tc) Vgs(th) (Max) @ Id: 5V @ 1mA Supplier Device Package: D3Pak Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±30V Drain to Source Voltage (Vdss): 800 V Gate Charge (Qg) (Max) @ Vgs: 122 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 3757 pF @ 25 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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APT37F50S | Microchip Technology |
Description: MOSFET N-CH 500V 37A D3PAK Packaging: Tube Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 37A (Tc) Rds On (Max) @ Id, Vgs: 150mOhm @ 18A, 10V Power Dissipation (Max): 520W (Tc) Vgs(th) (Max) @ Id: 5V @ 1mA Supplier Device Package: D3Pak Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±30V Drain to Source Voltage (Vdss): 500 V Gate Charge (Qg) (Max) @ Vgs: 145 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 5710 pF @ 25 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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APT33N90JCU2 | Microchip Technology |
Description: MOSFET N-CH 900V 33A SOT227 Packaging: Tray Package / Case: SOT-227-4, miniBLOC Mounting Type: Chassis Mount Operating Temperature: -40°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 33A (Tc) Rds On (Max) @ Id, Vgs: 120mOhm @ 26A, 10V Power Dissipation (Max): 290W (Tc) Vgs(th) (Max) @ Id: 3.5V @ 3mA Supplier Device Package: SOT-227 Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 900 V Gate Charge (Qg) (Max) @ Vgs: 270 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 6800 pF @ 100 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| A3P1000-1FG484M |
|
Hersteller: Microchip Technology
Description: IC FPGA 300 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Supplier Device Package: 484-FPBGA (23x23)
Total RAM Bits: 147456
Number of I/O: 300
DigiKey Programmable: Not Verified
Description: IC FPGA 300 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Supplier Device Package: 484-FPBGA (23x23)
Total RAM Bits: 147456
Number of I/O: 300
DigiKey Programmable: Not Verified
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 584.3 EUR |
| A3P1000-PQG208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 154 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Supplier Device Package: 208-PQFP (28x28)
Total RAM Bits: 147456
Number of I/O: 154
DigiKey Programmable: Not Verified
Description: IC FPGA 154 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Supplier Device Package: 208-PQFP (28x28)
Total RAM Bits: 147456
Number of I/O: 154
DigiKey Programmable: Not Verified
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 463.9 EUR |
| A3P250-VQ100M |
Hersteller: Microchip Technology
Description: IC FPGA 68 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Supplier Device Package: 100-VQFP (14x14)
Total RAM Bits: 36864
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC FPGA 68 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Supplier Device Package: 100-VQFP (14x14)
Total RAM Bits: 36864
Number of I/O: 68
DigiKey Programmable: Not Verified
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 309.2 EUR |
| A3PE3000L-1FG484M |
|
Hersteller: Microchip Technology
Description: IC FPGA 341 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Number of Gates: 3000000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Supplier Device Package: 484-FPBGA (23x23)
Total RAM Bits: 516096
Part Status: Active
Number of I/O: 341
Description: IC FPGA 341 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Number of Gates: 3000000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Supplier Device Package: 484-FPBGA (23x23)
Total RAM Bits: 516096
Part Status: Active
Number of I/O: 341
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APA1000-BGG456M |
|
Hersteller: Microchip Technology
Description: IC FPGA 356 I/O 456BGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.3V ~ 2.7V
Supplier Device Package: 456-PBGA (35x35)
Total RAM Bits: 202752
Number of I/O: 356
DigiKey Programmable: Not Verified
Description: IC FPGA 356 I/O 456BGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.3V ~ 2.7V
Supplier Device Package: 456-PBGA (35x35)
Total RAM Bits: 202752
Number of I/O: 356
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A3PE3000L-1FGG484M |
|
Hersteller: Microchip Technology
Description: IC FPGA 341 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Number of Gates: 3000000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Supplier Device Package: 484-FPBGA (23x23)
Total RAM Bits: 516096
Part Status: Active
Number of I/O: 341
Description: IC FPGA 341 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Number of Gates: 3000000
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Supplier Device Package: 484-FPBGA (23x23)
Total RAM Bits: 516096
Part Status: Active
Number of I/O: 341
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A54SX16A-1PQG208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 175 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1452
Part Status: Active
Number of I/O: 175
DigiKey Programmable: Not Verified
Description: IC FPGA 175 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1452
Part Status: Active
Number of I/O: 175
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A54SX16A-1TQG100M |
|
Hersteller: Microchip Technology
Description: IC FPGA 81 I/O 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 1452
Number of I/O: 81
DigiKey Programmable: Not Verified
Description: IC FPGA 81 I/O 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 1452
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A54SX16A-1TQG144M |
|
Hersteller: Microchip Technology
Description: IC FPGA 111 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 1452
Number of I/O: 111
DigiKey Programmable: Not Verified
Description: IC FPGA 111 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 1452
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APA300-BG456M |
|
Hersteller: Microchip Technology
Description: IC FPGA 290 I/O 456BGA
Description: IC FPGA 290 I/O 456BGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APA300-CQ208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 158 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 300000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.3V ~ 2.7V
Supplier Device Package: 208-CQFP (75x75)
Total RAM Bits: 73728
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 300000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.3V ~ 2.7V
Supplier Device Package: 208-CQFP (75x75)
Total RAM Bits: 73728
Number of I/O: 158
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APA300-FG256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 186 I/O 256FBGA
Description: IC FPGA 186 I/O 256FBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A54SX16A-PQG208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 175 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1452
Number of I/O: 175
DigiKey Programmable: Not Verified
Description: IC FPGA 175 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1452
Number of I/O: 175
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A54SX16A-TQG100M |
|
Hersteller: Microchip Technology
Description: IC FPGA 81 I/O 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 1452
Number of I/O: 81
DigiKey Programmable: Not Verified
Description: IC FPGA 81 I/O 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 1452
Number of I/O: 81
DigiKey Programmable: Not Verified
auf Bestellung 180 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 1084.35 EUR |
| A54SX16A-TQG144M |
|
Hersteller: Microchip Technology
Description: IC FPGA 113 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 1452
Number of I/O: 113
DigiKey Programmable: Not Verified
Description: IC FPGA 113 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 1452
Number of I/O: 113
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A54SX32A-1CQ208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 174 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-CQFP (75x75)
Number of LABs/CLBs: 2880
Number of I/O: 174
DigiKey Programmable: Not Verified
Description: IC FPGA 174 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-CQFP (75x75)
Number of LABs/CLBs: 2880
Number of I/O: 174
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A54SX32A-1CQ256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 228 I/O 256CQFP
Packaging: Tray
Package / Case: 256-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 256-CQFP (75x75)
Number of LABs/CLBs: 2880
Number of I/O: 228
DigiKey Programmable: Not Verified
Description: IC FPGA 228 I/O 256CQFP
Packaging: Tray
Package / Case: 256-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 256-CQFP (75x75)
Number of LABs/CLBs: 2880
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A54SX32A-1FG256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 203 I/O 256FBGA
Description: IC FPGA 203 I/O 256FBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A54SX32A-1FGG256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 203 I/O 256FBGA
Description: IC FPGA 203 I/O 256FBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A54SX32A-1TQG100M |
|
Hersteller: Microchip Technology
Description: IC FPGA 81 I/O 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 2880
Number of I/O: 81
DigiKey Programmable: Not Verified
Description: IC FPGA 81 I/O 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 2880
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A54SX32A-1TQG144M |
|
Hersteller: Microchip Technology
Description: IC FPGA 113 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 2880
Number of I/O: 113
DigiKey Programmable: Not Verified
Description: IC FPGA 113 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 2880
Number of I/O: 113
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APA300-FGG256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 186 I/O 256FBGA
Description: IC FPGA 186 I/O 256FBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APA300-PQG208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 300000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.3V ~ 2.7V
Supplier Device Package: 208-PQFP (28x28)
Total RAM Bits: 73728
Part Status: Active
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 300000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.3V ~ 2.7V
Supplier Device Package: 208-PQFP (28x28)
Total RAM Bits: 73728
Part Status: Active
Number of I/O: 158
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A54SX32A-CQ208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 174 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-CQFP (75x75)
Number of LABs/CLBs: 2880
Number of I/O: 174
DigiKey Programmable: Not Verified
Description: IC FPGA 174 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 48000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-CQFP (75x75)
Number of LABs/CLBs: 2880
Number of I/O: 174
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APA600-CQ208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 158 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 600000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.3V ~ 2.7V
Supplier Device Package: 208-CQFP (75x75)
Total RAM Bits: 129024
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208CQFP
Packaging: Tray
Package / Case: 208-BFCQFP with Tie Bar
Mounting Type: Surface Mount
Number of Gates: 600000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.3V ~ 2.7V
Supplier Device Package: 208-CQFP (75x75)
Total RAM Bits: 129024
Number of I/O: 158
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APA600-FG256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 186 I/O 256FBGA
Description: IC FPGA 186 I/O 256FBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APA600-FGG256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 186 I/O 256FBGA
Description: IC FPGA 186 I/O 256FBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A2F500M3G-FGG256M |
|
Hersteller: Microchip Technology
Description: IC SOC CORTEX-M3 80MHZ 256FBGA
Description: IC SOC CORTEX-M3 80MHZ 256FBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| A54SX32A-FGG256M |
|
Hersteller: Microchip Technology
Description: IC FPGA 203 I/O 256FBGA
Description: IC FPGA 203 I/O 256FBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A54SX16A-1PQ208M |
|
Hersteller: Microchip Technology
Description: IC FPGA 175 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1452
Part Status: Obsolete
Number of I/O: 175
Description: IC FPGA 175 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.25V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1452
Part Status: Obsolete
Number of I/O: 175
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APA1000-BG456M |
|
Hersteller: Microchip Technology
Description: IC FPGA 356 I/O 456BGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.3V ~ 2.7V
Supplier Device Package: 456-PBGA (35x35)
Total RAM Bits: 202752
Number of I/O: 356
DigiKey Programmable: Not Verified
Description: IC FPGA 356 I/O 456BGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 2.3V ~ 2.7V
Supplier Device Package: 456-PBGA (35x35)
Total RAM Bits: 202752
Number of I/O: 356
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APTGL60H120T3G |
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 80A 280W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 80 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 280 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 2.77 nF @ 25 V
Description: IGBT MODULE 1200V 80A 280W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 80 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 280 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 2.77 nF @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APT30DF100HJ |
|
Hersteller: Microchip Technology
Description: BRIDGE RECT 1P 1KV 45A SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227
Voltage - Peak Reverse (Max): 1 kV
Current - Average Rectified (Io): 45 A
Voltage - Forward (Vf) (Max) @ If: 3 V @ 30 A
Current - Reverse Leakage @ Vr: 100 µA @ 1000 V
Description: BRIDGE RECT 1P 1KV 45A SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227
Voltage - Peak Reverse (Max): 1 kV
Current - Average Rectified (Io): 45 A
Voltage - Forward (Vf) (Max) @ If: 3 V @ 30 A
Current - Reverse Leakage @ Vr: 100 µA @ 1000 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APT30DF20HJ |
|
Hersteller: Microchip Technology
Description: BRIDGE RECT 1P 200V 45A SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227
Voltage - Peak Reverse (Max): 200 V
Current - Average Rectified (Io): 45 A
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 250 µA @ 200 V
Description: BRIDGE RECT 1P 200V 45A SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227
Voltage - Peak Reverse (Max): 200 V
Current - Average Rectified (Io): 45 A
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 250 µA @ 200 V
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| APT50DF170HJ |
Hersteller: Microchip Technology
Description: BRIDGE RECT 1P 1.7KV 50A SOT227
Packaging: Tube
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227 (ISOTOP®)
Part Status: Active
Voltage - Peak Reverse (Max): 1.7 kV
Current - Average Rectified (Io): 50 A
Voltage - Forward (Vf) (Max) @ If: 2.2 V @ 50 A
Current - Reverse Leakage @ Vr: 250 µA @ 1700 V
Description: BRIDGE RECT 1P 1.7KV 50A SOT227
Packaging: Tube
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227 (ISOTOP®)
Part Status: Active
Voltage - Peak Reverse (Max): 1.7 kV
Current - Average Rectified (Io): 50 A
Voltage - Forward (Vf) (Max) @ If: 2.2 V @ 50 A
Current - Reverse Leakage @ Vr: 250 µA @ 1700 V
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 46.53 EUR |
| APT40GL120JU3 |
|
Hersteller: Microchip Technology
Description: IGBT MOD 1200V 65A 220W SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis, Stud Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
NTC Thermistor: No
Supplier Device Package: SOT-227
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 220 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
Description: IGBT MOD 1200V 65A 220W SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis, Stud Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
NTC Thermistor: No
Supplier Device Package: SOT-227
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 220 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APTGF150A60T3AG |
|
Hersteller: Microchip Technology
Description: IGBT MODULE 600V 230A 833W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 200A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: NPT
Part Status: Obsolete
Current - Collector (Ic) (Max): 230 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 833 W
Current - Collector Cutoff (Max): 350 µA
Input Capacitance (Cies) @ Vce: 9 nF @ 25 V
Description: IGBT MODULE 600V 230A 833W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 200A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: NPT
Part Status: Obsolete
Current - Collector (Ic) (Max): 230 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 833 W
Current - Collector Cutoff (Max): 350 µA
Input Capacitance (Cies) @ Vce: 9 nF @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APTGF50DH120T3G |
|
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 70A 312W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Asymmetrical Bridge
Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: NPT
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 312 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 3.45 nF @ 25 V
Description: IGBT MODULE 1200V 70A 312W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Asymmetrical Bridge
Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: NPT
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 312 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 3.45 nF @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APTGF50DSK120T3G |
|
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 70A 312W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual Buck Chopper
Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: NPT
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 312 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 3.45 nF @ 25 V
Description: IGBT MODULE 1200V 70A 312W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual Buck Chopper
Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: NPT
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 312 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 3.45 nF @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APTGL120TDU120TPG |
|
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 140A 517W SP6P
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Triple, Dual - Common Source
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 100A
NTC Thermistor: Yes
Supplier Device Package: SP6-P
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 140 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 517 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 6.2 nF @ 25 V
Description: IGBT MODULE 1200V 140A 517W SP6P
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Triple, Dual - Common Source
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 100A
NTC Thermistor: Yes
Supplier Device Package: SP6-P
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 140 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 517 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 6.2 nF @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APTGL40H120T1G |
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 65A 220W SP1
Packaging: Bulk
Package / Case: SP1
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
NTC Thermistor: Yes
Supplier Device Package: SP1
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 220 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
Description: IGBT MODULE 1200V 65A 220W SP1
Packaging: Bulk
Package / Case: SP1
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
NTC Thermistor: Yes
Supplier Device Package: SP1
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 220 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APTGL40X120T3G |
|
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 65A 220W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 220 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
Description: IGBT MODULE 1200V 65A 220W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 220 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APTGL90A120T1G |
|
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 110A 385W SP1
Packaging: Bulk
Package / Case: SP1
Mounting Type: Through Hole
Input: Standard
Configuration: Half Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP1
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
Description: IGBT MODULE 1200V 110A 385W SP1
Packaging: Bulk
Package / Case: SP1
Mounting Type: Through Hole
Input: Standard
Configuration: Half Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP1
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APTGL90DA120T1G |
|
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 110A 385W SP1
Packaging: Bulk
Package / Case: SP1
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP1
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
Description: IGBT MODULE 1200V 110A 385W SP1
Packaging: Bulk
Package / Case: SP1
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP1
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APT90DR160HJ |
|
Hersteller: Microchip Technology
Description: BRIDGE RECT 1PHASE 1.6KV SOT-227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227
Voltage - Peak Reverse (Max): 1.6 kV
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 90 A
Current - Reverse Leakage @ Vr: 50 µA @ 1600 V
Description: BRIDGE RECT 1PHASE 1.6KV SOT-227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227
Voltage - Peak Reverse (Max): 1.6 kV
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 90 A
Current - Reverse Leakage @ Vr: 50 µA @ 1600 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| APTGL90DDA120T3G |
|
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 110A 385W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual Boost Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
Description: IGBT MODULE 1200V 110A 385W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual Boost Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
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| APTGL90DSK120T3G |
|
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 110A 385W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual Buck Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
Description: IGBT MODULE 1200V 110A 385W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual Buck Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
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| APTGL90H120T3G |
|
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 110A 385W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
Description: IGBT MODULE 1200V 110A 385W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
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| APTGT200DA60T3AG |
|
Hersteller: Microchip Technology
Description: IGBT MODULE 600V 290A 750W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 200A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 290 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 750 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 12.3 nF @ 25 V
Description: IGBT MODULE 600V 290A 750W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 200A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 290 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 750 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 12.3 nF @ 25 V
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| APTGT200SK60T3AG |
|
Hersteller: Microchip Technology
Description: IGBT MODULE 600V 290A 750W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 200A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 290 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 750 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 12.3 nF @ 25 V
Description: IGBT MODULE 600V 290A 750W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 200A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 290 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 750 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 12.3 nF @ 25 V
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| APTGT20TL601G |
|
Hersteller: Microchip Technology
Description: IGBT MODULE 600V 32A 62W SP1
Packaging: Bulk
Package / Case: SP1
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Level Inverter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 20A
NTC Thermistor: No
Supplier Device Package: SP1
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 32 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 62 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.1 pF @ 25 V
Description: IGBT MODULE 600V 32A 62W SP1
Packaging: Bulk
Package / Case: SP1
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Level Inverter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 20A
NTC Thermistor: No
Supplier Device Package: SP1
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 32 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 62 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.1 pF @ 25 V
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| APT60DF20HJ |
|
Hersteller: Microchip Technology
Description: BRIDGE RECT 1P 200V 90A SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227
Voltage - Peak Reverse (Max): 200 V
Current - Average Rectified (Io): 90 A
Voltage - Forward (Vf) (Max) @ If: 1.15 V @ 60 A
Current - Reverse Leakage @ Vr: 250 µA @ 200 V
Description: BRIDGE RECT 1P 200V 90A SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227
Voltage - Peak Reverse (Max): 200 V
Current - Average Rectified (Io): 90 A
Voltage - Forward (Vf) (Max) @ If: 1.15 V @ 60 A
Current - Reverse Leakage @ Vr: 250 µA @ 200 V
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| APT75DF170HJ |
|
Hersteller: Microchip Technology
Description: BRIDGE RECT 1P 1.7KV 75A SOT227
Description: BRIDGE RECT 1P 1.7KV 75A SOT227
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| APT75DL120HJ |
|
Hersteller: Microchip Technology
Description: BRIDGE RECT 1P 1.2KV 75A SOT227
Description: BRIDGE RECT 1P 1.2KV 75A SOT227
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| APT40GL120JU2 |
|
Hersteller: Microchip Technology
Description: IGBT MOD 1200V 65A 220W SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis, Stud Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
NTC Thermistor: No
Supplier Device Package: SOT-227
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 220 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
Description: IGBT MOD 1200V 65A 220W SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis, Stud Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
NTC Thermistor: No
Supplier Device Package: SOT-227
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 220 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
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| APT13F120S |
|
Hersteller: Microchip Technology
Description: MOSFET N-CH 1200V 14A D3PAK
Description: MOSFET N-CH 1200V 14A D3PAK
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| APT14F100S |
|
Hersteller: Microchip Technology
Description: MOSFET N-CH 1000V 14A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 14A (Tc)
Rds On (Max) @ Id, Vgs: 980mOhm @ 7A, 10V
Power Dissipation (Max): 500W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 120 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3965 pF @ 25 V
Description: MOSFET N-CH 1000V 14A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 14A (Tc)
Rds On (Max) @ Id, Vgs: 980mOhm @ 7A, 10V
Power Dissipation (Max): 500W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 120 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3965 pF @ 25 V
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| APT17F80S |
|
Hersteller: Microchip Technology
Description: MOSFET N-CH 800V 18A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 18A (Tc)
Rds On (Max) @ Id, Vgs: 580mOhm @ 9A, 10V
Power Dissipation (Max): 500W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 800 V
Gate Charge (Qg) (Max) @ Vgs: 122 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3757 pF @ 25 V
Description: MOSFET N-CH 800V 18A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 18A (Tc)
Rds On (Max) @ Id, Vgs: 580mOhm @ 9A, 10V
Power Dissipation (Max): 500W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 800 V
Gate Charge (Qg) (Max) @ Vgs: 122 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3757 pF @ 25 V
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| APT37F50S |
|
Hersteller: Microchip Technology
Description: MOSFET N-CH 500V 37A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 37A (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 18A, 10V
Power Dissipation (Max): 520W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 145 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5710 pF @ 25 V
Description: MOSFET N-CH 500V 37A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 37A (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 18A, 10V
Power Dissipation (Max): 520W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 145 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5710 pF @ 25 V
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| APT33N90JCU2 |
Hersteller: Microchip Technology
Description: MOSFET N-CH 900V 33A SOT227
Packaging: Tray
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 33A (Tc)
Rds On (Max) @ Id, Vgs: 120mOhm @ 26A, 10V
Power Dissipation (Max): 290W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 3mA
Supplier Device Package: SOT-227
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 270 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6800 pF @ 100 V
Description: MOSFET N-CH 900V 33A SOT227
Packaging: Tray
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 33A (Tc)
Rds On (Max) @ Id, Vgs: 120mOhm @ 26A, 10V
Power Dissipation (Max): 290W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 3mA
Supplier Device Package: SOT-227
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 270 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6800 pF @ 100 V
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