Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36223) > Seite 157 nach 604
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MCF5329CVM240J | NXP USA Inc. |
 Description: IC MCU 32BIT ROMLESS 256MAPBGAPackaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 240MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 256-MAPBGA (17x17) Number of I/O: 94 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF5373LCVM240J | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 196MAPBGA Packaging: Tray Package / Case: 196-LBGA Mounting Type: Surface Mount Speed: 240MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 196-LBGA (15x15) Number of I/O: 62 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MCIMX25LPDKJ | NXP USA Inc. |
Description: I.MX25 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), LCD Core Processor: ARM9 Utilized IC / Part: i.MX25 |
Produkt ist nicht verfügbar |
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MCIMX351AJQ5CR2 | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tape & Reel (TR) Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -40°C ~ 85°C Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX353CJQ5C | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART Part Status: Active |
auf Bestellung 606 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX353CJQ5CR2 | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX353DJQ5C | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART Part Status: Active |
auf Bestellung 619 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX353DJQ5CR2 | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tape & Reel (TR) Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX355AJQ5CR2 | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tape & Reel (TR) Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX356AJQ5CR2 | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tape & Reel (TR) Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCIMX357CJQ5CR2 | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tape & Reel (TR) Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART Part Status: Active |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX357DJQ5C | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART Part Status: Active |
auf Bestellung 461 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX357DJQ5CR2 | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tape & Reel (TR) Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCIMX35LPDKJ | NXP USA Inc. |
Description: I.MX35 EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCIMX512DJM8C | NXP USA Inc. |
Description: IC MPU I.MX51 800MHZ 529BGA Packaging: Tray Package / Case: 529-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 85°C (TC) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Supplier Device Package: 529-BGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (3), USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART Part Status: Active |
auf Bestellung 397 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX51EXP | NXP USA Inc. |
Description: EXPANSION CARD I.MX51 |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCIMX51LCD | NXP USA Inc. |
Description: DAUGHTER LCD WVGA I.MX51 |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
| MDE6IC7120GNR1 | NXP USA Inc. |
Description: IC AMP W-CDMA 728-768MHZ TO270 Packaging: Tape & Reel (TR) Package / Case: TO-270-16 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 728MHz ~ 768MHz RF Type: W-CDMA Voltage - Supply: 28V Gain: 34.4dB P1dB: 50.8dBm Supplier Device Package: TO-270 WBL-16 GULL |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MPC603RVG200LC | NXP USA Inc. |
Description: IC MPU MPC6XX 200MHZ 255FCCBGA Packaging: Tray Package / Case: 255-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 200MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC 603e Voltage - I/O: 3.3V Supplier Device Package: 255-FCCBGA (21x21) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MPC8544COMEDEV | NXP USA Inc. |
Description: MPC8544E EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: e500 Board Type: Evaluation Platform Utilized IC / Part: MPC8544E Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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MRF6V12500HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 1.03GHz Power - Output: 500W Gain: 19.7dB Technology: LDMOS Supplier Device Package: NI-780H-2L Part Status: Active Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 200 mA |
auf Bestellung 200 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF6V12500HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 1.03GHz Power - Output: 500W Gain: 19.7dB Technology: LDMOS Supplier Device Package: NI-780S Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 200 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MRF8P9300HR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 960MHz Configuration: Dual Power - Output: 100W Gain: 19.4dB Technology: LDMOS Supplier Device Package: NI-1230 Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 2.4 A |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MRF8S21200HR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 2.14GHz Configuration: Dual Power - Output: 48W Gain: 18.1dB Technology: LDMOS Supplier Device Package: NI-1230 Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.4 A |
Produkt ist nicht verfügbar |
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| MRF8S9260HSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI880S Packaging: Tape & Reel (TR) Package / Case: NI-880S Mounting Type: Surface Mount Frequency: 960MHz Power - Output: 75W Gain: 18.6dB Technology: LDMOS Supplier Device Package: NI-880S Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 1.7 A |
Produkt ist nicht verfügbar |
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| MSC8156EADS | NXP USA Inc. |
Description: MSC8156 EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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MW7IC915NT1 | NXP USA Inc. |
Description: IC AMP W-CDMA 728-960MHZ 24QFN Packaging: Tape & Reel (TR) Package / Case: 24-PowerQFN Mounting Type: Surface Mount Frequency: 728MHz ~ 960MHz RF Type: W-CDMA Voltage - Supply: 28V Gain: 38dB P1dB: 15.5W Supplier Device Package: 24-PQFN (8x8) Part Status: Active |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XEQ512J3MAG | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 119 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912XEQ512J3MAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912XET256J2MAA | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFP |
auf Bestellung 417 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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S912XET256J2MAG | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 119 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12C128J2VFAER | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Not For New Designs Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12Q12J2VFAE1R | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 128KB (128K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Not For New Designs Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12XS256J0VAE | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 256KB (256K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 44 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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S9S12XS256J0VAER | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 256KB (256K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 44 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SC68376BGVAB25R | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Packaging: Tape & Reel (TR) Package / Case: 160-BQFP Mounting Type: Surface Mount Speed: 25MHz RAM Size: 7.5K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: CPU32 Data Converters: A/D 16x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 160-QFP (28x28) Number of I/O: 18 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SGMII-PEX-RISER | NXP USA Inc. |
Description: PHY RISER CARD SGMII/PEX Packaging: Box For Use With/Related Products: P4080 Accessory Type: Interface Board |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MC8640DTHX1067NE | NXP USA Inc. |
Description: IC MPU MPC86XX 1.067GHZ 1023BGA Packaging: Tray Package / Case: 1023-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.067GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e600 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 1023-FCCBGA (33x33) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HSSI, I2C, RapidIO Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MC8640VU1000HE | NXP USA Inc. |
Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA Packaging: Tray Package / Case: 994-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e600 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 994-FCCBGA (33x33) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HSSI, I2C, RapidIO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
 |
MC8641DTVU1333JE | NXP USA Inc. |
Description: IC MPU MPC86XX 1.333GHZ 1023BGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MC8641DVU1333JE | NXP USA Inc. |
Description: IC MPU MPC86XX 1.333GHZ 1023BGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
| MPC8572ECLPXATLD | NXP USA Inc. |
Description: IC MPU MPC85XX 1.2GHZ 1023FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MPC8572ECLPXAULD | NXP USA Inc. |
Description: IC MPU MPC85XX 1.333GHZ 1023BGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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MPC8572ECLVTAULD | NXP USA Inc. |
Description: IC MPU MPC85XX 1.333GHZ 1023BGA Packaging: Box Package / Case: 1023-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Supplier Device Package: 1023-FCBGA (33x33) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, HSSI, I2C, RapidIO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MRF8S7120NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-2 Packaging: Tape & Reel (TR) Package / Case: OM-780-2 Mounting Type: Surface Mount Frequency: 768MHz Power - Output: 32W Gain: 19.2dB Technology: LDMOS Supplier Device Package: OM-780-2 Part Status: Obsolete Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 600 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MRF8P20160HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780-4 Mounting Type: Chassis Mount Frequency: 1.92GHz Configuration: Dual Power - Output: 37W Gain: 16.5dB Technology: LDMOS Supplier Device Package: NI-780-4 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 550 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MRF8P20160HSR3 | NXP USA Inc. | Description: FET RF 2CH 65V 1.92GHZ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MRF8P20160HSR5 | NXP USA Inc. | Description: FET RF 2CH 65V 1.92GHZ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
| MRF8S26060HR3 | NXP USA Inc. | Description: FET RF 65V 2.69GHZ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MRF8S26060HSR3 | NXP USA Inc. |
Description: FET RF 65V 2.69GHZ Packaging: Tape & Reel (TR) Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 2.69GHz Power - Output: 15.5W Gain: 16.3dB Technology: LDMOS Supplier Device Package: NI-400S-2S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 450 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MRF8S26060HSR5 | NXP USA Inc. |
Description: FET RF 65V 2.69GHZ Packaging: Tape & Reel (TR) Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 2.69GHz Power - Output: 15.5W Gain: 16.3dB Technology: LDMOS Supplier Device Package: NI-400S-2S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 450 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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TDA8954TH/N1,118 | NXP USA Inc. |
Description: IC AMP D MONO/STEREO 420W 24HSOP Packaging: Tape & Reel (TR) Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: ±12.5V ~ 42.5V Max Output Power x Channels @ Load: 420W x 1 @ 8Ohm; 210W x 2 @ 4Ohm Supplier Device Package: 24-HSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MPC5125YVN400 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 324PBGA Packaging: Tray Package / Case: 324-BBGA Mounting Type: Surface Mount Speed: 400MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: External Program Memory Type: ROMless Core Processor: e300 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG Peripherals: DMA, WDT Supplier Device Package: 324-PBGA (23x23) Number of I/O: 64 DigiKey Programmable: Not Verified |
auf Bestellung 794 Stücke: Lieferzeit 10-14 Tag (e) |
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DAC1408D750W1/DB,598 | NXP USA Inc. | Description: BOARD DEMO DAC1408D750 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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ADC1413D125WO/DB,598 | NXP USA Inc. |
Description: BOARD DEMO FOR ADC1413D125 Packaging: Box Number of Bits: 14 Data Interface: Serial JESD204A, SPI™ Sampling Rate (Per Second): 125M Utilized IC / Part: ADC1413D125 Supplied Contents: Board(s) Number of A/D Converters: 2 Input Range: 1 ~ 2Vpp Power (Typ) @ Conditions: 1.27W @ 125MSPS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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ADC1415S125/DB,598 | NXP USA Inc. |
Description: BOARD DEMO FOR ADC1415S125 Packaging: Box Number of Bits: 14 Data Interface: SPI Sampling Rate (Per Second): 125M Utilized IC / Part: ADC1415S125 Supplied Contents: Board(s) Number of A/D Converters: 1 Input Range: 1 ~ 2Vpp Power (Typ) @ Conditions: 840mW @ 125MSPS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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ADC1613D125HN/C1,5 | NXP USA Inc. |
Description: IC ADC 16BIT PIPELINED 56HVQFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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ADC1413D125HN/C1,5 | NXP USA Inc. |
Description: IC ADC 14BIT PIPELINED 56HVQFN Features: Simultaneous Sampling Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Number of Bits: 14 Configuration: S/H-ADC Data Interface: JESD204A Reference Type: External, Internal Operating Temperature: -40°C ~ 85°C Voltage - Supply, Analog: 2.85V ~ 3.4V Voltage - Supply, Digital: 1.65V ~ 1.95V Sampling Rate (Per Second): 125M Input Type: Differential, Single Ended Number of Inputs: 2 Supplier Device Package: 56-HVQFN (8x8) Architecture: Pipelined Ratio - S/H:ADC: 1:1 Number of A/D Converters: 2 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MMA7331LCT | NXP USA Inc. |
Description: ACCELEROMETER 4-9G ANALOG 14LGA Packaging: Tray Features: Selectable Scale Package / Case: 14-TFLGA Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X, Y, Z Acceleration Range: ±4g, 9g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.2V ~ 3.6V Bandwidth: 400Hz (X,Y), 300Hz (Z) Supplier Device Package: 14-LGA (3x5) Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MMA7361LCT | NXP USA Inc. |
Description: ACCEL 1.5-6G ANALOG 14LGA Packaging: Tray Features: Selectable Scale, Sleep Mode Package / Case: 14-TFLGA Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X, Y, Z Acceleration Range: ±1.5g, 6g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.2V ~ 3.6V Bandwidth: 400Hz (X,Y), 300Hz (Z) Supplier Device Package: 14-LGA (3x5) Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MCF5329CVM240J |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 94
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 94
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF5373LCVM240J |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 62
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 62
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX25LPDKJ |
|
Hersteller: NXP USA Inc.
Description: I.MX25 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), LCD
Core Processor: ARM9
Utilized IC / Part: i.MX25
Description: I.MX25 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), LCD
Core Processor: ARM9
Utilized IC / Part: i.MX25
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX351AJQ5CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX353CJQ5C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 606 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 52.25 EUR |
| 10+ | 42.38 EUR |
| 25+ | 39.92 EUR |
| 100+ | 37.21 EUR |
| MCIMX353CJQ5CR2 |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX353DJQ5C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 619 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 50 EUR |
| 10+ | 40.5 EUR |
| 25+ | 38.13 EUR |
| 100+ | 35.52 EUR |
| MCIMX353DJQ5CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX355AJQ5CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX356AJQ5CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX357CJQ5CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1000+ | 44.16 EUR |
| MCIMX357DJQ5C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 461 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 63.01 EUR |
| 10+ | 51.37 EUR |
| 25+ | 48.46 EUR |
| 100+ | 45.27 EUR |
| MCIMX357DJQ5CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX35LPDKJ |
|
Hersteller: NXP USA Inc.
Description: I.MX35 EVAL BRD
Description: I.MX35 EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX512DJM8C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 800MHZ 529BGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX51 800MHZ 529BGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Part Status: Active
auf Bestellung 397 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 92.66 EUR |
| 10+ | 76.52 EUR |
| 25+ | 72.49 EUR |
| 100+ | 68.06 EUR |
| MCIMX51EXP |
|
Hersteller: NXP USA Inc.
Description: EXPANSION CARD I.MX51
Description: EXPANSION CARD I.MX51
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| MCIMX51LCD |
|
Hersteller: NXP USA Inc.
Description: DAUGHTER LCD WVGA I.MX51
Description: DAUGHTER LCD WVGA I.MX51
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| MDE6IC7120GNR1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 728-768MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 728MHz ~ 768MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 34.4dB
P1dB: 50.8dBm
Supplier Device Package: TO-270 WBL-16 GULL
Description: IC AMP W-CDMA 728-768MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 728MHz ~ 768MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 34.4dB
P1dB: 50.8dBm
Supplier Device Package: TO-270 WBL-16 GULL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC603RVG200LC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC6XX 200MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU MPC6XX 200MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8544COMEDEV |
|
Hersteller: NXP USA Inc.
Description: MPC8544E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e500
Board Type: Evaluation Platform
Utilized IC / Part: MPC8544E
Part Status: Obsolete
Description: MPC8544E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e500
Board Type: Evaluation Platform
Utilized IC / Part: MPC8544E
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF6V12500HR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Active
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Active
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 50+ | 874.61 EUR |
| MRF6V12500HSR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF8P9300HR6 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 960MHz
Configuration: Dual
Power - Output: 100W
Gain: 19.4dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 2.4 A
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 960MHz
Configuration: Dual
Power - Output: 100W
Gain: 19.4dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 2.4 A
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF8S21200HR6 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 2.14GHz
Configuration: Dual
Power - Output: 48W
Gain: 18.1dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 2.14GHz
Configuration: Dual
Power - Output: 48W
Gain: 18.1dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF8S9260HSR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI880S
Packaging: Tape & Reel (TR)
Package / Case: NI-880S
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 75W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: NI-880S
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.7 A
Description: RF MOSFET LDMOS 28V NI880S
Packaging: Tape & Reel (TR)
Package / Case: NI-880S
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 75W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: NI-880S
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.7 A
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MSC8156EADS |
|
Hersteller: NXP USA Inc.
Description: MSC8156 EVAL BRD
Description: MSC8156 EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MW7IC915NT1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 728-960MHZ 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 38dB
P1dB: 15.5W
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Description: IC AMP W-CDMA 728-960MHZ 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 38dB
P1dB: 15.5W
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1000+ | 55.57 EUR |
| S912XEQ512J3MAG |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XEQ512J3MAL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XET256J2MAA |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Description: IC MCU 16BIT 256KB FLASH 80QFP
auf Bestellung 417 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| S912XET256J2MAG |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12C128J2VFAER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12Q12J2VFAE1R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12XS256J0VAE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| S9S12XS256J0VAER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SC68376BGVAB25R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tape & Reel (TR)
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tape & Reel (TR)
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SGMII-PEX-RISER |
Hersteller: NXP USA Inc.
Description: PHY RISER CARD SGMII/PEX
Packaging: Box
For Use With/Related Products: P4080
Accessory Type: Interface Board
Description: PHY RISER CARD SGMII/PEX
Packaging: Box
For Use With/Related Products: P4080
Accessory Type: Interface Board
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 1239.13 EUR |
| MC8640DTHX1067NE |
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.067GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.067GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Part Status: Obsolete
Description: IC MPU MPC86XX 1.067GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.067GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC8640VU1000HE |
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA
Packaging: Tray
Package / Case: 994-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 994-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA
Packaging: Tray
Package / Case: 994-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 994-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC8641DTVU1333JE |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC8641DVU1333JE |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPC8572ECLPXATLD |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.2GHZ 1023FCBGA
Description: IC MPU MPC85XX 1.2GHZ 1023FCBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPC8572ECLPXAULD |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPC8572ECLVTAULD |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
Packaging: Box
Package / Case: 1023-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
Packaging: Box
Package / Case: 1023-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MRF8S7120NR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 768MHz
Power - Output: 32W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 600 mA
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 768MHz
Power - Output: 32W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 600 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF8P20160HR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 1.92GHz
Configuration: Dual
Power - Output: 37W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 550 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 1.92GHz
Configuration: Dual
Power - Output: 37W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 550 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF8P20160HSR3 |
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 1.92GHZ
Description: FET RF 2CH 65V 1.92GHZ
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MRF8P20160HSR5 |
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 1.92GHZ
Description: FET RF 2CH 65V 1.92GHZ
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MRF8S26060HR3 |
Hersteller: NXP USA Inc.
Description: FET RF 65V 2.69GHZ
Description: FET RF 65V 2.69GHZ
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MRF8S26060HSR3 |
Hersteller: NXP USA Inc.
Description: FET RF 65V 2.69GHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 2.69GHz
Power - Output: 15.5W
Gain: 16.3dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
Description: FET RF 65V 2.69GHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 2.69GHz
Power - Output: 15.5W
Gain: 16.3dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF8S26060HSR5 |
Hersteller: NXP USA Inc.
Description: FET RF 65V 2.69GHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 2.69GHz
Power - Output: 15.5W
Gain: 16.3dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
Description: FET RF 65V 2.69GHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 2.69GHz
Power - Output: 15.5W
Gain: 16.3dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDA8954TH/N1,118 |
|
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 420W 24HSOP
Packaging: Tape & Reel (TR)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 42.5V
Max Output Power x Channels @ Load: 420W x 1 @ 8Ohm; 210W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Description: IC AMP D MONO/STEREO 420W 24HSOP
Packaging: Tape & Reel (TR)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 42.5V
Max Output Power x Channels @ Load: 420W x 1 @ 8Ohm; 210W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC5125YVN400 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: e300
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: e300
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 794 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 76.13 EUR |
| 10+ | 62.36 EUR |
| 25+ | 58.92 EUR |
| 100+ | 55.14 EUR |
| DAC1408D750W1/DB,598 |
Hersteller: NXP USA Inc.
Description: BOARD DEMO DAC1408D750
Description: BOARD DEMO DAC1408D750
Produkt ist nicht verfügbar
Im Einkaufswagen
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| ADC1413D125WO/DB,598 |
Hersteller: NXP USA Inc.
Description: BOARD DEMO FOR ADC1413D125
Packaging: Box
Number of Bits: 14
Data Interface: Serial JESD204A, SPI™
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1413D125
Supplied Contents: Board(s)
Number of A/D Converters: 2
Input Range: 1 ~ 2Vpp
Power (Typ) @ Conditions: 1.27W @ 125MSPS
Description: BOARD DEMO FOR ADC1413D125
Packaging: Box
Number of Bits: 14
Data Interface: Serial JESD204A, SPI™
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1413D125
Supplied Contents: Board(s)
Number of A/D Converters: 2
Input Range: 1 ~ 2Vpp
Power (Typ) @ Conditions: 1.27W @ 125MSPS
Produkt ist nicht verfügbar
Im Einkaufswagen
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| ADC1415S125/DB,598 |
|
Hersteller: NXP USA Inc.
Description: BOARD DEMO FOR ADC1415S125
Packaging: Box
Number of Bits: 14
Data Interface: SPI
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1415S125
Supplied Contents: Board(s)
Number of A/D Converters: 1
Input Range: 1 ~ 2Vpp
Power (Typ) @ Conditions: 840mW @ 125MSPS
Description: BOARD DEMO FOR ADC1415S125
Packaging: Box
Number of Bits: 14
Data Interface: SPI
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1415S125
Supplied Contents: Board(s)
Number of A/D Converters: 1
Input Range: 1 ~ 2Vpp
Power (Typ) @ Conditions: 840mW @ 125MSPS
Produkt ist nicht verfügbar
Im Einkaufswagen
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| ADC1613D125HN/C1,5 |
|
Hersteller: NXP USA Inc.
Description: IC ADC 16BIT PIPELINED 56HVQFN
Description: IC ADC 16BIT PIPELINED 56HVQFN
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| ADC1413D125HN/C1,5 |
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Hersteller: NXP USA Inc.
Description: IC ADC 14BIT PIPELINED 56HVQFN
Features: Simultaneous Sampling
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: JESD204A
Reference Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.85V ~ 3.4V
Voltage - Supply, Digital: 1.65V ~ 1.95V
Sampling Rate (Per Second): 125M
Input Type: Differential, Single Ended
Number of Inputs: 2
Supplier Device Package: 56-HVQFN (8x8)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 2
Description: IC ADC 14BIT PIPELINED 56HVQFN
Features: Simultaneous Sampling
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: JESD204A
Reference Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.85V ~ 3.4V
Voltage - Supply, Digital: 1.65V ~ 1.95V
Sampling Rate (Per Second): 125M
Input Type: Differential, Single Ended
Number of Inputs: 2
Supplier Device Package: 56-HVQFN (8x8)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 2
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| MMA7331LCT |
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Hersteller: NXP USA Inc.
Description: ACCELEROMETER 4-9G ANALOG 14LGA
Packaging: Tray
Features: Selectable Scale
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 9g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
Description: ACCELEROMETER 4-9G ANALOG 14LGA
Packaging: Tray
Features: Selectable Scale
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 9g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
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| MMA7361LCT |
|
Hersteller: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 14LGA
Packaging: Tray
Features: Selectable Scale, Sleep Mode
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
Description: ACCEL 1.5-6G ANALOG 14LGA
Packaging: Tray
Features: Selectable Scale, Sleep Mode
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
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Im Einkaufswagen
Stück im Wert von UAH