Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35397) > Seite 158 nach 590
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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MDE6IC7120GNR1 | NXP USA Inc. |
Description: IC AMP W-CDMA 728-768MHZ TO270 Packaging: Tape & Reel (TR) Package / Case: TO-270-16 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 728MHz ~ 768MHz RF Type: W-CDMA Voltage - Supply: 28V Gain: 34.4dB P1dB: 50.8dBm Supplier Device Package: TO-270 WBL-16 GULL |
Produkt ist nicht verfügbar |
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MPC603RVG200LC | NXP USA Inc. |
Description: IC MPU MPC6XX 200MHZ 255FCCBGA Packaging: Tray Package / Case: 255-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 200MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC 603e Voltage - I/O: 3.3V Supplier Device Package: 255-FCCBGA (21x21) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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MPC8544COMEDEV | NXP USA Inc. |
Description: MPC8544E EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: e500 Board Type: Evaluation Platform Utilized IC / Part: MPC8544E Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MRF6V12500HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 1.03GHz Power - Output: 500W Gain: 19.7dB Technology: LDMOS Supplier Device Package: NI-780H-2L Part Status: Active Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 200 mA |
auf Bestellung 37 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF6V12500HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 1.03GHz Power - Output: 500W Gain: 19.7dB Technology: LDMOS Supplier Device Package: NI-780S Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 200 mA |
Produkt ist nicht verfügbar |
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MRF8S21200HR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 2.14GHz Configuration: Dual Power - Output: 48W Gain: 18.1dB Technology: LDMOS Supplier Device Package: NI-1230 Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.4 A |
Produkt ist nicht verfügbar |
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MRF8S9260HSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI880S Packaging: Tape & Reel (TR) Package / Case: NI-880S Mounting Type: Surface Mount Frequency: 960MHz Power - Output: 75W Gain: 18.6dB Technology: LDMOS Supplier Device Package: NI-880S Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 1.7 A |
Produkt ist nicht verfügbar |
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MSC8156EADS | NXP USA Inc. | Description: MSC8156 EVAL BRD |
Produkt ist nicht verfügbar |
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MW7IC915NT1 | NXP USA Inc. |
Description: IC AMP W-CDMA 728-960MHZ 24QFN Packaging: Tape & Reel (TR) Package / Case: 24-PowerQFN Mounting Type: Surface Mount Frequency: 728MHz ~ 960MHz RF Type: W-CDMA Voltage - Supply: 28V Gain: 38dB P1dB: 15.5W Supplier Device Package: 24-PQFN (8x8) Part Status: Active |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XEQ512J3MAG | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 119 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912XEQ512J3MAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912XET256J2MAA | NXP USA Inc. | Description: IC MCU 16BIT 256KB FLASH 80QFP |
auf Bestellung 417 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XET256J2MAG | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 119 |
Produkt ist nicht verfügbar |
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S9S12C128J2VFAER | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Not For New Designs Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12Q12J2VFAE1R | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 128KB (128K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Not For New Designs Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12XS256J0VAE | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 256KB (256K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 44 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12XS256J0VAER | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 256KB (256K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 44 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SGMII-PEX-RISER | NXP USA Inc. |
Description: PHY RISER CARD SGMII/PEX Packaging: Box For Use With/Related Products: P4080 Accessory Type: Interface Board |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MC8640DTHX1067NE | NXP USA Inc. |
Description: IC MPU MPC86XX 1.067GHZ 1023BGA Packaging: Tray Package / Case: 1023-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.067GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e600 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 1023-FCCBGA (33x33) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HSSI, I2C, RapidIO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC8640VU1000HE | NXP USA Inc. | Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA |
Produkt ist nicht verfügbar |
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MC8641DTVU1333JE | NXP USA Inc. | Description: IC MPU MPC86XX 1.333GHZ 1023BGA |
Produkt ist nicht verfügbar |
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MC8641DVU1333JE | NXP USA Inc. | Description: IC MPU MPC86XX 1.333GHZ 1023BGA |
Produkt ist nicht verfügbar |
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MPC8572ECLPXATLD | NXP USA Inc. | Description: IC MPU MPC85XX 1.2GHZ 1023FCBGA |
Produkt ist nicht verfügbar |
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MPC8572ECLPXAULD | NXP USA Inc. | Description: IC MPU MPC85XX 1.333GHZ 1023BGA |
Produkt ist nicht verfügbar |
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MPC8572ECLVTAULD | NXP USA Inc. |
Description: IC MPU MPC85XX 1.333GHZ 1023BGA Packaging: Box Package / Case: 1023-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Supplier Device Package: 1023-FCBGA (33x33) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, HSSI, I2C, RapidIO |
Produkt ist nicht verfügbar |
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MRF8S7120NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-2 Packaging: Tape & Reel (TR) Package / Case: OM-780-2 Mounting Type: Surface Mount Frequency: 768MHz Power - Output: 32W Gain: 19.2dB Technology: LDMOS Supplier Device Package: OM-780-2 Part Status: Obsolete Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 600 mA |
Produkt ist nicht verfügbar |
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MRF8P20160HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780-4 Mounting Type: Chassis Mount Frequency: 1.92GHz Configuration: Dual Power - Output: 37W Gain: 16.5dB Technology: LDMOS Supplier Device Package: NI-780-4 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 550 mA |
Produkt ist nicht verfügbar |
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MRF8P20160HSR3 | NXP USA Inc. | Description: FET RF 2CH 65V 1.92GHZ |
Produkt ist nicht verfügbar |
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MRF8P20160HSR5 | NXP USA Inc. | Description: FET RF 2CH 65V 1.92GHZ |
Produkt ist nicht verfügbar |
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MRF8S26060HR3 | NXP USA Inc. | Description: FET RF 65V 2.69GHZ |
Produkt ist nicht verfügbar |
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MRF8S26060HSR3 | NXP USA Inc. |
Description: FET RF 65V 2.69GHZ Packaging: Tape & Reel (TR) Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 2.69GHz Power - Output: 15.5W Gain: 16.3dB Technology: LDMOS Supplier Device Package: NI-400S-2S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 450 mA |
Produkt ist nicht verfügbar |
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MRF8S26060HSR5 | NXP USA Inc. |
Description: FET RF 65V 2.69GHZ Packaging: Tape & Reel (TR) Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 2.69GHz Power - Output: 15.5W Gain: 16.3dB Technology: LDMOS Supplier Device Package: NI-400S-2S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 450 mA |
Produkt ist nicht verfügbar |
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TDA8954TH/N1,118 | NXP USA Inc. |
Description: IC AMP D MONO/STEREO 420W 24HSOP Packaging: Tape & Reel (TR) Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: ±12.5V ~ 42.5V Max Output Power x Channels @ Load: 420W x 1 @ 8Ohm; 210W x 2 @ 4Ohm Supplier Device Package: 24-HSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TDA8954TH/N1,118 | NXP USA Inc. |
Description: IC AMP D MONO/STEREO 420W 24HSOP Packaging: Cut Tape (CT) Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: ±12.5V ~ 42.5V Max Output Power x Channels @ Load: 420W x 1 @ 8Ohm; 210W x 2 @ 4Ohm Supplier Device Package: 24-HSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC5125YVN400 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 324PBGA Packaging: Tray Package / Case: 324-BBGA Mounting Type: Surface Mount Speed: 400MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: External Program Memory Type: ROMless Core Processor: e300 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG Peripherals: DMA, WDT Supplier Device Package: 324-PBGA (23x23) Number of I/O: 64 DigiKey Programmable: Not Verified |
auf Bestellung 800 Stücke: Lieferzeit 10-14 Tag (e) |
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DAC1408D750W1/DB,598 | NXP USA Inc. | Description: BOARD DEMO DAC1408D750 |
Produkt ist nicht verfügbar |
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ADC1413D125WO/DB,598 | NXP USA Inc. |
Description: BOARD DEMO FOR ADC1413D125 Packaging: Box Number of Bits: 14 Data Interface: Serial JESD204A, SPI™ Sampling Rate (Per Second): 125M Utilized IC / Part: ADC1413D125 Supplied Contents: Board(s) Number of A/D Converters: 2 Input Range: 1 ~ 2Vpp Power (Typ) @ Conditions: 1.27W @ 125MSPS |
Produkt ist nicht verfügbar |
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ADC1415S125/DB,598 | NXP USA Inc. |
Description: BOARD DEMO FOR ADC1415S125 Packaging: Box Number of Bits: 14 Data Interface: SPI Sampling Rate (Per Second): 125M Utilized IC / Part: ADC1415S125 Supplied Contents: Board(s) Number of A/D Converters: 1 Input Range: 1 ~ 2Vpp Power (Typ) @ Conditions: 840mW @ 125MSPS |
Produkt ist nicht verfügbar |
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ADC1613D125HN/C1,5 | NXP USA Inc. | Description: IC ADC 16BIT PIPELINED 56HVQFN |
Produkt ist nicht verfügbar |
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ADC1413D125HN/C1,5 | NXP USA Inc. |
Description: IC ADC 14BIT PIPELINED 56HVQFN Packaging: Tray Features: Simultaneous Sampling Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Number of Bits: 14 Configuration: S/H-ADC Data Interface: JESD204A Reference Type: External, Internal Operating Temperature: -40°C ~ 85°C Voltage - Supply, Analog: 2.85V ~ 3.4V Voltage - Supply, Digital: 1.65V ~ 1.95V Sampling Rate (Per Second): 125M Input Type: Differential, Single Ended Number of Inputs: 2 Supplier Device Package: 56-HVQFN (8x8) Architecture: Pipelined Ratio - S/H:ADC: 1:1 Number of A/D Converters: 2 |
Produkt ist nicht verfügbar |
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MMA7331LCT | NXP USA Inc. | Description: ACCELEROMETER 4-9G ANALOG 14LGA |
Produkt ist nicht verfügbar |
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MMA7361LCT | NXP USA Inc. |
Description: ACCEL 1.5-6G ANALOG 14LGA Packaging: Tray Features: Selectable Scale, Sleep Mode Package / Case: 14-TFLGA Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X, Y, Z Acceleration Range: ±1.5g, 6g Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.2V ~ 3.6V Bandwidth: 400Hz (X,Y), 300Hz (Z) Supplier Device Package: 14-LGA (3x5) Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g) |
Produkt ist nicht verfügbar |
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BGD704/09,112 | NXP USA Inc. | Description: IC AMP MODULE 750MHZ SOT115J |
Produkt ist nicht verfügbar |
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ON4970,115 | NXP USA Inc. |
Description: MOSFET RF SOT-223 Packaging: Tape & Reel (TR) Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Supplier Device Package: SC-73 |
Produkt ist nicht verfügbar |
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BGD802/02,112 | NXP USA Inc. |
Description: IC AMP CATV SOT115J Packaging: Tube Package / Case: SOT-115J Mounting Type: Chassis Mount Applications: CATV Supplier Device Package: SOT115J Number of Circuits: 1 Current - Supply: 395 mA |
Produkt ist nicht verfügbar |
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BUK7524-55,127 | NXP USA Inc. |
Description: MOSFET N-CH 55V 45A TO220AB Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 45A (Tc) Rds On (Max) @ Id, Vgs: 24mOhm @ 25A, 10V Power Dissipation (Max): 103W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: TO-220AB Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 55 V Input Capacitance (Ciss) (Max) @ Vds: 1500 pF @ 25 V |
Produkt ist nicht verfügbar |
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BUK9535-55,127 | NXP USA Inc. |
Description: MOSFET N-CH 55V 34A TO220AB Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 34A (Tc) Rds On (Max) @ Id, Vgs: 35mOhm @ 17A, 5V Power Dissipation (Max): 85W (Tc) Vgs(th) (Max) @ Id: 2V @ 1mA Supplier Device Package: TO-220AB Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 5V Vgs (Max): ±10V Drain to Source Voltage (Vdss): 55 V Input Capacitance (Ciss) (Max) @ Vds: 1400 pF @ 25 V |
Produkt ist nicht verfügbar |
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PHD18NQ10T,118 | NXP USA Inc. |
Description: MOSFET N-CH 100V 18A DPAK Packaging: Tape & Reel (TR) Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 18A (Tc) Rds On (Max) @ Id, Vgs: 90mOhm @ 9A, 10V Power Dissipation (Max): 79W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: DPAK Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 100 V Gate Charge (Qg) (Max) @ Vgs: 21 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 633 pF @ 25 V |
Produkt ist nicht verfügbar |
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ON5213,118 | NXP USA Inc. |
Description: MOSFET RF SOT426 D2PAK Packaging: Tape & Reel (TR) Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB Mounting Type: Surface Mount Supplier Device Package: D2PAK Part Status: Obsolete |
Produkt ist nicht verfügbar |
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ON5224,118 | NXP USA Inc. | Description: MOSFET RF SOT426 D2PAK |
Produkt ist nicht verfügbar |
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ON5234,118 | NXP USA Inc. |
Description: MOSFET RF SOT404 D2PAK Packaging: Tape & Reel (TR) Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB Mounting Type: Surface Mount Supplier Device Package: D2PAK |
Produkt ist nicht verfügbar |
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ON5240,118 | NXP USA Inc. | Description: MOSFET RF SOT426 D2PAK |
Produkt ist nicht verfügbar |
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ON5157,127 | NXP USA Inc. |
Description: RF MOSFET TO220AB Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Supplier Device Package: TO-220AB |
Produkt ist nicht verfügbar |
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ON5154,127 | NXP USA Inc. |
Description: RF MOSFET TO220AB Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Supplier Device Package: TO-220AB |
Produkt ist nicht verfügbar |
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ON5173,118 | NXP USA Inc. | Description: MOSFET RF SOT404 D2PAK |
Produkt ist nicht verfügbar |
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ON5250,135 | NXP USA Inc. |
Description: RF MOSFET SC73 Packaging: Tape & Reel (TR) Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Supplier Device Package: SC-73 |
Produkt ist nicht verfügbar |
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BUK1M200-50SGTD,51 | NXP USA Inc. |
Description: IC PWR DRIVER N-CHANNEL 1:1 20SO Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 4 Interface: On/Off Switch Type: General Purpose Operating Temperature: 150°C (TJ) Output Configuration: Low Side Rds On (Typ): 150mOhm Input Type: Non-Inverting Voltage - Load: 50V (Max) Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 2.7A Ratio - Input:Output: 1:1 Supplier Device Package: 20-SO Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage |
Produkt ist nicht verfügbar |
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BUK1M200-50SDLD,51 | NXP USA Inc. |
Description: IC PWR DRIVER N-CHANNEL 1:1 20SO Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 4 Interface: On/Off Switch Type: General Purpose Operating Temperature: 150°C (TJ) Output Configuration: Low Side Rds On (Typ): 150mOhm Input Type: Non-Inverting Voltage - Load: 50V (Max) Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 800mA Ratio - Input:Output: 1:1 Supplier Device Package: 20-SO Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage |
Produkt ist nicht verfügbar |
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IP4044CX8/LF,135 | NXP USA Inc. |
Description: FILTER RC(PI) ESD SMD Packaging: Tape & Reel (TR) Package / Case: 8-UFBGA, WLCSP Size / Dimension: 0.059" L x 0.059" W (1.50mm x 1.50mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 47Ohms, 100Ohms, C = 35pF Height: 0.026" (0.65mm) Filter Order: 2nd Applications: Data Lines for Mobile Devices Technology: RC (Pi) Resistance - Channel (Ohms): 47, 100 ESD Protection: Yes Part Status: Obsolete Number of Channels: 3 |
Produkt ist nicht verfügbar |
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IP4065CX11/LF,135 | NXP USA Inc. |
Description: FILTER RC(PI) 33 OHM/27PF SMD Packaging: Tape & Reel (TR) Package / Case: 11-WFBGA, WLCSP Size / Dimension: 0.077" L x 0.058" W (1.97mm x 1.47mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -30°C ~ 85°C Values: R = 33Ohms, C = 27pF Height: 0.026" (0.65mm) Filter Order: 2nd Applications: USB Technology: RC (Pi) Resistance - Channel (Ohms): 33, 1.3k, 17k, 15k ESD Protection: Yes Part Status: Obsolete Number of Channels: 2 |
Produkt ist nicht verfügbar |
MDE6IC7120GNR1 |
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 728-768MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 728MHz ~ 768MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 34.4dB
P1dB: 50.8dBm
Supplier Device Package: TO-270 WBL-16 GULL
Description: IC AMP W-CDMA 728-768MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 728MHz ~ 768MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 34.4dB
P1dB: 50.8dBm
Supplier Device Package: TO-270 WBL-16 GULL
Produkt ist nicht verfügbar
MPC603RVG200LC |
Hersteller: NXP USA Inc.
Description: IC MPU MPC6XX 200MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU MPC6XX 200MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
MPC8544COMEDEV |
Hersteller: NXP USA Inc.
Description: MPC8544E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e500
Board Type: Evaluation Platform
Utilized IC / Part: MPC8544E
Part Status: Obsolete
Description: MPC8544E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e500
Board Type: Evaluation Platform
Utilized IC / Part: MPC8544E
Part Status: Obsolete
Produkt ist nicht verfügbar
MRF6V12500HR5 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Active
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Active
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)MRF6V12500HSR5 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
Produkt ist nicht verfügbar
MRF8S21200HR6 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 2.14GHz
Configuration: Dual
Power - Output: 48W
Gain: 18.1dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 2.14GHz
Configuration: Dual
Power - Output: 48W
Gain: 18.1dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
MRF8S9260HSR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI880S
Packaging: Tape & Reel (TR)
Package / Case: NI-880S
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 75W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: NI-880S
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.7 A
Description: RF MOSFET LDMOS 28V NI880S
Packaging: Tape & Reel (TR)
Package / Case: NI-880S
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 75W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: NI-880S
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.7 A
Produkt ist nicht verfügbar
MW7IC915NT1 |
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 728-960MHZ 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 38dB
P1dB: 15.5W
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Description: IC AMP W-CDMA 728-960MHZ 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 38dB
P1dB: 15.5W
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1000+ | 31.84 EUR |
S912XEQ512J3MAG |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ512J3MAL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XET256J2MAA |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Description: IC MCU 16BIT 256KB FLASH 80QFP
auf Bestellung 417 Stücke:
Lieferzeit 10-14 Tag (e)S912XET256J2MAG |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
Produkt ist nicht verfügbar
S9S12C128J2VFAER |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12Q12J2VFAE1R |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12XS256J0VAE |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12XS256J0VAER |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SGMII-PEX-RISER |
Hersteller: NXP USA Inc.
Description: PHY RISER CARD SGMII/PEX
Packaging: Box
For Use With/Related Products: P4080
Accessory Type: Interface Board
Description: PHY RISER CARD SGMII/PEX
Packaging: Box
For Use With/Related Products: P4080
Accessory Type: Interface Board
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 1239.13 EUR |
MC8640DTHX1067NE |
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.067GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.067GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Part Status: Obsolete
Description: IC MPU MPC86XX 1.067GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.067GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Part Status: Obsolete
Produkt ist nicht verfügbar
MC8640VU1000HE |
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA
Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA
Produkt ist nicht verfügbar
MC8641DTVU1333JE |
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Produkt ist nicht verfügbar
MC8641DVU1333JE |
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Produkt ist nicht verfügbar
MPC8572ECLPXATLD |
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.2GHZ 1023FCBGA
Description: IC MPU MPC85XX 1.2GHZ 1023FCBGA
Produkt ist nicht verfügbar
MPC8572ECLPXAULD |
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
Produkt ist nicht verfügbar
MPC8572ECLVTAULD |
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
Packaging: Box
Package / Case: 1023-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
Packaging: Box
Package / Case: 1023-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Produkt ist nicht verfügbar
MRF8S7120NR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 768MHz
Power - Output: 32W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 600 mA
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 768MHz
Power - Output: 32W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 600 mA
Produkt ist nicht verfügbar
MRF8P20160HR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 1.92GHz
Configuration: Dual
Power - Output: 37W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 550 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 1.92GHz
Configuration: Dual
Power - Output: 37W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 550 mA
Produkt ist nicht verfügbar
MRF8P20160HSR3 |
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 1.92GHZ
Description: FET RF 2CH 65V 1.92GHZ
Produkt ist nicht verfügbar
MRF8P20160HSR5 |
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 1.92GHZ
Description: FET RF 2CH 65V 1.92GHZ
Produkt ist nicht verfügbar
MRF8S26060HSR3 |
Hersteller: NXP USA Inc.
Description: FET RF 65V 2.69GHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 2.69GHz
Power - Output: 15.5W
Gain: 16.3dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
Description: FET RF 65V 2.69GHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 2.69GHz
Power - Output: 15.5W
Gain: 16.3dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
MRF8S26060HSR5 |
Hersteller: NXP USA Inc.
Description: FET RF 65V 2.69GHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 2.69GHz
Power - Output: 15.5W
Gain: 16.3dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
Description: FET RF 65V 2.69GHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 2.69GHz
Power - Output: 15.5W
Gain: 16.3dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
TDA8954TH/N1,118 |
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 420W 24HSOP
Packaging: Tape & Reel (TR)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 42.5V
Max Output Power x Channels @ Load: 420W x 1 @ 8Ohm; 210W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Description: IC AMP D MONO/STEREO 420W 24HSOP
Packaging: Tape & Reel (TR)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 42.5V
Max Output Power x Channels @ Load: 420W x 1 @ 8Ohm; 210W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
TDA8954TH/N1,118 |
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 420W 24HSOP
Packaging: Cut Tape (CT)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 42.5V
Max Output Power x Channels @ Load: 420W x 1 @ 8Ohm; 210W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Description: IC AMP D MONO/STEREO 420W 24HSOP
Packaging: Cut Tape (CT)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 42.5V
Max Output Power x Channels @ Load: 420W x 1 @ 8Ohm; 210W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC5125YVN400 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: e300
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: e300
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 67.36 EUR |
10+ | 51.43 EUR |
25+ | 47.36 EUR |
80+ | 43.44 EUR |
300+ | 42.34 EUR |
DAC1408D750W1/DB,598 |
Hersteller: NXP USA Inc.
Description: BOARD DEMO DAC1408D750
Description: BOARD DEMO DAC1408D750
Produkt ist nicht verfügbar
ADC1413D125WO/DB,598 |
Hersteller: NXP USA Inc.
Description: BOARD DEMO FOR ADC1413D125
Packaging: Box
Number of Bits: 14
Data Interface: Serial JESD204A, SPI™
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1413D125
Supplied Contents: Board(s)
Number of A/D Converters: 2
Input Range: 1 ~ 2Vpp
Power (Typ) @ Conditions: 1.27W @ 125MSPS
Description: BOARD DEMO FOR ADC1413D125
Packaging: Box
Number of Bits: 14
Data Interface: Serial JESD204A, SPI™
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1413D125
Supplied Contents: Board(s)
Number of A/D Converters: 2
Input Range: 1 ~ 2Vpp
Power (Typ) @ Conditions: 1.27W @ 125MSPS
Produkt ist nicht verfügbar
ADC1415S125/DB,598 |
Hersteller: NXP USA Inc.
Description: BOARD DEMO FOR ADC1415S125
Packaging: Box
Number of Bits: 14
Data Interface: SPI
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1415S125
Supplied Contents: Board(s)
Number of A/D Converters: 1
Input Range: 1 ~ 2Vpp
Power (Typ) @ Conditions: 840mW @ 125MSPS
Description: BOARD DEMO FOR ADC1415S125
Packaging: Box
Number of Bits: 14
Data Interface: SPI
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1415S125
Supplied Contents: Board(s)
Number of A/D Converters: 1
Input Range: 1 ~ 2Vpp
Power (Typ) @ Conditions: 840mW @ 125MSPS
Produkt ist nicht verfügbar
ADC1613D125HN/C1,5 |
Hersteller: NXP USA Inc.
Description: IC ADC 16BIT PIPELINED 56HVQFN
Description: IC ADC 16BIT PIPELINED 56HVQFN
Produkt ist nicht verfügbar
ADC1413D125HN/C1,5 |
Hersteller: NXP USA Inc.
Description: IC ADC 14BIT PIPELINED 56HVQFN
Packaging: Tray
Features: Simultaneous Sampling
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: JESD204A
Reference Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.85V ~ 3.4V
Voltage - Supply, Digital: 1.65V ~ 1.95V
Sampling Rate (Per Second): 125M
Input Type: Differential, Single Ended
Number of Inputs: 2
Supplier Device Package: 56-HVQFN (8x8)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 2
Description: IC ADC 14BIT PIPELINED 56HVQFN
Packaging: Tray
Features: Simultaneous Sampling
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: JESD204A
Reference Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.85V ~ 3.4V
Voltage - Supply, Digital: 1.65V ~ 1.95V
Sampling Rate (Per Second): 125M
Input Type: Differential, Single Ended
Number of Inputs: 2
Supplier Device Package: 56-HVQFN (8x8)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 2
Produkt ist nicht verfügbar
MMA7331LCT |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 4-9G ANALOG 14LGA
Description: ACCELEROMETER 4-9G ANALOG 14LGA
Produkt ist nicht verfügbar
MMA7361LCT |
Hersteller: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 14LGA
Packaging: Tray
Features: Selectable Scale, Sleep Mode
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
Description: ACCEL 1.5-6G ANALOG 14LGA
Packaging: Tray
Features: Selectable Scale, Sleep Mode
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
Produkt ist nicht verfügbar
BGD704/09,112 |
Hersteller: NXP USA Inc.
Description: IC AMP MODULE 750MHZ SOT115J
Description: IC AMP MODULE 750MHZ SOT115J
Produkt ist nicht verfügbar
ON4970,115 |
Hersteller: NXP USA Inc.
Description: MOSFET RF SOT-223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Supplier Device Package: SC-73
Description: MOSFET RF SOT-223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Supplier Device Package: SC-73
Produkt ist nicht verfügbar
BGD802/02,112 |
Hersteller: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 395 mA
Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 395 mA
Produkt ist nicht verfügbar
BUK7524-55,127 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 45A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 45A (Tc)
Rds On (Max) @ Id, Vgs: 24mOhm @ 25A, 10V
Power Dissipation (Max): 103W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1500 pF @ 25 V
Description: MOSFET N-CH 55V 45A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 45A (Tc)
Rds On (Max) @ Id, Vgs: 24mOhm @ 25A, 10V
Power Dissipation (Max): 103W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1500 pF @ 25 V
Produkt ist nicht verfügbar
BUK9535-55,127 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 34A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 34A (Tc)
Rds On (Max) @ Id, Vgs: 35mOhm @ 17A, 5V
Power Dissipation (Max): 85W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1400 pF @ 25 V
Description: MOSFET N-CH 55V 34A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 34A (Tc)
Rds On (Max) @ Id, Vgs: 35mOhm @ 17A, 5V
Power Dissipation (Max): 85W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1400 pF @ 25 V
Produkt ist nicht verfügbar
PHD18NQ10T,118 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 18A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 18A (Tc)
Rds On (Max) @ Id, Vgs: 90mOhm @ 9A, 10V
Power Dissipation (Max): 79W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: DPAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 21 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 633 pF @ 25 V
Description: MOSFET N-CH 100V 18A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 18A (Tc)
Rds On (Max) @ Id, Vgs: 90mOhm @ 9A, 10V
Power Dissipation (Max): 79W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: DPAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 21 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 633 pF @ 25 V
Produkt ist nicht verfügbar
ON5213,118 |
Hersteller: NXP USA Inc.
Description: MOSFET RF SOT426 D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Part Status: Obsolete
Description: MOSFET RF SOT426 D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Part Status: Obsolete
Produkt ist nicht verfügbar
ON5234,118 |
Hersteller: NXP USA Inc.
Description: MOSFET RF SOT404 D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Description: MOSFET RF SOT404 D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Produkt ist nicht verfügbar
ON5157,127 |
Hersteller: NXP USA Inc.
Description: RF MOSFET TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
Description: RF MOSFET TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
Produkt ist nicht verfügbar
ON5154,127 |
Hersteller: NXP USA Inc.
Description: RF MOSFET TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
Description: RF MOSFET TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
Produkt ist nicht verfügbar
ON5250,135 |
Hersteller: NXP USA Inc.
Description: RF MOSFET SC73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Supplier Device Package: SC-73
Description: RF MOSFET SC73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Supplier Device Package: SC-73
Produkt ist nicht verfügbar
BUK1M200-50SGTD,51 |
Hersteller: NXP USA Inc.
Description: IC PWR DRIVER N-CHANNEL 1:1 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 150mOhm
Input Type: Non-Inverting
Voltage - Load: 50V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 2.7A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-SO
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Description: IC PWR DRIVER N-CHANNEL 1:1 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 150mOhm
Input Type: Non-Inverting
Voltage - Load: 50V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 2.7A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-SO
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Produkt ist nicht verfügbar
BUK1M200-50SDLD,51 |
Hersteller: NXP USA Inc.
Description: IC PWR DRIVER N-CHANNEL 1:1 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 150mOhm
Input Type: Non-Inverting
Voltage - Load: 50V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 800mA
Ratio - Input:Output: 1:1
Supplier Device Package: 20-SO
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Description: IC PWR DRIVER N-CHANNEL 1:1 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 150mOhm
Input Type: Non-Inverting
Voltage - Load: 50V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 800mA
Ratio - Input:Output: 1:1
Supplier Device Package: 20-SO
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Produkt ist nicht verfügbar
IP4044CX8/LF,135 |
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-UFBGA, WLCSP
Size / Dimension: 0.059" L x 0.059" W (1.50mm x 1.50mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 47Ohms, 100Ohms, C = 35pF
Height: 0.026" (0.65mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 47, 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 3
Description: FILTER RC(PI) ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-UFBGA, WLCSP
Size / Dimension: 0.059" L x 0.059" W (1.50mm x 1.50mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 47Ohms, 100Ohms, C = 35pF
Height: 0.026" (0.65mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 47, 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 3
Produkt ist nicht verfügbar
IP4065CX11/LF,135 |
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 33 OHM/27PF SMD
Packaging: Tape & Reel (TR)
Package / Case: 11-WFBGA, WLCSP
Size / Dimension: 0.077" L x 0.058" W (1.97mm x 1.47mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -30°C ~ 85°C
Values: R = 33Ohms, C = 27pF
Height: 0.026" (0.65mm)
Filter Order: 2nd
Applications: USB
Technology: RC (Pi)
Resistance - Channel (Ohms): 33, 1.3k, 17k, 15k
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
Description: FILTER RC(PI) 33 OHM/27PF SMD
Packaging: Tape & Reel (TR)
Package / Case: 11-WFBGA, WLCSP
Size / Dimension: 0.077" L x 0.058" W (1.97mm x 1.47mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -30°C ~ 85°C
Values: R = 33Ohms, C = 27pF
Height: 0.026" (0.65mm)
Filter Order: 2nd
Applications: USB
Technology: RC (Pi)
Resistance - Channel (Ohms): 33, 1.3k, 17k, 15k
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
Produkt ist nicht verfügbar