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| Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||||
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| AR 06 HGL-TT | Assmann WSW Components | Description: SOCKET Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 6 Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 19200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 06 HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 6POS TIN | auf Bestellung 2315 Stücke: Lieferzeit 10-14 Tag (e) | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 06 HZL-TT | Assmann WSW Components | Conn DIP Socket SKT 6 POS 2.54mm Solder ST Thru-Hole Tube | auf Bestellung 12641 Stücke: Lieferzeit 14-21 Tag (e) |
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| AR 06 HZL-TT | Assmann WSW Components | Conn DIP Socket SKT 6 POS 2.54mm Solder ST Thru-Hole Tube | auf Bestellung 12641 Stücke: Lieferzeit 14-21 Tag (e) |
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| AR 06 HZL-TT | Assmann WSW Components | Conn DIP Socket SKT 6 POS 2.54mm Solder ST Thru-Hole Tube | auf Bestellung 6800 Stücke: Lieferzeit 14-21 Tag (e) |
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| AR 06-HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 6POS TIN Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active | auf Bestellung 15899 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 06-HZL/01-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 6POS GOLD Part Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic, Polyester Termination: Solder Number of Positions or Pins (Grid): 6 (2 x 3) Operating Temperature: -40°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube | auf Bestellung 11983 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 06-HZL/07-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 6POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active | auf Bestellung 3034 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 06-ST/T | Assmann WSW Components | IC-Sockets Turned Contacts, THT, 6pin | Produkt ist nicht verfügbar | Mindestbestellmenge: 14400 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 08 HGL-TT | Assmann WSW Components | Description: SOCKET Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 14400 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 08 HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 8POS TIN | auf Bestellung 13819 Stücke: Lieferzeit 10-14 Tag (e) | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 08 HZL-TT | Assmann WSW Components | Conn IC Socket SKT 8 POS 2.54mm Solder ST Thru-Hole | auf Bestellung 4500 Stücke: Lieferzeit 14-21 Tag (e) |
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| AR 08 HZL-TT | Assmann WSW Components | Conn IC Socket SKT 8 POS 2.54mm Solder ST Thru-Hole | auf Bestellung 19876 Stücke: Lieferzeit 14-21 Tag (e) |
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| AR 08 HZL-TT | Assmann | AR 08 HZL-TT Панельки для мікросхем та транзисторів | Produkt ist nicht verfügbar | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 08 HZL-TT | Assmann WSW Components | Conn IC Socket SKT 8 POS 2.54mm Solder ST Thru-Hole | Produkt ist nicht verfügbar | Mindestbestellmenge: 180 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 08 HZL-TT | Assmann WSW Components | Conn IC Socket SKT 8 POS 2.54mm Solder ST Thru-Hole | auf Bestellung 19825 Stücke: Lieferzeit 14-21 Tag (e) |
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| AR 08 HZL/01-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 8POS GOLD | auf Bestellung 4103 Stücke: Lieferzeit 10-14 Tag (e) | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 08 HZW/TN | Assmann WSW Components | Description: CONN IC DIP SOCKET 8POS GOLD | auf Bestellung 1150 Stücke: Lieferzeit 10-14 Tag (e) | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 08-HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 8POS TIN Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active | auf Bestellung 27501 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 08-HZL/01-TT | Assmann WSW Components | Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole Tube | auf Bestellung 250 Stücke: Lieferzeit 14-21 Tag (e) | Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 08-HZL/01-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 8POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active | auf Bestellung 11964 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 08-HZL/01-TT | Assmann WSW Components | Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole Tube | Produkt ist nicht verfügbar | Mindestbestellmenge: 14400 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 08-HZW/TN | Assmann WSW Components | Description: CONN IC DIP SOCKET 8POS GOLD Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -40°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Part Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic, Polyester Termination: Wire Wrap | Produkt ist nicht verfügbar | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 08-ST/T | Assmann WSW Components | Description: PIN HEADER DIL-SYSTEM, PIN: 11.9 Packaging: Tube Connector Type: DIP, DIL - Header Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 8 Pitch: 0.100" (2.54mm) Contact Type: Post Row Spacing: 0.300" (7.62mm) Termination: Solder Contact Finish Thickness: FLASH Part Status: Active Number of Rows: 2 | auf Bestellung 4876 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 10 HGL-TT | Assmann WSW Components | Description: SOCKET Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 11520 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 10 HZL-TT | Assmann WSW Components | Conn DIP Socket SKT 10 POS 2.54mm Solder ST Thru-Hole Tube | auf Bestellung 46 Stücke: Lieferzeit 14-21 Tag (e) | Mindestbestellmenge: 46 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 10 HZL-TT | Assmann WSW Components | Description: IC SOCKET 10 PIN MACH CONT | Produkt ist nicht verfügbar | Mindestbestellmenge: 45 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 10-ST/T | Assmann WSW Components | IC-Sockets Turned Contacts, THT, 6pin | Produkt ist nicht verfügbar | Mindestbestellmenge: 8640 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 14 HGL-TT | Assmann WSW Components | Description: SOCKET Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 8160 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 14 HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 14POS TIN | auf Bestellung 8856 Stücke: Lieferzeit 10-14 Tag (e) | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 14-HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 14POS TIN Part Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic, Polyester Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -40°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube | auf Bestellung 8750 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 14-HZL/01-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 14POS GOLD Part Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic, Polyester Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -40°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube | auf Bestellung 8288 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 14-HZL/07-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 14POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active | auf Bestellung 2966 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 14-HZW/TN | Assmann WSW Components | Description: CONN IC DIP SOCKET 14POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Wire Wrap Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active | auf Bestellung 294 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 14-ST/T | Assmann WSW Components | IC-Sockets Turned Contacts, THT, 6pin | Produkt ist nicht verfügbar | Mindestbestellmenge: 272 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 16 HGL-TT | Assmann WSW Components | Description: SOCKET Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 5017 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 16 HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 16POS TIN | auf Bestellung 3008 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 16 HZL/01-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 16POS GOLD | auf Bestellung 2090 Stücke: Lieferzeit 10-14 Tag (e) | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 16-HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 16POS TIN Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active | auf Bestellung 7605 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 16-HZL/01-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 16POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper | auf Bestellung 4301 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 16-HZL/07-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 16POS GOLD | auf Bestellung 1976 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 16-HZW/TN | Assmann WSW Components | Description: CONN IC DIP SOCKET 16POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Wire Wrap Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper | Produkt ist nicht verfügbar | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 16-ST/T | Assmann WSW Components | Conn IC Socket PIN 16 POS 2.54mm Solder ST Thru-Hole Tube | Produkt ist nicht verfügbar | Mindestbestellmenge: 203 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 18 HGL-TT | Assmann WSW Components | Description: SOCKET Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 6240 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 18 HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 18POS TIN | auf Bestellung 5721 Stücke: Lieferzeit 10-14 Tag (e) | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 18-HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 18POS TIN Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic, Polyester Termination: Solder Number of Positions or Pins (Grid): 18 (2 x 9) Operating Temperature: -40°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin | auf Bestellung 495 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 18-HZW/TN | Assmann WSW Components | Description: CONN IC DIP SOCKET 18POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Wire Wrap Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper | Produkt ist nicht verfügbar | Mindestbestellmenge: 5824 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 20 HGL-TT | Assmann WSW Components | Description: SOCKET Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 5520 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 20 HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 20POS TIN | auf Bestellung 1992 Stücke: Lieferzeit 10-14 Tag (e) | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 20-HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 20POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active | auf Bestellung 4458 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 20-HZL/01-TT | Assmann WSW Components | Description: SOCKET Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -40°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk | Produkt ist nicht verfügbar | Mindestbestellmenge: 20010 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 20-HZW/TN | Assmann WSW Components | Description: CONN IC DIP SOCKET 20POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Wire Wrap Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper | auf Bestellung 5015 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 22-HGL-TT | Assmann WSW Components | Description: SOCKET Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 22 Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 5016 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 22-HGL/7-TT | Assmann WSW Components | Description: SOCKET Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Brass Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 504 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 22-HZL-TT | Assmann WSW Components | Description: SOCKET Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 22 (2 x 11) Operating Temperature: -40°C ~ 105°C | Produkt ist nicht verfügbar | Mindestbestellmenge: 3360 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 22-HZL/01/7-TT | Assmann WSW Components | Description: SOCKET Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Brass Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 504 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 22-HZL/07/7-TT | Assmann WSW Components | Description: SOCKET Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Brass Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 504 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 22-HZL/7-TT | Assmann WSW Components | Description: SOCKET Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Brass Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 504 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 24 HGL-TT | Assmann WSW Components | Description: SOCKET Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 4800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 24 HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 24POS TIN | auf Bestellung 1773 Stücke: Lieferzeit 10-14 Tag (e) | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 24-HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 24POS TIN Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic, Polyester Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -40°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube | auf Bestellung 9266 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 24-HZL/01-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 24POS GOLD | auf Bestellung 1390 Stücke: Lieferzeit 10-14 Tag (e) | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 24-HZL/01/7-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 24POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper | auf Bestellung 1285 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 24-HZL/07/7-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 24POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper | Produkt ist nicht verfügbar | Mindestbestellmenge: 4800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 24-HZW/TN | Assmann WSW Components | Description: CONN IC DIP SOCKET 24POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Wire Wrap Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper | Produkt ist nicht verfügbar | Mindestbestellmenge: 4480 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 24-ST/T | Assmann WSW Components | Description: PIN HEADER DIL-SYSTEM, PIN: 11.9 Packaging: Tube Connector Type: DIP, DIL - Header Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 24 Pitch: 0.100" (2.54mm) Contact Type: Post Row Spacing: 0.600" (15.24mm) Termination: Solder Contact Finish Thickness: FLASH Part Status: Active Number of Rows: 2 | auf Bestellung 268 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 252/I Produktcode: 108668
zu Favoriten hinzufügen
Lieblingsprodukt
| APAR | Aktive Bauelemente > Sensoren | Produkt ist nicht verfügbar
| Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 252/LCD/I Produktcode: 108676
zu Favoriten hinzufügen
Lieblingsprodukt
| APAR | Aktive Bauelemente > Sensoren | Produkt ist nicht verfügbar
| Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 28 HGL-TT | Assmann WSW Components | Description: SOCKET Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 4080 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 28 HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 28POS TIN | auf Bestellung 5561 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 28 HZL/7-TT | Assmann WSW Components | Description: IC SOCKET 28 PIN MACH CONT | Produkt ist nicht verfügbar | Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 28-HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 28POS TIN Part Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic, Polyester Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -40°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube | auf Bestellung 1181 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 28-HZL/01-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 28POS GOLD Part Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic, Polyester Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -40°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube | auf Bestellung 9682 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 28-HZL/01/7-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 28POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active | auf Bestellung 10964 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 28-HZL/07-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 28POS GOLD Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic, Polyester Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -40°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin | Produkt ist nicht verfügbar | Mindestbestellmenge: 4080 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 28-HZL/07/7-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 28POS GOLD Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic, Polyester Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -40°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube | Produkt ist nicht verfügbar | Mindestbestellmenge: 4080 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 28-HZL/7-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 28POS TIN | Produkt ist nicht verfügbar | Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 28-HZW/TN | Assmann WSW Components | Description: CONN IC DIP SOCKET 28POS GOLD Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic, Polyester Termination: Wire Wrap Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -40°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper | Produkt ist nicht verfügbar | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 28-ST/T | Assmann WSW Components | SUPPORT DIL 28pts | Produkt ist nicht verfügbar | Mindestbestellmenge: 119 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 28-ST/T | Assmann WSW Components | Description: PIN HEADER Number of Rows: 2 Contact Finish Thickness: FLASH Termination: Solder Row Spacing: 0.600" (15.24mm) Contact Type: Male Pin Pitch: 0.100" (2.54mm) Number of Positions: 28 Mounting Type: Through Hole Color: Black Contact Finish: Gold Connector Type: DIP, DIL - Header Packaging: Bulk | Produkt ist nicht verfügbar | Mindestbestellmenge: 119 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 32 HGL-TT | Assmann WSW Components | Description: SOCKET Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 32 Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 6720 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 32 HZL-TT | Assmann WSW Components | Conn IC Socket SKT 32 POS 2.54mm Solder ST Thru-Hole Tube | auf Bestellung 339 Stücke: Lieferzeit 14-21 Tag (e) |
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| AR 32 HZL-TT | Assmann WSW Components | Conn IC Socket SKT 32 POS 2.54mm Solder ST Thru-Hole Tube | auf Bestellung 339 Stücke: Lieferzeit 14-21 Tag (e) |
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| AR 32 HZL-TT | Assmann WSW Components | Conn IC Socket SKT 32 POS 2.54mm Solder ST Thru-Hole Tube | auf Bestellung 1288 Stücke: Lieferzeit 14-21 Tag (e) |
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| AR 32 HZL-TT | Assmann WSW Components | Description: IC SOCKET 32 PIN MACH CONT | Produkt ist nicht verfügbar | Mindestbestellmenge: 14 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 32-HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 32POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active | Produkt ist nicht verfügbar | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 32-HZL/01-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 32POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper | auf Bestellung 1868 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 32-HZL/07-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 32POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper | Produkt ist nicht verfügbar | Mindestbestellmenge: 6720 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 36-HGL-TT | Assmann WSW Components | Description: SOCKET Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 36 (2 x 18) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 6240 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 40 HGL-TT | Assmann WSW Components | Description: SOCKET Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 5760 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 40 HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 40POS TIN | auf Bestellung 10754 Stücke: Lieferzeit 10-14 Tag (e) | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 40-HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 40POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active | auf Bestellung 4837 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 40-HZL/07-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 40POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper | Produkt ist nicht verfügbar | Mindestbestellmenge: 5760 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 40-HZW/TN | Assmann WSW Components | Description: CONN IC DIP SOCKET 40POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Wire Wrap Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper | Produkt ist nicht verfügbar | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 40-HZW/TN Produktcode: 176687
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Lieblingsprodukt
| Steckverbinder, Reihenklemmen > Plattenverbinder | Produkt ist nicht verfügbar
| Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
| AR 42-HGL-TT | Assmann WSW Components | Description: SOCKET Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 5280 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 48 HGL-TT | Assmann WSW Components | Description: SOCKET Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass | Produkt ist nicht verfügbar | Mindestbestellmenge: 4320 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 48-HZL-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 48POS TIN Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper | auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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| AR 48-HZL/01-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 48POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper | Produkt ist nicht verfügbar | Mindestbestellmenge: 9999 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| AR 48-HZL/07-TT | Assmann WSW Components | Description: CONN IC DIP SOCKET 48POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper | Produkt ist nicht verfügbar | Mindestbestellmenge: 4320 Stücke Im Einkaufswagen Stück im Wert von UAH |
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