Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36589) > Seite 157 nach 610
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
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MCF5272VM66J | NXP USA Inc. |
 Description: IC MCU 32BIT 16KB ROM 196MAPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 126 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCF5272VM66R2J | NXP USA Inc. |
Description: IC MCU 32BIT 16KB ROM 196MAPBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCF5282CVM66J | NXP USA Inc. |
Description: IC MCU 32B 512KB FLASH 256MAPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 256-MAPBGA (17x17) Part Status: Obsolete Number of I/O: 150 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCF5282CVM80J | NXP USA Inc. |
Description: IC MCU 32B 512KB FLASH 256MAPBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCF5328CVM240J | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 90 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCF5329CVM240J | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA DigiKey Programmable: Not Verified Number of I/O: 94 Supplier Device Package: 256-MAPBGA (17x17) Peripherals: DMA, LCD, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V Core Size: 32-Bit Single-Core Core Processor: Coldfire V3 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Speed: 240MHz Mounting Type: Surface Mount Package / Case: 256-LBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCF5373LCVM240J | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 196MAPBGA DigiKey Programmable: Not Verified Number of I/O: 62 Supplier Device Package: 196-LBGA (15x15) Peripherals: DMA, POR, PWM, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V Core Size: 32-Bit Single-Core Core Processor: Coldfire V3 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Speed: 240MHz Mounting Type: Surface Mount Package / Case: 196-LBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
| MCIMX25LPDKJ | NXP USA Inc. |
Description: I.MX25 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), LCD Core Processor: ARM9 Utilized IC / Part: i.MX25 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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MCIMX351AJQ5CR2 | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Core Processor: ARM1136JF-S Operating Temperature: -40°C ~ 85°C Speed: 532MHz Mounting Type: Surface Mount Package / Case: 400-LFBGA Packaging: Tape & Reel (TR) Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART Security Features: Secure Fusebox, Secure JTAG Display & Interface Controllers: Keypad, KPP, LCD Graphics Acceleration: No RAM Controllers: LPDDR, DDR2 Co-Processors/DSP: Multimedia; VFP Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 400-LFBGA (17x17) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCIMX353CJQ5C | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART Part Status: Active |
auf Bestellung 486 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX353CJQ5CR2 | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 90 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCIMX353DJQ5C | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART Part Status: Active |
auf Bestellung 512 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX353DJQ5CR2 | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tape & Reel (TR) Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCIMX355AJQ5CR2 | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tape & Reel (TR) Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCIMX356AJQ5CR2 | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tape & Reel (TR) Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCIMX357CJQ5CR2 | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tape & Reel (TR) Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART Part Status: Active |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX357DJQ5C | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Part Status: Active Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 461 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX357DJQ5CR2 | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART Core Processor: ARM1136JF-S Operating Temperature: -20°C ~ 70°C (TA) Speed: 532MHz Mounting Type: Surface Mount Package / Case: 400-LFBGA Packaging: Tape & Reel (TR) Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Display & Interface Controllers: Keypad, KPP, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR, DDR2 Co-Processors/DSP: Multimedia; GPU, IPU, VFP Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 400-LFBGA (17x17) Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCIMX35LPDKJ | NXP USA Inc. |
Description: I.MX35 EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCIMX512DJM8C | NXP USA Inc. |
Description: IC MPU I.MX51 800MHZ 529BGA Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART Part Status: Active Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Display & Interface Controllers: Keypad, LCD Graphics Acceleration: No RAM Controllers: LPDDR, DDR2 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (3), USB 2.0 + PHY (1) Ethernet: 10/100Mbps (1) Supplier Device Package: 529-BGA (19x19) Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Core Processor: ARM® Cortex®-A8 Operating Temperature: -20°C ~ 85°C (TC) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 529-LFBGA Packaging: Tray |
auf Bestellung 397 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX51EXP | NXP USA Inc. |
Description: EXPANSION CARD I.MX51 Packaging: Box Accessory Type: Expansion Module Utilized IC / Part: i.MX51 |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX51LCD | NXP USA Inc. |
Description: DAUGHTER LCD WVGA I.MX51 |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
| MDE6IC7120GNR1 | NXP USA Inc. |
Description: IC AMP W-CDMA 728-768MHZ TO270 Packaging: Tape & Reel (TR) Package / Case: TO-270-16 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 728MHz ~ 768MHz RF Type: W-CDMA Voltage - Supply: 28V Gain: 34.4dB P1dB: 50.8dBm Supplier Device Package: TO-270 WBL-16 GULL |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MPC603RVG200LC | NXP USA Inc. |
Description: IC MPU MPC6XX 200MHZ 255FCCBGA Mounting Type: Surface Mount Package / Case: 255-BCBGA, FCCBGA Packaging: Tray Graphics Acceleration: No Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 255-FCCBGA (21x21) Voltage - I/O: 3.3V Core Processor: PowerPC 603e Operating Temperature: 0°C ~ 105°C (TA) Speed: 200MHz |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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MPC8540PX533JB | NXP USA Inc. |
Description: IC MPU MPC85XX 533MHZ 783FCPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 36 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
| MPC8544COMEDEV | NXP USA Inc. |
Description: MPC8544E EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: e500 Board Type: Evaluation Platform Utilized IC / Part: MPC8544E Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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MRF6V12500HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Current - Test: 200 mA Voltage - Test: 50 V Voltage - Rated: 110 V Part Status: Active Supplier Device Package: NI-780H-2L Technology: LDMOS Gain: 19.7dB Power - Output: 500W Frequency: 1.03GHz Mounting Type: Chassis Mount Package / Case: SOT-957A Packaging: Tape & Reel (TR) |
auf Bestellung 200 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF6V12500HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 1.03GHz Power - Output: 500W Gain: 19.7dB Technology: LDMOS Supplier Device Package: NI-780S Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 200 mA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MRF8P9300HR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 960MHz Configuration: Dual Power - Output: 100W Gain: 19.4dB Technology: LDMOS Supplier Device Package: NI-1230 Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 2.4 A |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MRF8S21200HR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI1230 Current - Test: 1.4 A Voltage - Test: 28 V Voltage - Rated: 65 V Part Status: Obsolete Supplier Device Package: NI-1230 Technology: LDMOS Gain: 18.1dB Power - Output: 48W Configuration: Dual Frequency: 2.14GHz Mounting Type: Chassis Mount Package / Case: NI-1230 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
| MRF8S9260HSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI880S Current - Test: 1.7 A Voltage - Test: 28 V Voltage - Rated: 70 V Supplier Device Package: NI-880S Technology: LDMOS Gain: 18.6dB Power - Output: 75W Frequency: 960MHz Mounting Type: Surface Mount Package / Case: NI-880S Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MSC8156EADS | NXP USA Inc. |
Description: MSC8156 EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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MW7IC915NT1 | NXP USA Inc. |
Description: IC AMP W-CDMA 728-960MHZ 24QFN Part Status: Active Supplier Device Package: 24-PQFN (8x8) P1dB: 15.5W Gain: 38dB Voltage - Supply: 28V RF Type: W-CDMA Frequency: 728MHz ~ 960MHz Mounting Type: Surface Mount Package / Case: 24-PowerQFN Packaging: Tape & Reel (TR) |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XEQ512J3MAG | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFP DigiKey Programmable: Not Verified Number of I/O: 119 Part Status: Active Supplier Device Package: 144-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 24x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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S912XEQ512J3MAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP DigiKey Programmable: Not Verified Number of I/O: 91 Supplier Device Package: 112-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 112-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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S912XET256J2MAA | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFP |
auf Bestellung 417 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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S912XET256J2MAG | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 144LQFP Number of I/O: 119 Part Status: Active Supplier Device Package: 144-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 24x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 16K x 8 Program Memory Size: 256KB (256K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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S9S12C128J2VFAER | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFP Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 128KB (128K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 31 Part Status: Not For New Designs Supplier Device Package: 48-LQFP (7x7) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: HCS12 Program Memory Type: FLASH Oscillator Type: Internal |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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S9S12Q12J2VFAE1R | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFP DigiKey Programmable: Not Verified Number of I/O: 31 Part Status: Not For New Designs Supplier Device Package: 48-LQFP (7x7) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: HCS12 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 128KB (128K x 8) Speed: 16MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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S9S12XS256J0VAE | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 44 Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x12b Core Processor: HCS12X Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 12K x 8 Program Memory Size: 256KB (256K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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S9S12XS256J0VAER | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 44 Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x12b Core Processor: HCS12X Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 12K x 8 Program Memory Size: 256KB (256K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SC68376BGVAB25R | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP DigiKey Programmable: Not Verified Number of I/O: 18 Supplier Device Package: 160-QFP (28x28) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Core Size: 32-Bit Data Converters: A/D 16x10b Core Processor: CPU32 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 7.5K x 8 Speed: 25MHz Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SGMII-PEX-RISER | NXP USA Inc. |
Description: PHY RISER CARD SGMII/PEX Packaging: Box For Use With/Related Products: P4080 Accessory Type: Interface Board |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MC8640DTHX1067NE | NXP USA Inc. |
Description: IC MPU MPC86XX 1.067GHZ 1023BGA Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DDR, DDR2 Number of Cores/Bus Width: 2 Core, 32-Bit Ethernet: 10/100/1000Mbps (4) Supplier Device Package: 1023-FCCBGA (33x33) Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.067GHz Mounting Type: Surface Mount Package / Case: 1023-BBGA, FCBGA Packaging: Tray Additional Interfaces: DUART, HSSI, I2C, RapidIO Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e600 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
| MC8640DVU1067NE | NXP USA Inc. | Description: IC MPU MPC86XX 1.067GHZ 1023BGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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MC8640VU1000HE | NXP USA Inc. |
Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA Additional Interfaces: DUART, HSSI, I2C, RapidIO Graphics Acceleration: No RAM Controllers: DDR, DDR2 Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (4) Supplier Device Package: 994-FCCBGA (33x33) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e600 Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 994-BCBGA, FCCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MC8641DTVU1333JE | NXP USA Inc. |
Description: IC MPU MPC86XX 1.333GHZ 1023BGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MC8641DVU1333JE | NXP USA Inc. |
Description: IC MPU MPC86XX 1.333GHZ 1023BGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 24 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
| MPC8572ECLPXATLD | NXP USA Inc. |
Description: IC MPU MPC85XX 1.2GHZ 1023FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MPC8572ECLPXAULD | NXP USA Inc. |
Description: IC MPU MPC85XX 1.333GHZ 1023BGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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MPC8572ECLVTAULD | NXP USA Inc. |
Description: IC MPU MPC85XX 1.333GHZ 1023BGA Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.333GHz Mounting Type: Surface Mount Package / Case: 1023-BFBGA, FCBGA Packaging: Box Additional Interfaces: DUART, HSSI, I2C, RapidIO Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR2, DDR3 Co-Processors/DSP: Signal Processing; SPE, Security; SEC Number of Cores/Bus Width: 2 Core, 32-Bit Ethernet: 10/100/1000Mbps (4) Supplier Device Package: 1023-FCBGA (33x33) Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MRF8S7120NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-2 Current - Test: 600 mA Voltage - Test: 28 V Voltage - Rated: 70 V Part Status: Obsolete Supplier Device Package: OM-780-2 Technology: LDMOS Gain: 19.2dB Power - Output: 32W Frequency: 768MHz Mounting Type: Surface Mount Package / Case: OM-780-2 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MRF8P20160HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Current - Test: 550 mA Voltage - Test: 28 V Voltage - Rated: 65 V Supplier Device Package: NI-780-4 Technology: LDMOS Gain: 16.5dB Power - Output: 37W Configuration: Dual Frequency: 1.92GHz Mounting Type: Chassis Mount Package / Case: NI-780-4 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MRF8P20160HSR3 | NXP USA Inc. | Description: FET RF 2CH 65V 1.92GHZ |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MRF8P20160HSR5 | NXP USA Inc. | Description: FET RF 2CH 65V 1.92GHZ |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
| MRF8S26060HR3 | NXP USA Inc. | Description: FET RF 65V 2.69GHZ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MRF8S26060HSR3 | NXP USA Inc. |
Description: FET RF 65V 2.69GHZ Current - Test: 450 mA Voltage - Test: 28 V Voltage - Rated: 65 V Part Status: Obsolete Supplier Device Package: NI-400S-2S Technology: LDMOS Gain: 16.3dB Power - Output: 15.5W Frequency: 2.69GHz Mounting Type: Surface Mount Package / Case: NI-400S-2S Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MRF8S26060HSR5 | NXP USA Inc. |
Description: FET RF 65V 2.69GHZ Current - Test: 450 mA Voltage - Test: 28 V Voltage - Rated: 65 V Part Status: Obsolete Supplier Device Package: NI-400S-2S Technology: LDMOS Gain: 16.3dB Power - Output: 15.5W Frequency: 2.69GHz Mounting Type: Surface Mount Package / Case: NI-400S-2S Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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TDA8954TH/N1,118 | NXP USA Inc. |
Description: IC AMP D MONO/STEREO 420W 24HSOP Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby Packaging: Tape & Reel (TR) Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: ±12.5V ~ 42.5V Max Output Power x Channels @ Load: 420W x 1 @ 8Ohm; 210W x 2 @ 4Ohm Supplier Device Package: 24-HSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MPC5125YVN400 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 324PBGA Packaging: Tray Package / Case: 324-BBGA Mounting Type: Surface Mount Speed: 400MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: External Program Memory Type: ROMless Core Processor: e300 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG Peripherals: DMA, WDT Supplier Device Package: 324-PBGA (23x23) Number of I/O: 64 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MCF5272VM66J |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 126 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCF5272VM66R2J |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF5282CVM66J |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Obsolete
Number of I/O: 150
DigiKey Programmable: Not Verified
Description: IC MCU 32B 512KB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Obsolete
Number of I/O: 150
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF5282CVM80J |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 256MAPBGA
Description: IC MCU 32B 512KB FLASH 256MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF5328CVM240J |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCF5329CVM240J |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 94
Supplier Device Package: 256-MAPBGA (17x17)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V3
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 256MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 94
Supplier Device Package: 256-MAPBGA (17x17)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V3
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF5373LCVM240J |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 62
Supplier Device Package: 196-LBGA (15x15)
Peripherals: DMA, POR, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V3
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 62
Supplier Device Package: 196-LBGA (15x15)
Peripherals: DMA, POR, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V3
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX25LPDKJ |
|
Hersteller: NXP USA Inc.
Description: I.MX25 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), LCD
Core Processor: ARM9
Utilized IC / Part: i.MX25
Description: I.MX25 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), LCD
Core Processor: ARM9
Utilized IC / Part: i.MX25
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX351AJQ5CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Core Processor: ARM1136JF-S
Operating Temperature: -40°C ~ 85°C
Speed: 532MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tape & Reel (TR)
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Security Features: Secure Fusebox, Secure JTAG
Display & Interface Controllers: Keypad, KPP, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; VFP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 400-LFBGA (17x17)
Description: IC MPU I.MX35 532MHZ 400LFBGA
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Core Processor: ARM1136JF-S
Operating Temperature: -40°C ~ 85°C
Speed: 532MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tape & Reel (TR)
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Security Features: Secure Fusebox, Secure JTAG
Display & Interface Controllers: Keypad, KPP, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; VFP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 400-LFBGA (17x17)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX353CJQ5C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 486 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 74.05 EUR |
| 10+ | 60.37 EUR |
| 25+ | 56.95 EUR |
| 100+ | 53.2 EUR |
| MCIMX353CJQ5CR2 |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX353DJQ5C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 512 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 70.85 EUR |
| 10+ | 57.7 EUR |
| 25+ | 54.41 EUR |
| 100+ | 50.79 EUR |
| MCIMX353DJQ5CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX355AJQ5CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX356AJQ5CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX357CJQ5CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 51.91 EUR |
| MCIMX357DJQ5C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Part Status: Active
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Part Status: Active
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
auf Bestellung 461 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 71.08 EUR |
| 10+ | 57.95 EUR |
| 25+ | 54.92 EUR |
| MCIMX357DJQ5CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Core Processor: ARM1136JF-S
Operating Temperature: -20°C ~ 70°C (TA)
Speed: 532MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tape & Reel (TR)
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Display & Interface Controllers: Keypad, KPP, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 400-LFBGA (17x17)
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Description: IC MPU I.MX35 532MHZ 400LFBGA
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Core Processor: ARM1136JF-S
Operating Temperature: -20°C ~ 70°C (TA)
Speed: 532MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tape & Reel (TR)
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Display & Interface Controllers: Keypad, KPP, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 400-LFBGA (17x17)
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX35LPDKJ |
|
Hersteller: NXP USA Inc.
Description: I.MX35 EVAL BRD
Description: I.MX35 EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX512DJM8C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 800MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tray
Description: IC MPU I.MX51 800MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tray
auf Bestellung 397 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 110.27 EUR |
| 10+ | 91.06 EUR |
| 25+ | 86.26 EUR |
| 100+ | 80.99 EUR |
| MCIMX51EXP |
|
Hersteller: NXP USA Inc.
Description: EXPANSION CARD I.MX51
Packaging: Box
Accessory Type: Expansion Module
Utilized IC / Part: i.MX51
Description: EXPANSION CARD I.MX51
Packaging: Box
Accessory Type: Expansion Module
Utilized IC / Part: i.MX51
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 487.2 EUR |
| MCIMX51LCD |
|
Hersteller: NXP USA Inc.
Description: DAUGHTER LCD WVGA I.MX51
Description: DAUGHTER LCD WVGA I.MX51
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| MDE6IC7120GNR1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 728-768MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 728MHz ~ 768MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 34.4dB
P1dB: 50.8dBm
Supplier Device Package: TO-270 WBL-16 GULL
Description: IC AMP W-CDMA 728-768MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 728MHz ~ 768MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 34.4dB
P1dB: 50.8dBm
Supplier Device Package: TO-270 WBL-16 GULL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC603RVG200LC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC6XX 200MHZ 255FCCBGA
Mounting Type: Surface Mount
Package / Case: 255-BCBGA, FCCBGA
Packaging: Tray
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 255-FCCBGA (21x21)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 200MHz
Description: IC MPU MPC6XX 200MHZ 255FCCBGA
Mounting Type: Surface Mount
Package / Case: 255-BCBGA, FCCBGA
Packaging: Tray
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 255-FCCBGA (21x21)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 200MHz
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8540PX533JB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 36 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPC8544COMEDEV |
|
Hersteller: NXP USA Inc.
Description: MPC8544E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e500
Board Type: Evaluation Platform
Utilized IC / Part: MPC8544E
Part Status: Obsolete
Description: MPC8544E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e500
Board Type: Evaluation Platform
Utilized IC / Part: MPC8544E
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF6V12500HR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Current - Test: 200 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Active
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 19.7dB
Power - Output: 500W
Frequency: 1.03GHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 50V NI780
Current - Test: 200 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Active
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 19.7dB
Power - Output: 500W
Frequency: 1.03GHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 50+ | 1040.79 EUR |
| MRF6V12500HSR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MRF8P9300HR6 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 960MHz
Configuration: Dual
Power - Output: 100W
Gain: 19.4dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 2.4 A
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 960MHz
Configuration: Dual
Power - Output: 100W
Gain: 19.4dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 2.4 A
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF8S21200HR6 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Current - Test: 1.4 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-1230
Technology: LDMOS
Gain: 18.1dB
Power - Output: 48W
Configuration: Dual
Frequency: 2.14GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V NI1230
Current - Test: 1.4 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-1230
Technology: LDMOS
Gain: 18.1dB
Power - Output: 48W
Configuration: Dual
Frequency: 2.14GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF8S9260HSR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI880S
Current - Test: 1.7 A
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: NI-880S
Technology: LDMOS
Gain: 18.6dB
Power - Output: 75W
Frequency: 960MHz
Mounting Type: Surface Mount
Package / Case: NI-880S
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V NI880S
Current - Test: 1.7 A
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: NI-880S
Technology: LDMOS
Gain: 18.6dB
Power - Output: 75W
Frequency: 960MHz
Mounting Type: Surface Mount
Package / Case: NI-880S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MSC8156EADS |
|
Hersteller: NXP USA Inc.
Description: MSC8156 EVAL BRD
Description: MSC8156 EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MW7IC915NT1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 728-960MHZ 24QFN
Part Status: Active
Supplier Device Package: 24-PQFN (8x8)
P1dB: 15.5W
Gain: 38dB
Voltage - Supply: 28V
RF Type: W-CDMA
Frequency: 728MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 24-PowerQFN
Packaging: Tape & Reel (TR)
Description: IC AMP W-CDMA 728-960MHZ 24QFN
Part Status: Active
Supplier Device Package: 24-PQFN (8x8)
P1dB: 15.5W
Gain: 38dB
Voltage - Supply: 28V
RF Type: W-CDMA
Frequency: 728MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 24-PowerQFN
Packaging: Tape & Reel (TR)
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 76.9 EUR |
| S912XEQ512J3MAG |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 119
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 16BIT 512KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 119
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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| S912XEQ512J3MAL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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| S912XET256J2MAA |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Description: IC MCU 16BIT 256KB FLASH 80QFP
auf Bestellung 417 Stücke:
Lieferzeit 10-14 Tag (e)
| S912XET256J2MAG |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Number of I/O: 119
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Number of I/O: 119
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| S9S12C128J2VFAER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Not For New Designs
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Not For New Designs
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
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| S9S12Q12J2VFAE1R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Not For New Designs
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Not For New Designs
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| S9S12XS256J0VAE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 16BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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| S9S12XS256J0VAER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| SC68376BGVAB25R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 7.5K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT ROMLESS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 7.5K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| SGMII-PEX-RISER |
Hersteller: NXP USA Inc.
Description: PHY RISER CARD SGMII/PEX
Packaging: Box
For Use With/Related Products: P4080
Accessory Type: Interface Board
Description: PHY RISER CARD SGMII/PEX
Packaging: Box
For Use With/Related Products: P4080
Accessory Type: Interface Board
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1474.56 EUR |
| MC8640DTHX1067NE |
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.067GHZ 1023BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 2 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 1023-FCCBGA (33x33)
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.067GHz
Mounting Type: Surface Mount
Package / Case: 1023-BBGA, FCBGA
Packaging: Tray
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e600
Description: IC MPU MPC86XX 1.067GHZ 1023BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 2 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 1023-FCCBGA (33x33)
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.067GHz
Mounting Type: Surface Mount
Package / Case: 1023-BBGA, FCBGA
Packaging: Tray
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e600
Produkt ist nicht verfügbar
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| MC8640DVU1067NE |
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.067GHZ 1023BGA
Description: IC MPU MPC86XX 1.067GHZ 1023BGA
Produkt ist nicht verfügbar
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| MC8640VU1000HE |
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 994-FCCBGA (33x33)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e600
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 994-BCBGA, FCCBGA
Packaging: Tray
Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 994-FCCBGA (33x33)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e600
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 994-BCBGA, FCCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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| MC8641DTVU1333JE |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Produkt ist nicht verfügbar
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| MC8641DVU1333JE |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
Produkt ist nicht verfügbar
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| MPC8572ECLPXATLD |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.2GHZ 1023FCBGA
Description: IC MPU MPC85XX 1.2GHZ 1023FCBGA
Produkt ist nicht verfügbar
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| MPC8572ECLPXAULD |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
Produkt ist nicht verfügbar
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| MPC8572ECLVTAULD |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.333GHz
Mounting Type: Surface Mount
Package / Case: 1023-BFBGA, FCBGA
Packaging: Box
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
Number of Cores/Bus Width: 2 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 1023-FCBGA (33x33)
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.333GHz
Mounting Type: Surface Mount
Package / Case: 1023-BFBGA, FCBGA
Packaging: Box
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
Number of Cores/Bus Width: 2 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 1023-FCBGA (33x33)
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Produkt ist nicht verfügbar
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| MRF8S7120NR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Current - Test: 600 mA
Voltage - Test: 28 V
Voltage - Rated: 70 V
Part Status: Obsolete
Supplier Device Package: OM-780-2
Technology: LDMOS
Gain: 19.2dB
Power - Output: 32W
Frequency: 768MHz
Mounting Type: Surface Mount
Package / Case: OM-780-2
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V OM780-2
Current - Test: 600 mA
Voltage - Test: 28 V
Voltage - Rated: 70 V
Part Status: Obsolete
Supplier Device Package: OM-780-2
Technology: LDMOS
Gain: 19.2dB
Power - Output: 32W
Frequency: 768MHz
Mounting Type: Surface Mount
Package / Case: OM-780-2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MRF8P20160HR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 550 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780-4
Technology: LDMOS
Gain: 16.5dB
Power - Output: 37W
Configuration: Dual
Frequency: 1.92GHz
Mounting Type: Chassis Mount
Package / Case: NI-780-4
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 550 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780-4
Technology: LDMOS
Gain: 16.5dB
Power - Output: 37W
Configuration: Dual
Frequency: 1.92GHz
Mounting Type: Chassis Mount
Package / Case: NI-780-4
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MRF8P20160HSR3 |
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 1.92GHZ
Description: FET RF 2CH 65V 1.92GHZ
Produkt ist nicht verfügbar
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| MRF8P20160HSR5 |
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 1.92GHZ
Description: FET RF 2CH 65V 1.92GHZ
Produkt ist nicht verfügbar
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| MRF8S26060HR3 |
Hersteller: NXP USA Inc.
Description: FET RF 65V 2.69GHZ
Description: FET RF 65V 2.69GHZ
Produkt ist nicht verfügbar
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| MRF8S26060HSR3 |
Hersteller: NXP USA Inc.
Description: FET RF 65V 2.69GHZ
Current - Test: 450 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-400S-2S
Technology: LDMOS
Gain: 16.3dB
Power - Output: 15.5W
Frequency: 2.69GHz
Mounting Type: Surface Mount
Package / Case: NI-400S-2S
Packaging: Tape & Reel (TR)
Description: FET RF 65V 2.69GHZ
Current - Test: 450 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-400S-2S
Technology: LDMOS
Gain: 16.3dB
Power - Output: 15.5W
Frequency: 2.69GHz
Mounting Type: Surface Mount
Package / Case: NI-400S-2S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MRF8S26060HSR5 |
Hersteller: NXP USA Inc.
Description: FET RF 65V 2.69GHZ
Current - Test: 450 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-400S-2S
Technology: LDMOS
Gain: 16.3dB
Power - Output: 15.5W
Frequency: 2.69GHz
Mounting Type: Surface Mount
Package / Case: NI-400S-2S
Packaging: Tape & Reel (TR)
Description: FET RF 65V 2.69GHZ
Current - Test: 450 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-400S-2S
Technology: LDMOS
Gain: 16.3dB
Power - Output: 15.5W
Frequency: 2.69GHz
Mounting Type: Surface Mount
Package / Case: NI-400S-2S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| TDA8954TH/N1,118 |
|
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 420W 24HSOP
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 42.5V
Max Output Power x Channels @ Load: 420W x 1 @ 8Ohm; 210W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Description: IC AMP D MONO/STEREO 420W 24HSOP
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 42.5V
Max Output Power x Channels @ Load: 420W x 1 @ 8Ohm; 210W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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| MPC5125YVN400 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: e300
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: e300
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH